WO2023112735A1 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
WO2023112735A1
WO2023112735A1 PCT/JP2022/044665 JP2022044665W WO2023112735A1 WO 2023112735 A1 WO2023112735 A1 WO 2023112735A1 JP 2022044665 W JP2022044665 W JP 2022044665W WO 2023112735 A1 WO2023112735 A1 WO 2023112735A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
terminal
sealing resin
portions
terminal portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/044665
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
遼平 梅野
弘招 松原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to CN202280083050.3A priority Critical patent/CN118525371A/zh
Priority to JP2023567700A priority patent/JPWO2023112735A1/ja
Priority to DE112022005516.2T priority patent/DE112022005516T5/de
Publication of WO2023112735A1 publication Critical patent/WO2023112735A1/ja
Priority to US18/742,527 priority patent/US20240332138A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Definitions

  • the present disclosure relates to electronic devices.
  • Patent Document 1 discloses an example of a circuit for monitoring the voltage of a battery mounted on an electric vehicle and controlling an inverter. This circuit can prevent overvoltage from being supplied to the inverter for driving the motor.
  • the motor control device described in Patent Document 1 includes a voltage detection circuit (high voltage battery voltage detection circuit) for monitoring the voltage of the battery.
  • This voltage detection circuit can be packaged, for example, as one electronic device and mounted on a circuit board of an electric vehicle or the like.
  • SOP Small Outline Package
  • a plurality of lead terminals protruding from the sealing resin are arranged at regular intervals.
  • An object of the present disclosure is to provide an electronic device that is improved over conventional electronic devices.
  • an object of the present disclosure is to provide an electronic device capable of suppressing discharge between a plurality of terminals while reducing the size of the device.
  • An electronic device includes an electronic component, a sealing resin that covers the electronic component, and a sealing resin that protrudes from the sealing resin to one side in a first direction orthogonal to a thickness direction of the sealing resin.
  • the first terminal portion and the second terminal portion are adjacent to each other with a first gap in a second direction orthogonal to the thickness direction and the first direction.
  • the plurality of third terminal portions are arranged at second intervals in the second direction.
  • the first spacing is greater than the second spacing.
  • the first terminal portion includes a plurality of first mounting portions each positioned at an end portion opposite to the sealing resin in the first direction.
  • FIG. 1 is a plan view showing an electronic device according to a first embodiment
  • FIG. FIG. 2 is a diagram showing the encapsulating resin in imaginary lines in the plan view of FIG.
  • FIG. 3 is a front view of the electronic device according to the first embodiment
  • 4 is a rear view of the electronic device according to the first embodiment
  • FIG. FIG. 5 is a left side view of the electronic device according to the first embodiment
  • 6 is a right side view of the electronic device according to the first embodiment
  • FIG. FIG. 7 is a cross-sectional view along line VII-VII of FIG.
  • FIG. 8 is a cross-sectional view along line VIII-VIII of FIG.
  • FIG. 9 is a schematic diagram showing the circuit configuration of the electronic component.
  • FIG. 10 is a plan view showing the electronic device according to the second embodiment, showing the encapsulating resin in imaginary lines.
  • FIG. 11 is a front view of an electronic device according to a second embodiment;
  • FIG. 12 is an enlarged plan view of a main part showing one step of manufacturing the electronic device according to the second embodiment.
  • FIG. 13 is a plan view showing the electronic device according to the first modification of the second embodiment, showing the encapsulating resin in imaginary lines.
  • 14 is a rear view of an electronic device according to a first modification of the second embodiment;
  • FIG. FIG. 15 is a plan view showing an electronic device according to a second modified example of the second embodiment, showing a sealing resin with imaginary lines.
  • FIG. 16 is a plan view showing the electronic device according to the third modification of the second embodiment, showing the encapsulating resin in imaginary lines.
  • FIG. 17 is a plan view showing the electronic device according to the third embodiment, showing the encapsulating resin in imaginary lines.
  • FIG. 18 is a plan view showing the electronic device according to the fourth embodiment, showing the encapsulating resin in imaginary lines.
  • 19 is a schematic diagram showing a circuit configuration of electronic components in the electronic device shown in FIG. 18.
  • FIG. FIG. 20 is a plan view showing an electronic device according to a modification of the fourth embodiment, showing the encapsulating resin in imaginary lines.
  • FIG. 21 is a plan view showing the electronic device according to the fifth embodiment, showing the encapsulating resin in imaginary lines.
  • FIG. 22 is a plan view showing the electronic device according to the sixth embodiment, showing the sealing resin in imaginary lines.
  • FIG. 23 is a plan view showing the electronic device according to the seventh embodiment, showing the encapsulating resin in imaginary lines.
  • the electronic device A1 includes a first lead 11, a second lead 12, a plurality of third leads 13, a fourth lead 14, a fifth lead 15, a die pad 4, an electronic component 5, a plurality of connection members 61 to 66, and a sealing resin. 7.
  • the electronic device A1 includes eleven third leads 13, but the number of third leads 13 is not limited at all.
  • the specific application of the electronic device A1 is not limited at all, it is for detecting the battery voltage of an electric vehicle, for example.
  • the electronic device A1 does not detect the battery voltage of the electric vehicle, but may detect other voltages of the electric vehicle. The voltage used may be detected.
  • the electronic device A1 is a surface-mounted semiconductor package, and in this embodiment, is of the SOP (Small Outline Package) type, as shown in FIGS.
  • the thickness direction of the electronic device A1 will be referred to as "thickness direction z".
  • one of the thickness directions z may be referred to as upward and the other as downward.
  • descriptions such as “upper”, “lower”, “upper”, “lower”, “upper surface” and “lower surface” indicate the relative positional relationship of each component etc. in the thickness direction z, and are not necessarily It is not a term that defines the relationship with the direction of gravity.
  • plane view refers to the time when viewed in the thickness direction z.
  • One direction perpendicular to the thickness direction z is called a "first direction y”.
  • a direction orthogonal to the thickness direction z and the first direction y is referred to as a "second direction x".
  • the first lead 11, the second lead 12, the plurality of third leads 13, the fourth lead 14, the fifth lead 15 and the die pad 4 are made of metal such as Cu (copper), Ni (nickel) and Fe (iron). include.
  • the first lead 11, the second lead 12, the plurality of third leads 13, the fourth lead 14, the fifth lead 15 and the die pad 4 are obtained from the same lead frame.
  • the first lead 11, the second lead 12, the plurality of third leads 13, the fourth lead 14, the fifth lead 15, and the die pad 4 are formed, for example, on a metal plate material by a process selected from punching, bending, etching, or the like. is formed by applying In addition, Ag (silver), Ni, A plating layer made of Au (gold) or the like may be provided.
  • the first lead 11, the second lead 12, the plurality of third leads 13, the fourth lead 14, and the fifth lead 15 are electrically connected to the electronic component 5 and form a conduction path in the electronic device A1.
  • the first lead 11, the second lead 12, the plurality of third leads 13, the fourth lead 14, and the fifth lead 15 are separated from each other.
  • Each of the first lead 11, the second lead 12, the plurality of third leads 13, the fourth lead 14, and the fifth lead 15 has a portion covered with the sealing resin 7 and a portion exposed from the sealing resin 7. have.
  • the first lead 11 includes a first terminal portion 21 and a first extension portion 31 .
  • the first terminal portion 21 is a portion of the first lead 11 exposed from the sealing resin 7 .
  • the first terminal portion 21 protrudes from the sealing resin 7 to one side in the first direction y.
  • the first terminal portion 21 is bent in a gull-wing shape when viewed in the second direction x.
  • First terminal portion 21 includes a plurality of portions separated from each other, and each of the plurality of portions includes first mounting portion 211 , first root portion 212 and first relay portion 213 .
  • the first terminal portion 21 includes two portions separated from each other, and the first terminal portion 21 includes two first mounting portions 211, two first root portions 212 and 2 It includes one first relay section 213 .
  • a first mounting portion 211, a first root portion 212, and a first relay portion 213, which will be described below, are common to each of the plurality of mutually separated portions of the first terminal portion 21 unless otherwise specified.
  • the first mounting portion 211 is the tip portion of each separated portion of the first terminal portion 21 .
  • Each of the two first mounting parts 211 is a part that is joined to a circuit board of an electric vehicle or the like when the electronic device A1 is mounted on the circuit board.
  • the first mounting portion 211 is located at the end opposite to the sealing resin 7 in the first direction y. Therefore, the first mounting portion 211 is located farther from the sealing resin 7 than the first root portion 212 and the first relay portion 213 in the first direction y.
  • the first mounting portion 211 is located below the first root portion 212 in the thickness direction z.
  • each first dimension W21 see FIG.
  • the second direction x of the two first mounting portions 211 is, for example, 0.15 mm or more and 1.5 mm or less.
  • the two first mounting portions 211 are adjacent to each other with a gap d1 (see FIG. 4) in the second direction x.
  • the first root portion 212 is the root portion of each separated portion of the first terminal portion 21 . As shown in FIGS. 1 and 2, the first root portion 212 is located at the end portion of the separated portions of the first terminal portion 21 on the sealing resin 7 side in the first direction y. Therefore, the first root portion 212 is positioned closer to the sealing resin 7 than the first mounting portion 211 and the first relay portion 213 in the first direction y. The first root portion 212 is located above the first mounting portion 211 in the thickness direction z, and protrudes from the central portion of the sealing resin 7 in the thickness direction z. Each dimension along the second direction x of the two first root portions 212 is the same as the first dimension W21 of each of the two first mounting portions 211 .
  • the first relay portion 213 connects the first mounting portion 211 and the first root portion 212 .
  • the first relay portion 213 is bent in the thickness direction z at the first terminal portion 21 .
  • the first relay portion 213 is inclined with respect to the first mounting portion 211 and the first root portion 212 when viewed along the second direction x.
  • the dimension along the second direction x of the first relay portion 213 is the same as the first dimension W21 of the first mounting portion 211 .
  • the first extending portion 31 is a portion of the first lead 11 covered with the sealing resin 7 .
  • the first extending portion 31 is connected to the first terminal portion 21 and extends inward from the sealing resin 7 from the first terminal portion 21 .
  • the first extending portion 31 includes a branch portion 311, as shown in FIG.
  • the branch portion 311 is arranged at the end of the first extension portion 31 on the side connected to the first terminal portion 21 .
  • the branch portion 311 is connected to each of the plurality of first root portions 212 .
  • the number of branches 311 is the same as the number of first roots 212 . Therefore, in a configuration in which the first terminal portion 21 includes two first root portions 212, the branch portion 311 is bifurcated. Two first roots 212 extend from each branched tip of the branch 311 . Therefore, the two first mounting portions 211 of the first terminal portion 21 have the same potential.
  • the second lead 12 includes a second terminal portion 22 and a second extension portion 32.
  • the second terminal portion 22 is a portion of the second lead 12 exposed from the sealing resin 7 .
  • the second terminal portion 22 protrudes from the sealing resin 7 to one side in the first direction y.
  • the planar view shape of the second terminal portion 22 is congruent with the planar view shape of the first terminal portion 21, but unlike this configuration, these planar view shapes may not be mutually congruent.
  • the second terminal portion 22 is bent in a gull-wing shape when viewed in the second direction x.
  • the second terminal portion 22 overlaps the first terminal portion 21 when viewed in the second direction x.
  • the second terminal portion 22 includes a plurality of portions separated from each other, and each of the plurality of portions includes a second mounting portion 221 , a second root portion 222 and a second relay portion 223 .
  • the second terminal portion 22 includes two portions separated from each other, and the second terminal portion 22 includes two second mounting portions 221 , two second root portions 222 and two second root portions 222 and 2 . It includes two second relay sections 223 .
  • the second mounting portion 221, the second root portion 222, and the second relay portion 223, which will be described below, are common to the portions of the second terminal portion 22 separated from each other, unless otherwise specified.
  • the second mounting portion 221 is the tip portion of each separated portion of the second terminal portion 22 .
  • Each of the two second mounting parts 221 is a part that is joined to a circuit board of an electric vehicle or the like when the electronic device A1 is mounted on the circuit board.
  • the second mounting portion 221 is located at the end opposite to the sealing resin 7 in the first direction y. Therefore, the second mounting portion 221 is positioned farther from the sealing resin 7 than the second root portion 222 and the second relay portion 223 in the first direction y.
  • the second mounting portion 221 is located below the second root portion 222 in the thickness direction z.
  • the second mounting portion 221 is arranged at the same position as each of the first mounting portions 211 in the thickness direction z.
  • each second dimension W22 (see FIG. 1) along the second direction x of the two second mounting portions 221 is, for example, 0.15 mm or more and 1.5 mm or less.
  • each second dimension W22 of the two second mounting portions 221 is the same as each first dimension W21 of the two first mounting portions 211, but each first dimension W21 and each second dimension W22 may be different from each other.
  • the two second mounting portions 221 are adjacent to each other with a gap d2 (see FIG. 4) in the second direction x.
  • the second root portion 222 is the root portion of each separated portion of the second terminal portion 22 . As shown in FIGS. 1 and 2, the second root portion 222 is located at the end portion of the separated portions of the second terminal portion 22 on the sealing resin 7 side in the first direction y. Therefore, the second root portion 222 is positioned closer to the sealing resin 7 than the second mounting portion 221 and the second relay portion 223 in the first direction y. The second root portion 222 is located above the second mounting portion 221 in the thickness direction z and protrudes from the central portion of the sealing resin 7 in the thickness direction z. The second root portion 222 is arranged at the same position as the first root portion 212 in the thickness direction z. Each dimension along the second direction x of the two second root portions 222 is the same as the second dimension W22 of each of the two second mounting portions 221 .
  • the second relay portion 223 connects the second mounting portion 221 and the second root portion 222 .
  • the second relay portion 223 is bent in the thickness direction z at the second terminal portion 22 .
  • the second relay portion 223 is inclined with respect to the second mounting portion 221 and the second root portion 222 when viewed along the second direction x.
  • the dimension along the second direction x of the second relay portion 223 is the same as the second dimension W22 of the second mounting portion 221 .
  • the second extending portion 32 is a portion of the second lead 12 covered with the sealing resin 7 .
  • the second extending portion 32 is connected to the second terminal portion 22 and extends inward of the sealing resin 7 from the second terminal portion 22 .
  • the second extending portion 32 includes a branch portion 321, as shown in FIG.
  • the branch portion 321 is arranged at the end of the second extension portion 32 on the side connected to the second terminal portion 22 .
  • the branch portion 321 connects to each of the plurality of second root portions 222 .
  • the number of branches 321 is the same as the number of second roots 222 . Therefore, in a configuration in which the second terminal portion 22 includes two second root portions 222, the branch portion 321 is bifurcated. Two second roots 222 extend from each branched tip of the branch 321 . Therefore, the two second mounting portions 221 of the second terminal portion 22 have the same potential.
  • the multiple third leads 13 each include a third terminal portion 23 and a third extension portion 33 . Accordingly, the electronic device A1 includes multiple third terminal portions 23 and multiple third extension portions 33 .
  • the third terminal portion 23 and the third extension portion 33 described below are common to each third lead 13 unless otherwise specified.
  • the third terminal portion 23 is a portion of each third lead 13 exposed from the sealing resin 7 .
  • Each third terminal portion 23 protrudes from the sealing resin 7 to the other side in the first direction y.
  • Each third terminal portion 23 has a belt-like shape with the first direction y as its longitudinal direction in plan view.
  • the plurality of third terminal portions 23 are arranged at regular intervals along the second direction x.
  • Each third terminal portion 23 is bent in a gull-wing shape when viewed in the second direction x.
  • the plurality of third terminal portions 23 overlap each other when viewed in the second direction x.
  • the third terminal portion 23 includes a third mounting portion 231 , a third root portion 232 and a third relay portion 233 .
  • the electronic device A ⁇ b>1 includes a plurality of third mounting portions 231 , a plurality of third root portions 232 and a plurality of third relay portions 233 .
  • a third mounting portion 231, a third root portion 232, and a third relay portion 233, which will be described below, are common to each third terminal portion 23 unless otherwise specified.
  • the third mounting portion 231 is the tip portion of the third terminal portion 23 .
  • the third mounting portion 231 is a portion that is joined to a circuit board of an electric vehicle or the like when the electronic device A1 is mounted on the circuit board. As shown in FIGS. 1 and 2, the third mounting portion 231 is positioned at the end opposite to the sealing resin 7 in the first direction y. Therefore, the third mounting portion 231 is positioned farther from the sealing resin 7 than the third root portion 232 and the third relay portion 233 in the first direction y.
  • the third mounting portion 231 is located below the third root portion 232 in the thickness direction z.
  • the multiple third mounting portions 231 are arranged at the same position in the thickness direction z.
  • the third dimension W23 see FIG.
  • each third mounting portion 231 in the second direction x is greater than or equal to the first dimension W21 of each first mounting portion 211 and the second dimension W22 of each second mounting portion 221. be.
  • the first dimension W21 of each first mounting portion 211 and the second dimension W22 of each second mounting portion 221 are equal to or less than the third dimension W23 of each third mounting portion 231 .
  • the first dimension W21 of the first mounting portion 211 and the second dimension W22 of the second mounting portion 221 are each 1/10 or more and 1 or less times the third dimension W23 of each third mounting portion 231.
  • the first dimension W21 and the second dimension W22 are the same as the third dimension W23.
  • the third dimension W23 in the second direction x of each third mounting portion 231 is, for example, 0.15 mm or more and 1.5 mm or less.
  • the third root portion 232 is the root portion of the third terminal portion 23 . As shown in FIGS. 1 and 2, the third root portion 232 is located at the end of the third terminal portion 23 on the sealing resin 7 side in the first direction y. Therefore, the third root portion 232 is positioned closer to the sealing resin 7 than the third mounting portion 231 and the third relay portion 233 in the first direction y. The third root portion 232 is located above the third mounting portion 231 in the thickness direction z, and protrudes from the central portion of the sealing resin 7 in the thickness direction z. The plurality of third root portions 232 are arranged at the same positions in the thickness direction z. The dimension of the third root portion 232 along the second direction x is the same as the third dimension W23 of the third mounting portion 231 .
  • the third relay portion 233 connects the third mounting portion 231 and the third root portion 232 .
  • the third relay portion 233 bends in the thickness direction z at the third terminal portion 23 .
  • the third relay portion 233 is inclined with respect to the third mounting portion 231 and the third root portion 232 when viewed along the second direction x.
  • the dimension of the third relay portion 233 along the second direction x is the same as the third dimension W23 of the third mounting portion 231 .
  • the third extending portion 33 is a portion of each third lead 13 covered with the sealing resin 7 .
  • the third extending portion 33 is connected to the third terminal portion 23 and extends inwardly of the sealing resin 7 from the third terminal portion 23 .
  • the fourth lead 14 includes a fourth terminal portion 24 and a fourth extension portion 34.
  • the fourth terminal portion 24 is a portion of the fourth lead 14 exposed from the sealing resin 7 .
  • the fourth terminal portion 24 protrudes from the sealing resin 7 to the other side in the first direction y.
  • the plan view shape of the fourth terminal portion 24 is congruent with the plan view shape of the first terminal portion 21, but unlike this configuration, these plan view shapes may not be mutually congruent.
  • the fourth terminal portion 24 is positioned on the other side in the second direction x with respect to the plurality of third terminal portions 23 .
  • the fourth terminal portion 24 is bent in a gull-wing shape when viewed in the second direction x.
  • the fourth terminal portion 24 overlaps each third terminal portion 23 when viewed in the second direction x.
  • the fourth terminal portion 24 overlaps the first terminal portion 21 when viewed along the first direction y.
  • the fourth terminal portion 24 includes a plurality of portions separated from each other, and each of the plurality of portions includes a fourth mounting portion 241 , a fourth root portion 242 and a fourth relay portion 243 .
  • the fourth terminal portion 24 includes two portions separated from each other, and the fourth terminal portion 24 includes two fourth mounting portions 241, two fourth root portions 242 and 2 It includes one fourth relay section 243 .
  • the fourth mounting portion 241, the fourth root portion 242, and the fourth relay portion 243 which will be described below, are common to the respective separated portions of the fourth terminal portion 24 unless otherwise specified.
  • the fourth mounting portion 241 is the tip portion of each separated portion of the fourth terminal portion 24 .
  • Each of the two fourth mounting portions 241 is a portion that is joined to a circuit board of an electric vehicle or the like when the electronic device A1 is mounted on the circuit board.
  • the fourth mounting portion 241 is positioned at the end opposite to the sealing resin 7 in the first direction y. Therefore, the fourth mounting portion 241 is located farther from the sealing resin 7 than the fourth root portion 242 and the fourth relay portion 243 in the first direction y.
  • the fourth mounting portion 241 is located below the fourth root portion 242 in the thickness direction z.
  • the fourth mounting portion 241 is arranged at the same position as each of the third mounting portions 231 in the thickness direction z.
  • the two fourth mounting portions 241 are adjacent to each other in the second direction x on the other side (the left side in FIG. 1) of the plurality of third mounting portions 231 in the second direction x.
  • Each fourth dimension W24 (see FIG. 1) of the two fourth mounting portions 241 along the second direction x is less than or equal to the third dimension W23 of each third mounting portion 231.
  • each fourth dimension W24 is the same as each third dimension W23.
  • Each fourth dimension W24 of the two fourth mounting portions 241 is the same as each first dimension W21 of the two first mounting portions 211, for example.
  • each fourth dimension W24 along the second direction x of the two fourth mounting portions 241 is, for example, 0.15 mm or more and 1.5 mm or less.
  • the distance d4 (see FIG. 3) between the two fourth mounting portions 241 is the same as the second distance d3 between the third mounting portions 231 adjacent to each other in the second direction x.
  • the one arranged on the other side in the second direction x (the left side in FIG. 1) has an edge on the other side in the second direction x that is the second mounting portion 241 when viewed in the first direction y. It overlaps with the edge on the other side in the second direction x of the first mounting portion 211 on the other side in the second direction x.
  • the one arranged on one side in the second direction x (the right side in FIG.
  • the fourth root portion 242 is the root portion of each separated portion of the fourth terminal portion 24 . As shown in FIGS. 1 and 2, the fourth root portion 242 is located at the end portion of the separated portions of the fourth terminal portion 24 on the sealing resin 7 side in the first direction y. Therefore, the fourth root portion 242 is positioned closer to the sealing resin 7 than the fourth mounting portion 241 and the fourth relay portion 243 in the first direction y. The fourth root portion 242 is located above the fourth mounting portion 241 in the thickness direction z, and protrudes from the central portion of the sealing resin 7 in the thickness direction z. The fourth root portion 242 is arranged at the same position as each of the third root portions 232 in the thickness direction z. Each dimension along the second direction x of the two fourth root portions 242 is the same as the fourth dimension W24 of each of the two fourth mounting portions 241 .
  • the fourth relay portion 243 connects the fourth mounting portion 241 and the fourth root portion 242 .
  • the fourth relay portion 243 bends in the thickness direction z at the fourth terminal portion 24 .
  • the fourth relay portion 243 is inclined with respect to the fourth mounting portion 241 and the fourth root portion 242 when viewed along the second direction x.
  • the dimension of the fourth relay portion 243 along the second direction x is the same as the fourth dimension W24 of the fourth mounting portion 241 .
  • the fourth extending portion 34 is a portion of the fourth lead 14 covered with the sealing resin 7 .
  • the fourth extending portion 34 is connected to the fourth terminal portion 24 and extends inwardly of the sealing resin 7 from the fourth terminal portion 24 .
  • the fourth extending portion 34 includes a branch portion 341, as shown in FIG.
  • the branch portion 341 is arranged at the end portion of the fourth extension portion 34 on the side connected to the fourth terminal portion 24 .
  • the branch portion 341 connects to each of the plurality of fourth root portions 242 .
  • the number of branches 341 is the same as the number of fourth roots 242 . Therefore, in a configuration in which the fourth terminal portion 24 includes two fourth root portions 242, the branch portion 341 is bifurcated. Two fourth roots 242 extend from each branched tip of the branch 341 . Therefore, the two fourth mounting portions 241 of the fourth terminal portion 24 have the same potential.
  • the fifth lead 15 includes a fifth terminal portion 25 and a fifth extension portion 35.
  • the fifth terminal portion 25 is a portion of the fifth lead 15 exposed from the sealing resin 7 . As shown in FIG. 2, the fifth terminal portion 25 protrudes from the sealing resin 7 to the other side in the first direction y.
  • the plan view shape of the fifth terminal portion 25 is congruent with the plan view shape of the second terminal portion 22, but unlike this configuration, these plan view shapes may not be mutually congruent.
  • the plan view shape of the fifth terminal portion 25 is congruent with the plan view shape of the fourth terminal portion 24, but unlike this configuration, these plan view shapes may not be mutually congruent. good.
  • the fifth terminal portion 25 is positioned on one side in the second direction x with respect to the plurality of third terminal portions 23 .
  • the fifth terminal portion 25 is located on the side opposite to the fourth terminal portion 24 in the second direction x with respect to the plurality of third terminal portions 23 .
  • the fifth terminal portion 25 is bent in a gull-wing shape when viewed in the second direction x.
  • the fifth terminal portion 25 overlaps each third terminal portion 23 when viewed in the second direction x.
  • the fifth terminal portion 25 overlaps the second terminal portion 22 when viewed along the first direction y.
  • the fifth terminal portion 25 includes a plurality of portions separated from each other, and each of the plurality of portions includes a fifth mounting portion 251 , a fifth root portion 252 and a fifth relay portion 253 . In the example shown in FIGS.
  • the fifth terminal portion 25 includes two portions separated from each other, and the fifth terminal portion 25 includes two fifth mounting portions 251, two fifth root portions 252 and 2 It includes one fifth relay section 253 .
  • the fifth mounting portion 251, the fifth root portion 252, and the fifth relay portion 253, which will be described below, are common to the respective separated portions of the fifth terminal portion 25 unless otherwise specified.
  • the fifth mounting portion 251 is the tip portion of each separated portion of the fifth terminal portion 25 .
  • Each of the two fifth mounting portions 251 is a portion that is joined to a circuit board of an electric vehicle or the like when the electronic device A1 is mounted on the circuit board.
  • the fifth mounting portion 251 is positioned at the end opposite to the sealing resin 7 in the first direction y. Therefore, the fifth mounting portion 251 is located farther from the sealing resin 7 than the fifth root portion 252 and the fifth relay portion 253 in the first direction y.
  • the fifth mounting portion 251 is located below the fifth root portion 252 in the thickness direction z.
  • the fifth mounting portion 251 is arranged at the same position as each of the third mounting portions 231 in the thickness direction z.
  • the two fifth mounting portions 251 are adjacent to each other in the second direction x on one side (the right side in FIG. 1) of the plurality of third mounting portions 231 in the second direction x.
  • Each fifth dimension W25 (see FIG. 1) of the two fifth mounting portions 251 along the second direction x is less than or equal to the third dimension W23 of each third mounting portion 231 .
  • each fifth dimension W25 is the same as each third dimension W23.
  • Each fifth dimension W25 of the two fifth mounting portions 251 is, for example, the same as each second dimension W22 of the two second mounting portions 221 .
  • each fifth dimension W25 along the second direction x of the two fifth mounting portions 251 is, for example, 0.15 mm or more and 1.5 mm or less.
  • the distance d5 (see FIG. 3) between the two fifth mounting portions 251 is the same as the second distance d3 between the third mounting portions 231 adjacent to each other in the second direction x.
  • the one arranged on the other side in the second direction x (the left side in FIG. 1) has an edge on the other side in the second direction x that is the second mounting portion 251 when viewed in the first direction y. It overlaps with the edge of the second mounting portion 221 on the other side in the second direction x.
  • the one arranged on one side in the second direction x (the right side in FIG. 1) has an edge on one side in the second direction x that is the second mounting portion 251 when viewed in the first direction y. It overlaps with the edge on one side in the second direction x of the second mounting portion 221 on one side in the two directions x.
  • the fifth root portion 252 is the root portion of each separated portion of the fifth terminal portion 25 . As shown in FIGS. 1 and 2, the fifth root portion 252 is located at the end portion of the separated portions of the fifth terminal portion 25 on the sealing resin 7 side in the first direction y. Therefore, the fifth root portion 252 is positioned closer to the sealing resin 7 than the fifth mounting portion 251 and the fifth relay portion 253 in the first direction y. The fifth root portion 252 is located above the fifth mounting portion 251 in the thickness direction z, and protrudes from the central portion of the sealing resin 7 in the thickness direction z. The fifth root portion 252 is arranged at the same position as each of the third root portions 232 in the thickness direction z. Each dimension along the second direction x of the two fifth root portions 252 is the same as the fifth dimension W25 of each of the two fifth mounting portions 251 .
  • the fifth relay portion 253 connects the fifth mounting portion 251 and the fifth root portion 252 .
  • the fifth relay portion 253 bends in the thickness direction z at the fifth terminal portion 25 .
  • the fifth relay portion 253 is inclined with respect to the fifth mounting portion 251 and the fifth root portion 252 when viewed along the second direction x.
  • the dimension of the fifth relay portion 253 along the second direction x is the same as the fifth dimension W25 of the fifth mounting portion 251 .
  • the fifth extending portion 35 is a portion of the fifth lead 15 covered with the sealing resin 7 .
  • the fifth extending portion 35 is connected to the fifth terminal portion 25 and extends inwardly of the sealing resin 7 from the fifth terminal portion 25 .
  • the plurality of third extensions 33 are sandwiched between the fourth extensions 34 and the fifth extensions 35 in the second direction x.
  • the fifth extending portion 35 includes a branch portion 351 as shown in FIG.
  • the branch portion 351 is arranged at the end of the fifth extension portion 35 on the side connected to the fifth terminal portion 25 .
  • the branch portion 351 connects to each of the plurality of fifth root portions 252 .
  • the number of branches 351 is the same as the number of fifth roots 252 .
  • the branch portion 351 is bifurcated. Two fifth roots 252 extend from each branched tip of the branch 351 . Therefore, the two fifth mounting portions 251 of the fifth terminal portion 25 have the same potential.
  • the first mounting portion 211 on one side in the second direction x and the second mounting portion 221 on the other side in the second direction x are separated by a first distance d12 (see FIG. 4) in the second direction x. adjacent to each other.
  • the plurality of third mounting portions 231 are arranged in the second direction x with a second spacing d3 (see FIG. 3).
  • a first distance d12 (see FIG. 4) in the second direction x between the first mounting portion 211 on one side in the second direction x and the second mounting portion 221 on the other side in the second direction x is It is larger than the second interval d3 (see FIG. 3) between the adjacent third mounting portions 231 in the second direction x.
  • the first distance d12 is 10 times or more and 20 times or less the second distance d3.
  • the first distance d12 is, for example, 5 mm or more and 10 mm or less
  • the second distance d3 is, for example, 0.15 mm or more and 0.5 mm or less.
  • the first distance d12 may be 4 mm or more. preferable.
  • the distance d1 and the distance d2 are the same as the second distance d3 (see FIG. 3).
  • a third distance d34 (see FIG.
  • Each fourth dimension W24 of one fourth mounting portion 241 and each fifth dimension W25 of two fifth mounting portions 251 are the same as each other.
  • the first terminal portion 21, the second terminal portion 22, the plurality of third terminal portions 23, the fourth terminal portion 24, and the fifth terminal portion 25 are outer leads.
  • the second extension portion 32, the plurality of third extension portions 33, the fourth extension portion 34, and the fifth extension portion 35 are inner leads.
  • the shape of the inner leads is not limited to the illustrated example.
  • the die pad 4 supports the electronic component 5.
  • Die pad 4 includes a first pad portion 41 and a second pad portion 42 .
  • the first pad portion 41 and the second pad portion 42 are separated from each other.
  • each planar view shape of the first pad portion 41 and the second pad portion 42 is not limited at all, it is rectangular in the illustrated example.
  • the first pad portion 41 and the second pad portion 42 are arranged, for example, in the first direction y, and the first pad portion 41 is located closer to the first direction y than the second pad portion 42 is. located on one side of
  • the first pad portion 41 is connected to the first extension portion 31 .
  • the first pad portion 41 and the first lead 11 are integrally formed.
  • the second pad portion 42 is connected to the fourth extension portion 34 and the fifth extension portion 35 .
  • the second pad portion 42, the fourth lead 14 and the fifth lead 15 are integrally formed.
  • the die pad 4 and the inner leads are not limited to the illustrated example, and can be changed as appropriate according to the specifications of the electronic device A1.
  • the electronic component 5 is an element that exerts an electrical function in the electronic device A1.
  • a specific function of the electronic component 5 is not limited at all, but in the present embodiment, the electronic component 5 has a function of detecting voltage.
  • the electronic component 5 includes a first chip 51 and a second chip 52 separated from each other.
  • the first chip 51 is mounted on the first pad section 41 .
  • the first chip 51 outputs a first signal corresponding to the potential of the first lead 11 and a second signal corresponding to the potential of the second lead 12 to the second chip 52 .
  • the first chip 51 has a plurality of electrodes 511, 512, 513 arranged on the upper surface in the thickness direction z.
  • the second chip 52 is mounted on the second pad section 42 .
  • the second chip 52 receives the first signal and the second signal from the first chip 51 and outputs the third signal according to the potential difference between the first lead 11 and the second lead 12 . That is, the second chip 52 outputs a detection signal (third signal) of the voltage applied between the first lead 11 and the second lead 12 .
  • a plurality of electrodes 521 and 522 are arranged on the upper surface of the second chip 52 in the thickness direction z.
  • the electronic component 5 (the first chip 51 and the second chip 52) has the circuit configuration shown in FIG. 9, for example.
  • the first chip 51 includes a plurality of resistive elements R1-R4, and the second chip 52 includes an operational amplifier OP and a resistive element R5.
  • the circuit configuration of the electronic component 5 shown in FIG. 9 is not limited to the example shown in FIG.
  • the two resistance elements R1 and R2 are connected in series with each other.
  • the two resistance elements R1 and R2 divide the voltage of the terminal T1 (potential difference between the potential of the terminal T1 and the reference potential of the ground GND).
  • terminal T1 corresponds to each electrode 512 .
  • a connection point between the two resistance elements R1 and R2 is connected to the non-inverting input terminal of the operational amplifier OP.
  • the two resistive elements R3 and R4 are connected in series with each other.
  • the two resistance elements R3 and R4 divide the voltage of the terminal T2 (potential difference between the potential of the terminal T2 and the reference potential of the ground GND).
  • the terminal T2 corresponds to each electrode 511.
  • a connection point between the two resistance elements R3 and R4 is connected to an inverting input terminal of the operational amplifier OP.
  • the electronic device A1 detects the voltage of the battery mounted on the electric vehicle, one of the terminals T1 and T2 is electrically connected to the high potential side terminal of the battery, and the other is electrically connected to the low potential side terminal. is electrically connected to
  • the operational amplifier OP outputs a first signal corresponding to the potential of the terminal T1 (in this embodiment, a signal obtained by dividing the voltage of the terminal T1) and a second signal corresponding to the potential of the terminal T2 (in this embodiment, a signal obtained by dividing the voltage of the terminal T2). ) is input, and a third signal corresponding to the potential difference between the terminals T1 and T2 is output.
  • the resistance element R5 is an element (feedback resistance) for determining the amplification gain of the operational amplifier OP. One end of the resistance element R5 is connected to the inverting input terminal of the operational amplifier OP, and the other end is connected to the output terminal of the operational amplifier OP.
  • the second chip 52 may not include the resistance element R5.
  • each of the plurality of connecting members 61-66 electrically connect parts separated from each other.
  • each of the plurality of connecting members 61-66 is a bonding wire.
  • Each of the plurality of connection members 61 to 66 may be a plate-like metal member instead of a bonding wire.
  • Each of the plurality of connection members 61-66 contains any one of Au, Al (aluminum), and Cu.
  • connection member 61 is joined to the electrode 511 of the first chip 51 and the first extension 31 to electrically connect the first chip 51 and the first lead 11, as shown in FIG. That is, the first terminal portion 21 of the first lead 11 is electrically connected to the first chip 51 of the electronic component 5 via the connecting member 61 .
  • connection member 62 is joined to the first chip 51, the electrode 512 and the second extension 32, and electrically connects the first chip 51 and the second lead 12, as shown in FIG. That is, the second terminal portion 22 of the second lead 12 is electrically connected to the first chip 51 of the electronic component 5 via the connecting member 62 .
  • each of the plurality of connection members 63 is joined to one of the electrodes 521 of the second chip 52 and the plurality of third extensions 33, and is connected to either the second chip 52 or the plurality of third leads 13. electrically connect the heel. That is, each third terminal portion 23 of the plurality of third leads 13 is electrically connected to the second chip 52 of the electronic component 5 via one of the plurality of connecting members 63 .
  • connection member 64 is joined to the electrode 521 of the second chip 52 and the fourth extension 34 to electrically connect the second chip 52 and the fourth lead 14, as shown in FIG. That is, the fourth terminal portion 24 of the fourth lead 14 is electrically connected to the second chip 52 of the electronic component 5 via the connecting member 64 .
  • connection member 65 is joined to the electrode 521 of the second chip 52 and the fifth extension 35 to electrically connect the second chip 52 and the fifth lead 15, as shown in FIG. That is, the fifth terminal portion 25 of the fifth lead 15 is electrically connected to the second chip 52 of the electronic component 5 via the connection member 65 .
  • connection members 66 are joined to the electrodes 513 of the first chip 51 and the electrodes 522 of the second chip 52 to electrically connect the first chip 51 and the second chip 52, as shown in FIG. . Therefore, the plurality of connection members 66 are transmission paths for the first signal and the second signal.
  • the encapsulating resin 7 includes parts of the first lead 11, the second lead 12, the plurality of third leads 13, the fourth lead 14, and the fifth lead 15, and the die pad 4 (the first pad portion 41 and the second pad portion 41). 42), electronic component 5 (first chip 51 and second chip 52), and a plurality of connecting members 61-66.
  • Sealing resin 7 contains an insulating material such as epoxy resin.
  • the sealing resin 7 is made of a resin material having a CTI (Comparative Tracking Index) of 600 V or more.
  • the sealing resin 7 has, for example, a rectangular parallelepiped shape.
  • the sealing resin 7 has a dimension along the second direction x of, for example, 5 mm or more and 10 mm or less, and a dimension along the first direction y of, for example, 3 mm or more and 13 mm or less.
  • the sealing resin 7 has a resin main surface 71, a resin back surface 72, and a plurality of resin side surfaces 731-734.
  • the resin main surface 71 and the resin back surface 72 are separated from each other in the thickness direction z.
  • the resin main surface 71 faces one thickness direction z, and the resin back surface 72 faces the other thickness direction z.
  • the resin main surface 71 is the upper surface of the sealing resin 7 and the resin rear surface 72 is the lower surface of the sealing resin 7 .
  • the pair of resin side surfaces 731 and 732 are separated from each other in the first direction y.
  • the resin side surface 731 faces one side in the first direction y, and the resin side surface 732 faces the other side in the first direction y.
  • the pair of resin side surfaces 733 and 734 are separated from each other in the second direction x.
  • the resin side surface 733 faces one of the second directions x, and the resin side surface 734 faces the other of the second directions x.
  • the first terminal portion 21 and the second terminal portion 22 protrude from the resin side surface 731.
  • the plurality of third terminal portions 23 , fourth terminal portions 24 and fifth terminal portions 25 protrude from the resin side surface 732 .
  • the effects of the electronic device A1 are as follows.
  • the first terminal portion 21 and the second terminal portion 22 are adjacent to each other with a first gap d12 in the second direction x. , are arranged at a second interval d3.
  • the first spacing d12 is greater than the second spacing d3.
  • the electronic device A1 it is possible to suppress discharge between the first terminal portion 21 and the second terminal portion 22 while miniaturizing the device.
  • the electronic device A1 has a preferable package structure for suppressing discharge between the first terminal portion 21 and the second terminal portion 22 .
  • the first terminal portion 21 includes a plurality of first mounting portions 211
  • the second terminal portion 22 includes a plurality of second mounting portions 221.
  • the number of lead terminals (first terminal portions 21 and second terminal portions 22) protruding from one side of the sealing resin 7 in the first direction y is in the configuration in which the number of lead terminals (plurality of third terminal portions 23) projecting from the other side in the first direction y is smaller than the number of lead terminals on one side and the other side in the first direction y of the sealing resin 7 , the thermal stress concentrates on each lead terminal (first terminal portion 21 and second terminal portion 22) projecting from one side of the sealing resin 7 in the first direction y. Such concentration of thermal stress causes the first terminal portion 21 and the second terminal portion 22 to separate from the circuit board.
  • the first terminal portion 21 includes a plurality of first mounting portions 211
  • the second terminal portion 22 includes a plurality of second mounting portions 221, so that the first terminal portion 21 Relaxing the thermal stress applied to the first terminal portion 21 and the second terminal portion 22 as compared with the case where the one first mounting portion 211 and the second terminal portion 22 consist of the one second mounting portion 221. can be done.
  • the thermal stress applied to the first terminal portion 21 is distributed to the plurality of first mounting portions 211 and the thermal stress applied to the second terminal portion 22 is distributed to the plurality of second mounting portions 221 .
  • the electronic device A1 can prevent the first terminal portion 21 and the second terminal portion 22 from peeling off from the circuit board of an electric vehicle or the like, thereby improving the mounting reliability of the device.
  • the electronic device A1 includes a plurality of fourth mounting portions 241 overlapping each of the plurality of first mounting portions 211 when viewed in the second direction x, and a plurality of second mounting portions 221 when viewed in the second direction x. and a plurality of fifth mounting portions 251 overlapping each other.
  • the fourth dimensions W24 of the plurality of fourth mounting portions 241 along the second direction x are the same as the first dimensions W21 of the plurality of first mounting portions 211, and the respective fourth dimensions W21 of the plurality of fifth mounting portions 251 are the same.
  • Each fifth dimension W25 along the two directions x is the same as each second dimension W22 of the plurality of second mounting portions 221 .
  • the thermal stress applied to each first mounting portion 211 and the thermal stress applied to each fourth mounting portion 241 are equalized, and the thermal stress applied to each fourth mounting portion 241 and each fifth mounting portion are equalized.
  • Thermal stress can be equalized instead of 251 .
  • the lead terminals first terminal portion 21, It is possible to equalize the thermal stress applied to each of the second terminal portion 22, the fourth terminal portion 24, and the fifth terminal portion 25). Therefore, the electronic device A1 can further improve the mounting reliability of the lead terminals arranged at the four corners.
  • the first terminal portion 21 includes two first mounting portions 211 in the above embodiment, it may include three or more first mounting portions 211 .
  • the first dimension W21 of each first mounting portion 211 is made smaller than the third dimension W23 of each third mounting portion 231 in order to suppress an increase in the dimension of the electronic device A1 in the second direction x, Also, the thermal stress applied to the first terminal portion 21 can be relaxed.
  • the second terminal portion 22 has shown an example including two second mounting portions 221 , it may include three or more second mounting portions 221 .
  • FIGS. 10 and 11 show an electronic device A2 according to the second embodiment. As shown in FIGS. 10 and 11, the electronic device A2 differs from the electronic device A1 in the configurations of the first lead 11, the second lead 12, the fourth lead 14, and the fifth lead 15.
  • FIG. 10 and 11 show an electronic device A2 according to the second embodiment. As shown in FIGS. 10 and 11, the electronic device A2 differs from the electronic device A1 in the configurations of the first lead 11, the second lead 12, the fourth lead 14, and the fifth lead 15.
  • FIG. 10 and 11 show an electronic device A2 according to the second embodiment. As shown in FIGS. 10 and 11, the electronic device A2 differs from the electronic device A1 in the configurations of the first lead 11, the second lead 12, the fourth lead 14, and the fifth lead 15.
  • the first extending portion 31 does not include the branch portion 311, and the first root portion 212 is provided with a branched portion.
  • the width (dimension in the second direction x) of the portion overlapping the outer periphery of the sealing resin 7 in plan view is larger than that of the electronic device A1.
  • the second extending portion 32 does not include the branch portion 321, and the second root portion 222 is provided with a branched portion.
  • the width (dimension in the second direction x) of the portion overlapping the outer circumference of the sealing resin 7 in plan view is larger than that of the electronic device A1.
  • the fourth extending portion 34 does not include the branch portion 341, and a branched portion is provided at the fourth root portion 242.
  • the width (dimension in the second direction x) of the portion overlapping the outer circumference of the sealing resin 7 in plan view is larger than that of the electronic device A1.
  • the fifth extending portion 35 does not include the branch portion 351, and a branched portion is provided at the fifth root portion 252.
  • the width (dimension in the second direction x) of the portion overlapping the outer circumference of the sealing resin 7 in plan view is larger than that of the electronic device A1.
  • the electronic device A2 can suppress discharge between the first terminal portion 21 and the second terminal portion 22 while reducing the size of the device. Further, in the electronic device A2, similarly to the electronic device A1, the stress applied to the first terminal portion 21 and the second terminal portion 22 can be relaxed, and the mounting reliability of the device can be improved.
  • a branched portion is provided in the first root portion 212 (first terminal portion 21).
  • the aforementioned branched portion of the first lead 11 is arranged outside the sealing resin 7 .
  • the first lead 11, the second lead 12, the plurality of third leads 13, the fourth lead 14 and the fifth lead 15 are formed into one lead frame. 9 are connected to each other by tie bars 91 .
  • the tie bar 91 includes, for example, a first root portion 212 of the first lead 11, a second root portion 222 of the second lead 12, a third root portion 232 of each third lead 13, and a fourth root portion 242 of the fourth lead 14. and the fifth root portion 252 of the fifth lead 15, respectively.
  • the first extending portion 31 is supported by the tie bar 91 at the connection point C1 shown in FIG. Therefore, the load applied to the first extension portion 31 is applied to the connection portion C1.
  • the load on the first pad portion 41 is also applied to the connection portion C1, and the burden on the connection portion C1 is increased.
  • the first extension is performed. A load is applied to the projecting portion 31 and the first pad portion 41 .
  • the first lead 11 may be deformed (for example, the connection portion C1 may be deformed in the direction of gravity or when the first chip 51 is joined by pressure). direction). Therefore, in the electronic device A2, a branched portion is provided in the first base portion 212 (the first terminal portion 21) to secure a wider width of the connection portion C1 than in the electronic device A1. As a result, the strength of the connecting portion C1 can be improved, so deformation of the first lead 11 can be suppressed. That is, in the electronic device A ⁇ b>2 , deformation of the first lead 11 can be suppressed by arranging the branched portion in the first terminal portion 21 .
  • FIG. 12 the electronic device A2 by arranging the branch portions in each of the second terminal portion 22, the fourth terminal portion 24, and the fifth terminal portion 25, the strength of each of the connection points C2, C4, and C5 (see FIG. 12) is increased. improves. Thereby, the electronic device A2 can suppress deformation of each of the second lead 12, the fourth lead 14, and the fifth lead 15.
  • the electronic device A21 differs from the electronic device A2 in the following points.
  • the first terminal portion 21 first lead 11
  • the second terminal portion 22 has a portion branched to the second relay portion 223 instead of the second root portion 222 .
  • the fourth terminal portion 24 (fourth lead 14 ) has a branched portion not at the fourth base portion 242 but at the fourth relay portion 243 .
  • the fifth terminal portion 25 (fifth lead 15 ) has a portion branched to the fifth relay portion 253 instead of the fifth root portion 252 .
  • the electronic device A21 can suppress discharge between the first terminal portion 21 and the second terminal portion 22 while miniaturizing the device in the same manner as the electronic devices A1 and A2. Further, like the electronic devices A1 and A2, the electronic device A21 can relax the stress applied to the first terminal portion 21 and the second terminal portion 22, and improve the mounting reliability of the device.
  • the first terminal portion 21 (first lead 11 ) has a portion branched to the first relay portion 213 .
  • the strength of the connecting portion C1 (see FIG. 12) is further improved as compared with the case where the first root portion 212 has a branched portion (for example, the electronic device A2). Therefore, the electronic device A21 can suppress deformation of the first lead 11 more than the electronic device A2. This is the same for each of the second lead 12, the fourth lead 14 and the fifth lead 15 as well. That is, the electronic device A21 can further suppress deformation of each of the second lead 12, the fourth lead 14, and the fifth lead 15 than the electronic device A2.
  • FIG. 15 shows an electronic device A22 according to the second modification of the second embodiment.
  • the electronic device A22 differs from the electronic device A21 in the following points. That is, the fourth lead 14 and the fifth lead 15 of the electronic device A22 are similar to the fourth lead 14 and the fifth lead 15 of the electronic device A1. That is, as shown in FIG. 15, in the electronic device A22, portions of the first lead 11 branching toward the plurality of first mounting portions 211 are formed in the first relay portion 213, as in the electronic device A21. Moreover, portions of the second lead 12 that branch toward the plurality of second mounting portions 221 are formed in the second relay portion 223 . On the other hand, as shown in FIG.
  • the portions of the fourth lead 14 that branch toward the plurality of fourth mounting portions 241 are the fourth extending portions 34.
  • the portion of the fifth lead 15 that branches toward the plurality of fifth mounting portions 251 is formed in the fifth extending portion 35 .
  • the fourth lead 14 and the fifth lead 15 are connected to the second pad portion 42 respectively.
  • the load applied to each connection point C4, C5 is smaller than the load applied to the connection point C1.
  • the load applied to the fourth extending portion 34, the fifth extending portion 35 and the second pad portion 42 is distributed to the two connection points C4 and C5.
  • the strength of each of the connection points C4 and C5 is low, it may occur during transportation of the lead frame 9, bonding of the second chip 52 to the second pad portion 42, bonding of the connection members 64 and 65, and the like. Sufficient strength may be ensured against the load to be applied.
  • the parts of the fourth lead 14 that branch toward the plurality of fourth mounting parts 241 are provided inside the sealing resin 7 (that is, the fourth extending part 34), and The portion of the fifth lead 15 that branches toward the plurality of fifth mounting portions 251 may be provided inside the sealing resin 7 (that is, the fifth extending portion 35).
  • the electronic device A22 can suppress discharge between the first terminal portion 21 and the second terminal portion 22 while miniaturizing the device in the same manner as the electronic devices A1 and A2. Further, the electronic device A22 can relax the stress applied to the first terminal portion 21 and the second terminal portion 22 in the same manner as the electronic devices A1 and A2, thereby improving the mounting reliability of the device. Further, the electronic device A22 can suppress deformation of the first lead 11 and the second lead 12, like the electronic device A21.
  • FIG. 16 shows an electronic device A23 according to the third modified example of the second embodiment.
  • the electronic device A23 differs from the electronic device A22 in the following points. That is, the second lead 12 of the electronic device A23 is similar to the second lead 12 of the electronic device A1. That is, as shown in FIG. 16, unlike the electronic device A22, in the electronic device A23, the portions of the second lead 12 that branch toward the plurality of second mounting portions 221 are formed in the second extending portions 32. It is
  • the second lead 12 is not connected to the die pad 4.
  • the load applied to the connection point C2 is smaller than the load applied to the connection point C1. Therefore, even if the strength of the connecting portion C2 is low, sufficient strength may be ensured even when the lead frame 9 is transported, when the connecting member 62 is bonded, and the like. In such a case, even if the portions of the second lead 12 that branch toward the plurality of second mounting portions 221 are provided inside the sealing resin 7 (that is, the second extending portion 32), good.
  • the electronic device A23 can suppress discharge between the first terminal portion 21 and the second terminal portion 22 while miniaturizing the device in the same manner as the electronic devices A1 and A2. Further, the electronic device A23 can relax the stress applied to the first terminal portion 21 and the second terminal portion 22 in the same manner as the electronic devices A1 and A2, thereby improving the mounting reliability of the device. Further, the electronic device A23 can suppress deformation of the first lead 11, like the electronic device A21.
  • the branched portion may be provided outside the sealing resin 7 only.
  • the second lead 12 if the distance from the proximal end to the distal end of the second extension portion 32 is long, the load applied to the connection point C2 will be large.
  • the base end of the second extension portion 32 is the end overlapping the outer circumference of the sealing resin 7 in plan view, and the tip of the second extension portion 32 is the direction in which the second extension portion 32 extends. (corresponds to the portion to which the connection member 62 is connected in FIG.
  • the second lead 12 in the state of the lead frame 9 is highly likely to be deformed at the connection point C2.
  • the second lead 12 includes its branched portion outside the sealing resin 7 (that is, the second terminal portion 22).
  • the first lead 11 when the distance from the proximal end of the first extension portion 31 to the end of the first pad portion 41 opposite to the side connected to the first extension portion 31 is short, The load applied to the connection point C1 is reduced.
  • the base end of the first extending portion 31 is the end overlapping the outer periphery of the sealing resin 7 in plan view.
  • the first lead 11 in the state of the lead frame 9 is less likely to be deformed at the connection point C1.
  • the first lead 11 may include the branched portion inside the sealing resin 7 (that is, the first extending portion 31).
  • FIG. 17 shows an electronic device A3 according to the third embodiment.
  • the electronic device A3 differs from the electronic device A1 in that neither the fourth lead 14 nor the fifth lead 15 is provided.
  • the appearance of the electronic device A3 is the same as that of the electronic device A1. However, in the electronic device A ⁇ b>3 , among the plurality of third leads 13 , the third leads 13 located on the most one side and the other side in the second direction x are connected to the second pad section 42 .
  • the electronic device A3 can suppress discharge between the first terminal portion 21 and the second terminal portion 22 while reducing the size of the device. Further, in the electronic device A3, similarly to the electronic device A1, the stress applied to the first terminal portion 21 and the second terminal portion 22 can be relaxed, and the mounting reliability of the device can be improved.
  • FIG 18 and 19 show an electronic device A4 according to the fourth embodiment.
  • the electronic device A4 differs in function of the electronic component 5 from the electronic device A1.
  • the electronic component 5 of the electronic device A4 has a power conversion function instead of a voltage detection function.
  • Each of the first chip 51 and the second chip 52 is a switching element.
  • the circuit diagram of FIG. 19 shows an example in which each of the first chip 51 and the second chip 52 is composed of an IGBT (Insulated Gate Bipolar Transistor). Effect Transistor) or other transistors such as bipolar transistors.
  • IGBT Insulated Gate Bipolar Transistor
  • Effect Transistor Effect Transistor
  • the first chip 51 has three electrodes 511, 512, 513.
  • electrode 511 is the gate
  • electrode 512 is the emitter
  • electrode 513 is the collector.
  • the first chip 51 has, for example, a vertical structure, and two electrodes 511 and 512 are arranged on the upper surface (surface facing upward in the thickness direction z), and on the lower surface (surface facing downward in the thickness direction z).
  • An electrode 513 is arranged.
  • the first chip 51 is bonded to the first pad portion 41 by a conductive bonding material such as solder, and the electrode 513 provided on the bottom surface is connected to the first pad portion 41 via the conductive bonding material. conduct.
  • the second chip 52 has three electrodes 521, 522, 523.
  • electrode 521 is the gate
  • electrode 522 is the emitter
  • electrode 523 is the collector.
  • the second chip 52 has, for example, a vertical structure, and two electrodes 521 and 522 are arranged on the upper surface (the surface facing upward in the thickness direction z), and the lower surface (the surface facing downward in the thickness direction z).
  • An electrode 523 is arranged.
  • the second chip 52 is bonded to the second pad portion 42 by a conductive bonding material such as solder, and the electrode 523 provided on the bottom surface is connected to the second pad portion 42 via the conductive bonding material. conduct.
  • the first chip 51 and the second chip 52 may have a horizontal structure instead of a vertical structure.
  • the electrode 513 is arranged on the top surface of the first chip 51 and the electrode 523 is arranged on the top surface of the second chip 52 . Therefore, the electrode 513 and the first pad portion 41 (or the first extension portion 31 may be used) are electrically connected by a bonding wire or a plate-shaped metal member, and the electrode 523 and the second pad portion 42 (the fourth extension portion) are electrically connected. 34 or the fifth extension 35) are electrically connected by a bonding wire or a plate-like metal member.
  • connection member 61 is joined to the electrode 511 and any third extension 33 of the plurality of third leads 13 to electrically connect them.
  • the third mounting portion 231 of the third lead 13 to which the connection member 61 is joined is a signal input terminal for inputting a drive signal for the first chip 51 .
  • a plurality of connection members 62 are joined to the electrodes 512 and the second pad portions 42 to electrically connect them.
  • the connection member 63 is joined to the electrode 512 and any third extension 33 of the plurality of third leads 13 to electrically connect them.
  • the third mounting portion 231 of the third lead 13 to which the connection member 63 is joined is a detection terminal for detecting current flowing through the first chip 51 .
  • connection member 64 is joined to the electrode 521 and any third extension 33 of the plurality of third leads 13 to electrically connect them.
  • the third mounting portion 231 of the third lead 13 to which the connection member 64 is joined is a signal input terminal for inputting a drive signal for the second chip 52 .
  • a plurality of connection members 65 are joined to the electrode 522 and the second extension 32 of the second lead 12 to electrically connect them.
  • the connection member 66 is joined to the electrode 522 and any third extension 33 of the plurality of third leads 13 to electrically connect them.
  • the third mounting portion 231 of the third lead 13 to which the connection member 66 is joined is a detection terminal for detecting the current flowing through the second chip 52 .
  • a power supply voltage (for example, a DC voltage) is applied to the first terminal portion 21 and the second terminal portion 22 of the electronic device A4. It is converted into a voltage (for example an alternating voltage). This converted voltage is output from the fourth terminal section 24 and the fifth terminal section 25 .
  • the electronic device A4 can suppress discharge between the first terminal portion 21 and the second terminal portion 22 while achieving miniaturization of the device. Further, in the electronic device A4, similarly to the electronic device A1, the stress applied to the first terminal portion 21 and the second terminal portion 22 can be relaxed, and the mounting reliability of the device can be improved.
  • FIG. 20 shows an electronic device A41 according to a modification of the fourth embodiment.
  • the second chip 52 of the electronic device A41 is not a switching element, but a control IC that controls driving of the first chip 51 . Even in such a modified example, the same effects as those of the electronic device A4 can be obtained.
  • the function of the electronic component 5 is not limited to the voltage detection function.
  • the electronic component 5 (first chip 51 and second chip 52) includes a semiconductor element made of a semiconductor material.
  • FIG. 21 shows an electronic device A5 according to the fifth embodiment.
  • the electronic device A5 is different from the electronic device A1 in that the first chip 51 and the second chip 52 are mounted on one pad portion (a pad portion 40 described later). different in
  • the die pad 4 includes one pad section 40.
  • a first chip 51 and a second chip 52 are mounted on the pad section 40 .
  • the pad section 40 (die pad 4 ) is separated from the first lead 11 , the second lead 12 and the plurality of third leads 13 and connected to the fourth lead 14 and the fifth lead 15 .
  • the electronic device A5 can suppress discharge between the first terminal portion 21 and the second terminal portion 22 while reducing the size of the device. Further, in the electronic device A5, similarly to the electronic device A1, the stress applied to the first terminal portion 21 and the second terminal portion 22 can be relaxed, and the mounting reliability of the device can be improved.
  • the configuration of the die pad 4 is not limited to the configuration including the first pad section 41 and the second pad section 42 . That is, in the electronic device of the present disclosure, there is no limitation as to whether the die pad 4 is divided into a plurality of pad portions.
  • FIG. 22 shows an electronic device A6 according to the sixth embodiment.
  • the electronic device A6 differs from the electronic device A5 in that the electronic component 5 is composed of one chip 50.
  • FIG. 22 shows an electronic device A6 according to the sixth embodiment.
  • the electronic device A6 differs from the electronic device A5 in that the electronic component 5 is composed of one chip 50.
  • FIG. 22 shows an electronic device A6 according to the sixth embodiment.
  • the electronic device A6 differs from the electronic device A5 in that the electronic component 5 is composed of one chip 50.
  • the chip 50 includes a first functional section 501 and a second functional section 502, for example.
  • the chip 50 is obtained by integrating a first functional section 501 and a second functional section 502 into one chip.
  • each function of the first functional unit 501 and the second functional unit 502 is not limited at all, for example, the first functional unit 501 generates a signal corresponding to the potential of the first terminal unit 21, like the first chip 51 of the electronic device A1. and a signal corresponding to the potential of the second terminal portion 22, and the second function portion 502 has the function of outputting the first terminal portion 21 and the second terminal portion 22, similarly to the second chip 52 of the electronic device A1.
  • the first functional unit 501 has a switching function like the first chip 51 of the electronic device A3, and the second functional unit 502 has a switching function like the second chip 52 of the electronic device A3.
  • the first functional unit 501 and the second functional unit 502 are electrically connected by internal wiring (not shown) of the chip 50, for example.
  • the electronic device A6 can suppress electric discharge between the first terminal portion 21 and the second terminal portion 22 in the same manner as the electronic device A1. Further, in the electronic device A6, similarly to the electronic device A1, the stress applied to the first terminal portion 21 and the second terminal portion 22 can be relaxed, and the mounting reliability of the device can be improved.
  • the electronic component 5 is not limited to the configuration including the first chip 51 and the second chip 52 . That is, in the electronic device of the present disclosure, there is no limitation as to whether or not the electronic component 5 includes a plurality of chips.
  • FIG. 23 shows an electronic device A7 according to the seventh embodiment. As shown in FIG. 23, the electronic device A7 does not have a branched portion in each of the second lead 12, the fourth lead 14 and the fifth lead 15 as compared with the electronic device A1.
  • the second terminal portion 22 of the second lead 12 includes one second mounting portion 221 , one second root portion 222 and one second relay portion 223 .
  • the second terminal portion 22 has a rectangular shape in plan view.
  • the second dimension W22 (see FIG. 23) of the second mounting portion 221 along the second direction x is twice the second dimension W22 (see FIG. 1) of the electronic device A1 and the distance d2 ( (See FIG. 4).
  • the second dimension W22 of the electronic device A7 may be the same as the second dimension W22 of the electronic device A1.
  • the fourth terminal portion 24 of the fourth lead 14 includes one fourth mounting portion 241 , one fourth root portion 242 and one fourth relay portion 243 .
  • the fourth terminal portion 24 has a rectangular shape in plan view.
  • the fourth dimension W24 (see FIG. 23) along the second direction x of the fourth mounting portion 241 is twice the fourth dimension W24 (see FIG. 1) in the electronic device A1 and the distance d4 ( (See FIG. 3).
  • the fourth dimension W24 of the electronic device A7 may be the same as the fourth dimension W24 of the electronic device A1.
  • the fifth terminal portion 25 of the fifth lead 15 includes one fifth mounting portion 251 , one fifth root portion 252 and one fifth relay portion 253 .
  • the fifth terminal portion 25 has a rectangular shape in plan view. In the illustrated example, the fifth dimension W25 (see FIG.
  • the fifth dimension W25 of the electronic device A7 may be the same as the fifth dimension W25 of the electronic device A1.
  • the electronic device A7 can suppress discharge between the first terminal portion 21 and the second terminal portion 22, like the electronic device A1. Further, in the electronic device A7, similarly to the electronic device A1, the stress applied to the first terminal portion 21 can be relaxed, and the mounting reliability of the device can be improved.
  • the electronic device of the present disclosure has a plurality of first mounting portions in all of the first terminal portion 21, the second terminal portion 22, the fourth terminal portion 24, and the fifth terminal portion 25. 211 , the plurality of second mounting portions 221 , the plurality of fourth mounting portions 241 and the plurality of fifth mounting portions 251 . Of the first terminal portion 21, the second terminal portion 22, the fourth terminal portion 24, and the fifth terminal portion 25, the electronic device of the present disclosure is applied only to those that may be peeled off from the circuit board of an electric vehicle or the like. , a plurality of first mounting portions 211, a plurality of second mounting portions 221, a plurality of fourth mounting portions 241, and a plurality of fifth mounting portions 251, respectively.
  • the electronic device is not limited to the above-described embodiments.
  • the specific configuration of each part of the electronic device of the present disclosure can be modified in various ways.
  • the present disclosure includes embodiments set forth in the following appendices.
  • Appendix 1. electronic components; a sealing resin covering the electronic component; a first terminal projecting from the sealing resin to one side in a first direction perpendicular to the thickness direction of the sealing resin; a second terminal portion protruding from the sealing resin to one side in the first direction; a plurality of third terminal portions each protruding from the sealing resin toward the other side in the first direction; with the first terminal portion and the second terminal portion are adjacent to each other with a first interval in a second direction orthogonal to the thickness direction and the first direction; The plurality of third terminal portions are arranged in the second direction at a second interval, the first interval is greater than the second interval,
  • the electronic device wherein the first terminal portion includes a plurality of first mounting portions each positioned at an end portion opposite to the sealing resin in the first
  • Appendix 2 The electronic device according to appendix 1, wherein the second terminal portion includes a plurality of second mounting portions, each of which is positioned at an end opposite to the sealing resin in the first direction.
  • Appendix 3. The electronic device according to appendix 2, wherein each of the plurality of third terminal portions includes a third mounting portion located at an end portion opposite to the sealing resin in the first direction.
  • Appendix 4. Each of the plurality of first mounting portions has a first dimension along the second direction, each of the plurality of second mounting portions has a second dimension along the second direction, and each of the plurality of second mounting portions has a second dimension along the second direction.
  • the electronic device according to appendix 3 wherein the third mounting portion of each of the three-terminal portions has a third dimension along the second direction, and the first dimension and the second dimension are each equal to or smaller than the third dimension.
  • Device. Appendix 5. The electronic device according to appendix 4, wherein each of the first dimension and the second dimension is 1/10 to 1 times the third dimension.
  • Appendix 6. The first terminal portion includes a plurality of first root portions positioned at an end portion closer to the sealing resin in the first direction, and the plurality of first root portions and the plurality of first mounting portions. including a plurality of first relay units that individually connect the 6.
  • the electronic device according to appendix 4 or appendix 5, wherein the dimension along the second direction of each of the plurality of first root portions is the same as the first dimension.
  • the second terminal portion includes a plurality of second root portions positioned at an end portion closer to the sealing resin in the first direction, and the plurality of second root portions and the plurality of second mounting portions. including a plurality of second relay units that individually connect the 7.
  • the electronic device according to appendix 6, wherein the dimension along the second direction of each of the plurality of second roots is the same as the second dimension.
  • Appendix 8. The electronic device according to any one of appendices 1 to 7, wherein the first distance is 10 times or more and 20 times or less the second distance.
  • the fourth terminal portion includes a plurality of fourth mounting portions each positioned at an end portion opposite to the sealing resin in the first direction;
  • the fifth terminal portion includes a plurality of fifth mounting portions each positioned at an end portion opposite to the sealing resin in the first direction;
  • the first terminal portion includes a first root portion positioned at an end portion closer to the sealing resin in the first direction, and a first terminal portion connecting the first root portion and the plurality of first mounting portions. 1.
  • the electronic device according to Appendix 1 comprising a relay.
  • Appendix 13 The electronic device according to appendix 12, wherein the first relay portion branches from the first root portion toward the plurality of first mounting portions.
  • the first root portion and the plurality of first mounting portions are located at mutually different positions in the thickness direction; 14.
  • the second terminal portion includes a second root portion positioned at an end portion closer to the sealing resin in the first direction, and a second terminal portion connecting the second root portion and the plurality of second mounting portions. 3.
  • Appendix 16. 16 The electronic device according to appendix 15, wherein the second relay portion branches from the second root portion toward the plurality of second mounting portions.
  • Appendix 17. the second root portion and the plurality of second mounting portions are located at mutually different positions in the thickness direction; 17.
  • the electronic device according to appendix 16 wherein the second relay portion is bent in the thickness direction.
  • Each of the plurality of third terminal portions connects a third root portion located at an end portion closer to the sealing resin in the first direction and the third root portion and the third mounting portion. 3.
  • Appendix 20 Further comprising a second pad part separated from the first pad part and covered with the sealing resin, 20.
  • the electronic device according to appendix 19, wherein the electronic component includes a first chip mounted on the first pad section and a second chip mounted on the second pad section.
  • Appendix 21. the first chip is electrically connected to each of the first terminal portion and the second terminal portion; 21.
  • the electronic device according to appendix 20, wherein the second chip is electrically connected to at least one of the plurality of third terminal portions.
  • Appendix 22. a first extension portion extending from the first terminal portion and connected to the first pad portion; a second extending portion extending from the second terminal portion and spaced apart from the first pad portion; further comprising 22.
  • the electronic device according to appendix 21, wherein the first extension and the second extension are covered with the sealing resin.
  • the electronic device according to appendix 22 further comprising a first connection member that is joined to the first chip and the second extension and electrically connects the first chip and the second extension.
  • Appendix 24 further comprising a plurality of third extensions extending from the plurality of third terminal portions, The plurality of third extensions are covered with the sealing resin, 24.
  • the first chip includes a resistive element and outputs a first signal corresponding to the potential of the first terminal and a second signal corresponding to the potential of the second terminal;
  • the second chip includes an operational amplifier, receives the first signal and the second signal, and outputs a third signal according to the potential difference between the first terminal and the second terminal. 25. An electronic device according to any of clauses 24.

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CN202280083050.3A CN118525371A (zh) 2021-12-17 2022-12-05 电子装置
JP2023567700A JPWO2023112735A1 (https=) 2021-12-17 2022-12-05
DE112022005516.2T DE112022005516T5 (de) 2021-12-17 2022-12-05 Elektronische Vorrichtung
US18/742,527 US20240332138A1 (en) 2021-12-17 2024-06-13 Electronic device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025009349A1 (ja) * 2023-07-04 2025-01-09 ローム株式会社 電子装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260582A (ja) * 1993-03-09 1994-09-16 Hitachi Ltd 半導体装置
JPH1012790A (ja) * 1996-06-24 1998-01-16 Mitsubishi Electric Corp 半導体集積回路装置
JP2000269395A (ja) * 1999-03-18 2000-09-29 Toshiba Corp 半導体装置
JP2006203048A (ja) * 2005-01-21 2006-08-03 Matsushita Electric Ind Co Ltd 半導体装置
JP2015070027A (ja) * 2013-09-27 2015-04-13 大日本印刷株式会社 リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
JP2020155532A (ja) * 2019-03-19 2020-09-24 三菱電機株式会社 半導体装置の製造方法および半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260582A (ja) * 1993-03-09 1994-09-16 Hitachi Ltd 半導体装置
JPH1012790A (ja) * 1996-06-24 1998-01-16 Mitsubishi Electric Corp 半導体集積回路装置
JP2000269395A (ja) * 1999-03-18 2000-09-29 Toshiba Corp 半導体装置
JP2006203048A (ja) * 2005-01-21 2006-08-03 Matsushita Electric Ind Co Ltd 半導体装置
JP2015070027A (ja) * 2013-09-27 2015-04-13 大日本印刷株式会社 リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
JP2020155532A (ja) * 2019-03-19 2020-09-24 三菱電機株式会社 半導体装置の製造方法および半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025009349A1 (ja) * 2023-07-04 2025-01-09 ローム株式会社 電子装置

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