WO2023140261A1 - アンテナシステムおよびその製造方法並びに設計方法 - Google Patents

アンテナシステムおよびその製造方法並びに設計方法 Download PDF

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Publication number
WO2023140261A1
WO2023140261A1 PCT/JP2023/001227 JP2023001227W WO2023140261A1 WO 2023140261 A1 WO2023140261 A1 WO 2023140261A1 JP 2023001227 W JP2023001227 W JP 2023001227W WO 2023140261 A1 WO2023140261 A1 WO 2023140261A1
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WIPO (PCT)
Prior art keywords
layer
laminate
antenna system
frequency
thickness
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Ceased
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PCT/JP2023/001227
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English (en)
French (fr)
Japanese (ja)
Inventor
啓輔 池田
辰也 砂本
稔 小野寺
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Kuraray Co Ltd
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Kuraray Co Ltd
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Application filed by Kuraray Co Ltd filed Critical Kuraray Co Ltd
Priority to EP23743255.4A priority Critical patent/EP4468517A4/en
Priority to CN202380017218.5A priority patent/CN118575365A/zh
Priority to JP2023575260A priority patent/JP7851967B2/ja
Priority to KR1020247024315A priority patent/KR20240140074A/ko
Priority to US18/729,637 priority patent/US12573742B2/en
Publication of WO2023140261A1 publication Critical patent/WO2023140261A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/32—Adaptation for use in or on road or rail vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/1271—Supports; Mounting means for mounting on windscreens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
    • H01Q1/422—Housings not intimately mechanically associated with radiating elements, e.g. radome comprising two or more layers of dielectric material

Definitions

  • the present invention relates to an antenna system useful for high frequency communication.
  • Patent Literature 1 International Publication No. 2019/177144 describes a configuration in which a radiation element made of a conductive member and a waveguide member are spaced apart via a dielectric member in an antenna unit compatible with high frequencies.
  • Patent Document 2 International Publication No. 2021/112031 discloses, as an antenna system for use at a frequency of 1 GHz or higher, a first glass layer that transmits high frequencies, a low dielectric layer that has a dielectric constant lower than that of the first glass layer and is adjacent to the first glass layer and transmits high frequencies that are incident from the first glass layer, and an antenna circuit board that includes a high frequency insulating layer that is adjacent to the low dielectric layer and receives high frequencies that are incident from the low dielectric layer. and describes an antenna system comprising:
  • An antenna that is installed on the window glass of a mobile object such as an automobile should preferably be as thin as possible.
  • the antenna unit described in Patent Literature 1 is said to be compatible with high frequencies, but is used for window glass of buildings, and the thickness of the entire unit is large.
  • Patent Document 2 describes an antenna system with a thin configuration that can be applied to the window glass of a mobile body, but determines the optimum conditions based on the case where high frequencies are incident from the normal direction of the window glass.
  • the incident direction of the high-frequency waves usually changes.
  • the direction of incidence of high frequency waves changes as in mobile objects.
  • the incident direction of the high frequency wave can change depending on the height at which the antenna is installed.
  • An object of the present invention is to provide an antenna system that is integrated with a glass layer and has excellent transmission characteristics in the GHz band, and that can suppress a decrease in signal strength due to changes in the angle of incidence of high frequencies.
  • the inventors of the present invention studied the effect of the high-frequency incident angle on the glass layer in the antenna system having the glass layer and the low-dielectric layer disclosed in Patent Document 2, and found that when the incident angle deviates from the normal direction, the frequency at which the transmittance is maximized shifts to the high frequency side. As a result of various studies on conditions that can compensate for this incident angle dependence, the inventors have found that by controlling the thickness of the low dielectric layer within a predetermined range, it is possible to ensure high signal intensity over a relatively wide range of incident angles, and have completed the present invention.
  • the present invention can be configured in the following aspects.
  • An antenna system for use at frequencies above 1 GHz comprising: a laminate composed of a plurality of high-frequency-transmitting layers that are in contact with each other at interfaces and that each transmit high-frequency waves;
  • An antenna system comprising: an antenna circuit board that includes a high-frequency insulating layer, is arranged adjacent to the outermost high-frequency transmission layer of the laminate, and receives a high frequency transmitted through the laminate,
  • L nmin be the thickness of the n-th layer when the intensity of the reflected wave from the laminate is minimal, which is obtained as the intensity of the combined wave of the reflected waves from the front surface, the back surface, and each bond
  • ⁇ n is the dielectric constant of the n-th layer constituting the laminate
  • L n is the thickness of the n-th layer constituting the laminate
  • ⁇ n is the refraction angle of the high frequency incident on the n-th layer constituting the laminate
  • ⁇ is the wavelength in air of the high frequency incident on the laminate
  • ⁇ 0 is the relative permittivity of air
  • n represents an integer of 1 or more
  • the high-frequency transmission layer constituting the laminate includes at least one glass layer and at least one transmittance adjusting layer made of a resin layer having a dielectric constant lower than that of the glass, and when the transmittance adjusting layer is the n-th layer, the thickness of the transmittance adjusting layer falls within the range of L nmin ⁇ /(10 ⁇ n ).
  • the antenna system of any one of aspects 1-5 wherein the antenna system constitutes a windowpane of a vehicle or building.
  • Aspect 7 6.
  • the antenna system according to any one of aspects 1 to 5 for receiving radio waves while attached to a vehicle, building, or civil engineering structure.
  • a method of manufacturing an antenna system for use at frequencies above 1 GHz comprising: a laminate composed of a plurality of high-frequency-transmitting layers that are in contact with each other at interfaces and that each transmit high-frequency waves;
  • an antenna system comprising: an antenna circuit board that includes a high-frequency insulating layer, is arranged adjacent to the outermost high-frequency transmission layer of the laminate, and receives the high frequency transmitted through the laminate,
  • the dielectric constant of the n-th layer (n is an integer of 1 or more) of the plurality of high-frequency transmission layers is ⁇ n
  • ⁇ is the wavelength of the high frequency incident on the laminate
  • L nmin be the thickness of the n-th layer when the intensity of the reflected wave from the laminate is minimal, which is obtained as the intensity of the combined wave of the reflected waves from the front surface, the back surface, and each bonding interface of the laminate,
  • the thickness L n of the n-th layer is in the range of L nmin ⁇ /(10 ⁇
  • the laminate includes a laminate precursor including at least one glass layer, and at least one transmittance adjusting layer made of a resin layer having a lower dielectric constant than the glass layer included in the laminate precursor,
  • the transmittance adjusting layer is the n-th layer
  • the thickness of the transmittance adjusting layer is set to the range of L nmin ⁇ /(10 ⁇ n )
  • the antenna circuit board is bonded to the laminated precursor via the transmittance adjusting layer.
  • the present invention in an antenna system, by disposing a high-frequency antenna circuit board and disposing a high-frequency transmission layer with a predetermined layer thickness on the antenna circuit board, the attenuation of high-frequency waves is suppressed, the transmission characteristics of the antenna circuit board for high-frequency waves in a wide incident angle range are improved, and a large amount of information can be exchanged.
  • FIG. 1 is a schematic cross-sectional view showing the configuration of an antenna system according to one embodiment of the present invention.
  • FIG. 3 is a diagram for explaining an optical path (wave path) when a high frequency wave is incident on a laminate of a glass layer and a transmittance adjusting layer that constitute an antenna system; It is a figure which shows the incident angle dependence of the transmission amount of the high frequency which permeate
  • FIG. 5 is a diagram showing changes in the relationship between the frequency of high-frequency waves and the amount of transmission due to the thickness of the transmittance adjusting layer.
  • 4 is a graph showing the incidence angle dependency of the high-frequency transmission amount (dB) for each case where the thickness of the transmittance adjusting layer is changed.
  • 4 is a graph showing the thickness dependence of the reflection intensity of a high frequency for each case where the incident angle of the high frequency is changed.
  • FIG. 1 is a schematic cross-sectional view showing the configuration of an antenna system according to one embodiment of the present invention
  • FIG. 4 is a schematic cross-sectional view showing the configuration of an antenna system according to another embodiment
  • FIG. 4 is a schematic cross-sectional view showing the configuration of an antenna system according to another embodiment
  • FIG. 4 is a schematic cross-sectional view showing the configuration of an antenna system according to another embodiment
  • FIG. 4 is a schematic cross-sectional view for illustrating the configuration of a laminated circuit board included in the antenna system;
  • the antenna system of the present invention is an antenna system for use at a frequency of 1 GHz or higher, and is an antenna system comprising a laminate composed of a plurality of high-frequency transmission layers, and an antenna circuit board arranged adjacent to the outermost high-frequency transmission layer of the laminate and receiving high frequencies transmitted through the laminate.
  • the laminate may include at least one glass layer and at least one transmittance adjusting layer having a dielectric constant lower than that of the glass layer (hereinafter also referred to as a low dielectric layer) as a high frequency transmission layer.
  • adjacent arrangement may be closely arranged on the adjacent surface of the object, may be arranged by bonding on the adjacent surface of the object, or may be arranged close to the object with a space between them.
  • the laminate is formed of a plurality of high frequency transparent layers joined at interfaces. A high frequency incident on the laminate is reflected from the front surface, the back surface, and the interface of each layer.
