WO2023105841A1 - Dispositif de scellement par résine et moule de scellement - Google Patents

Dispositif de scellement par résine et moule de scellement Download PDF

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Publication number
WO2023105841A1
WO2023105841A1 PCT/JP2022/028425 JP2022028425W WO2023105841A1 WO 2023105841 A1 WO2023105841 A1 WO 2023105841A1 JP 2022028425 W JP2022028425 W JP 2022028425W WO 2023105841 A1 WO2023105841 A1 WO 2023105841A1
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WIPO (PCT)
Prior art keywords
mold
resin
clamper
sealing
work
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Application number
PCT/JP2022/028425
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English (en)
Japanese (ja)
Inventor
誠 川口
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アピックヤマダ株式会社
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Publication of WO2023105841A1 publication Critical patent/WO2023105841A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Definitions

  • the present invention relates to a resin sealing device and a sealing mold.
  • a transfer molding method is used as an example of a resin encapsulation device that seals a work having electronic components mounted on a base material with encapsulation resin (hereinafter sometimes simply referred to as "resin") and processes it into a molded product. It has been known.
  • a pot is provided to supply a predetermined amount of resin to a pair of sealing regions (cavities) provided in a sealing mold configured with an upper mold and a lower mold, and each sealing region is Workpieces are placed at positions corresponding to the respective positions, clamped with an upper mold and a lower mold, and resin is sealed by an operation of pouring resin from the pot into the cavity (Patent Document 1: Patent No. 5906528, Patent Document 2: See Japanese Patent No. 4778751).
  • the present invention has been made in view of the above circumstances, and has a structure in which a plurality of workpieces are collectively sealed with a resin, and it is possible to absorb variations in the thickness of the workpieces, and to perform molding in which the total thickness of the molded product is constant. It is an object of the present invention to provide a transfer molding method sealing mold that can be performed, facilitate maintenance, and reduce equipment costs, and a resin sealing device equipped with the sealing mold. do.
  • the present invention solves the above problems by means of solutions as described below as one embodiment.
  • a sealing mold according to the present invention includes an upper mold and a lower mold, and is a sealing mold for sealing a workpiece with a resin and processing it into a molded product, wherein the lower mold contains the tablet-shaped resin.
  • a pot into which the material is thrown is provided, and the upper die is provided with a cull block which is immovably fixed to the upper die chase block at a position directly above the pot and has a cull drilled on the lower surface thereof.
  • One of the mold and the lower mold is provided with a first work holding portion and a second work holding portion for holding one or more of the works, and the other is arranged corresponding to the first work holding portion.
  • the first cavity piece is arranged so as to be able to move up and down around the first cavity piece to form a side portion of one of the first cavities, or to form a side portion of a plurality of the first cavities to clamp the workpiece.
  • a first clamper a first clamper spring that biases the first clamper toward the first work holding portion, a second cavity piece that constitutes the bottom of the second cavity, and vertical movement around the second cavity piece.
  • a second clamper that is movably disposed to constitute a side portion of one of the second cavities or constitutes a side portion of a plurality of the second cavities for clamping the workpiece; and a second clamper spring that biases toward the second work holding portion.
  • each clamper is configured to be movable by being biased by a separate clamper spring.
  • each cavity piece is configured to be fixed to a common upper mold chase block, it is possible to form a molded product having a constant total thickness without depending on the thickness of the workpiece.
  • these can be achieved with a simpler configuration than conventional devices, it is possible to facilitate maintenance and reduce device costs.
  • each of the first clamper and the second clamper has a runner that communicates with the cull at least when the mold is closed. According to this, even if the first clamper and the second clamper are movable, a resin flow path having culls and runners can be constructed, and transfer molding can be performed.
  • first clamper spring and the second clamper spring are each provided with a plurality of types having different spring constants, and one of them is selected according to resin sealing conditions and can be attached to and detached from the upper mold or the lower mold. It is preferable that the configuration is fixed to the According to this, it is possible to set and adjust the workpiece clamping force appropriately for each workpiece. In addition, since the clamper spring can be changed, it is possible to easily perform settings that can reduce problems such as breakage of the workpiece (base material) and resin leakage in the resin sealing process.
  • each of the first clamper spring and the second clamper spring has a configuration in which a plurality of coil springs are arranged at intervals. According to this, it is possible to clamp the work with a uniform clamping force along the outer edge of the work. Therefore, it is possible to further enhance the effect of suppressing the occurrence of damage to the work (base material), leakage of resin, and the like.
