WO2022179641A2

WO2022179641A2 - Heating body, atomizer and electronic atomization device

Info

Publication number: WO2022179641A2
Application number: PCT/CN2022/092856
Authority: WO
Inventors: 赵月阳; 吕铭; 张彪; 樊文远; 李光辉
Original assignee: 深圳麦克韦尔科技有限公司
Priority date: 2022-05-13
Filing date: 2022-05-13
Publication date: 2022-09-01
Also published as: CN117044999A; WO2022179641A3; EP4159057A4; CN218185267U; EP4159057A2; US20230363455A1

Abstract

Disclosed are a heating body, an atomizer and an electronic atomization device. The heating body comprises a compact base body, which has a liquid suction surface and an atomization surface arranged opposite each other and is provided with a plurality of micropores that penetrate the liquid suction surface and the atomization surface. The atomization surface is of a surface-treated wetting structure that is in communication with the micropores in a liquid guide manner, which increases the wetting area of the atomization surface, thereby improving the atomization efficiency.

Description

Heating body, atomizer and electronic atomization device

technical field

The present application relates to the technical field of atomization, and in particular, to a heating element, an atomizer and an electronic atomization device.

Background technique

The electronic atomization device is composed of a heating element, a battery and a control circuit. The heating element is the core component of the electronic atomization device, and its characteristics determine the atomization effect and use experience of the electronic atomization device.

With the advancement of technology, users have higher and higher requirements for the atomization effect of electronic atomization devices. In order to meet the needs of users, a porous heating body using a dense matrix such as glass is provided. However, the thermal conduction efficiency of the dense matrix with through-holes is lower than that of the porous matrix with disordered through-holes (eg, porous ceramics), which affects the atomization efficiency.

SUMMARY OF THE INVENTION

The application provides a heating body with a dense matrix, an atomizer and an electronic atomization device having the heating body, so as to improve the atomization efficiency.

In order to solve the above-mentioned technical problems, the first technical solution provided by the present application is to provide a heating element, which is applied to an electronic atomization device and is used for heating an atomized aerosol to generate a matrix, including a dense matrix; the dense matrix has relatively The liquid absorbing surface and the atomizing surface are provided; the dense substrate is provided with a plurality of micropores, and the micropores penetrate through the liquid absorbing surface and the atomizing surface;

Wherein, the atomization surface is a surface-treated wetting structure, and the wetting structure is in communication with the micropore liquid conducting.

In one embodiment, the atomization surface has a first concave-convex structure to form the wetting structure; the first concave-convex structure includes a plurality of first grooves, and the first grooves are connected with the plurality of microscopic grooves. The holes are connected with fluid.

In one embodiment, the plurality of first grooves are arranged parallel to each other, and the length direction of the first grooves is parallel to the first direction; there is a first protrusion between two adjacent first grooves strip;

Or, a plurality of the first grooves are arranged in parallel with each other, and the length direction of the first grooves is parallel to the second direction; there is a second convex strip between two adjacent first grooves;

Or, a plurality of the first grooves include a plurality of first sub-slots extending along a first direction and a plurality of second sub-slots extending along a second direction, and a plurality of the first sub-slots and a plurality of the The second sub-slots are arranged crosswise; there is a bump between two adjacent first sub-slots and two adjacent second sub-slots;

Wherein, the second direction intersects with the first direction.

In one embodiment, a plurality of the first grooves includes a plurality of the first sub-grooves and a plurality of the second sub-grooves; a plurality of the first sub-grooves and a plurality of the second sub-grooves A plurality of the bumps distributed in an array are formed in cooperation.

In one embodiment, the plurality of ports of the plurality of micropores away from the liquid suction surface are all located on the bottom surface of the first groove;

Or, a plurality of ports of the plurality of micropores away from the liquid suction surface are all located on the end face of the bump away from the liquid suction surface;

Or, a part of the plurality of ports of the plurality of micropores far away from the liquid suction surface is located on the bottom surface of the first groove, and the other part is located on the end surface of the convex block away from the liquid suction surface.

In one embodiment, a plurality of ports of the plurality of micropores away from the liquid suction surface are located on the bottom surface of the first groove; a plurality of the micropores are distributed in an array, and each of the first sub-surfaces is arranged in an array. The groove corresponds to a row of the micro-holes, and each of the second sub-slots corresponds to a column of the micro-holes; multiple rows of the bumps and multiple rows of the micro-holes are alternately arranged, and multiple rows of the bumps and multiple rows of the micro-holes are arranged alternately. Alternate arrangement of microwells.

In one embodiment, the heating element further comprises a heating film, the heating film is arranged on the surface of the wetting structure, the heating film is used for heating and atomizing the aerosol generating substrate, and the heating film allows The corresponding micropores are exposed.

In one embodiment, the heating element further includes a heating film, the heating film includes a first part, a second part, a third part and a fourth part, and the first part is located on the side wall of the first sub-slot and bottom wall, the second part is located on the side wall and bottom wall of the second sub-tank, the third part is located on the end face of the bump away from the liquid suction surface, and the fourth part extends to the corresponding the pore walls of the micropores.

In one embodiment, the width of the first groove is 1 μm-100 μm.

In one embodiment, the width of the first groove is less than or equal to 1.2 times the diameter of the micropore.

In one embodiment, the depth of the first groove is 1 μm-200 μm.

In one embodiment, the depth of the first groove is 1 μm-50 μm.

In one embodiment, the plurality of micro-holes are arranged in an array, including a plurality of micro-hole columns parallel to the first direction; the wetting structure includes a plurality of first sub-grooves, and the extension of the first sub-groove is The direction is parallel to the first direction and corresponds to at least one row of microholes parallel to the first direction.

In one embodiment, the plurality of micropores includes a plurality of micropore rows parallel to the second direction, the wetting structure includes a plurality of second sub-grooves, and the extension direction of the second sub-grooves is the same as that of the second sub-groove. The direction is parallel and corresponds to at least one micropore row parallel to the second direction, wherein the plurality of first sub-slots and the plurality of second sub-slots are cross-connected to form a network structure.

In one embodiment, the heating element further includes a positive electrode and a negative electrode, and two ends of the heating film are respectively electrically connected to the positive electrode and the negative electrode; the first direction is along the positive electrode. The direction in which the electrodes approach the negative electrode.

In one embodiment, the surface of the heating film has an oleophilic structure and/or the surface of the heating film away from the dense substrate has a frosted structure or a sandblasted structure.

In one embodiment, the thickness of the heating film is 200nm-5μm; the material of the heating film is aluminum or its alloy, copper or its alloy, silver or its alloy, nickel or its alloy, chromium or its alloy, platinum. one or more of its alloys, titanium or its alloys, zirconium or its alloys, palladium or its alloys, iron or its alloys, gold or its alloys, molybdenum or its alloys, niobium or its alloys, tantalum or its alloys .

