WO2023125731A1 - 激光雷达和车辆 - Google Patents

激光雷达和车辆 Download PDF

Info

Publication number
WO2023125731A1
WO2023125731A1 PCT/CN2022/143047 CN2022143047W WO2023125731A1 WO 2023125731 A1 WO2023125731 A1 WO 2023125731A1 CN 2022143047 W CN2022143047 W CN 2022143047W WO 2023125731 A1 WO2023125731 A1 WO 2023125731A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
bracket
laser
circuit board
laser radar
Prior art date
Application number
PCT/CN2022/143047
Other languages
English (en)
French (fr)
Inventor
陈施能
赵波
丁明琦
宦强
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023125731A1 publication Critical patent/WO2023125731A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/08—Systems determining position data of a target for measuring distance only
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88—Lidar systems specially adapted for specific applications
    • G01S17/93—Lidar systems specially adapted for specific applications for anti-collision purposes
    • G01S17/931—Lidar systems specially adapted for specific applications for anti-collision purposes of land vehicles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A90/00—Technologies having an indirect contribution to adaptation to climate change
    • Y02A90/10—Information and communication technologies [ICT] supporting adaptation to climate change, e.g. for weather forecasting or climate simulation

Definitions

  • the present application relates to the technical field of radar, in particular to a laser radar and a vehicle.
  • Lidar Light Detection and Ranging, Lidar
  • Lidar is a radar system that emits laser beams to detect characteristic quantities such as the position and speed of the target.
  • the signal reflected by the target (target echo) is compared with the transmitted signal, and after proper processing, the relevant information of the target can be obtained, such as the target distance, azimuth, height, speed, attitude, and even shape parameters, so as to carry out the analysis of the target. Detect, track and identify.
  • lidar can include a laser and a light detector.
  • the laser can convert electrical pulses into light pulses and emit them, and the light detectors can restore the light pulses reflected from the target into electrical pulses.
  • the laser wavelength output by the laser will be affected by the laser temperature, and the corresponding photodetector has a certain range requirement for the received laser wavelength.
  • the laser temperature If the deviation is too large, the wavelength deviation of the laser will be too large, and part of the laser energy will exceed the wavelength range that the photodetector can receive, thus affecting the performance of the laser radar.
  • the embodiment of the present application provides a laser radar and a vehicle, which can solve the temperature control problem of the laser.
  • An embodiment of the present application provides a laser radar on the one hand, including: a bracket and a launch assembly; the launch assembly includes a substrate, a circuit board, an optical lens, a laser, and a temperature control device, the substrate is connected to the bracket, and the optical lens and the circuit board are respectively connected to the On the side of the substrate facing away from the support, the laser is connected to the side of the circuit board facing away from the substrate, and the temperature control device is connected to the side of the circuit board facing the substrate.
  • the hole is connected, and a heat-conducting gel is arranged between the temperature control device and the bracket.
  • the most precision-sensitive laser and the optical lens are finally fixed on the same
  • One module that is, on the substrate, can avoid the thermal expansion and contraction effect caused by temperature changes, which affects the dimensional accuracy between the laser and the optical lens; and realizes active temperature control by setting a temperature control device, which can solve the problem of laser temperature control , to prevent the temperature from affecting the wavelength of the laser light emitted by the laser.
  • the substrate includes a main body and a bracket, the bracket is connected to the side wall of the main body, the plane where the bracket is located is perpendicular to the plane where the main body is located, and the bracket is located on the side of the main body facing the circuit.
  • the circuit board is connected to the main body, the optical lens is connected to the bracket, the laser is located at the end of the circuit board close to the optical lens, and the laser and the optical lens are oppositely arranged.
  • the substrate has a two-part structure, which is used to carry the laser and the optical lens respectively. On the basis of integrating the laser and the optical lens on the same substrate, the optical lens and the laser can be aligned and arranged, and the space utilization is reasonable.
  • the temperature control device is a semiconductor refrigerator, and the semiconductor refrigerator is used for heating or cooling the circuit board.
  • the semiconductor refrigerator can heat up the laser when the external ambient temperature is low, and cool down the laser when the external ambient temperature is high, so that the temperature of the laser is in a constant range and prevents the temperature from affecting the laser wavelength emitted by the laser.
  • the coefficient of thermal expansion of the substrate is less than 10PPM. Setting the substrate with a low coefficient of thermal expansion can avoid large deviations in dimensional accuracy of lasers and optical lenses due to thermal expansion and contraction at high and low temperatures.
  • the coefficient of thermal expansion of the substrate is 4-10PPM. Setting the coefficient of thermal expansion of the substrate at 4-10PPM is easier to implement and makes the glue between the substrate and the bracket less likely to crack.
  • the absolute value of the difference between the coefficient of thermal expansion of the substrate and the coefficient of thermal expansion of the circuit board is less than or equal to 2PPM.
  • the material of the substrate includes Kovar, ceramic or glass. Setting Kovar, ceramic or glass as the substrate can meet the requirement of low thermal expansion coefficient of the substrate.
  • the material of the circuit board includes aluminum nitride ceramics. Setting aluminum nitride ceramics as the circuit board can meet the requirements of high thermal conductivity and low thermal expansion coefficient of the circuit board.
  • the material of the bracket includes aluminum alloy. Setting the aluminum alloy as the bracket can meet the structural strength requirements and high thermal conductivity requirements of the bracket.
  • the two ends of the circuit board are respectively fixed on the substrate through a riser, and the riser is a part of the structure protruding from the surface of the substrate, or the riser is a structure independent of the substrate and fixed on the on the substrate.
  • the raised block can reduce the contact area between the substrate and the circuit board, increase the space between the substrate and the circuit board, and reduce the thermal reflow effect.
  • both the length and the width of the stand-up block are less than 3mm. Setting up the risers has a small area, which can minimize the effect of thermal reflow.
  • the lidar further includes a buffer sheet, the buffer sheet is located between the bracket and the substrate, the buffer sheet and the bracket are bonded by adhesive, the buffer sheet and the substrate are welded, or the buffer sheet and the substrate are bonded by adhesive catch.
  • the buffer sheet can increase the reliability of bonding between the substrate and the support, and on the other hand, it can overcome the stress caused by the thermal expansion coefficient mismatch between the substrate and the support.
  • the thermal expansion coefficient of the buffer sheet is greater than the thermal expansion coefficient of the substrate, and the thermal expansion coefficient of the buffer sheet is smaller than the thermal expansion coefficient of the bracket.
  • the side of the substrate facing the bracket is provided with a mounting column
  • the side of the bracket facing the substrate is provided with a mounting hole
  • the mounting column is located in the mounting hole
  • the gap between the mounting column and the mounting hole Filled with viscose.
  • the lidar includes an optical machine
  • the optical machine includes a bracket, a transmitting component and a receiving component, and the receiving component and the transmitting component are respectively fixed on the bracket.
  • the bracket is used to install the transmitting component and the receiving component, so that the optical precision machinery in the laser radar can be integrated together to improve the integrity of the structure.
  • the lidar further includes a housing and a scanner, the optical machine and the scanner are installed on the housing, and the optical axis of the optical machine is aligned with the rotating mirror of the scanner.
  • the laser beam emitted by the optical machine is reflected by the rotating mirror, and the optical machine and the rotating mirror are aligned to ensure that the laser beam emitted by the optical machine is reflected by the rotating mirror to ensure the field of view range of the lidar.
  • the housing is provided with pins
  • the bracket is provided with waist-shaped holes
  • the length direction of the waist-shaped holes is perpendicular to the light output axis
  • the pins are installed in the waist-shaped holes and the The position is adjustable.
  • the position of the optical machine and the housing can be adjusted during assembly, which is conducive to improving the position accuracy between the optical machine and the rotating mirror, so that the lidar can achieve a larger FOV.
  • the optical lens is bonded on the substrate by glue
  • the circuit board is bonded on the substrate by glue.
  • the optical lens and the circuit board are respectively bonded on the substrate by glue, which can ensure the reliability of fixing.
  • At least one groove is opened on the side wall of the substrate. Setting the groove can reduce the heat conduction area of the substrate and reduce the heat reflow effect.
  • Another aspect of the embodiment of the present application provides a vehicle, including a vehicle body and the above-mentioned laser radar, and the laser radar is fixed on the vehicle body.
  • the embodiment of the present application provides a vehicle, which uses the laser radar provided by the above-mentioned embodiment of the present application, which can reduce the influence of temperature on the performance of the laser radar, has a large field of view performance, and is conducive to improving the performance of the vehicle such as distance measurement. Intelligence of vehicles.
  • the embodiment of the present application provides a laser radar and a vehicle.
  • the working temperature of the laser can be precisely controlled not to exceed the standard, so as to prevent the temperature from affecting the laser wavelength.
  • the deviation of the dimensional accuracy between the laser and the optical lens at high and low temperatures can be avoided, so that the optical performance of the lidar can be improved.