  • the thickness of each layer is adjusted based on the condition that the intensity of the composite wave of these reflected waves (reflection intensity) is minimized.
  • the thickness L nmin of the n-th layer that minimizes the amplitude of the composite wave of the reflected waves can be calculated from the wavelength ⁇ of the incident wave and the incident angle.
  • at least one layer constituting the high frequency transmission layer may have the above thickness range, two or more layers may have the above thickness range, and all the layers constituting the high frequency transmission layer may have the above thickness range.
  • the amplitude of the composite wave of the reflected waves is As, the reflection intensity is A s 2 .
  • the amplitude A s satisfies the following equation (1).
  • ⁇ n is the dielectric constant of the n-th layer constituting the laminate
  • L n is the thickness of the n-th layer constituting the laminate
  • ⁇ n is the refraction angle of the high frequency incident on the n-th layer constituting the laminate (incident angle from the n-th layer to the n+1-th layer)
  • ⁇ is the wavelength in air of the high frequency incident on the laminate
  • ⁇ 0 is the relative permittivity of air
  • n represents an integer of 1 or more
  • the laminate consists of, for example, N high-frequency transmission layers (where N is an integer equal to or greater than 2)
  • the reflected wave includes reflection from the emission surface of the laminate, so the right side of the above equation (1) is integrated for N+1 terms.
  • ( ⁇ N+1 ) 1/2 cos ⁇ N+1 can be set to ( ⁇ 0 ) 1/2 cos ⁇ 0 in the formula for calculating the amplitude A N+1 of the reflected wave.
  • the film thickness L nmin of the n-th layer at which the reflection intensity is minimized is preferably calculated assuming that the incident angle ⁇ 0 of the incident wave with respect to the laminate is 40 to 70°, preferably 40 to 60°, more preferably 40° to 50°, for example about 45° (45 ⁇ 2°).
  • the incident angle ⁇ 0 of the incident wave with respect to the laminate is 40 to 70°, preferably 40 to 60°, more preferably 40° to 50°, for example about 45° (45 ⁇ 2°).
  • the present invention also includes methods of manufacturing antenna systems and methods of designing antenna systems.
  • the material and thickness of each layer may be selected according to the wavelength of the high frequency to be used so as to satisfy the above relationship.
  • the thickness of each layer or the material and thickness of each layer may be set according to the wavelength of the high frequency to be used so as to satisfy the above relationship.
  • the transmittance adjusting layer may be used to adjust the above conditions.
  • the antenna system may be obtained by bonding an antenna circuit board to an existing laminated precursor (for example, a single-layer glass plate or a laminated glass consisting of a two-layer glass plate and an intermediate film) via a transmittance adjustment layer.
  • an existing laminated precursor for example, a single-layer glass plate or a laminated glass consisting of a two-layer glass plate and an intermediate film
  • the material and thickness of the transmittance adjusting layer may be determined according to the structure and material of the existing laminate precursor. For example, using the above formula (1), the relationship between the amplitude As of the composite wave and the thickness of the transmittance adjusting layer as the n-th layer can be graphed to obtain the value of L nmin .
  • FIG. 1 is a schematic cross-sectional view for explaining an antenna system 1 according to one embodiment of the invention.
  • the antenna system 1 includes a glass layer (first glass layer) 10 , a transmittance adjusting layer 20 having a dielectric constant lower than that of the glass layer 10 , and an antenna circuit board 30 .
  • the transmittance adjusting layer 20 is disposed between the glass layer 10 and the antenna circuit board 30 in the thickness direction (vertical direction in the drawing), and is bonded to the glass layer 10 on one side and the antenna circuit board 30 on the other side.
  • the transmittance adjusting layer 20 has a dielectric constant ⁇ 2 lower than the dielectric constant ⁇ 1 of the glass layer 10 .
  • the antenna circuit board 30 includes a circuit layer 30a, a high frequency insulating layer 30b, and a conductor layer 30c.
  • the antenna circuit board 30 may be a multi-layer circuit board having a plurality of circuit layers and a plurality of insulating layers as described later.
  • the conductor layer 30c may have a circuit pattern as necessary.
  • the thickness of the transmittance adjusting layer 20 discussed below can be regarded as the distance from the interface between the glass layer 10 and the transmittance adjusting layer 20 to the interface between the transmittance adjusting layer 20 and the high frequency insulating layer 30b.
  • FIG. 2 is a diagram for explaining the incident angle dependency of high frequency waves that pass through the laminate 2 composed of the glass layer 10 and the transmittance adjusting layer 20.
  • An incident wave WI that is incident on the laminated body from the outside (upper side of the figure) at an incident angle ⁇ 0 with the normal direction at 0 degrees is partly reflected as a first reflected wave WR1, and partly refracted at a refraction angle ⁇ 1 with the normal direction at 0 degrees to travel through the glass layer 10.
  • This high frequency is then partially reflected at the interface between the glass layer 10 and the transmittance adjusting layer 20 and emitted from the surface of the glass layer 10 as a second reflected wave WR2.
  • part of the high frequency wave incident on the transmittance adjusting layer 20 at a refraction angle ⁇ 2 is emitted from the transmittance adjusting layer 20 as a transmitted wave WT, and the other part is reflected on the surface of the transmittance adjusting layer 20 (in the embodiment of FIG. 1, the interface between the transmittance adjusting layer 2 and the antenna circuit board 3) and emitted from the surface of the glass layer 10 as a third reflected wave WR3.
  • FIG. 3 is a graph showing the incident angle dependency of the amount of high frequency transmitted through the glass layer 10 made of inorganic glass.
  • the frequency at which the transmittance is maximized shifts to the high frequency side as the incident angle increases from 0 degrees to 80 degrees.
  • the transmittance decreases and the signal strength received by the antenna decreases.
  • 3 and the following graphs of FIGS. 4 and 5 were derived using a multi-layer plate reflection transmission coefficient (1D) simulator RT1D Ver. 1.2.0 was used.
  • FIG. 4 is a graph showing how the amount of high-frequency waves transmitted through a laminated body composed of the glass layer 10 and the transmittance adjusting layer 20 changes depending on the thickness of the transmittance adjusting layer 20 .
  • the thickness of the transmittance adjusting layer 20 is 0 mm, which is indicated by the solid line
  • the frequency at which the transmittance adjusting layer 20 is 0.7 mm which is indicated by the dotted line, shifts to the low frequency side.
  • the present invention seeks conditions for obtaining high transmittance over a relatively wide range of incident angles.
  • FIG. 5 is a graph showing the incidence angle dependence of the high frequency transmittance (dB) for each thickness L2 of the transmittance adjusting layer 20 when a high frequency of 28 GHz is incident on the laminate of the glass layer 10 and the transmittance adjusting layer 20.
  • the optimal value of the thickness L2 of the transmittance adjusting layer 20 is 1.8 mm when the incident angle ⁇ 0 is 0°, 2.2 mm when it is 45°, and 2.4 mm when it is 60°.
  • the graph of FIG. 7 below from FIG. 5 is derived under the following conditions.
  • the optimum value of the thickness L2 of the transmittance adjusting layer 20 can be calculated without using an expensive simulator.
  • the amplitude A 1 of the first reflected wave WR1, the amplitude A 2 of the second reflected wave WR2, and the amplitude A 3 of the third reflected wave WR3 can be calculated as follows from the general formula (1) shown above.
  • a 1 (( ⁇ 0 ) 1/2 cos ⁇ 0 -( ⁇ 1 ) 1/2 cos ⁇ 1 )/(( ⁇ 0 ) 1/2 cos ⁇ 0 +( ⁇ 1 ) 1/2 cos ⁇ 1 )
  • a 2 ((( ⁇ 1 ) 1/2 cos ⁇ 1 -( ⁇ 2 ) 1/2 cos ⁇ 2 )/(( ⁇ 1 ) 1/2 cos ⁇ 1 +( ⁇ 2 ) 1/2 cos ⁇ 2 )) ⁇ (1-A 1 2 )
  • a 3 ((( ⁇ 2 ) 1/2 cos ⁇ 2 -( ⁇ 0 ) 1/2 cos ⁇ 3 )/(( ⁇ 2 ) 1/2 cos ⁇ 2 +( ⁇ 0 ) 1/2 cos ⁇ 0 )) ⁇ (1-A 1 2 ) ⁇ (1-A 2 2 ) becomes.
  • ⁇ 1 arc sin(sin ⁇ 0 / ⁇ 1 )
  • ⁇ 2 arc sin(sin ⁇ 0 / ⁇ 2 )
  • ⁇ x 1 , ⁇ x 2 , and ⁇ x 3 be the phase shifts of the first reflected wave WR1, the second reflected wave WR2, and the third reflected wave WR3 from the incident wave, respectively.
  • ⁇ x 1 0
  • ⁇ x 2 2L 1 ( ⁇ 0 ) 1/2 cos ⁇ 1
  • ⁇ x 3 2L 1 ( ⁇ 0 ) 1/2 cos ⁇ 1 +2L 2 (( ⁇ 2 ) 1/2 -( ⁇ 1 ) 1/2 sin ⁇ 1 sin ⁇ 2 )/cos ⁇ 2 .
  • FIG. 6A is a graph showing reflection intensity (As 2 ) when a high frequency wave of 28 GHz is incident on the laminate 2 composed of the glass layer 10 and the transmittance adjusting layer 20 .
