WO2023142384A1 - 一种设计版图缺陷修复方法、存储介质及设备 - Google Patents

一种设计版图缺陷修复方法、存储介质及设备 Download PDF

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Publication number
WO2023142384A1
WO2023142384A1 PCT/CN2022/103100 CN2022103100W WO2023142384A1 WO 2023142384 A1 WO2023142384 A1 WO 2023142384A1 CN 2022103100 W CN2022103100 W CN 2022103100W WO 2023142384 A1 WO2023142384 A1 WO 2023142384A1
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Prior art keywords
defect
layout
design layout
repair
mask layout
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PCT/CN2022/103100
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English (en)
French (fr)
Inventor
巫志城
陈钊
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深圳晶源信息技术有限公司
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Publication of WO2023142384A1 publication Critical patent/WO2023142384A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/77—Retouching; Inpainting; Scratch removal
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Definitions

  • the present invention relates to the technical field of graphics repair technology, in particular to a design layout defect repair method, storage medium and equipment.
  • the present invention provides a design layout defect repair method, storage medium and equipment.
  • the present invention provides the following technical solution: a method for repairing design layout defects, the method comprising the following steps: providing a design layout, and obtaining a mask layout through the design layout; obtaining defects on the design layout information; repairing the mask layout according to the defect information and preset repair rules to obtain a repaired mask layout.
  • obtaining defect information on the design layout specifically includes the following steps: performing simulation on the mask layout to obtain an initial exposure profile; detecting the exposure profile and the design layout through photolithography rules to obtain the defect information.
  • the defect information includes defect type information and defect location information
  • the preset repair rule is a defect modification method corresponding to the defect type and defect location.
  • repairing the design layout includes the following steps: repairing the mask layout includes the following steps: obtaining a defect edge of the mask layout corresponding to the defect according to the defect information; The rule and the defect type information move the defect edge to obtain the repaired mask layout.
  • obtaining the defect edge of the mask layout corresponding to the defect according to the defect information includes the following steps: defining a marking area according to the defect position information; the mask layout at least partially falls within the marking area The side of is the defect side.
  • defining the marking area includes the following steps: obtaining the center point of the defect according to the defect position information; and defining the marking area according to a preset size with the center point as a reference position.
  • moving the defect edge according to the repair rule to obtain the repaired mask layout includes the following steps: determining the moving direction and moving distance of the defect edge according to the defect type information and the repair rule; The defective side is moved according to the moving direction and the moving distance.
  • the following steps are further included: performing simulation on the repaired mask layout again to generate an exposure profile and performing defect detection on the exposure profile; if the repair of the defect does not reach the preset situation, then The repaired mask layout is repaired again.
  • the mask layout is a mask layout that has undergone Optical Proximity Correction (OPC), or a mask layout that has not undergone OPC.
  • OPC Optical Proximity Correction
  • the present invention provides another technical solution as follows: a computer-readable storage medium, on which computer program instructions are stored, and when the computer program instructions are executed by a processor, the design layout defect repair as described above is realized method.
  • the present invention provides another technical solution as follows: a device for repairing design layout defects, the device includes a device body and a device operating program, and when the device body executes the device operating program, the above-mentioned Design layout defect repair method.
  • a method for repairing design layout defects includes the following steps, providing a design layout, and obtaining a mask layout through the design layout; obtaining defect information on the design layout; according to the defect information and preset repair rules The mask layout is repaired to obtain the repaired mask layout.
  • This method classifies and confirms the defects of the design layout, and can determine the type of the defect. Based on the repair rules preset by the defect type and the defect location as the actual situation, repairing according to the preset rules can quickly complete the repair of the defect. Overall, the defects in the design layout can be accurately judged and the mask layout can be quickly repaired, which greatly reduces the time spent on repairing the design layout defects.
  • a design layout defect repair method obtaineds defect information on the design layout, specifically comprising the following steps: performing simulation on the mask layout to obtain the initial exposure profile; Defect information is detected.
  • the mask layout is simulated to obtain the initial exposure contour, and the exposure contour and design layout are detected by photolithography rules to obtain defect information, which can quickly obtain defect information, and facilitate subsequent classification and positioning of defects based on defect information, so as to reduce The time it takes to subsequently fix the defect.
  • the defect information includes defect type information and defect location information
  • the preset repair rule is a defect modification method corresponding to the defect type and defect location.
  • a design layout defect repair method provided by the present invention includes the following steps of repairing the mask layout: obtaining the defect edge of the mask layout corresponding to the defect according to the defect information; moving the defect edge according to the repair rule and defect type information to obtain Mask layout has been fixed. For different defects, according to the defect information, the defect edge is directly moved according to the preset repair rules to repair the defect, which speeds up the defect repair process and reduces the time spent on defect repair.
  • a method for repairing a design layout defect includes the following steps of obtaining the defect edge of the mask layout corresponding to the defect according to the defect information: defining the marked area according to the defect position information; The edge is the defect edge. Marking the position information of the defect according to the defect information can facilitate the subsequent determination of the defect edge, and through the defined area, part of the edge of the mask layout falls into the defined area and is marked as a defect edge. Defect edges are determined through the region, which facilitates the subsequent repair of defects and reduces the time spent on repairing defects in the design layout.
  • defining the marking area includes the following steps: obtaining the center point of the defect according to the defect position information; using the center point as the reference position, defining the marking area according to the preset size. According to the type and location of the defect and the relationship between the marked edges, and at the same time determine the moving direction of the edge through specific rules, the defects of the design layout can be repaired faster, thereby reducing the time consumption.
  • a design layout defect repair method provided by the present invention moving the defect edge according to the repair rule to obtain the repaired mask layout includes the following steps: determine the moving direction and moving distance of the defect edge according to the defect type information and the repair rule; Direction and moving distance to move the defect edge. According to the type information and position information of the defect, the moving direction and distance of the defect edge are judged, so that the defect can be repaired more quickly and stably.
  • a method for repairing design layout defects further includes the following steps after repairing the defects: performing simulation on the repaired mask layout again to generate an exposure profile and performing defect detection on the exposure profile.
  • the repaired mask layout is repaired again.
  • Defect detection is performed again on the simulated exposure profile generated by the repaired mask layout to prevent the repair of the defect from reaching the preset situation, and continue to repair the repaired mask layout that has not reached the preset situation, resulting in multiple iterations, until the repair of defects in the final output repaired mask layout reaches a preset condition.
  • the mask layout is a mask layout that has undergone Optical Proximity Correction (OPC), or a mask layout that has not undergone OPC.
  • OPC Optical Proximity Correction
  • Using the design layout that has been corrected by the optical proximity effect can reduce the defects of the design layout, thereby reducing the time spent on repairing the design layout defects.
  • a computer-readable storage medium provided by the present invention has computer program instructions on it, and when the computer program instructions are executed by a processor, the above-mentioned method for repairing design layout defects is realized.
  • the computer-readable storage medium has the same beneficial effects as the above-mentioned method for repairing design layout defects, which will not be repeated here.
  • a device for repairing design layout defects includes a device body and a device operating program, and the above-mentioned method for repairing design layout defects is implemented when the device body executes the device operating program.
