WO2023098105A1 - 一种soic封装高温分选测试设备 - Google Patents

一种soic封装高温分选测试设备 Download PDF

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Publication number
WO2023098105A1
WO2023098105A1 PCT/CN2022/107343 CN2022107343W WO2023098105A1 WO 2023098105 A1 WO2023098105 A1 WO 2023098105A1 CN 2022107343 W CN2022107343 W CN 2022107343W WO 2023098105 A1 WO2023098105 A1 WO 2023098105A1
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module
temperature
turret
products
product
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PCT/CN2022/107343
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English (en)
French (fr)
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李辉
王体
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深圳市诺泰芯装备有限公司
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Publication of WO2023098105A1 publication Critical patent/WO2023098105A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/361—Processing or control devices therefor, e.g. escort memory
    • B07C5/362—Separating or distributor mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/38—Collecting or arranging articles in groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers

Definitions

  • the invention relates to a production test equipment for semiconductor devices, and more specifically, the invention relates to a high-temperature sorting test equipment for SOIC packaging.
  • the SOIC package is a small-profile surface-mount integrated circuit package. Its external leads (pins) are not more than 28 small-profile integrated circuits. It is derived from the SOP (Small Out-Line Package) package and generally has a width of Both body and narrow body packages are available. It takes about 30-50% less space and about 70% less thickness than an equivalent DIP package.
  • High-temperature testing is required in the production process of some SOIC packaging products to determine the adaptability of products for storage, transportation, and use under high-temperature climate conditions. The severity of the test depends on the temperature and duration of exposure to the elevated temperature. The product quality after the high temperature test is generally inspected according to the product technical conditions or the requirements stipulated in the technical agreement.
  • High-temperature testing is a relatively complex production testing process, which directly restricts the quality and production efficiency of SOIC packaging products.
  • the traditional method is to use sampling inspection in the manufacturing process, and conduct high-temperature experimental tests on samples. During the test process, various equipment is segmented and tested, which requires a large amount of manpower or various related inspection equipment.
  • the purpose of the present invention is to provide a kind of SOIC package high-temperature sorting test equipment, which can integrate the testing equipment that originally required multiple independent functions into one device, and the SOIC package product Fully heat up under high-temperature climate conditions to realize electrical performance testing under high-temperature conditions.
  • a high-temperature sorting and testing equipment for SOIC packaging including a cabinet electrical box mechanism, and a feeding turret module, used for product input and normal temperature testing of the input products, and transferring products that pass the normal temperature test to the high-temperature turret module.
  • the high-temperature turret module is used to receive products that pass the normal temperature test, perform high-temperature tests, and transfer the products that pass the high-temperature test to the discharge turret module.
  • the output turret module is used to receive the products that have passed the high temperature test, perform laser marking and visual inspection after marking, and output the qualified products after taping and packaging.
  • the feed turret module, high temperature turret module and discharge turret module are all installed on the electrical box mechanism of the cabinet, and the high temperature test equipment control system communicates with the feed turret module, high temperature turret module and discharge turret module connect.
  • the feeding turret module includes a vibrating feeding module, a rear video inspection module, a front visual inspection module, a feeding positioning correction device, a normal temperature testing module, and a centralized classification device for poor feeding, wherein:
  • the vibrating feeding module is used to move the product to the back video inspection module for back video inspection, and deliver the products that pass the back video inspection to the front visual inspection module, and the products that fail the back video inspection
  • the product is conveyed to the centralized classification device for bad feed.
  • the front visual inspection module is used for frontal visual inspection of products, and the products that pass the frontal visual inspection are delivered to the feed positioning correction device, and the unqualified products through the feed positioning correction device are sent to the poor feeding Centralized sorting device.
  • the feeding positioning correction device is used to receive the products inspected by the vision system and correct their positioning.
  • the corrected products will be transferred to the normal temperature test module for normal temperature electrical testing. Products that pass the normal temperature electrical test are transferred to the high-temperature turret module, and unqualified products are transferred to the centralized classification device for poor feed.
  • the centralized classification device for defective feed is used to receive defective products from frontal visual inspection, rearward visual inspection and normal temperature electrical test.
  • the high-temperature turret module includes a high-temperature preheating module, a high-temperature heating module, a high-temperature constant temperature module, a high-temperature constant temperature test module, and a cooling and cooling module, wherein:
  • the high-temperature preheating module, the high-temperature heating module, and the high-temperature constant temperature module are distributed in sequence, and are used to fully heat the product, and the fully heated product is transferred to the high-temperature constant temperature test module for high-temperature constant temperature testing.
  • the qualified products are transferred to the cooling and heat dissipation module for cooling and cooling, and the unqualified products are transferred to the centralized classification device for bad discharge.
