CN114189988A - Printed circuit board assembly and electronic equipment - Google Patents
Printed circuit board assembly and electronic equipment Download PDFInfo
- Publication number
- CN114189988A CN114189988A CN202111637294.5A CN202111637294A CN114189988A CN 114189988 A CN114189988 A CN 114189988A CN 202111637294 A CN202111637294 A CN 202111637294A CN 114189988 A CN114189988 A CN 114189988A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- continuous
- welding
- board assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 claims abstract description 157
- 229910000679 solder Inorganic materials 0.000 claims description 55
- 238000000034 method Methods 0.000 description 14
- 238000005476 soldering Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000001788 irregular Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application discloses printed circuit board assembly and electronic equipment belongs to circuit board technical field. The printed circuit board assembly comprises a first printed circuit board and a second printed circuit board which are arranged in a stacked mode, a frame plate is arranged on one side, facing the second printed circuit board, of the first printed circuit board, the frame plate surrounds to form a concave structure, and the first printed circuit board is electrically connected with the second printed circuit board through a plurality of welding points; the plurality of welding points are arranged on the first surface of the frame plate facing the second printed circuit board, the plurality of welding points comprise continuous welding points, the continuous welding points comprise a plurality of first welding points which are connected into a whole and are of the same type, and the plurality of first welding points of the same type are welding points of the same signal; and the first surface is provided with continuous welding pads corresponding to the positions and the shapes of the continuous welding points.
Description
Technical Field
The application belongs to the technical field of circuit boards, and particularly relates to a printed circuit board assembly and an electronic device.
Background
With the development of the manufacturing technology of the printed circuit board, a Z-stacking technology, namely a Cavity technology, appears, the Cavity technology combines the frame plate and the intermediate connecting plate together, and the size of the connecting welding spot between the Cavity plate and other printed circuit boards is small, so that the space can be saved. But the adhesive force/stress between the Cavity board and other printed circuit boards also changes, so that welding spots are easy to crack in the falling process, and the contact is abnormal, thereby causing related functional failures.
Disclosure of Invention
An object of the embodiments of the present application is to provide a printed circuit board assembly and an electronic device, which can solve the problems in the related art that an adhesion force between a Cavity board and other printed circuit boards is poor, and a solder joint is easy to crack, thereby causing related functional failures.
In a first aspect, an embodiment of the present application provides a printed circuit board assembly, including:
the circuit board comprises a first printed circuit board and a second printed circuit board which are arranged in a stacked mode, wherein a frame plate is arranged on one side, facing the second printed circuit board, of the first printed circuit board, the frame plate surrounds to form a concave structure, and the first printed circuit board is electrically connected with the second printed circuit board through a plurality of welding points;
the plurality of welding points are arranged on the first surface of the frame plate facing the second printed circuit board, the plurality of welding points comprise continuous welding points, the continuous welding points comprise a plurality of first welding points which are connected into a whole and are of the same type, and the plurality of first welding points of the same type are welding points of the same signal;
and the first surface is provided with continuous welding pads corresponding to the positions and the shapes of the continuous welding points.
Optionally, the number of continuous welding spots is more than two, continuous welding spots are in the shape of a strip, the first surface is a hollow plane closed figure, and the continuous welding spots are distributed at intervals along the extending direction of the inner side edge of the first surface at the inner side edge of the first surface and along the extending direction of the outer side edge of the first surface at intervals.
Optionally, the number of the continuous welding spots is two, the continuous welding spots are strip-shaped, the first surface is a hollow plane closed figure, one of the continuous welding spots is arranged around the inner side edge of the first surface, and the other continuous welding spot is arranged around the outer side edge of the first surface.
Optionally, the first surface is further provided with a plurality of through holes, and the through holes are located in a middle area between an inner side edge and an outer side edge of the first surface and are arranged at intervals along a circumferential direction of the first surface.
Optionally, the plurality of welding spots further include a plurality of independent welding spots, the plurality of independent welding spots are located in a middle area between the inner side edge and the outer side edge of the first surface, and the two opposite side surfaces of the continuous welding spot located at the inner side edge of the first surface and the continuous welding spot located at the outer side edge of the first surface are both wavy.
Optionally, the number of the continuous welding spots is multiple, the orthographic projection of the continuous welding spots on the first surface is a closed figure, the first surface is a hollow plane closed figure, and the continuous welding spots are arranged at intervals along the circumferential direction of the first surface.
Optionally, the plurality of welding points further include a plurality of independent welding points, the plurality of independent welding points are distributed in the closed area of the continuous welding point, through holes are further formed in the closed area of the continuous welding point, and the inner side surface of the continuous welding point is wavy.