  • the device has the same beneficial effect as the above-mentioned method for repairing design layout defects, which will not be repeated here.
  • FIG. 1 is a flow chart of a design layout defect repair method provided by the first embodiment of the present invention.
  • FIG. 2 is a flowchart of step S0 of a design layout defect repair method provided by the first embodiment of the present invention.
  • FIG. 3 is a flowchart of step S2 of a design layout defect repair method provided by the first embodiment of the present invention.
  • FIG. 4 is a flowchart of step S3 of a design layout defect repair method provided by the first embodiment of the present invention.
  • FIG. 5 is a flow chart of step S31 of a design layout defect repair method provided by the first embodiment of the present invention.
  • FIG. 6 is a flow chart of step S311 of a design layout defect repair method provided by the first embodiment of the present invention.
  • Fig. 7 is a flow chart after step S312 of a design layout defect repair method provided by the first embodiment of the present invention.
  • FIG. 8 is a flow chart of step S4 of a design layout defect repair method provided by the first embodiment of the present invention.
  • FIG. 9 is a mask layout of an exemplary flow of a design layout defect repair method provided by the first embodiment of the present invention.
  • FIG. 10 is a mask layout marked with defect edges in an exemplary flow of a method for repairing design layout defects provided by the first embodiment of the present invention.
  • FIG. 11 is a mask layout after the 2nd to 5th iterations of an exemplary flow of a method for repairing design layout defects provided by the first embodiment of the present invention.
  • Fig. 12 is a schematic structural diagram of a computer-readable storage medium provided by a second embodiment of the present invention.
  • Fig. 13 is a schematic structural diagram of a device for repairing design layout defects according to the third embodiment of the present invention.
  • 100 Computer-readable storage media
  • 200 Equipment for repairing design layout defects
  • the defects in the present invention that is, the defects of the design layout
  • the defects of the mask layout obtained through the design layout originate from the defects on the design layout, rather than during the process of obtaining the mask layout. Defects caused by the process flow.
  • the first embodiment of the present invention provides a design layout defect repair method, including the following steps:
  • S1 Provide the design layout, and obtain the mask layout through the design layout
  • the first embodiment of the present invention provides a design layout defect repair method, the method classifies design layout defects and confirms information, can determine the type of defect, and preset repair rules based on the type of defect, Taking the defect location as the reality, repairing according to the preset rules can quickly complete the repair of defects, and can make accurate judgments on the defects of the design layout and quickly repair the mask layout, which greatly reduces the repair of design layout defects the time it takes.
  • the first embodiment of the present invention provides a method for repairing design layout defects, which further includes after step S1,
  • the first embodiment of the present invention provides a design layout defect repair method
  • the mask layout is a mask layout that has undergone Optical Proximity Correction (OPC), or a mask layout that has not undergone OPC .
  • OPC Optical Proximity Correction
  • Using the design layout that has been corrected by the optical proximity effect can reduce the defects of the design layout, thereby reducing the time spent on repairing the design layout defects.
  • the first embodiment of the present invention provides a method for repairing design layout defects.
  • the method for repairing design layout defects there is no limitation on whether the mask layout obtained from the design layout has been repaired by OPC.
  • the mask layout in this embodiment is After step S0, the mask layout has been repaired by OPC.
  • the first embodiment of the present invention provides a design layout defect repair method, in step S2 to obtain defect information on the design layout, which specifically includes the following steps:
  • S22 Obtain defect information by detecting the exposure profile and the design layout through photolithography rules.
  • the first embodiment of the present invention provides a design layout defect repair method, which simulates the mask layout to obtain the initial exposure contour, and performs photolithography rule detection on the exposure contour and the design layout to obtain defect information, which can be quickly acquired Defect information is convenient for subsequent classification and positioning of defects based on defect information, so as to reduce the time required for subsequent repair of defects.
  • the defect information includes defect type information and defect location information.
  • Defect types can be divided into EPE (Edge placement error, edge placement error), PINCH (circuit break) and BRIDGE (short circuit).
  • EPE Error placement error
  • PINCH circuit break
  • BRIDGE short circuit
  • the first embodiment of the present invention provides a method for repairing design layout defects.
  • defect information on the design layout information such as defect types and locations can be used to facilitate subsequent steps. Identifying the type of design layout defect can ensure that the subsequent repair method is the corresponding method, and judging the position on the mask layout corresponding to the design layout defect can facilitate subsequent judgment, marking and moving of the defect edge corresponding to the defect , which improves the efficiency of design layout repair and reduces the time consumed.
  • the first embodiment of the present invention provides a method for repairing design layout defects, and repairing the design layout in step S3 includes the following steps:
  • S32 Move the defect edge according to the repair rule and defect type information to obtain the repaired mask layout.
  • the first embodiment of the present invention provides a method for repairing design layout defects.
  • the defect edge is directly moved according to the preset repair rules to repair the defect. , to speed up the defect repair process and reduce the time spent on defect repair.
  • the preset repair rule is a defect modification method corresponding to the defect type and defect location.
  • the first embodiment of the present invention provides a method for repairing design layout defects.
  • Defects can be classified into EPE, PINCH, and BRIDGE, etc., and the modification methods adopted are different according to the type and location of the defect.
  • step S31 includes the following steps:
  • S311 Define a marking area according to the defect location information
  • S312 A side of the mask layout that at least partially falls within the marked area is a defect side.
  • the first embodiment of the present invention provides a method for repairing design layout defects.
  • defect location information By using defect location information, a bounded area is formed. Marking the defect location information according to the defect information can facilitate the subsequent judgment of the defect edge.
  • the area makes part of the edge of the mask layout fall into the defined area and is marked as a defect edge. Defect edges are determined through the region, which facilitates the subsequent repair of defects and reduces the time spent on repairing defects in the design layout.
  • the first embodiment of the present invention provides a design layout defect repair method, and defining the marked area in step S311 includes the following steps:
  • S311a Obtain the center point of the defect according to the defect location information
  • S311b Using the center point as a reference position, define a marking area according to a preset size.
  • the first embodiment of the present invention provides a method for repairing design layout defects, which uses the position of the defect as the center point to define the marking area according to the preset size, that is, forms a rectangular frame with the defect as the center point, and the area contained in the rectangular frame Then it is a bounded area, and the rectangular frame and the edge of the mask layout where the defect is located are contained by the rectangular frame, or the edge of the mask layout where the defect is located coincides or intersects with the boundary of the rectangular frame, then the area within the rectangular frame The edge of the mask layout or the edge of the mask layout that intersects or overlaps with the rectangular frame is judged as a defect edge.
  • step S312 also includes the following steps:
  • S313 Determine the moving direction and moving distance of the defect edge according to the defect type information and repair rules
  • the first embodiment of the present invention provides a design layout defect repair method, which moves the corresponding side of the mask layout corresponding to the defect, that is, the defect side, so that the defect reaches a preset state, and the design layout defect can be completed. repair. According to the type information and position information of the defect, the moving direction and distance of the defect edge are judged, so that the defect can be repaired more quickly and stably.
  • the marking area is defined according to the type of defect.
