WO2023088002A1 - 基板匹配电路、射频功率放大器及射频芯片 - Google Patents

基板匹配电路、射频功率放大器及射频芯片 Download PDF

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WO2023088002A1
WO2023088002A1 PCT/CN2022/125448 CN2022125448W WO2023088002A1 WO 2023088002 A1 WO2023088002 A1 WO 2023088002A1 CN 2022125448 W CN2022125448 W CN 2022125448W WO 2023088002 A1 WO2023088002 A1 WO 2023088002A1
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inductor
capacitor
matching circuit
inductance
radio frequency
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PCT/CN2022/125448
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English (en)
French (fr)
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于卫东
郭嘉帅
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深圳飞骧科技股份有限公司
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Publication of WO2023088002A1 publication Critical patent/WO2023088002A1/zh

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/02—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/56—Modifications of input or output impedances, not otherwise provided for
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/38—Impedance-matching networks

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  • the utility model relates to the technical field of wireless communication, in particular to a substrate matching circuit, a radio frequency power amplifier and a radio frequency chip.
  • the traditional substrate matching circuit design is still relatively fixed for taking into account these three areas at the same time, but it cannot achieve better results in terms of performance improvement. Therefore, it is necessary to further improve the effects of signal filtering, isolation, and transmission loss.
  • the utility model proposes a substrate matching circuit, a radio frequency power amplifier and a radio frequency chip with better filtering effect, loss and isolation to achieve balance, good transmission adaptability, small size and low production cost.
  • an embodiment of the utility model provides a substrate matching circuit, including a transmitting matching circuit, a first receiving matching circuit and a second receiving matching circuit respectively connected to the transmitting matching circuit;
  • the transmitting matching circuit includes a first inductor, a second inductor, a third inductor, a fourth inductor, a ninth inductor, a tenth inductor, an eleventh inductor, a first capacitor, a second capacitor, a third capacitor, and a fourth capacitor , the fifth capacitor;
  • the first end of the first inductance is connected to the battery voltage, and connected to the ground after connecting the first capacitor in series;
  • the second end of the first inductance is connected to the power amplification signal transmitting end as an input, and connected to the the first end of the second inductance;
  • the second terminal of the second inductor is respectively connected to the first terminal of the second capacitor and the first terminal of the third capacitor;
  • the second end of the second capacitor is connected to ground, and the second end of the third capacitor is respectively connected to the first end of the third inductor and the first end of the fourth inductor;
  • the first end of the third inductor is connected to ground, and the second end of the fourth inductor is connected to the first end of the ninth inductor;
  • the second end of the ninth inductor is respectively connected to the first end of the fifth capacitor and the first end of the tenth inductor;
  • the second end of the fifth capacitor is connected to ground, the second end of the tenth inductor is used as an output to connect to an external antenna, and the second end of the tenth inductor is connected to the eleventh inductor in series grounding;
  • the first receiving matching circuit includes a fifth inductor, a sixth inductor, a seventh inductor, an eighth inductor, a sixth capacitor, a seventh capacitor, an eighth capacitor, and a first switch;
  • the second end of the fifth inductance is connected to the first end of the ninth inductance, and the first end of the fifth inductance is connected in series with the sixth inductance as a first receiving signal end; and the fifth inductance The first end of the sixth capacitor is connected to the ground after being connected in series;
  • Both the second end of the seventh inductance and the second end of the eighth inductance are connected to the first end of the fifth inductance; the first end of the seventh inductance is connected to the seventh capacitor in series The power amplified signal transmitting end, the first end of the eighth inductor is connected in series with the eighth capacitor to the power amplified signal transmitting end;
  • the first switch is connected in series between ground and the second end of the seventh capacitor
  • the second receiving matching circuit includes a ninth inductor, a twelfth inductor, a thirteenth inductor, a fourteenth inductor, a fifteenth inductor, a tenth capacitor, and a second switch;
  • the second end of the ninth capacitor is connected to the second end of the ninth inductance, the first end of the ninth capacitor is respectively connected to the first end of the twelfth inductance, and the first end of the thirteenth inductance one end, the first end of the fourteenth inductance, and the first end of the fifteenth inductance;
  • the second end of the twelfth inductance is used as the second receiving signal end, the second end of the thirteenth inductance is connected to ground, and the second end of the fourteenth inductance is connected in series with the tenth capacitor to a power amplifying signal transmitting end, the second end of the fifteenth inductance is connected to the second end of the fourteenth inductance;
  • the second switch is connected in series between the ground and the second terminal of the tenth capacitor.
  • the substrate matching circuit is formed on the substrate.
  • the fifth inductor and the sixth capacitor form a low-pass filter.
  • the thirteenth inductor and the ninth capacitor form a high-pass filter.
  • the embodiment of the present invention also provides a radio frequency power amplifier, including the above-mentioned substrate matching circuit provided by the embodiment of the present invention.
  • the embodiment of the utility model also provides a radio frequency chip, and the radio frequency chip includes the above-mentioned radio frequency power amplifier provided by the embodiment of the utility model.
  • the substrate matching circuit, radio frequency power amplifier and radio frequency chip of the present invention are composed of a transmitting matching circuit, a first receiving matching circuit and a second receiving matching circuit respectively connected to the transmitting matching circuit, wherein,
  • the fifth inductance and the sixth capacitor in the first receiving matching circuit form a low-pass filter, and the isolation between the transmitting end of the adaptive power amplification signal and the first receiving signal end is realized by adjusting the fifth inductance; the sixth in the second receiving matching circuit
  • the thirteen inductance and the ninth capacitor form a high-pass filter. By adjusting the ninth capacitor, the isolation between the transmitting end of the power amplifying signal and the second receiving signal end is realized.
  • the transmitting signal of the power amplifying signal is filtered through the substrate while enhancing the power.
  • the isolation between the amplified signal and the received signal, as well as the isolation between the first received signal and the second received signal reduces the loss during signal transmission and reception, and makes the filtering effect, loss and isolation of the signal in the substrate matching circuit during transmission and reception The degree reaches a balance, and the reliability is better.
  • FIG. 1 is a schematic structural diagram of a substrate matching circuit provided by the present invention.
  • the embodiment of the present invention provides a substrate matching circuit 100 , including a transmitting matching circuit 1 , a first receiving matching circuit 2 and a second receiving matching circuit 3 respectively connected to the transmitting matching circuit 1 .
  • the substrate matching circuit 100 is formed on a substrate.
  • the transmitting matching circuit 1 includes a first inductor L1, a second inductor L2, a third inductor L3, a fourth inductor L4, a ninth inductor L9, a tenth inductor L10, an eleventh inductor L11, and a first capacitor C1 , the second capacitor C2, the third capacitor C3, the fourth capacitor C4, and the fifth capacitor C5.
  • the first end of the first inductance L1 is connected to the battery voltage Vbatt, and connected to the ground after the first capacitor C1 is connected in series; the second end of the first inductance L1 is connected to the power amplifying signal transmitting end Pa as an input (Tx), and connected to the first end of the second inductor L2.
  • the second end of the second inductor L2 is respectively connected to the first end of the second capacitor C2 and the first end of the third capacitor C3.
  • the second terminal of the second capacitor C2 is connected to the ground, and the second terminal of the third capacitor C3 is respectively connected to the first terminal of the third inductor L3 and the first terminal of the fourth inductor L4.
  • a first end of the third inductor L3 is connected to ground, and a second end of the fourth inductor L4 is connected to a first end of the ninth inductor L9.
  • the second terminal of the ninth inductor L9 is connected to the first terminal of the fifth capacitor C5 and the first terminal of the tenth inductor L10 respectively.
  • the second end of the fifth capacitor C5 is connected to ground, the second end of the tenth inductor L10 is used as an output for connecting an external antenna, and the second end of the tenth inductor L10 is connected in series with the eleventh inductor Connect to ground after L11.
  • the first receiving matching circuit 2 includes a fifth inductor L5, a sixth inductor L6, a seventh inductor L7, an eighth inductor L8, a sixth capacitor C6, a seventh capacitor C7, an eighth capacitor C8 and a first switch.
  • the second end of the fifth inductance L5 is connected to the first end of the ninth inductance L9, and the first end of the fifth inductance L5 is connected in series with the sixth inductance L6 as the first receiving signal end; and The first end of the fifth inductor L5 is connected in series with the sixth capacitor C6 to ground.
  • Both the second end of the seventh inductance L7 and the second end of the eighth inductance L8 are connected to the first end of the fifth inductance L5; the first end of the seventh inductance L7 is connected in series with the seventh The capacitor C7 is then connected to the power amplifying signal transmitting end Pa, and the first end of the eighth inductor L8 is connected in series with the eighth capacitor C8 to the power amplifying signal transmitting end Pa.
  • the first switch is connected in series between the ground and the second end of the seventh capacitor C7.
  • the second receiving matching circuit 3 includes a ninth inductor L9, a twelfth inductor L12, a thirteenth inductor L13, a fourteenth inductor L14, a fifteenth inductor L15, a tenth capacitor C10 and a second switch;
  • the second end of the ninth capacitor C9 is connected to the second end of the ninth inductor L9, the first end of the ninth capacitor C9 is respectively connected to the first end of the twelfth inductor L12, the tenth The first end of the third inductor L13, the first end of the fourteenth inductor L14, and the first end of the fifteenth inductor L15;
  • the second end of the twelfth inductance L12 serves as the second receiving signal end, the second end of the thirteenth inductance L13 is connected to ground, and the second end of the fourteenth inductance L14 is connected in series with the tenth capacitor C10 is then connected to the power amplified signal transmitting end Pa, and the second end of the fifteenth inductor L15 is connected to the second end of the fourteenth inductor L14.
  • the second switch is connected in series between the ground and the second end of the tenth capacitor C10.
  • the fifth inductor L5 and the sixth capacitor C6 form a low-pass filter.
  • the thirteenth inductor L13 and the ninth capacitor C9 form a high-pass filter.
  • the fifth inductance L5 and the sixth capacitor C6 form a low-pass filter, and the fifth inductance L5 can be adjusted to adapt to the power amplification signal transmitting end Pa.
  • the thirteenth inductor L13 and the ninth capacitor C9 form a high-pass filter, and adjust the ninth capacitor C9 to adapt to the signal isolation of the transmission signal Tx of the power amplification signal transmitting terminal Pa and the second receiving signal Rx2 of the first receiving signal terminal Rx1PIN Spend.
  • the input and output impedance is controlled at 50 ⁇ to reduce the transmission loss.
  • the fifth inductor L5 and the sixth capacitor C6 form a low-pass filter to filter high frequencies, the seventh inductor L7 and the seventh capacitor C7, and the sixth capacitor C7
  • the resonance formed by the eighth inductor L8 and the eighth capacitor C8 can filter a specific frequency point.
  • the ninth capacitor C9 forms a high-pass filter with the twelfth inductor L12 and the thirteenth inductor L13 to filter low frequencies, and the fourteenth inductor L14/the The resonance formed by the fifteenth inductor L15 and the tenth capacitor C10 can filter specific frequency points.
  • the isolation between the power amplified signal Tx and the received signal (Rx1/Rx1) and the isolation between the first received signal Rx1 and the second received signal Rx2 are enhanced while the signal passes through the above-mentioned substrate matching circuit 100 of the present invention, Reduce the loss during signal transmission and reception, so that the filtering effect, loss and isolation of the signal in the substrate matching circuit during transmission and reception can reach a balance, with better reliability, good transmission adaptability, small size and low production cost.
  • the substrate matching circuit solves the problems of signal filtering, isolation between signal transmission and reception, signal transmission loss, and signal transmission adaptation faced during signal transmission and reception. At the same time, while the area of the substrate is greatly reduced and the production cost is reduced, the transmission adaptation problem of signal transmission and reception in the substrate matching circuit is significantly improved.
  • the embodiment of the present invention also provides a radio frequency power amplifier, including the above-mentioned substrate matching circuit provided by the embodiment of the present invention.
  • the embodiment of the utility model also provides a radio frequency chip, and the radio frequency chip includes the above-mentioned radio frequency power amplifier provided by the embodiment of the utility model.
  • the substrate matching circuit, radio frequency power amplifier and radio frequency chip of the present invention are composed of a transmitting matching circuit, a first receiving matching circuit and a second receiving matching circuit respectively connected to the transmitting matching circuit, wherein,
  • the fifth inductance L5 and the sixth capacitor C6 in the first receiving matching circuit form a low-pass filter, and the isolation between the power amplification signal transmitting end and the first receiving signal end is realized by adjusting the fifth inductive matching circuit;
  • the second receiving matching circuit The thirteenth inductance L13 and the ninth capacitor C9 form a high-pass filter. By adjusting the ninth capacitor C9, the isolation between the transmitting end of the power amplifying signal and the second receiving signal end is realized.
  • the transmitting signal of the power amplifying signal passes through the substrate Enhance the isolation between the power amplified signal and the received signal, as well as the isolation between the first received signal and the second received signal while filtering, reduce the loss during signal transmission and reception, and make the signal in the substrate matching circuit during transmission and reception
  • the filtering effect, loss and isolation achieve a balance, and the reliability is better.

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  • Power Engineering (AREA)
  • Amplifiers (AREA)
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Abstract

本实用新型提供了一种基板匹配电路，包括发射匹配电路、分别与发射匹配电路连接的第一接收匹配电路和第二接收匹配电路，其中，第一接收匹配电路适配功率放大信号发射端与第一接收信号端的隔离度；第二接收匹配电路适配功率放大信号发射端与第二接收信号端的隔离度，且功率放大信号发射信号经基板在滤波的同时增强功率放大信号与接收信号隔离度，使信号在发射与接收时在基板匹配电路中滤波效果、损耗、隔离度达到一个平衡，可靠性更优。本实用新型还提供一种射频功率放大器及射频芯片。与相关技术相比，本实用新型的基板匹配电路、射频功率放大器及射频芯片传输适配性好，体积小，生产成本低。

Description

基板匹配电路、射频功率放大器及射频芯片 技术领域
本实用新型涉及无线通信技术领域，尤其涉及一种基板匹配电路、射频功率放大器及射频芯片。
背景技术
滤波、隔离度、传输损耗、作为CMOS功率放大器基板的重要指标，影响基板匹配电路对大信号的线性响应能力。
目前传统的基板匹配电路设计对于同时兼顾到这三个领域还是比较固定，但性能提升方面并不能达到较好的效果。因此，需要对信号滤波、隔离度、传输损耗效果再次提升。
实用新型内容
针对以上相关技术的不足，本实用新型提出一种滤波效果、损耗、隔离度更优以达到平衡、传输适配性好，体积小生产成本低的基板匹配电路、射频功率放大器及射频芯片。
为了解决上述技术问题，本实用新型实施例提供了一种基板匹配电路，包括发射匹配电路、分别与所述发射匹配电路连接的第一接收匹配电路和第二接收匹配电路；
所述发射匹配电路包括第一电感、第二电感、第三电感、第四电感、第九电感、第十电感、第十一电感、第一电容、第二电容、第三电容、第四电容、第五电容；
所述第一电感的第一端连接至电池电压，并通串联所述第一电容后连接至接地；所述第一电感的第二端作为输入连接至功率放大信号发射端，且连接至所述第二电感的第一端；
所述第二电感的第二端分别连接至所述第二电容和第一端和所述第三电容的第一端；
所述第二电容的第二端连接至接地，所述第三电容的第二端分别连接至所述第三电感的第一端和所述第四电感的第一端；
所述第三电感的第一端连接至接地，所述第四电感的第二端连接至所述第九电感的第一端；
所述第九电感的第二端分别连接至所述第五电容的第一端和所述第十电感的第一端；
所述第五电容的第二端连接至接地，所述第十电感的第二端作为输出用于连接外部天线，且所述第十电感的第二端串联所述第十一电感后连接至接地；
所述第一接收匹配电路包括第五电感、第六电感、第七电感、第八电感、第六电容、第七电容、第八电容以及第一开关；
所述第五电感的第二端连接至所述第九电感的第一端，所述第五电感的第一端串联所述第六电感后作为第一接收信号端；且所述第五电感的第一端串联所述第六电容后连接至接地；
所述第七电感的第二端及所述第八电感的第二端均连接至所述第五电感的第一端；所述第七电感的第一端串联所述第七电容后连接至所述功率放大信号发射端，所述第八电感的第一端串联所述第八电容后连接至所述功率放大信号发射端；
所述第一开关串联于接地与所述第七电容的第二端之间；
所述第二接收匹配电路包括第九电感、第十二电感、第十三电感、第十四电感、第十五电感、第十电容以及第二开关；
所述第九电容的第二端连接至所述第九电感的第二端，所述第九电容的第一端分别连接至所述第十二电感的第一端，第十三电感的第一端、第十四电感的第一端以及第十五电感的第一端；
所述第十二电感的第二端作为第二接收信号端，所述第十三电感的第二端连接至接地，所述第十四电感的第二端串联所述第十电容后 连接至功率放大信号发射端，所述第十五电感的第二端连接至所述第十四电感的第二端；
所述第二开关串联于接地与所述第十电容的第二端之间。
优选的，所述基板匹配电路形成于基板。
优选的，所述第五电感和所述第六电容组成低通滤波器。
优选的，所述第十三电感和所述第九电容组成高通滤波器。
本实用新型实施例还提供一种射频功率放大器，包括如本实用新型实施例提供的上述基板匹配电路。
本实用新型实施例还提供一种射频芯片，所述射频芯片包括如本实用新型实施例提供的上述射频功率放大器。
与相关技术相比，本实用新型的基板匹配电路、射频功率放大器及射频芯片中，由发射匹配电路、分别与发射匹配电路连接的第一接收匹配电路和第二接收匹配电路共同组成，其中，第一接收匹配电路中的第五电感和第六电容组成低通滤波器，通过调整第五电感实现适配功率放大信号发射端与第一接收信号端的隔离度；第二接收匹配电路中的第十三电感和第九电容组成高通滤波器，通过调整第九电容实现适配功率放大信号发射端与第二接收信号端的隔离度，由此，功率放大信号发射信号经基板在滤波的同时增强功率放大信号与接收信号隔离度，以及第一接收信号与第二接收信号之间隔离度，降低信号发射与接收时的损耗，使信号在发射与接收时在基板匹配电路中滤波效果、损耗、隔离度达到一个平衡，可靠性更优。
附图说明
下面结合附图详细说明本实用新型。通过结合以下附图所作的详细描述，本实用新型的上述或其他方面的内容将变得更清楚和更容易理解。附图中：
图1为本实用新型提供的基板匹配电路结构示意图。
具体实施方式
下面结合附图详细说明本实用新型的具体实施方式。
在此记载的具体实施方式/实施例为本实用新型的特定的具体实施方式，用于说明本实用新型的构思，均是解释性和示例性的，不应解释为对本实用新型实施方式及本实用新型范围的限制。除在此记载的实施例外，本领域技术人员还能够基于本申请权利要求书和说明书所公开的内容采用显而易见的其它技术方案，这些技术方案包括采用对在此记载的实施例的做出任何显而易见的替换和修改的技术方案，都在本实用新型的保护范围之内。
以下各实施例的说明是参考附加的图式，用以例示本实用新型可用以实施的特定实施例。本实用新型所提到的方向用语，例如上、下、前、后、左、右、内、外、侧面等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本实用新型，而非用以限制本实用新型。
请结合图1所示，本实用新型实施例提供一种基板匹配电路100，包括发射匹配电路1、分别与所述发射匹配电路1连接的第一接收匹配电路2和第二接收匹配电路3。本实施方式中，所述基板匹配电路100形成于基板。
具体的，所述发射匹配电路1包括第一电感L1、第二电感L2、第三电感L3、第四电感L4、第九电感L9、第十电感L10、第十一电感L11、第一电容C1、第二电容C2、第三电容C3、第四电容C4、第五电容C5。
所述第一电感L1的第一端连接至电池电压Vbatt，并通串联所述第一电容C1后连接至接地；所述第一电感L1的第二端作为输入连接至功率放大信号发射端Pa(Tx)，且连接至所述第二电感L2的第一端。
所述第二电感L2的第二端分别连接至所述第二电容C2和第一端和所述第三电容C3的第一端。
所述第二电容C2的第二端连接至接地，所述第三电容C3的第二 端分别连接至所述第三电感L3的第一端和所述第四电感L4的第一端。
所述第三电感L3的第一端连接至接地，所述第四电感L4的第二端连接至所述第九电感L9的第一端。
所述第九电感L9的第二端分别连接至所述第五电容C5的第一端和所述第十电感L10的第一端。
所述第五电容C5的第二端连接至接地，所述第十电感L10的第二端作为输出用于连接外部天线，且所述第十电感L10的第二端串联所述第十一电感L11后连接至接地。
所述第一接收匹配电路2包括第五电感L5、第六电感L6、第七电感L7、第八电感L8、第六电容C6、第七电容C7、第八电容C8以及第一开关。
所述第五电感L5的第二端连接至所述第九电感L9的第一端，所述第五电感L5的第一端串联所述第六电感L6后作为第一接收信号端；且所述第五电感L5的第一端串联所述第六电容C6后连接至接地。
所述第七电感L7的第二端及所述第八电感L8的第二端均连接至所述第五电感L5的第一端；所述第七电感L7的第一端串联所述第七电容C7后连接至所述功率放大信号发射端Pa，所述第八电感L8的第一端串联所述第八电容C8后连接至所述功率放大信号发射端Pa。
所述第一开关串联于接地与所述第七电容C7的第二端之间。
所述第二接收匹配电路3包括第九电感L9、第十二电感L12、第十三电感L13、第十四电感L14、第十五电感L15、第十电容C10以及第二开关；
所述第九电容C9的第二端连接至所述第九电感L9的第二端，所述第九电容C9的第一端分别连接至所述第十二电感L12的第一端，第十三电感L13的第一端、第十四电感L14的第一端以及第十五电感L15的第一端；
所述第十二电感L12的第二端作为第二接收信号端，所述第十三电感L13的第二端连接至接地，所述第十四电感L14的第二端串联所 述第十电容C10后连接至功率放大信号发射端Pa，所述第十五电感L15的第二端连接至所述第十四电感L14的第二端。
所述第二开关串联于接地与所述第十电容C10的第二端之间。
所述第五电感L5和所述第六电容C6组成低通滤波器。所述第十三电感L13和所述第九电容C9组成高通滤波器。
本实用新型的基板匹配电路100中，当输入输出信号传输时，第五电感L5与第六电容C6组成低通滤波器，并可以通过调整第五电感L5去适配功率放大信号发射端Pa的发射信号Tx与第一接收信号端Rx1PIN的第一接收信号Rx1的信号隔离度。第十三电感L13与第九电容C9组成高通滤波器，通过调整第九电容C9去适配功率放大信号发射端Pa的发射信号Tx与第一接收信号端Rx1PIN的第二接收信号Rx2的信号隔离度。通过调整逐级LC匹配单元改变频率把输入输出阻抗控制在50Ω减小传输损耗。
当天线端的ANT信号接收到达第一接收信号端Rx1过程中，第五电感L5与第六电容C6组成低通滤波器对高频起到滤波作用，第七电感L7与第七电容C7，和第八电感L8与第八电容C8组成谐振可以对特定频点进行滤波。
当天线端的ANT信号接收到达第二接收信号端Rx2过程中，第九电容C9与第十二电感L12及第十三电感L13组成高通滤波器对低频起到滤波作用，第十四电感L14/第十五电感L15与第十电容C10组成谐振可以对特定频点进行滤波。
从而，信号经本实用新型的上述基板匹配电路100的同时增强功率放大信号Tx与接收信号(Rx1/Rx1)的隔离度，以及第一接收信号Rx1与第二接收信号Rx2之间的隔离度，降低信号发射与接收时的损耗，使信号在发射与接收时在基板匹配电路中滤波效果、损耗、隔离度达到一个平衡，可靠性更优，传输适配性好，体积小生产成本低。
所述基板匹配电路解决了信号在发射与接收时面临的对信号滤波、信号发射与接收之间隔离度、信号传输损耗、信号传输适配的问 题。同时在极大程度减小了基板面积和削减生产成本的同时，信号的发射和接收在基板匹配电路中的传输适配问题具有明显提高。
本实用新型实施例还提供一种射频功率放大器，包括如本实用新型实施例提供的上述基板匹配电路。
本实用新型实施例还提供一种射频芯片，所述射频芯片包括如本实用新型实施例提供的上述射频功率放大器。
与相关技术相比，本实用新型的基板匹配电路、射频功率放大器及射频芯片中，由发射匹配电路、分别与发射匹配电路连接的第一接收匹配电路和第二接收匹配电路共同组成，其中，第一接收匹配电路中的第五电感L5和第六电容C6组成低通滤波器，通过调整第五电感L5实现适配功率放大信号发射端与第一接收信号端的隔离度；第二接收匹配电路中的第十三电感L13和第九电容C9组成高通滤波器，通过调整第九电容C9实现适配功率放大信号发射端与第二接收信号端的隔离度，由此，功率放大信号发射信号经基板在滤波的同时增强功率放大信号与接收信号隔离度，以及第一接收信号与第二接收信号之间隔离度，降低信号发射与接收时的损耗，使信号在发射与接收时在基板匹配电路中滤波效果、损耗、隔离度达到一个平衡，可靠性更优。
需要说明的是，以上参照附图所描述的各个实施例仅用以说明本实用新型而非限制本实用新型的范围，本领域的普通技术人员应当理解，在不脱离本实用新型的精神和范围的前提下对本实用新型进行的修改或者等同替换，均应涵盖在本实用新型的范围之内。此外，除上下文另有所指外，以单数形式出现的词包括复数形式，反之亦然。另外，除非特别说明，那么任何实施例的全部或一部分可结合任何其它实施例的全部或一部分来使用。

Claims (6)

  1. 一种基板匹配电路，其特征在于，包括发射匹配电路、分别与所述发射匹配电路连接的第一接收匹配电路和第二接收匹配电路；
    所述发射匹配电路包括第一电感、第二电感、第三电感、第四电感、第九电感、第十电感、第十一电感、第一电容、第二电容、第三电容、第四电容、第五电容；
    所述第一电感的第一端连接至电池电压，并通串联所述第一电容后连接至接地；所述第一电感的第二端作为输入连接至功率放大信号发射端，且连接至所述第二电感的第一端；
    所述第二电感的第二端分别连接至所述第二电容和第一端和所述第三电容的第一端；
    所述第二电容的第二端连接至接地，所述第三电容的第二端分别连接至所述第三电感的第一端和所述第四电感的第一端；
    所述第三电感的第一端连接至接地，所述第四电感的第二端连接至所述第九电感的第一端；
    所述第九电感的第二端分别连接至所述第五电容的第一端和所述第十电感的第一端；
    所述第五电容的第二端连接至接地，所述第十电感的第二端作为输出用于连接外部天线，且所述第十电感的第二端串联所述第十一电感后连接至接地；
    所述第一接收匹配电路包括第五电感、第六电感、第七电感、第八电感、第六电容、第七电容、第八电容以及第一开关；
    所述第五电感的第二端连接至所述第九电感的第一端，所述第五电感的第一端串联所述第六电感后作为第一接收信号端；且所述第五电感的第一端串联所述第六电容后连接至接地；
    所述第七电感的第二端及所述第八电感的第二端均连接至所述第五电感的第一端；所述第七电感的第一端串联所述第七电容后连接至 所述功率放大信号发射端，所述第八电感的第一端串联所述第八电容后连接至所述功率放大信号发射端；
    所述第一开关串联于接地与所述第七电容的第二端之间；
    所述第二接收匹配电路包括第九电感、第十二电感、第十三电感、第十四电感、第十五电感、第十电容以及第二开关；
    所述第九电容的第二端连接至所述第九电感的第二端，所述第九电容的第一端分别连接至所述第十二电感的第一端，第十三电感的第一端、第十四电感的第一端以及第十五电感的第一端；
    所述第十二电感的第二端作为第二接收信号端，所述第十三电感的第二端连接至接地，所述第十四电感的第二端串联所述第十电容后连接至功率放大信号发射端，所述第十五电感的第二端连接至所述第十四电感的第二端；
    所述第二开关串联于接地与所述第十电容的第二端之间。
  2. 根据权利要求1所述的基板匹配电路，其特征在于，所述基板匹配电路形成于基板。
  3. 根据权利要求1所述的基板匹配电路，其特征在于，所述第五电感和所述第六电容组成低通滤波器。
  4. 根据权利要求1所述的基板匹配电路，其特征在于，所述第十三电感和所述第九电容组成高通滤波器。
  5. 一种射频功率放大器，其特征在于，包括如权利要求1-4任意一项所述的基板匹配电路。
  6. 一种射频芯片，其特征在于，所述射频芯片包括如权利要求5任意一项所述的射频功率放大器。
PCT/CN2022/125448 2021-11-18 2022-10-14 基板匹配电路、射频功率放大器及射频芯片 WO2023088002A1 (zh)

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