  • the thickness (optimal thickness) at which the intensity of the reflected wave is minimized exists periodically, and when the incident angle ⁇ 0 is 0°, the optimal value of the thickness L2 of the transmittance adjusting layer 20 in the first period is 1.8 mm, whereas it is 2.2 mm when the incident angle is 45° and 2.4 mm when the incident angle is 60°.
  • the optimum values obtained here agree with the simulation results in FIG.
  • FIG. 6B is a graph summing the reflection intensity at each incident angle shown in FIG. 6A.
  • the minimum value of the graph appears when the thickness L2 of the transmittance adjusting layer 20 is around 2.2 mm, which substantially corresponds to the incident angle of 45°.
  • FIG. 7 is a graph showing the results of simulating the transmittance of high frequencies passing through the laminate 2 under the same conditions.
  • a multi-layer plate reflection transmission coefficient (1D) simulator RT1D Ver. 1.2.0 was used. This is simulation software that can be obtained from the following website, and calculates the transmittance by inputting the dielectric constant, thickness, and frequency. http://www.e-em.co.jp/App/RT1D.htm
  • the thickness at which the transmittance is maximized for each incident angle agrees well with the simulation results of FIG. 5 and the calculation results of FIG. 6A.
  • This multi-layer plate reflection/transmission coefficient (1D) simulator is practically advantageous because it is possible to obtain the maximum value of transmittance after the second cycle.
  • the incident angle of the high frequency may not be constant.
  • the thickness of the high-frequency transmission layer is adjusted based on the thickness at which the transmittance becomes maximum when the high frequency is incident at a predetermined tilt angle.
  • the effect of compensating the incident angle dependency of the high frequency transmittance can be obtained by adjusting the thickness L2 of the transmittance adjusting layer 2 . It can also be seen from FIG. 6B that it is advantageous to adjust L2 with reference to the optimum value for an angle of incidence of 45°.
  • the thickness L2 of the transmittance adjusting layer 20 has been described, but if possible, the thickness L1 of the glass layer 1 may also be adjusted.
  • the graphs of FIGS. 5 to 7 describe the laminated body 2 having a two-layer structure, the number of high-frequency transmission layers constituting the laminated body 2 is not limited to two, and may be three or more.
  • the thickness L n of the n-th layer of the high-frequency layer that constitutes the laminate may be adjusted within the range of, for example, L n45 ⁇ /10 ⁇ n , where L n45 is the optimum value at an incident angle of 45°.
  • FIG. 8-11 are schematic cross-sectional views illustrating embodiments of the antenna system.
  • the illustration of the laminated structure inside the antenna circuit board 30 is omitted for the sake of simplification.
  • An antenna system 1 according to an embodiment of the present invention may have a configuration as shown in FIG. 1, and as shown in FIG. Alternatively, as shown in FIG. 9, the antenna system 1 of the present invention may be embedded in a laminated glass 3 composed of a front glass layer 11, an intermediate film 21, and a back glass layer 12. FIG. The front side glass layer 11 may then be used as the first glass layer 10 of the antenna system 1 .
  • the intermediate film 21 may be made of a material different from that of the transmittance adjusting layer 20, or may be made of the same material.
  • the intermediate films 21 (21a to 21d) of the laminated glass 3 may constitute the transmittance adjusting layer 20 of the antenna system 1.
  • FIG. The antenna system 1 may comprise a circuit board 30 comprising transmittance adjusting layers of different thicknesses and having different distances from the first glass layer 10 .
  • the intermediate film of the laminated glass 3 is composed of a laminate of a first intermediate layer 21a, a second intermediate layer 21b, a third intermediate layer 21c, and a fourth intermediate layer 21d. constitutes a transmittance adjusting layer between
  • the circuit board 30 of the antenna system 1 may be laminated on the back surface of the laminated glass 3 with the transmittance adjusting layer 20 interposed therebetween.
  • the first glass layer 10 bonded to the transmittance adjusting layer 20 in the antenna system 1 is the rear glass layer 12 of the laminated glass 3 .
  • the front-side glass layer 11 and the intermediate film 21 of the laminated glass 3 may also be regarded as part of the antenna system 1 . Even in the configuration shown in FIG.
  • the transmittance adjusting layer 20 by providing the transmittance adjusting layer 20 on the back side of the laminated glass 3, it is possible to suppress the decrease in the transmittance depending on the incident angle, and by adjusting the thickness of the transmittance adjusting layer 20 to the thickness that maximizes the transmittance based on the case where the incident angle is inclined, it is confirmed by simulations and calculations that the decrease in transmittance when the incident angle is low is suppressed, and high high-frequency transmittance can be obtained even when the incident angle is 40 degrees or more.
  • the front side glass layer 11, the intermediate film 21, the first glass layer 10 (back side glass layer 12), and the transmittance adjusting layer 20 constitute the high frequency transmission layer, and in this order, the first to fourth layers of the high frequency transmission layer.
  • the antenna system 1 shown in FIG. 11 can also be manufactured by attaching the laminate 4 of the circuit board 30 and the transmittance adjusting layer 20 to the ordinary laminated glass 3 .
  • the antenna system laminate 4 as such an intermediate is also included in the present invention.
  • the high-frequency frequencies targeted by the antenna system of the present invention are, for example, 1 GHz or higher, preferably 2 GHz or higher.
  • the high-frequency frequency targeted by the antenna system of the present invention may be, for example, 5 to 6 GHz (eg, 5.8 GHz), more preferably 6 GHz or higher, and even more preferably 10 GHz or higher.
  • the upper limit of the wave number is not particularly limited, it may be, for example, 400 GHz or less, preferably 300 GHz or less.
  • the high-frequency frequency targeted by the antenna system of the present invention may be 10 GHz or more and 100 GHz or less, for example around 28 GHz (26 to 30 GHz, for example 28 GHz).
  • a plurality of antenna circuit boards 30 may be arranged in one antenna system 1, as illustrated in FIG.
  • the antenna system 1 may be a multiband antenna system 1 including a non-high-frequency antenna circuit board (not shown) for radio waves with a frequency of less than 1 GHz.
  • the antenna system 1 may be, for example, one that is incorporated in the window glass of a building, or one that is incorporated in the glass (front glass, side glass, rear glass, sunroof) of a mobile object such as an automobile or train.
  • the antenna system circuit board 30 is preferably arranged in a portion that does not obstruct the field of view.
  • the thickness L 1 of the first glass layer 10 can be appropriately set according to the use of the object provided with the first glass layer 10. For example, it may be about 0.5 to 20 mm, preferably about 1 to 15 mm, more preferably about 1.5 to 10 mm.
  • the first glass layer 10 is a window glass of a building, it may be relatively thick, but when it becomes a surface layer of the antenna system 1 as shown in FIG. 8, it may be thin from the viewpoint of weight reduction.
  • the first glass layer 10 that joins with the transmittance adjusting layer 20 is the back side glass 12 of the laminated glass 3 .
  • the thickness of the second glass layer can also be appropriately set according to the application of the object provided with the laminated glass 3. For example, it may be about 0.5 to 20 mm, preferably about 1 to 15 mm, more preferably about 1.5 to 10 mm.
  • the shape of the first glass layer 10 is not particularly limited as long as the high frequency can reach the antenna circuit board via the transmittance adjustment layer after transmitting the high frequency.
  • the material of the first and second glass layers is not particularly limited as long as it is a material generally used for window glass and the like, and various translucent transparent or translucent organic glass members (e.g., acrylic members, polycarbonate members, etc.) may be used.
  • Preferred examples include inorganic glass members such as soda lime glass, boric acid glass, borosilicate glass, aluminosilicate glass, and quartz glass from the viewpoint of weather resistance and transparency.
  • alkali component alkali-free glass and low-alkali glass can be mentioned.
  • the content of alkali metal components (eg, Na 2 O, K 2 O, Li 2 O) in the glass member is preferably 15% by weight or less, more preferably 10% by weight or less.
  • the glass member is produced by melting a mixture containing a main raw material such as silica or alumina, an antifoaming agent such as mirabilite or antimony oxide, and a reducing agent such as carbon at a temperature of 1400° C. to 1600° C., molding the mixture into a thin plate, and then cooling it.
  • a main raw material such as silica or alumina
  • an antifoaming agent such as mirabilite or antimony oxide
  • a reducing agent such as carbon
  • the glass formed into a predetermined shape such as a plate shape by these methods may be made into a thin plate, or the surface thereof may be given an uneven shape by anti-glare treatment or the like, if necessary.
  • chemical polishing may be performed with a solvent such as hydrofluoric acid.
  • the first and second glass layers may be, for example, vehicle window glass (for example, vehicle window glass for vehicles, railroads, airplanes, ships, etc.) or building window glass.
  • vehicle window glass for example, vehicle window glass for vehicles, railroads, airplanes, ships, etc.
  • building window glass for example, building window glass.
  • the second glass layer may be combined with the first glass layer, and the antenna circuit board may be arranged therebetween.
  • the second glass layer is generally a glass member arranged to face the first glass layer in the thickness direction, and the second glass layer may be made of the same material as or different from the material of the first glass layer.
