WO2023116183A1 - 激光指向改变时校正路径偏离的方法及其装置和机床 - Google Patents

激光指向改变时校正路径偏离的方法及其装置和机床 Download PDF

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Publication number
WO2023116183A1
WO2023116183A1 PCT/CN2022/127529 CN2022127529W WO2023116183A1 WO 2023116183 A1 WO2023116183 A1 WO 2023116183A1 CN 2022127529 W CN2022127529 W CN 2022127529W WO 2023116183 A1 WO2023116183 A1 WO 2023116183A1
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laser
turntable
laser light
axis
path
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PCT/CN2022/127529
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English (en)
French (fr)
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孙思叡
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上海名古屋精密工具股份有限公司
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Publication of WO2023116183A1 publication Critical patent/WO2023116183A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems

Definitions

  • the present invention relates to a method for adjusting the optical path of laser light, in particular to a method for compensating for the deviation of the propagation direction and/or position of the laser propagating in a rotary manner from preset, and a device and a machine tool using the method.
  • laser has been widely used in the cutting, welding and marking process of metal sheet metal and profiles, and also in technical fields such as superhard material processing to manufacture cutting tools.
  • the most common solution is to perform sheet metal and profile cutting or welding by means of a multi-axis machining center or a multi-joint robot. Its function is usually named in the industry, such as: cutting laser head or welding laser head), the focused beam emitted by the converging and the relative movement of the workpiece to be cut or welded to complete the required processing action, the focus of the laser and the processed plane (also known as height adjustment) ) is realized by the focusing module integrated in the laser or the Z-axis of the multi-axis machining center.
  • the laser transmitter is generally directly connected to the light output terminal of the laser generator through a dedicated industrial interface (such as: QBH, etc.). It is an important functional component that highly integrates external optical path functions such as collimation, beam expansion, focusing, and focusing.
  • the direct connection between the modular laser transmitter and the light output terminal of the laser generator not only simplifies equipment assembly and improves system reliability, but more importantly, simplifies the mechanical movement structure and optical path structure. By manipulating the rotation and pitch of the laser transmitter The movement can directly change the angle in the outgoing direction of the focused beam, thereby achieving a greater degree of freedom in processing.
  • the highly integrated light-emitting terminal and laser transmitter shorten the free optical path in space to the greatest extent and avoid the adverse effects of external disturbance on the beam pointing accuracy as much as possible, which is conducive to the improvement of processing accuracy.
  • this solution can freely change the laser focusing direction in a wide range, the positioning error of the focus spot will be greatly enlarged due to the deviation of the radius of the laser rotation with the turntable, and this technical solution requires that the light output terminal of the laser generator can be adjusted at any time. Since the laser emitter moves arbitrarily together in free space, there is only a fiber continuous laser or a microsecond or nanosecond-scale fiber pulse laser that connects the laser emitter and the light-emitting terminal with an optical fiber that can be bent and pulled. Only the light source can use this technical solution, and the optical fiber ultrafast laser generator that cannot be bent and pulled freely and the semiconductor laser generator that does not transmit light through the optical fiber provide a laser light source, and this technical solution cannot be used.
  • a device with an eccentric swing structure is applied to the equipment of the multi-axis machining center, which is suitable for the machining axis of "XA and YZB".
  • this solution can significantly reduce the rotary positioning error of the focused spot due to its small turning radius.
  • ultrafast lasers are restricted by technical conditions, and their optical fibers do not have sufficient movable characteristics (the allowable bending radius is too large, and the maximum total length of the optical fiber is too short), so it cannot be installed on the swing mechanism , which makes it difficult to integrate ultrafast lasers on five-axis machining centers for processing.
  • some light beams pass through the center of the turntable and then emit through the reflector placed in the center of the turntable After adjustment, it is coaxial with the rotation axis of the turntable, so no matter how the optical path part on the turntable rotates with the turntable, the beam will always be incident on the same point on the mirror on the rotation axis of the turntable in the same direction, so as to realize the laser beam emitted from the turntable on the turntable
  • the included angle of the rotation center axis is always constant.
  • the rotation of the turntable will cause the laser to reflect through the center of the turntable
  • the laser beam emitted by the mirror is deflected or/and positionally shifted with the rotation (the latter is called "deviation"), which leads to the deviation of the laser spot finally acting on the workpiece, resulting in poor processing accuracy and unable to meet the needs of precision processing .
  • This solution generally fixes the laser to emit vertically downwards and places the workpiece on the rotary swing table.
  • Adjusting the direction in which the laser acts on the workpiece by means of movement and rotation is equivalent to changing the focus direction of the laser.
  • This method does not substantially change the laser optical path, so it has the highest beam pointing accuracy, and can combine the advantages of placing optical devices such as galvanometers and shortening the optical path to further expand processing flexibility. Therefore, this solution is currently the most widely used in advanced precision processing fields such as laser processing of superhard materials.
  • One object of the present invention is to provide a method for correcting path deviation when the laser pointing changes, so as to eliminate the deviation due to factors such as stress, vibration, elastic deformation and temperature during the ultrafast laser optical path rotation, so as to meet the needs of precision processing .
  • Another object of the present invention is to provide a method for correcting path deviation when the laser pointing is changed, so that when the turntable rotates and drives the laser to change the pointing, the pointing of the laser to the workpiece conforms to the preset and remains stable, so as to meet the needs of precision machining.
  • Another object of the present invention is to provide a method for correcting path deviation when the laser pointing is changed, so that when the turntable rotates and drives the laser to change the pointing, the spot shape of the laser acting on the workpiece remains stable to meet the needs of precision machining.
  • Another object of the present invention is to provide a device for correcting the path deviation when the laser pointing changes, so as to correct the laser deviation, so that when the pointing direction of the laser changes by 30° or more, the pointing of the laser to the workpiece still conforms to Preset, the spot shape acting on the workpiece also remains stable to meet the needs of precision machining.
  • the fifth object of the present invention is to provide a multi-axis machining center, especially a multi-axis machine tool with a device for correcting path deviation when the laser pointing changes, so as to meet the needs of precision machining, improve machining accuracy, and effectively control machining costs. In particular, it solves the problem of low machining accuracy caused by the excessively large turning radius of long-axis parts.
  • the commonly understood laser is the light radiated by atoms due to excitation.
  • the electrons in the atoms absorb energy and jump from a low energy level to a high energy level, and then fall back from a high energy level to a low energy level.
  • the released energy is released in the form of photons .
  • the form of laser can be divided into continuous laser and pulsed laser. According to the pulse width characteristics of the laser, it is divided into thermal laser and cold laser.
  • Laser emitters such as but not limited to nanosecond, femtosecond or picosecond lasers that generate laser light such as infrared, infrared, blue, green, violet or extreme violet.
  • Ultrafast laser refers to a pulsed laser with an output laser pulse width of less than tens of nanoseconds, that is, a picosecond level or less than a picosecond level.
  • the core components involved in ultrafast lasers include oscillators, stretchers, amplifiers, and compressors.
  • the so-called workpiece is usually the material or semi-finished product used to manufacture parts or components, and is the processing object in the machining process. That is, after machining the workpiece, a product that meets the processing or design requirements is obtained.
  • Precision machining refers to the processing technology with extremely high machining accuracy and surface quality. For example: in tool processing, the size, straightness, profile, surface roughness, radius of blade tip arc, and machining accuracy are all higher than the micron level.
  • Shaft workpieces ie having a length at least 3 times the diameter.
  • Machining equipment is a processing equipment with multiple axes of motion. That is, in the right-handed rectangular coordinate system, the X, Y and Z axes move along the straight line, and the A, B and C axes rotate around the X, Y and Z axes respectively.
  • Machining equipment such as: CNC machine tools
  • various control software which receives and sends various instructions in the form of codes to automatically process the workpiece.
  • the laser light emitted by the ultrafast laser is first injected into a section of the cavity, and then emitted from the cavity, and then enters the laser projection relay part, the laser projection relay part changes the optical path of the laser and then emits the laser light, and finally the light output part Injected after receiving, it is used to process the workpiece.
  • the laser propagates in the cavity, and propagates along a straight line at the exit end of the cavity.
  • the laser emitted from the light-emitting part is focused within the range of the rotary axis, that is, the focused spot of the laser beam falls in a cylindrical space with a radius of 100mm centered on the rotary axis. .
  • the cavity is arranged in the turntable, which has an axis coaxial with the rotation axis of the turntable.
  • the laser light is injected into the cavity and propagates forward along a straight line, and it is preset to propagate forward along the direction of the rotary axis of the turntable (including parallel or coaxial).
  • the laser projection relay part is arranged on the turntable and is driven to rotate by the turntable.
  • the first reflector also rotates with the rotation of the turntable, so that the direction of the laser reflected by the first reflector changes. For example: the laser is incident on the laser projection relay part to the exit, and the laser pointing is rotated by 30° and above during the period. .
  • the laser travels forward along a straight line, and at the same time, the angle of intersection with a rotary axis (such as the rotary axis of the turntable) is required to be kept at 0° ⁇ 5°, the best is 0°, such as: parallel or coaxial.
  • the propagation path entering the laser projection relay component is also preset.
  • the laser projection relay part reflects the laser at least once to change the direction of the laser beam.
