CN114794567A

CN114794567A - Heating element, atomization component and electronic atomization device

Info

Publication number: CN114794567A
Application number: CN202110758774.0A
Authority: CN
Inventors: 吕铭; 段银祥; 朱明达; 熊玉明
Original assignee: Shenzhen Smoore Technology Ltd
Current assignee: Shenzhen Smoore Technology Ltd
Priority date: 2021-07-05
Filing date: 2021-07-05
Publication date: 2022-07-29

Abstract

The application provides a heating element, an atomization component and an electronic atomization device, wherein the heating element comprises a compact substrate and a heating film; the dense matrix comprises a first surface and a second surface opposite to the first surface; the dense substrate is provided with a plurality of micropores, the micropores being through holes, the micropores being for guiding the aerosol-generating substrate to the first surface; a heat-generating film formed on the first surface; wherein the ratio of the thickness of the dense matrix to the pore diameter of the micropores is 20:1-3: 1. Through the arrangement, the porosity of the heating body can be accurately controlled, and the consistency of products is improved; and the heating body can realize sufficient liquid supply and prevent liquid leakage in the work process.

Description

Heating element, atomization component and electronic atomization device

Technical Field

The invention relates to the technical field of atomizers, in particular to a heating body, an atomizing assembly and an electronic atomizing device.

Background

The typical electronic atomization device is composed of a heating element, a battery, a control circuit and the like, wherein the heating element is used as a core element of the electronic atomization device, and the characteristics of the heating element determine the atomization effect and the use experience of the electronic atomization device.

The existing heating elements mainly comprise cotton core heating elements and ceramic heating elements. The cotton core heating body is mostly in a structure that a spring-shaped metal heating wire is wound on a cotton rope or a fiber rope; the liquid aerosol generating substrate to be atomized is sucked by two ends of the cotton rope and then is transmitted to the central metal heating wire for heating and atomization. The ceramic heating body mostly forms a heating film on the surface of the porous ceramic body, and the porous ceramic body plays the roles of liquid guiding and liquid storage.

With the progress of the technology, the requirement of the user on the atomization effect of the electronic atomization device is higher and higher, and in order to meet the requirement of the user, a heating body with a better atomization effect needs to be provided.

Disclosure of Invention

In view of this, the present application provides a heating element, an atomizing component and an electronic atomizing device to solve the technical problem of how to satisfy the requirement of the user on the atomizing effect in the prior art.

In order to solve the above technical problem, a first technical solution provided by the present application is: providing a heating body, which comprises a compact substrate and a heating film; the dense matrix comprises a first surface and a second surface opposite the first surface; the dense substrate having pores, which are through holes, disposed thereon for guiding the aerosol-generating substrate to the first surface; the heat-generating film is formed on the first surface; the resistance of the heating film at normal temperature is 0.5-2 ohm; the thickness of the heating film is 200 nanometers to 5 micrometers; the heating film is made of aluminum and alloy thereof, and gold and alloy thereof.

Wherein, a plurality of the micropores are arranged in an array.

Wherein the shape and pore size of a plurality of micropores are the same; the micropores are arranged in a rectangular array.

The heating element comprises a first aperture micropore array area and a second aperture micropore array area, and the aperture of the micropores in the second aperture micropore array area is different from that of the micropores in the first aperture micropore array area.

Wherein the first surface and the second surface each comprise a smooth surface; the first surface is a plane; the micropore is a through hole vertically penetrating through the first surface and the second surface, and the cross section of the micropore is circular.

Wherein the first surface and the second surface are both planar and arranged in parallel.

Wherein the dense matrix is glass or dense ceramic.

Wherein the dense matrix is glass, and the glass is borosilicate glass, quartz glass or photosensitive lithium aluminosilicate glass.

Wherein the ratio of the thickness of the dense matrix to the micropores is 15:1 to 5: 1.

Wherein the ratio of the hole center distance between two adjacent micropores to the pore diameter of the micropores is 3:1-1.5: 1.

Wherein the ratio of the hole center distance between two adjacent micropores to the pore diameter of the micropores is 3:1-2.5: 1.

Wherein the thickness of the dense matrix is 0.1 mm-1 mm.

Wherein the thickness of the dense matrix is 0.2 mm-0.5 mm.

Wherein the pore diameter of the micropores is 1-100 micrometers.

Wherein the pore diameter of the micropores is 20-50 microns.

Wherein, the longitudinal section of the through hole is rectangular or dumbbell-shaped.

Wherein the micropores penetrate through the heat-generating film.

The material of the heating film is silver, copper, aluminum, gold or alloy thereof, the thickness of the heating film is 200 nanometers-5 micrometers, the resistance of the heating film is 0.5 ohm-2 ohm, and the resistivity of the heating film is not more than 0.06 x 10 ^-6 Ω·m。

Wherein the heating film is made of one of nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum and titanium; the thickness of the heating film is 5-100 microns.

Wherein, the heating film is in a sheet shape, a grid shape and a strip shape.

The protective film is arranged on the surface of the heating film, which is far away from the compact matrix; the protective film is made of one of stainless steel, nickel-chromium-iron alloy and nickel-based corrosion-resistant alloy.

In order to solve the above technical problem, a second technical solution provided by the present application is: there is provided an atomizing assembly comprising: a liquid storage cavity and a heating element; the reservoir chamber is for storing a liquid aerosol-generating substrate; the heating element is any one of the heating elements described above; the micropore is communicated with the liquid storage cavity.

The heating element comprises a heating element body, and is characterized by further comprising a loose matrix, wherein the loose matrix is arranged on the second surface of the dense matrix of the heating element body.

Wherein the loose matrix is a porous ceramic, sponge, foam or fiber layer.

In order to solve the above technical problem, a second technical solution provided by the present application is: the utility model provides an electronic atomization device, includes atomization component and power supply module, atomization component is above-mentioned arbitrary one atomization component, power supply module with the heat-generating body electricity is connected.

The power supply assembly comprises a battery, the voltage range of the battery is 2.5-4.4 volts, and the power range of the electronic atomization device is 6-8.5 watts.

The beneficial effect of this application: different from the prior art, the heating body in the application comprises a compact substrate and a heating film; the dense matrix comprises a first surface and a second surface opposite to the first surface; the dense substrate is provided with a plurality of micropores, the micropores being through holes, the micropores being for guiding the aerosol-generating substrate to the first surface; a heat-generating film formed on the first surface; wherein the ratio of the thickness of the dense matrix to the pore diameter of the micropores is 20:1-3: 1. Through the arrangement, the porosity of the heating body can be accurately controlled, and the consistency of products is improved; and the heating body can realize sufficient liquid supply and prevent liquid leakage in the work process.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an electronic atomizer provided herein;

FIG. 2 is a schematic structural view of an atomizing assembly provided herein;

FIG. 3 is a schematic view of a structure of a heat-generating body provided in the present application;

FIG. 4 is a schematic view showing the structure of a dense matrix in the heat-generating body provided in FIG. 3;

FIG. 5a is a schematic structural view of a first embodiment of micropores in the dense matrix provided in FIG. 3;

FIG. 5b is a schematic structural view of a second embodiment of micropores in the dense matrix provided in FIG. 3;

FIG. 5c is a schematic structural view of a third embodiment of micropores in the dense matrix provided in FIG. 3;

FIG. 5d is a schematic representation of the structure of a fourth embodiment of micropores in the dense matrix provided in FIG. 3;

FIG. 6a is a schematic top view of the first embodiment of the dense matrix provided in FIG. 3;

FIG. 6b is a schematic top view of a second embodiment of the dense matrix provided in FIG. 3;

FIG. 7 is a schematic flow chart of the process for making the dense matrix provided in FIG. 6 b;

FIG. 8a is a schematic top view of step S1 in FIG. 7;

FIG. 8b is a schematic side view of step S1 in FIG. 7;

fig. 8c is a schematic top view illustrating step S2 in fig. 7;

FIG. 8d is a schematic side view of step S2 in FIG. 7;

FIG. 9a is a schematic top view showing a structure of a heat generating film of a heating element according to the present invention, the heat generating film being a thick film;

FIG. 9b is a schematic top view of the heating element shown in FIG. 3;

FIG. 10 is a schematic view of a heat generating body provided by the present application including a protective film and the heat generating film being a thin film;

FIG. 11 is a schematic view of a heat generating body provided by the present application in a plan view of a structure in which the heat generating film includes a protective film and the heat generating film is a thick film;

FIG. 12 is a schematic illustration of a partial structure of an atomizing assembly provided herein that includes a loose matrix;

FIG. 13 is an SEM image of an embodiment of a heater film provided by the present application;

FIG. 14 is a graph comparing the amount of atomized aerosol of the heating element of the present application with that of a conventional porous ceramic heating element;

FIG. 15 is a diagram showing a failure of a heat generating film in the heat generating body provided by the present application;

FIG. 16 is an SEM image and an EDS image of the heat generating film failure map provided in FIG. 15;

FIG. 17 is a graph showing a relationship between a lifetime of a heat generating film and a thickness of a protective film in a heat generating body provided by the present application;

FIG. 18 is a schematic view of a heat-generating body wet combustion test provided in the present application;

FIG. 19 is a graph showing a relationship between a dense matrix thickness/micropore diameter and an atomizing amount of a heat-generating body provided by the present application;

FIG. 20 is a graph showing the relationship between the atomizing temperature and the heating power of the conventional porous ceramic heat-generating body;

FIG. 21 is a graph showing the relationship between the atomizing temperature and the heating power of the heating element according to the present application;

FIG. 22 is a graph showing the relationship between the atomizing temperature and the pumping time of the heating element provided in the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic atomization device provided in the present application.

