WO2023140314A1 - 銅合金板材およびその製造方法 - Google Patents

銅合金板材およびその製造方法 Download PDF

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WO2023140314A1
WO2023140314A1 PCT/JP2023/001476 JP2023001476W WO2023140314A1 WO 2023140314 A1 WO2023140314 A1 WO 2023140314A1 JP 2023001476 W JP2023001476 W JP 2023001476W WO 2023140314 A1 WO2023140314 A1 WO 2023140314A1
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Prior art keywords
mass
copper alloy
orientation
less
rolling
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PCT/JP2023/001476
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English (en)
French (fr)
Japanese (ja)
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紳悟 川田
俊太 秋谷
司 高澤
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Priority to JP2023575289A priority Critical patent/JPWO2023140314A1/ja
Priority to KR1020247013279A priority patent/KR20240137545A/ko
Priority to CN202380013969.XA priority patent/CN118103534A/zh
Publication of WO2023140314A1 publication Critical patent/WO2023140314A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Definitions

  • the present invention relates to a copper alloy sheet material and its manufacturing method, and in particular to a copper alloy sheet material that can be used for parts such as lead frames, connectors, terminals, relays, switches, sockets, and cases for electrical and electronic equipment, and its manufacturing method.
  • Corson copper alloy (Cu-Ni-Si alloy) is known as a copper alloy used for parts such as connectors and lead frames for electrical and electronic equipment.
  • Patent Document 1 describes a copper alloy plate material containing 1.0 to 5.0 mass% of Ni, 0.1 to 2.0 mass% of Si, and 0 to 3.0 mass% in total of at least one selected from the group consisting of B, Mg, P, Cr, Mn, Fe, Co, Zn, Zr, Ag, and Sn, and the balance being copper and inevitable impurities.
  • This document describes a copper alloy sheet material in which the ratio of the total area of crystal grains to the area of all crystal grains is 20% or more for crystal grains having an aspect ratio represented by the ratio of /major diameter of 0.3 or less and oriented within ⁇ 30 ° from the TD direction (plate width direction perpendicular to the rolling direction).
  • the Young's modulus in the sheet width direction perpendicular to the rolling direction is 125 GPa or more
  • the deflection coefficient in the sheet width direction measured by a deflection test is 115 GPa or more
  • the proof stress in the sheet width direction is 600 MPa or more.
  • the Young's modulus especially the Young's modulus in the plate width direction
  • the Young's modulus is large, for example, when a plate-shaped piece is used as a material for manufacturing parts such as terminals with a leaf spring portion, when cutting a plate piece in the plate width direction from the plate material, even a slight change in the displacement of the spring portion causes a large variation in the load applied to the contact.
  • the material strength especially the tensile strength in the plate width direction (the longitudinal direction of the plate-like piece) is low.
  • an object of the present invention is to provide a copper alloy sheet material in which line tension can be set high and good bending workability can be obtained, and a method for manufacturing the same.
  • the present inventors have found that in a copper alloy sheet material having an alloy composition containing at least one of Ni and Co in a total of 1.0% by mass or more and 5.0% by mass or less and Si of 0.10% by mass or more and 1.50% by mass or less, with the balance being Cu and unavoidable impurities, an inverse pole figure showing the strength distribution of the crystal orientation obtained from the crystal orientation analysis data of the SEM-EBSD method for a cross section parallel to the rolling direction and along the plate thickness direction is parallel to the rolling direction.
  • the degree of accumulation of crystal grains having a ⁇ 001> orientation to 8.0 or more and the degree of accumulation of grains having an orientation in which the Schmid factor is 0.49 or more in the sheet width direction perpendicular to the rolling direction to 3.0 or more, even if the tensile strength in the sheet width direction of the copper alloy sheet material is reduced, the tensile strength in the rolling direction can be increased. Arrived.
  • a copper alloy sheet material, wherein the degree of accumulation of crystal grains having orientation is 8.0 or more, and the degree of accumulation of crystal grains having orientation such that the Schmid factor is 0.49 or more in the sheet width direction perpendicular to the rolling direction is 3.0 or more.
  • the alloy composition further contains at least one component selected from the group consisting of Sn, Mg, Mn, Cr, Zr, Ti, Fe, and Zn in a total of 0.01% by mass or more and 1.20% by mass or less.
  • the third cold rolling step [step 9], the solution treatment step [step 10], the second aging treatment step [step 12], the fifth cold rolling step [step 13], and the second annealing step [step 14] are sequentially performed, and in the first temporary aging treatment step [step 5], the attained temperature is in the range of 400 ° C to 600 ° C and the holding time is in the range of 1 hour to 10 hours, and the total working rate in the third cold rolling step [step 9] is 10% to 60%.
