WO2023138613A1 - 一种方坯缺陷打标系统及方法 - Google Patents

一种方坯缺陷打标系统及方法 Download PDF

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Publication number
WO2023138613A1
WO2023138613A1 PCT/CN2023/072858 CN2023072858W WO2023138613A1 WO 2023138613 A1 WO2023138613 A1 WO 2023138613A1 CN 2023072858 W CN2023072858 W CN 2023072858W WO 2023138613 A1 WO2023138613 A1 WO 2023138613A1
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WO
WIPO (PCT)
Prior art keywords
billet
dimensional
marking
defect
pose
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PCT/CN2023/072858
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English (en)
French (fr)
Inventor
杨水山
何永辉
吴振平
李建辉
梁爽
彭铁根
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宝山钢铁股份有限公司
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Publication of WO2023138613A1 publication Critical patent/WO2023138613A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10004—Still image; Photographic image
    • G06T2207/10012—Stereo images
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

Definitions

  • the invention belongs to the application field of automatic detection and control of billet products, and in particular relates to a billet defect marking system and method.
  • defect marking is still dominated by spray marking, which is only marked on the length of the defect, and defect grinding can only be searched according to the length position.
  • spray marking which is only marked on the length of the defect
  • defect grinding can only be searched according to the length position.
  • There is no positioning basis in the circumferential direction and there is a risk of low search time and even difficulty in finding defects.
  • the existing automatic marking means cannot accurately locate the defect position of the billet, which affects the post-processing efficiency of the defect, and even easily finds the defect and causes the defect to slip away.
  • the near-surface defects of the billet are subtle and may be hidden on the surface and below the surface, so it is difficult to be directly inspected. Even if the defect of the billet is detected by technical means, if the defect cannot be effectively marked, it is still very difficult to find and reset the defect again.
  • the position identification of the defect should not only be reflected in the length position of the defect, but also in the circumferential positioning.
  • the invention application with the application number: CN202010348870.3 discloses "a two-dimensional and three-dimensional combined imaging detection system and method for the continuous casting slab surface", which includes an encoder, a position sensing mechanism and a mounting bracket arranged in sequence along the moving direction of the continuous casting slab; the mounting bracket is sequentially provided with a 3D imaging mechanism and a 2D imaging mechanism along the moving direction of the continuous casting slab; the position sensing mechanism is used to start the encoder, and the encoder is used to record the position information of the continuous casting slab; Moving up and down along the lifting device; the installation bracket is also provided with a heat shield, the two-dimensional imaging mechanism and the three-dimensional imaging mechanism are located above the heat shield, and the continuous casting slab is located below the heat shield.
  • the invention application with the application number: CN202111123476.0 discloses "a defect marking method and system".
  • the system includes at least one camera device with a field of view above the product to be inspected that can cover the X-axis direction of the product to be inspected.
  • Calculate the running length according to the position information of the marking device, the position information of the target defect, the position information of the camera device and the running length, determine whether the target defect reaches the preset range of the marking device, and if so, control the marking device to mark the defect on the product to be inspected.
  • the application number is: CN200720012998.2 utility model application, which discloses "a line scanning type X-ray experiment Time-based imaging detection system defect marker", in the process of flaw detection, when a workpiece defect is detected, the real-time imaging system calculates through software, and the control system sends a control pulse to the driver to drive the motor to rotate, thereby driving the pneumatic marking pen to move above the defect position, and automatically pops up the marker tip to mark the workpiece and mark the defect position.
  • the invention application with the application number: CN202111049131.5 discloses "an intelligent detection method and device for billet position and posture".
  • the position and posture changes of the length of the billet during production and transmission can be detected; by setting several vertical and spaced position sensors on the cross section of the billet, the distance between the position sensor and the side of the billet is equal.
  • the coordinate information of the actual position of the positioning point under the condition can obtain the pose representative value, and provide the coordinate reference in the length direction and the circumferential direction for the billet marking and grinding defects, which completely solves the lack of positioning basis in the circumferential direction, and the detection and calculation cannot be carried out based on the real pose of the billet, resulting in low search efficiency and missing defects.
  • the existing billet defect marking system can only determine the position of the defect in the length direction, lacks precise positioning and non-contact marking in the circumferential direction of the section on the length, and the positioning of the defect position is inaccurate, time-consuming, or even missed. Problems.
  • the purpose of the present invention is to solve the problem that the existing billet defect marking system can only determine the position of the defect in the length direction, lacks precise positioning and non-contact marking in the circumferential direction of the section on the length, and the positioning of the defect position is inaccurate, takes a long time and even misses the defect position.
  • the billet defect marking system provided by the present invention establishes and determines the defect position of the billet in the three-dimensional direction to accurately locate the position of the defect position, and completes the accurate marking of the defect position based on the actual three-dimensional pose of the billet through the three-dimensional marking action and contact marking, which saves the positioning time of the defect position and improves the positioning efficiency of the defect position.
  • the present invention provides a billet defect marking system, including: a data processing unit, a billet three-dimensional pose detection unit and a three-dimensional marking execution unit, wherein,
  • the data processing unit is used to complete the two-dimensional to three-dimensional mapping based on the actual three-dimensional space pose based on the data detected by the billet three-dimensional pose detection unit, thereby determining the three-dimensional space pose benchmark of the billet, and completing the corresponding three-dimensional vectorized representation of the defect position of the billet according to the three-dimensional space pose benchmark of the billet;
  • the three-dimensional marking execution unit determines the spatial movement trajectory according to the defect position represented by the three-dimensional vectorization of the billet defect position, and performs contact defect marking on the defect position of the billet.
  • the data processing unit establishes a three-dimensional defect position representation, and the three-dimensional marking execution unit plans the marking movement trajectory in three-dimensional space, realizes three-dimensional marking action and contact marking, and completes the accurate marking of the defect position based on the actual three-dimensional pose of the billet, so that the defect position of the marked billet is physically visible and checkable, and three-dimensional
  • the defect position characterization can be directly used for defect position grinding, eliminating the need to search for defects in a large area or expand the defect grinding range when the defect positioning accuracy is not high, saving the defect position positioning time and improving the defect position positioning efficiency.
  • the contact-type defect marking of the defect position of the billet is more stable than the non-contact marking of the defect position of the billet by means of spraying codes.
  • the defect bit data is determined and stored in the data processing unit in a manner independent of the billet defect marking system and before the billet defect marking system runs.
  • the billet three-dimensional pose detection unit includes: a camera group for acquiring two-dimensional data of adjacent two sides of the billet; a photoelectric switch and an encoder for acquiring billet length information;
  • the determination of the real space pose of the billet is completed according to the length information of the billet.
  • the three-dimensional marking execution unit includes: a marking robot arm capable of moving in three-dimensional space; and a marking pen flexibly connected to the marking robot arm.
  • the billet defect marking system also includes a propulsion piece and a motor-driven moving piece, and the marking robot is provided with an adapter; the marking pen is chalk, and the chalk is connected to the moving piece through the pushing piece; the outer periphery of the chalk is provided with a buffer sleeve and a sleeve in turn, and a buffer spring is arranged between the buffer sleeve and the sleeve, and the sleeve is connected to the adapter of the marking robot.
  • the billet defect marking system is also provided with a tool setting unit, which is used to monitor the wear of the chalk.
  • the embodiment of the present invention discloses a billet defect marking method, including:
  • the two-dimensional to three-dimensional mapping based on the actual three-dimensional space pose is completed, and the three-dimensional space pose benchmark of the billet is determined accordingly; the three-dimensional vectorized representation of the defect position of the billet is established according to the three-dimensional space pose benchmark of the billet;
  • a three-dimensional space movement trajectory is established, and the marking of billet defects is completed in a contact manner.
  • the billet defect marking method improves the positioning of the defect position and the efficiency of the marking process connection, and the defect grinding position is more focused; it realizes the precise positioning of the defect position in the three-dimensional direction, shortens the positioning time of the defect position, and improves the positioning efficiency of the defect position. It solves the problem of ambiguous defect location when one-dimensional or two-dimensional marking is performed on the surface of a three-dimensional object, and it takes a long time to determine the actual defect location, and even causes positioning errors or missing defects.
  • the billet defect marking system includes a billet three-dimensional pose detection unit and a data processing unit arranged in a process control machine, wherein the billet three-dimensional pose detection unit includes a camera group, a photoelectric switch, and an encoder, and the three-dimensional space pose reference of the billet is completed by the camera group, photoelectric switch, and encoder in cooperation with the data processing unit;
  • the data detected by the three-dimensional pose detection unit completes the two-dimensional to three-dimensional mapping based on the actual three-dimensional space pose, and determines the three-dimensional space pose reference of the billet accordingly, including: including:
  • the camera group is used to obtain the two-dimensional data of the adjacent two sides of the billet
  • the data processing unit completes the determination of the actual three-dimensional space pose according to the length information of the billet, and completes the mapping from two-dimensional to three-dimensional according to the two-dimensional data of the adjacent two sides of the billet based on the actual three-dimensional space pose, and determines the three-dimensional space pose benchmark of the billet accordingly.
  • the defect position data of the billet is pre-stored in the data processing unit of the process control machine in the form of two-dimensional data or three-dimensional data.
