WO2023125347A1 - 一种印刷电路板组件和电子设备 - Google Patents

一种印刷电路板组件和电子设备 Download PDF

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Publication number
WO2023125347A1
WO2023125347A1 PCT/CN2022/141739 CN2022141739W WO2023125347A1 WO 2023125347 A1 WO2023125347 A1 WO 2023125347A1 CN 2022141739 W CN2022141739 W CN 2022141739W WO 2023125347 A1 WO2023125347 A1 WO 2023125347A1
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WIPO (PCT)
Prior art keywords
printed circuit
solder joints
circuit board
continuous
board assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/CN2022/141739
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English (en)
French (fr)
Inventor
胡坤
雷毅
刘洋
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Publication date
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Publication of WO2023125347A1 publication Critical patent/WO2023125347A1/zh
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Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/023—Stackable modules

Definitions

  • the application belongs to the technical field of circuit boards, and in particular relates to a printed circuit board assembly and electronic equipment.
  • the purpose of the embodiments of the present application is to provide a printed circuit board assembly and electronic equipment, which can solve the problems of poor adhesion between the Cavity board and other printed circuit boards in the related art, and easy cracking of solder joints, which will lead to related function failures.
  • an embodiment of the present application provides a printed circuit board assembly, which includes:
  • the first printed circuit board and the second printed circuit board are stacked, the side of the first printed circuit board facing the second printed circuit board is provided with a shelf board, and the shelf board surrounds and forms a recessed structure, the The first printed circuit board is electrically connected to the second printed circuit board through a plurality of solder joints;
  • the plurality of solder joints are disposed on the first surface of the shelf plate facing the second printed circuit board, the plurality of solder joints include continuous solder joints, and the continuous solder joints include the same type of multiple first solder joints of the same type, the multiple first solder joints of the same type are solder joints of the same signal;
  • Continuous welding pads corresponding to the positions and shapes of the continuous welding spots are arranged on the first surface.
  • the number of the continuous welding spots is more than two, the continuous welding spots are strip-shaped, the first surface is a hollow plane closed figure, and a plurality of the continuous welding spots along the first surface
  • the extension direction of the inner edge of the first surface is distributed at intervals on the inner edge of the first surface and the extension direction of the outer edge of the first surface is distributed at intervals on the outer edge of the first surface.
  • the number of the continuous welding spots is two, the continuous welding spots are strip-shaped, and the first surface is a hollow planar closed figure, wherein one of the continuous welding spots is surrounded by the first The inner edge of the first surface, and the other continuous welding point is surrounded by the outer edge of the first surface.
  • a plurality of through holes are also opened on the first surface, the plurality of through holes are located in the middle area between the inner edge and the outer edge of the first surface, and along the first The interval setting of the perimeter direction of the face.
  • the plurality of welding spots further include a plurality of independent welding spots, the plurality of independent welding spots are located in the middle area between the inner edge and the outer edge of the first surface, and are located in the first The two opposite sides of the continuous welding spot on the inner edge of the surface and the continuous welding spot on the outer edge of the first surface are wave-shaped.
  • the number of the continuous welding spots is multiple, the orthographic projection of the continuous welding spots on the first surface is a closed figure, the first surface is a hollow plane closed figure, and the plurality of continuous welding spots The welding spots are arranged at intervals along the circumferential direction of the first surface.
  • the plurality of solder joints further include a plurality of independent solder joints, the multiple independent solder joints are distributed in the closed area of the continuous solder joints, and through holes are also arranged in the closed area of the continuous solder joints , the inner surface of the continuous welding spot is wavy.
  • the shape of the continuous welding spot is any one of strip shape, T shape, Z shape, X shape, Y shape, and L shape.
  • the plurality of soldering points further include a second soldering point, the continuous soldering point surrounds an outer periphery of the second soldering point, and the second soldering point is a target signal soldering point.
  • the first printed circuit board and the frame board are integrally formed.
  • an embodiment of the present application provides an electronic device, which includes the printed circuit board assembly as described in the first aspect.
  • the stacked first printed circuit board and the second printed circuit board are electrically connected through a plurality of solder joints, and multiple first solder joints of the same type among the multiple solder joints are integrated into one
  • the formation of continuous solder joints can effectively improve the stress condition of the solder joints, thereby improving the reliability of the printed circuit board assembly.
  • FIG. 1 is a schematic diagram of a stack of printed circuit boards in the related art
  • FIG. 2 is a schematic diagram of stacking another printed circuit board in the related art
  • FIG. 3 is a schematic structural diagram of a printed circuit board assembly provided in an embodiment of the present application.
  • FIG. 4 is a schematic diagram of multiple solder joints on the first surface provided by the embodiment of the present application.
  • Fig. 5 is one of the schematic diagrams of a continuous welding spot provided by the embodiment of the present application.
  • Figure 6 is the second schematic diagram of a continuous welding spot provided by the embodiment of the present application.
  • Fig. 7 is the third schematic diagram of a continuous welding spot provided by the embodiment of the present application.
  • Fig. 8 is the fourth schematic diagram of a continuous welding spot provided by the embodiment of the present application.
  • Fig. 9 is the fifth schematic diagram of a continuous welding spot provided by the embodiment of the present application.
  • Figure 10 is the sixth schematic diagram of a continuous welding spot provided by the embodiment of the present application.
  • Figure 11 is the seventh schematic diagram of a continuous welding spot provided by the embodiment of the present application.
  • Figure 12 is the eighth schematic diagram of a continuous welding spot provided by the embodiment of the present application.
  • FIG. 13 is a ninth schematic diagram of a continuous welding spot provided by the embodiment of the present application.
  • FIG. 1 is a schematic diagram of a stack of printed circuit boards in the related art.
