WO2022179642A2

WO2022179642A2 - Heating assembly, atomizer and electronic atomization device

Info

Publication number: WO2022179642A2
Application number: PCT/CN2022/092861
Authority: WO
Inventors: 赵月阳; 吕铭; 张彪
Original assignee: 深圳麦克韦尔科技有限公司
Priority date: 2022-05-13
Filing date: 2022-05-13
Publication date: 2022-09-01
Also published as: WO2022179642A3

Abstract

Disclosed are a heating assembly, an atomizer and an electronic atomization device. The heating assembly comprises a first base body and a second base body, wherein the first base body has a first surface and a second surface arranged opposite each other, the first surface being a liquid suction surface; the first base body is provided with a plurality of first liquid guide holes for guiding an aerosol generating matrix from the first surface to the second surface; the second base body has a third surface and a fourth surface arranged opposite each other, the fourth surface being an atomization surface; the second base body is provided with a plurality of second liquid guide holes for guiding the aerosol generating matrix from the third surface to the fourth surface; the second surface and the third surface face each other and have a clearance formed therebetween, and the first liquid guide holes are in fluid communication with the second liquid guide holes by means of the clearance; and the first base body is further provided with at least one liquid discharge hole that penetrates the first surface and the second surface, with the diameter of the liquid discharge hole being greater than that of the first liquid guide holes. Sufficient liquid supply in a local region is ensured by means of providing the liquid discharge hole.

Description

Heating components, atomizers and electronic atomization devices

technical field

The present application relates to the technical field of atomization, and in particular, to a heating component, an atomizer and an electronic atomization device.

Background technique

The electronic atomization device is composed of a heating element, a battery and a control circuit. The heating element is the core component of the electronic atomization device, and its characteristics determine the atomization effect and use experience of the electronic atomization device.

One of the existing heating elements is a cotton core heating element. The cotton core heating element is mostly a structure in which a spring-shaped metal heating wire is wound around a cotton rope or a fiber rope. The liquid aerosol generation matrix to be atomized is absorbed by both ends of the cotton rope or fiber rope, and then transferred to the central metal heating wire for heating and atomization. Due to the limited end area of the cotton rope or fiber rope, the adsorption and transmission efficiency of the aerosol-generating matrix is low. In addition, cotton rope or fiber rope has poor structural stability, and is prone to dry burning, carbon deposition and burnt smell after multiple thermal cycles.

Another existing heating element is a ceramic heating element. Most of the ceramic heating elements form a metal heating film on the surface of the porous ceramic body; the porous ceramic body plays the role of conducting liquid and storing liquid, and the metal heating film realizes the heating and atomization of the liquid aerosol-generating matrix. However, it is difficult to precisely control the location distribution and dimensional accuracy of micropores for porous ceramics prepared by high temperature sintering. In order to reduce the risk of liquid leakage, it is necessary to reduce the pore size and porosity, but in order to achieve sufficient liquid supply, it is necessary to increase the pore size and porosity, which are contradictory to each other. At present, under the conditions of pore size and porosity that meet the low risk of liquid leakage, the liquid conductivity of the porous ceramic matrix is limited, and a burnt smell will appear under high power conditions.

With the advancement of technology, users have higher and higher requirements for the atomization effect of electronic atomization devices. In order to meet the needs of users, a thin heating body is provided to improve the liquid supply capacity, but this thin heating body appears Insufficient liquid supply in some areas, causing fouling.

SUMMARY OF THE INVENTION

The heating assembly, atomizer and electronic atomization device provided by the present application solve the technical problem of insufficient liquid supply in some areas of the thin heating body in the prior art.

In order to solve the above-mentioned technical problems, the first technical solution provided by the present application is to provide a heating component, which is applied to an electronic atomization device and is used for atomizing aerosol to generate a matrix, including a first matrix and a second matrix; the The first base body has a first surface and a second surface that are oppositely arranged, and the first surface is a liquid absorbing surface; the first base body has a plurality of first liquid guide holes, and the first liquid guide holes are used for the air The sol-generating substrate is guided from the first surface to the second surface; the second substrate has a third surface and a fourth surface arranged oppositely, and the fourth surface is an atomizing surface; the second substrate having a plurality of second liquid-guiding holes for guiding the aerosol-generating substrate from the third surface to the fourth surface;

Wherein, the second surface is opposite to the third surface and forms a gap, and the first liquid guide hole and the second liquid guide hole are in fluid communication through the gap; the first substrate also has at least one through-hole In the lower liquid holes of the first surface and the second surface, the diameter of the lower liquid holes is larger than that of the first liquid conducting hole.

In one embodiment, also comprise a heating element, and the heating element is used for atomizing the aerosol to generate the matrix; the heating element is arranged on the fourth surface or is embedded in the second matrix, or the At least part of the second base body is electrically conductive to serve as the heating element.

In one embodiment, the projection of the lower liquid hole on the third surface and the projection of the heating element on the third surface are arranged in a staggered manner.

In one embodiment, the projection of the third liquid-guiding hole on the third surface partially overlaps the projection of the heating element on the third surface.

In one embodiment, the heating element includes a plurality of mutually parallel extending portions and a connecting portion connecting two adjacent extending portions;

The heating component also includes a positive electrode and a negative electrode, and the two ends of the heating element are respectively electrically connected to the positive electrode and the negative electrode; the extension part approaches the negative electrode along the positive electrode. direction extension;

The projection of the lower liquid hole on the plane where the heating element is located is located between two adjacent extension parts.

In one embodiment, the shape of the lower liquid hole is an elongated shape and is parallel to the extending portion.

In one embodiment, the diameter of the first liquid-conducting hole is 1 μm-100 μm; the diameter of the lower liquid-conducting hole is greater than or equal to twice the diameter of the first liquid-conducting hole.

