WO2023090033A1 - Barre omnibus, structure de connexion pour barre omnibus et carte de circuit imprimé, et procédé de connexion de barre omnibus et carte de circuit imprimé - Google Patents

Barre omnibus, structure de connexion pour barre omnibus et carte de circuit imprimé, et procédé de connexion de barre omnibus et carte de circuit imprimé Download PDF

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Publication number
WO2023090033A1
WO2023090033A1 PCT/JP2022/038857 JP2022038857W WO2023090033A1 WO 2023090033 A1 WO2023090033 A1 WO 2023090033A1 JP 2022038857 W JP2022038857 W JP 2022038857W WO 2023090033 A1 WO2023090033 A1 WO 2023090033A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
base material
bus bar
busbar
thin film
Prior art date
Application number
PCT/JP2022/038857
Other languages
English (en)
Japanese (ja)
Inventor
亮介 大阪
Original Assignee
矢崎総業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 矢崎総業株式会社 filed Critical 矢崎総業株式会社
Publication of WO2023090033A1 publication Critical patent/WO2023090033A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses

Definitions

  • the present invention relates to a bus bar, a connection structure between the bus bar and the circuit board, and a connection method between the bus bar and the circuit board.
  • connection structure between a bus bar and a circuit board which uses solder to connect the bus bar and the flexible printed circuit board.
  • solder is used to connect a predetermined portion of the circuit board to a predetermined portion of the plate-shaped bus bar. Moreover, a portion of the bus bar that is distant from the portion to which the circuit board is connected serves as a terminal connection portion that is connected to the terminal of the battery.
  • the center conductor of the coaxial cable is connected to the conductive terminal using solder.
  • the coaxial cable electrical connector described in Patent Document 1 is provided with a connection escape groove for retaining a flux material for improving the wettability of the solder.
  • solder protruding from the connection part spreads unnecessarily, this spread solder may cause defects such as fastening with the battery terminal.
  • a connection structure between a bus bar and a circuit board includes: a circuit board; a bus bar body portion including a metal base material; and a metal thin film covering the surface of the base material; a first connecting portion to which the circuit board is connected; a concave portion provided in the busbar main body and exposing the base material in at least a part of a surface thereof; and connecting the circuit board to the first connecting portion. and a solder connected to the .
  • a bus bar according to the present invention includes a bus bar main body portion including a metal base material and a metal thin film covering the surface of the base material, and a first connection provided in the bus bar main body portion to which a circuit board is connected. and a concave portion provided in the busbar main body portion and having the base material exposed on at least a part of the surface thereof.
  • a method for connecting a bus bar and a circuit board according to the present invention comprises press-working a bus bar material including a metal base material and a metal thin film covering the surface of the base material. into a predetermined shape, and forming a recess in the busbar material with the base material exposed on at least a part of the surface; and a circuit board installation step of installing the circuit board at a predetermined site different from the above using solder.
  • a method for connecting a bus bar and a circuit board according to the present invention includes a base material forming step of forming a metal base material into a predetermined shape, and a metal base material formed on the surface of the base material of the predetermined shape formed in the base material forming step. a thin film installation step of providing a thin film of by plating, and a recess for forming a recess in which the base material is exposed on at least part of the surface at a predetermined location of the base material with the thin film obtained in the thin film installation step. a circuit board installation step of installing a circuit board using solder in a predetermined portion different from the recess of the bus bar obtained by the base material molding step, the thin film installation step, and the recess formation step; , provided.
  • FIG. 1 is a perspective view of a battery unit that employs a connection structure between a bus bar and a circuit board according to an embodiment of the present invention.
  • FIG. 2 is a perspective view showing a connection structure between a bus bar and a circuit board according to the embodiment of the invention.
  • 3 is a view in the direction of arrow III in FIG. 2.
  • FIG. 4 is a diagram showing a IV-IV cross section in FIG. 5 is an enlarged view of a V portion in FIG. 4.
  • FIG. FIG. 6 is a diagram corresponding to FIG. 4 and showing a modified example of recesses of the busbar used in the connection structure between the busbar and the circuit board according to the embodiment of the present invention.