The electronic atomization device can be used for atomization of liquid substrates. The electronic atomizer comprises an atomizer assembly 1 and a power supply assembly 2 connected to each other. The atomizing assembly 1 is used for storing a liquid aerosol-generating substrate and atomizing the aerosol-generating substrate to form an aerosol for a user to inhale, and the liquid aerosol-generating substrate can be liquid substrates such as liquid medicine, plant leaf liquid and the like; the atomizing assembly 1 is particularly useful in different fields, such as medical treatment, electronic aerosolization, and the like. The power supply module 2 includes a battery (not shown), an airflow sensor (not shown), a controller (not shown), and the like; the battery is used for supplying power to the atomizing assembly 1 so that the atomizing assembly 1 can atomize a substrate to be atomized to form aerosol; the airflow sensor is used for detecting airflow changes in the electronic atomization device, and the controller starts the electronic atomization device according to the airflow changes detected by the airflow sensor. The atomization assembly 1 and the power supply assembly 2 can be integrally arranged or detachably connected and designed according to specific requirements.

Referring to fig. 2, fig. 2 is a schematic structural diagram of an atomizing assembly provided in the present application.

The atomization component 1 comprises a liquid storage cavity 10, a heating body 11, a suction nozzle 12 and an atomization channel 13. The liquid storage chamber 10 is used for storing a liquid aerosol generating substrate, and the heating element 11 is used for atomizing the aerosol generating substrate in the liquid storage chamber 10. In the present embodiment, a lower liquid channel 14 is formed between the liquid storage chamber 10 and the heating element 11 to guide the liquid in the liquid storage chamber 10 to the heating element 11; in another embodiment, the heat-generating body 11 may be directly exposed to the liquid storage chamber 10 to atomize the liquid in the liquid storage chamber 10. The atomized aerosol of the heating body 11 reaches the suction nozzle 12 through the fog outlet channel 13 and is sucked by the user. Wherein the heating element 11 is electrically connected to the power supply module 2 to atomize the aerosol to generate the substrate.

At present, the heating element 11 is commonly used with a cotton core heating element and a porous ceramic heating element. The cotton core heating body is mostly in a structure that a spring-shaped metal heating wire is wound by a cotton rope or a fiber rope; the spring-shaped metal heating wire needs to play a role of structural support in the cotton core heating body structure, and in order to achieve sufficient strength, the diameter of the metal heating wire is usually hundreds of micrometers; the liquid aerosol generating substrate to be atomized is sucked by two ends of the cotton rope or the fiber rope and then is transmitted to the central metal heating wire to be heated and atomized. One structure of the porous ceramic heating element is a metal heating wire with a spring shape embedded in a cylindrical porous ceramic body; the porous ceramic body plays the roles of guiding and storing liquid. The other structure of the porous ceramic heating body is that metal thick film slurry is printed on a porous ceramic body, and then a metal lead is formed on the porous ceramic body after high-temperature sintering; since the pore size distribution of the porous ceramic surface varies from 1 micron to 100 microns, resulting in a high roughness of the porous ceramic surface, the thickness of the metal film wire is usually over 100 microns in order to form a continuous and stable metal film wire.

The porous ceramic heating body is more and more popular in the market due to higher temperature stability and relative safety. The common structure of the porous ceramic heating element is that a metal thick film lead is printed on the surface of the porous ceramic. The material of the metal thick film wire of the existing electronic atomization device is generally selected from high-resistivity nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy and the like. When the liquid aerosol generating substrate is repeatedly heated by the metal thick film wire, heavy metal ions such as nickel and chromium exceed standards are often detected in the aerosol, and the accumulation of the heavy metal ions can damage human organs such as lungs, livers, kidneys and the like, so that huge potential safety hazards can be brought to users.

In addition, for the above structure of the cotton core heating element and the porous ceramic heating element, when the power is on, the metal heating wire or the metal thick film wire is heated, and the heat is conducted to the liquid in the cotton rope or the porous ceramic body, so that the liquid is heated and atomized. Because the metal heating wire or the metal thick film wire is a compact entity, when the power supply is switched on, the metal heating wire or the metal thick film wire needs to be preferentially heated, only the liquid near the metal heating wire or the metal thick film wire is directly heated by the metal heating wire or the metal thick film wire, and the liquid at a far distance needs to be heated and atomized by the heat conducted by the cotton rope or the porous ceramic body. The energy provided by the battery requires heating of a metal heater or metal thick film wire and also heating of the entire liquid transport medium, which has the disadvantage of inefficient atomization.

The power of the existing electronic atomization device does not exceed 10 watts, the power is usually 6 watts to 8.5 watts, and the voltage range of a battery adopted by the existing electronic atomization device is 2.5 volts to 4.4 volts. For a closed electronic atomizer (an atomizer that does not require the user to inject the substrate to be atomized) a battery voltage in the range of 3 volts to 4.4 volts is used.

The inventor of the application discovers that the liquid guiding substrate made of glass and other dense materials can deposit a continuous and stable metal heating film on the surface of the liquid guiding substrate in a physical vapor deposition or chemical vapor deposition mode due to the smooth surface of the liquid guiding substrate, and the thickness of the metal heating film is within the range of several micrometers or nanometer. This not only makes the heat-generating body 11 compact, but also saves the heat-generating film material.

However, the inventor of the present application finds that compared with the existing cotton core heating element and porous ceramic heating element, the liquid guide substrate made of dense materials such as glass has shorter liquid supply channel, faster liquid supply speed and larger liquid leakage risk liquid. Therefore, the heating element 11 is prepared by adopting the liquid guiding substrate made of dense materials such as glass and the like, and the atomizing assembly 1 is often required to be designed with higher sealing performance, so that the preparation difficulty and the cost of the atomizing assembly 1 are increased, and even if structures such as a liquid storage tank and the like are designed in the atomizing assembly 1 to collect leaked liquid and prevent the leaked liquid from flowing out of the atomizing assembly 1, the utilization rate of aerosol generating substrates is lower.

Further, the inventors of the present application have found that, since the resistivity of the conventional materials such as nickel-chromium alloy, nickel-chromium-iron alloy, and iron-chromium-aluminum alloy is high, the resistance of the heat generating film is significantly increased by reducing the thickness of the heat generating film to several micrometers or less in the same shape. For example, the thickness of the heating film is reduced from 100 micrometers to 10 micrometers, and the resistance is increased by 10 times; if the power of the heating body 11 is to be kept constant, the voltage of the battery needs to be increased, which leads to an increase in the cost of the electronic atomization device; in addition, the voltage of the battery of the power supply module 2 of the conventional electronic atomizer cannot be matched with the voltage of the heating element 11, which causes inconvenience to consumers.

In view of the problems of the conventional heat generating body, the present application provides a heat generating body 11 to solve the above problems, and the structure of the heat generating body 11 of the present application will be described in detail below.

Referring to fig. 3 and 4, fig. 3 is a schematic structural view of a heating element provided in the present application, and fig. 4 is a schematic structural view of a dense matrix in the heating element provided in fig. 3.

The heat-generating body 11 includes a dense base 111 and a heat-generating film 112. The dense substrate 111 includes a first surface 1111 and a second surface 1112 opposite to the first surface 1111; the dense substrate 111 is provided with a plurality of micro-pores 113, the micro-pores 113 being through-holes, the micro-pores 113 being for guiding the aerosol-generating substrate to the first surface 1111. The micropores 113 have a capillary action. The heat generating film 112 is formed on the first surface 1111; the resistance of the heat generating film 112 at normal temperature is 0.5 ohm-2 ohm, wherein the normal temperature is 25 ℃. It is understood that the dense substrate 111 serves as a structural support, and the heat generating film 112 in the heat generating body 11 is electrically connected to the power module 2. When the power of the electronic atomization device is 6-8.5 watts and the voltage range of the battery is 2.5-4.4 volts, in order to achieve the working resistance of the battery, the resistance range of the heating film 112 of the heating body 11 at normal temperature is 0.5-2 ohms.

This application is through setting up a plurality of micropores 113 that have capillary force on dense matrix 111 for the size of the porosity of heat-generating body 11 can accurate control, promotes the uniformity of product. That is, in mass production, the porosity of the dense substrate 111 in the heating element 11 is substantially uniform, and the thickness of the heating film 112 formed on the dense substrate 111 is uniform, so that the atomization effects of the electronic atomization devices shipped from the same batch are uniform.

The aerosol generating substrate in the liquid storage cavity 10 reaches the dense substrate 111 of the heating element 11 through the lower liquid channel 14, and is guided to the first surface 1111 of the dense substrate 111 by using the capillary force of the micropores 113 on the dense substrate 111, so that the aerosol generating substrate is atomized by the heating film 112; that is, the micro hole 113 communicates with the reservoir chamber 10 through the lower fluid passage 14. Wherein, the material of the dense substrate 111 can be glass or dense ceramic; when the dense substrate 111 is glass, it may be one of ordinary glass, quartz glass, borosilicate glass, or photosensitive lithium aluminosilicate glass.

Compared with the existing cotton core heating element and porous ceramic heating element, the liquid supply channel of the heating element 11 with the microporous sheet structure is shorter, the liquid supply speed is higher, and the liquid leakage risk liquid is larger. Therefore, the inventors of the present application studied the influence of the ratio of the thickness of the dense matrix 111 to the pore diameter of the micro-pores 113 on the liquid conductance of the heating element 11, and as a result, found that increasing the thickness of the dense matrix 111 and decreasing the pore diameter of the micro-pores 113 can reduce the risk of liquid leakage but also decrease the liquid supply rate, and that decreasing the thickness of the dense matrix 111 and increasing the pore diameter of the micro-pores 113 can increase the liquid supply rate but also increase the risk of liquid leakage, which are contradictory to each other. Therefore, the thickness of the compact substrate 111, the aperture of the micropores 113 and the proportion of the thickness of the compact substrate 111 to the aperture of the micropores 113 are designed, so that the heating element 11 can realize sufficient liquid supply and prevent liquid leakage when the power is 6-8.5 watts and the voltage is 2.5-4.4 volts. The thickness of the dense substrate 111 is the distance between the first surface 1111 and the second surface 1112.

In addition, the present inventors studied the ratio of the hole center distance of the adjacent micropores 113 to the pore diameter of the micropores 113, and found that if the ratio of the hole center distance of the adjacent micropores 113 to the pore diameter of the micropores 113 is too large, the strength of the dense matrix 111 is large and the dense matrix is easy to process, but the porosity is too small, which easily results in insufficient liquid supply amount; if the ratio of the hole center distance of the adjacent micropores 113 to the pore diameter of the micropores 113 is too small, the porosity is large, the liquid supply amount is sufficient, but the strength of the dense matrix 111 is small and the dense matrix is not easy to process; therefore, the ratio of the hole center distance of the adjacent micro holes 113 to the pore diameter of the micro holes 113 is designed, and the strength of the compact matrix 111 is improved as much as possible on the premise of meeting the liquid supply capacity.

The material of the dense substrate 111 is described below as glass.

Specifically, the first surface 1111 and the second surface 1112 each include a smooth surface, and the first surface 1111 is a plane surface. That is, the first surface 1111 of the dense substrate 111 is a smooth surface and is a plane, the heat generating film 112 is formed on the first surface 1111, and the smooth surface of the first surface 1111 is beneficial to deposition of a metal material into a film with a small thickness.

In one embodiment, both the first surface 1111 and the second surface 1112 of the dense substrate 111 are smooth surfaces, both are planar, and the first surface 1111 and the second surface 1112 of the dense substrate 111 are arranged in parallel; the micro-hole 113 penetrates through the first surface 1111 and the second surface 1112, the axis of the micro-hole 113 is perpendicular to the first surface 1111 and the second surface 1112, and the cross section of the micro-hole 113 is circular; at this time, the thickness of the dense matrix 111 is equal to the length of the micro-holes 113. It can be understood that the second surface 1112 is parallel to the first surface 1111, and the micro-pores 113 penetrate from the first surface 1111 to the second surface 1112, so that the production process of the dense substrate 111 is simple and the cost is reduced. The thickness of dense substrate 111 is the distance between first surface 1111 and second surface 1112. The micropores 113 may be straight-through pores having uniform pore diameters, or may be straight-through pores having non-uniform pore diameters, as long as the pore diameter variation range is within 50%. For example, due to the limitation of the manufacturing process, the micro-holes 113 formed in the glass by laser induction and etching are generally large at both ends and small in the middle. Therefore, it is sufficient to ensure that the pore diameter of the middle portion of the micro-pore 113 is not less than half of the pore diameters of the both end ports.

In another embodiment, the first surface 1111 of the dense substrate 111 is smooth and planar to facilitate deposition of a metal material into a film with a small thickness. The second surface 1112 of the dense substrate 111 is a smooth surface, and the second surface 1112 may be a non-planar surface, such as a bevel, an arc, a sawtooth surface, etc., and the second surface 1112 may be designed according to specific needs by only making the micro-holes 113 penetrate the first surface 1111 and the second surface 1112.

The following description will be made by taking the material of the dense substrate 111 as glass, and when the first surface 1111 and the second surface 1112 of the dense substrate 111 are both smooth planes and are arranged in parallel, the thickness of the dense substrate 111, the ratio of the thickness of the dense substrate 111 to the pore diameter of the micro-pores 113, and the ratio of the center distance between two adjacent micro-pores 113 to the pore diameter of the micro-pores 113 will be described.

The dense matrix 111 has a thickness of 0.1 mm to 1 mm. When the thickness of the dense matrix 111 is more than 1 mm, the liquid supply requirement cannot be met, so that the aerosol quantity is reduced, the heat loss is large, and the cost for arranging the micropores 113 is high; when the thickness of the dense substrate 111 is less than 0.1 mm, the strength of the dense substrate 111 cannot be ensured, which is not beneficial to improving the performance of the electronic atomization device. Preferably, the thickness of dense matrix 111 is 0.2mm to 0.5 mm. The pore size of the micropores 113 on the dense substrate 111 is 1 micron to 100 microns. When the aperture of the micropores 113 is smaller than 1 micron, the liquid supply requirement cannot be met, so that the aerosol quantity is reduced; when the pore diameter of the micropores 113 is greater than 100 microns, the aerosol-generating substrate tends to flow out of the micropores 113 to the first surface 1111 causing leakage, resulting in a decrease in atomisation efficiency. Preferably, the pore size of the micropores 113 is 20 micrometers to 50 micrometers. It is understood that the thickness of the dense matrix 111 and the pore size of the micropores 113 are selected according to actual needs.

The ratio of the thickness of the dense matrix 111 to the pore diameter of the micropores 113 is 20:1-3: 1; preferably, the ratio of the thickness of the dense matrix 111 to the pore diameter of the micro-pores 113 is 15:1-5:1 (see fig. 19, experiments show that the ratio of the thickness of the dense matrix 111 to the pore diameter of the micro-pores 113 is 15:1-5:1, and the atomization effect is better). When the ratio of the thickness of the dense substrate 111 to the pore diameter of the micropores 113 is greater than 20:1, the aerosol-generating substrate supplied by the capillary force of the micropores 113 is difficult to satisfy the atomization demand of the heating element 11, not only dry burning is easily caused, but also the amount of aerosol generated by single atomization is reduced; when the ratio of the thickness of the dense substrate 111 to the pore diameter of the micropores 113 is less than 3:1, the aerosol-generating substrate easily flows out from within the micropores 113 to the first surface 1111, the aerosol-generating substrate is wasted, resulting in a decrease in atomization efficiency, and thus a decrease in the total aerosol amount.

The ratio of the center distance between two adjacent micropores 113 to the aperture of the micropores 113 is 3:1-1.5:1, so that the strength of the dense matrix 111 is improved as much as possible on the premise that the micropores 113 on the dense matrix 111 meet the liquid supply capacity; preferably, the ratio of the hole center distance between two adjacent micro holes 113 to the hole diameter of the micro hole 113 is 3:1-2: 1; more preferably, the ratio of the center-to-center distance between two adjacent micro-holes 113 to the pore diameter of the micro-hole 113 is 3:1 to 2.5: 1.

In one embodiment, it is preferable that the ratio of the thickness of the dense matrix 111 to the pore diameter of the micro-pores 113 is 15:1 to 5:1, and the ratio of the center-to-center distance between two adjacent micro-pores 113 to the pore diameter of the micro-pores 113 is 3:1 to 2.5: 1.

Referring to fig. 5a, 5b, 5c and 5d, fig. 5a is a schematic structural diagram of a first embodiment of micropores in the dense matrix provided in fig. 3, fig. 5b is a schematic structural diagram of a second embodiment of micropores in the dense matrix provided in fig. 3, fig. 5c is a schematic structural diagram of a third embodiment of micropores in the dense matrix provided in fig. 3, and fig. 5d is a schematic structural diagram of a fourth embodiment of micropores in the dense matrix provided in fig. 3.

In other embodiments, the micro-holes 113 may have other structures, as shown in fig. 5a, 5b, 5c, and 5 d. The micropores 113 extend in a direction perpendicular to the thickness direction of the dense substrate 111. Specifically, the longitudinal section of the micro-hole 113 may be rectangular (as shown in fig. 5 a), trapezoidal (as shown in fig. 5 b), dumbbell-shaped with two large ends and a small middle (as shown in fig. 5 c), and the like. In another embodiment, the extension direction of the micro-pores 113 forms an angle with the thickness direction of the dense matrix 111, the angle being in the range of 80 degrees to 90 degrees; when the longitudinal section of the micro-hole 113 is rectangular, the structure is shown in fig. 5 d. Because the micropores 113 are arranged in a regular geometric shape, the volume of the micropores 113 in the heating element 11 can be calculated, so that the porosity of the whole heating element 11 can be calculated, and the consistency of the porosities of the heating elements 11 of the same kind of products can be well ensured.

Referring to fig. 6a and 6b, fig. 6a is a schematic top view of a first embodiment of the dense matrix shown in fig. 3, and fig. 6b is a schematic top view of a second embodiment of the dense matrix shown in fig. 3.

Specifically, the dense substrate 111 has a regular shape, such as a rectangular plate shape, a circular plate shape, or the like. In the present embodiment, the plurality of micropores 113 disposed on the dense substrate 111 are arranged in an array; that is, the plurality of micro holes 113 disposed on the dense substrate 111 are regularly arranged, and the center distances between the adjacent micro holes 113 among the plurality of micro holes 113 are the same. Optionally, the plurality of micro-wells 113 are arranged in a rectangular array; or a plurality of micro-wells 113 arranged in a circular array; or a plurality of micro-wells 113 arranged in a hexagonal array. The pore diameters of the plurality of micropores 113 may be the same or different, and are designed as necessary.

In one embodiment, the dense substrate 111 has a rectangular plate shape, and the plurality of micropores 113 disposed on the dense substrate 111 have the same shape and pore size and are arranged in a rectangular array, as shown in fig. 6 a.

In another embodiment, the dense substrate 111 has a rectangular plate shape, the first surface 1111 of the dense substrate 111 includes a first pore size micropore array region 1113 and a second pore size micropore array region 1114, the pore size of the micropores 113 of the second pore size micropore array region 1114 is different from the pore size of the micropores 113 of the first pore size micropore array region 1113, and the shape of the micropores 113 of the second pore size micropore array region 1114 is the same as the shape of the micropores 113 of the first pore size micropore array region 1113; the microwells 113 of the second aperture microwell array region 1114 and the microwells 113 of the first aperture microwell array region 1113 are arranged in a rectangular array; the first aperture microwell array region 1113 is located on both sides of the second aperture microwell array region 1114, and the pore size of the microwells 113 of the second aperture microwell array region 1114 is smaller than the pore size of the microwells 113 of the first aperture microwell array region 1113, as shown in fig. 6 b. It is understood that the second aperture microwell array region 1114 may be located on both sides of the first aperture microwell array region 1113, the pore diameter of the microwell 113 of the second aperture microwell array region 1114 may be smaller than the pore diameter of the microwell 113 of the first aperture microwell array region 1113, and the first aperture microwell array region 1113, the second aperture microwell array region 1114 and the microwells 113 disposed therein may be designed as desired.

In other embodiments, the axis of the micro-hole 113 is not perpendicular to the first surface 1111 and the second surface 1112. One end of the micro via 113 is open at the first surface 1111, and the other end of the micro via 113 is open at a third surface (not shown) connecting the first surface 1111 and the second surface 1112; alternatively, the other end of the micro-hole 113 is open at the second surface 1112, and the micro-hole 113 extends in a curve; the structure of the micro-pores 113 may be designed as desired to enable the capillary force to be utilised to direct the aerosol-generating substrate to the first surface 1111.

Referring to FIG. 7, FIG. 7 is a schematic flow chart of the process for fabricating the dense substrate shown in FIG. 6 b. FIG. 8a is a schematic top view of step S1 in FIG. 7; FIG. 8b is a schematic side view of step S1 in FIG. 7; FIG. 8c is a schematic top view of step S2 in FIG. 7; fig. 8d is a side view of step S2 in fig. 7.

In one embodiment, the dense substrate is glass, referred to as a liquid-conducting glass substrate, and the liquid-conducting glass substrate is produced by a method comprising the steps of:

and step S1, performing first laser induction and corrosion on the substrate to be processed to form a prefabricated hole of the first micropore.

Specifically, referring to fig. 8a-8b, a substrate 111a to be processed is provided, the substrate 111a to be processed includes a first surface 1111a and a second surface 1111b opposite to the first surface 1111a, the substrate 111a to be processed is subjected to a first laser induction, and the substrate 111a to be processed after the first laser induction is immersed in an etching solution to form a preformed hole of the first micro-hole 113 a. The prepared hole of the first micro-hole 113a has a prepared hole diameter, and the prepared hole penetrates the first surface 1111a and the second surface 1111 b.

A first micro-hole array 113c including a plurality of pre-fabricated holes having a pre-fabricated hole diameter is formed on the substrate to be processed 111a, via step S1.

Step S2: and carrying out second laser induction and corrosion on the substrate to be processed to form a second micropore, wherein the second micropore has a second aperture, and the process of carrying out second corrosion on the substrate to be processed enables the prefabricated hole of the first micropore to be enlarged from the prefabricated aperture to the first aperture.

Specifically, referring to fig. 8c to 8d, performing a second laser induction on the substrate to be processed 111a according to a second aperture, immersing the substrate to be processed 111a after the second laser induction in an etching solution to form a second micro-hole 113b, where the second micro-hole 113b has the second aperture, and performing a second etching process on the substrate to be processed 111a expands the prefabricated hole of the first micro-hole 113a from the prefabricated aperture to the first aperture, and the first micro-hole 113a penetrates through the first surface 1111a and the second surface 1111b, so as to obtain the liquid guiding glass substrate 116 with the liquid guiding micro-holes 113 having different apertures.

Through step S2, a second microwell array 113d including a plurality of second microwells 113b having a second pore size and a first microwell array 113c including a plurality of first microwells 113a having a first pore size are formed on the liquid guide glass substrate 116.

In one embodiment, in order to control the pore size of the first and second micro-pores 113a and 113b, the method of manufacturing the dense matrix includes:

and S11, performing laser induction on the substrate to be processed according to the distribution of the first micropores with the third pore diameter.

Referring to fig. 8a-8b, the material of the substrate 111a to be processed is glass, the glass may be one or more of borosilicate glass, quartz glass and photosensitive lithium aluminosilicate glass, the substrate 111a to be processed includes a first surface 1111a and a second surface 1111b opposite to the first surface 1111a, and the substrate 111a to be processed is subjected to a first irradiation with an infrared picosecond or femtosecond laser having a frequency of 100kHz to 200kHz and a pulse width of less than 10 picoseconds according to a first aperture. In this step, the material of the substrate 111a to be processed within the first aperture range is induced by the laser, and can be removed in the subsequent etching process.

And S12, performing first etching on the substrate subjected to the first laser induction, wherein the etching time is the total etching time (N) required by the first micropore with the first aperture minus the etching time (M) required by the second micropore with the second aperture.

Specifically, the to-be-processed substrate 111a after the first laser induction is immersed in an etching solution at a temperature of 30 ℃ to 60 ℃, the etching solution may be an acidic etching solution hydrofluoric acid solution or an alkaline etching solution sodium hydroxide solution, and the etching speed of the to-be-processed substrate passing through the laser-modified portion is tens of times greater than that of the to-be-processed substrate passing through the unmodified portion, so that a preformed hole having a preformed hole diameter is formed in the to-be-processed substrate 111a, and the preformed hole penetrates through the first surface 1111a and the second surface 1111 b.

Specifically, before preparation, it is determined through experiments that it takes N minutes to etch the first micropores 113a with the first pore size, and it takes M minutes to etch the second micropores 113b with the second pore size, so in this step, the first etching time is N-M minutes. That is, N is a first etching time for forming the first micro-hole 113a having the first pore size, M is a second etching time for forming the second micro-hole 113b having the second pore size, and N-M is a time difference between the first etching time for forming the first micro-hole 113a having the first pore size and the second etching time for forming the second micro-hole 113b having the second pore size.

In other embodiments, the first etching of the substrate 111a to be processed adopts etching methods such as spraying, stirring, and blowing, so that the etching solution is fully exchanged and flows, and the side walls of the etched first micropores 113a are more uniform and smooth. Furthermore, the temperature of the corrosion solution is preheated to 30-60 ℃, so that the corrosion speed can be accelerated.

In a specific embodiment, a first micro-hole array 113c including a plurality of pre-fabricated holes having a pre-fabricated aperture is formed on the substrate to be processed 111a, via steps S11 and S12.

And S13, performing laser induction on the substrate to be processed according to the second aperture.

Referring to fig. 8c to 8d, the substrate to be processed 111a, which has been subjected to the first laser induction and etching, is irradiated for the second time using an infrared picosecond or femtosecond laser having a frequency of 100kHz to 200kHz and a pulse width of less than 10 picoseconds according to the second aperture. The area of the second irradiation is different from the area of the first irradiation. In this step, the material of the substrate 111a to be processed within the second aperture range is induced by the laser, and can be removed in the subsequent etching process.

And S14, carrying out second corrosion on the substrate subjected to the second laser induction for the time (M) required by the second micropore with the second aperture.

In the step, the to-be-processed substrate 111a after the second laser induction is immersed in the etching solution, and after the immersion time is M minutes, a second micro-hole 113b with a second aperture is formed on the to-be-processed substrate 111a, wherein the preformed hole is expanded from the preformed aperture to the first aperture by the process of the second etching on the to-be-processed substrate 111a, so that the first micro-hole 113a is formed. Specifically, the thickness of the substrate 111a to be processed is reduced to a certain extent after two times of soaking in the etching solution, and the first micro-hole 113a and the second micro-hole 113b penetrate through the first surface 1111a and the second surface 1111b, so that the liquid guiding glass substrate 116 with the liquid guiding micro-holes 113 having different pore diameters is obtained. It is understood that when the liquid-conducting glass substrate 116 is made of glass such as borosilicate glass, quartz glass, or photosensitive lithium aluminosilicate glass, or dense ceramic, it is the dense substrate 111.

In a specific embodiment, a second microwell array 113d including a plurality of second microwells 113b having a second pore size and a first microwell array 113c including a plurality of first microwells 113a having a first pore size are formed on the liquid guiding glass substrate 116 through steps S13 and S14.

The dense substrate 111 in the heating element 11 is a dense material, and can serve as a structural support. Compared with the spring-shaped metal heating wire of the existing cotton core heating element and the metal thick film wire of the porous ceramic heating element, the strength and the thickness of the heating film 112 in the heating element 11 are not required, and the heating film 112 can be made of metal materials with low resistivity.

In one embodiment, the heat-generating film 112 formed on the first surface 1111 of the dense substrate 111 is a thin film, and the thickness of the heat-generating film 112 is in a range of 200 nm to 5 μm, i.e., the thickness of the heat-generating film 112 is relatively thin; preferably, the thickness of the heating film 112 ranges from 200 nm to 1 μm; more preferably, the thickness of the heat generating film 112 ranges from 200 nm to 500 nm. When the heat generating film 112 is a thin film, the micro holes 113 penetrate the heat generating film 112. Further, the heat generating film 112 is also formed on the inner surface of the micro-hole 113; preferably, the heat generating film 112 is also formed on the entire inner surface of the minute hole 113 (the structure is shown in fig. 3). The arrangement of the heating film 112 on the inner surface of the micro-pores 113 allows the aerosol-generating substrate to be atomised within the micro-pores 113, which is advantageous in improving the atomisation effect.

The thinner the heating film 112 is, the smaller the influence on the aperture of the micropores 113 is, thereby realizing a better atomization effect; further, the thinner the heat generating film 112 is, the less the heat generating film 112 itself absorbs heat, the lower the electric heating loss, and the higher the temperature rise speed of the heat generating element 11. On the basis that the resistance of the heat generating film 112 at normal temperature is 0.5 ohm-2 ohm, the application adopts a metal material with low conductivity to form a thin metal film, so as to reduce the influence on the aperture of the micro-hole 113 as much as possible. Optionally, the resistivity of the heat generating film 112 is not more than 0.06 x 10 ^-6 Omega.m. The metal material of the heating film 112 with low conductivity includes silver and its alloy, copper and its alloy, aluminum and its alloy, and gold and its alloy; alternatively, the material of the heat generating film 112 may include aluminum and its alloy, gold and its alloy. When the electric heating device is electrified and heated, the heating film 112 can be rapidly heated to directly heat the aerosol generating substrate in the micropores 113, so that efficient atomization is realized.

Further, the inventor of the present application has found that, when the liquid aerosol-generating substrate contains various flavors, fragrances, additives, elements such as sulfur, phosphorus, and chlorine, silver and copper are susceptible to corrosion failure when the heating film 122 is heated by electricity. Gold is very chemically inert and a dense oxide film is formed on the surface of aluminum, both of which are very stable in a liquid aerosol-generating substrate, and is preferred as the material for the heat generating film 122.

The heat generating film 112 can be formed on the first surface 1111 of the dense substrate 111 by physical vapor deposition (e.g., magnetron sputtering, vacuum evaporation, ion plating) or chemical vapor deposition (plasma-assisted chemical deposition, laser-assisted chemical deposition, deposition of metal organic compound). It is understood that the heat generating film 112 is formed such that it does not cover the microholes 113, i.e., the microholes 113 penetrate the heat generating film 112. The heat generating film 112 is formed on the first surface 1111 of the dense substrate 111 by physical vapor deposition or chemical vapor deposition, and the heat generating film 112 is also formed on the inner surfaces of the micro-holes 113. When a magnetron sputtering mode is selected to form the heating film 112 on the first surface 1111 of the dense substrate 111, metal atoms are perpendicular to the first surface 1111 and parallel to the inner surface of the micropores 113 during magnetron sputtering, and the metal atoms are more easily deposited on the first surface 1111; assuming that the thickness of the heat generating film 112 formed by depositing metal atoms on the first surface 1111 is 1 micron, the thickness of the metal atoms deposited on the inner surface of the micro-holes 113 is much less than 1 micron, even less than 0.5 micron; the thinner the thickness of the heat generating film 112 deposited on the first surface 1111 is, the thinner the thickness of the heat generating film 112 formed on the inner surface of the micro-hole 113 is, the less the influence is exerted on the pore diameter of the micro-hole 113. Since the thickness of the heat generating film 112 is much smaller than the pore diameter of the micro-pores 113, and the thickness of the portion of the heat generating film 112 deposited in the micro-pores 113 is smaller than the thickness of the portion of the first surface 1111 of the dense substrate 111, the influence of the deposition of the heat generating film 112 in the micro-pores 113 on the pore diameter of the micro-pores 113 is negligible.

In another embodiment, the heat generating film 112 formed on the first surface 1111 of the dense substrate 111 is a thick film, and the thickness of the heat generating film 112 is in a range of 5 micrometers to 100 micrometers, preferably, 5 micrometers to 50 micrometers. On the basis that the resistance of the heating film 112 is 0.5 ohm-2 ohm, the material of the heating film 112 includes one of nichrome, iron-chromium-aluminum alloy, nickel, platinum and titanium. The heating film 112 is formed on the first surface 1111 of the dense substrate 111 by printing; since the roughness of the first surface 1111 of the dense substrate 111 is low, the thickness of the heat generating film 112 is 100 μm to form a continuous film shape. At this time, the first surface 1111 of the dense substrate 111 includes a micro-pore pattern region 1115 and a non-micro-pore pattern region 1116, and the heat generating film 112 is formed on the non-micro-pore pattern region 1116; that is, the first surface 1111 of the dense substrate 111 is provided with the heat generating film 112 without the micro-holes 113, so as to ensure the stability and consistency of the heat generating film 112. (As shown in FIG. 9a, FIG. 9a is a schematic plan view of the heat generating film of the heat generating element of the present invention having a thick film).

Referring to fig. 9b, fig. 9b is a schematic top view of the heating element shown in fig. 3.

The heating film 112 may be shaped as a sheet, a net, or a strip. The sheet shape and the strip shape of the present application mean that the length-diameter ratio of the heating film 112 is different, and the heating film having a length-diameter ratio of more than 2 can be regarded as a strip shape, and the heating film having a length-diameter ratio of less than 2 can be regarded as a sheet shape. Under the condition that the material and the thickness are the same, the resistance of the strip heating film 112 is larger than that of the sheet heating film 112. When the heating film 112 is sheet-shaped, the heating film 112 can cover the whole first surface 1111, and the temperature field formed on the first surface 1111 of the dense substrate 111 is uniform; as the aerosol-generating substrate typically comprises a plurality of components, the temperature field is uniform and does not favour the reduction of the aerosol-generating substrate. When the heating film 112 is strip-shaped, the heating film 112 only covers part of the first surface 1111, and the heating film 112 forms a temperature field with a gradient on the first surface 1111 of the dense substrate 111, and the temperature field with the gradient respectively comprises the boiling point temperatures of different components in the aerosol generating substrate, so that each component in the aerosol generating substrate can be atomized at the boiling point of the component, a good atomization effect is realized, and the reduction degree of the aerosol generating substrate is improved. When the heating film 112 is in a mesh shape, the size of the mesh determines whether the temperature field formed by the heating film 112 on the first surface 1111 of the dense substrate 111 is uniform, and the size of the mesh is designed according to the requirement; even if the grid is set to have a temperature gradient field formed by the heating film 112 on the first surface 1111 of the dense substrate 111, the atomization effect is not as good as that when the heating film 112 is in a strip shape.

In other embodiments, when the heat generating film 112 is a sheet, the heat generating film 112 may cover the entire first surface 1111, and the heat generating film 112 may form a temperature field having a gradient on the first surface 1111 of the dense substrate 111 by making the thickness of the heat generating film 112 non-uniform in different regions or making the material of the heat generating film 112 different in different regions. It can be understood that the heating film 112 is deposited by physical vapor deposition or chemical vapor deposition, and the heating film 112 with gradient thickness can be easily realized by adjusting the position relationship between the dense substrate 111 and the material source.

The heating film 112 is described as a strip, and the structure is shown in fig. 9 b. The dense substrate 111 has a rectangular plate shape, and the heating film 112 includes a heating film body 1121 and an electrode 1122. The electrodes 1122 include positive and negative electrodes. In order to achieve a better atomization effect, the heat generating film body 1121 is designed to be in an S-shaped bent strip shape so as to form a temperature field with a temperature gradient on the first surface 1111 of the dense substrate 111, that is, a high temperature region and a low temperature region are formed on the first surface 1111 of the dense substrate 111, so as to atomize multiple components in the aerosol generating substrate to the maximum extent. One end of the heating film body 1121 is connected to the positive electrode, and the other end is connected to the negative electrode. The size of the electrode 1122 is larger than that of the heating film body 1121 so that the electrode 1122 can be electrically connected to the power module 2 better. In the present embodiment, the heating film body 1121 and the electrode 1122 are integrally formed, that is, the heating film body 1121 and the electrode 1122 are made of the same material; in other embodiments, the materials of the heating film body 1121 and the electrode 1122 may be different, and may fulfill their functions.

The inventor of the present application has found that, because the strip-shaped heating film 112 has a strip-shaped slender structure and the resistance is higher than that of the sheet-shaped heating film 112 under the same condition, in order to prepare the strip-shaped heating film 112 with a thickness of nanometer, especially a thickness of 200 nm to 500 nm, the material of the heating film 112 can only be selected from aluminum, gold, silver and copper, etc. with a resistivity of not more than 0.03 x 10 ^-6 Omega · m material.

The first surface 1111 of the dense substrate 111 includes a microporous region 1117 and a non-microporous region 1118, the electrode 1122 is disposed in the non-microporous region 1118, and the heat generating film body 1121 is disposed in the microporous region 1117. Since the heating film 112 shown in fig. 9b is a thin film, part of the micro holes 113 penetrate through the heating film body 1121.

It is understood that when the pore diameters of the plurality of micropores 113 disposed on the dense substrate 111 are different, the micropore region 1117 includes a first pore diameter micropore array region 1113 and a second pore diameter micropore array region 1114, the pore diameters of the micropores 113 in the first pore diameter micropore array region 1113 are the same, the pore diameters of the micropores 113 in the second pore diameter micropore array region 1114 are the same, and the pore diameters of the micropores 113 in the first pore diameter micropore array region 1113 are different from the pore diameters of the micropores 113 in the second pore diameter micropore array region 1114, and are designed as necessary. When the heating film 112 formed on the first surface 1111 of the dense substrate 111 is a thick film, the heating film body 1121 is disposed in the microporous region 1117, and the electrode 1122 is disposed in the non-microporous region 1118; due to the process conditions for forming the thick film heating film 112, the micro-hole 113 is not provided at the position where the heating film body 1121 is provided in the micro-hole region 1117; that is, the microporous region 1117 includes a microporous pattern region 1115 and a non-microporous pattern region 1116, and the heat generating film body 1121 is disposed at the non-microporous pattern region 1116.

As described above, in order to manufacture the heat generating film 112 having a thickness of less than 5 μm, even a nano-scale, aluminum, gold, silver, and copper are preferred materials. But the heat generating film 112, which is made of silver and copper, is susceptible to corrosion and failure in the liquid aerosol-generating substrate. In addition, the heat generating film 112 made of aluminum is also at risk of failure in long-term high-power use. For this reason, the present inventors studied the protective layer of the heat generating film 112 and found that the conventional oxide and nitride protective layers, such as silicon dioxide, have too large a difference in thermal expansion coefficient from metal, and that internal stress between the layers during thermal cycling causes the protective layer to rapidly fail. Moreover, the oxide and the nitride have poor conductivity and are used as protective layers, and if the protective layers cover the heating film and the electrodes, the electrodes can be in electric contact with the lead wires or the thimble; if the electrode is not covered, the preparation process is complex. In order to solve the above problem, the present application provides that a protective film 115 is further provided on the heat generating film 112 of the heat generating body 11.

Referring to fig. 10 and 11, fig. 10 is a partial structural schematic view of a heating element provided by the present application including a protective film and the heating film being a thin film, and fig. 11 is a schematic structural schematic view of a heating element provided by the present application including a protective film and the heating film being a thick film in a plan view.

Further, the heating element 11 further includes a protective film 115. The protective film 115 is formed on the surface of the heating film 112 far away from the dense substrate 111, and the protective film 115 is made of a metal alloy resistant to corrosion of the aerosol-generating substrate, so that the heating film 112 is prevented from being corroded by the aerosol-generating substrate, the heating film 112 is protected, and the performance of the electronic atomization device is improved.

When the heating film 112 is a thin film (structure shown in fig. 10), the thickness of the heating film 112 is 200 nm-5 μm, and the resistivity of the heating film 112 is not more than 0.06 × 10 ^-6 Omega · m, the material of the heating film 112 is copper and its alloy, silver and its alloy, aluminum and its alloy, gold and its alloy, the heating film 112 is formed on the first surface 1111 of the dense substrate 111 by physical vapor deposition or chemical vapor deposition; optionally, the material of the heating film 112 is one of copper, silver, aluminum, gold, aluminum alloy, and aluminum-gold alloy. The thickness of the protective film 115 is 100-1000 nm, and the protective film 115 is made of one of stainless steel, nickel-chromium-iron alloy and nickel-based corrosion-resistant alloy; wherein, the stainless steel can be 304 stainless steel, 316L stainless steel, 317L stainless steel, 904L stainless steel, etc., the nickel-chromium-iron alloy can be inconel625, inconel718, etc., and the nickel-base corrosion-resistant alloy can be nickel-molybdenum alloy B-2, nickel-chromium-molybdenum alloy C-276, etc. Preferably, the material of the protective film 115 is stainless steel. The protection film 115 is formed on the surface of the heat generating film 112 away from the dense substrate 111 by means of physical vapor deposition (e.g., magnetron sputtering, vacuum evaporation, ion plating) or chemical vapor deposition (plasma-assisted chemical deposition, laser-assisted chemical deposition, deposition of metal organic compounds). It is understood that the heat generating film 112 and the protective film 115 are formed by a process such that they do not cover the minute holes 113, i.e., the minute holes 113 penetrate the heat generating film 112 and the protective film 115. Since the protective film 115 can effectively prevent the aerosol-generating substrate from corroding the heat generating film 112, the heat generating film 112 may be made of copper or silver, thereby preparing the nano-scale heat generating film 112.

When the heating film 112 is a thick film (the structure is shown in fig. 11), the thickness of the heating film 112 is 5 micrometers to 100 micrometers, and the material of the heating film 112 is one of nichrome, iron-chromium-aluminum alloy, gold, silver, nickel, platinum, and titanium. The thickness of the protective film 115 is 5-20 microns, and the protective film 115 is made of one of stainless steel, nickel-chromium-iron alloy and nickel-based corrosion-resistant alloy; wherein, the stainless steel can be 304 stainless steel, 316L stainless steel, 317L stainless steel, 904L stainless steel, etc., the nickel-chromium-iron alloy can be inconel625, inconel718, etc., and the nickel-base corrosion-resistant alloy can be nickel-molybdenum alloy B-2, nickel-chromium-molybdenum alloy C-276, etc. Preferably, the material of the protective film 115 is stainless steel. When the heating film 112 and the protection film 115 are sequentially formed on the first surface 1111 of the dense matrix 111 by printing, the material of the heating film 112 is one of nichrome, iron-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum and titanium, and the material of the protection film 115 is stainless steel; when the heating film 112 is formed on the first surface 1111 of the dense substrate 111 by printing, the protection film 115 is formed on the surface of the heating film 112 away from the dense substrate 111 by physical vapor deposition or chemical vapor deposition, the material of the heating film 112 is one of nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum and titanium, and the material of the protection film 115 is one of stainless steel, nickel-chromium-iron alloy and nickel-based corrosion-resistant alloy. By providing the protective film 115 on the surface of the thick film heat generating film 112, the aerosol-generating substrate can be prevented from corroding the heat generating film 112.

The protective film 115 is arranged on the surface of the heating film 112, the protective film 115 is made of metal alloy, and theoretically, the protective film 115 generates heat while the heating film 112 generates heat; since the resistance of the protective film 115 is much larger than that of the heat generating film 112, the protective film 115 hardly generates heat, and the aerosol-generating substrate is mainly heated by the heat generating film 112. For example, the resistance of the heating film 112 is about 1 ohm, the protective film 115 is made of stainless steel, the resistance of the protective film 115 is about 30 ohm, the resistance of the protective film 115 is too large, and the resistance of the protective film 115 is much larger than the resistance of the heating film 112, so that the protective film 115 cannot play a role of the heating film 112, that is, the protective film 115 cannot heat the aerosol generating substrate, under the conditions that the power of the electronic atomization device is 6 w to 8.5 w and the voltage of the battery is 2.5 v to 4.4 v.

In the present application, the heating film 112 includes a heating film body 1121 and an electrode 1122, the heating film body 1121 and the electrode 1122 are made of the same material, and the protection film 115 is simultaneously disposed on the surfaces of the heating film body 1121 and the electrode 1122. It is understood that the protective film 115 is formed only on the heating film body 1121, and the protective film 115 is not provided on the electrode 1122, so as to reduce the resistance of the electrode 1122 and thus reduce the resistance consumption between the electrode 1122 and the thimble of the power module 2, that is, the protective film 115 partially exposes the heating film 112 to serve as the electrode 1122 of the heating film 112; further, the electrode 1122 may be made of a material different from that of the heating film body 1121, so that the resistance of the electrode 1122 is low, thereby reducing the resistance consumption between the electrode 1122 and the thimble of the power module 2.

It is understood that the thickness of the dense matrix 111, the pore diameter of the micro-pores 113, the ratio of the thickness of the dense matrix 111 to the pore diameter of the micro-pores 113, and the ratio of the center distance of the adjacent micro-pores 113 to the pore diameter of the micro-pores 113 provided by the present application can be designed in combination according to the requirement; the dense substrate 111 can be connected with a thin film heating film 112 (the thickness of the heating film 112 is 200 nm-5 μm, and the resistivity of the heating film 112 is not more than 0.06 x 10 ^-6 Omega · m, the material of the heating film 112 is copper and its alloy, silver and its alloy, aluminum and its alloy, or gold and its alloy) or the thick film heating film 112 (the thickness of the heating film 112 is 5 micrometers-100 micrometers, the material of the heating film 112 is one of nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum, titanium) is designed according to the need; the protective film 115 may be designed as necessary. The protective film 115 in the heating element 11 provided by the present application can be applied to the surface of the conventional porous ceramic heating element to protect the heating film.

Referring to fig. 12, fig. 12 is a schematic view of a portion of an atomizing assembly provided herein including a loose matrix.

Further, the atomizing assembly 1 further includes a loose base 114, and the loose base 114 is disposed on the second surface 1112 of the dense base 111 of the heating body 11. The loose matrix 114 can be made of porous ceramics, sponge, foam, fiber layers and other materials, and can achieve the effects of liquid storage, liquid guiding and heat insulation. That is, the aerosol-generating substrate in the liquid storage chamber 10 is guided to the second surface 1112 of the dense substrate 111 through the porous substrate 114, and then guided to the first surface 1111 of the dense substrate 111 through the micro-pores 113 on the dense substrate 111 to be atomized by the heat generating film 112.

Experiments prove that the arrangement mode of the micropores 113 on the dense substrate 111, the selection of the material of the heating film 112 and the effect of the protective film 115 are provided.

Experiment one: the material of the heating film 112 is selected when it is a thin film.

Taking a graph of the heating film 112 (the shape of the heating film 112 shown in fig. 9 b) common in the industry as an example, the length of the heating film 112 is 8.5 mm, the width of the heating film 112 is 0.4 mm, the resistance is 1 ohm at normal temperature, the heating film 112 is made of different materials, the theoretical thickness of the heating film 112 can be obtained according to the resistivity of different metal materials, and the result is shown in table 1.

TABLE 1 resistivity of metal material and theoretical thickness of heating film

As can be seen from table 1, when conventional nichrome, or ferrochromium alloy is used, the theoretical thickness of the heating film 112 needs to exceed 20 μm, which may seriously affect the atomization efficiency, and may also cause the pore diameter of the micropores 113 in the dense matrix 111 to decrease during the deposition process, which may affect the supply and atomization of the aerosol-generating substrate. When low-resistivity metal materials such as silver, copper, gold, aluminum and the like are adopted, the theoretical thickness of the heating film 112 is less than 1 mu m, the pore diameter of the micropores 113 in the compact substrate 111 is not influenced, and the energy absorbed by the heating film 112 during atomization is reduced. In addition, the heat conductivity of the materials such as silver, copper, gold, aluminum and the like is far higher than that of nichrome, nichrome and iron-chromium-aluminum alloy, so that the heat is conducted quickly, and the atomization efficiency is enhanced.

The heating film 112 made of silver, copper, gold, aluminum, etc. can stably work for a long time in a PG/VG mixed solution (a propylene glycol/glycerol mixed solution), but the aerosol-generating substrate also contains various flavors and additives, and the flavors and additives contain elements such as sulfur, phosphorus, chlorine, etc., which may corrode the heating film 112. Experiments show that when silver is used as the material of the heating film 112, the resistance of the heating film 112 is continuously increased in the wet burning thermal cycle process, and the heating film 112 fails after about 30 times of pumping; because copper has stronger corrosion resistance to chloride ions, when copper is used as the material of the heating film 112, the resistance of the heating film 112 can still be increased in the wet-firing thermal cycle process, but the service life of the heating film 112 can be prolonged to about 80 times; the aluminum is more stable in the environment of the aerosol generating substrate, a compact oxide film structure can be formed on the surface of the aluminum, and the aluminum can bear more than 600 times in the thermal cycle process; gold, as the metal with the most stable chemical property, is more stable and reliable in thermal cycling, and the resistance of the thermal cycling for more than 1500 times is still unchanged.

Therefore, when the material of the heating film 112 is silver or copper, the heating film 112 is easily corroded and fails when being electrified and heated; because gold has very strong chemical inertness, a compact oxide film can be generated on the surface of aluminum, and the heating film 112 formed by gold or aluminum is very stable in the aerosol generating substrate and is not easy to corrode when the heating film 112 is electrified and heated. Therefore, when the heat-generating body 11 does not include the protective film 115, the material of the heat-generating film 112 is aluminum and its alloy, gold and its alloy; when the heating element 11 includes the protective film 115, the protective film 115 can prevent the heating element 11 from being corroded by the aerosol-generating substrate, and there is no requirement for the material of the heating element 11, and the material of the heating film 112 is silver and its alloy, copper and its alloy, aluminum and its alloy, gold and its alloy.

Aluminum is selected as a material of the heat-generating film 112, and is deposited on the first surface 1111 of the dense substrate 111 by means of magnetron sputtering, the deposited thickness is 3 micrometers, and an obtained SEM image is shown in fig. 13 (fig. 13 is an SEM image of an embodiment of the heat-generating film provided by the present application). As can be seen from fig. 13, the deposition thickness of the heat generating film 112 is 3 μm, and the heat generating film 112 is also deposited on the inner surfaces of the micro holes 113, but the pore diameter of the micro holes 113 is not significantly affected.

The heating element 11 provided in the present application and a conventional porous ceramic heating element were subjected to a wet firing test at 6.5 watts to obtain respective amounts of atomized aerosol, and the results shown in fig. 14 were obtained by comparing the amounts of atomized aerosol obtained from the heating element of the present application and the conventional porous ceramic heating element (fig. 14 is a graph comparing the amounts of atomized aerosol obtained from the heating element of the present application and the conventional porous ceramic heating element); among them, the heating element 11 of the present application; the porosity of the traditional porous ceramic heating body is 57-61%, the thickness is 1.6mm, and the aperture is 15-50 μm. As can be seen from fig. 14, the aerosol amount of the heating element 11 of the present invention was stable after 650 wet burns, and the aerosol amount of the conventional porous ceramic heating element began to significantly decrease after 650 wet burns; under the same wet burning times, the amount of the atomized aerosol of the heating element 11 provided by the application is more than that of the atomized aerosol of the traditional porous ceramic heating element, namely, the heating element 11 provided by the application can realize high-efficiency atomization.

Experiment two: the effect of the protective film 115 provided in the present application was verified.

The life of the heating element 11 was evaluated by charging the heating element 11 and wet-firing. The experimental conditions are as follows: supplying power with 6.5W constant power, sucking for 3 s and stopping for 27 s, wherein the aerosol generating substrate has mint taste and 50mg/100ml nicotine content, and the thickness of the heating film 112 is 1-2 μm; the heating element 11 is compared with the heating element 11 without the protective film 115, the protective film 115 is selected from different materials for comparison, the normal use environment of the electronic atomization device is simulated for experiment, and the comparison result is shown in table 2, so that the relationship between the heating film 112 material and the protective film 115 material and the service life of the heating element 11 is obtained.

TABLE 2 relationship between the heating film material and the protective layer material and the life of the heating element

In Table 2, the thickness of the protective film 115 made of silicon dioxide was 30nm, the thickness of the protective film 115 made of titanium nitride was 100nm, and the thickness of the protective film 115 made of 316L stainless steel was 800 nm. As can be seen from table 2, when silver and copper are used as the material of the heating film 112, they are easily corroded by the flavors and fragrances and additives containing sulfur, phosphorus, chlorine, etc. in the aerosol-generating substrate, and it is difficult to meet the requirement of life; when aluminum is used as the material of the heating film 112, the aluminum can bear more than 600 times of thermal cycles, and the service condition of most electronic atomization devices (the power of the electronic atomization devices is 6-8.5 watts) is met, but the requirement that the power of the electronic atomization devices is more than 10 watts and more than 1500 times is difficult to meet.

When silicon dioxide is used as the material of the protective film 115, the protective film 115 is rapidly failed due to internal stress between film layers during thermal cycling because the difference between the thermal expansion coefficients of silicon dioxide and metal is too large, and the protective effect is difficult to be achieved. It is understood that when zirconia and alumina are used as the protective film 115, the thermal expansion coefficient of zirconia and alumina and metal is too large, and the protective film is not effective and difficult to protect.

Titanium nitride is used as a commonly used protective coating, and whether the titanium nitride is suitable for being used as a protective film 115 material is verified by using copper as a material of the heating film 112. The resistance of the heating film 112 is continuously increased in the wet firing process, and the heating film 112 fails after 130 times of thermal cycles (as shown in fig. 15, fig. 15 is a failure diagram of the heating film in the heating body provided by the present application). The heat generating film 112 was found to be severely corroded and peeled off from the dense base 111 by observation with an optical microscope. From fig. 16 (fig. 16 is an SEM picture and EDS picture of the heat generating film failure picture provided in fig. 15), it can be seen that the titanium nitride layer of the surface of the heat generating film 112 has been substantially completely etched to expose the copper layer of the heat generating film 112, and the copper layer has been also severely etched to expose a part of the area of the dense base 111. That is, in the present application, the protective film 115 made of titanium nitride is also easily corroded by the aerosol-generating substrate.

When stainless steel is used as the material of the protective film 115, the heating film 112 can withstand more than 1500 thermal cycles regardless of whether it is made of silver, copper or aluminum, and the life of the heating element 11 can be greatly prolonged. Furthermore, it is found through experiments that metals with higher nickel content can protect the heat generating film 112.

Therefore, in the present invention, corrosion-resistant stainless steel (304, 316L, 317L, 904L, etc.), inconel (inconel625, inconel718, etc.), nickel-based corrosion-resistant alloy (ni-mo alloy B-2, ni-cr-mo alloy C-276), or the like is used as the material of the protective film 115, and the life of the heating element 11 is prolonged. The life of the heating element 11 can be greatly prolonged by using the protective film 115 regardless of whether the material of the heating film 112 is silver, copper or aluminum.

The life of the heat generating film 112 increases with the increase in the thickness of the protective film 115, as shown in fig. 17 (fig. 17 is a graph of the life of the heat generating film and the thickness of the protective film in the heat generating body provided by the present application). As is clear from fig. 17, when the aerosol-generating substrate used was mint 50mg and the material of the protective film 115 was S316L stainless steel, the resistance change of the heat generating film 112 decreased with the increase in the thickness of the protective film 115, and the life of the heat generating film 112 was increased.

Experiment three: the thickness of the dense matrix 111 and the pore diameter of the micropores 113 influence the liquid supply efficiency.

The liquid supply efficiency of the heating element 11 was evaluated by a wet combustion experiment of the heating element 11, the principle of which is shown in fig. 18 (fig. 18 is a schematic view of the wet combustion experiment of the heating element provided by the present application). The direct current power supply is adopted for supplying power, the thimble 20 of the power supply component 2 (the thimble 20 is electrically connected with the battery) is respectively connected with the electrode 1122 of the heating film 112, the electrifying power and the electrifying time are controlled, and the infrared thermal imager or the thermocouple is adopted for measuring the temperature of the heating film 112.

When the heating film 112 is energized, the instantaneous temperature rises to vaporize the aerosol-generating substrate in the pores 113, and as the aerosol-generating substrate in the pores 113 is consumed, the aerosol-generating substrate in the liquid storage chamber 10 is continuously replenished to the heating film 112 by the capillary action of the pores 113.

The flow of the aerosol-generating substrate within the pores 113 having capillary action may be estimated according to the Washburn equation, S being the pore area of the pores 113, ρ being the aerosol-generating substrate density, z being the distance traversed by the aerosol-generating substrate, γ being the surface tension, μ being the viscosity of the aerosol-generating substrate, r being the radius of the pores 113, and θ being the contact angle of the aerosol-generating substrate to the dense substrate 111 material. The aerosol-generating substrate nebulized amounts were as follows:

as can be seen from the formula, after the materials of the aerosol-generating substrate and the dense matrix 111 are determined, ρ, γ, μ, θ are unchanged. The larger the pore size of the micropores 113, the more adequate the liquid supply, but the greater the risk of airborne negative pressure during transport and warm flushing leakage during use of the product. Thus, the thickness, pore size and thickness to diameter ratio of the dense substrate 111 are important both to ensure adequate liquid supply during atomisation and to prevent leakage of the aerosol-generating substrate.

The heat-generating body 11 was subjected to an assembling test to evaluate the relationship between the thickness of the dense substrate 111/the pore diameter of the micropores 113 and the atomization amount, and the result is shown in FIG. 19 (FIG. 19 is a graph showing the relationship between the thickness of the dense substrate/the pore diameter of the micropores and the atomization amount of the heat-generating body provided in the present application). As can be seen from fig. 19, when the thickness of the dense substrate 111/the pore diameter of the fine pores 113 is too large, the aerosol-generating substrate supplied by capillary action hardly satisfies the required amount of atomization, and the amount of atomization is decreased. When the thickness of the dense substrate 111/the pore diameter of the fine pores 113 is too small, the aerosol-generating substrate easily flows out from the fine pores 113 to the surface of the heat generating film 112, and the atomization efficiency and the atomization amount are reduced.

Experiment four: the heating element 11 provided in the present application is compared with a conventional porous ceramic heating element in performance.

If the supply of aerosol-generating substrate is sufficient, the heat-generating film 112 may be maintained at a temperature around the boiling point of the aerosol-generating substrate at thermal equilibrium; if the aerosol-generating substrate is not supplied enough, dry burning may occur and the heat generating film 112 is at a temperature above the boiling point of the aerosol-generating substrate. Therefore, the liquid supply efficiency of the heat-generating body 11 can be evaluated by the heat-generating body 11 wet firing experiment.

The thickness of the dense substrate 111 of the heating element 11 provided in the present application was 0.2mm, and the pore diameter of the micropores 113 was 30 μm. The above-mentioned heating element 11 was compared with a conventional porous ceramic heating element (porosity of 57% -61%, thickness of 1.6mm, pore diameter of 15-50 μm).

For a traditional porous ceramic heating body, under the condition of power of 6.5w, the temperature of a heating film rises to be near 270 ℃ instantly after being electrified, and is almost stable and unchanged within the heating duration time of 3 seconds, so that the heat balance state is achieved; however, as the heating power increases, the temperature of the heat generating film in the thermal equilibrium state increases, which shows that the porous ceramic structure having the liquid guiding function is insufficient to supply liquid, as shown in fig. 20 (fig. 20 is a relationship diagram between the atomizing temperature and the heating power of the conventional porous ceramic heat generating body).

In contrast, when the heating element 11 having a thickness of the dense substrate 111 of 0.2mm and a pore diameter of the fine pores 113 of 30 μm is used, the temperatures of the heat generating film 112 in the thermal equilibrium state are all around 250 ℃ in the range of power 6.5w to 11.5w, as shown in FIG. 21 (FIG. 21 is a graph showing the relationship between the atomizing temperature and the heating power of the heating element provided in the present application); the compact matrix 111 of the structure has sufficient liquid supply, and no liquid leakage phenomenon is found in the experiment.

Fig. 22 shows the relationship between the atomizing temperature and the pumping time of the heating element 11 of the present application, as a result of examining the relationship between the atomizing temperature and the pumping time under the heating power of 6.5w (fig. 22 is a graph showing the relationship between the atomizing temperature and the pumping time of the heating element of the present application). As can be seen from fig. 22, the atomization temperature of the heating element 11 provided by the present application in the thermal equilibrium state is also stable and constant with the increase of the heating time; it is explained that the aerosol-generating substrate in the liquid storage chamber 10 can be continuously supplied when boiling atomization occurs with continuous consumption of the aerosol-generating substrate in the micropores 113, which can satisfy the required amount of atomization and ensure the amount of atomization.

The heating body comprises a compact substrate and a heating film; the dense matrix comprises a first surface and a second surface opposite to the first surface; the dense substrate is provided with a plurality of micropores, the micropores being through holes, the micropores being for guiding the aerosol-generating substrate to the first surface; a heat-generating film formed on the first surface; wherein the ratio of the thickness of the dense matrix to the pore diameter of the micropores is 20:1-3: 1. Through the arrangement, the porosity of the heating body can be accurately controlled, and the consistency of products is improved; and the heating body can realize sufficient liquid supply and prevent liquid leakage in the work process.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A heat-generating body for heating an atomised liquid aerosol-generating substrate, the body comprising:

a dense substrate comprising a first surface and a second surface opposite the first surface; a plurality of micropores are provided in the dense substrate, the micropores being through-holes for guiding the aerosol-generating substrate to the first surface;

a heat generating film formed on the first surface;

wherein the ratio of the thickness of the dense matrix to the pore diameter of the micropores is 20:1-3: 1.

2. A heat-generating body as described in claim 1, wherein a plurality of said micro holes are arranged in an array.

3. A heat-generating body as described in claim 2, characterized in that a plurality of said micropores are the same in shape and pore diameter; the micropores are arranged in a rectangular array.

4. A heat-generating body as described in claim 2, characterized in that said heat-generating body comprises a first pore diameter micropore array region and a second pore diameter micropore array region, and the pore diameter of said micropores of said second pore diameter micropore array region is different from the pore diameter of said micropores of said first pore diameter micropore array region.

5. A heat-generating body as described in claim 1, wherein each of said first surface and said second surface comprises a smooth surface; the first surface is a plane; the micropore is a through hole vertically penetrating through the first surface and the second surface, and the cross section of the micropore is circular.

6. A heat-generating body as described in claim 5, characterized in that said first surface and said second surface are both flat and arranged in parallel.

7. A heat-generating body as described in claim 1, characterized in that the dense substrate is glass or dense ceramic.

8. A heat-generating body as described in claim 7, characterized in that the dense substrate is glass, and the glass is borosilicate glass, quartz glass, or photosensitive lithium aluminosilicate glass.

9. A heat-generating body as described in claim 8, characterized in that the ratio of the thickness of said dense base to said micropores is 15:1 to 5: 1.

10. A heat-generating body as described in claim 8, characterized in that the ratio of the hole center distance between two adjacent said minute holes to the hole diameter of said minute hole is 3:1 to 1.5: 1.

11. A heat-generating body as described in claim 8, characterized in that the ratio of the hole center distance between two adjacent said minute holes to the hole diameter of said minute hole is 3:1 to 2.5: 1.

12. A heat-generating body as described in claim 8, characterized in that the thickness of the dense substrate is 0.1 mm to 1 mm.

13. A heat-generating body as described in claim 8, characterized in that the thickness of the dense substrate is 0.2mm to 0.5 mm.

14. A heat-generating body as described in claim 8, characterized in that the pore diameter of said fine pores is 1 μm to 100. mu.m.

15. A heat-generating body as described in claim 8, characterized in that the pore diameter of said fine pores is 20 micrometers to 50 micrometers.

16. A heat-generating body as described in claim 1, characterized in that the longitudinal section of said through hole is rectangular or dumbbell-shaped.

17. A heat-generating body as described in claim 1, wherein said minute hole penetrates said heat-generating film.

18. A heat-generating body as described in claim 17, characterized in that the material of the heat-generating film is silver, copper, aluminum, gold or an alloy thereof, the thickness of the heat-generating film is 200 nm-5 μm, the resistance of the heat-generating film is 0.5 ohm-2 ohm, and the resistivity of the heat-generating film is not more than 0.06 x 10 ^-6 Ω·m。

19. A heat-generating body as described in claim 1, characterized in that the material of the heat-generating film is one of nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum, titanium; the thickness of the heating film is 5-100 microns.

20. A heat-generating body as described in claim 1, characterized in that the heat-generating film is in a sheet shape, a mesh shape, a strip shape.

21. A heat-generating body as described in claim 1, further comprising a protective film provided on a surface of the heat-generating film remote from the dense base; the protective film is made of one of stainless steel, nickel-chromium-iron alloy and nickel-based corrosion-resistant alloy.

22. An atomizing assembly, comprising:

a reservoir for storing a liquid aerosol-generating substrate;

a heat-generating body according to any one of claims 1 to 21; the micropore is communicated with the liquid storage cavity.

23. The atomizing assembly of claim 22, further comprising a loose matrix disposed on the second surface of the dense matrix of the heat-generating body.

24. The atomizing assembly of claim 23, wherein the loose matrix is a porous ceramic, sponge, foam, or fibrous layer.

25. An electronic atomizer, comprising an atomizer assembly according to any one of claims 22 to 24 and a power supply assembly electrically connected to said heat generating body.

26. The electronic vaping device of claim 25, wherein the power supply component includes a battery having a voltage in a range of 2.5 volts to 4.4 volts, and the electronic vaping device has a power in a range of 6 watts to 8.5 watts.