WO2022174448A1 - 显示基板及显示装置 - Google Patents

显示基板及显示装置 Download PDF

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Publication number
WO2022174448A1
WO2022174448A1 PCT/CN2021/077249 CN2021077249W WO2022174448A1 WO 2022174448 A1 WO2022174448 A1 WO 2022174448A1 CN 2021077249 W CN2021077249 W CN 2021077249W WO 2022174448 A1 WO2022174448 A1 WO 2022174448A1
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WO
WIPO (PCT)
Prior art keywords
base substrate
light
substrate
display substrate
opening
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PCT/CN2021/077249
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English (en)
French (fr)
Inventor
李重寰
Original Assignee
京东方科技集团股份有限公司
北京京东方传感技术有限公司
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Application filed by 京东方科技集团股份有限公司, 北京京东方传感技术有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202180000258.XA priority Critical patent/CN115280382A/zh
Priority to US17/638,611 priority patent/US20230165120A1/en
Priority to PCT/CN2021/077249 priority patent/WO2022174448A1/zh
Publication of WO2022174448A1 publication Critical patent/WO2022174448A1/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/8791Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/126Shielding, e.g. light-blocking means over the TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65OLEDs integrated with inorganic image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/35Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/38Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/875Arrangements for extracting light from the devices
    • H10K59/879Arrangements for extracting light from the devices comprising refractive means, e.g. lenses

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a display substrate and a display device.
  • Embodiments of the present disclosure provide a display substrate and a display device, and the specific solutions are as follows:
  • a display substrate provided by an embodiment of the present disclosure includes:
  • a plurality of photosensitive devices are located between the layer where the plurality of light-emitting devices are located and the base substrate; the orthographic projection of each of the photosensitive devices on the base substrate is located adjacent to the light-emitting device on the substrate At the gap of the orthographic projection on the substrate;
  • the black matrix has a plurality of first openings and a plurality of second openings; wherein the plurality of The color resists are correspondingly arranged in the plurality of first openings and cover the plurality of light-emitting devices; the orthographic projection of the plurality of second openings on the base substrate is the same as that of the plurality of photosensitive devices in the plurality of light-emitting devices.
  • the orthographic projections on the base substrate overlap each other.
  • At least one of the second openings is disposed corresponding to one of the photosensitive devices.
  • the orthographic projection of the second opening on the base substrate is located in the corresponding orthographic projection of the photosensitive device on the base substrate.
  • the shape of the second opening is substantially a circle or a regular polygon.
  • the aperture when the second opening is circular or the diagonal when the second opening is a regular polygon is 2 ⁇ m-20 ⁇ m.
  • the thickness of the black matrix is 1 ⁇ m-5 ⁇ m.
  • the display substrate provided by the embodiment of the present disclosure, further comprising: a plurality of convex lenses located on a side of the black matrix away from the base substrate;
  • the convex lens is arranged in a one-to-one correspondence with the second opening, the convex surface of the convex lens faces away from the photosensitive device, and the convex lens is configured to collect the light within the preset angle range reflected by the finger through the second opening to the photosensitive device.
  • the orthographic projection of the convex lens on the base substrate completely covers the orthographic projection of the corresponding second opening on the base substrate.
  • the orthographic projection center of the convex lens on the base substrate coincides with the orthographic projection center of the corresponding second opening on the base substrate.
  • the convex lens is specifically configured to condense light rays of different angles within the preset angle range to at least two intersection points, wherein one of the intersection points is at the
  • the orthographic projection on the base substrate coincides with the center of the orthographic projection of the convex lens on the base substrate, and the orthographic projections of the remaining intersection points on the base substrate are relative to the convex lens on the base substrate
  • the center of the orthographic projection is offset by a specific distance.
  • the refractive index of the convex lens is 1.6-1.8
  • the curvature radius of the convex lens is 5 ⁇ m-20 ⁇ m.
  • the display substrate further comprises: a transparent adhesive layer sequentially located on the side of the layer where the plurality of convex lenses are located away from the base substrate, and the transparent adhesive layer is refracting ratio is less than the refractive index of the convex lens.
  • the refractive index of the transparent adhesive layer is 1.35-1.45.
  • the above-mentioned display substrate provided in the embodiment of the present disclosure further includes: a plurality of filter structures, each of the second openings is disposed in one of the filter structures, and the plurality of filter structures are Configured to filter out infrared light.
  • the material of the filter structure is green resin.
  • a surface of the filter structure away from the base substrate is flush with a surface of the black matrix away from the base substrate.
  • the distance from the surface of the filter structure away from the base substrate to the base substrate is smaller than or greater than the distance from the black matrix away from the substrate.
  • the above-mentioned display substrate provided by the embodiment of the present disclosure further includes: a light shielding layer located on the side of the black matrix facing the base substrate, the light shielding layer having a plurality of third openings;
  • the plurality of third openings are in one-to-one correspondence with the plurality of second openings, and the orthographic projections on the base substrate at least partially overlap.
  • the orthographic projection of the third opening on the base substrate is located in the corresponding orthographic projection of the second opening on the base substrate, And the center of the orthographic projection of the third opening on the base substrate coincides with the center of the orthographic projection of the corresponding second opening on the base substrate.
  • the shape of the third opening is substantially a circle or a regular polygon.
  • the aperture when the third opening is circular or the diagonal when the third opening is a regular polygon is 2 ⁇ m-10 ⁇ m.
  • the thickness of the light shielding layer is -2 ⁇ m.
  • the material of the light shielding layer is metal
  • the thickness of the light shielding layer is metal
  • the material of the light shielding layer is the same as the material of the black matrix, and the thickness of the light shielding layer is 0.5 ⁇ m-2 ⁇ m.
  • the above-mentioned display substrate provided by the embodiment of the present disclosure, it further comprises: an encapsulation layer located between the layer where the plurality of light-emitting devices are located and the layer where the multiple color resistors are located;
  • the light shielding layer is located between the first electrode of the light emitting device and the encapsulation layer.
  • the light shielding layer and the second electrode of the light emitting device are provided in the same layer.
  • an embodiment of the present disclosure further provides a display device including the above-mentioned display substrate.
  • FIG. 1 is a schematic structural diagram of a display substrate provided by an embodiment of the present disclosure
  • Fig. 2 is a kind of sectional structure schematic diagram along line I-II in Fig. 1;
  • Fig. 3 is the structural representation of Z1 area in Fig . 2;
  • FIG. 4 is a schematic diagram of light convergence provided by an embodiment of the present disclosure.
  • Fig. 5 is another kind of cross-sectional structure schematic diagram along line I-II in Fig. 1;
  • Fig. 6 is the structural representation of Z 2 region in Fig. 5;
  • Fig. 7 is another kind of sectional structure schematic diagram along line I-II in Fig. 1;
  • FIG. 8 is a schematic structural diagram of the Z 3 region in FIG. 7 .