  • the bonding strength of the launch assembly and the bracket can be improved, the glue can be prevented from cracking under high and low temperature and vibration impact, and the reliability of bonding can be improved.
  • the position of the optical machine relative to the housing can be adjusted and fixed in one direction, thereby realizing the relative positional accuracy alignment of the optical machine and the scanner, and achieving a relatively high accuracy. Large field of view performance.
  • the laser radar provided in the embodiment of the present application can realize constant control of the temperature of the laser at 75 ⁇ 5°C at an ambient temperature of -40°C to 85°C by setting a temperature control device; by integrating the laser and the optical lens in the same On the substrate, and set the substrate to be made of a material with a low thermal expansion coefficient, the dimensional deviation between the laser and the optical lens can be controlled at less than 5 microns at an ambient temperature of -40°C to 85°C; and, at high and low temperatures and vibration During the test, the bonding reliability of the emission component and the bracket met the design requirements; the position of the optical machine is adjustable, and a large field of view of 140 degrees can be achieved.
  • Fig. 1 is a schematic structural diagram of a vehicle provided by an embodiment of the present application.
  • Fig. 2 is a schematic diagram of the detection range of the lidar on the vehicle provided by an embodiment of the present application
  • FIG. 3 is a schematic diagram of the external structure of a lidar provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of the internal structure of a lidar provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of an optical machine provided by an embodiment of the present application.
  • Fig. 6 is an exploded schematic diagram of an optical machine provided by an embodiment of the present application.
  • Fig. 7 is a simplified structural schematic diagram of a launch assembly and a bracket provided by an embodiment of the present application.
  • FIG. 8 is a schematic diagram of the heat dissipation path of the emitting component provided by an embodiment of the present application.
  • Fig. 9 is a schematic structural diagram of a bracket provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of a transmitting component provided by an embodiment of the present application.
  • Fig. 11 is a structural schematic diagram of another angle of the emitting assembly provided by an embodiment of the present application.
  • FIG. 12 is a schematic top view of a laser radar provided by an embodiment of the present application.
  • Fig. 13 is a schematic diagram of the working principle of the laser radar provided by an embodiment of the present application.
  • FIG. 14 is a simplified structural schematic diagram of a lidar provided by an embodiment of the present application.
  • Fig. 15 is a top view of a housing provided by an embodiment of the present application.
  • Fig. 16 is a structural schematic diagram of another viewing angle of the stent provided by an embodiment of the present application.
  • Fig. 17 is a bottom view of a bracket provided by an embodiment of the present application.
  • 21-bracket 211-first accommodation chamber; 212-second accommodation chamber; 213-third accommodation chamber; 214-installation boss; 215-installation hole; 216-waist hole;
  • 22-launching assembly 221-substrate; 221a-main body; 221b-bracket; 2211-opening; 2212-rising block; 2213-groove; 224-laser; 225-temperature control device; 226-thermal gel; 227-buffer sheet; 2281-first glue; 2282-second glue; 2283-third glue;
  • Lidar is a radar system that emits laser beams to detect the position, speed and other characteristic quantities of the target. It has the advantages of high resolution, good concealment, strong anti-interference ability, and small size. It is used in resource exploration, transportation and communication, and environmental monitoring. and other fields are widely used.
  • lidar can be installed on the vehicle as an important part of the intelligent driving environment perception system.
  • Vehicle-mounted lidar has the advantages of accurate acquisition of three-dimensional information of the target, high resolution, strong anti-interference ability, wide detection range, and nearly all-weather work.
  • Fig. 1 is a schematic structural diagram of a vehicle provided by an embodiment of the present application.
  • an embodiment of the present application provides a vehicle on the one hand.
  • the vehicle includes a vehicle body and a laser radar 100 installed on the vehicle body.
  • the number of laser radars 100 can be one or more.
  • the installation position on the vehicle can refer to the figure shown, for example, it can be installed in the front, left front, right front, and rear of the car body to detect a larger coverage area and improve the safety of the vehicle driving environment.
  • FIG. 2 is a schematic diagram of a detection range of a laser radar on a vehicle provided by an embodiment of the present application.
  • the laser radar 100 is installed at the front, left front, and right front of the car body.
  • the detection field of view of the laser radar 100 is FOV.
  • the coverage area, or FOV, is a key performance parameter of LiDAR 100 .
  • the optical machine is the key core component of the vehicle lidar. It needs to output stable high-quality laser and accurately receive the reflected laser during the entire life cycle of the vehicle.
  • the optical machine can include a transmitting component and a receiving component.
  • the transmitting component is used to output the laser wavelength
  • the receiving component is used to receive the laser reflected from the target.
  • the core component of the transmitting component is a laser.
  • the current structural design of lidar has many difficulties.
  • the laser wavelength output by the laser will be affected by the temperature of the laser, and the corresponding receiving component also has a certain range requirement for the received laser wavelength. If the temperature deviation of the laser is too large, the wavelength deviation of the laser is too large, and part of the laser energy exceeds the wavelength range that the receiver can receive, which will affect the receiving efficiency and further affect the performance index of the detection distance. Therefore, how to design the temperature control of the laser is one of the difficulties in the structural design of the laser radar.
  • the mainstream laser of lidar is edge emitting laser (Edge Emitting Laser, EEL), which has the advantages of high peak optical power and high energy efficiency, and is the preferred light source for long-distance vehicle-mounted lidar products.
  • EEL Edge Emitting Laser
  • Temperature control is also a key challenge in the current lidar optical-mechanical structure design.
  • the laser waveform directly output by the laser generally does not meet the conditions for direct use of lidar, and optical lenses are required for beam shaping.
  • the dimensional accuracy between the laser and the optical lens will affect the laser quality.
  • the previous dimensional accuracy of the two should be maintained at the micron level during the entire life cycle.
  • the processing accuracy of parts, bonding reliability, and the influence of thermal expansion and contraction caused by temperature changes will all lead to changes in dimensional accuracy between the two. Therefore, how to realize the dimensional precision control design between the laser and the optical lens is one of the current design challenges.
  • the laser and surrounding circuits can be installed on a semiconductor cooler (Thermo Electric Cooler: TEC), and fixed together with the optical lens in the lidar housing.
  • TEC Thermo Electric Cooler
  • the laser is fixed on the housing through the TEC, and the optical lens is directly fixed on the housing, so the TEC also participates in the dimensional positioning process between the laser and the lens. Under the effect of thermal expansion and contraction caused by temperature changes, the optical lens and the laser The dimensional accuracy between them is additionally affected by TEC, which is not conducive to shortening the dimensional chain of the positioning relationship between the two.
  • the laser is carried by a semiconductor cooler.
  • the TEC can be used to control the temperature of the laser, it is only suitable for situations where the laser and peripheral circuits are small in size, such as fiber lasers, optical modules, etc. It cannot be applied to the scene of a larger-sized lidar using an EEL laser.
  • the embodiment of the present application provides a laser radar.
  • a temperature control device to actively control the temperature of the laser, it can avoid the temperature from affecting the laser wavelength, and at the same time, reduce the Dimensional accuracy between the laser and the optical lens, which can improve the optical performance of the lidar.
  • FIG. 3 is a schematic diagram of an external structure of a laser radar provided by an embodiment of the present application
  • FIG. 4 is a schematic diagram of an internal structure of a laser radar provided by an embodiment of the present application.
  • the laser radar 100 provided by the embodiment of the present application may include a housing 11 , an optical machine 12 and a scanner 13 disposed inside the housing 11 .
  • the structure of the housing 11 is not specifically limited in this embodiment of the application.
  • the housing 11 may include an upper shell and a lower shell (not marked in the figure), and the upper shell and the lower shell may be bonded, screwed and so on, to form an accommodating space for accommodating the optical machine 12 and the scanner 13.
  • the optical machine 12 and the scanner 13 can be respectively fixed to the casing 11, for example, can be fixed on the bottom wall of the lower casing (the positive direction of the Y-axis in the figure is up, and the negative direction is down).
  • the optical machine 12 is used to emit and receive laser beams.
  • the scanner 13 is provided with a rotating mirror, and the laser beam emitted by the optical machine 12 can be irradiated onto the reflecting surface of the rotating mirror and then reflected.
  • the optical axis of the optical machine 12 can be aligned with the rotating mirror of the scanner 13.
  • the optical machine 12 and the scanner 13 can be arranged at intervals on the Z axis, and the optical axis of the optical machine 12 can extend along the Z direction in the figure .
  • the housing 11 is also provided with an information processing system (not marked in the figure), the information processing system is used to process the laser signal received by the optical machine 12, and the housing 11 is also provided with other components, which will not be described in detail here .
  • the optical machine 12 is used to output stable high-quality laser light and accurately receive the reflected laser light, which is a key core component of the laser radar 100 .
  • FIG. 5 is a schematic structural diagram of an optical machine provided by an embodiment of the present application