  • the resin sealing device according to the present invention is required to include the sealing mold.
  • a resin sealing apparatus using a transfer molding method for collectively sealing a plurality of workpieces with resin variations in the thickness of the workpieces can be absorbed. It is possible to prevent the work from being displaced and the resin from leaking due to an insufficient amount.
  • molding can be performed in which the total thickness of the molded product is constant. Furthermore, simplification of maintenance and suppression of apparatus cost can be achieved.
  • FIG. 1 is a plan view showing an example of a sealing mold and a resin sealing device according to an embodiment of the present invention.
  • FIG. 2 is a side view taken along line II--II of FIG.
  • FIG. 3 is a front cross-sectional view showing an example of a sealing mold for the resin sealing device of FIG. 4 is a top view showing an example of a lower mold of the sealing mold of FIG. 3.
  • FIG. 5 is a bottom view showing an example of the upper mold of the sealing mold of FIG. 3.
  • FIG. 6 is an explanatory view (front cross-sectional view) of the operation of the resin sealing device of FIG.
  • FIG. 7 is an operation explanatory view (front cross-sectional view) following FIG.
  • FIG. 1 is a plan view showing an example of a sealing mold and a resin sealing device according to an embodiment of the present invention.
  • FIG. 2 is a side view taken along line II--II of FIG.
  • FIG. 3 is a front cross-sectional view showing an example of
  • FIG. 8 is an operation explanatory view (front cross-sectional view) following FIG. 9 is a bottom view showing another example of the upper mold of the sealing mold of FIG. 3.
  • FIG. 10 is a bottom view showing another example of the upper mold of the sealing mold of FIG. 3.
  • FIG. 1 is a plan view (schematic diagram) showing an example of a sealing mold 202 according to an embodiment of the present invention and a resin sealing device 1 including the sealing mold 202.
  • FIG. 2 is a side view taken along line II-II in FIG. 1 (some mechanisms are not shown).
  • arrows in the drawings may be used to indicate the front/rear, left/right, and up/down directions of the resin sealing device 1 .
  • members having the same functions are denoted by the same reference numerals, and repeated description thereof may be omitted.
  • the resin sealing device 1 is a device that seals a work (molded product) W with resin using a sealing mold 202 having an upper mold 204 and a lower mold 206 .
  • a workpiece W is held by a lower mold 206, and a cavity 208 (including part of the mold surface 204a) provided in the upper mold 204 in a corresponding arrangement is covered with a release film (hereinafter simply referred to as "
  • a release film hereinafter simply referred to as " An example of a resin sealing device using a transfer molding method that seals the work W with the resin R by covering with a film F, performing a clamping operation between the upper mold 204 and the lower mold 206, and sealing the workpiece W with the resin R will be described. do.
  • two cavities 208 are provided in one upper mold 204, and two workpieces W (for example, strip-shaped workpieces) are arranged in one lower mold 206 and sealed together with resin.
  • a configuration in which two moldings Wp are obtained at the same time by stopping is described as an example.
  • the configuration is not limited to this, and a plurality of sets of the above configurations may be arranged side by side (not shown).
  • the film F is also not essential, and the cavity 208 may be provided in either one or both of the upper mold 204 and the lower mold 206 .
  • the workpiece W to be molded has a structure in which one or a plurality of electronic components Wb are mounted on a base material Wa in a predetermined arrangement.
  • the base material Wa include plate-like members such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers formed in a rectangular shape, a circular shape, or the like.
  • electronic components Wb include semiconductor chips, MEMS chips, passive elements, radiator plates, conductive members, spacers, and combinations thereof. However, it is not limited to these.
  • Examples of methods for mounting the electronic component Wb on the base material Wa include mounting methods such as wire bonding mounting and flip chip mounting.
  • mounting methods such as wire bonding mounting and flip chip mounting.
  • an adhesive tape having heat peelability or an ultraviolet curable resin that is cured by ultraviolet irradiation is used.
  • a tablet-shaped (for example, cylindrical) thermosetting resin for example, a filler-containing epoxy resin, etc.
  • the resin R is not limited to the above state, and may have a shape other than a cylindrical shape, and may be a resin other than an epoxy-based thermosetting resin.
  • the film F examples include film materials excellent in heat resistance, peelability, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, Fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride and the like are preferably used.