  • the color film is directly made on the encapsulation layer (Color Film On Encapsulation, COE) scheme, the color film can be used to replace the polarizer, so that the OLED display has Higher integration, thinner and lighter features, and a lot of production cost savings.
  • OLED Organic Light-Emitting Diode
  • COE Color Film On Encapsulation
  • the off-screen fingerprint recognition technology can integrate the fingerprint acquisition module on the back of the display (ie, the opposite side of the display surface) without occupying the display area of the display. Therefore, off-screen fingerprint recognition has become an important implementation of fingerprint recognition.
  • the under-screen fingerprint recognition technology is applied to the OLED display screen based on COE technology, since the color film includes color resistance and black matrix (BM), the existence of the black matrix greatly reduces the light transmittance of the OLED display screen, making the screen The lower fingerprint acquisition module cannot perceive clear fingerprint signals.
  • BM black matrix
  • an embodiment of the present disclosure provides a display substrate, as shown in FIG. 1 to FIG. 3 , which may include:
  • a plurality of photosensitive devices 103 are located between the layers where the plurality of light-emitting devices 102 are located and the base substrate 101; the orthographic projection of each photosensitive device 103 on the base substrate 101 is located in the orthographic projection of the adjacent light-emitting device 102 on the base substrate 101. gap;
  • the color resistors 104 are correspondingly disposed in the plurality of first openings O 1 and cover the plurality of light emitting devices 102 ; the orthographic projections of the plurality of second openings O 2 on the base substrate 101 and the plurality of photosensitive devices 103 on the base substrate
  • the orthographic projections on 101 overlap each other.
  • the transmittance of the light reflected by the fingerprint is effectively improved; and
  • the propagation path of the light reflected by the fingerprint is greatly shortened, and the light energy loss is reduced. Therefore, the above-mentioned technical solutions provided by the present disclosure can effectively improve the clarity of fingerprint identification.
  • the photosensitive device 103 is located at the gap of the light emitting device 102, the existence of the photosensitive device 103 will not affect the light emission of the light emitting device 102, so that the display effect can be guaranteed.
  • the light-emitting device 102 may include a first electrode 1021, a light-emitting functional layer 1022 and a second electrode 1023; wherein the light-emitting functional layer 1022 includes, but is not limited to, a hole injection layer, A hole transport layer, an electron blocking layer, a light emitting material layer, a hole blocking layer, an electron transport layer, and an electron injection layer.
  • the light emitting functional layer 1022 may be a red light emitting functional layer EL R , a green light emitting functional layer EL G and a blue light emitting slave functional layer EL B .
  • the color resists 104 may include red color resists CF R , green color resists CF G , and blue color resists CF B .
  • the photosensitive device 103 may include a bottom electrode 1031, a top electrode 1032, and a PIN structure located therebetween, and the PIN structure may specifically include a P-type semiconductor layer, an intrinsic semiconductor layer I, and an N-type semiconductor layer; wherein, P The N-type semiconductor layer is located between the bottom electrode 1031 and the intrinsic semiconductor layer I, and the N-type semiconductor layer is located between the intrinsic semiconductor layer I and the top electrode 1032; or, the N-type semiconductor layer is located between the bottom electrode 1031 and the intrinsic semiconductor layer I During this time, the P-type semiconductor layer is located between the intrinsic semiconductor layer I and the top electrode 1032.
  • the color resistors 104 are located directly above the light-emitting devices 102
  • the black matrix 105 is located directly above the gaps between the light-emitting devices 102 .
  • FIG. 1 only schematically shows an arrangement of the color resistors 104 The manner (equivalent to the arrangement manner of the light-emitting devices 102 ) may also be other arrangement manners known to those skilled in the art during specific implementation, which is not limited herein.
  • FIG. 1 only shows that the light-emitting device 102 has the photosensitive device 103 at the column gap (corresponding to the position of the second opening O 2 ).
  • the photosensitive device 103 may also be disposed at the column gap of the light-emitting device 102 .
  • At least one second opening O 2 may be set to correspond to one photosensitive device 103 , that is, one or more photosensitive devices 103 may be set above one photosensitive device 103 .
  • the second opening O 2 so that the light transmittance of each photosensitive device 103 is increased due to the second opening O 2 , thereby improving the fingerprint recognition effect.
  • the orthographic projection of the second opening O 2 on the base substrate 101 is located corresponding to the orthographic projection of the photosensitive device 103 on the base substrate 101 Inside.
  • the photosensitive device 103 can convert the received light into electrical signals to realize the function of fingerprint recognition.
  • the light transmitted through the second opening O 2 can all be irradiated onto the photosensitive device 103 , so that the intensity of the light received by the photosensitive device 103 can be improved, thereby providing a more obvious electrical signal and ensuring the clarity of the fingerprint.
  • the shape of the second opening O 2 can be set to be roughly circular or positive.
  • the aperture d 1 when the second opening O 2 is circular or the diagonal when the second opening O 2 is a regular polygon is 2 ⁇ m-20 ⁇ m.
  • the shape of the second opening O 2 may also be a square or other shapes, as long as it can function to transmit light with a small angle.
  • the thickness h 1 of the black matrix 105 may be 1 ⁇ m-5 ⁇ m.
  • the black matrix 105 can make the transmittance of the light in the range of 400nm-850nm to be less than 0.1%, that is, the light in the range of 400nm-850nm can be effectively intercepted, so as to avoid the occurrence of the outgoing light of the adjacent color resists 104 crosstalk.
  • the display substrate may further include: a plurality of convex lenses 106 located on the side of the black matrix 105 away from the base substrate 101 ;
  • the two openings O 2 are arranged in a one-to-one correspondence, the convex surface of the convex lens 106 faces away from the photosensitive device 103, and the convex lens 106 is configured to pass the light rays L 1 -L 2 within the range of the preset angle ⁇ (eg 10°) reflected by the finger through the second opening O 2 converges to the photosensitive device 103 , thereby further ensuring that only approximately collimated small-angle light rays are irradiated to the photosensitive device 103 , thereby improving the accuracy of fingerprint identification.
  • eg 10°
  • the orthographic projection of the convex lens 106 on the base substrate 101 completely covers the corresponding second opening O 2 on the base substrate 101 orthographic projection, to ensure that the light rays L 1 -L 2 within the range of the preset angle ⁇ (eg, 10°) can be converged by the convex lens 106 and then irradiated to the photosensitive device 103 through the second opening O 2 .