  • FIG. 7 is a diagram corresponding to FIG.
  • FIG. 8 is a diagram showing a connection structure between a busbar and a circuit board according to a comparative example.
  • FIG. 9 is a diagram showing a connection structure between an electronic component and a substrate according to a reference example.
  • connection structure 1 between a bus bar and a circuit board according to an embodiment of the present invention is used, for example, in a battery unit 3, as shown in FIG. Indicated by reference number 5 in FIG. 1 is a battery.
  • one predetermined direction in the connection structure between the bus bar and the circuit board is defined as the vertical direction
  • one predetermined direction perpendicular to the vertical direction is defined as the horizontal direction
  • the vertical direction is defined as the horizontal direction.
  • the vertical direction is defined as the direction perpendicular to the . 1 to 8
  • the vertical direction, horizontal direction, vertical direction, upward direction (upper side), and downward direction (lower side) are indicated by UDD, TD, LD, UP, and DN, respectively.
  • a connection structure 1 between a busbar and a circuit board includes a circuit board 7, a busbar 9, and solder 10, as shown in FIGS.
  • the circuit board 7, for example, a flexible printed circuit board (FPC) is adopted.
  • the busbar 9 includes a busbar main body portion 11 , a first connection portion 13 , a second connection portion 15 and a concave portion 17 .
  • the busbar main body 11 includes a metal (for example, copper) base material (raw material) and a metal thin film (for example, a tin thin film) covering the surface of the base material.
  • the metal thin film is provided on the base material by plating, for example.
  • the metal thin film protects the base material from chemical changes such as oxidation and sulfurization, prevents discoloration of the base material and rusting of the base material. It is provided to increase the bonding strength.
  • the first connection portion (circuit board connection portion) 13 is provided on the busbar body portion 11 .
  • a circuit board 7 is connected to the first connection portion 13 .
  • the concave portion 17 is provided in the busbar main body portion 11 slightly apart from the first connection portion 13 . On at least a part of the surface (recessed surface; inner surface) 18 of the recess 17, the base material is exposed due to the absence of the metal thin film. Note that the concave portion 17 may be in contact with the first connection portion 13 .
  • the solder (including lead-free solder) 10 connects the circuit board 7 to the first connecting portion 13 of the busbar body portion 11 .
  • the wettability of the solder 10 on the busbar 9 is better for the metal thin film of the busbar 9 than for the base material of the busbar 9 .
  • a case where molten solder 10 is dropped on a metal base material and a case where molten solder 10 is dropped on a metal thin film are compared. In this comparison, dripping molten solder 10 onto a thin metal film results in more molten solder 10 than dripping molten solder 10 onto a metallic base material. It flows easily and spreads easily.
  • busbar main body portion 11 is a flat portion 19. As shown in FIG. Note that the entire busbar main body portion 11 may be formed in a flat plate shape. At least a part of the circuit board 7 also has a flat plate-like portion 21 . The thickness direction of the plate-like portions 19 and 21 is shown as the vertical direction in FIG. 2 and the like.
  • the first connecting portion 13 is provided within one surface in the thickness direction (the first surface in the thickness direction) of the flat portion 19 of the busbar body portion 11 .
  • the concave portion 17 is also provided in the flat plate-like portion 19 of the busbar main body portion 11 within the first plane in the thickness direction of the busbar main body portion 11 .
  • the solder 10 is layered (flat plate).
  • the thickness direction of the flat plate portion 19 of the bus bar main body 11 the thickness direction of the solder 10, and the flat plate shape of the circuit board 7 are connected. and the thickness direction of the portion of are coincident with each other.
  • the flat plate-like portion 19 of the busbar main body 11 In the thickness direction of the flat plate-like portion 19 of the busbar main body 11, the flat plate-like portion 19 of the busbar main body 11, the solder 10, and the flat plate-like portion 21 of the circuit board 7 are arranged in this order from top to bottom. I'm listening.