  • the edge of the marking can be moved with specific rules. It should move toward the inside of the marked area; on the contrary, the edge marked by a negative EPE, that is, a defect whose edge placement error is less than 0, should move toward the outside of the marked area. Edges marked by PINCH defects should move toward the outside of the marked area, while edges marked by BRIDGE defects need to move toward the inside of the marked area.
  • the first embodiment of the present invention provides a method for repairing design layout defects, which further includes after step S3,
  • S4 Simulate the repaired mask layout again to generate an exposure profile and perform defect detection on the exposure profile. If the defect repair does not meet the preset conditions, repair the repaired mask layout again.
  • the first embodiment of the present invention provides a design layout defect repair method, by performing defect detection on the repaired design layout again, to prevent the repair of defects from reaching the preset situation, and to prevent the defect repair from reaching the preset situation
  • the repaired mask layout continues to be repaired, forming multiple iterations, until the defect repair of the final output repaired mask layout reaches a preset condition.
  • a mask layout as shown in FIG. 9 is provided, and manual OPC correction is performed on the mask layout, that is, simulation is performed to obtain the exposure profile of the first version, and defect detection is performed on the exposure profile of the first version to detect the existence of EPE defects, such as As shown in Figure 10, the defect edge is marked for the EPE defect, and the mask layout is repaired iteratively for multiple times, so that the EPE defect at this position is repaired.
  • S201 Simulating the mask layout after the first OPC correction to obtain an exposure profile
  • S202 Perform defect detection on the exposure profile, and find that the simulated exposure profile has an EPE defect
  • S205 Determine the defect edge of the mask layout where the EPE defect is located by defining the area
  • S207 Perform defect detection on the repaired mask layout, and repeat the above steps if the repair of the defect does not meet a preset condition.
  • FIG. 11 shows the mask layout after the 2nd to 5th iterations are completed. In this embodiment, after five iterations, the repair of the mask layout is completed.
  • the first embodiment of the present invention provides a design layout correction method, which provides a design layout and obtains the mask layout of the design layout, simulates the mask layout to obtain the initial exposure profile, and performs photolithography on the exposure profile and the design layout.
  • Rule detection to obtain the defect information on the design layout, according to the position information on the mask layout corresponding to the defect information on the design layout, define the marking area centered on the defect, and pass the marking area and the edge of the mask layout where the defect is located
  • Defect edge is judged by the relationship, and the defect edge is moved according to the defect information and the positional relationship between the defect and the defect edge, so that the defect reaches the preset state, and the defect repair of the design layout is completed.
  • the repaired mask layout is simulated.
  • the generated simulated exposure profile is checked for defects again, and if the defect does not reach the preset state, it is repaired again to form an iteration, and multiple iterations are performed until the mask layout with the defect completely repaired is output.
  • the second embodiment of the present invention provides a computer-readable storage medium 100 with computer program instructions 110 thereon.
  • the computer program instructions 110 are executed by a processor, the above mask layout correction method is implemented.
  • computer program instructions 110 are stored in the computer-readable storage medium 100 in the second embodiment of the present invention, and the instructions of the computer program 110 can be invoked by a processor to implement a design layout defect described in the first embodiment above. Repair method.
  • the computer-readable storage medium 100 has the same beneficial effect as the above-mentioned method for repairing design layout defects, which will not be repeated here.
  • the computer-readable storage medium 100 may be an electronic memory such as flash memory, EEPROM (Electrically Erasable Programmable Read-Only Memory), EPROM, hard disk, or ROM.
  • EEPROM Electrically Erasable Programmable Read-Only Memory
  • EPROM Electrically Erasable Programmable Read-Only Memory
  • hard disk or ROM.
  • the computer-readable storage medium 100 includes a non-volatile computer-readable medium.
  • the computer-readable storage medium 100 has a storage space for computer program instructions 110 for executing any method steps in the above methods. These program instructions can be read from or written into one or more computer program products. Optionally, the computer program instructions 110 may be compressed in a suitable form.
  • the third embodiment of the present invention provides a design layout defect repairing device 200 , which includes a device body 210 and a device operating program 220 .
  • the device body 210 can implement the method described in the first embodiment above when executing the device running program 220 .
  • the device has the same beneficial effects as the above-mentioned method for repairing design layout defects and will not be repeated here.
  • B corresponding to A means that B is associated with A, and B can be determined according to A.
  • determining B based on A does not mean determining B only based on A, and B can also be determined based on A and/or other information.
  • sequence numbers of the above-mentioned processes do not necessarily mean the order of execution, and the execution order of each process should be determined by its functions and internal logic, and should not be used in the implementation of the present invention.
  • the implementation of the examples constitutes no limitation.
  • each block in a flowchart or block diagram may represent a module, program segment, or portion of code that contains one or more logical functions for implementing specified executable instructions.
  • the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or they may sometimes be executed in the reverse order, depending upon the functionality involved.
  • each block in the block diagrams and/or flowcharts, and combinations of blocks in the block diagrams and/or flowcharts can be implemented by a dedicated hardware-based system that performs the specified functions or operations , or may be implemented by a combination of dedicated hardware and computer instructions.
  • a design layout defect repair method provided by the present invention has the following beneficial effects:
  • a method for repairing design layout defects includes the following steps, providing a design layout, and obtaining a mask layout through the design layout; obtaining defect information on the design layout; according to the defect information and preset repair rules The mask layout is repaired to obtain the repaired mask layout.
  • This method classifies and confirms the defects of the design layout, and can determine the type of the defect. Based on the repair rules preset by the defect type and the defect location as the actual situation, repairing according to the preset rules can quickly complete the repair of the defect. Overall, the defects in the design layout can be accurately judged and the mask layout can be quickly repaired, which greatly reduces the time spent on repairing the design layout defects.
  • a design layout defect repair method obtaineds defect information on the design layout, specifically comprising the following steps: performing simulation on the mask layout to obtain the initial exposure profile; Defect information is detected.
  • the mask layout is simulated to obtain the initial exposure contour, and the exposure contour and design layout are detected by photolithography rules to obtain defect information, which can quickly obtain defect information, and facilitate subsequent classification and positioning of defects based on defect information, so as to reduce The time it takes to subsequently fix the defect.
  • the defect information includes defect type information and defect location information
  • the preset repair rule is a defect modification method corresponding to the defect type and defect location.
  • a design layout defect repair method provided by the present invention includes the following steps of repairing the mask layout: obtaining the defect edge of the mask layout corresponding to the defect according to the defect information; moving the defect edge according to the repair rule and defect type information to obtain Mask layout has been fixed. For different defects, according to the defect information, the defect edge is directly moved according to the preset repair rules to repair the defect, which speeds up the defect repair process and reduces the time spent on defect repair.
  • a method for repairing a design layout defect includes the following steps of obtaining the defect edge of the mask layout corresponding to the defect according to the defect information: defining the marked area according to the defect position information; The edge is the defect edge. Marking the position information of the defect according to the defect information can facilitate the subsequent determination of the defect edge, and through the defined area, part of the edge of the mask layout falls into the defined area and is marked as a defect edge. Defect edges are determined through the region, which facilitates the subsequent repair of defects and reduces the time spent on repairing defects in the design layout.