In one embodiment, the shape of the lower liquid hole is a long strip, and the width of the lower liquid hole is greater than or equal to twice the diameter of the first liquid conducting hole.

In one embodiment, the shape of the lower liquid hole includes two parallel side edges and a curved edge connecting the two side edges, and the curved edge is convex in a direction away from the inner space of the lower liquid hole. ; The width of the lower liquid hole refers to the distance between the two sides.

In one embodiment, the capillary force of the second liquid guide hole is greater than the capillary force of the first liquid guide hole.

In one embodiment, the second substrate is a dense substrate, and the second liquid-conducting hole is a through hole penetrating the third surface and the fourth surface.

In one embodiment, the first substrate is a dense substrate, and the first liquid-conducting hole is a through hole penetrating through the first surface and the second surface.

In one embodiment, the material of the first matrix is quartz, glass or dense ceramic; the material of the second matrix is quartz, glass or dense ceramic.

In one embodiment, the heating component further includes a spacer; the spacer is disposed between the second surface and the third surface, and is located on the first base body and/or the second base body edge, so that the first base body and the second base body form the gap.

In one embodiment, the first base body and the second base body are arranged in parallel; or, an angle is formed between the first base body and the second base body.

In one embodiment, the spacer is an independently arranged spacer;

Or, the spacer is a support column or a support frame fixed on the second surface and/or the third surface;

Or, the spacer is a protrusion integrally formed with the first base body and/or the second base body.

In order to solve the above technical problems, the second technical solution provided by the present application is to provide an atomizer, which includes a liquid storage chamber and a heating element; the liquid storage chamber is used to store a liquid aerosol generation substrate; the heating element is the heating element described in any one of the above; the heating element is in fluid communication with the liquid storage chamber.

In one embodiment, the heating element is the heating element described in any one of the above-mentioned heating elements, and the lower liquid hole and the second substrate can dislocate the region where the aerosol-generating substrate generates aerosol.

In order to solve the above technical problems, the third technical solution provided by the present application is to provide an electronic atomization device, including an atomizer and a host, the atomizer is the atomizer described in any of the above, and the The host is electrically connected with the heating component.

Beneficial effects of the present application: Different from the prior art, the present application discloses a heating component, an atomizer and an electronic atomization device. The heating component includes a first base body and a second base body; a surface and a second surface, the first surface is a liquid-absorbing surface; the first substrate has a plurality of first liquid-guiding holes, and the first liquid-guiding holes are used to guide the aerosol-generating substrate from the first surface to the second surface; the third The two substrates have a third surface and a fourth surface arranged oppositely, and the fourth surface is an atomizing surface; the second substrate has a plurality of second liquid-conducting holes, and the second liquid-conducting holes are used for transferring the aerosol-generating substrate from the third surface Guided to the fourth surface; wherein, the second surface is opposite to the third surface and forms a gap, and the first liquid guide hole and the second liquid guide hole are in fluid communication through the gap; The lower liquid hole on the two surfaces, the diameter of the lower liquid hole is larger than that of the first liquid conducting hole, and the lower liquid hole is arranged to ensure sufficient liquid supply in the local area.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

1 is a schematic structural diagram of an electronic atomization device provided by an embodiment of the present application;

Fig. 2 is the structural representation of the atomizer of the electronic atomization device that Fig. 1 provides;

3 is a schematic structural diagram of an embodiment of a heating assembly of the atomizer provided in FIG. 2;

FIG. 4 is a schematic structural diagram of the heating assembly provided in FIG. 3 viewed from one side of the atomizing surface;

FIG. 5 is a schematic structural diagram of the heating assembly provided in FIG. 3 viewed from the liquid-absorbing surface side;

6 is a schematic cross-sectional structure diagram of the heating assembly provided in FIG. 3 along a first direction;

7 is a schematic structural diagram of another embodiment of the heating element of the heating assembly provided in FIG. 3;

8 is a schematic structural diagram of another embodiment of the heating element of the heating assembly provided in FIG. 3;

9 is a positional relationship diagram of an embodiment of the lower liquid hole of the heating assembly provided in FIG. 3 and the heating element;

10 is a positional relationship diagram of the lower liquid hole of the heating assembly provided in FIG. 3 and another embodiment of the heating element;

11 is a schematic structural diagram of another embodiment of the heating assembly of the atomizer provided in FIG. 2;

FIG. 12 is a schematic structural diagram of another arrangement of the spacer 125 in the heating assembly provided in FIG. 11 .

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

In the following description, for purposes of illustration and not limitation, specific details such as specific system structures, interfaces, techniques, etc. are set forth in order to provide a thorough understanding of the present application.

The terms "first", "second" and "third" in this application are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second", "third" may expressly or implicitly include at least one of said features. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined. All directional indications (such as up, down, left, right, front, rear...) in the embodiments of the present application are only used to explain the relative positional relationship between components under a certain posture (as shown in the accompanying drawings). , motion situation, etc., if the specific posture changes, the directional indication also changes accordingly. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally also includes Other steps or components inherent to these processes, methods, products or devices.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of the phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are they separate or alternative embodiments that are mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

The present application will be described in detail below with reference to the accompanying drawings and embodiments.

Please refer to FIG. 1 , which is a schematic structural diagram of an electronic atomization device provided by an embodiment of the present application.

In this embodiment, an electronic atomization device 100 is provided. The electronic atomization device 100 can be used for atomization of aerosol-generating substrates. The electronic atomizer device 100 includes an atomizer 1 and a host 2 that are electrically connected to each other.