  • the billet defect marking system includes a three-dimensional marking execution unit, and the three-dimensional marking execution unit includes a marking robot arm and a marking pen;
  • the three-dimensional space movement trajectory is established, and the marking of billet defects is completed in a contact manner, including:
  • the marking manipulator establishes a three-dimensional space movement trajectory according to the three-dimensional vectorized representation of the defect position of the billet;
  • the contact type is realized by the marking pen driven by the marking robot arm.
  • the billet defect marking system also includes a propulsion piece and a motor-driven moving piece, and the marking robot is provided with an adapter seat; the marking pen is chalk, and the chalk is connected to the motor-driven moving piece through the pushing piece;
  • the outer periphery of the chalk is provided with a buffer sleeve and a sleeve in turn, and a buffer spring is arranged between the buffer sleeve and the sleeve, and the sleeve is connected with the adapter seat of the marking robot.
  • the billet defect marking system is provided with a tool setting unit, and the tool setting unit establishes the monitoring of the wear condition of the chalk;
  • the motor can drive the moving part to drive the propulsion part and the chalk to move a set distance.
  • the tool setting frequency of the tool setting unit is performed according to the set frequency, or according to the statistical quantity of defect positions of the existing billet.
  • the defect length is accumulated and counted starting from the first defect position, and when the accumulated defect length reaches the set threshold value, a tool setting alarm prompt is triggered, and the marking pen completes the wear calculation through the tool setting unit.
  • the invention provides a billet defect marking system and method.
  • a three-dimensional defect position representation By establishing a three-dimensional defect position representation, three-dimensional marking action and contact marking, the accuracy marking of the defect position based on the actual billet pose is completed, and the marking is completed accordingly.
  • the defect position is physically visible and checkable, and can be directly used as a positioning mark for defect grinding, eliminating the need to search for defects on a large scale or expand the scope of defect grinding when the defect positioning accuracy is not high.
  • the invention improves the efficiency of process connection and focuses the defect grinding position; avoids the risk of one-dimensional or two-dimensional marking on the surface of three-dimensional objects, unclear defect positioning, long determination time when actually locating defects, and even the risk of positioning errors or missing defects.
  • Fig. 1 is a schematic diagram of the working process of the billet defect marking method of the embodiment in the description of the present invention
  • Fig. 2 is a schematic structural diagram of the billet defect marking system of the embodiment in the specification of the present invention.
  • Fig. 3 is a schematic structural diagram of the marking pen of the three-dimensional marking execution unit of the embodiment in the specification of the present invention.
  • 0-Bill defect marking system 1-Bill position detection device; 2-Head and tail detection photoelectric switch; 3-Length measuring encoder; 4-Marking robot arm; 5-Knife setting unit; 6-Marking pen; 7-Controller;
  • connection should be understood in a broad sense, for example, it may be fixed connection, detachable connection, or integral connection; it may be mechanical connection or electrical connection; Those of ordinary skill in the art can understand the specific meanings of the above terms in this embodiment in specific situations.
  • an embodiment of the present invention provides a billet defect marking system 0, including a data processing unit (not shown in the figure), a billet three-dimensional pose detection unit (not shown in the figure) and a three-dimensional marking execution unit (not shown in the figure).
  • the billet three-dimensional pose detection unit is used to detect the real real-time pose of the billet and generate detection data.
  • the detection data is two-dimensional data
  • the two-dimensional detection data is the pose data of the billet in the X and Y directions detected by the billet three-dimensional pose detection unit.
  • the billet three-dimensional pose detection unit acquires two-dimensional data of adjacent two sides of the billet 10 .
  • the data processing unit receives the detection data of the three-dimensional pose detection unit of the billet, generates a mapping result from two-dimensional data to three-dimensional data based on the actual three-dimensional pose of the billet based on the detection data, determines the three-dimensional pose reference of the billet 10 according to the mapping result, and completes the corresponding three-dimensional vectorized representation of the defect position of the billet according to the three-dimensional pose reference of the billet 10.
  • the data processing unit can receive the detection data of the billet 3D pose detection unit, and process the detection data (such as generating a mapping result from 2D data to 3D data according to the detection data based on the actual 3D pose reference, and completing the corresponding 3D vector representation of the defect position of the billet according to the 3D pose reference of the billet 10), generating the 3D pose reference of the billet 10 and the 3D vector representation of the defect position of the billet, so as to accurately locate the defect position of the billet at the 3D position of the 3D pose reference of the billet 10, and paving the way for subsequent accurate marking pad.
  • the detection data such as generating a mapping result from 2D data to 3D data according to the detection data based on the actual 3D pose reference, and completing the corresponding 3D vector representation of the defect position of the billet according to the 3D pose reference of the billet 10
  • a mapping result from two-dimensional data to three-dimensional data is generated based on the detection data and based on the actual three-dimensional space pose, including:
  • the data processing unit converts the detection data (two-dimensional data) into a three-dimensional data mapping result through matrix transformation operations, and determines the three-dimensional space pose reference of the billet 10 according to the mapping result of the three-dimensional data;
  • the 3D sensor can be set to detect the three-dimensional data of the billet pose change, and detect and error compensate the deformed rectangular billet 10, so as to accurately determine the three-dimensional space pose reference of the billet 10, that is, the true shape of the billet 10. Real-time three-dimensional space pose.
  • the three-dimensional marking execution unit determines the spatial movement trajectory according to the three-dimensional vectorized representation of the defect position of the billet, and performs contact marking on the defect position of the billet 10 . That is to say, the three-dimensional marking execution unit not only determines the spatial movement trajectory of marking according to the defect position of the billet, but also performs contact marking of the defect position of the billet.
  • the data processing unit establishes a three-dimensional defect representation, and the three-dimensional marking execution unit plans the marking trajectory in three-dimensional space, realizes three-dimensional marking action and contact marking, and completes the accurate marking of the defect position based on the actual three-dimensional pose of the billet 10, so that the defect position of the marked billet is physically visible and checkable.
  • the positioning efficiency of the defective bit is improved.
  • the contact-type defect marking on the defect position of the billet 10 has a more stable marking effect than the non-contact marking on the defect position of the billet 10 by means of spraying codes or the like.
  • the defect bit data is determined and stored in the data processing unit in a manner independent of the billet defect marking system 0 and before the billet defect marking system 0 runs.
  • the defect position data is determined and stored in the data processing unit in a manner independent of the billet defect marking system 0 before the billet 10 moves to the defect position.
  • the defective position data is two-dimensional data or three-dimensional data of the defective position of the billet 10 .
  • the defective bit data is the two-dimensional data of the defective bit of the billet 10, and the defective bit is a slender strip along the length direction of the billet 10, and the defective bit data is the starting point and the ending point of the slender strip along the two-dimensional direction (i.e. X, Y) on the billet 10, or the defect bit data is the starting point and the ending point of the slender strip along the two-dimensional direction (i.e. X, Y) on the billet and the length information of the slender strip.
  • the defect position data can be used to complete the corresponding three-dimensional vectorized characterization of the billet defect position according to the three-dimensional space pose reference of the billet 10 through the data processing unit.
  • the billet three-dimensional pose detection unit includes:
  • a camera group used to acquire two-dimensional data of adjacent sides of the billet
  • Photoelectric switch and encoder used to obtain billet length information
  • the determination of the real space pose of the billet is completed according to the length information of the billet.
  • the billet three-dimensional pose detection unit includes a billet position detection device 1 .
  • the billet 10 is placed on the V-shaped roller table, the first edge and the adjacent two side surfaces of the billet 10 are in contact with the roller table, and a second edge is arranged in the billet 10 opposite to the first edge.
  • the billet position detection device 1 is a camera group, and the camera group includes at least two cameras, and at least two cameras are respectively arranged corresponding to the two sides adjacent to the second edge of the billet 10.
  • the setting is used to acquire the two-dimensional data of the two sides adjacent to the second edge of the billet 10 .
  • the billet three-dimensional pose detection unit further includes a photoelectric switch and an encoder.
  • the billet position detection device 1 acquires the two-dimensional data of the adjacent two sides of the second edge of the billet 10 , that is, the spatial position data of the section.
  • the photoelectric switch is a photoelectric switch 2 for head and tail detection
  • the encoder is a length measuring encoder 3 .
  • the billet position detection device 1, the head and tail detection photoelectric switch 2, and the length measuring encoder 3 are all bottom-level signal input sensors.
  • the billet position detection device 1 (camera group) obtains the cross-sectional space position data of the billet 10, that is, obtains the two-dimensional data of the two sides adjacent to the second edge of the billet 10; Provide data support for the calculation of the real space pose of the billet by integrating the cross-sectional space position information of the billet 10 and the length data of the billet 10 later.
  • the data processing unit integrates the cross-sectional spatial position information of the billet 10 and the length data of the billet 10 to complete the calculation of the real space pose of the billet; the data processing unit completes the corresponding three-dimensional vectorized representation of the billet defect according to the real space pose of the billet and the defect data received from the host computer 8.
  • the three-dimensional marking execution unit (not shown in the figure) includes: a marking robot arm 4 that can move in three-dimensional space; and a marking pen 6 that is flexibly connected to the marking robot arm 4.
  • the three-dimensional marking execution unit (not shown in the figure) includes a marking robot arm 4 and a marking pen 6 .
  • the marking robot arm 4 can move in a three-dimensional space, that is, the marking robot arm 4 can move in a three-dimensional space.
  • the marking pen 6 is flexibly connected with the marking robot arm 4, and the marking pen 6 can move in three-dimensional space driven by the marking robot arm 4 until it moves to the marking position to accurately mark the defect position.