Optionally, the shape of the continuous welding spot is any one of a strip shape, a T shape, a Z shape, an X shape, a Y shape, and an L shape.
Optionally, the plurality of solder points further include a second solder point, the continuous solder point surrounds the periphery of the second solder point, and the second solder point is a solder point of the target signal.
Optionally, the first printed circuit board and the chassis are integrally formed.
In a second aspect, embodiments of the present application provide an electronic device including a printed circuit board assembly as described in the first aspect.
In the embodiment of the application, the first printed circuit board and the second printed circuit board which are stacked are electrically connected through the plurality of welding spots, and the plurality of first welding spots of the same type in the plurality of welding spots are connected into a whole to form the continuous welding spot, so that the stress condition of the welding spot can be effectively improved, and the reliability of the printed circuit board assembly is further improved.
Drawings
Fig. 1 is a schematic diagram of a printed circuit board stack in the related art;
FIG. 2 is a schematic view of another printed circuit board stack in the related art;
fig. 3 is a schematic structural diagram of a printed circuit board assembly according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of a plurality of pads on a first side according to an embodiment of the present disclosure;
FIG. 5 is a schematic view of a continuous welding spot according to an embodiment of the present disclosure;
FIG. 6 is a second schematic view of a continuous solder joint provided in an embodiment of the present application;
FIG. 7 is a third schematic view of a continuous solder joint according to an embodiment of the present invention;
FIG. 8 is a fourth schematic view of a continuous solder joint according to an embodiment of the present disclosure;
FIG. 9 is a fifth exemplary diagram of a continuous welding spot according to an embodiment of the present disclosure;
FIG. 10 is a sixth schematic view of a continuous solder joint provided in an embodiment of the present application;
FIG. 11 is a seventh schematic view of a continuous weld provided in accordance with an embodiment of the present application;
FIG. 12 is an eighth schematic view of a continuous solder joint provided in the embodiments of the present application;
fig. 13 is a ninth schematic view of a continuous solder joint provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present disclosure.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The printed circuit board assembly and the electronic device provided by the embodiments of the present application are described in detail with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
Referring to fig. 1, fig. 1 is a schematic diagram of a printed circuit board stack in the related art. As shown in fig. 1, in a stacking manner of the printed circuit boards, a radio frequency chassis 11, an intermediate connecting plate 12, and a main board 13 are stacked, the radio frequency chassis 11 and the main board 13 are connected by the intermediate connecting plate 12, that is, two ends of the intermediate connecting plate 13 are respectively welded with the radio frequency chassis 11 and the main board 13, a plurality of devices 14 are disposed on a side surface of the radio frequency chassis 11 away from the intermediate connecting plate 12, the plurality of devices 14 are shielded by a shielding cover 15, a plurality of devices 14 are also disposed on a side surface of the main board 13 away from the intermediate connecting plate 12, the plurality of devices 14 are shielded by another shielding cover 15, and a plurality of devices 14 are also disposed in a surrounding area of the intermediate connecting plate 13 on a side surface of the main board 13 toward the radio frequency chassis 11. Such a stacking approach is a "sandwich" stack, which can take advantage of the Z-space to reduce the planar size of the printed circuit board.
Referring to fig. 2, fig. 2 is a schematic diagram of another printed circuit board stack in the related art. As shown in fig. 2, in another stacking manner of the pcb, the rf chassis and the intermediate connecting board are directly and integrally designed to form a complete cavity board 21, a cavity, i.e. a hole, i.e. a recessed structure is formed on the surface of the pcb, the cavity board 21 and the motherboard 23 are stacked, the cavity board 21 and the motherboard 23 are electrically connected by soldering, a plurality of devices 24 are disposed on a side surface of the cavity board 21 facing away from the motherboard 23, the plurality of devices 24 are covered and shielded by a shielding cover 25, a plurality of devices 24 are also disposed on a side surface of the motherboard 23 facing away from the cavity board 21, the plurality of devices 24 are covered and shielded by another shielding cover 25, and a plurality of devices 24 are also disposed in a surrounding area of the cavity board 21 on a side surface of the motherboard 23 facing towards the cavity board 21. Compared with the sandwich stacking mode, the stacking mode has smaller welding points and can save space. However, as the solder bump size decreases, the amount of tin thereon also decreases, and the adhesion between the cavity plate 21 and the main plate 23 also varies. When the welding spot falls, the welding spot is easy to crack, so that the contact is poor, and the corresponding function is failed.
