WO2023115508A1 - 柔性显示面板及显示装置 - Google Patents

柔性显示面板及显示装置 Download PDF

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Publication number
WO2023115508A1
WO2023115508A1 PCT/CN2021/141060 CN2021141060W WO2023115508A1 WO 2023115508 A1 WO2023115508 A1 WO 2023115508A1 CN 2021141060 W CN2021141060 W CN 2021141060W WO 2023115508 A1 WO2023115508 A1 WO 2023115508A1
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WO
WIPO (PCT)
Prior art keywords
buffer member
substrate
display panel
layer
flexible display
Prior art date
Application number
PCT/CN2021/141060
Other languages
English (en)
French (fr)
Inventor
曹蔚然
尹翔
韩佰祥
Original Assignee
深圳市华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US17/623,596 priority Critical patent/US20240057448A1/en
Publication of WO2023115508A1 publication Critical patent/WO2023115508A1/zh

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8723Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/311Flexible OLED

Definitions

  • the present application relates to the field of display technology, in particular to a flexible display panel and a display device.
  • OLED Organic Light Emitting Diode
  • OLED display also known as organic electroluminescent display, is an emerging flat panel display.
  • Embodiments of the present application provide a flexible display panel and a display device to alleviate the technical problem of poor impact resistance of existing flexible display panels.
  • An embodiment of the present application provides a flexible display panel, which includes:
  • a driving circuit layer disposed on one side of the substrate
  • a light emitting structure disposed on a side of the driving circuit layer away from the substrate;
  • an encapsulation layer disposed on a side of the light emitting structure away from the driving circuit layer
  • At least a surface of the encapsulation layer or the substrate is further provided with a buffer member.
  • the buffer member is disposed on a surface of the encapsulation layer away from the light emitting structure.
  • the buffer member is disposed on the surface of the substrate away from the driving circuit layer.
  • the buffer member includes a first buffer member and a second buffer member, the first buffer member is disposed on the surface of the substrate away from the driving circuit layer, and the second buffer member is disposed On the surface of the encapsulation layer away from the light emitting structure, the projection of the first buffer member on the substrate and the projection of the second buffer member on the substrate do not coincide.
  • the height of the first cushioning member is smaller than the height of the second cushioning member.
  • the cushioning member is a support column.
  • the support column is arranged in an inverted T shape.
  • the support column includes one or more of a truss and a cylinder.
  • the toughness of the cushioning member is greater than the toughness of the substrate.
  • a plurality of the support columns are arranged in an array.
  • the embodiment of the present application also provides a display device, which includes a device body and the above-mentioned flexible display panel, and the flexible display panel includes:
  • a driving circuit layer disposed on one side of the substrate
  • a light emitting structure disposed on a side of the driving circuit layer away from the substrate;
  • an encapsulation layer disposed on a side of the light emitting structure away from the driving circuit layer
  • a buffer member is further provided on the surface of at least one of the encapsulation layer or the substrate.
  • the buffer member is disposed on a surface of the encapsulation layer away from the light emitting structure.
  • the buffer member is disposed on the surface of the substrate away from the driving circuit layer.
  • the buffer member includes a first buffer member and a second buffer member, the first buffer member is disposed on the surface of the substrate away from the driving circuit layer, and the second buffer member is disposed On the surface of the encapsulation layer away from the light emitting structure, the projection of the first buffer member on the substrate and the projection of the second buffer member on the substrate do not coincide.
  • the height of the first cushioning member is smaller than the height of the second cushioning member.
  • the cushioning member is a support column.
  • the support column is arranged in an inverted T shape.
  • the support column includes one or more of a truss and a cylinder.
  • the toughness of the cushioning member is greater than the toughness of the substrate.
  • a plurality of the support columns are arranged in an array.
  • the present application provides a flexible display panel and a display device.
  • the flexible display panel includes a substrate, a driving circuit layer arranged on one side of the substrate, a light-emitting structure arranged on the side of the driving circuit layer away from the substrate, and a light-emitting structure arranged on the light-emitting layer. Structure the encapsulation layer on the side away from the driving circuit layer, wherein a buffer member is further provided on the surface of at least one of the encapsulation layer or the substrate. Since the flexible display panel in the present application is provided with a buffer member on at least one layer of the encapsulation layer or the substrate, the impact resistance of the flexible display panel is enhanced, and black spots, bright spots, and colorful spots are avoided when being hit. , can not be displayed in full color and other issues.
  • FIG. 1 is a schematic diagram of a first structure of a flexible display panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a second structure of a flexible display panel provided by an embodiment of the present application.
  • FIG. 3 is a schematic diagram of a third structure of a flexible display panel provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a fourth structure of a flexible display panel provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a fifth structure of a flexible display panel provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a sixth structure of a flexible display panel provided by an embodiment of the present application.
  • FIG. 7 is a schematic diagram of a seventh structure of a flexible display panel provided by an embodiment of the present application.
  • FIG. 8 is a schematic diagram of an eighth structure of a flexible display panel provided by an embodiment of the present application.
  • FIG. 9 is a schematic diagram of a ninth structure of a flexible display panel provided by an embodiment of the present application.
  • FIG. 10 is a schematic diagram of a tenth structure of a flexible display panel provided by an embodiment of the present application.
  • FIG. 11 is a schematic diagram of an eleventh structure of a flexible display panel provided by an embodiment of the present application.
  • first and second are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features.
  • a feature defined as “first” or “second” may explicitly or implicitly include one or more of said features.
  • “plurality” means two or more, unless otherwise specifically defined.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.
