CN114190606A

CN114190606A - Electronic atomization device and heating assembly and heating body thereof

Info

Publication number: CN114190606A
Application number: CN202111547935.8A
Authority: CN
Inventors: 王守平; 石楠; 张立超; 柳志伟; 孙晓波; 张琳
Original assignee: Hainan Moore Brothers Technology Co Ltd
Current assignee: Hainan Moore Brothers Technology Co Ltd
Priority date: 2021-12-16
Filing date: 2021-12-16
Publication date: 2022-03-18
Also published as: WO2023109355A1

Abstract

The invention relates to an electronic atomization device, a heating component and a heating body thereof, wherein the heating body comprises a heating layer and a heat conduction isolation layer; the layer that generates heat set up in on the heat conduction isolation layer, and with the heat conduction isolation layer forms a body structure, in order to pass through the heat conduction isolation layer is kept apart with the gaseous state medium that forms after atomizing medium and/or atomizing, and passes through the heat conduction isolation layer with the atomizing medium carries out heat-conduction. The heat-generating body keeps apart the gaseous state medium that layer and this atomizing medium and/or atomizing back formed will generate heat through this heat conduction isolation layer to this heat conduction isolation layer of accessible and this atomizing medium carry out heat-conduction, thereby can not direct contact with the atomizing medium with the layer that generates heat, and then can reduce the probability that harmful substance produced, avoid atomizing medium to concentrate, can improve atomizing volume and improve the mouth feel of atomizing gas after the atomizing, still can improve the anti fatigue life on layer that generates heat, increase atomizing device's practical number of times.

Description

Electronic atomization device and heating assembly and heating body thereof

Technical Field

The present invention relates to an atomizing device, and more particularly, to an electronic atomizing device, a heating assembly thereof, and a heating element thereof.

Background

The heating material in the heating body of the electronic atomization device in the related technology is generally in direct contact or semi-isolated state with the atomization medium and/or the gaseous medium formed after atomization, and the defects of easy generation of scorched smell, concentrated atomization medium, low atomization amount, poor taste, short service life of the heating material and the like exist in the atomization process.

Disclosure of Invention

The invention aims to provide an improved heating body, and further provides an improved electronic atomization device and a heating assembly.

The technical scheme adopted by the invention for solving the technical problems is as follows: constructing a heating body, which comprises a heating layer and a heat conduction isolation layer; the layer that generates heat set up in on the heat conduction isolation layer, and with the heat conduction isolation layer forms a body structure, in order to pass through the heat conduction isolation layer is kept apart with the gaseous state medium that forms after atomizing medium and/or atomizing, and passes through the heat conduction isolation layer with the atomizing medium carries out heat-conduction.

In some embodiments, the thermally conductive isolation layer comprises a first thermally conductive isolation layer and a second thermally conductive isolation layer;

the heating layer is arranged between the first heat conduction isolation layer and the second heat conduction isolation layer.

In some embodiments, the heat generating layer is sheet-shaped.

In some embodiments, the thermally conductive isolation layer sheet structure.

In some embodiments, the heat-conducting isolation layer includes a first heat-conducting surface in contact with the heat-generating layer for conducting heat, and a second heat-conducting surface disposed opposite to the first heat-conducting surface for conducting heat in contact with the atomizing medium and/or the gaseous medium.

In some embodiments, the first heat transfer surface and/or the second heat transfer surface are planar.

In some embodiments, the first heat transfer surface and/or the second heat transfer surface is an arcuate surface.

In some embodiments, the thermally conductive isolation layer is a highly thermally conductive dense material having a thermal conductivity greater than 90 w/m.k.

In some embodiments, the thermally conductive isolation layer is a thermally conductive ceramic.

In some embodiments, the heat-generating layer is a heat-generating film, and the heat-generating film is coated on the heat-conducting isolation layer by a film coating technology.

In some embodiments, the heat-generating layer further comprises a conductive structure disposed on the heat-conducting isolation layer and in conductive contact with the heat-generating layer, or the conductive structure is disposed on the heat-generating layer.

In some embodiments, the heat generating layer includes at least two straight portions and at least one bent portion; the bending part is connected with two adjacent straight parts.

The invention also constructs a heating component, which comprises a liquid guide element and the heating body;

the heating element is inserted in the liquid guide element.

In some embodiments, the liquid-conducting element is a low thermal conductivity ceramic porous body having a thermal conductivity of less than 2 w/m.k.

In some embodiments, the liquid guiding element is provided with a through hole with two through ends;

the heating element is inserted into the through hole, and the wall surface of the liquid guide element, which is opposite to the heating element, forms an atomization surface.

In some embodiments, a gap left between the through hole and the heating body forms a gas passage.

In some embodiments, the wall of the through hole is provided with at least one vent groove.

In some embodiments, the atomization surface includes a first atomization zone in contact with the heat-generating body such that the atomized media is heated and atomized directly by the heat-generating body.

In some embodiments, the atomization surface further comprises a second atomization zone that is in non-contact with the heater such that the atomized media is radiatively atomized by the heater.

The invention also constructs an electronic atomization device which comprises the heating body and a power supply assembly electrically connected with the heating body.

The electronic atomization device, the heating component and the heating body thereof have the following beneficial effects: this heat-generating body is through setting up the layer that will generate heat on the heat conduction isolation layer and form a body structure with this heat conduction isolation layer, gaseous state medium through this heat conduction isolation layer and this atomizing medium and/or atomizing back formation is kept apart, and this heat conduction isolation layer of accessible and this atomizing medium carry out heat-conduction, thereby can not direct contact with atomizing medium with the layer that generates heat, and then can reduce the probability that harmful substance produced, it is concentrated to avoid atomizing medium, can improve the atomizing volume and improve the taste of atomizing gas after the atomizing, still can improve the anti fatigue life on the layer that generates heat, increase atomizing device's practical number of times.

Drawings

The invention will be further described with reference to the accompanying drawings and examples, in which:

fig. 1 is a schematic structural diagram of a heating element of an electronic atomization device in a first embodiment of the invention;

FIG. 2 is a partial block diagram of a heat generating component of the electronic atomizer of FIG. 1;

FIG. 3 is a schematic end view of a heat generating component of an electronic atomizer according to a second embodiment of the present invention;

FIG. 4 is a partial block diagram of a heat generating component of the electronic atomizer shown in FIG. 3;

FIG. 5 is a schematic structural diagram of a heat generating component of an electronic atomizer according to a third embodiment of the present invention;

fig. 6 is a partial structural view of a heat generating component of the electronic atomizer shown in fig. 5.

Detailed Description

For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

Fig. 1 and 2 show some preferred embodiments of the electronic atomization device of the present invention. The electronic atomization device can be used for heating and atomizing liquid atomization medium to generate atomization gas for a user to suck. In some embodiments, the electronic atomization device has the advantages of simple structure, high atomization efficiency, good atomization taste, long service life, low manufacturing cost and easy implementation.

As shown in fig. 1 and fig. 2, in this embodiment, the electronic atomization device may include an atomization shell, a heating element and a power supply element, the heating element and the power supply element may be accommodated in the atomization shell, and the heating element may be configured to heat an atomized medium. The power supply assembly is mechanically and electrically connected with the heating assembly and is used for supplying power to the heating assembly.

Further, in the present embodiment, the heat generating component may include a liquid guiding member 20 and a heat generating body 10. The heating element 10 can be inserted into the liquid guiding element 20, and can be electrically connected to the power supply component, and can be powered by the power supply component. The heating element 10 can be used for heating and atomizing the atomizing medium on the liquid guiding element 20. The atomizing medium may be a liquid atomizing medium. The liquid guiding element 20 can be communicated with the liquid storage cavity in the atomizing shell and used for sucking the atomizing medium in the liquid storage cavity.

Further, in the present embodiment, the heat-generating body 10 may be a sheet or a flat shape as a whole, and specifically, in some embodiments, the heat-generating body 10 may be a flat rectangular parallelepiped shape. In this embodiment, the cross-sectional area of the entire heat-generating body 10 is preferably 20% without affecting the suction resistance. In some embodiments, the heat generating body 10 may include a heat generating layer 11 and a heat conductive insulating layer 12. The heating layer 11 can be disposed on the heat-conducting isolation layer 12 and can form an integrated structure with the heat-conducting isolation layer 12, and the heating layer 11 can be used for generating heat and transferring the heat to the heat-conducting isolation layer 12. The heat-conducting isolation layer 12 can be used for isolating the heating layer 11 from the atomizing medium and/or the gaseous medium formed after atomization, and can transfer the heat conducted by the heating layer 11 to the atomizing medium on the liquid guiding element 20, so that the heat conduction can be carried out on the atomizing medium.

