WO2023082570A1 - 一种电路结构 - Google Patents

一种电路结构 Download PDF

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Publication number
WO2023082570A1
WO2023082570A1 PCT/CN2022/091934 CN2022091934W WO2023082570A1 WO 2023082570 A1 WO2023082570 A1 WO 2023082570A1 CN 2022091934 W CN2022091934 W CN 2022091934W WO 2023082570 A1 WO2023082570 A1 WO 2023082570A1
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Prior art keywords
conductive pattern
circuit structure
temporary
target
layer
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PCT/CN2022/091934
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English (en)
French (fr)
Inventor
鲁强
樊洪江
王莉
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北京梦之墨科技有限公司
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Publication of WO2023082570A1 publication Critical patent/WO2023082570A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Definitions

  • the present application belongs to the technical field of electronic circuits, and in particular relates to a circuit structure.
  • the electroplating lead is a kind of process auxiliary line, its function is to lead the target line out of the wiring, so as to complete the electroplating of the target line, it is not retained in the final product, it needs to be removed after the product is electroplated, the traditional removal of the electroplating lead
  • the method is to remove it by machining and cutting, but with the increasing precision and complexity of current circuit products, such as coil products, the electroplating leads need to connect their internal circuits, and if machining is used, it will destroy The base material of the target line product, resulting in a decrease in the structural stability of the base material, and at the same time, the precision of machining is also difficult to meet the cutting requirements of internal high-precision lines.
  • an object of the present application is to propose a circuit structure, so as to solve the requirement of complex circuit plating.
  • the circuit structure includes: a substrate; a removable first conductive layer formed on the surface of the substrate; wherein, the first conductive layer includes a target conductive pattern and a temporary conductive pattern; an insulating tape covering the temporary conductive pattern.
  • the circuit structure may further include: a non-removable second conductive layer covering the target conductive pattern.
  • the target circuit structure is obtained by removing the insulating tape and the temporary conductive pattern.
  • the side of the substrate in contact with the first conductive layer has a roughened surface.
  • the second conductive layer is a single-layer or multi-layer structure.
  • the first conductive layer and/or the second conductive layer are formed by printing, printing, electroplating, electroless plating, evaporation or magnetron sputtering.
  • the temporary conductive pattern is separated into an inner circuit and an outer circuit by the target conductive pattern; the insulating tape is covered on the inner circuit.
  • the substrate has a profiled surface, and the first conductive layer is formed on the profiled surface of the substrate.
  • the insulating tape is consistent with the shape of the temporary conductive pattern.
  • the base material is a soft or hard base material.
  • the temporary conductive pattern is prevented from being directly exposed, thereby preventing the plating layer from being plated on the temporary conductive pattern, and the selective plating effect of the complex circuit can be realized; and, after the formation of the plating layer is completed After that, it only needs to peel off the insulating tape and remove the temporary conductive pattern to obtain the target circuit structure, which has the advantages of simple process, easy implementation, and low cost.
  • Fig. 1 is a structure example 1 of the circuit structure in the embodiment of the present application.
  • Fig. 2 is a structure example 2 of the circuit structure in the embodiment of the present application.
  • Fig. 3 is a structural example three of the circuit structure in the embodiment of the present application.
  • FIG. 4 is a structure example four of the circuit structure in the embodiment of the present application.
  • Removable and “non-removable” in the embodiment of this application are relative terms, that is, the same process and under the same conditions can complete the cleaning of "removable” parts, but not “non-removable” parts. damage or impact on “removable” parts; or, through the same process and under the same conditions, the removal of "removable” parts will cause minor impact on “non-removable” parts, but its main performance will not be affected; no The affected performance may refer to the conduction, conductivity, surface smoothness, surface gloss, etc. of the circuit.
  • FIG. 1 is a structural example 1 of the circuit structure in the embodiment of the present application
  • Figure 2 is the structure of the circuit structure in the embodiment of the present application Example two
  • FIG. 3 is a structural example three of the circuit structure in the embodiment of the present application
  • FIG. 4 is a structural example four of the circuit structure in the embodiment of the present application
  • the circuit structure includes: a substrate 10; formed on the surface of the substrate 10
  • a removable first conductive layer 20 wherein, the first conductive layer 20 includes a target conductive pattern 21 and a temporary conductive pattern 22; an insulating tape 30 covering the temporary conductive pattern 22.