  • the concave portion 17 is provided slightly away from the first connecting portion 13 within the first plane in the thickness direction of the busbar main body portion 11 as described above.
  • the second connecting portion (electrical component connecting portion) 15 is provided in the busbar main body portion 11 on the side opposite to the first connecting portion 13 with the recess 17 therebetween and slightly apart from the recess 17 . ing.
  • the second connection portion 15 is adapted to be connected to another electrical component 23 . Note that the second connecting portion 15 may be in contact with the recess 17 .
  • the second connecting portion 15 is also provided on the flat plate-like portion 19 of the busbar main body portion 11 within the first plane in the thickness direction.
  • the first connecting portion 13, the recessed portion 17, and the second connecting portion 15 are arranged in this order in the vertical direction.
  • connection structure 1 between the busbar and the circuit board a part 10A of the solder 10 enters the recess 17. As shown in FIG. A portion 10A is a portion of the solder 10 protruding from the circuit board 7 due to the connection between the first connecting portion 13 and the circuit board 7 .
  • the first connection is formed between the end 17A of the recess 17 (the end on the second connection portion 15 side) and the second connection portion 15.
  • the solder 10 used for connecting the portion 13 and the circuit board 7 and protruding from the circuit board 7 is in a non-existent state.
  • the concave portion 17 is formed by partially plastically deforming the busbar main body portion 11 .
  • the base material is exposed at least at a side portion 18 ⁇ /b>A of the surface 18 of the recess 17 .
  • the concave portion 17 is recessed from a first surface, which is one surface in the thickness direction of the flat plate-like portion 19 , toward a second surface, which is the other surface in the thickness direction of the flat plate-like portion 19 . That is, the recess 17 is recessed upward from the lower side of the flat plate-like portion 19 .
  • connection structure 1 between the bus bar and the circuit board will be explained in more detail.
  • the battery 5 is employed as the electrical component 23 connected to the second connection portion 15 of the busbar 9 .
  • the battery 5 includes a rectangular parallelepiped battery main body portion 25 and a columnar terminal portion 27 protruding from the upper surface of the battery main body portion 25 .
  • the flat plate-like portion 19 of the busbar body portion 11 When the flat plate-like portion 19 of the busbar body portion 11 is viewed in the thickness direction (vertical direction), it has a first rectangular portion 29 and a second rectangular portion 31 .
  • the lateral dimension of the second rectangular portion 31 is larger than the lateral dimension of the first rectangular portion 29 .
  • the first rectangular portion 29 When viewed in the vertical direction, the first rectangular portion 29 vertically protrudes from the second rectangular portion 31 .
  • a rectangular through hole 33 is formed in the central portion of the first rectangular portion 29 .
  • the first connecting portion 13 When viewed in the vertical direction, the first connecting portion 13 includes the entire first rectangular portion 29 and a small portion of the second rectangular portion 31 (a portion near the first rectangular portion 29). ).
  • the concave portion 17 is formed in the shape of a rectangular parallelepiped, and when viewed in the vertical direction, is formed in an elongated rectangular shape in which the value of the horizontal dimension is larger than the value of the vertical dimension.
  • the recess 17 is provided in the second rectangular portion 31 .
  • the lateral position of the recess 17 substantially matches the lateral position of the first rectangular portion 29 .
  • the recess 17 is located near the first connecting portion 13 in the longitudinal direction.
  • the concave portion 17 is formed by pressing, for example. As a result, the base material is exposed at the portion 18A on the side surface of the recess 17, and the metal thin film remains at the portion 18B on the bottom surface of the recess 17. As shown in FIG.
  • the second connecting portion 15 is provided on the second rectangular portion 31 .
  • the second connecting portion 15 is formed over substantially the entire second rectangular portion 31 in the horizontal direction.
  • the second connection portion 15 is formed on the side opposite to the first rectangular portion 29 with the recess 17 in between, slightly apart from the recess 17 in the vertical direction.
  • Two cylindrical through holes 35 are provided in the second connecting portion 15 .
  • the two through-holes 35 are arranged side by side with a predetermined interval in the lateral direction.