Wherein, the atomizer 1 is used for storing the aerosol-generating substrate and atomizing the aerosol-generating substrate to form an aerosol that can be inhaled by a user. The atomizer 1 can be used in different fields, for example, medical treatment, beauty, leisure smoking and so on. In a specific embodiment, the atomizer 1 can be used in an electronic aerosolization device for atomizing aerosol-generating substrates and generating aerosols for smokers to inhale. example.

The specific structure and function of the atomizer 1 can be referred to the specific structure and function of the atomizer 1 involved in the following embodiments, and the same or similar technical effects can be achieved, which will not be repeated here.

The host 2 includes a battery (not shown) and a controller (not shown). The battery is used to provide electrical energy for the operation of the atomizer 1 , so that the atomizer 1 can atomize the aerosol-generating substrate to form an aerosol; the controller is used to control the operation of the atomizer 1 . The host 2 also includes other components such as a battery holder, an airflow sensor, and the like.

The atomizer 1 and the host 2 may be integrally provided or detachably connected, and may be designed according to specific needs.

Please refer to FIG. 2 , which is a schematic structural diagram of the atomizer of the electronic atomization device provided in FIG. 1 .

The atomizer 1 includes a housing 10 , a heating component 11 , and an atomizing seat 12 . The atomization seat 12 has an installation cavity (not shown in the figure), and the heating element 11 is arranged in the installation cavity; the heating element 11 and the atomization seat 12 are arranged in the casing 10 together. The housing 10 is formed with a mist outlet channel 13 , the inner surface of the housing 10 , the outer surface of the mist outlet channel 13 cooperate with the top surface of the atomization seat 12 to form a liquid storage chamber 14 , and the liquid storage chamber 14 is used to store the liquid aerosol generated. matrix. Wherein, the heating element 11 is electrically connected with the host 2 to generate aerosol by atomizing the aerosol generating matrix.

The atomizing seat 12 includes an upper seat 121 and a lower seat 122, the upper seat 121 cooperates with the lower seat 122 to form an installation cavity; the atomization surface of the heating component 11 cooperates with the cavity wall of the installation cavity to form an atomization cavity 120. The upper seat 121 is provided with a lower liquid channel 1211 ; the lower liquid channel 1211 of the aerosol generating matrix channel in the liquid storage chamber 14 flows into the heating element 11 , that is, the heating element 11 is in fluid communication with the liquid storage chamber 14 . The lower seat 122 is provided with an air inlet channel 15 , the outside air enters the atomizing chamber 120 through the air inlet channel 15 , and the aerosol atomized by the heating component 11 flows to the mist outlet channel 13 , and the user inhales through the port of the mist outlet channel 13 . Aerosol.

Please refer to FIGS. 3 to 6 , FIG. 3 is a schematic structural diagram of an embodiment of the heating element of the atomizer provided in FIG. 2 , FIG. 4 is a schematic structural diagram of the heating element provided in FIG. 3 viewed from the side of the atomizing surface, and FIG. 5 FIG. 3 is a schematic structural diagram of the heating element provided in FIG. 3 viewed from the liquid absorbing surface side, and FIG. 6 is a schematic cross-sectional structure diagram of the heating element provided in FIG. 3 along the first direction.

The heating element 11 includes a first base body 111 and a second base body 112 .

The first base 111 includes a first surface 1111 and a second surface 1112 which are arranged opposite to each other, and the first surface 1111 is a liquid absorbing surface; the first base 111 has a plurality of first liquid guide holes 1113, and the first liquid guide holes 1113 The aerosol-generating substrate is guided from the first surface 1111 to the second surface 1112 , ie, the first liquid guide holes 1113 are used to guide the aerosol-generating substrate from the suction surface to the second surface 1112 .

The second base 112 includes a third surface 1121 and a fourth surface 1122 that are oppositely disposed, and the fourth surface 1122 is an atomized surface. The second base 112 has a plurality of second liquid-guiding holes 1123 for guiding the aerosol-generating substrate from the third surface 1121 to the fourth surface 1122 , that is, the second liquid-guiding holes 1123 are used for The aerosol-generating substrate is directed from the third surface 1121 to the atomizing surface.

The second surface 1112 of the first base body 111 is opposite to the third surface 1121 of the second base body 112 and forms a gap 113 (as shown in FIG. 6 ). . It can be understood that the aerosol-generating substrate in the liquid storage chamber 14 flows to the first surface 1111 of the first substrate 111 through the lower liquid channel 1211 , and is guided to the first surface 1111 of the first substrate 111 by the capillary force of the first liquid guide hole 1113 . The two surfaces 1112 enter the gap 113, and are guided from the third surface 1121 of the second substrate 112 to the fourth surface 1122 through the capillary force of the second liquid guide hole 1123; / or flow from the suction surface to the atomization surface under the action of capillary force. The aerosol generating substrate is heated and atomized on the atomizing surface of the heating element 11 to generate an aerosol. The capillary force of the second liquid guide hole 1123 is greater than the capillary force of the first liquid guide hole 1113, so that the aerosol generating substrate can flow from the gap 113 to the atomizing surface.

In this embodiment, the first base body 111 is provided with at least one lower liquid hole 1114, the lower liquid hole 1114 is a through hole passing through the first surface 1111 and the second surface 1112, and the diameter of the lower liquid hole 1114 is larger than that of the first liquid conducting hole The diameter of the hole 1113. It can be understood that, since the aerosol-generating substrate is atomized to generate aerosols on the atomizing surface of the second substrate 112 , the second substrate 112 may have a local area where the liquid supply is insufficient, and a liquid hole is set in this area corresponding to the first substrate 111 1114, and the diameter of the lower liquid hole 1114 is larger than that of the first liquid guide hole 1113, which improves the liquid supply speed, thereby solving the problem of insufficient liquid supply in the second base 112; The heating element 11 has a limit wet burning power. It should be noted that the lower liquid hole 1114 has no capillary force, or its capillary force is very small, which can be ignored relative to the first liquid guide hole 1113 .

