WO2023088743A1 - Surmoulage thermodurcissable de pcb empilées (pcb séparées par des pièces d'écartement) ayant un circuit de refroidissement pour un système électronique de chaîne cinématique - Google Patents

Surmoulage thermodurcissable de pcb empilées (pcb séparées par des pièces d'écartement) ayant un circuit de refroidissement pour un système électronique de chaîne cinématique Download PDF

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Publication number
WO2023088743A1
WO2023088743A1 PCT/EP2022/081228 EP2022081228W WO2023088743A1 WO 2023088743 A1 WO2023088743 A1 WO 2023088743A1 EP 2022081228 W EP2022081228 W EP 2022081228W WO 2023088743 A1 WO2023088743 A1 WO 2023088743A1
Authority
WO
WIPO (PCT)
Prior art keywords
pcbs
control unit
cavity
coolant tube
spacer
Prior art date
Application number
PCT/EP2022/081228
Other languages
German (de)
English (en)
Inventor
Sandeep Menedal
Andreas Albert
Pradeep Sulur
Thejesh Kumar MAGADI BYREDEVARU
Nurondayya Hiremath
Amaresh Tatti
Original Assignee
Vitesco Technologies Germany Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitesco Technologies Germany Gmbh filed Critical Vitesco Technologies Germany Gmbh
Publication of WO2023088743A1 publication Critical patent/WO2023088743A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20872—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20881—Liquid coolant with phase change