  • defining the marking area includes the following steps: obtaining the center point of the defect according to the defect position information; taking the center point as the reference position, and defining the marking area according to the preset size. According to the type and location of the defect and the relationship between the marked edges, and at the same time determine the moving direction of the edge through specific rules, the defects of the design layout can be repaired faster, thereby reducing the time consumption.
  • a design layout defect repair method provided by the present invention moving the defect edge according to the repair rule to obtain the repaired mask layout includes the following steps: determine the moving direction and moving distance of the defect edge according to the defect type information and the repair rule; Direction and moving distance to move the defect edge. According to the type information and position information of the defect, the moving direction and distance of the defect edge are judged, so that the defect can be repaired more quickly and stably.
  • a method for repairing design layout defects further includes the following steps after repairing the defects: performing simulation on the repaired mask layout again to generate an exposure profile and performing defect detection on the exposure profile.
  • the repaired mask layout is repaired again.
  • Defect detection is performed again on the simulated exposure profile generated by the repaired mask layout to prevent the repair of the defect from reaching the preset situation, and continue to repair the repaired mask layout that has not reached the preset situation, resulting in multiple iterations, until the repair of defects in the final output repaired mask layout reaches a preset condition.
  • the mask layout is a mask layout that has undergone Optical Proximity Correction (OPC), or a mask layout that has not undergone OPC.
  • OPC Optical Proximity Correction
  • Using the design layout that has been corrected by the optical proximity effect can reduce the defects of the design layout, thereby reducing the time spent on repairing the design layout defects.
  • a computer-readable storage medium provided by the present invention has computer program instructions on it, and when the computer program instructions are executed by a processor, the above-mentioned method for repairing design layout defects is realized.
  • the computer-readable storage medium has the same beneficial effects as the above-mentioned method for repairing design layout defects, which will not be repeated here.
  • a device for repairing design layout defects includes a device body and a device operating program, and the above-mentioned method for repairing design layout defects is implemented when the device body executes the device operating program.
  • the device has the same beneficial effect as the above-mentioned method for repairing design layout defects, which will not be repeated here.

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Abstract

