WO2023125347A1

WO2023125347A1 - Printed circuit board assembly and electronic device

Info

Publication number: WO2023125347A1
Application number: PCT/CN2022/141739
Authority: WO
Inventors: 胡坤; 雷毅; 刘洋
Original assignee: 维沃移动通信有限公司
Priority date: 2021-12-29
Filing date: 2022-12-26
Publication date: 2023-07-06
Also published as: CN114189988A

Abstract

The present application belongs to the technical field of circuit boards, and discloses a printed circuit board assembly and an electronic device. The printed circuit board assembly comprises a first printed circuit board and a second printed circuit board which are stacked, a frame plate is arranged on the side of the first printed circuit board facing the second printed circuit board, the frame plate is enclosed to form a recessed structure, and the first printed circuit board is electrically connected to the second printed circuit board by means of a plurality of solder joints; the plurality of solder joints are arranged on a first surface of the frame plate facing the second printed circuit board, the plurality of solder joints comprise continuous solder joints, the continuous solder joints comprise a plurality of first solder joints of the same type connected as a whole, and the plurality of first solder joints of the same type are solder joints of the same signal; and the first surface is provided with continuous bonding pads corresponding to the positions and shapes of the continuous solder joints.

Description

A printed circuit board assembly and electronic device

Cross References to Related Applications

This application claims priority to Chinese Patent Application No. 202111637294.5 filed in China on December 29, 2021, the entire contents of which are hereby incorporated by reference.

technical field

The application belongs to the technical field of circuit boards, and in particular relates to a printed circuit board assembly and electronic equipment.

Background technique

With the development of printed circuit board manufacturing technology, a Z-direction stacking technology, namely Cavity technology, has emerged. This technology combines the shelf board and the intermediate connection board together, and the connection between this style of Cavity board and other printed circuit boards Small solder joint size saves space. However, the adhesion/stress between the Cavity board and other printed circuit boards has also changed, and the solder joints are easy to crack during the drop process, and the contact is abnormal, which leads to the failure of related functions.

Contents of the invention

The purpose of the embodiments of the present application is to provide a printed circuit board assembly and electronic equipment, which can solve the problems of poor adhesion between the Cavity board and other printed circuit boards in the related art, and easy cracking of solder joints, which will lead to related function failures.

In a first aspect, an embodiment of the present application provides a printed circuit board assembly, which includes:

The first printed circuit board and the second printed circuit board are stacked, the side of the first printed circuit board facing the second printed circuit board is provided with a shelf board, and the shelf board surrounds and forms a recessed structure, the The first printed circuit board is electrically connected to the second printed circuit board through a plurality of solder joints;

The plurality of solder joints are disposed on the first surface of the shelf plate facing the second printed circuit board, the plurality of solder joints include continuous solder joints, and the continuous solder joints include the same type of multiple first solder joints of the same type, the multiple first solder joints of the same type are solder joints of the same signal;

Continuous welding pads corresponding to the positions and shapes of the continuous welding spots are arranged on the first surface.

Optionally, the number of the continuous welding spots is more than two, the continuous welding spots are strip-shaped, the first surface is a hollow plane closed figure, and a plurality of the continuous welding spots along the first surface The extension direction of the inner edge of the first surface is distributed at intervals on the inner edge of the first surface and the extension direction of the outer edge of the first surface is distributed at intervals on the outer edge of the first surface.

Optionally, the number of the continuous welding spots is two, the continuous welding spots are strip-shaped, and the first surface is a hollow planar closed figure, wherein one of the continuous welding spots is surrounded by the first The inner edge of the first surface, and the other continuous welding point is surrounded by the outer edge of the first surface.

Optionally, a plurality of through holes are also opened on the first surface, the plurality of through holes are located in the middle area between the inner edge and the outer edge of the first surface, and along the first The interval setting of the perimeter direction of the face.

Optionally, the plurality of welding spots further include a plurality of independent welding spots, the plurality of independent welding spots are located in the middle area between the inner edge and the outer edge of the first surface, and are located in the first The two opposite sides of the continuous welding spot on the inner edge of the surface and the continuous welding spot on the outer edge of the first surface are wave-shaped.