  • the target conductive pattern 21 in the embodiment of the present application refers to the conductive pattern consistent with the target circuit
  • the temporary conductive pattern 22 refers to the conductive pattern temporarily applied to the target circuit for a specific purpose (such as electroplating lead wire requirements, etc.), which is completed after the target circuit is completed. After the processing of the target circuit, it is removed to obtain the target circuit.
  • the insulating tape 30 in the embodiment of the present application is at least formed of an insulating adhesive material, such as an insulating film; in some embodiments, the insulating tape 30 can also be composed of an adhesive layer and a polymer film/cloth. multi-layer structure.
  • the temporary conductive pattern is prevented from being directly exposed, thereby preventing the plating layer from being plated on the temporary conductive pattern, and the selective plating effect of the complex circuit can be realized; and, after the formation of the plating layer is completed After that, it only needs to peel off the insulating tape and remove the temporary conductive pattern to obtain the target circuit structure, which has the advantages of simple process, easy implementation, and low cost.
  • the base material in the embodiment of the present application is not limited to flexible or hard base material, specifically can be selected as PET (polyester, Polyethylene terephthalate), PTFE (polytetrafluoroethylene, Poly tetrafluoroethylene), PI (Polyimide, Polyimide), PC (Polycarbonate, Polycarbonate), ABS (copolymer plastic, Acrylonitrile Butadiene Styrene plastic), LCP (Liquid Crystal Polymer, Liquid Crystal Polymer), FR4, glass (such as glass resin, di Any one of silicon oxide, high borosilicate).
  • the base material can be PET, PI, PTFE, LCP or glass, and this type of base material has excellent properties of temperature resistance, corrosion resistance and adhesion.
  • the base material can also be selected from materials such as cloth, wood, paper and the like.
  • the removable first conductive layer 20 in the embodiment of the present application can be formed using an easily removable conductive ink, and the conductive ink is not limited to metal particle-based conductive ink, carbon-based conductive ink, inorganic conductive ink, liquid metal, etc.; preferably,
  • the conductive ink in the embodiment of the present application is made of metallic particle-based conductive ink, such as conductive silver paste, conductive aluminum paste, conductive copper paste, etc., or conductive silver paste, conductive aluminum paste, conductive copper paste, etc. doped with liquid metal.
  • the printed circuit of the conductive silver paste doped with liquid metal has good bending resistance and the best conductivity.
  • the first conductive layer in this embodiment includes the polymer film-former in the conductive ink, so it can be removed by a polymer solvent.
  • the first conductive layer 20 in the embodiments of the present application is formed by printing, printing, electroplating, electroless plating, vapor deposition or magnetron sputtering.
  • the specific method of forming the first conductive layer is not limited to printing or printing and other molding methods, specifically, the printing method is not limited to direct writing printing, extrusion printing, spraying, 3D printing, etc., and the printing method is not limited to screen printing. Printing, pad printing, letterpress printing, gravure printing, coating, etc.
  • the first conductive layer may be formed by screen printing, which is suitable for substrates with flat surfaces.
  • the base material with special-shaped structure methods such as pad printing, 3D printing, etc. can be selected to be formed on the special-shaped surface of the base material with special-shaped structure.
  • the substrate 10 in the embodiment of the present application has a profiled surface, and the first conductive layer 20 is formed on the profiled surface of the substrate 10 .
  • the side of the substrate 10 in contact with the first conductive layer 20 has a roughened surface to improve the adhesion of the conductive ink on the substrate surface; the roughened surface can be formed by forming the first conductive layer 20.
  • the surface of the substrate is roughened, and the surface roughening treatment is not limited to surface roughening treatments such as sand blasting and plasma treatment.
  • the surface roughening treatment can only be performed on the area to be printed (that is, the area where the first conductive layer is located), so as to ensure the surface smoothness and glossiness of the non-printed area.
  • the printed area may be consistent with the pattern of the first conductive layer, or cover the pattern area of the first conductive layer.
  • the insulating tape 30 in the embodiment of the present application can be consistent with the shape of the temporary conductive pattern 22, so that the insulating tape 30 can completely cover the temporary conductive pattern 22.
