WO2023109356A1

WO2023109356A1 - Electronic atomization device, and heating assembly and heating body thereof

Info

Publication number: WO2023109356A1
Application number: PCT/CN2022/130104
Authority: WO
Inventors: 王守平; 张立超; 孙利佳; 张琳; 朱林林
Original assignee: 海南摩尔兄弟科技有限公司
Priority date: 2021-12-16
Filing date: 2022-11-04
Publication date: 2023-06-22
Also published as: CN114190605A

Abstract

An electronic atomization device, and a heating assembly and heating body thereof. The heating body (10) comprises a heating structure (11) and a columnar thermally conductive isolation structure (12), wherein the heating structure (11) is arranged in the thermally conductive isolation structure (12), so that, by means of the thermally conductive isolation structure (12), the heating structure (11) is isolated from an atomization medium and/or a gaseous medium formed after atomization, and thermal conduction between the heating structure (11) and the atomization medium is carried out by means of the thermally conductive isolation structure (12). By means of the thermally conductive isolation structure (12), the heating body (10) isolates the heating structure (11) from an atomization medium and/or a gaseous medium formed after atomization, and performs thermal conduction between the heating structure (11) and the atomization medium and/or the gaseous medium formed after atomization; thus direct contact between the heating structure (11) and the atomization medium can be avoided, reducing the generation probability of harmful substances, avoiding the concentration of the atomization medium, and therefore improving the atomization amount and the taste of atomization vapor formed after atomization, also prolonging the anti-fatigue life of the heating structure (11), and increasing the number of times an atomization device is used.

Description

Electronic atomization device and its heating component and heating element

technical field

The present invention relates to an atomizing device, more specifically, to an electronic atomizing device, a heating component and a heating body thereof.

Background technique

The heat-generating material in the heat-generating body of the electronic atomization device in the related art is generally in direct contact or semi-isolated state with the medium to be atomized and/or the gaseous medium formed after atomization.

technical problem

The electronic atomization device in the related art has disadvantages such as easy to produce burnt smell during the atomization process, concentration of the medium to be atomized, low amount of atomization, poor taste, and short service life of the heating material.

technical solution

The technical problem to be solved by the present invention is to provide an improved heating element, and further provide an improved electronic atomization device and a heating component.

The technical solution adopted by the present invention to solve the technical problem is: to construct a heating body, including a heating structure and a columnar heat conduction isolation structure; the heat generation structure is arranged in the heat conduction isolation structure, so that the The heating structure is isolated from the medium to be atomized and/or the gaseous medium formed after atomization, and heat conduction is performed between the heating structure and the medium to be atomized through the heat conduction isolation structure.

Preferably, the heat conduction isolation structure is a hollow structure with both ends penetrated;

The heat generating structure is disposed on the inner surface of the heat conducting isolation structure.

Preferably, an airflow channel is formed inside the heat conduction isolation structure.

Preferably, the heat conduction isolation structure is a solid structure, and the heat generating structure is embedded in the heat conduction isolation structure.

Preferably, the thermally conductive isolation structure is a dense material with high thermal conductivity, and the thermal conductivity of the thermally conductive isolation structure is greater than 90w/m.k.

Preferably, the thermally conductive isolation structure is thermally conductive ceramics.

Preferably, the heat generating structure is integrally formed with the heat conducting isolation structure.

Preferably, the heat-generating structure is a heat-generating film, and the heat-generating film is attached to the heat-conducting isolation structure through film coating technology.

Preferably, a conductive structure is further included, the conductive structure is arranged at one or both ends of the heat-conducting isolation structure, and electrically connected with the heat-generating structure.

Preferably, the conductive structure is a conductive film, and the conductive film is attached to the thermally conductive isolation structure through a film coating technique.

The present invention also constructs a heating element, including a columnar porous body for liquid conduction and the heating element described in the present invention;

The heating body is inserted into the porous body.

Preferably, the porous body is a ceramic porous body with low thermal conductivity, and the thermal conductivity of the porous body is less than 2w/m.k.

Preferably, the porous body is provided with an insertion hole passing through both ends and used for inserting the heating element.

Preferably, the shape and size of the socket are adapted to the shape and size of the heat conducting isolation structure of the heating element.