In addition, by disposing the first base body 111 on the side of the second base body 112 close to the liquid storage chamber 14 , a gap 113 is formed between the second surface 1112 of the first base body 111 and the third surface 1121 of the second base body 112 , and the gap 113 passes through the gap 113 . It can be excluded that the air intake of the second liquid guide hole 1123 during the atomization process forms large air bubbles on the third surface 1121 of the second substrate 112, so as to prevent the air bubbles from hindering the liquid supply, thereby avoiding dry burning. By disposing the lower liquid hole 1114 on the first base body 111, the air bubbles in the atomization process can be discharged from the lower liquid hole 1114, further avoiding the formation of large air bubbles on the third surface 1121 of the second base body 112, that is, further Air bubbles are prevented from obstructing the liquid supply. By setting the gap 113 , lateral fluid supplementation can be achieved, and even if the bubbles adhere to the liquid absorbing surface of the first base 111 and cover part of the first liquid guide hole 1113 , the liquid supply of the second base 112 will not be affected. In addition, by disposing the first base body 111 on the side of the second base body 112 close to the liquid storage cavity 14, the first base body 111 can be insulated to a certain extent, preventing the heat on the second base body 112 from being conducted to the liquid storage cavity 14, which is beneficial to Guaranteed consistency of taste.

Specifically, the first substrate 111 may be a porous substrate, such as porous ceramics, cotton, quartz sand cores, or materials with foam structures; The first base 111 may also be a dense base, such as quartz, glass, dense ceramic or silicon; the first liquid conducting hole 1113 is a through hole penetrating the first surface 1111 and the second surface 1112 . When the material of the first substrate 111 is glass, it can be one of ordinary glass, quartz glass, borosilicate glass, and photosensitive lithium aluminosilicate glass.

The second matrix 112 may be a porous matrix, for example, a material of porous ceramic, cotton, quartz sand core, or foam structure; the plurality of micropores in the second matrix 112 itself are the second liquid-conducting holes 1123 . The second base 112 may also be a dense base, such as quartz, glass, dense ceramic or silicon; the second liquid conducting holes 1123 are through holes penetrating the third surface 1121 and the fourth surface 1122 . When the material of the second substrate 112 is glass, it can be one of ordinary glass, quartz glass, borosilicate glass, and photosensitive lithium aluminosilicate glass.

The materials of the first base body 111 and the second base body 112 may be the same or different. The first substrate 111 and the second substrate 112 can be arbitrarily combined, for example, the first substrate 111 is a porous ceramic, and the second substrate 112 is a dense substrate; for another example, the first substrate 111 is a porous ceramic, and the second substrate 112 is a porous ceramic Ceramic; for another example, the first matrix 111 is a dense matrix, and the second matrix 112 is a porous ceramic; in another example, the first matrix 111 is a dense matrix, and the second matrix 112 is a dense matrix.

The first base body 111 and the second base body 112 are both sheet-shaped. It can be understood that the sheet-shaped body is relative to the block-shaped body, and the ratio of the length to the thickness of the sheet-shaped body is larger than the ratio of the length to the thickness of the block-shaped body. . The first base body 111 and the second base body 112 can be flat, curved, cylindrical, etc., and can be designed according to specific needs.

The heating component 11 will be described in detail below by taking the first substrate 111 and the second substrate 112 as dense substrates, and the first substrate 111 and the second substrate 112 as a flat plate as an example (as shown in FIG. 3 ).

The diameter of the second liquid conducting hole 1123 on the second substrate 112 is 1 μm-100 μm. When the diameter of the second liquid guide hole 1123 is less than 1 μm, the liquid supply demand cannot be met, resulting in a decrease in the amount of aerosol; when the diameter of the second liquid guide hole 1123 is greater than 100 μm, the aerosol-generating matrix easily flows out of the second liquid guide hole 1123 Cause liquid leakage, resulting in a drop in atomization efficiency. Optionally, the diameter of the second liquid conducting hole 1123 is 20 μm-60 μm. It can be understood that, the diameter of the second liquid guide hole 1123 is selected according to actual needs.

The thickness of the second base body 112 is 0.1 mm-1 mm. The thickness of the second base 112 is the distance between the third surface 1121 and the fourth surface 1122 . When the thickness of the second base body 112 is greater than 1 mm, the liquid supply requirement cannot be met, resulting in a decrease in the amount of aerosol, and the resulting heat loss is large, and the cost of installing the second liquid conducting holes 1123 is high; when the thickness of the second base body 112 is less than 0.1 mm , the strength of the second substrate 112 cannot be guaranteed, which is not conducive to improving the performance of the electronic atomization device. Optionally, the thickness of the second base body 112 is 0.2mm-0.5mm. It can be understood that the thickness of the second base body 112 is selected according to actual needs.

The ratio of the thickness of the second base body 112 to the diameter of the second liquid conducting hole 1123 is 20:1-3:1, so as to improve the liquid supply capacity. When the ratio of the thickness of the second substrate 112 to the diameter of the second liquid-conducting hole 1123 is greater than 20:1, the aerosol-generating matrix supplied by the capillary force of the second liquid-conducting hole 1123 cannot meet the atomization requirements, which not only easily leads to Dry burning, and the amount of aerosol generated by a single atomization decreases; when the ratio of the thickness of the second substrate 112 to the diameter of the second liquid-conducting hole 1123 is less than 3:1, the aerosol-generating matrix is easily generated from the second liquid-conducting hole. The flow out of 1123 causes waste, which leads to a decrease in atomization efficiency, which in turn reduces the total amount of aerosol. Optionally, the ratio of the thickness of the second substrate 112 to the diameter of the second liquid guide hole 1123 is 15:1-5:1.