  • FIG. 1 is a view showing the position of the ⁇ 001> orientation and the range of orientations where the Schmid factor is 0.49 or more in an inverse pole figure showing the intensity distribution of the crystal orientation obtained from the crystal orientation analysis data of the SEM-EBSD method for the cross section parallel to the rolling direction and along the plate thickness direction.
  • the copper alloy sheet material according to the present invention has an alloy composition containing at least one of Ni and Co in a total of 1.0% by mass to 5.0% by mass and 0.10% by mass to 1.50% by mass of Si, with the balance being Cu and unavoidable impurities.
  • the degree of accumulation of crystal grains having a ⁇ 001> orientation is 8.0 or more, and the degree of accumulation of crystal grains having an orientation such that the Schmid factor is 0.49 or more in the sheet width direction perpendicular to the rolling direction is 3.0 or more.
  • the copper alloy sheet material of the present invention contains one or both of Ni and Co and Si in appropriate amounts and is manufactured under appropriate manufacturing conditions so that the ⁇ 001> orientation of the precipitated crystal grains is oriented in the rolling direction. Therefore, the frequency of existence of crystal grains having the ⁇ 001> orientation parallel to the rolling direction can be increased by 8.0 times or more compared to a structure with a completely random orientation distribution. In addition, since the crystal grains having precipitated crystal grains with a Schmid factor of 0.49 or more are oriented in the sheet width direction, the existence frequency of crystal grains having an orientation with a Schmid factor of 0.49 or more parallel to the sheet width direction can be increased by 3.0 times or more with respect to a structure having a completely random orientation distribution.
  • the copper alloy sheet material of the present invention By using a copper alloy sheet material in which crystal grains having such highly anisotropic orientation are precipitated, it is possible to reduce the tensile strength in the sheet width direction and increase the tensile strength in the rolling direction. Therefore, by using the copper alloy sheet material of the present invention, it is possible to provide a copper alloy sheet material that can set a high line tension particularly along the rolling direction and obtain good bending workability, and a method for producing the same.
  • alloy composition of the copper alloy sheet material of the present invention contains, as essential components, at least one of Ni and Co in total of 1.0% by mass or more and 5.0% by mass or less, and Si in a range of 0.10% by mass or more and 1.50% by mass or less. Reasons for limiting the alloy composition of the copper alloy sheet will be described below.
  • Ni and Co 1.0% by mass or more and 5.0% by mass or less in total
  • Ni (nickel) and Co (cobalt) are important components that act to increase the tensile strength of the copper alloy sheet material. From the viewpoint of exhibiting such an effect, it is necessary to add one or both of Ni and Co, and to contain them in the range of 1.0% by mass or more and 5.0% by mass or less in total. Here, if the total amount of Ni and Co is less than 1.0% by mass, the strength of the material is lowered, and the tensile strength required for electronic parts cannot be obtained.
  • the total amount of Ni and Co exceeds 5.0% by mass, Ni and Co cannot completely dissolve in the solution treatment step [Step 10] described later and remain in the metal structure (matrix) as a second phase. Therefore, the total amount of Ni and Co should be in the range of 1.0% by mass or more and 5.0% by mass or less.
  • Si 0.10% by mass or more and 1.50% by mass or less
  • Si silicon
  • Si is an important component that forms compounds with Ni and Co and has the effect of increasing the tensile strength of copper alloy sheet materials. From the viewpoint of exhibiting such effects, it is necessary to set the Si content to 0.10% by mass or more. On the other hand, if the Si content exceeds 1.50% by mass, it becomes difficult to control the metal structure and the electrical conductivity decreases. Therefore, the Si content should be 0.10% by mass or more and 1.50% by mass or less.
  • the copper alloy sheet material of the present invention can further contain at least one component selected from the group consisting of Sn, Mg, Mn, Cr, Zr, Ti, Fe and Zn as an optional additive component in a total amount of 0.01% by mass or more and 1.20% by mass or less.
  • Sn (tin) is a component highly effective in solid-solution strengthening of copper alloys.
  • the Sn content is preferably 0.01% by mass or more.
  • the Sn content is preferably in the range of 0.01% by mass or more and 0.50% by mass or less.
  • Mg manganesium
  • Mg is a component highly effective in solid-solution strengthening of copper alloys. In order to exhibit this effect, it is preferable to set the Mg content to 0.01% by mass or more. On the other hand, when the Mg content exceeds 0.30% by mass, the electrical conductivity tends to decrease. Therefore, the Mg content is preferably in the range of 0.01% by mass or more and 0.30% by mass or less.
