WO2023077646A1 - 印制电路板 - Google Patents

印制电路板 Download PDF

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Publication number
WO2023077646A1
WO2023077646A1 PCT/CN2021/142199 CN2021142199W WO2023077646A1 WO 2023077646 A1 WO2023077646 A1 WO 2023077646A1 CN 2021142199 W CN2021142199 W CN 2021142199W WO 2023077646 A1 WO2023077646 A1 WO 2023077646A1
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WO
WIPO (PCT)
Prior art keywords
signal
circuit board
printed circuit
layer
hole
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Application number
PCT/CN2021/142199
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English (en)
French (fr)
Inventor
陆平
Original Assignee
深南电路股份有限公司
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Application filed by 深南电路股份有限公司 filed Critical 深南电路股份有限公司
Publication of WO2023077646A1 publication Critical patent/WO2023077646A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections

Definitions

  • the invention is applied to the technical field of printed circuit boards.
  • PCB printed Circuit Board
  • PCB printed Circuit Board
  • the signal hole at the connector insertion point is the necessary place for signal transmission, and the structure of the connector insertion signal hole will affect the two.
  • the interconnection of signals between circuit boards will affect the bandwidth and quality of signal transmission.
  • the structure of the signal hole of the traditional printed circuit board will spread a large copper sheet around the signal hole as a reference ground.
  • the signal hole of the connector with this structure has large impedance fluctuations, poor matching, and the transmission signal bandwidth is not high. In serious cases, it will cause the signal bit error rate of the signal receiving end to increase, resulting in signal restoration errors.
  • the invention provides a printed circuit board to solve the problems in the prior art that the signal hole impedance of the printed circuit board fluctuates greatly and the signal bandwidth is not high.
  • the present invention provides a printed circuit board, comprising: a first conductive layer arranged on one side of the printed circuit board; a second conductive layer arranged on the other side of the printed circuit board;
  • the signal line layer is arranged between the first conductive layer and the second conductive layer;
  • the signal hole is at least partially provided with a signal metal layer on the inner wall of the signal hole, and the signal metal layer is electrically connected to the signal line layer;
  • the signal metal layer is connected to the printed circuit
  • the side of the board close to the first conductive layer is arranged at intervals; wherein, the signal holes are used for inserting the signal pins of the connector, so that the signal pins contact the signal metal layer and are electrically connected with the signal line layer.
  • the signal metal layer of the signal hole is spaced apart from the side of the printed circuit board close to the second conductive layer.
  • the distance between the end of the signal metal layer of the signal hole close to the second conductive layer and the signal line layer is less than 10mil.
  • the signal line layer includes a surrounding piece, a connecting piece and a wiring piece; the surrounding piece is arranged around the signal hole; one end of the connecting piece is connected to the surrounding piece, and the other end of the connecting piece is connected to the wiring piece; one end of the wiring piece is connected to the connecting piece,
  • the traces overlap with the projections of other conductive layers of the printed circuit board except the signal line layer on the first plane.
  • the width of the connecting element is larger than the width of the wiring element.
  • the surrounding member and the connecting member are not overlapped with projections of other conductive layers on the first plane except the signal line layer of the printed circuit board.
  • one shielding hole is symmetrically arranged on both sides of each signal hole.
  • every two adjacent signal holes form a group of signal pairs; four ground holes are arranged symmetrically around each group of signal pairs.
  • the center point of each signal pair coincides with the center points of the corresponding 4 shielding holes; the center point of each signal pair coincides with the center points of the corresponding 4 grounding holes.
  • the inner wall of the shielding hole is provided with a shielding metal layer, and the shielding metal layer runs through the printed circuit board, and is connected to other conductive layers in the printed circuit board except the signal line layer;
  • the inner wall of the grounding hole is provided with a grounding metal layer, and the grounding metal layer The layer runs through the printed circuit board and connects other conductive layers in the printed circuit board except the signal line layer.
  • the distance between the end of the signal hole close to the first conductive layer and the first conductive layer is greater than or equal to 0.5 mm.
  • the printed circuit board of the present invention is at least partly provided with a signal metal layer on the inner wall of the signal hole, and the signal metal layer is electrically connected to the signal line layer, and the signal The metal layer is spaced apart from the side of the printed circuit board close to the first conductive layer, so that when the printed circuit board is connected to the signal pin of the connector, the signal metal layer of the signal hole can contact the thicker middle part of the signal pin , realize electrical connection and signal transmission, and can shorten the length of the signal metal layer of the signal hole, avoid shunting and bifurcation of the redundant signal metal layer, and affect the impedance, thereby reducing the fluctuation of the via impedance and improving the signal Transmission bandwidth and signal transmission quality.
  • Fig. 1 is a schematic structural view of an embodiment of a printed circuit board of the present invention
  • Fig. 2 is a top view structural schematic diagram of the printed circuit board in the embodiment of Fig. 1;
  • FIG. 3 is a front structural schematic view of the printed circuit board in the embodiment of FIG. 1 .
  • the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.
  • FIG. 1 is a structural diagram of an embodiment of a printed circuit board of the present invention.
  • FIG. 2 is a schematic top view of the printed circuit board in the embodiment of FIG. 1
  • FIG. 3 is a schematic front view of the printed circuit board in the embodiment of FIG. 1 .
  • the printed circuit board 100 of this embodiment at least includes a first conductive layer 101 , a second conductive layer 102 , a signal line layer 104 and a signal hole 103 .
  • the first conductive layer 101 is arranged on one side of the printed circuit board 100, and the second conductive layer 102 is arranged on the other side of the printed circuit board 100, that is, the first conductive layer 101 and the second conductive layer 102 are respectively arranged on the printed circuit board 100. opposite sides of the circuit board 100 .
  • the signal line layer 104 is disposed between the first conductive layer 101 and the second conductive layer 102 .
  • the inner wall of the signal hole 103 is at least partially provided with a signal metal layer (not marked in the figure), and the signal metal layer is electrically connected to the signal line layer 104; the signal metal layer is spaced apart from the side of the printed circuit board 100 close to the first conductive layer 101 ; Wherein, the signal hole 103 is used to insert the signal pin of the connector, so that the signal pin is in contact with the signal metal layer and electrically connected with the signal line layer 104, so that the signal is carried out between the connector and the signal line layer 104 through the signal hole 103 transmission.
  • At least part of the inner wall of the signal hole 103 is metallized, and the middle of the hole is hollowed out for inserting the signal pin of the connector.
  • the printed circuit board 100 of this embodiment can be applied to all products using connectors for connection, including communication backplanes, servers, and common circuit boards.
  • the signal hole 103 can extend to the first conductive layer 101 of the printed circuit board 100, but the signal metal layer of the signal hole 103 does not extend along the inner wall of the signal hole 103, so that the signal of the signal hole 103 The metal layer is spaced apart from the first conductive layer 101 of the printed circuit board 100 . Since the shape of the signal pin of the connector is thick in the middle and thin at both ends, when the signal pin of the connector is plugged into the signal hole 103, only the thicker middle part of the signal pin abuts against the signal metal layer of the signal hole 103, and then To achieve electrical connection and signal transmission, its thinner end does not realize the function of electrical connection with the signal hole 103.
  • the signal metal layer of the signal hole 103 is spaced from the first conductive layer 101 of the printed circuit board 100, It can not only ensure that the thicker middle part of the signal pin is in contact with the signal metal layer of the signal hole 103 to realize electrical connection and signal transmission, but also reduce the inability of the signal metal layer to be in contact with the thinner end of the signal pin at the end close to the first conductive layer 101
  • the invalid setting of the contact reduces the shunt and bifurcation of the signal metal layer, which affects the impedance.
  • the signal hole 103 and its signal metal layer are spaced apart from the first conductive layer 101 of the printed circuit board 100 , and the signal hole 103 can be arranged at the bottom of the groove on the printed circuit board 100 , so that the signal pin passes through the groove and is inserted into the signal hole 103 for abutment, so that the signal pin can be contacted with the signal metal layer of the signal hole 103 to realize electrical connection and signal transmission, and the signal of the signal hole 103 can be shortened
  • the length of the metal layer avoids shunting and bifurcation of the redundant signal metal layer, which affects the impedance.
  • the printed circuit board of this embodiment is at least partly provided with a signal metal layer on the inner wall of the signal hole, and the signal metal layer is electrically connected to the signal line layer, and the signal metal layer and the printed circuit board are close to the first One side of the conductive layer is arranged at intervals, so that when the printed circuit board is connected to the signal pin of the connector, the signal metal layer of the signal hole can be contacted with the thicker middle part of the signal pin to realize electrical connection and signal transmission. Shorten the length of the signal metal layer of the signal hole, avoid shunting and bifurcation of the redundant signal metal layer, and affect the impedance, thereby reducing the fluctuation of the impedance of the via hole, and improving the signal transmission bandwidth and signal transmission quality.
  • the signal metal layer of the signal hole 103 is spaced apart from the side of the printed circuit board 100 close to the second conductive layer 102 .
  • the signal is transmitted to the signal pin of the connector through the signal wire layer 104 and the signal metal layer of the signal hole 103, so when the signal metal layer of the signal hole 103 is connected to the printed
  • the circuit board 100 is arranged at intervals on one side close to the second conductive layer 102, it can further reduce shunting and bifurcation of redundant signal metal layers, reduce impedance fluctuation of signal hole 103, reduce signal reflection, and improve signal transmission bandwidth.
  • the distance between the signal metal layer of the signal hole 103 and the second conductive layer 102 is similar to the distance between the signal metal layer of the signal hole 103 and the first conductive layer 101 in the foregoing embodiments, please Refer to the previous article, and will not repeat it here.
  • the distance between the end of the signal metal layer of the signal hole 103 close to the second conductive layer 102 and the signal line layer 104 is less than 10 mils. That is, the signal metal layer of the signal hole 103 protrudes from the signal line layer 104 by a distance of less than 10 mil in the direction close to the second conductive layer 102, for example, the protruding distance is 0 mil, 1 mil, 3 mil, 5 mil, 6 mil, 8 mil or 10 mil etc., the smaller the protrusion distance, the better the performance of reducing shunts and bifurcations caused by redundant signal metal layers.
  • the signal line layer 104 includes surrounding elements 1041 , connecting elements 1042 and wiring elements 1043 .
  • the surrounding piece 1041 is arranged around the corresponding signal hole 103, and is connected to the signal metal layer of the signal hole 103, one end of the connecting piece 1042 is connected to the surrounding piece 1041, and the other end of the connecting piece 1042 is connected to the wiring piece 1043; the wiring piece 1043 One end of the wire is connected to the connector 1042, and the other end of the wire 1043 is used for wire signal transmission.
  • the number of surrounding elements 1041 , connecting elements 1042 and wiring elements 1043 in the signal line layer 104 corresponds to the number of signal holes 103 .
  • the number of signal holes 103 is multiple, a group of surrounding parts 1041, connecting parts 1042 and wiring parts 1043 are respectively connected to the corresponding signal holes 103 in the signal line layer 104 until all the signal holes 103 are connected, thereby performing signal routing.
  • the surrounding member 1041 and the signal metal layer of the signal hole 103 are surrounded and connected, which can improve the connection quality effect between the surrounding member 1041 and the signal hole 103, improve the signal transmission effect, and reduce the occurrence of signal transmission being affected by poor contact.
  • the wiring member 1043 overlaps with the projections of other conductive layers on the first plane except the signal line layer 104 of the printed circuit board 100 .
  • the surrounding part 1041 and the connecting part 1042 of the signal line layer 104 are not overlapped with the projections of other conductive layers of the printed circuit board 100 except the signal line layer 104 on the first plane.
  • the first plane is parallel to the signal line layer 104 and other conductive layers of the printed circuit board 100 .
  • the signal line layer 104 is spaced apart from other conductive layers in the printed circuit board 100, and the surrounding part 1041 and the connecting part 1042 of the signal line layer 104 are connected to other conductive layers of the printed circuit board 100 except the signal line layer 104.
  • the projection of the layer on the first plane does not overlap setting.
  • the conductive layer of the printed circuit board 100 may include at least one third conductive layer 107 in addition to the first conductive layer 101 , the second conductive layer 102 and the signal line layer 104 .
  • the third conductive layer 107 is disposed between the first conductive layer 101 and the second conductive layer 102 to realize the circuit function of the printed circuit board 100 .
  • the number of the third conductive layer 107 can be set based on actual needs, for example, 3 layers, 5 layers or 8 layers, etc., which is not limited here.
  • the signal line layer 104 is spaced apart from the first conductive layer 101, the second conductive layer 102 and the third conductive layer 107 in the printed circuit board 100, and the surrounding part 1041 and the connecting part 1042 of the signal line layer 104 are connected to the first conductive layer 104.
  • the projections of the conductive layer 101 , the second conductive layer 102 and the third conductive layer 107 on the first plane are not overlapped.
  • the width of the connection part 1042 of the signal line layer 104 is greater than the width of the wiring part 1043 .
  • the width of the connecting part 1042 Setting it larger than the width of the wiring piece 1043 can balance the impedance between the connecting piece 1042 and the wiring piece 1043 , thereby making the impedance of the connecting piece 1042 and the wiring piece 1043 the same, improving the signal transmission quality of the entire signal line layer 104 .
  • one shielding hole 106 is symmetrically disposed on both sides of each signal hole 103 , wherein the axes of the signal hole 103 and the corresponding two shielding holes 106 are coplanar. In an actual setting, there may be an error of at most 10 mil in the coplanar axes of the signal hole 103 and the two shielding holes 106 on both sides. Wherein, when the axes of the signal hole 103 and the two shielding holes 106 are coplanar, the shielding hole 106 has a better signal shielding effect on the signal hole 103 .
  • every two adjacent signal holes 103 form a group of signal pairs 1031
  • four ground holes 105 are symmetrically arranged around each group of signal pairs 1031 .
  • the printed circuit board 100 is provided with at least one set of signal pairs 1031, which may be 2 sets, 5 sets, 15 sets or 30 sets, etc., which may be set based on actual needs, and are not limited here.
  • grounding holes 105 are arranged symmetrically around each signal pair 1031, which can enhance the overall grounding effect of the signal holes and effectively shorten the return path of the signal.
  • the center points of each signal pair 1031 coincide with the center points of the corresponding four shielding holes 106
  • the center points of each signal pair 1031 coincide with the center points of the corresponding four ground holes 105 .
  • Such a design is conducive to the shielding between the signal hole 103 and other surrounding signals, avoiding mutual interference between signals, and at the same time, enhancing the overall grounding effect of the signal hole 103, effectively shortening the return path of the signal, and helping to improve the signal passing through the signal hole. transmission bandwidth.
  • the number of various holes shown in the schematic diagram of this embodiment is only based on one signal pair 1031, and does not limit the number of various holes.
  • the printed circuit board may include n signal pairs, 2n signal holes, 4n shielding holes and 4n grounding holes, where n is a positive integer.
  • the inner wall of the shielding hole 106 is provided with a shielding metal layer (not shown in the figure), the shielding hole 106 and the shielding metal layer penetrate the printed circuit board 100, and are connected to the printed circuit board 100 except for the signal line layer All other conductive layers except 104.
  • the shielding hole 106 is a complete through hole extending from the first conductive layer 101 to the second conductive layer 102 , the hole wall is metallized, and the middle of the hole can be hollowed out or copper plated.
  • the inner wall of the ground hole 105 is provided with a ground metal layer (not shown in the figure), the ground hole 105 and the ground metal layer penetrate the printed circuit board 100, and connect all other conductive parts in the printed circuit board 100 except the signal line layer 104. layer.
  • the ground hole 105 is a complete through hole extending from the first conductive layer 101 to the second conductive layer 102 , the wall of the hole is metallized, and the middle of the hole is hollowed out.
  • the distance between the end of the signal hole 103 close to the first conductive layer 101 and the first conductive layer 101 is greater than or equal to 0.5 mm.
  • the distance between the end of the signal hole 103 close to the first conductive layer 101 and the first conductive layer 101 can be 0.5 mm, 0.8 mm, 1.0 mm, 2.0 mm or 3.0 mm, etc., which can be based on the structure of the signal pin of the connector to set.
  • the signal transmission path is the connector, the middle part of the signal pin of the connector, the hole wall of the signal hole 103, and the signal line layer 104, and the end of the signal hole 103 close to the first conductive layer 101 and the first conductive layer
  • the distance between 101 is greater than or equal to 0.5 mm, which greatly reduces the shunt and bifurcation path in signal transmission, greatly reduces the reflection of the signal, and is conducive to improving the impedance of the signal hole 103, reducing the
  • the signal hole 103 resists fluctuations, reduces signal reflection, improves signal transmission bandwidth, and facilitates signal interconnection between circuit boards.
  • the printed circuit board 100 further includes an insulating layer (not shown in the figure), and the insulating layer overlaps and sticks to each conductive layer in sequence.
  • the insulating layer is used to support each conductive layer and the signal hole 103 , and ensure the stability of each conductive layer and the signal hole 103 , thereby forming the printed circuit board 100 .
  • the material of the insulating layer includes epoxy resin, polyimide, BT, ABF, ceramic base and so on.
  • the distance between the signal hole of the printed circuit board of this embodiment and the first conductive layer is greater than or equal to 0.5mm, the signal hole passes through the signal line layer and the distance between the signal hole and the signal line layer is ⁇ 10mil, so that the signal transmission is greatly improved. It greatly reduces the shunt and bifurcation path, and greatly reduces the reflection of the signal. It is not only beneficial to improve the impedance of the signal via hole, reduce the fluctuation of the via hole impedance, reduce the signal reflection, but also improve the transmission bandwidth of the signal, which is beneficial to the signal interconnection between the circuit boards.

Abstract

本发明公开了印制电路板，其中，印制电路板包括：第一导电层，设置于印制电路板的一侧；第二导电层，设置于印制电路板的另一侧；信号线层，设置于第一导电层与第二导电层之间；信号孔，信号孔的内壁至少部分设置有信号金属层，信号金属层与信号线层电连接；信号金属层与印制电路板靠近第一导电层的一侧间隔设置；其中，信号孔用于插入连接器的信号针，以使信号针与信号金属层接触并与信号线层电连接。通过上述结构，本发明能够通过减少信号孔的无效信号金属层，减少信号传输中的分流和分叉路径，进而减小信号孔的阻抗波动，提高信号传输带宽以及信号传输质量。

Description

印制电路板 【技术领域】
本发明应用于印制电路板的技术领域。
【背景技术】
PCB(Printed Circuit Board)，又被称为印制电路板或印刷线路板，是应用广泛的重要电子部件，是电子元器件的支撑体，同样也是电子元器件电气连接的载体。
当两个印制电路板之间主要通过背板连接器实现连接以及信号传输时，连接器插接处的信号孔是信号传输的必经之处，连接器插接信号孔的结构会影响两个线路板之间信号互连情况，进而影响信号传输的带宽和信号传输质量。
传统印制电路板的信号孔的结构会在信号孔周围铺大铜皮做为参考地，这样结构的连接器信号孔，阻抗波动较大，匹配性较差，传输的信号带宽也不高，严重时会引起信号接收端信号误码率上升导致信号还原错误。
【发明内容】
本发明提供印制电路板，以解决现有技术中存在的印制电路板的信号孔阻抗波动较大以及信号带宽不高的问题。
为解决上述技术问题，本发明提供了一种印制电路板，包括：第一导电层，设置于印制电路板的一侧；第二导电层，设置于印制电路板的另一侧；信号线层，设置于第一导电层与第二导电层之间；信号孔，信号孔的内壁至少部分设置有信号金属层，信号金属层与信号线层电连接；信号金属层与印制电路板靠近第一导电层的一侧间隔设置；其中，信号孔用于插入连接器的信号针，以使信号针与信号金属层接触并与信号线层电连接。
其中，信号孔的信号金属层与印制电路板靠近第二导电层的一侧间隔设置。
其中，信号孔的信号金属层靠近第二导电层的一端与信号线层之间的距离小于10mil。
其中，信号线层包括环绕件、连接件以及走线件；环绕件环绕信号孔设置；连接件的一端连接环绕件，连接件的另一端连接走线件；走线件的一端连接连接件，且走线件与印制电路板除信号线层外的其他导电层在第一平面上的投影重叠设置。
其中，连接件的宽度大于走线件的宽度。
其中，环绕件以及连接件与印制电路板除信号线层外的其他导电层在第一平面上的投影不重叠设置。
其中，各信号孔的两边分别对称设置有1个屏蔽孔。
其中，每两个相邻的信号孔组成一组信号对；每组信号对的四周对称设置有4个接地孔。
其中，每个信号对的中心点与对应的4个屏蔽孔的中心点重合；每个信号 对的中心点与对应的4个接地孔的中心点重合。
其中，屏蔽孔的内壁设置有屏蔽金属层，屏蔽金属层贯穿印制电路板，并连接印制电路板中除信号线层外的其他导电层；接地孔的内壁设置有接地金属层，接地金属层贯穿印制电路板，并连接印制电路板中除信号线层外的其他导电层。
其中，信号孔靠近第一导电层的一端与第一导电层之间的距离大于或等于0.5毫米。
本发明的有益效果是：区别于现有技术的情况，本发明的印制电路板通过在信号孔的内壁至少部分设置有信号金属层，并使信号金属层与信号线层电连接，而信号金属层与印制电路板靠近第一导电层的一侧间隔设置，从而印制电路板在与连接器的信号针连接时，既能够使信号孔的信号金属层与信号针较粗的中部接触，实现电连接和信号传输，又能够减短信号孔的信号金属层的长度，避免多余的信号金属层产生分流和分叉，影响阻抗的情况发生，进而减小过孔阻抗的波动，提高信号传输带宽以及信号传输质量。
【附图说明】
图1是本发明印制电路板一实施例的结构示意图；
图2是图1实施例中印制电路板的俯视结构示意图；
图3是图1实施例中印制电路板的正视结构示意图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，均属于本发明保护的范围。
需要说明，若本发明实施例中有涉及方向性指示(诸如上、下、左、右、前、后……)，则该方向性指示仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，若本发明实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。
请参阅图1-3，图1是本发明印制电路板一实施例的结构示意图。图2是图1实施例中印制电路板的俯视结构示意图，图3是图1实施例中印制电路板的正视结构示意图。
本实施例的印制电路板100至少包括第一导电层101、第二导电层102、信 号线层104以及信号孔103。
第一导电层101设置于印制电路板100的一侧，第二导电层102设置于印制电路板100的另一侧，即第一导电层101与第二导电层102分别设置于印制电路板100的相对两侧。而信号线层104设置于第一导电层101与第二导电层102之间。
信号孔103的内壁至少部分设置有信号金属层(图中未标注)，信号金属层与信号线层104电连接；信号金属层与印制电路板100靠近第一导电层101的一侧间隔设置；其中，信号孔103用于插入连接器的信号针，以使信号针与信号金属层接触并与信号线层104电连接，从而通过信号孔103在连接器与信号线层104之间进行信号传输。
信号孔103的至少部分内壁金属化，且孔中间镂空，以用于插接连接器的信号针。
本实施例的印制电路板100可以应用于所有使用了连接器实现连接的产品，包括通讯背板、服务器以及常见的线路板等。
在一个具体的应用场景中，信号孔103可以延伸至印制电路板100的第一导电层101，但信号孔103的信号金属层不随着信号孔103的内壁进行延伸，使得信号孔103的信号金属层与印制电路板100的第一导电层101间隔设置。由于连接器的信号针的形状为中间粗、两端细，当连接器的信号针插接至信号孔103内时，信号针只有较粗的中部与信号孔103的信号金属层抵接，进而实现电连接和信号传输，其较细的端部不实现与信号孔103电连接的功能，因此，当信号孔103的信号金属层与印制电路板100的第一导电层101间隔设置时，既可以保证信号针较粗的中部与信号孔103的信号金属层接触，实现电连接和信号传输，又能减少信号金属层在靠近第一导电层101的一端无法与信号针较细的端部接触的无效设置，进而减少信号金属层产生分流和分叉，影响阻抗的情况发生。
在另一个具体的应用场景中，信号孔103及其信号金属层都与印制电路板100的第一导电层101间隔设置，而信号孔103可以设置于印制电路板100上凹槽的底部，从而使得信号针穿过凹槽插入信号孔103内进行抵接，从而既能够使信号针与信号孔103的信号金属层接触，实现电连接和信号传输，又能够减短信号孔103的信号金属层的长度，避免多余的信号金属层产生分流和分叉，影响阻抗的情况发生。
通过上述结构，本实施例的印制电路板通过在信号孔的内壁至少部分设置有信号金属层，并使信号金属层与信号线层电连接，而信号金属层与印制电路板靠近第一导电层的一侧间隔设置，从而印制电路板在与连接器的信号针连接时，既能够使信号孔的信号金属层与信号针较粗的中部接触，实现电连接和信号传输，又能够减短信号孔的信号金属层的长度，避免多余的信号金属层产生分流和分叉，影响阻抗的情况发生，进而减小过孔阻抗的波动，提高信号传输带宽以及信号传输质量。
在其他实施例中，信号孔103的信号金属层与印制电路板100靠近第二导电层102的一侧间隔设置。在印制电路板100与连接器的信号针连接过程中， 信号经信号线层104以及信号孔103的信号金属层传递至连接器的信号针，因此，当信号孔103的信号金属层与印制电路板100靠近第二导电层102的一侧间隔设置时，能够进一步减少多余的信号金属层产生分流和分叉，减小信号孔103阻抗的波动，减少信号反射，提高信号的传输带宽。
在一个具体的应用场景中，信号孔103的信号金属层与第二导电层102间隔设置的方式与前述实施例中信号孔103的信号金属层与第一导电层101间隔设置的方式类似，请参阅前文，在此不再赘述。
在其他实施例中，信号孔103的信号金属层靠近第二导电层102的一端与信号线层104之间的距离小于10mil。即信号孔103的信号金属层在靠近第二导电层102的方向上凸出于信号线层104的距离范围小于10mil，例如凸出的距离为0mil、1mil、3mil、5mil、6mil、8mil或10mil等，当凸出的距离越小，其减少多余的信号金属层产生分流和分叉的性能越优越。
在其他实施例中，信号线层104包括环绕件1041、连接件1042以及走线件1043。其中，环绕件1041环绕对应的信号孔103设置，且与信号孔103的信号金属层连接，连接件1042的一端连接环绕件1041，连接件1042的另一端连接走线件1043；走线件1043的一端连接连接件1042，走线件1043的另一端用于进行走线信号传输。
其中，信号线层104中环绕件1041、连接件1042以及走线件1043的数量与信号孔103的数量对应。当信号孔103的数量为多个时，信号线层104中分别有一组环绕件1041、连接件1042以及走线件1043与对应的信号孔103连接，直至连接完所有的信号孔103，从而进行信号走线。
环绕件1041与信号孔103的信号金属层环绕连接，能够提高环绕件1041与信号孔103之间的连接质量效果，提高信号传输效果，减少因接触不良影响信号传输的情况发生。
其中，走线件1043与印制电路板100除信号线层104外的其他导电层在第一平面上的投影重叠设置。
在其他实施例中，信号线层104的环绕件1041以及连接件1042与印制电路板100除信号线层104外的其他导电层在第一平面上的投影不重叠设置。其中，第一平面与印制电路板100的信号线层104以及其他导电层平行。
也就是说，信号线层104与印制电路板100内其他导电层都间隔设置，且信号线层104的环绕件1041以及连接件1042与印制电路板100除信号线层104外的其他导电层在第一平面上的投影不重叠设置。
其中，印制电路板100的导电层除第一导电层101、第二导电层102以及信号线层104外，还可以包括至少一层第三导电层107。第三导电层107设置于第一导电层101与第二导电层102之间，以实现印制电路板100的电路功能。具体地，第三导电层107的数量可以基于实际需求进行设置，例如为3层、5层或8层等，在此不做限定。
则信号线层104与印制电路板100内的第一导电层101、第二导电层102以及第三导电层107都间隔设置，且信号线层104的环绕件1041以及连接件1042与第一导电层101、第二导电层102以及第三导电层107在第一平面上的投影不 重叠设置。
在其他实施例中，信号线层104的连接件1042的宽度大于走线件1043的宽度。其中，由于连接件1042与印制电路板100除信号线层104外的其他导电层在第一平面上的投影不重叠设置，而走线件1043与印制电路板100除信号线层104外的其他导电层在第一平面上的投影重叠设置，使得印制电路板100除信号线层104外的其他导电层会对走线件1043的阻抗产生影响，因此，通过将连接件1042的宽度设置得大于走线件1043的宽度，能够平衡连接件1042与走线件1043之间的阻抗，进而使得连接件1042与走线件1043的阻抗相同，提高整个信号线层104的信号传输质量。
在其他实施例中，各信号孔103的两边分别对称设置有1个屏蔽孔106，其中，信号孔103与对应的两个屏蔽孔106的轴线共面。在实际设置中，信号孔103与两边的两个屏蔽孔106的轴线共面可以存在最多10mil的误差。其中，当信号孔103与两个屏蔽孔106的轴线共面设置时，屏蔽孔106对信号孔103的信号屏蔽效果更好。
在其他实施例中，每两个相邻的信号孔103组成一组信号对1031，每组信号对1031的四周对称设置有4个接地孔105。印制电路板100中设置有至少一组信号对1031，具体可以为2组、5组、15组或30组等，具体可以基于实际需求进行设置，在此不做限定。
其中，4个接地孔105对称设置在每组信号对1031的四周，能够增强信号孔整体的接地效果，有效缩短信号的返回路径。
在其他实施例中，每个信号对1031的中心点与对应的4个屏蔽孔106的中心点重合，且每个信号对1031的中心点与对应的4个接地孔105的中心点重合。这样的设计有利于信号孔103与周围其他信号之间的屏蔽，避免信号之间的互相干扰，同时，增强信号孔103整体的接地效果，有效缩短信号的返回路径，有利于提高信号通过信号孔的传输带宽。本实施例示意图中所展示的各种孔的数量仅基于一个信号对1031进示意，并不对各种孔的数量进行限定，在其他实施例中，印制电路板可以包括n个信号对，2n个信号孔，4n个屏蔽孔以及4n个接地孔，n为正整数。
在其他实施例中，屏蔽孔106的内壁设置有屏蔽金属层(图中未示出)，屏蔽孔106以及屏蔽金属层贯穿印制电路板100，并连接印制电路板100中除信号线层104外的所有其他导电层。屏蔽孔106为完整的通孔，从第一导电层101延伸至第二导电层102，孔壁金属化，孔中间可以镂空也可以镀铜塞孔。
接地孔105的内壁设置有接地金属层(图中未示出)，接地孔105以及接地金属层贯穿印制电路板100，并连接印制电路板100中除信号线层104外的所有其他导电层。接地孔105是完整的通孔，从第一导电层101延伸至第二导电层102，孔壁金属化，孔中间镂空。
在其他实施例中，信号孔103靠近第一导电层101的一端与第一导电层101之间的距离大于或等于0.5毫米。信号孔103靠近第一导电层101的一端与第一导电层101之间的距离可以为0.5毫米、0.8毫米、1.0毫米、2.0毫米或3.0毫米等，具体可以基于插接器的信号针的结构进行设置。
实际应用中信号的传输路径依次是插接器、插接器的信号针的中部、信号孔103孔壁、信号线层104，通过信号孔103靠近第一导电层101的一端与第一导电层101之间的距离大于或等于0.5毫米的设置，使得信号传输中极大程度地减少了分流和分叉路径，极大程度地减少了信号的反射，有利于提升信号孔103的阻抗，减小信号孔103抗的波动，减少信号反射，提高信号的传输带宽，有利于线路板之间信号互连。
在其他实施例中，印制电路板100还包括绝缘层(图中未示出)，绝缘层与各导电层依次重叠且贴合设置。绝缘层用于支撑各导电层以及信号孔103，并保障各导电层以及信号孔103的稳定性，从而形成印制电路板100。绝缘层的材料包括环氧树脂类、聚酰亚胺类、BT类、ABF类、陶瓷基类等。
通过上述结构，本实施例的印制电路板的信号孔距离第一导电层大于等于0.5mm，信号孔穿过信号线层且信号孔与信号线层距离≤10mil，使得信号传输中极大程度地减少了分流和分叉路径，极大程度地减少了信号的反射。既有利于提升信号过孔的阻抗，减小过孔阻抗的波动，减少信号反射，又提高信号的传输带宽，有利于线路板之间信号互连。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (16)

  1. 一种印制电路板，其特征在于，所述印制电路板包括：
    第一导电层，设置于所述印制电路板的一侧；
    第二导电层，设置于所述印制电路板的另一侧；
    信号线层，设置于所述第一导电层与所述第二导电层之间；
    信号孔，所述信号孔的内壁至少部分设置有信号金属层，所述信号金属层与所述信号线层电连接；所述信号金属层与所述印制电路板靠近所述第一导电层的一侧间隔设置；
    其中，所述信号孔用于插入连接器的信号针，以使所述信号针与所述信号金属层接触并与所述信号线层电连接。
  2. 根据权利要求1所述的印制电路板，其特征在于，所述信号孔的信号金属层与所述印制电路板靠近所述第二导电层的一侧间隔设置。
  3. 根据权利要求2所述的印制电路板，其特征在于，所述信号孔的信号金属层靠近所述第二导电层的一端与所述信号线层之间的距离小于10mil。
  4. 根据权利要求1所述的印制电路板，其特征在于，所述信号线层包括环绕件、连接件以及走线件；
    所述环绕件环绕所述信号孔设置；
    所述连接件的一端连接所述环绕件，所述连接件的另一端连接所述走线件；
    所述走线件的一端连接所述连接件，且所述走线件与所述印制电路板除所述信号线层外的其他导电层在第一平面上的投影重叠设置。
  5. 根据权利要求4所述的印制电路板，其特征在于，所述环绕件环绕所述信号孔的信号金属层设置。
  6. 根据权利要求4所述的印制电路板，其特征在于，
    所述连接件的宽度大于所述走线件的宽度。
  7. 根据权利要求4所述的印制电路板，其特征在于，所述环绕件以及所述连接件与所述印制电路板除所述信号线层外的其他导电层在第一平面上的投影不重叠设置。
  8. 根据权利要求7所述的印制电路板，其特征在于，
    所述信号线层以及所述其他导电层与所述第一平面平行。
  9. 根据权利要求1所述的印制电路板，其特征在于，
    各所述信号孔的两边分别对称设置有1个屏蔽孔。
  10. 根据权利要求9所述的印制电路板，其特征在于，每两个相邻的信号孔组成一组信号对；
    每组所述信号对的四周对称设置有4个接地孔。
  11. 根据权利要求10所述的印制电路板，其特征在于，
    每个所述信号对的中心点与对应的4个所述屏蔽孔的中心点重合；
    每个所述信号对的中心点与对应的4个所述接地孔的中心点重合。
  12. 根据权利要求10所述的印制电路板，其特征在于，
    所述屏蔽孔的内壁设置有屏蔽金属层，所述屏蔽金属层贯穿所述印制电路 板，并连接所述印制电路板中除所述信号线层外的其他导电层；
    所述接地孔的内壁设置有接地金属层，所述接地金属层贯穿所述印制电路板，并连接所述印制电路板中除所述信号线层外的其他导电层。
  13. 根据权利要求1-12任一项所述的印制电路板，其特征在于，所述信号孔靠近所述第一导电层的一端与所述第一导电层之间的距离大于或等于0.5毫米。
  14. 根据权利要求1所述的印制电路板，其特征在于，所述信号孔内壁全部设置有信号金属层，所述信号金属层与所述信号线层电连接；所述信号孔与所述印制电路板靠近所述第一导电层的一侧间隔设置。
  15. 根据权利要求1所述的印制电路板，其特征在于，所述信号孔内壁部分设置有信号金属层，所述信号金属层与所述信号线层电连接；所述信号金属层与所述印制电路板靠近所述第一导电层的一侧间隔设置，所述信号孔延伸至所述第一导电层。
  16. 根据权利要求1所述的印制电路板，其特征在于，所述印制电路板还包括绝缘层；
    所述绝缘层与各导电层依次重叠且贴合设置。
PCT/CN2021/142199 2021-11-04 2021-12-28 印制电路板 WO2023077646A1 (zh)

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Citations (4)

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Publication number Priority date Publication date Assignee Title
CN201042106Y (zh) * 2007-06-07 2008-03-26 杭州华三通信技术有限公司 一种电路板通孔及电路板
CN209546002U (zh) * 2018-09-27 2019-10-25 深圳市一博电路有限公司 一种优化超高速连接器过孔性能的pcb结构
CN110996508A (zh) * 2019-12-26 2020-04-10 新华三技术有限公司合肥分公司 电路板及其制作方法和电子设备
CN111465170A (zh) * 2020-03-31 2020-07-28 新华三技术有限公司 电路板、插拔模块和电路板的制备工艺

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201042106Y (zh) * 2007-06-07 2008-03-26 杭州华三通信技术有限公司 一种电路板通孔及电路板
CN209546002U (zh) * 2018-09-27 2019-10-25 深圳市一博电路有限公司 一种优化超高速连接器过孔性能的pcb结构
CN110996508A (zh) * 2019-12-26 2020-04-10 新华三技术有限公司合肥分公司 电路板及其制作方法和电子设备
CN111465170A (zh) * 2020-03-31 2020-07-28 新华三技术有限公司 电路板、插拔模块和电路板的制备工艺

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