  • the discharge turret module includes a discharge positioning correction device, a marking sub-disc device, a laser marking device, a printing appearance detection device, a discharge rotation positioning device, a visual appearance inspection device, and a centralized classification device for defective discharge , Taping package module. in:
  • the discharge positioning correction device is used to receive the products from the cooling and heat dissipation module for product positioning correction, and transfer the products to the marking sub-disk device of the discharge turret.
  • the laser marking device is used for laser marking and printing on the products located on the marking sub-disk device.
  • the printing appearance inspection device is used to inspect the marking appearance of the marked products.
  • the unqualified products are transferred to the centralized classification device for bad discharge, and the qualified products are transferred to the discharge rotary positioning device.
  • the discharge rotary positioning device is used for product inspection. Carry out rotation positioning correction, and after correction, the products are transferred to the visual appearance inspection device for visual appearance inspection, unqualified products are transferred to the centralized classification device for poor discharge, and qualified products are transferred to the tape packaging module for finished product output after tape packaging.
  • the defective discharge centralized sorting device is used to receive electrical defective products from high-temperature electrical testing, product marking appearance defective products, and product visual inspection of appearance defective products, and usually has multiple classification recycling barrels.
  • a feed turret cleaning recovery device is provided on one side of the centralized classification device for poor feed.
  • a high-temperature turret cleaning recovery device is installed on one side of the discharge turret module.
  • a discharge and cleaning device is provided on one side of the braided packaging module.
  • the feed positioning correction device is arranged above the normal temperature test module.
  • the cooling and cooling module is a fan group.
  • the invention patent discloses a high-temperature sorting and testing equipment for SOIC packaging, which is a high-temperature sorting and testing equipment for online full inspection during the production process of SOIC packaging products, and is also a high-efficiency and high-quality high-temperature testing equipment. Integrate the testing equipment that originally required multiple independent functions into one equipment, and fully heat up SOIC packaged products under high-temperature climate conditions to realize electrical performance testing under high-temperature conditions. To meet the product quality inspection requirements after the high temperature test, it is generally inspected according to the requirements specified in the product technical conditions or technical agreement. The impact of high temperature environment on the performance of chip packaging products is manifested in the increase in the resistance of conductive materials in the product, resulting in changes in current, which affect the performance parameters of chip packaging products. Generally, after the product is tested by temperature, if it can meet the relevant performance parameters Requirements, it is considered that the product meets the high temperature requirements.
  • the suitability inspection for storage, transportation and use of SOIC packaging products under simulated high-temperature climate environment conditions is realized. Its advantages are mainly reflected in the following: First, the cost of production management is reduced. Second, the full inspection method has a higher control over product quality and monitors product quality in real time. Third, it simplifies the product testing and production process, reduces product handling and transit storage, and requires less space. Fourth, the production efficiency of product testing is improved, and fifth, the types of product testing and production equipment are reduced, and equipment maintenance costs are reduced. Sixth, product efficiency is improved and manufacturing costs are reduced.
  • FIG. 1 is a schematic top view of the test equipment of the present invention.
  • Fig. 2 is a three-dimensional structural schematic diagram 1 of the testing equipment of the present invention.
  • Fig. 3 is a second perspective view of the test equipment of the present invention.
  • Fig. 4 is a three-dimensional schematic diagram of the test equipment of the present invention.
  • Fig. 5 is a side view structural schematic diagram of the test equipment of the present invention.
  • Fig. 6 is a schematic diagram of the test equipment of the present invention.
  • Fig. 7 is a structural flow chart of the test equipment of the present invention.
  • Fig. 8 is a product flow chart of the test equipment of the present invention.
  • FIG. 1-5 it is a kind of SOIC packaging high temperature sorting test equipment according to the present invention, which mainly includes a cabinet electric box mechanism 1 and three turret modules, and the turret module is composed of three sets of DDR motor turret modules , which are the feed turret module 2, the high temperature turret module 3 and the discharge turret module 4 respectively.
  • the feed turret module 2, the high temperature turret module 3 and the discharge turret module 4 are all installed on the cabinet electrical box mechanism 1, wherein the feed turret module 2 and the discharge turret module 4 are arranged on the high temperature turret module 3, and the feed turret module 2 communicates with the high temperature turret module 3, the discharge turret module 4 also communicates with the high temperature turret module 3, the control system of the high temperature test equipment is connected with the feed turret module 2, the high temperature The turret module 3 and the discharge turret module 4 are connected by communication, and the feed turret module 2, the high temperature turret module 3 and the discharge turret module 4 are all uniformly controlled by the high temperature test equipment control system.
  • the feed turret module 2 includes a vibration feed module 201, a rear video inspection module 202, a front visual inspection module 203, a normal temperature test module 206, a feed positioning correction device 205, a centralized classification device 207 for poor feed, And the feeding turret mechanism, wherein one end of the vibrating feeding module 201 is the product input end, and after the other end of the product is output, the feeding high-speed pick-and-place mechanism 209 of the feeding turret module 2 and the feeding turret suction nozzle mechanism 210 The joint action takes the product and moves the product to the rear video inspection module 202 for rear video detection.
  • the polarity direction of the product is judged from the detection result, and then the front visual inspection module 203 inspects the front video of the product.
  • the visual system The appearance of the product is identified, and the turret mechanism of the feeding turret module 2 puts the defective products into the centralized classification device 207 for defective feeding.
  • the product inspected by the visual system has a feed positioning correction device 205 to correct its positioning, and the corrected product is subjected to a normal temperature electrical test by the normal temperature test module 206.
  • the turret mechanism of the feeding turret module 2 transfers them to the high-temperature carrier plate of the high-temperature turret module 3. Products that fail the electrical test at room temperature, that is, fail the test, are sent to the feeding turret The turret mechanism of module 2 transfers it to the centralized classification device 207 for poor feed.
  • the high-temperature turret module 3 includes a high-temperature preheating module 301, a high-temperature heating module 302, a high-temperature constant temperature module 303, a high-temperature constant temperature test module 304, a cooling and cooling module 305, and a high-temperature turret mechanism.
  • the product is fully subjected to heat treatment, wherein, the high-temperature preheating module 301 is located in the high-temperature preheating zone, the high-temperature cooking module 302 is located in the high-temperature boiling zone, and the high-temperature constant temperature module 303 is located in the high-temperature constant temperature zone.
  • the turret mechanism of the high temperature turret module 3 transfers them to the high temperature constant temperature test module 304 for high temperature constant temperature test.
  • the turret mechanism of the high-temperature turret module 3 transfers them to the cooling and cooling module 305 for cooling and heat dissipation; for products that fail the high-temperature constant temperature test, the turret mechanism of the discharge turret module 4 It is transferred to the centralized classification device 407 for poor discharging.
  • the discharge turret module 4 includes a discharge positioning correction device 401, a marking sub-disc device 402, a laser marking device 403, a printing appearance detection device 404, a discharge rotation positioning device 405, a visual appearance inspection device 406, a discharge Defective centralized classification device 407, braiding and encapsulation module 408, discharge cleaning device 409, and discharge turret mechanism, wherein the discharge turret module 4 receives products that have been cooled and radiated from the cooling and heat dissipation module 305, specifically , the discharge high-speed pick-and-place mechanism 410 of the discharge turret and the discharge suction nozzle mechanism 411 of the discharge turret take out the product from the high-temperature carrier tray and transfer it to the discharge positioning correction device 401 of the discharge turret module 4.
  • the discharge positioning correction device 401 is used for product positioning correction to ensure that the position of the product in the subsequent process is consistent, and then the product is transferred to the marking sub-disk device 402 of the discharge turret, and the laser marking device 403 is located on the marking sub-disk device 402 Laser mark and print the products on the screen, the printed appearance inspection device 404 performs marking appearance inspection on the marked products, the visual system recognizes the marked appearance of the products, and puts the defective products into the centralized classification device 407 for defective discharge. Then transfer the good marking appearance to the discharge rotary positioning device 405, and the discharge rotary positioning device 405 corrects the rotation and positioning of the product. After the correction, the product is transferred to the visual appearance inspection device 406 for visual appearance inspection. For the unqualified visual appearance inspection The products are transferred to the centralized classification device 407 for defective discharge, and the qualified products are transferred from the turret mechanism of the discharge turret module 4 to the tape packaging module 408 for output of finished products after tape packaging.
  • a feeding turret clearing recovery device 208 is provided on one side of the poor-feed centralized classification device 207 .
  • a high-temperature turret cleaning recovery device 306 is provided on one side of the discharge turret module.
  • a discharge and cleaning device 409 is provided on one side of the braiding and encapsulation module 408 .
  • the feed turret cleaning recovery device 208, the high-temperature turret cleaning recovery device 306, and the discharge cleaning device 409 are used to receive the products that have not been cleared on the respective turret mechanisms, so as to facilitate the reset of the equipment and be used for the suction of the equipment.
  • the mouth retrieves the product and enters the testing process for testing.
  • the invention patent discloses a high-temperature sorting and testing equipment for SOIC packaging, which is a high-temperature sorting and testing equipment for online full inspection during the production process of SOIC packaging products, and is also an efficient and high-quality high-temperature testing equipment. Integrate the testing equipment that originally required multiple independent functions into one equipment, and fully heat up SOIC packaged products under high-temperature climate conditions to realize electrical performance testing under high-temperature conditions. To meet the product quality inspection requirements after the high temperature test, it is generally inspected according to the requirements specified in the product technical conditions or technical agreements. The impact of high temperature environment on the performance of chip packaging products is manifested in the increase in the resistance of conductive materials in the product, resulting in changes in current, which affect the performance parameters of chip packaging products. Generally, after the product is tested by temperature, if it can meet the relevant performance parameters Requirements, it is considered that the product meets the high temperature requirements.