  • Mn manganese
  • Mn manganese
  • the Mn content is preferably in the range of 0.01% by mass or more and 0.30% by mass or less.
  • Cr 0.01% by mass or more and 0.30% by mass or less
  • Cr Cr (chromium) is a component that has the effect of strengthening the material by forming a second phase compound containing Cr and Si, and suppressing coarsening of the crystal grain size in the solution heat treatment process by the compound. In order to exhibit this effect, it is preferable to set the Cr content to 0.01% by mass or more. On the other hand, if the Cr content exceeds 0.30% by mass, coarse crystallized substances are produced during casting, which tend to cause breakage during rolling. Therefore, the Cr content is preferably in the range of 0.01% by mass or more and 0.30% by mass or less.
  • Zr 0.01% by mass or more and 0.15% by mass or less
  • Zr zirconium
  • Zr zirconium
  • the Zr content is preferably in the range of 0.01% by mass or more and 0.15% by mass or less.
  • Ti 0.01% by mass or more and 0.10% by mass or less
  • Ti titanium
  • Ti titanium
  • the Ti content is preferably in the range of 0.01% by mass or more and 0.10% by mass or less.
  • Fe Fe
  • Fe is a component highly effective in solid-solution strengthening of a copper alloy.
  • the Fe content is preferably 0.01% by mass or more.
  • the Fe content is preferably in the range of 0.01% by mass or more and 0.10% by mass or less.
  • Zn 0.01% by mass or more and 0.60% by mass or less
  • Zn (zinc) is a component that has the effect of further improving bending workability and improving adhesion and migration properties of Sn plating.
  • the Zn content is preferably 0.01% by mass or more.
  • the Zn content is preferably in the range of 0.01% by mass or more and 0.60% by mass or less.
  • Total content of optional additive components 0.01% by mass or more and 1.20% by mass or less
  • All of these optional additive components are components having the effect of improving the strength of the material, so it is preferable that the total content is 0.01% by mass or more.
  • the total content of these components exceeds 1.20% by mass, there is a tendency to form compounds or to lower the electrical conductivity, so the total content is preferably 1.20% by mass or less. Therefore, the total content of the optional additive components is preferably in the range of 0.01 mass % or more and 1.20 mass % or less, more preferably 0.20 mass % or more and 1.00 mass % or less.
  • the Cu alloy constituting the copper alloy sheet material has an alloy composition in which the balance is Cu (copper) and inevitable impurities other than the components described above.
  • the term “inevitable impurities” as used herein refers to impurities that are generally present in the raw materials of metal products or that are unavoidably mixed in during the manufacturing process. They are essentially unnecessary impurities, but are allowed in trace amounts and do not affect the characteristics of metal products. Examples of components that can be cited as inevitable impurities include nonmetallic elements such as sulfur (S), carbon (C), and oxygen (O), and metallic elements such as antimony (Sb).
  • the upper limit of the content of these components can be, for example, 0.05% by mass for each of the above components and 0.20% by mass for the total amount of the above components.
  • the degree of accumulation of crystal grains having ⁇ 001> orientation in the rolling direction and the degree of accumulation of crystal grains having an orientation in which the Schmid factor is 0.49 or more in the sheet width direction. is 8.0 or more.
  • the presence frequency of crystal grains having ⁇ 001> orientation in the rolling direction is increased by 8.0 times or more compared to a structure having a completely random orientation distribution due to the anisotropy of the orientation of precipitated crystal grains. Therefore, in the copper alloy sheet material of the present invention, the existence frequency of crystal grains having ⁇ 001> orientation in the rolling direction is 8.0 times or more as compared to the structure having a completely random orientation distribution, so that a high line tension can be applied in the rolling direction when the sheet is passed through the process.
  • the degree of accumulation of crystal grains having an orientation with a Schmid factor of 0.49 or more in the sheet width direction perpendicular to the rolling direction is 3.0 or more.
  • the frequency of existence of crystal grains having an orientation in which the Schmid factor in the sheet width direction is 0.49 or more is increased by 3.0 times or more with respect to a structure having a completely random orientation distribution. Therefore, in the copper alloy sheet material of the present invention, the frequency of existence of grains having an orientation in which the Schmid factor in the sheet width direction is 0.49 or more is 3.0 times or more that of the structure having a completely random orientation distribution.
  • the tensile strength in the rolling direction can be increased by increasing the degree of accumulation of crystal grains having a ⁇ 001> orientation parallel to the rolling direction and the degree of accumulation of crystal grains having an orientation parallel to the width direction and having a Schmid factor of 0.49 or more.