Further, in the present embodiment, the heat generating layer 11 may be a heat generating film, which may have a sheet structure. The heating layer 11 can be coated on the heat-conducting isolation layer 12 by a film coating technique, and is integrated with the heat-conducting isolation layer 12. Specifically, in some embodiments, the heating film may be manufactured by a silk-screen technique or other type of technique, and the heating efficiency and the heat conduction efficiency may be improved by using the heating film. In some embodiments, the shape and size of the heat generating film can be freely designed into various shapes according to the power and atomization performance requirements of the expected design.

Further, in the present embodiment, the heat generating layer 11 may include four straight portions 111 and three bending portions 112, the four straight portions 111 may be disposed side by side, and two adjacent straight portions 111 may be connected by one bending portion 112. In some embodiments, the straight portion 111 and the bent portion 112 may be integrally formed. It will be appreciated that in other embodiments. The number of the straight portions 111 is two, and the number of the bending portions 112 may be one, but the number of the straight portions 111 may also be more than two. The bending portion 112 may be more than one.

Further, in the present embodiment, the heat-generating body 10 may have a three-layer structure. The thermally conductive isolation layer 12 may be two layers, and specifically, the thermally conductive isolation layer 12 includes a first thermally conductive isolation layer 121 and a second thermally conductive isolation layer 122. The heat conductive isolation layer 12 may be a sheet structure, and both the first heat conductive isolation layer 121 and the second heat conductive isolation layer 122 may be flat rectangular parallelepiped. The first thermal isolation layer 121 and the second thermal isolation layer 122 have the same material, shape and size, and the first thermal isolation layer 121 and the second thermal isolation layer 122 can be stacked. In this embodiment, the heat generating layer 11 can be disposed between the first thermal isolation layer 121 and the second thermal isolation layer 122. Can avoid generating heat layer 11 and atomizing medium direct contact atomizing and bring the drawback through setting up this first heat conduction isolation layer 121 and second heat conduction isolation layer 122, improve the antifatigue life-span of heating film, reduce the risk that the heating film drops, guarantee the uniformity of taste and the fine and smooth nature of atomizing gas and the reductibility of fragrance, increase electron atomizing device's practical number of times etc.. If the heating layer 11 is directly contacted with the atomized medium and/or the gaseous medium formed after atomization, a series of problems, such as aging of the heating layer 11 and nonuniformity of resistance, are directly caused, and generation of overheated aldehyde ketone is directly caused, in addition, due to nonuniformity of an atomization field, the regional atomization temperature is higher, and the defect of easy generation of scorched smell in the atomization process exists, and the heating layer 11 is not directly contacted with the atomized medium and/or the gaseous medium formed after atomization through the heat conduction isolation layer 12, so that generation of the problems can be well avoided or reduced.

Further, in the present embodiment, the thermally conductive isolation layer 12 may include a first thermally conductive surface 12a and a second thermally conductive surface 12b, and the first thermally conductive isolation layer 121 and the second thermally conductive isolation layer 122 both include the first thermally conductive surface 12a and the second thermally conductive surface 12 b. The first heat conducting surface 12a is disposed on the heat generating layer 11, directly contacting the heat generating layer 11, and is used for conducting heat with the heat generating layer 11. The second heat conducting surface 12b is opposite to the first heat conducting surface 12a, and can be disposed opposite to the liquid guiding element 20, and is configured to contact with the atomizing medium to conduct heat, so as to heat the atomizing medium. In the present embodiment, the first heat-conducting surface 12a and the second heat-conducting surface 12b may be both flat surfaces. Of course, it is understood that in other embodiments, the first heat conduction surface 12a or the second heat conduction surface 12b is not limited to be a plane, and the first heat conduction surface 12a and/or the second heat conduction surface 12b may also be an arc surface. In some embodiments, the entire heat-generating body 10 may also be in an arc shape.