  • the bus bar 9 When the bus bar 9 is installed on the battery 5 , the lower surface of the second rectangular portion 31 forming the second connection portion 15 is in contact with the upper surface of the battery main body portion 25 and the terminal portion of the battery 5 . 27 passes through the through hole 35 . Also, in this state, the nut 37 is screwed onto the terminal portion 27 at the upper end portion of the terminal portion 27 . Thereby, the bus bar 9 is installed integrally with the battery 5 .
  • a flat plate-shaped portion 21 of the circuit board 7 is also formed in a rectangular shape when viewed in the vertical direction.
  • the lateral dimension of the plate-like portion 21 is slightly larger than the lateral dimension of the first rectangular portion 29 .
  • both ends of the plate-like portion 21 in the horizontal direction slightly protrude from the first rectangular portion 29 .
  • one longitudinal end 21A of the flat plate-like portion 21 is located near the recess 17, and the flat plate-like portion 21 is located on the other longitudinal end side (lower side in FIG. 3) from the one end 21A. ).
  • the solder 10 When viewed in the vertical direction, the solder 10 is provided at a portion where the first rectangular portion 29 of the busbar 9 and the flat plate portion 21 of the circuit board 7 are overlapped with each other. 10A protrudes from the overlapped portion and enters the recess 17. As shown in FIG. The recessed portion 17 is not entirely filled with the portion 10A of the solder 10, but the portion 10A of the solder 10 enters the portion of the recessed portion 17. As shown in FIG.
  • the form of the concave portion 17 may be changed as appropriate.
  • a portion 18B of the bottom surface of the recess 17 may be formed in a shape in which the central portion is recessed. That is, the depth of the recess 17 may be shallow in the periphery of the recess 17 and gradually become deeper toward the center.
  • the portion 18B of the bottom surface of the concave portion 17 may have a shape in which small irregularities are repeatedly formed instead of being flat.
  • connection structure 1 between the bus bar and the circuit board will be described.
  • the circuit board 7 is installed on the first connecting portion 13 of the bus bar 9 using solder 10 .
  • the busbar 9 is installed on the battery 5 .
  • connection structure 1 between the bus bar and the circuit board may be changed as follows.
  • the base material By pressing the metal base material, the base material is formed into a predetermined shape. Subsequently, a metal thin film is provided by plating on the surface (for example, the entire surface) of the molded base material having a predetermined shape.
  • recesses 17 are formed in predetermined locations of the thin film-attached base material (busbar main body) 11 by press working. Subsequently, the circuit board 7 is installed on the first connecting portion 13 using the solder 10 . After that, the busbar 9 is installed on the battery 5 .
  • a connection structure 1 between a busbar and a circuit board includes a circuit board 7, solder 10, and a busbar main body 11 including a metal base material and a metal thin film covering the surface of the base material.
  • the busbar body portion 11 is provided with a first connection portion 13 and a concave portion 17 .
  • a circuit board 7 is connected to the first connection portion 13 .
  • the recess 17 is provided away from the first connecting portion 13 .
  • the solder 10 connects the circuit board 7 to the first connection portion 13 of the busbar body portion 11 .
  • the recess 17 Since the recess 17 is provided, it is possible to easily determine whether or not the solder 10 overflows the recess 17 by visual observation and image processing.
  • connection structure 1 (busbar 9 ) between the busbar and the circuit board
  • the base material is exposed on at least part of the surface of the recess 17 .
  • the solder 10A melted in the concave portion 17 can be accurately removed by the exposed base material. It can be clipped into the recess 17 . Further, the expansion of the solder 10A protruding from the connecting portion between the bus bar 9 and the circuit board 7 can be more strongly restricted.
  • connection structure 301 between a busbar and a circuit board according to a comparative example will be described with reference to FIG.
  • a connection structure 301 between a busbar and a circuit board includes a busbar 303 , a circuit board 305 and solder 307 .
  • Bus bar 303 and circuit board 305 are connected to each other by solder 307 .
  • a portion 307 A of the solder 307 protrudes greatly from the connecting portion between the bus bar 303 and the circuit board 305 .
