WO2023123908A1 - Dispositif d'électroplacage - Google Patents

Dispositif d'électroplacage Download PDF

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Publication number
WO2023123908A1
WO2023123908A1 PCT/CN2022/100051 CN2022100051W WO2023123908A1 WO 2023123908 A1 WO2023123908 A1 WO 2023123908A1 CN 2022100051 W CN2022100051 W CN 2022100051W WO 2023123908 A1 WO2023123908 A1 WO 2023123908A1
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WO
WIPO (PCT)
Prior art keywords
suction
spray
pipe
electroplating device
suction pipe
Prior art date
Application number
PCT/CN2022/100051
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English (en)
Chinese (zh)
Inventor
袁继旺
余锦玉
刘梦茹
杨海云
纪成光
Original Assignee
生益电子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 生益电子股份有限公司 filed Critical 生益电子股份有限公司
Publication of WO2023123908A1 publication Critical patent/WO2023123908A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Definitions

  • the present application relates to the technical field of electroplating, for example, to an electroplating device.
  • electroplating the holes to be plated can realize the conduction between the multi-layer core boards.
  • the requirements for the precision of circuit board manufacturing are getting higher and higher, so the requirements for the deep plating effect of the plated holes are also higher and higher, that is, the electroplating device needs to have better deep plating ability.
  • the PCB electroplating device in the related art is provided with a suction pipe on one side of the PCB and a spray pipe on the other side, which not only makes the side of the hole to be plated near the suction pipe on the PCB surface and the side of the hole to be plated near the nozzle
  • the pressure difference also forms a circulation loop of the plating solution, realizes the exchange of the plating solution in the hole to be plated, and realizes the deep plating of the hole to be plated by the electroplating device.
  • the present application provides an electroplating device, which can solve the problem of poor deep plating ability of the electroplating device in the related art when electroplating circuit boards with high aspect ratio holes to be plated.
  • An electroplating device configured to electroplate a PCB, the PCB is provided with holes to be plated along a first direction, comprising:
  • An electroplating tank is set to accommodate the plating solution; two anode plates and the PCB are arranged in the electroplating tank, the PCB is arranged between the two anode plates, and the two anode plates are connected to the PCB electrical connection;
  • the injection and suction assembly includes a pump and a suction pipe and a spray pipe connected to the pump, and the suction pipe and the spray pipe are arranged between the anode plate and the PCB; the pump is arranged to The plating solution is transported in the spray pipe; the spray pipe is set to spray the plating solution to the hole to be plated; the suction pipe is set to suck back the plating solution passing through the hole to be plated;
  • the straws include:
  • the straw body is tubular and extends along the second direction;
  • the wedge-shaped suction opening is arranged on the suction pipe body along the second direction and communicates with the suction pipe body.
  • the end of the wedge-shaped suction suction opening away from the suction pipe body is larger than the wedge-shaped suction suction opening near the suction pipe body one end.
  • the suction pipe body is provided with an opening along the second direction, and deflectors are provided on both sides of the suction pipe body in the width direction of the opening, and the two deflectors are in the shape of The angle is set, and the two deflectors and the opening form the wedge-shaped suction inlet.
  • the width of the opening ranges from 8 mm to 12 mm.
  • the angle range of the included angle is 70°-90°.
  • the width of the side of the wedge-shaped back suction opening away from the straw body is in the range of 50mm-100mm.
  • multiple sets of the spray suction assemblies are provided in the electroplating device, and the multiple sets of the spray suction assemblies are arranged at intervals along the third direction;
  • the straws are arranged staggered along the third direction; the first direction, the second direction and the third direction are arranged perpendicular to each other.
  • the nozzles of each group of the spray and suction components are arranged opposite to one side of the hole to be plated, and the suction pipes in each group of the spray and suction components are connected to the side of the hole to be plated.
  • the other side of the hole is oppositely arranged.
  • a plurality of nozzles are uniformly arranged on the spray pipe along the second direction, and the nozzles on two adjacent spray pipes in the same spray and suction assembly are arranged alternately.