Optionally, the number of the continuous welding spots is multiple, the orthographic projection of the continuous welding spots on the first surface is a closed figure, the first surface is a hollow plane closed figure, and the plurality of continuous welding spots The welding spots are arranged at intervals along the circumferential direction of the first surface.

Optionally, the plurality of solder joints further include a plurality of independent solder joints, the multiple independent solder joints are distributed in the closed area of the continuous solder joints, and through holes are also arranged in the closed area of the continuous solder joints , the inner surface of the continuous welding spot is wavy.

Optionally, the shape of the continuous welding spot is any one of strip shape, T shape, Z shape, X shape, Y shape, and L shape.

Optionally, the plurality of soldering points further include a second soldering point, the continuous soldering point surrounds an outer periphery of the second soldering point, and the second soldering point is a target signal soldering point.

Optionally, the first printed circuit board and the frame board are integrally formed.

In a second aspect, an embodiment of the present application provides an electronic device, which includes the printed circuit board assembly as described in the first aspect.

In the embodiment of the present application, the stacked first printed circuit board and the second printed circuit board are electrically connected through a plurality of solder joints, and multiple first solder joints of the same type among the multiple solder joints are integrated into one The formation of continuous solder joints can effectively improve the stress condition of the solder joints, thereby improving the reliability of the printed circuit board assembly.

Description of drawings

FIG. 1 is a schematic diagram of a stack of printed circuit boards in the related art;

FIG. 2 is a schematic diagram of stacking another printed circuit board in the related art;

FIG. 3 is a schematic structural diagram of a printed circuit board assembly provided in an embodiment of the present application;

FIG. 4 is a schematic diagram of multiple solder joints on the first surface provided by the embodiment of the present application;

Fig. 5 is one of the schematic diagrams of a continuous welding spot provided by the embodiment of the present application;

Figure 6 is the second schematic diagram of a continuous welding spot provided by the embodiment of the present application;

Fig. 7 is the third schematic diagram of a continuous welding spot provided by the embodiment of the present application;

Fig. 8 is the fourth schematic diagram of a continuous welding spot provided by the embodiment of the present application;

Fig. 9 is the fifth schematic diagram of a continuous welding spot provided by the embodiment of the present application;

Figure 10 is the sixth schematic diagram of a continuous welding spot provided by the embodiment of the present application;

Figure 11 is the seventh schematic diagram of a continuous welding spot provided by the embodiment of the present application;

Figure 12 is the eighth schematic diagram of a continuous welding spot provided by the embodiment of the present application;

FIG. 13 is a ninth schematic diagram of a continuous welding spot provided by the embodiment of the present application.

Detailed ways

The following will clearly describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, but not all of them. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in this application belong to the protection scope of this application.

The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It should be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequences other than those illustrated or described herein, and that references to "first," "second," etc. distinguish Objects are generally of one type, and the number of objects is not limited. For example, there may be one or more first objects. In addition, "and/or" in the specification and claims means at least one of the connected objects, and the character "/" generally means that the related objects are an "or" relationship.

The printed circuit board assembly and the electronic device provided by the embodiments of the present application will be described in detail below through specific embodiments and application scenarios with reference to the accompanying drawings.

Please refer to FIG. 1 , which is a schematic diagram of a stack of printed circuit boards in the related art. As shown in Figure 1, in a stacking mode of printed circuit boards, the radio frequency frame board 11, the intermediate connection board 12, and the main board 13 are stacked and arranged, and the radio frequency frame board 11 and the main board 13 are connected through the intermediate connection board 12, that is The two ends of the intermediate connection plate 13 are respectively welded to the radio frequency frame 11 and the main board 13, and a plurality of devices 14 are arranged on the surface of the side of the radio frequency frame 11 away from the intermediate connection plate 12, and the plurality of devices 14 are covered by a shielding cover 15 Shielding, a plurality of devices 14 are also arranged on the side surface of the main board 13 away from the intermediate connection board 12, and the plurality of devices 14 are shielded by another shielding case 15 cover, while on the side of the main board 13 facing the radio frequency shelf 11 On the surface, a plurality of devices 14 are also arranged in the enclosed area of the intermediate connecting board 13 . Such a stacking method can be called a "sandwich" stacking, and the Z-direction space can be used to reduce the plane size of the printed circuit board.

Please refer to FIG. 2 , which is a schematic diagram of another printed circuit board stack in the related art. As shown in Figure 2, in another stacking method of printed circuit boards, the radio frequency shelf board and the intermediate connection board are directly integrated to form a complete cavity board 21, cativy, that is, holes, holes, that is, on the printed circuit board A concave structure is formed on the surface of the cavity board 21 and the main board 23 are stacked, and electrical connection is realized between the cavity board 21 and the main board 23 by welding, and a plurality of devices 24 are arranged on the side surface of the cavity board 21 away from the main board 23, and a plurality of The device 24 is shielded by the cover of the shielding case 25, and a plurality of devices 24 are also arranged on the side surface of the main board 23 away from the cavity board 21. On one side surface of the cavity board 21 , a plurality of devices 24 are also arranged in the enclosed area of the cavity board 21 . Compared with the "sandwich" stacking method, this stacking method has smaller solder joints and can save space. However, due to the reduction in the size of the solder joints, the amount of tin on it will also decrease, and the adhesion between the cavity board 21 and the main board 23 will also change. When dropped, its solder joints are prone to cracking, resulting in poor contact, which in turn leads to failure of corresponding functions.

Therefore, please refer to FIG. 3 , which is a schematic structural diagram of a printed circuit board assembly provided by an embodiment of the present application. As shown in FIG. 3 , the embodiment of the present application provides a printed circuit board assembly, which includes a first printed circuit board 31 and a second printed circuit board 32 arranged in a stack, wherein the first printed circuit board 31 A frame plate 311 is provided on one side facing the second printed circuit board 32, and the frame plate 311 surrounds and forms a recessed structure 312; optionally, the shape of the frame plate 311 can be a regular shape, such as a cylinder, and the frame plate The enclosed area of the plate 311 is the cylindrical hollow area, which is the concave structure 312. Alternatively, the cross-sectional shape of the shelf plate 311 is a hollow rectangle, and the enclosed area of the shelf plate 311 is in the shape of a cube, namely is a concave structure 312; optionally, the shape of the shelf 311 may also be an irregular shape, for example, the cross-sectional shape of the shelf 311 is a hollow and irregular closed figure.

Please refer to FIG. 4 , which is a schematic diagram of multiple solder joints on the first surface provided by an embodiment of the present application. As shown in Figures 3 and 4, the first printed circuit board 31 is electrically connected to the second printed circuit board 32 through a plurality of solder joints 33, and the plurality of solder joints 33 are arranged on the second printed circuit board of the shelf plate 311. On the first surface 313 of the first printed circuit board 32 , that is to say, the frame board 311 of the first printed circuit board 31 and the second printed circuit board 32 are soldered and fixed. Among them, the plurality of solder joints 33 include continuous solder joints 331, and the continuous solder joints 331 include a plurality of first solder joints of the same type connected together. The so-called multiple first solder joints of the same type are used to connect the same signal. The first surface 313 is provided with pads corresponding to the positions and shapes of the plurality of solder joints 33 one by one, that is to say, the first surface 313 is also provided with the positions and shapes of the continuous solder joints 331 The corresponding continuous pads, the so-called continuous pads, are composed of a plurality of first pads that are originally independent of each other, and these first pads correspond to connecting the same signal.

In some embodiments of the present application, optionally, the first printed circuit board 31 and the shelf board 311 are integrally formed, and both may correspond to the stacking style of the cavity board in FIG. 2 , in the case of the cavity board, the first printed circuit board The frame plate 311 of 31 is a skeleton frame plate, that is, the frame plate 311 is in the shape of a bone position protrusion.

In other embodiments of the present application, optionally, the first printed circuit board 31 and the frame plate 311 are separately provided, and the two ends of the frame plate 311 are respectively connected to the first printed circuit board 31 and the first printed circuit board 31 through a plurality of first solder joints 33 and The second printed circuit board 32 is electrically connected, ie corresponds to the stacking pattern in FIG. 1 .

Compared with the way in which each solder joint is independently arranged in the prior art, in the embodiment of the present application, a plurality of originally independent pads are connected together to form a continuous pad, and the amount of tin on the continuous pad during welding Effectively increase, and connect a plurality of first solder joints of the same type into one during soldering, the stress at the soldering position is effectively improved, thereby enhancing the connection between the first printed circuit board 31 and the second printed circuit board 32 The strength reduces the probability of disconnection of solder joints between the first printed circuit board 31 and the second printed circuit board 32 when falling and collides, and improves the reliability of the printed circuit board assembly.