In one embodiment, the thickness of the heating film is 200 nm-10 μm; the material of the heating film is one or more of stainless steel, nickel-chromium-iron alloy, and nickel-based corrosion-resistant alloy.

In one embodiment, the atomized surface is a frosted structure or a sandblasted structure to form the wetting structure.

In one embodiment, the liquid absorbing surface is a frosted structure or a sandblasted structure.

In one embodiment, the liquid absorbing surface has a second concave-convex structure, the second concave-convex structure has a plurality of second grooves, and the second grooves are in communication with the micropores for liquid conducting.

In one embodiment, the material of the dense matrix is quartz, glass or dense ceramic, and the micropores are ordered.

In one embodiment, the micropores are straight through holes, and the axes of the micropores are perpendicular to the dense matrix.

In one embodiment, a liquid guide member is further included, and the liquid guide member is spaced apart from the liquid suction surface of the dense substrate to form a gap; or, the liquid guide member is in contact with the liquid suction surface of the dense substrate.

In one embodiment, the liquid guiding member is a porous ceramic or cotton wick; or, the liquid guiding member is made of dense material, and a plurality of through holes are provided on the liquid guiding member.

In one embodiment, the dense matrix is further provided with a plurality of transverse holes, and the plurality of transverse holes communicate with the plurality of the micro holes; wherein, the axis of the transverse hole intersects with the axis of the micro hole .

In order to solve the above technical problems, the second technical solution provided by the present application is to provide an atomizer, including a liquid storage chamber and a heating body; the liquid storage chamber is used to store the aerosol generating matrix; the heating body and The liquid storage chamber is in fluid communication; the heating element is any one of the heating elements described above.

In order to solve the above technical problems, the third technical solution provided by the present application is to provide an electronic atomization device, including an atomizer and a main unit; the atomizer is the above-mentioned atomizer; To provide electrical energy for the work of the atomizer.

Beneficial effects of the present application: Different from the prior art, the present application discloses a heating body, an atomizer and an electronic atomization device, wherein the heating body includes a dense matrix; The dense substrate is provided with a plurality of micropores, and the micropores penetrate through the liquid absorbing surface and the atomizing surface; among them, the atomizing surface is a surface-treated wetting structure, and the wetting structure is connected with the micropores to conduct liquid, which increases the atomization. The wetting area of the surface is increased, thereby improving the atomization efficiency.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

1 is a schematic structural diagram of an electronic atomization device provided by an embodiment of the present application;

Fig. 2 is the structural representation of the atomizer of the electronic atomization device that Fig. 1 provides;

Fig. 3 is the structural representation of the first embodiment of the heating element of the atomizer provided in Fig. 2;

Fig. 4 is the structural representation of the heating element provided by Fig. 3 viewed from the side of the atomizing surface;

Fig. 5 is the structural representation of the heating element provided by Fig. 3 viewed from the liquid absorbing surface side;

Fig. 6 is the partial enlarged structural schematic diagram of Fig. 3;

7 is a schematic structural diagram of an embodiment of the first concave-convex structure of the heating element provided in FIG. 3;

8 is a schematic structural diagram of another embodiment of the first concave-convex structure of the heating element provided in FIG. 3;

9 is a schematic structural diagram of another embodiment of the first concave-convex structure of the heating body provided in FIG. 3;

Figure 10 is a schematic structural diagram of the second embodiment of the heating element of the atomizer provided in Figure 2;

11 is a schematic structural diagram of the third embodiment of the heating element of the atomizer provided in FIG. 2;

FIG. 12 is a schematic structural diagram of the third embodiment of the heating element of the atomizer provided in FIG. 2;

FIG. 13 is a schematic structural diagram of the dense matrix of the fifth embodiment of the heating element of the atomizer provided in FIG. 2 .

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

In the following description, for purposes of illustration and not limitation, specific details such as specific system structures, interfaces, techniques, etc. are set forth in order to provide a thorough understanding of the present application.

The terms "first", "second" and "third" in this application are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second", "third" may expressly or implicitly include at least one of said features. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined. All directional indications (such as up, down, left, right, front, rear...) in the embodiments of the present application are only used to explain the relative positional relationship between components under a certain posture (as shown in the accompanying drawings). , motion situation, etc., if the specific posture changes, the directional indication also changes accordingly. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally also includes Other steps or components inherent to these processes, methods, products or devices.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of the phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are they separate or alternative embodiments that are mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

The present application will be described in detail below with reference to the accompanying drawings and embodiments.

Please refer to FIG. 1 , which is a schematic structural diagram of an electronic atomization device provided by an embodiment of the present application.

In this embodiment, an electronic atomization device 100 is provided. The electronic atomization device 100 can be used for atomization of aerosol-generating substrates. The electronic atomizer device 100 includes an atomizer 1 and a host 2 that are electrically connected to each other.

Wherein, the atomizer 1 is used for storing the aerosol-generating substrate and atomizing the aerosol-generating substrate to form an aerosol that can be inhaled by a user. The atomizer 1 can be used in different fields, for example, medical treatment, beauty, leisure smoking and so on. In a specific embodiment, the atomizer 1 can be used in an electronic aerosolization device for atomizing aerosol-generating substrates and generating aerosols for smokers to inhale. example.

The specific structure and function of the atomizer 1 can be referred to the specific structure and function of the atomizer 1 involved in the following embodiments, and the same or similar technical effects can be achieved, which will not be repeated here.

The host 2 includes a battery (not shown) and a controller (not shown). The battery is used to provide electrical energy for the operation of the atomizer 1 , so that the atomizer 1 can atomize the aerosol-generating substrate to form an aerosol; the controller is used to control the operation of the atomizer 1 . The host 2 also includes other components such as a battery holder, an airflow sensor, and the like.

The atomizer 1 and the host 2 may be integrally provided or detachably connected, and may be designed according to specific needs.

Please refer to FIG. 2 , which is a schematic structural diagram of the atomizer of the electronic atomization device provided in FIG. 1 .

The atomizer 1 includes a housing 10 , a heating body 11 , and an atomizing seat 12 . The atomizing seat 12 has an installation cavity (not shown in the figure), and the heating element 11 is arranged in the installation cavity; the heating element 11 and the atomizing seat 12 are arranged in the casing 10 together. The housing 10 is formed with a mist outlet channel 13 , the inner surface of the housing 10 , the outer surface of the mist outlet channel 13 cooperate with the top surface of the atomization seat 12 to form a liquid storage chamber 14 , and the liquid storage chamber 14 is used to store the liquid aerosol generated. matrix. Wherein, the heating element 11 is electrically connected with the host 2, and the aerosol is generated by atomizing the aerosol generating matrix.