  • Complicated bending can be applied to the copper alloy plate material.
  • the Young's modulus in the rolling direction can be reduced to 120 GPa or less.
  • the Young's modulus in the sheet width direction can be reduced by increasing the accumulation degree of crystal grains having an orientation in which the Schmid factor in the sheet width direction is 0.49 or more to 3.0 or more.
  • the upper limit of the degree of accumulation of crystal grains having ⁇ 001> orientation parallel to the rolling direction is not particularly limited, and can be set to 17.0, for example. Also, the upper limit of the degree of accumulation of crystal grains having an orientation in which the Schmid factor is 0.49 or more in the plate width direction is not particularly limited, and can be set to 5.0, for example.
  • the degree of accumulation of crystal grains having ⁇ 001> orientation in the rolling direction and the degree of accumulation of crystal grains having an orientation in which the Schmid factor is 0.49 or more in the sheet width direction are values obtained from an inverse pole figure showing the intensity distribution of the crystal orientation drawn from the crystal orientation analysis data of this SEM-EBSD method.
  • the crystal orientation analysis data of the SEM-EBSD method can be obtained by mirror-polishing a cross section along the plate thickness direction parallel to the rolling direction of the copper alloy plate material to prepare a cross-sectional sample, observing the cross-sectional sample using a field emission scanning electron microscope (FE-SEM), and performing EBSD measurement (measurement by electron beam backscatter diffraction).
  • the total area to be measured in the EBSD measurement shall be 0.01 mm 2 or more, and the step at the time of measurement shall be 0.2 ⁇ m.
  • an inverse pole figure can be obtained using the data analysis software "OIM ANALYSIS". More specifically, using a harmonic function (Harmonic Series Expansion), the expansion order (Series Rank) is set to 16, the half-width (Gaussian Half-Width) when applied to a Gaussian distribution is 5 °, and the symmetry of the sample is Orthotropic (Rolled sheet). From the obtained inverse pole figure, an inverse pole figure in the rolling direction is drawn, and the degree of accumulation at the position of point A in FIG. 1 is the degree of accumulation of crystal grains having ⁇ 001> orientation in the rolling direction. Also, an inverse pole figure in the plate width direction is drawn, and the maximum value of the degree of accumulation in range B in FIG.
  • the copper alloy sheet material of the present invention preferably has an average grain size of 30 ⁇ m or less and a standard deviation of the average grain size of 15 ⁇ m or less.
  • the crystal grains to be oriented become coarse, and the grain size of the crystal grains increases overall, resulting in an increase in the average crystal grain size, or the grain size of some crystal grains.
  • the average crystal grain size exceeds 30 ⁇ m or the standard deviation exceeds 15 ⁇ m, the presence of large crystal grains tends to cause uneven deformation, resulting in large bending wrinkles during bending and poor workability.
  • the average crystal grain size of the crystal grains is preferably 30 ⁇ m or less, more preferably 20 ⁇ m or less.
  • the standard deviation of the average crystal grain size of the crystal grains is preferably 15 ⁇ m or less, more preferably 10 ⁇ m or less.
  • the average crystal grain size and its standard deviation of the crystal grains of the copper alloy sheet material can be obtained from the grain size (diameter) graph obtained from the crystal orientation analysis data of the above-mentioned SEM-EBSD method using the data analysis software "OIM ANALYSIS". At this time, the average diameter and standard deviation obtained from the Area Fraction can be used as the average crystal grain size of the crystal grains and its standard deviation.
  • the copper alloy material of the present invention preferably has Young's moduli in both the rolling direction and the sheet width direction of 120 GPa or less. As a result, the stress fluctuation due to the displacement difference is reduced, so that it can be suitably used for the parts of electric and electronic devices that are further miniaturized.
  • the Young's modulus is measured using a No. 13B test piece specified in JIS Z2241:2011, which is cut so that the rolling direction and the plate width direction, which are the tensile directions, are the longitudinal directions.
  • the copper alloy sheet of the present invention preferably has a tensile strength in the width direction lower than the tensile strength in the rolling direction by 50 MPa or more.
  • the rolling direction has a tensile strength to which a line tension can be applied, shape defects such as wrinkles are less likely to occur when the sheet is passed through the process.
  • the tensile strength is low in the plate width direction, complicated bending can be performed especially when forming a part extending along the plate width direction. Therefore, by making the tensile strength in the sheet width direction lower than the tensile strength in the rolling direction, it is possible to obtain a copper alloy sheet that is easy to work.
  • the copper alloy sheet material of the present invention preferably has a tensile strength of 600 MPa or more in the rolling direction from the viewpoint of being able to apply line tension.