本发明涉及图形修复技术领域，一种设计版图缺陷修复方法、存储介质及设备，包括以下步骤，提供设计版图，并通过设计版图获取掩模版图；获取所述设计版图上的缺陷信息；根据所述缺陷信息及预设的修复规则对所述掩模版图进行修复得到已修复的掩模版图。本发明提供的一种设计版图缺陷修复方法、存储介质及设备解决了现有的设计版图修复技术消耗时间多这一问题。

Description

一种设计版图缺陷修复方法、存储介质及设备 【技术领域】
本发明涉及图形修复技术技术领域，其特别涉及一种设计版图缺陷修复方法、存储介质及设备。
【背景技术】
现有的针对设计版图的图形修复方法中修正过程非常依赖工程师的经验，自动化过程不高，修复迭代次数过多，导致了对设计版图修复的周期长，消耗时间多。
【发明内容】
为了解决对设计版图修复消耗时间多的问题，本发明提供一种设计版图缺陷修复方法、存储介质及设备。
本发明为解决上述技术问题，提供如下的技术方案：一种设计版图缺陷修复方法，所述方法包括以下步骤：提供设计版图，并通过设计版图获取掩模版图；获取所述设计版图上的缺陷信息；根据所述缺陷信息及预设的修复规则对所述掩模版图进行修复得到已修复的掩模版图。
优选地，获取所述设计版图上的缺陷信息，具体包括以下步骤：对所述掩模版图进行模拟仿真得到初次曝光 轮廓；将所述曝光轮廓与所述设计版图经光刻规则检测得到所述缺陷信息。
优选地，所述缺陷信息包括缺陷类型信息及缺陷位置信息，所述预设修复规则为根据缺陷类型以及缺陷位置对应的缺陷修改方式。
优选地，对所述设计版图进行修复包括以下步骤：对所述掩模版图进行修复包括以下步骤：根据所述缺陷信息获取所述缺陷对应的所述掩模版图的缺陷边；根据所述修复规则及所述缺陷类型信息移动所述缺陷边得到所述已修复掩模版图。
优选地，根据所述缺陷信息获取所述缺陷对应的所述掩模版图的缺陷边包括以下步骤：根据所述缺陷位置信息界定标记区域；所述掩模版图至少部分落入所述标记区域内的边为所述缺陷边。
优选地，所述界定标记区域包括以下步骤：根据所述缺陷位置信息得到所述缺陷的中心点；以所述中心点为基准位置，根据预设尺寸界定所述标记区域。
优选地，根据所述修复规则移动所述缺陷边得到所述已修复掩模版图包括以下步骤：根据所述缺陷类型信息及所述修复规则判定所述缺陷边的移动方向及移动距离；根据所述移动方向及所述移动距离移动所述缺陷边。
优选地，在修复所述缺陷之后还包括以下步骤：再次 对所述已修复掩模版图进行仿真模拟生成曝光轮廓并对曝光轮廓进行缺陷检测，若对所述缺陷修复未达到预设情况，则对所述已修复掩模版图再次进行修复。
优选地，所述掩模版图为已经过光学邻近效应校正(Optical Proximity Correction，OPC)的掩模版图，或为未经过OPC的掩模版图。
本发明为解决上述技术问题，提供又一技术方案如下：一种计算机可读存储介质，其上存储有计算机程序指令，所述计算机程序指令被处理器执行时实现如上所述的设计版图缺陷修复方法。
本发明为解决上述技术问题，提供又一技术方案如下：一种设计版图缺陷修复设备，所述设备包括设备本体和设备运行程序，所述设备本体执行所述设备运行程序时实现如上所述的设计版图缺陷修复方法。
与现有技术相比，本发明所提供的一种设计版图缺陷修复方法、存储介质及设备，具有如下的有益效果：
1.本发明所提供的一种设计版图缺陷修复方法，方法包括以下步骤，提供设计版图，并通过设计版图获取掩模版图；获取设计版图上的缺陷信息；根据缺陷信息及预设的修复规则对掩模版图进行修复得到已修复的掩模版图。该方法对设计版图的缺陷进行分类以及信息确认，可以判断出缺陷的类型，以该缺陷的类型预设的修复规则，以 缺陷位置为实际，按照预设规则进行修复可以快速对缺陷完成修复，总体可以对设计版图的缺陷进行准确的判断且进行掩模版图快速的修复，极大的减少了对设计版图缺陷进行修复所需要花费的时间。
2.本发明所提供的一种设计版图缺陷修复方法，获取设计版图上的缺陷信息，具体包括以下步骤：对掩模版图进行模拟仿真得到初次曝光轮廓；将曝光轮廓与设计版图经光刻规则检测得到缺陷信息。对掩模版图进行仿真模拟得到初次曝光轮廓，对曝光轮廓以及设计版图进行光刻规则检测得到缺陷信息，可以快速的获取缺陷信息，方便后续依据缺陷信息对缺陷进行分类和定位等，以便于减少后续对缺陷进行修复所需要花费的时间。
3.本发明所提供的一种设计版图缺陷修复方法，缺陷信息包括缺陷类型信息及缺陷位置信息，预设修复规则为根据缺陷类型以及缺陷位置对应的缺陷修改方式。通过对设计版图上的缺陷信息进行识别，可以依据缺陷的类型以及位置等信息，便于后续步骤的进行。对设计版图缺陷的类型进行识别可以保使得后续对其修复的方式为对应方式，对设计版图缺陷的所在位置以及缺陷对应的掩模版图属性进行判定可以方便后续对其缺陷对应的缺陷边进行判断标记以及移动，提高了设计版图修复的效率，减少了所需消耗的时间。
4.本发明所提供的一种设计版图缺陷修复方法，对掩模版图进行修复包括以下步骤：根据缺陷信息获取缺陷对应的掩模版图的缺陷边；根据修复规则及缺陷类型信息移动缺陷边得到已修复掩模版图。针对不同的缺陷，依据缺陷的信息直接根据预设的修复规则对缺陷边进行针对该缺陷的移动，以对缺陷进行修复，加快了缺陷修复的进程，减少了缺陷修复所花费的时间。
5.本发明所提供的一种设计版图缺陷修复方法根据缺陷信息获取缺陷对应的掩模版图的缺陷边包括以下步骤：根据缺陷位置信息界定标记区域；掩模版图至少部分落入标记区域内的边为缺陷边。根据缺陷信息对缺陷的位置信息进行标定可以方便后续对缺陷边进行判定，通过界定的区域使得掩模版图的部分边落入界定区域内，并标记为缺陷边。通过区域判定出缺陷边，便于后续对缺陷的修复，减少了设计版图的缺陷修复所花费的时间。
6.本发明所提供的一种设计版图缺陷修复方法，界定标定区域包括以下步骤：根据缺陷位置信息得到缺陷的中心点；以中心点为基准位置，根据预设尺寸界定标记区域。依据缺陷的类型以及所在的位置以及所标记边的关系，同时通过特定规则判定出边的移动方向，可以更快的对设计版图的缺陷进行修复，进而减少了时间的消耗。
7.本发明所提供的一种设计版图缺陷修复方法，根据 修复规则移动缺陷边得到已修复掩模版图包括以下步骤：根据缺陷类型信息及修复规则判定缺陷边的移动方向及移动距离；根据移动方向及移动距离移动缺陷边。针对缺陷的类型信息以及位置信息，对缺陷边进行移动方向和距离的判定，可以更加快速且稳定的对缺陷进行修复。
8.本发明所提供的一种设计版图缺陷修复方法，在修复缺陷之后还包括以下步骤：再次对已修复掩模版图进行仿真模拟生成曝光轮廓并对曝光轮廓进行缺陷检测，若对缺陷修复未达到预设情况，则对已修复掩模版图再次进行修复。通过对已修复的掩模版图所生成的仿真曝光轮廓再次进行缺陷检测，以防止缺陷的修复未达到预设情况，对缺陷修复未达到预设情况的已修复掩模版图继续进行修复，形成多次迭代，直到最终输出的已修复的掩模版图对缺陷的修复达到预设情况。
9.本发明所提供的一种设计版图缺陷修复方法，掩模版图为已经过光学邻近效应校正(Optical Proximity Correction，OPC)的掩模版图，或为未经过OPC的掩模版图。采用已经过光学邻近效应校正的设计版图可以减少设计版图的缺陷，进而减少了设计版图缺陷修复所需要的花费的时间。
10.本发明所提供的一种计算机可读存储介质，其上有计算机程序指令，计算机程序指令被处理器执行时实现上述 一种设计版图缺陷修复方法。该计算机可读储存介质具有和上述一种设计版图缺陷修复方法相同的有益效果，在此不做赘述。
11.本发明所提供的一种设计版图缺陷修复设备，包括设备本体和设备运行程序，设备本体执行设备运行程序时实现上述一种设计版图缺陷修复方法。该设备具有和上述一种设计版图缺陷修复方法相同的有益效果，在此不做赘述。