  • FIG. 6 is a schematic exploded view of the optical machine provided by an embodiment of the present application.
  • the optical machine 12 may include a bracket 21 , a transmitting component 22 and a receiving component 23 , and the receiving component 23 and the transmitting component 22 may be respectively fixed on the bracket 21 .
  • the bracket 21 may include a first accommodating cavity 211, a second accommodating cavity 212, and a third accommodating cavity 213, the first accommodating cavity 211 and the second accommodating cavity 212 are respectively used to accommodate the launch assembly 22, and the third accommodating cavity
  • the cavity 213 is used for accommodating the receiving component 23 .
  • the structures of the two emission components 22 are mirror-symmetrical, and the structures of the first accommodation chamber 211 and the second accommodation chamber 212 are mirror-symmetrical.
  • the first accommodation chamber 211 and the second accommodation chamber 212 can be respectively arranged on the On two adjacent side surfaces, for example, the opening of the first accommodating cavity 211 is oriented in the positive direction of the X-axis, and the opening of the second accommodating cavity 212 is oriented in the positive direction of the Z-axis.
  • the third accommodating chamber 213 is located above the first accommodating chamber 211 and the second accommodating chamber 212, and is arranged as an annular through-hole structure, and the receiving assembly 23 is passed through the annular through-hole, for the third accommodating chamber 213 and the second accommodating chamber 213
  • the specific structure of the receiving component 23 is not specifically described in this application.
  • the optical machine 12 can also include a mirror group 24, the mirror group 24 can be connected on the bracket 21, and is located between the first accommodation cavity 211 and the second accommodation cavity 212, and the laser beams emitted by the two emission components 22 can enter the mirror In the group 24, they are converged at the mirror group 24 and then emitted outwards.
  • FIG. 7 is a schematic diagram of a simplified structure of a launch assembly and a bracket provided by an embodiment of the present application. It should be understood that FIG. 7 shows a part of the structure of the bracket 21 , that is, a cross-sectional view corresponding to a launch assembly 22 .
  • the emission component 22 may include a substrate 221 , a circuit board 222 , an optical lens 223 , a laser 224 and a temperature control device 225 .
  • the substrate 221 can be connected on the bracket 21, the optical lens 223 and the circuit board 222 can be respectively connected on the side of the substrate 221 facing away from the bracket 21, and the laser 224 can be connected on the side of the circuit board 222 facing away from the substrate 221,
  • the temperature control device 225 can be connected to the side of the circuit board 222 facing the substrate 221, the substrate 221 is provided with an opening 2211, the temperature control device 225 and the support 21 are connected at the opening 2211, and the temperature control device 225 and the support 21 Thermally conductive gel 226 is provided.
  • the laser 224 can be welded on the top of the circuit board 222, the circuit board 222 can be bonded to the substrate 221 through the first glue 2281, and the optical lens 223 can be bonded to the substrate through the second glue 2282 221 , the substrate 221 can be bonded to the bracket 21 by a third glue 2283 .
  • the laser 224 can be arranged at one end of the circuit board 222 close to the optical lens 223, so that the distance between the laser 224 and the optical lens 223 is close and opposite to each other.
  • the laser radar 100 may further include a buffer sheet 227, which is located between the bracket 21 and the substrate 221, and the buffer sheet 227 may be welded to the substrate 221, or the buffer sheet 227 may be bonded to the substrate by adhesive. 221 for bonding, and the buffer sheet 227 can be bonded with the bracket 21 through the third glue 2283 .
  • the optical lens 223 may be in the form of a double-convex thick aspheric lens for collimating the divergent light emitted by the laser 224 .
  • the laser 224 may be an edge emitting laser (Edge Emitting Laser, EEL), for example, a four-channel or eight-channel laser.
  • EEL Edge Emitting Laser
  • the temperature control device 225 is connected to the support 21, and the temperature control device 225 is a device for temperature control, which can be used for heating or cooling, so as to heat up the laser 224 when the external environment temperature is low, and to heat up the laser 224 when the external environment temperature is high.
  • the temperature of the laser 224 is lowered so that the temperature of the laser 224 is within a constant range, preventing the temperature from affecting the laser wavelength emitted by the laser 224 .
  • the specific type of the temperature control device 225 is not specifically limited in the embodiment of the present application.
  • the temperature control device 225 can be a semiconductor cooler TEC, and it can be controlled to cool the circuit board 222 and the laser 224 by exchanging the positive and negative poles of the semiconductor cooler. Or heating.
  • the position where the temperature control device 225 is connected on the substrate 221 may be as close as possible to the position of the laser 224 to improve heat transfer efficiency.
  • An opening 2211 is provided on the substrate 221 , so that the temperature control device 225 can be connected to the support 21 at the opening 2211 , so as to transfer heat to the support 21 smoothly.
  • the temperature control device 225 is connected to the bracket 21 to transfer heat to the bracket 21 , and the temperature control device 225 can transfer heat to the bracket 21 through the thermal conductive gel 226 to improve heat dissipation efficiency.
  • the thickness of the thermally conductive gel 226 may be less than 1.5 mm, and the thermal conductivity of the thermally conductive gel 226 may be 5 ⁇ 15 W/m ⁇ K.
  • the bracket 21 is used to fix the mounting substrate 221 and realize the heat dissipation of the laser 224 .
  • the bracket 21 can be made of aluminum alloy and other metals, made by die-casting or aluminum profile machining.
  • the thermal expansion coefficient of the material for the bracket 21 can be 21-24PPM, for example, about 23PPM.
  • the thermal conductivity of the bracket 21 can be 140-200W/ m ⁇ K.
  • Substrate 221 is used to carry optical lens 223 and laser 224, can adopt low thermal expansion coefficient (Coefficient of thermal expansion, CTE) and the material of low thermal conductivity to make, the thermal expansion coefficient of substrate 221 is less than the thermal expansion coefficient of support 21, the thermal expansion coefficient of substrate 221 The coefficient can be less than or equal to 10PPM.
  • CTE coefficient of thermal expansion
  • the thermal expansion coefficient of the buffer sheet 227 may be greater than the thermal expansion coefficient of the substrate 221 and smaller than the thermal expansion coefficient of the bracket 21 .
  • the coefficient of thermal expansion of the buffer sheet 227 may be 5-23PPM.
  • the buffer sheet 227 can increase the bonding reliability between the substrate 221 and the bracket 21 , and setting the thermal expansion coefficient of the buffer sheet 227 between the substrate 221 and the bracket 21 can overcome the stress caused by the mismatch of thermal expansion coefficients.
  • the material of the buffer sheet 227 is not specifically limited in the embodiment of the present application.
  • the buffer sheet 227 may be made of stainless steel, aluminum or other materials, and the thickness of the buffer sheet 227 may be 0.2-2.0 mm.
  • the thermal expansion coefficient of the substrate 221 may be 4-10PPM, which is easier to realize on the one hand, and makes the third adhesive 2283 not easy to crack on the other hand.
  • the thermal conductivity of the substrate 221 is less than 50 W/m ⁇ K.
  • the substrate 221 include but are not limited to: Kovar, ceramics (such as alumina or zirconia, etc.), glass, and the like.
  • the substrate 221 may be a Kovar alloy with a thermal expansion coefficient of about 5.5PPM, for example, a 4J29 Kovar alloy with a thermal expansion coefficient of 5.5PPM.
  • the absolute value of the difference between the thermal expansion coefficient of the substrate 221 and the thermal expansion coefficient of the circuit board 222 is less than or equal to 2PPM.
  • the circuit board 222 can be made of plate with high thermal conductivity, such as aluminum nitride ceramics, etc. Exemplarily, the thermal expansion coefficient of the circuit board 222 can be between 4-6PPM.
  • the substrate 221 is set to have a lower coefficient of thermal expansion, the substrate 221 is not easily affected by thermal expansion and contraction, and the dimensional accuracy is more stable, which can avoid the large dimensional accuracy of the laser 224 and the optical lens 223 due to thermal expansion and contraction at high and low temperatures. offset. Even if the substrate 221 is affected by thermal expansion and contraction, by setting the thermal expansion coefficients of the substrate 221 and the circuit board 222 close, the influence of temperature on the substrate 221 and the circuit board 222 is also similar, so that the dimensional accuracy is less affected, and the substrate 221 and the circuit board 222 are similar. The performance of the second adhesive 2282 between the circuit boards 222 can also be guaranteed, and the second adhesive 2282 is not easy to crack due to the large difference in deformation between the substrate 221 and the circuit board 222 .
  • the thermal expansion coefficient of the circuit board 222 can be 4-5PPM, which is smaller than the thermal expansion coefficient of the substrate 221, and the thermal expansion coefficient of the substrate 221 can be 5.5PPM, which is smaller than the thermal expansion coefficient of the bracket 21, and the thermal expansion coefficient of the bracket 21 Can be 23PPM.
  • the side of the bracket 21 facing the substrate 221 can be provided with an installation boss 214, and the installation boss 214 can correspond to the position of the temperature control device 225, so as to reduce the distance between the temperature control device 225 and the support 21, so that the temperature control device 225 can It is connected to the mounting boss 214 through a thermally conductive gel 226 .
  • the installation boss 214 may be a part of the structure of the bracket 21 , or the installation boss 214 may be a structure independent of the bracket 21 and fixed on the bracket 21 .
  • FIG. 8 is a schematic diagram of a heat dissipation path of a radiation component provided by an embodiment of the present application.
  • the heat generated by the laser 224 and the circuit board 222, the main heat dissipation path (as shown by the big arrow in the figure) is transferred to the bracket 21 through the temperature control device 225 and the thermally conductive gel 226, and a small part of the heat is refluxed ( As shown by the small arrow in the figure), return to the circuit board 222 through the bracket 21 and the substrate 221 .