  • a through hole 309 is provided in the bus bar 303 .
  • a terminal portion 313 of a battery 311 passes through the through hole 309 .
  • a nut 315 is screwed onto the upper end of the terminal portion 313 .
  • the bus bar 303 is installed on the battery 311 by sandwiching the bus bar 303 between the battery body 317 and the nut 315 .
  • connection structure 301 between the busbar and the circuit board the concave portion 17 is not formed unlike the connection structure 1 between the busbar and the circuit board according to the embodiment of the present invention. Therefore, the spread amount of the protruding solder 307A is large. Therefore, the protruding solder 307A interferes with the battery 311, and the bus bar 303 may not be properly installed on the battery 311.
  • the component connection structure 331 includes a circuit board 335 provided with a pad portion 333 and an electronic component 337 from which a lead wire 339 extends.
  • lead wires 339 are connected to pad portions 333 using solder 341 .
  • the lead wires 339 are appropriately bent, thereby suppressing the leakage and spreading of the solder 341.
  • connection structure 1 between the busbar and the circuit board it is conceivable to change the concave portion 17 from a blind hole to a through hole penetrating the flat portion 19 of the busbar body portion 11 in the thickness direction.
  • the concave portion 17 is a through hole
  • the area of the surface (upper surface) of the bus bar 9 is reduced by the amount of the through hole, compared to the case where the concave portion 17 is a blind hole.
  • the solder 10A may leak through the through-hole.
  • the concave portion 17 as a blind hole, the flat plate-like portion 19 of the busbar main body portion 11 can be made small, and the spreading and wetting of the solder 10A can be restricted in a space-saving manner.
  • the second connection portion 15 is provided on the busbar body portion 11 .
  • the second connection portion 15 is adapted to be connected to another electrical component 23 and is separated from the recess 17 on the opposite side of the recess 17 from the first connection portion 13 .
  • solder 10A protruding from the connecting portion between the bus bar 9 and the circuit board 7 is accumulated in the concave portion 17 and blocked by the concave portion 17 so that it does not reach the second connecting portion 15.
  • the concave portion 17 is formed by partially plastically deforming the busbar body portion 11 .
  • the concave portion 17 can be formed at the same time when the bus bar 9 is formed by press working.
  • the base material basic material of the busbar 9
  • the base material can be exposed as a scratch to the extent that the metal thin film is peeled off.
  • connection structure 1 (bus bar 9) between the bus bar and the circuit board, the base material (the base material having poor wettability with the solder 10) is exposed at least at the side surface portion 18A of the surface of the recess 17. This makes it easier for the recess 17 to hold the solder 10A. In other words, since the spread of the molten solder 10 (10A) is stopped at the portion 18A on the side surface of the recess 17, the spread of the melted solder 10 (10A) is prevented more than when it is stopped at the portion 18B on the bottom of the recess 17. You can definitely stop.
  • the method of connecting busbars and circuit boards includes a busbar forming process and a circuit board installation process.
  • a busbar forming process a flat plate-shaped busbar material including a metal base material and a thin metal film covering the surface of the base material is press-formed into a predetermined shape. and forming recesses in the bus bar material.
  • the circuit board installation process is a process of installing the circuit board 7 using the solder 10 at a predetermined portion (first connection portion 13) different from the concave portion 17 of the busbar 9 molded in the busbar molding process.
  • the process of forming the bus bar 9 provided with the recess 17 can be simplified. Moreover, since the side surface (portion 18A) of the recess 17 is formed by shearing during press working, the base material can be easily exposed at the side surface (portion 18A) of the recess 17.
  • the method of connecting the bus bar and the circuit board includes a base material forming process, a thin film installation process, a recess formation process, and a circuit board installation process.
  • the base material forming process is a process in which a metal base material is pressed into a predetermined shape.
  • the thin film installation step is a step of plating a metal thin film on the surface (for example, the entire surface) of the base material having a predetermined shape formed in the base material forming step.
  • the concave portion forming step is a step of forming concave portions 17 by press working in predetermined locations of the thin film-attached base material (busbar main body portion 11) obtained in the thin film installing step.
  • solder 10 is applied to a predetermined portion (first connecting portion 13) different from the recess 17 of the bus bar 9 obtained in the base material molding step, the thin film installation step, and the recess formation step. This is the step of installing the circuit board 7 .
  • the base material can be easily exposed at the side surface (portion 18A) of the recess 17, and the surface of the bus bar 9 other than the side surface (portion 18A) of the recess 17 can be easily exposed.
  • a metal thin film can be provided on the entire surface.
  • the busbar manufacturing method has a busbar molding process.
  • the busbar forming step is a step of pressing a flat busbar material including a metal base material and a metal thin film covering the surface of the base material. Further, the busbar forming step is a step of forming the busbar material into a predetermined shape by press working and forming the recessed portion 17 in the busbar material.
  • the bus bar manufacturing method has a base material forming process, a thin film installation process, and a recess forming process.
  • the base material forming step is a step of forming a metal base material into a predetermined shape.
  • the thin film installation process is a process of providing a metal thin film by plating on the surface of the base material having a predetermined shape formed in the base material forming process.
  • the concave portion forming step is a step of forming concave portions 17 by press working in predetermined locations of the base material with the thin film obtained in the thin film installing step.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'invention concerne une structure de connexion (1) pour une barre omnibus et une carte de circuit imprimé comprenant : une carte de circuit imprimé (6); une partie corps de barre omnibus (11) comprenant un matériau de base de métal et un film mince de métal recouvrant une surface du matériau de base; une première partie de connexion (13) disposée sur la partie corps de barre omnibus (11) et sur laquelle la carte de circuit imprimé (6) est reliée; un évidement (17) disposé dans la partie de corps de barre omnibus (11) et ayant une surface (18) exposant au moins partiellement le matériau de base; et une brasure (10) reliant la carte de circuit imprimé (6) à la première partie de connexion (13).
PCT/JP2022/038857 2021-11-17 2022-10-19 Barre omnibus, structure de connexion pour barre omnibus et carte de circuit imprimé, et procédé de connexion de barre omnibus et carte de circuit imprimé WO2023090033A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021186897A JP2023074117A (ja) 2021-11-17 2021-11-17 バスバー、バスバーと回路基板との接続構造、および、バスバーと回路基板との接続方法
JP2021-186897 2021-11-17

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WO2023090033A1 true WO2023090033A1 (fr) 2023-05-25

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WO (1) WO2023090033A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003115337A (ja) * 2001-07-31 2003-04-18 Rohm Co Ltd 端子板、この端子板を備えた回路基板、およびこの端子板の接続方法
WO2011105095A1 (fr) * 2010-02-24 2011-09-01 三洋電機株式会社 Module de batterie, sysème de batterie, véhicule électrique, corps mobile, dispositif de stockage électrique, dispositif d'alimentation électrique, et appareil électrique
JP2015139289A (ja) * 2014-01-22 2015-07-30 株式会社オートネットワーク技術研究所 スイッチング基板
JP2018055843A (ja) * 2016-09-26 2018-04-05 矢崎総業株式会社 電池監視ユニット
JP2021118154A (ja) * 2020-01-29 2021-08-10 住友電装株式会社 バスバー

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003115337A (ja) * 2001-07-31 2003-04-18 Rohm Co Ltd 端子板、この端子板を備えた回路基板、およびこの端子板の接続方法
WO2011105095A1 (fr) * 2010-02-24 2011-09-01 三洋電機株式会社 Module de batterie, sysème de batterie, véhicule électrique, corps mobile, dispositif de stockage électrique, dispositif d'alimentation électrique, et appareil électrique
JP2015139289A (ja) * 2014-01-22 2015-07-30 株式会社オートネットワーク技術研究所 スイッチング基板
JP2018055843A (ja) * 2016-09-26 2018-04-05 矢崎総業株式会社 電池監視ユニット
JP2021118154A (ja) * 2020-01-29 2021-08-10 住友電装株式会社 バスバー

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