  • the light output component includes at least one of a field lens and a galvanometer, a focusing lens, a beam expander and a reflector, which can be obtained commercially or taken from an existing laser.
  • Aperture refers to the component that limits the light beam in the optical system. It can be the edge of a lens, a frame or a perforated screen provided. Its role is mainly to limit the beam or limit the field of view (imaging range) size.
  • the diaphragm that restricts the most beams in the optical system is called the aperture diaphragm, and the diaphragm that restricts the field of view (size) the most is called the field diaphragm.
  • diaphragms are generally used to pre-adjust the optical path, or as part of a spatial filter to shape the beam.
  • the laser optical path in front of the incident galvanometer and the rotary axis of the turntable have a set distance and a set angle. Due to factors such as stress, vibration, elastic deformation, temperature and rotation error, the actual distance between the laser optical path incident on the galvanometer and the rotary axis of the turntable When the deviation between the distance and the actual angle and the set distance and the set angle is too large, the rotation of the turntable will cause additional laser positioning errors, that is, position offset.
  • the laser passing through the turntable no longer maintains the original angle and distance (such as: coaxial) with the turntable axis of rotation. , the laser propagation will produce deflection and deviation.
  • the deflected laser is changed in direction by the laser projection relay component, the degree of deviation from the preset laser propagation path is further enlarged.
  • the axis of rotation is the A axis, the B axis or the C axis, so that the laser light emitted from the light emitting part is distributed around the direction of the rotation axis (turntable), so that the laser light path can be rotated and positioned to a specified angle for machining.
  • the turntable and the laser projection relay part and light output part arranged on the turntable move synchronously along the linear axis, so that the laser light distributed around the rotation axis moves synchronously along the linear axis according to the instruction and implements the machining of the workpiece .
  • the aperture is arranged on the laser propagation path, specifically, on a section of the propagation path before the laser exits from the cavity and enters the light-exiting component.
  • the laser is reflected at least once.
  • the diaphragm Before the laser enters the light-emitting part, it should be affected by the diaphragm, so that the diaphragm blocks the deviated laser beam, so that the undeviated laser beam can pass and continue Propagation, so that the laser light speed conforms to the preset propagation path.
  • the method of the present invention can also compensate the laser light path before entering the vibrating mirror.
  • the laser light path in front of the incident galvanometer has a second distance and a second included angle with the rotary axis of the turntable.
  • the difference is less than or equal to 1 ⁇ m, and the second included angle and Compared with the set angle, if the difference is ⁇ 0.05mrad, it is considered (after compensation) that the relative position of the laser light path incident on the galvanometer and the rotary axis of the turntable is maintained.
  • the laser light emitted by the laser emitter propagates in a straight line from one end of the cavity to the other end without deflection.
  • a lumen with a straight-through space can be used, such as but not limited to a straight tubular, conical, and frustum-shaped hole or cavity.
  • a method for correcting the deviation of the path when the laser pointing changes.
  • the laser rotates with the turntable to change the direction it points to, the laser beam that has been reflected and changed in its propagation direction continues to propagate toward the aperture, so that the laser beam passing through the aperture moves along the predetermined direction. Let the path continue to propagate.
  • the light beam passing through the diaphragm usually needs to be reflected again to adjust the direction of the laser incident galvanometer.
  • Another method of correcting the deviation of the path when the laser pointing changes the laser rotates with the turntable, and when the direction it points to changes, the laser beam that changes the direction of propagation through reflection continues to propagate toward the diaphragm, so that the laser beam passing through the diaphragm moves along the The preset path continues to propagate, so that it is reflected again to change the direction of propagation.
  • the laser that rotates with the turntable first exits the cavity of the rotary turntable, changes its propagation direction after at least one reflection, and then continues to propagate toward the aperture, so that the laser beam passing through the aperture continues to propagate along the preset path.
  • the laser corrected by the method of the present invention can not only make the light beam after passing through the diaphragm propagate along the preset path, but also can set the distance and the included angle between the laser light path incident on the galvanometer and the rotation axis of the turntable at any angle of the turntable. If it remains unchanged, the laser pointing to the workpiece can meet the preset requirements, and the shape of the spot acting on the workpiece can also be kept stable, so as to meet the needs of precision processing.
  • pre-calibration is carried out before the laser beam is injected into the cavity, so that the laser beam is along the direction of the rotary axis of the turntable (including parallel or coaxial) propagate forward. That is to adjust the laser beam in advance so that it is coaxial or parallel to the rotary axis of the turntable as much as possible.
  • closed-loop pointing control that is, real-time closed-loop adjustment of the laser pointing to the workpiece through the fast mirror and sensor before the beam passes through the aperture.
  • the sensor is used to perceive the incident information of the laser, that is, when the laser touches the sensing element, the incident angle information of the laser and the position information of the laser on the sensing element.
  • the information of the two-dimensional coordinate system where the laser spot on the sensor element is located is used as the position information.
  • the laser beam has set position information on the sensor. Due to factors such as stress, vibration, elastic deformation, temperature and rotation error, the actual position of the laser beam on the sensor deviates from the set position.
  • the sensor perceives the incident laser light, it can obtain position information, know the actual position, and provide a basis for whether there is a deviation from the set position and whether to compensate.
  • the set position information should be understood as information that is set after debugging and can meet the requirements of precision machining.
  • the distance between the focused spot of the laser beam and the rotary axis of the turntable is always maintained, that is, the turntable rotates at any angle, and the distance deviation between the focused spot and the rotary axis of the turntable is ⁇ 1 ⁇ m.
  • the laser beam enters the galvanometer and the distance deviation between the focused spot and the rotary axis of the turntable is ⁇ 1 ⁇ m, it is considered that the rotary error of the laser optical path is eliminated.
  • the sensor when the turntable rotates, receives laser information (for example: information from the information emitted from the turntable or information incident on the turntable), senses the incident information of the laser, and transmits the real-time incident information to the controller. Compare the real-time incident information with the set position information to get the offset value. When the offset value exceeds the set threshold, the reflection mechanism will be driven to adjust the laser optical path in real time for compensation, so that the laser optical path of the incident galvanometer after compensation is the same as the The relative position of the rotary axis of the turntable is maintained.
  • laser information for example: information from the information emitted from the turntable or information incident on the turntable
  • the sensor is usually set at the end where the laser light enters or exits from the turntable to receive laser information. When it is installed at the output end, it will rotate around the rotation axis of the turntable together with the turntable to receive laser information, especially it is arranged behind the reflector to receive the laser information refracted by the reflector.
  • the reflection mechanism usually includes at least one fast reflection mirror, which is used to receive the laser light emitted from the ultrafast laser, and to adjust the reflection mirror to compensate the laser light path according to the instructions of the controller.
  • Another method for correcting path deviation when the laser pointing changes When the turntable rotates, a sensor is installed at the end where the laser is emitted or incident from the turntable to receive the laser information and transmit the real-time incident information to the controller. The controller sends the real-time incident information Comparing with the set position information to get the offset value, when the offset value exceeds the set threshold, the quick mirror is driven;
  • the fast mirror reflects the laser light emitted from the ultrafast laser, and compensates the laser light path after receiving instructions from the controller, so that the relative positional relationship between the laser light path incident on the galvanometer and the rotary axis of the turntable can be maintained after compensation.
  • Another method for correcting path deviation when the laser pointing changes When the turntable rotates, a sensor is installed at the end where the laser is emitted or incident from the turntable to receive the laser information and transmit the real-time incident information to the controller. The controller sends the real-time incident information Comparing with the set position information to get the offset value, when the offset value exceeds the set threshold, the quick mirror is driven;
  • the fast mirror reflects the laser light emitted from the turntable, and after obtaining the instructions from the controller, adjusts the angle of the mirror to compensate for the laser light path (deviation) caused by the turntable rotation.
  • the method of the present invention is applied to processing equipment with multiple axes of motion (such as three-axis machine tools, four-axis machine tools, and five-axis machine tools, etc.), eliminating factors such as turntable rotation, stress, vibration, elastic deformation, temperature, and rotation errors.
  • multiple axes of motion such as three-axis machine tools, four-axis machine tools, and five-axis machine tools, etc.
  • the present invention also provides a device for correcting path deviation when the laser pointing is changed, including:
  • a turntable which performs a rotary movement, and includes a cavity for accommodating the propagation of the laser light
  • Ultrafast laser the laser emitted by it passes through the turntable through the cavity channel
  • the laser projection relay part is arranged on the turntable and rotates around the rotation axis of the turntable together with the turntable, receives the laser light from the exit end of the cavity, changes the direction of the laser light path, and then emits the laser light, including at least the first reflector and the second mirror. Reflector;
  • the diaphragm receives the light beam reflected from the first reflector.
  • the device of the present invention also includes:
  • the light emitting part is arranged on the turntable and rotates around the rotary axis of the turntable together with the turntable, receives the laser light emitted by the laser projection relay part, and focuses on the range of the rotary axis.
  • the device of the present invention also includes:
  • a controller which receives the real-time incident information sent by the sensor, and compares it with the preset position information to obtain the position offset value
  • the reflection mechanism receives the laser light emitted from the ultrafast laser, and compensates the reflected laser light path after receiving instructions from the controller.
  • the reflecting mechanism includes at least one reflecting mirror.
  • two mirrors are required.
