WO2023125158A1 - Dispositif de traitement de semi-conducteur et système de transport de tranche associé - Google Patents

Dispositif de traitement de semi-conducteur et système de transport de tranche associé Download PDF

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Publication number
WO2023125158A1
WO2023125158A1 PCT/CN2022/140406 CN2022140406W WO2023125158A1 WO 2023125158 A1 WO2023125158 A1 WO 2023125158A1 CN 2022140406 W CN2022140406 W CN 2022140406W WO 2023125158 A1 WO2023125158 A1 WO 2023125158A1
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WO
WIPO (PCT)
Prior art keywords
wafer
tray
cavity
chamber
assembly
Prior art date
Application number
PCT/CN2022/140406
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English (en)
Chinese (zh)
Inventor
赵东华
杜林昕
李晓军
王磊磊
李世凯
刘晶晶
王铁然
孙小芹
宫兆辉
许利飞
Original Assignee
北京北方华创微电子装备有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京北方华创微电子装备有限公司 filed Critical 北京北方华创微电子装备有限公司
Publication of WO2023125158A1 publication Critical patent/WO2023125158A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the lift drive assembly includes a lift drive part and an elastic drive part; the drive shaft of the lift drive part is used to contact the bottom end of the lift rod when rising, and push the lift rod up; the elastic drive part It is used to apply downward elastic force to the lifting rod, so as to drive the lifting rod to descend when the driving shaft descends.
  • the bottom end of the lift rod has an arc-shaped convex surface
  • the top end of the drive shaft of the lift drive part has a horizontal contact surface, and when the drive shaft of the lift drive part pushes the lift rod up, the The horizontal contact surface is in contact with the arc-shaped convex surface.
  • the calibration cavity 300 communicates with the transfer cavity 100, and a calibration component is arranged in the calibration cavity 300, and the calibration component is used to adjust the position of the tray 20 introduced into the calibration cavity 300 (specifically including the horizontal position of the tray 20 and the rotation angle of the tray 20). to calibrate;
  • Both the support block 700 and the second transmission assembly 500 are fixed on the fixed platform 900 .
  • the second transport assembly 500 takes the next wafer 10 out of the cassette 40 fixed in the first cassette and puts it into the wafer aligner 600 to calibrate the rotation direction of the wafer, and then the calibrated wafer
  • the circles 10 are transferred onto a plurality of ejector pins 450 raised in the loading chamber 400 .
  • the gate valve driving mechanism 420 drives the gate valve 410 to close and isolate the outside atmosphere from the chamber environment.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un système de transport de tranche. Le système de transport de tranche comprend une cavité de transport, un premier ensemble de transport, une cavité de chargement, un second ensemble de transport et une cavité d'étalonnage, la cavité de transport étant utilisée pour être en communication avec une cavité de réaction ; un côté de la cavité de chargement est en communication avec la cavité de transport, et l'autre côté de la cavité de chargement est pourvu d'une ouverture de transport ; le second ensemble de transport est utilisé pour transporter une tranche vers un plateau dans la cavité de chargement par l'intermédiaire de l'ouverture de transport, saisir la tranche à partir du plateau dans la cavité de chargement et transporter la tranche hors de la cavité de chargement ; un ensemble d'étalonnage est disposé dans la cavité d'étalonnage, et est utilisé pour étalonner la position du plateau ; le premier ensemble de transport est utilisé pour transporter le plateau dans la cavité d'étalonnage pour étalonner la position du plateau, retirer le plateau étalonné de la cavité d'étalonnage et transporter le plateau étalonné dans la cavité de chargement, et est également utilisé pour retirer le plateau portant la tranche de la cavité de chargement et transporter le plateau dans la cavité de réaction. Dans la présente invention, le premier ensemble de transport peut coopérer avec la cavité d'étalonnage pour étalonner la position du plateau, de telle sorte qu'un transport et une capture automatiques de tranches de carbure de silicium sont réalisés. La présente invention porte également sur un dispositif de traitement de semi-conducteur.
PCT/CN2022/140406 2021-12-28 2022-12-20 Dispositif de traitement de semi-conducteur et système de transport de tranche associé WO2023125158A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202111629651.3A CN114361086A (zh) 2021-12-28 2021-12-28 半导体工艺设备及其晶圆传输系统
CN202111629651.3 2021-12-28

Publications (1)

Publication Number Publication Date
WO2023125158A1 true WO2023125158A1 (fr) 2023-07-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/140406 WO2023125158A1 (fr) 2021-12-28 2022-12-20 Dispositif de traitement de semi-conducteur et système de transport de tranche associé

Country Status (3)

Country Link
CN (1) CN114361086A (fr)
TW (1) TWI828481B (fr)
WO (1) WO2023125158A1 (fr)

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CN117276162A (zh) * 2023-11-22 2023-12-22 深圳市恒运昌真空技术有限公司 一种等离子体处理设备
CN117316846A (zh) * 2023-11-30 2023-12-29 浙江果纳半导体技术有限公司 晶圆传输设备
CN118073259A (zh) * 2024-04-18 2024-05-24 苏州普洛泰科精密工业有限公司 一种灵活通用且小巧的晶圆芯片供料装置及供料方法

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* Cited by examiner, † Cited by third party
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CN114361086A (zh) * 2021-12-28 2022-04-15 北京北方华创微电子装备有限公司 半导体工艺设备及其晶圆传输系统
CN114953231A (zh) * 2022-05-27 2022-08-30 北京北方华创微电子装备有限公司 半导体工艺设备及校准装置
CN115050677A (zh) * 2022-06-20 2022-09-13 上海福赛特机器人有限公司 一种晶圆传输装置及方法
CN115116913B (zh) * 2022-06-22 2024-04-26 南京原磊纳米材料有限公司 一种多片式晶圆传输机构
CN116254599B (zh) * 2023-05-16 2023-08-08 南京原磊纳米材料有限公司 一种外延用动密封沉积装置
CN116815140B (zh) * 2023-06-21 2024-03-26 北京北方华创微电子装备有限公司 半导体工艺设备及其工艺腔室

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JP2006019544A (ja) * 2004-07-02 2006-01-19 Ulvac Japan Ltd 基板移載装置および基板搬送システム
CN103715123A (zh) * 2013-12-31 2014-04-09 上海集成电路研发中心有限公司 用于半导体制造工艺中的硅片定位系统
CN110473812A (zh) * 2019-08-29 2019-11-19 上海华力集成电路制造有限公司 低温离子注入机及其工作方法
CN211125588U (zh) * 2019-11-25 2020-07-28 无锡宇邦半导体科技有限公司 一种晶圆位置偏离识别装置
CN113611647A (zh) * 2021-10-08 2021-11-05 芯三代半导体科技(苏州)有限公司 一种半导体传输系统及其传输方法
CN114361086A (zh) * 2021-12-28 2022-04-15 北京北方华创微电子装备有限公司 半导体工艺设备及其晶圆传输系统

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US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
CN111029287B (zh) * 2019-11-29 2021-01-12 上海福赛特机器人有限公司 晶圆自动上下片系统

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006019544A (ja) * 2004-07-02 2006-01-19 Ulvac Japan Ltd 基板移載装置および基板搬送システム
CN103715123A (zh) * 2013-12-31 2014-04-09 上海集成电路研发中心有限公司 用于半导体制造工艺中的硅片定位系统
CN110473812A (zh) * 2019-08-29 2019-11-19 上海华力集成电路制造有限公司 低温离子注入机及其工作方法
CN211125588U (zh) * 2019-11-25 2020-07-28 无锡宇邦半导体科技有限公司 一种晶圆位置偏离识别装置
CN113611647A (zh) * 2021-10-08 2021-11-05 芯三代半导体科技(苏州)有限公司 一种半导体传输系统及其传输方法
CN114361086A (zh) * 2021-12-28 2022-04-15 北京北方华创微电子装备有限公司 半导体工艺设备及其晶圆传输系统

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117276162A (zh) * 2023-11-22 2023-12-22 深圳市恒运昌真空技术有限公司 一种等离子体处理设备
CN117276162B (zh) * 2023-11-22 2024-03-22 深圳市恒运昌真空技术股份有限公司 一种等离子体处理设备
CN117316846A (zh) * 2023-11-30 2023-12-29 浙江果纳半导体技术有限公司 晶圆传输设备
CN117316846B (zh) * 2023-11-30 2024-03-08 浙江果纳半导体技术有限公司 晶圆传输设备
CN118073259A (zh) * 2024-04-18 2024-05-24 苏州普洛泰科精密工业有限公司 一种灵活通用且小巧的晶圆芯片供料装置及供料方法

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CN114361086A (zh) 2022-04-15
TWI828481B (zh) 2024-01-01

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