  • a first feature being "on” or “under” a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them.
  • “above”, “above” and “above” the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.
  • “Below”, “beneath” and “under” the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.
  • a pixel may be a pixel unit or a sub-pixel constituting a pixel unit, wherein the sub-pixel may be selected from one or more of red sub-pixels, blue sub-pixels, green sub-pixels and white sub-pixels.
  • the OLED display is a carrier double-injection light-emitting device.
  • the electrons and holes injected by the electrodes recombine in the organic material to release energy and transfer the energy to the molecules of the organic light-emitting substance. , so that it is excited, transitions from the ground state to the excited state, and emits light when the excited molecule returns to the ground state from the excited state.
  • Embodiments of the present application provide a flexible display panel and a display device to alleviate the technical problem of poor impact resistance of existing flexible display panels.
  • FIG. 1 it is a schematic diagram of the first structure of the flexible display panel provided by the embodiment of the present application.
  • the flexible display panel 10 includes a substrate 11 and a driving circuit layer 12 and a light emitting structure stacked on the substrate 11 in sequence. 13 and the encapsulation layer 14, wherein a buffer member is provided on the encapsulation layer 14, and the buffer member 16 acts as a buffer when the flexible display panel 10 is impacted, can absorb and release stress more uniformly, and reduce the single-point damage caused by the flexible display panel 10 The risk of component damage due to high force is achieved, thereby achieving the purpose of improving impact resistance and display failure, and avoiding problems such as black spots, bright spots, colorful spots, and failure to display in full color when the flexible display panel 10 is impacted.
  • the substrate 11 may be a flexible substrate, which may include polyethylene phthalate (PET), polyethylene naphthalate (PEN), polyimide (Polyimide, PI) film,
  • PET polyethylene phthalate
  • PEN polyethylene naphthalate
  • PI polyimide
  • a flexible substrate such as an ultra-thin glass film can be used as the substrate 11 to make a flexible display panel, so as to realize special properties such as bending and curling of the flexible display panel.
  • the driving circuit layer 12 includes an active layer 121, a gate insulating layer 122, a gate 123, an interlayer insulating layer 124, a source-drain layer 125, and a planarization layer, which are sequentially stacked on the first buffer layer 15.
  • the active layer 121 includes a channel region 1211 and a source region 1212 and a drain region 1213 located on both sides of the channel region 1211 .
  • the gate insulating layer 122 covers the active layer 121 and the first buffer layer 15, the gate 123 is disposed on the gate insulating layer 122, and the gate 123 and the The channel region 1211 is correspondingly provided.
  • the interlayer insulating layer 124 covers the gate 123 and the gate insulating layer 122, the source and drain layer 125 is disposed on the interlayer insulating layer 124, and the source and drain layer 125 is patterned
  • the source electrode 1251, the drain electrode 1252, the data line 1253, etc. are formed, the source electrode 1251 is connected to the source region 1212 through the via hole of the interlayer insulating layer 124, and the drain electrode 1252 is connected to the source region 1212 through the interlayer insulating layer Another via hole of the insulating layer 124 is connected to the drain region 1213 .
  • the planarization layer 126 covers the source-drain layer 125 and the interlayer insulating layer 124, and the arrangement of the planarization layer 126 can provide a flat film layer surface for the flexible display panel, so as to improve the preparation of light emission. Stability of Structure 13.
  • the pixel definition layer 127 covers the planarization layer 126, the pixel definition layer 127 is patterned to form a pixel opening, the pixel opening exposes a part of the anode 133, and the pixel definition layer 127 is patterned In order to form an opening corresponding to each pixel, the opening is used to accommodate the luminescent material and define the area of the pixel, and the luminescent material of different colors is vapor-deposited in the corresponding opening, thereby forming pixels of different colors.
  • the structure of the driving circuit layer 12 of the present application is not limited to that shown in this embodiment, the driving circuit layer 12 of the present application may also include more or fewer film layers, and the positional relationship of each film layer is not limited to As shown in this embodiment, for example, the gate 123 may also be located under the active layer 121 to form a bottom gate structure.
  • the driving circuit layer 12 is used for providing a driving voltage to the light emitting structure 13 to make the light emitting structure 13 emit light.
  • the light emitting structure 13 includes a light emitting unit 131 , a cathode 132 and an anode 133 .
  • the light-emitting unit 131 is formed by arranging light-emitting materials of different colors on the surface of the driving circuit layer 12.
  • the light-emitting materials of different colors emit light of different colors. For example, red light-emitting materials emit red light, and green light-emitting materials emit green light. light, the blue luminescent material emits blue light.
  • the cathode 132 covers the light-emitting unit 131, and the light-emitting unit 131 emits light under the joint action of the anode 133 and the cathode 132, and the light-emitting units 131 of different colors emit light of different colors, thereby realizing the flexible display panel. Full color display.
  • the anode 133 is disposed on the planarization layer 126, and is connected to the source 1251 or the drain 1252 through the via hole of the planarization layer 126.
  • the anode 133 and the drain Take the pole 1252 connection as an example.
  • the anode 133 can be a transparent electrode or a reflective electrode. If the anode 133 is a transparent electrode, the anode 133 can be made of, for example, indium tin oxide (ITO), indium zinc oxide (IZO), ZnO or In2O3 form. If the anode 133 is a reflective electrode, the anode 133 may include, for example, a reflective layer formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or a combination thereof and a reflective layer formed of ITO, IZO , ZnO or In2O3 layer. However, the anode 133 is not limited thereto, and the anode 133 may be formed of various materials, and may also be formed in a single-layer or multi-layer structure.