  • the first and second glass layers may contain a colored region, and the antenna circuit in the antenna circuit board may be arranged in the colored region.
  • the colored regions of the first and/or second glass layer may be partially (for example, edge regions) particularly when visibility is required, such as for window panes, vehicle glass, and the like.
  • the transmittance adjustment (low dielectric layer) has a dielectric constant (relative dielectric constant) lower than that of the first glass layer, and has a role of allowing high frequencies incident from the first glass layer to reach the antenna circuit board.
  • the low dielectric layer has a lower dielectric constant than the first glass layer when compared at the same frequency.
  • the dielectric constant ⁇ f of the low dielectric layer may be, for example, ⁇ g-5 to ⁇ g-0.1, preferably ⁇ g-4.5 to ⁇ g-0.5, more preferably ⁇ g-4 to ⁇ g-1.5.
  • the microstrip line method which can measure the permittivity in the thickness direction.
  • the dielectric properties in the planar direction that can be measured by the Fabry-Perot method may be substituted.
  • the measurement can be performed according to JIS R 1660-2 at 28 GHz (25°C) using a Fabry-Perot resonator (Model No. DPS03) manufactured by Keycom Co., Ltd.
  • This measurement method enables very high precision measurement in both one direction and the direction perpendicular to it (XY directions) on a plane, and enables high precision measurement even for objects with low tan ⁇ .
  • the dielectric constant ⁇ g of the first glass layer may be 5.5 to 7.5, preferably 5.8 to 7.3, more preferably 6.0 to 7.0, and the dielectric constant ⁇ f of the low dielectric layer may be, for example, 2.0 to 4.0, preferably 2.2 to 3.5, more preferably 2.4 to 3.0.
  • the dielectric loss tangent tan ⁇ g of the first glass layer may be 0.05 or less, preferably 0.03 or less, more preferably 0.02 or less, and the dielectric loss tangent tan ⁇ f of the low dielectric layer may be, for example, 0.05 or less, preferably 0.03 or less, more preferably 0.01 or less.
  • the dielectric constant and dielectric loss tangent of the second glass layer can take values similar to those of the first glass layer.
  • the thickness of the low dielectric layer 20 is controlled as described above. Therefore, a single low dielectric layer 20 may be used, or a laminate of two or more thin layers may be used as the low dielectric layer 20 .
  • the thickness L 2 of the low dielectric layer may be selected from a wide range of about 1 ⁇ m to 20.0 mm within the range of L 2min ⁇ /(10 ⁇ 2 ).
  • the low dielectric layer (transmittance adjusting layer) is not particularly limited as long as it has a predetermined dielectric constant and can be in contact with the first glass layer.
  • it may be formed from a thermoplastic resin or a thermosetting resin having a predetermined dielectric constant.
  • the low dielectric layer itself is preferably an adhesive low dielectric layer having adhesiveness.
  • the low dielectric layer may have adhesiveness to the first glass layer, may have adhesiveness to the antenna circuit board, and preferably has adhesiveness to both.
  • the low dielectric layer material When the low dielectric layer has heat-sealability, the low dielectric layer material may be melted to fuse the antenna circuit board and the first glass via the low dielectric layer material.
  • the low dielectric layer material solution may be applied to the bonding surface of the first glass and/or the antenna circuit board, and the antenna circuit board and the first glass may be bonded via the low dielectric layer material.
  • the fusion or bonding (hereinafter referred to as fusion or the like) is preferably performed under degassing and/or under reduced pressure. Degassing may be accomplished by physically pushing air out of the bond interface. Fusion may be performed by preliminarily fusing or adhering the antenna circuit board and the low dielectric material to form a laminate, and then fusing the laminate and the first glass under degassing and/or reduced pressure.
  • adhesive low-dielectric layers examples include polyvinyl acetal resins, olefin-vinyl carboxylate copolymer resins, ionomer resins, acrylic resins, urethane resins, vinyl chloride resins, fatty acid polyamides, polyester resins, silicone elastomers, epoxy resins, polycarbonates, etc., which have good affinity for glass materials such as inorganic glass and resin glass (these materials will be described later).
  • the adhesive low dielectric layer can be adhered by thermocompression bonding, it is possible to suppress the occurrence of disconnection or deformation of the circuit during the bonding, and even if the glass substrate is curved glass such as an automobile windshield, foaming and peeling can be suppressed accordingly.
  • lamination can be performed under general production conditions for laminated glass, so extra steps can be omitted.
  • the antenna circuit board 30 preferably includes at least one circuit layer 30a and at least one high-frequency insulating layer 30b, and its form is not particularly limited, and it can be used as various high-frequency circuit boards by known or conventional means.
  • FIG. 1 shows an antenna circuit board including a circuit layer 30a, a high frequency insulating layer 30b, and a conductor layer 30c.
  • antenna circuit board 30 As another antenna circuit board 30, as shown in the schematic cross-sectional view of FIG. 12, it may be a laminated circuit board having a plurality of circuit layers 31a (including conductor layers 31c), a plurality of insulating layers 31b, and, if necessary, vias (holes for conduction) 31d provided between different circuit layers 31a.
  • the antenna circuit board 30 may be a circuit board (or a semiconductor element mounting board) on which a semiconductor element (for example, an IC chip: not shown) is mounted.
  • the antenna circuit board 30 can be connected, for example, to a transmitting/receiving device (not shown) or the like via a conductive band (not shown).
  • the antenna circuit board 30 is capable of receiving high-frequency electromagnetic waves targeted by the antenna system 1 described above.
  • the antenna circuit board 30 is also preferably capable of transmitting these high frequencies.
  • the circuit layer may be made of, for example, at least a conductive metal, and a circuit may be formed using a known circuit processing method.
  • Conductors forming the circuit layer may be various metals having conductivity, such as gold, silver, copper, iron, nickel, aluminum, or alloy metals thereof.
  • the antenna circuit board may include a conductor layer such as a ground layer in addition to the circuit layer.
  • the conductor layer 30c may be made of various conductive metals such as gold, silver, copper, iron, nickel, aluminum, or alloy metals thereof.
  • the conductors forming the circuit layer and the conductor layer may be the same or different.
  • the antenna circuit board may be used for various transmission lines, such as coaxial lines, strip lines, microstrip lines, coplanar lines, parallel lines, and other known or commonly used transmission lines, and may be used for antennas (for example, microwave or millimeter wave antennas). Also, the circuit board may be used in an antenna device in which an antenna and a transmission line are integrated.
  • the antenna structure may have a known or commonly used structure. Examples include waveguide slot antennas, horn antennas, lens antennas, chip antennas, pattern antennas, printed antennas, triplate antennas, microstrip antennas, patch antennas, and other antennas that use millimeter waves and microwaves.
  • the antenna circuit board (or semiconductor element mounting board) may be used for various sensors, particularly for vehicle-mounted radars.
  • the high-frequency antenna circuit board may be capable of supporting data transmission speeds of 10 gigabits per second or higher.
  • the high-frequency antenna circuit board may be a circuit board compatible with 5G and the next generation.
  • the area of the antenna circuit board is not limited, for example, it may be as small as 5 cm x 5 cm or 3 cm x 3 cm .
  • the lower limit is not particularly limited as long as the antenna system is operated, but it may be, for example, about 1 cm 2 .
  • the antenna circuit board preferably has a high frequency insulating layer.
  • the high-frequency insulating layer is not particularly limited as long as it is an insulating layer capable of reducing transmission loss of electrical signals in a high-frequency circuit.
  • an insulating layer made of polyimide is preferably used because it has excellent heat resistance and excellent chemical resistance.
  • a thermoplastic liquid crystal polymer is preferably employed because of its excellent dielectric properties.
  • the insulating layer may be formed from a thermoplastic liquid crystal polymer film or polyimide film, in which case the antenna circuit board can be obtained by disposing a circuit layer or the like on the thermoplastic liquid crystal polymer film or polyimide film.
  • the material of the high frequency insulating layer will be described later.
  • the thickness of the insulating layer 30b in the antenna circuit board 30 can be appropriately set according to the required antenna performance, and can be selected from a wide range of, for example, 10 ⁇ m to 2.5 mm.
  • the thickness of the insulating layer indicates the total thickness of the insulating layers constituting the multilayer circuit board (or the total thickness of all the insulating layers).
  • the dielectric constant ⁇ p in both one direction and the direction perpendicular thereto in the plane of the high frequency insulating layer may be, for example, 2.0 to 4.0, preferably 2.2 to 3.5, more preferably 2.4 to 3.0 at a frequency of 28 GHz.
  • the dielectric loss tangent tan ⁇ p in both one direction and the direction perpendicular thereto in the plane of the high-frequency insulating layer may be, for example, 0.010 or less, preferably 0.005 or less, more preferably 0.003 or less at a frequency of 28 GHz.
  • the dielectric properties are values measured by the method described above.
  • the antenna system can be manufactured according to the method described in the example of Patent Document 2, except that the control range of the thickness of the transmittance adjustment layer 20 is different.
  • a circuit is formed by thermocompression bonding copper foil to both sides of the insulating film and removing part of the copper foil by etching.
  • a multilayer circuit board can be obtained by repeatedly pressing and etching an insulating film and a copper foil.