Definitions

  • the invention relates generally to a thermoset overmolding for a control unit having stacked circuit boards separated by at least one spacer, such as a spacer, the control unit also including a coolant circuit for a powertrain electronics system.
  • Controllers are commonly used to control the operation of a powertrain, such as a powertrain of an internal combustion engine that includes a transmission, or a powertrain of an electric vehicle, depending on the intended design.
  • the control unit typically consists of a printed circuit board (PCB) with various circuitry.
  • the PCB is in electrical communication with a connector outside of a housing.
  • the PCB is typically located within the housing and is immersed in transmission fluid.
  • the PCB may be part of a transmission control unit (TCU), and the transmission control unit may be attached to or remote from the transmission.
  • TCU transmission control unit
  • the PCB is overmolded with a thermoset material so that the PCB is protected from the transmission fluid.
  • Some controllers require the use of two or more PCBs located on opposite sides of a die-cast coolant housing, with the controller including cover plates for covering each PCB.
  • the die-cast coolant housing can be made Have aluminum die-cast parts and other parts made of plastic.
  • Some current designs use die-cast aluminum as the heat-conducting medium and have a cooling duct or cooling tube integrated into the die-cast coolant housing.
  • One object of the invention is therefore to provide a control unit which comprises a plurality of printed circuit boards arranged in a stack.
  • the controller includes a spacer, such as a standoff, cooling duct or hose, connected to one of the plurality of circuit boards, and a thermoset material that forms a housing and also conducts heat away from the circuit boards.
  • multiple circuit boards are connected to one or more spacers such that the circuit boards are spaced apart in a stacked configuration.
  • spacers or standoffs include, but are not limited to, screw domes, self-destructing snaps, or frames, and may be made of plastic or metal.
  • the assembled circuit boards are overmolded with a thermoset material. By using the thermoset material instead of a die-cast material such as aluminum, the desired cooling effect is achieved.
  • the design of the housing subassembly according to the invention also leads to a reduction in the complexity of the manufacturing and assembly processes.
  • At least two circuit boards are arranged in a manner in which a coolant tube is attached to one of the circuit boards by welding, soldering, or sheet metal clips.
  • the two circuit boards are separated by one or more spacers or standoffs.
  • are both sides of each circuit board are equipped with electronics.
  • the coolant tube serves as a medium for heat exchange such that heat is transferred from the electronics to the coolant tube.
  • the two printed circuit boards are overmoulded with a duroplastic material. The thermoset material also serves as a heat exchange medium to transfer heat from the electronics to the coolant tube.
  • a minimum number of components is used to construct the control unit of the present invention. Since the number of parts is reduced, the manufacturing cost of the control unit is also reduced. In one embodiment, the control unit is compact compared to conventional control units. In one embodiment, the spacing between the electronic components and the cooling tube is reduced.
  • the controller of the present invention is usable with an internal combustion engine and transmission vehicle, a battery powered electric vehicle, or any other type of vehicle that requires a controller to perform various functions.
  • one of the circuit boards is larger than the other to allow for the closure of the overmolding tool for the overmolding process.
  • an interposer is used to hold one of the circuit boards in place when the overmolding tool is closed.
  • the coolant tube is made of a material such as aluminum, copper, steel, and others. manufactured. The coolant tube is mounted to one of the circuit boards using any of a variety of connections, including but not limited to clamping, welding, or soldering.
  • thermoset overmolding for a control unit according to independent claim 1 and the method according to independent Claim 7 can be solved.
  • Preferred embodiments are given in the dependent claims.
  • the present invention is a controller having a plurality of printed circuit boards (PCBs) and at least one spacer located between and connected to two of the PCBs and forming a cavity between the two PCBs.
  • the controller also includes a coolant tube connected to one of the PCBs such that at least a portion of the coolant tube is within the cavity, a housing surrounding the PCBs and the spacer, and a thermoset material.
  • the housing is formed by the thermoset material such that a portion of the thermoset material surrounds the PCBs and another portion of the thermoset material resides in the cavity.
  • the control unit also includes at least one bracket connected to one of the PCBs such that the bracket is in the cavity and the coolant tube is connected to the bracket.
  • the controller also includes a plurality of fasteners, and at least one of the fasteners connects a first of the two PCBs to the spacer and another of the fasteners connects a second of the PCBs to the spacer.
  • thermoset material in the cavity transfers heat from the PCBs to the coolant tube.
  • the in-cavity portion of the coolant tube is generally S-shaped.
  • the coolant tube can be any shape to meet various heat transfer and cooling requirements, such as generally U-shaped, generally L-shaped, generally V-shaped, straight, and others
  • the in-cavity portion of the coolant tube is surrounded by the thermoset material.
  • the present invention is a method of manufacturing a control unit, providing a plurality of PCBs, providing at least one spacer, providing a coolant tube, and providing a housing.
  • the method includes connecting the first one of the PCBs to the spacer, connecting the coolant tube to the first PCB, and connecting a second one of the PCBs to the at least one spacer.
  • the method includes forming a cavity between the first one of the PCBs and the second one of the PCBs after the first one of the PCBs and the second one of the PCBs have been connected to the spacer such that at least a portion of the coolant tube is in the cavity.
  • the method of the present invention also includes over-molding with a thermoset material such that a portion of the thermoset material forms a housing surrounding the PCBs and spacer and another portion of the thermoset material resides in the cavity. In one embodiment, the method of the present invention also includes transferring heat from the PCBs to the coolant tube using the thermoset material within the cavity.
  • the inventive method also includes providing at least one clip, connecting the clipping to the first of the plurality of PCBs and connecting the coolant tube to the at least one clip before connecting the at least one spacer to the first of the plurality of PCBs.
  • the method of the present invention also includes providing a plurality of fasteners, connecting the first of the two of the plurality of PCBs to the at least one spacer using a first of the plurality of fasteners, and connecting the second of the two of the plurality PCBs with the at least one spacer using another of the plurality of fasteners.
  • FIG. 1 is a perspective view of a controller with a thermoset overmold and stacked circuit boards, according to embodiments of the present invention
  • Figure 2 is a sectional view taken along lines A-A of Figure 1;
  • Figure 3A is an exploded side view of a circuit board and bracket assembled as part of a controller with a thermoset overmold and stacked Circuit boards according to embodiments of the present invention are used;
  • 3B is a perspective view of a clip connected to a circuit board used as part of a controller with a thermoset overmold and stacked circuit boards according to embodiments of the present invention
  • 4A is an exploded side view of a circuit board, bracket, and coolant tube used as part of a controller having a thermoset overmold and stacked circuit boards according to embodiments of the present invention
  • FIG. 4B is a perspective view of a clip and coolant tube connected to a circuit board used as part of a controller having a thermoset overmold and stacked circuit boards according to embodiments of the present invention
  • 5A is an exploded side view of two fasteners and two standoffs connected to a circuit board with a bracket and coolant tube connected to the circuit board, all as part of a thermoset overmolded controller and stacked circuit boards according to embodiments of the present invention be used;
  • 5B is a perspective view of a bracket, coolant tube, two standoffs, and two fasteners connected to a circuit board used as part of a controller with thermoset overmolding and stacked circuit boards according to embodiments of the present invention
  • 6A is an exploded side view of two additional fasteners connected to two standoffs to secure a second circuit board to the two standoffs, the two standoffs, a clip, and a coolant tube connected to a first circuit board, all as part of a Control unit with a thermoset overmolding and stacked circuit boards can be used according to embodiments of the present invention
  • Figure 6B is a perspective view of two circuit boards connected using fasteners with two standoffs, and a clamp and coolant tube also connected to one of the circuit boards used as part of a controller with a thermoset overmold and stacked circuit boards Embodiments of the present invention are used;
  • FIG. 7 is a side view of two circuit boards connected using fasteners with two standoffs, and a clamp and coolant tube also connected to one of the circuit boards used as part of a controller with a thermoset overmold and stacked circuit boards according to embodiments of the present invention
  • thermoset overmold and stacked circuit boards are a side view of a controller with a thermoset overmold and stacked circuit boards according to embodiments of the present invention
  • FIG. 9 is a sectional view of an alternative embodiment of a control unit having a thermoset overmold and stacked circuit boards in accordance with embodiments of the present invention and 10 is a sectional view of another alternative embodiment of a control unit having a thermoset overmold and stacked circuit boards with an intermediate support holding the circuit boards in place according to embodiments of the present invention.
  • the control unit 10 includes a plurality of circuit boards, and in the embodiment shown includes a first printed circuit board (PCB) 12 and a second PCB 14. Each PCB 12, 14 is separated by one or more spacers or spacers 16a, 16b , each spacer 16a, 16b being between the circuit boards 12,14. In the area between the printed circuit boards 12, 14 there is a cavity which is generally designated 18. Connected to the first circuit board 12 is a connector, which is a clip 20 in the embodiment shown. The bracket 20 is connected to the circuit board 12 using a snap fit connection, however, it is within the scope of the invention that other types of connectors and connections could be used.
  • each of the printed circuit boards 12, 14 has two openings 22 and each standoff 16a, 16b has two threaded openings 24 therein.
  • the control unit 10 also includes a plurality of fasteners 26a, 26b, 26c, 26d, and each fastener 26a, 26b, 26c, 26d extends through one of the openings 22 and into one of the threaded openings 24.
  • the control unit 10 also includes a coolant tube 28 a portion of which extends through the cavity 18 . In the embodiment shown, the coolant tube 28 extends in a serpentine fashion through the cavity 18 such that the portion of the coolant tube 28 located within the cavity 18 is generally S-shaped.
  • the coolant tube 28 may be disposed in the cavity 18 in other configurations having other shapes.
  • the coolant tube 28 is connected to the first PCB 12 using the clamp 20 as shown in FIG. 2, however, it is within the scope of the invention for the coolant tube 28 to be connected using other types of connections, such as welding , soldering or the like, may be connected to the first PCB 12 .
  • Fasteners 26a, 26b, 26c, 26d are surrounded by a thermoset material formed during an over-molding process.
  • a portion of the thermoset material forms the housing 30 that surrounds the components, and another portion of the thermoset material fills the cavity 18 in the areas of the cavity 18 not occupied by the bracket 20 and coolant tube 28 .
  • the thermoset material acts as a heat transfer medium to facilitate the transfer of heat from the first PCB 12 and the second PCB 14 to the coolant in the coolant tube 28 .
  • the thermoset material also allows heat to be dissipated from any circuitry on the first PCB 12 and the second PCB 14.
  • the thermoset material can be any type of material that allows heat to be dissipated from the first PCB 12 and the second PCB 14 allows.
  • FIG. 3A One embodiment of the steps for manufacturing and assembling the control unit 10 of the present invention is illustrated in Figures 3A-8.
  • the clip 20 is connected to the first PCB 12 .
  • the clip 20 is connected to the first PCB 12 using a snap fit or other type of connection and is shown connected to the first PCB 12 in Figure 3B.
  • the coolant tube 28 is connected to the first PCB 12 using the clamp 20 .
  • the clamp 20 substantially encircles a portion of the coolant tube 28 and applies a force to the coolant tube 28 to secure the coolant tube 28 in place so that the coolant tube 28 does not contact any of the PCBs 12, 14 is in contact.
  • the two standoffs 16a, 16b are mounted to the first PCB 12 using two of the fasteners 26a, 26b.
  • Each fastener 26a, 26b extends through a respective opening 22 and into a respective threaded opening 24 of one of the spacers 16a, 16b.
  • the spacers 16a, 16b are shown connected to the first PCB 12 in Figure 5B by two of the fasteners 26a, 26b.
  • the second PCB 14 is then connected to the spacers 16a, 16b using fasteners 26c, 26d. Again, each fastener 26c, 26d extends through a corresponding opening 22 of the second PCB 14 and into a corresponding threaded opening 24 of one of the standoffs 16a, 16b, as shown in Figure 6A.
  • Both PCBs 12, 14 are shown connected to spacers 16a, 16b in Figs. 6B and 7. Referring now to FIG. 7, both PCBs 12, 14 are shown connected to standoffs 16a, 16b before the thermoset material is applied during the overmolding process.
  • thermoset material is then applied during the over-molding process to form the housing 30 which surrounds the components and such that the thermoset material also fills the cavity 18 in the areas of the cavity 18 not covered by the bracket 20 and coolant tube 28 are occupied.
  • the control unit 10 is complete as shown in FIGS. 1 and 8.
  • FIG. 9 An alternate embodiment of the present invention is illustrated in FIG. 9, wherein like reference numerals refer to like components.
  • the first PCB 12 is larger than the second PCB 14.
  • the first PCB 12 includes a first end portion 32 and a second end portion 34 that extend out of the housing 30 and are not covered by the thermoset material .
  • each of the end portions 32, 34 is connected to a tool which secures the first PCB 12 in place and thereby also secures the remainder of the described components in place during the overmolding process.
  • FIG. 10 Another alternative embodiment of the present invention is illustrated in FIG. 10, wherein like reference numerals refer to like components.
  • This embodiment includes an intermediate support, indicated generally at 36, and the intermediate support 36 includes two inserts 36a, 36b.
  • the first insert 36a includes a large diameter portion 38a and a small diameter portion 38b
  • the second insert 36b also includes a large diameter portion 40a and a small diameter portion 40b.
  • the inserts 36a, 36b are positioned such that the small diameter portions 38b, 40b extend through the second PCB 14 and into the cavity 18 and mate with the first PCB 12 in be in contact without penetrating them.
  • the intermediate support 36 serves to hold the position of the first PCB 12 and the second PCB 14 during the overmolding process. After the completion of the overmolding process, there are two surfaces of the second PCB 14 that the large diameter portions 38a, 40a will contact. These contact surfaces 42a, 42b are not covered by the housing 30 after the end of the overmolding process.
  • Embodiments of the controller 10 according to the present invention are usable with an internal combustion engine vehicle with a transmission, a battery powered electric vehicle, or any other type of vehicle that requires a controller to perform various functions.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Est divulguée une unité de commande (10) ayant une pluralité de cartes de circuit imprimé (PCB) (12, 14) et au moins une entretoise (16a, 16b) qui est située entre deux des PCB (12, 14), est connectée à celles-ci et forme une cavité (18) entre les deux PCB (12, 14). L'unité de commande (10) contient également un conduit de liquide de refroidissement (28) qui est connecté à l'une des PCB (12, 14) de telle sorte qu'au moins une partie du conduit de liquide de refroidissement (28) est située dans la cavité (18), un boîtier (30) qui entoure les PCB (12, 14) et l'entretoise (16a, 16b), et un matériau thermodurcissable. Le boîtier (30) est formé par le matériau thermodurcissable de telle sorte qu'une partie du matériau thermodurcissable entoure les PCB et une autre partie du matériau thermodurcissable est située dans la cavité (18).
PCT/EP2022/081228 2021-11-16 2022-11-09 Surmoulage thermodurcissable de pcb empilées (pcb séparées par des pièces d'écartement) ayant un circuit de refroidissement pour un système électronique de chaîne cinématique WO2023088743A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021211936.0 2021-11-16
DE102021211936.0A DE102021211936B3 (de) 2021-11-16 2021-11-16 Duroplast-Umspritzung gestapelter (durch Distanzstücke getrennter) PCBs miteinem Kühlmittelkreislauf für ein Antriebsstrangelektroniksystem

Publications (1)

Publication Number Publication Date
WO2023088743A1 true WO2023088743A1 (fr) 2023-05-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2022/081228 WO2023088743A1 (fr) 2021-11-16 2022-11-09 Surmoulage thermodurcissable de pcb empilées (pcb séparées par des pièces d'écartement) ayant un circuit de refroidissement pour un système électronique de chaîne cinématique

Country Status (2)

Country Link
DE (1) DE102021211936B3 (fr)
WO (1) WO2023088743A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002031924A1 (fr) 2000-10-12 2002-04-18 Flexconn, Inc. Connecteur adaptatif pour structure etagee
US20060012034A1 (en) * 2004-07-13 2006-01-19 Hitachi, Ltd. Engine control circuit device
US20060171127A1 (en) * 2005-01-04 2006-08-03 Hitachi, Ltd. Electronic control unit and method thereof
CN107694127A (zh) 2017-11-06 2018-02-16 中国地质大学（武汉） 一种堆叠型拼插式电子积木
US10720720B2 (en) 2018-03-19 2020-07-21 Visteon Global Technologies, Inc. System of stacking electronic modules on a base board
US20200296834A1 (en) * 2016-06-28 2020-09-17 Robert Bosch Gmbh Electronic unit and method for forming an electronic unit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2352092B (en) 1999-07-13 2003-10-29 Delphi Tech Inc Motor vehicle control module
US6396692B1 (en) 2000-07-27 2002-05-28 Motorola, Inc. Electronic control unit with integrated cooling module
DE10316449A1 (de) 2003-04-10 2004-10-21 Robert Bosch Gmbh Elektronisches Steuergerät mit integrierter Kühlung
DE102015223550A1 (de) 2015-11-27 2017-06-01 Robert Bosch Gmbh Elektronikmodul und Verfahren zum Herstellen eines Elektronikmoduls mit einem fluiddichten Gehäuse
DE102016223889A1 (de) 2016-12-01 2018-06-07 Zf Friedrichshafen Ag Stapelbares Elektronikmodul, Wechselrichter und Kraftfahrzeugantriebsstrang

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002031924A1 (fr) 2000-10-12 2002-04-18 Flexconn, Inc. Connecteur adaptatif pour structure etagee
US20060012034A1 (en) * 2004-07-13 2006-01-19 Hitachi, Ltd. Engine control circuit device
US20060171127A1 (en) * 2005-01-04 2006-08-03 Hitachi, Ltd. Electronic control unit and method thereof
US20200296834A1 (en) * 2016-06-28 2020-09-17 Robert Bosch Gmbh Electronic unit and method for forming an electronic unit
CN107694127A (zh) 2017-11-06 2018-02-16 中国地质大学（武汉） 一种堆叠型拼插式电子积木
US10720720B2 (en) 2018-03-19 2020-07-21 Visteon Global Technologies, Inc. System of stacking electronic modules on a base board

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