  • the anode 133 is a transparent electrode or a reflective electrode depends on the light emitting direction of the flexible display panel.
  • the anode 133 can be a transparent electrode or a reflective electrode.
  • the use of reflective electrodes can improve the utilization rate of light emitted by the light emitting unit 131; when the flexible display panel adopts bottom emission, the anode 133 uses a transparent electrode to increase the light transmittance.
  • the flexible display panel adopts top emission as an example for illustration.
  • the cathode 132 needs to be formed of a transparent conductive material.
  • the cathode 132 can be made of transparent conductive oxides such as ITO, IZO, ZnO or In2O3 (Transparent Conductive Oxide, TCO) formation.
  • the light emitting structure 13 may further include a hole injection layer (Hole Injection Layer, HIL), hole transport layer (Hole Transport Layer, HTL); and electron injection layer (Electron Injecting Layer, EIL), electron transport layer (Electron Transport Layer, ETL).
  • HIL hole injection Layer
  • HTL Hole Transport Layer
  • EIL Electrode Transport Layer
  • ETL Electro Transport Layer
  • the hole injection layer receives the holes transported by the anode 133, the holes are transported to the light-emitting unit 131 through the hole transport layer
  • the electron injection layer receives the electrons transported by the cathode 132, and the electrons are transported to the light-emitting unit 131 through the electron transport layer, and the holes and electrons Excitons are generated after the light-emitting unit 131 is combined, and the excitons transition from the excited state to the ground state to release energy and emit light.
  • the encapsulation layer 14 covers the light-emitting structure 13 for protecting the light-emitting unit 131 of the light-emitting structure 13 and avoiding the failure of the light-emitting unit 131 caused by water and oxygen intrusion.
  • the encapsulation layer 14 can be encapsulated with a thin film, for example, the encapsulation layer 14 can be a laminated structure formed by sequentially laminating three layers of thin films of a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer or more Multilayer laminated structure.
  • the buffer member 16 is provided on the surface of the encapsulation layer 14.
  • the buffer member can be arranged on the surface of the substrate 11.
  • the buffer member can also be divided into a first buffer member and a second buffer member.
  • the first buffer member is arranged on The substrate 11 is away from the surface of the driving circuit layer
  • the second buffer member is disposed on the surface of the encapsulation layer 14 away from the light-emitting structure, and the projection of the first buffer member on the substrate 11 and the projection of the second buffer member on the substrate 11 The projections are not coincident.
  • the following content describes several settings of the buffer member in detail respectively.
  • a buffer member is provided on the surface of the encapsulation layer 14 away from the light-emitting functional layer light-emitting structure 13 , and the buffer member is a buffer layer 161 .
  • the material of the buffer layer 161 may include inorganic materials such as silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiON), and the buffer layer 161 may be a metal material, and the metal material
  • the toughness of is greater than the toughness of the protective substrate 11.
  • the buffer layer can be manufactured in an independent process, or can be integrated in an existing process (such as Array/OLED/encapsulation process).
  • the manufacturer of the display panel can produce the buffer layer 161, the substrate 11, the driving electric layer 12, the light emitting structure 13 and the encapsulation layer 14 as a whole when producing the display panel, and can also combine the substrate 11, the driving electric layer
  • the layer 12, the light-emitting structure 13 and the encapsulation layer 14 are produced as a whole, and the buffer layer 161 is produced separately, and then the separately produced buffer layer 161 is used on a display panel without a buffer layer.
  • the buffer member includes at least one support column 162 , and the toughness of the support column 162 is greater than that of the substrate 11 . Since the toughness of the supporting pillars 162 is greater than that of the substrate 11 , when the flexible display panel 10 is impacted, the supporting pillars 162 will first deform to prevent the substrate 11 from being damaged.
  • the support column may be in the shape of a cylinder, a prism, etc., and the specific shape is not limited here.
  • the support column 163 is prismatic, and the support column is arranged in an inverted T shape. Since the support column 163 is arranged in an inverted T shape, the contact surface between the support column 163 and the encapsulation layer 14 is relatively large. Therefore, the support column 163 can release the force evenly to the encapsulation layer 14, so as to avoid the encapsulation layer 14 being affected by a certain point. larger and damaged.
  • the supporting pillars 163 can be arranged at intervals according to needs, can be arranged at equal intervals, or can be arranged at any distance, and the specific arrangement method is not limited here.
  • FIG. 5 which is a schematic diagram of the fifth structure of the flexible display panel provided by the embodiment of the present application
  • a buffer member is provided on the surface of the substrate away from the driving circuit layer, and the buffer member is a support column 164 .
  • the support column 164 will share part of the force on the flexible display panel 10, thus reducing the force received by other parts of the flexible display panel 10, and the support column 164 can also resist the force of the module mechanism. (such as hinge mechanism, curling mechanism, telescopic mechanism, etc.), to prevent these mechanisms from causing damage to the flexible display panel.
  • the module mechanism such as hinge mechanism, curling mechanism, telescopic mechanism, etc.
  • the support column 165 is prismatic and arranged in an inverted T shape. Since the support column 165 is arranged in an inverted T shape, the contact surface between the support column 165 and the substrate 11 is relatively large. Therefore, the support column 165 can release the force evenly to the substrate 11, so as to avoid the substrate 11 being stressed by a certain point. larger and damaged.
  • the supporting pillars 165 can be arranged at intervals according to needs, and the specific setting method is not limited here, and can be set equidistantly, or can be set at any distance.