  • a spacer 2212 may be provided on the surface of the substrate 221 facing away from the support 21 , and the circuit board 222 is fixed on the spacer 2212 .
  • the heightening block 2212 is used to play the role of raising the height.
  • the heightening block 2212 can be in the form of a boss, a raised line, a bump, etc., which can reduce the contact area between the substrate 221 and the circuit board 222, and increase the contact area between the substrate 221 and the circuit board.
  • the space between the plates 222 reduces thermal backflow effects.
  • the raised block 2212 can be a part of the structure protruding from the substrate 221, which is integrally formed with the substrate 221, or the raised block 2212 can be a heat insulating block with a low thermal conductivity, which is fixed to the substrate 221 by bonding or the like, so as to The heat transferred from the substrate 221 to the circuit board 222 is reduced.
  • the shape of the raised block 2212 can be rectangular, circular, long and other types, and the length and width of the raised block 221 can be less than 3mm, so as to reduce the area of the raised block 221 and minimize the heat reflow effect.
  • the assembly process between the emitting assembly 22 and the bracket 21 can be as follows: firstly, the laser 224 and the temperature control device 225 are respectively fixed on the circuit board 222, and then the circuit board 222 and the optical lens 223 are respectively fixed on the substrate 221 by glue, and the The buffer sheet 227 is welded on the base plate 221 to form the launch assembly 22 , and then the launch assembly 22 is bonded to the support 21 by glue, and a thermally conductive gel 226 is applied between the temperature control device 225 and the support 21 .
  • the effect of thermal expansion and contraction caused by temperature changes can be avoided, affecting the laser 224 and optical lens 223.
  • Fig. 9 is a schematic structural view of a bracket provided by an embodiment of the present application
  • Fig. 10 is a schematic structural view of a transmitting assembly provided by an embodiment of the present application
  • Fig. 11 is a schematic structural view of another angle of the emitting assembly provided by an embodiment of the present application .
  • 9-11 in the embodiment of the present application, the side of the substrate 221 facing the bracket 21 is provided with a mounting column 2214, and the side of the bracket 21 facing the substrate 221 is provided with a mounting hole 215, and the mounting column 2214 is located on the In the hole 215 , the gap between the mounting post 2214 and the mounting hole 215 is filled with glue.
  • connection between the mounting column 2214 and the mounting hole 215 can be regarded as a mortise and tenon structure, and glue is filled between the mounting column 2214 and the mounting hole 215 to increase the bonding strength between the launch assembly 22 and the bracket 21, so that the The reliability of the viscose can still be satisfied under the conditions of environment and shock vibration.
  • the number of mounting columns 2214 can be two, for example, and the two mounting columns 2214 can be respectively arranged on the outer sides of the adjacent two sides of the opening 2211.
  • the mounting holes 215 and the mounting columns 2214 are correspondingly provided.
  • the substrate 221 may include a main body 221a and a bracket 221b, the bracket 221b is connected to the side wall of the main body 221a, and the plane where the bracket 221b is located is perpendicular to the plane where the main body 221a is located. And the bracket 221b is located at the side of the main body 221a facing the circuit board 222, the circuit board 222 is connected on the main body 221a, the optical lens 223 is connected on the bracket 221b, and the laser 224 is located at one end of the circuit board 222 near the optical lens 223 , the laser 224 and the optical lens 223 are arranged oppositely.
  • the substrate 221 has a two-part structure, that is, the main body 221a and the bracket 221b, which are respectively used to carry the laser 224 and the optical lens 223.
  • the substrate is reasonably planned. 221, so that the optical lens 223 and the laser 224 can be aligned. 5 and 6, it can be seen that the optical lenses 223 in the two emitting assemblies 22 are arranged close to the mirror group 24, so that the laser beams emitted by the two lasers 224 can pass through the optical lens 223 respectively, converge to the mirror group 24, and then issue.
  • At least one groove 2213 may also be provided on the substrate 221 to reduce the heat conduction area of the substrate 221 and reduce the heat backflow effect.
  • Grooves 2213 may be provided on the sidewall of the main body portion 221a, and the number and shape of the grooves 2213 are not specifically limited in this embodiment of the present application. Exemplarily, there are two grooves 2213 in the figure.
  • FIG. 12 is a schematic top view of a lidar provided by an embodiment of the present application.
  • the optical machine 12 and the scanner 13 can be respectively fixed on the housing 11 , and the laser beam emitted by the optical machine 12 can be irradiated onto the reflective surface of the rotating mirror in the scanner 13 and then reflected.
  • Fig. 13 is a schematic diagram of the working principle of the lidar provided by an embodiment of the present application.
  • the laser beam emitted by the optical machine 12 is reflected by the rotating mirror 131 and then reflected toward the side away from the optical machine 12 (as shown by the solid arrow in the figure),
  • This scene is a scene with an angle of view of +70°;
  • the laser beam emitted by the optical machine 12 is reflected by the rotating mirror 131 and then reflected toward the side close to the optical machine 12 (as shown by the dotted arrow in the figure) shown), the scene is a scene with a field of view of -70°.
  • the laser beam emitted by the optical machine 12 may not be reflected by the rotating mirror 131 at a larger viewing angle, that is, there will be light leakage, which will affect the viewing angle of the lidar. field angle range.
  • the dimensional accuracy between the optical machine 12 and the scanner 13 is required to be high, especially in a large FOV scene, the size of the rotating mirror 131 is limited by the overall size of the product and often cannot be enlarged, and the projection of the rotating mirror 131 on the optical path The size becomes smaller, which is basically equal to the size of the spot, and there is no size margin on both sides. Therefore, it is required that the light spot of the optical machine 12 and the rotating mirror 131 are completely aligned. The higher the degree of alignment, the larger the FOV of the lidar.
  • FIG. 14 is a simplified structural schematic diagram of a lidar provided by an embodiment of the present application.
  • the cooperation between the optical machine 12 and the housing 11 is realized by setting the pin 111 and the waist-shaped hole 216, and the length extension direction of the waist-shaped hole 216 is perpendicular to the direction of the light output axis of the optical machine 12 , so that the position of the optical machine 12 relative to the housing 11 can be matched, that is, the optical machine 12 can fine-tune the position in the direction perpendicular to the light output axis, so that the position can be adjusted when the optical machine 12 and the housing 11 are assembled (adjustment of the optical machine 12 The direction is shown by the arrow in the figure), which is beneficial to improve the positional accuracy between the optical machine 12 and the rotating mirror 131 .
  • Fig. 15 is a top view of the housing provided by an embodiment of the present application
  • Fig. 16 is a structural schematic diagram of another viewing angle of the bracket provided by an embodiment of the present application
  • Fig. 17 is a bottom view of the bracket provided by an embodiment of the present application.
  • the housing 11 can be provided with a pin 111
  • the bracket 21 can be provided with a waist-shaped hole 216, and the length direction of the waist-shaped hole 216 is perpendicular to the optical machine 12.
  • the pin 111 can be installed in the waist-shaped hole 216 and the position of the pin 111 in the waist-shaped hole 216 can be adjusted.
  • the number of waist-shaped holes 216 is at least two, and the two waist-shaped holes 216 may be arranged at intervals on the bottom wall of the bracket 21 to limit the optical machine 12 to move only in the length direction of the waist-shaped holes 216
  • the fine adjustment of the position is carried out without rotation, which can ensure the reliability of the position adjustment.
  • the housing 11 may be provided with a waist-shaped hole 216
  • the bracket 21 may be provided with a pin 111 , which can also realize the function of adjusting the position of the optical machine 12 relative to the housing 11 .
  • the lidar provided by the above-mentioned embodiment of the present application fixes the optical lens and the laser on the same substrate, and uses a temperature control device to actively control the temperature of the laser, so that the working temperature of the laser can be precisely controlled to not exceed the standard, and the temperature does not affect the laser wavelength; At the same time, the deviation of the dimensional accuracy between the laser and the optical lens at high and low temperatures can be avoided, thereby improving the optical performance of the lidar.
  • the bonding strength of the launch assembly and the bracket can be improved, the glue can be prevented from cracking under high and low temperature and vibration impact, and the reliability of bonding can be improved.
  • the position of the optical machine relative to the housing can be adjusted and fixed in one direction, thereby realizing the relative positional accuracy alignment of the optical machine and the scanner, and achieving a relatively high accuracy. Large field of view performance.
  • the lidar provided by the above-mentioned embodiment of the present application can realize constant control of the temperature of the laser 224 at 75 ⁇ 5°C at an ambient temperature of -40°C to 85°C by setting the temperature control device 225; by setting the temperature of the laser 224 It is integrated with the optical lens 223 on the same substrate 221, and the substrate 221 is made of a material with a low thermal expansion coefficient, which can control the dimensional deviation between the laser 224 and the optical lens 223 at an ambient temperature of -40°C to 85°C
  • the bonding reliability of the emission component 22 and the bracket 21 meets the design requirements; the position of the optical machine 12 is adjustable, and a large field of view performance of 140 degrees can be realized.
  • the embodiment of the present application provides a vehicle, which uses the laser radar provided by the above-mentioned embodiment of the present application, which can reduce the influence of temperature on the performance of the laser radar, has a large field of view performance, and is conducive to improving the performance of the vehicle such as distance measurement. Intelligence of vehicles.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Optical Radar Systems And Details Thereof (AREA)