  • the present invention puts the packaged product to be detected into the vibrating feed module 201 of the feed turret module 2, through the feed high-speed pick-and-place mechanism 209 of the feed turret and the feed turret
  • the feeding turret suction nozzle mechanism 210 of the tower brings the product into the rear video inspection module 202 of the feeding turret.
  • the vision system recognizes the polarity direction of the product, and then inspects the front video of the product.
  • the vision system The appearance of the product is identified, and the defective product is put into the defective centralized classification device 207 .
  • the feeding positioning correction device 205 corrects the direction according to the information results of visual recognition to ensure that the direction and position of the product in the subsequent process are consistent, and then conducts the electrical test of the product at room temperature, and the testing machine puts the defective product into the poor feeding
  • the centralized sorting device 207 brings the products that pass the electrical test at room temperature into the high-temperature carrier tray of the high-temperature turret module 3 .
  • the product passes through the high-temperature preheating module 301, the high-temperature heating module 302, the high-temperature constant temperature module 303 and other modules through the high-temperature carrier plate, so that the product is fully heat-treated, and then passes through the high-temperature constant temperature test module 304 conducts an electrical test on the product at a high temperature, and the testing machine puts the defective product into the centralized classification device 407 according to the electrical test result, and then the product passes through the cooling module 305 for cooling.
  • the discharge high-speed pick-and-place mechanism 410 and the discharge suction nozzle mechanism 411 of the discharge turret module 4 take the product out of the high-temperature carrier tray, correct the product positioning to ensure that the position of the product in the subsequent process is consistent, and then transfer the product to the discharge turret
  • the marking sub-disk device 402 of module 4 performs laser marking and printing, and performs marking appearance inspection after marking.