  • An antenna system having a desired structure can be obtained by laminating the antenna circuit board thus formed with a separately prepared low dielectric film and glass, and forming a laminated body using a vacuum laminator or a vacuum bag. An example of a specific manufacturing method will be described later.
  • polyvinyl acetal resin examples include polyvinyl acetal resins produced by acetalization of vinyl alcohol-based resins such as polyvinyl alcohol or vinyl alcohol copolymers.
  • the low dielectric layer contains a polyvinyl acetal resin, it may contain one type of polyvinyl acetal resin, or may contain two or more polyvinyl acetal resins different in at least one of the viscosity-average degree of polymerization, degree of acetalization, acetyl group content, hydroxyl group content, ethylene content, molecular weight of aldehyde used for acetalization, and chain length.
  • polyvinyl acetal resin contains two or more different polyvinyl acetal resins
  • a mixture of two or more polyvinyl acetal resins each having a different viscosity-average polymerization degree, acetalization degree, acetyl group content, or hydroxyl group content is preferred from the viewpoint of ease of melt molding.
  • the polyvinyl acetal resin used in the present invention can be obtained by a known or conventional method.
  • an acetalization reaction is performed by adding an aldehyde (or a keto compound) and an acid catalyst to an aqueous solution of polyvinyl alcohol or vinyl alcohol copolymer.
  • a neutralizing agent such as an alkali is added for neutralization, and the resin is filtered, washed with water and dried to obtain a polyvinyl acetal resin.
  • Polyvinyl alcohol can be obtained by saponifying a polyvinyl ester obtained by polymerizing a vinyl ester compound, and a vinyl alcohol copolymer can be obtained by saponifying a copolymer of a vinyl ester compound and other monomers.
  • vinyl ester compounds for example, vinyl acetate, 1 -acetate, 1 -methyl vinyl, 1 -butenyl acetate, 2 -methyl -propenyl, vinyl, vinyl, vinyl, pivarine, pivarine acid, pentantic acid vinyl, pentantic acid vinyl, pentantic acid.
  • vinyl ester compounds can be used alone or in combination.
  • vinyl ester compounds vinyl acetate is preferred from the viewpoint of productivity.
  • monomers include, for example, ⁇ -olefins such as ethylene, propylene, n-butene, and isobutylene; acrylic acid and its salts; acrylic acid esters such as methyl acrylate, ethyl acrylate, n-propyl acrylate, i-propyl acrylate, n-butyl acrylate, i-butyl acrylate, t-butyl acrylate, 2-ethylhexyl acrylate, dodecyl acrylate, and octadecyl acrylate; methacrylic acid and its salts; methyl methacrylate, ethyl methacrylate, Methacrylic acid esters such as n-propyl methacrylate, i-propyl methacrylate, n-butyl methacrylate, i-butyl methacrylate, t-butyl methacrylate, 2-ethylhexyl meth
  • the acid catalyst used for the acetalization reaction is not particularly limited, and both organic acids and inorganic acids can be used. Examples thereof include acetic acid, p-toluenesulfonic acid, nitric acid, sulfuric acid and hydrochloric acid. Among them, hydrochloric acid, sulfuric acid and nitric acid are preferable from the viewpoint of acid strength and ease of removal during washing.
  • the aldehyde (or keto compound) used to produce the polyvinyl acetal resin is preferably linear, branched or cyclic having 1 to 10 carbon atoms, more preferably linear or branched. This leads to corresponding linear or branched acetal side chains.
  • the polyvinyl acetal resin used in the present invention may be obtained by acetalizing polyvinyl alcohol or vinyl alcohol copolymer with a mixture of multiple aldehydes (or keto compounds).
  • Polyvinyl alcohol or vinyl alcohol copolymer may be composed of either one alone, or may be a mixture of polyvinyl alcohol and vinyl alcohol copolymer.
  • aldehydes include aliphatic, aromatic, and alicyclic aldehydes such as formaldehyde, acetaldehyde, propionaldehyde, n-butyraldehyde, isobutyraldehyde, valeraldehyde, isovaleraldehyde, n-hexylaldehyde, 2-ethylbutyraldehyde, n-heptylaldehyde, n-octylaldehyde, 2-ethylhexylaldehyde, n-nonylaldehyde, n-decylaldehyde, benzaldehyde, and cinnamaldehyde.
  • formaldehyde acetaldehyde, propionaldehyde
  • n-butyraldehyde isobutyraldehyde
  • valeraldehyde isovaleraldeh
  • aldehydes having 2 to 6 carbon atoms are preferable, and n-butyraldehyde is particularly preferable from the viewpoint of easily obtaining a polyvinyl acetal resin having suitable breaking energy.
  • aldehydes can be used alone or in combination of two or more.
  • polyfunctional aldehydes, aldehydes having other functional groups, and the like may be used together in an amount of 20% by mass or less of the total aldehydes.
  • the content of n-butyraldehyde in the aldehyde used for acetalization is preferably 50% by mass or more, more preferably 80% by mass or more, still more preferably 95% by mass or more, particularly preferably 99% by mass or more, and may be 100% by mass.
  • the viscosity average degree of polymerization of polyvinyl alcohol which is a raw material of polyvinyl acetal resin, is preferably 100 or more, more preferably 300 or more, more preferably 400 or more, even more preferably 600 or more, particularly preferably 700 or more, and most preferably 750 or more.
  • the viscosity average degree of polymerization of polyvinyl alcohol which is a raw material of the polyvinyl acetal resin, is preferably 500 or more, more preferably 900 or more, more preferably 1000 or more, still more preferably 1200 or more, particularly preferably 1500 or more, and most preferably 1600 or more.
  • the viscosity average degree of polymerization of polyvinyl alcohol is preferably 5000 or less, more preferably 3000 or less, still more preferably 2500 or less, particularly preferably 2300 or less, and most preferably 2000 or less.
  • the viscosity average degree of polymerization of polyvinyl alcohol can be measured, for example, based on JIS K 6726 "Polyvinyl alcohol test method".
  • the viscosity-average polymerization degree of polyvinyl acetal resin usually matches the viscosity-average polymerization degree of polyvinyl alcohol as a raw material
  • the preferable viscosity-average polymerization degree of polyvinyl alcohol matches the preferable viscosity-average polymerization degree of polyvinyl acetal resin.
  • the viscosity-average degree of polymerization of at least one polyvinyl acetal resin is not less than the lower limit and not more than the upper limit.
  • the amount of acetyl groups in the polyvinyl acetal resin constituting the low dielectric layer is preferably 0.01 to 20% by mass, more preferably 0.05 to 10% by mass, and still more preferably 0.1 to 5% by mass based on the ethylene unit of the polyvinyl acetal main chain.
  • the acetyl group content of the polyvinyl acetal resin can be adjusted by appropriately adjusting the degree of saponification of the raw polyvinyl alcohol or vinyl alcohol copolymer.
  • the acetyl group content of at least one polyvinyl acetal resin is preferably within the above range.
  • the degree of acetalization of the polyvinyl acetal resin used in the present invention is not particularly limited, it is preferably 40 to 86 mol%, more preferably 45 to 82 mol%, even more preferably 50 to 78 mol%, particularly preferably 60 to 74 mol%, and most preferably 68 to 74 mol%.
  • the degree of acetalization of the polyvinyl acetal resin can be adjusted within the above range by appropriately adjusting the amount of aldehyde used when the polyvinyl alcohol resin is acetalized. When the degree of acetalization is within the above range, the compatibility between the polyvinyl acetal resin and the plasticizer is less likely to decrease.
  • the degree of acetalization of at least one polyvinyl acetal resin is preferably within the above range.
  • the hydroxyl group content of the polyvinyl acetal resin is preferably 6 to 26% by mass, more preferably 12 to 24% by mass, more preferably 15 to 22% by mass, particularly preferably 18 to 21% by mass, based on the ethylene unit of the polyvinyl acetal main chain.
  • the amount of aldehyde used in acetalizing the polyvinyl alcohol resin can be adjusted within the above range.
  • the amount of hydroxyl groups in at least one polyvinyl acetal resin is preferably within the above range.
  • Polyvinyl acetal resins are usually composed of acetal group units, hydroxyl group units and acetyl group units, and the amount of each of these units can be measured, for example, by JIS K 6728 "Polyvinyl butyral test method" or nuclear magnetic resonance (NMR).
  • JIS K 6728 Polyvinyl butyral test method
  • NMR nuclear magnetic resonance
  • the amount of hydroxyl group units and the amount of acetyl group units are measured, and by subtracting both of these unit amounts from the acetal group unit amount when no units other than acetal group units are included, the remaining acetal group unit amount can be calculated.
  • the low dielectric layer preferably contains uncrosslinked polyvinyl acetal from the viewpoint of easily obtaining good film formability, but may also contain crosslinked polyvinyl acetal.
  • polyvinyl acetal may be cross-linked by thermal self-cross-linking with carboxyl group-containing polyvinyl acetal, or by intermolecular cross-linking with polyaldehyde, glyoxylic acid, or the like.
  • the viscosity of the polyvinyl acetal resin can be appropriately set according to the type used.
  • the viscosity of the polyvinyl acetal resin can be adjusted by using or using together a polyvinyl acetal resin produced using a polyvinyl alcohol resin having a high or low viscosity-average degree of polymerization as a raw material or a part of the raw material.
