CN114190605A

CN114190605A - Electronic atomization device and heating assembly and heating body thereof

Info

Publication number: CN114190605A
Application number: CN202111545551.2A
Authority: CN
Inventors: 王守平; 张立超; 孙利佳; 张琳; 朱林林
Original assignee: Hainan Moore Brothers Technology Co Ltd
Current assignee: Hainan Moore Brothers Technology Co Ltd
Priority date: 2021-12-16
Filing date: 2021-12-16
Publication date: 2022-03-18
Also published as: WO2023109356A1

Abstract

The invention relates to an electronic atomization device, a heating component and a heating body thereof, wherein the heating body comprises a heating structure and a columnar heat conduction isolation structure; the heating structure set up in the heat conduction isolation structure, in order to pass through the heat conduction isolation structure will the heating structure is kept apart with atomizing medium and/or the gaseous state medium that forms after atomizing, and pass through the heat conduction isolation structure will the heating structure with atomizing medium carries out heat-conduction. This heat-generating body keeps apart this heating structure and the gaseous state medium that forms behind atomizing medium and/or the atomizing through this heat conduction isolating structure, and carry out heat-conduction with this heating structure and this atomizing medium and/or the gaseous state medium that forms behind this atomizing through this heat conduction isolating structure, and then can avoid heating structure and atomizing medium direct contact, reduce the probability that harmful substance produced, it is concentrated to avoid atomizing medium, can improve atomizing volume and improve the taste of atomizing gas after the atomizing, still can improve heating structure's anti fatigue life, increase atomizing device's practical number of times.

Description

Electronic atomization device and heating assembly and heating body thereof

Technical Field

The present invention relates to an atomizing device, and more particularly, to an electronic atomizing device, a heating assembly thereof, and a heating element thereof.

Background

The heating material in the heating body of the electronic atomization device in the related technology is generally in direct contact or semi-isolated state with the atomization medium and/or the gaseous medium formed after atomization, and the defects of easy generation of scorched smell, concentrated atomization medium, low atomization amount, poor taste, short service life of the heating material and the like exist in the atomization process.

Disclosure of Invention

The invention aims to provide an improved heating body, and further provides an improved electronic atomization device and a heating assembly.

The technical scheme adopted by the invention for solving the technical problems is as follows: constructing a heating body, which comprises a heating structure and a columnar heat conduction isolation structure; the heating structure set up in the heat conduction isolation structure, in order to pass through the heat conduction isolation structure will the heating structure is kept apart with atomizing medium and/or the gaseous state medium that forms after atomizing, and pass through the heat conduction isolation structure will the heating structure with atomizing medium carries out heat-conduction.

Preferably, the heat conduction isolation structure is a hollow structure with two through ends;

the heating structure is arranged on the inner surface of the heat conduction isolation structure.

Preferably, the inner side of the thermally conductive spacer structure forms an air flow channel.

Preferably, the heat conduction isolation structure is a solid structure, and the heating structure is embedded in the heat conduction isolation structure.

Preferably, the heat conduction isolation structure is a high heat conduction dense material, and the heat conduction coefficient of the heat conduction isolation structure is greater than 90 w/m.k.

Preferably, the thermally conductive isolation structure is a thermally conductive ceramic.

Preferably, the heat generating structure and the heat conducting isolation structure are integrally formed.

Preferably, the heating structure is a heating film, and the heating film is attached to the heat conduction isolation structure through a film coating technology.

Preferably, the heat-conducting structure further comprises a conductive structure, wherein the conductive structure is arranged at one end or two ends of the heat-conducting isolation structure and is in conductive connection with the heating structure.

Preferably, the conductive structure is a conductive film, and the conductive film is attached to the heat conduction isolation structure by a film coating technology.

The invention also constructs a heating component, which comprises a columnar porous body for guiding liquid and the heating body;

the heating element is inserted into the porous body.

Preferably, the porous body is a low thermal conductivity ceramic porous body having a thermal conductivity of less than 2 w/m.k.

Preferably, the porous body is provided with an insertion hole through which the heating element is inserted at both ends.