Therefore, referring to fig. 3, fig. 3 is a schematic structural diagram of a printed circuit board assembly according to an embodiment of the present disclosure. As shown in fig. 3, the present embodiment provides a printed circuit board assembly, which includes a first printed circuit board 31 and a second printed circuit board 32 arranged in a stacked manner, wherein a side of the first printed circuit board 31 facing the second printed circuit board 32 is provided with a frame plate 311, and the frame plate 311 encloses a recessed structure 312; optionally, the frame plate 311 may have a regular shape, for example, a cylindrical shape, and the surrounding area of the frame plate 311 is a cylindrical hollow area, that is, the recessed structure 312, or the cross-sectional shape of the frame plate 311 is a hollow rectangle, so that the surrounding area of the frame plate 311 is a cube shape, that is, the recessed structure 312; alternatively, the shelf 311 may have an irregular shape, for example, the cross-sectional shape of the shelf 311 is a hollow and irregular closed figure.
Referring to fig. 4, fig. 4 is a schematic view illustrating a plurality of solder bumps on a first surface according to an embodiment of the disclosure. As shown in fig. 3 and 4, the first printed circuit board 31 is electrically connected to the second printed circuit board 32 through a plurality of solder joints 33, and the plurality of solder joints 33 are disposed on the first surface 313 of the frame plate 311 facing the second printed circuit board 32, that is, the frame plate 311 of the first printed circuit board 31 is soldered to the second printed circuit board 32. The plurality of welding points 33 include a continuous welding point 331, the continuous welding point 331 includes a plurality of first welding points of the same type connected together, the first welding points of the same type are welding points for connecting the same signal, the first surface 313 is provided with welding pads corresponding to the positions and shapes of the plurality of welding points 33 one by one, that is, the first surface 313 is also provided with continuous welding pads corresponding to the positions and shapes of the continuous welding point 331, the continuous welding pads are formed by connecting a plurality of originally mutually independent first welding pads into one, and the first welding pads are corresponding to the connection of the same signal.
In some embodiments of the present application, optionally, the first pcb 31 and the shelf 311 are integrally formed, and both may correspond to a stacking pattern of cavity boards in fig. 2, where the shelf 311 of the first pcb 31 is a rib shelf, that is, the shelf 311 is in a rib convex shape.
In other embodiments of the present application, optionally, the first printed circuit board 31 and the frame plate 311 are separately disposed, and two end surfaces of the frame plate 311 are electrically connected to the first printed circuit board 31 and the second printed circuit board 32 through a plurality of first solder joints 33, respectively, that is, corresponding to the stacking style in fig. 1.
Compared with the mode that each welding spot is independently arranged in the prior art, the welding spots are connected into a whole to form the continuous welding spot, the tin feeding amount of the continuous welding spot is effectively increased during welding, a plurality of first welding spots of the same type are connected into a whole during welding, and the stress at the welding position is effectively improved, so that the connection strength between the first printed circuit board 31 and the second printed circuit board 32 is enhanced, the probability of occurrence of the condition that the welding spots between the first printed circuit board 31 and the second printed circuit board 32 are disconnected during falling and collision is reduced, and the reliability of the printed circuit board assembly is improved.
Therefore, in the embodiment of the present application, the stacked first printed circuit board 31 and the stacked second printed circuit board 32 are electrically connected through the plurality of solder joints 33, and the plurality of first solder joints of the same type in the plurality of solder joints 33 are connected into a whole to form the continuous solder joint 331, so that the stress condition of the solder joints can be effectively improved, and the reliability of the printed circuit board assembly can be further improved.
Referring to fig. 5, fig. 5 is a schematic view illustrating a continuous welding spot according to an embodiment of the present disclosure. As shown in fig. 5, in some embodiments of the present application, the number of the continuous welding points 331 is two or more, the continuous welding points 331 are in a strip shape, and the first surface 313 of the shelf 311 on the first printed circuit board 31 is in a hollow plane closed figure, which may be in a regular shape, such as a ring shape, a hollow rectangle shape, or the like, and optionally, the plane closed figure may also be in an irregular shape. The first surface 313 includes an inner side and an outer side, and a surrounding area of the inner side is a hollow portion of the first surface 313, wherein a plurality of continuous welding spots 331 are distributed at intervals on the inner side edge of the first surface 313 along an extending direction of the inner side of the first surface 313, and are distributed at intervals on the outer side edge of the first surface 313 along an extending direction of the outer side edge of the first surface 313.