  • each reflector is configured on a separate frame, so that each reflector has at least 2 adjustable degrees of freedom, that is, at least 2 reflectors provide more than 4 degrees of freedom to implement the laser compensation scheme .
  • a specific embodiment of a reflection mechanism including a third reflector and a fourth reflector, the third reflector reflects the laser to the fourth reflector after receiving the laser, and the fourth reflector directs the laser toward the cavity after receiving the laser reflection.
  • the laser projection relay part includes at least one reflecting mirror, which is a double-sided polished mirror. It can be used to receive the laser light reflected from the second reflector, or directly receive the laser light from the exit end of the cavity, after changing the direction of the laser light path, it can be used as the incident laser light of the vibrating mirror.
  • a sensor is installed behind the reflector, and the reflector is used to refract (transmit) the light beam to observe and detect the laser spot, and obtain real-time incident information of the laser.
  • several reflectors can also be arranged to adjust the light path of the reflected laser light.
  • the turntable such as but not limited to the inner rotor turntable, the outer rotor turntable, the mechanical transmission turntable and the direct drive turntable etc.
  • the cavity installed in the turntable has a self-contained outer wall, or the inner wall of the hollow structure in the rotor is used as the outer wall of the cavity, then the cavity is the hollow structure in the turntable at this time, thereby reducing the space occupied by the device.
  • the laser projection relay part, the light output part and the hollow turntable rotate synchronously.
  • the light emitting part is connected with the laser projection relay part, driven by the hollow turntable, and rotates around the rotary axis.
  • Various devices provided by the present invention are installed on the machining equipment, such as: three linear motion axes, one rotary motion axis for fixing the workpiece and one laser beam rotary axis are combined to form a five-axis laser machining scheme in space. It can realize the machining of the workpiece in a multi-axis manner, and manufacture products with complex and diverse structures.
  • the machine tool has at least three linear axes, wherein the device of the present invention is installed on one of the linear axes (for example: arranged on the plane determined by the X axis and the Z axis, and moves linearly along the Z axis), and the rotation is installed on the other linear axis
  • the positioning mechanism drives the positioning of the workpiece to be processed (for example: setting the workpiece on the plane determined by the X-axis and the Y-axis), eliminates factors such as stress, vibration, elastic deformation, temperature rise and rotation error, and adjusts the laser pointing and spot after focusing
  • the influence of the position so that when the turntable is at any angle, the space distance between the focused laser spot and the center of the rotary axis on the turntable surface remains unchanged, which improves the precision of laser processing and facilitates laser processing of various specifications of parts.
  • the turntable of the device of the present invention is installed on a linear axis, and the device moves along a straight line, so that the focused spot of the laser emitted by the light-emitting part moves linearly, and when the light-emitting part rotates around the rotation axis, the laser spot Distributed on the rotary surface, it is suitable for processing various workpieces.
  • the aperture is used to correct the propagation path, selectively filter out the part of the beam that deviates due to the rotation (such as: laser pointing deviation), and makes the passing
  • the laser beam of the diaphragm that is, does not deviate from the preset propagation path
  • the method provided by the invention senses the laser spot position and pointing information in real time through the sensor, and adjusts the reflection mechanism through the controller to compensate the offset caused by the laser optical path, and eliminate the rotation, stress, vibration, elastic deformation, temperature rise and rotation of the turntable Factors such as errors affect the laser pointing and spot position after focusing, so that at any angle of the turntable, the space distance between the focused laser spot and the center of the rotary axis on the turntable remains unchanged, which improves the laser processing accuracy.
  • the laser head of the ultrafast laser is installed vertically and directed downward, which facilitates the integration of the ultrafast laser on machining equipment and implements precise laser processing.
  • the diaphragm is arranged between two adjacent mirrors in the laser projection relay part, and the laser deviation caused by factors such as turntable rotation, stress, vibration, elastic deformation, temperature rise, and rotation error can be predicted. Correction of the established propagation path is beneficial to the low-cost transformation of existing machining equipment, and is beneficial to the integration of ultrafast lasers on machining equipment to implement laser precision machining.
  • FIG. 1 is a schematic diagram of an embodiment of an existing device for laser machining
  • Fig. 2 is the schematic diagram of an embodiment of the laser optical path of an existing device for laser machining
  • Fig. 3 is the schematic diagram of another embodiment of the laser optical path of the existing device for laser machining
  • Fig. 4 is the schematic diagram of an embodiment of the method of the present invention.
  • Fig. 5 is an enlarged schematic diagram of an angle of the diaphragm shown in Fig. 4;
  • Figure 6 is a schematic diagram of an embodiment of a device for implementing the method of the present invention.
  • Figure 7 is a schematic diagram of another embodiment of the device for implementing the method of the present invention.
  • Fig. 8 is a schematic diagram of the notch of the laser on the surface of the workpiece when the device of the present invention is used to process the workpiece;
  • FIG. 9 is a schematic diagram of the laser marking on the surface of the workpiece after the aperture of the device of the present invention is removed.
  • the laser light emitted by the laser transmitter is first injected into a section of cavity, and then emitted from the cavity, and then enters the laser projection relay part, which changes the propagation path of the laser After that, the laser is emitted, and finally it is received by the light-emitting component and emitted for processing the workpiece.
  • the laser beam propagates in the cavity, either along a straight line or along a folded line. The laser propagates along a straight line at the exit end of the cavity.
  • the rotation axis is the A-axis, B-axis or C-axis, so that the laser emitted by the light-emitting part is distributed around the rotation axis, and the laser is focused on the range of the rotation axis.
  • Inner that is, in the plane of revolution (circle) with a radius of 100 mm from the center of the axis of rotation, especially focusing on the axis of rotation.
  • the laser pointing direction is changed by the rotation of the rotary shaft to implement machining.
  • the cavity is in the Y-axis direction
  • the rotation axis is the B-axis
  • the light-emitting component rotates around the B-axis.
  • FIG. 1 is a schematic diagram of an embodiment of a conventional laser machining device. As shown in FIG. 1 , the device includes a laser emitter 100 , a cavity 200 , a laser projection relay component 700 , a light output component 300 and a turntable 400 .
  • the laser emitter 100 is disposed at one end of the cavity 200 , and the laser 110 emitted from the laser emitter 100 enters the cavity 200 .
  • the cavity 200 is in the shape of a straight tube, and the laser 110 emitted from the laser emitter 100 propagates along a straight line after being incident on the cavity 200 without deflection, and is coaxial or parallel to the rotation axis of the turntable 400, and reaches the other end shoot.
  • the laser projection relay part 700 the laser beam emitted from the cavity 200 is redirected and received by the light emitting part 300, and the emitted laser beam 310 is focused within the range of the rotary axis 410 for processing the workpiece.
  • the laser projection relay part 700 includes a first reflection mechanism 710 and a second reflection mechanism 720.
  • the first reflection mechanism 710 receives the laser light that enters the laser projection relay part, and directs the laser light toward the second reflection mechanism 720. direction reflection, the second reflection mechanism 720 receives the laser light 730 reflected from the first reflection mechanism 710, reflects the laser light 730 again, and emits the laser light out of the projection relay component.
  • the laser projection relay part 700 is driven by the turntable 400, rotates around the rotary shaft 410, and receives the laser from the exit end of the cavity, changes the direction of the optical path of the laser, and then emits the laser.
  • the light emitting component 300 rotates around the rotation axis 410 and emits the laser beam 310 for machining.
  • the turntable 400 turns around the Y axis, and the axis around which it turns is the B axis (not shown).
  • the lumen 200 has an axis (colinear with the laser 110 in the figure, not shown), which is coaxial with the B-axis.
  • the light emitting component 300 rotates around the B-axis, so that the emitted laser light is distributed around the B-axis direction, so that the laser can be machined in a rotating manner.
  • the cavity 200 is arranged in the turntable 400, that is, a section of the turntable 400 is located in a straight tube-shaped hollow cavity, and the axis of the cavity is coaxial with the B-axis and also coaxial with the rotational symmetry axis of the turntable.
  • the cavity 200 disposed therein does not shift, so that the laser light 110 passing through the cavity 200 always propagates along a straight line without deflection, and is always received by the light output component 300 .
  • the laser light is distributed in the direction of rotation around the B-axis.
  • the laser projects the relay components and the light output
  • the component also rotates around the rotary axis 410 , and the laser used for machining is emitted from the light emitting component 300 and rotates around the rotary axis 410 of the turntable together.
  • the laser projection relay part rotates with the turntable, so that the laser pointing changes, such as: 1°, 5°, 10°, 20°, 30°, 40°, 50°, 60°, 70°, 80° and 90° or more .
  • FIGS. 3 are the schematic diagrams of another embodiment of the laser light path of the existing device for laser machining, which schematically show that when the relay part and the light exit part rotate with the turntable, the laser light path 110 of the incident cavity and the If the rotation axis 410 of the turntable is not coaxial, the laser light emitted by the light emitting component 300 cannot land on the same position. Therefore, it is still necessary to readjust the optical path frequently, and it takes a lot of time to adjust the actual distance and actual included angle between the laser optical path of the incident galvanometer and the rotary axis of the turntable deviated from the set distance and set angle. Not conducive to cost control.
  • this embodiment provides a method for correcting path deviation when the laser pointing changes.
