WO2023109355A1

WO2023109355A1 - Electronic atomization device, and heating assembly and heating element thereof

Info

Publication number: WO2023109355A1
Application number: PCT/CN2022/130102
Authority: WO
Inventors: 王守平; 石楠; 张立超; 柳志伟; 孙晓波; 张琳
Original assignee: 海南摩尔兄弟科技有限公司
Priority date: 2021-12-16
Filing date: 2022-11-04
Publication date: 2023-06-22
Also published as: CN114190606A

Abstract

An electronic atomization device, and a heating assembly and a heating element (10) thereof. The heating element (10) comprises a heating layer (11) and a heat-conducting isolation layer (12); the heating layer (11) is disposed on the heat-conducting isolation layer (12), and forms an integral structure with the heat-conducting isolation layer (12), so that the heating element (10) is isolated, by means of the heat-conducting isolation layer (12), from a medium to be atomized and/or a gaseous medium formed after atomization, and conducts, by means of the heat-conducting isolation layer (12), heat with the medium to be atomized. According to the heating element (10), the heating layer (11) is isolated, by means of the heat-conducting isolation layer (12), from the medium to be atomized and/or the gaseous medium formed after atomization, and can conduct, by means of the heat-conducting isolation layer (12), heat with the medium to be atomized, such that the heating layer (11) is not in direct contact with the medium to be atomized. Thus, the probability of generating harmful substances can be reduced, the concentration of media to be atomized is avoided, the amount of atomization can be improved and the taste of vapor generated after atomization can be improved, the anti-fatigue service life of the heating layer (11) can also be prolonged, and the number of use times of the atomization device is increased.

Description

Electronic atomization device and its heating component and heating element

technical field

The present invention relates to an atomizing device, more specifically, to an electronic atomizing device, a heating component and a heating body thereof.

Background technique

The heat-generating material in the heat-generating body of the electronic atomization device in the related art is generally in direct contact or semi-isolated state with the medium to be atomized and/or the gaseous medium formed after atomization.

technical problem

The heating element of the electronic atomization device in the related art has disadvantages such as easy to produce burnt smell during the atomization process, concentration of the medium to be atomized, low amount of atomization, poor taste, and short service life of the heating material.

technical solution

The technical problem to be solved by the present invention is to provide an improved heating element, and further provide an improved electronic atomization device and a heating component.

The technical solution adopted by the present invention to solve the technical problem is: to construct a heating body, including a heating layer and a heat-conducting isolation layer; the heating layer is arranged on the heat-conducting isolation layer and integrated with the heat-conducting isolation layer structure, so that the heating element is isolated from the medium to be atomized and/or the gaseous medium formed after atomization through the heat conducting isolation layer, and conducts heat conduction through the heat conducting isolation layer and the medium to be atomized.

In some embodiments, the thermally conductive isolation layer includes a first thermally conductive isolation layer and a second thermally conductive isolation layer;

The heat generating layer is disposed between the first heat conduction isolation layer and the second heat conduction isolation layer.

In some embodiments, the heat generating layer is in the form of a sheet.

In some embodiments, the thermally conductive isolation layer has a sheet structure.

In some embodiments, the heat-conducting isolation layer includes a first heat-conducting surface that is in contact with the heat-generating layer and is disposed opposite to the first heat-conducting surface to be in contact with the medium to be atomized and/or the gaseous medium. Thermally conductive second thermally conductive surface.

In some embodiments, the first heat conduction surface and/or the second heat conduction surface are planes.

In some embodiments, the first heat conduction surface and/or the second heat conduction surface is an arc surface.

In some embodiments, the thermally conductive isolation layer is a dense material with high thermal conductivity, and the thermal conductivity of the thermally conductive isolation layer is greater than 90w/m.k.

In some embodiments, the thermally conductive isolation layer is thermally conductive ceramics.

In some embodiments, the heat-generating layer is a heat-generating film, and the heat-generating film is covered on the heat-conducting isolation layer by film-coating technology.

In some embodiments, a conductive structure is further included, the conductive structure is disposed on the thermally conductive isolation layer and is in conductive contact with the heat generating layer, or the conductive structure is disposed on the heat generating layer.

In some embodiments, the heat generating layer includes at least two straight portions and at least one bent portion; the bent portion connects two adjacent straight portions.