  • the multiple supporting columns 166 are arranged in an array, because the multiple supporting columns 166 are arranged in an array, therefore, the force received by each supporting column 166 is uniform, and the supporting columns 166 are prevented from being affected by Different forces produce different deformations, which in turn affect the performance of the display panel.
  • a buffer member is provided on the surface of the substrate 11 away from the driving circuit layer 12 , and the buffer member is a buffer layer 167 , wherein the buffer layer 167 can be manufactured independently, or can be integrated into the flexible substrate 21
  • the buffer layer 167 can further prevent unwanted impurities or pollutants (such as moisture, oxygen, etc.) from diffusing from the substrate 11 into devices that may be damaged by these impurities or pollutants, and can Resist the force of the module mechanism (such as hinge mechanism, curling mechanism, telescopic mechanism, etc.), and prevent these mechanisms from causing damage to the flexible display panel.
  • a first buffer member 169 is provided on the side of the substrate 11 away from the driving circuit layer 12
  • a first buffer member 169 is provided on the side of the packaging layer 14 away from the light emitting structure 13 .
  • One side is provided with a second buffer member 168, the projections of the first buffer member 169 and the second buffer member 168 on the substrate 11 do not coincide, and the first buffer member 169 and the second buffer member 169
  • the buffer member 168 can be made of the same material or different materials, and the selection of specific materials is not limited here.
  • both the first buffer member and the second buffer member are made of flexible organic materials
  • the first buffer member is made of polyimide
  • the second buffer member is made of polyimide.
  • the first buffer member 1611 and the second buffer member 1610 adopt different materials and different shapes
  • the first buffer member 1611 is a support column
  • the second buffer member 1610 is a buffer layer.
  • both the support columns 1611 and the buffer layer 1610 act as buffers to share part of the impact force on the flexible display panel 10 and prevent other parts of the flexible display panel from being damaged due to excessive force.
  • the shape of the support column 1611 is not limited here, and may be T-shaped or cylindrical.
  • the height of the first cushioning member is smaller than the height of the second cushioning member.
  • the difference between the height of the first buffer member and the height of the second buffer member is not limited here, it can be set according to specific needs, for example, the second buffer member is higher than the first buffer member 10nm, or 20nm higher.
  • the first buffer member 1613 and the second buffer member 1612 are made of different materials and shapes