The ratio of the hole center distance between two adjacent second liquid guide holes 1123 to the diameter of the second liquid guide holes 1123 is 3:1-1.5:1, so that the second liquid guide holes 1123 on the second substrate 112 On the premise of satisfying the liquid supply capacity, the strength of the second base 112 is improved as much as possible; optionally, the ratio of the hole center distance between two adjacent second liquid guide holes 1123 to the diameter of the second liquid guide holes 1123 is 3:1-2:1; further optionally, the ratio of the hole center distance between two adjacent second liquid-guiding holes 1123 to the diameter of the second liquid-guiding holes 1123 is 3:1-2.5:1.

The diameter of the first liquid conducting hole 1113 on the first substrate 111 is 1 μm-100 μm. When the pore size of the first liquid guide hole 1113 is less than 1 μm, the liquid supply demand cannot be met, resulting in a decrease in the amount of aerosol; when the pore size of the first liquid guide hole 1113 is larger than 100 μm, it is easy to cause liquid leakage, resulting in a decrease in atomization efficiency. It can be understood that the aperture of the first base body 111 is selected according to actual needs.

Optionally, the diameter of the first liquid guide hole 1113 is larger than that of the second liquid guide hole 1123, so that the capillary force of the second liquid guide hole 1123 is greater than the capillary force of the first liquid guide hole 1113, and the aerosol generates a matrix. It can flow from the gap 113 to the atomizing surface of the second base body 112 . Since the first liquid guide hole 1113 also has capillary force, when the port of the mist outlet channel 13 is used downward, it can prevent the liquid from flowing back and prevent the liquid supply from being insufficient.

The thickness of the first base body 111 is 0.1 mm-1 mm. The thickness of the first substrate 111 is the distance between the first surface 1111 and the second surface 1112. Optionally, the thickness of the first base body 111 is smaller than the thickness of the second base body 112 .

Specifically, the lower liquid hole 1114 and the region where the aerosol can be generated in the second substrate 112 are arranged in a staggered position. Since the second substrate 112 is a dense substrate, the heat generated by the heating element 114 is conducted to the second substrate 112 to atomize the aerosol in the second liquid conducting hole 1113 to generate the substrate. Therefore, the area on the second substrate 112 that is closer to the heating element 114 has a high temperature and is sufficient to atomize the aerosol-generating substrate to generate aerosol, which is defined as a high-temperature area; the area on the second substrate 112 that is farther from the heating element 114 The region where the heat conduction may not be sufficient to atomize the aerosol-generating substrate to generate aerosol is defined as the low temperature region. Since the aerosol-generating matrix located in the second liquid-conducting hole 1113 in the high-temperature region is atomized, external gas may enter the second liquid-conducting hole 1113 to form bubbles, which are arranged on the side of the second matrix 112 close to the liquid storage chamber 14 The first base body 111, the first base body 111 can prevent the bubbles entering through the second liquid guide hole 1113 from growing. Therefore, the lower liquid hole 1114 and the region where the plurality of second liquid conducting holes 1113 capable of atomizing the aerosol-generating substrate to generate aerosol are arranged in a staggered position, that is, the lower liquid hole 1114 and the second substrate 112 are capable of generating aerosol. The high temperature area is arranged in a staggered position to ensure the realization of the function of the first base body 111 to prevent the growth of bubbles entering from the second liquid guide hole 1113 during the atomization process.

Optionally, the shapes of the first liquid guide hole 1113 and the lower liquid hole 1114 are both circular holes. The diameter of the lower liquid hole 1114 is greater than or equal to twice the diameter of the first liquid guide hole 1113 .

Optionally, the shape of the first liquid guide hole 1113 is a circular hole, the shape of the lower liquid hole 1114 is a strip shape, and the width of the lower liquid hole 1114 is 90 μm-110 μm.

Optionally, the shape of the first liquid guide hole 1113 is a circular hole, the shape of the lower liquid hole 1114 is a long strip, and the width of the lower liquid hole 1114 is greater than or equal to twice the diameter of the first liquid guide hole 1113 . The length of the lower liquid hole 1114 is designed as required, so that the lower liquid hole 1114 can increase the liquid supply speed and is not enough to cause liquid leakage.

Exemplarily, the shape of the lower liquid hole 1114 is a long strip, that is, the lower liquid hole 1114 includes two parallel sides a and a curved side b connecting the two side sides a, and the curved side b is far from the lower liquid hole 1114. The direction of the inner space is convex (as shown in FIG. 5 ), and the two curved sides b are arranged symmetrically; the width of the lower liquid hole 1114 refers to the distance between the two sides a.

Referring to FIG. 4 , the heating assembly 11 further includes a heating element 114 , a positive electrode 116 and a negative electrode 117 , and both ends of the heating element 114 are electrically connected to the positive electrode 116 and the negative electrode 117 respectively. The heating element 114 is disposed on the fourth surface 1122 of the second substrate 112 to generate the aerosol by atomizing the aerosol-generating substrate. Both the positive electrode 116 and the negative electrode 117 are disposed on the fourth surface 1122 of the second base body 112 to facilitate electrical connection with the host 2 . The heating element 114 can be a heating sheet, a heating film, a heating net, etc., and can heat the atomized aerosol to generate a substrate. In another embodiment, the heating element 114 may be embedded inside the second base body 112 . In yet another embodiment, at least a portion of the second base body 112 is electrically conductive to serve as the heating element 114 .

Optionally, the heating element 114 is in the shape of a strip; specifically, the heating element 114 is bent multiple times to form a plurality of mutually parallel extension parts 1141, and the heating element 114 also includes a connection part 1142 connecting two adjacent extension parts 1141, The extension portion 1141 extends along the direction in which the positive electrode 116 approaches the negative electrode 117 (as shown in FIG. 4 ).

Optionally, the heating element 114 is a waist-shaped film (as shown in FIG. 7 , which is a schematic structural diagram of another embodiment of the heating element of the heating assembly provided in FIG. 3 ). Compared with the heating element 114 shown in FIG. 4 , the heating element 114 provided in FIG. 7 covers a larger area of the second base 112 .

Optionally, the heating element 114 is a whole film (as shown in FIG. 8 , which is a schematic structural diagram of another embodiment of the heating element of the heating assembly provided in FIG. 3 ). Compared with the heating element 114 shown in FIG. 4 , the heating element 114 provided in FIG. 8 covers a larger area of the second substrate 112 . The heating element 114 provided in FIG. 8 covers the second substrate 114 relative to the heating element 114 shown in FIG. The area of the second base body 112 is larger.

The projection of the first base body 111 on the second base body 112 completely covers the heating element 114 to ensure that the liquid supply speed can meet the atomization speed of the heating element 114 and achieve a better atomization effect.

Continuing to refer to FIG. 4 , in this embodiment, only a part of the surface of the second substrate 112 is provided with a plurality of second liquid guide holes 1123 in an array arrangement. Specifically, the second substrate 112 is provided with a micro-hole array area 1124 and a blank area 1125 arranged around the micro-hole array area 1124. The micro-hole array area 1124 has a plurality of second liquid conducting holes 1123; the heating element 114 is arranged in the micro-hole array area 1124. The hole array area 1124 is used to heat the atomized aerosol to generate the matrix; the positive electrode 116 and the negative electrode 117 are arranged in the blank area 1125 of the atomization surface (the fourth surface 1122) to ensure that the positive electrode 116 and the negative electrode 117 are electrically connected stability.

By providing a microwell array area 1124 and a blank area 1125 around the microwell array area 1124 on the second substrate 112, it can be understood that the second liquid guide hole 1123 is not provided on the blank area 1125, which reduces the number of The number of the second liquid guide holes 1123 on the two base bodies 112 increases the strength of the second base body 112 and reduces the production cost of disposing the second liquid guide holes 1123 on the second base body 112 . The microporous array area 1124 in the second substrate 112 is used as an atomization area, covering the heating element 114 and the surrounding area of the heating element 114 , that is, basically covering the area that reaches the temperature of the atomized aerosol generation substrate, making full use of thermal efficiency.

It can be understood that the size of the area around the micropore array area 1124 of the second substrate 112 in this application is larger than the diameter of the second liquid-conducting hole 1123, so it can be called the blank area 1125; that is, the blank area in this application 1125 is an area where the second liquid guide hole 1123 can be formed but no second liquid guide hole 1123 is formed, and is not a region around the microwell array area 1124 where the second liquid guide hole 1123 cannot be formed. In one embodiment, the distance between the second liquid guide hole 1123 closest to the edge of the second base 112 and the edge of the second base 112 is greater than the diameter of the second liquid guide hole 1123, and it is considered that the micro-hole array area 1124 There is a blank area 1125 on the circumference of .

Whether the entire surface of the first base body 111 is provided with the first liquid guide holes 1113 or only a part of the surface with the first liquid guide holes 1113 can be designed as required. Optionally, referring to FIG. 5 , the first substrate 111 is provided with a microwell array area 1116 and a blank area 1117 arranged around the microwell array area 1116 , and the microwell array area 1116 has a plurality of first liquid conducting holes 1113 .

Optionally, the projection of the micropore array area 1116 of the first substrate 111 on the second substrate 112 completely covers the micropore array area 1124 of the second substrate 112, so that the liquid supply speed can meet the atomization speed of the heating element 114. .

Please refer to FIG. 9 . FIG. 9 is a positional relationship diagram of an embodiment of the lower liquid hole and the heating element of the heating assembly provided in FIG. 3 .

In one embodiment, the projection of the lower liquid hole 1114 on the third surface 1121 of the second substrate 112 is staggered from the projection of the heating element 114 on the third surface 1121 . The heating element 114 may be the heating element 114 shown in FIG. 4 , FIG. 7 , and FIG. 8 . FIG. 9 illustrates the heating element 114 shown in FIG. 4 as an example.

Exemplarily, the heating element 114 includes three mutually parallel extending portions 1141 and two connecting portions 1142 connecting two adjacent extending portions 1141 . The first base body 111 is provided with two lower liquid holes 1114 . Two lower liquid holes 1114 and three extending portions 1141 are alternately arranged. The projection of the lower liquid hole 1114 on the plane where the heating element 114 is located is located between two adjacent extension parts 1141 .

Optionally, the lower liquid hole 1114 is in the shape of a long strip and is arranged parallel to the extension portion 1141 .

Please refer to FIG. 10 . FIG. 10 is a positional relationship diagram of the lower liquid hole of the heating assembly provided in FIG. 3 and the heating element according to another embodiment.

In another embodiment, the projection of the lower liquid hole 1114 on the third surface 1121 of the second substrate 112 partially overlaps the projection of the heating element 114 on the third surface 1121 . The heating element 114 may be the heating element 114 shown in FIG. 4 , FIG. 7 , and FIG. 8 . FIG. 10 illustrates the heating element 114 shown in FIG. 4 as an example.

Continuing to refer to FIG. 6 , the edge of the first base body 111 has a liquid inlet 1115 . It can be understood that the gap 113 communicates with the liquid storage cavity 14 through the liquid inlet 1115 and the first liquid guide hole 1113 .

Optionally, two opposite edges of the first base body 111 are provided with liquid inlets 1115 .

The heating assembly 11 further includes a fixing member 115 , and the fixing member 115 has a liquid inlet hole 1151 .