The present invention also constructs a heating component, including a liquid guiding element and the heating element of the present invention;

The heating body is inserted into the liquid guiding element.

In some embodiments, the liquid conducting element is a ceramic porous body with low thermal conductivity, and the thermal conductivity of the liquid conducting element is less than 2w/m.k.

In some embodiments, the liquid-guiding element is provided with a through hole penetrating through both ends;

The heating element is inserted in the through hole, and in the through hole, the wall surface of the liquid guiding element opposite to the heating element forms an atomizing surface.

In some embodiments, the gap between the through hole and the heating element forms a gas channel.

In some embodiments, at least one ventilation groove is formed on the wall of the through hole.

In some embodiments, the atomizing surface includes a first atomizing area that is in contact with the heating element so that the medium to be atomized is heated and atomized directly through the heating element.

In some embodiments, the atomizing surface further includes a second atomizing area that is not in contact with the heating element so that the medium to be atomized is radiatively atomized through the heating element.

The present invention also constructs an electronic atomization device, including the heating element described in the present invention, and a power supply assembly electrically connected to the heating element.

Beneficial effect

The heating element is arranged on the heat-conducting isolation layer and forms an integral structure with the heat-conducting isolation layer, and the heat-generating element is connected with the medium to be atomized and/or the gaseous medium formed after atomization through the heat-conducting isolation layer. isolation, and conduct heat conduction through the heat-conducting isolation layer and the medium to be atomized, so that the heating layer and the medium to be atomized are not in direct contact, thereby reducing the probability of harmful substances being produced, avoiding the concentration of the medium to be atomized, and Increasing the amount of atomization and the mouthfeel of the atomized gas after atomization can also improve the anti-fatigue life of the heating layer and increase the practical times of the atomization device.

Description of drawings

The present invention will be further described below in conjunction with accompanying drawing and embodiment, in the accompanying drawing:

Fig. 1 is a schematic structural view of the heating element of the electronic atomization device in the first embodiment of the present invention;

Fig. 2 is a partial structural diagram of the heating element of the electronic atomization device shown in Fig. 1;

3 is a schematic diagram of the end structure of the heating element of the electronic atomization device in the second embodiment of the present invention;

Fig. 4 is a partial structural diagram of the heating element of the electronic atomization device shown in Fig. 3;

Fig. 5 is a schematic structural diagram of a heating component of an electronic atomization device in a third embodiment of the present invention;

Fig. 6 is a partial structural view of the heating element of the electronic atomization device shown in Fig. 5 .

BEST MODE FOR CARRYING OUT THE INVENTION

In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described in detail with reference to the accompanying drawings.

Figure 1 and Figure 2 show some preferred embodiments of the electronic atomization device of the present invention. The electronic atomization device can be used to heat and atomize the medium to be atomized so as to generate atomized gas for users to inhale. In some embodiments, the electronic atomization device has the advantages of simple structure, high atomization efficiency, good atomization taste, long service life, low manufacturing cost and easy implementation.

As shown in Figure 1 and Figure 2, further, in this embodiment, the electronic atomization device may include an atomizing case, a heating component and a power supply component, the heating component and power supply component may be housed in the atomizing case, the The heating element can be used to heat and atomize the medium to be atomized. The power supply component is mechanically and electrically connected with the heating component, and is used for supplying power to the heating component.

Further, in this embodiment, the heating component may include a liquid guiding element 20 and a heating body 10 . The heating element 10 can be inserted into the liquid guiding element 20, and can be electrically connected with the power supply component, and can be powered by the power supply component. The heating element 10 can be used to heat and atomize the medium to be atomized on the liquid guiding element 20 . The medium to be atomized may be a liquid atomized medium. The liquid guiding element 20 can communicate with the liquid storage cavity in the atomization shell, and is used for absorbing the medium to be atomized in the liquid storage cavity.