Therefore, the continuous welding points 331 are arranged on the inner side edge and the outer side edge of the welding surface (i.e. the first surface 313) in a sectional manner, so that the stress can be absorbed by the continuous welding points 331, the stress value of the positions of the continuous welding points 331 is reduced, and the connection strength is improved; moreover, because the continuous welding points 331 are arranged at intervals, the soldering flux used in the welding process can be released from the gap 34 between two adjacent continuous welding points 331, so that the probability of tin migration on the welding pad is reduced, and the quality of a finished product is ensured.
In some embodiments of the present application, the plurality of weld points 33 further includes a plurality of individual weld points 332, the plurality of individual weld points 332 are located in a middle region between the inner side edge and the outer side edge of the first side 313, and the continuous weld point 331 located at the inner side edge of the first side 313 and the continuous weld point 331 located at the outer side edge of the first side 313 are both undulated on opposite sides, that is, the side of the continuous weld point 331 located at the inner side edge of the first side 313 that faces the continuous weld point 331 located at the outer side edge of the first side 313 is undulated, and the side of the continuous weld point 331 located at the outer side edge of the first side 313 that faces the continuous weld point 331 located at the inner side edge of the first side 313 is also undulated. Since the plurality of independent welding points 332 in the middle area are generally circular, the wavy side of the continuous welding point 331 can ensure that the gaps 34 between the plurality of independent welding points 332 adjacent to the continuous welding point 331 and the continuous welding point 331 are the same, so that the plurality of independent welding points 332 can be designed to be consistent in size, the positions of the independent welding points 332 are more convenient to arrange, and the possibility of the independent welding points 332 and the continuous welding point 331 being in mistaken contact is reduced.
In some embodiments, each of the plurality of individual weld points 332 adjacent to the undulating side of the continuous weld point 331 is directly opposite a recessed portion of the undulating side to ensure that the gaps 34 between the plurality of individual weld points 332 adjacent to the continuous weld point 331 and the continuous weld point 331 are all the same.
Referring to fig. 6, fig. 6 is a second schematic view of a continuous solder joint provided in the present embodiment. In other embodiments of the present disclosure, as shown in fig. 6, the number of the continuous welding points 331 is two, the continuous welding points 331 are in a shape of a strip, and the first side 313 is in a hollow plane closed figure, which may be a regular shape, such as a ring shape, a hollow rectangle, or the like, and optionally, the plane closed figure may be an irregular shape. The first surface 313 includes an inner side and an outer side, wherein a surrounding area of the inner side is a hollow portion of the first surface 313, one of the continuous welding points 331 is disposed around the inner side edge of the first surface 313, and the other continuous welding point 331 is disposed around the outer side edge of the first surface 313. Illustratively, one of the continuous welding spots 331 is arranged along the extension direction of the inner side edge of the first surface 313 and connected together end to form a circle, and the other continuous welding spot 331 is arranged along the extension direction of the outer side edge of the first surface 313 and connected together end to form a circle.
Therefore, the two continuous welding points 331 are arranged on the inner side edge and the outer side edge of the welding surface (i.e., the first surface 313) in a ring shape, so that the stress can be absorbed by the continuous welding points 331, the stress value of the positions of the continuous welding points 331 is reduced, and the connection strength is improved.
In some embodiments of the present disclosure, the first surface 313 is further provided with a plurality of through holes 35, and the through holes 35 are located in a middle area between an inner edge and an outer edge of the first surface 313 and are spaced apart from each other along a circumferential direction of the first surface 313, or along a length extending direction of the first surface 313. The soldering flux used in the soldering process can be released from the through holes 35 which are arranged at intervals, so that the probability of tin migration on the bonding pad is reduced, and the quality of a finished product is ensured. Of course, the through hole 35 may be formed in the second printed circuit board 32 in a region facing the first surface 313, and the above-described effects can be similarly obtained.
In some embodiments of the present application, the plurality of weld points 33 further includes a plurality of individual weld points 332, the plurality of individual weld points 332 are located in a middle region between the inner side edge and the outer side edge of the first side 313, and the continuous weld point 331 located at the inner side edge of the first side 313 and the continuous weld point 331 located at the outer side edge of the first side 313 are both undulated on opposite sides, that is, the side of the continuous weld point 331 located at the inner side edge of the first side 313 that faces the continuous weld point 331 located at the outer side edge of the first side 313 is undulated, and the side of the continuous weld point 331 located at the outer side edge of the first side 313 that faces the continuous weld point 331 located at the inner side edge of the first side 313 is also undulated. Since the plurality of independent welding points 332 in the middle area are generally circular, the wavy side of the continuous welding point 331 can ensure that the gaps 34 between the plurality of independent welding points 332 adjacent to the continuous welding point 331 and the continuous welding point 331 are the same, so that the plurality of independent welding points 332 can be designed to be consistent in size, the positions of the independent welding points 332 are more convenient to arrange, and the possibility of the independent welding points 332 and the continuous welding point 331 being in mistaken contact is reduced.