  • the upper limit of the tensile strength in the rolling direction of the copper alloy sheet material of the present invention is not particularly limited, but can be set to 1000 MPa, for example.
  • the copper alloy sheet material of the present invention preferably has a tensile strength of 900 MPa or less in the sheet width direction from the viewpoint of being able to be subjected to complicated bending.
  • the tensile strength can be measured according to JIS Z2241 using a No. 13B test piece specified in JIS Z2241, which is cut so that the rolling direction and the plate width direction are the longitudinal directions.
  • An example of a method for producing a copper alloy sheet material The copper alloy sheet material described above can be realized by controlling a combination of the alloy composition and the production process, and the production process is not particularly limited. Among them, the following method can be mentioned as an example of a manufacturing process capable of obtaining such high tensile strength and stably excellent drawability.
  • An example of the method for producing a copper alloy sheet material of the present invention is to subject a copper alloy material having an alloy composition equivalent to that of the copper alloy sheet material described above to at least a melting casting process [process 1], a homogenization heat treatment process [process 2], a hot rolling process [process 3], a first cold rolling process [process 4], a first temporary treatment process [process 5], a warm rolling process [process 6], a second cold rolling process [process 7], a first annealing process [process 8], and a third cold rolling process [process 9].
  • the temperature reached is in the range of 400° C. or more and 600° C. or less, and the holding time is in the range of 1 hour or more and 10 hours or less.
  • the total working ratio in the third cold rolling step [step 9] is set in the range of 10% or more and 60% or less.
  • (i) Melting and casting process [process 1]
  • a copper alloy material having an alloy composition equivalent to the alloy composition described above is melted and cast to produce an ingot having a predetermined shape (for example, a thickness of 30 mm, a width of 100 mm, and a length of 200 mm).
  • a high-frequency melting furnace is preferably used to melt and cast the copper alloy material in the air, in an inert gas atmosphere, or in a vacuum.
  • the alloy composition of the copper alloy material may not completely match the alloy composition of the copper alloy sheet material that is produced by adhering or volatilizing in the melting furnace depending on the additive components in each manufacturing process. However, it has substantially the same alloy composition as the alloy composition of the copper alloy sheet material.
  • the homogenization heat treatment step [step 2] is a step of heat-treating the ingot after the casting step [step 1].
  • the heat treatment conditions in the homogenization heat treatment step [step 2] are preferably such that the temperature is in the range of 800° C. or more and 1000° C. or less, and the holding time at the temperature is in the range of 1 hour or more and 10 hours or less.
  • the hot rolling step [step 3] is a step of hot-rolling the ingot that has undergone the homogenizing heat treatment step [step 2] until it reaches a predetermined thickness to produce a hot-rolled material.
  • the hot rolling step [step 3] for example, it is preferable to set the total working ratio (total rolling reduction ratio) to 50% or more and to set it in the range of 800° C. or higher and 1000° C. or lower.
  • the "rolling rate” (reduction rate) is a value obtained by dividing the cross-sectional area before rolling minus the cross-sectional area after rolling by the cross-sectional area before rolling, multiplying by 100, and expressed as a percentage, and is expressed by the following formula.
  • [Processing rate] ⁇ ([cross-sectional area before rolling] - [cross-sectional area after rolling]) / [cross-sectional area before rolling] ⁇ x 100 (%)
  • the means for cooling the hot-rolled material is not particularly limited, but from the viewpoint that a fine and uniform recrystallized structure can be obtained, for example, it is preferable to use a means for increasing the cooling rate, for example, water cooling. It is preferable to set the cooling rate to 10 ° C./second or more.
  • the first cold rolling step [step 4] is a step of cold rolling the hot-rolled material after the hot working step [step 3].
  • the precipitation of crystal grains is facilitated in the first temporary treatment step [step 5], which will be described later, so that the effect of the anisotropy of the crystal grain orientation can be easily obtained.
  • the first temporary treatment step [step 5] is a step of precipitating a compound of Ni or Co and Si by subjecting the cold-rolled material after the first cold rolling step [step 4] to heat treatment according to the alloy composition.
  • the concentration of Ni, Co, and Si in the matrix is reduced by the precipitation of compounds of Ni, Co, and Si. Therefore, in the warm rolling step [step 6] described later, many nuclei of crystal grains having ⁇ 001> orientation in the direction parallel to the rolling direction and nuclei of crystal grains having an orientation in which the Schmid factor is 0.49 or more in the plate width direction perpendicular to the rolling direction can be generated.