Preferably, at least one ventilation groove is opened on the hole wall of the insertion hole, and the two ends of the ventilation groove are arranged through to form an atomizing air channel.

Preferably, the outer wall of the heat conducting isolation structure of the heating element is provided with at least one outwardly protruding boss;

The boss is provided with a vent hole with both ends passing through to form an atomizing air channel.

Preferably, in the insertion hole, the wall surface of the porous body opposite to the heating element forms an atomizing surface.

Preferably, the atomization surface includes a first atomization area that is in contact with the heating element so that the medium to be atomized is heated and atomized directly through the heating element.

Preferably, the atomizing surface further includes a second atomizing area that is not in contact with the heating element so that the medium to be atomized is radiatively atomized through the heating element.

The present invention also constructs an electronic atomization device, including the heating element described in the present invention, and a power supply assembly electrically connected to the heating element.

Beneficial effect

The electronic atomization device and its heating components and heating body implementing the present invention have the following beneficial effects: the heating body arranges the heating structure in a columnar heat-conducting isolation structure, so that the heating structure is connected to the heat-generating structure through the heat-conducting isolation structure The atomized medium and/or the gaseous medium formed after atomization are isolated, and the heat-generating structure and the medium to be atomized and/or the gaseous medium formed after atomization are heat-conducted through the heat-conducting isolation structure, thereby avoiding the heat-generating structure Direct contact with the atomized medium reduces the probability of harmful substances and avoids the concentration of the atomized medium, which can increase the amount of atomization and the taste of the atomized gas after atomization, and can also improve the anti-fatigue life of the heating structure. Increase the practical times of the atomizing device.

Description of drawings

The present invention will be further described below in conjunction with accompanying drawing and embodiment, in the accompanying drawing:

Fig. 1 is a schematic structural view of a heating component of an electronic atomization device in some embodiments of the present invention;

Fig. 2 is a partial structural view of the heating element of the electronic atomization device shown in Fig. 1 .

BEST MODE FOR CARRYING OUT THE INVENTION

In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described in detail with reference to the accompanying drawings.

Figure 1 and Figure 2 show some preferred embodiments of the electronic atomization device of the present invention. The electronic atomization device can be used to heat and atomize the medium to be atomized so as to generate atomized gas for users to inhale. In some embodiments, the electronic atomization device has the advantages of simple structure, high atomization efficiency, good atomization taste, long service life, low manufacturing cost and easy implementation.

As shown in Figure 1 and Figure 2, further, in this embodiment, the electronic atomization device may include an atomizing case, a heating component and a power supply component, the heating component and power supply component may be housed in the atomizing case, the The heating element can be used to heat and atomize the medium to be atomized. The power supply component is mechanically and electrically connected with the heating component, and is used for supplying power to the heating component.

Further, in this embodiment, the heating component may include a porous body 20 and a heating body 10 . The heating element 10 can be inserted into the porous body 20, and can be electrically connected with the power supply component, and can be powered by the power supply component. The heating body 10 can be used to heat and atomize the medium to be atomized on the porous body 20 . The medium to be atomized may be a liquid medium to be atomized. The porous body 20 can communicate with the liquid storage cavity in the atomization shell, and is used for absorbing the medium to be atomized in the liquid storage cavity.

Further, in this embodiment, the heating element 10 may be columnar as a whole. Specifically, in some embodiments, the heating element 10 may be columnar as a whole. In some embodiments, the heat generating body 10 may include a heat generating structure 11 and a heat conducting isolation structure 12, the heat generating structure 11 may be disposed in the heat conducting isolation structure 12, the heat generating structure 11 may be disposed in the heat conducting isolation structure 12, and It can be integrally formed with the heat-conducting isolation structure 12 , and the heat-generating structure 11 can be used to generate heat and transfer the heat directly to the heat-conducting isolation structure 12 . The heat-conducting isolation structure 12 can be used to isolate the heat-generating structure 11 from the medium to be atomized and/or the gaseous medium formed after atomization, and can transfer the heat conducted by the heat-generating structure 11 to the material to be atomized on the porous body 20. The gaseous medium formed after atomization in the medium and/or airflow channel can conduct heat conduction to the medium to be atomized.