  • the visual system recognizes the appearance of the product marking, and puts the defective products into the centralized classification device 407 for defective products, and marks them. Products that pass the visual inspection are corrected by rotation and positioning, and then undergo a visual appearance inspection. Unqualified products are transferred to the centralized classification device 407 for defective discharge, and finally the good products are taped and packaged by the tape packaging module 408 for output.
  • the suitability inspection for storage, transportation and use of SOIC packaging products under simulated high-temperature climate environment conditions is realized. Its advantages are mainly reflected in the following: First, the cost of production management is reduced. Second, the full inspection method has a higher control over product quality and monitors product quality in real time. Third, it simplifies the product testing and production process, reduces product handling and transit storage, and requires less space. Fourth, the production efficiency of product testing is improved, and fifth, the types of product testing and production equipment are reduced, and equipment maintenance costs are reduced. Sixth, product efficiency is improved and manufacturing costs are reduced.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

本发明公开了一种SOIC封装高温分选测试设备，包括机柜电箱机构，进料转塔模块，高温转塔模块，出料转塔模块，且高温测试设备控制系统与进料转塔模块、高温转塔模块以及出料转塔模块均通信连接。设备对SOIC封装产品在高温气候环境条件下充分煲热，实现高温度环境状态下电性能测试。满足经高温试验后的产品质量检验要求，通过实施本发明实现仿真高温气候环境条件下，对SOIC封装产品储存、运输、使用的适应性检查。其优点主要体现在减少了生产管理成本；简化了产品测试生产过程，减少了产品的搬运及中转储存，需要占地空间较小；提高了产品测试生产效率，减少了产品测试生产设备种类，减少了设备维护成本。

Description

一种SOIC封装高温分选测试设备 技术领域
本发明涉及一种半导体器件的生产测试设备，更具体地，本发明涉及一种SOIC封装高温分选测试设备。
背景技术
SOIC封装是一种小外形表面贴装集成电路封装,它的外引线(引脚)数不超过28条的小外形集成电路，由SOP(Small Out-Line Package)封装派生而来，一般有宽体和窄体两种封装形式。它比同等的DIP封装减少约30-50％的空间，厚度方面减少约70％。一些SOIC封装产品生产工艺中需要进行高温测试，用来确定产品在高温气候环境条件下储存、运输、使用的适应性的方法。试验的严苛程度取决于高温的温度和曝露持续时间。经高温试验后的产品质量，一般都是按产品技术条件或技术协定中规定的要求检验。高温环境对芯片封装产品性能的影响，表现在产品内导电材料的电阻变大，导致电流的变化，对芯片封装产品性能参数影响，一般情况下，产品经温度试验后，若能满足相关性能参数要求，便认为产品符合高温要求。
由于这种SOIC封装产品引脚数量较多，体积较小。进行高温测试是一个相对复杂的生产检测工艺方法，直接制约SOIC封装产品质量和生产效率。传统做法是在制造过程中采用抽样检查的方式，将样品进行高温实验测试，测试过程多种设备分段检测，需要配置大量人力，或者多种相关检查设备。
这种做法技术的缺点和不足，主要体现在以下：第一，增加了生产管理成本；第二，抽检的方式对产品质量的把控较弱，质量不稳定；第三，产品测试生产过程复杂，需要大量的搬运及中转储存，需要占地空间较大；第四，产品测试生产效率较低，第五，产品测试生产设备种类较多，增加了设备维护成本。第六，产品效率较低，制造成本较高。
发明内容
为了克服现有技术中存在的不足，本发明目的在于提供一种SOIC封装高 温分选测试设备，其能够将原本需要多种独立功能的检测设备，整合集成在一台设备上，对SOIC封装产品在高温气候环境条件下充分煲热，实现高温度环境状态下电性能测试。
为实现上述目的，本发明采用的技术方案为：
一种SOIC封装高温分选测试设备，包括机柜电箱机构，进料转塔模块，用于产品输入以及对输入的产品进行常温测试，并将常温测试合格的产品转移至高温转塔模块。
高温转塔模块，用于接收常温测试合格的产品，进行高温测试，并将高温测试合格的产品转移至出料转塔模块。
出料转塔模块用于接收高温测试合格的产品，进行激光打标以及打标后的视觉检查，并将检查合格的产品编带封装后输出。
进料转塔模块、高温转塔模块以及出料转塔模块均安装在机柜电箱机构上，且高温测试设备控制系统与进料转塔模块、高温转塔模块以及出料转塔模块均通信连接。
进一步地，所述进料转塔模块包括振动进料模组、背面视像检查模组、正面视觉检查模组、进料定位纠正装置、常温测试模组、进料不良集中分类装置，其中：
所述振动进料模组用于将产品移动至背面视像检查模组进行背面视像检查，并将通过背面视像检查合格的产品输送给正面视觉检查模组，背面视像检查不合格的产品输送给进料不良集中分类装置。
所述正面视觉检查模组用于对产品的正面视像检查，并将通过正面视像检查合格的产品输送给进料定位纠正装置，通过进料定位纠正装置不合格的产品输送给进料不良集中分类装置。
所述进料定位纠正装置用于接收通过视觉系统检查的产品，并对其定位纠正，纠正后的产品将其转移至由常温测试模组进行常温电性测试。常温电性测试合格的产品转移至高温转塔模块，不合格的产品转移至进料不良集中分类装置。
所述进料不良集中分类装置用于接收正面视像检查、背面视像检查以及常温电性测试的不良品。
进一步地，所述高温转塔模块包括高温预热模组、高温煲热模组、高温恒温模组，高温恒温测试模组、降温散热模组，其中：
高温预热模组、高温煲热模组、高温恒温模组依次分布，用于使产品充分受热处理，充分受热的产品转移至高温恒温测试模组进行高温恒温测试。高温恒温测试后合格的产品转移至降温散热模组降温散热，不合格的产品转移至出料不良集中分类装置。
进一步地，所述出料转塔模块包括出料定位纠正装置、打标副盘装置、激光打标装置、印字外观检测装置、出料旋转定位装置、视觉外观检查装置、出料不良集中分类装置、编带封装模组。其中：
出料定位纠正装置用于接收来自降温散热模组的产品，用于进行产品定位纠正，并将产品转移至出料转塔的打标副盘装置。
激光打标装置用于对位于打标副盘装置上的产品进行激光打标印字。
印字外观检测装置用于对打标后的产品进行打标外观检查，不合格的产品转移至出料不良集中分类装置，合格品转移至出料旋转定位装置，出料旋转定位装置用于对产品进行旋转定位纠正，纠正后产品转移至视觉外观检查装置进行视觉外观检查，不合格的产品转移至出料不良集中分类装置，合格品转移至编带封装模组进行编带封装后的成品输出。
出料不良集中分类装置用于接收高温电性测试的电性不良品，产品打标外观不良品以及产品视觉检查的外观不良品，通常具备多个分类回收料桶。
进一步地，在进料不良集中分类装置的一侧设置有进料转塔清料回收装置。在出料转塔模块的一侧设置有高温转塔清料回收装置。在编带封装模组的一侧设置有出料清料装置。
进一步地，所述进料定位纠正装置设置在常温测试模组上方。
在本发明可选的一个实施例中，所述降温散热模组为风扇组。
本发明了专利公开了一种SOIC封装高温分选测试设备，是一种对SOIC 封装产品生产过程中，进行在线式全检的高温分选测试设备，也是一种高效高质量的高温测试设备。将原本需要多种独立功能的检测设备，整合集成在一台设备上，对SOIC封装产品在高温气候环境条件下充分煲热，实现高温度环境状态下电性能测试。满足经高温试验后的产品质量检验要求，一般都是按产品技术条件或技术协定中规定的要求检验。高温环境对芯片封装产品性能的影响，表现在产品内导电材料的电阻变大，导致电流的变化，对芯片封装产品性能参数影响，一般情况下，产品经温度试验后，若能满足相关性能参数要求，便认为产品符合高温要求。
通过实施本发明实现仿真高温气候环境条件下，对SOIC封装产品储存、运输、使用的适应性检查。其优点主要体现在以下：第一，减少了生产管理成本。第二，全检的方式对产品质量的把控较高，实时监控产品质量。第三，简化了产品测试生产过程，减少了产品的搬运及中转储存，需要占地空间较小。第四，提高了产品测试生产效率，第五，减少了产品测试生产设备种类，减少了设备维护成本。第六，提高了产品效率，降低了生产制造成本。
附图说明
图1是本发明测试设备的俯视结构示意图。
图2是本发明测试设备的立体结构示意图一。
图3是本发明测试设备的立体结构示意图二。
图4是本发明测试设备的立体结构示意图三。
图5是本发明测试设备的侧视结构示意图。
图6是本发明测试设备的原理图。
图7是本发明测试设备的结构流程图。
图8是本发明测试设备的产品流程图。
图中：1、机柜电箱机构。2、进料转塔模块。201、振动进料模组。202、背面视像检查模组。203、正面视觉检查模组。205、进料定位纠正装置。206、常温测试模组。207、进料不良集中分类装置。208、进料转塔清料回收装置。209、进料高速取放机构。210、进料转塔吸嘴机构。3、高温转塔模块。301、 高温预热模组。302、高温煲热模组。303、高温恒温模组。304、高温恒温测试模组。305、降温散热模组。306、高温转塔清料回收装置。4、出料转塔模块。401、出料定位纠正装置。402、打标副盘装置。403、激光打标装置。404、印字外观检测装置。405、出料旋转定位装置。406、视觉外观检查装置。407、出料不良集中分类装置。408、编带封装模组。409、出料清料装置。410、出料高速取放机构。411、出料吸嘴机构。
具体实施方式
下面结合附图和具体实施例，进一步阐明本发明，应理解这些实例仅用于说明本发明而不用于限制本发明的范围，在阅读了本发明之后，本领域技术人员对本发明的各种等价形式的修改均落于本申请所附权利要求所限定的范围。
如图1-5所示为本发明所述的一种SOIC封装高温分选测试设备，其主要包括机柜电箱机构1以及三个转塔模块，转塔模块为三套DDR电机转塔模块构成，分别为进料转塔模块2、高温转塔模块3以及出料转塔模块4。进料转塔模块2、高温转塔模块3以及出料转塔模块4均安装在机柜电箱机构1上，其中，进料转塔模块2以及出料转塔模块4设置在高温转塔模块3的相邻侧，且进料转塔模块2和高温转塔模块3相通，出料转塔模块4也与高温转塔模块3相通，高温测试设备控制系统与进料转塔模块2、高温转塔模块3以及出料转塔模块4通信连接，且进料转塔模块2、高温转塔模块3以及出料转塔模块4均由高温测试设备控制系统统一控制。