  • the second buffer member 1612 is a support column
  • the first buffer member 1612 is a supporting column
  • 1613 is a buffer layer.
  • the buffer layer 1613 can be produced by an independent process, or can be integrated in an existing process (such as Array/OLED/packaging process), for example, a display panel manufacturer can combine the buffer layer 161 with the substrate The bottom 11, the driving motor layer 12, the light emitting structure 13 and the packaging layer 14 are produced as a whole, or the substrate 11, the driving driving layer 12, the light emitting structure 13 and the packaging layer 14 can be produced as a whole, and the buffer layer 161 is separately produced. production, and then use the separately produced buffer layer 161 on the display panel without the buffer layer.
  • the shape of the support column 1612 is not limited here, and may be T-shaped or cylindrical.
  • the present application provides a flexible display panel including a substrate, a driving circuit layer disposed on one side of the substrate, a light emitting structure disposed on a side of the driving circuit layer far away from the substrate, and a light emitting structure disposed on a side far away from the driving circuit layer.
  • the encapsulation layer on the side wherein a buffer member is further provided on the surface of at least one of the encapsulation layer or the substrate. Since the flexible display panel in the present application is provided with a buffer member on at least one layer of the encapsulation layer or the substrate, the impact resistance of the flexible display panel is enhanced, and black spots, bright spots, and colorful spots are avoided when being hit. , can not be displayed in full color and other issues.
  • a display device includes a device body and the above-mentioned flexible display panel.

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种柔性显示面板(10)及显示装置,柔性显示面板(10)包括衬底(11)、设置在衬底(11)的一侧的驱动电路层(12)、设置在驱动电路层(12)远离衬底(11)的一侧的发光结构(13)、以及设置在发光结构(13)远离驱动电路层(12)的一侧的封装层(14),其中,在封装层(14)或衬底(11)中至少一层的表面,还设置有缓冲构件(16)。

Description

柔性显示面板及显示装置 技术领域
本申请涉及显示技术领域,尤其涉及一种柔性显示面板及显示装置。
背景技术
显示面板已经广泛用于人们的生活中,例如:手机、电脑、电视机等都用到了显示面板。其中,有机发光二极管(Organic Light Emitting Diode,OLED)显示器具有主动发光、可视角度大,色域宽、亮度高、响应速度快、低功耗以及结构上可弯曲等优点,越来越受到市场的欢迎。OLED显示器也称为有机电致发光显示器,是一种新兴的平板显示器。
为保证显示器的可靠性,在OLED显示器生产完成后一般都需要进行一系列的可靠性实验。通常采用落球实验来测试屏幕的抗冲击性能,但是,传统的OLED显示器在被落球击中的瞬间会出现黑斑、亮斑、彩斑、不能全彩显示等现象,因此,传统的OLED显示器存在抗冲击性差的问题。
技术问题
本申请实施例提供一种柔性显示面板及显示装置,用以缓解现有柔性显示面板抗冲击性差的技术问题。
技术解决方案
本申请实施例提供一种柔性显示面板,该柔性显示面板包括:
衬底;
驱动电路层,设置在所述衬底的一侧;
发光结构,设置在所述驱动电路层远离所述衬底的一侧;
封装层,设置在所述发光结构远离所述驱动电路层的一侧;
其中,在所述封装层或所述衬底中至少的表面,还设置有缓冲构件。
在一种实施例中,在所述封装层远离所述发光结构的表面上设置有所述缓冲构件。
在一种实施例中,在所述衬底远离所述驱动电路层的表面上设置有所述缓冲构件。
在一种实施例中,所述缓冲构件包括第一缓冲构件和第二缓冲构件,所述第一缓冲构件设置在所述衬底远离所述驱动电路层的表面,所述第二缓冲构件设置在所述封装层远离所述发光结构的表面,所述第一缓冲构件在所述衬底上的投影和所述第二缓冲构件在所述衬底上的投影不重合。
在一种实施例中,所述第一缓冲构件的高度小于所述第二缓冲构件的高度。
在一种实施例中,所述缓冲构件为支撑柱。
在一种实施例中,所述支撑柱呈倒T形设置。
在一种实施例中,所述支撑柱包括棱台、圆柱中的一种或者多种。