  • the laser beam emitted from the turntable 400 changes its propagation direction after at least one reflection, and then continues to propagate toward the diaphragm, so that the laser beam passing through the diaphragm travels along the Preset paths continue to propagate.
  • FIG. 4 is a schematic diagram of an embodiment of the method of the present invention
  • FIG. 5 is an enlarged schematic diagram of an angle of the diaphragm shown in FIG. 4 . In combination with Fig. 1, as shown in Fig. 4 and Fig.
  • the laser projection relay part is rotated synchronously by the turntable 400, and during operation, the beam 761 is affected by factors such as stress, vibration, temperature and elastic deformation, and the beam 761 deviates This is followed by light beam 762 .
  • the laser beam 760 that conforms to the preset propagation path can be obtained through the aperture 750, that is, the propagation direction is changed by reflection, for example: the reflection changes the propagation direction and then enters The light output component 300, so that the beam that deviates from the preset propagation path can be corrected, and when the laser rotates synchronously with the turntable and its propagation direction changes by 180° or more, the pointing of the laser to the workpiece conforms to the preset, and the direction of the laser beam acting on the workpiece The spot shape also remains stable to meet the needs of precision machining.
  • Fig. 6 is a schematic diagram of an embodiment of a device for implementing the method of the present invention.
  • the device of this embodiment includes a turntable 400 , an ultrafast laser 120 and a laser projection relay unit 700 .
  • the turntable 400 is hollow and includes a cavity for accommodating the propagation of laser light.
  • the ultrafast laser 120 is placed on the bracket 600 , and the emitted laser 121 is reflected by the reflection mechanism 800 and redirected, and then injected into the cavity 200 .
  • the laser 121 propagates along a straight line.
  • the laser projection relay part 700 is set on the turntable 400 and rotates around the rotation axis of the turntable with the turntable 400, receives the laser from the exit end of the cavity, changes the optical path direction of the laser, and then emits the laser, including at least the first reflector 731 and the second mirror 721.
  • the aperture 750 is arranged between the first reflector 731 and the second reflector 721, so that after being reflected by the first reflector 731 and changing the propagation direction, it continues to propagate toward the aperture 750, so that the laser beam passing through the aperture 750 travels along the predetermined direction. Let the path continue to propagate. From the incident laser to the laser projection relay part to the exit, the sum of the changes in the propagation angle of the laser reaches 180° and above.
  • the laser light is redirected by the laser projection relay component 700 and then received by the vibrating mirror 320 of the light output component.
  • the light emitting component rotates around the rotary axis and focuses on the range of the rotary axis.
  • pre-calibration is carried out before the laser beam is injected into the cavity, so that the laser beam is along the direction of the rotary axis of the turntable (including parallel or coaxial) propagate forward. That is to adjust the laser beam in advance so that it is coaxial or parallel to the rotary axis of the turntable as much as possible.
  • closed-loop pointing control that is, real-time closed-loop adjustment of the laser's pointing to the workpiece through fast mirrors and sensors.
  • the sensor rotates with the turntable around the axis of rotation of the turntable, and the sensor is installed at the end where the laser beam exits from the turntable, receives laser information, and transmits the real-time incident information to the controller, and the controller compares the real-time incident information with the setting The position information is compared to obtain the offset value, and when the offset value exceeds the set threshold, the reflection mechanism is driven.
  • the reflection mechanism receives the laser light emitted from the ultrafast laser, and compensates the laser light path after receiving the instruction from the controller, so that the relative position of the laser light path incident on the galvanometer and the rotary axis of the turntable can be maintained after compensation.
  • Fig. 7 is a schematic diagram of another embodiment of a device for implementing the method of the present invention.
  • the inner wall of the hollow structure in the rotor is used as the outer wall of the cavity
  • the cavity 200 is the cavity of the hollow structure in the turntable.
  • the ultrafast laser 120 is placed on the bracket 600 , the emitted laser light 121 is reflected by the reflection mechanism 800 and redirected, and then injected into the cavity 200 .
  • the laser 121 propagates along a straight line.
  • the laser light is redirected by the laser projection relay component 700 and then received by the vibrating mirror 320 of the light output component.
  • the light emitting component rotates around the rotary axis and focuses on the range of the rotary axis.
  • the laser projection relay part includes at least one reflector-type double-sided polished lens.
  • the laser projection relay component is provided with a second reflector 721 and a first reflector 731 .
  • the first reflector 731 reflects the laser light, so that the light beam propagates toward the aperture 750, and after passing through the aperture 750, the propagation path conforms to the preset path, and moves toward the second reflector 721, and the second reflector After the 721 receives the laser light, it reflects the laser light towards the vibrating mirror.
  • the sensor 900 is located behind the second reflector 721, and uses the light passing through the reflector to detect the laser spot from the exit end of the cavity to obtain real-time position information of the laser.
  • the controller (not shown) receives the real-time position information sent by the sensor 900 and compares it with the preset position information to obtain a position offset value. When the position deviation value exceeds the threshold value, it indicates that the relative position between the laser light path and the rotary axis of the turntable cannot be maintained, and an instruction is sent to the reflection mechanism.
  • two sensing elements are used to obtain the incident angle information of the laser light and the position information of the laser light on the sensing element respectively, so as to obtain more incident information of the laser light.
  • the reflection mechanism 800 adjusts the received laser light from the ultrafast laser, and adjusts the optical path of the emitted laser light, so that the relative position between the incident laser light path 740 of the galvanometer and the rotary axis of the turntable can be maintained and compensated in real time. Changes in the laser light path.
  • the reflecting mechanism 800 includes a third reflecting mirror 810 and a fourth reflecting mirror 820, and each reflecting mirror is configured on a separate frame, so that each reflecting mirror has at least two adjustable degrees of freedom, That is, more than 4 degrees of freedom are provided through at least 2 mirrors to implement the laser compensation scheme. Specifically, after the third reflector 810 receives the laser light, it reflects the laser light to the fourth reflector 820.
  • the fourth reflector After the fourth reflector receives the laser light, it reflects the laser light toward the cavity, so that the laser light path of the incident galvanometer is opposite to the rotation axis of the turntable. The position is maintained.
  • the AOI of the third mirror 810 and the fourth mirror 820 are both 22.5°.
  • the senor 900 can also be installed before the laser incident on the turntable 400, and the light transmitted through the reflector can be used to detect the laser spot from the exit end of the cavity to obtain the real-time position information of the laser; or the reflection mechanism 800 can be placed on the turntable Above 400, all should be regarded as the equivalent replacement of this technical solution.
  • machining equipment for example: a spatial five-axis laser machining solution is formed by combining three linear motion axes, one rotary motion axis for fixing the workpiece and one laser beam rotary axis,
  • the workpiece can be machined in a multi-axis manner, and products with complex and diverse structures can be manufactured, especially suitable for precision machining of long-axis parts.
  • the machine tool has at least three linear axes, wherein the device of the present invention is installed on one of the linear axes (for example: arranged on the plane determined by the X axis and the Z axis, and moves linearly along the Z axis), and the rotation is installed on the other linear axis Positioning mechanism, which drives the positioning of the workpiece to be processed (for example: setting the workpiece on the plane determined by the X-axis and Y-axis), and eliminates factors such as stress, vibration, elastic deformation or temperature that cause the relative position of the beam and the rotary axis of the turntable to be unable to maintain In this case, improving the precision of laser processing is conducive to the implementation of laser processing on various specifications of parts.