In the present embodiment, the thermally conductive isolation layer 12 may be a dense material with high thermal conductivity, and in some embodiments, the thermally conductive isolation layer 12 may be a thermally conductive ceramic material. The thermal conductivity coefficient of the thermal insulation layer 12 is larger than 90w/m.k, the thermal insulation layer can be heated immediately and has the characteristic of high heat transfer efficiency, and the heat transfer loss can be reduced within 5%. In addition, the adopted heat-conducting ceramic material not only plays a role of oil separation, but also has unique infrared radiation characteristics, atomized gas has the advantages of fineness, purity, safety, health and the like, and in addition, the heat efficiency loss and conduction of the atomized gas are hardly influenced; the uniform heat radiation electromagnetic wavelength is about 5-20 microns, is in the range of mid-infrared electromagnetic wavelength, is the functional characteristic absorption spectral line of most organic matters, and brings great benefits to uniform atomization medium atomization and mouthfeel.

Further, in the present embodiment, the heat generating body 10 may further include a conductive structure 13, and the conductive structure 13 may be used to electrically connect the heat generating layer 11 with the electrode of the power supply assembly. In this embodiment, the conductive structure 13 may be disposed on the thermal isolation layer 12 and electrically connected to the heat generating layer 11. Of course, it is understood that in other embodiments, the electrically conductive structure 13 may not be limited to be disposed on the thermally conductive isolation layer 12, but may also be disposed on the heat generating layer 11. In some embodiments, the conductive structure 13 may include a first conductive structure 131 and a second conductive structure 132, and the first conductive structure 131 and the second conductive structure 132 may be disposed at intervals and may be connected to the ends of the flat portions 111 of the heat generating layer 11 on both sides, respectively. In some embodiments, the first conductive structure 131 and the second conductive structure 132 can be disposed near one end of the thermally conductive isolation layer 12, but it is understood that in other embodiments, the first conductive structure 131 and the second conductive structure 132 can be disposed at two ends of the thermally conductive isolation layer 12. In some embodiments, the conductive structure 13 may be a conductive sheet, which is attached to the heat conductive isolation layer 12, or inserted into the heat conductive isolation layer 12. In some embodiments, the conductive structure 13 may not be limited to be a conductive sheet, and in other embodiments, the conductive structure 13 may also be a conductive film, which is coated on the first heat conduction surface 12a of the heat conduction isolation layer 12 by a coating technique. In other embodiments, the conductive structure 13 may also be a lead.

Further, in the present embodiment, the liquid guiding element 20 may be made of low thermal conductivity ceramic. In particular, the liquid guiding element 20 may be a low thermal conductivity ceramic porous body, the thermal conductivity of which may be less than 2 w/m.k.

Further, in this embodiment, the liquid guiding element 20 may be cylindrical, and may have a hollow structure with two ends penetrating through. It is understood that in other embodiments, the liquid guiding member 20 may not be limited to a cylindrical shape, but may also be a square cylindrical shape or other shapes. The heating element 10 can be inserted into the liquid guiding element 20, so that the problem of uniform heating of the circumference can be solved, and the heat is almost not lost due to the internal distribution, so that the heat efficiency of the heating element 10 can be greatly improved.

Further, in the present embodiment, a through hole 21 may be disposed on the liquid guiding member 20, and the through hole 21 may be disposed to penetrate along both ends of the liquid guiding member 20 in the axial direction. In this embodiment, the through hole 21 may have a rectangular parallelepiped shape, and a cross section thereof may have a square shape. The heating element 10 can be inserted into the through hole 21 along the diagonal line of the cross section of the through hole 21, and the width of the heating element 10 can be equivalent to the length of the diagonal line of the cross section of the through hole 21, so that the two opposite sides of the heating element 10 can be in contact with the liquid guiding element 20, and a gap can be left between the two opposite sides of the heating element 10 and the wide surface of the heating element, namely, in the through hole 21, the two opposite sides of the heating element 10 can be hollowed out. In some embodiments, the gap left between the through hole 21 and the heat-generating body 10 may form an air flow passage, and specifically, the air flow passage may include a first air flow passage 21a and a second air flow passage 21b which are oppositely disposed. This airflow channel can be atomizing air flue, and this heating film can produce the heat after connecting in the power through this electrically conductive structure 13, and this heat accessible this heat conduction isolation layer 12 radiation heating atomizes the atomizing medium on the liquid guide element 20, and this atomizing medium can be heated at this atomizing air flue and form smog to accessible this air flue is pumped to in the user's mouth. Through setting up heat-generating body 10 in this airflow channel to gaseous state medium that forms after this layer 11 and this atomizing medium and/or atomizing of will generating heat is kept apart through this heat conduction isolation layer 13, thereby can improve the fatigue resistance of the material that generates heat, and can avoid local atomizing medium to concentrate, the smog volume is on the low side taste uniformity scheduling problem.

