JP2023084730A - 樹脂封止装置及び封止金型 - Google Patents

樹脂封止装置及び封止金型 Download PDF

Info

Publication number
JP2023084730A
JP2023084730A JP2021198965A JP2021198965A JP2023084730A JP 2023084730 A JP2023084730 A JP 2023084730A JP 2021198965 A JP2021198965 A JP 2021198965A JP 2021198965 A JP2021198965 A JP 2021198965A JP 2023084730 A JP2023084730 A JP 2023084730A
Authority
JP
Japan
Prior art keywords
resin
mold
clamper
sealing
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021198965A
Other languages
English (en)
Japanese (ja)
Inventor
誠 川口
Makoto Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apic Yamada Corp
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Priority to JP2021198965A priority Critical patent/JP2023084730A/ja
Priority to PCT/JP2022/028425 priority patent/WO2023105841A1/fr
Priority to TW111134228A priority patent/TW202323016A/zh
Publication of JP2023084730A publication Critical patent/JP2023084730A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2021198965A 2021-12-08 2021-12-08 樹脂封止装置及び封止金型 Pending JP2023084730A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021198965A JP2023084730A (ja) 2021-12-08 2021-12-08 樹脂封止装置及び封止金型
PCT/JP2022/028425 WO2023105841A1 (fr) 2021-12-08 2022-07-22 Dispositif de scellement par résine et moule de scellement
TW111134228A TW202323016A (zh) 2021-12-08 2022-09-12 樹脂密封裝置及密封模具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021198965A JP2023084730A (ja) 2021-12-08 2021-12-08 樹脂封止装置及び封止金型

Publications (1)

Publication Number Publication Date
JP2023084730A true JP2023084730A (ja) 2023-06-20

Family

ID=86730037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021198965A Pending JP2023084730A (ja) 2021-12-08 2021-12-08 樹脂封止装置及び封止金型

Country Status (3)

Country Link
JP (1) JP2023084730A (fr)
TW (1) TW202323016A (fr)
WO (1) WO2023105841A1 (fr)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5824765B2 (ja) * 2011-01-11 2015-12-02 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置並びに供給ハンドラ
JP6611631B2 (ja) * 2015-03-04 2019-11-27 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置

Also Published As

Publication number Publication date
WO2023105841A1 (fr) 2023-06-15
TW202323016A (zh) 2023-06-16

Similar Documents

Publication Publication Date Title
US20240217144A1 (en) Compression molding device and compression molding method
TWI750369B (zh) 樹脂模製模具及樹脂模製裝置
JP2023062616A (ja) 樹脂封止装置及び樹脂封止方法
WO2023105841A1 (fr) Dispositif de scellement par résine et moule de scellement
WO2022254776A1 (fr) Dispositif de scellement par résine et procédé de scellement par résine
TWI786515B (zh) 樹脂模製裝置及樹脂模製方法
WO2023149016A1 (fr) Dispositif de scellement par résine et procédé de scellement par résine
WO2024047916A1 (fr) Dispositif de scellement à la résine et procédé de scellement à la résine
WO2023105840A1 (fr) Dispositif d'étanchéité et moule d'étanchéité en résine
WO2024161680A1 (fr) Dispositif de moulage par compression et procédé de moulage par compression
WO2023139825A1 (fr) Dispositif de scellage à la résine
WO2023144856A1 (fr) Dispositif d'étanchéité de résine, moule d'étanchéité et procédé d'étanchéité de résine
TWI853274B (zh) 壓縮成形裝置
WO2024161681A1 (fr) Résine d'étanchéité utilisée pour le moulage par compression et son procédé de formation
TWI853237B (zh) 壓縮成形裝置及壓縮成形方法
WO2023084824A1 (fr) Dispositif de scellement à la résine et procédé de scellement à la résine
JP2023106688A (ja) 圧縮成形装置及び圧縮成形方法
JP2023123172A (ja) 樹脂封止装置及び樹脂封止方法
TW202430355A (zh) 壓縮成形裝置及壓縮成形方法
JP2023048797A (ja) 樹脂封止装置及び樹脂封止方法
JP2023058834A (ja) 圧縮成形装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240119