  • the relative distance between the nozzle and the suction pipe in the same suction assembly is 45mm-115mm; the nozzle adjacent to the nozzle in the third direction and the The distance between the straws is 50mm.
  • the above electroplating device also includes a swing mechanism, the swing mechanism is arranged on the side wall of the electroplating tank, the spray suction assembly is arranged at the output end of the swing mechanism, and the swing mechanism is set To drive the suction assembly to reciprocate along the third direction.
  • the electroplating device provided by the application includes a spray suction assembly, and the spray suction assembly includes a pump and a suction pipe and a nozzle connected to the pump.
  • the suction pipe and the nozzle are arranged between the PCB and the anode plate to realize the plating solution in the hole to be plated. exchange.
  • the nozzle is set to spray the plating solution to the PCB, so that the area of the hole to be plated near the nozzle generates a positive pressure, and the suction pipe is set to suck back the plating solution passing through the hole to be plated, so as to realize the exchange of the plating solution in the hole to be plated.
  • the suction pipe includes a suction pipe body and a wedge-shaped suction port arranged along the second direction.
  • the wedge-shaped suction port is connected with the suction pipe body, so that negative pressure is generated in the area near the suction pipe of the hole to be plated, which increases the pressure difference between the two sides of the hole to be plated, and accelerates the The flow of the plating solution in the hole to be plated is ensured, so that the electroplating device also has better deep plating ability for the hole to be plated with a high aspect ratio.
  • Fig. 1 is the schematic structural view of the jet suction assembly in the embodiment of the present application
  • Fig. 2 is a schematic structural view of the straw in the embodiment of the present application.
  • a first feature being "on” or “under” a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them.
  • “above”, “above” and “above” the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.
  • “Below”, “beneath” and “under” the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.
  • this embodiment provides an electroplating device, which is configured to electroplate a PCB3, and holes to be plated are provided on the PCB3 along a first direction (ie, the X direction in the drawings).
  • the electroplating device includes an electroplating tank arranged to accommodate the plating solution, two anode plates 4 and a PCB3 are arranged in the electroplating tank, the PCB3 is arranged between the two anode plates 4, and the two anode plates 4 are electrically connected to the PCB3, so that the anode
  • the board 4 forms an electrical circuit with the PCB3, so as to facilitate the electroplating of the PCB3.
  • the distance between the PCB 3 and each anode plate 4 is adjustable, so as to be adaptively adjusted according to actual working conditions, so that the electroplating device has a better electroplating effect.
  • the electroplating device also includes a spray-suction assembly, which includes a pump 5 and a suction pipe 2 and a nozzle 1 connected to the pump 5 , and the suction pipe 2 and the nozzle 1 are arranged between the PCB 3 and the anode plate 4 .
  • the pump 5 is connected to the spray pipe 1 and the suction pipe 2 respectively through a PVC hose.
  • the setting of the PVC hose makes the distance between the pump 5 and the spray pipe 1 and the suction pipe 2 adjustable, so that the distance between the pump 5 and the spray pipe 1 and the suction pipe 2 can be adjusted according to actual working conditions Change the relative position of nozzle 1 and suction pipe 2 to ensure the plating effect of PCB3.
  • the pump 5 is set to deliver the plating solution to the spray pipe 1, and the spray pipe 1 is set to spray the plating solution to the hole to be plated, so that the area of the hole to be plated close to the spray pipe 1 generates a positive pressure.
  • the suction pipe 2 is set to suck back the plating solution passing through the hole to be plated, so that the plating solution starts to circulate, thereby increasing the exchange speed of the plating solution in the hole to be plated.
  • the suction pipe 2 includes a suction pipe body 22 and a wedge-shaped suction opening 21 .
  • the straw body 22 is tubular and extends along the second direction (ie, the Y direction in the drawing).
  • the wedge-shaped suction opening 21 is arranged on the suction pipe body 22 along the second direction and communicates with the suction pipe body 22 .
  • the setting of the wedge-shaped back-suction port 21 can confluence the plating solution to accelerate the plating solution entering the suction pipe 2; This enables better exchange of the plating solution in the hole to be plated with a high aspect ratio, that is, the deep plating ability of the hole to be plated with a high aspect ratio is improved.
  • the first direction is a direction perpendicular to the PCB 3 board surface
  • the second direction is the extending direction of the suction pipe 2.
  • the hole to be plated is a through hole, and the flow process of the plating solution is as described above.
  • the holes to be plated can also be blind holes.
  • the blind hole is divided into the first blind hole and the second blind hole, the nozzle 1 is set to spray the plating solution into the first blind hole, so that the area between the nozzle 1 and the first blind hole generates a positive pressure, and the suction pipe is set In order to suck back the plating solution at the second blind hole, a negative pressure is generated in the area between the suction pipe 2 and the second blind hole, so that the area between the nozzle 1 and the first blind hole and the suction pipe 2 and the second blind hole A pressure difference is generated in the area between them, and the exchange of the plating solution in the first blind hole is realized.
  • the second blind hole is also in a negative pressure state, so that a pressure difference is formed inside and outside the second blind hole, so that the plating solution can diffuse in the second hole to be plated.
  • the wedge-shaped back-suction port 21 increases the negative pressure in the area between the second blind hole and the suction pipe 2, accelerates the flow velocity of the plating solution, and improves the deep plating ability of the electroplating device for the blind hole.
  • the suction pipe body 22 is provided with an opening 212 along the second direction, and the two sides of the suction pipe body 22 in the width direction of the opening 212 are provided with deflectors 211, and the two deflectors 211 are arranged at an angle.
  • the flow plate 211 and the opening 212 form a wedge-shaped suction inlet 21 .
  • the setting of the deflector 211 can confluence the plating solution, and the setting of the opening 212 can make the plating solution enter the suction pipe body 22 through the guidance of the deflector 211 , so as to realize the circulating flow of the plating solution between the nozzle 1 and the suction pipe 2 .
  • the dynamic pressure of the plating solution at the opening 212 reaches the maximum value and the static pressure reaches the minimum value, and the flow velocity of the plating solution increases due to the decrease of the flow cross-sectional area.
  • the entire plating solution will experience the process of reducing the flow cross-sectional area at the same time, so the pressure will also decrease at the same time, thereby generating a pressure difference. Therefore, the flow velocity of the plating solution and the pressure difference between the two ends of the hole to be plated are closely related to the structure of the wedge-shaped suction port 21 .
  • the width of the opening 212 ranges from 8 mm to 12 mm. In this embodiment, the width of the opening 212 is 10mm.
  • the angle range of the included angle is 70°-90°. In this embodiment, the included angle is 80°.
  • the width of the side of the wedge-shaped suction back opening 21 away from the suction pipe body 22 ranges from 50 mm to 100 mm. In this embodiment, the width of the side of the wedge-shaped suction back opening 21 away from the straw body 22 is 75 mm.
  • the size of the wedge-shaped back-suction port 21 in the second direction is equal to the size of the nozzle 1 in the second direction, so as to improve the confluence effect of the wedge-shaped back-suction port 21 on the plating solution ejected from the nozzle tube 1 .
  • the wedge-shaped back-suction port 21 and the suction pipe body 22 and the nozzle 1 are all in contact with the plating solution, in order to prevent the plating solution from corroding the wedge-shaped suction port 21 and the suction pipe body 22 and the nozzle 1, the wedge-shaped suction port 21 and the suction pipe body 22 and the nozzle 1 Made of 316 stainless steel. 316 stainless steel contains Mo element, which greatly improves its corrosion resistance and high temperature strength.
  • the electroplating device is provided with multiple sets of spray and suction components to improve the deep plating efficiency of the electroplating device.
  • the nozzle pipes 1 and the suction pipes 2 in the multiple groups of spray suction assemblies are arranged at intervals along the third direction (ie, the Z direction in the figure), and the multiple nozzle pipes 1 and the multiple suction pipes 2 are arranged alternately along the third direction.
  • the first direction, the second direction and the third direction are arranged perpendicular to each other.
  • two groups of spray suction assemblies are provided in the electroplating device, including a first spray suction assembly and a second spray suction assembly, and a second spray suction assembly is provided between two adjacent suction pipes 2 in the first spray suction assembly.
  • the nozzle 1 in the suction assembly, the first suction assembly produces a force to the left in the first direction, while the second suction assembly produces a force to the right in the first direction, and the two forces can cancel each other out to ensure that the PCB3 is stressed Uniform, so that the position of PCB3 does not shift.
  • each suction assembly includes two spray pipes 1 and two suction pipes 2 .
  • the relative distance between the suction pipe 2 and the spray pipe 1 in the same suction assembly is in the range of 45mm-115mm. Therefore, the maximum distance between the notch of the wedge-shaped suck-back opening 21 and the PCB3 is 35mm.
  • the distance between adjacent spout pipes 1 and suction pipes 2 in the third direction is 50mm.
  • the relative distance between the suction pipe 2 and the nozzle pipe 1 in the same suction assembly is 70 mm, and the distance between the adjacent nozzle pipes 1 and the suction pipe 2 in the third direction is 50 mm.
  • a plurality of nozzles 11 are uniformly arranged on the spray pipe 1 along the second direction, so as to increase the injection amount of the plating solution.
  • the nozzles 11 on two adjacent spray pipes 1 in the same injection suction assembly are arranged alternately to ensure that the injection pressures of the nozzles 11 received by the PCB3 are equal.
  • the diameter of the inner core hole of the nozzle 11 ranges from 0.5 mm to 2.5 mm. In this embodiment, the diameter of the inner core hole of the nozzle 11 is 1.5 mm, and the diameter of the outer hole is 10 mm.
  • the liquid outlet end of the nozzle 11 should be arranged opposite to the wedge-shaped back-suction port 21 . Therefore, correspondingly, the wedge-shaped back-suction ports 21 in two adjacent suction pipes 2 in the same suction assembly are staggered, so that the plating solution ejected from the corresponding nozzle 1 and the surrounding plating solution can be effectively converged into the suction pipe 2,
  • a pressure difference is generated on both sides of the PCB3 to improve the deep plating ability of the electroplating device; on the other hand, it avoids the uneven concentration of the plating solution caused by the dead angle in the spraying and suction process.
  • the electroplating device further includes a swing mechanism, the swing mechanism is arranged on the side wall of the electroplating tank, the spray suction assembly is arranged at the output end of the swing mechanism, and the swing mechanism is configured to drive the spray suction assembly to reciprocate along a third direction.
  • the above setting fully stirs the plating solution, which can discharge the bubbles on the surface of PCB3, and improves the exchange efficiency of the plating solution in the hole to be plated; on the other hand, it ensures the uniformity of electroplating and improves the quality of electroplating.
  • the swing mechanism includes a driving member and a slide rail
  • the slide rail is arranged on the side wall of the electroplating tank along the third direction
  • the spray suction assembly is arranged on the slide rail, and is connected with the output end of the driving member
  • the driving member is set In order to drive the suction assembly to slide on the slide rail, to realize the reciprocating movement of the suction assembly in the third direction.
  • the driving member is an electric cylinder.
  • the swing frequency of the swing mechanism is 0.1-1 (times/s), and the above swing frequency can be adaptively changed according to actual working conditions.
  • the amplitude of the swing mechanism is 100mm-250mm.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Est divulgué dans la présente demande un dispositif d'électroplacage, comprenant un ensemble de pulvérisation et d'aspiration. L'ensemble de pulvérisation et d'aspiration comprend une pompe, et un tuyau d'aspiration et un tuyau de pulvérisation, qui sont reliés à la pompe et disposés entre une plaque d'anode et une carte à circuit imprimé. La pompe est configurée pour transporter une solution de placage dans le tuyau de pulvérisation ; le tuyau de pulvérisation est configuré pour pulvériser la solution de placage dans la carte à circuit imprimé, de telle sorte qu'une pression positive est générée dans une région, qui est proche du tuyau de pulvérisation, d'un trou à plaquer ; et le tuyau d'aspiration est configuré pour aspirer la solution de placage qui passe à travers ledit trou, de façon à obtenir l'échange de la solution de placage dans ledit trou. Le tuyau d'aspiration comprend un corps de tuyau d'aspiration, et un orifice d'aspiration en forme de coin, qui est disposé sur le corps de tuyau d'aspiration dans une seconde direction et communique avec le corps de tuyau d'aspiration.
PCT/CN2022/100051 2021-12-31 2022-06-21 Dispositif d'électroplacage WO2023123908A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202111667692.1 2021-12-31
CN202111667692.1A CN114214712B (zh) 2021-12-31 2021-12-31 一种电镀装置

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WO2023123908A1 true WO2023123908A1 (fr) 2023-07-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117265609A (zh) * 2023-11-20 2023-12-22 圆周率半导体(南通)有限公司 一种提升pcb板填孔电镀镀铜均匀性的电镀设备及方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114250499B (zh) * 2021-12-31 2023-09-19 生益电子股份有限公司 一种电镀装置
CN114214712B (zh) * 2021-12-31 2023-10-03 生益电子股份有限公司 一种电镀装置
CN114705747A (zh) * 2022-03-31 2022-07-05 生益电子股份有限公司 一种基于伏安循环法监控深镀能力的方法

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Publication number Priority date Publication date Assignee Title
EP1533400A1 (fr) * 2003-11-20 2005-05-25 Process Automation International Limited Un système pour la délivrance d'un liquide pour un appareil de galvanoplastie, un appareil de galvanoplastie avec d'un tel système et un procédé d'opération d'un appareil de galvanoplastie
TWM468525U (zh) * 2013-07-30 2013-12-21 You-Ren Liu 電鍍裝置
CN111910242A (zh) * 2020-07-24 2020-11-10 广州兴森快捷电路科技有限公司 印制电路板的电镀方法及装置
CN112501664A (zh) * 2020-11-24 2021-03-16 深圳明阳芯蕊半导体有限公司 Pcb板电镀方法和pcb板电镀设备
CN213538147U (zh) * 2020-07-24 2021-06-25 广州兴森快捷电路科技有限公司 印制电路板的电镀装置
CN114214712A (zh) * 2021-12-31 2022-03-22 生益电子股份有限公司 一种电镀装置
CN114250499A (zh) * 2021-12-31 2022-03-29 生益电子股份有限公司 一种电镀装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1533400A1 (fr) * 2003-11-20 2005-05-25 Process Automation International Limited Un système pour la délivrance d'un liquide pour un appareil de galvanoplastie, un appareil de galvanoplastie avec d'un tel système et un procédé d'opération d'un appareil de galvanoplastie
TWM468525U (zh) * 2013-07-30 2013-12-21 You-Ren Liu 電鍍裝置
CN111910242A (zh) * 2020-07-24 2020-11-10 广州兴森快捷电路科技有限公司 印制电路板的电镀方法及装置
CN213538147U (zh) * 2020-07-24 2021-06-25 广州兴森快捷电路科技有限公司 印制电路板的电镀装置
CN112501664A (zh) * 2020-11-24 2021-03-16 深圳明阳芯蕊半导体有限公司 Pcb板电镀方法和pcb板电镀设备
CN114214712A (zh) * 2021-12-31 2022-03-22 生益电子股份有限公司 一种电镀装置
CN114250499A (zh) * 2021-12-31 2022-03-29 生益电子股份有限公司 一种电镀装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117265609A (zh) * 2023-11-20 2023-12-22 圆周率半导体(南通)有限公司 一种提升pcb板填孔电镀镀铜均匀性的电镀设备及方法
CN117265609B (zh) * 2023-11-20 2024-04-09 圆周率半导体(南通)有限公司 一种提升pcb板填孔电镀镀铜均匀性的电镀设备及方法

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