  • the heat treatment conditions in the first temporary treatment step [step 5] are such that the reaching temperature is in the range of 400°C or higher and 600°C or lower and the holding time is in the range of 1 hour or longer and 10 hours or shorter, preferably 1 hour or longer and 5 hours or shorter.
  • the concentration of the additive element contained in the matrix is reduced, and as a result, after the solution treatment step [step 10] described later, highly anisotropic crystal grain orientation can be easily obtained.
  • the ultimate temperature is less than 400° C. or when the holding time is less than 1 hour, the crystal grains are not sufficiently precipitated and the effect cannot be obtained.
  • the temperature exceeds 600° C.
  • the crystal grains of the matrix become coarse, making it impossible to obtain the desired structure.
  • the holding time exceeds 10 hours, the grain size of the crystal grains becomes coarse. Therefore, by performing the first temporary treatment step [step 5] under heat treatment conditions in which the reaching temperature is in the range of 400 ° C. or more and 600 ° C. or less and the holding time is in the range of 1 hour to 10 hours, and the warm rolling step [step 6] described later is performed, many nuclei of crystal grains having ⁇ 001> orientation in the direction parallel to the rolling direction and nuclei of crystal grains having an orientation with a Schmid factor of 0.49 or more in the sheet width direction perpendicular to the rolling direction can be generated.
  • this makes it possible to easily produce a copper alloy sheet having a Young's modulus in both the rolling direction and the sheet width direction of 120 GPa or less, a tensile strength in the rolling direction of 600 MPa or more, and a tensile strength in the sheet width direction that is 50 MPa or more lower than the tensile strength in the rolling direction.
  • the warm rolling step [step 6] is a step of warm rolling the aged material after the first temporary hardening step [step 5] to a predetermined thickness.
  • the warm rolling step [step 6] By performing the warm rolling step [step 6], many nuclei of crystal grains having ⁇ 001> orientation in the direction parallel to the rolling direction or having an orientation having a Schmid factor of 0.49 or more in the sheet width direction perpendicular to the rolling direction can be generated.
  • nuclei of crystal grains having ⁇ 001> orientation in the direction parallel to the rolling direction and having an orientation with a Schmid factor of 0.49 or more in the sheet width direction perpendicular to the rolling direction are also generated.
  • the rolling conditions in the warm rolling step [step 6] from the viewpoint of generating a large number of crystal grain nuclei, it is preferable to perform rolling at a total reduction rate (total reduction rate) in the range of 50% or more and 70% or less.
  • the working temperature in the warm rolling step [step 6] is preferably within the range of the temperature reached in the first temporary treatment step [step 5], and water cooling is preferably performed after the warm rolling step [step 6].
  • Second cold rolling step [step 7] is a step of further cold rolling the warm rolled material after the warm rolling step [step 6].
  • the rolling in the second cold rolling step [step 7] introduces many defects inside the material, and from the viewpoint of obtaining a structure having a uniform grain size in the subsequent heat treatment, the total working ratio is preferably 50% or more.
  • the first annealing step [step 8] is an annealing step in which the cold-rolled material after the second cold rolling step [step 7] is subjected to heat treatment to uniformize the strain.
  • the average crystal grain size of the crystal grains after performing the solution treatment step [step 10] described later can be reduced, and a highly uniform structure with a small standard deviation of the average crystal grain size can be formed.
  • the conditions for the heat treatment in the first annealing step [step 8] are such that the reaching temperature is in the range of 400° C. or higher and 700° C. or lower, and the holding time at the reaching temperature is preferably 30 seconds or less.
  • (ix) third cold rolling step [step 9] The cold-rolled material after the first annealing step [step 8] is further subjected to the third cold rolling step [step 9].
  • the desired anisotropic structure has crystal grains that grow rapidly due to recrystallization during the solution treatment step [Step 10], so in order to maintain a fine structure, the total working ratio in the third cold rolling step [Step 9] should be in the range of 10% or more and 60% or less, preferably 10% or more and 50% or less. Thereby, it is possible to easily obtain a copper alloy sheet having an average crystal grain size of 30 ⁇ m or less and a standard deviation of the average crystal grain size of 15 ⁇ m or less.
  • the total working ratio in the third cold rolling step [step 9] is preferably in the range of 15% or more and 40% or less, and more preferably in the range of 20% or more and 35% or less.