Preferably, the shape and size of the jack are matched with the shape and size of the heat conduction isolation structure of the heating body.

Preferably, at least one vent groove is formed in the hole wall of the insertion hole, and two ends of the vent groove are arranged in a penetrating mode to form an atomization air passage.

Preferably, at least one boss protruding outwards is arranged on the outer side wall of the heat conduction isolation structure of the heating body;

and the boss is internally provided with a vent hole with two ends communicated to form an atomization air passage.

Preferably, in the insertion hole, a wall surface of the porous body provided to face the heating element forms an atomization surface.

Preferably, the atomization surface comprises a first atomization area which is in contact with the heating body so that the atomization medium is directly heated and atomized by the heating body.

Preferably, the atomization surface further comprises a second atomization area which is in non-contact with the heating element so that the atomization medium is atomized through radiation of the heating element.

The invention also constructs an electronic atomization device which comprises the heating body and a power supply assembly electrically connected with the heating body.

The electronic atomization device, the heating component and the heating body thereof have the following beneficial effects: this heat-generating body is through setting up this heating structure in cylindrical heat conduction isolating structure, thereby keep apart this heating structure and the gaseous state medium that forms behind atomizing medium and/or the atomizing through this heat conduction isolating structure, and carry out heat-conduction with this heating structure and this atomizing medium and/or the gaseous state medium that forms behind this atomizing through this heat conduction isolating structure, and then can avoid heating structure and atomizing medium direct contact, reduce the probability that harmful substance produced, avoid atomizing medium to concentrate, can improve atomizing volume and the taste of the atomizing gas after improving the atomizing, still can improve heating structure's anti fatigue life, increase atomizing device's practical number of times.

Drawings

The invention will be further described with reference to the accompanying drawings and examples, in which:

FIG. 1 is a schematic diagram of a heat generating component of an electronic atomizer device in accordance with certain embodiments of the present invention;

fig. 2 is a partial structural view of a heat generating component of the electronic atomizer shown in fig. 1.

Detailed Description

For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

Fig. 1 and 2 show some preferred embodiments of the electronic atomization device of the present invention. The electronic atomization device can be used for heating and atomizing liquid atomization medium to generate atomization gas for a user to suck. In some embodiments, the electronic atomization device has the advantages of simple structure, high atomization efficiency, good atomization taste, long service life, low manufacturing cost and easy implementation.

As shown in fig. 1 and fig. 2, in this embodiment, the electronic atomization device may include an atomization shell, a heating element and a power supply element, the heating element and the power supply element may be accommodated in the atomization shell, and the heating element may be configured to heat an atomized medium. The power supply assembly is mechanically and electrically connected with the heating assembly and is used for supplying power to the heating assembly.

Further, in the present embodiment, the heat generating component may include the porous body 20 and the heat generating body 10. The heating element 10 can be inserted into the porous body 20, and can be electrically connected to the power supply unit to supply power thereto. The heating element 10 can be used to heat and atomize the atomizing medium on the porous body 20. The atomizing medium may be a liquid atomizing medium. The porous body 20 may be in communication with a reservoir in the atomizing housing for drawing the atomized medium from the reservoir.

Further, in the present embodiment, the heat generating body 10 may be entirely columnar, and specifically, in some embodiments, the heat generating body 10 may be entirely columnar. In some embodiments, the heat generating body 10 may include a heat generating structure 11 and a heat conducting isolation structure 12, the heat generating structure 11 may be disposed in the heat conducting isolation structure 12 and may be integrally formed with the heat conducting isolation structure 12, and the heat generating structure 11 may be configured to generate heat and transfer the heat to the heat conducting isolation structure 12. The heat-conducting isolation structure 12 may be configured to isolate the heating structure 11 from the atomized medium and/or the gaseous medium formed after atomization, and may transfer the heat conducted by the heating structure 11 to the atomized medium on the porous body 20 and/or the gaseous medium formed after atomization in the airflow channel, so as to conduct heat to the atomized medium.