  • the size of the insulating tape 30 is slightly larger than that of the temporary conductive pattern 22 .
  • the shape of the insulating tape can be consistent with the temporary conductive pattern by cutting or other methods before applying the insulating tape; in other examples, the insulating tape can also be reshaped after the insulating tape is applied. Laser engraving, cutting, corrosion (dissolving), etc.
  • the circuit structure may further include: a non-removable second conductive layer 40 covering the target conductive pattern 21 .
  • the second conductive layer 40 can be formed by printing, printing, electroplating, electroless plating, vapor deposition or magnetron sputtering.
  • the second conductive layer 40 can be a single-layer or multi-layer structure.
  • the conductive ink that is difficult to remove is selected to print on the target conductive pattern to form the second conductive layer; wherein, the conductive ink is more stable than the conductive ink that forms the first conductive layer after molding.
  • a metal coating on the target conductive pattern by means of electroplating, electroless plating or vapor deposition, and the coating is not limited to any one of tin, copper, nickel, silver, gold or any alloy thereof.
  • the metal plating layer may be a multi-layer structure, such as copper, nickel, and gold sequentially formed on the target conductive pattern; or silver, gold, and the like.
  • the temporary conductive pattern in the embodiment of the present application may be an electroplating lead (also called an electroplating auxiliary line) designed by the user to form a metal plating layer on the target conductive pattern; in other embodiments, The temporary conductive pattern in the embodiment of the present application may also be other process auxiliary lines, or other functional lines designed by the user.
  • the target circuit structure can be obtained by removing the insulating tape 30 and the temporary conductive pattern 22 .
  • the method of removing the insulating tape 30 is not limited to peeling and/or corrosion (dissolving), etc., and the removal of the temporary conductive pattern 22 is not limited to one or more combinations of chemical corrosion, laser etching, grinding, and cutting. remove.
  • the insulating tape and the temporary conductive pattern can be removed by peeling off and chemical etching. Among them, this method is aimed at selecting the first conductive layer (i.e. temporary conductive pattern) formed by conductive ink containing resin and the insulating tape formed by the adhesive film.
  • both the insulating tape and the temporary conductive pattern are polymer components, they can be passed through the corresponding high Molecular solvents are removed by means not limited to dipping and/or wiping, so that they are removed sequentially or in one piece. For other cases, it can also be removed by a combination of solvent and laser, for example, the insulating tape is removed by solvent, and the temporary conductive pattern is removed by laser. Or for the insulating tape with composite structure, the temporary conductive pattern can be removed by peeling off the insulating tape, using a solvent or laser; wherein, the adhesive that may remain after the insulating tape is peeled off can also be removed by solvent.
  • the temporary conductive pattern 22 is separated by the target conductive pattern 21 into an inner circuit 221 and an outer circuit 222 ; the insulating tape 30 covers the inner circuit 221 .
  • the temporary conductive pattern 22 is divided by the target conductive pattern 21
  • the inner circuit 221 and the outer circuit 222 of the temporary conductive pattern 22 can be removed in different ways, so as to further reduce the removal difficulty and improve the removal efficiency.
  • part of the temporary conductive pattern 22 in this embodiment is located outside the target conductive pattern 21, and can be removed by matching cutting, for example, after peeling off the insulating tape 30, and then removing the target conductive pattern 21 by laser
  • the temporary conductive pattern that is, the inner line 221) within the target conductive pattern 21, and finally remove the temporary conductive pattern (that is, the outer line 222) outside the range of the target conductive pattern 21 by cutting.
  • this solution can reduce the laser The frequency of use reduces the maintenance cost of the laser, saves the service life of the laser equipment, reduces the cost, and improves the removal efficiency.
  • the circuit structure in the embodiment of the present application may further include: a protective layer covering the second conductive layer, the protective layer can function as solder resistance, oxygen barrier, water resistance, corrosion resistance, temperature resistance, bending resistance The effect of any one or any combination of such properties.
  • a protective layer covering the second conductive layer the protective layer can function as solder resistance, oxygen barrier, water resistance, corrosion resistance, temperature resistance, bending resistance The effect of any one or any combination of such properties.
  • an opening is provided on the protection layer to expose part of the second conductive layer.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

本申请公开了一种电路结构，涉及电子电路技术领域；该电路结构，包括：基材；成型于所述基材表面上的、可移除的第一导电层；其中，所述第一导电层包括目标导电图案与临时导电图案；覆盖在所述临时导电图案上的绝缘胶带。本申请实施例中通过利用绝缘胶带遮盖临时导电图案，避免临时导电图案直接暴露在外，从而防止镀层在临时导电图案的上镀，可实现复杂电路的选择性上镀效果；并且，在镀层形成完成之后，只需要揭开绝缘胶带，以及去除临时导电图案，即可得到目标电路结构，具有工艺简单、易于实施，成本低等优势。

Description

一种电路结构
本申请要求于2021年11月12日提交中国专利局、申请号为202122769630.3、申请名称为“一种电路结构”的中国专利申请的优先权，其全部内容通过引用在本申请中。
技术领域
本申请属于电子电路技术领域，尤其涉及一种电路结构。
背景技术
电镀引线是一种工艺辅助线，其作用是将目标线路引出接线，以此完成目标线路的电镀，其在最终的产品中不被保留，需要在产品完成电镀后进行去除，传统去除电镀引线的方法是采用机加工裁切的方式去除，但随着目前线路产品的精密度和复杂度的不断增加，例如线圈产品，电镀引线需要连接其内部线路，而如果采用机加工的方式，则会破坏目标线路产品的基材，从而造成基材的结构稳定性的下降，同时机加工的精度也很难满足内部高精度线路的裁切需求。
申请内容
有鉴于此，本申请的一个目的是提出一种电路结构,以此解决复杂电路上镀的需求。
在一些说明性实施例中，所述电路结构，包括：基材；成型于所述基材表面上的、可移除的第一导电层；其中，所述第一导电层包括目标导电图案与临时导电图案；覆盖在所述临时导电图案上的绝缘胶带。
在一些可选地实施例中，所述电路结构，还可包括：覆盖在所述目 标导电图案上的、不可移除的第二导电层。
在一些可选地实施例中，通过移除所述绝缘胶带与所述临时导电图案，得到目标电路结构。
在一些可选地实施例中，所述基材与所述第一导电层相接触的一侧具有粗化表面。
在一些可选地实施例中，所述第二导电层为单层或多层结构。
在一些可选地实施例中，所述第一导电层和/或所述第二导电层通过打印、印刷、电镀、化镀、蒸镀或磁控溅射的方式形成。
在一些可选地实施例中，所述临时导电图案被所述目标导电图案分隔为内侧线路和外侧线路；所述绝缘胶带覆盖在所述内侧线路上。
在一些可选地实施例中，所述基材具有异型面，所述第一导电层成型于所述基材的异型面上。
在一些可选地实施例中，所述绝缘胶带与所述临时导电图案的形状一致。
在一些可选地实施例中，所述基材选用柔质或硬质基材。
与现有技术相比，本申请具有如下优势：
本申请实施例中通过利用绝缘胶带遮盖临时导电图案，避免临时导电图案直接暴露在外，从而防止镀层在临时导电图案的上镀，可实现复杂电路的选择性上镀效果；并且，在镀层形成完成之后，只需要揭开绝缘胶带，以及去除临时导电图案，即可得到目标电路结构，具有工艺简单、易于实施，成本低等优势。
附图说明
图1是本申请实施例中电路结构的结构示例一；
图2是本申请实施例中电路结构的结构示例二；
图3是本申请实施例中电路结构的结构示例三；
图4是本申请实施例中电路结构的结构示例四。
具体实施方式
以下描述和附图充分地示出本申请的具体实施方案，以使本领域的技术人员能够实践它们。其他实施方案可以包括结构的、逻辑的、电气的、过程的以及其他的改变。实施例仅代表可能的变化。除非明确要求，否则单独的部件和功能是可选的，并且操作的顺序可以变化。一些实施方案的部分和特征可以被包括在或替换其他实施方案的部分和特征。本申请的实施方案的范围包括权利要求书的整个范围，以及权利要求书的所有可获得的等同物。在本文中，本申请的这些实施方案可以被单独地或总地用术语“申请”来表示，这仅仅是为了方便，并且如果事实上公开了超过一个的申请，不是要自动地限制该应用的范围为任何单个申请或申请构思。
本申请实施例中的“可移除”和“不可移除”是相对而言的，即相同工艺、在相同条件下，可对“可移除”部件完成清除，但不会对“不可移除”部件造成破坏或影响；或者，通过相同工艺、在相同条件下，对“可移除”部件完成清除，会对“不可移除”部件造成微小影响，但其主要性能不受影响；不受影响的性能可以是指线路的导通、导电性能、表面平整度、表面光泽等。
需要说明的是，在不冲突的情况下本申请实施例中的各技术特征均可以相互结合。
本申请实施例中公开了一种电路结构，具体地，如图1-4所示，图 1为本申请实施例中电路结构的结构示例一；图2是本申请实施例中电路结构的结构示例二；图3是本申请实施例中电路结构的结构示例三；图4是本申请实施例中电路结构的结构示例四；该电路结构，包括：基材10；成型于基材10表面上的、可移除的第一导电层20；其中，第一导电层20包括目标导电图案21与临时导电图案22；覆盖在临时导电图案22上的绝缘胶带30。
本申请实施例中的目标导电图案21是指与目标电路一致的导电图案，临时导电图案22是指处于特定目的(如电镀引线需求等)临时施加于目标电路上的导电图案，其在完成对目标电路的处理后，将其移除得到目标电路。
本申请实施例中的绝缘胶带30至少由绝缘材质的粘接材料形成，例如绝缘胶膜；在一些实施例中，绝缘胶带30还可以由粘接层与高分子膜材/布料等材料组成的多层结构。
本申请实施例中通过利用绝缘胶带遮盖临时导电图案，避免临时导电图案直接暴露在外，从而防止镀层在临时导电图案的上镀，可实现复杂电路的选择性上镀效果；并且，在镀层形成完成之后，只需要揭开绝缘胶带，以及去除临时导电图案，即可得到目标电路结构，具有工艺简单、易于实施，成本低等优势。
在一些实施例中，本申请实施例中的基材不限于柔质或硬质基材，具体可选用如PET(聚酯，Polyethylene terephthalate)、PTFE(聚四氟乙烯，Poly tetra fluoroethylene)、PI(聚酰亚胺，Polyimide)、PC(聚碳酸脂，Polycarbonate)、ABS(共聚物塑料，Acrylonitrile Butadiene Styrene plastic)、LCP(液晶聚合物，Liquid Crystal Polymer)、FR4、玻璃(如玻璃树脂、二氧化硅、高硼硅)中的任意一种。优选地，该基材可选用PET、PI、PTFE、LCP或玻璃，该类基材的耐温、耐腐、附着力性能优异。在另一些实施例中，基材还可以选用如布料、木材、纸 等材料。
本申请实施例中的可移除的第一导电层20可利用易去除的导电油墨形成，导电油墨不限于金属颗粒系导电油墨、碳基导电油墨、无机导电油墨、液态金属等；优选地，本申请实施例中的导电油墨选用金属颗粒系导电油墨，例如导电银浆、导电铝浆、导电铜浆等，亦或者掺杂了液态金属的导电银浆、导电铝浆、导电铜浆等。其中，掺杂了液态金属的导电银浆的印制线路的耐弯折性能良好和导电性能最佳。该实施例中的第一导电层包括导电油墨中的高分子成膜物，因此可利用高分子溶剂实现移除。
在一些实施例中，本申请实施例中的第一导电层20通过打印、印刷、电镀、化镀、蒸镀或磁控溅射的方式形成。优选地，形成第一导电层的具体方式不限于打印或印刷等成型方式，具体地，打印方式不限于直写式打印、挤出式打印、喷涂、3D打印等方式，印刷方式不限于丝网印刷、移印、凸版印刷、凹版印刷、涂布等方式。优选地，本申请实施例中可以选用丝网印刷的方式形成第一导电层，适用于表面平整的基材。在另一些实施例中，针对异型结构的基材而言，则可以选用如移印、3D打印等方式成型在异型结构的基材的异型面上。具体地，本申请实施例中的基材10具有异型面，第一导电层20成型于基材10的异型面上。
在一些实施例中，基材10与第一导电层20相接触的一侧具有粗化表面，用以提高导电油墨在基材表面上的附着力；该粗化表面可通过在形成第一导电层20之前，对基材表面进行粗化处理获得，该表面粗化处理不限于喷砂、等离子体处理等表面粗化处理。优选地，该表面粗化处理可仅对待印制区域(即第一导电层所在的区域)进行处理，从而保证非印制区域的表面平整度与光泽度。其中，该印制区域可以与第一导电层的图案一致，或者覆盖第一导电层的图案区域。
在一些实施例中，本申请实施例中的绝缘胶带30可与临时导电图案22的形状一致，以使绝缘胶带30可以完全遮盖临时导电图案22，考虑临时导电图案22其实质上为三维实体，因此绝缘胶带30的尺寸会比临时导电图案22略大。本领域技术人员应该理解的是，本申请实施例中施加的绝缘胶带30在不遮挡目标导电图案、及遮挡临时导电图案的情况下，其余部分的图案、大小不影响本申请的技术方案的实施与技术效果的获得。
优选地，可通过裁剪等方法在施加绝缘胶带之前，使绝缘胶带的形状与临时导电图案一致；在另一些示例中，亦可在施加绝缘胶带之后，再对绝缘胶带进行整形，整形方式不限于镭雕、裁剪、腐蚀(溶解)等。
在一些实施例中，所述电路结构，还可包括：覆盖在目标导电图案21上的、不可移除的第二导电层40。其中，第二导电层40可通过打印、印刷、电镀、化镀、蒸镀或磁控溅射的方式形成。其中，第二导电层40可为单层或多层结构。
例如：选用不易去除的导电油墨在目标导电图案上印刷形成第二导电层；其中，该导电油墨相比形成第一导电层的导电油墨成型后的稳定性更强。
例如：通过电镀、化镀或蒸镀方式在目标导电图案上形成金属镀层，该镀层不限于锡、铜、镍、银、金中的任意一种或者其任意合金。其中，金属镀层可以为多层结构，例如依次在目标导电图案上形成的铜、镍、金；或者银、金等。
在一些实施例中，本申请实施例中的临时导电图案可以是用户为了在目标导电图案上电镀形成金属镀层，从而设计的电镀引线(亦称为电镀辅助线)；在另一些实施例中，本申请实施例中的临时导电图案亦可以为其它工艺辅助线，或者用户设计的其它功能线路。
在一些实施例中，在第二导电层40形成后，可通过移除绝缘胶带 30与临时导电图案22，得到目标电路结构。其中，移除绝缘胶带30的方式不限于揭除和/或腐蚀(溶解)等，临时导电图案22的移除不限于通过化学腐蚀、激光蚀刻、研磨、裁切中的一种或多种组合方式移除。优选地，本申请实施例中可通过揭除配合化学腐蚀的方式去除绝缘胶带和临时导电图案。其中，该方式针对于选用包含树脂的导电油墨形成的第一导电层(即临时导电图案)以及胶膜形成的绝缘胶带，由于绝缘胶带和临时导电图案均为高分子成分，可通过相应的高分子溶剂进行去除，去除方式不限于浸渍和/或擦拭，从而将其依次将其移除或将其一体移除。而针对其他情况，亦可以通过溶剂与激光搭配的方式去除，例如通过溶剂去除绝缘胶带，再通过激光去除临时导电图案。又或者针对复合结构的绝缘胶带而言，可通过揭开绝缘胶带，利用溶剂或激光去除临时导电图案；其中，在绝缘胶带揭开后可能残留的粘接剂亦可通过溶剂去除。
在一些实施例中，所述临时导电图案22被所述目标导电图案21分隔为内侧线路221和外侧线路222；所述绝缘胶带30覆盖在所述内侧线路221上。具体地，如图3-4所示，第一导电层20的临时导电图案22与目标导电图案21之间存在线路交叉，即线路重叠的部分，因此使临时导电图案22被目标导电图案21分割为了两部分，一部分位于目标导电图案21的范围内部的内侧线路221，另一部分位于目标导电图案21的范围外侧的外侧线路222。该实施例中的临时导电图案22的内侧线路221和外侧线路222可通过不同的方式移除，从而进一步降低移除困难度，提升移除效率。
示例性的，该实施例中部分的临时导电图案22位于目标导电图案21的外侧，可通过搭配裁切的方式去除，例如通过揭开绝缘胶带30后，再通过激光去除位于目标导电图案21范围内的临时导电图案(即内侧线路221)，最后通过裁切的方式去除位于目标导电图案21范围外的临时导电图案(即外侧线路222)，该方案相对于前述方式而言，可以 降低激光的使用频率，从而降低激光的维护成本，节省激光设备的使用寿命，降低成本，并且可以提升移除效率。
在一些实施例中，本申请实施例中的电路结构还可包括：遮盖第二导电层的保护层，该保护层可起到阻焊、隔氧、阻水、耐腐、耐温、耐弯折等性能中的任意之一或任意组合的作用效果。优选地，该保护层上设置有开窗，用以暴露部分第二导电层。
本领域技术人员还应当理解，结合本文的实施例描述的各种说明性的逻辑框、模块、电路和算法步骤均可以实现成电子硬件、计算机软件或其组合。为了清楚地说明硬件和软件之间的可交换性，上面对各种说明性的部件、框、模块、电路和步骤均围绕其功能进行了一般地描述。至于这种功能是实现成硬件还是实现成软件，取决于特定的应用和对整个系统所施加的设计约束条件。熟练的技术人员可以针对每个特定应用，以变通的方式实现所描述的功能，但是，这种实现决策不应解释为背离本公开的保护范围。

Claims (10)

  1. 一种电路结构，其特征在于，包括：
    基材；
    成型于所述基材表面上的、可移除的第一导电层；其中，所述第一导电层包括目标导电图案与临时导电图案；
    覆盖在所述临时导电图案上的绝缘胶带。
  2. 根据权利要求1所述的电路结构，其特征在于，还包括：
    覆盖在所述目标导电图案上的、不可移除的第二导电层。
  3. 根据权利要求2所述电路结构，其特征在于，通过移除所述绝缘胶带与所述临时导电图案，得到目标电路结构。
  4. 根据权利要求1所述的电路结构，其特征在于，所述基材与所述第一导电层相接触的一侧具有粗化表面。
  5. 根据权利要求2所述的电路结构，其特征在于，所述第二导电层为单层或多层结构。
  6. 根据权利要求2所述的电路结构，其特征在于，所述第一导电层和/或所述第二导电层通过打印、印刷、电镀、化镀、蒸镀或磁控溅射的方式形成。
  7. 根据权利要求1所述的电路结构，其特征在于，所述临时导电图案被所述目标导电图案分隔为内侧线路和外侧线路；
    所述绝缘胶带覆盖在所述内侧线路上。
  8. 根据权利要求1所述的电路结构，其特征在于，所述基材具有异型面，所述第一导电层成型于所述基材的异型面上。
  9. 根据权利要求1所述的电路结构，其特征在于，所述绝缘胶带与所述临时导电图案的形状一致。
  10. 根据权利要求1所述的电路结构，其特征在于，所述基材选用柔质或硬质基材。
PCT/CN2022/091934 2021-11-12 2022-05-10 一种电路结构 WO2023082570A1 (zh)

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CN101330799A (zh) * 2007-06-22 2008-12-24 健鼎科技股份有限公司 独立焊垫的无导线电镀方法
TW201005891A (en) * 2008-07-21 2010-02-01 Kinsus Interconnect Tech Corp Alternative electroplate method without conductive wire
CN102373492A (zh) * 2010-08-13 2012-03-14 北大方正集团有限公司 电路板表面进行选择性电镀的方法和电路板
CN214572290U (zh) * 2021-01-27 2021-11-02 新恒汇电子股份有限公司 一种引线框架选择性电镀模具

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020158043A1 (en) * 2001-04-27 2002-10-31 Yi-Jing Leu Method of fabricating a flexible circuit board
CN101330799A (zh) * 2007-06-22 2008-12-24 健鼎科技股份有限公司 独立焊垫的无导线电镀方法
TW201005891A (en) * 2008-07-21 2010-02-01 Kinsus Interconnect Tech Corp Alternative electroplate method without conductive wire
CN102373492A (zh) * 2010-08-13 2012-03-14 北大方正集团有限公司 电路板表面进行选择性电镀的方法和电路板
CN214572290U (zh) * 2021-01-27 2021-11-02 新恒汇电子股份有限公司 一种引线框架选择性电镀模具

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