  • the solution treatment step [step 10] is a step of heat-treating the cold-rolled material after the third cold rolling step [step 9]. Due to the heat treatment in the solution treatment step [step 10], crystals grow from the nuclei generated in the warm rolling step [step 6], so it is possible to develop a structure containing crystal grains having a ⁇ 001> orientation in the direction parallel to the rolling direction or having an orientation with a Schmid factor of 0.49 or more in the sheet width direction perpendicular to the rolling direction. At this time, crystal grains having a ⁇ 001> orientation in the direction parallel to the rolling direction and an orientation having a Schmid factor of 0.49 or more in the plate width direction perpendicular to the rolling direction may also develop.
  • the conditions for the heat treatment in the solution treatment step [Step 10] are that the temperature reached is in the range of 700° C. or higher and 1000° C. or lower, and the holding time at the reached temperature is 30 seconds or less.
  • a fourth cold rolling step [Step 11] may be carried out in which cold rolling is further applied to the solution treated material after the solution treatment step [Step 10].
  • the total working ratio in the fourth cold rolling step [Step 11] is not particularly limited, but is in the range of more than 0% and 50% or less.
  • the second aging treatment step [step 12] is a step of precipitating crystal grains by subjecting the cold-rolled material after cold rolling to a heat treatment according to the alloy composition.
  • the heat treatment conditions in the second aging treatment step [step 12] are such that the temperature reached is in the range of 400° C. or more and 600° C. or less, and the holding time at the reached temperature is in the range of 1 hour or more and 5 hours or less.
  • the fifth cold rolling step [step 13] is a step of further cold rolling the cold-rolled material after the second aging treatment step [step 12].
  • the total working ratio in the fifth cold rolling step [step 13] is preferably within 70% from the solution treatment step [step 10] combined with the fourth cold rolling step [step 11] from the viewpoint of suppressing deterioration of bending workability.
  • the second annealing step [step 14] is an annealing step in which the cold-rolled material after the fifth cold rolling step [step 13] is subjected to heat treatment to recrystallize.
  • the heat treatment conditions in the second annealing step [step 14] are such that the temperature reached is in the range of 400° C. or higher and 600° C. or lower, and the holding time at the reached temperature is preferably 30 seconds or less, from the viewpoint of improving the workability of the copper alloy sheet.
  • oxide films and the like formed on the surface after each step may be removed as appropriate by chamfering, pickling, or the like.
  • the copper alloy sheet material of the present invention is suitable for use in electrical and electronic parts and the like. More specifically, it is suitable for use in parts such as lead frames, connectors, terminals, relays, switches, sockets and cases for electrical and electronic equipment that particularly require miniaturization and weight reduction.
  • the cooled hot-rolled material was subjected to a first cold rolling step [Step 4] in which the hot-rolled material was rolled so that the longitudinal direction of the hot-rolled material was in the rolling direction under conditions where the total reduction ratio was 50%, followed by a first temporary aging treatment step [Step 5] in which heat treatment was performed at the reached temperature and the holding time shown in Table 1, and a warm rolling step [Step 6] in which the rolled material was rolled so that the longitudinal direction was in the rolling direction at the same temperature and the total reduction ratio was 50%.
  • the rolled material after the warm rolling step [Step 6] was subjected to a second cold rolling step [Step 7] in which the rolled material was rolled so that the longitudinal direction of the rolled material was in the rolling direction under the condition that the total reduction ratio was 95%.
  • a solution treatment step [step 10] was performed in which the temperature reached 700°C or higher and 1000°C or lower was maintained for 30 seconds.
  • a second aging treatment step [step 12] was performed in which the temperature was maintained at a temperature of 400° C. or more and 600° C. or less for 1 hour or more and 5 hours or less.
  • the rolled material after the second aging treatment process [Step 12] was subjected to a fifth cold rolling process [Step 13] in which the rolled material was rolled so that the longitudinal direction of the rolled material was in the rolling direction under the condition that the total reduction ratio was 10% or more and 30% or less, and a second annealing process [Step 14] was performed in which heat treatment was performed at a reaching temperature of 400 ° C or more and 600 ° C or less for a holding time of 30 seconds or less, thereby producing the copper alloy sheet material of the present invention.
  • the copper alloy sheet materials of Examples 1 to 14 of the present invention all have alloy compositions within the appropriate range of the present invention, parallel to the rolling direction and in the thickness direction. Since the degree of accumulation of crystal grains having an orientation with a factor of 0.49 or more was 3.0 or more, the difference between the Young's modulus in the rolling direction, the Young's modulus in the sheet width direction, the tensile strength in the rolling direction, and the tensile strength in the sheet width direction was evaluated as a passing level.
  • the copper alloy sheet material of Comparative Example 1 had a low Si content, and the alloy composition was outside the appropriate range of the present invention.