Further, in this embodiment, the heating element 10 may be in the shape of a sheet or flat as a whole, specifically, in some embodiments, the heating element 10 may be in the shape of a flat cuboid. In this embodiment, the cross-sectional area of the entire heating element 10 is preferably 20% that does not affect the draw resistance. In some embodiments, the heating element 10 may include a heating layer 11 and a heat conducting isolation layer 12 . The heat-generating layer 11 can be disposed on the heat-conducting isolation layer 12 and can form an integral structure with the heat-conducting isolation layer 12 . The heat-generating layer 11 can be used to generate heat and transfer the heat directly to the heat-conducting isolation layer 12 . It should be noted that the heating layer 11 can only be in contact with the heat conducting isolation layer 12 . The heat-conducting isolation layer 12 can be used to isolate the heat-generating layer 11 from the medium to be atomized and/or the gaseous medium formed after atomization, and can transfer the heat conducted by the heat-generating layer 11 to the mist to be sprayed on the liquid-conducting element 20 The atomized medium can conduct heat conduction to the atomized medium.

Further, in this embodiment, the heat generating layer 11 can be a heat generating film, which can be a sheet structure. The heat generating layer 11 can be covered on the heat conducting isolation layer 12 by coating technology, and has an integral structure with the heat conducting isolation layer 12 . Specifically, in some embodiments, the heat-generating film can be made by silk-screen printing technology or other forms of technology, and the heating efficiency and heat conduction efficiency can be improved by using the heat-generating film. In some embodiments, the shape and size of the heating film can be freely designed into various shapes according to the expected design power and atomization performance requirements.

Further, in this embodiment, the heat generating layer 11 may include four straight portions 111 and three bent portions 112, the four straight portions 111 may be arranged side by side, and the two straight portions 111 adjacently arranged It can be connected by a bent part 112 . In some embodiments, the straight portion 111 and the bent portion 112 can be integrally formed. Understandably, in some other embodiments. There are two straight portions 111 , and there may be one bent portion 112 , of course, there may be more than two straight portions 111 . The bending portion 112 can also be more than one.

Further, in this embodiment, the heating element 10 may have a three-layer structure. The heat conduction isolation layer 12 may be two layers, specifically, the heat conduction isolation layer 12 includes a first heat conduction isolation layer 121 and a second heat conduction isolation layer 122 . The heat conduction isolation layer 12 can be a sheet structure, and both the first heat conduction isolation layer 121 and the second heat conduction isolation layer 122 can be in the shape of a flat cuboid. The material, shape and size of the first heat conduction isolation layer 121 and the second heat conduction isolation layer 122 are the same, and the first heat conduction isolation layer 121 and the second heat conduction isolation layer 122 can be stacked. In this embodiment, the heat generating layer 11 can be disposed between the first heat conducting isolation layer 121 and the second heat conducting isolation layer 122 . By arranging the first heat-conducting isolation layer 121 and the second heat-conducting isolation layer 122, the disadvantages caused by direct contact between the heating layer 11 and the medium to be atomized can be avoided, the fatigue life of the heating film can be improved, and the risk of falling off of the heating film can be reduced. , to ensure the consistency of the taste, the fineness of the atomized gas and the reduction of the aroma, and to increase the practical frequency of the electronic atomization device. If the heating layer 11 is in direct contact with the atomized medium and/or the gaseous medium formed after atomization, it will inevitably bring a series of problems, such as the aging of the heating layer 11 and the non-uniformity of resistance, which will directly bring overheated aldehyde In addition, due to the non-uniformity of the atomization field, the regional atomization temperature is relatively high, and there is a disadvantage that burnt smell is easily generated during the atomization process. The medium and/or the gaseous medium formed after atomization are not in direct contact, so that the above problems can be well avoided or reduced.

Further, in this embodiment, the heat conduction isolation layer 12 may include a first heat conduction surface 12a and a second heat conduction surface 12b, then the first heat conduction isolation layer 121 and the second heat conduction isolation layer 122 both comprise the first heat conduction surface 12a and the second heat conducting surface 12b. The first heat-conducting surface 12 a can be disposed on the heat-generating layer 11 , be in direct contact with the heat-generating layer 11 , and be used for heat conduction with the heat-generating layer 11 . The second heat-conducting surface 12b is opposite to the first heat-conducting surface 12a, and can be arranged opposite to the liquid-conducting element 20, and is used for conducting heat in contact with the medium to be atomized, thereby heating the medium to be atomized. In this embodiment, both the first heat conduction surface 12a and the second heat conduction surface 12b may be planes. Of course, it can be understood that in some other embodiments, the first heat conduction surface 12a or the second heat conduction surface 12b are not limited to being plane, and the first heat conduction surface 12a and/or the second heat conduction surface 12b can also be curved surface. In some embodiments, the entire heating element 10 may also be arc-shaped.

In this embodiment, the thermally conductive isolation layer 12 may be a dense material with high thermal conductivity. Specifically, in some embodiments, the thermally conductive isolation layer 12 may be optionally made of a thermally conductive ceramic material. The thermal conductivity of the thermal insulation layer 12 is greater than 90w/m.k, it can be heated immediately and has the characteristics of high heat transfer efficiency, and its heat transfer loss can be reduced within 5%. In addition, the heat-conducting ceramic material used not only plays the role of oil separation, but also has unique infrared radiation characteristics. The atomized gas after atomization has the advantages of fineness, purity, safety and health. In addition, its thermal efficiency loss and conduction are almost unaffected; Its uniform thermal radiation electromagnetic wavelength is about 5-20 microns, which is in the mid-infrared electromagnetic wavelength range, and is the characteristic absorption line of most organic substances, which will bring great benefits to the uniform atomization and taste of the atomized medium. big benefit.

Further, in this embodiment, the heating element 10 may further include a conductive structure 13, and the conductive structure 13 may be used to electrically connect the heating layer 11 with the electrodes of the power supply component. In this embodiment, the conductive structure 13 can be disposed on the heat-conducting isolation layer 12 and electrically connected to the heat-generating layer 11 . Of course, it can be understood that in some other embodiments, the conductive structure 13 is not limited to be disposed on the heat conducting isolation layer 12 , and it can also be disposed on the heat generating layer 11 . In some embodiments, the conductive structure 13 may include a first conductive structure 131 and a second conductive structure 132, the first conductive structure 131 and the second conductive structure 132 may be arranged at intervals, and may be located at the heat generating layer 11 respectively. Ends of the straight portions 111 on both sides are connected. In some embodiments, the first conductive structure 131 and the second conductive structure 132 can be disposed close to one end of the heat-conducting isolation layer 12. Of course, it can be understood that in some other embodiments, the first conductive structure 131 and the The second conductive structure 132 can also be distributed on both ends of the thermally conductive isolation layer 12 . In some embodiments, the conductive structure 13 can be a conductive sheet, which can be pasted on the thermally conductive isolation layer 12 or inserted into the thermally conductive isolation layer 12 . In some embodiments, the conductive structure 13 is not limited to being a conductive sheet. In some other embodiments, the conductive structure 13 can also be a conductive film, which can be covered on the first layer of the thermally conductive isolation layer 12 by film coating technology. on the heat conducting surface 12a. In some other embodiments, the conductive structure 13 may also be a lead.

Further, in this embodiment, the liquid guiding element 20 can be made of low thermal conductivity ceramics. Specifically, the liquid guiding element 20 may be a ceramic porous body with low thermal conductivity, and its thermal conductivity may be less than 2w/m.k.

Further, in this embodiment, the liquid guiding element 20 may be cylindrical, and may be a hollow structure with both ends penetrating. It can be understood that, in some other embodiments, the liquid guiding element 20 is not limited to a cylindrical shape, and may also be a square column shape or other shapes. The heating element 10 can be inserted into the liquid-conducting element 20 , which not only solves the problem of uniform heating around the circle, but also causes almost no loss of heat due to internal control, thereby greatly improving the thermal efficiency of the heating element 10 .

Further, in this embodiment, a through hole 21 may be provided on the liquid guiding element 20 , and the through hole 21 may be provided through both ends along the axial direction of the liquid guiding element 20 . In this embodiment, the through hole 21 may be in the shape of a cuboid, and its cross section may be a square. The heating element 10 can be inserted in the through hole 21 along the diagonal of the cross section of the through hole 21, and the width of the heating element 10 can be equivalent to the length of the diagonal of the cross section of the through hole 21, so that The two opposite sides of the heating element 10 can be in contact with the liquid guiding element 20, and a gap can be left on the wide surface of the heating element 10, that is, in the through hole 21, the two opposite sides of the heating element 10 can be Openwork setting. In some embodiments, the gap between the through hole 21 and the heating element 10 can form an airflow channel, specifically, the airflow channel can include a first airflow channel 21a and a second airflow channel 21b disposed opposite to each other. The air flow channel can be an atomizing air channel, and the heating film can generate heat after being connected to a power supply through the conductive structure 13, and the heat can radiate and heat the medium to be atomized on the atomizing liquid guiding element 20 through the heat conducting isolation layer 12, The medium to be atomized can be heated in the atomizing air channel to form smoke, and can be sucked into the user's mouth through the air channel. By setting the heating element 10 in the airflow channel, and isolating the heating layer 11 from the medium to be atomized and/or the gaseous medium formed after atomization through the heat conducting isolation layer 13, the fatigue resistance of the heating material can be improved And it can avoid problems such as local concentration of the medium to be atomized, low smoke volume and poor taste consistency.

Further, in this embodiment, in the through hole 21 , the wall surface of the liquid guiding element 20 opposite to the heating element 10 can form an atomizing surface 22 . When the electronic atomization device is atomized, the medium to be atomized can go from the liquid storage chamber to the outside of the liquid guide element 20 and penetrate into the liquid guide element 20 until the atomization surface 22. The structure of the liquid guide element 20 It can effectively ensure the balance between directional liquid inlet and atomization. The atomizing surface 22 can be divided into a first atomizing area 221 and a second atomizing area 222 by leaving a gap between the heating element 10 and the liquid guiding element 20 . The first atomization area 221 can be in direct contact with the heating element 10 , the first atomization area 221 can be located at both ends of the heating element 10 in the width direction, and can form a high temperature atomization area. In the first atomization area 221 , the heating element 10 can directly heat and atomize the liquid guiding element 20 . The second atomization area 222 can be located on a wall surface of the liquid guiding element 20 opposite to the wide surface of the heating element 10 . The second atomization area 222 has no direct contact with the heating element 10 and forms a low-temperature atomization area. In the second atomization area 222 , the heating element 10 can atomize the medium to be atomized on the liquid guiding element 20 through spatial radiation heat transfer. By dividing the atomizing surface 22 into a first atomizing area 221 and a second atomizing area 222, the heating element can have an atomizing environment with a three-dimensional spatial temperature gradient, and the unique three-dimensional temperature atomizing environment will affect the The taste has been greatly improved.

The electronic atomization device of this embodiment not only solves the problem of direct contact between the atomized medium and the heating layer 11, but also makes the heating material safe, long-lived, and not easy to be polluted. At the same time, the structure is simple, the parts are convenient to manufacture, and easy to assemble. , which is convenient for automatic production and practical application.

3 and 4 show the second embodiment of the electronic atomization device of the present invention. The difference from the first embodiment is that the through hole 21 can be in the shape of a flat cuboid, and its cross-sectional shape and size can be adapted to the cross-sectional shape and size of the heating element 10 . In this embodiment, a plurality of ventilation grooves 23 can be provided on the hole wall of the through hole 21, specifically, three ventilation grooves 23 can be arranged on the two sides of the liquid guiding element 20 opposite to the wide surface of the heating element 10. , the ventilation groove 23 can be used to form an airflow channel. In this embodiment, the second atomization area 222 may be formed on a groove wall of the ventilation groove 23 opposite to the heating element 10 . In some other embodiments, the ventilation groove 23 is not limited to be opened on the hole wall of the through hole 21 , it can be opened on the heat conducting isolation layer 12 of the heating element 10 .

5 and 6 show the third embodiment of the electronic atomization device of the present invention, which is different from the first embodiment in that the heating layer 11 may only include two straight parts 111 and one bent part 112 . The first conductive structure 131 and the second conductive structure 132 can be respectively disposed on ends of the two straight portions 111 . An insertion hole 14 is defined on the thermally conductive isolation layer 12 , and the insertion hole 14 may include a first insertion hole 141 and a second insertion hole 142 corresponding to the first conductive structure 131 and the second conductive structure 132 respectively. Through the first insertion hole 141 and the second insertion hole 142 , the conductive column of the power supply component can be inserted and electrically connected to the first conductive structure 131 and the second conductive structure 132 . In this embodiment, the through hole 21 may also be cylindrical, not limited to a rectangular parallelepiped.

It can be understood that the above examples only express the preferred implementation of the present invention, and its description is relatively specific and detailed, but it should not be interpreted as limiting the patent scope of the present invention; it should be pointed out that for those of ordinary skill in the art In other words, on the premise of not departing from the concept of the present invention, the above-mentioned technical features can be freely combined, and some modifications and improvements can also be made, all of which belong to the protection scope of the present invention; All equivalent transformations and modifications should fall within the scope of the claims of the present invention.

Claims

A heating element, characterized by comprising a heating layer (11) and a thermally conductive isolation layer (12); the heating layer (11) is arranged on the thermally conductive isolation layer (12), and is connected to the thermally conductive isolation layer (12) Forming an integrated structure to isolate the heating element from the medium to be atomized and/or the gaseous medium formed after atomization through the thermally conductive isolation layer (12), and through the thermally conductive isolation layer (12) to The medium to be atomized conducts heat conduction.
The heating element according to claim 1, characterized in that, the heat conduction isolation layer (12) comprises a first heat conduction isolation layer (121) and a second heat conduction isolation layer (122);

The heat generating layer (11) is arranged between the first heat conduction isolation layer (121) and the second heat conduction isolation layer (122).
The heating element according to claim 1, characterized in that, the heating layer (11) is in the shape of a sheet.
The heating element according to claim 1, characterized in that, the heat conducting isolation layer (12) has a sheet structure.
The heating element according to claim 1, characterized in that, the heat-conducting isolation layer (12) includes a first heat-conducting surface (12a) that is in contact with the heat-generating layer (11) and conducts heat, and is in contact with the first heat-conducting surface (12a) A second heat conducting surface (12b) for contacting and conducting heat with the medium to be atomized and/or the gaseous medium is provided opposite to it.
The heating element according to claim 5, characterized in that, the first heat conduction surface (12a) and/or the second heat conduction surface (12b) is a plane.
The heating element according to claim 5, characterized in that, the first heat conduction surface (12a) and/or the second heat conduction surface (12b) is an arc surface.
The heating element according to claim 1, characterized in that the thermally conductive insulating layer (12) is a dense material with high thermal conductivity, and the thermal conductivity of the thermally conductive insulating layer (12) is greater than 90w/m.k.
The heating element according to claim 8, characterized in that, the heat-conducting isolation layer (12) is heat-conducting ceramics.
The heating element according to claim 1, characterized in that, the heating layer (11) is a heating film, and the heating film is covered on the heat-conducting isolation layer (12) by a film coating technique.
The heating element according to claim 1, characterized in that it further comprises a conductive structure (13), the conductive structure (13) is arranged on the heat-conducting isolation layer (12) and conducts electricity with the heat-generating layer (11) contact, or the conductive structure (13) is disposed on the heat generating layer (11).
The heating element according to claim 1, characterized in that, the heating layer (11) includes at least two straight parts (111) and at least one bent part (112); the bent part (112) is connected to Two straight parts (111) arranged adjacently.
A heating component, characterized by comprising a liquid guiding element (20) and the heating element (10) according to any one of claims 1 to 12;

The heating element (10) is inserted into the liquid guiding element (20).
The heating component according to claim 13, characterized in that the liquid conducting element (20) is a ceramic porous body with low thermal conductivity, and the thermal conductivity of the liquid conducting element (20) is less than 2w/m.k.
The heating component according to claim 13, characterized in that, the liquid guiding element (20) is provided with a through hole (21) passing through both ends;

The heating element (10) is inserted in the through hole (21), and in the through hole (21), the wall surface of the liquid guiding element (20) opposite to the heating element (10) forms fog Surface (22).
The heating component according to claim 15, characterized in that, the gap left between the through hole (21) and the heating body (10) forms a gas channel.
The heating component according to claim 15, characterized in that at least one ventilation groove (23) is opened on the hole wall of the through hole (21).
The heating component according to claim 15, characterized in that, the atomizing surface (22) includes a heating element in contact with the heating element (10) so that the medium to be atomized directly passes through the heating element (10) to heat the mist The first atomization zone (221) of the atomization.
The heating component according to claim 18, characterized in that, the atomizing surface (22) also includes a non-contact with the heating element (10) so that the medium to be atomized radiates through the heating element (10). A second atomization zone (222) for atomization.
An electronic atomization device, characterized by comprising the heating element (10) according to any one of claims 1 to 13, and a power supply assembly electrically connected to the heating element (10).