The atomizing seat 12 includes an upper seat 121 and a lower seat 122. The upper seat 121 cooperates with the lower seat 122 to form an installation cavity; the atomization surface of the heating element 11 cooperates with the cavity wall of the installation cavity to form an atomization cavity 120. The upper seat 121 is provided with a lower liquid channel 1211 ; the lower liquid channel 1211 of the aerosol generating matrix channel in the liquid storage chamber 14 flows into the heating body 11 , that is, the heating body 11 is in fluid communication with the liquid storage chamber 14 . The lower seat 122 is provided with an air inlet channel 15 , the outside air enters the atomizing chamber 120 through the air inlet channel 15 , and the aerosol atomized by the heating body 11 flows to the mist outlet channel 13 , and the user inhales through the port of the mist outlet channel 13 . Aerosol.

Please refer to FIGS. 3 to 6 . FIG. 3 is a schematic structural diagram of the first embodiment of the heating element of the atomizer provided in FIG. 2 , and FIG. 4 is a schematic structural diagram of the heating element provided in FIG. 3 viewed from the side of the atomizing surface. 5 is a schematic structural diagram of the heating element provided in FIG. 3 viewed from the liquid-absorbing surface side, and FIG. 6 is a partially enlarged structural schematic diagram of FIG. 3 .

The heating element 11 includes a dense base body 111, and the dense base body 111 has a liquid absorbing surface 1111 and an atomizing surface 1112 arranged oppositely. The dense substrate 111 is provided with a plurality of micropores 1113, the micropores 1113 are through holes penetrating the liquid absorbing surface 1111 and the atomizing surface 1112, and the plurality of micropores 1113 are ordered. The pores 1113 are used to guide the aerosol-generating substrate from the suction surface 1111 to the atomization surface 1112. That is, the aerosol-generating matrix in the liquid storage chamber 14 flows to the liquid suction surface 1111 of the dense matrix 111 through the lower liquid channel 1211, and is guided to the atomization surface 1112 by the capillary force of the micropores 1113; that is, the aerosol The resulting matrix flows from the suction surface to the atomization surface under the action of gravity and/or capillary forces. The aerosol generating substrate is heated and atomized on the atomizing surface of the heating element 11 to generate an aerosol. The atomizing surface 1112 is a surface-treated wetting structure, and the wetting structure is in fluid-conducting communication with the micropores 1113 . The liquid-absorbing surface 1111 is a smooth surface.

It can be understood that since the aerosol-generating matrix is atomized on the atomizing surface 1112 to generate aerosols, by setting the wetting structure on the atomizing surface 1112, the wetting area of the atomizing surface 1112 is increased, so that the atomizing surface 1112 can attach more The aerosol-generating matrix improves the nebulization efficiency.

The material of the dense matrix 111 is glass or dense ceramics or silicon or quartz. When the material of the dense substrate 111 is glass, it can be one of ordinary glass, quartz glass, borosilicate glass, and photosensitive lithium aluminosilicate glass.

The dense matrix 111 is in the shape of a sheet. It can be understood that the sheet is relative to the block, and the ratio of the length to the thickness of the sheet is larger than the ratio of the length to the thickness of the block; for example, a rectangular sheet. The dense base body 111 can also be in the shape of a flat plate, an arc shape, a cylinder shape, etc., which can be specifically designed as required, and other structures of the atomizer 1 are arranged in coordination with the shape of the dense base body 111 . The micropores 1113 on the dense substrate 111 are straight through holes penetrating two opposite surfaces of the dense substrate 111 .

The diameter of the micropores 1113 on the dense substrate 111 is 1 μm-100 μm. When the pore size of the micropores 1113 is less than 1 μm, the liquid supply requirement cannot be met, resulting in a decrease in the amount of aerosol; when the pore size of the micropores 1113 is greater than 100 μm, the aerosol-forming matrix is likely to flow out of the micropores 1113 and cause liquid leakage. Optionally, the diameter of the micropores 1113 is 20 μm-50 μm. It can be understood that the diameter of the micropores 1113 is selected according to actual needs.

The thickness of the dense matrix 111 is 0.1 mm-2 mm. The thickness of the dense substrate 111 is the distance between the liquid absorbing surface 1111 and the atomizing surface 1112. When the thickness of the dense matrix 111 is greater than 2 mm, the liquid supply demand cannot be met, resulting in a decrease in the amount of aerosol, and the resulting heat loss is high, and the cost of installing the dense matrix 111 is high; when the thickness of the dense matrix 111 is less than 0.1 mm, the dense matrix cannot be guaranteed The strength of 111 is not conducive to improving the performance of the electronic atomization device. Optionally, the thickness of the dense base body 111 is 0.3mm-0.8mm. It can be understood that the thickness of the dense matrix 111 is selected according to actual needs.

The ratio of the thickness of the dense matrix 111 to the diameter of the micropores 1113 is 20:1-3:1, so as to improve the liquid supply capacity. When the ratio of the thickness of the dense matrix 111 to the pore size of the micropores 1113 is greater than 20:1, the aerosol-generating matrix supplied by the capillary force of the micropores 1113 cannot meet the atomization requirements, which not only easily leads to dry burning, but also causes a single atomization. The amount of generated aerosol decreases; when the ratio of the thickness of the dense matrix 111 to the aperture of the micropores 1113 is less than 3:1, the aerosol generation matrix easily flows out of the micropores 1113 to cause waste, resulting in a decrease in the atomization efficiency, which in turn makes the total gas The amount of sol decreased. Optionally, the ratio of the thickness of the dense matrix 111 to the diameter of the micropores 1113 is 15:1-5:1.

The ratio of the hole center distance between two adjacent micropores 1113 to the diameter of the micropores 1113 is 3:1-1.5:1, so that the micropores 1113 on the dense matrix 111 meet the liquid supply capacity under the premise. The strength of the dense matrix 111 is improved as much as possible; optionally, the ratio of the distance between the centers of the two adjacent micropores 1113 to the diameter of the micropores 1113 is 3:1-2:1; The ratio of the hole center distance between two adjacent micro holes 1113 to the diameter of the micro holes 1113 is 3:1-2.5:1.

In this embodiment, the heating element 11 further includes a heating element 112 , a positive electrode 113 and a negative electrode 114 , and both ends of the heating element 112 are electrically connected to the positive electrode 113 and the negative electrode 114 respectively. The heating element 112 is used to atomize the aerosol-generating substrate. The heating element 112 is arranged on the atomizing surface 1112 of the dense substrate 111 , that is, the heating element 12 is arranged on the surface of the above-mentioned wetting structure to heat the atomized aerosol-generating matrix to generate aerosol. Both the positive electrode 113 and the negative electrode 114 are disposed on the atomized surface 1112 of the dense substrate 111 to facilitate electrical connection with the host 2 . The heating element 112 can be a heating sheet, a heating film, a heating net, etc., and can heat the atomized aerosol to generate a substrate. In another embodiment, the heating element 112 may be embedded in the dense matrix 111 . In yet another embodiment, at least part of the dense matrix 111 is electrically conductive to serve as the heating element 112 .