In some embodiments, each of the plurality of individual weld points 332 adjacent to the undulating side of the continuous weld point 331 is directly opposite a recessed portion of the undulating side to ensure that the gaps 34 between the plurality of individual weld points 332 adjacent to the continuous weld point 331 and the continuous weld point 331 are all the same.
Referring to fig. 7 and 8, fig. 7 is a third schematic view of a continuous welding spot provided in an embodiment of the present application, and fig. 8 is a fourth schematic view of a continuous welding spot provided in an embodiment of the present application. As shown in fig. 7 and 8, in some embodiments of the present application, the plurality of pads 33 further includes a second pad 333, the continuous pad 331 is located at the outer periphery of the second pad 333, and the second pad 333 is a pad of the target signal. That is, the target signal is an important signal, the second pad 333 is a pad of an important signal line, and the stress is further absorbed by forming the plurality of first pads around the second pad 333 into a single integrated continuous pad 331, thereby improving the stress of the inner pad. Optionally, the continuous pad 331 located at the periphery of the second pad 333 is a ground pad to avoid interference with the target signal on the second pad 333.
As shown in fig. 7 and 8, the continuous welding points 331 in the embodiment of the present application are based on the shape of the continuous welding points 331 in fig. 6, and further connect the internal first welding points of the same type as a whole, so as to further improve the stress situation.
Referring to fig. 9, fig. 9 is a fifth schematic view of a continuous solder joint according to an embodiment of the present application. In other embodiments of the present disclosure, as shown in fig. 9, the number of the continuous welding points 331 is multiple, and the orthographic projection of the continuous welding points 331 on the first side 313 is a closed figure, which may be a regular shape, such as a triangle, a rectangle, an ellipse, a pentagon, etc., or an irregular shape, i.e., only one circle is enclosed. The first side 313 is a hollow planar closed figure, which may be a regular shape, such as a ring shape, a hollow rectangle shape, etc., and optionally, may be an irregular shape. The plurality of continuous welding spots 331 are spaced apart along a circumferential direction of the first surface 313, or along a lengthwise extension direction of the first surface 313.
Therefore, the continuous welding points 331 are arranged on the welding surface (namely the first surface 313) in a fully-surrounding type interval mode, so that the stress can be absorbed by the continuous welding points 331, the stress value of the positions of the continuous welding points 331 is reduced, and the connection strength is improved.
In some embodiments of the present application, the plurality of solder joints 33 further include a plurality of independent solder joints 332, the plurality of independent solder joints 332 are distributed in a closed area (i.e., a hollow portion) surrounded by each continuous solder joint 331, at least one through hole 35 is further disposed in the closed area of each continuous solder joint 331, and a flux used in a soldering process can be released from the plurality of through holes 35 arranged at intervals, so that a probability of migration of tin on the solder joint is reduced, and a quality of a finished product is ensured. Of course, the through hole 35 may be formed in the second printed circuit board 32 in a region facing the first surface 313, and the above-described effects can be similarly obtained.
In some embodiments, optionally, the inner side of the continuous weld 331 is wavy. Because the plurality of independent welding points 332 in the closed area are generally circular, the wavy inner side surface of the continuous welding point 331 can ensure that the gaps 34 between the plurality of independent welding points 332 adjacent to the continuous welding point 331 and the continuous welding point 331 are the same, so that the sizes of the plurality of independent welding points 332 can be designed to be consistent, the positions of the independent welding points 332 are more convenient to arrange, and the possibility of mistaken contact between the independent welding points 332 and the continuous welding point 331 is reduced.
In some embodiments, each of the plurality of individual weld points 332 adjacent to the undulating inner side of the continuous weld point 331 is directly opposite a recessed portion of the undulating inner side to ensure that the gaps 34 between the plurality of individual weld points 332 adjacent to the continuous weld point 331 and the continuous weld point 331 are all the same.
Referring to fig. 10, fig. 10 is a sixth schematic view of a continuous solder joint according to an embodiment of the present application. As shown in fig. 10, in some embodiments of the present application, the plurality of pads 33 further includes a second pad 333, the continuous pad 331 surrounds the outer periphery of the second pad 333, and the second pad 333 is a pad of the target signal. That is, the target signal is an important signal, the second pad 333 is a pad of an important signal line, and the stress is further absorbed by forming the plurality of first pads around the second pad 333 into a single integrated continuous pad 331, thereby improving the stress of the inner pad. Optionally, the continuous pad 331 located at the periphery of the second pad 333 is a ground pad to avoid interference with the target signal on the second pad 333.
As shown in fig. 10, the continuous welding points 331 in the embodiment of the present application are based on the shape of the continuous welding points 331 in fig. 9, and further connect the first welding points of the same type inside into a whole, thereby further improving the stress situation.
Referring to fig. 11 to 13, fig. 11 is a seventh schematic view of a continuous welding spot provided in an embodiment of the present application, fig. 12 is an eighth schematic view of a continuous welding spot provided in an embodiment of the present application, and fig. 13 is a ninth schematic view of a continuous welding spot provided in an embodiment of the present application. In some embodiments of the present application, optionally, the shape of the continuous solder joint 331 is any one of a bar shape, a T shape, a Z shape, an X shape, a Y shape, and an L shape, the plurality of pads originally independent of each other are connected to form the continuous solder joint, the amount of tin on the continuous solder joint is effectively increased during soldering, and the plurality of first solder joints of the same type are connected to form the continuous solder joint during soldering, the stress at the soldering position is effectively improved, thereby enhancing the connection strength between the first printed circuit board 31 and the second printed circuit board 32, reducing the occurrence probability of the situation in which the solder joint between the first printed circuit board 31 and the second printed circuit board 32 is disconnected during a falling collision, and improving the reliability of the printed circuit board assembly. As shown in fig. 11, in which the continuous welding points 331 are X-shaped, as shown in fig. 12, in which the continuous welding points 331 are inverted T-shaped, and as shown in fig. 13, in which the continuous welding points 331 are Z-shaped. Of course, the shape of the continuous welding point 331 in the embodiment of the present application is not limited to the above shape, and may be other regular or irregular shapes.
In summary, in the embodiment of the present application, the stacked first printed circuit board and the stacked second printed circuit board are electrically connected through the plurality of solder joints, and the plurality of first solder joints of the same type in the plurality of solder joints are connected into a whole to form a continuous solder joint, so that the stress condition of the solder joints can be effectively improved, and the reliability of the printed circuit board assembly is further improved.
Another embodiment of the present application further provides an electronic device, where the electronic device includes the printed circuit board assembly as described in the above embodiments, and the same technical effects can be achieved, and details are not repeated here to avoid repetition.
In this embodiment, the electronic device may be a terminal, or may be other devices besides the terminal. The electronic Device may be, for example, a Mobile phone, a tablet computer, a notebook computer, a palm top computer, a vehicle-mounted electronic Device, a Mobile Internet Device (MID), an Augmented Reality (AR)/Virtual Reality (VR) Device, a robot, a wearable Device, an ultra-Mobile personal computer (UMPC), a netbook or a Personal Digital Assistant (PDA), and the like, and may also be a server, a Network Attached Storage (NAS), a Personal Computer (PC), a Television (TV), a teller machine, a self-service machine, and the like, and the embodiments of the present application are not particularly limited.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present application may be embodied in the form of a computer software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, or a network device) to execute the method according to the embodiments of the present application.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (11)
1. A printed circuit board assembly is characterized by comprising a first printed circuit board and a second printed circuit board which are arranged in a stacked mode, wherein a frame plate is arranged on one side, facing the second printed circuit board, of the first printed circuit board, the first printed circuit board is electrically connected with the second printed circuit board through a plurality of welding points, and the plurality of welding points are arranged on a first surface, facing the second printed circuit board, of the frame plate;
the plurality of welding spots comprise continuous welding spots, the continuous welding spots comprise a plurality of first welding spots of the same type which are connected into a whole, and the plurality of first welding spots of the same type are welding spots of the same signal;
and the first surface is provided with continuous welding pads corresponding to the positions and the shapes of the continuous welding points.
2. The printed circuit board assembly of claim 1, wherein the number of the continuous solder joints is two or more, the continuous solder joints are in the shape of bars, the first surface is in a hollow plane closed figure, and the continuous solder joints are distributed at intervals at the inner side edge of the first surface along the extending direction of the inner side edge of the first surface and at intervals at the outer side edge of the first surface along the extending direction of the outer side edge of the first surface.
3. The printed circuit board assembly of claim 1, wherein the number of the continuous pads is two, the continuous pads are in the shape of a strip, the first surface is in a hollow planar closed figure, one of the continuous pads is disposed around an inside edge of the first surface, and the other continuous pad is disposed around an outside edge of the first surface.