  • the radio frequency frame board 11, the intermediate connection board 12, and the main board 13 are stacked and arranged, and the radio frequency frame board 11 and the main board 13 are connected through the intermediate connection board 12, that is The two ends of the intermediate connection plate 13 are respectively welded to the radio frequency frame 11 and the main board 13, and a plurality of devices 14 are arranged on the surface of the side of the radio frequency frame 11 away from the intermediate connection plate 12, and the plurality of devices 14 are covered by a shielding cover 15 Shielding, a plurality of devices 14 are also arranged on the side surface of the main board 13 away from the intermediate connection board 12, and the plurality of devices 14 are shielded by another shielding case 15 cover, while on the side of the main board 13 facing the radio frequency shelf 11 On the surface, a plurality of devices 14 are also arranged in the enclosed area of the intermediate connecting board 13 .
  • FIG. 2 is a schematic diagram of another printed circuit board stack in the related art.
  • the radio frequency shelf board and the intermediate connection board are directly integrated to form a complete cavity board 21, cativy, that is, holes, holes, that is, on the printed circuit board
  • a concave structure is formed on the surface of the cavity board 21 and the main board 23 are stacked, and electrical connection is realized between the cavity board 21 and the main board 23 by welding, and a plurality of devices 24 are arranged on the side surface of the cavity board 21 away from the main board 23, and a plurality of The device 24 is shielded by the cover of the shielding case 25, and a plurality of devices 24 are also arranged on the side surface of the main board 23 away from the cavity board 21.
  • a plurality of devices 24 are also arranged in the enclosed area of the cavity board 21 .
  • this stacking method has smaller solder joints and can save space.
  • the amount of tin on it will also decrease, and the adhesion between the cavity board 21 and the main board 23 will also change.
  • its solder joints are prone to cracking, resulting in poor contact, which in turn leads to failure of corresponding functions.
  • FIG. 3 is a schematic structural diagram of a printed circuit board assembly provided by an embodiment of the present application.
  • the embodiment of the present application provides a printed circuit board assembly, which includes a first printed circuit board 31 and a second printed circuit board 32 arranged in a stack, wherein the first printed circuit board 31
  • a frame plate 311 is provided on one side facing the second printed circuit board 32, and the frame plate 311 surrounds and forms a recessed structure 312; optionally, the shape of the frame plate 311 can be a regular shape, such as a cylinder, and the frame plate
  • the enclosed area of the plate 311 is the cylindrical hollow area, which is the concave structure 312.
  • the cross-sectional shape of the shelf plate 311 is a hollow rectangle, and the enclosed area of the shelf plate 311 is in the shape of a cube, namely is a concave structure 312; optionally, the shape of the shelf 311 may also be an irregular shape, for example, the cross-sectional shape of the shelf 311 is a hollow and irregular closed figure.
  • FIG. 4 is a schematic diagram of multiple solder joints on the first surface provided by an embodiment of the present application.
  • the first printed circuit board 31 is electrically connected to the second printed circuit board 32 through a plurality of solder joints 33, and the plurality of solder joints 33 are arranged on the second printed circuit board of the shelf plate 311.
  • the frame board 311 of the first printed circuit board 31 and the second printed circuit board 32 are soldered and fixed.
  • the plurality of solder joints 33 include continuous solder joints 331
  • the continuous solder joints 331 include a plurality of first solder joints of the same type connected together.
  • the so-called multiple first solder joints of the same type are used to connect the same signal.
  • the first surface 313 is provided with pads corresponding to the positions and shapes of the plurality of solder joints 33 one by one, that is to say, the first surface 313 is also provided with the positions and shapes of the continuous solder joints 331
  • the corresponding continuous pads, the so-called continuous pads are composed of a plurality of first pads that are originally independent of each other, and these first pads correspond to connecting the same signal.
  • the first printed circuit board 31 and the shelf board 311 are integrally formed, and both may correspond to the stacking style of the cavity board in FIG. 2 , in the case of the cavity board, the first printed circuit board
  • the frame plate 311 of 31 is a skeleton frame plate, that is, the frame plate 311 is in the shape of a bone position protrusion.
  • the first printed circuit board 31 and the frame plate 311 are separately provided, and the two ends of the frame plate 311 are respectively connected to the first printed circuit board 31 and the first printed circuit board 31 through a plurality of first solder joints 33 and The second printed circuit board 32 is electrically connected, ie corresponds to the stacking pattern in FIG. 1 .
  • each solder joint is independently arranged in the prior art
  • a plurality of originally independent pads are connected together to form a continuous pad, and the amount of tin on the continuous pad during welding Effectively increase, and connect a plurality of first solder joints of the same type into one during soldering, the stress at the soldering position is effectively improved, thereby enhancing the connection between the first printed circuit board 31 and the second printed circuit board 32
  • the strength reduces the probability of disconnection of solder joints between the first printed circuit board 31 and the second printed circuit board 32 when falling and collides, and improves the reliability of the printed circuit board assembly.
  • the first printed circuit board 31 and the second printed circuit board 32 that are stacked are electrically connected through a plurality of solder joints 33, and multiple solder joints 33 of the same type
  • the first solder joints are connected to form a continuous solder joint 331, which can effectively improve the stress condition of the solder joints, thereby improving the reliability of the printed circuit board assembly.
  • FIG. 5 is one of the schematic diagrams of a continuous welding spot provided by the embodiment of the present application.
  • the number of continuous solder joints 331 is more than two, and the continuous solder joints 331 are strip-shaped, and the first surface of the shelf board 311 on the first printed circuit board 31 313 is a hollow plane closed figure, which may be a regular shape, such as a ring, a hollow rectangle, etc.
  • the plane closed figure may also be an irregular shape.
  • the first surface 313 includes an inner side and an outer side, and the enclosed area of the inner side is the hollow part of the first surface 313, wherein a plurality of continuous welding spots 331 are along the inner side of the first surface 313.
  • the extension direction is distributed at intervals on the inner edge of the first surface 313 , and is distributed at intervals along the extension direction of the outer edge of the first surface 313 on the outer edge of the first surface 313 .
  • a plurality of continuous welding spots 331 are arranged in sections on the inner edge and outer edge of the welding surface (i.e., the first surface 313), so that the continuous welding spots 331 can be used to absorb stress, thereby reducing the position of the continuous welding spots 331.