Further, in this embodiment, the heating structure 11 may be a heating film, which may be a sheet-like structure. The heat-generating structure 11 can be covered on the heat-conducting isolation structure 12 by film-coating technology, and forms an integral structure with the heat-conducting isolation structure 12 . Specifically, in some embodiments, the heat-generating film can be made by silk-screen printing technology or other forms of technology, and the heating efficiency and heat conduction efficiency can be improved by using the heat-generating film. In some embodiments, the shape and size of the heating film can be freely designed into various shapes according to the expected design power and atomization performance requirements.

Further, in this embodiment, the heat conduction isolation structure 12 may be a hollow structure with both ends penetrating, and the heat generating structure 11 may be disposed on the inner surface of the heat conduction isolation structure 12 . The heat conduction isolation structure 12 may be cylindrical. Of course, it can be understood that in some other embodiments, the heat conduction isolation structure 12 is not limited to be cylindrical, and may be a rectangular column or other shapes. In some embodiments, an airflow channel 121 can be formed inside the heat-conducting isolation structure 12, and the airflow channel 121 can allow external air to enter the heat-generating component 10 and can preheat the air in advance through the heat-generating structure 11 to increase heat utilization and To achieve the advantage of increasing the temperature of the atomized gas, of course, it can be understood that in some other embodiments, the airflow channel 121 can be omitted, the heat-conducting isolation structure 12 can be a solid structure, and the heat-generating structure 11 can be embedded in the heat-conducting isolation structure 12 in. In some embodiments, the heating structure 11 may not preheat the air in the airflow channel 121 .

In this embodiment, the thermally conductive isolation structure 12 may be a dense material with high thermal conductivity. Specifically, in some embodiments, the thermally conductive isolation structure 12 may be optionally made of a thermally conductive ceramic material. The thermal conductivity of the thermal insulation structure 12 is greater than 90w/m.k, it can be heated immediately and has the characteristics of high heat transfer efficiency, and its heat transfer loss can be reduced within 5%. In addition, the heat-conducting ceramic material used not only plays the role of oil separation, but also has unique infrared radiation characteristics. The atomized gas after atomization has the advantages of fineness, purity, safety and health. In addition, its thermal efficiency loss and conduction are almost unaffected; Its uniform thermal radiation electromagnetic wavelength is about 5-20 microns, which is in the mid-infrared electromagnetic wavelength range, and is the characteristic absorption line of most organic substances, which will bring great benefits to the uniform atomization and taste of the atomized medium. big benefit.

Further, in this embodiment, the heating element 10 may further include a conductive structure 13, and the conductive structure 13 may be used to electrically connect the heating structure 11 with the electrodes of the power supply component. In this embodiment, the conductive structure 13 can be disposed on the heat-conducting isolation structure 12 and electrically connected to the heat-generating structure 11 . Of course, it can be understood that in some other embodiments, the conductive structure 13 is not limited to be disposed on the heat-conducting isolation structure 12 , and it can also be disposed on the heat-generating structure 11 . In some embodiments, the conductive structure 13 may include a first conductive structure and a second conductive structure, and the first conductive structure and the second conductive structure may be disposed at one end of the thermally conductive isolation structure 12 at intervals. In some embodiments, the first conductive structure and the second conductive structure are disposed on the inner surface of the thermally conductive isolation structure 12 and may be disposed near one end of the thermally conductive isolation structure 12. Of course, it can be understood that in some other embodiments In this case, the first conductive structure and the second conductive structure 132 may also be distributed at both ends of the thermally conductive isolation structure. In some embodiments, the conductive structure 13 can be a conductive sheet, which can be attached to the inner surface or the end surface of the thermally conductive isolation structure 12 , and can also be inserted into the thermally conductive isolation structure 12 . In some embodiments, the conductive structure 13 is not limited to be a conductive sheet, and in some other embodiments, the conductive structure 13 can also be a conductive film, which can be attached to the inner surface of the thermally conductive isolation structure 12 by film coating technology and It can be arranged close to the end of the heat conduction isolation structure 12 . In some other embodiments, the conductive structure 13 may also be a lead.

Further, in this embodiment, the porous body 20 can be made of ceramics with low thermal conductivity. Specifically, the porous body 20 may be a ceramic porous body with low thermal conductivity, and its thermal conductivity may be less than 2w/m.k.

Further, in this embodiment, the porous body 20 may be cylindrical, and may be a hollow structure with both ends penetrating. It can be understood that, in some other embodiments, the porous body 20 is not limited to a cylindrical shape, and may also be a square column shape or other shapes. The heating element 10 can be inserted into the porous body 20 , which not only solves the problem of uniform heating around the circumference, but also causes almost no loss of heat due to internal control, thereby greatly improving the thermal efficiency of the heating element 10 .

Further, in this embodiment, the porous body 20 may be provided with an insertion hole 21 , and the insertion hole 21 may be disposed through both axial ends of the porous body 20 . In this embodiment, the insertion hole 21 is a round hole. The cross-sectional shape and size of the insertion hole 21 can be adapted to the cross-sectional shape and size of the heating element 10 . In some embodiments, the radial dimension of the insertion hole 21 may be equivalent to the radial dimension of the heat conduction isolation structure 12 . In some embodiments, the heating element 10 is arranged in the socket 21, and the heat-generating structure 11 is isolated from the medium to be atomized and/or the gaseous medium formed after atomization through the heat-conducting isolation layer 12, thereby improving The fatigue resistance of the heating material can avoid problems such as local concentration of the medium to be atomized, low smoke volume and poor taste consistency.

Further, in this embodiment, in the insertion hole 21 , the wall surface of the porous body 20 opposite to the heating element 10 can form an atomizing surface 22 . When the electronic atomization device is atomized, the medium to be atomized can go from the liquid storage chamber to the outside of the porous body 20 and penetrate into the porous body 20 until the atomization surface 22. The structure of the porous body 20 can effectively Ensure the balance between directional liquid inlet and atomization.

Further, in this embodiment, a plurality of ventilation grooves 23 can be opened on the hole wall of the insertion hole 21, and the ventilation grooves 23 can be arranged at intervals along the circumference of the insertion hole 21, and the two ends of each ventilation groove 23 Through the arrangement, it can form an atomizing air channel. When in use, the heating film can generate heat after being connected to the power supply through the conductive structure 13, and the heat can radiate and heat the atomized porous body 20 through the heat conducting isolation structure 12. The medium to be atomized can be heated in the atomizing air channel to form smoke, and can be sucked into the mouth of the user through the atomizing air channel. In some embodiments, the ventilation groove 23 is not limited to be opened on the wall of the insertion hole 21 , it can also be opened on the heat conduction isolation structure 12 . In some other embodiments, the outer wall of the heat conduction isolation structure 12 can be provided with a plurality of bosses, and the plurality of bosses can be arranged at intervals along the circumference of the heat conduction isolation structure 12 , and the bosses can be arranged along the heat conduction isolation structure 12 radially outwardly protruding, and a vent hole through which both ends can be arranged in the boss, and the vent hole can form an atomizing air channel. Understandably, in some other embodiments, there may be one boss. In some embodiments, the number and shape of the vent groove 23 or the vent hole can match the suction resistance and atomization power design of the medium to be atomized.

In some embodiments, the atomization surface 22 can be divided into a first atomization area 221 and a second atomization area 222 . The first atomization area 221 can be in direct contact with the heating element 10 , and the first atomization area 221 forms a high temperature atomization area. In the first atomization zone 221 , the heating element 10 can directly heat and atomize the porous body 20 . The second atomizing area 222 can be located on a wall of the vent groove 23 opposite to the heating element 10 . The second atomization area 222 has no direct contact with the heating element 10 and forms a low-temperature atomization area. In the second atomization area 222 , the heating element 10 can atomize the medium to be atomized on the porous body 20 through space radiation heat transfer. By dividing the atomizing surface 22 into a first atomizing area 221 and a second atomizing area 222, the heating element can have an atomizing environment with a three-dimensional spatial temperature gradient, and the unique three-dimensional temperature atomizing environment will affect the The taste has been greatly improved.

The electronic atomization device of this embodiment not only solves the problem of direct contact between the atomized medium and the heating structure 11, but also makes the heating material have the characteristics of safety, long life, and not easy to be polluted. At the same time, the structure is simple, the parts are convenient to manufacture, and easy to assemble , which is convenient for automatic production and practical application.

It can be understood that the above examples only express the preferred implementation of the present invention, and its description is relatively specific and detailed, but it should not be interpreted as limiting the patent scope of the present invention; it should be pointed out that for those of ordinary skill in the art In other words, on the premise of not departing from the concept of the present invention, the above-mentioned technical features can be freely combined, and some modifications and improvements can also be made, all of which belong to the protection scope of the present invention; All equivalent transformations and modifications should fall within the scope of the claims of the present invention.

Claims

A heating element, characterized in that it includes a heating structure (11) and a columnar heat-conducting isolation structure (12); the heating structure (11) is arranged in the heat-conducting isolation structure (12) to isolate The structure (12) isolates the heat-generating structure (11) from the medium to be atomized and/or the gaseous medium formed after atomization, and through the heat-conducting isolation structure (12), the heat-generating structure (11) is separated from the The atomized medium conducts heat conduction.
The heating element according to claim 1, characterized in that, the heat conduction isolation structure (12) is a hollow structure with both ends connected;

The heating structure (11) is arranged on the inner surface of the heat conducting isolation structure (12).
The heating element according to claim 2, characterized in that an air flow channel (121) is formed inside the heat conducting isolation structure (12).
The heating element according to claim 1, characterized in that, the heat conduction isolation structure (12) is a solid structure, and the heat generation structure (11) is embedded in the heat conduction isolation structure (12).
The heating element according to claim 1, characterized in that the thermally conductive isolation structure (12) is a dense material with high thermal conductivity, and the thermal conductivity of the thermally conductive isolation structure (12) is greater than 90w/m.k.
The heating element according to claim 5, characterized in that, the heat conducting isolation structure (12) is heat conducting ceramics.
The heating element according to claim 1, characterized in that, the heating structure (11) is integrally formed with the heat conducting isolation structure (12).
The heating element according to claim 1, characterized in that, the heating structure (11) is a heating film, and the heating film is attached to the heat-conducting isolation structure (12) by a film coating technique.
The heating element according to claim 1, further comprising a conductive structure (13), the conductive structure (13) is arranged at one end or both ends of the heat conduction isolation structure (12), and is connected with the heat generating The structure (11) is conductively connected.
The heating element according to claim 9, characterized in that, the conductive structure (13) is a conductive film, and the conductive film is attached to the thermally conductive isolation structure (12) by a film coating technique.
A heating component, characterized in that it comprises a columnar porous body (20) for liquid conduction and the heating body (10) according to any one of claims 1 to 10;

The heating body (10) is inserted into the porous body (20).
The heating component according to claim 11, characterized in that the porous body (20) is a ceramic porous body (20) with low thermal conductivity, and the thermal conductivity of the porous body (20) is less than 2w/m.k.
The heating component according to claim 11, characterized in that, the porous body (20) is provided with an insertion hole (21) through which both ends are penetrated and used for inserting the heating element (10).
The heating assembly according to claim 13, characterized in that, the shape and size of the insertion hole (21) is adapted to the shape and size of the heat conducting isolation structure (12) of the heating body (10).
The heating component according to claim 13, characterized in that at least one ventilation groove (23) is opened on the hole wall of the insertion hole (21), and the two ends of the ventilation groove (23) are arranged through to form an atomization airway.
The heating assembly according to claim 13, characterized in that, the outer wall of the heat conducting isolation structure (12) of the heating element (10) is provided with at least one outwardly protruding boss;

The boss is provided with a vent hole with both ends passing through to form an atomizing air channel.
The heating component according to claim 13, characterized in that, in the insertion hole (21), a wall surface of the porous body (20) opposite to the heating body (10) forms an atomizing surface (22).
The heating component according to claim 17, characterized in that, the atomizing surface (22) includes a heating element in contact with the heating element (10) so that the medium to be atomized directly passes through the heating element (10) to heat the mist The first atomization zone (221) of the atomization.
The heating component according to claim 11, characterized in that, the atomization surface (22) also includes a non-contact with the heating element (10) so that the medium to be atomized radiates through the heating element (10). A second atomization zone (222) for atomization.
An electronic atomization device, characterized by comprising the heating element (10) according to any one of claims 1 to 10, and a power supply assembly electrically connected to the heating element (10).