  • the viscosity is the viscosity of such mixture.
  • the polyvinyl acetal resin may be combined with a known or commonly used plasticizer as needed.
  • plasticizers include the following plasticizers. These plasticizers may be used alone or in combination of two or more.
  • the low dielectric layer may be formed as a plasticized polyvinyl acetal resin composition composed of a plasticizer and a polyvinyl acetal resin.
  • esters of polyhydric aliphatic or aromatic acids For example, dialkyl adipates (e.g., dihexyl adipate, di-2-ethylbutyl adipate, dioctyl adipate, di-2-ethylhexyl adipate, hexylcyclohexyl adipate, mixtures of heptyl adipate and nonyl adipate, diisononyl adipate, heptyl nonyl adipate); esters of adipic acid with alcohols including alicyclic ester alcohols or ether compounds (e.g., di(butoxyethyl) adipate dialkyl sebacate (e.g., dibutyl sebacate); esters of sebacic acid with alcohols containing alicyclic or ether compounds; esters of phthalic acid (e.g.
  • Esters or ethers of polyhydric aliphatic or aromatic alcohols or oligoether glycols having one or more aliphatic or aromatic substituents examples include esters of glycerin, diglycol, triglycol, tetraglycol, etc. with linear or branched aliphatic or alicyclic carboxylic acids.
  • Specific examples include diethylene glycol-bis-(2-ethylhexanoate), triethylene glycol-bis-(2-ethylhexanoate), triethylene glycol-bis-(2-ethylbutanoate), tetraethylene glycol-bis-n-heptanoate, triethylene glycol-bis-n-heptanoate, triethylene glycol-bis-n-hexanoate, tetraethylene glycol dimethyl ether, and dipropylene glycol benzoate.
  • Phosphate esters of aliphatic or aromatic ester alcohols Phosphate esters of aliphatic or aromatic ester alcohols.
  • Examples include tris(2-ethylhexyl) phosphate (TOF), triethyl phosphate, diphenyl-2-ethylhexyl phosphate, and tricresyl phosphate. • Esters of citric acid, succinic acid and/or fumaric acid.
  • polyesters or oligoesters composed of polyhydric alcohols and polycarboxylic acids, terminal esterified products or etherified products thereof, polyesters or oligoesters composed of lactones or hydroxycarboxylic acids, terminal esterified products or etherified products thereof, etc. may be used as plasticizers.
  • the content of the plasticizer may be, for example, 0 to 40% by mass, preferably 0 to 30% by mass, more preferably 0 to 15% by mass, still more preferably 0 to 10% by mass, and even more preferably 0 to 5% by mass, based on the total amount of the polyvinyl acetal resin and the plasticizer.
  • Preferred polyvinyl acetal resins are commercially available, for example, from Kuraray Co., Ltd. as "Mobital (trademark),” and polyvinyl acetal resin films are commercially available, for example, from Kuraray Co., Ltd., as "Trosifol (trademark)."
  • a plasticizer may be further applied to a film composed of polyvinyl acetal resin to enhance the adhesiveness of the polyvinyl acetal resin with the plasticizer.
  • plasticizers the plasticizers described above can be used, and triethylene glycol-bis-(2-ethylbutanoate), triethylene glycol-bis-(2-ethylhexanoate), dihexyl adipate, dibutyl sebacate, di(butoxyethyl) adipate, and di(butoxyethoxyethyl) adipate are preferable, and triethylene glycol-bis-(2-ethylhexanoate), di (Butoxyethyl)adipate and di(butoxyethoxyethyl)adipate are more preferred, and di(butoxyethyl)adipate and di(butoxyethoxyethyl)adipate are particularly preferred.
  • the olefin-vinyl carboxylate copolymer resin is not particularly limited as long as it has a dielectric constant lower than that of the first glass layer.
  • the olefin include ethylene, propylene, n-butene, isobutylene, butadiene, and isoprene.
  • the vinyl carboxylate include the vinyl ester compounds exemplified in the polyvinyl acetal resin section.
  • an ethylene-vinyl acetate copolymer resin in which ethylene is used as the olefin and vinyl acetate is used as the vinyl carboxylate compound is preferable because the dielectric constant can be controlled and the adhesiveness is good.
  • the olefin-vinyl carboxylate copolymer resin may further copolymerize a monomer as a third component as long as the dielectric constant can be controlled within a predetermined range.
  • the monomer as the third component include acrylic acid esters, methacrylic acid esters, acrylamide and its derivatives, methacrylamide and its derivatives, vinyl ethers, nitriles, vinyl halides, vinylidene halides, allyl compounds, unsaturated carboxylic acids and their derivatives, and vinylsilyl compounds described in the section of the polyvinyl acetal resin. These monomers can be used alone or in combination of two or more. When these other monomers are copolymerized, it is generally preferred that these other monomers are used in a proportion of less than 10 mol % relative to the vinyl carboxylate compound.
  • the ratio of the vinyl carboxylate unit to the total of the olefin unit and the vinyl carboxylate unit is, for example, preferably less than 50 mol%, more preferably 30 mol% or less, further preferably 20 mol% or less, and particularly preferably 15 mol% or less.
  • the lower limit of vinyl carboxylate is not particularly limited, it may be, for example, about 5 mol %.
  • a preferred olefin-vinyl carboxylate copolymer resin is, for example, ethylene vinyl acetate marketed by Tosoh Corporation as "Mersen (trademark)".
  • the ionomer resin is not particularly limited, but includes a structural unit derived from an olefin such as ethylene, and a structural unit derived from an ⁇ , ⁇ -unsaturated carboxylic acid, and at least a portion of the ⁇ , ⁇ -unsaturated carboxylic acid is a thermoplastic resin neutralized with a metal ion.
  • metal ions include alkali metal ions such as sodium ions; alkaline earth metal ions such as magnesium ions; and zinc ions.
  • the content of ⁇ , ⁇ -unsaturated carboxylic acid structural units is preferably 2% by mass or more, more preferably 5% by mass or more, based on the mass of the ethylene- ⁇ , ⁇ -unsaturated carboxylic acid copolymer. Also, the content of structural units of ⁇ , ⁇ -unsaturated carboxylic acid is preferably 30% by mass or less, more preferably 20% by mass or less.
  • Examples of structural units derived from ⁇ , ⁇ -unsaturated carboxylic acids possessed by ionomer resins include structural units derived from acrylic acid, methacrylic acid, maleic acid, monomethyl maleate, monoethyl maleate, and maleic anhydride. Among them, structural units derived from acrylic acid or methacrylic acid are particularly preferred.
  • an ethylene-acrylic acid copolymer ionomer and an ethylene-methacrylic acid copolymer ionomer are more preferable, and an ethylene-acrylic acid copolymer zinc ionomer, an ethylene-acrylic acid copolymer sodium ionomer, an ethylene-methacrylic acid copolymer zinc ionomer, and an ethylene-methacrylic acid copolymer sodium ionomer are particularly preferable.
  • the ionomer resins can be used alone or in combination of two or more.
  • Preferred ionomer resin-made films are commercially available, for example, from Kuraray Co., Ltd. as "Sentryglas (trademark)".
  • the acrylic resin is preferably a polymer obtained from an acrylic acid ester-based monomer and/or a methacrylic acid ester-based monomer, and the monomers include alkyl acrylates such as methyl acrylate, ethyl acrylate and n-propyl acrylate; modified acrylates such as glycidyl acrylate and 2-hydroxyethyl acrylate; polyfunctional acrylates such as ethylene glycol diacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, neopentyl glycol diacrylate and pentaerythritol triacrylate; alkyl methacrylates; modified methacrylates such as glycidyl methacrylate and 2-hydroxyethyl methacrylate; polyfunctional methacrylates such as ethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, neopentyl glycol dimeth
  • Copolymers of acrylic acid ester-based monomers and/or methacrylic acid ester-based monomers with unsaturated carboxylic acids such as acrylic acid and methacrylic acid; acrylamides such as N,N-dimethylacrylamide; and aromatic vinyl compounds such as styrene and ⁇ -methylstyrene can also be suitably used as acrylic resins.
  • a preferable acrylic resin is marketed as "3S resin” by Shinko Glass Industry Co., Ltd. as a liquid injection type resin.
  • the low dielectric layer may contain known or commonly used additives as required.
  • additives include solvents, plasticizers, ultraviolet absorbers, antioxidants, adhesion modifiers, brighteners or fluorescent brighteners, stabilizers, dyes, processing aids, organic or inorganic nanoparticles, calcined silicic acid and surfactants.
  • An additive can be used individually or in combination of 2 or more types.
  • an insulating layer made of polyimide (hereinafter sometimes referred to as a polyimide insulating layer) is preferable.
  • Polyimide is not particularly limited as long as it is a polymer having an imide group in a structural unit, and examples thereof include polyimide resins such as polyimide, polyamideimide, polybenzimidazole, polyimideester, polyetherimide, and polysiloxaneimide.
  • Polyimide can be formed by imidizing (curing) the precursor polyamic acid.
  • a polyamic acid can be synthesized by reacting a known diamine and a tetracarboxylic acid (including its acid anhydride) in the presence of a solvent.
  • diamines aromatic diamines, aliphatic diamines, alicyclic diamines, etc. can be used, and from the viewpoint of heat resistance, aromatic diamines are preferred.