Thus, in the embodiment of the present application, the first printed circuit board 31 and the second printed circuit board 32 that are stacked are electrically connected through a plurality of solder joints 33, and multiple solder joints 33 of the same type The first solder joints are connected to form a continuous solder joint 331, which can effectively improve the stress condition of the solder joints, thereby improving the reliability of the printed circuit board assembly.

Please refer to FIG. 5 . FIG. 5 is one of the schematic diagrams of a continuous welding spot provided by the embodiment of the present application. As shown in FIG. 5 , in some embodiments of the present application, the number of continuous solder joints 331 is more than two, and the continuous solder joints 331 are strip-shaped, and the first surface of the shelf board 311 on the first printed circuit board 31 313 is a hollow plane closed figure, which may be a regular shape, such as a ring, a hollow rectangle, etc. Optionally, the plane closed figure may also be an irregular shape. The first surface 313 includes an inner side and an outer side, and the enclosed area of the inner side is the hollow part of the first surface 313, wherein a plurality of continuous welding spots 331 are along the inner side of the first surface 313. The extension direction is distributed at intervals on the inner edge of the first surface 313 , and is distributed at intervals along the extension direction of the outer edge of the first surface 313 on the outer edge of the first surface 313 .

Thus, a plurality of continuous welding spots 331 are arranged in sections on the inner edge and outer edge of the welding surface (i.e., the first surface 313), so that the continuous welding spots 331 can be used to absorb stress, thereby reducing the position of the continuous welding spots 331. The stress value improves the connection strength; and, because the continuous solder joints 331 are arranged at intervals, the flux used in the welding process can be released from the gap 34 between two adjacent continuous solder joints 331, thereby reducing the The probability of tin migration on the pad ensures the quality of the finished product.

In some embodiments of the present application, the plurality of welding spots 33 further include a plurality of independent welding spots 332, and the plurality of independent welding spots 332 are located in the middle area between the inner side and the outer side of the first surface 313, and, The two opposite sides of the continuous welding spot 331 located at the inner edge of the first surface 313 and the continuous welding spot 331 located at the outer edge of the first surface 313 are wavy, that is to say, the inner edge of the first surface 313 The side of the continuous welding spot 331 facing the continuous welding spot 331 located on the outer edge of the first surface 313 is wavy, while the continuous welding spot 331 located on the outer edge of the first surface 313 is facing the inner edge of the first surface 313 The side surfaces of the continuous solder joints 331 are also wavy. Since the plurality of independent welding spots 332 located in the middle area are generally circular, the wave-shaped side of the continuous welding spot 331 can ensure the contact between the plurality of independent welding spots 332 adjacent to the continuous welding spot 331 and the continuous welding spot 331. The gaps 34 are all the same, so that the dimensions of the plurality of independent solder joints 332 can be designed to be consistent, their positions are more convenient to set, and the possibility of false contact between the independent solder joints 332 and the continuous solder joints 331 is reduced.

In some embodiments, among the plurality of independent welding spots 332 adjacent to the wavy side of the continuous welding spot 331, each independent welding spot 332 is directly opposite to a concave portion of the wavy side, so as to ensure that the continuous welding spot 331 The gaps 34 between the multiple adjacent independent welding spots 332 and the continuous welding spots 331 are the same.

Please refer to FIG. 6 . FIG. 6 is the second schematic diagram of continuous solder joints provided by the embodiment of the present application. As shown in Figure 6, in other embodiments of the present application, the number of continuous welding spots 331 is two, the continuous welding spots 331 are strip-shaped, and the first surface 313 is a hollow plane closed figure, which can be A regular shape, such as a ring, a hollow rectangle, etc. Optionally, the planar closed figure can also be an irregular shape. The first surface 313 includes an inner side and an outer side, and the enclosed area of the inner side is the hollow part of the first side 313, wherein a continuous solder joint 331 is surrounded by the inner side edge of the first side 313, and the other A continuous solder joint 331 is disposed around the outer edge of the first surface 313 . Exemplarily, one of the continuous welding spots 331 is arranged along the extension direction of the inner side of the first surface 313, and is connected end to end to form a circle, and the other continuous welding spot 331 is arranged along the extension direction of the outer side of the first surface 313. Arranged in the direction of extension, and connected end to end to form a circle.

Thus, the two continuous welding spots 331 are arranged in a circle on the inner edge and the outer edge of the welding surface (i.e. the first surface 313), so that the continuous welding spots 331 can be used to absorb stress, thereby reducing the stress at the position of the continuous welding spots 331. Stress value, improve connection strength.

In some embodiments of the present application, a plurality of through holes 35 are also opened on the first surface 313, and the plurality of through holes 35 are located in the middle area between the inner edge and the outer edge of the first surface 313, and along the first surface 313 are arranged at intervals along the circumferential direction of the first surface 313 , or in other words, arranged at intervals along the extending direction of the length of the first surface 313 . The flux used in the soldering process can be released from the plurality of through holes 35 arranged at intervals, thereby reducing the probability of migration of tin on the pad and ensuring the quality of the finished product. Of course, the through hole 35 can also be opened in the area of the second printed circuit board 32 facing the first surface 313 , which can also achieve the above effect.

Please refer to FIG. 7 and FIG. 8 , FIG. 7 is the third schematic diagram of a continuous welding spot provided by the embodiment of the present application, and FIG. 8 is the fourth schematic diagram of a continuous welding spot provided by the embodiment of the present application. As shown in Fig. 7 and Fig. 8, in some embodiments of the present application, the plurality of welding spots 33 also include a second welding spot 333, and the continuous welding spots 331 are located on the periphery of the second welding spot 333, and the second welding spot 333 is the target Signal solder joints. That is to say, the target signal is an important signal, and the second welding spot 333 is a welding spot of an important signal line. By making a plurality of first welding spots around the second welding spot 333 into a whole to form a continuous welding spot 331, Thereby further absorbing the stress, thereby improving the stress condition of the internal solder joints. Optionally, the continuous solder joints 331 located on the outer periphery of the second solder joints 333 are ground solder joints, so as to avoid interference to the target signal on the second solder joints 333 .

As shown in Figures 7 and 8, the continuous solder joint 331 in the embodiment of the present application is based on the shape of the continuous solder joint 331 in Figure 6, and further connects the first internal solder joints of the same type as a whole, This further improves the stress situation.

Please refer to FIG. 9 . FIG. 9 is a fifth schematic diagram of a continuous welding spot provided by the embodiment of the present application. As shown in FIG. 9 , in other embodiments of the present application, the number of continuous welding spots 331 is multiple, and the orthographic projection of the continuous welding spots 331 on the first surface 313 is a closed figure, which can be a regular shape, Such as triangle, rectangle, ellipse, pentagon, etc., also can be irregular shapes, that is, as long as they are surrounded by a circle. The first surface 313 is a hollow plane closed figure, and the plane closed figure can be a regular shape, such as a ring, a hollow rectangle, etc. Optionally, the plane closed figure can also be an irregular shape. A plurality of continuous welding spots 331 are arranged at intervals along the circumferential direction of the first surface 313 , or in other words, arranged at intervals along the length extension direction of the first surface 313 .

Thus, a plurality of continuous welding spots 331 are arranged at intervals on the welding surface (i.e. the first surface 313) in a fully enclosed manner, so that the continuous welding spots 331 can be used to absorb stress, thereby reducing the stress value at the position of the continuous welding spots 331, Improve connection strength.

In some embodiments of the present application, the plurality of welding spots 33 also includes a plurality of independent welding spots 332, and the plurality of independent welding spots 332 are distributed in the closed area (ie, the hollow part) formed by each continuous welding spot 331, each At least one through hole 35 is also arranged in the closed area of the continuous solder joint 331, and the flux used in the soldering process can be released from a plurality of through holes 35 arranged at intervals, thereby reducing the possibility of migration of tin on the pad. Probability, ensuring the quality of the finished product. Of course, the through hole 35 can also be opened in the area of the second printed circuit board 32 facing the first surface 313 , which can also achieve the above effect.

In some embodiments, optionally, the inner surface of the continuous welding spot 331 is wavy. Since the plurality of independent welding spots 332 located in the closed area are generally circular, the wave-shaped inner surface of the continuous welding spot 331 can ensure that the gap between the plurality of independent welding spots 332 adjacent to the continuous welding spot 331 and the continuous welding spot 331 The gaps 34 are the same, so that the dimensions of the multiple independent solder joints 332 can be designed to be consistent, their positions are more convenient to set, and the possibility of false contact between the independent solder joints 332 and the continuous solder joints 331 is reduced.

In some embodiments, among the plurality of independent welding spots 332 adjacent to the wavy inner surface of the continuous welding spot 331, each independent welding spot 332 is directly opposed to a concave part of the wavy inner surface, so as to ensure that it is compatible with the continuous welding spot 331. The gaps 34 between the plurality of independent welding spots 332 adjacent to the point 331 and the continuous welding spots 331 are all the same.

Please refer to FIG. 10 . FIG. 10 is a sixth schematic diagram of a continuous welding spot provided by an embodiment of the present application. As shown in FIG. 10 , in some embodiments of the present application, the plurality of welding spots 33 further include a second welding spot 333, and the continuous welding spots 331 surround the periphery of the second welding spots 333, and the second welding spots 333 are the target signal. solder joints. That is to say, the target signal is an important signal, and the second welding spot 333 is a welding spot of an important signal line. By making a plurality of first welding spots around the second welding spot 333 into a whole to form a continuous welding spot 331, Thereby further absorbing the stress, thereby improving the stress condition of the internal solder joints. Optionally, the continuous welding spot 331 located on the outer periphery of the second welding spot 333 is a grounding welding spot, so as to avoid interference to the target signal on the second welding spot 333 .

As shown in Figure 10, the continuous welding spot 331 in the embodiment of the present application is based on the shape of the continuous welding spot 331 in Figure 9, and further connects the first internal welding spots of the same type as a whole, thereby further improving stress situation.

Please refer to Figure 11 to Figure 13, Figure 11 is the seventh schematic diagram of a continuous solder joint provided by the embodiment of the present application, Figure 12 is the eighth schematic diagram of a continuous solder joint provided by the embodiment of the present application, Figure 13 is the The ninth schematic diagram of a continuous welding spot provided in the embodiment of the application. In some embodiments of the present application, optionally, the shape of the continuous welding spot 331 is any one of strip shape, T shape, Z shape, X shape, Y shape, and L shape. The pads are connected together to form a continuous pad, the amount of tin on the continuous pad is effectively increased during welding, and multiple first solder joints of the same type are connected into one during welding, the stress at the welding position is effectively improved, Therefore, the connection strength between the first printed circuit board 31 and the second printed circuit board 32 is enhanced, and the situation of disconnection of solder joints between the first printed circuit board 31 and the second printed circuit board 32 during a fall and collision is reduced probability of occurrence, improving the reliability of printed circuit board assemblies. As shown in FIG. 11 , the continuous solder joints 331 are in an X shape, as shown in FIG. 12 , the continuous solder joints 331 are in an inverted T shape, and as shown in FIG. 13 , the continuous solder joints 331 are in a Z shape. Certainly, the shape of the continuous welding spot 331 in the embodiment of the present application is not limited to the above shape, and may also be other regular or irregular shapes.

In short, in the embodiment of the present application, the first printed circuit board and the second printed circuit board that are stacked are electrically connected through a plurality of solder joints, and multiple first solder joints of the same type among the multiple solder joints are connected to each other. Forming a continuous solder joint as a whole can effectively improve the stress condition of the solder joint, thereby improving the reliability of the printed circuit board assembly.

Another aspect of the present application provides an electronic device, the electronic device includes the printed circuit board assembly as described in the above embodiments, and can achieve the same technical effect. To avoid repetition, details are not repeated here.

In the embodiment of the present application, the foregoing electronic device may be a terminal, or may be other devices except the terminal. Exemplarily, the electronic device can be a mobile phone, a tablet computer, a notebook computer, a handheld computer, a vehicle electronic device, a mobile Internet device (Mobile Internet Device, MID), an augmented reality (augmented reality, AR)/virtual reality (virtual reality, VR) ) equipment, robots, wearable devices, ultra-mobile personal computer (ultra-mobile personal computer, UMPC), netbook or personal digital assistant (personal digital assistant, PDA), etc., can also serve as server, network attached storage (Network Attached Storage, NAS), personal computer (personal computer, PC), television (television, TV), teller machine, or self-service machine, etc., which are not specifically limited in this embodiment of the present application.

It should be noted that, in this document, the term "comprising", "comprising" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article or apparatus comprising a set of elements includes not only those elements, It also includes other elements not expressly listed, or elements inherent in the process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising that element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved. Functions are performed, for example, the described methods may be performed in an order different from that described, and various steps may also be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

Through the description of the above embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus a necessary general-purpose hardware platform, and of course also by hardware, but in many cases the former is better implementation. Based on such an understanding, the technical solution of the present application can be embodied in the form of computer software products, which are stored in a storage medium (such as ROM/RAM, magnetic disk, etc.) , optical disc), including several instructions to enable a terminal (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in various embodiments of the present application.

The embodiments of the present application have been described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementations. The above-mentioned specific implementations are only illustrative and not restrictive. Those of ordinary skill in the art will Under the inspiration of this application, without departing from the purpose of this application and the scope of protection of the claims, many forms can also be made, all of which belong to the protection of this application.

Claims

A printed circuit board assembly, comprising a first printed circuit board and a second printed circuit board stacked, the first printed circuit board is provided with a shelf plate on the side facing the second printed circuit board, the first printed circuit board The printed circuit board is electrically connected to the second printed circuit board through a plurality of welding points, and the plurality of welding points are arranged on the first surface of the frame plate facing the second printed circuit board;

The multiple solder joints include continuous solder joints, the continuous solder joints include a plurality of first solder joints of the same type connected together, and the multiple first solder joints of the same type are solder joints of the same signal;

Continuous welding pads corresponding to the positions and shapes of the continuous welding spots are arranged on the first surface.
The printed circuit board assembly according to claim 1, wherein the number of the continuous solder joints is more than two, the continuous solder joints are strip-shaped, the first surface is a hollow plane closed figure, and a plurality of The continuous welding spots are distributed on the inner edge of the first surface at intervals along the extending direction of the inner edge of the first surface and distributed on the first surface at intervals along the extending direction of the outer edge of the first surface outer edge of .
The printed circuit board assembly according to claim 1, wherein the number of the continuous solder joints is two, the continuous solder joints are strip-shaped, the first surface is a hollow plane closed figure, one of the The continuous welding spot is arranged around the inner edge of the first surface, and another continuous welding spot is arranged around the outer edge of the first surface.
The printed circuit board assembly according to claim 3, wherein a plurality of through holes are formed on the first surface, and the plurality of through holes are located between the inner edge and the outer edge of the first surface middle area, and arranged at intervals along the circumferential direction of the first surface.
The printed circuit board assembly according to claim 2 or 3, wherein the plurality of solder joints further comprises a plurality of independent solder joints, the plurality of independent solder joints are located on the inner edge of the first surface and the outer side In the middle area between the edges, the two opposite sides of the continuous welding spot located on the inner edge of the first surface and the continuous welding spot located on the outer edge of the first surface are all wavy.
The printed circuit board assembly according to claim 1, wherein the number of the continuous solder joints is multiple, the orthographic projection of the continuous solder joints on the first surface is a closed figure, and the first surface is hollow A plane closed figure, a plurality of the continuous welding spots are arranged at intervals along the circumferential direction of the first surface.
The printed circuit board assembly according to claim 6, wherein the plurality of solder joints further include a plurality of independent solder joints, the plurality of independent solder joints are distributed in the enclosed area of the continuous solder joints, and the continuous solder joints Through holes are also provided in the closed area of the spot, and the inner surface of the continuous solder spot is wavy.
The printed circuit board assembly according to claim 1, wherein the first printed circuit board and the shelf board are integrally formed.
The printed circuit board assembly according to claim 1, wherein the shape of the continuous solder joint is any one of a strip shape, a T shape, a Z shape, an X shape, a Y shape, and an L shape.
The printed circuit board assembly according to claim 1, wherein the plurality of solder joints further include a second solder joint, the continuous solder joints surround the outer periphery of the second solder joints, and the second solder joints are Solder spot for target signal.
An electronic device, comprising the printed circuit board assembly according to any one of claims 1-10.