  • the billet defect marking system 0 also includes a propulsion piece and a motor-driven moving piece.
  • the marking robot 4 is provided with an adapter seat 11, and the marking pen 6 is chalk, which is connected to the moving piece through the propulsion piece;
  • FIG. 3 shows a schematic structural diagram of the three-dimensional marking execution unit of the billet defect marking system 0 in FIG. 2 .
  • the three-dimensional marking execution unit includes a marking pen 6 .
  • the marking pen 6 is chalk.
  • the chalk and the billet 10 realize contact marking; moreover, the chalk can be written and dried immediately, compared with In terms of the need to wait for a long drying time after the inkjet pen codes, it saves the marking time of the defect and improves the marking efficiency; using chalk as the marking pen 6 solves the problem that the nozzle of the inkjet pen is easily blocked, and the ink cannot be ejected from the nozzle to mark the defect.
  • the billet defect marking system 0 also includes a propulsion piece (not shown in the figure) and a motor-driven moving piece (not shown in the figure), the marking robot hand 4 is provided with an adapter seat 11; the marking pen 6 is chalk, and the chalk is connected to the moving piece driven by the motor through the pushing piece;
  • a buffer sleeve 14 and a sleeve 13 are sequentially arranged on the outer periphery of the chalk, and a buffer spring 15 is arranged between the buffer sleeve 14 and the sleeve 13 , and the sleeve 13 is connected with the adapter seat 11 of the marking robot hand 4 .
  • the three-dimensional marking execution unit of the billet defect marking system 0 includes a marking robot 4 , which is provided with an adapter 11 , and the marking robot 4 and the adapter 11 are rotatably connected.
  • the three-dimensional marking execution unit includes a buffer sleeve 14 and a sleeve 13 sequentially arranged on the outer periphery of the chalk (ie, the marking pen 6 ).
  • the sleeve 13 has a protective effect on the buffer sleeve 14 .
  • the sleeve 13 is connected with the adapter 11 of the marking robot 4, so that the marking pen 6 is connected with the marking robot 4 through the sleeve 13, and the marking pen 6 can rotate relative to the marking robot 4 through the adapter 11, so as to complete the precise marking of the defective position of the billet.
  • a buffer spring 15 is provided between the buffer sleeve 14 and the sleeve 13 , one end of the buffer spring 15 abuts against the marking pen 6 , and the other end abuts against the sleeve 13 .
  • the buffer spring 15 can buffer the spatial position error between the marking pen 6 and the billet 10, so that the marking pen 6 can accurately mark the defect of the billet.
  • the buffer sleeve 14 and the buffer spring 15 form the buffer mechanism of the marking robot arm 4 to prevent equipment damage caused by the rigid contact produced by the marking action.
  • the buffer sleeve 14 and the sleeve 13 form a pre-tightening force on the buffer spring 15, and the pressure can be adjusted, that is, the pressure of the marking pen 6 on the marking surface of the blank 10 can be adjusted to improve the marking effect.
  • the buffer sleeve 14 is provided with a propulsion piece (not shown in the figure) and a motor-driven moving piece (not shown in the figure), the chalk (that is, the marking pen 6) is connected with the motor-driven moving piece through the pushing piece, and the moving piece and the pushing piece can realize the wear compensation of the chalk.
  • the propulsion element is a screw, which can convert the helical motion into linear motion.
  • the motor drives the moving part to push the chalk toward the side where the billet 10 is located through the screw rod (as shown in Figure 3, the motor drives the moving part to push the chalk from the left side of Figure 3 to the right side of Figure 3 through the screw rod), so as to compensate for the wear error of the chalk, so that the chalk can normally mark the defective position of the billet 10.
  • the three-dimensional marking execution unit includes a clamping spring 16, which is arranged at one end of the marking pen 6 not in contact with the billet 10, that is, the clamping spring 16 is arranged at the end of the marking pen 6 closer to the buffer sleeve 14, and the clamping spring 16 is used to clamp the marking pen 6 to prevent the marking pen 6 from falling.
  • the clamping spring 16 clamps the marking pen 6 along the circumferential direction of the marking pen 6, effectively preventing the marking pen 6 from drop.
  • a tool setting unit 5 is also provided in the billet defect marking system, and the tool setting unit 5 is used to monitor the wear of chalk. That is, the tool setting unit 5 is used for monitoring the wear of chalk (ie, marking pen 6 ) and detecting the wear of chalk (ie, marking pen 6 ).
  • the tool setting unit 5 can accurately measure the position from the tip of the chalk to the base of the marking robot (not shown in the figure), and if there is a position deviation, push the chalk to move to the side where the billet 10 is located to compensate for the wear error until the positional relationship from the tip of the chalk to the base of the marking robot is satisfied.
  • the wear of the tip of the chalk reaches the wear threshold, and the motor drives the moving part to drive the pusher and the chalk to move the chalk a set distance toward the side where the billet 10 is located to compensate for the wear; when the wear of the tip of the chalk reaches the second preset value, the billet defect marking system 0 prompts to replace new chalk.
  • the billet defect marking system 0 further includes a controller 7 .
  • the controller 7 is connected to the billet position detection device 1.
  • the controller 7 is used to control the billet position detection device 1 to collect the real real-time pose of the billet and generate two-dimensional detection data, which provides two-dimensional data support for the mapping results from two-dimensional data to three-dimensional data.
  • the controller 7 is connected to the head and tail detection photoelectric switch 2 and the length measuring encoder 3, and the controller 7 cooperates with the head and tail detection photoelectric switch 2 and the length measuring encoder 3 to obtain the length information of the billet.
  • the controller 7 is connected with the marking robot arm 4 for controlling the movement of the marking robot arm 4 in three-dimensional space; the controller 7 is also connected with the marking pen 6 for controlling the movement of the marking pen 6 in the three-dimensional space.
  • the marking robot arm 4 moves within a relatively large range in the three-dimensional space and can move a relatively long distance; the marking pen 6 moves within a small range in the three-dimensional space, and the general movement distance is limited.
  • the movement of the marking pen 6 is mainly used to accurately determine the marking position of the defect position of the billet.
  • the controller 7 is connected to the tool setting unit 5 and is used to control the tool setting unit 5 to monitor the wear condition of the marking pen 6 .
  • the controller 7 is also connected to the upper computer 8 which is independent of the billet defect marking system 0.
  • the controller 7 of the billet defect marking system 0 can receive the defect data of the billet defects sent by the upper computer 8, and control the billet defect marking system 0 to complete the positioning of the defect on the surface of the billet 10, and complete the defect identification at the designated position (that is, the defect position).
  • the present invention provides a method for marking defects of a billet, including:
  • the billet defect marking method improves the positioning of the defect position and the efficiency of the marking process connection, and the defect grinding position is more focused; it realizes the precise positioning of the defect position in the three-dimensional direction, shortens the positioning time of the defect position, and improves the positioning efficiency of the defect position. It solves the problem of ambiguous defect location when one-dimensional or two-dimensional marking is performed on the surface of a three-dimensional object, and it takes a long time to determine the actual defect location, and even causes positioning errors or missing defects.
  • the billet defect marking system 0 includes a billet three-dimensional pose detection unit (not shown in the figure) and a data processing unit (not shown in the figure) provided in the process control machine.
  • the billet three-dimensional pose detection unit includes a billet position detection device 1 , for example, a camera group.
  • the billet three-dimensional pose detection unit also includes a photoelectric switch and an encoder.
  • the photoelectric switch is a photoelectric switch 2 for head and tail detection
  • the encoder is a length measuring encoder 3 .
  • the three-dimensional space pose reference of the billet is completed by the camera group, the photoelectric switch and the encoder in cooperation with the data processing unit.
  • the camera group obtains the two-dimensional data of the adjacent two sides of the billet
  • the data processing unit completes the determination of the actual three-dimensional space pose according to the length information of the billet, and completes the mapping from two-dimensional to three-dimensional according to the two-dimensional data of the two adjacent sides of the billet based on the actual three-dimensional space pose, and determines the three-dimensional space pose reference of the billet accordingly.
  • the defect position data of the billet is pre-stored in the data processing unit of the process control machine in the form of two-dimensional data or three-dimensional data.
  • the defect bit data has been described in detail above, and will not be repeated here.
  • the billet defect marking system 0 includes a three-dimensional marking execution unit, and the three-dimensional marking execution unit includes a marking robot arm 4 and a marking pen 6;
  • the marking robot arm 4 establishes a three-dimensional marking space movement track according to the three-dimensional vectorized representation of the defect position of the billet;
  • the contact method is realized by the marking pen 6 driven by the marking robot arm 4 . That is, the marking robot arm 4 drives the marking pen 6 to complete the marking of the defect position of the billet in a contact manner
  • the billet defect marking system The system 0 also includes a propulsion element (not shown in the figure) and a motor-driven moving element (not shown in the figure), and the marking robot arm 4 is provided with an adapter seat 11 .
  • the marking pen 6 is chalk, and the chalk is connected with the moving part driven by the motor through a propelling part.
  • a buffer sleeve 14 and a sleeve 13 are sequentially arranged on the outer periphery of the chalk, a buffer spring 15 is arranged between the buffer sleeve 14 and the sleeve 13, and the sleeve 13 is connected with the adapter seat 11. This has been described in detail above, and will not be repeated here.