Abstract

本申请实施例提供一种激光雷达和车辆，激光雷达包括：支架和发射组件；发射组件包括基板、电路板、光学透镜、激光器和温控器件，基板连接在支架上，光学透镜和电路板分别连接在基板的背向支架的一侧，激光器连接在电路板的背向基板的一侧，温控器件连接在电路板的面向基板的一侧，基板上设置有开孔，温控器件和支架在开孔处连接，温控器件和支架之间设置有导热凝胶。本申请实施例提供一种激光雷达和车辆，可以解决激光器的温度管控问题。

Description

激光雷达和车辆
本申请要求于2021年12月31日提交中国专利局、申请号为202111679281.4、申请名称为“激光雷达和车辆”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及雷达技术领域，尤其涉及一种激光雷达和车辆。
背景技术
激光雷达(Light Detection and Ranging，Lidar)是以发射激光束探测目标的位置、速度等特征量的雷达系统，激光雷达的工作原理是向目标发射探测信号(激光束)，然后将接收到的从目标反射回来的信号(目标回波)与发射信号进行比较，作适当处理后，就可获得目标的有关信息，如目标距离、方位、高度、速度、姿态、甚至形状等参数，从而对目标进行探测、跟踪和识别。
相关技术中，激光雷达可以包括激光器和光探测器，激光器可以将电脉冲变成光脉冲发射出去，光探测器再将从目标反射回来的光脉冲还原成电脉冲。
但是，相关技术中未设置用于为激光器降温或加热的温度管控装置，激光器输出的激光波长会受到激光器温度的影响，而对应的光探测器对接收的激光波长有一定的范围要求，激光器温度偏差过大，会导致激光的波长偏差过大，部分激光能量超出光探测器能接收的波长范围，从而影响激光雷达的性能。
发明内容
本申请实施例提供一种激光雷达和车辆，可以解决激光器的温度管控问题。
本申请实施例一方面提供一种激光雷达，包括：支架和发射组件；发射组件包括基板、电路板、光学透镜、激光器和温控器件，基板连接在支架上，光学透镜和电路板分别连接在基板的背向支架的一侧，激光器连接在电路板的背向基板的一侧，温控器件连接在电路板的面向基板的一侧，基板上设置有开孔，温控器件和支架在开孔处连接，温控器件和支架之间设置有导热凝胶。本申请实施例中，通过将激光器固定在电路板上，将激光器和电路板的组件固定在基板上，同时将光学透镜固定在基板上，使得精度最敏感的激光器和光学透镜最终都固定在同一个模块，即基板上，可以避免温度变化导致的热胀冷缩效应，影响到激光器和光学透镜之间的尺寸精度；并通过设置温控器件来实现主动控温，可以解决激光器控温的问题，避免温度影响到激光器发射的激光的波长。
在一种可能的实施方式中，基板包括主体部和托架，托架连接在主体部的侧壁上，托架所在的平面垂直于主体部所在的平面，且托架位于主体部的面向电路板的一侧，电路板连接在主体部上，光学透镜连接在托架上，激光器位于电路板的靠近光学透镜的一端，激 光器和光学透镜相对设置。基板具有两部分结构，分别用来承载激光器和光学透镜，在将激光器和光学透镜集成在同一个基板的基础上，使得光学透镜和激光器可以对齐设置，空间利用合理。
在一种可能的实施方式中，温控器件为半导体制冷器，半导体制冷器用于为电路板加热或制冷。半导体制冷器可以在外部环境温度较低时为激光器升温，在外部环境温度较高时为激光器降温，使激光器的温度处于一个恒定范围内，防止温度影响到激光器发射的激光波长。
在一种可能的实施方式中，基板的热膨胀系数小于10PPM。设置基板具有较低的热膨胀系数，可以避免激光器与光学透镜在高低温下因为热胀冷缩效应导致尺寸精度发生大的偏移。
在一种可能的实施方式中，基板的热膨胀系数为4-10PPM。设置基板的热膨胀系数处于4-10PPM，更容易实现，且使得基板和支架之间的粘胶不容易开裂。
在一种可能的实施方式中，基板的热膨胀系数与电路板的热膨胀系数的差值的绝对值小于等于2PPM。在温度变化较大时，即便受到热胀冷缩的影响，由于基板和电路板的热膨胀系数接近，因此对基板和电路板的影响差异较小，且基板和电路板之间的粘胶的性能也能得到保障。
在一种可能的实施方式中，基板的材料包括可伐合金、陶瓷或玻璃。设置可伐合金、陶瓷或玻璃作为基板，可以满足基板的低热膨胀系数要求。
在一种可能的实施方式中，电路板的材料包括氮化铝陶瓷。设置氮化铝陶瓷作为电路板，可以满足电路板的高导热性能要求和低热膨胀系数要求。
在一种可能的实施方式中，支架的材料包括铝合金。设置铝合金作为支架，可以满足支架的结构强度要求和高导热性能要求。
在一种可能的实施方式中，电路板的两端分别通过垫高块固定在基板上，垫高块为基板表面凸出的一部分结构，或者，垫高块为独立于基板的结构并固定在基板上。垫高块可以减少基板和电路板之间的接触面积，增大基板和电路板之间的空间，降低热回流效应。
在一种可能的实施方式中，垫高块的长度和宽度均小于3mm。设置垫高块具有较小的面积，可以尽量降低热回流效应。
在一种可能的实施方式中，激光雷达还包括缓冲片，缓冲片位于支架和基板之间，缓冲片和支架通过粘胶粘接，缓冲片和基板焊接，或者缓冲片和基板通过粘胶粘接。缓冲片一方面可以增加基板和支架之间粘接的可靠性，另一方面可以克服基板和支架之间热膨胀系数失配的应力。
在一种可能的实施方式中，缓冲片的热膨胀系数大于基板的热膨胀系数，缓冲片的热膨胀系数小于支架的热膨胀系数。
在一种可能的实施方式中，基板的面向支架的一侧设置有安装柱，支架的面向基板的一侧设置有安装孔，安装柱位于安装孔内，安装柱和安装孔之间的间隙内填充有粘胶。安装柱和安装孔的胶接，可以增加基板和支架之间的胶接强度，使得在高低温情况及冲击振动情况下，粘胶的可靠性还能满足。
在一种可能的实施方式中，激光雷达包括光机，光机包括支架、发射组件和接收组件，接收组件、发射组件分别固定在支架上。支架用来安装发射组件和接收组件，使激光雷达 中的光学精密机械集成在一起，提高结构的一体性。
在一种可能的实施方式中，激光雷达还包括壳体和扫描器，光机和扫描器均安装在壳体上，且光机的出光轴和扫描器的转镜对齐设置。光机发射的激光束经转镜反射出去，光机和转镜对齐设置，可以保证光机发出的激光束均被转镜反射，以保证激光雷达的视场角范围。
在一种可能的实施方式中，壳体上设置有销钉，支架上设置有腰型孔，腰型孔的长度方向垂直于出光轴，销钉安装在腰型孔内且销钉在腰型孔内的位置可调节。光机和壳体装配时可以调节位置，有利于提高光机和转镜之间的位置精度，使激光雷达可以实现更大的FOV。
在一种可能的实施方式中，光学透镜通过粘胶粘接在基板上，电路板通过粘胶粘接在基板上。光学透镜和电路板分别通过粘胶粘接在基板上，可以保证固定的可靠性。
在一种可能的实施方式中，基板的侧壁上开设有至少一个凹槽。设置凹槽可以降低基板的导热面积，降低热回流效应。
本申请实施例另一方面提供一种车辆，包括车体和上述的激光雷达，激光雷达固定在车体上。
本申请实施例提供一种车辆，应用了上述本申请实施例提供的激光雷达，可以降低温度对激光雷达的性能影响，具有大视场角性能，有利于提高车辆的测距等性能，有利于车辆的智能化。
本申请实施例提供一种激光雷达和车辆，通过将激光器固定在电路板上，将激光器和电路板的组件以及光学透镜固定在同一个基板上，并利用控温器件来主动控制激光器的温度，可以精确控制激光器工作温度不超标，避免温度影响激光波长。同时，可以避免激光器和光学透镜之间的尺寸精度在高低温下的偏移，从而可以提高激光雷达的光学性能。另外，通过设置缓冲片以及安装柱和安装孔的配合结构，可以提高发射组件和支架的胶接强度，防止胶水在高低温和振动冲击下开裂，可以提高粘接的可靠性。通过在支架上设计腰形孔匹配壳体上的销钉设计，使光机相对于壳体在一个方向上位置可调节可固定，从而实现了光机与扫描器的相对位置精度对准，实现较大的视场角性能。
本申请实施例提供的激光雷达，通过设置温控器件，可以实现在外界-40℃～85℃环境温度下，激光器的温度恒定控制在75±5℃；通过将激光器和光学透镜集成在同一个基板上，并设置基板为低热膨胀系数的材料制成，可以在外界-40℃～85℃的环境温度下，激光器与光学透镜之间尺寸偏差控制在小于5微米；并且，在高低温及振动测试中，发射组件和支架的粘接可靠性满足设计要求；设置光机位置可调，可以实现140度的大视场角性能。
附图说明
图1为本申请一实施例提供的车辆的结构示意图；
图2为本申请一实施例提供的车辆上的激光雷达的探测范围示意图；
图3为本申请一实施例提供的激光雷达的外部结构示意图；
图4为本申请一实施例提供的激光雷达的内部结构示意图；
图5为本申请一实施例提供的光机的结构示意图；
图6为本申请一实施例提供的光机的爆炸示意图；
图7为本申请一实施例提供的发射组件和支架的简化结构示意图；
图8为本申请一实施例提供的发射组件的散热路径示意图；
图9为本申请一实施例提供的支架的结构示意图；
图10为本申请一实施例提供的发射组件的结构示意图；
图11为本申请一实施例提供的发射组件的另一角度的结构示意图；
图12为本申请一实施例提供的激光雷达的俯视示意图；
图13为本申请一实施例提供的激光雷达的工作原理示意图；
图14为本申请一实施例提供的激光雷达的简化结构示意图；
图15为本申请一实施例提供的壳体的俯视图；
图16为本申请一实施例提供的支架的另一视角的结构示意图；
图17为本申请一实施例提供的支架的仰视图。
附图标记说明：
100-激光雷达；11-壳体；111-销钉；12-光机；13-扫描器；131-转镜；
21-支架；211-第一容置腔；212-第二容置腔；213-第三容置腔；214-安装凸台；215-安装孔；216-腰型孔；
22-发射组件；221-基板；221a-主体部；221b-托架；2211-开孔；2212-垫高块；2213-凹槽；2214-安装柱；222-电路板；223-光学透镜；224-激光器；225-温控器件；226-导热凝胶；227-缓冲片；2281-第一粘胶；2282-第二粘胶；2283-第三粘胶；
23-接收组件；24-镜组。
具体实施方式
激光雷达是以发射激光束探测目标的位置、速度等特征量的雷达系统，具有分辨率高、隐蔽性好、抗有源干扰能力强、体积小等优点，在资源勘探、交通通讯、环境监测等领域应用广泛。
其中，激光雷达可以安装在车辆上，以作为智能驾驶环境感知系统中重要的一部分。车载激光雷达具有可准确获取目标的三维信息、分辨率高、抗干扰能力强、探测范围广、近全天候工作等优点。
图1为本申请一实施例提供的车辆的结构示意图。参考图1所示，本申请实施例一方面提供一种车辆，车辆包括车体和安装在车体上的激光雷达100，激光雷达100的数量可以为一个或多个，激光雷达100在车体上的安装位置可以参考图中所示，例如可以安装在车体的正前方、左前方、右前方、正后方等位置，以探测更大的覆盖范围，提高车辆驾驶环境的安全性。
图2为本申请一实施例提供的车辆上的激光雷达的探测范围示意图。参考图2所示，以在车体的正前方、左前方、右前方三个位置设置激光雷达100为例，激光雷达100的探测视场角为FOV，FOV越大，就能探测到越大的覆盖范围，即FOV是激光雷达100的一项关键性能参数。
此外，光机是车载激光雷达的关键核心部件，需要输出在车载全生命周期内，输出稳定的高质量激光并能精准的接收到反射回来的激光。光机可以包括发射组件和接收组件，发射组件用来输出激光波长，接收组件用来接收从目标反射回来的激光，发射组件的核心 部件是激光器。
当前激光雷达的结构设计具有较多难点，一方面，激光器输出的激光波长会受到激光器温度的影响，而对应的接收组件也对接收的激光波长有一定的范围要求。如果激光器温度偏差过大，导致激光的波长偏差过大，部分激光能量超出接收器能接收的波长范围，将影响接收效率，进一步影响探测距离的性能指标。因此，如何对激光器进行控温设计，是激光雷达的结构设计难点之一。
相关技术中，激光雷达的主流激光器为边缘发光激光器(Edge Emitting Laser，EEL)具有峰值光功率高，能效高等优点，是远距离车载激光雷达产品的优选光源，如何对采用EEL激光器的光机进行控温，也是当前激光雷达光机结构设计中的关键挑战。
另一方面，激光器直接输出的激光波形一般不满足激光雷达直接使用的条件，需要采用光学透镜进行波束整形。但是，激光器与光学透镜之间的尺寸精度会影响激光质量，根据光学设计的需求，两者之前的尺寸精度要在全生命周期内保持在微米级。而零件的加工精度、粘接可靠性、使用温度变化导致的热胀冷缩的影响都会导致两者之间的尺寸精度变化。因此，如何实现对激光器和光学透镜之间尺寸精度管控设计，是当前设计的挑战之一。
在一种相关技术中，激光器及周边的电路可以安装在半导体制冷器(Thermo Electric Cooler：TEC)上，并与光学透镜共同固定在激光雷达的外壳内。该相关技术中，如果激光器及周边电路尺寸较大，不仅仅TEC尺寸也需要增大，增加功耗尺寸，而且在激光器及周边电路的重量都在TEC上，在振动场景下，对TEC的强度及相应的固定强度的要求都很高。另外，激光器通过TEC固定在外壳上，光学透镜直接固定在外壳上，因此TEC也参与了激光器和透镜之间的尺寸定位过程，在温度变化导致的热胀冷缩效应下，光学透镜和激光器之间的尺寸精度还额外受到TEC的影响，不利于缩短两者的定位关系尺寸链。
因此，该相关技术中，将激光器通过半导体制冷器来承载，虽然可以利用TEC对激光器控温，但只适用于激光器及周边电路尺寸较小的情况，例如光纤激光器、光模块等场景下，而无法适用于采用EEL激光器的较大尺寸的激光雷达的场景。
基于上述问题，本申请实施例提供一种激光雷达，通过将光学透镜和激光器固定在同一个基板上，并利用控温器件来主动控制激光器的温度，可以避免温度影响激光波长，同时，可以降低激光器和光学透镜之间的尺寸精度，从而可以提高激光雷达的光学性能。
图3为本申请一实施例提供的激光雷达的外部结构示意图，图4为本申请一实施例提供的激光雷达的内部结构示意图。参考图3和图4，本申请实施例提供的激光雷达100，可以包括壳体11和设置在壳体11内部的光机12、扫描器13。
其中，壳体11的结构在本申请实施例中不做具体限制，示例性地，壳体11可以包括上壳和下壳(图中未标记)，上壳和下壳可以通过粘接、螺接等方式固定，以形成容置光机12、扫描器13的容置空间。
光机12和扫描器13可以分别和壳体11固定，例如可以固定在下壳的底壁上(以图中Y轴正方向为上，负方向为下)。光机12用来发射激光束和接收激光束，扫描器13内设置有转镜，光机12发射的激光束可以照射至转镜的反射面上再反射出去。光机12的出光轴可以和扫描器13的转镜对齐设置，示例性地，光机12和扫描器13可以在Z轴上间隔排布，光机12的出光轴可以沿图中Z方向延伸。
另外，壳体11内部还设置有信息处理系统(图中未标记)，信息处理系统用来处理光 机12接收到的激光信号，壳体11内部还设置有其它部件，在此不做具体描述。应理解，光机12用来输出稳定的高质量激光并能精准地接收到反射回来的激光，是激光雷达100的关键核心部件。
图5为本申请一实施例提供的光机的结构示意图，图6为本申请一实施例提供的光机的爆炸示意图。参考图5和图6所示，本申请实施例中，光机12可以包括支架21、发射组件22和接收组件23，接收组件23、发射组件22可以分别固定在支架21上。
支架21可以包括第一容置腔211、第二容置腔212、第三容置腔213，第一容置腔211和第二容置腔212分别用来容置发射组件22，第三容置腔213用来容置接收组件23。两个发射组件22的结构呈镜像对称，第一容置腔211和第二容置腔212的结构呈镜像对称，第一容置腔211和第二容置腔212可以分别设置在支架21的相邻的两个侧面上，示例性地，第一容置腔211的开口朝向为X轴正方向，第二容置腔212的开口朝向为Z轴正方向。第三容置腔213位于第一容置腔211和第二容置腔212的上方，设置为环形通孔结构，接收组件23穿设在该环形通孔内，对第三容置腔213和接收组件23的具体结构，本申请不做具体描述。
光机12还可以包括镜组24，镜组24可以连接在支架21上，且位于第一容置腔211和第二容置腔212之间，两个发射组件22发射的激光束可以进入镜组24内，在镜组24处汇聚后再向外发射。
图7为本申请一实施例提供的发射组件和支架的简化结构示意图，应理解，图7示出的为支架21的一部分结构，即对应一个发射组件22的剖面图。参考图7所示，本申请实施例中，发射组件22可以包括基板221、电路板222、光学透镜223、激光器224和温控器件225。
其中，基板221可以连接在支架21上，光学透镜223和电路板222可以分别连接在基板221的背向支架21的一侧，激光器224可以连接在电路板222的背向基板221的一侧，温控器件225可以连接在电路板222的面向基板221的一侧，基板221上设置有开孔2211，温控器件225和支架21在开孔2211处连接，温控器件225和支架21之间设置有导热凝胶226。
以图中的上下方向为例，激光器224可以焊接在电路板222上方，电路板222可以通过第一粘胶2281粘接在基板221上，光学透镜223可以通过第二粘胶2282粘接在基板221上，基板221可以通过第三粘胶2283粘接在支架21上。激光器224可以设置在电路板222的靠近光学透镜223的一端，使激光器224和光学透镜223距离接近且相对设置。
在一种可能的实施方式中，激光雷达100还可以包括缓冲片227，缓冲片227位于支架21和基板221之间，缓冲片227可以和基板221焊接，或者缓冲片227可以通过粘胶和基板221粘接，缓冲片227可以和支架21通过第三粘胶2283粘接。
光学透镜223的具体形式在本申请实施例中不做具体限制，例如光学透镜223可以为双凸厚非球面透镜形式，用于将激光器224发射的发散光线准直。激光器224可以为边缘发光激光器(Edge Emitting Laser，EEL)，例如可以为四通道或者八通道的激光器。
温控器件225和支架21连接，温控器件225为用于进行温度控制的器件，可以用于加热或制冷，以在外部环境温度较低时为激光器224升温，在外部环境温度较高时为激光器224降温，使激光器224的温度处于一个恒定范围内，防止温度影响到激光器224发射的激光波长。温控器件225的具体类型在本申请实施例中不做具体限制，温控器件225可以为半导体制冷器TEC，通过调换半导体制冷器的正负极，可以控制它给电路板222和激光器224制冷或者制热。
应理解，温控器件225连接在基板221上的位置，可以尽量靠近激光器224的位置，以提高传热效率。基板221上设置开孔2211，以使温控器件225可以在开孔2211处与支架21连接，以顺利将热量传递给支架21。
温控器件225和支架21连接，以将热量传递至支架21，温控器件225可以通过导热凝胶226将热量传递给支架21，以提高散热效率。示例性地，导热凝胶226的厚度可以小于1.5mm，导热凝胶226的导热系数可以为5～15W/m·K。
支架21用来固定安装基板221，以及实现对激光器224的散热。支架21可以采用铝合金等金属，通过压铸或者铝型材机加件制作，支架21的制作材料的热膨胀系数可以处于21～24PPM，例如可以为23PPM左右，支架21的导热系数可以为140～200W/m·K。
基板221用来承载光学透镜223和激光器224，可以采用低热膨胀系数(Coefficient of thermal expansion，CTE)及低导热系数的材料制成，基板221的热膨胀系数小于支架21的热膨胀系数，基板221的热膨胀系数可以小于等于10PPM。
其中，缓冲片227的热膨胀系数可以大于基板221的热膨胀系数，并小于支架21的热膨胀系数。示例性地，缓冲片227的热膨胀系数可以为5-23PPM。缓冲片227一方面可以增加基板221和支架21之间粘接的可靠性，设置缓冲片227的热膨胀系数介于基板221和支架21之间，可以克服热膨胀系数失配的应力。缓冲片227的材料在本申请实施例中不做具体限制，缓冲片227可以采用不锈钢、铝等材料，缓冲片227的厚度可以为0.2-2.0mm。
应理解，选取热膨胀系数小于4PPM的材料作为基板221的困难较大，且若基板221的热膨胀系数过小，缓冲片227和支架21之间的第三粘胶2283容易发生开裂。示例性地，基板221的热膨胀系数可以为4-10PPM，一方面更容易实现，另一方面可以使第三粘胶2283不容易开裂。基板221的导热系数小于50W/m·K。
基板221的制作材料包括但不限于：可伐合金，陶瓷(例如氧化铝或者氧化锆等)，玻璃等。在一种可能的实施方式中，基板221可以为热膨胀系数为5.5PPM左右的可伐合金，例如可以为4J29牌号、热膨胀系数为5.5PPM的可伐合金。
另外，基板221的热膨胀系数和电路板222的热膨胀系数的差值的绝对值小于等于2PPM。电路板222可以采用高导热系数的板材，例如氮化铝陶瓷等，示例性地，电路板222的热膨胀系数可以处于4-6PPM之间。
设置基板221具有较低的热膨胀系数，基板221不容易受到热胀冷缩的影响，尺寸精度更加稳定，可以避免激光器224与光学透镜223在高低温下因为热胀冷缩效应导致尺寸精度发生大的偏移。即便基板221受到了热胀冷缩的影响，通过设置基板221和电路板222的热膨胀系数接近，温度对基板221和电路板222的影响也类似，从而使尺寸精度影响较小，并且基板221和电路板222之间的第二粘胶2282的性能也可以得到保证，第二粘胶2282不容易因为基板221和电路板222之间变形的差异大而开裂。
在一种可能的实施方式中，电路板222的热膨胀系数可以为4-5PPM，小于基板221的热膨胀系数，基板221的热膨胀系数可以为5.5PPM，小于支架21的热膨胀系数，支架21的热膨胀系数可以为23PPM。
支架21的面向基板221的一侧可以设置安装凸台214，安装凸台214可以对应温控器件225的位置，以减小温控器件225和支架21之间的距离，使温控器件225可以通过导热凝胶226与安装凸台214连接。安装凸台214可以为支架21的结构的一部分，或者， 安装凸台214可以为独立于支架21的固定在支架21上的结构。
图8为本申请一实施例提供的发射组件的散热路径示意图。参考图8所示，激光器224和电路板222产生的热量，主要散热路径(如图中大箭头所示)为经过温控器件225、导热凝胶226传递至支架21，少部分热量存在回流(如图中小箭头所示)，通过支架21、基板221回到电路板222。
另外，基板221的背向支架21的表面上可以设置垫高块2212，电路板222固定在垫高块2212上。垫高块2212用来起到垫高作用，垫高块2212例如可以为凸台、凸条、凸点等形式，可以减少基板221和电路板222之间的接触面积，增大基板221和电路板222之间的空间，降低热回流效应。
垫高块2212可以为基板221上凸出设置的一部分结构，与基板221一体成型，或者，垫高块2212可以为导热系数较低的隔热块，通过粘接等方式和基板221固定，以降低自基板221传递至电路板222的热量。垫高块2212的形状可以为矩形、圆形、长条形等类型，垫高块221的长度和宽度可以小于3mm，以减小垫高块221的面积，尽量降低热回流效应。
发射组件22和支架21之间的组装过程可以为，首先将激光器224和温控器件225分别固定在电路板222上，然后将电路板222和光学透镜223分别通过胶水固定在基板221上，将缓冲片227焊接在基板221上，构成发射组件22，再将发射组件22通过胶水粘接在支架21上，并在温控器件225和支架21之间涂覆导热凝胶226。
整体上，本申请实施例中，通过将精度最敏感的激光器224和光学透镜223固定在同一个模块，即基板221上，可以避免温度变化导致的热胀冷缩效应，影响到激光器224和光学透镜223之间的尺寸精度；并通过设置温控器件225来实现主动控温，同时匹配降低热回流的设计，可以解决激光器224控温的问题，避免温度影响到激光器224发射的激光的波长。
图9为本申请一实施例提供的支架的结构示意图，图10为本申请一实施例提供的发射组件的结构示意图，图11为本申请一实施例提供的发射组件的另一角度的结构示意图。参考图9-图11所示，本申请实施例中，基板221的面向支架21的一侧设置有安装柱2214，支架21的面向基板221的一侧设置有安装孔215，安装柱2214位于安装孔215内，安装柱2214和安装孔215之间的间隙内填充有粘胶。
安装柱2214和安装孔215的连接，可以视为榫卯结构，粘胶填充在安装柱2214和安装孔215之间，用来增加发射组件22和支架21之间胶接强度，使得在高低温情况及冲击振动情况下，粘胶的可靠性还能满足。
安装柱2214的数量例如可以为两个，两个安装柱2214可以分别设置在开孔2211的相邻的两边外侧，安装孔215和安装柱2214对应设置，两个安装孔215可以分别设置在安装凸台214的相邻的两边外侧。应理解，缓冲片227需避让安装柱2214。
继续参考图10-图11所示，基板221可以包括主体部221a和托架221b，托架221b连接在主体部221a的侧壁上，托架221b所在的平面垂直于主体部221a所在的平面，且托架221b位于主体部221a的面向电路板222的一侧，电路板222连接在主体部221a上，光学透镜223连接在托架221b上，激光器224位于电路板222的靠近光学透镜223的一端，激光器224和光学透镜223相对设置。
基板221具有两部分结构，即主体部221a和托架221b，分别用来承载激光器224和光学 透镜223，在将激光器224和光学透镜223集成在同一个基板221的基础上，合理地规划了基板221的结构，使得光学透镜223和激光器224可以对齐设置。结合图5、图6可以看出，两个发射组件22内的光学透镜223均接近镜组24设置，使得两个激光器224发出的激光束可以分别经过光学透镜223，汇聚到镜组24处再发出。
另外，基板221上还可以设置至少一个凹槽2213，以降低基板221的导热面积，降低热回流效应。凹槽2213可以设置在主体部221a的侧壁上，凹槽2213的数量和形状在本申请实施例中不做具体限制。示例性地，图中凹槽2213的数量为两个。
图12为本申请一实施例提供的激光雷达的俯视示意图。参考图12所示，光机12和扫描器13可以分别固定在壳体11上，光机12发射的激光束可以照射至扫描器13内的转镜的反射面上再反射出去。
图13为本申请一实施例提供的激光雷达的工作原理示意图。参考图13所示，在使用过程中，一种场景下，光机12发射的激光束经转镜131反射再向着远离光机12的一侧反射出去(如图中实线箭头所示)，该场景为视场角处于+70°的场景；再另一种场景下，光机12发射的激光束经转镜131反射后再向着靠近光机12的一侧反射出去(如图中虚线箭头所示)，该场景为视场角处于-70°的场景。应理解，若光机12和转镜131未对准，则在较大的视场角下，光机12发出的激光束可能无法被转镜131反射，即存在漏光现象，影响激光雷达的视场角范围。
因此光机12与扫描器13之间的尺寸精度要求较高，特别是在大FOV场景下时，转镜131的尺寸受制于产品整体尺寸往往无法加大，转镜131在光程上的投影尺寸变小，基本与光斑尺寸相等，两侧没有尺寸余量，因此要求光机12光斑和转镜131完全对准，对准的程度越高，代表着激光雷达可以实现更大的FOV。
图14为本申请一实施例提供的激光雷达的简化结构示意图。参考图14所示，本申请实施例中，通过设置销钉111和腰型孔216来实现光机12和壳体11的配合，腰型孔216的长度延伸方向垂直于光机12的出光轴方向，使得光机12相对于壳体11的位置可配合，即光机12可以在垂直于出光轴的方向上微调位置，使光机12和壳体11装配时可以调节位置(光机12的调整方向如图中箭头所示)，有利于提高光机12和转镜131之间的位置精度。
图15为本申请一实施例提供的壳体的俯视图，图16为本申请一实施例提供的支架的另一视角的结构示意图，图17为本申请一实施例提供的支架的仰视图。参考图15-图17所示，在一种可能的实施方式中，壳体11上可以设置销钉111，支架21上可以设置有腰型孔216，腰型孔216的长度方向垂直于光机12的出光轴，销钉111可以安装在腰型孔216内且销钉111在腰型孔216内的位置可调节。
示例性地，腰型孔216的数量至少为两个，两个腰型孔216可以间隔排布在支架21的底壁上，以限制光机12仅能在腰型孔216的长度方向上移动进行位置微调，而不会发生转动，可以保证位置调节的可靠性。
不难理解，在另一种可能的实施方式中，壳体11上可以设置腰型孔216，支架21上可以设置销钉111，同样可以实现光机12相对于壳体11调节位置的功能。
上述本申请实施例提供的激光雷达，通过将光学透镜和激光器固定在同一个基板上，并利用控温器件来主动控制激光器的温度，可以精确控制激光器工作温度不超标，避免温度影响激光波长；同时，可以避免激光器和光学透镜之间的尺寸精度在高低温下的偏移， 从而可以提高激光雷达的光学性能。
另外，通过设置缓冲片以及安装柱和安装孔的配合结构，可以提高发射组件和支架的胶接强度，防止胶水在高低温和振动冲击下开裂，可以提高粘接的可靠性。通过在支架上设计腰形孔匹配壳体上的销钉设计，使光机相对于壳体在一个方向上位置可调节可固定，从而实现了光机与扫描器的相对位置精度对准，实现较大的视场角性能。
整体上，上述本申请实施例提供的激光雷达，通过设置温控器件225，可以实现在外界-40℃～85℃环境温度下，激光器224的温度恒定控制在75±5℃；通过将激光器224和光学透镜223集成在同一个基板221上，并设置基板221为低热膨胀系数的材料制成，可以在外界-40℃～85℃的环境温度下，激光器224与光学透镜223之间尺寸偏差控制在小于5微米；并且，在高低温及振动测试中，发射组件22和支架21的粘接可靠性满足设计要求；设置光机12位置可调，可以实现140度的大视场角性能。
本申请实施例提供一种车辆，应用了上述本申请实施例提供的激光雷达，可以降低温度对激光雷达的性能影响，具有大视场角性能，有利于提高车辆的测距等性能，有利于车辆的智能化。
最后应说明的是：以上各实施例仅用以说明本申请实施例的技术方案，而非对其限制；尽管参照前述各实施例对本申请实施例进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请实施例技术方案的范围。

Claims (20)

  1. 一种激光雷达，其特征在于，包括：支架和发射组件；
    所述发射组件包括基板、电路板、光学透镜、激光器和温控器件，所述基板连接在所述支架上，所述光学透镜和所述电路板分别连接在所述基板的背向所述支架的一侧，所述激光器连接在所述电路板的背向所述基板的一侧，所述温控器件连接在所述电路板的面向所述基板的一侧，所述基板上设置有开孔，所述温控器件和所述支架在所述开孔处连接，所述温控器件和所述支架之间设置有导热凝胶。
  2. 根据权利要求1所述的激光雷达，其特征在于，所述基板包括主体部和托架，所述托架连接在所述主体部的侧壁上，所述托架所在的平面垂直于所述主体部所在的平面，且所述托架位于所述主体部的面向所述电路板的一侧，所述电路板连接在所述主体部上，所述光学透镜连接在所述托架上，所述激光器位于所述电路板的靠近所述光学透镜的一端，所述激光器和所述光学透镜相对设置。
  3. 根据权利要求1或2所述的激光雷达，其特征在于，所述温控器件为半导体制冷器，所述半导体制冷器用于为所述电路板加热或制冷。
  4. 根据权利要求1-3任一项所述的激光雷达，其特征在于，所述基板的热膨胀系数小于等于10PPM。
  5. 根据权利要求4所述的激光雷达，其特征在于，所述基板的热膨胀系数为4-10PPM。
  6. 根据权利要求1-5任一项所述的激光雷达，其特征在于，所述基板的热膨胀系数与所述电路板的热膨胀系数的差值的绝对值小于等于2PPM。
  7. 根据权利要求6所述的激光雷达，其特征在于，所述基板的材料包括可伐合金、陶瓷或玻璃。
  8. 根据权利要求6所述的激光雷达，其特征在于，所述电路板的材料包括氮化铝陶瓷。
  9. 根据权利要求1-8任一项所述的激光雷达，其特征在于，所述支架的材料包括铝合金。
  10. 根据权利要求1-9任一项所述的激光雷达，其特征在于，所述电路板的两端分别通过垫高块固定在所述基板上，所述垫高块为所述基板表面凸出的一部分结构，或者，所述垫高块为独立于所述基板的结构并固定在所述基板上。
  11. 根据权利要求10所述的激光雷达，其特征在于，所述垫高块的长度和宽度均小于3mm。
  12. 根据权利要求1-11任一项所述的激光雷达，其特征在于，所述激光雷达还包括缓冲片，所述缓冲片位于所述支架和所述基板之间，所述缓冲片和所述支架通过粘胶粘接，所述缓冲片和所述基板焊接，或者所述缓冲片和所述基板通过粘胶粘接。
  13. 根据权利要求12所述的激光雷达，其特征在于，所述缓冲片的热膨胀系数大于所述基板的热膨胀系数，所述缓冲片的热膨胀系数小于所述支架的热膨胀系数。
  14. 根据权利要求12所述的激光雷达，其特征在于，所述基板的面向所述支架的一侧设置有安装柱，所述支架的面向所述基板的一侧设置有安装孔，所述安装柱位于所述安装孔内，所述安装柱和所述安装孔之间的间隙内填充有粘胶。
  15. 根据权利要求1-14任一项所述的激光雷达，其特征在于，所述激光雷达包括光机，所述光机包括所述支架、所述发射组件和接收组件，所述接收组件、所述发射组件分别固 定在所述支架上。
  16. 根据权利要求15所述的激光雷达，其特征在于，所述激光雷达还包括壳体和扫描器，所述光机和所述扫描器均安装在所述壳体上，且所述光机的出光轴和所述扫描器的转镜对齐设置。
  17. 根据权利要求16所述的激光雷达，其特征在于，所述壳体上设置有销钉，所述支架上设置有腰型孔，所述腰型孔的长度方向垂直于所述出光轴，所述销钉安装在所述腰型孔内且所述销钉在所述腰型孔内的位置可调节。
  18. 根据权利要求1-17任一项所述的激光雷达，其特征在于，所述光学透镜通过粘胶粘接在所述基板上，所述电路板通过粘胶粘接在所述基板上。
  19. 根据权利要求1-18任一项所述的激光雷达，其特征在于，所述基板的侧壁上开设有至少一个凹槽。
  20. 一种车辆，其特征在于，包括车体和至少一个权利要求1-19任一项所述的激光雷达，所述激光雷达固定在所述车体上。
PCT/CN2022/143047 2021-12-31 2022-12-28 激光雷达和车辆 WO2023125731A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202111679281.4A CN116413726A (zh) 2021-12-31 2021-12-31 激光雷达和车辆
CN202111679281.4 2021-12-31

Publications (1)

Publication Number Publication Date
WO2023125731A1 true WO2023125731A1 (zh) 2023-07-06

Family

ID=86998072

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/143047 WO2023125731A1 (zh) 2021-12-31 2022-12-28 激光雷达和车辆

Country Status (2)

Country Link
CN (1) CN116413726A (zh)
WO (1) WO2023125731A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116609766B (zh) * 2023-07-21 2023-11-07 深圳市速腾聚创科技有限公司 激光雷达及可移动设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN209417295U (zh) * 2018-11-13 2019-09-20 北醒（北京）光子科技有限公司 一种激光雷达主模块及激光雷达
WO2021001502A1 (en) * 2019-07-03 2021-01-07 Blickfeld GmbH Post-scanner telescope optics for lidar system
CN214623023U (zh) * 2020-11-26 2021-11-05 上海禾赛科技股份有限公司 发射电路板组件、发射模组与激光雷达
CN113791418A (zh) * 2021-09-30 2021-12-14 北醒（北京）光子科技有限公司 一种激光测距雷达

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN209417295U (zh) * 2018-11-13 2019-09-20 北醒（北京）光子科技有限公司 一种激光雷达主模块及激光雷达
WO2021001502A1 (en) * 2019-07-03 2021-01-07 Blickfeld GmbH Post-scanner telescope optics for lidar system
CN214623023U (zh) * 2020-11-26 2021-11-05 上海禾赛科技股份有限公司 发射电路板组件、发射模组与激光雷达
CN113791418A (zh) * 2021-09-30 2021-12-14 北醒（北京）光子科技有限公司 一种激光测距雷达

Also Published As

Publication number Publication date
CN116413726A (zh) 2023-07-11

Similar Documents

Publication Publication Date Title
US8842260B2 (en) Compact laser rangefinder
WO2023125731A1 (zh) 激光雷达和车辆
WO2020107164A1 (zh) 激光二极管封装模块及距离探测装置、电子设备
JP7312979B2 (ja) レーザートランシーバーモジュールおよびその光学調整方法、レーザーレーダーおよび自動運転装置
WO2023169055A1 (zh) 深度相机模组及其组装方法、拍摄组件和电子设备
CN216670273U (zh) 一种激光测距雷达
CN208239607U (zh) 一种激光雷达散热结构
WO2023169057A1 (zh) 飞行时间模组及其组装方法、拍摄组件和终端
CN110596675A (zh) 一种激光发射装置及激光雷达系统
JPS60221713A (ja) 光電モジユ−ルケ−シング
CN214473946U (zh) 一种抗干扰的流动测距装置
CN113791418A (zh) 一种激光测距雷达
CN212275966U (zh) 测距装置
CN115053149A (zh) 激光雷达及具有激光雷达的设备
CN111952837A (zh) 一种太赫兹量子级联激光器的耦合输出结构及其封装方法
CN205899023U (zh) 微型激光测距机
CN215932125U (zh) 激光雷达
CN218886154U (zh) 一种激光测云雷达
US20220206118A1 (en) METHODS AND APPARATUSES FOR THERMAL MANAGEMENT OF A DETECTION SENSOR ASSEMBLY IN A LiDAR SYSTEM
CN216900913U (zh) 一种光路通道模块及激光雷达
CN220855171U (zh) 一种四轴双侧光路激光收发模组
WO2023044915A1 (zh) 测距装置和具有该测距装置的可移动平台
WO2024103823A1 (zh) 光学装置及激光雷达系统
CN221247410U (zh) 一种高功率半导体激光焊用光斑形成装置
CN112611342B (zh) 一种基于热稳定性设计的机床五自由度误差测量装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22914981

Country of ref document: EP

Kind code of ref document: A1