Further, in the present embodiment, the heat generating structure 11 may be a heat generating film, which may be a sheet structure. The heat-generating structure 11 can be coated on the heat-conducting isolation structure 12 by a film-coating technique, and is integrated with the heat-conducting isolation structure 12. Specifically, in some embodiments, the heating film may be manufactured by a silk-screen technique or other type of technique, and the heating efficiency and the heat conduction efficiency may be improved by using the heating film. In some embodiments, the shape and size of the heat generating film can be freely designed into various shapes according to the power and atomization performance requirements of the expected design.

Further, in the present embodiment, the heat conducting isolation structure 12 may be a hollow structure with two ends penetrating through, and the heat generating structure 11 may be disposed on an inner surface of the heat conducting isolation structure 12. The thermally conductive isolation structure 12 may be cylindrical, although it is understood that in other embodiments, the thermally conductive isolation structure 12 may not be limited to being cylindrical, and may be rectangular cylindrical or other shapes. In some embodiments, the inner side of the heat-conducting isolation structure 12 may form an air flow channel 121, the air flow channel 121 may allow external air to enter the heat generating component 10 and may preheat air in advance through the heat generating structure 11, thereby increasing the heat utilization rate and achieving the advantage of increasing the temperature of the atomizing air, of course, in other embodiments, the air flow channel 121 may be omitted, the heat-conducting isolation structure 12 may be a solid structure, and the heat generating structure 11 may be embedded in the heat-conducting isolation structure 12. In some embodiments, the heat generating structure 11 may not preheat the air in the air flow channel 121.

In the present embodiment, the thermally conductive isolation structure 12 may be a dense material with high thermal conductivity, and in some embodiments, the thermally conductive isolation structure 12 may be a thermally conductive ceramic material. The thermal conductivity coefficient of the heat conduction isolation structure 12 is larger than 90w/m.k, the heat conduction isolation structure can be heated immediately and has the characteristic of high heat transfer efficiency, and the heat transfer loss can be reduced within 5%. In addition, the adopted heat-conducting ceramic material not only plays a role of oil separation, but also has unique infrared radiation characteristics, atomized gas has the advantages of fineness, purity, safety, health and the like, and in addition, the heat efficiency loss and conduction of the atomized gas are hardly influenced; the uniform heat radiation electromagnetic wavelength is about 5-20 microns, is in the range of mid-infrared electromagnetic wavelength, is the functional characteristic absorption spectral line of most organic matters, and brings great benefits to uniform atomization medium atomization and mouthfeel.

Further, in the present embodiment, the heating body 10 may further include a conductive structure 13, and the conductive structure 13 may be used to electrically connect the heating structure 11 with the electrode of the power supply assembly. In this embodiment, the conductive structure 13 may be disposed on the thermal isolation structure 12 and electrically connected to the heat generating structure 11. Of course, it is understood that, in other embodiments, the electrically conductive structure 13 may not be limited to be disposed on the thermally conductive isolating structure 12, but may also be disposed on the heat generating structure 11. In some embodiments, the conductive structure 13 may include a first conductive structure and a second conductive structure, and the first conductive structure and the second conductive structure may be disposed at an end of the thermal isolation structure 12 at an interval. In some embodiments, the first and second conductive structures are disposed on the inner surface of the thermally conductive isolation structure 12 and can be disposed near one end of the thermally conductive isolation structure 12, although it is understood that in other embodiments, the first and second conductive structures 132 can be disposed at two ends of the thermally conductive isolation structure. In some embodiments, the electrically conductive structure 13 may be an electrically conductive sheet, which is attached to an inner surface or an end surface of the thermally conductive isolation structure 12, or may be inserted into the thermally conductive isolation structure 12. In some embodiments, the conductive structure 13 may not be limited to be a conductive sheet, and in other embodiments, the conductive structure 13 may also be a conductive film, which may be coated on the inner surface of the thermal isolation structure 12 and disposed near the end of the thermal isolation structure 12 by a coating technique. In other embodiments, the conductive structure 13 may also be a lead.