Optionally, the fixing member 115 has a sealing function, and the material of the fixing member 115 is silicone or fluorine rubber.

Optionally, at least part of the edge of the first base 111 is spaced from the hole wall of the liquid inlet hole 1151 to form a liquid inlet 1115, and the second base 112 spans the entire liquid inlet 1151; for example, two opposite lengths of the first base 111 The sides are spaced apart from the hole wall of the liquid inlet hole 1151 to form two symmetrically arranged liquid inlet ports 1115 (as shown in FIG. 5 ).

Optionally, the edge of the first base body 111 is provided with a through hole (not shown) to form a liquid inlet 1115 , and the second base body 112 spans the entire liquid inlet hole 1151 .

The projection of the first base body 111 on the atomizing surface completely covers the heating element 114 , and the liquid inlet 1115 and the heating element 114 are arranged in a staggered position. By arranging the liquid inlet 1115 on the first base 111, not only can the gap 113 be filled with liquid through the liquid inlet 1115, but also air bubbles can be eliminated through the liquid inlet 1115, so as to avoid the influence of the air bubbles entering the liquid storage chamber 14 on the liquid supply, and further Avoid dry burning.

The liquid inlet hole 1151 is in fluid communication with the liquid storage chamber 14 through the lower liquid channel 1211 . The first base body 111 and/or the second base body 112 are embedded in the liquid inlet hole 1151 , that is, the fixing member 115 is used to fix the periphery of the first base body 111 and/or the second base body 112 . When the fixing member 115 covers the periphery of the second base body 112 , the fixing member 115 does not cover the heating element 114 , and the liquid inlet hole 1151 can completely expose the heating element 114 . Optionally, the hole wall of the liquid inlet hole 1151 has an annular installation groove (not shown), and the edges of the first base body 111 and/or the second base body 112 are embedded in the annular installation groove, and the first base body 111 and the second base body 112 are embedded in the annular installation groove. The two base bodies 112 form a gap 113 . It can be understood that the first base body 111 and the second base body 112 may be arranged parallel to each other to form a gap 113 ; it may also be a non-parallel setting between the first base body 111 and the second base body 112 to form a gap 113 , specifically, the first base body 111 An included angle is formed with the second base body 112 .

Please refer to FIG. 11 . FIG. 11 is a schematic structural diagram of another embodiment of the heating component of the atomizer provided in FIG. 2 .

The heating assembly 11 provided in FIG. 11 is basically the same in structure as the heating assembly 11 provided in FIG. 3 , the difference is that in the heating assembly 11 provided in FIG. , a gap 113 is formed between the first base 111 and the second base 112 through the annular mounting groove; while the spacer 118 in the heating assembly 11 provided in FIG. 11 forms a gap 113 between the first base 111 and the second base 112 .

The heating element 11 further includes a spacer 118, the spacer 118 is arranged between the second surface 1112 and the third surface 1121, and is located at the edge of the first base 111 and/or the second base 112, so that the first base 111 and the second base 111 The base body 112 forms a gap 113 . The spacer 118 may be disposed along the circumference of the first base body 111 and/or the second base body 112 , that is, the spacer 118 is an annular structure, so as to avoid leakage of the aerosol-generating matrix in the gap 113 . The spacers 118 may also be multiple and spaced along the circumferential direction of the first base body 111 and the second base body 112 , and seal the circumferential direction of the first base body 111 and the second base body 112 by a sealing member (not shown).

In one embodiment, the first base body 111 and the second base body 112 are arranged in parallel (as shown in FIG. 11 ).

Optionally, the spacer 118 is an independently provided spacer, the spacer is detachably connected to the first base body 111 and the second base body 112 , and the spacer is an annular structure. The specific operations are: forming a first liquid guide hole 1113 on the first base body 111, forming a second liquid guide hole 1123 on the second base body 112, and then disposing a gasket between the first base body 111 and the second base body 112, Specifically, the spacer is disposed between the blank area 1117 of the first base body 111 and the blank area 1125 of the second base body 112 . For example, the spacer 118 can be a silicone frame or a plastic frame.

Optionally, the spacer 118 is a support column or a support frame fixed on the second surface 1112 of the first base body 111 and/or the third surface 1121 of the second base body 112 , and the support column or support frame is clamped or welded. It is fixed on the second surface 1112 of the first base body 111 and/or the third surface 1121 of the second base body 112 . The specific operation is: forming a first liquid guide hole 1113 on the first base body 111, forming a second liquid guide hole 1123 on the second base body 112, and then welding or clamping to make the support column or support frame and the first liquid guide hole 1123. A base body 111 and a second base body 112 are integrated. For example, the first base 111 and the second base 112 are glass plates, glass frit is coated on the edge of the first base 111 , and after the second base 112 is covered, the glass frit is sintered into glass with a laser to connect the support posts or supports The frame is fixed to the first base body 111 and the second base body 112 .

Optionally, the spacer 118 is a protrusion integrally formed with the first base body 111 and/or the second base body 112 . If the spacer 118 is a protrusion integrally formed with the first base body 111 , the first liquid guide hole 1113 is formed on the first base body 111 , the second liquid guide hole 1123 is formed on the second base body 112 , and then the second base body 112 is formed. Overlap on the protrusion to form a gap 113 . If the spacer 118 is a protrusion integrally formed with the second base body 112 , the first liquid guide hole 1113 is formed on the first base body 111 , the second liquid guide hole 1123 is formed on the second base body 112 , and then the first base body 111 is formed. Overlap on the protrusion to form a gap 113 . For example, grooves are formed by etching on the second surface 1112 of the first base body 111 , the sidewalls of the grooves serve as spacers 118 , and the first liquid guide holes 1113 are formed on the bottom wall of the grooves; the third surface 1121 of the second base body 112 The third surface 1121 of the second base 112 overlaps the end surface of the side wall of the groove of the second surface 1212 , that is, the third surface 1121 of the second base 112 is in contact with the second surface 1112 of the first base 111 , the third surface 1121 cooperates with the groove to form a gap 113 . If the bottom surface of the groove is interpreted as the second surface 1112 , the sidewall of the groove can be interpreted as the protrusion of the second surface 1112 .

Please refer to FIG. 12 . FIG. 12 is a schematic structural diagram of FIG. 11 providing another arrangement of the spacers in the heating element. In another embodiment, an included angle is formed between the first base body 111 and the second base body 112 , and the included angle is an acute angle, for example, the included angle is 15 degrees to 30 degrees. It can be understood that the angle formed between the first base body 111 and the second base body 112 may be that the spacer 118 is located at the edge of one end of the first base body 111 and the second base body 112 , and the edge of the other end of the first base body 111 and the second base body 112 Direct abutment; two spacers 118 may also be located at the edges of both ends of the first base body 111 and the second base body 112 and have different heights.

The above are only the embodiments of the present application, and are not intended to limit the scope of the patent of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present application, or directly or indirectly applied in other related technical fields, All are similarly included in the scope of patent protection of the present application.

Claims

A heating component, applied to an electronic atomization device, used for atomizing aerosol generation substrate, comprising:

The first base has a first surface and a second surface arranged oppositely, the first surface is a liquid absorption surface; the first base has a plurality of first liquid guide holes, and the first liquid guide holes are used to an aerosol-generating substrate is directed from the first surface to the second surface;

The second substrate has a third surface and a fourth surface arranged opposite to each other, and the fourth surface is an atomization surface; the second substrate has a plurality of second liquid-conducting holes, and the second liquid-conducting holes are used to the aerosol-generating substrate is directed from the third surface to the fourth surface;

Wherein, the second surface is opposite to the third surface and forms a gap, and the first liquid guide hole and the second liquid guide hole are in fluid communication through the gap; the first substrate also has at least one through-hole In the lower liquid holes of the first surface and the second surface, the diameter of the lower liquid holes is larger than that of the first liquid conducting hole.
The heating assembly according to claim 1, further comprising a heating element for atomizing the aerosol generating substrate; the heating element is arranged on the fourth surface or embedded in the second surface The inside of the base body, or at least part of the second base body, is electrically conductive to serve as the heating element.
The heating assembly according to claim 2, wherein the projection of the lower liquid hole on the third surface and the projection of the heating element on the third surface are arranged in a dislocation.
The heating assembly according to claim 2, wherein the projection of the lower liquid hole on the third surface partially overlaps the projection of the heating element on the third surface.
The heating assembly according to claim 3, wherein the heating element comprises a plurality of mutually parallel extending portions and a connecting portion connecting two adjacent extending portions;

The heating component also includes a positive electrode and a negative electrode, and the two ends of the heating element are respectively electrically connected to the positive electrode and the negative electrode; the extension part approaches the negative electrode along the positive electrode. direction extension;

The projection of the lower liquid hole on the plane where the heating element is located is located between two adjacent extension parts.
The heating element according to claim 5, wherein the lower liquid hole is in the shape of an elongated strip and is parallel to the extending portion.
The heating element according to claim 1, wherein the diameter of the first liquid-conducting hole is 1 μm-100 μm; the diameter of the lower liquid-conducting hole is greater than or equal to twice the diameter of the first liquid-conducting hole.
The heating element according to claim 1, wherein the shape of the lower liquid hole is a long strip, and the width of the lower liquid hole is greater than or equal to twice the diameter of the first liquid conducting hole.
The heating element according to claim 8, wherein the shape of the lower liquid hole comprises two parallel side edges and a curved edge connecting the two side edges, and the curved edge is directed away from the lower liquid hole. The direction of the inner space is convex; the width of the lower liquid hole refers to the distance between the two sides.
The heating element according to claim 1, wherein the capillary force of the second liquid guide hole is greater than the capillary force of the first liquid guide hole.
The heating element according to claim 1, wherein the second substrate is a dense substrate, and the second liquid conducting hole is a through hole penetrating through the third surface and the fourth surface.
The heating element according to claim 11, wherein the first base body is a dense base body, and the first liquid conducting hole is a through hole passing through the first surface and the second surface.
The heating component according to claim 12, wherein the material of the first base body is quartz, glass or dense ceramics; the material of the second base body is quartz, glass or dense ceramics.
The heat-generating component according to claim 1, wherein the heat-generating component further comprises a spacer; the spacer is disposed between the second surface and the third surface, and is located on the first base and/or or the edge of the second base body, so that the first base body and the second base body form the gap.
The heating element according to claim 14, wherein the first base body and the second base body are arranged in parallel; or, an angle is formed between the first base body and the second base body.
The heating assembly according to claim 14, wherein the spacer is an independently arranged gasket;

Or, the spacer is a support column or a support frame fixed on the second surface and/or the third surface;

Or, the spacer is a protrusion integrally formed with the first base body and/or the second base body.
An atomizer comprising:

a liquid storage chamber for storing the liquid aerosol-generating substrate;

A heating component, the heating component is the heating component according to any one of claims 1-16; the heating component is in fluid communication with the liquid storage chamber.
The atomizer according to claim 17, wherein the heating component is the heating component according to any one of claims 11-13, and the lower liquid hole and the second substrate can generate the aerosol Regionally dislocated settings for aerosol-generated aerosols from matrix nebulization.
An electronic atomization device, comprising an atomizer and a main unit, the atomizer is the atomizer of claim 17 or claim 18, and the main unit is electrically connected to the heating component.