【附图说明】
图1是本发明第一实施例提供的一种设计版图缺陷修复方法的流程图。
图2是本发明第一实施例提供的一种设计版图缺陷修复方法的步骤S0的流程图。
图3是本发明第一实施例提供的一种设计版图缺陷修复方法的步骤S2的流程图。
图4是本发明第一实施例提供的一种设计版图缺陷修复方法的步骤S3的流程图。
图5是本发明第一实施例提供的一种设计版图缺陷修复方法的步骤S31的流程图。
图6是本发明第一实施例提供的一种设计版图缺陷修复方法的步骤S311的流程图。
图7是本发明第一实施例提供的一种设计版图缺陷修 复方法的步骤S312之后的流程图。
图8是本发明第一实施例提供的一种设计版图缺陷修复方法的步骤S4的流程图。
图9是本发明第一实施例提供的一种设计版图缺陷修复方法的示例性流程的掩模版图。
图10是本发明第一实施例提供的一种设计版图缺陷修复方法的示例性流程的标记了缺陷边掩模版图。
图11是本发明第一实施例提供的一种设计版图缺陷修复方法的示例性流程的第2-5次迭代后的掩模版图。
图12是本发明第二实施例提供的一种计算机可读存储介质的结构示意图。
图13是本发明第三实施例提供的一种设计版图缺陷修复设备的结构示意图。
附图标识说明：
100、计算机可读存储介质；200、设计版图缺陷修复设备；
110、计算机程序指令；210、设备本体；220、设备运行程序。
【具体实施方式】
为了使本发明的目的，技术方案及优点更加清楚明白，以下结合附图及实施实例，对本发明进行进一步详细说明。 应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
作为一种说明，本发明中的缺陷即设计版图的缺陷是存在于设计版图上，通过设计版图获取的掩模版图的存在的缺陷来源于设计版图上的缺陷，而非获取掩模版图过程中的工艺流程带来的缺陷。
请参阅图1，本发明第一实施例提供一种设计版图缺陷修复方法，包括以下步骤：
S1：提供设计版图，并通过设计版图获取掩模版图；
S2：获取设计版图上的缺陷信息；
S3：根据缺陷信息及预设的修复规则对掩模版图进行修复得到已修复的掩模版图。
可以理解地，本发明第一实施例提供一种设计版图缺陷修复方法，该方法对设计版图的缺陷进行分类以及信息确认，可以判断出缺陷的类型，以该缺陷的类型预设的修复规则，以缺陷位置为实际，按照预设规则进行修复可以快速对缺陷完成修复，总体可以对设计版图的缺陷进行准确的判断且进行掩模版图快速的修复，极大的减少了对设计版图缺陷进行修复所需要花费的时间。
请参阅图2，本发明第一实施例提供一种设计版图缺陷修复方法，步骤S1之后还包括，
S100：对提供的掩模版图进行光学邻近效应校正。
可以理解地，本发明第一实施例提供一种设计版图缺陷修复方法，掩模版图为已经过光学邻近效应校正(Optical Proximity Correction，OPC)的掩模版图，或为未经过OPC的掩模版图。采用已经过光学邻近效应校正的设计版图可以减少设计版图的缺陷，进而减少了设计版图缺陷修复所需要的花费的时间。
可以理解地，本发明第一实施例提供一种设计版图缺陷修复方法中对提供设计版图获取的掩模版图是否经过OPC修复不做限定，作为一种优选，本实施例中的掩模版图为经过步骤S0即经过OPC修复的掩模版图。
请参阅图3，本发明第一实施例提供一种设计版图缺陷修复方法，在步骤S2中获取设计版图上的缺陷信息，具体包括以下步骤：
S21：对掩模版图进行模拟仿真得到初次曝光轮廓；
S22：将曝光轮廓与设计版图经光刻规则检测得到缺陷信息。
可以理解地，本发明第一实施例提供一种设计版图缺陷修复方法，对掩模版图进行仿真模拟得到初次曝光轮廓，对曝光轮廓以及设计版图进行光刻规则检测得到缺陷信息，可以快速的获取缺陷信息，方便后续依据缺陷信息对缺陷进行分类和定位等，以便于减少后续对缺陷进行修复所需要花费的时间。
具体的，缺陷信息包括缺陷类型信息及缺陷位置信息。缺陷类型可分为EPE(Edge placement error，边缘放置误差)、PINCH(电路断路)以及BRIDGE(短路)等。缺陷位置即为设计版图的缺陷在其掩模版图中所对应的位置。
可以理解地，本发明第一实施例提供一种设计版图缺陷修复方法，通过对设计版图上的缺陷信息进行识别，可以依据缺陷的类型以及位置等信息，可以更好地方便后续步骤的进行。对设计版图缺陷的类型进行识别可以保使得后续对其修复的方式为对应方式，对设计版图缺陷对应的掩模版图上的位置进行判定可以方便后续对其缺陷对应的缺陷边进行判断标记以及移动，提高了设计版图修复的效率，减少了所需消耗的时间。
请参阅图4，本发明第一实施例提供一种设计版图缺陷修复方法，步骤S3中对设计版图进行修复包括以下步骤：
S31：根据缺陷信息获取缺陷对应的掩模版图的缺陷边；
S32：根据修复规则及缺陷类型信息移动缺陷边得到已修复掩模版图。
可以理解地，本发明第一实施例提供一种设计版图缺陷修复方法，针对不同的缺陷，依据缺陷的信息直接根据预设的修复规则对缺陷边进行针对该缺陷的移动，以对 缺陷进行修复，加快了缺陷修复的进程，减少了缺陷修复所花费的时间。
具体的，预设修复规则为根据缺陷类型以及缺陷位置对应的缺陷修改方式。
可以理解地，本发明第一实施例提供一种设计版图缺陷修复方法，缺陷可分为EPE、PINCH以及BRIDGE等，根据缺陷的类型以及缺陷的位置所采用的修改方式也不相同。
请参阅图5，本发明第一实施例提供一种设计版图缺陷修复方法，步骤S31包括以下步骤：
S311：根据所述缺陷位置信息界定标记区域；
S312：掩模版图至少部分落入标记区域内的边为缺陷边。
可以理解地，本发明第一实施例提供一种设计版图缺陷修复方法，通过缺陷位置信息，形成一界定区域，根据缺陷信息对缺陷的位置信息进行标定可以方便后续对缺陷边进行判定，通过界定的区域使得掩模版图的部分边落入界定区域内，并标记为缺陷边。通过区域判定出缺陷边，便于后续对缺陷的修复，减少了设计版图的缺陷修复所花费的时间。
请参阅图6，本发明第一实施例提供一种设计版图缺陷修复方法，步骤S311中界定标定区域包括以下步骤：
S311a：根据缺陷位置信息得到缺陷的中心点；
S311b：以中心点为基准位置，根据预设尺寸界定标记区域。
可以理解地，本发明第一实施例提供一种设计版图缺陷修复方法，以缺陷所在位置为中心点根据预设尺寸界定标记区域，即形成以缺陷为中心点的矩形框，矩形框所包含区域则为界定区域，矩形框与该缺陷所在位置的掩模版图的边被矩形框所包含，或者该缺陷所在位置的掩模版图的边与矩形框的边界重合或相交，那么处于矩形框内的掩模版图的边或与矩形框相交或重叠的掩模版图的边均被判断为缺陷边。
请参阅图7，本发明第一实施例提供一种设计版图缺陷修复方法，步骤S312还包括以下步骤：
S313：根据缺陷类型信息及修复规则判定缺陷边的移动方向及移动距离；
S314：根据移动方向及移动距离移动缺陷边。
可以理解地，本发明第一实施例提供一种设计版图缺陷修复方法，对缺陷对应的掩模版图的对应边即缺陷边进行移动，使得缺陷达到预设的状况，即可完成该设计版图缺陷的修复。针对缺陷的类型信息以及位置信息，对缺陷边进行移动方向和距离的判定，可以更加快速且稳定的对缺陷进行修复。
示例性的，在步骤S311中根据缺陷类型界定了标记区域，根据这个标记区域，标记的边可以进行具有特定规则的移动，比方说EPE为正值的缺陷即边缘放置误差大于0，标记的边就应该往标记区域内部的方向去移动；反之，由负值EPE即边缘放置误差小于0的缺陷标定的边，则应该往标记区域外部的方向去移动。由PINCH缺陷标记到的边就应该往标记区域外部的方向去移动，而通过BRIDGE缺陷标记到的边则需要往标记区域内部的方向去移动。
请参阅图8，本发明第一实施例提供一种设计版图缺陷修复方法，步骤S3之后还包括，
S4：再次对已修复掩模版图进行仿真模拟生成曝光轮廓并对曝光轮廓进行缺陷检测，若对缺陷修复未达到预设情况，则对已修复掩模版图再次进行修复。
可以理解地，本发明第一实施例提供一种设计版图缺陷修复方法，通过对已修复的设计版图再次进行缺陷检测，以防止缺陷的修复未达到预设情况，对缺陷修复未达到预设情况的已修复掩模版图继续进行修复，形成多次迭代，直到最终输出的已修复的掩模版图对缺陷的修复达到预设情况。
示例性的，提供一块如图9所示掩模版图，对该掩模版图进行手动OPC修正，即进行仿真模拟得到初版曝光轮廓，对初版曝光轮廓利进行缺陷检测，检测出存在EPE 缺陷，如图示10对EPE缺陷进行缺陷边标记，对掩模版图进行多次迭代修复，使得该位置的EPE缺陷被修复。
具体的，步骤如下：
S201：对经过首次OPC修正的掩模版图进行模拟仿真，获得曝光轮廓；
S202：对曝光轮廓进行缺陷检测，得出该仿真曝光轮廓存在EPE缺陷；
S203：获取EPE缺陷的位置信息；
S204：通过EPE缺陷的位置信息，以EPE缺陷为中心形成一个界定区域；
S205：通过界定区域判断出EPE缺陷所在掩模版图的缺陷边；
S206：依据EPE缺陷与缺陷边的位置信息，对缺陷边进行移动，以对掩模版图的EPE缺陷进行修复；
S207：对已完成修复的掩模版图进行缺陷检测，若缺陷的修复未达到预设情况，则重复上述步骤。
具体的，图11为第2-5次迭代完成后的掩模版图，本实施例中经过五次迭代，完成了对掩模版图的修复。
综上，本发明第一实施例提供一种设计版图修正方法，提供一个设计版图并获取设计版图的掩模版图，对掩模版图模拟仿真得到初次曝光轮廓，对曝光轮廓与设计版图进行光刻规则检测，获取设计版图上的缺陷信息，根据设计版图上 的缺陷信息所对应的掩模版图上的位置信息，界定以缺陷为中心的标记区域，通过标记区域与缺陷所在的掩模版图的边的关系判定缺陷边，根据缺陷信息以及缺陷与缺陷边的位置关系进行缺陷边的移动，使得缺陷达到预设的状态，完成设计版图的缺陷修复，对已完成修复的掩模版图经仿真模拟所生成的仿真曝光轮廓进行再一次缺陷检查，若缺陷未达到预设状态则再次进行修复，形成一个迭代，进行多次迭代，直至输出缺陷被完全修复的掩模版图。
请参阅图12，本发明第二实施例提供一种计算机可读存储介质100，其上有计算机程序指令110，计算机程序指令110被处理器执行时实现上述一种掩模版图修正方法。
可以理解地，本发明第二实施例中的计算机可读存储介质100中存储有计算机程序指令110，计算机程序110指令可被处理器调用执行上述第一实施例中所描述的一种设计版图缺陷修复方法。计算机可读存储介质100具有与上述一种设计版图缺陷修复方法相同的有益效果在此不做赘述。
具体的，计算机可读存储介质100可以是诸如闪存、EEPROM(电可擦除可编程只读存储器)、EPROM、硬盘或者ROM之类的电子存储器。
可选的，计算机可读存储介质100包括非易失性计算机可读介质。
具体的，计算机可读存储介质100具有执行上述方法中的任何方法步骤的计算机程序指令110的存储空间。这些程序指令可以从一个或者多个计算机程序产品中读出或者写入到这一个或者多个计算机程序产品中。可选的，计算机程序指令110可以以适当形式进行压缩。
请参阅图13，本发明第三实施例提供一种设计版图缺陷修复设备200，包括设备本体210和设备运行程序220，设备本体210执行设备运行程序220时实现上述一种设计版图缺陷修复方法。
可以理解地，本发明第三实施例中的设计版图缺陷修复设备200运行时，设备本体210执行设备运行程序220时可实现上述第一实施例中所描述的方法。设备具有与上述一种设计版图缺陷修复方法相同的有益效果在此不做赘述。
在本发明所提供的实施例中，应理解，“与A对应的B”表示B与A相关联，根据A可以确定B。但还应理解，根据A确定B并不意味着仅仅根据A确定B，还可以根据A和/或其他信息确定B。
应理解，说明书通篇中提到的“一个实施例”或“一实施例”意味着与实施例有关的特定特征、结构或特性包括在本发明的至少一个实施例中。因此，在整个说明书各处出现的“在一个实施例中”或“在一实施例中”未必一定指相同的实施例。此外，这些特定特征、结构或特性可以以任意适 合的方式结合在一个或多个实施例中。本领域技术人员也应该知悉，说明书中所描述的实施例均属于可选实施例，所涉及的动作和模块并不一定是本发明所必须的。
在本发明的各种实施例中，应理解，上述各过程的序号的大小并不意味着执行顺序的必然先后，各过程的执行顺序应以其功能和内在逻辑确定，而不应对本发明实施例的实施过程构成任何限定。
在本发明的附图中的流程图和框图，图示了按照本申请各种实施例的系统、方法和计算机程序产品的可能实现的体系架构、功能和操作。在这点上，流程图或框图中的每个方框可以代表一个模块、程序段、或代码的一部分，该模块、程序段、或代码的一部分包含一个或多个用于实现规定的逻辑功能的可执行指令。也应当注意，在有些作为替换的实现方案中，方框中所标注的功能也可以不同于附图中所标注的顺序发生。例如，两个接连地表示的方框实际上可以基本并行地执行，它们有时也可以按相反的顺序执行，在此基于涉及的功能而确定。需要特别注意的是，框图和/或流程图中的每个方框、以及框图和/或流程图中的方框的组合，可以用执行规定的功能或操作的专用的基于硬件的系统来实现，或者可以用专用硬件与计算机指令的组合来实现。
与现有技术相比，本发明所提供给的一种设计版图缺陷修复方法具有如下的有益效果：
1.本发明所提供的一种设计版图缺陷修复方法，方法包括以下步骤，提供设计版图，并通过设计版图获取掩模版图；获取设计版图上的缺陷信息；根据缺陷信息及预设的修复规则对掩模版图进行修复得到已修复的掩模版图。该方法对设计版图的缺陷进行分类以及信息确认，可以判断出缺陷的类型，以该缺陷的类型预设的修复规则，以缺陷位置为实际，按照预设规则进行修复可以快速对缺陷完成修复，总体可以对设计版图的缺陷进行准确的判断且进行掩模版图快速的修复，极大的减少了对设计版图缺陷进行修复所需要花费的时间。
2.本发明所提供的一种设计版图缺陷修复方法，获取设计版图上的缺陷信息，具体包括以下步骤：对掩模版图进行模拟仿真得到初次曝光轮廓；将曝光轮廓与设计版图经光刻规则检测得到缺陷信息。对掩模版图进行仿真模拟得到初次曝光轮廓，对曝光轮廓以及设计版图进行光刻规则检测得到缺陷信息，可以快速的获取缺陷信息，方便后续依据缺陷信息对缺陷进行分类和定位等，以便于减少后续对缺陷进行修复所需要花费的时间。
3.本发明所提供的一种设计版图缺陷修复方法，缺陷信息包括缺陷类型信息及缺陷位置信息，预设修复规则为根据缺陷类型以及缺陷位置对应的缺陷修改方式。通过对设计版图上的缺陷信息进行识别，可以依据缺陷的 类型以及位置等信息，便于后续步骤的进行。对设计版图缺陷的类型进行识别可以保使得后续对其修复的方式为对应方式，对设计版图缺陷的所在位置以及缺陷对应的掩模版图属性进行判定可以方便后续对其缺陷对应的缺陷边进行判断标记以及移动，提高了设计版图修复的效率，减少了所需消耗的时间。
4.本发明所提供的一种设计版图缺陷修复方法，对掩模版图进行修复包括以下步骤：根据缺陷信息获取缺陷对应的掩模版图的缺陷边；根据修复规则及缺陷类型信息移动缺陷边得到已修复掩模版图。针对不同的缺陷，依据缺陷的信息直接根据预设的修复规则对缺陷边进行针对该缺陷的移动，以对缺陷进行修复，加快了缺陷修复的进程，减少了缺陷修复所花费的时间。
5.本发明所提供的一种设计版图缺陷修复方法根据缺陷信息获取缺陷对应的掩模版图的缺陷边包括以下步骤：根据缺陷位置信息界定标记区域；掩模版图至少部分落入标记区域内的边为缺陷边。根据缺陷信息对缺陷的位置信息进行标定可以方便后续对缺陷边进行判定，通过界定的区域使得掩模版图的部分边落入界定区域内，并标记为缺陷边。通过区域判定出缺陷边，便于后续对缺陷的修复，减少了设计版图的缺陷修复所花费的时间。
6.本发明所提供的一种设计版图缺陷修复方法，界定 标定区域包括以下步骤：根据缺陷位置信息得到缺陷的中心点；以中心点为基准位置，根据预设尺寸界定标记区域。依据缺陷的类型以及所在的位置以及所标记边的关系，同时通过特定规则判定出边的移动方向，可以更快的对设计版图的缺陷进行修复，进而减少了时间的消耗。
7.本发明所提供的一种设计版图缺陷修复方法，根据修复规则移动缺陷边得到已修复掩模版图包括以下步骤：根据缺陷类型信息及修复规则判定缺陷边的移动方向及移动距离；根据移动方向及移动距离移动缺陷边。针对缺陷的类型信息以及位置信息，对缺陷边进行移动方向和距离的判定，可以更加快速且稳定的对缺陷进行修复。
8.本发明所提供的一种设计版图缺陷修复方法，在修复缺陷之后还包括以下步骤：再次对已修复掩模版图进行仿真模拟生成曝光轮廓并对曝光轮廓进行缺陷检测，若对缺陷修复未达到预设情况，则对已修复掩模版图再次进行修复。通过对已修复的掩模版图所生成的仿真曝光轮廓再次进行缺陷检测，以防止缺陷的修复未达到预设情况，对缺陷修复未达到预设情况的已修复掩模版图继续进行修复，形成多次迭代，直到最终输出的已修复的掩模版图对缺陷的修复达到预设情况。
9.本发明所提供的一种设计版图缺陷修复方法，掩模版图为已经过光学邻近效应校正(Optical Proximity  Correction，OPC)的掩模版图，或为未经过OPC的掩模版图。采用已经过光学邻近效应校正的设计版图可以减少设计版图的缺陷，进而减少了设计版图缺陷修复所需要的花费的时间。
10.本发明所提供的一种计算机可读存储介质，其上有计算机程序指令，计算机程序指令被处理器执行时实现上述一种设计版图缺陷修复方法。该计算机可读储存介质具有和上述一种设计版图缺陷修复方法相同的有益效果，在此不做赘述。
11.本发明所提供的一种设计版图缺陷修复设备，包括设备本体和设备运行程序，设备本体执行设备运行程序时实现上述一种设计版图缺陷修复方法。该设备具有和上述一种设计版图缺陷修复方法相同的有益效果，在此不做赘述。
以上对本发明实施例公开的一种设计版图缺陷修复方法、存储介质及设备，进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制，凡在本发明的原则之内所作的任何修改，等同替换和改进等均应包含本发明的保护范围之内。

Claims (15)

  1. 一种设计版图缺陷修复方法，其特征在于：所述方法包括以下步骤：
    提供设计版图，并通过设计版图获取掩模版图；
    获取所述设计版图上的缺陷信息；
    根据所述缺陷信息及预设的修复规则对所述掩模版图进行修复得到已修复的掩模版图。
  2. 如权利要求1所述的一种设计版图缺陷修复方法，其特征在于：获取所述设计版图上的缺陷信息，具体包括以下步骤：
    对所述掩模版图进行模拟仿真得到初次曝光轮廓；
    将所述曝光轮廓与所述设计版图经光刻规则检测得到所述缺陷信息。
  3. 如权利要求1所述的一种设计版图缺陷修复方法，其特征在于：所述缺陷信息包括缺陷类型信息及缺陷位置信息，所述预设修复规则为根据缺陷类型以及缺陷位置对应的缺陷修改方式。
  4. 如权利要求3所述的一种设计版图缺陷修复方法，其特征在于：对所述掩模版图进行修复包括以下步骤：
    根据所述缺陷信息获取所述缺陷对应的所述掩模版图的缺陷边；
    根据所述修复规则及所述缺陷类型信息移动所述缺 陷边得到所述已修复掩模版图。
  5. 如权利要求4所述的一种设计版图缺陷修复方法，其特征在于：根据所述缺陷信息获取所述缺陷对应的所述掩模版图的缺陷边包括以下步骤：
    根据所述缺陷位置信息界定标记区域；
    所述掩模版图至少部分落入所述标记区域内的边为所述缺陷边。
  6. 如权利要求5所述的一种设计版图缺陷修复方法，其特征在于：所述界定标记区域包括以下步骤：
    根据所述缺陷位置信息得到所述缺陷的中心点；
    以所述中心点为基准位置，根据预设尺寸界定所述标记区域。
  7. 如权利要求5所述的一种设计版图缺陷修复方法，其特征在于：根据所述修复规则移动所述缺陷边得到所述已修复掩模版图包括以下步骤：
    根据所述缺陷类型信息及所述修复规则判定所述缺陷边的移动方向及移动距离；
    根据所述移动方向及所述移动距离移动所述缺陷边。
  8. 如权利要求4所述的一种设计版图缺陷修复方法，其特征在于：在修复所述缺陷之后还包括以下步骤：
    再次对所述已修复掩模版图进行仿真模拟生成曝光轮廓并对曝光轮廓进行缺陷检测，若对所述缺陷修复未 达到预设情况，则对所述已修复掩模版图再次进行修复。
  9. 如权利要求8所述的一种设计版图缺陷修复方法，其特征在于：
    对所述已修复的掩模版图再次进行修复包括以下步骤：
    对经过首次OPC修正的掩模版图进行模拟仿真，获得曝光轮廓；
    对曝光轮廓进行缺陷检测，得出该仿真曝光轮廓存在EPE缺陷；
    获取EPE缺陷的位置信息；
    通过EPE缺陷的位置信息，以EPE缺陷为中心形成一个界定区域；
    通过界定区域判断出EPE缺陷所在掩模版图的缺陷边；
    依据EPE缺陷与缺陷边的位置信息，对缺陷边进行移动，以对掩模版图的EPE缺陷进行修复。
  10. 如权利要求8所述的一种设计版图缺陷修复方法，其特征在于：
    对所述已修复的掩模版图再次进行修复还包括以下步骤：
    S207：对已完成修复的掩模版图进行缺陷检测，若缺陷的修复未达到预设情况，则重复上述步骤。
  11. 如权利要求1所述的一种设计版图缺陷修复方法，其特征在于：所述掩模版图为已经过光学邻近效应校正(Optical Proximity Correction，OPC)的掩模版图，或为未经过OPC的掩模版图。
  12. 如权利要求1所述的一种设计版图缺陷修复方法，其特征在于：
    在获取掩模版图之后，还包括以下步骤：
    对提供的掩模版图进行光学邻近效应校正。
  13. 一种计算机可读存储介质，其上存储有计算机程序指令，其特征在于：所述计算机程序指令被处理器执行时实现如权利要求1-9中任一项所述方法。
  14. 如权利要求13所述的计算机可读存储介质，其特征在于：
    所述计算机存储介质为闪存、EEPROM(电可擦除可编程只读存储器)、EPROM、硬盘或者ROM之类的电子存储器中的一种或多种。
  15. 一种设计版图缺陷修复设备，其特征在于：所述设备包括设备本体和设备运行程序，所述设备本体执行所述设备运行程序时实现如权利要求1-9中任一项所述方法。
PCT/CN2022/103100 2022-01-25 2022-06-30 一种设计版图缺陷修复方法、存储介质及设备 WO2023142384A1 (zh)

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