  • the stress value improves the connection strength; and, because the continuous solder joints 331 are arranged at intervals, the flux used in the welding process can be released from the gap 34 between two adjacent continuous solder joints 331, thereby reducing the The probability of tin migration on the pad ensures the quality of the finished product.
  • the plurality of welding spots 33 further include a plurality of independent welding spots 332, and the plurality of independent welding spots 332 are located in the middle area between the inner side and the outer side of the first surface 313, and,
  • the two opposite sides of the continuous welding spot 331 located at the inner edge of the first surface 313 and the continuous welding spot 331 located at the outer edge of the first surface 313 are wavy, that is to say, the inner edge of the first surface 313
  • the side of the continuous welding spot 331 facing the continuous welding spot 331 located on the outer edge of the first surface 313 is wavy, while the continuous welding spot 331 located on the outer edge of the first surface 313 is facing the inner edge of the first surface 313
  • the side surfaces of the continuous solder joints 331 are also wavy.
  • the wave-shaped side of the continuous welding spot 331 can ensure the contact between the plurality of independent welding spots 332 adjacent to the continuous welding spot 331 and the continuous welding spot 331.
  • the gaps 34 are all the same, so that the dimensions of the plurality of independent solder joints 332 can be designed to be consistent, their positions are more convenient to set, and the possibility of false contact between the independent solder joints 332 and the continuous solder joints 331 is reduced.
  • each independent welding spot 332 is directly opposite to a concave portion of the wavy side, so as to ensure that the continuous welding spot 331
  • the gaps 34 between the multiple adjacent independent welding spots 332 and the continuous welding spots 331 are the same.
  • FIG. 6 is the second schematic diagram of continuous solder joints provided by the embodiment of the present application.
  • the number of continuous welding spots 331 is two
  • the continuous welding spots 331 are strip-shaped
  • the first surface 313 is a hollow plane closed figure, which can be A regular shape, such as a ring, a hollow rectangle, etc.
  • the planar closed figure can also be an irregular shape.
  • the first surface 313 includes an inner side and an outer side, and the enclosed area of the inner side is the hollow part of the first side 313, wherein a continuous solder joint 331 is surrounded by the inner side edge of the first side 313, and the other A continuous solder joint 331 is disposed around the outer edge of the first surface 313 .
  • one of the continuous welding spots 331 is arranged along the extension direction of the inner side of the first surface 313, and is connected end to end to form a circle
  • the other continuous welding spot 331 is arranged along the extension direction of the outer side of the first surface 313. Arranged in the direction of extension, and connected end to end to form a circle.
  • the two continuous welding spots 331 are arranged in a circle on the inner edge and the outer edge of the welding surface (i.e. the first surface 313), so that the continuous welding spots 331 can be used to absorb stress, thereby reducing the stress at the position of the continuous welding spots 331. Stress value, improve connection strength.
  • a plurality of through holes 35 are also opened on the first surface 313, and the plurality of through holes 35 are located in the middle area between the inner edge and the outer edge of the first surface 313, and along the first surface 313 are arranged at intervals along the circumferential direction of the first surface 313 , or in other words, arranged at intervals along the extending direction of the length of the first surface 313 .
  • the flux used in the soldering process can be released from the plurality of through holes 35 arranged at intervals, thereby reducing the probability of migration of tin on the pad and ensuring the quality of the finished product.
  • the through hole 35 can also be opened in the area of the second printed circuit board 32 facing the first surface 313 , which can also achieve the above effect.
  • the plurality of welding spots 33 further include a plurality of independent welding spots 332, and the plurality of independent welding spots 332 are located in the middle area between the inner side and the outer side of the first surface 313, and,
  • the two opposite sides of the continuous welding spot 331 located at the inner edge of the first surface 313 and the continuous welding spot 331 located at the outer edge of the first surface 313 are wavy, that is to say, the inner edge of the first surface 313
  • the side of the continuous welding spot 331 facing the continuous welding spot 331 located on the outer edge of the first surface 313 is wavy, while the continuous welding spot 331 located on the outer edge of the first surface 313 is facing the inner edge of the first surface 313
  • the side surfaces of the continuous solder joints 331 are also wavy.
  • the wave-shaped side of the continuous welding spot 331 can ensure the contact between the plurality of independent welding spots 332 adjacent to the continuous welding spot 331 and the continuous welding spot 331.
  • the gaps 34 are all the same, so that the dimensions of the plurality of independent solder joints 332 can be designed to be consistent, their positions are more convenient to set, and the possibility of false contact between the independent solder joints 332 and the continuous solder joints 331 is reduced.
  • each independent welding spot 332 is directly opposite to a concave portion of the wavy side, so as to ensure that the continuous welding spot 331
  • the gaps 34 between the multiple adjacent independent welding spots 332 and the continuous welding spots 331 are the same.
  • FIG. 7 is the third schematic diagram of a continuous welding spot provided by the embodiment of the present application
  • FIG. 8 is the fourth schematic diagram of a continuous welding spot provided by the embodiment of the present application.
  • the plurality of welding spots 33 also include a second welding spot 333
  • the continuous welding spots 331 are located on the periphery of the second welding spot 333
  • the second welding spot 333 is the target Signal solder joints. That is to say, the target signal is an important signal
  • the second welding spot 333 is a welding spot of an important signal line.
  • the continuous solder joints 331 located on the outer periphery of the second solder joints 333 are ground solder joints, so as to avoid interference to the target signal on the second solder joints 333 .
  • the continuous solder joint 331 in the embodiment of the present application is based on the shape of the continuous solder joint 331 in Figure 6, and further connects the first internal solder joints of the same type as a whole, This further improves the stress situation.
  • FIG. 9 is a fifth schematic diagram of a continuous welding spot provided by the embodiment of the present application.
  • the number of continuous welding spots 331 is multiple, and the orthographic projection of the continuous welding spots 331 on the first surface 313 is a closed figure, which can be a regular shape, Such as triangle, rectangle, ellipse, pentagon, etc., also can be irregular shapes, that is, as long as they are surrounded by a circle.
  • the first surface 313 is a hollow plane closed figure, and the plane closed figure can be a regular shape, such as a ring, a hollow rectangle, etc.
  • the plane closed figure can also be an irregular shape.
  • a plurality of continuous welding spots 331 are arranged at intervals along the circumferential direction of the first surface 313 , or in other words, arranged at intervals along the length extension direction of the first surface 313 .
  • a plurality of continuous welding spots 331 are arranged at intervals on the welding surface (i.e. the first surface 313) in a fully enclosed manner, so that the continuous welding spots 331 can be used to absorb stress, thereby reducing the stress value at the position of the continuous welding spots 331, Improve connection strength.
  • the plurality of welding spots 33 also includes a plurality of independent welding spots 332, and the plurality of independent welding spots 332 are distributed in the closed area (ie, the hollow part) formed by each continuous welding spot 331, each At least one through hole 35 is also arranged in the closed area of the continuous solder joint 331, and the flux used in the soldering process can be released from a plurality of through holes 35 arranged at intervals, thereby reducing the possibility of migration of tin on the pad. Probability, ensuring the quality of the finished product.
  • the through hole 35 can also be opened in the area of the second printed circuit board 32 facing the first surface 313 , which can also achieve the above effect.
  • the inner surface of the continuous welding spot 331 is wavy. Since the plurality of independent welding spots 332 located in the closed area are generally circular, the wave-shaped inner surface of the continuous welding spot 331 can ensure that the gap between the plurality of independent welding spots 332 adjacent to the continuous welding spot 331 and the continuous welding spot 331 The gaps 34 are the same, so that the dimensions of the multiple independent solder joints 332 can be designed to be consistent, their positions are more convenient to set, and the possibility of false contact between the independent solder joints 332 and the continuous solder joints 331 is reduced.
  • each independent welding spot 332 is directly opposed to a concave part of the wavy inner surface, so as to ensure that it is compatible with the continuous welding spot 331.
  • the gaps 34 between the plurality of independent welding spots 332 adjacent to the point 331 and the continuous welding spots 331 are all the same.
  • FIG. 10 is a sixth schematic diagram of a continuous welding spot provided by an embodiment of the present application.
  • the plurality of welding spots 33 further include a second welding spot 333, and the continuous welding spots 331 surround the periphery of the second welding spots 333, and the second welding spots 333 are the target signal. solder joints. That is to say, the target signal is an important signal, and the second welding spot 333 is a welding spot of an important signal line.
  • the continuous welding spot 331 located on the outer periphery of the second welding spot 333 is a grounding welding spot, so as to avoid interference to the target signal on the second welding spot 333 .
  • the continuous welding spot 331 in the embodiment of the present application is based on the shape of the continuous welding spot 331 in Figure 9, and further connects the first internal welding spots of the same type as a whole, thereby further improving stress situation.
  • Figure 11 is the seventh schematic diagram of a continuous solder joint provided by the embodiment of the present application
  • Figure 12 is the eighth schematic diagram of a continuous solder joint provided by the embodiment of the present application
  • Figure 13 is the The ninth schematic diagram of a continuous welding spot provided in the embodiment of the application.
  • the shape of the continuous welding spot 331 is any one of strip shape, T shape, Z shape, X shape, Y shape, and L shape.
  • the continuous solder joints 331 are in an X shape, as shown in FIG. 12 , the continuous solder joints 331 are in an inverted T shape, and as shown in FIG. 13 , the continuous solder joints 331 are in a Z shape.
  • the shape of the continuous welding spot 331 in the embodiment of the present application is not limited to the above shape, and may also be other regular or irregular shapes.
  • the first printed circuit board and the second printed circuit board that are stacked are electrically connected through a plurality of solder joints, and multiple first solder joints of the same type among the multiple solder joints are connected to each other. Forming a continuous solder joint as a whole can effectively improve the stress condition of the solder joint, thereby improving the reliability of the printed circuit board assembly.
  • the electronic device includes the printed circuit board assembly as described in the above embodiments, and can achieve the same technical effect. To avoid repetition, details are not repeated here.
  • the foregoing electronic device may be a terminal, or may be other devices except the terminal.
  • the electronic device can be a mobile phone, a tablet computer, a notebook computer, a handheld computer, a vehicle electronic device, a mobile Internet device (Mobile Internet Device, MID), an augmented reality (augmented reality, AR)/virtual reality (virtual reality, VR) ) equipment, robots, wearable devices, ultra-mobile personal computer (ultra-mobile personal computer, UMPC), netbook or personal digital assistant (personal digital assistant, PDA), etc.
  • the term “comprising”, “comprising” or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article or apparatus comprising a set of elements includes not only those elements, It also includes other elements not expressly listed, or elements inherent in the process, method, article, or device. Without further limitations, an element defined by the phrase “comprising a " does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising that element.
  • the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved. Functions are performed, for example, the described methods may be performed in an order different from that described, and various steps may also be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

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Abstract

本申请公开了一种印刷电路板组件和电子设备，属于电路板技术领域。所述印刷电路板组件包括堆叠设置的第一印刷电路板和第二印刷电路板，所述第一印刷电路板朝向所述第二印刷电路板的一侧设置有架板，所述架板围合形成凹陷结构，所述第一印刷电路板通过多个焊点与所述第二印刷电路板电连接；所述多个焊点设置于所述架板的朝向所述第二印刷电路板的第一面上，所述多个焊点包括连续焊点，所述连续焊点包括连为一体的同类型的多个第一焊点，所述同类型的多个第一焊点为同一信号的焊点；所述第一面上设置有与所述连续焊点的位置和形状相对应的连续焊盘。

Description

一种印刷电路板组件和电子设备
相关申请的交叉引用
本申请主张在2021年12月29日在中国提交的中国专利申请No.202111637294.5的优先权，其全部内容通过引用包含于此。
技术领域
本申请属于电路板技术领域，具体涉及一种印刷电路板组件和电子设备。
背景技术
随着印刷电路板制作工艺技术的发展，出现了一种Z向堆叠技术即Cavity技术，此技术将架板和中间连接板合并到一起，该样式的Cavity板和其他印刷电路板之间的连接焊点尺寸小，可以节省空间。但是Cavity板和其他印刷电路板之间的附着力/应力也发生了变化，在跌落过程中焊点容易开裂，接触发生异常，进而导致相关功能失效。
发明内容
本申请实施例的目的是提供一种印刷电路板组件和电子设备，能够解决相关技术中Cavity板和其他印刷电路板之间附着力差，焊点容易开裂继而导致相关功能失效的问题。
第一方面，本申请实施例提供了一种印刷电路板组件，该印刷电路板组件包括：
堆叠设置的第一印刷电路板和第二印刷电路板，所述第一印刷电路板朝向所述第二印刷电路板的一侧设置有架板，所述架板围合形成凹陷结构，所述第一印刷电路板通过多个焊点与所述第二印刷电路板电连接；
所述多个焊点设置于所述架板的朝向所述第二印刷电路板的第一面上，所述多个焊点包括连续焊点，所述连续焊点包括连为一体的同类型的多个第一焊点，所述同类型的多个第一焊点为同一信号的焊点；
所述第一面上设置有与所述连续焊点的位置和形状相对应的连续焊盘。
可选地，所述连续焊点的数量为两个以上，所述连续焊点呈条形，所述第一面呈中空的平面封闭图形，多个所述连续焊点沿所述第一面的内侧边的延伸方向间隔分布在所述第一面的内侧边缘以及沿所述第一面的外侧边的延伸方向间隔分布在所述第一面的外侧边缘。
可选地，所述连续焊点的数量为两个，所述连续焊点呈条形，所述第一面呈中空的平面封闭图形，其中一个所述连续焊点围设于所述第一面的内侧边缘，另一个所述连续焊点围设于所述第一面的外侧边缘。
可选地，所述第一面上还开设有多个通孔，所述多个通孔位于所述第一面的内侧边缘和所述外侧边缘之间的中间区域，且沿所述第一面的周长方向间隔设置。
可选地，所述多个焊点还包括多个独立焊点，所述多个独立焊点位于所述第一面的内侧边缘和所述外侧边缘之间的中间区域，位于所述第一面的内侧边缘的连续焊点以及位于所述第一面的外侧边缘的连续焊点的相向的两个侧面均呈波浪形。
可选地，所述连续焊点的数量为多个，所述连续焊点在所述第一面的正投影为封闭图形，所述第一面呈中空的平面封闭图形，多个所述连续焊点沿所述第一面的周长方向间隔设置。
可选地，所述多个焊点还包括多个独立焊点，所述多个独立焊点分布于所述连续焊点的封闭区域，所述连续焊点的封闭区域内还设置有通孔，所述连续焊点的内侧面呈波浪形。
可选地，所述连续焊点的形状为条形、T字形、Z字形、X字形、Y字形、L字形中的任一者。
可选地，所述多个焊点还包括第二焊点，所述连续焊点环绕在所述第二焊点的外周，所述第二焊点为目标信号的焊点。
可选地，所述第一印刷电路板和所述架板一体成型。
第二方面，本申请实施例提供了一种电子设备，该电子设备包括如第一 方面所述的印刷电路板组件。
在本申请实施例中，堆叠设置的第一印刷电路板和第二印刷电路板之间通过多个焊点实现电连接，将多个焊点中同类型的多个第一焊点连为一体构成连续焊点，可以有效改善焊点的应力情况，进而提高印刷电路板组件的可靠性。
附图说明
图1为相关技术中的一种印刷电路板的堆叠示意图；
图2为相关技术中的另一种印刷电路板的堆叠示意图；
图3为本申请实施例提供的一种印刷电路板组件的结构示意图；
图4为本申请实施例提供的第一面上的多个焊点的示意图；
图5为本申请实施例提供的一种连续焊点的示意图之一；
图6为本申请实施例提供的一种连续焊点的示意图之二；
图7为本申请实施例提供的一种连续焊点的示意图之三；
图8为本申请实施例提供的一种连续焊点的示意图之四；
图9为本申请实施例提供的一种连续焊点的示意图之五；
图10为本申请实施例提供的一种连续焊点的示意图之六；
图11为本申请实施例提供的一种连续焊点的示意图之七；
图12为本申请实施例提供的一种连续焊点的示意图之八；
图13为本申请实施例提供的一种连续焊点的示意图之九。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数 据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的印刷电路板组件和电子设备进行详细地说明。
请参考图1，图1为相关技术中的一种印刷电路板的堆叠示意图。如图1所示，在一种印刷电路板的堆叠方式中，射频架板11、中间连接板12、主板13堆叠设置，射频架板11与主板13之间通过中间连接板12进行连接，即中间连接板13的两端分别与射频架板11以及主板13焊接，在射频架板11的背离中间连接板12的一侧表面设置有多个器件14，多个器件14被屏蔽罩15封盖屏蔽，在主板13的背离中间连接板12的一侧表面也设置有多个器件14，多个器件14被另一个屏蔽罩15封盖屏蔽，而在主板13的朝向射频架板11的一侧表面上，中间连接板13的围合区域内也设置有多个器件14。这样的堆叠方式可称为“三明治”堆叠，可以利用Z向空间来减少印刷电路板的平面尺寸。
请参考图2，图2为相关技术中的另一种印刷电路板的堆叠示意图。如图2所示，在另一种印刷电路板的堆叠方式中，射频架板和中间连接板直接一体设计，构成完整的一个cavity板21，cativy，即孔、洞，也即在印刷电路板的表面形成凹陷结构，cavity板21和主板23堆叠设置，cavity板21和主板23之间通过焊接实现电连接，在cavity板21的背离主板23的一侧表面设置有多个器件24，多个器件24被屏蔽罩25封盖屏蔽，在主板23的背离cavity板21的一侧表面也设置有多个器件24，多个器件24被另一个屏蔽罩25封盖屏蔽，而在主板23的朝向cavity板21的一侧表面上，cavity板21的围合区域内也设置有多个器件24。这样的堆叠方式相较于“三明治”堆叠方式而言，其焊点更小，可以节省空间。但是，由于其焊点尺寸减小，其上锡量也 会减少，cavity板21和主板23的附着力也产生变化。在跌落时其焊点容易开裂，使得接触不良，进而导致相应功能失效。
由此，请参考图3，图3为本申请实施例提供的一种印刷电路板组件的结构示意图。如图3所示，本申请实施例提供了一种印刷电路板组件，该印刷电路板组件包括堆叠设置的第一印刷电路板31和第二印刷电路板32，其中，第一印刷电路板31朝向第二印刷电路板32的一侧设置有架板311，所述架板311围合形成凹陷结构312；可选的，该架板311的形状可以为规则形状，例如筒形，所述架板311的围合区域即筒形的空心区域，即为凹陷结构312，或者，该架板311的横截面形状为中空的矩形，则所述架板311的围合区域即呈立方体形状，即为凹陷结构312；可选地，该架板311的形状也可以为不规则形状，例如，该架板311的横截面形状为中空的、且不规则的封闭图形。
请参考图4，图4为本申请实施例提供的第一面上的多个焊点的示意图。如图3和图4所示，第一印刷电路板31通过多个焊点33与第二印刷电路板32电连接，多个焊点33设置于所述架板311的朝向第二印刷电路板32的第一面313上，也就是说，第一印刷电路板31的架板311与第二印刷电路板32之间进行焊接固定。其中，多个焊点33包括连续焊点331，连续焊点331包括连为一体的同类型的多个第一焊点，所谓同类型的多个第一焊点，即为用于连接同一信号的焊点，第一面313上设置有与多个焊点33的位置和形状一一相对应的焊盘，也就是说，第一面313上同样设置有与连续焊点331的位置和形状相对应的连续焊盘，所谓连续焊盘，是将多个原本互相独立的第一焊盘连为一体构成，这些第一焊盘即对应于连接同一信号。
本申请的一些实施例中，可选的，第一印刷电路板31和架板311一体成型，两者可对应于图2中的cavity板的堆叠样式，cavity板的情况下第一印刷电路板31的架板311为骨位架板，即架板311呈骨位凸起状。
本申请的另一些实施例中，可选的，第一印刷电路板31和架板311分体设置，架板311的两端面分别通过多个第一焊点33与第一印刷电路板31以 及第二印刷电路板32电连接，即对应于图1中的堆叠样式。
相较于现有技术中各个焊点独立设置的方式而言，本申请实施例中通过将多个原本互相独立的焊盘连为一体形成连续焊盘，在焊接时连续焊盘的上锡量有效增加，并且将同类型的多个第一焊点在焊接时连为一体，焊接位置处的应力得到有效改善，从而增强了第一印刷电路板31和第二印刷电路板32之间的连接强度，降低了摔落碰撞时第一印刷电路板31和第二印刷电路板32之间的焊点断开的情况的发生概率，提高了印刷电路板组件的可靠性。
由此，在本申请实施例中，堆叠设置的第一印刷电路板31和第二印刷电路板32之间通过多个焊点33实现电连接，将多个焊点33中同类型的多个第一焊点连为一体构成连续焊点331，可以有效改善焊点的应力情况，进而提高印刷电路板组件的可靠性。
请参考图5，图5为本申请实施例提供的一种连续焊点的示意图之一。如图5所示，本申请的一些实施例中，连续焊点331的数量为两个以上，连续焊点331呈条形，并且，第一印刷电路板31上的架板311的第一面313呈中空的平面封闭图形，该平面封闭图形可以为规则的形状，例如环形、中空的矩形等，可选的，该平面封闭图形也可以为不规则形状。该第一面313包括内侧边和外侧边，其内侧边的围合区域即该第一面313的中空部分，其中，多个连续焊点331沿第一面313的内侧边的延伸方向间隔分布在第一面313的内侧边缘，并且沿第一面313的外侧边的延伸方向间隔分布在第一面313的外侧边缘。
由此，多个连续焊点331呈分段式排布在焊接面(即第一面313)的内侧边缘以及外侧边缘，从而可以利用连续焊点331吸收应力，从而减少连续焊点331所在位置的应力值，提升连接强度；并且，由于连续焊点331呈间隔排布，因此，焊接过程中使用到的助焊剂可以从相邻两个连续焊点331之间的间隙34释放，从而降低了焊盘上的锡发生迁移的概率，确保了成品的质量。
在本申请的一些实施例中，多个焊点33还包括多个独立焊点332，多个 独立焊点332位于第一面313的内侧边和外侧边之间的中间区域，并且，位于第一面313的内侧边缘的连续焊点331以及位于第一面313的外侧边缘的连续焊点331的相向的两个侧面均呈波浪形，也就是说，位于第一面313的内侧边缘的连续焊点331的朝向位于第一面313的外侧边缘的连续焊点331的侧面呈波浪形，而位于第一面313的外侧边缘的连续焊点331的朝向位于第一面313的内侧边缘的连续焊点331的侧面也呈波浪形。由于位于中间区域的多个独立焊点332通常为圆形，因此，连续焊点331的波浪形侧面可以保证与连续焊点331相邻的多个独立焊点332与连续焊点331之间的间隙34均相同，从而使得多个独立焊点332的尺寸可以设计成一致，其位置更加方便设置，并减少独立焊点332与连续焊点331发生误接触的可能。
在一些实施例中，与连续焊点331的波浪形侧面相邻的多个独立焊点332中，每一个独立焊点332与波浪形侧面的一个凹陷部分正对，以确保与连续焊点331相邻的多个独立焊点332与连续焊点331之间的间隙34均相同。
请参考图6，图6为本申请实施例提供的连续焊点的示意图之二。如图6所示，本申请的另一些实施例中，连续焊点331的数量为两个，连续焊点331呈条形，第一面313呈中空的平面封闭图形，该平面封闭图形可以为规则的形状，例如环形、中空的矩形等，可选的，该平面封闭图形也可以为不规则形状。该第一面313包括内侧边和外侧边，其内侧边的围合区域即该第一面313的中空部分，其中一个连续焊点331围设于第一面313的内侧边缘，另一个连续焊点331围设于第一面313的外侧边缘。示例性的，其中一个连续焊点331沿第一面313的内侧边的延伸方向排布，并且首尾连接在一起形成一圈，另一个连续焊点331沿第一面313的外侧边的延伸方向排布，并且首尾连接在一起形成一圈。
由此，两个连续焊点331呈圈状排布在焊接面(即第一面313)的内侧边缘以及外侧边缘，从而可以利用连续焊点331吸收应力，从而减少连续焊点331所在位置的应力值，提升连接强度。
本申请的一些实施例中，第一面313上还开设有多个通孔35，多个通孔 35位于第一面313的内侧边缘和外侧边缘之间的中间区域，且沿第一面313的周长方向间隔设置，或者说沿第一面313的长度延伸方向间隔设置。焊接过程中使用到的助焊剂可以从间隔排布的多个通孔35中释放，从而降低了焊盘上的锡发生迁移的概率，确保了成品的质量。当然，通孔35也可以开设在第二印刷电路板32上与第一面313正对的区域内，同样能够起到上述效果。
在本申请的一些实施例中，多个焊点33还包括多个独立焊点332，多个独立焊点332位于第一面313的内侧边和外侧边之间的中间区域，并且，位于第一面313的内侧边缘的连续焊点331以及位于第一面313的外侧边缘的连续焊点331的相向的两个侧面均呈波浪形，也就是说，位于第一面313的内侧边缘的连续焊点331的朝向位于第一面313的外侧边缘的连续焊点331的侧面呈波浪形，而位于第一面313的外侧边缘的连续焊点331的朝向位于第一面313的内侧边缘的连续焊点331的侧面也呈波浪形。由于位于中间区域的多个独立焊点332通常为圆形，因此，连续焊点331的波浪形侧面可以保证与连续焊点331相邻的多个独立焊点332与连续焊点331之间的间隙34均相同，从而使得多个独立焊点332的尺寸可以设计成一致，其位置更加方便设置，并减少独立焊点332与连续焊点331发生误接触的可能。
在一些实施例中，与连续焊点331的波浪形侧面相邻的多个独立焊点332中，每一个独立焊点332与波浪形侧面的一个凹陷部分正对，以确保与连续焊点331相邻的多个独立焊点332与连续焊点331之间的间隙34均相同。
请参考图7和图8，图7为本申请实施例提供的一种连续焊点的示意图之三，图8为本申请实施例提供的一种连续焊点的示意图之四。如图7、图8所示，本申请的一些实施例中，多个焊点33还包括第二焊点333，连续焊点331位于第二焊点333的外周，第二焊点333为目标信号的焊点。也就是说，目标信号为一重要信号，第二焊点333为重要信号线的焊点，通过将该第二焊点333周围的多个第一焊点做成一个整体形成连续焊点331，从而进一步吸收应力，从而改善内部的焊点的受力情况。可选的，位于第二焊点333外周的连续焊点331为接地焊点，以避免对第二焊点333上的目标信号产生干 扰。
如图7、图8所示，本申请实施例中的连续焊点331是在图6的连续焊点331的形状的基础上，进一步将内部的同类型的第一焊点连接为一个整体，从而进一步改善应力情况。
请参考图9，图9为本申请实施例提供的一种连续焊点的示意图之五。如图9所示，本申请的另一些实施例中，连续焊点331的数量为多个，连续焊点331在第一面313上的正投影为封闭图形，该封闭图形可以为规则形状，例如三角形、矩形、椭圆形、五边形等，也可以是不规则形状，即只要围成一圈即可。第一面313呈中空的平面封闭图形，该平面封闭图形可以为规则的形状，例如环形、中空的矩形等，可选的，该平面封闭图形也可以为不规则形状。多个连续焊点331沿第一面313的周长方向间隔设置，或者说沿第一面313的长度延伸方向间隔设置。
由此，多个连续焊点331呈全包围式间隔排布在焊接面(即第一面313)上，从而可以利用连续焊点331吸收应力，从而减少连续焊点331所在位置的应力值，提升连接强度。
本申请的一些实施例中，多个焊点33还包括多个独立焊点332，多个独立焊点332分布于各连续焊点331围合形成的封闭区域内(即中空部分)，每一连续焊点331的封闭区域内还设置有至少一个通孔35，焊接过程中使用到的助焊剂可以从间隔排布的多个通孔35中释放，从而降低了焊盘上的锡发生迁移的概率，确保了成品的质量。当然，通孔35也可以开设在第二印刷电路板32上与第一面313正对的区域内，同样能够起到上述效果。
在一些实施例中，可选的，连续焊点331的内侧面呈波浪形。由于位于封闭区域的多个独立焊点332通常为圆形，因此，连续焊点331的波浪形内侧面可以保证与连续焊点331相邻的多个独立焊点332与连续焊点331之间的间隙34均相同，从而使得多个独立焊点332的尺寸可以设计成一致，其位置更加方便设置，并减少独立焊点332与连续焊点331发生误接触的可能。
在一些实施例中，与连续焊点331的波浪形内侧面相邻的多个独立焊点 332中，每一个独立焊点332与波浪形内侧面的一个凹陷部分正对，以确保与连续焊点331相邻的多个独立焊点332与连续焊点331之间的间隙34均相同。
请参考图10，图10为本申请实施例提供的一种连续焊点的示意图之六。如图10所示，本申请的一些实施例中，多个焊点33还包括第二焊点333，连续焊点331环绕在第二焊点333的外周，第二焊点333为目标信号的焊点。也就是说，目标信号为一重要信号，第二焊点333为重要信号线的焊点，通过将该第二焊点333周围的多个第一焊点做成一个整体形成连续焊点331，从而进一步吸收应力，从而改善内部的焊点的受力情况。可选的，位于第二焊点333外周的连续焊点331为接地焊点，以避免对第二焊点333上的目标信号产生干扰。
如图10所示，本申请实施例中的连续焊点331是在图9的连续焊点331的形状的基础上，进一步将内部的同类型的第一焊点连接为一个整体，从而进一步改善应力情况。
请参考图11至图13，图11为本申请实施例提供的一种连续焊点的示意图之七，图12为本申请实施例提供的一种连续焊点的示意图之八，图13为本申请实施例提供的一种连续焊点的示意图之九。本申请的一些实施例中，可选的，连续焊点331的形状为条形、T字形、Z字形、X字形、Y字形、L字形中的任一者，通过将多个原本互相独立的焊盘连为一体形成连续焊盘，在焊接时连续焊盘的上锡量有效增加，并且将同类型的多个第一焊点在焊接时连为一体，焊接位置处的应力得到有效改善，从而增强了第一印刷电路板31和第二印刷电路板32之间的连接强度，降低了摔落碰撞时第一印刷电路板31和第二印刷电路板32之间的焊点断开的情况的发生概率，提高了印刷电路板组件的可靠性。如图11所示，其中的连续焊点331为X字形，如图12所示，其中的连续焊点331呈倒置的T字形，如图13所示，其中的连续焊点331呈Z字形。当然，本申请实施例中的连续焊点331的形状不限于上述形状，还可以为其他规则或不规则的形状。
总之，在本申请实施例中，堆叠设置的第一印刷电路板和第二印刷电路板之间通过多个焊点实现电连接，将多个焊点中同类型的多个第一焊点连为一体构成连续焊点，可以有效改善焊点的应力情况，进而提高印刷电路板组件的可靠性。
本申请另一方面实施例还提供了一种电子设备，该电子设备包括如上述实施例中所述的印刷电路板组件，且能达到相同的技术效果，为避免重复，这里不再赘述。
本申请实施例中，上述电子设备可以是终端，也可以为除终端之外的其他设备。示例性的，电子设备可以为手机、平板电脑、笔记本电脑、掌上电脑、车载电子设备、移动上网装置(Mobile Internet Device，MID)、增强现实(augmented reality，AR)/虚拟现实(virtual reality，VR)设备、机器人、可穿戴设备、超级移动个人计算机(ultra-mobile personal computer，UMPC)、上网本或者个人数字助理(personal digital assistant，PDA)等，还可以为服务器、网络附属存储器(Network Attached Storage，NAS)、个人计算机(personal computer，PC)、电视机(television，TV)、柜员机或者自助机等，本申请实施例不作具体限定。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。此外，需要指出的是，本申请实施方式中的方法和装置的范围不限按示出或讨论的顺序来执行功能，还可包括根据所涉及的功能按基本同时的方式或按相反的顺序来执行功能，例如，可以按不同于所描述的次序来执行所描述的方法，并且还可以添加、省去、或组合各种步骤。另外，参照某些示例所描述的特征可在其他示例中被组合。
通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到上述实施例方法可借助软件加必需的通用硬件平台的方式来实现，当然也可以通过硬件，但很多情况下前者是更佳的实施方式。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分可以以计算机软件产品的形式体现出来，该计算机软件产品存储在一个存储介质(如ROM/RAM、磁碟、光盘)中，包括若干指令用以使得一台终端(可以是手机，计算机，服务器，或者网络设备等)执行本申请各个实施例所述的方法。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (11)

  1. 一种印刷电路板组件，包括堆叠设置的第一印刷电路板和第二印刷电路板，所述第一印刷电路板朝向所述第二印刷电路板的一侧设置有架板，所述第一印刷电路板通过多个焊点与所述第二印刷电路板电连接，所述多个焊点设置于所述架板的朝向所述第二印刷电路板的第一面上；
    所述多个焊点包括连续焊点，所述连续焊点包括连为一体的同类型的多个第一焊点，所述同类型的多个第一焊点为同一信号的焊点；
    所述第一面上设置有与所述连续焊点的位置和形状相对应的连续焊盘。
  2. 根据权利要求1所述的印刷电路板组件，其中，所述连续焊点的数量为两个以上，所述连续焊点呈条形，所述第一面呈中空的平面封闭图形，多个所述连续焊点沿所述第一面的内侧边的延伸方向间隔分布在所述第一面的内侧边缘以及沿所述第一面的外侧边的延伸方向间隔分布在所述第一面的外侧边缘。
  3. 根据权利要求1所述的印刷电路板组件，其中，所述连续焊点的数量为两个，所述连续焊点呈条形，所述第一面呈中空的平面封闭图形，其中一个所述连续焊点围设于所述第一面的内侧边缘，另一个所述连续焊点围设于所述第一面的外侧边缘。
  4. 根据权利要求3所述的印刷电路板组件，其中，所述第一面上还开设有多个通孔，所述多个通孔位于所述第一面的内侧边缘和所述外侧边缘之间的中间区域，且沿所述第一面的周长方向间隔设置。
  5. 根据权利要求2或3所述的印刷电路板组件，其中，所述多个焊点还包括多个独立焊点，所述多个独立焊点位于所述第一面的内侧边缘和所述外侧边缘之间的中间区域，位于所述第一面的内侧边缘的连续焊点以及位于所述第一面的外侧边缘的连续焊点的相向的两个侧面均呈波浪形。
  6. 根据权利要求1所述的印刷电路板组件，其中，所述连续焊点的数量 为多个，所述连续焊点在所述第一面的正投影为封闭图形，所述第一面呈中空的平面封闭图形，多个所述连续焊点沿所述第一面的周长方向间隔设置。
  7. 根据权利要求6所述的印刷电路板组件，其中，所述多个焊点还包括多个独立焊点，所述多个独立焊点分布于所述连续焊点的封闭区域，所述连续焊点的封闭区域内还设置有通孔，所述连续焊点的内侧面呈波浪形。
  8. 根据权利要求1所述的印刷电路板组件，其中，所述第一印刷电路板和所述架板一体成型。
  9. 根据权利要求1所述的印刷电路板组件，其中，所述连续焊点的形状为条形、T字形、Z字形、X字形、Y字形、L字形中的任一者。
  10. 根据权利要求1所述的印刷电路板组件，其中，所述多个焊点还包括第二焊点，所述连续焊点环绕在所述第二焊点的外周，所述第二焊点为目标信号的焊点。
  11. 一种电子设备，包括如权利要求1-10中任一项所述的印刷电路板组件。
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