  • aromatic diamines examples include 4,4'-diaminodiphenyl ether, 2'-methoxy-4,4'-diaminobenzanilide, 1,4-bis(4-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 2,2'-bis[4-(4-aminophenoxy)phenyl]propane, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxy-4,4'-di aminobiphenyl, 4,4'-diaminobenzanilide, 5-amino-2-(p-aminophenyl)benzoxazole and the like.
  • an aromatic tetracarboxylic acid an aromatic tetracarboxylic acid, an aliphatic tetracarboxylic acid, an alicyclic tetracarboxylic acid, an acid anhydride thereof, or the like can be used.
  • an aromatic tetracarboxylic acid anhydride is preferable.
  • aromatic tetracarboxylic anhydrides include pyromellitic anhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-diphenylsulfonetetracarboxylic dianhydride, and 4,4'-oxydiphthalic anhydride. These diamines and tetracarboxylic acids can be used alone or in combination of two or more.
  • the polyimide film used for the polyimide insulating layer can be produced, for example, by coating a solution of polyamic acid (polyimide precursor) obtained by reacting diamine and tetracarboxylic acid on a support, drying it to obtain a polyamic acid film, and then curing (imidizing) it by heat treatment.
  • polyamic acid polyamic acid precursor
  • known coating methods such as spin coating, comma coating, screen printing, slit coating, roll coating, knife coating, dip coating, and die coating can be used.
  • additives, fillers, etc. may be added to the polyimide film within a range that does not impair the effects of the present invention.
  • Polyimide films are marketed as, for example, Kapton EN, Kapton H, and Kapton V (all trade names) manufactured by DuPont-Toray Co., Ltd., Apical NPI (trade name) manufactured by Kaneka Corporation, Upilex S (trade name) manufactured by Ube Industries, Ltd., and the like.
  • thermoplastic liquid crystal polymer insulating layer composed of a thermoplastic liquid crystal polymer (hereinafter sometimes referred to as a thermoplastic liquid crystal polymer insulating layer) is preferable.
  • the thermoplastic liquid crystal polymer film used for the thermoplastic liquid crystal polymer insulating layer is formed from a melt moldable liquid crystalline polymer.
  • the thermoplastic liquid crystal polymer is a polymer capable of forming an optically anisotropic melt phase, and its chemical constitution is not particularly limited as long as it is a liquid crystalline polymer that can be melt-molded.
  • the thermoplastic liquid crystal polymer may also be a polymer obtained by introducing an isocyanate-derived bond such as an imide bond, a carbonate bond, a carbodiimide bond, or an isocyanurate bond into an aromatic polyester or an aromatic polyester amide.
  • an isocyanate-derived bond such as an imide bond, a carbonate bond, a carbodiimide bond, or an isocyanurate bond
  • thermoplastic liquid crystal polymer used in the present invention include known thermoplastic liquid crystal polyesters and thermoplastic liquid crystal polyester amides derived from the compounds classified into (1) to (4) below and derivatives thereof.
  • thermoplastic liquid crystal polyesters and thermoplastic liquid crystal polyester amides derived from the compounds classified into (1) to (4) below and derivatives thereof.
  • thermoplastic liquid crystal polyester amides derived from the compounds classified into (1) to (4) below and derivatives thereof.
  • Aromatic or aliphatic dihydroxy compound (see Table 1 for representative examples)
  • Aromatic diamine, aromatic hydroxylamine or aromatic aminocarboxylic acid see Table 4 for representative examples.
  • Copolymers having the structural units shown in Tables 5 and 6 can be cited as typical examples of thermoplastic liquid crystal polymers obtained from these raw material compounds.
  • polymers containing at least p-hydroxybenzoic acid and/or 6-hydroxy-2-naphthoic acid as repeating units are preferred, and in particular (i) polymers containing repeating units of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, or (ii) at least one aromatic hydroxycarboxylic acid selected from the group consisting of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, and at least one aromatic diol and Copolymers containing repeating units of aromatic hydroxylamine and at least one aromatic dicarboxylic acid are preferred.
  • At least one aromatic hydroxycarboxylic acid (C) selected from the group consisting of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid at least one aromatic diol (D) selected from the group consisting of 4,4'-dihydroxybiphenyl, hydroquinone, phenylhydroquinone, and 4,4'-dihydroxydiphenyl ether, and from the group consisting of terephthalic acid, isophthalic acid, and 2,6-naphthalenedicarboxylic acid
  • the molar ratio of repeating units derived from 6-hydroxy-2-naphthoic acid in the aromatic hydroxycarboxylic acid (C) may be, for example, 85 mol% or more, preferably 90 mol% or more, more preferably 95 mol% or more.
  • the molar ratio of repeating units derived from 2,6-naphthalene dicarboxylic acid in the aromatic dicarboxylic acid (E) may be, for example, 85 mol% or more, preferably 90 mol% or more, more preferably 95 mol% or more.
  • the aromatic diol (D) may be repeating units (D1) and (D2) derived from two different aromatic diols selected from the group consisting of hydroquinone, 4,4'-dihydroxybiphenyl, phenylhydroquinone, and 4,4'-dihydroxydiphenyl ether. It may be from 75 to 75/25, more preferably from 30/70 to 70/30.
  • the ability to form an optically anisotropic molten phase as referred to in the present invention can be certified by, for example, placing a sample on a hot stage, heating the sample at elevated temperature in a nitrogen atmosphere, and observing light transmitted through the sample.
  • thermoplastic liquid crystal polymers have a melting point (hereinafter referred to as Tm 0 ) of 200 to 360°C, preferably 240 to 360°C, more preferably 260 to 360°C, and still more preferably 270 to 350°C.
  • Tm 0 is determined by measuring the temperature at which the main endothermic peak appears with a differential scanning calorimeter (Shimadzu Corporation DSC). That is, after heating a thermoplastic liquid crystal polymer sample at a rate of 10° C./min to completely melt it, the melt is cooled to 50° C. at a rate of 10° C./min, and the temperature is again raised at a rate of 10° C./min.
  • thermoplastic polymers such as polyethylene terephthalate, modified polyethylene terephthalate, polyolefin, polycarbonate, polyarylate, polyamide, polyphenylene sulfide, polyether ether ketone, fluororesin, various additives, fillers, etc. may be added within the range that does not impair the effects of the present invention.
  • thermoplastic liquid crystal polymer film is obtained, for example, by extruding a melt-kneaded product of the thermoplastic liquid crystal polymer.
  • Any method can be used as the extrusion molding method, but the well-known T-die method, inflation method and the like are industrially advantageous.
  • the inflation method stress is applied not only to the mechanical axis direction (hereinafter abbreviated as MD direction) of the thermoplastic liquid crystal polymer film, but also to the direction perpendicular thereto (hereinafter abbreviated as TD direction), and the film can be stretched uniformly in the MD and TD directions, so that a thermoplastic liquid crystal polymer film with controlled molecular orientation, dielectric properties, etc. in the MD and TD directions can be obtained.
  • thermoplastic liquid crystal polymer film may be increased by heating for several hours at the melting point (Tm 0 ) of the thermoplastic liquid crystal polymer ⁇ 10° C. or higher (for example, about Tm 0 ⁇ 10° C. to Tm 0 +30° C., preferably about Tm 0 ° C. to Tm 0 +20° C.).
  • thermoplastic liquid crystal polymer film By providing a circuit layer and/or a conductor layer on the obtained thermoplastic liquid crystal polymer film by a known or commonly used method, it is possible to produce an antenna circuit board having a thermoplastic liquid crystal polymer insulating layer.
  • the melting point (Tm) of the thermoplastic liquid crystal polymer insulating layer may be, for example, 200-380°C, preferably in the range of 240-370°C.
  • the melting point (Tm) of the thermoplastic liquid crystal polymer insulating layer can be obtained by observing the thermal behavior of a sample obtained from the thermoplastic liquid crystal polymer insulating layer (or thermoplastic liquid crystal polymer film) using a differential scanning calorimeter. That is, the position of the endothermic peak that appears when the thermoplastic liquid crystal polymer film sample is heated at a rate of 10° C./min can be determined as the melting point (Tm) of the thermoplastic liquid crystal polymer film.
  • the thermoplastic liquid crystal polymer insulating layer has, for example, a coefficient of thermal expansion of 0 to 25 ppm/°C, and the coefficient of thermal expansion may preferably be about 5 to 22 ppm/°C.
  • the thermal expansion coefficient can be grasped as a value measured between 30° C. and 150° C. when the temperature is raised from 25° C. to 200° C. at a rate of 5° C./min using a thermomechanical analyzer (TMA), then cooled to 30° C. at a rate of 20° C./min, and then heated again at a rate of 5° C./min.
  • TMA thermomechanical analyzer
  • the dielectric constant and dielectric loss tangent in the thickness direction can be measured by the microstrip line method.
  • the relative permittivity and dielectric loss tangent in the plane direction are determined by Model No. manufactured by Keycom Co., Ltd. Measurement can be performed in accordance with JIS R 1660-2 at a frequency of 28 GHz (25° C.) using a DPS03 (Fabry-Perot resonator). It should be noted that measurements are made both in one direction in the plane and in directions perpendicular to it (XY directions).