Further, in the present embodiment, the porous body 20 may be made of a low thermal conductive ceramic. Specifically, the porous body 20 may be a low thermal conductivity ceramic porous body, which may have a thermal conductivity of less than 2 w/m.k.

Further, in this embodiment, the porous body 20 may have a cylindrical shape, and may have a hollow structure with both ends penetrating therethrough. It is understood that in other embodiments, the porous body 20 may not be limited to a cylindrical shape, but may also be a square cylindrical shape or other shapes. The heating element 10 can be inserted into the porous body 20, so that not only the problem of uniform heating of the circumference can be solved, but also the heat is hardly lost due to the internal distribution, so that the heat efficiency of the heating element 10 can be greatly improved.

Further, in the present embodiment, the porous body 20 may be provided with the insertion holes 21, and the insertion holes 21 may be provided to penetrate along both ends of the porous body 20 in the axial direction. In the present embodiment, the insertion hole 21 is circular. The cross-sectional shape and size of the insertion hole 21 can be adapted to the cross-sectional shape and size of the heat-generating body 10. In some embodiments, the radial dimension of the receptacle 21 may be comparable to the radial dimension of the thermally conductive spacer structure 12. In some embodiments, the heating element 10 is disposed in the insertion hole 21, and the heat-conducting isolation layer 12 isolates the heating structure 11 from the atomized medium and/or the gaseous medium formed after atomization, so as to improve fatigue resistance of the heating material, and avoid the problems of local atomized medium concentration, low smoke amount, poor taste consistency, and the like.

Further, in the present embodiment, the wall surface of the insertion hole 21 on which the porous body 20 is provided to face the heating element 10 may form an atomization surface 22. When the electronic atomization device atomizes, the atomization medium can flow from the liquid storage cavity to the outside of the porous body 20 and permeate into the porous body 20 to the atomization surface 22, and the structure of the porous body 20 can effectively ensure the balance of directional liquid inlet and atomization.

Further, in this embodiment, a plurality of air grooves 23 may be formed on the hole wall of the insertion hole 21, the air grooves 23 may be disposed at intervals along the circumferential direction of the insertion hole 21, and two ends of each air groove 23 are disposed in a penetrating manner, so as to form an atomization air passage. In some embodiments, the vent groove 23 is not limited to be formed on the hole wall of the insertion hole 21, and may be formed on the thermal isolation structure 12. In other embodiments, the outer sidewall of the heat conducting isolation structure 12 may be provided with a plurality of bosses, the plurality of bosses may be arranged at intervals along the circumferential direction of the heat conducting isolation structure 12, the bosses may protrude outward along the radial direction of the heat conducting isolation structure 12, and the bosses may be provided therein with vent holes, both ends of which are communicated, and the vent holes may form an atomizing air channel. It will be appreciated that in other embodiments, there may be one boss. In some embodiments, the number and shape of the vent grooves 23 or vent holes may be matched to the design of the draw resistance and atomization power of the atomizing medium.

In some embodiments, the atomization surface 22 may be divided into a first atomization zone 221 and a second atomization zone 222. The first atomization region 221 can be in direct contact with the heating element 10, and the first atomization region 221 forms a high-temperature atomization region. In the first atomization zone 221, the heating element 10 can directly heat and atomize the porous body 20. The second atomization region 222 may be located on a wall surface of the vent groove 23 disposed opposite to the heating element 10. The second atomization region 222 is not in direct contact with the heating element 10, so as to form a low-temperature atomization region. In the second atomization zone 222, the heating element 10 can atomize the atomized medium on the porous body 20 by means of spatial radiation heat transfer. By dividing the atomization surface 22 into the first atomization area 221 and the second atomization area 222, the heating assembly can have an atomization environment with a three-dimensional temperature gradient, and the unique three-dimensional temperature atomization environment can greatly improve the smoking taste.

The electronic atomization device of this embodiment has not only solved the problem of 11 direct contact of atomizing medium and heating structure for the material that generates heat has safety, longe-lived, difficult contaminated characteristics, and simultaneously, simple structure, the part preparation is convenient, easily equipment, the automated production and the practical application of being convenient for.