在一种实施例中,所述缓冲构件的韧性大于所述衬底的韧性。
在一种实施例中,多个所述支撑柱之间呈阵列设置。
本申请实施例还提供了一种显示装置,其包括设备本体及上述的柔性显示面板,所述柔性显示面板包括:
衬底;
驱动电路层,设置在所述衬底的一侧;
发光结构,设置在所述驱动电路层远离所述衬底的一侧;
封装层,设置在所述发光结构远离所述驱动电路层的一侧;
其中,在所述封装层或所述衬底中至少一层的表面,还设置有缓冲构件。
在一种实施例中,在所述封装层远离所述发光结构的表面上设置有所述缓冲构件。
在一种实施例中,在所述衬底远离所述驱动电路层的表面上设置有所述缓冲构件。
在一种实施例中,所述缓冲构件包括第一缓冲构件和第二缓冲构件,所述第一缓冲构件设置在所述衬底远离所述驱动电路层的表面,所述第二缓冲构件设置在所述封装层远离所述发光结构的表面,所述第一缓冲构件在所述衬底上的投影和所述第二缓冲构件在所述衬底上的投影不重合。
在一种实施例中,所述第一缓冲构件的高度小于所述第二缓冲构件的高度。
在一种实施例中,所述缓冲构件为支撑柱。
在一种实施例中,所述支撑柱呈倒T形设置。
在一种实施例中,所述支撑柱包括棱台、圆柱中的一种或者多种。
在一种实施例中,所述缓冲构件的韧性大于所述衬底的韧性。
在一种实施例中,多个所述支撑柱之间呈阵列设置。
有益效果
本申请提供一种柔性显示面板及显示装置,柔性显示面板包括衬底、设置在衬底的一侧的驱动电路层、设置在驱动电路层远离衬底的一侧的发光结构,以及设置在发光结构远离驱动电路层的一侧的封装层,其中,在封装层或衬底中至少一层的表面,还设置有缓冲构件。由于本申请中的柔性显示面板的在封装层或衬底的至少一层上设置有缓冲构件,因此增强了柔性显示面板的抗冲击性,避免在被撞击时出现黑斑、亮斑、彩斑、不能全彩显示等问题。
附图说明
下面结合附图,通过对本申请的具体实施方式详细描述,将使本申请的技术方案及其它有益效果显而易见。
图1为本申请实施例提供的柔性显示面板的第一种结构示意图。
图2为本申请实施例提供的柔性显示面板的第二种结构示意图。
图3为本申请实施例提供的柔性显示面板的第三种结构示意图。
图4为本申请实施例提供的柔性显示面板的第四种结构示意图。
图5为本申请实施例提供的柔性显示面板的第五种结构示意图。
图6为本申请实施例提供的柔性显示面板的第六种结构示意图。
图7为本申请实施例提供的柔性显示面板的第七种结构示意图。
图8为本申请实施例提供的柔性显示面板的第八种结构示意图。
图9为本申请实施例提供的柔性显示面板的第九种结构示意图。
图10为本申请实施例提供的柔性显示面板的第十种结构示意图。
图11为本申请实施例提供的柔性显示面板的第十一种结构示意图。
本发明的实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
在本申请的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。
在本申请的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接或可以相互通讯;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本申请。此外,本申请可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本申请提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
本申请中,像素即可以是像素单元,也可以是组成像素单元的子像素,其中子像素可以选自红色子像素、蓝色子像素、绿色子像素和白色子像素的一种或几种。
本申请中,OLED显示器为载流子双注入型发光器件,在外界电压的驱动下,由电极注入的电子和空穴在有机材料中复合而释放出能量并将能量传递给有机发光物质的分子,使其受到激发,从基态跃迁到激发态,当受激分子从激发态回到基态时辐射而产生发光现象。
实施例一
本申请实施例提供一种柔性显示面板及显示装置,用以缓解现有柔性显示面板抗冲击性差的技术问题。
如图1所示,为本申请实施例提供的柔性显示面板的第一种结构示意图,柔性显示面板10包括衬底11以及依次层叠设置在所述衬底11上的驱动电路层12、发光结构13和封装层14,其中,在封装层14上设置有缓冲构件,缓冲构件16在柔性显示面板10受到冲击时起缓冲作用,能更均匀地吸收和释放应力,降低柔性显示面板10因单点受力大而导致元件损坏的风险,进而达到提高抗冲击能力、改善显示失效的目的,避免柔性显示面板10在被撞击时出现黑斑、亮斑、彩斑、不能全彩显示等问题。可选地,所述衬底11可以为柔性基板,可包括苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、聚酰亚胺(Polyimide,PI)薄膜、超薄玻璃薄膜等柔性基板,采用柔性基板作衬底11可以制作柔性显示面板,以实现柔性显示面板的弯折、卷曲等特殊性能。
所述驱动电路层12包括依次层叠设置在所述第一缓冲层15上的有源层121、栅极绝缘层122、栅极123、层间绝缘层124、源漏极层125、平坦化层126以及像素定义层127,所述有源层121包括沟道区1211以及位于所述沟道区1211两侧的源极区1212和漏极区1213。所述栅极绝缘层122覆于所述有源层121及所述第一缓冲层15上,所述栅极123设置与所述栅极绝缘层122上,且所述栅极123与所述沟道区1211对应设置。
所述层间绝缘层124覆于所述栅极123以及所述栅极绝缘层122上,所述源漏极层125设置于所述层间绝缘层124上,所述源漏极层125图案化形成源极1251、漏极1252以及数据线1253等,所述源极1251通过所述层间绝缘层124的过孔与所述源极区1212连接,所述漏极1252通过所述层间绝缘层124的另一过孔与所述漏极区1213连接。
所述平坦化层126覆于所述源漏极层125以及所述层间绝缘层124上,设置所述平坦化层126可为所述柔性显示面板提供平坦的膜层表面,以提高制备发光结构13的稳定性。
所述像素定义层127覆于所述平坦化层126上,所述像素定义层127图案化形成有像素开口,所述像素开口裸露出部分所述阳极133,对像素定义层127进行图案化处理以形成对应每个像素的开口,开口用于容纳发光材料并限定像素的区域,不同颜色的发光材料蒸镀于对应的开口内,进而形成不同颜色的像素。
需要说明的是,本申请驱动电路层12的结构不限于本实施例示意的,本申请的驱动电路层12还可包括更多或更少的膜层,且各膜层的位置关系也不限于本实施例示意的,比如所述栅极123还可位于所述有源层121的下方,形成底栅结构。所述驱动电路层12用于给所述发光结构13提供驱动电压,以使所述发光结构13发光。
所述发光结构13包括发光单元131、阴极132以及阳极133。所述发光单元131是把不同颜色的发光材料整面设置在所述驱动电路层12的表面形成,不同颜色的发光材料发射不同颜色的光,比如红色发光材料发射红光,绿色发光材料发射绿光,蓝色发光材料发射蓝光。
所述阴极132覆盖所述发光单元131,所述发光单元131在所述阳极133和所述阴极132的共同作用下发光,不同颜色的发光单元131发射不同颜色的光,进而实现柔性显示面板的全彩显示。
所述阳极133设置于所述平坦化层126上,并通过所述平坦化层126的过孔与所述源极1251或所述漏极1252连接,本申请以所述阳极133与所述漏极1252连接为例说明。
可选地,所述阳极133可以是透明电极或反射电极,如果所述阳极133是透明电极,则所述阳极133可以由例如氧化铟锡(ITO)、氧化铟锌(IZO)、ZnO或In2O3形成。如果所述阳极133是反射电极,则所述阳极133例如可以包括由Ag、Mg、Al、Pt、Pd、Au、Ni、Nd、Ir、Cr或它们的组合形成的反射层以及由ITO、IZO、ZnO或In2O3形成的层。然而,阳极133不限于此,阳极133可以由各种材料形成,并且也可以形成为单层或多层结构。
需要说明的是,所述阳极133具体是采用透明电极还是反射电极需取决于所述柔性显示面板的出光方向,当柔性显示面板采用顶发光时,所述阳极133可以是透明电极或反射电极,当然地,采用反射电极时能够提高发光单元131发出光线的利用率;当柔性显示面板采用底发光时,所述阳极133采用透明电极,以提高光线的透过率。本实施例以所述柔性显示面板采用顶发光为例说明,为了提高光线的透过率,所述阴极132需采用透明导电材料形成。例如所述阴极132可由ITO、IZO、ZnO或In2O3等透明导电氧化物(Transparent Conductive Oxide,TCO)形成。
可选地,所述发光结构13还可包括设置于所述发光单元131与所述阳极133之间的空穴注入层(Hole Injection Layer,HIL)、空穴传输层(Hole Transport Layer,HTL);以及设置于所述发光单元131与所述阴极132之间的电子注入层(Electron Injecting Layer,EIL)、电子传输层(Electron Transport Layer,ETL)。空穴注入层接收阳极133传输的空穴,空穴经由空穴传输层传输至发光单元131,电子注入层接收阴极132传输的电子,电子经由电子传输层传输至发光单元131,空穴和电子在发光单元131位置结合后产生激子,激子由激发态跃迁至基态释放能量并发光。
所述封装层14覆盖所述发光结构13,用于保护所述发光结构13的发光单元131,避免水氧入侵导致发光单元131失效。可选地,所述封装层14可采用薄膜封装,比如所述封装层14可以为由第一无机封装层、有机封装层、第二无机封装层三层薄膜依次层叠形成的叠层结构或更多层的叠层结构。
图1中缓冲构件16设置封装层14的表面,实际情况中,缓冲构件可以设置在衬底11的表面,缓冲构件也可以分为第一缓冲构件和第二缓冲构件,第一缓冲构件设置在衬底11远离驱动电路层的表面,第二缓冲构件设置在封装层14远离发光结构的表面,且第一缓冲构件在衬底11上的投影和第二缓冲构件在所述衬底11上的投影不重合。以下内容对缓冲构件的几种设置分别进行详细说明。
实施例二
如图2所示,为本申请实施例提供的柔性显示面板的第二种结构示意图,在封装层14远离发光功能层发光结构13的表面上设置有缓冲构件,且缓冲构件为缓冲层161。可选地,所述缓冲层161的材料可包括氧化硅(SiOx)、氮化硅(SiNx)、氮氧化硅(SiON)等无机材料,所述缓冲层161可以为金属材料,所述金属材料的韧性大于保护衬底11的韧性。当柔性显示面板10受到冲击时,由于缓冲层161的韧性大于衬底11的韧性,因此,缓冲层161会比衬底11先产生形变,防止柔性显示面板10的衬底11受到损伤。
其中,缓冲层可以独立制程制作,也可以集成在现有工艺制程中(如Array/OLED/的封装制程)。例如,显示面板的生产厂商可以在生产显示面板时,将缓冲层161与衬底11、驱动电动层12、发光结构13以及封装层14作为一个整体统一生产,也可以将衬底11、驱动电动层12、发光结构13以及封装层14作为一个整体生产,将缓冲层161单独生产,再将单独生产的缓冲层161用于无缓冲层的显示面板上。
如图3所示,在一种实施例中,所述缓冲构件包括至少一个支撑柱162,所述支撑柱162的韧性大于衬底11的韧性。由于支撑柱162的韧性大于衬底11的韧性,因此,在柔性显示面板10受到冲击时,支撑柱162会先产生形变,防止衬底11受到损坏。
其中,支撑柱可以是圆柱形、棱形等形状,具体形状在此不做限定。
如图4所示,在一种实施例中,支撑柱163为棱形,且支撑柱呈倒T形设置。由于支撑柱163倒T形设置,支撑柱163与封装层14的接触面较大,因此,可以支撑柱163可以将受到力均匀的释放到封装层14上,避免封装层14因某一个点受到较大而受到损坏。
其中,支撑柱163可以根据需要间隔设,可以是等距来设置,也可以任意距离来设置,具体的设置方法在此不做限定。
实施例三
如图5所示,为本申请实施例提供的柔性显示面板的第五种结构示意图,在所述衬底远离所述驱动电路层的表面上设置有缓冲构件,缓冲构件为支撑柱164。在柔性显示面板10受到冲击时,支撑柱164会将柔性显示面板10受的力分担一部分,因此减少了柔性显示面板10其他部分收到的力,且支撑柱164也可以抵抗模组机构的力(如铰链机构、卷曲机构、伸缩机构等),防止这些机构对柔性显示面板造成损伤。
如图6所示,在一种实施例中,所述支撑柱165为棱形且呈倒T形设置。由于支撑柱165倒T形设置,支撑柱165与衬底11的接触面较大,因此,可以支撑柱165可以将受到力均匀的释放到衬底11上,避免衬底11因某一个点受到较大而受到损坏。其中,支撑柱165可以根据需要间隔设置,具体的设置方法在此不做限定,可以是等距来设置,也可以任意距离来设置。
如图7所示,多个支撑柱166之间呈阵列设置,由于,多个支撑柱166之间呈阵列设置,因此,每个支撑柱166受到的力是均匀的,避免支撑柱166因受到的力不同而产生不同的形变,进而影响显示面板的性能。
如图8所示,在所述衬底11远离所述驱动电路层12的表面设置有缓冲构件,缓冲构件为缓冲层167,其中,缓冲层167可以独立制程制作,也可集成于柔性基底21上,所述缓冲层167可以进一步防止不期望的杂质或污染物(例如湿气、氧气等)从所述衬底11扩散至可能因这些杂质或污染物而受损的器件中,同时还可以抵抗模组机构的力(如铰链机构、卷曲机构、伸缩机构等),防止这些机构对柔性显示面板造成损伤。
实施例四
如图9所示,在一种实施例中,在所述衬底11远离所述驱动电路层12的一侧设置有第一缓冲构件169,在所述封装层14远离所述发光结构13的一侧设置有第二缓冲构件168,所述第一缓冲构件169和所述第二缓冲构件168在所述衬底11上的投影不重合,且所述第一缓冲构件169和所述第二缓冲构件168可以采用相同的材料,也可以采用不同的材料,具体材料的选定在此不做限定。
在一种实施例中,所述第一缓冲构件和所述第二缓冲构件都采用柔性有机材料,所述第一缓冲构件的材料采用聚酰亚胺,所述第二缓冲构件的材料为聚丙烯酸酯,由于柔性有机材料具有更好的缓冲性,因此可以更好地释放应力,从而提升显示面板的抗冲击能力并改善显示失效;同时由于柔性有机材料的弯折性好,因此在用于柔性显示面板时可以提升柔性显示面板的抗弯折性。
如图10所示,在一种实施例中,所述第一缓冲构件1611和所述第二缓冲构件1610采用不同的材料,不同的形状,第一缓冲构件1611为支撑柱,第二缓冲构件1610为缓冲层。在柔性显示面板10受到冲击时,支撑柱1611和缓冲层1610都起到缓冲作用,分担柔性显示面板10受到的一部分冲击力,避免柔性显示面板其他部分因受力过大,而被损坏。其中,支撑柱1611的形状在此不做限定,可以是T形,也可以是圆柱形。
在一种实施例中,所述第一缓冲构件的高度小于所述第二缓冲构件的高度。其中,所述第一缓冲构件的高度与所述第二缓冲构件的高度之差在此不做限定,根据具体需要进行设定,例如,所述第二缓冲构件比所述第一缓冲构件高10nm,也可以高20nm。
如图11所示,在一种实施例中,所述第一缓冲构件1613和所述第二缓冲构件1612采用不同的材料,不同的形状,第二缓冲构件1612为支撑柱,第一缓冲构件1613为缓冲层。在柔性显示面板10受到冲击时,支撑柱1612和缓冲层1613都起到缓冲作用,分担柔性显示面板10受到的一部分冲击力,避免柔性显示面板其他部分因受力过大,而被损坏。
其中,缓冲层1613可以独立制程制作,也可以集成在现有工艺制程中(如Array/OLED/的封装制程),例如,显示面板的生产厂商可以在生产显示面板时,将缓冲层161与衬底11、驱动电动层12、发光结构13以及封装层14作为一个整体统一生产,也可以将衬底11、驱动电动层12、发光结构13以及封装层14作为一个整体生产,将缓冲层161单独生产,再将单独生产的缓冲层161用于无缓冲层的显示面板上。支撑柱1612的形状在此不做限定,可以是T形,也可以是圆柱形。
本申请提供一种柔性显示面板包括衬底、设置在衬底的一侧的驱动电路层、设置在驱动电路层远离衬底的一侧的发光结构、以及设置在发光结构远离驱动电路层的一侧的封装层,其中,在封装层或衬底中至少一层的表面,还设置有缓冲构件。由于本申请中的柔性显示面板的在封装层或衬底的至少一层上设置有缓冲构件,因此增强了柔性显示面板的抗冲击性,避免在被撞击时出现黑斑、亮斑、彩斑、不能全彩显示等问题。
一种显示装置,包括设备本体及如上所述的柔性显示面板。
在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详述的部分,可以参见其他实施例的相关描述。
以上实施方式的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施方式中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。
以上对本申请实施例所提供的一种柔性显示面板及显示装置进行了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想;本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (20)

  1. 一种柔性显示面板,其包括:
    衬底;
    驱动电路层,设置在所述衬底的一侧;
    发光结构,设置在所述驱动电路层远离所述衬底的一侧;
    封装层,设置在所述发光结构远离所述驱动电路层的一侧;
    其中,在所述封装层或所述衬底中至少一层的表面,还设置有缓冲构件。
  2. 根据权利要求1所述的柔性显示面板,其中,在所述封装层远离所述发光结构的表面上设置有所述缓冲构件。
  3. 根据权利要求1所述的柔性显示面板,其中,在所述衬底远离所述驱动电路层的表面上设置有所述缓冲构件。
  4. 根据权利要求1所述的柔性显示面板,其中,所述缓冲构件包括第一缓冲构件和第二缓冲构件,所述第一缓冲构件设置在所述衬底远离所述驱动电路层的表面,所述第二缓冲构件设置在所述封装层远离所述发光结构的表面,所述第一缓冲构件在所述衬底上的投影和所述第二缓冲构件在所述衬底上的投影不重合。
  5. 根据权利要求4所述的柔性显示面板,其中,所述第一缓冲构件的高度小于所述第二缓冲构件的高度。
  6. 根据权利要求1所述的柔性显示面板,其中,所述缓冲构件为支撑柱。
  7. 根据权利要求6所述的柔性显示面板,其中,所述支撑柱呈倒T形设置。
  8. 根据权利要求6所述的柔性显示面板,其中,所述支撑柱包括棱台、圆柱中的一种或者多种。
  9. 根据权利要求1至8任一项所述的柔性显示面板,其中,所述缓冲构件的韧性大于所述衬底的韧性。
  10. 根据权利要求6所述的柔性显示面板,其中,多个所述支撑柱之间呈阵列设置。
  11. 一种显示装置,其包括设备本体及如权利要求1所述的柔性显示面板,所述柔性显示面板包括:
    衬底;
    驱动电路层,设置在所述衬底的一侧;
    发光结构,设置在所述驱动电路层远离所述衬底的一侧;
    封装层,设置在所述发光结构远离所述驱动电路层的一侧;
    其中,在所述封装层或所述衬底中至少一层的表面,还设置有缓冲构件。
  12. 根据权利要求11所述的显示装置,其中,在所述封装层远离所述发光结构的表面上设置有所述缓冲构件。
  13. 根据权利要求11所述的显示装置,其中,在所述衬底远离所述驱动电路层的表面上设置有所述缓冲构件。
  14. 根据权利要求11所述的显示装置,其中,所述缓冲构件包括第一缓冲构件和第二缓冲构件,所述第一缓冲构件设置在所述衬底远离所述驱动电路层的表面,所述第二缓冲构件设置在所述封装层远离所述发光结构的表面,所述第一缓冲构件在所述衬底上的投影和所述第二缓冲构件在所述衬底上的投影不重合。
  15. 根据权利要求14所述的显示装置,其中,所述第一缓冲构件的高度小于所述第二缓冲构件的高度。
  16. 根据权利要求11所述的显示装置,其中,所述缓冲构件为支撑柱。
  17. 根据权利要求16所述的显示装置,其中,所述支撑柱呈倒T形设置。
  18. 根据权利要求16所述的显示装置,其中,所述支撑柱包括棱台、圆柱中的一种或者多种。
  19. 根据权利要求11所述的显示装置,其中,所述缓冲构件的韧性大于所述衬底的韧性。
  20. 根据权利要求16所述的显示装置,其中,多个所述支撑柱之间呈阵列设置。
PCT/CN2021/141060 2021-12-22 2021-12-24 柔性显示面板及显示装置 WO2023115508A1 (zh)

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