  • the degree of accumulation of crystal grains having ⁇ 001> orientation in the rolling direction and the degree of accumulation of crystal grains having an orientation in which the Schmid factor is 0.49 or more in the sheet width direction were outside the appropriate range of the present invention. Therefore, in the copper alloy material of Comparative Example 1, the Young's modulus in the rolling direction, the Young's modulus in the sheet width direction, the tensile strength in the rolling direction, and the difference between the tensile strength in the rolling direction and the tensile strength in the sheet width direction did not reach an acceptable level.
  • the copper alloy sheet material of Comparative Example 1 had a low tensile strength in the rolling direction and did not reach an acceptable level, so that the line tension could not be sufficiently increased during pressing, etc., resulting in shape defects.
  • the copper alloy sheet material of Comparative Example 1 had high Young's modulus in the rolling direction and the sheet width direction, which did not reach the acceptable level, and thus was inferior in robustness against contact load.
  • the copper alloy sheet materials of Comparative Examples 2 to 6 did not reach acceptable levels in terms of the Young's modulus in the rolling direction, the Young's modulus in the sheet width direction, the tensile strength in the rolling direction, and the difference in tensile strength in the sheet width direction.
  • the copper alloy sheet materials of Comparative Examples 2 to 6 had a high Young's modulus in one or both of the rolling direction and the sheet width direction, and did not reach an acceptable level, and were inferior in robustness against contact load.
  • the copper alloy sheet material of Comparative Example 7 had a small total amount of Ni and Co, and the alloy composition was outside the appropriate range of the present invention. Therefore, the copper alloy material of Comparative Example 7 did not reach an acceptable level in tensile strength in the rolling direction.
  • the copper alloy sheet material of Comparative Example 7 had a low tensile strength in the rolling direction and did not reach an acceptable level, so that the line tension could not be sufficiently increased during pressing, resulting in a problem of shape defects.
  • the copper alloy sheet material of Comparative Example 8 had a large Si content, and the alloy composition was outside the appropriate range of the present invention.
  • the degree of accumulation of crystal grains having ⁇ 001> orientation in the rolling direction and the degree of accumulation of crystal grains having an orientation in which the Schmid factor is 0.49 or more in the sheet width direction were outside the appropriate range of the present invention. Therefore, in the copper alloy material of Comparative Example 8, the differences in Young's modulus in the rolling direction, Young's modulus in the sheet width direction, tensile strength in the rolling direction, and tensile strength in the sheet width direction did not reach acceptable levels. In particular, the copper alloy sheet material of Comparative Example 8 had high Young's moduli in the rolling direction and the sheet width direction, which did not reach the acceptable level, and thus was inferior in robustness against contact load.
  • the difference in the rolling direction Young's modulus, the sheet width direction Young's modulus, the rolling direction tensile strength, and the sheet width direction tensile strength is at least at an acceptable level when the alloy composition, the degree of accumulation of crystal grains having ⁇ 001> orientation in the rolling direction, and the degree of accumulation of crystal grains having an orientation in which the Schmidt factor is 0.49 or more in the sheet width direction are within appropriate ranges. Therefore, the copper alloy sheet materials of Examples 1 to 14 of the present invention were capable of applying a high line tension in the rolling direction when passing through the process, and were capable of being subjected to complicated bending.

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Publication number Priority date Publication date Assignee Title
JP2008223136A (ja) * 2007-02-13 2008-09-25 Dowa Metaltech Kk Ｃｕ−Ｎｉ−Ｓｉ系銅合金板材およびその製造法
WO2011068134A1 (ja) * 2009-12-02 2011-06-09 古河電気工業株式会社 低ヤング率を有する銅合金板材およびその製造法
WO2012026611A1 (ja) * 2010-08-27 2012-03-01 古河電気工業株式会社 銅合金板材及びその製造方法
JP2013040399A (ja) * 2011-07-15 2013-02-28 Jx Nippon Mining & Metals Corp コルソン合金及びその製造方法
JP2019157153A (ja) * 2018-03-07 2019-09-19 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008223136A (ja) * 2007-02-13 2008-09-25 Dowa Metaltech Kk Ｃｕ−Ｎｉ−Ｓｉ系銅合金板材およびその製造法
WO2011068134A1 (ja) * 2009-12-02 2011-06-09 古河電気工業株式会社 低ヤング率を有する銅合金板材およびその製造法
WO2012026611A1 (ja) * 2010-08-27 2012-03-01 古河電気工業株式会社 銅合金板材及びその製造方法
JP2013040399A (ja) * 2011-07-15 2013-02-28 Jx Nippon Mining & Metals Corp コルソン合金及びその製造方法
JP2019157153A (ja) * 2018-03-07 2019-09-19 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金

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