It is to be understood that the foregoing examples, while indicating the preferred embodiments of the invention, are given by way of illustration and description, and are not to be construed as limiting the scope of the invention; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several changes and modifications can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.

Claims

1. A heating body is characterized by comprising a heating structure (11) and a columnar heat conduction isolation structure (12); heating structure (11) set up in heat conduction isolating structure (12) in order to pass through heat conduction isolating structure (12) will heating structure (11) are kept apart with the gaseous medium that forms behind atomizing medium and/or the atomizing, and pass through heat conduction isolating structure (12) will heating structure (11) with the atomizing medium carries out heat-conduction.

2. A heat-generating body as described in claim 1, wherein the heat conductive isolation structure (12) is a hollow structure with both ends penetrating;

the heating structure (11) is arranged on the inner surface of the heat conduction isolation structure (12).

3. A heat-generating body as described in claim 2, wherein an air flow passage (121) is formed inside the heat conductive separator structure (12).

4. A heat-generating body as described in claim 1, wherein the heat conducting isolation structure (12) is a solid structure, and the heat-generating structure (11) is embedded in the heat conducting isolation structure (12).

5. A heat-generating body as described in claim 1, characterized in that the heat conductive isolation structure (12) is a high heat conductive dense material, and the heat conductivity coefficient of the heat conductive isolation structure (12) is larger than 90 w/m.k.

6. A heat-generating body as described in claim 5, characterized in that the heat conductive isolation structure (12) is a heat conductive ceramic.

7. A heat-generating body as described in claim 1, wherein the heat-generating structure (11) is integrally formed with the heat conductive insulating structure (12).

8. A heat-generating body as claimed in claim 1, characterized in that the heat-generating structure (11) is a heat-generating film, which is attached to the heat-conductive isolating structure (12) by a film-coating technique.

9. A heat-generating body as claimed in claim 1, characterized by further comprising an electrically conductive structure (13), said electrically conductive structure (13) being disposed at one end or both ends of said heat conductive isolation structure (12) and being electrically conductively connected with said heat-generating structure (11).

10. A heat-generating body as described in claim 1, wherein the electrically conductive structure (13) is an electrically conductive film, and the electrically conductive film is attached to the thermally conductive separator structure (12) by a film-coating technique.

11. A heat generating component characterized by comprising a porous body (20) for guiding liquid in a columnar shape and a heat generating body (10) according to any one of claims 1 to 10;

the heating element (10) is inserted into the porous body (20).

12. The heating assembly according to claim 11, wherein the porous body (20) is a low thermal conductive ceramic porous body (20), the thermal conductivity of the porous body (20) being less than 2 w/m.k.

13. The heating element according to claim 11, wherein the porous body (20) is provided with an insertion hole (21) through which both ends thereof are inserted for insertion of the heating element (10).

14. The heat generating component as claimed in claim 13, wherein the shape and size of the insertion hole (21) are adapted to the shape and size of the heat conductive insulating structure (12) of the heat generating body (10).

15. The heating element according to claim 13, wherein the hole wall of the insertion hole (21) is provided with at least one ventilation groove (23), and two ends of the ventilation groove (23) are arranged in a penetrating manner to form an atomizing air passage.

16. The heating assembly according to claim 13, wherein the outer side wall of the heat conducting and isolating structure (12) of the heating body (10) is provided with at least one boss protruding outwards;

17. The heating element according to claim 11, wherein a wall surface of the insertion hole (21) where the porous body (20) is disposed opposite to the heating element (10) forms an atomization surface (22).

18. The heating assembly according to claim 17, wherein the atomizing surface (22) comprises a first atomizing area (221) which is in contact with the heating body (10) such that the atomizing medium is heated and atomized directly by the heating body (10).

19. The heating assembly according to claim 11, wherein the atomization surface (22) further comprises a second atomization zone (222) which is in non-contact with the heating body (10) so that the atomized medium is radiatively atomized by the heating body (10).

20. An electronic atomizer, characterized by comprising a heat-generating body (10) according to any one of claims 1 to 10 and a power supply unit electrically connected to said heat-generating body (10).