  • the preset angle ⁇ eg, 10°
  • the orthographic projection center of the convex lens 106 on the base substrate 101 coincides with the orthographic projection center of the corresponding second opening O 2 on the base substrate 101 .
  • the second opening O 2 with a smaller size can also completely transmit the converged light of the convex lens 1061 to On the photosensitive device 103, on the basis of increasing the intensity of the reflected light from the fingerprint received by the photosensitive device 103, the collimation effect of the reflected light on the fingerprint is effectively guaranteed.
  • the convex lens 106 can specifically convert the light rays L 1 of different angles (eg, different from the vertical direction) within the range of the preset angle ⁇ (eg, 10°).
  • the included angle is 0°
  • L 3 for example, the included angle with the vertical direction is 3°
  • L 4 for example, the included angle with the vertical direction is 5°
  • L 2 for example, the included angle with the vertical direction is 5°
  • the orthographic center e of the convex lens 106 on the base substrate 101 coincides, and the orthographic projections of the remaining intersection points (for example, the three intersection points b, c, and d) on the base substrate 101 are offset by a certain distance from the orthographic projection center e of the convex lens 106 on the base substrate 101.
  • the specific distance is related to the angle of the light and the refractive index of the convex lens 106 , and the larger the angle of the light is, the greater the distance from the intersection point converged by the convex lens 106 to the orthographic center e of the convex lens 106 .
  • the convex lens 106 converts the light rays L 1 (for example, the included angle with the vertical direction is 0°) and L 3 (for example, with the vertical direction) at different angles.
  • the included angle is 3°
  • L 4 for example, the included angle with the vertical direction is 5°
  • L 2 for example, the included angle with the vertical direction is 10°
  • a light shielding layer 110 can be added to selectively transmit light at different angles.
  • the refractive index of the convex lens 106 may be 1.6-1.8, and the curvature radius r of the convex lens 106 may be 5 ⁇ m-20 ⁇ m, as shown in FIG. 2 .
  • the convex lens 106 with a larger refractive index has a better effect on the convergence of light, and the radius of curvature within the above range can meet the requirements of different products. near the focus.
  • the display substrate may further include: a transparent adhesive layer 107 located in sequence on the side of the layer where the plurality of convex lenses 106 are located away from the base substrate 101 .
  • the refractive index of the transparent adhesive layer 107 is smaller than that of the convex lens 106 to match the refractive index of the convex lens 106 .
  • the transparent adhesive layer 107 is also used for bonding and fixing the protective cover 108 with the color resist 104 , the black matrix 105 and the convex lens 106 .
  • the refractive index of the transparent adhesive layer 107 may be 1.35-1.45.
  • the transparent adhesive layer 107 may be a clear optical adhesive (OCA).
  • the display substrate may further include: a plurality of filter structures 109 , one filter structure 109 is disposed in each second opening O 2 , a plurality of filter structures 109 are configured to filter out infrared light.
  • the photosensitive device 103 may also sense ambient light incident through the finger.
  • the ambient light may interfere with the fingerprint recognition of the photosensitive device 103 .
  • the ambient light can penetrate the finger and excite the biological tissue in the finger to emit pigmented light, which may interfere with fingerprint recognition.
  • the pigment light mainly includes light with a wavelength above 600 nm. Therefore, the filter structure 109 located at the second opening O 2 can effectively avoid the influence of ambient light by intercepting the infrared light, thereby achieving the effect of accurate fingerprint identification in an outdoor sunlight environment.
  • the material of the filter structure 109 may be green resin.
  • the green resin is a material of green color resist CF G , which can effectively intercept the light of 580nm-850nm.
  • the filter structure 109 can also be made of other materials than green resin, as long as the function of cutting off infrared light can be achieved.
  • the filter structure 109 The surface away from the base substrate 101 is flush with the surface of the black matrix 105 away from the base substrate 101 , that is, the filter structure 109 just fills the second opening O 2 , and the bottom of the convex lens 106 is exactly the same as the upper surface of the black matrix 105 . face settings.
  • the distance from the surface of the filter structure 109 away from the base substrate 101 to the base substrate 101 may be smaller or greater than the distance from the surface of the black matrix 105 away from the base substrate 101 to the base substrate 101, that is, the filter The light structure 109 has not yet filled or overflowed the second opening O 2 . Accordingly, the bottom of the convex lens 106 is embedded in the second opening O 2 or higher than the upper surface of the black matrix 105 .
  • the above-mentioned display substrate provided by the embodiments of the present disclosure can use approximately collimated small-angle light rays for fingerprint identification, but during the fingerprint identification process, some large-angle crosstalk light rays L 5 will inevitably appear.
  • the crosstalk light L5 can be blocked by the black matrix 105, as shown in FIG. 2; but in some embodiments, the crosstalk light L5 cannot be effectively blocked by the black matrix 105, as shown in FIG. 5 .
  • a light shielding layer 110 may also be provided on the side of the black matrix 105 facing the base substrate 101 , the light shielding layer 110 has a plurality of third openings O 3 ; the plurality of third openings O 3 and the plurality of second openings O 2 correspond one-to-one and the orthographic projections on the base substrate 101 at least partially overlap. It can be seen from FIG.
  • the light shielding layer 110 can play a role in intercepting the crosstalk light L 5 , and since the third opening O 3 and the second opening O 2 are correspondingly overlapped, the small-angle light rays L 1 , L 3 and L can be blocked. 4 plays a role in collimation, so it is beneficial to improve the effect of fingerprint recognition.
  • an orthographic projection of the third opening O 3 on the base substrate 101 may be set. is located in the orthographic projection of the corresponding second opening O 2 on the base substrate 101 , and the center of the orthographic projection of the third opening O 3 on the base substrate 101 corresponds to the orthographic projection of the second opening O 2 on the base substrate 101 Centers coincide.
  • the shape of the third opening O 3 may be approximately a circular regular polygon (for example, a regular hexagon, etc.), and the third opening O 3 is in the shape of a circular regular polygon.
  • the aperture is circular, or the diagonal when the third opening O 3 is a regular polygon may be 2 ⁇ m-10 ⁇ m.
  • the shape of the third opening O 3 may also be a square or other shapes, as long as it can perform the function of collimating light with a small angle.
  • the thickness h 2 of the light shielding layer 110 is -2 ⁇ m.
  • the light shielding layer 110 can make the transmittance of the crosstalk light L 3 in the range of 400nm-850nm be less than 0.1%, that is, the crosstalk light L 3 in the range of 400nm-850nm can be effectively intercepted, so as to avoid the crosstalk light L 3 Impact on fingerprint recognition.
  • the light-shielding layer 110 may be made of light-absorbing or low-reflectivity materials such as black matrix (BM), molybdenum metal (Mu), etc., so as to reduce the degree of reflection of the large-angle crosstalk light L 3 on the light-shielding layer 110 , to improve the accuracy of fingerprint recognition.