  • the billet defect marking system is provided with a tool setting unit 5 , and the tool setting monitors the wear of chalk. That is, the knife setting unit 5 is used to monitor the amount of wear of the chalk. When the amount of wear of the chalk reaches the set wear threshold, the motor can drive the moving part to drive the propelling part and the chalk to move a set distance. This has been described in detail above, and will not be repeated here.
  • the tool setting frequency of the tool setting unit 5 is performed according to the set frequency, or according to the statistical quantity of defects of existing billets.
  • the tool setting frequency of the tool setting unit 5 is performed according to the set frequency.
  • the frequency of tool setting is once every 6 minutes, or the frequency of tool setting is once every 3 minutes.
  • the defect length is accumulated and counted starting from the first defect position, and when the cumulative amount of the defect length reaches the set threshold value, a tool setting alarm is triggered, and the marking pen 6 completes the wear calculation through the tool setting unit 5.
  • the set threshold of the cumulative amount of defect length is set to 20 meters, then the first defect bit starts, and the defect length is accumulated and counted until the cumulative amount of defect length reaches 2 meters, a tool setting alarm is triggered, and the marking pen 6 completes the wear calculation via the tool setting unit 5, and the calculated wear amount is 8 mm.
  • the tool setting frequency is counted through the cumulative amount of defect length, which is convenient for the tool setting unit 5 to monitor the wear amount of the marking pen 6 in real time, replace the marking pen 6 in time, and prevent the occurrence of missing the marking of the defect position due to the insufficient length of the marking pen 6.
  • the billet defect marking system 0 receives the defect data sent by the host computer 8, completes the positioning of the billet 10 surface by itself, and completes the defect marking at the designated position.
  • Billet defect marking system 0 is mainly composed of the following parts: billet position detection device 1, head and tail detection photoelectric switch 2, length measuring encoder 3, marking robot arm 4, knife setting device 5, marking pen 6 and controller 7.
  • the structural setting of the marking pen 6 is the core component setting of the billet defect marking system 0, which consists of a servo motor 12, a sleeve 13, a buffer sleeve 14, a buffer spring 15, an adapter seat 11, a clamping spring 16 and a marking pen 6.
  • the rotation of the servo motor 12 can push the marking pen 6 to move relative to the buffer sleeve 14 .
  • the servo motor 12 pushes the marking pen 6 forward to compensate for the wear.
  • the buffer sleeve 14 and the buffer spring 15 form the buffer mechanism of the marking robot arm 4 to prevent equipment damage caused by the rigid contact produced by the marking action.
  • the buffer sleeve 14 and the sleeve 13 form a pre-tightening force to the buffer spring, and the pressure can be adjusted, that is, the pressure of the marking pen 6 on the marking surface of the blank can be adjusted to improve the marking effect.
  • the controller 7 receives the defect bit data sent by the host computer 8, including the position, size and type of the defect.
  • the billet 10 reaches the marking position, and the billet defect marking system 0 completes position tracking.
  • the billet defect marking system 0 is equipped with a head and tail position detection photoelectric switch 2.
  • the photoelectric switch 2 is triggered, and the controller 7 starts to receive the position model of the length measuring encoder 3, and starts counting the length of the billet 10 to complete the length position tracking.
  • the controller 7 Before marking the billet 10, the controller 7 needs to complete the detection of the pose of the billet 10.
  • the 3D position sensor is used to measure the spatial position, and the center position of each surface of the billet 10 is corrected to obtain a position reference.
  • the defect bit data sent by the host computer 10 will become a space vector value (ie, three-dimensional data) on this reference.
  • Static marking requires the billet 10 to stop, and the marking robot 4 drives the marking pen 6 to perform marking actions; this mode requires the controller 7 to be able to control the billet transmission roller table, and stop the defect position within the working range of the marking robot 4 .
  • the dynamic marking is to realize the defect identification dynamically during the running process of the billet 10 .
  • the controller 7 accurately tracks the length position and spatial position of the billet 10, and the marking robot arm 4 responds quickly, and completes the marking process while the billet 10 is running.
  • step (4) that is, before marking at the defect position, it is necessary to calibrate the position of the marking pen 6 in step (5) to determine whether the position of the marking pen 6 is normal. If the position of the marking pen 6 is normal, then perform step (4) Mark the defect position on the blank 10; if the position of the marking pen 6 is abnormal, you need to compensate and correct the material loss of the marking pen 6 through step (5), and then perform step (4) to mark the defect position on the blank 10.
  • the billet defect marking system 0 and method proposed by the present invention through the establishment of three-dimensional defect position representation, three-dimensional marking action and contact marking, completes the precision marking of defect positions based on the actual billet position and posture, and the marked billet 10 is physically visible and checkable.
  • the present invention improves the efficiency of process linking, and the defect grinding position is more focused; it avoids one-dimensional or two-dimensional marking on the surface of a three-dimensional object, the defect location is not clear, and the actual location of the defect takes a long time to determine and even causes the risk of positioning errors or missing defects.

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Abstract

一种方坯缺陷打标系统，包括数据处理单元、方坯三维位姿检测单元及三维打标执行单元，数据处理单元用以根据方坯三维位姿检测单元检测的数据、完成以实际三维空间位姿为基准的二维到三维的映射、据此确定方坯的三维空间位姿基准，并据方坯的三维空间位姿基准完成方坯缺陷位的相应三维矢量化表征；三维打标执行单元根据方坯缺陷位的三维矢量化表征确定空间运动轨迹，对方坯的缺陷位进行接触式打标。本发明提供的一种方坯缺陷打标系统，通过建立三维的缺陷位表征、三维的打标动作以及接触式打标，完成基于实际方坯位姿的缺陷位的精确打标。本发明还提供了一种方坯缺陷打标方法。

Description

一种方坯缺陷打标系统及方法 技术领域
本发明属于方坯产品自动检测与控制应用领域，具体涉及一种方坯缺陷打标系统及方法。
背景技术
方坯缺陷检测和控制应用中，超声探伤和磁探检测后缺陷打标仍以喷标为主，仅在缺陷长度位置上标识，缺陷修磨只能根据长度位置查找，在周向缺乏定位依据，存在查找时效低，甚至难以找到缺陷的风险。现有的自动打标手段不能精确的定位方坯的缺陷位置，影响缺陷的后处理效率，甚至容易找不到缺陷而导致缺陷溜掉。
正常情况下，小方坯近表缺陷细微且可能隐藏于表面和表面以下，很难直接被检查出来。即使通过技术手段将方坯的缺陷检查出来，如果该缺陷不能被有效标识，再次查找和复定位该缺陷仍然十分困难。缺陷的位置标识，不仅要体现在缺陷长度位置，更要体现在周向的定位上。
申请号为：CN202010348870.3的发明申请，公开了“一种连铸坯表面二维三维组合成像检测系统及其方法”，包括沿所述连铸坯运动方向依次设置的编码器、位置感应机构和安装支架；所述安装支架上沿所述连铸坯运动方向依次设有三维成像机构、二维成像机构；所述位置感应机构用以启动所述编码器，所述编码器用以记录所述连铸坯的位置信息；所述安装支架上还设有提升装置，所述三维成像机构沿所述提升装置上下移动；所述安装支架上还设有隔热板，所述二维成像机构、所述三维成像机构均位于所述隔热板的上方，所述连铸坯位于所述隔热板的下方。
申请号为：CN202111123476.0的发明申请，公开了“一种缺陷打标方法和系统”，所述系统包括设置在待检测产品上方的视野可以覆盖待检测产品的X轴方向的至少一个摄像装置，待检测产品在传输轴的运动下沿Y轴运动，传输轴与编码器连接；所述方法包括：通过至少一个摄像装置采集待检测产品的目标检测图像，根据目标检测图像确定目标缺陷的位置信息；获取编码器读数，根据编码器读数计算运行长度；根据打标装置的位置信息、目标缺陷的位置信息、摄像装置的位置信息以及运行长度，确定目标缺陷是否到达打标装置的预设范围内，若是，则控制打标装置在待检测产品上进行缺陷标记。
申请号为：CN200720012998.2的实用新型申请，公开了“一种线扫描式X射线实 时成像检测系统缺陷打标器”，在探伤过程中，当检测出工件缺陷时，实时成像系统通过软件计算，控制系统发出控制脉冲到驱动器，驱动电机转动，从而带动气动打标笔移动到缺陷位置上方，自动弹起标记笔头在工件上打上标记点，标记缺陷位置。
申请号为：CN202111049131.5的发明申请，公开了“一种方坯位姿智能检测方法及装置”，通过沿辊道运行方向依次固定安装头尾检测传感器、编码器，可检测方坯在生产和传动过程中产生的长度的位姿变化；通过在方坯横截面上设有若干个垂直且间隔设置的位置传感器，位置传感器与方坯侧面距离均相等，通过测量头至方坯定位点距离的变化值，推算出在位姿变化条件下定位点的实际位置点坐标信息，获得位姿表征值，为方坯打标和修磨缺陷时提供在长度方向及周向的坐标基准，彻底解决了在周向缺乏定位依据，不能依据方坯的真实位姿进行检测计算，造成查找效率低、漏查缺陷的技术问题。
现有的方坯缺陷打标系统存在仅能在长度方向上确定缺陷的位置，缺乏在该长度上截面周向精确定位并进行非接触式打标，缺陷位的定位不精确、耗时长甚至漏掉缺陷位的问题。
发明内容
本发明的目的在于解决现有的方坯缺陷打标系统存在仅能在长度方向上确定缺陷的位置，缺乏在该长度上截面周向精确定位并进行非接触式打标，缺陷位的定位不精确、耗时长甚至漏掉缺陷位的问题。
第一方面，本发明提供的方坯缺陷打标系统，在三维方向上建立并确定方坯的缺陷位表征准确定位缺陷位的位置，通过三维的打标动作以及接触式打标，完成基于方坯的实际三维位姿的缺陷位的精确打标，节省了缺陷位的定位时间，提高了缺陷位的定位效率。
为解决以上问题，本发明提供了一种方坯缺陷打标系统，包括：数据处理单元、方坯三维位姿检测单元及三维打标执行单元，其中，
数据处理单元用以根据方坯三维位姿检测单元检测的数据、完成以实际三维空间位姿为基准的二维到三维的映射、据此确定该方坯的三维空间位姿基准，并据方坯的三维空间位姿基准完成方坯缺陷位的相应三维矢量化表征；
三维打标执行单元根据方坯缺陷位的三维矢量化表征的缺陷位确定空间运动轨迹，对方坯的缺陷位进行接触式的缺陷打标。
采用上述技术方案，数据处理单元建立三维的缺陷位表征，三维打标执行单元规划三维空间的打标运动轨迹、实现三维的打标动作以及接触式打标，完成基于方坯的实际三维位姿的缺陷位的精确打标，使得完成打标的方坯的缺陷位置物理可见、可查，三维 的缺陷位表征能够直接用于缺陷位修磨，省却了缺陷定位精度不高时，缺陷修磨要大范围搜索缺陷或者扩大缺陷修磨范围，节省了缺陷位的定位时间，提高了缺陷位的定位效率。同时，对方坯的缺陷位进行接触式的缺陷打标，相较于通过喷码等方式对方坯的缺陷位进行非接触式的打标而言，打标效果更加稳定。
根据本发明的另一具体实施方式，缺陷位数据以独立于方坯缺陷打标系统的方式、在方坯缺陷打标系统运行之前被确定并储存于数据处理单元。
根据本发明的另一具体实施方式，方坯三维位姿检测单元包括：用于获取方坯相邻两侧面的二维数据的相机组；用于获取方坯长度信息的光电开关及编码器；