4. The printed circuit board assembly of claim 3, wherein the first surface further defines a plurality of through holes, the through holes being located in a middle region between an inner edge and an outer edge of the first surface and spaced apart from each other along a perimeter of the first surface.
5. The printed circuit board assembly of claim 2 or 3, wherein the plurality of pads further comprises a plurality of individual pads located in a middle region between the inner edge and the outer edge of the first face, wherein opposing sides of the continuous pad located at the inner edge of the first face and the continuous pad located at the outer edge of the first face are each undulating.
6. The printed circuit board assembly of claim 1, wherein the number of the continuous solder joints is plural, an orthographic projection of the continuous solder joints on the first surface is a closed figure, the first surface is a hollow plane closed figure, and the plural continuous solder joints are arranged at intervals along a circumferential direction of the first surface.
7. The printed circuit board assembly of claim 6, wherein the plurality of solder points further comprises a plurality of independent solder points distributed in an enclosed area of the continuous solder point, wherein a through hole is further formed in the enclosed area of the continuous solder point, and an inner side surface of the continuous solder point is wavy.
8. The printed circuit board assembly of claim 1, wherein the first printed circuit board and the chassis are integrally formed.
9. The printed circuit board assembly of claim 1, wherein the shape of the continuous solder joint is any one of a bar, a T-shape, a Z-shape, an X-shape, a Y-shape, and an L-shape.
10. The printed circuit board assembly of claim 1, wherein the plurality of pads further comprises a second pad, the continuous pad surrounding a periphery of the second pad, the second pad being a pad of a target signal.
11. An electronic device comprising a printed circuit board assembly according to any of claims 1-10.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111637294.5A CN114189988A (en) | 2021-12-29 | 2021-12-29 | Printed circuit board assembly and electronic equipment |
| PCT/CN2022/141739 WO2023125347A1 (en) | 2021-12-29 | 2022-12-26 | Printed circuit board assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111637294.5A CN114189988A (en) | 2021-12-29 | 2021-12-29 | Printed circuit board assembly and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114189988A true CN114189988A (en) | 2022-03-15 |
Family
ID=80545163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111637294.5A Pending CN114189988A (en) | 2021-12-29 | 2021-12-29 | Printed circuit board assembly and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114189988A (en) |
| WO (1) | WO2023125347A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115066094A (en) * | 2022-06-14 | 2022-09-16 | 维沃移动通信有限公司 | Circuit board structure and electronic equipment |
| WO2023125347A1 (en) * | 2021-12-29 | 2023-07-06 | 维沃移动通信有限公司 | Printed circuit board assembly and electronic device |
| CN116634664A (en) * | 2023-07-06 | 2023-08-22 | 荣耀终端有限公司 | Circuit board assembly, electronic equipment and preparation method of circuit board assembly |
| CN117255477A (en) * | 2023-11-10 | 2023-12-19 | 荣耀终端有限公司 | Circuit board assembly, preparation method of circuit board assembly and electronic equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020104874A1 (en) * | 2001-02-05 | 2002-08-08 | Samsung Electronics Co., Ltd. | Semiconductor chip package comprising enhanced pads |
| CN1469697A (en) * | 2002-07-17 | 2004-01-21 | 仁宝电脑工业股份有限公司 | Method of fixing IC package onto circuit board |
| JP2011159840A (en) * | 2010-02-02 | 2011-08-18 | Panasonic Corp | Packaging connection structure of electronic component |
| CN104952746A (en) * | 2014-02-27 | 2015-09-30 | 英飞凌科技股份有限公司 | Method of connecting a semiconductor package to a board |
| CN108513435A (en) * | 2018-05-30 | 2018-09-07 | 烽火通信科技股份有限公司 | A kind of PCB construction for reducing generation ground pad cavity |
| CN110312363A (en) * | 2019-06-24 | 2019-10-08 | 维沃移动通信有限公司 | A kind of printed circuit-board assembly and terminal |
| CN112151392A (en) * | 2019-06-27 | 2020-12-29 | 台湾积体电路制造股份有限公司 | Method for forming chip packaging structure |