Further, in the present embodiment, in the through hole 21, a wall surface of the liquid guide member 20 provided to face the heating element 10 may form an atomization surface 22. When the electronic atomization device atomizes, the atomization medium can penetrate from the liquid storage cavity to the outside of the liquid guide element 20 and penetrate into the liquid guide element 20 to the atomization surface 22, and the structure of the liquid guide element 20 can effectively ensure the balance of directional liquid inlet and atomization. By providing a gap between the heat generating element 10 and the liquid guiding member 20, the atomization surface 22 can be divided into the first atomization region 221 and the second atomization region 222. The first atomization region 221 may be in direct contact with the heating element 10, and the first atomization region 221 may be located at both ends of the heating element 10 in the width direction, which may form a high temperature atomization region. In the first atomization zone 221, the heat-generating body 10 can directly heat and atomize the liquid guiding element 20. The second atomization region 222 may be located on a wall surface of the liquid guide member 20 disposed opposite to the wide surface of the heating element 10. The second atomization region 222 is not in direct contact with the heating element 10, so as to form a low-temperature atomization region. In the second atomization zone 222, the heating element 10 can atomize the atomization medium on the liquid guide element 20 by means of spatial radiation heat transfer. By dividing the atomization surface 22 into the first atomization area 221 and the second atomization area 222, the heating assembly can have an atomization environment with a three-dimensional temperature gradient, and the unique three-dimensional temperature atomization environment can greatly improve the smoking taste.

The electronic atomization device of this embodiment has not only solved atomizing medium and the 11 direct contact's in layer problem that generates heat for the material that generates heat has safety, longe-lived, difficult contaminated characteristics, and simultaneously, simple structure, the part preparation is convenient, easily equipment, the automated production and the practical application of being convenient for.

Fig. 3 and 4 show a second embodiment of the electronic atomization device of the invention. It is different from the first embodiment in that the through-hole 21 may be in a flat rectangular parallelepiped shape whose cross sectional shape and size are adapted to the cross sectional shape and size of the heat-generating body 10. In this embodiment, a plurality of vent grooves 23 may be formed on the wall of the through hole 21, specifically, three vent grooves 23 may be formed on both sides of the liquid guiding member 20 opposite to the wide surface of the heating element 10, and the vent grooves 23 may be used to form an airflow channel. In this embodiment, the second atomizing area 222 may be formed on a wall of the vent groove 23 disposed opposite to the heating body 10. In other embodiments, the vent groove 23 may not be limited to be opened on the hole wall of the through hole 21, and may be opened on the heat conductive isolation layer 12 of the heat generating body 10.

Fig. 5 and 6 show a third embodiment of the electronic atomizer of the present invention, which is different from the first embodiment in that the heat generating layer 11 may include only two straight portions 111 and one bent portion 112. The first conductive structure 131 and the second conductive structure 132 may be respectively disposed at ends of the two straight portions 111. The heat-conductive isolation layer 12 is formed with a plug hole 14, and the plug hole 14 may include a first plug hole 141 and a second plug hole 142 respectively corresponding to the first conductive structure 131 and the second conductive structure 132. Through the first jack 141 and the second jack 142, the conductive posts of the power supply assembly can be inserted into conductive connection with the first conductive structure 131 and the second conductive structure 132. In the present embodiment, the through hole 21 may be cylindrical, and is not limited to a rectangular parallelepiped shape.

It is to be understood that the foregoing examples, while indicating the preferred embodiments of the invention, are given by way of illustration and description, and are not to be construed as limiting the scope of the invention; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several changes and modifications can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.