根据方坯相邻两侧面的二维数据完成二维到三维的映射；
根据方坯长度信息完成方坯真实空间位姿的确定。
根据本发明的另一具体实施方式，三维打标执行单元包括：可于三维空间动作的打标机器手；与打标机器手柔性连接的打标笔。
根据本发明的另一具体实施方式，方坯缺陷打标系统还包括推进件和电机驱动的移动件，打标机器手设有转接座；打标笔为粉笔，粉笔通过推进件与移动件连接；粉笔外周依次设有缓冲套筒及套筒，缓冲套筒与套筒之间设有缓冲弹簧，套筒与打标机器手的转接座连接。
根据本发明的另一具体实施方式，方坯缺陷打标系统内还设有对刀单元，对刀单元用于对粉笔的磨损情况建立监控。
第二方面，本发明的实施方式公开了一种方坯缺陷打标方法，包括：
根据方坯三维位姿检测单元检测的数据、完成以实际三维空间位姿为基准的二维到三维的映射、据此确定方坯的三维空间位姿基准；根据方坯的三维空间位姿基准建立方坯缺陷位的三维矢量化表征；
根据方坯缺陷位的三维矢量化表征建立三维的空间运动轨迹、以接触式的方式完成方坯缺陷位的打标。
采用上述技术方案，方坯缺陷打标方法使得缺陷位的定位、打标工序衔接效率提高，缺陷修磨位置更聚焦；实现了三维方向中的缺陷位的精准定位，缩短了缺陷位的定位时间，提高了缺陷位的定位效率。解决了在三维物体表面做一维或者二维打标，缺陷定位不明确，实际定位缺陷时确定时间长甚至造成定位错误或者漏掉缺陷的问题。根据本发明的另一具体实施方式，方坯缺陷打标系统包括方坯三维位姿检测单元和设于过程控制机的数据处理单元，其中，方坯三维位姿检测单元包括相机组和光电开关及编码器，方坯的三维空间位姿基准由相机组、光电开关及编码器配合数据处理单元完成；根据方坯 三维位姿检测单元检测的数据、完成以实际三维空间位姿为基准的二维到三维的映射、据此确定方坯的三维空间位姿基准，包括：包括：
相机组用于获取方坯相邻两侧面的二维数据；
光电开关及编码器配合、用于获取方坯长度信息；
数据处理单元根据方坯长度信息完成实际三维空间位姿的确定、并以实际三维空间位姿为基根据方坯相邻两侧面的二维数据完成二维到三维的映射，据此确定方坯的三维空间位姿基准。
根据本发明的另一具体实施方式，方坯的缺陷位数据以二维数据或三维数据的形式事先存储于过程控制机中的数据处理单元。
根据本发明的另一具体实施方式，方坯缺陷打标系统包括三维打标执行单元，三维打标执行单元包括打标机器手和打标笔；
根据方坯缺陷位的三维矢量化表征建立三维的空间运动轨迹、以接触式的方式完成方坯缺陷位的打标，包括：
打标机器手根据方坯缺陷位的三维矢量化表征建立三维的空间运动轨迹；
接触式经由打标机器手带动的打标笔实现。
根据本发明的另一具体实施方式，方坯缺陷打标系统还包括推进件和电机驱动的移动件，打标机器手设有转接座；打标笔为粉笔，粉笔通过推进件与电机驱动的移动件连接；
粉笔外周依次设有缓冲套筒及套筒，缓冲套筒与套筒之间设有缓冲弹簧，套筒与打标机器手的转接座连接。
根据本发明的另一具体实施方式，方坯缺陷打标系统设有对刀单元，对刀单元建立对粉笔的磨损情况的监控；
当粉笔的磨损量达到设定的磨损阈值时，电机能够驱动移动件，以带动推进件和粉笔移动设定的距离。
根据本发明的另一具体实施方式，对刀单元的对刀频率按照设定的频率进行，或按照对已有方坯的缺陷位的统计量进行。
根据本发明的另一具体实施方式，当对刀频率按照对已有方坯的缺陷位的统计量进行时，自第一个缺陷位开始，对缺陷长度进行累积统计，当缺陷长度的累积量达到设定阈值时，触发对刀报警提示，打标笔经由对刀单元完成磨损计算。
本发明提供了一种方坯缺陷打标系统及方法，通过建立三维的缺陷位表征、三维的打标动作以及接触式打标，完成基于实际方坯位姿的缺陷位的精度打标，据此完成打标 的方坯，缺陷位置物理可见、可查，能够直接用于缺陷修磨的定位标识，省却了缺陷定位精度不高时，缺陷修磨要大范围搜索缺陷或者扩大缺陷修磨范围，本发明使得工序衔接效率提高，缺陷修磨位置更聚焦；避免了在三维物体表面做一维或者二维打标，缺陷定位不明确，实际定位缺陷时确定时间长甚至造成定位错误或者漏掉缺陷的风险。
附图说明
图1为本发明说明书中的实施例的方坯缺陷打标方法的工作过程示意图；
图2为本发明说明书中的实施例的方坯缺陷打标系统结构示意图；
图3为本发明说明书中的实施例的三维打标执行单元的打标笔结构示意图。
上述附图中，附图标记对应的部件名称如下：
0-方坯缺陷打标系统；1-方坯位置检测装置；2-头尾检测光电开关；3-测长编码器；4-打标机器手；5-对刀单元；6-打标笔；7-控制器；8-上位机；10-方坯；11-转接座；12-伺服电机；13-套筒；14-缓冲套筒；15-缓冲弹簧；16-夹紧弹簧；17-打标笔。
具体实施方式
以下由特定的具体实施例说明本发明的实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的其他优点及功效。虽然本发明的描述将结合较佳实施例一起介绍，但这并不代表此发明的特征仅限于该实施方式。恰恰相反，结合实施方式作发明介绍的目的是为了覆盖基于本发明的权利要求而有可能延伸出的其它选择或改造。为了提供对本发明的深度了解，以下描述中将包括许多具体的细节。本发明也可以不使用这些细节实施。此外，为了避免混乱或模糊本发明的重点，有些具体细节将在描述中被省略。需要说明的是，在不冲突的情况下，本发明中的实施例及实施例中的特征可以相互组合。
应注意的是，在本说明书中，相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步定义和解释。
术语“第一”、“第二”等仅用于区分描述，而不能理解为指示或暗示相对重要性。
在本实施例的描述中，还需要说明的是，除非另有明确的规定和限定，术语“设置”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本实施例中的具体含义。
为使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明的实施方式作进一步地详细描述。
下面，根据说明书附图和具体实施方式对本发明的一种方坯缺陷打标系统及方法作进一步具体说明。
第一方面，参考图2，本发明的实施例中提供一种方坯缺陷打标系统0，包括数据处理单元(图中未示出)、方坯三维位姿检测单元(图中未示出)及三维打标执行单元(图中未示出)。
方坯三维位姿检测单元用于检测方坯的真实的实时位姿并生成检测数据。其中，检测数据为二维数据，二维的检测数据即方坯三维位姿检测单元检测方坯在X、Y方向上的位姿数据。
示例性地，方坯三维位姿检测单元获取方坯10相邻两侧面的二维数据。
数据处理单元接收方坯三维位姿检测单元的检测数据，根据检测数据以实际三维空间位姿为基准生成二维数据到三维数据的映射结果，根据映射结果确定该方坯10的三维空间位姿基准，并根据方坯10的三维空间位姿基准完成方坯缺陷位的相应三维矢量化表征。
即，数据处理单元能够接收方坯三维位姿检测单元的检测数据，对检测数据进行处理(如根据检测数据以实际三维空间位姿为基准生成二维数据到三维数据的映射结果、根据方坯10的三维空间位姿基准完成方坯缺陷位的相应三维矢量化表征)，生成方坯10的三维空间位姿基准和方坯缺陷位的三维矢量化表征，以准确定位方坯缺陷位在方坯10的三维空间位姿基准的三维位置，为后续精确打标做铺垫。
继续参考图2，在本实施例中，示例性地，根据检测数据以实际三维空间位姿为基准生成二维数据到三维数据的映射结果，包括：
第一，方坯10在生产和传动过程中，针对规则长方形的方坯10，数据处理单元将检测数据(二维数据)通过矩阵变换运算转换为三维数据映射结果，根据三维数据的映射结果确定该方坯10的三维空间位姿基准；在其他一些可能的实施例中，数据处理单元将检测数据(二维数据)通过其他能够将二维数据转换为三维数据的运算方法转换为三维数据映射结果。
第二，方坯10在生产和传动过程中，热态连铸或者热态轧制会造成方坯10直度变形和产生扭曲，在冷床上由于自身的弯曲、扭曲，以及辊道的磨损，导致方坯10本身存在位姿变化。可以设置3D传感器检测方坯位姿变化的三维数据，对变形的长方形方坯10进行检测和误差补偿，以准确确定该方坯10的三维空间位姿基准，即该方坯10的真 实的实时三维空间位姿。
三维打标执行单元根据方坯缺陷位的三维矢量化表征确定空间运动轨迹，对方坯10的缺陷位进行接触式打标。即三维打标执行单元不仅根据方坯缺陷位确定打标的空间运动轨迹，而且执行方坯缺陷位的接触式打标。
采用上述技术方案，数据处理单元建立三维的缺陷位表征，三维打标执行单元规划三维空间的打标运动轨迹、实现三维的打标动作以及接触式打标，完成基于方坯10的实际三维位姿的缺陷位的精确打标，使得完成打标的方坯的缺陷位置物理可见、可查，三维的缺陷位表征能够直接用于缺陷位修磨，省却了缺陷定位精度不高时，缺陷修磨要大范围搜索缺陷或者扩大缺陷修磨范围，节省了缺陷位的定位时间，提高了缺陷位的定位效率。同时，对方坯10的缺陷位进行接触式的缺陷打标，相较于通过喷码等方式对方坯10的缺陷位进行非接触式的打标而言，打标效果更加稳定。在本发明提供的一些可能的实施例中，参考图2，缺陷位数据以独立于方坯缺陷打标系统0的方式、在方坯缺陷打标系统0运行之前被确定并储存于数据处理单元。
在本发明提供的其他一些可能的实施例中，示例性地，缺陷位数据以独立于方坯缺陷打标系统0的方式、在方坯10运动到缺陷位之前被确定并储存于数据处理单元。
缺陷位数据为方坯10的缺陷位的二维数据或三维数据。示例性地，缺陷位数据为方坯10的缺陷位的二维数据，缺陷位即沿方坯10的长度方向的细长条，缺陷位数据为该细长条的在方坯10上的沿二维方向(即X、Y)的起始点、结束点，或者缺陷位数据为该细长条的在方坯上的沿二维方向(即X、Y)的起始点、结束点以及该细长条的长度信息。
缺陷位数据能够通过数据处理单元根据方坯10的三维空间位姿基准完成方坯缺陷位的相应三维矢量化表征。
在本发明提供的一些可能的实施例中，方坯三维位姿检测单元，包括：
用于获取方坯相邻两侧面的二维数据的相机组；
用于获取方坯长度信息的光电开关及编码器；
根据方坯相邻两侧面的二维数据完成二维到三维的映射；
根据方坯长度信息完成方坯真实空间位姿的确定。
具体而言，参考图2，方坯三维位姿检测单元包括方坯位置检测装置1。
方坯10放置在V型辊道上，方坯10的第一棱边以及相邻的两侧面与辊道接触，方坯10中与第一棱边相对设置有第二棱边。示例性地，方坯位置检测装置1为相机组，相机组至少包括两个相机，至少两个相机分别与方坯10的第二棱边相邻的两侧面相对应设 置，用于获取与方坯10的第二棱边相邻两侧面的二维数据。
在本发明提供的其他一些可能的实施例中，参考图2，方坯三维位姿检测单元还包括光电开关及编码器。
如前所述，方坯位置检测装置1(即前述实施例中的相机组)获取方坯10的第二棱边相邻两侧面的二维数据，即截面的空间位置数据。示例性地，光电开关为头尾检测光电开关2，编码器为测长编码器3。当方坯10沿长度方向的第一端经过头尾检测光电开关2时，测长编码器3开始计算方坯的长度信息；当方坯10沿长度方向的第二端经过头尾检测光电开关2时，测长编码器3停止计算方坯10的长度信息。因而，头尾检测光电开关2与测长编码器3相互配合，以获取方坯10的长度信息。
在本实施例中，方坯位置检测装置1、头尾检测光电开关2、测长编码器3均为底层信号输入传感器。方坯位置检测装置1(相机组)获取方坯10的截面空间位置数据，即获取与方坯10的第二棱边相邻两侧面的二维数据；头尾检测光电开关2、测长编码器3获取方坯10的长度数据。为后续综合方坯10的截面空间位置信息和方坯10的长度数据完成方坯真实空间位姿的计算提供数据支持。在本发明提供的其他一些可能的实施例中，数据处理单元综合方坯10的截面空间位置信息和方坯10的长度数据完成方坯真实空间位姿计算；数据处理单元根据方坯真实空间位姿、从上位机8接收的缺陷位数据，完成方坯缺陷位的相应的三维矢量化表征。
在本发明提供的其他一些可能的实施例中，参考图2，方坯缺陷打标系统0中，三维打标执行单元(图中未示出)包括：可于三维空间动作的打标机器手4；与打标机器手4柔性连接的打标笔6。
具体而言，参考图2，三维打标执行单元(图中未示出)包括打标机器手4和打标笔6。其中，打标机器手4能够在三维空间内动作，即打标机器手4能够在三维空间内运动。打标笔6与打标机器手4柔性连接，打标笔6能够在打标机器手4的带动下，在三维空间内运动，直至运动到打标位置以对缺陷位进行精确打标。在本发明提供的其他一些可能的实施例中，方坯缺陷打标系统0还包括推进件和电机驱动的移动件，打标机器手4设有转接座11，打标笔6为粉笔，粉笔通过推进件与移动件连接；粉笔外周依次设有缓冲套筒14及套筒13，缓冲套筒14与套筒13之间设有缓冲弹簧15，套筒13与转接座11连接。
具体而言，图3示出了图2中的方坯缺陷打标系统0的三维打标执行单元的结构示意图。参考图3并结合图2，三维打标执行单元包括打标笔6。示例性地，打标笔6为粉笔。相较于喷码笔而言，粉笔与方坯10实现接触式打标；再者，粉笔即写即干，相较于 喷码笔喷码之后需要等待较长的干燥时间而言，节省了缺陷位的打标时间，提高了打标效率；使用粉笔作为打标笔6，解决了喷码笔的喷头容易被堵塞，墨水无法喷出喷头以进行缺陷位打标的问题。
继续参考图3，方坯缺陷打标系统0还包括推进件(图中未示出)和电机驱动的移动件(图中未示出)，打标机器手4设有转接座11；打标笔6为粉笔，粉笔通过推进件与电机驱动的移动件连接；
粉笔外周依次设有缓冲套筒14及套筒13，缓冲套筒14与套筒13之间设有缓冲弹簧15，套筒13与打标机器手4的转接座11连接。
具体而言，参考图3并结合图2，方坯缺陷打标系统0的三维打标执行单元包括打标机器手4，打标机器手4设有转接座11，打标机器手4与转接座11可旋转连接。
继续参考图3并结合图2，三维打标执行单元包括依次设置在粉笔(即打标笔6)外周的缓冲套筒14及套筒13，套筒13对缓冲套筒14具有保护作用。套筒13与打标机器手4的转接座11连接，以使打标笔6通过套筒13与打标机器手4相连接，且打标笔6能够通过转接座11相对于打标机器手4旋转运动，以完成对方坯缺陷位的精准打标。
继续参考图3并结合图2，缓冲套筒14与套筒13之间设有缓冲弹簧15，缓冲弹簧15的一端与打标笔6相抵接，另一端与套筒13相抵接。当打标机器手4带动打标笔6与方坯10的缺陷位进行接触式打标时，缓冲弹簧15能够缓冲打标笔6与方坯10之间的空间位置误差，以使打标笔6能够对方坯缺陷位进行精准打标。
缓冲套筒14和缓冲弹簧15组成了打标机器手4的缓冲机构，防止打标动作产生的刚性接触带来的设备损坏。缓冲套筒14和套筒13对缓冲弹簧15构成预紧力，该压力可以调节，即调整打标笔6对方坯10的打标表面的压力，改善画标效果。
缓冲套筒14内设有推进件(图中未示出)和电机驱动的移动件(图中未示出)，粉笔(即打标笔6)通过推进件与电机驱动的移动件连接，移动件和推进件能够实现粉笔的磨损补偿。
示例性地，推进件为丝杆，能够将螺旋运动转换为线性运动。粉笔(即打标笔6)磨损时，电机驱动移动件通过丝杆将粉笔朝向方坯10所在的一侧推出(如图3所示，电机驱动移动件通过丝杆将粉笔由图3的左侧向图3的右侧推出)，以补偿粉笔的磨损误差，使得粉笔能够正常地对方坯10的缺陷位进行打标。继续参考图3，三维打标执行单元包括夹紧弹簧16，夹紧弹簧16设于打标笔6的不与方坯10相接触的一端，也即夹紧弹簧16设于打标笔6更靠近缓冲套筒14的一端，夹紧弹簧16用于夹紧打标笔6，防止打标笔6掉落。示例性地，夹紧弹簧16沿打标笔6的周向夹紧打标笔6，有效防止打标笔6 掉落。
在本发明提供的一些可能的实施例中，参考图2，方坯缺陷打标系统内还设有对刀单元5，对刀单元5用于对粉笔的磨损情况建立监控。即对刀单元5用于监控粉笔(即打标笔6)的磨损、检测粉笔(即打标笔6)的磨损。
示例性地，参考图2，对刀单元5能够精确测量粉笔的笔尖到打标机器人(图中未示出)的底座的位置，如果出现位置偏差则推动粉笔向方坯10所在的一侧运动以弥补磨损误差直至满足粉笔的笔尖到打标机器人的底座的位置关系。
示例性地，粉笔的笔尖磨损达到磨损阈值，电机驱动移动件带动推进件和粉笔将粉笔朝向方坯10所在的一侧移动设定的距离以补偿磨损；当粉笔的笔尖磨损达到第二预设值，方坯缺陷打标系统0提示更换新的粉笔。
在本发明提供的其他一些可能的实施例中，继续参考图2，方坯缺陷打标系统0还包括控制器7。在方坯缺陷打标系统0内，控制器7与方坯位置检测装置1相互连接，控制器7用于控制方坯位置检测装置1采集方坯的真实的实时位姿并生成二维检测数据，为之后生成二维数据到三维数据的映射结果提供二维数据支持。
控制器7与头尾检测光电开关2、测长编码器3相互连接，控制器7配合头尾检测光电开关2和测长编码器3获取方坯的长度信息。
控制器7与打标机器手4相互连接，用于控制打标机器手4在三维空间内运动；控制器7还与打标笔6相连接，用于控制打标笔6在三维空间内运动。打标机器手4在三维空间内的较大范围内运动，能够运动较远的距离；打标笔6在三维空间内的较小范围内运动，一般运动的距离有限，打标笔6的运动主要用于精准确定方坯缺陷位的打标位置。
控制器7与对刀单元5相互连接，用于控制对刀单元5对打标笔6的磨损情况进行监控。
继续参考图2，控制器7还与独立于方坯缺陷打标系统0的上位机8相互连接，方坯缺陷打标系统0的控制器7能够接收上位机8发送的方坯缺陷位的缺陷数据，并控制方坯缺陷打标系统0完成缺陷位在方坯10表面的定位，并在指定位置(即缺陷位置)完成缺陷标识。
第二方面，参考图1，本发明提供了一种方坯缺陷打标方法，包括：
S1：根据方坯三维位姿检测单元检测的数据、完成以实际三维空间位姿为基准的二维到三维的映射、据此确定方坯的三维空间位姿基准；
S2：根据方坯实的三维空间位姿基准建立方坯缺陷位的三维矢量化表征；
S3：根据方坯缺陷位的三维矢量化表征建立三维的空间运动轨迹、以接触式的方式完成方坯缺陷位的打标。
采用上述技术方案，方坯缺陷打标方法使得缺陷位的定位、打标工序衔接效率提高，缺陷修磨位置更聚焦；实现了三维方向中的缺陷位的精准定位，缩短了缺陷位的定位时间，提高了缺陷位的定位效率。解决了在三维物体表面做一维或者二维打标，缺陷定位不明确，实际定位缺陷时确定时间长甚至造成定位错误或者漏掉缺陷的问题。
在本发明提供的其他一些可能的实施例中，参考图2，方坯缺陷打标系统0包括方坯三维位姿检测单元(图中未示出)和设于过程控制机的数据处理单元(图中未示出)。参考图2，其中，方坯三维位姿检测单元(图中未示出)包括方坯位置检测装置1，示例性地，如相机组。方坯三维位姿检测单元还包括光电开关及编码器，示例性地，光电开关为头尾检测光电开关2，编码器为测长编码器3。方坯的三维空间位姿基准由相机组、光电开关及编码器配合数据处理单元完成。
S1：根据方坯三维位姿检测单元检测的数据、完成以实际三维空间位姿为基准的二维到三维的映射、据此确定方坯的三维空间位姿基准，包括：
S11：相机组获取方坯相邻两侧面的二维数据；
S12：光电开关及编码器配合以获取方坯长度信息；
S13：数据处理单元根据方坯长度信息完成实际三维空间位姿的确定、并以实际三维空间位姿为基根据方坯相邻两侧面的二维数据完成二维到三维的映射，据此确定方坯的三维空间位姿基准。
在本发明提供的其他一些可能的实施例中，方坯的缺陷位数据以二维数据或三维数据的形式事先存储于过程控制机中的数据处理单元。前述对缺陷位数据已有详细描述，在此不做赘述。
在本发明提供的其他一些可能的实施例中，参考图2并结合图3，方坯缺陷打标系统0包括三维打标执行单元，三维打标执行单元包括打标机器手4和打标笔6；
S3：根据方坯缺陷位的三维矢量化表征建立三维的空间运动轨迹、以接触式的方式完成方坯缺陷位的打标，包括：
S31：打标机器手4根据方坯缺陷位的三维矢量化表征建立三维的打标空间运动轨迹；
S32：所述的接触式经由打标机器手4带动的打标笔6实现。即打标机器手4带动打标笔6以接触式的方式完成方坯缺陷位的打标
在本发明提供的其他一些可能的实施例中，参考图3并结合图2，方坯缺陷打标系 统0还包括推进件(图中未示出)和电机驱动的移动件(图中未示出)，打标机器手4设有转接座11。打标笔6为粉笔，粉笔通过推进件与电机驱动的移动件连接。粉笔外周依次设有缓冲套筒14及套筒13，缓冲套筒14与套筒13之间设有缓冲弹簧15，套筒13与转接座11连接。前述对此已有详细描述，在此不做赘述。
在本发明提供的其他一些可能的实施例中，参考图2，方坯缺陷打标系统设有对刀单元5，对刀建立对粉笔的磨损情况的监控。即对刀单元5用于监控粉笔的磨损量。当粉笔的磨损量达到设定的磨损阈值时，由电机能够驱动移动件，以带动推进件和粉笔移动设定的距离。前述对此已有详细描述，在此不做赘述。
在本发明提供的其他一些可能的实施例中，参考图2，对刀单元5的对刀频率按照设定的频率进行，或按照对已有方坯的缺陷位缺陷的统计量进行。
示例性地，对刀单元5的对刀频率按照设定的频率进行。如对刀频率为每6分钟一次，或对刀频率为每3分钟一次。在本发明提供的其他一些可能的实施例中，参考图2，当对刀频率按照对已有方坯10的缺陷位缺陷的统计量进行时，自第一个缺陷位开始，对缺陷长度进行累积统计，当缺陷长度的累积量达到设定阈值时，触发对刀报警提示，打标笔6经由对刀单元5完成磨损计算。示例性地，设定缺陷长度的累积量的设定阈值为20米，则第一个缺陷位开始，累计统计缺陷长度，直至缺陷长度的累积量达到2米时，触发对刀报警提示，打标笔6经由对刀单元5完成磨损计算，计算磨损量为8毫米。
采用上述技术方案，通过缺陷长度的累积量统计对刀频率，便于对刀单元5实时监控打标笔6的磨损量，及时更换打标笔6，防止出现因打标笔6长度不够而漏掉缺陷位打标的情况。
工作过程、原理及实施例
参考图1至图3，以下介绍方坯缺陷打标方法的示例性实施方式。
结合图1对工作原理进行下述阐述；
如图2所示，方坯缺陷打标系统0接收上位机8发送的缺陷数据，自己完成方坯的10表面的定位，在指定位置完成缺陷标识。方坯缺陷打标系统0主要由以下几部分组成：方坯位置检测装置1、头尾检测光电开关2、测长编码器3、打标机器手4、对刀装置5、打标笔6和控制器7。
如图3所示并结合图2所示，打标笔6部分的结构设置是方坯缺陷打标系统0的核心部件设置，其由伺服电机12、套筒13、缓冲套筒14、缓冲弹簧15、转接座11、夹紧弹簧16和打标笔6组成。
伺服电机12转动可以推动打标笔6相对于缓冲套筒14运动。缓冲套筒14末端有曲面弹簧(即夹紧弹簧16)，曲面弹簧(即夹紧弹簧16)可以压紧打标笔6。打标笔6出现磨损时，伺服电机12推动打标笔6前进，弥补磨损值。
缓冲套筒14和缓冲弹簧15组成了打标机器手4的缓冲机构，防止打标动作产生的刚性接触带来的设备损坏。缓冲套筒14和套筒13对缓冲弹簧构成预紧力，该压力可以调节，即调整打标笔6对方坯的打标表面的压力，改善画标效果。
参考图1并结合图2和图3，方坯缺陷打标的工作步骤如下：
(1)方坯10未到打标位置之前，控制器7收到上位机8发送的缺陷位数据，包括缺陷的位置、大小和缺陷种类。
(2)方坯10达到打标位置，方坯缺陷打标系统0完成位置跟踪。方坯缺陷打标系统0配置头尾位置检测光电开关2，方坯10头部到达方坯缺陷打标系统0前的指定位置时，触发光电开关2，控制器7开始接收测长编码器3的位置型号，开始对方坯10进行计长，完成长度位置跟踪。
(3)在对方坯10打标之前，控制器7要完成方坯10的位姿检测。方坯10在运行过程中，由于辊道磨损和方坯10材质本身的变形和扭曲，方坯10表面的真实位置会在传输过程中上下跳动。采用3D位置传感器进行空间位置测量，对方坯10各个面的中心位置进行校正，获得位置基准，上位机10发送的缺陷位数据将在这个基准上变成空间矢量值(即三维数据)。
(4)缺陷位置打标。实时跟踪方坯10的位置，当上位机8发送的方坯10的缺陷位到达方坯缺陷打标系统0时，打标机器手4带动打标笔6工作。方坯缺陷打标系统0可以实现静态达标和动态打标。
静态打标需要方坯10停下来，打标机器手4带动打标笔6做打标动作；该模式需要控制器7能够控制方坯传输辊道，且将缺陷位停在打标机器手4工作范围内。
动态打标则是在方坯10运行过程中动态实现缺陷标识。控制器7精确跟踪方坯10的长度位置和空间位置，打标机器手4快速反应，在方坯10运转的同时完成标记过程。
(5)打标笔6的位置标定。为了保证打标的精度，以及保证方坯缺陷打标系统0工作的稳定性，加入对刀单元5，打标笔6每次或者间隔一定时间，要进行对刀工作，对刀动作能够检测打标笔6的损耗，对打标笔6的材料损耗量进行补偿和修正，尤其针对粉笔类画标材料进行损耗补偿和材料缺失报警。
在步骤(4)之前，即，在缺陷位置打标之前，需要通过步骤(5)打标笔6的位置标定以进行打标笔6位置是否正常的判定，如果打标笔6的位置正常，则执行步骤(4) 对方坯10进行缺陷位置的打标；如果打标笔6的位置异常，则需要通过步骤(5)补偿和修正打标笔6的材料损耗量，再执行步骤(4)对方坯10进行缺陷位置的打标。
本发明提出的一种方坯缺陷打标系统0及方法，通过建立三维的缺陷位表征、三维的打标动作以及接触式打标，完成基于实际方坯位姿的缺陷位的精度打标，据此完成打标的方坯10，缺陷位置物理可见、可查，能够直接用于缺陷修磨的定位标识，省却了缺陷定位精度不高时，缺陷修磨要大范围搜索缺陷或者扩大缺陷修磨范围。本发明使得工序衔接效率提高，缺陷修磨位置更聚焦；避免了在三维物体表面做一维或者二维打标，缺陷定位不明确，实际定位缺陷时确定时间长甚至造成定位错误或者漏掉缺陷的风险。
虽然通过参照本发明的某些优选实施方式，已经对本发明进行了图示和描述，但本领域的普通技术人员应该明白，以上内容是结合具体的实施方式对本发明所作的进一步详细说明，不能认定本发明的具体实施只局限于这些说明。本领域技术人员可以在形式上和细节上对其作各种改变，包括做出若干简单推演或替换，而不偏离本发明的精神和范围。

Claims (14)

  1. 一种方坯缺陷打标系统，其特征在于，包括：数据处理单元、方坯三维位姿检测单元及三维打标执行单元，其中，
    所述数据处理单元用以根据所述方坯三维位姿检测单元检测的数据、完成以实际三维空间位姿为基准的二维到三维的映射、据此确定方坯的三维空间位姿基准，并据所述方坯的三维空间位姿基准完成方坯缺陷位的相应三维矢量化表征；
    所述三维打标执行单元根据所述方坯缺陷位的三维矢量化表征确定空间运动轨迹，对所述方坯的缺陷位进行接触式打标。
  2. 根据权利要求1所述的一种方坯缺陷打标系统，其特征在于，
    所述方坯的缺陷位数据以独立于所述方坯缺陷打标系统的方式、在所述方坯缺陷打标系统运行之前被确定并储存于所述数据处理单元。
  3. 根据权利要求1所述的一种方坯缺陷打标系统，其特征在于，所述方坯三维位姿检测单元，包括：
    用于获取方坯相邻两侧面的二维数据的相机组；
    用于获取方坯长度信息的光电开关及编码器；
    根据方坯相邻两侧面的二维数据完成二维到三维的映射；
    根据方坯长度信息完成方坯真实空间位姿的确定。
  4. 根据权利要求1所述的一种方坯缺陷打标系统，其特征在于，所述三维打标执行单元包括：
    可于三维空间动作的打标机器手；
    与所述打标机器手柔性连接的打标笔。
  5. 根据权利要求4所述的一种方坯缺陷打标系统，其特征在于，所述方坯缺陷打标系统还包括推进件和电机驱动的移动件，所述打标机器手设有转接座，
    所述打标笔为粉笔，所述粉笔通过所述推进件与所述移动件连接；
    所述粉笔外周依次设有缓冲套筒及套筒，所述缓冲套筒与所述套筒之间设有缓冲弹簧，所述套筒与所述转接座连接。
  6. 根据权利要求5所述的一种方坯缺陷打标系统，其特征在于，所述方坯缺陷打标系统内还设有对刀单元，所述对刀单元用于对粉笔的磨损情况建立监控。
  7. 一种方坯缺陷打标方法，其特征在于，包括：根据方坯三维位姿检测单元检测的数据、完成以实际三维空间位姿为基准的二维到三维的映射、据此确定方坯的三维空间位姿 基准；
    根据方坯的三维空间位姿基准建立方坯缺陷位的三维矢量化表征；
    根据所述方坯缺陷位的三维矢量化表征建立三维的空间运动轨迹、以接触式的方式完成所述方坯缺陷位的打标。
  8. 根据权利要求7所述的一种方坯缺陷打标方法，其特征在于，方坯缺陷打标系统包括所述方坯三维位姿检测单元和设于过程控制机的所述数据处理单元，其中，所述方坯三维位姿检测单元包括相机组和光电开关及编码器，所述方坯的三维空间位姿基准由所述相机组、所述光电开关及编码器配合所述数据处理单元完成；
    所述根据方坯三维位姿检测单元检测的数据、完成以实际三维空间位姿为基准的二维到三维的映射、据此确定方坯的三维空间位姿基准，包括：
    所述相机组获取所述方坯相邻两侧面的二维数据；
    所述光电开关及编码器配合以获取所述方坯长度信息；
    数据处理单元根据方坯长度信息完成实际三维空间位姿的确定、并以所述实际三维空间位姿为基准根据所述方坯相邻两侧面的二维数据完成二维到三维的映射，据此确定方坯的三维空间位姿基准。
  9. 根据权利要求7所述的一种方坯缺陷打标方法，其特征在于，
    所述方坯的缺陷位数据以二维数据或三维数据的形式事先存储于过程控制机中的所述数据处理单元。
  10. 根据权利要求7所述的一种方坯缺陷打标方法，其特征在于，所述方坯缺陷打标系统包括三维打标执行单元，所述三维打标执行单元包括打标机器手和打标笔；
    所述根据所述方坯缺陷位的三维矢量化表征建立三维的空间运动轨迹、以接触式的方式完成所述方坯缺陷位的打标，包括：
    所述打标机器手根据所述方坯缺陷位的三维矢量化表征建立所述三维的空间运动轨迹；
    所述的接触式经由打标机器手带动的打标笔实现。
  11. 根据权利要求10所述的一种方坯缺陷打标方法，其特征在于，所述方坯缺陷打标系统还包括推进件和电机驱动的移动件，所述打标机器手设有转接座；
    所述打标笔为粉笔，所述粉笔通过推进件与电机驱动的移动件连接；
    所述粉笔外周依次设有缓冲套筒及套筒，所述缓冲套筒与所述套筒之间设有缓冲弹簧，所述套筒与所述转接座连接。
  12. 根据权利要求11所述的一种方坯缺陷打标方法，其特征在于，所述方坯缺陷打标 系统设有对刀单元，所述对刀单元用于建立对粉笔的磨损情况的监控；
    当所述粉笔的磨损量达到设定的磨损阈值时，所述电机能够驱动所述移动件，以带动所述推进件和所述粉笔移动设定的距离。
  13. 根据权利要求12所述的一种方坯缺陷打标方法，其特征在于，所述对刀单元的对刀频率按照设定的频率进行，或按照对已有所述方坯的缺陷位的统计量进行。
  14. 根据权利要求13所述的一种方坯缺陷打标方法，其特征在于，当所述对刀频率按照对已有所述方坯的缺陷位的统计量进行时，自第一个所述缺陷位开始，对缺陷长度进行累积统计，当所述缺陷长度的累积量达到设定阈值时，触发对刀报警提示，所述打标笔经由所述对刀单元完成磨损计算。
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