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Abstract

一种激光指向改变时校正路径偏离的方法，自激光发射器（100）射出的激光（110）随转台（400）转动，使其所指向的方向改变时，将经反射改变传播方向的激光继续朝向光阑（750）传播，使得通过光阑的激光光束沿着预设路径继续传播。以及一种应用该方法的加工设备、一种装置和一种机加工设备。该方法可消除转台转动、应力、振动、弹性形变或温度等因素导致光束传播方向偏离预设方向，使得激光对工件的指向符合预设，作用于工件的光斑形状也保持稳定，以满足精密加工的需要。

Description

激光指向改变时校正路径偏离的方法及其装置和机床 技术领域
本发明涉及一种调整激光光路的方法，尤其涉及一种对以回转方式传播的激光发生传播方向和/或位置偏离预设而进行补偿的方法，以及采用此方法的装置和机床。
背景技术
目前激光已经被广泛应用于金属钣金及型材的切割、焊接及打标加工工艺中，也有应用于如超硬材料加工以制造切削刀具等技术领域。由多轴加工中心或多关节机器人以激光为手段实施钣金和型材切割或焊接加工是最常见的解决方案，其利用机械轴驱动经由激光发射器(即用于实施加工的激光输出部件，根据其功能在行业内通常名称如：切割激光头或焊接激光头)汇聚射出的聚焦光束与被切割或焊接工件发生相对移动以完成所需加工动作，激光和被加工平面的对焦(又称调高)则由集成于激光器的对焦模块或者多轴加工中心的Z轴来实现。激光发射器一般通过专用的工业化接口(如：QBH等)直接驳接激光发生装置的出光端子，它是将准直、扩束、对焦及聚焦等外光路功能高度集成的重要功能部件。通过模块化的激光发射器与激光发生装置的出光端子的直连，不仅简化设备装配并提高系统可靠性，更重要的是简化机械运动结构和光路结构，通过操纵激光发射器的旋转运动和俯仰运动即可直接在聚焦光束出射方向上实现角度的改变，进而达到较大的加工自由度。除此之外，通过高度集成的出光端子和激光发射器最大程度缩短了空间自由光路并尽可能避免了外界扰动对光束指向精度的不利影响，有利于加工精度的提高。虽然此种方案可以实现激光聚焦方向在大范围的自由改变，但此方案因激光随转台转动的半径偏大会显著放大聚焦光斑的定位误差，且此种技术方案要求激光发生装置的出光端子可以随着激光发射器在自由空间中一起任意移动，因此只有用具有可弯折和牵拉特性的光纤将激光发射器和出光端子相连起来的光纤连续激光器或微秒或纳秒量级的光纤脉冲激光器光源才可以使用该技术方案，而光纤不能自由弯折牵拉的光纤超快激光发生装置和不通过光纤传输光的半导体激光发生装置等提供激光光源的，则无法使用该技术方案。
为了兼顾激光聚焦方向在大范围的自由改变和尽量小的回转定位误差，一种具有偏心摆动构造的装置被应用到多轴加工中心的设备中，适用于加工轴系为“XA和YZB”的多轴激光加工，此种方案由于具有较小的回转半径进而可以显著缩小聚焦光斑的回转定位误差。这对于通常脉冲激光器是可行的，但超快激光器受技术条件制约，其光纤不具有足够的可运动特性(其可允许弯折半径过大，光纤最大总长过短)，无法安装于摆动机构上，这使得在五轴加工中心上集成超快激光器进行加工难以实现。为了解决这一问题，进一步提出了将一些光束穿过转台中心后借由置于转台中心反射镜射出的飞行光路方案(如：CN202020298469.9和CN202020298514.0)，在该系列 方案中激光光束经过调整后与转台转轴同轴，因此无论转台上的光路部分如何随转台旋转，光束始终都以相同方向入射位于转台转轴线的反射镜上同一点并借此实现从转台上出射的激光光束于转台回转中心轴线的夹角始终不变。但当未能正确调整，或由于加工中心运行中产生的各种应力、振动、弹性形变和温度等因素导致激光光束不再与转台中心保持同轴时，转台的旋转会导致激光经转台中心反射镜射出的激光光束随着旋转发生角度偏转或/和位置偏移(后者称“偏离”)，进而导致最终作用于工件上的激光光斑发生偏离，导致加工精度不良，无法满足精密加工的需求。
另一方面，通过振镜等光学装置代替机械轴改变光束聚焦方向也是一个常见的解决方案，该技术方案对激光器光源一般没有特殊要求，虽然也有前聚焦振镜等技术改良方案，但总的来说聚焦光束只能在有限角度内进行调整，难以满足工业应用中对激光聚焦方向大范围自由改变的需求；而另一个明显的问题在于是聚焦焦距受限，在振镜加工方案中无论是前聚焦振镜还是后聚焦振镜，为了获得更大的加工幅面就需要设置更大直径的和更远焦距(即工作距离)的聚焦镜(场镜)，更大直径的聚焦镜(场镜)不仅难以制造且成本高昂，同时更远的工作距离会降低激光束指向精度并进而降低整个加工系统的加工定位精度，因此用振镜实现大范围大角度高精度的激光自由加工在很多情况下是过于昂贵和难以实施的。
另一方面，利用多轴机械结构改变被加工工件角度是激光精密加工中最主要的解决方案，这一方案一般固定激光垂直向下发射并把工件置于回转摇摆台上，通过控制工件的俯仰运动和旋转运动等方式调整激光作用于工件的方向，即相当于改变了激光聚焦方向。这一方式实质上不改变激光光路因而具有最高的光束指向精度，并可以同时结合振镜等光学装置的置入和光路短化等手段的优势以进一步拓展加工灵活性。因此这一方案目前在超硬材料的激光加工等先进精密加工领域得到了最广泛应用。但这种方案其受限于多轴机械结构的设置，不具有普遍的适用性，尤其是用于长轴类零件加工时会由于零件长度放大零件的回转半径进而导致回转定位误差放大。
因此总的来说，虽然技术人员已经为激光高精度大角度加工开发了众多技术手段，但如何在目前的激光加工中兼顾更大的光束指向自由度和更好的光束指向定位精度仍有待解决。
发明内容
本发明的一个目的在于提供一种激光指向改变时校正路径偏离的方法，以消除超快激光光路回转中，应受到应力、振动、弹性形变和温度等因素而发生偏离，以满足精密加工的需要。
本发明的另一个目的在于提供一种激光指向改变时校正路径偏离的方法，使得转台旋转并带动激光改变指向时，激光对工件的指向符合预设并保持稳定，以满足精密加工的需要。
本发明的再一个目的在于提供一种激光指向改变时校正路径偏离的方法，使得转台旋转并带动激光改变指向时，激光作用于工件的光斑形状保持稳定，以满足精密加 工的需要。
本发明的又一个目的在于提供一种装置，用于激光指向改变时校正路径偏离，以实施对激光偏离的校正，使得激光所指向的方向改变30°及以上时，激光对工件的指向仍符合预设，作用于工件的光斑形状也保持稳定，以满足精密加工的需要。
本发明的第五目的在于提供一种多轴加工中心，尤其是具有激光指向改变时校正路径偏离的装置的多轴机床，以满足精密加工的需要，既提高加工精度，也有效控制加工成本，尤其是解决长轴类零件自身回转半径过大导致加工精度偏低的问题。
通常理解的激光，系原子因受激而辐射的光，原子中的电子吸收能量后从低能级跃迁到高能级，再从高能级回落到低能级的时候，所释放的能量以光子的形式放出。激光的形态可分为连续激光和脉冲激光。依据激光的脉冲宽度特性分为热激光和冷激光。
激光发射器如：但不限于纳秒、飞秒或皮秒激光器，产生的激光如：红外、红外、蓝光、绿光、紫光或极紫光。
超快激光是指输出激光的脉冲宽度数十纳秒以下，即皮秒级别或小于皮秒级别的脉冲激光。超快激光器涉及的核心部件包括振荡器、展宽器、放大器和压缩器等。
在机加工中，所称的工件通常是用于制造零件或部件的材料或半成品，是机械加工过程中的加工对象。即对工件实施机加工后，得到符合加工或设计要求的产品。
精密加工，指加工精度和表面质量达到极高程度的加工技术。比如：刀具加工中，尺寸、直线度、轮廓度、表面粗糙度、刃尖圆弧半径、加工精度均高于达到微米级。
轴类工件，即具有长度是直径至少3倍。
机加工设备(或机加工中心)，系具有多个运动轴的加工设备。即在右手直角坐标系中，沿直线方向移动的X、Y和Z轴，以及分别绕X、Y和Z轴的回转的A轴、B轴和C轴。
机加工设备，如：数控机床，通常加载了各项控制软件，以代码形式接收和发出各项指令对工件实施自动化加工。
本发明中，超快激光器射出的激光先射入一段腔道，再自腔道射出后，再进入激光投射中继部件，激光投射中继部件改变激光的光路后再射出激光，最后由出光部件接收后射出，用于对工件实施加工。激光在腔道内传播，在腔道的出口端沿着直线传播，自出光部件射出的激光聚焦于该回转轴范围内，即激光束聚焦光斑落在以回转轴为中心半径100mm的圆柱形空间内。
本发明中，腔道设置于转台中，其具有与转台回转轴共轴的轴线。激光射入腔道并沿着直线向前传播，预设沿转台回转轴的走向(包括平行或同轴)向前传播。激光投射中继部件设置于转台上，受转台驱动而转动。第一反射镜也同样随着转台的转动而转动，使得经由第一反射镜反射出的激光所指向的方向改变，比如：激光入射激光投射中继部件至出射，期间激光指向转动30°及以上。
为了满足精密加工的要求，激光沿着直线向前传播，于此同时与一条回转轴(如： 转台的回转轴)的交角要求保持在0°～5°，最佳的为0°，如：平行或同轴。由此，当其出射后，进入激光投射中继部件的传播路径同样得以预先设定。
激光投射中继部件至少对激光进行1次反射以改变激光光束方向。
出光部件至少包括场镜及振镜、聚焦镜、扩束镜和反射镜之一，其可通过市售获得，或者取自现有激光器中。
光阑是指在光学系统中对光束起着限制作用的部件。它可以是透镜的边缘、框架或经设置的带孔屏。其作用主要是限制光束或限制视场(成像范围)大小。光学系统中限制光束最多的光阑，称为孔径光阑，限制视场(大小)最多的光阑，称为视场光阑。在激光领域，光阑一般用来对光路进行预调，或者作为空间滤波器的一部分用来对光束进行整形。
入射振镜前的激光光路与转台回转轴线具有设定距离和设定夹角，由于应力、振动、弹性形变、温度及回转误差等因素致使入射振镜的激光光路与转台回转轴心线的实际距离和实际夹角与设定距离和设定夹角的偏差过大时，转台的回转会造成额外的激光定位误差，即发生位置偏移。
实际工况下，由于应力、振动、弹性形变、温度及回转误差等因素，转台转动时穿过转台的激光不再与转台回转轴线保持原先的夹角及距离的情况(如：同轴)下，激光传播将产生偏转和偏离。当偏离后的激光经激光投射中继部件改变方向后，其与预设的激光传播路径偏离程度被进一步扩大。
本发明的方法实施时，回转轴为A轴、B轴或C轴，使出光部件射出的激光绕(转台)回转轴方向分布，实现激光光路以回转运动及定位至指定角度实施机加工。
本发明的方法实施时，转台及设置于转台上的激光投射中继部件和出光部件沿直线轴同步移动，以使绕回转轴方向分布的激光根据指令沿直线轴同步移动并实施工件的机加工。
本发明的方法，将光阑设置在激光传播的路径上，具体地，设置在激光从腔道出射后，再入射出光部件前的一段传播路径上。在此段路径上，激光至少被进行1次反射，在激光入射出光部件前，应受到光阑的作用，使得光阑对发生偏离的激光光束进行阻挡，使得未偏离的激光光束得以通过并继续传播，由此使得激光光速符合预设的传播路径。
本发明的方法，还可以对入射振镜前的激光光路进行补偿。经补偿后入射振镜前的激光光路与转台回转轴心线具有第二距离和第二夹角，当第二距离和设定距离相比，差值相比≤1μm，以及第二夹角和设定夹角相比，差值≤0.05mrad，则认为(补偿后)入射振镜的激光光路与转台回转轴心线的相对位置得以保持。
为了实施本发明的方法，优先选择激光发射器射出的激光从腔道一端入射至另一端出射均沿直线方向传播，不发生偏转。可采用具有直通空间的腔道，如：但不限于直管状、圆锥状和圆台状孔体或腔体等。
一种激光指向改变时校正路径偏离的方法，激光随转台转动，使其所指向的方向 改变时，将经反射改变传播方向的激光继续朝向光阑传播，使得通过光阑的激光光束沿着预设路径继续传播。
需要接入振镜等光学器件时，则通过光阑的光束通常需要再经反射以此调整激光入射振镜的方向。
另一种激光指向改变时校正路径偏离的方法，激光随转台转动，使其所指向的方向改变时，将经反射改变传播方向的激光继续朝向光阑传播，使得通过光阑的激光光束沿着预设路径继续传播，使被再次反射改变传播方向。
随转台转动的激光，先从回转转台的腔道出射，经至少1次反射改变传播方向，再继续朝向光阑传播，使得通过光阑的激光光束沿着预设路径继续传播。
经本发明方法校正的激光，不仅能使得经过光阑后的光束沿预设路径传播，在转台任意角度下其入射振镜的激光光路与转台回转轴线之间设定距离和设定夹角也保持不变，能使激光对工件的指向符合预设要求，作用于工件的光斑形状也能保持稳定，从而满足精密加工的需要。
为了提高激光对工件的指向符合预设要求的稳定性，以及作用于工件的光斑形状的稳定性，在激光束射入腔道前进行预校准，使得激光光束沿转台回转轴的走向(包括平行或同轴)向前传播。即预先调整激光光束，使其与转台回转轴尽量处于同轴或平行状态。或者进行闭环指向控制，即在光束通过光阑前通过快反镜和传感器对激光对工件的指向进行实时闭环调节。
传感器用于感知激光的入射信息，即包括激光碰触传感元件时，激光的入射角信息，以及激光在传感元件上的位置信息。通常，以传感元件上的激光光斑所处二维坐标系的信息作为位置信息。激光光束在传感器上具有设定位置信息，由于应力、振动、弹性形变、温度及回转误差等因素致使激光光速在传感器上的实际位置与设定位置相比发生偏差。当传感器感知入射的激光后，就能取得位置信息，知悉实际位置，并为与设定位置是否发生偏差，以及补偿与否提供依据。在传感器中，通常至少具有一个传感元件，但为了获得更多的激光入射信息，则采用两个或更多的传感元件是更优的选择。
设定位置信息应当理解为是经调试而设定的，能够满足精密加工要求的信息。比如：激光光束的聚焦光斑与转台回转轴线的距离始终得以保持，即转台转动任意角度，聚焦光斑至转台回转轴线的距离偏差≤1μm。当(补偿后)激光光束入射振镜而取得聚焦光斑至转台回转轴线的距离偏差≤1μm时，则认为激光光路的回转误差被消除。
本发明的方法，在转台转动时，传感器接收激光信息(比如：来自从转台中出射的信息或入射转台的信息)，并感知激光的入射信息，并将实时入射信息传送至控制器，控制器将此实时入射信息与设定位置信息进行比较，得到偏移值，当偏移值超出设定阈值时，则驱动反射机构，实时调整激光光路进行补偿，使补偿后入射振镜的激光光路与转台回转轴心线的相对位置得以保持。
传感器通常设置于激光从转台中入射或出射的一端，接收激光信息。当其设置于 出射的一端时，则随转台一同绕转台回转轴线转动，接收激光信息，尤其是设置于反射镜之后，接收由反射镜折射的激光信息。
反射机构，通常至少包括1件快反镜，用于接收来自超快激光器射出的激光，以及控制器的指令，调整反射镜对激光光路进行补偿。
另一种激光指向改变时校正路径偏离的方法，在转台转动时，激光从转台出射或入射的一端设置传感器，接收激光信息，并将实时入射信息传送至控制器，控制器将此实时入射信息与设定位置信息进行比较，得到偏移值，当偏移值超出设定阈值时，则驱动快反镜；
快反镜反射来自超快激光器射出的激光，并在获得控制器的指令后，对激光光路进行补偿，使补偿后入射振镜的激光光路与转台回转轴心线的相对位置关系得以保持。
另一种激光指向改变时校正路径偏离的方法，在转台转动时，激光从转台出射或入射的一端设置传感器，接收激光信息，并将实时入射信息传送至控制器，控制器将此实时入射信息与设定位置信息进行比较，得到偏移值，当偏移值超出设定阈值时，则驱动快反镜；
快反镜反射来自从转台出射的激光，并在获得控制器的指令后，调整反射镜角度对转台回转造成的激光光路(出现的偏差)进行补偿。
本发明的方法应用于具有多个运动轴的加工设备(如：三轴机床、四轴机床和五轴机床等)，消除转台转动、应力、振动、弹性形变、温度及回转误差等因素对聚焦后激光指向和光斑位置的影响，以使在转台转动任意角度时，聚焦后的激光光斑距离转台面上回转轴中心处的空间距离得以保持。
为实施上述方法，利于将本发明的方法应用于机加工设备，本发明还提供一种装置，激光指向改变时以实施校正路径偏离，包括：
转台，其实施回转运动，包括腔道，其腔道用于容纳激光的传播；
超快激光器，其射出的激光经腔道通过转台；
激光投射中继部件，设置于转台上并随转台一同绕转台回转轴线转动，接收来自腔道出射端的激光，使激光的光路方向发生改变后，再射出激光，至少包括第一反射镜和第二反射镜；
光阑，接收来自第一反射镜反射的光束。
本发明的装置，还包括：
出光部件，设置于转台上并随转台一同绕转台回转轴线转动，接收由激光投射中继部件射出的激光，并聚焦于回转轴范围内。
本发明的装置，还包括：
传感器，获得激光的实时入射信息；
控制器，其接收传感器发出的实时入射信息，并与预设位置信息进行比较，得到位置偏移值；
反射机构，其接收来自超快激光器射出的激光，并在获得控制器的指令后，对反射后的激光光路进行补偿。
本发明的装置，反射机构至少包括1件反射镜。但为了取得更优的激光光路补偿方案，则需要2件反射镜。进一步，各个反射镜被配置于单独的镜架上，以使各件反射镜均至少具有2个可调节的自由度，即通过至少2件反射镜提供4个以上自由度，以实施激光补偿方案。
一种反射机构的具体实施方式，包括第三反射镜和第四反射镜，第三反射镜受到激光后，将激光反射至第四反射镜，第四反射镜受到激光后，将激光朝向腔道反射。
本发明的装置，激光投射中继部件至少包括1件反射镜，系双面抛光镜片。其可用于接受从第二反射镜反射的激光，或者直接接受来自腔道出射端的激光，使激光的光路方向发生改变后，作为振镜的入射激光。
在反射镜之后设置传感器，利用反射镜折射(透过)光束来观察检测激光光斑，获取激光的实时入射信息。
为了便于反射的激光作为振镜的入射激光，其间还可设置若干反射镜，调整反射的激光光路。
本发明提供的装置，转台如：但不限于内转子转台、外转子转台、机械传动转台和直驱转台等，其内中空，以设置腔道。设置于转台内的腔道，其具有自成外壁，或者利用转子内中空构造的内壁作为腔道的外壁，则此时腔道即为转台内的中空构造，以此减少装置所占的空间。
本发明提供的装置，激光投射中继部件、出光部件与中空转台同步转动。具体的，出光部件与激光投射中继部件相连，受中空转台驱动，绕回转轴转动。
本发明提供的各种装置安装于机加工设备上，比如：以三个直线运动轴、一个用于固定工件的回转运动轴和一个激光束回转轴相组合形成空间五轴激光机加工方案，就能实现以多轴方式对工件进行机加工，制造复杂和多样构造的产品。比如：机床具有至少三个直线轴，其中一个直线轴上安装本发明的装置(比如：设置在X轴和Z轴确定的平面上，并沿Z轴直线移动)，另一个直线轴上安装转动定位机构，驱动被加工工件回转的定位(比如：将工件设置于X轴和Y轴确定的平面上)，消除应力、振动、弹性形变、温升及回转误差等因素对聚焦后激光指向和光斑位置的影响，以使在转台任意角度时，聚焦后的激光光斑距离转台面上回转轴中心处的空间距离不变，提高激光加工的精密度，利于对各种规格零件实施激光加工。
另一种机加工设备，将本发明装置的转台安装于直线轴上，装置沿直线移动，则使得出光部件射出的激光的聚焦光斑呈线性移动，当出光部件绕回转轴转动，则使得激光光斑分布于回转面上，适应各种工件加工。
本发明技术方案实现的有益效果：
本发明提供的方法，在激光随转台转动，使得激光指向改变时以光阑对传播路径进行校正，选择性地滤除因回转而发生偏离(如：激光指向偏差)的部分光束，并使 得通过光阑的激光光束(即未偏离预设传播路径)沿着预设路径继续传播，再经反射改变传播方向，仍能使激光保持对工件的指向符合预设，作用于工件的光斑形状也保持稳定，以满足精密加工的需要。
本发明提供的方法，通过传感器实时感知激光光斑位置及指向信息，并经控制器对反射机构进行调节，补偿激光光路产生的偏移，消除转台转动、应力、振动、弹性形变、温升及回转误差等因素对聚焦后激光指向和光斑位置的影响，以使在转台任意角度时，聚焦后的激光光斑距离转台面上回转轴中心处的空间距离不变，提高了激光加工精度。
本发明提供的方法，将超快激光器的激光头竖直安装，并朝向下方，利于超快激光器集成于机加工设备上，实施激光的精密加工。
本发明提供的装置，将光阑设置于激光投射中继部件中2个相邻反射镜之间，对转台转动、应力、振动、弹性形变、温升及回转误差等因素所致的激光偏离预设的传播路径进行校正，利于对现有机加工设备进行低成本改造，利于超快激光器集成于机加工设备上，实施激光的精密加工。
附图说明
图1为现有用于激光实施机加工的装置一实施例的示意图；
图2为现有用于激光实施机加工的装置激光光路一实施例的示意图；
图3为现有用于激光实施机加工的装置激光光路另一实施例的示意图；
图4为本发明方法一实施例的示意图；
图5为图4所示光阑一角度的放大示意图；
图6为用于实施本发明方法的装置一实施例的示意图；
图7为用于实施本发明方法的装置另一实施例的示意图；
图8为采用本发明装置对工件实施加工时激光在工件表面的刻痕的示意图；
图9为将本发明装置的光阑移除后激光在工件表面的刻痕的示意图。
具体实施方式
以下结合附图详细描述本发明的技术方案。本发明实施例仅用以说明本发明的技术方案而非限制，尽管参照较佳实施例对本发明进行了详细说明，本领域的普通技术人员应当理解，可以对发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的精神和范围，其均应涵盖在本发明的权利要求范围中。
本实施例提供的激光实施机加工的方法，激光发射器射出的激光先射入一段腔道，再自腔道射出后，再进入激光投射中继部件，激光投射中继部件改变激光的传播路径后再射出激光，最后由出光部件接收后射出，用于对工件实施加工。激光在腔道内传播，或沿直线传播，或沿折线传播。激光在腔道的出口端沿着直线传播，在右手 直角坐标系中，回转轴为A轴、B轴或C轴，使出光部件射出的激光绕回转轴方向分布，激光聚焦于该回转轴范围内，即以与回转轴为中心半径100mm的回转(圆)面内，尤其是聚焦于回转轴线上。通过回转轴回转带动激光指向方向改变以实施机加工。本实施例中，腔道于Y轴方向，回转轴为B轴，出光部件绕B轴转动。
图1为现有实施激光机加工的装置一实施例的示意图。如图1所示，设备包括激光发射器100，腔道200、激光投射中继部件700、出光部件300和转台400。
激光发射器100设置于腔道200的一端，自激光发射器100射出的激光110进入腔道200。本实施例中，腔道200呈直管状，自激光发射器100射出的激光110从腔道200入射后沿直线方向传播，不发生偏转，与转台400的回转轴共轴或平行，至另一端出射。受激光投射中继部件700的作用，自腔道200出射的激光发生变向后，被出光部件300接收，射出的激光310聚焦于回转轴410范围内用于对工件实施加工。
本实施例中，激光投射中继部件700包括第一反射机构710和第二反射机构720，第一反射机构710接收射入激光投射中继部件的激光，并将激光朝向第二反射机构720的方向反射，第二反射机构720接收到反射自第一反射机构710的激光730后，将激光730再次反射，并将激光射出投射中继部件。
激光投射中继部件700受转台400驱动，绕回转轴410转动，并接收来自腔道出射端的激光，使激光的光路方向发生改变后，再射出激光。出光部件300绕回转轴410旋转，射出实施机加工的激光束310。
在右手直角坐标系中，转台400绕Y轴回转，回转所绕的轴为B轴(未示出)。腔道200具有一条轴线(与图中激光110共线，未示出)，该轴线与B轴共轴。出光部件300绕B轴回转，使得射出的激光绕B轴方向分布，实现激光以回转的方式实施机加工。腔道200设置于转台400内，即为转台400内一段位于直管型中空腔体，腔体的轴线与B轴共轴，还与转台的转动对称轴共轴。
随着中空转台400旋转，设置于其内的腔道200并不发生位移，而使得从腔道200穿行的激光110始终沿直线方向传播，不发生偏转，并始终为出光部件300所接收。随着出光部件300绕B轴不断回转，而形成绕B轴回转方向分布激光。
此种装置装备多轴系的机加工设备后，当入射腔道的激光光路110与转台的回转轴410的交角保持在0°～5°，那么随着转台转动，激光投射中继部件和出光部件也绕回转轴410回转，用于机加工的激光从出光部件300出射，一同绕转台回转轴线410转动。激光投射中继部件跟随转台转动，使得激光指向改变，比如：1°、5°、10°、20°、30°、40°、50°、60°、70°、80°和90°或以上。在现实生产中，由于不可避免发生应力、振动、温度和弹性形变等因素，转台转动时激光不再沿着与转台回转轴的轴向传播，由此激光传播产生偏离。当偏离后的激光经激光投射中继部件改变方向后，其与预设的激光传播路径偏离程度被进一步扩大，以致于出光部件发出的激光310发生偏移，影响激光加工精度。图2和图3为现有用于激光实施机加工的装置激光光路另一实施例的示意图，其示意性地表明，当中继部件和出光部件随着转台转动时，入射腔道的激光光路110与转台的回转轴410未处于同轴状态的情况下，出光部件300发出的激 光无法落于同一位置处。因而仍需要经常性地重调光路，对入射振镜的激光光路与转台回转轴心线的实际距离和实际夹角偏离设定距离和设定夹角的情况进行调整，花费大量的时间，不利于成本控制。
为此，本实施例提供一种激光指向改变时校正路径偏离的方法，从转台400出射的激光经至少1次反射改变传播方向后，继续朝向光阑传播，使得通过光阑的激光光束沿着预设路径继续传播。图4为本发明方法一实施例的示意图，图5为图4所示光阑一角度的放大示意图。结合图1，如图4和图5所示，激光投射中继部件受转台400作用同步转动，并在运行过程中，受应力、振动、温度和弹性形变等因素影响光束761，光束761发生偏离后即为光束762。当光束761,762经反射镜731反射后朝向光阑750传播，通过光阑750就能得到符合预设的传播路径的激光光束760，即，并经反射改变传播方向，比如：反射改变传播方向后入射出光部件300，以此使得偏离预设传播路径的光束得以校正，并在激光与转台同步旋转且其传播方向发生180°及以上改变时，取得激光对工件的指向符合预设，作用于工件的光斑形状也保持稳定，以满足精密加工的需要。
图6为用于实施本发明方法的装置一实施例的示意图。如图6所示，本实施例的装置包括转台400、超快激光器120和激光投射中继部件700。转台400为中空，包括腔道，用于容纳激光的传播。超快激光器120安置于支架600，射出激光121由反射机构800反射后变向，再射入腔道200内，在腔道200的出口端，激光121沿直线传播。
激光投射中继部件700设置于转台400上并随转台400一同绕转台回转轴线转动，接收来自腔道出射端的激光，使激光的光路方向发生改变后，再射出激光，至少包括第一反射镜731和第二反射镜721。光阑750设置于第一反射镜731和第二反射镜721之间，使得经第一反射镜731反射改变传播方向后，继续朝向光阑750传播，使得通过光阑750的激光光束沿着预设路径继续传播。激光入射激光投射中继部件至出射，期间激光传播角度改变的总和达180°及以上。激光受激光投射中继部件700作用而变向后由出光部件的振镜320接收。出光部件绕回转轴旋转，聚焦于回转轴范围内。
为了提高激光对工件的指向符合预设要求的稳定性，以及作用于工件的光斑形状的稳定性，在激光束射入腔道前进行预校准，使得激光光束沿转台回转轴的走向(包括平行或共轴)向前传播。即预先调整激光光束，使其与转台回转轴尽量处于同轴或平行状态。或者进行闭环指向控制，即通过快反射镜和传感器对激光对工件的指向进行实时闭环调节。比如：即转台转动时，传感器随转台一同绕转台回转轴线转动，激光从转台出射的一端设置传感器，接收激光信息，并将实时入射信息传送至控制器，控制器将此实时入射信息与设定位置信息进行比较，得到偏移值，当偏移值超出设定阈值时，则驱动反射机构。
反射机构接收来自超快激光器射出的激光，并在获得控制器的指令后，对激光光路进行补偿，使得补偿后入射振镜的激光光路与转台回转轴心线的相对位置得以保持。
图7为用于实施本发明方法的装置另一实施例的示意图。如图7所示，利用转子内中空构造的内壁作为腔道的外壁，腔道200即为转台内的中空构造腔体。将超快激光器120安置于支架600，射出激光121由反射机构800反射后变向，再射入腔道200 内，在腔道200的出口端，激光121沿直线传播。激光受激光投射中继部件700作用而变向后由出光部件的振镜320接收。出光部件绕回转轴旋转，聚焦于回转轴范围内。
激光投射中继部件至少包括1件反射镜系双面抛光镜片。本实施例中，激光投射中继部件设置第二反射镜721和第一反射镜731。具体的，第一反射镜731受到激光后，将激光反射，使得光束朝向光阑750传播，通过光阑750后，传播路径符合预设的路径，并朝向第二反射镜721，第二反射镜721受到激光后，将激光朝向振镜反射。
传感器900位于第二反射镜721之后，利用从反射镜透过的光来检测来自腔道出射端的激光光斑，获得激光的实时位置信息。控制器(未示出)接收传感器900发出的实时位置信息，并与预设位置信息进行比较，得到位置偏移值。当位置偏移值超出阈值时，则表明发生了激光光路与转台回转轴的相对位置无法保持的情形，则向反射机构发出指令。本实施例中，采用两个的传感元件，分别获得激光的入射角信息，以及激光在传感元件上的位置信息，以获得更多的激光入射信息。
反射机构800获得控制器的指令后，对受到的来自超快激光器的激光进行调节，调节发射激光的光路，使入射振镜的激光光路740与转台回转轴心线的相对位置得以保持，实时补偿激光光路的变化。本实施例中，反射机构800包括第三反射镜810和第四反射镜820，各个反射镜均被配置于单独的镜架上，以使各个反射镜均至少具有2个可调节的自由度，即通过至少2件反射镜提供4个以上自由度，以实施激光补偿方案。具体的，第三反射镜810受到激光后，将激光反射至第四反射镜820，第四反射镜受到激光后，将激光朝向腔道反射，使得入射振镜的激光光路与转台回转轴的相对位置得以保持。优先选择的，第三反射镜810与第四反射镜820的AOI均为22.5°。
另外，也可以将传感器900设置于激光入射转台400之前，利用从反射镜透过的光来检测来自腔道出射端的激光光斑，获得激光的实时位置信息；或将反射机构800一并置于转台400之上，都应视作本技术方案的同等替换。
上述各项实施例提供的装置安装于机加工设备上，比如：以三个直线运动轴、一个用于固定工件的回转运动轴和一个激光束回转轴相组合形成空间五轴激光机加工方案，就能实现以多轴方式对工件进行机加工，制造复杂和多样构造的产品，尤其是适合长轴类零件的精密加工。比如：机床具有至少三个直线轴，其中一个直线轴上安装本发明的装置(比如：设置在X轴和Z轴确定的平面上，并沿Z轴直线移动)，另一个直线轴上安装转动定位机构，驱动被加工工件回转的定位(比如：将工件设置于X轴和Y轴确定的平面上)，消除应力、振动、弹性形变或温度等因素导致光束与转台回转轴相对位置无法保持的情形，提高激光加工的精密度，利于对各种规格零件实施激光加工。
以本实施例图6所示的装置设置于机床，在焦平面设置试样卡，样卡随B轴转动，打开激光并驱动B轴旋转180°后，用200倍显微镜观察试样卡，刻蚀痕迹仅为一直径与光斑直径相当的圆形图案(参见图8)，显示随着B轴转动光斑仅发生自转而未发生位移。
将上述装置中光阑移除后进行相同测试，用200倍显微镜观察试样卡，产生的刻痕情况如图9所示。与图8对比可见，移除光阑后随着B轴转动，激光聚焦点位置发生漂移，在 实验装置中最大偏离量达到光斑直径的4倍以上，显然不能满足精加工要求。

Claims (15)

  1. 一种激光指向改变时校正路径偏离的方法，其特征在于激光随转台转动，使其所指向的方向改变时，将经反射改变传播方向的激光继续朝向光阑传播，使得通过光阑的激光光束沿着预设路径继续传播。
  2. 根据权利要求1所述的方法，其特征在于还包括在激光束射入腔道前进行预校准，使得激光光束沿转台回转轴的走向向前传播。
  3. 根据权利要求1所述的方法，其特征在于还包括在光束通过光阑前通过快反射镜和传感器对激光对工件的指向进行实时闭环调节。
  4. 根据权利要求1所述的方法，其特征在于从转台出射或入射的一端设置传感器，接收激光信息，并将实时入射信息传送至控制器，控制器将此实时入射信息与设定位置信息进行比较，得到偏移值，当偏移值超出设定阈值时，则驱动快反镜；
    快反镜反射来自超快激光器射出的激光，并在获得控制器的指令后，对激光光路进行补偿，使补偿后入射振镜的激光光路与转台回转轴心线的相对位置关系得以保持。
  5. 根据权利要求1所述的方法，其特征在于从转台出射或入射的一端设置传感器，接收激光信息，并将实时入射信息传送至控制器，控制器将此实时入射信息与设定位置信息进行比较，得到偏移值，当偏移值超出设定阈值时，则驱动快反镜；
    快反镜反射来自从转台出射的激光，并在获得控制器的指令后，调整反射镜角度对转台回转造成的激光光路偏差进行补偿。
  6. 根据权利要求1所述的方法，其特征在于激光从回转转台上腔道出射后，经至少1次反射改变传播方向，再随转台转动。
  7. 根据权利要求1所述的方法应用于具有多个运动轴的加工设备，使激光对工件的指向符合预设并保持稳定，提高激光加工的精密度。
  8. 根据权利要求1所述的方法应用于具有多个运动轴的加工设备，使作用于工件的光斑形状也保持稳定，以满足精密加工的需要。
  9. 一种机加工设备，其特征在于采用权利要求1所述的方法。
  10. 一种装置，其特征在于包括：
    转台，其实施回转运动，包括腔道，其腔道用于容纳激光的光路；
    超快激光器，其射出的激光经所述的腔道通过所述的转台；
    激光投射中继部件，设置于转台上并随转台一同绕转台回转轴线转动，接收来自腔道出射端的激光，使激光的光路方向发生改变后，再射出激光，至少包括第一反射镜；
    光阑，接收来自第一反射镜反射的光束。
  11. 根据权利要求10所述的装置，其特征在于还包括：
    出光部件，设置于转台上并随转台一同绕转台回转轴线转动，接收由激光投射中继部件射出的激光，并聚焦于回转轴范围内。
  12. 根据权利要求10所述的装置，其特征在于还包括：
    传感器，获得激光的实时入射信息；
    控制器，其接收传感器发出的实时入射信息，并与预设位置信息进行比较，得到位置偏移值；
    反射机构，其接收来自超快激光器射出的激光，并在获得控制器的指令后，对反射后的激光光路进行补偿，并使聚焦光斑至转台回转轴线的距离始终得以保持，即转台任意角度下该距离的偏差≤1μm。
  13. 根据权利要求12所述的装置，其特征在于所述反射机构至少包括2件快反镜，各件快反镜均至少具有2个可调节的自由度。
  14. 根据权利要求12所述的装置，其特征在于所述的反射机构包括第三反射镜和第四反射镜，第三反射镜受到激光后，将激光反射至第四反射镜，第四反射镜受到激光后，将激光朝向腔道反射。
  15. 一种机加工设备，其特征在于包括权利要求10所述的装置。
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CN113489547A (zh) * 2021-06-29 2021-10-08 西安理工大学 一种激光光束快速对准系统及其方法
CN217370913U (zh) * 2021-12-20 2022-09-06 上海名古屋精密工具股份有限公司 激光指向改变时校正路径偏离的装置和机床

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US4707596A (en) * 1985-08-23 1987-11-17 Carl-Zeiss-Stiftung Articulated optical system having an arrangement for correcting the position of a laser beam
JPH09271971A (ja) * 1996-04-02 1997-10-21 Shinozaki Seisakusho:Kk レーザ加工装置
CN107255451A (zh) * 2017-07-07 2017-10-17 浙江理工大学 角度补偿式激光外差干涉位移测量装置及方法
CN109483047A (zh) * 2018-11-15 2019-03-19 中国科学院西安光学精密机械研究所 一种激光光束终端指向检测与校正方法及激光加工装置
CN110385521A (zh) * 2019-08-29 2019-10-29 西安交通大学 一种用于碳化硅快速深刻蚀的飞秒激光加工装置及方法
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CN113489547A (zh) * 2021-06-29 2021-10-08 西安理工大学 一种激光光束快速对准系统及其方法
CN217370913U (zh) * 2021-12-20 2022-09-06 上海名古屋精密工具股份有限公司 激光指向改变时校正路径偏离的装置和机床

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