Optionally, the heating element 112 is a heating film, the thickness of the heating film is 200nm-5 μm, and the material of the heating film is aluminum or its alloy, copper or its alloy, silver or its alloy, nickel or its alloy, chromium or its alloy, One or more of platinum or its alloys, titanium or its alloys, zirconium or its alloys, palladium or its alloys, iron or its alloys, gold or its alloys, molybdenum or its alloys, niobium or its alloys, tantalum or its alloys kind.

Optionally, the heating element 112 is a heating film, the thickness of the heating film is 200nm-10 μm, and the material of the heating film is stainless steel (304, 316L, 317L, 904L, etc.), nickel-chromium-iron alloy (inconel625, inconel718, etc.), nickel-based One or more of corrosion alloys (Ni-Mo alloy B-2, Ni-Cr-Mo alloy C-276).

In other embodiments, the aerosol-generating matrix can be atomized by microwave heating, laser heating, etc., which can be specifically designed as required.

Hereinafter, the heating body 11 will be described in detail by taking the heating element 112 for heating, the heating element 112 disposed on the surface of the wetting structure, and the heating element 112 being a heating film as an example.

Optionally, the heating film is formed with the atomized surface 1112 of the dense substrate 111 by a physical vapor deposition process. The heating film allows the corresponding micropores 1113 to be exposed (as shown in FIGS. 3 and 4 ).

Referring to FIG. 4 and FIG. 5 , in this embodiment, only a part of the surface of the dense substrate 111 is provided with a plurality of micro-holes 1113 in an array arrangement. Specifically, the dense matrix 111 is provided with a micro-hole array area 1114 and a blank area 1115 arranged around the micro-hole array area 1114. The micro-hole array area 1114 has a plurality of micro-holes 1113, and the blank area 1115 is not provided with micro-holes 1113; the heating element 112 is arranged in the micropore array area 1114 to heat the atomized aerosol to generate the matrix; the positive electrode 113 and the negative electrode 114 are arranged in the blank area 1115 of the atomizing surface 1112 to ensure the positive electrode 113 and the negative electrode 114 Stability of electrical connections.

By providing a microhole array area 1114 and a blank area 1115 around the microhole array area 1114 on the dense substrate 111, the number of microholes 1113 on the dense substrate 111 is reduced, thereby improving the strength of the dense substrate 111 and reducing the The production cost of disposing the micropores 1113 on the dense substrate 111 . The microporous array area 1114 in the dense matrix 111 serves as an atomization area, covering the heating element 112 and the surrounding area of the heating element 112, that is, basically covering the area that reaches the temperature of the atomized aerosol-generated matrix, making full use of thermal efficiency.

It can be understood that the area around the micropore array area 1114 of the dense matrix 111 in this application is larger than the diameter of the micropore 1113, so it can be called the blank area 1115; that is, the blank area 1115 in this application can be formed The micro-holes 1113 are not formed in the area where the micro-holes 1113 are formed, but not in the area around the micro-hole array area 1114 where the micro-holes 1113 cannot be formed. In one embodiment, the distance between the micropores 1113 closest to the edge of the dense matrix 111 and the edge of the dense matrix 111 is greater than the aperture of the dense matrix 111, and it is considered that there is a blank area on the circumference of the micropore array region 1114. 1115.

In this embodiment, the atomized surface 1112 of the dense substrate 111 has a first concave-convex structure 1116 to form a wetting structure. The first concave-convex structure 1116 includes a plurality of first grooves 1116a, the first grooves 1116a are in liquid-conducting communication with the plurality of micropores 1113, and the capillary force of the first grooves 1116a can guide the aerosol-generating substrate from the micropores 1113 To the first groove 1116a, a part of the heating film (the heating element 112) is deposited in the first groove 1116a. Among them, the plurality of first grooves 1116a span the microwell array area 1114 . It can be understood that the atomizing surface 1112 includes a plurality of first grooves 1116a relative to the smooth surface of the atomizing surface. The first grooves 1116a can store the aerosol generating matrix, which increases the area of the atomizing surface 1112, that is, The contact area between the aerosol generating matrix and the heating film (heating element 112) is increased, that is, the effective atomization area is increased, which is beneficial to improve the atomization efficiency; The aerosol-generating substrate in the groove 1116a will not flow back to the liquid storage chamber 14, and the aerosol-generating substrate in the first groove 1116a is directly atomized, avoiding repeated heating, and the aerosol reduction degree is high. In addition, after the electronic atomization device has been stopped for a period of time, a certain amount of aerosol-generating matrix will be stored in the first groove 1116a, and the user will not take a few puffs of the electronic atomization device upside down when using it next time. Dry burning.

Optionally, the width of the first groove 1116a is 1 μm-100 μm. When the width of the first groove 1116a is greater than 100 μm, the capillary force of the first groove 1116a is not strong, and the effect of improving the atomization efficiency is not obvious; when the width of the first groove 1116a is less than 1 μm, the flow resistance is too large, which makes the gas The flow of the sol-forming matrix is slow.

Optionally, the width of the first groove 1116a is less than or equal to 1.2 times the diameter of the micropore 1113, so as to ensure that the capillary force of the first groove 1116a meets the requirements.

Optionally, the depth of the first groove 1116a is 1 μm-200 μm. When the depth of the first groove 1116a is less than 1 μm, the capillary force of the first groove 1116a is not obvious, and it is difficult to guide the aerosol-generating matrix in the micropore 1113 to the first groove 1116a, resulting in dryness in the first groove 1116a. When the depth of the first groove 1116a is greater than 200 μm, the problem of frying liquid is prone to occur, and the heating film (heating element 112) is not easy to form in the first groove 1116a, if the dense matrix 111 is very thin, the first groove 1116a If the depth is too deep, it will easily affect the strength. Optionally, the depth of the first groove 1116a is 1 μm-50 μm, which can prevent frying liquid and prevent the aerosol particles from being too large in size. If the aerosol particle size is desired to be larger, the depth of the first groove 1116a can be selected to be 50-200 μm.

In one embodiment, the plurality of first grooves 1116a are arranged parallel to each other, and the length direction of the first grooves 1116a is parallel to the first direction; there are first protruding strips 1116b between two adjacent first grooves 1116a (As shown in FIG. 7 , FIG. 7 is a schematic structural diagram of an embodiment of the first concave-convex structure of the heating body provided in FIG. 3 ). The first direction is a direction along the positive electrode 113 approaching the negative electrode 114 . The plurality of micro-holes 1112 are arranged in an array, including a plurality of micro-hole rows parallel to the first direction, and the first groove 1116a corresponds to at least one micro-hole row parallel to the first direction. At this time, the first concave-convex structure 1116 includes a plurality of first grooves 1116a and a plurality of first protruding strips 1116b.

Optionally, multiple ports of the plurality of micropores 1113 away from the liquid suction surface 1111 are located on the bottom surface of the first groove 1116a (as shown in FIG. 7 ); The ports are all located on the end surface of the first protruding strip 1116b away from the liquid-absorbing surface 1111; or, a part of the ports of the plurality of micropores 1113 away from the liquid-absorbing surface 1111 are located on the bottom surface of the first groove 1116a, and the other part is located on the first protruding strip 1116b is away from the end surface of the liquid-absorbing surface 1111 .

Optionally, the port of the same micropore 1113 away from the liquid suction surface 1111 is located on the bottom surface of the first groove 1116a (as shown in FIG. 7 ); A ridge 1116b is far away from the end face of the liquid-absorbing surface 1111; or, a part of the port of the same micro-hole 1113 that is far away from the liquid-absorbing surface 1111 is located on the bottom surface of the first groove 1116a, and the other part is located on the first protruding strip 1116b away from the liquid-absorbing surface 1111 end face.

Optionally, the heating film includes a first part, a second part and a third part; the first part of the heating film (heating element 112) is located on the side wall and bottom wall of the first groove 1116a, and the second part is located on the first convex strip 1116b. Away from the end face of the liquid suction surface 1111 , the third portion extends to the hole wall of the corresponding micro hole 1113 . Since part of the heating film located on the side wall and/or bottom wall of the first groove 1116a is directly electrically connected to the positive electrode 113 and the negative electrode 114, the part of the side wall and/or bottom wall of the first groove 1116a generates heat There is a current passing through the film, which can directly generate heat to heat the first groove 1116a and the aerosol in the micropore 1113 to form a matrix, thereby improving the energy utilization rate.

In another embodiment, the plurality of first grooves 1116a are arranged parallel to each other, and the length direction of the first grooves 1116a is parallel to the second direction; there is a second convex strip between two adjacent first grooves 1116a 1116c (as shown in FIG. 8 , which is a schematic structural diagram of another embodiment of the first concave-convex structure of the heating body provided in FIG. 3 ). Wherein, the second direction intersects with the first direction. Exemplarily, the included angle between the second direction and the first direction is 90 degrees. The plurality of micro-holes 1112 are arranged in an array, including a plurality of micro-hole rows parallel to the second direction, and the first groove 1116a corresponds to at least one micro-hole row parallel to the second direction. At this time, the first concave-convex structure 1116 includes a plurality of first grooves 1116a and a plurality of second protruding strips 1116c. It can be understood that the included angle between the second direction and the first direction is not limited to 90 degrees, and may also be an acute angle or an obtuse angle.

Optionally, multiple ports of the plurality of micropores 1113 away from the liquid suction surface 1111 are all located on the bottom surface of the first groove 1116a (as shown in FIG. 8 ); The ports are all located on the end surface of the second ridge 1116c away from the liquid suction surface 1111; or, a part of the multiple ports of the plurality of pores 1113 away from the liquid suction surface 1111 is located on the bottom surface of the first groove 1116a, and the other part is located on the second ridge 1116c is away from the end surface of the liquid-absorbing surface 1111 .

Optionally, the port of the same micropore 1113 away from the liquid suction surface 1111 is located on the bottom surface of the first groove 1116a (as shown in FIG. 8 ); The end face of the two protruding strips 1116c away from the liquid absorbing surface 1111; or, a part of the port of the same micropore 1113 which is far away from the liquid absorbing surface 1111 is located on the bottom surface of the first groove 1116a, and the other part is located on the second protruding strip 1116c away from the liquid absorbing surface 1111 end face.

Optionally, the heating film includes a first part, a second part and a third part; the first part of the heating film (heating element 112) is located on the side wall and bottom wall of the first groove 1116a, and the second part is located on the second convex strip 1116c. Away from the end face of the liquid suction surface 1111 , the third portion extends to the hole wall of the corresponding micro hole 1113 . Since part of the heating film located on the side wall and/or bottom wall of the first groove 1116a is directly electrically connected to the positive electrode 113 and the negative electrode 114, the part of the side wall and/or bottom wall of the first groove 1116a generates heat There is a current passing through the film, which can directly generate heat to heat the first groove 1116a and the aerosol in the micropore 1113 to form a matrix, thereby improving the energy utilization rate.

In yet another embodiment, the plurality of first grooves 1116a includes a plurality of first sub-grooves A extending along the first direction and a plurality of second sub-grooves B extending along the second direction, the plurality of first sub-grooves A It is crossed with a plurality of second sub-slots B; there is a bump 1116d between two adjacent first sub-slots A and two adjacent second sub-slots B (as shown in FIG. 9 , FIG. 9 is a 3. A schematic structural diagram of another embodiment of the first concave-convex structure of the heating body provided). The first direction is a direction along which the positive electrode 113 approaches the negative electrode 114 , and the second direction intersects the first direction. Exemplarily, the included angle between the second direction and the first direction is 90 degrees. At this time, the first concave-convex structure 1116 includes a plurality of first sub-grooves A, a plurality of second sub-grooves B and a plurality of bumps 1116d. It can be understood that the included angle between the second direction and the first direction is not limited to 90 degrees, and may also be an acute angle or an obtuse angle. The first sub-slot A and the second sub-slot B are cross-connected to form a network structure.

Optionally, multiple ports of the plurality of micropores 1113 away from the liquid suction surface 1111 are located on the bottom surface of the first groove 1116a (as shown in FIG. 9 ); The ports are all located on the end surface of the bump 1116d away from the liquid suction surface 1111; or, a part of the plurality of ports of the plurality of micropores 1113 away from the liquid suction surface 1111 is located on the bottom surface of the first groove 1116a, and the other part is located on the bump 1116d away from the liquid suction end face of face 1111.

Optionally, the port of the same micropore 1113 away from the liquid suction surface 1111 is located on the bottom surface of the first groove 1116a (as shown in FIG. 9 ); or, the port of the same micropore 1113 away from the liquid absorption surface 1111 is located in the convex The end face of the block 1116d far away from the liquid suction surface 1111;

Optionally, a plurality of first sub-slots A cooperate with a plurality of second sub-slots B to form a plurality of bumps 1116d distributed in an array. The plurality of micro-holes 1113 are arranged in an array, including a plurality of micro-hole columns parallel to the first direction and a plurality of micro-hole columns parallel to the second direction; the extending direction of the first sub-slot A is parallel to the first direction and at least parallel to the first direction. A row of micro-holes parallel to the first direction corresponds to; the extending direction of the second sub-slots B is parallel to the second direction and corresponds to at least one row of micro-holes parallel to the second direction, wherein the plurality of first sub-slots A and the plurality of The second sub-slots B are cross-connected to form a network structure.

Exemplarily, the plurality of micro-holes 1113 are distributed in an array; the plurality of ports of the plurality of micro-holes 1113 away from the liquid suction surface 1111 are located on the bottom surface of the first groove 1116a; each first sub-groove A is parallel to a first direction Each second sub-slot B corresponds to a micro-hole column parallel to the second direction; the rows of bumps 1116d and the rows of micro-holes 1113 are alternately arranged, and the rows of bumps 1116d and the rows of micro-holes 1113 are alternately arranged. Alternate settings (as shown in Figure 9).

Optionally, the heating film includes a first part, a second part, a third part and a fourth part; the first part of the heating film (heating element 112) is located on the side wall and bottom wall of the first sub-slot A, and the second part is located in the first part. The side and bottom walls of the two sub-tanks B, the third part is located on the end face of the bump 1116d away from the liquid suction surface 1111 , and the fourth part extends to the hole wall of the corresponding micro hole 1113 (as shown in FIG. 6 ). Since part of the heating film located on the side wall and/or bottom wall of the first groove 1116a is directly electrically connected to the positive electrode 113 and the negative electrode 114, the part of the side wall and/or bottom wall of the first groove 1116a generates heat There is a current passing through the film, which can directly generate heat to heat the first groove 1116a and the aerosol in the micropore 1113 to form a matrix, thereby improving the energy utilization rate.

It should be noted that when the atomized surface of the heating element is a smooth surface, when the heating film is formed on the atomized surface by the physical vapor deposition process, the heating film includes a flat heating film, a heating film in the hole and a heating film in the connecting corner area. The heating film is located on the atomizing surface, the heating film in the hole is located in the micropore, and the heating film in the corner area is connected to the flat heating film and the heating film in the hole. Through the potential simulation analysis of the heating element when it is energized, it is found that in this type of heating element, the current is basically on the surface heating film and the heating film in the connecting corner area, and almost no current flows through the heating film in the hole. Therefore, it can be considered that the area where the heating body actually generates heat is the surface heating film and the heating film in the connecting corner area, and the heating film in the hole is the heat transfer area. Through the observation of the atomization surface during atomization, it is found that the atomization surface basically has no oil film whether it is working or not working, so it is determined that it is really used for atomization as a heating film in the hole. In the potential simulation analysis of the heating body when it is energized, the heating film in the hole is the heat transfer area, so the energy utilization rate of the heating film can be said to be low, which is intuitively expressed as a small amount of atomization. At the same time, it is inferred in the reverse direction that only by dissipating the heat of the heating film in the hole, and then dissipating the heat of the entire heating film, the problems caused by synchronization are the risk of dry burning and burning.

In the present application, the atomized surface 1112 of the dense substrate 111 is set as a wetting structure. For example, the atomized surface 1112 has a first concave-convex structure 1116 , and a heating film (heating element 112 ) is also formed on the first concave-convex structure 1116 . The side wall and bottom wall of the first groove 1116a increase the effective heating area of the heating element 112, thereby improving the energy utilization rate. The first groove 1116a leads part of the aerosol-generating matrix into the groove for atomization, which is beneficial to improve the atomization. efficiency. Since the first groove 1116a and the micro-holes 1113 are atomized at the same time, it can effectively prevent the aerosol-generating matrix in the hole from being emptied instantly due to excessive atomization in the hole, and the sound of sucking and returning air caused by air intake. At the same time, the contact area between the aerosol generating substrate and the heating element 112 is increased by the first concave-convex structure 1116, thereby increasing the heat dissipation area of the heating element 112, thereby effectively preventing dry burning.

The applicant has also studied and found that by setting the atomized surface 1112 as a wetting structure, the heating film is deposited on the rough rubbing surface. Compared with the smooth surface of the atomized surface, the heating film is deposited on the smooth surface, and the amount of atomization is significantly increased. For example, It was increased from 6.2mg/puff to 8.5mg/puff, and the scaling phenomenon was also significantly reduced, which also improved the aerosol taste and sweetness.

It can be understood that the longitudinal cross-sectional shape of the first groove 1116a is a rectangle, a triangle, a circle, an arc, a V/U shape, an Ω shape, etc., which can be specifically designed as required. Here, the longitudinal section refers to a section along a direction perpendicular to the dense matrix 111 .

In other embodiments, the first concave-convex structure 1116 on the atomizing surface 1112 may cover the area where the heating film (heating element 112 ) is provided; The area of the heating film (heating element 112); or, the first concave-convex structure 1116 on the atomizing surface 1112 can cover part of the area where the heating film (heating element 112) is provided, and cover part of the blank area 1115, which can to a certain extent It is sufficient to improve the energy utilization rate of the heating element 112 .

In other embodiments, the atomization surface 1112 is set as a frosted structure or a sandblasted structure to form a wetting structure, and the same technical effect can be achieved compared with the atomization surface 1112 having the first concave-convex structure 1116 to form a wetting structure ,No longer.

Please refer to FIG. 10 , which is a schematic structural diagram of the second embodiment of the heating element of the atomizer provided in FIG. 2 .

The structure of the heating body 11 provided in FIG. 10 is basically the same as that of the heating body 11 provided in FIG. 3 , the difference is that the structure of the liquid absorbing surface 1111 of the dense substrate 111 is different, and the same parts will not be repeated.

In this embodiment, the liquid absorbing surface 1111 has a second concave-convex structure 1117 , and the second concave-convex structure 1117 has a plurality of second grooves 1117 a ; the specific arrangement of the second concave-convex structure 1117 may refer to the specific arrangement of the first concave-convex structure 1116 method, which will not be repeated here. The second groove 1117a is in liquid-conducting communication with the plurality of micro-holes 1113. The second groove 1117a is provided to prevent the air bubbles entering from the micro-hole 1113 from adhering to the liquid-absorbing surface 1111 and growing up, thereby hindering the micro-holes in the surrounding area. 1113 under the liquid.

The present application also provides a heating body 11 . In this embodiment, the structure is basically the same as that of the heating body 11 provided in FIG. 3 , except that the structure of the heating element 112 is different. Specifically, the heating element 112 is a heating film, the heating film is an oleophilic structure and/or the surface of the heating film far from the dense substrate 111 has a frosted structure or a sandblasted structure, so that the contact angle is small and the wettability is high, which is beneficial to improve energy utilization rate and improve the atomization efficiency.

In a set of comparative experiments, under the condition that other conditions remain unchanged, the dense matrix is quartz glass, the thickness of the dense matrix is 400 μm, the diameter of the micropores is 40 μm, the distance between the holes is 80 μm, the heating film is a thin film, the power is 6.5W, the inventor The atomization amount comparison experiment was carried out on the heating element with a smooth atomizing surface and a groove on the atomizing surface (see Figure 4). The depth of the groove was 15-25 μm, and the width of the groove was 30-40 μm. The amount was increased from 6.2mg/mouth to 7.6mg/mouth. That is to say, when other conditions remain unchanged, a groove is provided on the atomization surface of the dense substrate, and the heating element is partially located in the groove, which can greatly improve the heat utilization rate and the amount of atomization.

Please refer to FIG. 11 , which is a schematic structural diagram of the third embodiment of the heating element of the atomizer provided in FIG. 2 .

The structure of the heating body 11 provided in FIG. 11 is basically the same as that of the heating body 11 provided in FIG. 3 , the difference is that the heating body 11 further includes a first protective film 115 and a second protective film 116 , and the same parts are not repeated.

The first protective film 115 is arranged on the surface of the heating element 112 away from the dense substrate 111 , and the material of the first protective film 115 is a non-conductive material resistant to the corrosion of the aerosol generation matrix; the second protective film 116 is arranged on the positive electrode 113 and the negative electrode 114 Away from the surface of the dense substrate 111 , the material of the second protective film 116 is a conductive material that is resistant to corrosion of the aerosol-generating matrix, which effectively prevents the aerosol-generating matrix from corroding the heating element 112 , the positive electrode 113 , and the negative electrode 114 , which is beneficial to improve the heating element 11 service life.

Optionally, the material of the first protective film 115 is ceramic or glass. Since the material of the heating element 112 is metal, the thermal expansion coefficient of the ceramic or glass matches that of the metal heating element 112, and the adhesion of the ceramic or glass matches that of the metal heating element 112. Using ceramic or glass as the first protective film 115, the first The protective film 115 is not easy to fall off from the heating part 1121, and can play a good protective role.

When the material of the first protective film 115 is ceramic, the material of the ceramic can be one or more of aluminum nitride, silicon nitride, aluminum oxide, silicon oxide, silicon carbide, and zirconium oxide, which can be selected according to needs.

Optionally, the thickness of the first protective film 115 is 10 nm-1000 nm.

Optionally, the thickness of the second protective film 116 is 10 nm-2000 nm.

Optionally, the material of the second protective film 116 is conductive ceramic or metal. Compared with the first protective film 115 being a non-conductive material, the second protective film 116 is a conductive material, so that the second protective film 116 does not affect the positive electrode 113 while protecting the positive electrode 113 and the negative electrode 114 from being corroded by the aerosol-generating matrix. , the electrical connection between the negative electrode 114 and the host 2 . By using conductive ceramic or metal as the second protective film 116, it is beneficial to reduce the contact resistance.

When the material of the second protective film 116 is a conductive ceramic, the material of the conductive ceramic is one or more of titanium nitride and titanium diboride. It will be appreciated that conductive ceramics are more resistant to aerosol-generating matrix corrosion than metals.

Please refer to FIG. 12 , which is a schematic structural diagram of the fourth embodiment of the heating element of the atomizer provided in FIG. 2 .

The structure of the heating body 11 provided in FIG. 12 is basically the same as that of the heating body 11 provided in FIG. 3 , the difference is that the heating body 11 further includes a liquid conducting member 117 , and the same parts are not repeated.

Optionally, the material of the liquid conducting member 117 is a porous material, such as porous ceramics, cotton wick, and the like.

Optionally, the material of the liquid conducting member 117 is dense, such as dense ceramics, glass, etc. At this time, the liquid conducting member 117 is provided with a plurality of through holes (not shown), and the through holes have capillary force.

Optionally, the liquid-conducting member 117 is in contact with the liquid-absorbing surface 1111 of the dense substrate 111 (as shown in FIG. 12 ). The aerosol-generating substrate is guided to the liquid-absorbing surface 1111 of the dense substrate 111 by the capillary force of the liquid-conducting member 117 .

Optionally, the liquid-conducting member 117 is opposite to the liquid-absorbing surface 1111 of the dense substrate 111 and is disposed at intervals to form a gap (not shown). The aerosol-generating substrate is guided to the gap by the capillary force of the liquid-conducting member 117 , and then enters the liquid-absorbing surface 1111 of the dense substrate 111 .

The liquid supply speed is further controlled by arranging the liquid guiding member 117 on the liquid absorbing surface 1111 side of the dense substrate 111 .

Please refer to FIG. 13 , which is a schematic structural diagram of the fifth embodiment of the heating element of the atomizer provided in FIG. 2 .

The structure of the heating body 11 provided in FIG. 13 is basically the same as that of the heating body 11 provided in FIG. 3 , the difference is that a plurality of transverse holes 1118 are also provided in the dense matrix 111 of the heating body 11 and the same parts will not be repeated.

The plurality of lateral holes 1118 communicate with the plurality of micro holes 1113 . The axis of the transverse hole 1118 intersects the axis of the micro hole 1113 . Optionally, the axis of the transverse hole 1118 is perpendicular to the axis of the micro hole 1113 .

A plurality of micro-holes 1113 and a plurality of transverse holes 1118 form a grid-like micro-flow channel. During the atomization process, air bubbles will enter the micro-holes 1113. By setting the transverse holes 1118, the bubbles entering through the adjacent micro-holes 1113 can be prevented from being connected together. One piece can prevent the bubbles from growing; at the same time, even if the bubbles enter the liquid absorption surface 1111 from the atomizing surface 1112 through the micropores 1113, and adhere to the liquid absorption surface 1111 to grow up, blocking part of the micropores 1113, the lateral holes 1118 can give The blocked micropores 1113 supplement the aerosol generating matrix, so that the atomizing surface 1112 can ensure timely liquid supply and avoid dry burning. The transverse hole 1118 also has a certain function of storing liquid, which can ensure that at least two holes will not be blown off when pumped back.

It can be understood that the features of the first embodiment of the heating element 11 , the second embodiment of the heating element 11 , the third embodiment of the heating element 11 , the fourth embodiment of the heating element 11 , and the fifth embodiment of the heating element 11 provided in this application can be based on Any combination is required.

The above are only the embodiments of the present application, and are not intended to limit the scope of the patent of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present application, or directly or indirectly applied in other related technical fields, All are similarly included in the scope of patent protection of the present application.

Claims

A heating element, applied to an electronic atomization device, is used for heating an atomized aerosol generating substrate, comprising:

a dense substrate, with a liquid absorbing surface and an atomizing surface arranged oppositely; a plurality of micropores are arranged on the dense substrate, and the micropores penetrate through the liquid absorbing surface and the atomizing surface;

Wherein, the atomization surface is a surface-treated wetting structure, and the wetting structure is in communication with the micropore liquid conducting.
The heating element according to claim 1, wherein the atomizing surface has a first concave-convex structure to form the wetting structure; the first concave-convex structure comprises a plurality of first grooves, the first grooves is in fluid communication with the plurality of micropores.
The heating element according to claim 2, wherein the plurality of first grooves are arranged parallel to each other, and the length direction of the first grooves is parallel to the first direction; two adjacent first grooves There is a first convex strip between;

Or, a plurality of the first grooves are arranged in parallel with each other, and the length direction of the first grooves is parallel to the second direction; there is a second convex strip between two adjacent first grooves;

Or, a plurality of the first grooves include a plurality of first sub-slots extending along a first direction and a plurality of second sub-slots extending along a second direction, and a plurality of the first sub-slots and a plurality of the The second sub-slots are arranged crosswise; there is a bump between two adjacent first sub-slots and two adjacent second sub-slots;

Wherein, the second direction intersects with the first direction.
The heating element according to claim 3, wherein a plurality of the first grooves comprises a plurality of the first sub-grooves and a plurality of the second sub-grooves; a plurality of the first sub-grooves and a plurality of the second sub-grooves The second sub-slots cooperate to form a plurality of the bumps distributed in an array.
The heating element according to claim 4, wherein a plurality of ports of the plurality of micropores away from the liquid suction surface are located on the bottom surface of the first groove;

Or, a plurality of ports of the plurality of micropores away from the liquid suction surface are all located on the end face of the bump away from the liquid suction surface;

Or, a part of the plurality of ports of the plurality of micropores far away from the liquid suction surface is located on the bottom surface of the first groove, and the other part is located on the end surface of the convex block away from the liquid suction surface.
The heating element according to claim 5, wherein a plurality of ports of the plurality of the micro-holes away from the liquid suction surface are located on the bottom surface of the first groove; the plurality of the micro-holes are distributed in an array, each Each of the first sub-slots corresponds to a row of the micro-holes, and each of the second sub-slots corresponds to a column of the micro-holes; multiple rows of the bumps and multiple rows of the micro-holes are alternately arranged, and multiple rows of the projections are arranged alternately. Blocks and columns of the microwells are alternately arranged.
The heating element according to any one of claims 1-6, wherein the heating element further comprises a heating film, the heating film is arranged on the surface of the wetting structure, and the heating film is used for heating the atomization device. The aerosol-generating substrate is used, and the heating film allows the corresponding micropores to be exposed.
The heating element according to any one of claims 3-7, wherein the heating element further comprises a heating film, the heating film comprises a first part, a second part, a third part and a fourth part, the first part The second part is located on the side wall and bottom wall of the first sub-tank, the third part is located on the side wall and bottom wall of the second sub-tank, and the third part is located on the side of the bump away from the suction surface. On the end face, the fourth part extends to the hole wall of the corresponding micro hole.
The heating element according to claim 2, wherein the width of the first groove is 1 μm-100 μm.
The heating element according to claim 2, wherein the width of the first groove is less than or equal to 1.2 times the diameter of the micropore.
The heating element according to claim 2, wherein the depth of the first groove is 1 μm-200 μm.
The heating element according to claim 11, wherein the depth of the first groove is 1 μm-50 μm.
The heating element according to claim 1, wherein the plurality of micro-holes are arranged in an array, including a plurality of micro-hole columns parallel to the first direction; the wetting structure comprises a plurality of first sub-grooves, the The extending direction of the first sub-groove is parallel to the first direction and corresponds to at least one micro-hole row parallel to the first direction.
The heating element according to claim 13, wherein the plurality of micropores comprises a plurality of micropore rows parallel to the second direction, the wetting structure comprises a plurality of second sub-grooves, the second sub-grooves Its extension direction is parallel to the second direction and corresponds to at least one micropore row parallel to the second direction, wherein the plurality of first sub-slots and the plurality of second sub-slots are cross-connected to form a network structure.
The heating element according to claim 7, wherein the heating element further comprises a positive electrode and a negative electrode, and two ends of the heating film are respectively electrically connected to the positive electrode and the negative electrode; the first direction is along the direction of the positive electrode approaching the negative electrode.
The heating element according to claim 7, wherein the surface of the heating film has a lipophilic structure and/or the surface of the heating film far from the dense substrate has a frosted structure or a sandblasted structure.
The heating element according to claim 7, wherein the thickness of the heating film is 200nm-5μm; the material of the heating film is aluminum or its alloy, copper or its alloy, silver or its alloy, nickel or its alloy, Chromium or its alloys, platinum or its alloys, titanium or its alloys, zirconium or its alloys, palladium or its alloys, iron or its alloys, gold or its alloys, molybdenum or its alloys, niobium or its alloys, tantalum or its alloys one or more of.
The heating element according to claim 7, wherein the thickness of the heating film is 200 nm-10 μm; the material of the heating film is one or more of stainless steel, nickel-chromium-iron alloy, and nickel-based corrosion-resistant alloy.
The heating element according to claim 1, wherein the atomized surface has a frosted structure or a sandblasted structure to form the wetting structure.
The heating element according to claim 1, wherein the liquid absorbing surface has a frosted structure or a sandblasted structure.
The heating element according to claim 1, wherein the liquid absorbing surface has a second concave-convex structure, the second concave-convex structure has a plurality of second grooves, and the second grooves are connected to the microporous liquid conducting Connected.
The heating element according to claim 1, wherein the material of the dense matrix is quartz, glass or dense ceramic, and the micropores are ordered.
The heating element according to claim 1, wherein the micro-holes are straight through holes, and the axes of the micro-holes are perpendicular to the dense matrix.
The heating element according to claim 1, further comprising a liquid-conducting member, the liquid-conducting member and the liquid-absorbing surface of the dense base are spaced apart to form a gap; or, the liquid-conducting member and the dense base are suction surface contact.
The heating element according to claim 24, wherein the liquid-conducting member is a porous ceramic or a cotton wick; or, the liquid-conducting member is made of dense material, and the liquid-conducting member is provided with a plurality of through holes.
The heating element according to claim 1, wherein a plurality of transverse holes are further provided in the dense matrix, and the plurality of transverse holes communicate with the plurality of the micropores; wherein, the axis of the transverse hole is connected to the The axes of the micropores intersect.
An atomizer comprising:

a liquid storage chamber for storing the aerosol-generating substrate;

A heating element, the heating element is in fluid communication with the liquid storage chamber; the heating element is the heating element according to any one of claims 1-26.
An electronic atomization device, comprising:

Atomizer, the atomizer is the atomizer of claim 27;

The host is used to provide electrical energy for the work of the atomizer.