  • BM black matrix
  • Mo molybdenum metal
  • the thickness of the light shielding layer 110 may be set to
  • the thickness of the light shielding layer 110 may be set to 0.5 ⁇ m-2 ⁇ m .
  • the display substrate may further include: an encapsulation layer 111 located between the layers where the plurality of light emitting devices 102 are located and the layers where the multiple color resists 104 are located;
  • the layer 110 may be located between the first electrode 1021 of the light emitting device 102 and the encapsulation layer 111 .
  • the light shielding layer 110 may also be provided in the same layer as the second electrode 1023 of the light emitting device 102.
  • the second electrode 1023 may be an anode
  • the first electrode 1021 may be a cathode.
  • “same layer” refers to a layer structure formed by using the same film forming process to form a film layer for making a specific pattern, and then using the same mask to form a layer structure by one patterning process. That is, one patterning process corresponds to one mask (mask, also called photomask).
  • a patterning process may include multiple exposure, development or etching processes, and the specific patterns in the formed layer structure may be continuous or discontinuous, and these specific patterns may be at the same height or Have the same thickness, possibly also at different heights or have different thicknesses.
  • the light-shielding layer 110 and the second electrode 1023 of the light-emitting device 102 are arranged in the same layer, the light-shielding layer 110 can be avoided to be provided separately, thereby reducing the number of film layers, facilitating the realization of light and thin design, and saving costs.
  • the above-mentioned display substrate may further include: a heat dissipation film 112 , a buffer layer 113 , a gate insulating layer 114 , an interlayer dielectric layer 115 , a flat layer 116, a bias line 117, a transfer electrode 118, a first transistor TFT 1 and a second transistor TFT 2 , and the like.
  • a heat dissipation film 112 it may further include: a heat dissipation film 112 , a buffer layer 113 , a gate insulating layer 114 , an interlayer dielectric layer 115 , a flat layer 116, a bias line 117, a transfer electrode 118, a first transistor TFT 1 and a second transistor TFT 2 , and the like.
  • Other essential components of the display substrate should be understood by those of ordinary skill in the art, and will not be repeated here, nor should it be regarded as a limitation of the present invention.
  • the present disclosure further provides a display device including the above-mentioned display substrate provided by the embodiment of the present disclosure, and the display substrate may be an OLED display substrate. Since the principle of solving the problem of the display device is similar to the principle of solving the problem of the above-mentioned display substrate, the implementation of the display device may refer to the embodiment of the above-mentioned display substrate, and the repetition will not be repeated.
  • the above-mentioned display devices provided by the embodiments of the present disclosure may be: mobile phones, tablet computers, televisions, monitors, notebook computers, digital photo frames, navigators, smart watches, fitness wristbands, personal digital assistants, etc.
  • the display device provided by the embodiments of the present disclosure may further include, but is not limited to, a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply.

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  • Life Sciences & Earth Sciences (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示基板及包括其的显示装置。该显示基板包括:衬底基板(101);多个发光器件(102),位于衬底基板(101)之上;多个光敏器件(103),位于多个发光器件(102)所在层与衬底基板(101)之间;各光敏器件(103)在衬底基板(101)上的正投影位于相邻发光器件(102)在衬底基板(101)上正投影的间隙处;多个色阻(104)和黑矩阵(105);位于多个发光器件(102)所在层背离衬底基板(101)的一侧;黑矩阵(105)具有多个第一开口(O 1)和多个第二开口(O 2);其中,多个色阻(104)对应设置在多个第一开口(O 1)内,且覆盖多个发光器件(102);多个第二开口(O 2)在衬底基板(101)上的正投影与多个光敏器件(103)在衬底基板(101)上的正投影相互交叠。

Description

显示基板及显示装置 技术领域
本公开涉及显示技术领域,尤其涉及一种显示基板及显示装置。
背景技术
随着终端技术的不断发展,电子设备的应用越来越广泛。为保护用户的信息安全,指纹识别功能在电子设备上的使用越来越普遍,比如用于手机解锁、移动支付(如支付、转账)等。
发明内容
本公开实施例提供了一种显示基板及显示装置,具体方案如下:
一方面,本公开实施例提供的一种显示基板,包括:
衬底基板;
多个发光器件,位于所述衬底基板之上;
多个光敏器件,位于所述多个发光器件所在层与所述衬底基板之间;各所述光敏器件在所述衬底基板上的正投影位于相邻所述发光器件在所述衬底基板上正投影的间隙处;
多个色阻和黑矩阵;位于所述多个发光器件所在层背离所述衬底基板的一侧;所述黑矩阵具有多个第一开口和多个第二开口;其中,所述多个色阻对应设置在所述多个第一开口内,且覆盖所述多个发光器件;所述多个第二开口在所述衬底基板上的正投影与所述多个光敏器件在所述衬底基板上的正投影相互交叠。
可选地,在本公开实施例提供的上述显示基板中,至少一个所述第二开口与一个所述光敏器件对应设置。
可选地,在本公开实施例提供的上述显示基板中,所述第二开口在所述衬底基板上的正投影位于对应所述光敏器件在所述衬底基板上的正投影内。
可选地,在本公开实施例提供的上述显示基板中,所述第二开口的形状大致为圆形或正多边形。
可选地,在本公开实施例提供的上述显示基板中,所述第二开口呈圆形时的孔径或所述第二开口呈正多边形时的对角线为2μm-20μm。
可选地,在本公开实施例提供的上述显示基板中,在垂直于所述衬底基板的方向上,所述黑矩阵的厚度为1μm-5μm。
可选地,在本公开实施例提供的上述显示基板中,还包括:位于所述黑矩阵远离所述衬底基板一侧的多个凸透镜;
所述凸透镜与所述第二开口一一对应设置,所述凸透镜的凸面背离所述光敏器件,且所述凸透镜被配置为将手指反射的预设角度范围内的光线经所述第二开口汇聚至所述光敏器件。
可选地,在本公开实施例提供的上述显示基板中,所述凸透镜在所述衬底基板上的正投影完全覆盖对应所述第二开口在所述衬底基板上的正投影。
可选地,在本公开实施例提供的上述显示基板中,所述凸透镜在所述衬底基板上的正投影中心与对应所述第二开口在所述衬底基板上的正投影中心重合。
可选地,在本公开实施例提供的上述显示基板中,所述凸透镜具体被配置为将所述预设角度范围内不同角度的光线汇聚到至少两个交点,其中一个所述交点在所述衬底基板上的正投影与所述凸透镜在所述衬底基板上的正投影中心重合,其余所述交点在所述衬底基板上的正投影相对于所述凸透镜在所述衬底基板上的正投影中心偏移特定距离。
可选地,在本公开实施例提供的上述显示基板中,所述凸透镜的折射率为1.6-1.8,所述凸透镜的曲率半径为5μm-20μm。
可选地,在本公开实施例提供的上述显示基板中,还包括:依次位于所述多个凸透镜所在层背离所述衬底基板一侧的透明粘结层,所述透明粘结层的折射率小于所述凸透镜的折射率。
可选地,在本公开实施例提供的上述显示基板中,所述透明粘结层的折 射率为1.35-1.45。
可选地,在本公开实施例提供的上述显示基板中,还包括:多个滤光结构,每个所述第二开口内设置于一个所述滤光结构,所述多个滤光结构被配置为滤除红外光线。
可选地,在本公开实施例提供的上述显示基板中,所述滤光结构的材料为绿色树脂。
可选地,在本公开实施例提供的上述显示基板中,所述滤光结构远离所述衬底基板的表面与所述黑矩阵远离所述衬底基板的表面平齐。
可选地,在本公开实施例提供的上述显示基板中,所述滤光结构远离所述衬底基板的表面到所述衬底基板的距离,小于或大于所述黑矩阵远离所述衬底基板的表面到所述衬底基板的距离。
可选地,在本公开实施例提供的上述显示基板中,还包括:位于所述黑矩阵面向所述衬底基板一侧的遮光层,所述遮光层具有多个第三开口;
所述多个第三开口与所述多个第二开口一一对应且在所述衬底基板上的正投影至少部分重合。
可选地,在本公开实施例提供的上述显示基板中,所述第三开口在所述衬底基板上的正投影位于对应所述第二开口在所述衬底基板上的正投影内,且所述第三开口在所述衬底基板上的正投影中心与对应所述第二开口在所述衬底基板上的正投影中心重合。
可选地,在本公开实施例提供的上述显示基板中,所述第三开口的形状大致为圆形或正多边形。
可选地,在本公开实施例提供的上述显示基板中,所述第三开口呈圆形时的孔径或所述第三开口呈正多边形时的对角线为2μm-10μm。
可选地,在本公开实施例提供的上述显示基板中,在垂直于所述衬底基板的方向上,所述遮光层的厚度为
Figure PCTCN2021077249-appb-000001
-2μm。
可选地,在本公开实施例提供的上述显示基板中,所述遮光层的材料为金属,所述遮光层的厚度为
Figure PCTCN2021077249-appb-000002
可选地,在本公开实施例提供的上述显示基板中,所述遮光层的材料与所述黑矩阵的材料相同,所述遮光层的厚度为0.5μm-2μm。
可选地,在本公开实施例提供的上述显示基板中,还包括:位于所述多个发光器件所在层与所述多个色阻所在层之间的封装层;
所述遮光层位于所述发光器件的第一电极与所述封装层之间。
可选地,在本公开实施例提供的上述显示基板中,所述遮光层与所述发光器件的第二电极同层设置。
另一方面,本公开实施例还提供了一种显示装置,包括上述显示基板。
附图说明
图1为本公开实施例提供的显示基板的结构示意图;
图2为沿图1中I-II线的一种剖面结构示意图;
图3为图2中Z 1区域的结构示意图;
图4为本公开实施例提供的光线汇聚示意图;
图5为沿图1中I-II线的又一种剖面结构示意图;
图6为图5中Z 2区域的结构示意图;
图7为沿图1中I-II线的又一种剖面结构示意图;
图8为图7中Z 3区域的结构示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚,下面将结合本公开实施例的附图,对本公开实施例的技术方案进行清楚、完整地描述。需要注意的是,附图中各图形的尺寸和形状不反映真实比例,目的只是示意说明本公开内容。并且自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。显然,所描述的实施例是本公开的一部分实施例,而不是全部的实施例。基于所描述的本公开实施例,本领域普通技术人员在无需创造性劳动的前提下所获得的所有其它实施例,都属于本公开保护的范 围。
除非另作定义,此处使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开说明书以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性,而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同,而不排除其他元件或者物件。“内”、“外”、“上”、“下”等仅用于表示相对位置关系,当被描述对象的绝对位置改变后,则该相对位置关系也可能相应地改变。
在有机发光显示屏(Organic Light-Emitting Diode,OLED)中,将彩膜直接制作在封装层之上(Color Film On Encapsulation,COE)的方案,可利用彩膜取代偏光片,使得OLED显示屏具有更高集成度、更轻薄的特性,且节约了大量的生产成本。
屏下指纹识别技术可将指纹采集模块集成在显示屏背面(即显示面的相对侧),无需占用显示屏的显示区域,因此屏下指纹识别已成为指纹识别的一种重要实现方式。但是,将屏下指纹识别技术应用于基于COE技术的OLED显示屏时,由于彩膜包括色阻和黑矩阵(BM),黑矩阵的存在导致OLED显示屏的透光率大幅度降低,使得屏下指纹采集模块无法感知清晰的指纹信号。
为了至少解决相关技术中存在的上述技术问题,本公开实施例提供了一种显示基板,如图1至图3所示,可以包括:
衬底基板101;
多个发光器件102,位于衬底基板101之上;
多个光敏器件103,位于多个发光器件102所在层与衬底基板101之间;各光敏器件103在衬底基板101上的正投影位于相邻发光器件102在衬底基板101上正投影的间隙处;
多个色阻104和黑矩阵105;位于多个发光器件102所在层背离衬底基板101的一侧;黑矩阵105具有多个第一开口O 1和多个第二开口O 2;其中,多 个色阻104对应设置在多个第一开口O 1内,且覆盖多个发光器件102;多个第二开口O 2在衬底基板101上的正投影与多个光敏器件103在衬底基板101上的正投影相互交叠。
在本公开实施例提供的上述显示基板中,通过在黑矩阵105中设置与多个光敏器件103相互交叠的多个第二开口O 2,有效提高了指纹所反射光线的透过率;并且,通过将光敏器件103集成于显示基板中,相较于光敏器件103位于显示基板下方的相关方案,大大缩短了指纹所反射光线的传播路径,降低了光能损耗。因此,采用本公开提供的上述技术方案,可有效提高指纹识别的清晰度。另外,由于光敏器件103位于发光器件102的间隙处,因此光敏器件103的存在不会影响发光器件102的发光,从而可保证显示效果。
在一些实施例中,如图2和图3所示,发光器件102可以包括第一电极1021、发光功能层1022和第二电极1023;其中,发光功能层1022包括但不限于空穴注入层、空穴传输层、电子阻挡层、发光材料层、空穴阻挡层、电子传输层和电子注入层。具体地,发光功能层1022可以为红色发光功能层EL R、绿色发光功能层EL G和蓝色发光从功能层EL B。相应地,色阻104可以包括红色色阻CF R、绿色色阻CF G和蓝色色阻CF B。另外,光敏器件103可以包括底电极1031、顶电极1032、以及位于二者之间的PIN结构,该PIN结构具体可以包括P型半导体层、本征半导体层I和N型半导体层;其中,P型半导体层位于底电极1031与本征半导体层I之间,N型半导体层位于本征半导体层I与顶电极1032之间;或者,N型半导体层位于底电极1031与本征半导体层I之间,P型半导体层位于本征半导体层I与顶电极1032之间。
需要说明的是,在本公开中色阻104位于发光器件102的正上方,黑矩阵105位于发光器件102之间间隙的正上方,图1仅示意性给出了色阻104的一种排布方式(相当于发光器件102的排布方式),在具体实施时,还可以为本领域技术人员已知的其他排布方式,在此不做限定。另外,图1仅示出了发光器件102的列间隙处具有光敏器件103(对应第二开口O 2的位置),在一些实施例中,光敏器件103还可以设置在发光器件102的列间隙处。
可选地,在本公开实施例提供的上述显示基板中,如图3所示,可以设置至少一个第二开口O 2与一个光敏器件103对应,即一个光敏器件103上方可以设置一个或多个第二开口O 2,从而使得每个光敏器件103所在位置的透光率均因第二开口O 2而增大,进而提高指纹识别效果。
可选地,在本公开实施例提供的上述显示基板中,如图3所示,第二开口O 2在衬底基板101上的正投影位于对应光敏器件103在衬底基板101上的正投影内。光敏器件103可将所接收的光线转换成电信号来实现指纹识别的功能。通过设置第二开口O 2在衬底基板101上的正投影位于对应光敏器件103在衬底基板101上的正投影内,可以使得经第二开口O 2透射的光线均照射至光敏器件103上,从而可提高光敏器件103所接收光线的强度,进而提供较明显的电信号,保证了指纹的清晰度。
可选地,在本公开实施例提供的上述显示基板中,由于大角度光线会对指纹识别造成干扰,因此为了保证仅近似准直的小角度光线(例如图2所示θ范围内的光线L 1-L 2)透过第二开口O 2照射至光敏器件103,如图1和图3所示,结合不同分辨率的显示屏,可以设置第二开口O 2的形状大致为圆形或正多边形(例如正六边形等),第二开口O 2呈圆形时的孔径d 1或第二开口O 2呈正多边形时的对角线为2μm-20μm。
需要说明的是,显示屏的分辨率越大,黑矩阵105的线宽越小,相应地第二开口O 2的尺寸越小。另外,在一些实施例中,第二开口O 2的形状也可以为方形或其他形状,只要可以起到透射小角度光线的功能即可。
可选地,在本公开实施例提供的上述显示基板中,如图3所示,在垂直于衬底基板101的方向上,黑矩阵105的厚度h 1可以为1μm-5μm。在此厚度下,黑矩阵105可以使得400nm-850nm范围内的光线的透光率在0.1%以下,即可以有效拦截的400nm-850nm范围内的光线,从而避免相邻色阻104的出射光线发生串扰。
可选地,在本公开实施例提供的上述显示基板中,如图2和图3所示,还可以包括:位于黑矩阵105远离衬底基板101一侧的多个凸透镜106;凸透 镜106与第二开口O 2一一对应设置,凸透镜106的凸面背离光敏器件103,且凸透镜106被配置为将手指反射的预设角度θ(例如10°)范围内的光线L 1-L 2经第二开口O 2汇聚至光敏器件103,从而进一步保证仅近似准直的小角度光线照射至光敏器件103,由此提高指纹识别的准确性。
可选地,在本公开实施例提供的上述显示基板中,如图2和图3所示,凸透镜106在衬底基板101上的正投影完全覆盖对应第二开口O 2在衬底基板101上的正投影,以保证预设角度θ(例如10°)范围内的光线L 1-L 2均可凸透镜106汇聚后,透过第二开口O 2照射向光敏器件103。
可选地,在本公开实施例提供的上述显示基板中,凸透镜106在衬底基板101上的正投影中心与对应第二开口O 2在衬底基板101上的正投影中心重合。通过设置凸透镜106在衬底基板101上的正投影中心与其完全覆盖的第二开口O 2的正投影中心重合,使得较小尺寸的第二开口O 2也可以将凸透镜1061的汇聚光线完全透射至光敏器件103上,从而在提高光敏器件103接受到的指纹反射光强的基础上,有效保证了对指纹反射光的准直效果。
可选地,在本公开实施例提供的上述显示基板中,如图4所示,凸透镜106具体可以将预设角度θ(例如10°)范围内不同角度的光线L 1(例如与竖直方向的夹角为0°)、L 3(例如与竖直方向的夹角为3°)、L 4(例如与竖直方向的夹角为5°)和L 2(例如与竖直方向的夹角为10°)汇聚到至少两个交点(例如a、b、c、d四个交点),其中一个交点(例如a交点)在衬底基板101上的正投影与凸透镜106在衬底基板101上的正投影中心e重合,其余交点(例如b、c、d三个交点)在衬底基板101上的正投影与凸透镜106在衬底基板101上的正投影中心e偏移特定距离,该特定距离与光线的角度及凸透镜106的折射率相关,且光线的角度越大,被凸透镜106汇聚成的交点到凸透镜106正投影中心e的距离越大。
由图4可以看出,在凸透镜106将预设角度θ(例如10°)范围内不同角度的光线L 1(例如与竖直方向的夹角为0°)、L 3(例如与竖直方向的夹角为3°)、L 4(例如与竖直方向的夹角为5°)和L 2(例如与竖直方向的夹角 为10°)汇聚到至少两个交点(例如a、b、c、d四个交点)的基础上,可增设遮光层110选择性透过不同角度的光线。例如图4中的遮光层110可选择性遮挡稍大角度光线(例如L 2)的交点(例如d交点),并选择性透过稍小角度的光线(例如L 1、L 3和L 4),以进一步提高准直效果。
可选地,在本公开实施例提供的上述显示基板中,凸透镜106的折射率可以为1.6-1.8,凸透镜106的曲率半径r可以为5μm-20μm,如图2所示。折射率较大的凸透镜106对光线的汇聚效果较好,且上述范围内的曲率半径可以满足不同产品需求,具体地,上述范围内的曲率半径r可以保证光敏器件103的上表面在凸透镜106的焦点附近。
可选地,在本公开实施例提供的上述显示基板中,如图2和图3所示,还可以包括:依次位于多个凸透镜106所在层背离衬底基板101一侧的透明粘结层107,透明粘结层107的折射率小于凸透镜106的折射率,以匹配凸透镜106的折射率。同时,透明胶粘层107还用于将保护盖板108与色阻104、黑矩阵105、凸透镜106之间进行贴合固定。
可选地,在本公开实施例提供的上述显示基板中,为较好地匹配凸透镜106的折射率,透明粘结层107的折射率可以为1.35-1.45。在一些实施例中,透明粘结层107可以为透明光学胶(OCA)。
可选地,在本公开实施例提供的上述显示基板中,如图2和图3所示,还可以包括:多个滤光结构109,每个第二开口O 2内设置一个滤光结构109,多个滤光结构109被配置为滤除红外光线。
由于在指纹识别的过程中,除了发光器件102所发出的光经指纹反射后可被光敏器件103感应外,光敏器件103还可能感应通过手指射入的环境光。该环境光可能对光敏器件103的指纹识别产生干扰。例如,当环境光照射在手指的正上方时,环境光可透过手指并激发手指内生物组织发出色素光,该色素光可能会对指纹识别产生干扰。通过检测,该色素光主要包括波长在600nm以上的光。因此,位于第二开口O 2处的滤光结构109,可通过对红外光线的拦截,有效避免了环境光的影响,从而达到在室外太阳光环境下可以 进行准确指纹识别的效果。
可选地,在本公开实施例提供的上述显示基板中,滤光结构109的材料可以为绿色树脂。具体地,该绿色树脂为绿色色阻CF G的材料,可有效拦截580nm-850nm的光线。当然,在具体实施时,滤光结构109还可以选用绿色树脂之外的其他材料制作,只要可实现截止红外光线的功能即可。
需要说明的是,在对红外光线实现截止效果时,不同材料的绿色树脂所需的厚度不同,致使第二开口O 2内的预留空间不同,因此,在一些实施例中,滤光结构109远离衬底基板101的表面与黑矩阵105远离衬底基板101的表面平齐,即滤光结构109恰好填满第二开口O 2,此时凸透镜106的底部恰好与黑矩阵105的上表面共面设置。在另一些实施例中,滤光结构109远离衬底基板101的表面到衬底基板101的距离,可能小于或大于黑矩阵105远离衬底基板101的表面到衬底基板101的距离,即滤光结构109尚未填满或溢出第二开口O 2,相应地,凸透镜106的底部会嵌入第二开口O 2或高于黑矩阵105的上表面。
由上述描述可知,本公开实施例提供的上述显示基板可以利用近似准直的小角度光线进行指纹识别,但在指纹识别过程中,不可避免会出现一些大角度的串扰光线L 5。在一些实施例中,该串扰光线L 5可被黑矩阵105遮挡,如图2所示;但在一些实施例中,该串扰光线L 5未能被黑矩阵105有效拦截,如图5所示。
基于此,为了有效拦截串扰光线L 5,在本公开实施例提供的上述显示基板中,如图5和图6所示,还可以设置在黑矩阵105面向衬底基板101一侧的遮光层110,该遮光层110具有多个第三开口O 3;多个第三开口O 3与多个第二开口O 2一一对应且在衬底基板101上的正投影至少部分重合。由图5可见,该遮光层110可以起到拦截串扰光线L 5的作用,且由于第三开口O 3与第二开口O 2对应交叠,可对小角度光线L 1、L 3和L 4起到准直作用,因此利于提高指纹识别的效果。
可选地,在本公开实施例提供的上述显示基板中,如图5和图6所示, 为了获得较好的准直效果,可以设置第三开口O 3在衬底基板101上的正投影位于对应第二开口O 2在衬底基板101上的正投影内,且第三开口O 3在衬底基板101上的正投影中心与对应第二开口O 2在衬底基板101上的正投影中心重合。
可选地,在本公开实施例提供的上述显示基板中,为保证准直效果,第三开口O 3的形状可以大致为圆形正多边形(例如正六边形等),第三开口O 3呈圆形时的孔径或所述第三开口O 3呈正多边形时的对角线可以为2μm-10μm。另外,在一些实施例中,第三开口O 3的形状也可以为方形或其他形状,只要可以起到对小角度光线准直的功能即可。
可选地,在本公开实施例提供的上述显示基板中,如图5所示,在垂直于衬底基板101的方向上,遮光层110的厚度h 2
Figure PCTCN2021077249-appb-000003
-2μm。在此厚度下,遮光层110可以使得400nm-850nm范围内串扰光线L 3的透光率在0.1%以下,即可以有效拦截的400nm-850nm范围内的串扰光线L 3,从而避免串扰光线L 3对指纹识别的影响。
在一些实施例中,遮光层110可以使用黑矩阵(BM)、钼金属(Mu)等吸光或低反射率的材料制作,以降低大角度的串扰光线L 3在遮光层110上发生反射的程度,提高指纹识别准确性。
可选地,在本公开实施例提供的上述显示基板中,遮光层110的材料为金属时,为了有效拦截串扰光线L 3,遮光层110的厚度可以设置为
Figure PCTCN2021077249-appb-000004
可选地,在本公开实施例提供的上述显示基板中,遮光层110的材料与黑矩阵105的材料相同时,为了有效拦截串扰光线L 3,遮光层110的厚度可以设置为0.5μm-2μm。
可选地,在本公开实施例提供的上述显示基板中,如图6所示,还可以包括:位于多个发光器件102所在层与多个色阻104所在层之间的封装层111;遮光层110可以位于发光器件102的第一电极1021与封装层111之间。或者,如图7和图8所示,遮光层110还可以与发光器件102的第二电极1023同层 设置。可选地,第二电极1023可以为阳极,第一电极1021可以为阴极。
需要说明的是,在本公开中,“同层”指的是采用同一成膜工艺形成用于制作特定图形的膜层,然后利用同一掩模板通过一次构图工艺形成的层结构。即一次构图工艺对应一道掩模板(mask,也称光罩)。根据特定图形的不同,一次构图工艺可能包括多次曝光、显影或刻蚀工艺,而所形成层结构中的特定图形可以是连续的也可以是不连续的,这些特定图形可能处于相同的高度或者具有相同的厚度、也可能处于不同的高度或者具有不同的厚度。可见,在将遮光层110与发光器件102的第二电极1023同层设置的情况下,可以避免单独设置遮光层110,由此减少了膜层数量,利于实现轻薄化设计,且节约了成本。
一般地,在本公开实施例提供的上述显示基板中,如图2至图8所示,还可以包括:散热膜112、缓冲层113、栅绝缘层114、层间介电层115、平坦层116、偏压线117、转接电极118、第一晶体管TFT 1和第二晶体管TFT 2等。对于显示基板的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的,在此不做赘述,也不应作为对本发明的限制。
基于同一发明构思,本公开还提供了一种显示装置,包括本公开实施例提供的上述显示基板,该显示基板可以为OLED显示基板。由于该显示装置解决问题的原理与上述显示基板解决问题的原理相似,因此,该显示装置的实施可以参见上述显示基板的实施例,重复之处不再赘述。
在一些实施例中,本公开实施例提供的上述显示装置可以为:手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪、智能手表、健身腕带、个人数字助理等任何具有显示功能的产品或部件。本公开实施例提供的显示装置还可以包括但不限于:射频单元、网络模块、音频输出单元、输入单元、传感器、显示单元、用户输入单元、接口单元、存储器、处理器、以及电源等部件。本领域技术人员可以理解,上述显示装置的组成并不构成对显示装置的限定,显示装置可以包括上述更多或更少的部件,或者组合某些部件,或者不同的部件布置。
显然,本领域的技术人员可以对本发明实施例进行各种改动和变型而不脱离本发明实施例的精神和范围。这样,倘若本发明实施例的这些修改和变型属于本发明权利要求及其等同技术的范围之内,则本发明也意图包含这些改动和变型在内。

Claims (27)

  1. 一种显示基板,其中,包括:
    衬底基板;
    多个发光器件,位于所述衬底基板之上;
    多个光敏器件,位于所述多个发光器件所在层与所述衬底基板之间;各所述光敏器件在所述衬底基板上的正投影位于相邻所述发光器件在所述衬底基板上正投影的间隙处;
    多个色阻和黑矩阵;位于所述多个发光器件所在层背离所述衬底基板的一侧;所述黑矩阵具有多个第一开口和多个第二开口;其中,所述多个色阻对应设置在所述多个第一开口内,且覆盖所述多个发光器件;所述多个第二开口在所述衬底基板上的正投影与所述多个光敏器件在所述衬底基板上的正投影相互交叠。
  2. 如权利要求1所述的显示基板,其中,至少一个所述第二开口与一个所述光敏器件对应设置。
  3. 如权利要求2所述的显示基板,其中,所述第二开口在所述衬底基板上的正投影位于对应所述光敏器件在所述衬底基板上的正投影内。
  4. 如权利要求3所述的显示基板,其中,所述第二开口的形状大致为圆形或正多边形。
  5. 如权利要求4所述的显示基板,其中,所述第二开口呈圆形时的孔径或所述第二开口呈正多边形时的对角线为2μm-20μm。
  6. 如权利要求1所述的显示基板,其中,在垂直于所述衬底基板的方向上,所述黑矩阵的厚度为1μm-5μm。
  7. 如权利要求1-6任一项所述的显示基板,其中,还包括:位于所述黑矩阵远离所述衬底基板一侧的多个凸透镜;
    所述凸透镜与所述第二开口一一对应设置,所述凸透镜的凸面背离所述光敏器件,且所述凸透镜被配置为将手指反射的预设角度范围内的光线经所 述第二开口汇聚至所述光敏器件。
  8. 如权利要求7所述的显示基板,其中,所述凸透镜在所述衬底基板上的正投影完全覆盖对应所述第二开口在所述衬底基板上的正投影。
  9. 如权利要求8所述的显示基板,其中,所述凸透镜在所述衬底基板上的正投影中心与对应所述第二开口在所述衬底基板上的正投影中心重合。
  10. 如权利要求9所述的显示基板,其中,所述凸透镜具体被配置为将所述预设角度范围内不同角度的光线汇聚到至少两个交点,其中一个所述交点在所述衬底基板上的正投影与所述凸透镜在所述衬底基板上的正投影中心重合,其余所述交点在所述衬底基板上的正投影相对于所述凸透镜在所述衬底基板上的正投影中心偏移特定距离。
  11. 如权利要求7所述的显示基板,其中,所述凸透镜的折射率为1.6-1.8,所述凸透镜的曲率半径为5μm-20μm。
  12. 如权利要求11所述的显示基板,其中,还包括:依次位于所述多个凸透镜所在层背离所述衬底基板一侧的透明粘结层,所述透明粘结层的折射率小于所述凸透镜的折射率。
  13. 如权利要求12所述的显示基板,其中,所述透明粘结层的折射率为1.35-1.45。
  14. 如权利要求1-13任一项所述的显示基板,其中,还包括:多个滤光结构,每个所述第二开口内设置一个所述滤光结构,所述多个滤光结构被配置为滤除红外光线。
  15. 如权利要求14所述的显示基板,其中,所述滤光结构的材料为绿色树脂。
  16. 如权利要求14所述的显示基板,其中,所述滤光结构远离所述衬底基板的表面与所述黑矩阵远离所述衬底基板的表面平齐。
  17. 如权利要求14所述的显示基板,其中,所述滤光结构远离所述衬底基板的表面到所述衬底基板的距离,小于或大于所述黑矩阵远离所述衬底基板的表面到所述衬底基板的距离。
  18. 如权利要求1-17任一项所述的显示基板,其中,还包括:位于所述黑矩阵面向所述衬底基板一侧的遮光层,所述遮光层具有多个第三开口;
    所述多个第三开口与所述多个第二开口一一对应且在所述衬底基板上的正投影至少部分重合。
  19. 如权利要求18所述的显示基板,其中,所述第三开口在所述衬底基板上的正投影位于对应所述第二开口在所述衬底基板上的正投影内,且所述第三开口在所述衬底基板上的正投影中心与对应所述第二开口在所述衬底基板上的正投影中心重合。
  20. 如权利要求18所述的显示基板,其中,所述第三开口的形状大致为圆形或正多边形。
  21. 如权利要求19所述的显示基板,其中,所述第三开口呈圆形时的孔径或所述第三开口呈正多边形时的对角线为2μm-10μm。
  22. 如权利要求18所述的显示基板,其中,在垂直于所述衬底基板的方向上,所述遮光层的厚度为
    Figure PCTCN2021077249-appb-100001
  23. 如权利要求22所述的显示基板,其中,所述遮光层的材料为金属,所述遮光层的厚度为
    Figure PCTCN2021077249-appb-100002
  24. 如权利要求22所述的显示基板,其中,所述遮光层的材料与所述黑矩阵的材料相同,所述遮光层的厚度为0.5μm-2μm。
  25. 如权利要求18所述的显示基板,其中,还包括:位于所述多个发光器件所在层与所述多个色阻所在层之间的封装层;
    所述遮光层位于所述发光器件的第一电极与所述封装层之间。
  26. 如权利要求18所述的显示基板,其中,所述遮光层与所述发光器件的第二电极同层设置。
  27. 一种显示装置,其中,包括如权利要求1-26任一项所述的显示基板。
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