进料转塔模块2包括振动进料模组201、背面视像检查模组202、正面视觉检查模组203、常温测试模组206、进料定位纠正装置205、进料不良集中分类装置207、以及进料转塔机构，其中振动进料模组201的一端为产品输入端，另一端产品输出后，进料转塔模块2的进料高速取放机构209与进料转塔吸嘴机构210联合动作取到产品将产品移动至背面视像检查模组202进行背面视像检测，由检测结果判断产品的极性方向，接着由正面视觉检查模组203对产品的正面视像检查，视觉系统对产品的外观进行识别，进料转塔模块2的转塔机构将不良品放入进料不良集中分类装置207。通过视觉系统检查的产品，有进 料定位纠正装置205对其定位纠正，纠正后的产品由常温测试模组206对其进行常温电性测试。
对于通过常温电性测试的产品，进料转塔模块2的转塔机构将其转移至高温转塔模块3的高温载盘，常温电性测试未通过即测试不合格的产品，进料转塔模块2的转塔机构将其转移至进料不良集中分类装置207。
所述高温转塔模块3包括高温预热模组301、高温煲热模组302、高温恒温模组303，高温恒温测试模组304、降温散热模组305以及高温转塔机构，其中，由进料转塔模块2的转塔机构转移的通过常温电性测试的产品，在高温载盘上，依次经过高温预热模组301、高温煲热模组302、高温恒温模组303，在这些模组上，使产品充分受热处理，其中，高温预热模组301位于高温预热区，高温煲热模组302位于高温煲热区，高温恒温模组303位于高温恒温区。对于得到充分受热的产品，高温转塔模块3的转塔机构将其转移至高温恒温测试模组304进行高温恒温测试。
对于高温恒温测试后合格的产品，高温转塔模块3的转塔机构将其转移至降温散热模组305进行降温散热，对于高温恒温测试不合格的产品，出料转塔模块4的转塔机构将其转移至出料不良集中分类装置407。
所述出料转塔模块4包括出料定位纠正装置401、打标副盘装置402、激光打标装置403与印字外观检测装置404、出料旋转定位装置405、视觉外观检查装置406、出料不良集中分类装置407、编带封装模组408、出料清料装置409以及出料转塔机构，其中，出料转塔模块4接收来自降温散热模组305的经过降温散热的产品，具体地，出料转塔的出料高速取放机构410与出料转塔的出料吸嘴机构411将产品从高温载盘内取出转移至出料转塔模块4的出料定位纠正装置401，该出料定位纠正装置401用于进行产品定位纠正确保后工序产品位置一致，然后将产品转移至出料转塔的打标副盘装置402上，激光打标装置403对位于打标副盘装置402上的产品进行激光打标印字，印字外观检测装置404对打标后的产品进行打标外观检查，视觉系统对产品打标的外观进行识别，将不良品放入出料不良集中分类装置407，然后对打标外观良品转移至出料旋 转定位装置405，出料旋转定位装置405对产品进行旋转定位纠正，纠正后产品转移至视觉外观检查装置406进行视觉外观检查，对于视觉外观检查不合格的产品，转移至出料不良集中分类装置407，合格品由出料转塔模块4的转塔机构转移至编带封装模组408进行编带封装后的成品输出。
此外，在本实施例中，在进料不良集中分类装置207的一侧设置有进料转塔清料回收装置208。在出料转塔模块的一侧设置有高温转塔清料回收装置306。在编带封装模组408的一侧设置有出料清料装置409。所述进料转塔清料回收装置208、高温转塔清料回收装置306、出料清料装置409用于接收各自转塔机构上未被清除的产品，便于设备复位，用于设备的吸嘴重新取得产品进入测试流程进行测试。
本发明了专利公开了一种SOIC封装高温分选测试设备，是一种对SOIC封装产品生产过程中，进行在线式全检的高温分选测试设备，也是一种高效高质量的高温测试设备。将原本需要多种独立功能的检测设备，整合集成在一台设备上，对SOIC封装产品在高温气候环境条件下充分煲热，实现高温度环境状态下电性能测试。满足经高温试验后的产品质量检验要求，一般都是按产品技术条件或技术协定中规定的要求检验。高温环境对芯片封装产品性能的影响，表现在产品内导电材料的电阻变大，导致电流的变化，对芯片封装产品性能参数影响，一般情况下，产品经温度试验后，若能满足相关性能参数要求，便认为产品符合高温要求。
如图6-8所示，本发明将待检测的封装产品投放入进料转塔模块2的振动进料模组201中，通过进料转塔的进料高速取放机构209与进料转塔的进料转塔吸嘴机构210，将产品带入进料转塔的背面视像检查模组202，视觉系统对产品的极性方向进行识别，接着对产品的正面视像检查，视觉系统对产品的外观进行识别，将不良品放入进料不良集中分类装置207。进料定位纠正装置205根据视觉识别的信息结果进行方向纠正，确保后工序产品方向及位置一致，然后将产品进行常温电性测试，测试机根据电性测试结果，将不良品放入进料不良集中分类装置207，将常温电性测试合格的产品带入高温转塔模块3的高温 载盘。
产品在高温转塔内通过高温载盘分别经过了高温预热模组301、高温煲热模组302、高温恒温模组303等模组，使产品充分受热处理后，再经过高温恒温测试模组304对产品进行高温状态下电性测试，测试机根据电性测试结果，将不良品放入出料不良集中分类装置407，接着产品经过降温散热模组305进行降温处理。
出料转塔模块4的出料高速取放机构410与出料吸嘴机构411将产品从高温载盘内取出，进行产品定位纠正确保后工序产品位置一致，然后将产品转移至出料转塔模块4的打标副盘装置402进行激光打标印字，打标后进行打标外观检查，视觉系统对产品打标的外观进行识别，将不良品放入出料不良集中分类装置407，打标外观检查合格的产品在经过旋转定位纠正后，再经过视觉外观检查，不合格的产品，转移至出料不良集中分类装置407，最后对良品通过编带封装模组408进行编带封装输出。