Claims

1. A heating body is characterized by comprising a heating layer (11) and a heat conduction isolation layer (12); the heating layer (11) is arranged on the heat conduction isolation layer (12), and forms an integrated structure with the heat conduction isolation layer (12) so as to pass through the heat conduction isolation layer (12) is isolated from the atomized medium and/or the gaseous medium formed after atomization, and pass through the heat conduction isolation layer (12) and the atomized medium are conducted with heat.

2. A heat-generating body as described in claim 1, wherein the heat conductive and insulating layer (12) comprises a first heat conductive and insulating layer (121) and a second heat conductive and insulating layer (122);

the heating layer (11) is arranged between the first heat conduction isolation layer (121) and the second heat conduction isolation layer (122).

3. A heat-generating body as described in claim 1, characterized in that the heat-generating layer (11) is in a sheet shape.

4. A heat-generating body as described in claim 1, characterized in that the heat conductive and insulating layer (12) has a sheet-like structure.

5. A heat-generating body as described in claim 1, characterized in that the heat conductive separator (12) comprises a first heat conductive surface (12a) for conducting heat in contact with the heat-generating layer (11), and a second heat conductive surface (12b) provided opposite to the first heat conductive surface (12a) for conducting heat in contact with the atomizing medium and/or the gaseous medium.

6. A heat-generating body as described in claim 5, characterized in that the first heat-conducting surface (12a) and/or the second heat-conducting surface (12b) is a plane.

7. A heat-generating body as described in claim 5, characterized in that the first heat-conducting surface (12a) and/or the second heat-conducting surface (12b) is an arc surface.

8. A heat-generating body as described in claim 1, characterized in that the heat conductive isolation layer (12) is a high heat conductive dense material, and the heat conductivity coefficient of the heat conductive isolation layer (12) is more than 90 w/m.k.

9. A heat-generating body as described in claim 8, characterized in that the heat conductive insulating layer (12) is a heat conductive ceramic.

10. A heat-generating body as described in claim 1, wherein the heat-generating layer (11) is a heat-generating film, and the heat-generating film is coated on the heat-conductive insulating layer (12) by a film-coating technique.

11. A heat-generating body as claimed in claim 1, characterized by further comprising an electrically conductive structure (13), the electrically conductive structure (13) being provided on the heat-conductive insulating layer (12) and being in electrically conductive contact with the heat-generating layer (11), or the electrically conductive structure (13) being provided on the heat-generating layer (11).

12. A heat-generating body as described in claim 1, characterized in that the heat-generating layer (11) comprises at least two straight portions (111) and at least one bent portion (112); the bending part (112) is connected with two adjacent straight parts (111).

13. A heat generating component characterized by comprising a liquid guiding member (20) and the heat generating body (10) according to any one of claims 1 to 12;

the heating element (10) is inserted into the liquid guide element (20).

14. The heating element according to claim 13, wherein the liquid guiding element (20) is a low thermal conductivity ceramic porous body, the thermal conductivity of the liquid guiding element (20) being less than 2 w/m.k.

15. The heating element according to claim 13, wherein the liquid guiding element (20) is provided with a through hole (21) with two ends penetrating;

the heating element (10) is inserted into the through hole (21), and in the through hole (21), the wall surface of the liquid guide element (20) opposite to the heating element (10) forms an atomization surface (22).

16. The heat generating component as claimed in claim 15, wherein a gap left between the through hole (21) and the heat generating body (10) forms a gas passage.

17. The heating element according to claim 15, characterized in that the wall of the through hole (21) is provided with at least one ventilation groove (23).

18. The heating assembly according to claim 15, wherein the atomizing surface (22) comprises a first atomizing area (221) which is in contact with the heating body (10) so that the atomizing medium is heated and atomized directly by the heating body (10).

19. The heating assembly according to claim 18, wherein the atomization surface (22) further comprises a second atomization zone (222) which is in non-contact with the heating body (10) so that the atomized medium is radiatively atomized by the heating body (10).

20. An electronic atomizer, characterized by comprising a heat-generating body (10) according to any one of claims 1 to 13 and a power supply unit electrically connected to said heat-generating body (10).