  • the thickness of the antenna circuit board can be measured using a micrometer (Model 227-201-CLM-15QM manufactured by Mitutoyo Corporation). Also, the thickness of the low dielectric layer is measured using a film used as the low dielectric layer. The thickness of the low dielectric layer may be obtained by measuring the thickness of the entire antenna system and the thickness of the antenna circuit board and glass in the antenna system, respectively, and subtracting the thickness of the antenna circuit board and glass from the thickness of the entire antenna system.
  • ⁇ /10 ⁇ 2 is 0.65 mm from the high frequency wavelength of 10.7 mm, so for example, based on the optimum value of 45°, if the glass layer is 2 mm, it is 0.6 ⁇ 0.65 mm or 4.2 ⁇ 0.65 mm.
  • ⁇ n is the dielectric constant of the n-th layer constituting the laminate
  • L n is the thickness of the n-th layer constituting the laminate
  • ⁇ n is the refraction angle of the high frequency incident on the n-th layer constituting the laminate (incident angle from the n-th layer to the n+1-th layer)
  • ⁇ is the wavelength in air of the high frequency incident on the laminate
  • ⁇ 0 is the relative permittivity of air
  • n represents an integer of 1 or more
  • the optimum value of the thickness L2 of the transmittance adjusting layer which is obtained from the minimum value of the reflection intensity, is similar to the value obtained from the transmittance simulation shown in Table 7.
  • the frequency is 5.8 GHz
  • the wavelength of the high frequency is 51.7 mm
  • ⁇ / 10 ⁇ 2 is 3.15 mm
  • ⁇ / 10 ⁇ 2 is 0.65 mm as described above.
  • the thickness of the transmittance adjusting layer may be controlled within a range of ⁇ 3.15 mm for a high frequency of 5.8 GHz and ⁇ 0.65 mm for a high frequency of 28 GHz with respect to the optimal layer thickness for an incident angle of 45° obtained from the table.
  • the optimal value of the layer thickness of the high-frequency transmission layer (in this case, the transmittance adjustment layer) determined as described above can be applied to, for example, the manufacture of the antenna system described below.
  • thermoplastic liquid crystal polymer film manufactured by Kuraray Co., Ltd., Vecstar (registered trademark), thickness 50 ⁇ m, relative permittivity in the X direction: 3.4, relative permittivity in the Y direction: 3.4, dielectric loss tangent in the X direction: 0.002, dielectric loss tangent in the Y direction: 0.002) is overlaid with copper foil (manufactured by Fukuda Metal Foil & Powder Co., Ltd., electrolytic copper foil “H9A”, thickness 12 ⁇ m), and a heating platen is applied using a vacuum heat press. The temperature is set to 290° C.
  • Polyvinyl butyral resin 1 (hydroxyl group content 19.8% by mass, degree of acetalization 70.8 mol%, acetyl group content 1.0% by mass, resin viscosity 152 mPa s) and polyvinyl butyral resin 2 (hydroxyl group content 20.1% by mass, degree of acetalization 70.4 mol%, acetyl group content 0.9% by mass, resin viscosity 1410 mPa s) were blended at a mass ratio of 75:25 and melt-kneaded. extruded into strands and pelletized.
  • the obtained pellets are melt-extruded using a single-screw extruder and a T-die, and a polyvinyl acetal resin film with a smooth surface and a thickness of 12 mm (X-direction dielectric constant: 2.5, Y-direction dielectric constant: 2.5, X-direction dielectric loss tangent: 0.01, Y-direction dielectric loss tangent: 0.01, plasticizer content: 0% by mass, resin viscosity: 245 mPa s) is obtained.
  • the Teflon (registered trademark) sheet adjacent to the polyvinyl acetal resin film is arranged so that the embossed surface is in contact with the polyvinyl acetal resin film.
  • the Teflon (registered trademark) sheet adjacent to the antenna circuit board is arranged so that the mirror surface is in contact with the antenna circuit board.
  • the antenna circuit board is arranged so that the surface having the circuit is in contact with the polyvinyl acetal resin film.
  • the pressure was returned to normal pressure, and the Teflon (registered trademark) sheets and the upper and lower glasses were removed, and the polyvinyl acetal resin film (transmittance adjusting layer)/circuit (circuit layer)/antenna circuit board inner layer (multilayer board with thermoplastic liquid crystal polymer film as an insulating layer)/copper.
  • the layer thickness of the polyvinyl acetal resin film can be adjusted to a desired thickness by laminating and press-bonding a plurality of layers as necessary.
  • the upper chamber was set to -10 kPa (differential pressure with the lower chamber of about 90 kPa) and held for 15 minutes. After returning to normal pressure, the Teflon (registered trademark) sheet and the upper glass were removed. layer) to obtain an antenna system in which the antenna circuit board is arranged on a part of the glass. In the obtained antenna system, a high frequency incident on the glass can efficiently pass through the transmittance adjusting layer and reach the antenna circuit board.
  • the antenna system has a laminated structure of glass (first glass layer)/polyvinyl acetal resin film (low dielectric layer)/antenna circuit board, but if necessary, a low dielectric layer and a second glass layer may be laminated under the antenna circuit board.
  • the following transmittance adjusting layer can be used instead of the transmittance adjusting layer used in the above example.
  • Polyvinyl acetal resin film (relative dielectric constant in the X direction: 2.5, dielectric constant in the Y direction: 2.5, dielectric loss tangent in the X direction: 0.01, dielectric loss tangent in the Y direction: 0.01, plasticizer content: 0% by mass, resin viscosity: 245 mPa s)
  • B Ionomer resin film (manufactured by Kuraray Co., Ltd., a film obtained by thinning SentryGlas (registered trademark) SG5000 by heat pressing, relative permittivity in the X direction: 2.2, relative permittivity in the Y direction: 2.2, dielectric loss tangent in the X direction: 0.002, dielectric loss tangent in the Y direction: 0.002)
  • C Polyvinyl acetal film (manufactured by Kuraray Co., Ltd., V200KE, thickness 700 ⁇ m, dielectric constant in X direction: 2.7, dielectric constant in Y direction: 2.7
  • the following insulating layer can also be used.
  • Polyimide film manufactured by DuPont-Toray Co., Ltd., Kapton 300H, thickness 75 ⁇ m, dielectric constant in X direction: 3.3, dielectric constant in Y direction: 3.3, dielectric loss tangent in X direction: 0.007, dielectric loss tangent in Y direction: 0.007).
  • Polyimide film manufactured by Kaneka Corporation, Apical NPI, thickness 50 ⁇ m, relative dielectric constant in X direction: 3.4, relative dielectric constant in Y direction: 3.4, dielectric loss tangent in X direction: 0.004, dielectric loss tangent in Y direction: 0.004).
  • the glass layer is made of glass with a dielectric constant of 6.5, but organic glass such as acrylic glass or polycarbonate may also be used.
  • a laminator is used to laminate each layer, but the laminated material may be placed in a vacuum bag, preheated, and then heated and pressurized.
  • the laminated material may be placed in a vacuum bag, decompressed at room temperature for 15 minutes, heated to 100° C. while being decompressed and held for 30 minutes, then cooled to release the decompressed pressure, temporarily crimped, placed in an autoclave, and treated at 140° C. and 12 MPa for 30 minutes.
  • the antenna system may be fabricated by applying triethylene glycol-di-(2-ethylhexanoate) or dibutoxyethyl adipate to the low-dielectric layer of the antenna system laminate, bonding it to glass, and then drying it with hot air.
  • the antenna system of the present invention can suppress the attenuation of high frequencies and improve the transmission characteristics of the antenna circuit board for high frequencies, and can exchange a large amount of information, it can be effectively used as an antenna system for vehicles such as so-called connected cars such as automatic driving and constant communication by on-vehicle equipment, and as an antenna system for small cell base stations by installing it in the windows and walls of buildings, various civil engineering structures (railroad facilities, road facilities, energy facilities, dam/river facilities, water supply and sewerage facilities, airport facilities).
  • the antenna system of the present invention can be used to form the glazing of a vehicle or building, or attached to a vehicle or building.
  • the antenna system of the present invention can also be installed in electronic devices such as display devices. Display devices include, for example, large screen televisions, monitors, tablets, smart phones, laptop computers, desktop computers, personal digital assistants, or other display devices.
  • the antenna system of the invention can also be installed, for example, on the back glass of a smartphone or the like.

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PCT/JP2023/001227 2022-01-18 2023-01-17 アンテナシステムおよびその製造方法並びに設計方法 Ceased WO2023140261A1 (ja)

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EP23743255.4A EP4468517A4 (en) 2022-01-18 2023-01-17 ANTENNA SYSTEM, ITS MANUFACTURING PROCESS AND ITS DESIGN PROCESS
CN202380017218.5A CN118575365A (zh) 2022-01-18 2023-01-17 天线系统及其制造方法以及设计方法
JP2023575260A JP7851967B2 (ja) 2022-01-18 2023-01-17 アンテナシステムおよびその製造方法並びに設計方法
KR1020247024315A KR20240140074A (ko) 2022-01-18 2023-01-17 안테나 시스템 및 그 제조 방법 그리고 설계 방법
US18/729,637 US12573742B2 (en) 2022-01-18 2023-01-17 Antenna system, and manufacturing method and design method for same

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