  • a roll-shaped film is used as the film F.
  • a strip-shaped film may be used (not shown).
  • the resin sealing apparatus 1 includes a supply unit 100A that mainly supplies a workpiece W and a resin R to be resin-sealed, and a supply unit 100A that mainly seals the workpiece W with resin and processes it into a molded product Wp.
  • a press unit 100B for carrying out the molding, and a storage unit 100C for mainly storing the molded product Wp after resin sealing are provided as main components.
  • the resin sealing apparatus 1 also includes a transport mechanism 100D that moves between units and transports the work W, the resin R, and the molded product Wp.
  • the transport mechanism 100D includes an inloader 122 that loads the workpiece W and the resin R into the press unit 100B, an outloader 124 that transports the molded product Wp out of the press unit 100B, and a guide rail shared by the inloader 122 and the outloader 124. 126 is provided.
  • the transport mechanism 100D is not limited to the configuration described above, and may be configured to use a known pickup or the like as appropriate (not shown). Also, instead of the configuration including the loader, a configuration including an articulated robot may be employed (not shown).
  • the in-loader 122 functions to receive the workpiece W and the resin R in the supply unit 100A and transport them to the press unit 100B.
  • work holding portions 122A and 122B that are arranged in parallel in two rows along the left-right direction and each can hold one work W are provided.
  • a plurality of work holding portions 122A and 122B are positioned between the two rows of work holding portions 122A and 122B (although a case of four is given as an example, the present invention is not limited to this, or a single work holding portion may be used).
  • maintenance parts which can hold
  • the workpiece holding portions 122A and 122B and the resin holding portion 122C are provided with known holding mechanisms (for example, holding claws to hold and hold, suction holes to communicate with a suction device to suck, etc.). ) is used (not shown).
  • the in-loader 122 is configured to move in the left-right direction and the front-rear direction to load the workpiece W and the resin R into the sealing mold 202 and place them at predetermined positions on the lower mold 206 .
  • the configuration is not limited to this, and a configuration in which a loader that moves in the left-right direction to transport between units and a loader that moves in the front-back direction to carry in the sealing mold 202 are provided separately. (not shown).
  • the outloader 124 receives the molded product Wp (including unnecessary resin portions such as the cull portion and runner portion) in the press unit 100B and conveys it to the storage unit 100C.
  • molded product holding portions 124A and 124B are provided in parallel in two rows in the horizontal direction and each can hold one molded product Wp.
  • a known holding mechanism for example, a configuration that has holding claws to sandwich, a configuration that has a suction hole communicating with a suction device and sucks, etc. is used (not shown).
  • the outloader 124 is configured to move in the left-right direction and the front-rear direction to carry out the molded product Wp out of the sealing mold 202 and place it on the molded product table 114 .
  • it is not limited to this, and a configuration in which a loader that moves in the front-rear direction to carry out from the sealing mold 202 and a loader that moves in the left-right direction to transport between units are provided separately. (not shown).
  • the resin sealing device 1 can change the overall configuration mode by changing the configuration of the unit.
  • the configuration shown in FIG. 1 is an example in which two press units 100B are installed. Also, it is possible to adopt a configuration in which other units are additionally installed (none of which is shown).
  • the supply unit 100A includes, for example, a work stocker 102 used to store the work W and a work table 104 on which the work W is placed.
  • a known stack magazine, slit magazine, or the like is used for the work stocker 102, and a plurality of works W can be accommodated collectively.
  • the work W is taken out from the work stocker 102 using a known pusher or the like (not shown) and placed on the work table 104 (for example, a set of two works W are placed in parallel). is done).
  • the work W placed on the work table 104 is held by the in-loader 122 and conveyed to the press unit 100B.
  • the supply unit 100A (may be another unit) has a resin supply mechanism 140 that supplies the resin R at a side position of the work table 104.
  • the resin supply mechanism 140 includes a supply unit 142 having a hopper, a feeder, etc. to supply the resin R, and a transfer mechanism such as an elevator, and a plurality of resins R supplied from the supply unit 142 having a predetermined and a delivery portion 144 that holds the device in place. With this configuration, a plurality of resins R held in the transfer section 144 are held by the in-loader 122 and transported to the press unit 100B.
  • FIG. 3 is a front cross-sectional view (schematic) of the sealing mold 202 of the resin sealing apparatus 1
  • FIG. 4 is an upper surface of the lower mold 206 of the sealing mold 202 (that is, mold surface 206a).
  • FIG. 5 is a schematic view of the lower surface of the upper mold 204 of the sealing mold 202 (that is, the mold surface 204a).
  • the press unit 100B includes a press device 250 that clamps the workpiece W and seals it with resin by opening and closing a sealing mold 202, which will be described later.
  • the press device 250 includes a sealing die 202 having a lower die 206 and an upper die 204 and disposed between a pair of platens 252 and 254, and a pair of platens 252 and 254. It includes a plurality of connecting mechanisms 256 to be constructed, a drive source (for example, an electric motor) 260 for moving (lifting) the platen 254, and a drive transmission mechanism (for example, a ball screw or a toggle link mechanism) 262.
  • the upper die 204 is attached to the fixed platen 252 and the lower die 206 is attached to the movable platen 254 .
  • the configuration is not limited to this, and the upper die 204 may be assembled with the movable platen and the lower die 206 may be assembled with the stationary platen, or both the upper die 204 and the lower die 206 may be assembled with the movable platen. .
  • the press unit 100B also includes a film supply mechanism 201 for conveying (supplying) the roll-shaped film F without openings (holes) on the sheet surface into the sealing mold 202 .
  • a film supply mechanism 201 for conveying (supplying) the roll-shaped film F without openings (holes) on the sheet surface into the sealing mold 202 .
  • an unused film F is sent out from an unwinding section 201A, supplied to the opened sealing mold 202, and used for resin sealing in the sealing mold 202.
  • the film F is wound by the winding section 201B.
  • the unwinding section 201A and the winding section 201B may be arranged reversely in the front-rear direction, or may be arranged so as to supply a single strip of film F in the left-right direction (neither is shown). Further, as described above, a strip-shaped film may be used instead of the roll-shaped film (not shown).
  • the lower mold 206 of the sealing mold 202 includes a lower mold base 212, a lower mold chase block 216, a lower mold clamp block 220, and the like, which are assembled together.
  • lower die chase block 216 is fixed on lower die mold base 212
  • lower die mold base 212 is fixed on movable platen 254 .
  • a plurality of (for example, four) cylindrical pots 240 in which resin (here, resin tablets) R is accommodated are arranged along the front-rear direction. , but not limited to, or may be singular).
  • the pot 240 is formed as a through hole continuous to the lower die chase block 216 and the lower die clamp block 220 .
  • a plunger 16 that is pushed by a known transfer drive mechanism (not shown) is arranged in the pot 240 . With this configuration, the plunger 16 is pushed to supply the resin R in the pot 240 into the cavity 208 (described later).
  • a work holding portion 205 for holding one or a plurality of works W is provided so as to be surrounded by the lower die clamp block 220 fixed on the lower die chase block 216 . More specifically, as shown in FIG. 4, two work holding portions 205 (first work holding portion 205A and second work holding portion 205B) are arranged so as to sandwich the pot 240 in the lateral direction.
  • the work holding unit 205 has a suction path communicating with a suction device (none of which is shown), and is configured to hold the work W by suction.
  • a structure provided with holding claws for holding the outer circumference of the work W may be provided (not shown).
  • the lower mold base 212 is provided with a lower heater (not shown).
  • a lower heater (not shown).
  • heat is conducted to the periphery of the pot 240 via the lower mold chase block 216 and the like, and the resin R in the pot 240 is efficiently heated to a predetermined temperature (about 180° C. in this embodiment) in a short time and melted.
  • a predetermined temperature about 180° C. in this embodiment
  • a known heating wire heater, sheathed heater, or the like is used for the lower mold heater.
  • the upper mold 204 of the sealing mold 202 includes an upper mold base 210, an upper mold chase block 214, an upper mold clamp block 218, and the like, and these are assembled together.
  • the upper mold chase block 214 is fixed to the lower surface of the upper mold base 210
  • the upper mold base 210 is fixed to the lower surface of the stationary platen 252 .
  • an upper die chase block 214 (here, fixed to the upper die chase block 214) is positioned directly above the pot 240 of the lower die 206.
  • a cull block 244 is provided that is immovably fixed to the cull block 244 and has a cull 246 drilled through its lower surface.
  • a cavity 208 is provided in which a predetermined portion of the work W (a portion on which the electronic component Wb is mounted) is accommodated.
  • the cavity 208 is arranged to be surrounded by an upper mold clamp block 218 fixed below the upper mold chase block 214 . More specifically, the cull block 244 is sandwiched in the horizontal direction in plan view so as to correspond to the positions of the two work holding portions 205 (the first work holding portion 205A and the second work holding portion 205B) of the lower die 206. There are two cavities 208 (first cavity 208A and second cavity 208B) provided in the arrangement.
  • a first cavity piece 226A that is fixed to the upper die chase block 214 and constitutes the bottom of the first cavity 208A;
  • a first clamper 228A is disposed vertically movable around the first cavity piece 226A to constitute a side portion of the first cavity 208A and clamp the work W, and the first clamper 228A is used as a first work holding portion. and a first clamper spring 232A biasing toward 205A.
  • a second cavity piece 226B that is fixed to the upper die chase block 214 and constitutes the bottom of the second cavity 208B is arranged symmetrically with this, and vertically movable around the second cavity piece 226B in plan view.
  • a suction path for deaeration and film suction in the cavity 208 is omitted from the drawing.
  • a plurality of (two in this embodiment) workpieces W are held by the lower mold 206, and the clampers 228A and 228B hold the respective workpieces W.
  • the clampers 228A and 228B By clamping and urging the clampers 228A and 228B with corresponding clamper springs 232A and 232B to move them, variations in the thickness of the workpiece W (specifically, the base material Wa) are absorbed.
  • the cavity pieces 226A and 226B themselves are fixed to one common upper mold chase block 214, regardless of the thickness of the workpiece W, molding can be performed so that the total thickness of the molded product Wp is constant. .
  • the first clamper 228A and the second clamper 228B have a movable structure. Therefore, in the first clamper 228A and the second clamper 228B, runners 248 communicating with the cull 246 and the first cavity 208A and the second cavity 208B at least when the mold is closed are bored in the lower surface or the vicinity of the lower surface of each. It is preferable to set it as the structure provided. Thereby, even if the first clamper 228A and the second clamper 228B are movable structures, a resin flow path having the cull 246 and the runner 248 can be constructed, and transfer molding can be performed.
  • the first clamper spring 232A and the second clamper spring 232B are provided with a plurality of types of springs (eg, coil springs) having different spring constants, and one of them is selected according to the resin sealing conditions.
  • One is selected and detachably fixed to the upper die 204 .
  • the work clamping force can be individually set and adjusted, so that the conditions can be changed very easily so that the work clamping force is appropriate for each work W. That is, it is possible to easily perform a setting that can reduce problems such as breakage of the workpiece W (base material Wa) and resin leakage in the resin sealing process.
  • each of the first clamper spring 232A and the second clamper spring 232B includes a plurality of springs (as an example, coil springs) are arranged at intervals.
  • the work W can be clamped along the outer edge with a uniform clamping force. Therefore, it is possible to further enhance the effect of suppressing the occurrence of damage to the work W (base material Wa), leakage of resin, and the like.
  • the upper mold base 210 is provided with an upper heater (not shown). As a result, heat is conducted around the cavity 208 and the resin passages (cull 246, runners 248, etc.) via the upper die chase block 214 and the like, and the melted state filling the cavity 208 and the resin passages 246, 248 is conducted.
  • the resin R can be heated to a predetermined temperature. As an example, a known heating wire heater, sheathed heater, or the like is used for the upper mold heater.
  • FIG. 9 a plurality of first cavities 208A are arranged at corresponding positions of the first workpiece holding portion 205A.
  • the side of one first cavity 208A may be configured with one first clamper 228A, or as shown in FIG. may be composed of one first clamper 228A.
  • the configuration shown in FIG. 9 can be applied.
  • the first cavity 208A and the second cavity 208B are illustrated as having the same configuration, but they can be configured separately.
  • the storage unit 100C includes a molded article table 114 on which the molded article Wp is placed, a gate break section 116 for removing unnecessary resin portions such as a cull portion, a runner portion, and a gate portion from the molded article Wp, and an unnecessary resin portion. and a molded product stocker 112 used to store the molded product Wp from which the has been removed.
  • a known stack magazine, slit magazine, or the like is used for the molded product stocker 112, and can collectively store a plurality of molded products Wp.
  • the molded product Wp (connected via the unnecessary resin portion) conveyed from the press unit 100B using the outloader 124 or the like is placed on the molded product table 114 .
  • the gate break section 116 using a known pickup or the like (not shown) to remove the unnecessary resin portion, it is stored in the molded product stocker 112 using a known pusher or the like (not shown).
  • a heating step (upper mold heating step) is performed in which the upper mold 204 is adjusted to a predetermined temperature (for example, 100° C. to 200° C.) and heated by an upper heater.
  • a heating step (lower mold heating step) is performed in which the lower mold 206 is adjusted to a predetermined temperature (for example, 100° C. to 200° C.) and heated by the lower mold heater.
  • the film F is conveyed (sent out) from the unwinding section 201A to the winding section 201B by the film supply mechanism 201, and is placed at a predetermined position (a position between the upper mold 204 and the lower mold 206) in the sealing mold 202.
  • a step of supplying the film F (film supplying step) is carried out.
  • the works W are unloaded one by one from the work stocker 102 by a known pusher or the like (not shown) and placed on the upper surface of the work table 104 (in addition, a known pickup mechanism or the like is also used). can also be used).
  • the tablet-type resin R is carried out one by one from the supply unit 142 by a known feeder, elevator, or the like (not shown), and a plurality of (for example, four) resins R are transferred to a predetermined position of the delivery unit 144. Carry out the holding step.
  • the in-loader 122 is moved directly above the work table 104 (it may be on standby at the same position in advance). At that position, the work table 104 is raised (or the in-loader 122 is lowered), and the work W is held by the work holding sections 122A and 122B (in this embodiment, the work holding sections 122A and 122B each hold one work W). hold) process.
  • the in-loader 122 is moved directly above the delivery section 144 .
  • the transfer section 144 is raised (or the in-loader 122 is lowered), and the resin R is held by the resin holding section 122C (in this embodiment, the resin holding section 122C holds four pieces of resin R). Carry out the process.
  • a plurality of (two in this embodiment) workpieces W and a plurality of (four in this embodiment) resin R are placed in the sealing mold 202 of the press unit 100B in one process.
  • a process (preheating process) of preheating the work W and the resin R by a heater (not shown) provided in the in-loader 122 may be performed during the transportation.
  • the sealing mold 202 is closed, and the workpiece W is clamped between the upper mold 204 and the lower mold 206 to be resin-sealed to form a molded product Wp (resin sealing process).
  • the drive source 260 and the drive transmission mechanism 262 are driven to move the movable platen 254 upward.
  • This causes the lower mold 206 to move toward the upper mold 204 (that is, upward).
  • the first clamper 228A of the upper die 204 contacts the work W held by the first work holding portion 205A of the lower die 206, as shown in FIG. contact and the work W is clamped.
  • the second clamper 228B of the upper mold 204 comes into contact with the work W held by the second work holding portion 205B of the lower mold 206, and the work W is clamped.
  • the lower die 206 continues to move upward, as shown in FIG.
  • the first clamper 228A in contact with the work W of the first work holding portion 205A moves against the biasing force of the first clamper spring 232A. It moves upward, and the first cavity piece 226A relatively moves downward.
  • the second clamper 228B in contact with the work W of the second work holding portion 205B moves upward against the biasing force of the second clamper spring 232B, and the second cavity piece 226B relatively moves downward.
  • the transfer driving mechanism is operated to push the plunger 242 toward the upper mold 204 and force-feed the molten sealing resin into the cavity 208 through the cull 246 and the runner 248 of the upper mold 204 . 6 to 8, illustration of the release film is omitted in order to clarify the structure.
  • the resin R is thermally cured and resin sealing (compression molding) is performed to form the molded product Wp.
  • the workpieces W held by the workpiece holding portions 205A and 205B are clamped by separate clampers 228A and 228B, respectively, and the clampers 228A and 228B are biased by separate clamper springs 232A and 232B, respectively. Since it is the structure which carries out, the dispersion
  • each of the cavity pieces 226A and 226B is configured to be fixed to one common upper mold chase block 214, regardless of the thickness of the workpiece W, molding can be performed so that the total thickness of the molded product Wp is constant. can be done.
  • the sealing mold 202 is opened, and the outloader 124 removes unnecessary resin portions such as culls and runners from a plurality of (in this embodiment, two) molded products Wp in one process. and connected via them) from the sealing mold 202 is performed.
  • the film feeding mechanism 201 conveys the film F from the unwinding section 201A to the winding section 201B, thereby carrying out a step of sending out the used film F.
  • the outloader 124 carries out a step of placing the molded product Wp (including the cull portion, runner portion, etc.) on the molded product table 114 (a known pickup mechanism or the like may also be used).
  • a step of removing unnecessary resin portions such as cull portions and runner portions from the molded product Wp at the gate break portion 116 is performed.
  • a step of carrying the molded products Wp (with unnecessary resin portions removed) into the molded product stocker 112 one by one is performed by a known pusher or the like (not shown).
  • a step of post-curing the molded article Wp may be performed before these steps.
  • the above is the main operation of resin encapsulation performed using the resin encapsulation apparatus 1 .
  • the above order of steps is only an example, and it is possible to change the order of the steps before and after or perform them in parallel as long as there is no problem.
  • the two press units 100B are provided, it is possible to efficiently form a molded product by performing the above operations in parallel.
  • the sealing die and the resin sealing apparatus provided with the sealing die according to the present invention in the resin sealing apparatus using the transfer molding method for collectively sealing a plurality of workpieces with resin, it is possible to absorb variations in the thickness of the workpiece, thereby preventing damage to the workpiece due to excessive clamping force, displacement of the workpiece due to insufficient clamping force, leakage of resin, and the like.
  • molding can be performed in which the total thickness of the molded product is constant. Furthermore, compared to conventional devices, maintenance can be facilitated and device costs can be reduced.
  • the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.
  • the upper mold is provided with one upper mold resin sealing portion in which two cavities are arranged
  • the lower mold is provided with two workpiece holders each holding one workpiece.
  • a plurality of sets of the upper mold resin sealing parts are provided in the front-rear direction (or the left-right direction) of the upper mold, and the lower mold resin is arranged in the front-rear direction (or the left-right direction) of the corresponding lower mold.
  • a configuration including a plurality of sets of sealing portions may be employed. According to this configuration, even if the thickness of the work varies, it is possible to mass-produce products (that is, molded products) having a constant total thickness.
  • the cavity may be provided in the lower mold.
  • the resin passes vertically through a hole penetrating vertically in a work such as a lead frame.
  • the above-mentioned movable clamper mechanism (mechanism using a clamper, a clamper spring, etc.) is changed from the configuration in which the upper die is provided to the configuration in which the lower die is provided. do it.
  • the pot is provided on the lower side, it is possible to adopt a configuration in which the runner is communicated from the upper mold cull to the lower mold.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

La présente invention permet d'absorber une variation d'épaisseur d'une pièce, et réalise un moulage qui permet à un article moulé d'avoir une épaisseur totale constante. En tant que solution, un moule de scellement (202) selon la présente invention comprend : un pot (240) dans un moule inférieur (206) ; un bloc culot (244), dans lequel un culot (246) est percé, dans un moule supérieur (204) ; une première partie de support de pièce (205A) et une seconde partie de support de pièce (205B) dans un moule parmi le moule inférieur (206) et le moule supérieur (204) ; une ou plusieurs premières cavités (208A) et une ou plusieurs secondes cavités (208B) dans l'autre moule parmi le moule inférieur (206) et le moule supérieur (204) ; un premier élément à cavité (226A) et un premier dispositif de serrage (228A), qui constituent chacune des premières cavités (208A) ; un premier ressort (232A) de dispositif de serrage qui pousse le premier dispositif de serrage (228A) ; un second élément à cavité (226B) et un second dispositif de serrage (228B), qui constituent chacune des secondes cavités (208B) ; et un second ressort (232B) de dispositif de serrage qui pousse le second dispositif de serrage (228B).
PCT/JP2022/028425 2021-12-08 2022-07-22 Dispositif de scellement par résine et moule de scellement WO2023105841A1 (fr)

Applications Claiming Priority (2)

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JP2021-198965 2021-12-08
JP2021198965A JP2023084730A (ja) 2021-12-08 2021-12-08 樹脂封止装置及び封止金型

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WO2023105841A1 true WO2023105841A1 (fr) 2023-06-15

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012146770A (ja) * 2011-01-11 2012-08-02 Apic Yamada Corp 樹脂モールド方法及び樹脂モールド装置並びに供給ハンドラ
JP2016167583A (ja) * 2015-03-04 2016-09-15 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012146770A (ja) * 2011-01-11 2012-08-02 Apic Yamada Corp 樹脂モールド方法及び樹脂モールド装置並びに供給ハンドラ
JP2016167583A (ja) * 2015-03-04 2016-09-15 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置

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TW202323016A (zh) 2023-06-16

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