通过实施本发明实现仿真高温气候环境条件下，对SOIC封装产品储存、运输、使用的适应性检查。其优点主要体现在以下：第一，减少了生产管理成本。第二，全检的方式对产品质量的把控较高，实时监控产品质量。第三，简化了产品测试生产过程，减少了产品的搬运及中转储存，需要占地空间较小。第四，提高了产品测试生产效率，第五，减少了产品测试生产设备种类，减少了设备维护成本。第六，提高了产品效率，降低了生产制造成本。
以上所述仅是本发明的优选实施方式，应当指出：对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (7)

  1. 一种SOIC封装高温分选测试设备，包括机柜电箱机构(1)，其特征在于，还包括：
    进料转塔模块(2)，用于产品输入以及对输入的产品进行常温测试，并将常温测试合格的产品转移至高温转塔模块(3)；
    高温转塔模块(3)，用于接收常温测试合格的产品，进行高温测试，并将高温测试合格的产品转移至出料转塔模块(4)；
    出料转塔模块(4)用于接收高温测试合格的产品，进行激光打标以及打标后的视觉检查，并将检查合格的产品编带封装后输出；
    进料转塔模块(2)、高温转塔模块(3)以及出料转塔模块(4)均安装在机柜电箱机构(1)上，且高温测试设备控制系统与进料转塔模块(2)、高温转塔模块(3)以及出料转塔模块(4)均通信连接；
    所述高温转塔模块(3)包括高温预热模组(301)、高温煲热模组(302)、高温恒温模组(303)，高温恒温测试模组(304)、降温散热模组(305)，其中：
    高温预热模组(301)、高温煲热模组(302)、高温恒温模组(303)依次分布，用于使产品充分受热处理，充分受热的产品转移至高温恒温测试模组(304)进行高温恒温测试；高温恒温测试后合格的产品转移至降温散热模组(305)降温散热，不合格的产品转移至出料不良集中分类装置(407)；在高温载盘上，产品依次经过高温预热模组(301)、高温煲热模组(302)、高温恒温模组(303)，其中，高温预热模组(301)位于高温预热区，高温煲热模组(302)位于高温煲热区，高温恒温模组(303)位于高温恒温区，对于得到充分受热的产品，高温转塔模块(3)的转塔机构将其转移至高温恒温测试模组(304)进行高温恒温测试；
    所述进料转塔模块(2)包括振动进料模组(201)、背面视像检查模组(202)、正面视觉检查模组(203)、进料定位纠正装置(205)、常温测试模组(206)、进料不良集中分类装置(207)，其中：
    所述振动进料模组(201)用于将产品移动至背面视像检查模组(202)进 行背面视像检查，并将通过背面视像检查合格的产品输送给正面视觉检查模组(203)，背面视像检查不合格的产品输送给进料不良集中分类装置(207)；
    所述正面视觉检查模组(203)用于对产品的正面视像检查，并将通过正面视像检查合格的产品输送给进料定位纠正装置(205)，通过进料定位纠正装置(205)不合格的产品输送给进料不良集中分类装置(207)；
    所述进料定位纠正装置(205)用于接收通过视觉系统检查的产品，并对其定位纠正，纠正后的产品将其转移至由常温测试模组(206)进行常温电性测试；常温电性测试合格的产品转移至高温转塔模块(3)，不合格的产品转移至进料不良集中分类装置(207)；
    所述进料不良集中分类装置(207)用于接收正面视像检查、背面视像检查以及常温电性测试的不良品。
  2. 根据权利要求1所述的一种SOIC封装高温分选测试设备，其特征在于：所述出料转塔模块(4)包括出料定位纠正装置(401)、打标副盘装置(402)、激光打标装置(403)、印字外观检测装置(404)、出料旋转定位装置(405)、视觉外观检查装置(406)、出料不良集中分类装置(407)、编带封装模组(408)，其中：
    所述出料定位纠正装置(401)用于接收来自降温散热模组(305)的产品，用于进行产品定位纠正，并将产品转移至出料转塔的打标副盘装置(402)；
    所述激光打标装置(403)用于对位于打标副盘装置(402)上的产品进行激光打标印字；
    所述印字外观检测装置(404)用于对打标后的产品进行打标外观检查，不合格的产品转移至出料不良集中分类装置(407)，合格品转移至出料旋转定位装置(405)，出料旋转定位装置(405)用于对产品进行旋转定位纠正，纠正后产品转移至视觉外观检查装置(406)进行视觉外观检查，不合格的产品转移至出料不良集中分类装置(407)，合格品转移至编带封装模组(408)进行编带封装后的成品输出。
  3. 根据权利要求2所述的一种SOIC封装高温分选测试设备，其特征在于： 所述进料不良集中分类装置(207)的一侧设置有进料转塔清料回收装置(208)。
  4. 根据权利要求3所述的一种SOIC封装高温分选测试设备，其特征在于：所述出料转塔模块(4)的一侧设置有高温转塔清料回收装置(306)。
  5. 根据权利要求4所述的一种SOIC封装高温分选测试设备，其特征在于：所述编带封装模组(408)的一侧设置有出料清料装置(409)。
  6. 根据权利要求5所述的一种SOIC封装高温分选测试设备，其特征在于：所述进料定位纠正装置(205)设置在常温测试模组(206)上方。
  7. 根据权利要求6所述的一种SOIC封装高温分选测试设备，其特征在于：所述降温散热模组(305)为风扇组。
PCT/CN2022/107343 2021-11-30 2022-07-22 一种soic封装高温分选测试设备 WO2023098105A1 (zh)

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