| CN113347788A (en) * | 2021-06-16 | 2021-09-03 | 维沃移动通信有限公司 | Printed circuit board structure and electronic equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10085338B2 (en) * | 2015-09-24 | 2018-09-25 | Seagate Technology Llc | Printed circuit board with flux reservoir |
| CN110213881B (en) * | 2019-05-28 | 2021-07-06 | 四川九洲电器集团有限责任公司 | Printed circuit board and test fixture |
| CN114189988A (en) * | 2021-12-29 | 2022-03-15 | 维沃移动通信有限公司 | Printed circuit board assembly and electronic equipment |
-
2021
- 2021-12-29 CN CN202111637294.5A patent/CN114189988A/en active Pending
-
2022
- 2022-12-26 WO PCT/CN2022/141739 patent/WO2023125347A1/en unknown
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020104874A1 (en) * | 2001-02-05 | 2002-08-08 | Samsung Electronics Co., Ltd. | Semiconductor chip package comprising enhanced pads |
| CN1469697A (en) * | 2002-07-17 | 2004-01-21 | 仁宝电脑工业股份有限公司 | Method of fixing IC package onto circuit board |
| JP2011159840A (en) * | 2010-02-02 | 2011-08-18 | Panasonic Corp | Packaging connection structure of electronic component |
| CN104952746A (en) * | 2014-02-27 | 2015-09-30 | 英飞凌科技股份有限公司 | Method of connecting a semiconductor package to a board |
| CN108513435A (en) * | 2018-05-30 | 2018-09-07 | 烽火通信科技股份有限公司 | A kind of PCB construction for reducing generation ground pad cavity |
| CN110312363A (en) * | 2019-06-24 | 2019-10-08 | 维沃移动通信有限公司 | A kind of printed circuit-board assembly and terminal |
| CN112151392A (en) * | 2019-06-27 | 2020-12-29 | 台湾积体电路制造股份有限公司 | Method for forming chip packaging structure |
| CN113347788A (en) * | 2021-06-16 | 2021-09-03 | 维沃移动通信有限公司 | Printed circuit board structure and electronic equipment |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023125347A1 (en) * | 2021-12-29 | 2023-07-06 | 维沃移动通信有限公司 | Printed circuit board assembly and electronic device |
| CN115066094A (en) * | 2022-06-14 | 2022-09-16 | 维沃移动通信有限公司 | Circuit board structure and electronic equipment |
| CN116634664A (en) * | 2023-07-06 | 2023-08-22 | 荣耀终端有限公司 | Circuit board assembly, electronic equipment and preparation method of circuit board assembly |
| CN117255477A (en) * | 2023-11-10 | 2023-12-19 | 荣耀终端有限公司 | Circuit board assembly, preparation method of circuit board assembly and electronic equipment |
| CN117255477B (en) * | 2023-11-10 | 2024-04-12 | 荣耀终端有限公司 | Circuit board assembly, preparation method of circuit board assembly and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023125347A1 (en) | 2023-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114189988A (en) | Printed circuit board assembly and electronic equipment | |
| CN109121285B (en) | Circuit board structure and electronic equipment | |
| CA3143077C (en) | Printed circuit board assembly and terminal | |
| US10756462B2 (en) | Resin multilayer substrate and an electronic device and a joint structure of a resin multilayer substrate | |
| JP4527035B2 (en) | Shield structure | |
| CN112448138A (en) | NFC antenna structure and NFC circuit board and wireless charging seat applying same | |
| EP2533617B1 (en) | Printed circuit board with chip package component | |
| US8787033B2 (en) | Electronic component and electronic device | |
| CN102593104B (en) | Semiconductor package and method of manufacturing the same | |
| JP4625674B2 (en) | Printed wiring board and information processing apparatus mounting this board | |
| CN218450699U (en) | Integrated circuit structure and electronic equipment | |
| CN107979914A (en) | A kind of circuit board and terminal | |
| CN215912388U (en) | Frame-shaped circuit board, circuit board jointed board, circuit assembly and electronic equipment | |
| CN209283623U (en) | A kind of connection frame plate and mobile terminal | |
| JP2021158224A (en) | Shield case | |
| CN212324455U (en) | Circuit board, circuit board assembly and electronic equipment | |
| CN212519571U (en) | Printed circuit board assembly and terminal | |
| JP3881156B2 (en) | 180 degree distributor | |
| CN116525592A (en) | Packaging structure, electronic equipment and packaging method | |
| CN110087387B (en) | Flexible circuit board with improved accuracy of bonding position | |
| JP2018125370A (en) | Electronic device | |
| CN112614821A (en) | Packaging structure, preparation method thereof and electronic equipment | |
| CN216960317U (en) | Welded structure, circuit board and electronic equipment | |
| CN201563294U (en) | Welding structure of circuit board | |
| CN115884509B (en) | Flexible circuit board, circuit board assembly and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |