WO2023071445A9 - 集成光学传感器的模组、显示面板、显示装置 - Google Patents

集成光学传感器的模组、显示面板、显示装置 Download PDF

Info

Publication number
WO2023071445A9
WO2023071445A9 PCT/CN2022/113332 CN2022113332W WO2023071445A9 WO 2023071445 A9 WO2023071445 A9 WO 2023071445A9 CN 2022113332 W CN2022113332 W CN 2022113332W WO 2023071445 A9 WO2023071445 A9 WO 2023071445A9
Authority
WO
WIPO (PCT)
Prior art keywords
optical sensor
light guide
guide plate
display panel
optical
Prior art date
Application number
PCT/CN2022/113332
Other languages
English (en)
French (fr)
Other versions
WO2023071445A1 (zh
Inventor
田正
安亚斌
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to US18/262,639 priority Critical patent/US20240304024A1/en
Priority to EP22885345.3A priority patent/EP4261795A4/en
Publication of WO2023071445A1 publication Critical patent/WO2023071445A1/zh
Publication of WO2023071445A9 publication Critical patent/WO2023071445A9/zh

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4298—Coupling light guides with opto-electronic elements coupling with non-coherent light sources and/or radiation detectors, e.g. lamps, incandescent bulbs, scintillation chambers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/94—Hardware or software architectures specially adapted for image or video understanding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/601—Assemblies of multiple devices comprising at least one organic radiation-sensitive element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present application relates to the field of sensors, in particular to a module integrating an optical sensor, a display panel, and a display device.
  • the amount of signal received by the optical sensor directly affects its accuracy of optical feature recognition.
  • the level of integration is getting higher and higher, integrating optical sensors into devices with other functions has become a conventional means.
  • the amount of light signal received by the optical sensor is affected by more and more other structures, which directly affects the accuracy of optical feature recognition.
  • integrating an optical sensor into a display panel can realize biometric identification (for example, fingerprint recognition, facial recognition, etc.), proximity light detection, ambient light detection, and the like.
  • biometric identification for example, fingerprint recognition, facial recognition, etc.
  • proximity light detection for example, proximity light detection
  • ambient light detection for example, ambient light detection
  • the wiring and light-emitting related devices in the display panel have seriously hindered the optical sensor from receiving light signals.
  • the present application provides a module integrating an optical sensor, a display panel, and a display device.
  • the present application provides a module integrating an optical sensor, including:
  • At least one optical sensor that receives an optical signal from the first side of the module
  • At least one light guide plate, the light guide plate and the optical sensor are arranged along the thickness direction of the module, and the light guide plate is arranged on the side of the optical sensor away from the first side;
  • the light guide plate includes a first part and a second part; along the thickness direction of the module, the first part at least partially overlaps the optical sensor, and the second part has no intersection with the optical sensor stack;
  • the surface of the first part away from the optical sensor is a first convex structure, and the angle between at least part of the side of the second part and the thickness direction of the module is larger than 0°.
  • a side of the first portion close to the optical sensor includes at least two second protrusion structures.
  • the module includes a plurality of optical sensors; along the thickness direction of the module, the light guide plate covers at least two of the optical sensors;
  • the light guide plate further includes a third part, and along the thickness direction of the module, the third part covers the area between the at least two optical sensors;
  • the first protruding structure does not overlap with the third portion.
  • the module includes a plurality of optical sensors and a plurality of the light guide plates, and the optical sensors are arranged in one-to-one correspondence with the light guide plates.
  • the projection of the second part surrounds the projection of the optical sensor
  • Angles between the sides of the second portion and the thickness direction of the module are greater than 0°.
  • the optical sensor is a thin film transistor device, and the gate of the thin film transistor device is located on a side of the optical sensor away from the light guide plate.
  • the optical sensor is at least one of an organic photosensitive device and a photodiode device.
  • the present application provides a display panel, including a display area and a non-display area, the non-display area surrounds the display area; at least one of the display area and the non-display area includes:
  • At least one optical sensor that receives an optical signal from the first side of the display panel
  • At least one light guide plate, the light guide plate and the optical sensor are arranged along the thickness direction of the display panel, and the light guide plate is arranged on a side of the optical sensor away from the first side;
  • the light guide plate includes a first part and a second part; along the thickness direction of the display panel, the first part at least partially overlaps the optical sensor, and the second part has no intersection with the optical sensor. stack;
  • the surface of the first part away from the optical sensor is a first convex structure, and the angle between at least part of the side of the second part and the thickness direction of the display panel is greater than 0°.
  • a side of the first portion close to the optical sensor includes at least two second protrusion structures.
  • the non-display area includes a plurality of optical sensors
  • the light guide plate covers at least two of the optical sensors located on opposite sides of the display area;
  • the light guide plate further includes a third portion, at least part of which is located in the display area;
  • the first protrusion structure does not overlap with the third portion located in the display area.
  • the display panel includes a plurality of optical sensors and a plurality of light guide plates, and the optical sensors are arranged in one-to-one correspondence with the light guide plates.
  • the projection of the second part surrounds the projection of the optical sensor
  • Angles between sides of the second portion and the thickness direction of the display panel are greater than 0°.
  • the non-display area includes at least one optical sensor and at least one light guide plate;
  • the display area includes the optical sensor, and the optical sensor located in the display area is used for biometric identification.
  • the optical sensor is a thin film transistor device, and the gate of the thin film transistor device is located on a side of the active layer away from the light guide plate.
  • the optical sensor is at least one of an organic photosensitive device and a photodiode device.
  • the present application provides a display device, including the display panel as provided in the second aspect.
  • the light guide plate located on the side of the optical sensor away from receiving the light signal includes a first part and a second part, and the second part protruding from the optical sensor can be Receive the light signal around the optical sensor and make the light signal can be totally reflected in the light guide plate, the first part blocked by the optical sensor can change the total reflection path of the light signal in the light guide plate and then be emitted by the light guide plate, and mainly reach the optical sensor .
  • the strength of the light signal received by the optical sensor can be increased, and the accuracy of optical feature recognition by the module, display panel, and display device can be increased.
  • FIG. 1 is a schematic diagram of a module integrating an optical sensor provided in an embodiment of the present application
  • FIG. 2 is a schematic diagram of another integrated optical sensor module provided by the embodiment of the present application.
  • Fig. 3 is a schematic diagram of another module integrating an optical sensor provided by the embodiment of the present application.
  • FIG. 4 is a schematic diagram of yet another integrated optical sensor module provided in an embodiment of the present application.
  • FIG. 5 is a schematic diagram of another module integrating an optical sensor provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of an optical sensor and a light guide plate provided by an embodiment of the present application.
  • FIG. 7 is a schematic diagram of a display panel provided by an embodiment of the present application.
  • FIG. 8 is a schematic diagram of another display panel provided by an embodiment of the present application.
  • Fig. 9 is a schematic cross-sectional view corresponding to Fig. 7;
  • Fig. 10 is a schematic cross-sectional view corresponding to Fig. 8;
  • Fig. 11 is another schematic cross-sectional view corresponding to Fig. 7;
  • Fig. 12 is another schematic cross-sectional view corresponding to Fig. 8;
  • FIG. 13 is a schematic cross-sectional view of a display panel provided by an embodiment of the present application.
  • FIG. 14 is a schematic cross-sectional view of another display panel provided by an embodiment of the present application.
  • FIG. 15 is a schematic cross-sectional view of another display panel provided by an embodiment of the present application.
  • FIG. 16 is a schematic diagram of a display device provided by an embodiment of the present application.
  • FIG. 1 is a schematic diagram of a module integrating an optical sensor provided by an embodiment of the present application.
  • the module integrating the optical sensor 10 provided by the embodiment of the present application includes at least one optical sensor 10 and at least one light guide plate 20 , and the light guide plate 20 and the optical sensor 10 are arranged along the thickness direction Z of the module.
  • the optical sensor 10 receives an optical signal from the first side of the module and the light guide plate 20 is disposed on a side of the optical sensor 10 away from the first side.
  • the upper side of the module is its first side
  • the optical sensor 10 receives the optical signal transmitted from the upper side
  • the light guide plate 20 is disposed on the lower side of the optical sensor 10 .
  • the optical signal is a signal used to be transmitted to the optical sensor 10 and converted into an electrical signal by the optical sensor 10, thereby realizing optical feature recognition, specifically, it may be near-infrared light, infrared light, visible light, ultraviolet light, etc. .
  • the light guide plate 20 includes a first part 21 and a second part 22 , that is, the light guide plate 20 is a continuous whole, and the light guide plate 20 is divided into a first part 21 and a second part 22 according to the position difference between the light guide plate 20 and the optical sensor 10 .
  • the second portion 22 does not overlap with the optical sensor 10 , that is, the second portion 22 is a portion protruding from the optical sensor 10 .
  • the angle between at least part of the side 220 of the second part 22 and the thickness direction Z of the module is ⁇ , and ⁇ >0°.
  • the second part 22 is used to receive the optical signal from the periphery of the optical sensor 10 and from the first side of the module; The light signal is converted into light that can be totally reflected in the light guide plate 20 .
  • the light guide plate 20 is a material with a relatively high refractive index. If it is made of acrylic material, its refractive index is 1.491. According to the refractive index formula, when the optical signal incident on the light guide plate 20 undergoes total reflection in the light guide plate 20, the incident angle of the optical signal must be greater than 41.8°. The inclination angle of at least part of the sides 220 of the second portion 22 can be set.
  • the first portion 21 at least partially overlaps the optical sensor 10 , that is, at least a portion of the first portion 21 is blocked by the optical sensor 10 .
  • the surface of the first part 21 far away from the optical sensor 10 is a first raised structure 210, which can change the transmission path of the totally reflected light in the light guide plate 20, that is, the first raised structure 210 can The total reflection of the light in the light guide plate 20 is destroyed, so that it is emitted from the light guide plate 20 .
  • the optical signal whose transmission path is destroyed in the light guide plate 20 is mainly emitted from the surface of the first part 21 close to the optical sensor 10, and mainly The optical sensor 10 is reached.
  • the first raised structure 210 may be printed white dots or injection molded small raised dots.
  • the second part 22 protruding from the optical sensor 10 can receive the light signal around the optical sensor 10 and make the light signal can be totally reflected in the light guide plate 20, and the first part 21 blocked by the optical sensor 10 can make The total reflection path of the light signal in the light guide plate 20 is changed, then emitted from the light guide plate 20 , and mainly reaches the optical sensor 10 .
  • the strength of the optical signal received by the optical sensor 10 can be increased, and the accuracy of the optical feature recognition of the module can be increased.
  • the first protruding structure 210 is only disposed on the first portion 21 overlapping with the optical sensor 10 , and the first protruding structure 210 is disposed away from the first portion 21
  • the optical signal received by the light guide plate 20 can be emitted from the area of the light guide plate 20 corresponding to the optical sensor 10 , effectively increasing the signal amount of the optical signal received by the optical sensor 10 .
  • FIG. 2 is a schematic diagram of another module integrating an optical sensor 10 provided by an embodiment of the present application.
  • the side of the first portion 21 close to the optical sensor 10 includes at least two second protruding structures 211 .
  • the second protruding structure 211 can change the emission angle of this part of the large-angle ray, so that the light transmitted by the light guide plate 20 More of the emitted light is incident on the optical sensor 10 .
  • the second protruding structure 211 can change the transmission path of the received optical signals, specifically making the outgoing angle of these optical signals smaller than the incident angle.
  • the second protruding structure 211 may be a prism structure such as a cone, a hemisphere, or the like.
  • the second protrusion structure 211 may be made of acrylic resin.
  • the first raised structure 210 may be a part of the light guide plate 20, that is, the first raised structure 210 is obtained by designing the surface of the first part 21 away from the optical sensor 10;
  • the protruding structure 211 can also be a part of the light guide plate 20 , that is, the second protruding structure 211 is obtained by designing the surface of the first part 21 close to the optical sensor 10 .
  • the second protruding structure 211 can also be a structure different from that of the light guide plate 20 , that is, the second protruding structure 211 is additionally provided on the upper surface of the light guide plate 20 close to the optical sensor 10 .
  • FIG. 3 is a schematic diagram of another module integrating an optical sensor 10 provided by an embodiment of the present application.
  • the module includes a plurality of optical sensors 10, and along the thickness direction Z of the module, a light guide plate 20 covers at least two optical sensors 10, that is, one light guide plate 20 corresponds to at least two optical sensors 10 .
  • the light guide plate 20 further includes a third portion 23 , and along the thickness direction of the module, the third portion 23 covers an area between at least two optical sensors 10 . That is to say, the third portion 23 of the light guide plate 20 is a portion located between adjacent first portions 21 belonging to the same light guide plate 20 .
  • the first protruding structure 210 does not overlap with the third portion 23 . That is to say, the first protruding structure 210 is not provided on the third part 23 between the adjacent optical sensors 10 in the light guide plate 20, so as to prevent the light signal received by the light guide plate 20 from being transmitted by the light guide plate in the area where the optical sensor 10 is not provided. 20 shots.
  • the light guide plate 20 covers at least two optical sensors 10
  • the light guide plate 20 covering the at least two optical sensors 10 includes at least two first portions 21
  • one optical sensor 10 corresponds to one first portion 21 .
  • the module includes a light guide plate 20 , and the light guide plate 20 may be a whole-surface structure covering all the optical sensors 10 .
  • FIG. 4 is a schematic diagram of another module integrating an optical sensor 10 provided by an embodiment of the present application.
  • the module includes a plurality of optical sensors 10 and a plurality of light guide plates 20 , and the optical sensors 10 and the light guide plates 20 are arranged in one-to-one correspondence.
  • the projection of the second part 22 surrounds the projection of the optical sensor 10
  • the angle between the side 220 of the second part 22 and the thickness direction Z of the module is greater than 0°, that is to say, the light signals around the optical sensor 10 can reach the light guide plate 20 to be received and utilized by the light guide plate 20 .
  • the module includes a plurality of optical sensors 10 and a plurality of light guide plates 20, and, along the thickness direction Z of the module, at least one light guide plate 20 of the light guide plates 20 simultaneously covers at least Two optical sensors 10 , at least one light guide plate 20 of the light guide plates 20 is provided in one-to-one correspondence with the optical sensors 10 .
  • FIG. 5 is a schematic diagram of another module integrating an optical sensor 10 provided by an embodiment of the present application.
  • the module when the module includes at least two optical sensors 10, wherein the two optical sensors 10 are arranged adjacent to each other and their corresponding light guide plates 20 are different, then the two optical sensors 10 In the light plates 20 , the included angles between the side of one light guide plate 20 close to the other light guide plate 20 and the thickness direction Z of the module are substantially equal to 0°. That is to say, within the range of process error, among the sides of two adjacent light guide plates 20 , the included angle between the side between them and the thickness direction Z of the module is basically 0°.
  • the right side of the left light guide plate 20 is the side close to the right light guide plate 20, which is basically parallel to the thickness direction Z of the module; the left side of the right light guide plate 20 To be close to the side of the left light guide plate 20 , the side is also substantially parallel to the thickness direction Z of the module. Crosstalk of optical signals over different optical sensors 10 can then be avoided.
  • FIG. 6 is a schematic diagram of an optical sensor 10 and a light guide plate 20 provided by an embodiment of the present application.
  • the optical sensor 10 is a thin film transistor device, and the optical sensor 10 includes an active layer 11, a grid 12, a source 13 and a drain 14, wherein the active layer 11 can generate different carrier concentrations according to the amount of received optical signal, and then make the optical sensor 10 generate different electrical signals, realizing optical feature recognition.
  • the active layer 11 may specifically be at least one of an amorphous silicon film, a polysilicon film, and a metal oxide semiconductor layer.
  • the gate 12 of the thin film transistor device serving as the optical sensor 10 is located on a side of the optical sensor 10 away from the light guide plate 20 . That is to say, if the gate 12 of the thin film transistor device of the optical sensor 10 is located on the side of the active layer receiving the light signal, the gate 12 will block the light signal and affect the amount of light signal received by the optical sensor 10 .
  • the inventive concept of the present application is adopted, that is, the light guide plate 20 provided by any one of the above-mentioned embodiments is arranged under the optical sensor 10, which can significantly increase the light signal amount of the optical sensor 10 structure.
  • the gate 12 of the thin film transistor device as the optical sensor 10 can be arranged in contact with the active layer 11 , that is, no insulating layer is arranged between the two.
  • the optical sensor 10 may also be at least one of an organic photosensitive device and a photodiode device.
  • FIG. 7 is a schematic diagram of a display panel provided in an embodiment of the present application
  • FIG. 8 is a schematic diagram of another display panel provided in an embodiment of the present application
  • FIG. 9 is a schematic cross-sectional view corresponding to FIG. 7
  • FIG. 10 is a schematic diagram of a display panel in FIG. 8 A corresponding cross-sectional schematic diagram.
  • the embodiment of the present application also provides a display panel.
  • the display panel provided in the embodiment of the present application includes a display area AA and a non-display area BB, and the non-display area BB surrounds the display area AA.
  • the display area AA includes a plurality of light-emitting sub-pixels 30, and this area is mainly used for light-emitting display.
  • the non-display area BB may further include a black frame area B2 and a middle area B1 between the black frame area B2 and the display area AA.
  • At least one of the display area AA and the non-display area BB includes at least one optical sensor 10 and at least one light guide plate 20 , and the light guide plate 20 and the optical sensor 10 are arranged along the thickness direction Z of the display panel. That is to say, the display panel includes at least one optical sensor 10 and at least one light guide plate 20, and the at least one optical sensor 10 and at least one light guide plate 20 are arranged in at least one of the display area AA and the non-display area BB. .
  • the optical sensor 10 and the light guide plate 20 are arranged in the non-display.
  • the optical sensor 10 can preferably be used as a device for ambient light detection or proximity light detection, avoiding the light emitted by the display area AA. Effect on ambient light detection or proximity light detection.
  • the optical sensor 10 and the light guide plate 20 are disposed in the display area AA. That is, the display area AA includes the optical sensor 10 , and the optical sensor 10 located in the display area AA can be used for biometric identification, such as fingerprint identification. Then, in the process of biometric identification, the light-emitting sub-pixel 30 in the display area AA can be used as a detection light source for biometric identification, emitting detection light to the living body, and the detection light reflected by the living body is incident on the optical sensor 10 and the light guide plate 20 , and then realize biometric identification.
  • biometric identification such as fingerprint identification.
  • the light-emitting sub-pixel 30 in the display area AA can be used as a detection light source for biometric identification, emitting detection light to the living body, and the detection light reflected by the living body is incident on the optical sensor 10 and the light guide plate 20 , and then realize biometric identification.
  • part of the optical sensors 10 and part of the light guide plate 20 are disposed in the non-display area BB, and another part of the optical sensors 10 and another part of the light guide plate 20 are disposed in the display area AA.
  • optical sensors 10 and the light guide plate 20 when at least part of the optical sensors 10 and at least part of the light guide plate 20 are arranged in the non-display area BB, these optical sensors 10 and the light guide plate 20 can be arranged in the middle area B1 as shown in FIG. 7 and FIG. In the black frame area B2, or partly set in the middle area B1 and another part set in the black frame area B2.
  • the optical sensor 10 receives light signals from the first side of the display panel and the light guide plate 20 is disposed on a side of the optical sensor 10 away from the first side.
  • the side of the light-emitting surface of the display panel is its first side, then the optical sensor 10 receives the optical signal transmitted from the side of the light-emitting surface of the display panel, and the light guide plate 20 is arranged on the optical sensor 10. The side away from the light-emitting surface of the display panel.
  • the optical signal is a signal used to be transmitted to the optical sensor 10 and converted into an electrical signal by the optical sensor 10, thereby realizing optical feature recognition, specifically, it may be near-infrared light, infrared light, visible light, ultraviolet light, etc. .
  • the light guide plate 20 includes a first part 21 and a second part 22, that is, the light guide plate 20 is a continuous whole. twenty two.
  • the second portion 22 has no overlap with the optical sensor 10 , that is, the second portion 22 is a portion protruding from the optical sensor 10 .
  • the angle between at least part of the side 220 of the second portion 22 and the thickness direction Z of the display panel is ⁇ , and ⁇ >0°.
  • the second part 22 is used to receive the optical signal around the optical sensor 10 and from the first side of the display panel; The light signal is converted into light that can be totally reflected in the light guide plate 20 .
  • the light guide plate 20 is a material with a relatively high refractive index. If it is made of acrylic material, its refractive index is 1.491. According to the refractive index formula, when the optical signal incident on the light guide plate 20 undergoes total reflection in the light guide plate 20, the incident angle of the optical signal must be greater than 41.8°. The inclination angle of at least part of the sides 220 of the second portion 22 can be set.
  • the first portion 21 at least partially overlaps the optical sensor 10 , that is, at least a portion of the first portion 21 is blocked by the optical sensor 10 .
  • the surface of the first part 21 far away from the optical sensor 10 is a first raised structure 210, which can change the transmission path of the totally reflected light in the light guide plate 20, that is, the first raised structure 210 can The total reflection of the light in the light guide plate 20 is destroyed, so that it is emitted from the light guide plate 20 .
  • the optical signal whose transmission path is destroyed in the light guide plate 20 is mainly emitted from the surface of the first part 21 close to the optical sensor 10, and mainly The optical sensor 10 is reached.
  • the first raised structure 210 may be printed white dots or injection molded small raised dots.
  • the second part 22 protruding from the optical sensor 10 can receive the light signal around the optical sensor 10 and make the light signal can be totally reflected in the light guide plate 20, and the first part 21 blocked by the optical sensor 10 can make The total reflection path of the light signal in the light guide plate 20 is changed, then emitted from the light guide plate 20 , and mainly reaches the optical sensor 10 .
  • the strength of the light signal received by the optical sensor 10 can be increased, and the accuracy of the optical feature recognition of the display panel can be increased.
  • the display panel integrated with the optical sensor 10 can realize biometric identification (for example, fingerprint identification, face identification, etc.), approaching light detection, ambient light detection, and the like.
  • the display panel along the thickness direction Z of the display panel, the display panel includes a base substrate 01, a protective cover 02, and a functional layer 03 between them, wherein the functional layer 03 is provided with light-emitting sub-pixels 30, and the photosensitive device can be integrated in the functional layer 03.
  • the base substrate 01 may be a rigid substrate or a flexible substrate.
  • the light guide plate 20 can be attached on the side of the base substrate 01 away from the functional layer 03 , and can also be attached on the side of the protective cover 02 away from the functional layer 03 .
  • the light guide plate 20 can be attached to the side of the base substrate 01 away from the functional layer 03; when the light received by the photosensitive device When the signal comes from the side of the display panel close to the base substrate 01 , the light guide plate 20 can be attached to the side of the protective cover 02 away from the functional layer 03 .
  • the display mode of the display panel is top emission and the photosensitive device receives the light signal from the light-emitting side of the display panel, that is, the side where the protective cover 02 is located is the display panel.
  • FIG. 11 is another schematic cross-sectional view corresponding to FIG. 7
  • FIG. 12 is another schematic cross-sectional view corresponding to FIG. 8 .
  • the side of the first portion 21 close to the optical sensor 10 includes at least two second protruding structures 211 .
  • the second protruding structure 211 can change the emission angle of this part of the large-angle ray, so that the light transmitted by the light guide plate 20 More of the emitted light is incident on the optical sensor 10 .
  • the specific structure, material and setting method of the second protruding structure 211 can be the same as the specific structure and setting method of the second protruding structure 211 in the module integrated with the optical sensor 10 in the above-mentioned embodiment, and will not be repeated here. .
  • FIG. 13 is a schematic cross-sectional view of a display panel provided by an embodiment of the present application.
  • the non-display area BB includes a plurality of optical sensors 10, and along the thickness direction Z of the display panel, the light guide plate 20 covers at least two optical sensors located on opposite sides of the display area AA. sensor 10. That is to say, at least one optical sensor 10 is respectively arranged in the non-display regions BB on opposite sides of the display region AA, and the optical devices respectively arranged in the non-display regions BB on the opposite sides can be guided by the same sensor.
  • the light board 20 covers.
  • the light guide plate 20 further includes a third portion 23, and at least part of the third portion 23 is located in the display area AA.
  • the first protruding structure 210 does not overlap with the third portion 23 located in the display area AA. That is to say, the portion of the light guide plate 20 located in the display area AA is not provided with the first protruding structure 210 , so that the light signal received by the light guide plate 20 can be prevented from being emitted from the light guide plate 20 in the display area AA.
  • the light guide plate 20 prevents the light signal received by the light guide plate 20 from being used for optical feature recognition to cause waste; on the other hand, it prevents the light signal used for optical feature recognition from being emitted in the display area AA and affecting the normal display screen of the display area AA.
  • the second protruding structure 211 does not overlap with the third portion 23 .
  • the light guide plate 20 covers at least two optical sensors 10
  • the light guide plate 20 covering the at least two optical sensors 10 includes at least two first portions 21
  • one optical sensor 10 corresponds to one first portion 21 .
  • the display panel includes a light guide plate 20
  • the light guide plate 20 may be a whole-surface structure covering all the optical sensors 10 .
  • the display panel includes a plurality of optical sensors 10 and a plurality of light guide plates 20 , and the optical sensors 10 and the light guide plates 20 are arranged in one-to-one correspondence.
  • the projection of the second part 22 surrounds the projection of the optical sensor 10 and the side of the second part 22
  • the included angles between the side 220 and the thickness direction Z of the display panel are greater than 0°, that is to say, the light signals around the optical sensor 10 can reach the light guide plate 20 and be received and utilized by the light guide plate 20, thereby effectively improving the optical sensor 10.
  • the semaphore of the received optical signal is greater than 0°, that is to say, the light signals around the optical sensor 10 can reach the light guide plate 20 and be received and utilized by the light guide plate 20, thereby effectively improving the optical sensor 10. The semaphore of the received optical signal.
  • the display panel includes a plurality of optical sensors 10 and a plurality of light guide plates 20, and, along the thickness direction Z of the display panel, at least one of the light guide plates 20 covers at least Two optical sensors 10 , at least one light guide plate 20 of the light guide plates 20 is provided in one-to-one correspondence with the optical sensors 10 .
  • FIG. 14 is a schematic cross-sectional view of another display panel provided by an embodiment of the present application.
  • the non-display area BB includes at least one optical sensor 10 and at least one light guide plate 20, and is arranged in the light guide plate 20 of the non-display area BB, close to the display area AA.
  • the sides are parallel to the thickness direction of the display panel. That is to say, within the range of process error, among the sides of the light guide plate 20 disposed in the non-display area BB, the angle between the side near the display area AA and the thickness direction Z of the display panel is substantially 0°.
  • the right side of the light guide plate 20 disposed in the non-display area BB is the side close to the display area AA, and the side is substantially parallel to the thickness direction Z of the display panel.
  • FIG. 15 is a schematic cross-sectional view of another display panel provided by an embodiment of the present application.
  • the optical sensor 10 is a thin film transistor device, and the optical sensor 10 includes an active layer 11, a gate 12, a source 13 and a drain 14, wherein the active layer 11 can generate different carrier concentrations according to the amount of received optical signal, and then make the optical sensor 10 generate different electrical signals, realizing optical feature recognition.
  • the active layer 11 may specifically be at least one of an amorphous silicon film, a polysilicon film, and a metal oxide semiconductor layer.
  • the gate 12 of the thin film transistor device serving as the optical sensor 10 is located on a side of the optical sensor 10 away from the light guide plate 20 . That is to say, if the gate 12 of the thin film transistor device of the optical sensor 10 is located on the side of the active layer receiving the light signal, the gate 12 will block the light signal and affect the amount of light signal received by the optical sensor 10 .
  • the inventive concept of the present application is adopted, that is, the light guide plate 20 provided by any one of the above-mentioned embodiments is arranged under the optical sensor 10, which can significantly increase the light signal amount of the optical sensor 10 structure.
  • the thin-film transistor device used as the optical sensor 10 can be fabricated on the same layer as at least part of the structure of the thin-film transistor device 301 in the light-emitting sub-pixel 30, wherein the thin-film transistor device 301 in the light-emitting sub-pixel 30 can be the Light emitting device 302 provides a light emitting signal. As shown in FIG.
  • the gate 12 of the thin film transistor device of the optical sensor 10 can be arranged on the same layer as the gate 32 of the thin film transistor device 301 in the light-emitting sub-pixel 30, as the source 13 of the thin film transistor device of the optical sensor 10
  • the drain 14 may be set in the same layer as the source 33 and the drain 34 of the TFT device 301 in the light-emitting sub-pixel 30 .
  • the active layer 11 of the thin film transistor device serving as the optical sensor 10 can be arranged in the same layer as the active layer 31 of the thin film transistor device 301 in the light-emitting sub-pixel 30 or arranged in different layers. And in the embodiment of the present application, the gate 12 of the thin film transistor device as the optical sensor 10 can be arranged in contact with the active layer 11 , that is, no insulating layer is arranged between the two.
  • the optical sensor 10 may also be at least one of an organic photosensitive device and a photodiode device.
  • FIG. 16 is a schematic diagram of a display device provided in an embodiment of the present application.
  • the display device includes the display device provided in any embodiment of the present application.
  • Display panel 001 the specific structure of the display panel 001 has been described in detail in the above embodiments, and will not be repeated here.
  • the display device shown in FIG. 16 is only for schematic illustration, and may be any display device with a display function such as a mobile phone, a tablet computer, a notebook computer, an electronic paper book, a TV, and a smart watch. the display panel.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Optics & Photonics (AREA)
  • Human Computer Interaction (AREA)
  • Software Systems (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Sustainable Development (AREA)
  • Image Input (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本申请实施例一种集成光学传感器的模组、显示面板、显示装置，导光板与光学传感器沿厚度方向排布，光学传感器接收来自第一侧的光信号，导光板设置在光学传感器远离第一侧的一侧；导光板的第一部分沿厚度方向与光学传感器至少部分交叠，第二部分与光学传感器无交叠；第一部分远离光学传感器的表面为第一凸起结构，第二部分的至少部分侧边与厚度方向之间的夹角大于0°。在本申请实施例中，突出于光学传感器的第二部分可以接收光学传感器周边的光信号并使得光信号可以在导光板内全反射，被光学传感器遮挡的第一部分可以使导光板内的光信号的全反射路径改变后由导光板射出，可以增加光学传感器接收的光信号强度，增加模组对光学特征识别的精度。

Description

集成光学传感器的模组、显示面板、显示装置
本申请要求于2021年10月28日提交中国专利局、申请号为202111264791.5、申请名称为“集成光学传感器的模组、显示面板、显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及传感器领域，具体地涉及集成光学传感器的模组、显示面板、显示装置。
背景技术
在光学传感器领域，光学传感器接收信号量的多少直接影响其对光学特征识别的准确度。在集成化程度越来越高的当前，将光学传感器集成到具有其他功能的装置中，已经是常规的手段。但是，在将光学传感器集成到具有其他功能的装置中时，光学传感器所接收的光信号量受到越来越多其他结构的影响，直接影响了光学特征识别的准确度。
例如，在显示领域，将光学传感器集成到显示面板，可以实现生物特征识别(例如，指纹识别、面部识别等)、接近光检测、环境光检测等。然而显示面板中的线路和发光相关的器件对光学传感器接收光信号造成了严重的阻碍。
因此，如何提高集成有光学传感器的装置的光学特征识别准确度仍然是亟待解决的问题。
发明内容
有鉴于此，本申请提供一种集成光学传感器的模组、显示面板、显示装置。
第一方面，本申请提供一种集成光学传感器的模组，包括：
至少一个光学传感器，所述光学传感器接收来自所述模组第一侧的光信号；
至少一个导光板，所述导光板与所述光学传感器沿所述模组的厚度方向排布，且所述导光板设置在所述光学传感器远离所述第一侧的一侧；
其中，所述导光板包括第一部分和第二部分；沿所述模组的厚度方向，所述第一部分与所述光学传感器至少部分交叠，且所述第二部分与所述光学传感器无交叠；
所述第一部分远离所述光学传感器的表面为第一凸起结构，所述第二部分的至少部分侧边与所述模组厚度方向之间的夹角大于0°。
在第一方面的一种实现方式中，所述第一部分靠近所述光学传感器的一侧包括至少两个第二凸起结构。
在第一方面的一种实现方式中，所述模组包括多个光学传感器；沿所述模组的厚度方向，所述导光板覆盖至少两个所述光学传感器；
所述导光板还包括第三部分，沿所述模组的厚度方向，所述第三部分覆盖所述至少两个所述光学传感器之间的区域；
其中，沿所述模组的厚度方向，所述第一凸起结构与所述第三部分无交叠。
在第一方面的一种实现方式中，所述模组包括多个光学传感器及多个所述导光板，所述光学传感器与所述导光板一一对应设置。
在第一方面的一种实现方式中，在对应设置的所述光学传感器与所述导光板中，沿所述模组的厚度方向，所述第二部分的投影围绕所述光学传感器的投影；
所述第二部分的侧边与所述模组厚度方向之间的夹角均大于0°。
在第一方面的一种实现方式中，所述光学传感器为薄膜晶体管器件，且所述薄膜晶体管器件的栅极位于所述光学传感器远离所述导光板的一侧。
在第一方面的一种实现方式中，所述光学传感器为有机感光器件、光电二极管器件中的至少一者。
第二方面，本申请提供一种显示面板，包括显示区和非显示区，所述非显示区围绕所述显示区；所述显示区与所述非显示区中的至少一者包括：
至少一个光学传感器，所述光学传感器接收来自所述显示面板第一侧的光信号；
至少一个导光板，所述导光板与所述光学传感器沿所述显示面板的厚度方向排布，且所述导光板设置在所述光学传感器远离所述第一侧的一侧；
其中，所述导光板包括第一部分和第二部分；沿所述显示面板的厚度方向，所述第一部分与所述光学传感器至少部分交叠，且所述第二部分与所述光学传感器无交叠；
所述第一部分远离所述光学传感器的表面为第一凸起结构，所述第二部分的至少部分侧边与所述显示面板厚度方向之间的夹角大于0°。
在第二方面的一种实现方式中，所述第一部分靠近所述光学传感器的一侧包括至少两个第二凸起结构。
在第二方面的一种实现方式中，所述非显示区包括多个所述光学传感器；
沿所述显示面板的厚度方向，所述导光板覆盖位于所述显示区相对两侧的至少两个所述光学传感器；
所述导光板还包括第三部分，所述第三部分的至少部分位于所述显示区；
其中，沿所述显示面板的厚度方向，所述第一凸起结构与位于所述显示区的所述 第三部分无交叠。
在第二方面的一种实现方式中，所述显示面板包括多个光学传感器及多个所述导光板，所述光学传感器与所述导光板一一对应设置。
在第二方面的一种实现方式中，在对应设置的所述光学传感器与所述导光板中，沿所述显示面板的厚度方向，所述第二部分的投影围绕所述光学传感器的投影；
所述第二部分的侧边与所述显示面板厚度方向之间的夹角均大于0°。
在第二方面的一种实现方式中，所述非显示区包括至少一个所述光学传感器及至少一个所述导光板；
设置在所述非显示的所述导光板中，靠近所述显示区的侧边与所述显示面板的厚度方向平行。
在第二方面的一种实现方式中，所述显示区包括所述光学传感器，位于所述显示区的所述光学传感器用于进行生物特征识别。
在第二方面的一种实现方式中，所述光学传感器为薄膜晶体管器件，且所述薄膜晶体管器件的栅极位于有源层远离所述导光板的一侧。
在第二方面的一种实现方式中，所述光学传感器为有机感光器件、光电二极管器件中的至少一者。
第三方面，本申请提供一种显示装置，包括如第二方面提供的显示面板。
在本申请实施例提供的集成光学传感器的模组、显示面板及显示装置中，位于光学传感器背离接收光信号一侧的导光板包括第一部分和第二部分，突出于光学传感器的第二部分可以接收光学传感器周边的光信号并使得光信号可以在导光板内全反射，被光学传感器遮挡的第一部分可以使导光板内的光信号的全反射路径改变后由导光板射出，并主要到达光学传感器。则本申请实施例通过在光学传感器的下方设置导光板，并且对导光板进行特殊设计，可以增加光学传感器接收的光信号强度，增加模组、显示面板及显示装置对光学特征识别的精度。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其它的附图。
图1为本申请实施例提供的一种集成光学传感器的模组的示意图；
图2为本申请实施例提供的另一种集成光学传感器的模组的示意图；
图3为本申请实施例提供的又一种集成光学传感器的模组的示意图；
图4为本申请实施例提供的再一种集成光学传感器的模组的示意图；
图5为本申请实施例提供的还一种集成光学传感器的模组的示意图；
图6为本申请实施例提供的一种光学传感器与导光板的示意图；
图7为本申请实施例提供的一种显示面板的示意图；
图8为本申请实施例提供的另一种显示面板的示意图；
图9为图7对应的一种剖面示意图；
图10为图8对应的一种剖面示意图；
图11为图7对应的另一种剖面示意图；
图12为图8对应的另一种剖面示意图；
图13为本申请实施例提供的一种显示面板的剖面示意图；
图14为本申请实施例提供的另一种显示面板的剖面示意图；
图15为本申请实施例提供的又一种显示面板的剖面示意图；
图16为本申请实施例提供的一种显示装置的示意图。
具体实施方式
为了更好的理解本申请的技术方案，下面结合附图对本申请实施例进行详细描述。
应当明确，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
在本申请实施例中使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本申请。在本申请实施例和所附权利要求书中所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式，除非上下文清楚地表示其他含义。
应当理解，本文中使用的术语“和/或”仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，甲和/或乙，可以表示：单独存在甲，同时存在甲和乙，单独存在乙这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。
图1为本申请实施例提供的一种集成光学传感器的模组的示意图。
如图1所示，本申请实施例提供的集成光学传感器10的模组包括至少一个光学传感器10和至少一个导光板20，导光板20与光学传感器10沿模组的厚度方向Z排布。
光学传感器10接收来自模组第一侧的光信号且导光板20设置在光学传感器10远离第一侧的一侧。例如，如图1所示，模组的上侧为其第一侧，则光学传感器10接收上侧传输过来的光信号，并且导光板20设置在光学传感器10的下侧。
在本申请实施例中，光信号是用于传导至光学传感器10并且由光学传感器10转换为电信号，进而实现光学特征识别的信号，具体可以为近红外光、红外光、可见光、紫外光等。
其中，导光板20包括第一部分21和第二部分22，即导光板20为一个连续的整体，根据其与光学传感器10位置的不同，将导光板20划分为第一部分21与第二部分22。
沿模组的厚度方向Z，第二部分22与光学传感器10无交叠，也就是说，第二部分22为突出于光学传感器10的部分。并且第二部分22的至少部分侧边220与模组 的厚度方向Z之间的夹角为α，且α＞0°。第二部分22用于接收光学传感器10周边的且来自模组第一侧的光信号；并且第二部分22的部分侧边220的倾斜角度与导光板20的折射率配合设置，用于将接收的光信号转换为能够在导光板20内进行全反射的光线。
导光板20为一种折射率较高的材料。如采用亚克力材料制成时，其折射率为1.491，根据折射率公式，当入射至导光板20的光信号在导光板20内发生全反射时，光信号的入射角度需大于41.8°，依此可以设置第二部分22中至少部分侧边220的倾斜角度。
沿模组的厚度方向Z，第一部分21与光学传感器10至少部分交叠，也就是说，第一部分21的至少部分被光学传感器10所遮挡。并且，第一部分21远离光学传感器10的表面为第一凸起结构210，第一凸起结构210可以改变导光板20内进行全反射的光线的传输路径，也就是，第一凸起结构210可以破坏导光板20内光线的全反射，使其由导光板20射出。此外，由于第一部分21中远离光学传感器10的表面设置第一凸起结构210，则导光板20中被破坏了传输路径的光信号主要由第一部分21中靠近光学传感器10的表面射出，并主要达到光学传感器10。
第一凸起结构210具体可以为印刷白色网点或者注塑小凸点。
在本申请实施例中，突出于光学传感器10的第二部分22可以接收光学传感器10周边的光信号并使得光信号可以在导光板20内全反射，被光学传感器10遮挡的第一部分21可以使导光板20内的光信号的全反射路径改变后由导光板20射出，并主要到达光学传感器10。则本申请实施例通过在光学传感器10的下方设置导光板20，并且对导光板20进行特殊设计，可以增加光学传感器10接收的光信号强度，增加模组对光学特征识别的精度。
在本申请的一个实施例中，如图1所示，第一凸起结构210仅设置在与光学传感器10存在交叠的第一部分21上，且第一凸起结构210设置在第一部分21远离光学传感器10的表面，则被导光板20接收的光信号可以有导光板20中对应光学传感器10的区域射出，有效提升光学传感器10接收的光信号的信号量。
图2为本申请实施例提供的另一种集成光学传感器10的模组的示意图。
在本申请的一个实施例中，如图2所示，第一部分21靠近光学传感器10的一侧包括至少两个第二凸起结构211。在导光板20内传输的被第一凸起结构210破坏全反射路径的光信号中存在大角度光线，第二凸起结构211可以改变该部分大角度光线的发射角度，进而使得由导光板20射出的光线更多地入射至光学传感器10。
也就说，第二凸起结构211可以将接收的光信号的传输路径发生改变，具体为使得该些光信号的出射角度小于入射角度。则第二凸起结构211可以为锥形、半球形等棱镜结构。第二凸起结构211可以由亚克力树脂制成。
需要说明的是，在本申请实施例中，第一凸起结构210可以为导光板20的一部分，即第一凸起结构210为对第一部分21远离光学传感器10的表面进行设计得到；第二凸起结构211也可以为导光板20的一部分，即第二凸起结构211为对第一部分21靠近光学传感器10的表面进行设计得到。此外，第二凸起结构211也可以为区别于导光板20的结构，即在导光板20靠近光学传感器10的上表面额外设置第二凸起 结构211。
图3为本申请实施例提供的又一种集成光学传感器10的模组的示意图。
在本申请的一个实施例中，如图3所示，模组包括多个光学传感器10，且沿模组的厚度方向Z，导光板20覆盖至少两个光学传感器10，也就是，一个导光板20对应至少两个光学传感器10。
在本实施例中，导光板20还包括第三部分23，沿模组的厚度方向，第三部分23覆盖至少两个光学传感器10之间的区域。也就是说导光板20的第三部分23为位于属于同一导光板20的相邻第一部分21之间的部分。
其中，沿模组的厚度方向Z，第一凸起结构210与第三部分23无交叠。也就是说，导光板20中位于相邻光学传感器10之间的第三部分23上不设置第一凸起结构210，避免导光板20接收的光信号在不设置光学传感器10的区域由导光板20射出。
可以理解地，当导光板20覆盖至少两个光学传感器10时，覆盖该至少两个光学传感器10的导光板20包括至少两个第一部分21，一个光学传感器10对应一个第一部分21。
在本实施例的一种实现方式中，模组包括一个导光板20，且该导光板20可以为覆盖所有光学传感器10的整面结构。
图4为本申请实施例提供的再一种集成光学传感器10的模组的示意图。
在本申请的另一个实施例中，如图4所示，模组包括多个光学传感器10及多个导光板20，且光学传感器10与导光板20一一对应设置。
在本实施例的一种实现方式中，如图4所示，在对应设置的光学传感器10与导光板20中，沿模组的厚度方向Z，第二部分22的投影围绕光学传感器10的投影并且第二部分22的侧边220与模组厚度方向Z之间的夹角均大于0°，也就是说，光学传感器10周围的光信号均可以到达导光板20被导光板20所接收利用。
在本申请的又一个实施例中，模组包括多个光学传感器10及多个导光板20，并且，沿模组的厚度方向Z，该些导光板20中的至少一个导光板20同时覆盖至少两个光学传感器10，该些导光板20的至少一个导光板20与光学传感器10一一对应设置。
图5为本申请实施例提供的还一种集成光学传感器10的模组的示意图。
在本申请的一个实施例中，如图5所示，当模组包括至少两个光学传感器10时，其中两个光学传感器10相邻设置且各自对应的导光板20不同，则该两个导光板20中，一个导光板20靠近另一个导光板20的侧边与模组厚度方向Z之间的夹角均基本等于0°。也就是说，在工艺误差范围内，相邻设置的两个导光板20的侧边中，位于两者之间的侧边与模组厚度方向Z之间的夹角基本为0°。例如，如图5所示，左侧导光板20的右侧边为靠近右侧导光板20的侧边，该侧边与模组的厚度方向Z基本平行；右侧导光板20的左侧边为靠近左侧导光板20的侧边，该侧边与模组的厚度方向Z也基本平行。则可以避免不同光学传感器10上方的光信号的串扰。
图6为本申请实施例提供的一种光学传感器10与导光板20的示意图。
在本申请的一个实施例中，如图6所示，光学传感器10为薄膜晶体管器件，则光学传感器10包括有源层11、栅极12、源极13及漏极14，其中，有源层11可以根 据接收到的光信号量的多少产生不同的载流子浓度，进而使得光学传感器10产生不同的电信号，实现光学特征识别。有源层11具体可以为非晶硅薄膜、多晶硅薄膜、金属氧化物半导体层中的至少一者。
在本实施例的一种实现方式中，其中，作为光学传感器10的薄膜晶体管器件的栅极12位于光学传感器10远离导光板20的一侧。也就是说，作为光学传感器10的薄膜晶体管器件的栅极12位于有源层接收光信号的一侧，则该栅极12会对光信号进行遮挡，影响光学传感器10接收的光信号量。在该实现方式中，采用本申请的发明构思，即在光学传感器10的下方设置上述任意一个实施例提供的导光板20，可以明显增加光学传感器10结构的光信号量。
在本申请实施例中，作为光学传感器10的薄膜晶体管器件的栅极12可以与其有源层11接触设置，即两者之间不设置绝缘层。
在本申请的另一个实施例中，光学传感器10也可以为有机感光器件、光电二极管器件中的至少一者。
图7为本申请实施例提供的一种显示面板的示意图，图8为本申请实施例提供的另一种显示面板的示意图，图9为图7对应的一种剖面示意图，图10为图8对应的一种剖面示意图。
本申请实施例还提供一种显示面板，如图7-图10所示，本申请实施例提供的显示面板包括显示区AA和非显示区BB，非显示区BB围绕显示区AA。显示区AA中包括多个发光子像素30，该区域主要用于进行发光显示。非显示区BB还可以包括黑色边框区B2、以及位于黑色边框区B2与显示区AA之间的中间区B1。
其中，显示区AA与非显示区BB的至少一者中包括至少一个光学传感器10和至少一个导光板20，导光板20与光学传感器10沿显示面板的厚度方向Z排布。也就是说，显示面板包括至少一个光学传感器10和至少一个导光板20，且该至少一个光学传感器10和至少一个导光板20设置在显示区AA、非显示区BB中的至少一者所在区域内。
例如，如图7与图9所示，光学传感器10与导光板20设置在非显示内，此时光学传感器10优选可以作为环境光检测或者接近光检测的器件，避免了显示区AA所发射光线对环境光检测或者接近光检测的影响。
例如，如图8与图10所示，光学传感器10与导光板20设置在显示区AA内。即，显示区AA包括光学传感器10，则位于显示区AA的光学传感器10可以用于生物特征识别，例如进行指纹识别。则在生物特征识别过程中，显示区AA中的发光子像素30可以作为进行生物特征识别的探测光源，向生物体发射探测光，经生物体反射的探测光入射至光学传感器10和导光板20，进而实现生物特征识别。
例如，部分光学传感器10与部分导光板20设置在非显示区BB，另一部分光学传感器10与另一部分导光板20设置在显示区AA内。
此外，当有至少部分光学传感器10与至少部分导光板20设置在非显示区BB时，该些光学传感器10与导光板20可以如图7与图9所示设置在中间区B1，也可以设置在黑色边框区B2，或者部分设置在中间区B1且另一部分设置在黑色边框区B2。
光学传感器10接收来自显示面板第一侧的光信号且导光板20设置在光学传感器10远离第一侧的一侧。例如，如图9及图10所示，显示面板的出光面一侧为其第一侧，则光学传感器10接收显示面板出光面一侧传输过来的光信号，并且导光板20设置在光学传感器10背离显示面板出光面的一侧。
在本申请实施例中，光信号是用于传导至光学传感器10并且由光学传感器10转换为电信号，进而实现光学特征识别的信号，具体可以为近红外光、红外光、可见光、紫外光等。
其中，导光板20包括第一部分21和第二部分22，即导光板20为一个连续的整体，根据其与对应的光学传感器10位置的不同，将导光板20划分为第一部分21与第二部分22。
沿显示面板的厚度方向Z，第二部分22与光学传感器10无交叠，也就是说，第二部分22为突出于光学传感器10的部分。并且第二部分22的至少部分侧边220与显示面板的厚度方向Z之间的夹角为α，且α＞0°。第二部分22用于接收光学传感器10周边的且来自显示面板第一侧的光信号；并且第二部分22的部分侧边220的倾斜角度与导光板20的折射率配合设置，用于将接收的光信号转换为能够在导光板20内进行全反射的光线。
导光板20为一种折射率较高的材料。如采用亚克力材料制成时，其折射率为1.491，根据折射率公式，当入射至导光板20的光信号在导光板20内发生全反射时，光信号的入射角度需大于41.8°，依此可以设置第二部分22中至少部分侧边220的倾斜角度。
沿显示面板的厚度方向Z，第一部分21与光学传感器10至少部分交叠，也就是说，第一部分21的至少部分被光学传感器10所遮挡。并且，第一部分21远离光学传感器10的表面为第一凸起结构210，第一凸起结构210可以改变导光板20内进行全反射的光线的传输路径，也就是，第一凸起结构210可以破坏导光板20内光线的全反射，使其由导光板20射出。此外，由于第一部分21中远离光学传感器10的表面设置第一凸起结构210，则导光板20中被破坏了传输路径的光信号主要由第一部分21中靠近光学传感器10的表面射出，并主要达到光学传感器10。
第一凸起结构210具体可以为印刷白色网点或者注塑小凸点。
在本申请实施例中，突出于光学传感器10的第二部分22可以接收光学传感器10周边的光信号并使得光信号可以在导光板20内全反射，被光学传感器10遮挡的第一部分21可以使导光板20内的光信号的全反射路径改变后由导光板20射出，并主要到达光学传感器10。则本申请实施例通过在光学传感器10的下方设置导光板20，并且对导光板20进行特殊设计，可以增加光学传感器10接收的光信号强度，增加显示面板对光学特征识别的精度。
在本申请实施例中，集成有光学传感器10的显示面板可以实现生物特征识别(例如，指纹识别、面部识别等)、接近光检测、环境光检测等。
在本申请实施例中，沿显示面板的厚度方向Z，显示面板包括衬底基板01及保护盖板02，以及位于两者之间的功能层03，其中，功能层03中设置有发光子像素30，并且光感器件可以集成在功能层03中。衬底基板01可以是刚性基板、也可以是柔性 基板。
此外，导光板20可以贴附在衬底基板01远离功能层03的一侧，也可以贴附在保护盖板02远离功能层03的一侧。当光感器件接收的光信号来自于显示面板中靠近保护盖板02的一侧时，则导光板20可以贴附在衬底基板01远离功能层03的一侧；当光感器件接收的光信号来自于显示面板中靠近衬底基板01的一侧时，则导光板20可以贴附在保护盖板02远离功能层03的一侧。
在一种实现方式中，如图9及图10所示，显示面板的显示方式为顶发射且光感器件接收显示面板出光面一侧的光信号，即保护盖板02所在一侧为显示面板的出光面，且光感器件接收显示面板出光面一侧的光信号，则导光板20可以贴附在衬底基板01上。
图11为图7对应的另一种剖面示意图，图12为图8对应的另一种剖面示意图。
在本申请的一个实施例中，如图11及图12所示，第一部分21靠近光学传感器10的一侧包括至少两个第二凸起结构211。在导光板20内传输的被第一凸起结构210破坏全反射路径的光信号中存在大角度光线，第二凸起结构211可以改变该部分大角度光线的发射角度，进而使得由导光板20射出的光线更多地入射至光学传感器10。
其中，第二凸起结构211的具体结构、材料及设置方式可以与上述实施例中集成光学传感器10的模组中的第二凸起结构211的具体结构及设置方式相同，在此不再赘述。
图13为本申请实施例提供的一种显示面板的剖面示意图。
在本申请的一个实施例中，如图13所示，非显示区BB包括多个光学传感器10，且沿显示面板的厚度方向Z，导光板20覆盖位于显示区AA相对两侧至少两个光学传感器10。也就是说，在位于显示区AA的相对两侧的非显示区BB中分别设置有至少一个光学传感器10，且分别设置在该相对两侧的非显示区BB中的光学器件可以被同一个导光板20覆盖。
在本实施例中，导光板20还包括第三部分23，且第三部分23的至少部分位于显示区AA。其中，沿显示面板的厚度方向Z，第一凸起结构210与位于显示区AA的第三部分23无交叠。也就是说，导光板20中位于显示区AA的部分上不设置第一凸起结构210，则可以避免导光板20接收的光信号在显示区AA由导光板20射出。一方面，避免导光板20接收的光信号不用于光学特征识别造成浪费；另一方面，避免用于进行光学特征识别的光信号在显示区AA射出影响显示区AA正常的显示画面。
此外，第二凸起结构211也与第三部分23无交叠。
可以理解地，当导光板20覆盖至少两个光学传感器10时，覆盖该至少两个光学传感器10的导光板20包括至少两个第一部分21，一个光学传感器10对应一个第一部分21。
在本实施例的一种实现方式中，显示面板包括一个导光板20，且该导光板20可以为覆盖所有光学传感器10的整面结构。
在本申请的另一个实施例中，显示面板包括多个光学传感器10及多个导光板20，且光学传感器10与导光板20一一对应设置。
在本申请的一种实现方式中，在对应设置的光学传感器10与导光板20中，沿显示面板的厚度方向Z，第二部分22的投影围绕光学传感器10的投影并且第二部分22的侧边220与显示面板厚度方向Z之间的夹角均大于0°，也就是说，光学传感器10周围的光信号均可以到达导光板20并被导光板20所接收利用，进而有效提升光学传感器10所接收的光信号的信号量。
在本申请的又一个实施例中，显示面板包括多个光学传感器10及多个导光板20，并且，沿显示面板的厚度方向Z，该些导光板20中的至少一个导光板20同时覆盖至少两个光学传感器10，该些导光板20的至少一个导光板20与光学传感器10一一对应设置。
图14为本申请实施例提供的另一种显示面板的剖面示意图。
在本申请的一个实施例中，如图14所示，非显示区BB包括至少一个光学传感器10及至少一个导光板20，并且设置在非显示区BB的导光板20中，靠近显示区AA的侧边与显示面板的厚度方向平行。也就是说，在工艺误差范围内，设置在非显示区BB的导光板20的侧边中，靠近显示区AA的侧边与显示面板厚度方向Z之间的夹角基本为0°。例如，如图14所示，非显示区BB中设置的导光板20的右侧边为靠近显示区AA的侧边，该侧边与显示面板的厚度方向Z基本平行。
则显示面板所发射的用于进行发光显示的光线到达非显示区BB时，基本不会在导光板20内全反射后出射至光学传感器10，避免了显示区AA中发光显示的光线对非显示区BB光学特征识别准确度的影响。
图15为本申请实施例提供的又一种显示面板的剖面示意图。
在本申请的一个实施例中，如图15所示，光学传感器10为薄膜晶体管器件，则光学传感器10包括有源层11、栅极12、源极13及漏极14，其中，有源层11可以根据接收到的光信号量的多少产生不同的载流子浓度，进而使得光学传感器10产生不同的电信号，实现光学特征识别。有源层11具体可以为非晶硅薄膜、多晶硅薄膜、金属氧化物半导体层中的至少一者。
在本实施例的一种实现方式中，其中，作为光学传感器10的薄膜晶体管器件的栅极12位于光学传感器10远离导光板20的一侧。也就是说，作为光学传感器10的薄膜晶体管器件的栅极12位于有源层接收光信号的一侧，则该栅极12会对光信号进行遮挡，影响光学传感器10接收的光信号量。在该实现方式中，采用本申请的发明构思，即在光学传感器10的下方设置上述任意一个实施例提供的导光板20，可以明显增加光学传感器10结构的光信号量。
进一步地，作为光学传感器10的薄膜晶体管器件可以与发光子像素30中的薄膜晶体管器件301的至少部分结构同层制备，其中发光子像素30中的薄膜晶体管器件301可以为发光子像素30中的发光器件302提供发光信号。如图15所示，作为光学传感器10的薄膜晶体管器件的栅极12可以与发光子像素30中的薄膜晶体管器件301的栅极32同层设置，作为光学传感器10的薄膜晶体管器件的源极13、漏极14可以与发光子像素30中的薄膜晶体管器件301的源极33、漏极34同层设置。
作为光学传感器10的薄膜晶体管器件的有源层11可以与发光子像素30中的薄 膜晶体管器件301的有源层31同层设置或者不同层设置。且在本申请实施例中，作为光学传感器10的薄膜晶体管器件的栅极12可以与其有源层11接触设置，即两者之间不设置绝缘层。
在本申请的另一个实施例中，光学传感器10也可以为有机感光器件、光电二极管器件中的至少一者。
本申请还提供一种显示装置，图16为本申请实施例提供的一种显示装置的示意图，在本申请的一个实施例中，如图16所示，显示装置包括本申请任意实施例提供的显示面板001。其中，显示面板001的具体结构已经在上述实施例中进行了详细说明，此处不再赘述。当然，图16所示的显示装置仅仅为示意说明，例如可以是手机、平板计算机、笔记本电脑、电纸书、电视机、智能手表等任何具有显示功能的显示装置。所述的显示面板。
以上所述，仅为本申请的具体实施方式，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。本申请的保护范围应以所述权利要求的保护范围为准。

Claims (17)

  1. 一种集成光学传感器的模组，其特征在于，包括：
    至少一个光学传感器，所述光学传感器接收来自所述模组第一侧的光信号；
    至少一个导光板，所述导光板与所述光学传感器沿所述模组的厚度方向排布，且所述导光板设置在所述光学传感器远离所述第一侧的一侧；
    其中，所述导光板包括第一部分和第二部分；沿所述模组的厚度方向，所述第一部分与所述光学传感器至少部分交叠，且所述第二部分与所述光学传感器无交叠；
    所述第一部分远离所述光学传感器的表面为第一凸起结构，所述第二部分的至少部分侧边与所述模组厚度方向之间的夹角大于0°。
  2. 根据权利要求1所述的模组，其特征在于，所述第一部分靠近所述光学传感器的一侧包括至少两个第二凸起结构。
  3. 根据权利要求1所述的模组，其特征在于，所述模组包括多个光学传感器；沿所述模组的厚度方向，所述导光板覆盖至少两个所述光学传感器；
    所述导光板还包括第三部分，沿所述模组的厚度方向，所述第三部分覆盖所述至少两个所述光学传感器之间的区域；
    其中，沿所述模组的厚度方向，所述第一凸起结构与所述第三部分无交叠。
  4. 根据权利要求1所述的模组，其特征在于，所述模组包括多个光学传感器及多个所述导光板，所述光学传感器与所述导光板一一对应设置。
  5. 根据权利要求4所述的模组，其特征在于，在对应设置的所述光学传感器与所述导光板中，沿所述模组的厚度方向，所述第二部分的投影围绕所述光学传感器的投影；
    所述第二部分的侧边与所述模组厚度方向之间的夹角均大于0°。
  6. 根据权利要求1所述的模组，其特征在于，所述光学传感器为薄膜晶体管器件，且所述薄膜晶体管器件的栅极位于所述光学传感器远离所述导光板的一侧。
  7. 根据权利要求1所述的模组，其特征在于，所述光学传感器为有机感光器件、光电二极管器件中的至少一者。
  8. 一种显示面板，其特征在于，包括显示区和非显示区，所述非显示区围绕所述显示区；所述显示区与所述非显示区中的至少一者包括：
    至少一个光学传感器，所述光学传感器接收来自所述显示面板第一侧的光信号；
    至少一个导光板，所述导光板与所述光学传感器沿所述显示面板的厚度方向排布，且所述导光板设置在所述光学传感器远离所述第一侧的一侧；
    其中，所述导光板包括第一部分和第二部分；沿所述显示面板的厚度方向，所述第一部分与所述光学传感器至少部分交叠，且所述第二部分与所述光学传感器无交叠；
    所述第一部分远离所述光学传感器的表面为第一凸起结构，所述第二部分的至少部分侧边与所述显示面板厚度方向之间的夹角大于0°。
  9. 根据权利要求8所述的显示面板，其特征在于，所述第一部分靠近所述光学传感器的一侧包括至少两个第二凸起结构。
  10. 根据权利要求8所述的显示面板，其特征在于，所述非显示区包括多个所述 光学传感器；
    沿所述显示面板的厚度方向，所述导光板覆盖位于所述显示区相对两侧的至少两个所述光学传感器；
    所述导光板还包括第三部分，所述第三部分的至少部分位于所述显示区；
    其中，沿所述显示面板的厚度方向，所述第一凸起结构与位于所述显示区的所述第三部分无交叠。
  11. 根据权利要求8所述的显示面板，其特征在于，所述显示面板包括多个光学传感器及多个所述导光板，所述光学传感器与所述导光板一一对应设置。
  12. 根据权利要求11所述的显示面板，其特征在于，在对应设置的所述光学传感器与所述导光板中，沿所述显示面板的厚度方向，所述第二部分的投影围绕所述光学传感器的投影；
    所述第二部分的侧边与所述显示面板厚度方向之间的夹角均大于0°。
  13. 根据权利要求8所述的显示面板，其特征在于，所述非显示区包括至少一个所述光学传感器及至少一个所述导光板；
    设置在所述非显示的所述导光板中，靠近所述显示区的侧边与所述显示面板的厚度方向平行。
  14. 根据权利要求8所述的显示面板，其特征在于，所述显示区包括所述光学传感器，位于所述显示区的所述光学传感器用于进行生物特征识别。
  15. 根据权利要求8所述的显示面板，其特征在于，所述光学传感器为薄膜晶体管器件，且所述薄膜晶体管器件的栅极位于有源层远离所述导光板的一侧。
  16. 根据权利要求8所述的显示面板，其特征在于，所述光学传感器为有机感光器件、光电二极管器件中的至少一者。
  17. 一种显示装置，其特征在于，包括如权利要求8-16任意一项所述的显示面板。
PCT/CN2022/113332 2021-10-28 2022-08-18 集成光学传感器的模组、显示面板、显示装置 WO2023071445A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US18/262,639 US20240304024A1 (en) 2021-10-28 2022-08-18 Module Integrated with Optical Sensor, Display Panel, and Display Apparatus
EP22885345.3A EP4261795A4 (en) 2021-10-28 2022-08-18 MODULE INTEGRATED WITH OPTICAL SENSOR, DISPLAY SCREEN AND DISPLAY DEVICE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202111264791.5A CN115019353B (zh) 2021-10-28 2021-10-28 集成光学传感器的模组、显示面板、显示装置
CN202111264791.5 2021-10-28

Publications (2)

Publication Number Publication Date
WO2023071445A1 WO2023071445A1 (zh) 2023-05-04
WO2023071445A9 true WO2023071445A9 (zh) 2023-07-13

Family

ID=83065168

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/113332 WO2023071445A1 (zh) 2021-10-28 2022-08-18 集成光学传感器的模组、显示面板、显示装置

Country Status (4)

Country Link
US (1) US20240304024A1 (zh)
EP (1) EP4261795A4 (zh)
CN (1) CN115019353B (zh)
WO (1) WO2023071445A1 (zh)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101620025A (zh) * 2009-05-05 2010-01-06 华映光电股份有限公司 显示器光学检测装置及其检测方法
CN102644890B (zh) * 2012-04-01 2013-11-20 深圳市华星光电技术有限公司 窄边框背光模组
US9140930B2 (en) * 2012-04-01 2015-09-22 Shenzhen China Star Optoelectronics Technology Co., Ltd. Slim frame backlight module
JP6355066B2 (ja) * 2013-08-29 2018-07-11 株式会社リコー センサ装置及び画像形成装置
CN106951816A (zh) * 2016-01-07 2017-07-14 上海箩箕技术有限公司 光学指纹传感器模组
CN205880271U (zh) * 2016-07-25 2017-01-11 深圳Tcl新技术有限公司 导光板及背光模组
EP3440594A4 (en) * 2017-01-04 2019-09-25 Shenzhen Goodix Technology Co., Ltd. ENHANCING OPTICAL DETECTION PERFORMANCE OF OPTICAL SENSOR MODULE SUB-SCREEN FOR DIGITAL FOOTPRINT DETECTION ON SCREEN
US10529759B2 (en) * 2017-09-11 2020-01-07 Pixart Imaging Inc. Optical sensor package module and manufacturing method thereof
CN108258017B (zh) * 2018-01-02 2021-05-14 上海天马微电子有限公司 显示面板和显示装置
CN109037296B (zh) * 2018-08-07 2021-02-05 武汉天马微电子有限公司 一种显示装置及电子设备
CN109618025B (zh) * 2018-11-20 2021-01-12 维沃移动通信有限公司 一种电子设备
CN109447046B (zh) * 2018-12-27 2021-07-23 厦门天马微电子有限公司 显示面板和显示装置
CN110515231B (zh) * 2019-08-30 2021-11-23 厦门天马微电子有限公司 一种显示装置
CN113227889B (zh) * 2019-09-04 2023-11-03 京东方科技集团股份有限公司 纹路识别装置及显示装置
CN213210660U (zh) * 2020-04-15 2021-05-14 深圳阜时科技有限公司 背光模组、被动式发光的显示装置、屏下生物特征检测系统和电子设备
CN111965897B (zh) * 2020-08-26 2022-07-12 厦门天马微电子有限公司 一种背光模组和显示装置
CN112485947B (zh) * 2020-12-09 2022-08-16 武汉天马微电子有限公司 显示模组及显示装置
CN112882288B (zh) * 2021-03-12 2022-09-09 厦门天马微电子有限公司 一种显示装置
CN113301190B (zh) * 2021-04-16 2022-08-05 荣耀终端有限公司 压力传感器和电子设备
CN113296314B (zh) * 2021-06-01 2022-07-12 厦门天马微电子有限公司 显示模组和显示装置

Also Published As

Publication number Publication date
WO2023071445A1 (zh) 2023-05-04
CN115019353A (zh) 2022-09-06
US20240304024A1 (en) 2024-09-12
CN115019353B (zh) 2023-05-09
EP4261795A4 (en) 2024-07-24
EP4261795A1 (en) 2023-10-18

Similar Documents

Publication Publication Date Title
US11003886B2 (en) Display apparatus including a fingerprint identification device
EP3584842B1 (en) Display screen, display device and mobile terminal
CN112001337B (zh) 一种指纹识别基板及显示装置
US10592722B2 (en) Photosensitive unit, photosensitive module and display device
WO2018145461A1 (zh) 显示装置
US12063838B2 (en) Display device
US11644914B2 (en) Display panel and display device
CN113994253B (zh) 显示装置及其制造方法
WO2019148798A1 (en) Pattern identification device and display apparatus
WO2021249178A1 (zh) 显示面板和显示装置
WO2021012117A1 (zh) 屏下光学指纹识别装置及系统、扩散膜和液晶显示屏
US20230181067A1 (en) In-cell optical biometrics sensor
US20200184183A1 (en) Liquid crystal display device having fingerprint sensor
WO2021143036A1 (zh) 指纹感测模块
CN114740994B (zh) 显示屏和显示装置
US11769344B2 (en) Pattern identification device and display apparatus
US11740503B2 (en) Display screen and electronic device
WO2023071445A9 (zh) 集成光学传感器的模组、显示面板、显示装置
WO2022174448A1 (zh) 显示基板及显示装置
WO2021007971A1 (zh) 一种识别模组、显示面板
WO2020124775A1 (zh) Amoled柔性显示装置
WO2023197118A1 (zh) 显示基板及显示装置
US20240365638A1 (en) Display device
TWI726506B (zh) 感測元件基板
CN118430029A (zh) 一种指纹识别显示面板和显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22885345

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022885345

Country of ref document: EP

Effective date: 20230712

WWE Wipo information: entry into national phase

Ref document number: 18262639

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE