WO2023066343A1 - 驱动组件和摄像模组 - Google Patents

驱动组件和摄像模组 Download PDF

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Publication number
WO2023066343A1
WO2023066343A1 PCT/CN2022/126447 CN2022126447W WO2023066343A1 WO 2023066343 A1 WO2023066343 A1 WO 2023066343A1 CN 2022126447 W CN2022126447 W CN 2022126447W WO 2023066343 A1 WO2023066343 A1 WO 2023066343A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
sma wire
driving element
movable
carrier
Prior art date
Application number
PCT/CN2022/126447
Other languages
English (en)
French (fr)
Inventor
卞强龙
姜瑶清
魏罕钢
戎琦
黄桢
杨巧凤
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202111222720.9A external-priority patent/CN116017099A/zh
Priority claimed from CN202111221269.9A external-priority patent/CN116017118A/zh
Priority claimed from CN202111222733.6A external-priority patent/CN116017100A/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to CN202280065657.9A priority Critical patent/CN118077211A/zh
Publication of WO2023066343A1 publication Critical patent/WO2023066343A1/zh

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  • the present application relates to the field of camera modules, in particular to a drive assembly and a camera module, wherein the drive assembly uses the elastic component group of the circuit board as the reset and limit element of the SMA driver to reduce the chip by multiplexing the components.
  • the overall height dimension of the anti-shake unit is not limited.
  • the camera modules of mobile electronic devices are required to have an anti-shake function. It should be understood that when a mobile electronic device is used to take pictures, the human body will have a certain frequency of physiological tremors under normal conditions and the shaking caused by movement will lead to poor picture taking effect. Therefore, it is expected that a mobile electronic device is equipped with an anti-shake device to drive an optical lens or a photosensitive chip to move to achieve optical anti-shake.
  • an optimized anti-shake structure for camera modules is expected to meet the dual technical requirements of anti-shake and structural design.
  • An advantage of the present application is to provide a drive assembly and a camera module, wherein the drive assembly uses the elastic parts of the circuit board to set the reset and limit elements of the SMA driver to reduce the chip anti-shake part by multiplexing the components. overall height dimension.
  • Another advantage of the present application is to provide a drive assembly and a camera module, wherein there is a height difference between the inner circuit board and the outer circuit of the circuit board so that the elastic member group is in a stretched state, so that the stretched The stretched elastic component group provides a pressing force for the ball assembly to abut against the anti-shake fixing part of the chip, so as to avoid the detachment between the ball assembly and the anti-shake fixing part of the chip and generate noise.
  • Another advantage of the present application is to provide a drive assembly and a camera module, wherein at least three balls of the ball assembly form a horizontal mounting surface so that the inner circuit board moves on a horizontal plane, improving the stability of the anti-shake sex.
  • Another advantage of the present application is to provide a drive assembly and a camera module, wherein, in a specific example of the present application, the chip anti-shake movable part and at least one SMA wire are arranged on the base and inner circuit of the chip anti-shake fixed part Between the boards, through such a position arrangement, the internal space of the chip anti-shake fixing part can be more fully utilized so that the overall height and dimension of the driving assembly can be reduced.
  • a drive assembly which includes:
  • a chip anti-shake fixing part having a receiving cavity, the chip anti-shaking fixing part including at least one driving element fixing part located in the receiving cavity;
  • a chip anti-shake movable part located in the housing cavity includes a movable carrier and at least one driving element movable part that is linked to the movable carrier;
  • the circuit board suspended and fixed in the accommodating cavity, wherein the circuit board includes an inner circuit board, an outer circuit board, and an elastic member group extending between the inner circuit board and the outer circuit board,
  • the inner circuit board is suspended in the outer circuit board through the elastic member group, and the inner circuit board is movable relative to the outer circuit board, wherein the inner circuit board is suitable for installation A photosensitive chip, and the inner circuit board is fixed on the movable carrier of the anti-shake movable part of the chip;
  • a drive element comprising at least one SMA wire extending between said at least one drive element fixed portion and said at least one drive element movable portion;
  • the at least one SMA wire when the at least one SMA wire is driven, the at least one SMA wire is adapted to act on the movable part of the at least one driving element to drive the movable carrier of the anti-shake movable part of the chip to drive the
  • the inner circuit board of the circuit board moves relative to the outer circuit board. In this way, it is suitable to drive the photosensitive chip installed on the inner circuit board to move, and the elastic component group of the circuit board is suitable for Reset the inner circuit board.
  • the at least one movable part of the driving element includes a first movable part of the driving element and a movable part of the second driving element arranged oppositely
  • the fixed part of the at least one driving element includes a movable part of the oppositely arranged
  • the first driving element fixing part and the second driving element fixing part, the first driving element fixing part, the second driving element fixing part, the first driving element movable part and the second driving element movable The parts are located at the four corners of the receiving cavity; wherein, the at least one SMA wire includes a first SMA wire extending from the fixed part of the first driving element and the movable part of the first driving element, and extending from the moving part of the first driving element.
  • the second SMA wire of the first driving element movable part and the second driving element fixing part the third SMA wire extending from the second driving element fixing part and the second driving element movable part, and , a fourth SMA wire extending between the second driving element movable part and the first driving element fixing part.
  • the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire are located on the same plane, and the first SMA wire, the The plane where the second SMA wire, the third SMA wire and the fourth SMA wire are located is parallel to the plane where the inner circuit board is located.
  • the first SMA line is parallel to the third SMA line, and the first SMA line is perpendicular to the second SMA line, and the first SMA line is parallel to the
  • the fourth SMA wire is vertical, wherein the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire have the same length.
  • the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire there is a gap between it and the elastic member group, and the gap is greater than or equal to 0.1mm.
  • the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire are lower than the bottom surface of the inner circuit board.
  • the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire are located outside the inner circuit board.
  • the anti-shake fixing part includes a base and an upper cover engaged with the base, and the accommodation cavity is formed between the upper cover and the base.
  • the outer circuit board of the circuit board is clamped between the upper cover and the base, in such a way that the circuit board is suspended and fixed on the Inside the containment chamber.
  • the chip anti-shake movable part further includes an anti-collision assembly fixed on the top surface of the inner circuit board.
  • the elastic member group includes a first elastic member, a second elastic member, a third elastic member and a fourth elastic member, the first elastic member, the second elastic member, the The third elastic member and the fourth elastic member are arranged in a rotationally symmetrical manner relative to the center set by the inner circuit board, wherein the first elastic member, the second elastic member, the first elastic member
  • the three elastic pieces and the fourth elastic piece are respectively distributed around the four corners of the inner circuit board, and the first elastic piece, the second elastic piece, the third elastic piece and the fourth elastic piece
  • the components respectively connect one of the inner sides of the outer circuit board and one of the outer sides of the inner circuit board which are vertically distributed.
  • the chip anti-shake fixing part further includes a fixed carrier stacked on the base, and the fixed carrier includes a fixed carrier main body and first respectively extending outwardly from the fixed carrier.
  • the chip anti-shake fixing part further includes a support provided on the base, and a top surface of the support is in contact with the outer circuit board.
  • the driving assembly further includes a ball assembly disposed between the movable carrier and the chip anti-shake fixing part.
  • the application provides a drive assembly, which includes:
  • a chip anti-shake fixing part having a receiving cavity, the chip anti-shaking fixing part including at least one driving element fixing part located in the receiving cavity;
  • a chip anti-shake movable part located in the housing cavity includes a movable carrier and at least one driving element movable part that is linked to the movable carrier;
  • the circuit board suspended and fixed in the accommodating cavity wherein the circuit board includes an inner circuit board, an outer circuit board, and an elastic member group extending between the inner circuit board and the outer circuit board,
  • the inner circuit board is suspended in the outer circuit board through the elastic component group, wherein the inner circuit board is suitable for installing a photosensitive chip, and the inner circuit board is fixed on the chip anti- Shake the movable carrier of the movable part;
  • a drive element comprising at least one SMA wire extending between said at least one drive element fixed portion and said at least one drive element movable portion;
  • a ball assembly movably clamped between the movable carrier and the chip anti-shake fixing part, wherein there is a height difference between the inner circuit board and the outer circuit board so that the elastic member The group is in a stretched state, and the elastic member group in the stretched state provides a pressing force for making the ball assembly abut against the anti-shake fixing part of the chip.
  • the anti-shake fixing part includes a base and an upper cover engaged with the base, and the accommodation cavity is formed between the upper cover and the base.
  • the ball assembly and the at least one SMA wire are located between the upper cover and the movable carrier.
  • the ball assembly and the at least one SMA wire are located between the base and the movable carrier.
  • the inner circuit board is higher than the outer circuit board.
  • the height difference between the inner circuit board and the outer circuit board is between 0.05 mm and 0.1 mm.
  • the magnitude of the pressing force is between 20mN and 50mN.
  • the ball assembly includes at least three balls that are rollingly clamped between the base and the movable carrier, and the top ends of the at least three balls are formed with the inner circuit board. parallel planes.
  • the top surface of the inner circuit board has a photosensitive chip mounting area and a peripheral area formed on the periphery of the photosensitive chip mounting area, wherein the at least three balls correspond to the peripheral area area.
  • the at least three balls are fixed to the movable carrier, or the at least three balls are fixed to the base.
  • the at least one movable part of the driving element includes a first movable part of the driving element and a movable part of the second driving element arranged oppositely
  • the fixed part of the at least one driving element includes a movable part of the oppositely arranged
  • the first driving element fixing part and the second driving element fixing part, the first driving element fixing part, the second driving element fixing part, the first driving element movable part and the second driving element movable The parts are located at the four corners of the receiving cavity; wherein, the at least one SMA wire includes a first SMA wire extending from the fixed part of the first driving element and the movable part of the first driving element, and extending from the moving part of the first driving element.
  • the second SMA wire of the first driving element movable part and the second driving element fixing part the third SMA wire extending from the second driving element fixing part and the second driving element movable part, and , a fourth SMA wire extending between the second driving element movable part and the first driving element fixing part.
  • the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire are located on the same plane, and the first SMA wire, the The plane where the second SMA line, the third SMA line, and the fourth SMA line are located is parallel to the plane where the inner circuit board is located, wherein the first SMA line is parallel to the third SMA line, and The first SMA line is perpendicular to the second SMA line, and the first SMA line is perpendicular to the fourth SMA line, wherein the first SMA line, the second SMA line, and the first SMA line
  • the third SMA wire and the fourth SMA wire have the same length.
  • the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire there is a gap between it and the elastic member group, and the gap is greater than or equal to 0.1 mm.
  • the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire are located outside the inner circuit board.
  • the chip anti-shake fixing part further includes a fixed carrier stacked on the base, and the fixed carrier includes a fixed carrier main body and first respectively extending outwardly from the fixed carrier. a fixed carrier branch and a second fixed carrier branch, wherein the first drive element fixing part and the second drive element fixing part are respectively mounted on the first fixed carrier branch and the second fixed carrier branch, wherein , the movable carrier includes a movable carrier main body and a first movable carrier branch and a second movable carrier branch extending relatively downward and outward from the movable carrier main body, wherein the first driving element The movable part and the movable part of the second driving element are mounted on the first movable carrier branch and the second movable carrier branch respectively.
  • the fixed carrier body has at least three ball grooves for receiving the at least three balls.
  • the chip anti-shake fixing part further includes a support provided on the base, and a top surface of the support is in contact with the outer circuit board.
  • the chip anti-shake movable part further includes an anti-collision plate fixed on the top surface of the inner circuit board. components.
  • the elastic member group includes a first elastic member, a second elastic member, a third elastic member and a fourth elastic member, the first elastic member, the second elastic member, the The third elastic member and the fourth elastic member are arranged in a rotationally symmetrical manner relative to the center set by the inner circuit board, wherein the first elastic member, the second elastic member, the first elastic member
  • the three elastic pieces and the fourth elastic piece are respectively distributed around the four corners of the inner circuit board, and the first elastic piece, the second elastic piece, the third elastic piece and the fourth elastic piece
  • the components respectively connect one of the inner sides of the outer circuit board and one of the outer sides of the inner circuit board which are vertically distributed.
  • the application provides a drive assembly, which includes:
  • a chip anti-shake fixing part having a receiving cavity, the chip anti-shaking fixing part including at least one driving element fixing part located in the receiving cavity;
  • a chip anti-shake movable part located in the housing cavity includes a movable carrier and at least one driving element movable part that is linked to the movable carrier;
  • the circuit board suspended and fixed in the accommodating cavity wherein the circuit board includes an inner circuit board, an outer circuit board, and an elastic member group extending between the inner circuit board and the outer circuit board,
  • the inner circuit board is suspended in the outer circuit board through the elastic component group, the inner circuit board is suitable for installing photosensitive chips and the inner circuit board is movable relative to the outer circuit board, Wherein, the movable carrier is attached to the bottom surface of the inner circuit board;
  • a driving element including at least one SMA wire extending between the at least one driving element fixing part and the at least one driving element movable part, the at least one SMA wire being lower than the bottom surface of the inner circuit board;
  • the at least one SMA wire when the at least one SMA wire is driven, the at least one SMA wire is adapted to act on the movable part of the at least one driving element to drive the movable carrier of the anti-shake movable part of the chip to drive the
  • the inner circuit board of the circuit board moves relative to the outer circuit board. In this way, it is suitable to drive the photosensitive chip installed on the inner circuit board to move, and the elastic component group of the circuit board is suitable for Reset the inner circuit board.
  • the anti-shake fixing part includes a base and an upper cover engaged with the base, and the receiving cavity is formed between the upper cover and the base, wherein the At least one SMA wire and the movable carrier are located between the inner circuit board and the base.
  • the at least one movable part of the driving element includes a first movable part of the driving element and a movable part of the second driving element arranged oppositely
  • the fixed part of the at least one driving element includes a movable part of the oppositely arranged
  • the first driving element fixing part and the second driving element fixing part, the first driving element fixing part, the second driving element fixing part, the first driving element movable part and the second driving element movable The parts are located at the four corners of the receiving cavity; wherein, the at least one SMA wire includes a first SMA wire extending from the first driving element fixed part and the first driving element movable part, and extending from the first driving element movable part.
  • the second SMA wire of the first driving element movable part and the second driving element fixing part the third SMA wire extending from the second driving element fixing part and the second driving element movable part, and , a fourth SMA wire extending between the second driving element movable part and the first driving element fixing part.
  • the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire are located on the same plane, and the first SMA wire, the The plane where the second SMA line, the third SMA line, and the fourth SMA line are located is parallel to the plane where the inner circuit board is located, wherein the first SMA line is parallel to the third SMA line, and The first SMA line is perpendicular to the second SMA line, and the first SMA line is perpendicular to the fourth SMA line, and the first SMA line, the second SMA line, the third The SMA wire and the fourth SMA wire have the same length.
  • the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire there is a gap between it and the elastic member group, and the gap is greater than or equal to 0.1mm.
  • the outer circuit board of the circuit board is clamped between the upper cover and the base, in such a way that the circuit board is suspended and fixed on the Inside the containment chamber.
  • the chip anti-shake movable part further includes an anti-collision plate fixed on the top surface of the inner circuit board. components.
  • the driving assembly further includes: a ball assembly movably clamped between the movable carrier and the base, wherein the inner circuit board and the outer There is a height difference between the circuit boards so that the elastic component group is in a stretched state, and the elastic component group in the stretched state provides a pressing force for making the ball assembly abut against the anti-shake fixing part of the chip.
  • the inner circuit board is higher than the outer circuit board.
  • the height difference between the inner circuit board and the outer circuit board is between 0.05mm and 0.1mm, and the magnitude of the pressing force is between 20mN and 50mN.
  • the ball assembly includes at least three balls that are rollingly clamped between the base and the movable carrier, the at least three balls are fixed to the movable carrier or fixed on the base.
  • the top surface of the inner circuit board has a photosensitive chip mounting area and a peripheral area formed on the periphery of the photosensitive chip mounting area, wherein the at least three balls correspond to the peripheral area area.
  • the chip anti-shake fixing part further includes a fixed carrier stacked on the base, and the fixed carrier includes a fixed carrier main body and first respectively extending outwardly from the fixed carrier. a fixed carrier branch and a second fixed carrier branch, wherein the first drive element fixing part and the second drive element fixing part are respectively mounted on the first fixed carrier branch and the second fixed carrier branch, wherein , the fixed carrier body has at least three ball grooves for accommodating the at least three balls.
  • the movable carrier includes a movable carrier main body and a first movable carrier branch and a second movable carrier branch extending relatively downward and outward from the movable carrier main body, respectively, wherein, the movable part of the first driving element and the movable part of the second driving element are mounted on the first movable carrier branch and the second movable carrier branch respectively.
  • the chip anti-shake fixing part further includes a support provided on the base, and a top surface of the support is in contact with the outer circuit board.
  • the elastic member group includes a first elastic member, a second elastic member, a third elastic member and a fourth elastic member, the first elastic member, the second elastic member, the The third elastic member and the fourth elastic member are arranged in a rotationally symmetrical manner relative to the center set by the inner circuit board, wherein the first elastic member, the second elastic member, the first elastic member
  • the three elastic pieces and the fourth elastic piece are respectively distributed around the four corners of the inner circuit board, and the first elastic piece, the second elastic piece, the third elastic piece and the fourth elastic piece
  • the components respectively connect one of the inner sides of the outer circuit board and one of the outer sides of the inner circuit board which are vertically distributed.
  • a camera module which includes:
  • FIG. 1 illustrates a schematic perspective view of a camera module according to an embodiment of the present application.
  • Fig. 2 illustrates a schematic diagram of a photosensitive component and a driving component of the camera module according to an embodiment of the present application.
  • Fig. 3 illustrates a three-dimensional exploded schematic view of the photosensitive assembly and the driving assembly according to an embodiment of the present application.
  • FIG. 4A illustrates a schematic diagram of a circuit board of the photosensitive assembly according to an embodiment of the present application.
  • Fig. 4B illustrates a partially enlarged schematic diagram of the circuit board according to an embodiment of the present application.
  • FIG. 5A illustrates a schematic cross-sectional view of the driving assembly and the photosensitive assembly according to an embodiment of the present application.
  • Fig. 5B illustrates a schematic cross-sectional view of a modified embodiment of the driving assembly and the photosensitive assembly according to the embodiment of the present application.
  • Fig. 6 illustrates a schematic diagram of a movable carrier and a fixed carrier of the driving assembly according to an embodiment of the present application.
  • Fig. 7 illustrates a top view of the movable carrier and the fixed carrier according to an embodiment of the present application.
  • FIG. 8 illustrates a bottom view of the drive assembly after removing the base according to an embodiment of the present application.
  • Fig. 9 illustrates a schematic perspective view of the base of the driving assembly, the ball assembly and the anti-shake fixing part of the chip according to the embodiment of the present application.
  • a camera module 1 which includes a photosensitive component 30 , an optical lens 10 held on the photosensitive path of the photosensitive component 30 , and used to drive the The optical lens 10 and/or the photosensitive component 30 move to realize the driving component 20 for optical performance adjustment, for example, optical anti-shake, optical focus and so on.
  • the optical lens 10 includes a lens barrel 11 and a lens group 12 installed in the lens barrel 11, the lens group 12 includes at least one optical lens, and the number of the at least one optical lens can be one or Multiple, not limited.
  • the photosensitive component 30 includes a circuit board 31, a photosensitive chip 321 electrically connected to the circuit board 31, an electronic component 322, and a connector. The circuit board 31 and the connector are electrically connected with external mobile electronic equipment.
  • the photosensitive chip 321 includes a photosensitive area and a non-photosensitive area, and the photosensitive chip 321 is electrically connected to the circuit board 31 through a photosensitive chip pad located in the non-photosensitive area.
  • the photosensitive chip 321 can be connected by a wire bond.
  • the circuit board 31 is electrically connected to the circuit board 31 by bonding (gold wire), welding, FC process (flip chip) or RDL (redistribution layer technology).
  • the photosensitive chip 321 is adapted to be fixed on the upper surface of the circuit board 31 through an adhesive medium (herein, in the embodiment of the present application, the surface of the circuit board 31 facing the lens is defined as the upper surface).
  • the photosensitive chip 321 is arranged in the circuit board through hole of the circuit board 31, thereby reducing the thickness of the circuit board 31 and affecting the photosensitive Influenced by the thickness of the component 30, the height of the camera module 1 is reduced.
  • the photosensitive component 30 further includes a filter element 324 held on the photosensitive path of the photosensitive chip 321 for filtering the imaging light entering the photosensitive chip 321 .
  • the filter element 324 is installed on the base 323 of the photosensitive component 30 and corresponds to at least the photosensitive area of the photosensitive chip 321, and the base 323 is implemented as a separately molded plastic bracket , which is attached to the surface of the circuit board 31 through an adhesive medium, and is used to support other components, or, the base 323 is implemented as a molded base, which is integrally formed on the preset surface of the circuit board 31 through a molding process.
  • the location, for that matter, is not limited by the present application.
  • the filter element 324 can also be installed in other positions of the camera module, for example, the filter element 324 is formed in the optical lens 10 ( For example, as a layer of filter film attached to the surface of a certain optical lens of the optical lens 10).
  • the driving assembly 20 includes a chip driving part 201, and the chip driving part 201 may include a chip anti-shake part 21, and the chip anti-shake part 21 is suitable for driving the photosensitive chip 321 of the photosensitive component 30 in the X-axis direction and the Y-axis direction. Axis translation and/or rotation around the Z-axis direction, in order to realize the translation anti-shake and/or rotation anti-shake of the photosensitive assembly 30; or, the chip anti-shake part 21 is suitable for driving the photosensitive assembly 30
  • the chip 321 rotates around the X-axis and around the Y-axis, so as to implement tilting and anti-shake of the photosensitive component 30 .
  • the X-axis direction and the Y-axis direction are perpendicular to each other, and the Z-axis direction is perpendicular to the plane where the X-axis direction and the Y-axis direction lie.
  • the X-axis, Y-axis and Z-axis constitute a three-dimensional coordinate system.
  • the chip driving part 201 also includes a chip focusing part, that is, the chip driving part 201 can also drive the photosensitive chip 321 of the photosensitive component 30 to move along the optical axis (ie, the Z-axis direction) , to realize the chip focusing function.
  • the chip driving part 201 can also drive the photosensitive chip 321 of the photosensitive component 30 to move along the optical axis (ie, the Z-axis direction) , to realize the chip focusing function.
  • the on-chip anti-shake part 21 and the on-chip focusing part may be driving motors such as voice coil motors, piezoelectric motors, SMA (Shape Memory Alloy) motors, and the like.
  • Shape memory alloy is an alloy material that can completely eliminate its deformation at a lower temperature after heating up and restore its original shape before deformation. For example, when the shape memory alloy undergoes a limited plastic deformation at a temperature lower than the phase transformation state, it can be restored to its original shape before deformation by heating. Among them, it can be realized by energizing the SMA wire SMA wire heating.
  • the driving assembly 20 may further include a lens driving part 202, and the lens driving part 202 includes a lens driving fixed part, a lens driving movable part, and a lens connecting the lens driving fixed part and the lens.
  • the lens driving part 202 includes a lens driving fixed part, a lens driving movable part, and a lens connecting the lens driving fixed part and the lens.
  • the optical lens 10 is installed on the lens driving movable part of the lens driving part 202, and the driving element drives the lens driving fixed part and the optical lens 10 to move , in order to realize the functions of lens anti-shake or lens focus.
  • the lens driving part 202 includes a lens focusing part, and the lens focusing part is suitable for driving the optical lens 10 to move along the optical axis to realize the lens focusing function; in another aspect of the present application, the lens driving part 202 includes a lens focusing part and a lens anti-shake part, so that the lens driving part 202 is suitable for realizing the lens focusing function and the lens anti-shake function at the same time; in another embodiment of the present application , the lens driving part 202 only includes a lens anti-shake part, so that the lens anti-shake part drives the optical lens 10 to move to realize the lens anti-shake function.
  • the camera module is suitable for realizing both the lens anti-shake function and the chip anti-shake function, realizing "dual OIS" function, thereby improving the anti-shake effect of the camera module.
  • the lens focus unit and the lens anti-shake unit may be driving motors such as voice coil motors, piezoelectric motors, and SMA (Shape Memory Alloy) motors.
  • driving motors such as voice coil motors, piezoelectric motors, and SMA (Shape Memory Alloy) motors.
  • the driving element is a coil-magnet pair
  • the lens anti-shake part is a piezoelectric motor
  • the driving element is a piezoelectric element
  • the shaking part is an SMA motor
  • the driving element is an SMA wire.
  • FIG. 2 shows the photosensitive assembly and the drive assembly of the camera module according to the embodiment of the application Schematic diagram
  • FIG. 3 is a three-dimensional exploded schematic diagram of the photosensitive component and the driving component according to an embodiment of the present application
  • FIG. 4A is a schematic diagram of a circuit board of the photosensitive component according to an embodiment of the present application
  • FIG. 4B is a schematic diagram of a circuit board according to an embodiment of the present application.
  • FIG. 5A is a schematic cross-sectional view of the driving assembly and the photosensitive assembly according to the embodiment of the present application
  • FIG. 5B is the schematic diagram of the driving assembly and the photosensitive assembly according to the embodiment of the present application.
  • FIG. 6 is a schematic diagram of the movable carrier and the fixed carrier of the drive assembly according to an embodiment of the present application.
  • FIG. 7 is a schematic diagram of the movable carrier and the fixed carrier according to an embodiment of the present application.
  • the top view of the fixed carrier, FIG. 8 is a bottom view of the drive assembly according to the embodiment of the present application after removing the base, and
  • FIG. 9 is the base, ball assembly and chip of the drive assembly according to the embodiment of the present application A three-dimensional schematic diagram of the anti-shake fixing part.
  • the photosensitive component 30 includes a circuit board 31 , a mounting part 32 and a connector installed on the circuit board 31 .
  • the circuit board 31 includes a circuit board main body 311, a connection strip and a connector part (the connection strip, the connector part and the connector are not shown in the figure), and the connector is installed at the end of the connector part, so
  • the connecting strip connects the circuit board main body 311 and the connector part and realizes electrical conduction between the circuit board main body 311 and the connector part.
  • the circuit board main body 311 includes an outer circuit board 3113 , an inner circuit board 3111 and an elastic member group 3112 connecting the outer circuit board 3113 and the inner circuit board 3111 .
  • 32 is adapted to be installed on the upper surface of the inner circuit board 3111, the mounting part 32 includes a photosensitive chip 321 electrically connected to the inner circuit board 3111, an electronic component 322 and a base installed and fixed on the inner circuit board 3111 323 and the filter element 324 installed on the base 323.
  • the inner circuit board 3111 may be provided with a groove or a through hole (circuit board through hole 31115), and the photosensitive chip 321 is installed and fixed in the groove or through hole of the inner circuit board 3111. In the through hole 31115 of the circuit board, the height of the camera module is lowered.
  • the upper surface of the inner circuit board 3111 has a photosensitive chip mounting area and a peripheral area surrounding the photosensitive chip mounting, wherein the photosensitive chip 321 is mounted on the The photosensitive chip mounting area, and the electronic components 322 and the base 323 are installed in the peripheral area.
  • the photosensitive chip mounting area is the groove or the through hole.
  • the outer circuit board 3113 is arranged around the inner circuit board 3111 , and the elastic member group 3112 passes between the outer circuit board 3113 and the inner circuit board 3111 connection, wherein, the inner circuit board 3111 is suspended inside the outer circuit board 3113 through the elastic member group 3112 to form an elastic circuit board, so that the inner circuit board 3111 can be relatively Move between the outer circuit boards 3113 (for example, make the inner circuit board 3111 translate, rotate or tilt relative to the outer circuit board 3113, etc.), and when the external force disappears, the elasticity of the elastic member group 3112 can be relied on to The inner circuit board 3111 returns to the initial position.
  • the circuit board 311 has at least the following characteristics: (1) The inner circuit board 3111 and the outer circuit board 3113 of the circuit board 311 are relatively accessible move; (2) after the inner circuit board 3111 moves relative to the outer circuit board 3113, the elastic member group 3112 can restore the inner circuit board 3111 to its original position; (3) due to the elastic member With the existence of the group 3112, the functions of the circuit board 311 can be reused (will be explained in the subsequent description).
  • the elastic member group 3112 is also suitable for electrically connecting the inner circuit board 3111 and the outer circuit board 3113, so that the photosensitive sensor mounted on the inner circuit board 3111
  • the chip 321 can be electrically connected to the outer circuit board 3113 through the inner circuit board 3111 and the elastic component group 3112 . That is, in the embodiment of the present application, the elastic component group 3112 not only connects the inner circuit board 3111 and the outer circuit board 3113 structurally, but also electrically connects the inner circuit board 3111 and the outer circuit board 3111 electrically.
  • the external circuit board 3113 is also suitable for electrically connecting the inner circuit board 3111 and the outer circuit board 3113, so that the photosensitive sensor mounted on the inner circuit board 3111
  • the chip 321 can be electrically connected to the outer circuit board 3113 through the inner circuit board 3111 and the elastic component group 3112 . That is, in the embodiment of the present application, the elastic component group 3112 not only connects the inner circuit board 3111 and the outer circuit board 3113 structurally, but also electrically connects
  • the elastic member set 3112 includes a plurality of elastic members.
  • the plurality of elastic members have the same shape and use the same material, so that each of the plurality of elastic members
  • the elastic force provided by the elastic member to the inner circuit board 3111 is the same.
  • the set of elastic elements 3112 is rotationally symmetrical to the center set by the inner circuit board 3111, that is, the set of elastic elements 3112 rotates around its center at a certain angle.
  • the inner circuit board 3111 is adapted to coincide with the original shape. Therefore, driven by an external force, the inner circuit board 3111 can translate relative to the outer circuit board 3113 and rotate within the plane where the inner circuit board 3111 is located.
  • the set of elastic elements 3112 is arranged axisymmetrically with respect to the center set by the inner circuit board 3111, so that the inner circuit board 3111 can be driven by an external force relative to the outer circuit board.
  • Plate 3113 translates as well as tilts.
  • the structure of the elastic component group 3112 may also be in other irregular shapes, and the present application is not limited thereto.
  • the outer circuit board 3113 has a rectangular structure with a rectangular through hole inside, and the inner circuit board 3111 has a rectangular structure and is located in the rectangular structure of the outer circuit board 3113. Inside the through hole, the four inner sides of the outer circuit board 3113 are respectively parallel to the four outer sides of the inner circuit board 3111 .
  • the elastic member group 3112 includes four elastic members, the four elastic members are respectively distributed around the four corners of the inner circuit board 3111, and are connected to one of the inner surfaces of the outer circuit board 3113 that is vertically distributed and One of the outer sides of the inner circuit board 3111 , that is, the inner side of the outer circuit board 3113 to which the elastic member is fixed is perpendicular to the outer side of the inner circuit board 3111 .
  • each of the elastic members includes at least one elastic arm 31120, and the at least one elastic arm 31120 is directed from the outer surface of the inner circuit board 3111 in a direction perpendicular to the outer surface. extending away from the inner circuit board 3111, then bending and extending in a direction parallel to the outer surface of the inner circuit board 3111, then bending and extending in a direction parallel to the other outer surface adjacent to the above outer surface, and finally Extending in a direction perpendicular to the other outer side and away from the inner circuit board 3111 to connect with the inner side of the outer circuit board 3113 .
  • the at least one elastic arm 31120 extends from the outer side of the inner circuit board 3111 to the inner side of the outer circuit board 3113 through three times of 90° (right angle) bending.
  • the gaps between the multiple elastic arms 31120 may be equal or unequal, depending on how the outer circuit board 3113 suspends the inner circuit.
  • the plate 3111 and the photosensitive chip 321 need to be electrically connected.
  • At least one electrical conducting line is provided on the elastic arm 31120 for providing electrical connection between the inner circuit board 3111 and the outer circuit board 3113 .
  • At least one electrical conducting line is provided on the elastic member for providing electrical connection between the inner circuit board 3111 and the outer circuit board 3113 .
  • each elastic arm 31120 includes a first elastic arm part 31120a, a second elastic arm part 31120b, a third elastic arm part 31120c and a fourth elastic arm part 31120d, so The first elastic arm part 31120a, the second elastic arm part 31120b, the third elastic arm part 31120c and the fourth elastic arm part 31120d are connected to each other (for example, they can be connected to each other by integral molding, It can also be connected to each other by bonding and fixing).
  • the first elastic arm part 31120a extends to a side away from the inner circuit board 3111 along a direction perpendicular to the outer surface of the inner circuit board 3111, and the second elastic arm part 31120b is connected to the first elastic arm
  • the part 31120a is vertically arranged and connected
  • the third elastic arm part 31120c is vertically arranged and connected to the second elastic arm part 31120b
  • the fourth elastic arm part 31120d is vertically arranged and connected to the third elastic arm part 31120c
  • the fourth elastic arm part 31120d is further connected to the outer circuit board 3113 to form the elastic arm 31120, and one or more elastic arms 31120 form an elastic member.
  • the outer side of the inner circuit board 3111 and the inner side of the outer circuit board 3113 connected by the elastic arm 31120 are adjacent and perpendicular to each other.
  • the four elastic members of the elastic member group 3112 are a first elastic member 31121 , a second elastic member 31122 , a third elastic member 31123 and a fourth elastic member 31124 .
  • the four adjacent inner surfaces of the outer circuit board 3113 are respectively the first inner surface 31131, the second inner surface 31132, the third inner surface 31133 and the fourth inner surface 31134 in counterclockwise order, and between adjacent inner surfaces perpendicular to each other;
  • the four adjacent outer surfaces of the inner circuit board 3111 are the first outer surface 31111, the second outer surface 31112, the third outer surface 31113 and the fourth outer surface 31114 in a counterclockwise order, and the adjacent outer surfaces perpendicular to each other.
  • the first inner side 31131 is parallel to the first outer side 31111
  • the second inner side 31132 is parallel to the second outer side 31112
  • the third inner side 31133 is parallel to the third outer side 31113 are parallel
  • the fourth inner side 31134 is parallel to the fourth outer side 31114 .
  • the first elastic member 31121 extends from the first outer side 31111 of the inner circuit board 3111 to the second inner side 31132 of the outer circuit board 3113 , and connects the inner circuit board 3111 and the outer circuit board 3113
  • the second elastic member 31122 extends from the second outer side 31112 of the inner circuit board 3111 to the third inner side 31133 of the outer circuit board 3113, and connects the inner circuit board 3111 and the outer circuit board 3113;
  • the third outer side 31113 of the inner circuit board 3111 extends toward the fourth inner side 31134 of the outer circuit board 3113, and connects the inner circuit board 3111 and the outer circuit board 3113;
  • the fourth outer side 31114 of 3111 extends toward the first inner side 31131 of the outer circuit board 3113 and connects the inner circuit board 3111 and the outer circuit board 3113 .
  • the base layer includes a PI layer (polyimide layer); then, form a metal layer on the PI layer side of the base layer, the material of the metal layer can be titanium copper or other alloys
  • the material of the metal layer can be titanium copper or other alloys
  • copper material is deposited on the PI layer side of the base layer to form an electrical conduction line; then, the base layer is divided by laser cutting, mechanical cutting, etching, etc.
  • At least one elastic arm 31120 is formed to constitute the elastic elements (the first elastic element 31121 , the second elastic element 31122 , the third elastic element 31123 and the fourth elastic element 31124 ).
  • the base layer has a certain degree of elasticity, so that the formed elastic arm 31120 is suitable for providing the resilience of the inner circuit board 3111.
  • no metal layer may be provided.
  • the base layer The bottom layer can contain multiple PI layers and realize the conduction of multi-layer lines.
  • the elastic member may further include an insulating layer wrapping the metal layer, so as to prevent a short circuit between the plurality of elastic arms 31120 in the elastic member.
  • the base layer including the PI layer is a component of a common rigid-flex board, which is a combination of a flexible circuit board and a rigid circuit board through processes such as pressing.
  • the elastic member of the circuit board 31 in the present application may be formed by part of the circuit board 31, for example, the circuit board 31 in the present application may include the outer circuit board 3113, the inner circuit board 3111 and the The soft and hard combination board of the flexible circuit board between the outer circuit board 3113 and the inner circuit board 3111 and electrically connected to the outer circuit board 3113 and the inner circuit board 3111 is cut by laser cutting, mechanical cutting, etching, etc.
  • the flexible circuit board of the circuit board 31 Divide the flexible circuit board of the circuit board 31 to form at least one elastic arm 31120 to form an elastic member.
  • four groups of the elastic members are formed to form a rotationally symmetrical elastic member.
  • the flexible circuit board of the circuit board 31 can be provided with other components such as a metal layer made of titanium copper or other alloys to improve the elasticity (K value) of the elastic member.
  • the chip anti-shake part 21 includes a chip anti-shake fixed part 211, a chip
  • the movable part 212 moves relative to the chip anti-shake fixed part 211 and the chip anti-shake electrical connection part (not shown in the figure), wherein the drive element is respectively connected to the chip anti-shake movable part 212 and
  • the chip anti-shake fixing part 211 and the chip anti-shake electrical connection part are electrically connected to the circuit board 31 and provide driving power for the chip anti-shake part 21 .
  • the chip anti-shake fixing part 211 has a receiving cavity, and the circuit board 311 is suspended and fixed in the receiving cavity, that is, the outer circuit board of the circuit board 311 3113 is fixed in the receiving cavity and the inner circuit board 3111 of the circuit board can move relative to the outer circuit board 3111 .
  • the chip anti-shake movable part 212 and the inner circuit board 3111 can be linked, for example, the chip anti-shake movable part 212 is installed and fixed on the inner circuit board of the circuit board 31 3111, so that when the driving element drives the chip anti-shake movable part 212 to move relative to the chip anti-shake fixed part 211, the inner circuit board 3111 of the circuit board 311 is relatively the outer circuit board 3113. move, so as to drive the photosensitive chip 321 mounted on the inner circuit board 3111 to move, and realize the anti-shake function of the chip.
  • the elastic member group 3112 of the circuit board 31 forms the suspension system of the chip anti-shake part 21, and the chip anti-shake movable part 212 passes through the elastic parts
  • the group 3112 is suspended in the chip anti-shake fixing part 211 .
  • the chip anti-shake movable part 212 is connected to the elastic member group 3112 through the inner circuit board 3111, and the chip anti-shake fixed part 211 is connected to the elastic member group 3112 through the outer circuit board 3113. connected, so that the elastic member group 3112 serves as a suspension system to suspend the chip anti-shake movable part 212 in the chip anti-shake fixed part 211 .
  • the chip anti-shake fixing part 211 includes a base 2111 and an upper cover 2112.
  • the upper cover 2112 has a rectangular through hole for providing the
  • the photosensitive chip 321 has a clear aperture to obtain the imaging light converged by the optical lens 10, and the base 2111 is fixedly connected to the upper cover 2112 to form a housing and a storage cavity to house and protect the chip from shaking and moving
  • the camera module components such as the part 212 , the driving element, and the photosensitive element 30 .
  • the outer circuit board 3113 of the circuit board 311 is clamped between the upper cover 2111 and the base 2112, in such a way that the circuit board 311 is suspended and fixed in the cavity of the chip anti-shake fixing part 211 . That is, in the embodiment of the present application, the outer circuit board 3113 of the circuit board 311 is clamped between the upper cover 2112 and the base 2111, so that the outer circuit board 3111 is relatively resistant to the chip.
  • the anti-shake fixing part 211 remains stationary, that is, the circuit board 311 is suspended and fixed in the cavity of the chip anti-shake fixing part 211 .
  • the anti-shake fixing part also includes a fixing carrier 2113 and two driving element fixing parts (for convenience of description, defined as the first driving element fixing part 2114 and the second driving element fixing part 2115), the fixing carrier 2113 is bonded Or integrally formed on the base 2111, the fixed carrier 2113 includes a fixed carrier body 21131 and two fixed carrier branches (the first fixed carrier branch 21132 and the second fixed carrier branch 21133), the two fixed carrier branches are connected to the fixed carrier main body 21131 by bonding or integrally forming.
  • the first driving element fixing part 2114 is fixed to the first fixed carrier branch 21132 by bonding or integral molding
  • the second driving element fixing part 2115 is fixed on the first fixed carrier branch 2115 by bonding or integral molding.
  • Two fixed carrier branches 21133 so that the fixed carrier 2113 is fixed to the driving element through the two driving element fixing parts.
  • the chip anti-shake movable part 212 includes a movable carrier 2121 and two driving element movable parts (for convenience of description, defined as the first driving element movable part 2122 and the second driving element movable part 2123), the
  • the movable carrier 2121 includes a movable carrier body 21211 for fixing with the inner circuit board 3111 and two movable carrier branches (the first movable carrier branch 21212 and the second The movable carrier branch 21213), the movable carrier branch is connected with the movable carrier main body 21211 through bonding or integral molding.
  • the movable carrier 2121 is bonded and fixed to the bottom surface of the inner circuit board 3111 of the circuit board 31 through the movable carrier body 21211 (the side on which the photosensitive chip is bonded to the circuit board is the front side, and the opposite side is the bottom surface. ), in other embodiments, the movable carrier 2121 can be integrally formed on the bottom surface of the inner circuit board 3111 through processes such as molding, or the movable carrier 2121 can also be the inner circuit board 3111 a part of.
  • the first driving element movable part 2122 is fixed to the first movable carrier branch 21212 through bonding or integral molding
  • the second driving element movable part 2123 is fixed to the first movable carrier branch 2123 through bonding or integral molding.
  • the second movable carrier branch 21213 so that the movable carrier 2121 is fixed to the driving element through two movable parts of the driving element.
  • the two fixed carrier branches are distributed on opposite corners of the inner circuit board 3111, and the two movable carrier branches are distributed on the other diagonal corner of the inner circuit board 3111, so that the two fixed carrier branches are connected to the inner circuit board 3111.
  • the two movable carrier branches are distributed on the four corners of the inner circuit board 3111, so that the two fixed parts of the driving element and the two movable parts of the driving element are located on the inner circuit board 3111 the four corners.
  • the driving element of the chip anti-shake part 21 includes four SMA (shape memory alloy) wires 213 (the first SMA wire 2131, the second SMA wire) respectively fixed between the fixed carrier branch and the movable carrier branch. 2132, the third SMA wire 2133 and the fourth SMA wire 2134), the two ends of the first SMA wire 2131 are respectively fixed to the first driving element fixing part 2114 and the first driving element movable part 2122, so Both ends of the second SMA wire 2132 are respectively fixed to the first driving element movable part 2122 and the second driving element fixing part 2115, and both ends of the third SMA wire 2133 are respectively fixed to the second The driving element fixing part 2115 and the second driving element movable part 2123, the two ends of the fourth SMA wire 2134 are respectively fixed on the second driving element movable part 2123 and the first driving element fixing part 2114 .
  • the first SMA wire 2131 , the second SMA wire 2132 , the third SMA wire 2133 and the fourth SMA wire 2134 are adjacent
  • each of the driving element fixing parts also includes two driving element fixing ends
  • the first driving element fixing part 2114 includes a first driving element fixing end 2114a and a second driving element fixing end 2114b
  • the second The driving element fixed part 2115 includes a third driving element fixed end 2115c and a fourth driving element fixed end 2115d
  • each of the driving element movable parts also includes two driving element movable ends
  • the first driving element movable part 2122 includes a first driving element movable end 2122a and a second driving element movable end 2122b
  • the second driving element movable part 2123 includes a third driving element movable end 2123c and a fourth driving element movable end 2123d.
  • Both ends of the first SMA wire 2131 are respectively fixed to the fixed end 2114b of the second driving element and the movable end 2122a of the first driving element, and both ends of the second SMA wire 2132 are respectively fixed to the second driving element.
  • the movable end 2122b of the second driving element and the fixed end 2115c of the third driving element, the two ends of the third SMA wire 2133 are respectively fixed on the fixed end 2115d of the fourth driving element and the movable end of the third driving element 2123c, the two ends of the fourth SMA wire 2134 are respectively fixed to the movable end 2123d of the fourth driving element and the fixed end 2114a of the first driving element.
  • first driving element fixing end 2114a and the second driving element fixing end 2114b of the first driving element fixing part 2114 may be electrically connected or not electrically connected; the third driving element fixing part 2115 of the second driving element The element fixed end 2115c and the fourth drive element fixed end 2115d can be electrically connected or not electrically connected; the first drive element movable end 2122a and the second drive element movable end 2122b of the first drive element movable part 2122 may be electrically connected or not electrically connected; the third driving element movable end 2123c of the second driving element movable part 2123 and the fourth driving element movable end 2123d may be electrically connected or not electrically connected. Not limited to this.
  • the gap between the four SMA wires 213 and the elastic member group 3112 is greater than 0.1mm.
  • the first SMA wire 2131, the second SMA wire 2132, the third SMA wire 2133 and the fourth SMA wire 2134 are located on the same plane, and this plane is the same as the The plane where the inner circuit board 3111 is located is parallel, so that the driving element is adapted to drive the inner circuit board 3111 to move in the plane where the inner circuit board 3111 is located by driving the deformation of the four SMA wires 213 .
  • the chip anti-shake fixed part 211 includes two of the driving element fixing parts 2114, 2115
  • the chip anti-shake movable part 212 includes two of the The driving element movable parts 2122, 2123, the two driving element fixing parts 2114, 2115 and the two driving element moving parts 2122, 2123 are located at the four corners of the housing cavity of the chip anti-shake fixing part 211 , and including four SMA wires 2131, 2132, 2133, 2134 extending between the two fixed parts of the driving element and the movable parts of the driving element as an example
  • the chip anti-shake fixing part 211 includes at least one driving element fixing part
  • the chip anti-shaking movable part 212 includes at least one driving element movable part
  • the at least one movable part of the driving element includes a first movable part 2122 of the driving element and a second movable part 2122 arranged on opposite sides of the movable carrier 2121.
  • the driving element movable part 2123, and the at least one driving element fixing part only includes one driving element fixing part, wherein the driving element fixing part is located between the first driving element movable part 2122 and the second driving element fixing part.
  • the at least one SMA wire 213 includes a first second movable part 2122 extending between the movable part 2122 of the driving element and the fixed part of the driving element.
  • An SMA wire 2131 and a second SMA wire 2132 extending between the second driving element movable part 2123 and the driving element fixing part.
  • a larger number or a smaller number of the SMA wires 213 are set, for example, can be used in the Two first SMA wires 2131 are arranged between the first driving element fixed part 2114 and the first driving element movable part 2122, or, between the first driving element movable part 2122 and the second Two SMA wires 2132 are arranged between the driving element fixing parts 2115, or two third SMA wires are arranged between the second driving element fixing part 2115 and the second driving element movable part 2123 2133, or, two fourth SMA wires 2134 are arranged between the second driving element movable part 2123 and the first driving element fixing part 2114, which is not limited by
  • the movable carrier 2121 includes a movable carrier body 21211 and a first movable carrier branch 21212 and a second movable carrier branch 21212 extending downward and outward from the movable carrier body 21211 respectively.
  • the movable carrier 2121 is implemented as a metal sheet, and the first movable carrier branch 21212, the second movable carrier branch 21213 and the movable carrier main body 21211 Integral molding, and by bending the first movable carrier branch 21212 and the second movable carrier branch 21213 so that the first movable carrier branch 21212 and the second movable carrier branch 21213 are relatively movable
  • the movable carrier body 21211 extends obliquely so as to adjust the height of the movable end of the driving element.
  • the four SMA wires 213 are located on the inner circuit board On the bottom side of the inner circuit board 3111, the four SMA wires 213 are lower than the bottom surface of the inner circuit board 3111. Specifically, as shown in FIG. 7 and FIG. 8, the four SMA wires 213 are located on the outside of the inner circuit board 3111, and the first SMA wire 2131 and the second SMA wire 2132, the fourth SMA wire Line 2134 is perpendicular and parallel to the third SMA line 2133 .
  • the lengths of the first SMA wire 2131, the second SMA wire 2132, the third SMA wire 2133 and the fourth SMA wire 2134 are equal, so that they are suitable for driving
  • the deformation of the four SMA wires 213 drives the inner circuit board 3111 to translate in the plane where the inner circuit board 3111 is located.
  • FIG. 8 illustrates a bottom view of the chip anti-shake portion 21 after removing the base 2111 and the upper cover 2112 .
  • the fixed carrier 2113, the movable carrier 2121 and the four SMA wires 213 are installed on the bottom side of the circuit board 31, and the four SMA wires 213 are located on The outside of the elastic element set 3112 reduces the risk of interference between the SMA wire 213 and the elastic element set 3112 .
  • the inner circuit board 3111 is fixed on the movable carrier 2121 in such a way that the inner circuit board 3111 is fixed on the chip anti-shake movable part 212, and the outer circuit board 3113 is passed through the
  • the base 2111 and the upper cover 2112 are clamped and fixed on the chip anti-shake fixing part 211, and there is a gap between the elastic member group 3112 of the circuit board 31 and the upper cover 2112, so as to prevent the elastic member from The group 3112 is deformed due to the impact, which affects the performance of the elastic member group 3112 .
  • the chip anti-shake fixing part 211 further includes a support 2116, the support 2116 is fixed to the base 2111 by bonding or integral molding, and the top surface of the support 2116 has A plane is provided to support the outer circuit board 3113 , so as to increase the stability of the outer circuit board 3113 fixed between the base 2111 and the upper cover 2112 .
  • the chip anti-shake part 21 also includes The ball assembly 214 between.
  • the ball assembly 214 includes at least three balls 2141 , and the at least three balls 2141 are used to reduce frictional resistance when the chip anti-shake movable part 212 moves relative to the chip anti-shake fixed part 211 .
  • the at least three balls 2141 are adapted to be arranged between the movable carrier 2121 and the base 2111, the at least three balls 2141 are used to provide support for the movable carrier 2121, and make the movable The frictional resistance experienced by the carrier 2121 when it translates relative to the base 2111 is reduced. That is, in the embodiment of the present application, the ball assembly 214 and the at least one SMA wire 213 are located between the base 2111 and the movable carrier 2121 .
  • the movable carrier 2121 is driven by the driving element,
  • the movable carrier 2121 is translated relative to the base 2111 by the four balls 2141 .
  • the fixed carrier main body 21131 of the fixed carrier 2113 has four ball grooves 211311, the four balls 2141 are accommodated in the four ball grooves 211311 respectively, and the balls 2141 protrude from the fixed carrier main body 21131 , so that the moving space of the four balls 2141 is limited in the four ball grooves 211311, and the balls 2141 are not easy to fall off.
  • the ball groove 211311 is a through groove or a through hole, so that the ball 2141 is suitable for directly contacting the base 2111 .
  • the ball groove 211311 is a groove, and the ball 2141 contacts the base 2111 indirectly through the bottom of the ball groove 211311 .
  • the inner circuit board 3111 and the outer circuit board 3113 are not on the same plane, that is, the plane where the inner circuit board 3111 is located and the plane where the outer circuit board 3113 is located There is a height difference so that the elastic component set 3112 is in a stretched state, and the elastic component set 3112 in the stretched state provides a pressing force for making the ball assembly 214 abut against the chip anti-shake fixing portion 211 .
  • the elastic member group 3112 of the circuit board 311 enables the at least three balls 2141 to be clamped between the movable carrier 2121 of the chip anti-shake movable part 212 and the chip anti-shake fixed part 211 In this way, the at least three balls 2141 are affected by forces in two directions.
  • the movable carrier 2121 is stationary relative to the chip anti-shake fixing part 211, the positions of the at least three balls 2141 are relatively stationary. In other words, The at least three balls 2141 are less likely to generate noise due to impact of the balls 2141 due to shaking of the camera module.
  • the present application there is a height difference between the plane where the inner circuit board 3111 is located and the plane where the outer circuit board 3113 is located.
  • the force in the direction of the inner circuit board 3111 makes the inner circuit board 3111 press the at least three balls 2141 in the ball assembly 214 through the movable carrier 2121, and the at least three balls 2141 are supported by the movable carrier 2121
  • the size is 20mN-50mN (mN) pressure.
  • the at least three balls 2141 are not easy to fall off; when the pressure is less than 50mN, the friction between the at least three balls 2141 and the movable carrier 2121 is small, and the at least three balls
  • the frictional force between 2141 and the base 2111 is relatively small, and when the movable carrier 2121 moves relative to the base 2111, the frictional resistance received by the movable carrier 2121 is relatively small, and the driving element (SMA line) the driving force requirements are reduced.
  • the force generated by the elastic member group 3112 along the Z-axis direction is affected by the height difference between the inner circuit board 3111 and the outer circuit board 3113, and the distance between the inner circuit board 3111 and the outer circuit board 3113 is The height difference between them is between 0.05mm-0.1mm.
  • the elastic force generated by the elastic member group 3112 along the Z-axis direction is not enough to prevent the at least three balls 2141 from falling off; when the height difference is greater than 0.1 mm, the elastic member group 3112 is Elasticity in the plane perpendicular to the Z-axis direction (XY plane) is affected.
  • the inner circuit board 3111 is higher than the outer circuit board 3113, and the elastic member group 3112 connects the inner circuit board 3111 and the outer circuit board 3113 obliquely upward, so that the inner circuit board 3111 3111 generates a downward force (that is, toward the direction of the ball 2141 ) through the elastic component set 3112 .
  • the distance between the inner circuit board 3111 and the base 2111 is greater than the distance between the outer circuit board 3113 and the base 2111, and the inner circuit board 3111 is fixed on the bottom surface of the inner circuit board 3111 by the
  • the movable carrier 2121 presses down the four balls 2141 on the base 2111 to prevent the balls 2141 from falling off.
  • the four balls 2141 support the movable carrier 2121 , and the movable carrier 2121 slides on the four balls 2141 .
  • the four balls 2141 have the same size, so that the four balls 2141 provide a plane where the movable carrier 2121 is parallel to the plane where the base 2111 is located, so that the movable The movable carrier 2121 moves (translates and/or rotates) on a plane parallel to the base 2111, and then the inner circuit board 3111 fixed to the movable carrier 2121 follows the movable carrier 2121 in contact with the Move (translate and/or rotate) in a plane parallel to the base 2111.
  • the flatness of the base 2111 and the dimensional accuracy of the balls 2141 can greatly affect the movement accuracy of the movable carrier 2121 .
  • the at least three balls 2141 are fixed to the base 2111 and/or the fixed carrier 2113 to prevent the at least three balls 2141 (ball assembly 214 ) from falling off.
  • the top surfaces of the at least three balls 2141 form a plane parallel to the inner circuit board 3111, so that the inner circuit board 3111 can translate in the plane where the inner circuit board is located.
  • the at least three balls 2141 are fixed to the base 2111 by bonding in the ball groove 211311, and the material of the balls 2141 is suitable for plastic, metal or other materials; or, the at least three The three balls 2141 are fixed on the fixed carrier body 21131 of the fixed carrier 2113 by bonding, and the material of the balls 2141 is suitable for plastic, metal or other materials; or, the at least three balls 2141 are in the fixed carrier body 21131.
  • the ball groove 211311 is fixed to the base 2111 by welding, the material of the balls 2141 is suitable for metal, and the material of the base 2111 is also a metal; or, the at least three balls 2141 are fixed by welding
  • the material of the ball 2141 is suitably made of metal, and the material of the fixed carrier 2113 is also made of metal.
  • the at least three balls 2141 are fixed to the movable carrier 2121 to prevent the at least three balls 2141 (ball assembly 214 ) from falling off.
  • the bottom surfaces of the at least three balls 2141 form a plane parallel to the inner circuit board 3111, so that the inner circuit board 3111 can translate in the plane where the inner circuit board is located.
  • the at least three balls 2141 are fixed to the movable carrier body 21211 of the movable carrier 2121 by bonding, and the material of the balls 2141 is suitable for plastic, metal or other materials; or, The at least three balls 2141 are fixed to the movable carrier body 21211 of the movable carrier 2121 by welding, the material of the balls 2141 is suitable for metal, and the material of the movable carrier 2121 is also metal .
  • the ball assembly 214 can also be replaced by a slider assembly, and the slider assembly includes at least three sliders.
  • the at least three sliders are integrally formed with the base, the at least three sliders protrude from the ball groove, and the top surfaces of the at least three sliders form a plane parallel to the inner circuit board 3111, so that Make the inner circuit board 3111 translate in the plane where the inner circuit board is located; or, the at least three sliders are integrally formed with the fixed carrier main body 21131 of the fixed carrier 2113, and the top surfaces of the at least three sliders A plane parallel to the inner circuit board 3111 is formed, so that the inner circuit board 3111 is translated in the plane where the inner circuit board is located; or, the at least three sliders and the movable carrier 2121
  • the moving carrier body 21211 is integrally formed, and the bottom surfaces of the at least three sliders form a plane parallel to the inner circuit board 3111, so that the inner circuit board 3111 can translate in the plane where the inner circuit board is located.
  • FIG. 5B shows another embodiment of the present application. The difference from the embodiment shown in FIG. Placed in the through hole and directly bonded and fixed to the movable carrier 2121, the height of the module is reduced.
  • the photosensitive chip 321 fixed on the movable carrier 2121 moves with the movable carrier 2121 .
  • the ball assembly 214 is located under the inner circuit board 3111, but not directly below the photosensitive chip 321, thereby avoiding the ball assembly 214
  • the ball assembly 214 causes the deformation of the movable carrier 2121, and directly or indirectly deforms the photosensitive chip 321 through the deformation of the inner circuit board 3111, so that the imaging of the camera module Degraded quality, such as field curvature problems in imaging.
  • the projection of the photosensitive chip 321 on the substrate 2111 does not overlap with the projection of the four balls 2141 of the ball assembly 214 on the substrate 2111 .
  • the inner circuit board 3111 has a photosensitive chip mounting area and a peripheral area surrounding the photosensitive chip mounting area, wherein the four balls 2141 correspond to the peripheral area, Through such position setting, the four balls 2141 are not located directly under the photosensitive chip 321 .
  • the four ball grooves 211311 are respectively located on the diagonal of the photosensitive chip 321 , and are respectively located outside the four corners of the photosensitive chip 321 .
  • the ball assembly 214 and the at least one SMA wire 213 are located between the base 2111 and the movable carrier 2121 . It should be understood that, in other examples of the present application, the ball assembly 214 and the at least one SMA wire 213 can also be disposed between the movable carrier 2121 and the chip anti-shake fixing part 211 in other ways, For example, the ball assembly 214 and the at least one SMA wire 213 are located between the upper cover 2112 and the movable carrier 2121, or the ball assembly 214 is arranged on the base 2111 and the movable carrier.
  • the at least one SMA wire is disposed between the carriers 2121 and between the base 2111 and the movable carrier 2121 , which is not limited by the present application.
  • the chip anti-shake movable part 212 further includes an anti-collision component 2124, and the anti-collision component 2124 has a frame structure.
  • the anti-collision component 2124 is fixed on the inner circuit board 3111 and corresponds to the upper cover 2112 of the chip anti-shake fixing part 211. The projections in the z-axis direction overlap.
  • the chip anti-shake fixing part 211 of the chip anti-shake part 21 is integrally formed with the lens driving and fixing part of the lens driving part 202, that is, the chip anti-shake fixing part 211 and the lens driving part 202 may share the same structural member, reducing the tolerance in the assembly process of the driving assembly 20 .
  • the upper cover 2112 of the chip anti-shake fixing part 211 is integrally formed with the lens driving fixing part.
  • the camera module based on the embodiment of the present application is clarified, wherein the drive assembly 20 of the camera module 1 uses the elastic component group 3112 of the circuit board 311 as the reset and limit element of the SMA driver, and the component Multiplexing is used to reduce the overall height and size of the chip anti-shake portion 21, and in this way, the anti-shake requirements and size requirements of the camera module are met.

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  • Adjustment Of Camera Lenses (AREA)

Abstract

公开了一种驱动组件和摄像模组，其中，所述驱动组件以线路板的弹性件组作为SMA驱动器的复位和限位元件，通过元件复用的方式来降低芯片防抖部的整体高度尺寸。并且，在所述驱动组件中，芯片防抖可动部和至少一SMA线设置于芯片防抖固定部的基底和内线路板之间，通过这样的位置布置，更为充分地利用所述芯片防抖固定部的内部空间以使得所述驱动组件的整体高度尺寸可被缩减。所述线路板的内线路板和外线路之间具有高度差以使得所述弹性件组处于拉伸状态，这样处于拉伸状态的所述弹性件组提供使得所述滚珠组件抵靠于所述芯片防抖固定部的迫紧力，以避免滚珠组件与芯片防抖固定部之间发生脱离而产生噪音。

Description

驱动组件和摄像模组 技术领域
本申请涉及摄像模组领域，尤其涉及一种驱动组件和摄像模组，其中，所述驱动组件以线路板的弹性件组作为SMA驱动器的复位和限位元件通过元件复用的方式来降低芯片防抖部的整体高度尺寸。
背景技术
随着移动电子设备的普及，被用于移动电子设备的用于帮助使用者获取影像(例如，视频或者图像)的摄像模组的相关技术得到了迅猛的发展和进步，并且在近年来，摄像模组在诸如医疗、安防、工业生产等诸多的领域都得到了广泛的应用。
目前在市场中消费者对于配置于移动电子设备的摄像模组的功能要求越来越高和多样化，例如，要求移动电子设备的摄像模组具有防抖功能。应可以理解，在使用移动电子设备进行摄像时，由于人体在正常情况下存在一定频率的生理震颤和由于运动产生的抖动会导致摄像效果不佳。因此，期待移动电子设备配有防抖装置以驱动光学镜头或感光芯片移动来实现光学防抖。
目前已有多种方案被应用于解决摄像模组的防抖问题，其中一个较大的技术难点为防抖结构会增加摄像模组的尺寸，这与移动电子设备朝着轻型化和薄型化的发展趋势相违背。
因此，期待一种优化的用于摄像模组的防抖结构，以满足防抖和结构设计的双重技术要求。
发明内容
本申请的一优势在于提供了一种驱动组件和摄像模组，其中，所述驱动组件以线路板的弹性件组SMA驱动器的复位和限位元件通过元件复用的方式来降低芯片防抖部的整体高度尺寸。
本申请的另一优势在于提供一种驱动组件和摄像模组，其中，所述线路板的内线路板和外线路之间具有高度差以使得所述弹性件组处于拉伸状态，这样处于拉伸状态的所述弹性件组提供使得所述滚珠组件抵靠于所述芯片防抖固定部的迫紧力，以避免滚珠组件与芯片防抖固定部之间发生脱离而产生噪音。
本申请的又一优势在于提供一种驱动组件和摄像模组，其中，所述滚珠组件的至少三滚珠形成一水平安装面以使得所述内线路板在水平面上发生移动，提高防抖的稳定性。
本申请的又一优势在于提供一种驱动组件和摄像模组，其中，在本申请一个具体示例中，芯片防抖可动部和至少一SMA线设置于芯片防抖固定部的基底和内线路板之间，通过这样的位置布置，更为充分地利用所述芯片防抖固定部的内部空间以使得所述驱动组件的整体高度尺寸可被缩减。
通过下面的描述，本申请的其它优势和特征将会变得显而易见，并可以通过权利要求书中特别指出的手段和组合得到实现。
为实现上述至少一优势，本申请提供一种驱动组件，其包括：
具有收容腔的芯片防抖固定部，所述芯片防抖固定部包括位于所述收容腔内的至少一驱动元件固定部；
位于所述收容腔内的芯片防抖可动部，所述芯片防抖可动部包括可动载体和可联动地连接于所述可动载体的至少一驱动元件可动部；
被悬持地固定于所述收容腔内的线路板，其中，所述线路板包括内线路板、外线路板和延伸于所述内线路板和所述外线路板之间的弹性件组，所述内线路板通过所述弹性件组被悬持地设置于所述外线路板内，且所述内线路板相对于所述外线路板可移动，其中，所述内线路板适于安装感光芯片，且所述内线路板被固定于所述芯片防抖可动部的可动载体；以及
驱动元件，包括延伸于所述至少一驱动元件固定部和所述至少一驱动元件可动部之间的至少一SMA线；
其中，在所述至少一SMA线被驱动时，所述至少一SMA线适于作动于所述至少一驱动元件可动部以带动所述芯片防抖可动部的可动载体从而带动所述线路板的内线路板相对于所述外线路板进行移动，通过这样的方式，适于带动安装于所述内线路板的该感光芯片进行移动，且所述线路板的 弹性件组适于将所述内线路板复位。
在根据本申请的驱动组件中，所述至少一驱动元件可动部包括相对设置的第一驱动元件可动部和第二驱动元件可动部，所述至少一驱动元件固定部包括相对设置的第一驱动元件固定部和第二驱动元件固定部，所述第一驱动元件固定部、所述第二驱动元件固定部、所述第一驱动元件可动部和所述第二驱动元件可动部位于所述收容腔的四个转角处；其中，所述至少一SMA线包括延伸于所述第一驱动元件固定部和所述第一驱动元件可动部的第一SMA线、延伸于所述第一驱动元件可动部和所述第二驱动元件固定部的第二SMA线、延伸于所述第二驱动元件固定部和所述第二驱动元件可动部的第三SMA线，以及，延伸于所述第二驱动元件可动部和所述第一驱动元件固定部的第四SMA线。
在根据本申请的驱动组件中，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线位于同一平面，且所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线所在的平面与所述内线路板所在的平面平行。
在根据本申请的驱动组件中，所述第一SMA线与所述第三SMA线平行，且所述第一SMA线与所述第二SMA线垂直，且所述第一SMA线与所述第四SMA线垂直，其中，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线具有相同的长度。
在根据本申请的驱动组件中，在所述驱动组件所设定的Z轴方向上，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线与所述弹性件组之间具有间隙，所述间隙大于等于0.1mm。
在根据本申请的驱动组件中，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线低于所述内线路板的底面。
在根据本申请的驱动组件中，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线位于所述内线路板的外侧。
在根据本申请的驱动组件中，所述防抖固定部包括基底和与所述基底相扣合的上盖，所述收容腔形成于所述上盖和所述基底之间。
在根据本申请的驱动组件中，所述线路板的外线路板被夹持于所述上盖和所述基底之间，通过这样的方式使得，所述线路板被悬持地固定于所述收容腔内。
在根据本申请的驱动组件中，所述线路板的弹性件组与所述上盖之间具有间隙。
在根据本申请的驱动组件中，所述芯片防抖可动部进一步包括固定于所述内线路板的顶面的防撞组件。
在根据本申请的驱动组件中，所述弹性件组包括第一弹性件、第二弹性件、第三弹性件和第四弹性件，所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件相对于所述内线路板所设定的中心以旋转对称的方式布置，其中，所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件分别围绕所述内线路板的四个转角分布，且所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件分别连接呈垂直分布的所述外线路板的其中一个内侧面和所述内线路板的其中一个外侧面。
在根据本申请的驱动组件中，所述芯片防抖固定部还包括叠置于所述基底的固定载体，所述固定载体包括固定载体主体和自所述固定载体分别相对地往外延伸的第一固定载体支部和第二固定载体支部，其中，所述第一驱动元件固定部和所述第二驱动元件固定部被分别安装于所述第一固定载体支部和所述第二固定载体支部。
在根据本申请的驱动组件中，所述芯片防抖固定部还包括设置于所述基底的支撑件，所述支撑件的顶面抵触于所述外线路板。
在根据本申请的驱动组件中，所述驱动组件进一步包括设置于所述可动载体和所述芯片防抖固定部之间的滚珠组件。
本申请提供一种驱动组件，其包括：
具有收容腔的芯片防抖固定部，所述芯片防抖固定部包括位于所述收容腔内的至少一驱动元件固定部；
位于所述收容腔内的芯片防抖可动部，所述芯片防抖可动部包括可动载体和可联动地连接于所述可动载体的至少一驱动元件可动部；
被悬持地固定于所述收容腔内的线路板，其中，所述线路板包括内线路板、外线路板和延伸于所述内线路板和所述外线路板之间的弹性件组，所述内线路板通过所述弹性件组被悬持地设置于所述外线路板内，其中，所述内线路板适于安装感光芯片，且所述内线路板被固定于所述芯片防抖可动部的可动载体；
驱动元件，包括延伸于所述至少一驱动元件固定部和所述至少一驱动元 件可动部之间的至少一SMA线；以及
被可移动地夹持于所述可动载体和所述芯片防抖固定部之间的滚珠组件，其中，所述内线路板和所述外线路板之间具有高度差以使得所述弹性件组处于拉伸状态，处于拉伸状态的所述弹性件组提供使得所述滚珠组件抵靠于所述芯片防抖固定部的迫紧力。
在根据本申请的驱动组件中，所述防抖固定部包括基底和与所述基底相扣合的上盖，所述收容腔形成于所述上盖和所述基底之间。
在根据本申请的驱动组件中，所述滚珠组件和所述至少一SMA线位于所述上盖和所述可动载体之间。
在根据本申请的驱动组件中，所述滚珠组件和所述至少一SMA线位于所述基底和所述可动载体之间。
在根据本申请的驱动组件中，所述内线路板高于所述外线路板。
在根据本申请的驱动组件中，所述内线路板与所述外线路板之间的高度差在0.05mm至0.1mm之间。
在根据本申请的驱动组件中，所述迫紧力的大小在20mN至50mN之间。
在根据本申请的驱动组件中，所述滚珠组件包括被滚动地夹持于所述基底和所述可移动载体之间的至少三滚珠，所述至少三滚珠的顶端形成与所述内线路板平行的平面。
在根据本申请的驱动组件中，所述内线路板的顶面具有感光芯片贴装区域和形成于所述感光芯片贴装区域外围的外围区域，其中，所述至少三滚珠对应于所述外围区域。
在根据本申请的驱动组件中，所述至少三滚珠固定于所述可动载体，或者，所述至少三滚珠固定于所述基底。
在根据本申请的驱动组件中，所述至少一驱动元件可动部包括相对设置的第一驱动元件可动部和第二驱动元件可动部，所述至少一驱动元件固定部包括相对设置的第一驱动元件固定部和第二驱动元件固定部，所述第一驱动元件固定部、所述第二驱动元件固定部、所述第一驱动元件可动部和所述第二驱动元件可动部位于所述收容腔的四个转角处；其中，所述至少一SMA线包括延伸于所述第一驱动元件固定部和所述第一驱动元件可动部的第一SMA线、延伸于所述第一驱动元件可动部和所述第二驱动元件固定部的第二SMA线、延伸于所述第二驱动元件固定部和所述第二驱动元件可动部的 第三SMA线，以及，延伸于所述第二驱动元件可动部和所述第一驱动元件固定部的第四SMA线。
在根据本申请的驱动组件中，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线位于同一平面，且所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线所在的平面与所述内线路板所在的平面平行，其中，所述第一SMA线与所述第三SMA线平行，且所述第一SMA线与所述第二SMA线垂直，且所述第一SMA线与所述第四SMA线垂直，其中，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线具有相同的长度。
在根据本申请的驱动组件中，在所述驱动组件所设定的Z轴方向上，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线与所述弹性件组之间具有间隙，所述间隙大于等于0.1mm。
在根据本申请的驱动组件中，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线位于所述内线路板的外侧。
在根据本申请的驱动组件中，所述芯片防抖固定部还包括叠置于所述基底的固定载体，所述固定载体包括固定载体主体和自所述固定载体分别相对地往外延伸的第一固定载体支部和第二固定载体支部，其中，所述第一驱动元件固定部和所述第二驱动元件固定部被分别安装于所述第一固定载体支部和所述第二固定载体支部，其中，所述可动载体包括可动载体主体和自所述可动载体主体分别相对地往下且往外延伸的第一可动载体支部和第二可动载体支部，其中，所述第一驱动元件可动部和所述第二驱动元件可动部分别安装于所述第一可动载体支部和所述第二可动载体支部。
在根据本申请的驱动组件中，所述固定载体主体具有用于收容所述至少三滚珠的至少三滚珠槽。
在根据本申请的驱动组件中，所述芯片防抖固定部还包括设置于所述基底的支撑件，所述支撑件的顶面抵触于所述外线路板。
在根据本申请的驱动组件中，所述线路板的弹性件组与所述上盖之间具有间隙，所述芯片防抖可动部进一步包括固定于所述内线路板的顶面的防撞组件。
在根据本申请的驱动组件中，所述弹性件组包括第一弹性件、第二弹性件、第三弹性件和第四弹性件，所述第一弹性件、所述第二弹性件、所述第 三弹性件和所述第四弹性件相对于所述内线路板所设定的中心以旋转对称的方式布置，其中，所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件分别围绕所述内线路板的四个转角分布，且所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件分别连接呈垂直分布的所述外线路板的其中一个内侧面和所述内线路板的其中一个外侧面。
本申请提供一种驱动组件，其包括：
具有收容腔的芯片防抖固定部，所述芯片防抖固定部包括位于所述收容腔内的至少一驱动元件固定部；
位于所述收容腔内的芯片防抖可动部，所述芯片防抖可动部包括可动载体和可联动地连接于所述可动载体的至少一驱动元件可动部；
被悬持地固定于所述收容腔内的线路板，其中，所述线路板包括内线路板、外线路板和延伸于所述内线路板和所述外线路板之间的弹性件组，所述内线路板通过所述弹性件组被悬持地设置于所述外线路板内，所述内线路板适于安装感光芯片且所述内线路板相对于所述外线路板可移动，其中，所述可动载体被附着于所述内线路板的底面；以及
驱动元件，包括延伸于所述至少一驱动元件固定部和所述至少一驱动元件可动部之间的至少一SMA线，所述至少一SMA线低于所述内线路板的底面；
其中，在所述至少一SMA线被驱动时，所述至少一SMA线适于作动于所述至少一驱动元件可动部以带动所述芯片防抖可动部的可动载体从而带动所述线路板的内线路板相对于所述外线路板进行移动，通过这样的方式，适于带动安装于所述内线路板的该感光芯片进行移动，且所述线路板的弹性件组适于将所述内线路板复位。
在根据本申请的驱动组件中，所述防抖固定部包括基底和与所述基底相扣合的上盖，所述收容腔形成于所述上盖和所述基底之间，其中，所述至少一SMA线和所述可动载体位于所述内线路板和所述基底之间。
在根据本申请的驱动组件中，所述至少一驱动元件可动部包括相对设置的第一驱动元件可动部和第二驱动元件可动部，所述至少一驱动元件固定部包括相对设置的第一驱动元件固定部和第二驱动元件固定部，所述第一驱动元件固定部、所述第二驱动元件固定部、所述第一驱动元件可动部和所述第二驱动元件可动部位于所述收容腔的四个转角处；其中，所述至少一SMA 线包括延伸于所述第一驱动元件固定部和所述第一驱动元件可动部的第一SMA线、延伸于所述第一驱动元件可动部和所述第二驱动元件固定部的第二SMA线、延伸于所述第二驱动元件固定部和所述第二驱动元件可动部的第三SMA线，以及，延伸于所述第二驱动元件可动部和所述第一驱动元件固定部的第四SMA线。
在根据本申请的驱动组件中，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线位于同一平面，且所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线所在的平面与所述内线路板所在的平面平行，其中，所述第一SMA线与所述第三SMA线平行，且所述第一SMA线与所述第二SMA线垂直，且所述第一SMA线与所述第四SMA线垂直，且所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线具有相同的长度。
在根据本申请的驱动组件中，在所述驱动组件所设定的Z轴方向上，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线与所述弹性件组之间具有间隙，所述间隙大于等于0.1mm。
在根据本申请的驱动组件中，所述线路板的外线路板被夹持于所述上盖和所述基底之间，通过这样的方式使得，所述线路板被悬持地固定于所述收容腔内。
在根据本申请的驱动组件中，所述线路板的弹性件组与所述上盖之间具有间隙，所述芯片防抖可动部进一步包括固定于所述内线路板的顶面的防撞组件。
在根据本申请的驱动组件中，所述驱动组件，进一步包括：被可移动地夹持于所述可动载体和所述基底之间的滚珠组件，其中，所述内线路板和所述外线路板之间具有高度差以使得所述弹性件组处于拉伸状态，处于拉伸状态的所述弹性件组提供使得所述滚珠组件抵靠于所述芯片防抖固定部的迫紧力。
在根据本申请的驱动组件中，所述内线路板高于所述外线路板。
在根据本申请的驱动组件中，所述内线路板与所述外线路板之间的高度差在0.05mm至0.1mm之间，所述迫紧力的大小在20mN至50mN之间。
在根据本申请的驱动组件中，所述滚珠组件包括被滚动地夹持于所述基底和所述可移动载体之间的至少三滚珠，所述至少三滚珠固定于所述可动载 体或者固定于所述基底。
在根据本申请的驱动组件中，所述内线路板的顶面具有感光芯片贴装区域和形成于所述感光芯片贴装区域外围的外围区域，其中，所述至少三滚珠对应于所述外围区域。
在根据本申请的驱动组件中，所述芯片防抖固定部还包括叠置于所述基底的固定载体，所述固定载体包括固定载体主体和自所述固定载体分别相对地往外延伸的第一固定载体支部和第二固定载体支部，其中，所述第一驱动元件固定部和所述第二驱动元件固定部被分别安装于所述第一固定载体支部和所述第二固定载体支部，其中，所述固定载体主体具有用于收容所述至少三滚珠的至少三滚珠槽。
在根据本申请的驱动组件中，所述可动载体包括可动载体主体和自所述可动载体主体分别相对地往下且往外延伸的第一可动载体支部和第二可动载体支部，其中，所述第一驱动元件可动部和所述第二驱动元件可动部分别安装于所述第一可动载体支部和所述第二可动载体支部。
在根据本申请的驱动组件中，所述芯片防抖固定部还包括设置于所述基底的支撑件，所述支撑件的顶面抵触于所述外线路板。
在根据本申请的驱动组件中，所述弹性件组包括第一弹性件、第二弹性件、第三弹性件和第四弹性件，所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件相对于所述内线路板所设定的中心以旋转对称的方式布置，其中，所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件分别围绕所述内线路板的四个转角分布，且所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件分别连接呈垂直分布的所述外线路板的其中一个内侧面和所述内线路板的其中一个外侧面。
根据本申请的另一方面，还提供了一种摄像模组，其包括：
光学镜头；
感光芯片；以及
如上所述的驱动组件，其中，所述感光芯片被安装于所述内线路板。
通过对随后的描述和附图的理解，本申请进一步的目的和优势将得以充分体现。
本申请的这些和其它目的、特点和优势，通过下述的详细说明，附图和 权利要求得以充分体现。
附图说明
通过结合附图对本申请实施例进行更详细的描述，本申请的上述以及其他目的、特征和优势将变得更加明显。附图用来提供对本申请实施例的进一步理解，并且构成说明书的一部分，与本申请实施例一起用于解释本申请，并不构成对本申请的限制。在附图中，相同的参考标号通常代表相同部件或步骤。
图1图示了根据本申请实施例的摄像模组的立体示意图。
图2图示了根据本申请实施例的所述摄像模组的感光组件和驱动组件的示意图。
图3图示了根据本申请实施例的所述感光组件和所述驱动组件的立体爆炸示意图。
图4A图示了根据本申请实施例的所述感光组件的线路板的示意图。
图4B图示了根据本申请实施例的所述线路板的局部放大示意图。
图5A图示了根据本申请实施例的所述驱动组件和所述感光组件的截面示意图。
图5B图示了根据本申请实施例的所述驱动组件和所述感光组件的一种变形实施例的截面示意图。
图6图示了根据本申请实施例的所述驱动组件的可动载体和固定载体的示意图。
图7图示了根据本申请实施例的所述可动载体和所述固定载体的俯视图。
图8图示了根据本申请实施例的所述驱动组件在去除基底后的仰视图。
图9图示了根据本申请实施例的所述驱动组件的基底、滚珠组件和芯片防抖固定部的立体示意图。
具体实施方式
下面，将参考附图详细地描述根据本申请的示例实施例。显然，所描述的实施例仅仅是本申请的一部分实施例，而不是本申请的全部实施例，应理解，本申请不受这里描述的示例实施例的限制。
示例性摄像模组
如图1至图9所示，根据本申请实施例的摄像模组1被阐明，其包括感光组件30、被保持于所述感光组件30的感光路径上的光学镜头10，以及用于驱动所述光学镜头10和/或所述感光组件30移动以实现光学性能调整的驱动组件20，例如，光学防抖、光学对焦等。
相应地，所述光学镜头10包括镜筒11和被安装于所述镜筒11内的镜片组12，所述镜片组12包括至少一光学镜片，所述至少一光学镜片的数量可以为一个或者多个，并不受限。所述感光组件30包括线路板31及电连接于线路板31的感光芯片321、电子元件322以及连接器，所述感光芯片321用于接收所述光学镜头10采集的外界光线成像并通过所述线路板31及所述连接器与外部移动电子设备电连接。
所述感光芯片321包括感光区和非感光区，所述感光芯片321通过位于所述非感光区的感光芯片焊盘电连接于所述线路板31，例如，所述感光芯片321可以通过引线键合(打金线)、焊接、FC工艺(芯片倒装)或者RDL(再布线层技术)等方式电连接于所述线路板31。所述感光芯片321适于通过黏合介质固定于所述线路板31的上表面(这里，在本申请实施例中，定义所述线路板31朝向镜头的表面定义为上表面)。在本申请一些示例中，为了降低所述摄像模组1的整体高度尺寸，将所述感光芯片321设置于所述线路板31的线路板通孔中，从而减少线路板31厚度对所述感光组件30厚度的影响，降低所述摄像模组1高度。
所述感光组件30进一步包括滤光元件324，所述滤光元件324被保持于所述感光芯片321的感光路径上，用于对进入所述感光芯片321的成像光线进行过滤。在一个具体的示例中，所述滤光元件324被安装于所述感光组件30的底座323上且对应于所述感光芯片321的至少感光区域，所述底座323被实施为单独成型的塑料支架，其通过黏合介质附着于所述线路板31的表面，并用于支撑其他部件，或者，所述底座323被实施为模塑底座，其通过模塑工艺一体成型于所述线路板31的预设位置，对此，并不为本申请所局限。值得一提的是，在本申请其他示例中，所述滤光元件324还能够被安装于所述摄像模组的其他位置，例如，所述滤光元件324形成于所述光学镜头10内(比如，作为一层滤光膜附着于所述光学镜头10的某片光学镜片的表 面)。
所述驱动组件20包括芯片驱动部分201，所述芯片驱动部分201可以包括芯片防抖部21，所述芯片防抖部21适于驱动所述感光组件30的感光芯片321在X轴方向和Y轴方向上平移和/或绕Z轴方向旋转，以实现所述感光组件30的平移防抖和/或旋转防抖；或者，所述芯片防抖部21适于驱动所述感光组件30的感光芯片321在绕X轴方向和绕Y轴方向旋转，以实现所述感光组件30的倾斜防抖。在本申请中，X轴方向和Y轴方向相互垂直，Z轴方向垂直于X轴方向和Y轴方向所在平面，换言之，X轴、Y轴和Z轴构成了三维立体坐标系。
在本申请一些示例中，所述芯片驱动部分201还包括芯片对焦部，也就是，所述芯片驱动部分201还可以驱动所述感光组件30的感光芯片321沿光轴(即Z轴方向)移动，实现芯片对焦功能。
在本申请的实施例中，所述芯片防抖部21和所述芯片对焦部可以是音圈马达、压电马达、SMA(形状记忆合金，Shape Memory Alloy)马达等类型的驱动马达。形状记忆合金是一种在加热升温后能完全消除其在较低的温度下发生的变形，恢复其变形前原始形状的合金材料。举例来说，当形状记忆合金在低于相变态温度下，受到一有限度的塑性变形后，可通过加热的方式，使其恢复到变形前的原始形状，其中，可以通过给SMA线通电实现SMA线加热。
在本申请一些具体示例中，所述驱动组件20还可以包括镜头驱动部分202，所述镜头驱动部分202包括镜头驱动固定部、镜头驱动可动部、连接所述镜头驱动固定部和所述镜头驱动可动部的镜头悬挂部以及驱动元件，所述光学镜头10安装于所述镜头驱动部分202的镜头驱动可动部，所述驱动元件驱动所述镜头驱动固定部和所述光学镜头10移动，以实现镜头防抖或者镜头对焦功能。
具体地，在本申请的一个实施方式中，所述镜头驱动部分202包括镜头对焦部，所述镜头对焦部适于驱动所述光学镜头10沿光轴移动实现镜头对焦功能；在本申请的另一个实施方式中，所述镜头驱动部分202包括镜头对焦部和镜头防抖部，从而所述镜头驱动部分202适于同时实现镜头对焦功能和镜头防抖功能；在本申请的再一个实施方式中，所述镜头驱动部分202仅包括镜头防抖部，从而所述镜头防抖部驱动所述光学镜头10移动实现镜头 防抖功能。值得一提的是，当所述镜头驱动部分202和所述芯片驱动部分201均具备防抖功能时，所述摄像模组适于同时实现镜头防抖和芯片防抖功能，实现“双OIS”功能，从而提升摄像模组的防抖效果。
在本申请的实施例中，所述镜头对焦部和所述镜头防抖部可以是音圈马达、压电马达、SMA(形状记忆合金，Shape Memory Alloy)马达等类型的驱动马达。当所述镜头防抖部是音圈马达时，所述驱动元件为线圈-磁石对；当所述镜头防抖部是压电马达时，所述驱动元件为压电元件；当所述镜头防抖部是SMA马达时，所述驱动元件为SMA线。
如图2至图9所示，根据本申请实施例的所述驱动组件的芯片防抖部被阐明，其中，图2为根据本申请实施例的所述摄像模组的感光组件和驱动组件的示意图，图3为根据本申请实施例的所述感光组件和所述驱动组件的立体爆炸示意图，图4A为根据本申请实施例的所述感光组件的线路板的示意图，图4B为根据本申请实施例的所述线路板的局部放大示意图，图5A为根据本申请实施例的所述驱动组件和所述感光组件的截面示意图，图5B为根据本申请实施例的所述驱动组件和所述感光组件的一种变形实施例的截面示意图，图6为根据本申请实施例的所述驱动组件的可动载体和固定载体的示意图，图7为根据本申请实施例的所述可动载体和所述固定载体的俯视图，图8为根据本申请实施例的所述驱动组件在去除基底后的仰视图，以及，图9为根据本申请实施例的所述驱动组件的基底、滚珠组件和芯片防抖固定部的立体示意图。
如图2和图3所示，在本申请实施例中，所述感光组件30包括线路板31及安装于所述线路板31上的安装件32、连接器。所述线路板31包括线路板主体311、连接带以及连接器部分(图中未示出连接带、连接器部分以及连接器)，所述连接器安装于所述连接器部分的端部，所述连接带连接所述线路板主体311和所述连接器部分并实现所述线路板主体311和所述连接器部分之间的电导通。
如图4A至图5所示，所述线路板主体311包括外线路板3113、内线路板3111以及连接所述外线路板3113和所述内线路板3111的弹性件组3112，所述安装件32适于安装于所述内线路板3111的上表面，所述安装件32包括电连接于所述内线路板3111的感光芯片321、电子元件322以及安装固定于所述内线路板3111的底座323和安装在所述底座323上的滤光元件324。 在本申请的一个实施方式中，所述内线路板3111上可以设有凹槽或者通孔(线路板通孔31115)，所述感光芯片321安装固定于所述内线路板3111的凹槽或者线路板通孔31115中，降低所述摄像模组高度。
也就是，在本申请实施例中，所述内线路板3111的上表面具有感光芯片贴装区域和包围所述感光芯片贴装的外围区域，其中，所述感光芯片321被贴装于所述感光芯片贴装区域，而所述电子元件322和所述底座323则被安装于所述外围区域。并且，在本申请实施例中，当所述内线路板3111的上表面部分凹陷以形成凹槽或通孔时，所述感光芯片贴装区域为所述凹槽或所述通孔。
如图4A所示，在本申请实施例中，所述外线路板3113围绕所述内线路板3111设置，所述外线路板3113与所述内线路板3111之间通过所述弹性件组3112连接，其中，所述内线路板3111通过所述弹性件组3112被悬持于所述外线路板3113内侧以形成弹性线路板，这样，所述内线路板3111可以在外力作用下相对所述外线路板3113之间移动(譬如，使所述内线路板3111相对所述外线路板3113平移、旋转或者倾斜等)，而当该外力消失时，可以依靠所述弹性件组3112的弹性，所述内线路板3111回复至初始位置。也就是，在本申请实施例中，所述线路板311相较于常规的线路板，至少具有如下特性：(1)所述线路板311的内线路板3111和外线路板3113之间相对可移动；(2)在所述内线路板3111相对所述外线路板3113发生移动后，所述弹性件组3112能够将所述内线路板3111回复至原始位置；(3)由于所述弹性件组3112的存在，所述线路板311的功能能被复用(会于后续描述中展开说明)。
进一步地，在本申请实施例中，所述弹性件组3112还适于电连接所述内线路板3111和所述外线路板3113，以使得安装于所述内线路板3111上的所述感光芯片321能够通过所述内线路板3111、所述弹性件组3112与所述外线路板3113电连接。也就是，在本申请实施例中，所述弹性件组3112不仅在结构上连接所述内线路板3111和所述外线路板3113，而且在电性上电连接所述内线路板3111和所述外线路板3113。
在本申请实施例中，所述弹性件组3112包括多个弹性件，优选地，所述多个弹性件之间的形状相同，并采用相同的材质，从而所述多个弹性件的每个弹性件提供给所述内线路板3111的弹力相同。在本申请的一个实施方 式中，所述弹性件组3112相对于所述内线路板3111所设定的中心呈旋转对称设置，也就是，所述弹性件组3112在绕其中心旋转一定角度后适于与原来的形状重合，因此，通过外力驱动，所述内线路板3111能够相对所述外线路板3113平移以及在所述内线路板3111所在平面内旋转。在本申请的另一个实施方式中，所述弹性件组3112相对于所述内线路板3111所设定的中心呈轴对称设置，从而能够通过外力驱动所述内线路板3111相对所述外线路板3113平移以及倾斜。所述弹性件组3112的结构也可以是其他不规则的形状，本申请并不为此所局限。
在如图4A和图4B所示意的示例中，所述外线路板3113呈矩形结构，其内侧具有一矩形通孔，所述内线路板3111呈矩形结构并位于所述外线路板3113的矩形通孔内侧，所述外线路板3113的四个内侧面与所述内线路板3111的四个外侧面分别平行。所述弹性件组3112包括四个弹性件，所述四个弹性件分别围绕所述内线路板3111的四个转角分布，且连接呈垂直分布的所述外线路板3113的其中一个内侧面和所述内线路板3111的其中一个外侧面，即，所述弹性件连接固定的所述外线路板3113的内侧面与所述内线路板3111的外侧面相互垂直。
更具体地，在本申请实施例中，每一所述弹性件包括至少一弹性臂31120，所述至少一弹性臂31120从所述内线路板3111的外侧面沿垂直于该外侧面的方向向远离所述内线路板3111的方向延伸，再向与所述内线路板3111外侧面平行的方向弯折延伸，再向与上述外侧面相邻的另一外侧面平行的方向弯折延伸，最后向垂直于该另一外侧面的方向向远离所述内线路板3111的方向延伸进而与所述外线路板3113的内侧面连接。换言之，所述至少一弹性臂31120从所述内线路板3111的外侧面向外通过三次90°(直角)的弯折延伸与所述外线路板3113的内侧面相连。在本申请中，所述至少一弹性臂31120的数量为多个时，多个弹性臂31120之间的间隙可以相等，也可以不相等，具体根据所述外线路板3113悬持所述内线路板3111以及所述感光芯片321电导通的需求而定。所述弹性臂31120上设有至少一电导通线路用于提供所述内线路板3111与所述外线路板3113之间的电连接。所述弹性件上设有至少一电导通线路用于提供所述内线路板3111与所述外线路板3113之间的电连接。
如图4B所示，在本申请实施例中，每一所述弹性臂31120包括第一弹 性臂部件31120a、第二弹性臂部件31120b、第三弹性臂部件31120c以及第四弹性臂部件31120d，所述第一弹性臂部件31120a、所述第二弹性臂部件31120b、所述第三弹性臂部件31120c以及所述第四弹性臂部件31120d之间相互连接(例如，可以通过一体成型的方式相互连接，也可以通过粘接固定的方式相互连接)。所述第一弹性臂部件31120a沿垂直于所述内线路板3111的外侧面的方向向远离所述内线路板3111的一侧延伸，所述第二弹性臂部件31120b与所述第一弹性臂部件31120a垂直设置并相连，所述第三弹性臂部件31120c与所述第二弹性臂部件31120b垂直设置并相连，所述第四弹性臂部件31120d与所述第三弹性臂部件31120c垂直设置并相连，所述第四弹性臂部件31120d进一步与所述外线路板3113相连，形成所述弹性臂31120，进而一个或者多个弹性臂31120组成一个弹性件。所述弹性臂31120连接的所述内线路板3111的外侧面及所述外线路板3113的内侧面相邻并相互垂直。
在本申请的一个示例中，所述弹性件组3112的四个弹性件分别是第一弹性件31121、第二弹性件31122、第三弹性件31123以及第四弹性件31124。所述外线路板3113的四个相邻的内侧面沿逆时针顺序分别是第一内侧面31131、第二内侧面31132、第三内侧面31133以及第四内侧面31134，相邻内侧面之间相互垂直；所述内线路板3111的四个相邻的外侧面逆时针顺序分别是第一外侧面31111、第二外侧面31112、第三外侧面31113以及第四外侧面31114，相邻外侧面之间相互垂直。所述第一内侧面31131与所述第一外侧面31111相平行，所述第二内侧面31132与所述第二外侧面31112相平行，所述第三内侧面31133与所述第三外侧面31113相平行，所述第四内侧面31134与所述第四外侧面31114相平行。
所述第一弹性件31121由所述内线路板3111的第一外侧面31111向所述外线路板3113的第二内侧面31132延伸，并连接所述内线路板3111和所述外线路板3113；所述第二弹性件31122由所述内线路板3111的第二外侧面31112向所述外线路板3113的第三内侧面31133延伸，并连接所述内线路板3111和所述外线路板3113；所述内线路板3111的第三外侧面31113向所述外线路板3113的第四内侧面31134延伸，并连接所述内线路板3111和所述外线路板3113；所述内线路板3111的第四外侧面31114向所述外线路板3113的第一内侧面31131延伸，并连接所述内线路板3111和所述外线 路板3113。
进一步地，对具有所述弹性件组3112的所述线路板31(第一弹性件31121、第二弹性件31122、第三弹性件31123以及第四弹性件31124)的一种制作方法进行说明。首先提供一基底层，所述基底层包括PI层(聚酰亚胺层)；然后，在所述基底层的PI层一侧形成金属层，所述金属层的材质可以为钛铜或者其他合金，例如，在所述基底层的PI层一侧沉积铜材料形成电导通线路；接着，再通过激光切割、机械切割、蚀刻等方式分割所述基底层，去除所述基底层不必要的部分，形成至少一弹性臂31120，从而构成弹性件(第一弹性件31121、第二弹性件31122、第三弹性件31123以及第四弹性件31124)。所述基底层具有一定的弹性，从而形成的所述弹性臂31120适于提供所述内线路板3111回复的弹力，在其他实施方式中，也可以不设置金属层，作为替代地，所述基底层中可以包含多个PI层并实现多层线路的导通。相应地，在本申请实施例中，所述弹性件还可以包括包裹所述金属层的绝缘层，以防止在所述弹性件中的多个弹性臂31120之间发生短路问题。
在上述实施方式中，包括PI层的基底层是常见的软硬结合板中的组成部分，软硬结合板是一种由柔性线路板和硬性线路板经过压合等工序组合在一起形成的具有柔性线路板特性与硬性线路板特性的线路板。换言之，本申请所述线路板31的弹性件可以通过所述线路板31的部分形成，例如本申请所述线路板31可以是包括所述外线路板3113、所述内线路板3111和位于所述外线路板3113和所述内线路板3111之间并电连接所述外线路板3113和所述内线路板3111的柔性线路板的软硬结合板，通过激光切割、机械切割、蚀刻等方式分割所述线路板31的柔性线路板形成至少一个弹性臂31120进而构成弹性件，在该实施方式中，通过去除柔性线路板不必要的一部分，形成四组所述弹性件，构成旋转对称的弹性件组3112。进一步地，所述线路板31的柔性线路板可以设置其他部件例如钛铜或者其他合金构成的金属层提升所述弹性件的弹性(K值)。
进一步地，在本申请实施例中，如图2至图9所示，所述芯片防抖部21包括芯片防抖固定部211、芯片防抖可动部212、用于驱动所述芯片防抖可动部212相对于所述芯片防抖固定部211移动的驱动元件以及芯片防抖电连接部(未有图示意)，其中，所述驱动元件分别连接所述芯片防抖可动部212和所述芯片防抖固定部211，所述芯片防抖电连接部与所述线路板31电连接 并提供所述芯片防抖部21驱动电源。具体地，在本申请实施例中，所述芯片防抖固定部211具有收容腔，所述线路板311被悬持地固定于所述收容腔内，即，所述线路板311的外线路板3113被固定于所述收容腔内且所述线路板的内线路板3111能够相对于所述外线路板3111可移动。进一步地，所述芯片防抖可动部212与所述内线路板3111之间可联动，例如，所述芯片防抖可动部212被安装固定于所述线路板31的所述内线路板3111，从而当所述驱动元件驱动所述芯片防抖可动部212相对于所述芯片防抖固定部211进行移动时，所述线路板311的内线路板3111相对所述外线路板3113发生移动，从而驱动安装于所述内线路板3111的所述感光芯片321移动，实现芯片防抖功能。
应注意到，在本申请实施例中，所述线路板31的所述弹性件组3112形成所述芯片防抖部21的悬持系统，所述芯片防抖可动部212通过所述弹性件组3112悬持在所述芯片防抖固定部211中。具体地，所述芯片防抖可动部212通过所述内线路板3111与所述弹性件组3112连接，所述芯片防抖固定部211通过所述外线路板3113与所述弹性件组3112连接，从而所述弹性件组3112作为悬挂系统使所述芯片防抖可动部212被悬挂于所述芯片防抖固定部211中。
图3和图5A示出了所述芯片防抖部21的具体结构，所述芯片防抖固定部211包括基底2111和上盖2112，所述上盖2112具有一矩形通孔用于提供所述感光芯片321通光孔径以获取经由所述光学镜头10汇聚的成像光线，所述基底2111与所述上盖2112固定连接，构成壳体并形成收容腔容置并保护所述芯片防抖可动部212、所述驱动元件以及所述感光组件30等摄像模组部件。在本申请实施例中，所述线路板311的外线路板3113被夹持于所述上盖2111和所述基底2112之间，通过这样的方式使得，所述线路板311被悬持地固定于所述芯片防抖固定部211的收容腔内。也就是，在本申请实施例中，所述线路板311的外线路板3113被夹持于所述上盖2112和所述基底2111之间，这样所述外线路板3111相对于所述芯片防抖固定部211保持不动，即，所述线路板311被悬持地固定于所述芯片防抖固定部211的收容腔内。
所述防抖固定部还包括固定载体2113和两个驱动元件固定部(为了便于说明，定义为第一驱动元件固定部2114和第二驱动元件固定部2115)， 所述固定载体2113通过粘接或者一体成型的方式固定于所述基底2111，所述固定载体2113包括固定载体主体21131及两个位于所述固定载体主体21131对角的固定载体支部(第一固定载体支部21132和第二固定载体支部21133)，两个所述固定载体支部通过粘接或者一体成型的方式与所述固定载体主体21131相连。所述第一驱动元件固定部2114通过粘接或者一体成型的方式固定于所述第一固定载体支部21132，所述第二驱动元件固定部2115通过粘接或者一体成型的方式固定于所述第二固定载体支部21133，从而所述固定载体2113通过所述两个驱动元件固定部与所述驱动元件固定。
所述芯片防抖可动部212包括可动载体2121及两个驱动元件可动部(为了便于说明，定义为第一驱动元件可动部2122和第二驱动元件可动部2123)，所述可动载体2121包括用于与所述内线路板3111固定的可动载体主体21211以及两个位于所述可动载体主体21211对角的可动载体支部(第一可动载体支部21212和第二可动载体支部21213)，所述可动载体支部通过粘接或者一体成型的方式与所述可动载体主体21211相连。所述可动载体2121通过所述可动载体主体21211粘接固定于所述线路板31的所述内线路板3111的底面(以线路板粘接感光芯片一侧为正面，相反侧即为底面)，在其他实施方式中，所述可动载体2121可以通过诸如模塑成型等工艺一体成型在所述内线路板3111底面，或者，所述可动载体2121也可以是所述内线路板3111的一部分。所述第一驱动元件可动部2122通过粘接或者一体成型的方式固定于所述第一可动载体支部21212，所述第二驱动元件可动部2123通过粘接或者一体成型的方式固定于所述第二可动载体支部21213，从而所述可动载体2121通过两个所述驱动元件可动部与所述驱动元件固定。
两个所述固定载体支部分布于所述内线路板3111的对角，两个所述可动载体支部分布于所述内线路板3111的另一个对角，从而两个所述固定载体支部与两个所述可动载体支部分布在所述内线路板3111的四个角落，从而两个所述驱动元件固定部与两个所述驱动元件可动部相间隔的位于所述内线路板3111的四角。
所述芯片防抖部21的驱动元件包括四根分别固定于所述固定载体支部和所述可动载体支部之间的SMA(形状记忆合金)线213(第一SMA线2131、第二SMA线2132、第三SMA线2133和第四SMA线2134)，所述第一SMA线2131的两端分别固定于所述第一驱动元件固定部2114与所述第一驱动元件 可动部2122，所述第二SMA线2132的两端分别固定于所述第一驱动元件可动部2122与所述第二驱动元件固定部2115，所述第三SMA线2133的两端分别固定于所述第二驱动元件固定部2115与所述第二驱动元件可动部2123，所述第四SMA线2134的两端分别固定于所述第二驱动元件可动部2123与所述第一驱动元件固定部2114。所述第一SMA线2131、所述第二SMA线2132、所述第三SMA线2133和所述第四SMA线2134呈逆时针相邻设置。
具体地，每个所述驱动元件固定部还包括两个驱动元件固定端，所述第一驱动元件固定部2114包括第一驱动元件固定端2114a以及第二驱动元件固定端2114b，所述第二驱动元件固定部2115包括第三驱动元件固定端2115c以及第四驱动元件固定端2115d；每个所述驱动元件可动部还包括两个驱动元件可动端，所述第一驱动元件可动部2122包括第一驱动元件可动端2122a以及第二驱动元件可动端2122b，所述第二驱动元件可动部2123包括第三驱动元件可动端2123c以及第四驱动元件可动端2123d。所述第一SMA线2131的两端分别固定于所述第二驱动元件固定端2114b与所述第一驱动元件可动端2122a，所述第二SMA线2132的两端分别固定于所述第二驱动元件可动端2122b与所述第三驱动元件固定端2115c，所述第三SMA线2133的两端分别固定于所述第四驱动元件固定端2115d与所述第三驱动元件可动端2123c，所述第四SMA线2134的两端分别固定于所述第四驱动元件可动端2123d与所述第一驱动元件固定端2114a。
其中，所述第一驱动元件固定部2114的第一驱动元件固定端2114a和第二驱动元件固定端2114b之间可以电连接或者不电连接；所述第二驱动元件固定部2115的第三驱动元件固定端2115c以及第四驱动元件固定端2115d之间可以电连接或者不电连接；所述第一驱动元件可动部2122的第一驱动元件可动端2122a以及第二驱动元件可动端2122b之间可以电连接或者不电连接；所述第二驱动元件可动部2123的第三驱动元件可动端2123c以及第四驱动元件可动端2123d之间可以电连接或者不电连接，本申请不为此所限。
在本申请的一个实施方式中，四根所述SMA线213与所述弹性件组3112之间存在间隙，以避免四根所述SMA线213与所述弹性件组3112干涉，在Z轴方向上，四根所述SMA线213与所述弹性件组3112之间的间隙大于0.1mm。
在本申请的一个实施方式中，所述第一SMA线2131、所述第二SMA线2132、所述第三SMA线2133和所述第四SMA线2134位于同一平面，且该平 面与所述内线路板3111所在平面平行，从而所述驱动元件适于通过驱动四根SMA线213形变驱动所述内线路板3111在所述内线路板3111所在平面内移动。
值得一提的是，虽然在本申请实施例中，以所述芯片防抖固定部211包括两个所述驱动元件固定部2114，2115、所述芯片防抖可动部212包括两个所述驱动元件可动部2122,2123，两个所述驱动元件固定部2114，2115和两个所述驱动元件可动部2122,2123位于所述芯片防抖固定部211的收容腔的四个转角处，且包括延伸于两个所述驱动元件固定部和两个所述驱动元件可动部之间的四根SMA线2131，2132，2133,2134为示例，应可以理解，在本申请实施例中，所述芯片防抖固定部211包括至少一个所述驱动元件固定部，所述芯片防抖可动部212包括至少一个所述驱动元件可动部，且包括延伸于所述至少一个驱动元件固定部和所述至少一个驱动元件可动部之间的至少一SMA线213即可。
例如，在本申请一个具体的示例中，所述至少一个所述驱动元件可动部包括相对地布置于所述可动载体2121的相对的两侧的第一驱动元件可动部2122和第二驱动元件可动部2123，而所述至少一驱动元件固定部仅包括一个所述驱动元件固定部，其中，所述驱动元件固定部位于所述第一驱动元件可动部2122和所述第二驱动元件可动部2123所设定的连接的中垂线上，并且，所述至少一SMA线213包括延伸于所述第一驱动元件可动部2122和所述驱动元件固定部之间的第一SMA线2131和延伸于所述第二驱动元件可动部2123和所述驱动元件固定部之间的第二SMA线2132。
当然，在本申请实施例中，在所述驱动元件可动部和所述驱动元件固定部的数量是确定的情况下(例如，包括如图7和图8所示意的第一驱动元件可动部2122、第二驱动元件可动部2123、第一驱动元件固定部2114和第二驱动元件固定部2115时)，设置更多数量或者更少数量的所述SMA线213，例如，可在所述第一驱动元件固定部2114和所述第一驱动元件可动部2122之间设置两根所述第一SMA线2131，或者，在所述第一驱动元件可动部2122和所述第二驱动元件固定部2115之间设置两根所述SMA线2132，或者，在所述第二驱动元件固定部2115和所述第二驱动元件可动部2123之间设置两根所述第三SMA线2133，或者，在所述第二驱动元件可动部2123和所述第一驱动元件固定部2114之间设置两根所述第四SMA线2134，对此， 并不为本申请所局限。
进一步地，如图6所示，在本申请实施例中，通过使所述第一可动载体支部21212和所述第二可动载体支部21213相对于所述可动载体主体21211向所述固定载体2113一侧倾斜设置(也就是，所述可动载体2121包括可动载体主体21211和自所述可动载体主体21211分别相对地往下且往外延伸的第一可动载体支部21212和第二可动载体支部21213)，使得固定于所述第一可动载体支部21212和所述第二可动载体支部21213的驱动元件可动端与固定于所述第一固定载体支部21132和所述第二固定载体支部21133的驱动元件固定端处于相同高度上。
例如，在本申请一个具体的示例中，所述可动载体2121被实施为金属片，所述第一可动载体支部21212、所述第二可动载体支部21213与所述可动载体主体21211一体成型，并通过弯折所述第一可动载体支部21212和所述第二可动载体支部21213以使得所述第一可动载体支部21212和所述第二可动载体支部21213相对于可动载体主体21211倾斜地延伸，从而调整驱动元件可动端的高度。
特别地，在本申请的一个实施方式中，四根所述SMA线213(第一SMA线2131、第二SMA线2132、第三SMA线2133和第四SMA线2134)位于所述内线路板3111的底面一侧，四根所述SMA线213低于所述内线路板3111底面。具体地，如图7及图8所示，四根所述SMA线213位于所述内线路板3111的外侧，所述第一SMA线2131与所述第二SMA线2132、所述第四SMA线2134垂直且与所述第三SMA线2133平行。在本申请的另一个实施方式中，所述第一SMA线2131、所述第二SMA线2132、所述第三SMA线2133和所述第四SMA线2134的长度相等，从而适于通过驱动四根SMA线213形变驱动所述内线路板3111在所述内线路板3111所在平面内平移。
图8图示了去除所述基底2111和所述上盖2112后的所述芯片防抖部21的仰视图。如图8所示，所述固定载体2113、所述可动载体2121与所述四根所述SMA线213安装于所述线路板31的底面一侧，并且，四根所述SMA线213位于所述弹性件组3112的外侧，降低所述SMA线213与所述弹性件组3112干涉的风险。
并且，所述内线路板3111固定于所述可动载体2121通过这样的方式，使得所述内线路板3111被固定于所述芯片防抖可动部212，所述外线路板 3113则通过所述基底2111和所述上盖2112夹持固定于所述芯片防抖固定部211，所述线路板31的所述弹性件组3112与所述上盖2112之间存在间隙，避免所述弹性件组3112由于撞击而产生影响所述弹性件组3112性能的形变。在本申请一些示例中，所述芯片防抖固定部211还包括一支撑件2116，所述支撑件2116通过粘接或者一体成型的方式固定于所述基底2111，所述支撑件2116顶面具有一平面以提供所述外线路板3113支撑，从而增加固定于所述基底2111和所述上盖2112之间的外线路板3113的稳定性。
为了使得所述可动载体2121的移动更为平滑，在本申请实施例中，所述芯片防抖部21还包括设置于所述芯片防抖固定部211和所述芯片防抖可动部212之间的滚珠组件214。所述滚珠组件214包括至少三滚珠2141，所述至少三滚珠2141用于减少芯片防抖可动部212相对芯片防抖固定部211移动时的摩擦阻力。具体地，所述至少三滚珠2141适于设置在所述可动载体2121和所述基底2111之间，所述至少三滚珠2141用于提供所述可动载体2121支撑，并使所述可动载体2121相对所述基底2111平移时受到的摩擦阻力减小。也就是，在本申请实施例中，所述滚珠组件214和所述至少一SMA线213位于所述基底2111和所述可动载体2121之间。
如图5A至图9所示，在本申请实施例中，所述可动载体2121和所述基底2111之间设有四个滚珠2141，所述可动载体2121在所述驱动元件驱动下，所述可动载体2121藉由所述四个滚珠2141在相对所述基底2111平移。所述固定载体2113的所述固定载体主体21131具有四个滚珠槽211311，所述四个滚珠2141分别容置于所述四个滚珠槽211311中，所述滚珠2141突出于所述固定载体主体21131，从而所述四个滚珠2141的移动空间被限制于所述四个滚珠槽211311中，所述滚珠2141不容易脱落。
在上述实施方式中，所述滚珠槽211311是一个通槽或者通孔，从而所述滚珠2141适于直接与所述基底2111接触。在其他实施方式中，所述滚珠槽211311是一个凹槽，所述滚珠2141通过所述滚珠槽211311的底部间接地与所述基底2111接触。
应特别注意到，在本申请实施例中，所述内线路板3111与所述外线路板3113不在同一平面上，也就是，所述内线路板3111所在平面与所述外线路板3113所在平面存在高度差以使得所述弹性件组3112处于拉伸状态，处于拉伸状态的所述弹性件组3112提供使得所述滚珠组件214抵靠于所述芯 片防抖固定部211的迫紧力。也就是，所述线路板311的弹性件组3112使得所述至少三滚珠2141被夹持于所述芯片防抖可动部212的所述可动载体2121与所述芯片防抖固定部211之间，这样所述至少三滚珠2141受到两个方向的力的作用，在所述可动载体2121相对所述芯片防抖固定部211静止时，所述至少三滚珠2141的位置相对静止，换言之，所述至少三滚珠2141不易由于所述摄像模组的晃动导致滚珠2141撞击产生噪音。
更具体地，在本申请的一个实施方式中，所述内线路板3111所在平面与所述外线路板3113所在平面存在高度差，所述弹性件组3112产生的沿Z轴(垂直于所述内线路板3111方向)方向的力使所述内线路板3111通过所述可动载体2121施压所述滚珠组件214中的至少三滚珠2141，所述至少三滚珠2141受到所述可动载体2121大小在20mN-50mN(毫牛)的压力。当该压力大于20mN时，所述至少三滚珠2141不易于脱落；当该压力小于50mN时，所述至少三滚珠2141与所述可动载体2121之间的摩擦力较小，所述至少三滚珠2141与所述基底2111之间的摩擦力较小，所述可动载体2121在相对所述基底2111移动时，所述可动载体2121受到的摩擦阻力较小，进而对所述驱动元件(SMA线)的驱动力的要求降低。
所述弹性件组3112产生沿Z轴方向的力的大小受所述内线路板3111与所述外线路板3113之间的高度差影响，所述内线路板3111与所述外线路板3113之间的高度差在0.05mm-0.1mm之间。当该高度差小于0.05mm时，所述弹性件组3112产生的沿Z轴方向的弹力不足以防止所述至少三滚珠2141脱落；当该高度差大于0.1mm时，所述弹性件组3112在垂直Z轴方向的平面(XY平面)上的弹性会受影响。
进一步参照图5A，所述内线路板3111高于所述外线路板3113，所述弹性件组3112倾斜向上地连接所述内线路板3111和所述外线路板3113，从而所述内线路板3111藉由所述弹性件组3112产生向下(即朝向滚珠2141方向)的力。所述内线路板3111与所述基底2111之间的距离大于所述外线路板3113与所述基底2111之间的距离，所述内线路板3111通过固定于所述内线路板3111底面的所述可动载体2121下压所述四个滚珠2141于所述基底2111，防止所述滚珠2141脱落。所述四个滚珠2141支撑所述可动载体2121，所述可动载体2121在所述四个滚珠2141上滑动。
在本申请的一些实施例中，所述四个滚珠2141具有相同的尺寸，从而 所述四个滚珠2141提供所述可动载体2121与所述基底2111所在平面相平行的平面，使所述可动载体2121在与所述基底2111相平行的平面上移动(平移和/或旋转)，进而与所述可动载体2121相固定的所述内线路板3111跟随所述可动载体2121在与所述基底2111相平行的平面上移动(平移和/或旋转)。所述基底2111的平整度以及所述滚珠2141的尺寸精度能够较大地影响所述可动载体2121的移动精度。
在本申请的一个实施方式中，所述至少三个滚珠2141与所述基底2111和/或所述固定载体2113相固定，避免所述至少三滚珠2141(滚珠组件214)脱落。所述至少三滚珠2141的顶面构成一与所述内线路板3111平行的平面，从而使所述内线路板3111在所述内线路板所在平面平移。例如，所述至少三个滚珠2141在所述滚珠槽211311中通过粘接的方式固定于所述基底2111，所述滚珠2141的材质适于为塑料、金属或者其他材质；或者，所述至少三个滚珠2141通过粘接的方式固定于所述固定载体2113的所述固定载体主体21131，所述滚珠2141的材质适于为塑料、金属或者其他材质；或者，所述至少三滚珠2141在所述滚珠槽211311中通过焊接的方式固定于所述基底2111，所述滚珠2141的材质适于为金属材质，所述基底2111的材质也是金属材质；或者，所述至少三滚珠2141通过焊接的方式固定于所述固定载体2113的所述固定载体主体21131，所述滚珠2141的材质适于为金属材质，所述固定载体2113的材质也是金属材质。
在本申请的一个实施方式中，所述至少三个滚珠2141与所述可移动载体2121相固定，避免所述至少三滚珠2141(滚珠组件214)脱落。所述至少三滚珠2141的底面构成一与所述内线路板3111平行的平面，从而使所述内线路板3111在所述内线路板所在平面平移。例如，所述至少三滚珠2141通过粘接的方式固定于所述可移动载体2121的所述可动载体主体21211相固定，所述滚珠2141的材质适于为塑料、金属或者其他材质；或者，所述至少三滚珠2141通过焊接的方式固定于所述可移动载体2121的所述可动载体主体21211，所述滚珠2141的材质适于为金属材质，所述可移动载体2121的材质也是金属材质。
在本申请的一个实施方式中，所述滚珠组件214还可以被替换为滑块组件，所述滑块组件包括至少三滑块。所述至少三滑块与所述基底一体成型，所述至少三滑块突出于所述滚珠槽，且所述至少三滑块的顶面构成一与所述 内线路板3111平行的平面，从而使所述内线路板3111在所述内线路板所在平面平移；或者，所述至少三滑块与所述固定载体2113的所述固定载体主体21131一体成型，所述至少三滑块的顶面构成一与所述内线路板3111平行的平面，从而使所述内线路板3111在所述内线路板所在平面平移；或者，所述至少三滑块与所述可移动载体2121的所述可动载体主体21211一体成型，所述至少三滑块的底面构成一与所述内线路板3111平行的平面，从而使所述内线路板3111在所述内线路板所在平面平移。
图5B示出了本申请的另一个实施方式，与图5a所示实施方式的不同之处在于，所述内线路板3111中间具有一通孔(线路板通孔31115)，所述感光芯片321容置于所述通孔中并直接粘接固定于所述可动载体2121，降低了模组的高度。当所述可动载体2121移动时，固定于所述可动载体2121上的所述感光芯片321随所述可动载体2121移动。
参照图5a及图5b，在本申请的一个实施方式中，所述滚珠组件214位于所述内线路板3111的下方，但不位于所述感光芯片321的正下方，从而避免所述滚珠组件214在受压时，所述滚珠组件214造成所述可动载体2121的形变，并直接或者间接地通过所述内线路板3111的形变使所述感光芯片321形变，使得所述摄像模组的成像品质降低，例如导致成像存在场曲问题。具体地，沿垂直于所述感光芯片321方向，所述感光芯片321在所述基底2111上的投影与所述滚珠组件214的四个滚珠2141在所述基底2111上的投影不重叠。也就是，在本申请实施例中，所述内线路板3111具有感光芯片贴装区域和包围所述感光芯片贴装区域的外围区域，其中，所述四个滚珠2141对应于所述外围区域，通过这样的位置设置使得所述四个滚珠2141不位于所述感光芯片321的正下方。
在本申请的一个实施方式中，所述四个滚珠槽211311分别位于所述感光芯片321的对角线上，且分别位于所述感光芯片321的四角之外。
值得一提的是，在如图1至图9所示意的示例中，所述滚珠组件214和所述至少一SMA线213位于所述基底2111和所述可动载体2121之间。应可以理解，在本申请其他示例中，所述滚珠组件214和所述至少一SMA线213还能够以其他方式被设置于所述可动载体2121和所述芯片防抖固定部211之间，例如，将所述滚珠组件214和所述至少一SMA线213位于所述上盖2112和所述可动载体2121之间，或者，将所述滚珠组件214设置于所 述基底2111和所述可动载体2121之间且将所述至少一SMA线设置于所述上盖2112和所述可动载体2121之间，或者，将所述滚珠组件214设置于所述上盖2112和所述可动载体2121之间且将所述至少一SMA线设置于所述基底2111和所述可动载体2121之间，对此，并不为本申请所局限。
进一步地，在本申请一些示例中，所述芯片防抖可动部212还包括防撞组件2124，所述防撞组件2124呈框型结构。所述防撞组件2124固定于所述内线路板3111并与所述芯片防抖固定部211的所述上盖2112对应，所述防撞组件2124在Z轴方向的投影与所述上盖2112在Z轴方向的投影重叠。当所述芯片防抖部21在受到撞击时，所述芯片防抖可动部212在沿Z轴方向移动时，所述芯片防抖可动部212在Z轴方向的移动距离受限，从而使所述芯片防抖可动部212不易脱落，所述滚珠组件214不易从所述滚珠槽211311中脱离。
在本申请的一个实施方式中，所述芯片防抖部21的所述芯片防抖固定部211与所述镜头驱动部分202的所述镜头驱动固定部一体成型，即所述芯片防抖固定部211与所述镜头驱动部分202的可以共用同一结构件，减小所述驱动组件20组装过程中的公差。在本申请的一个具体示例中，所述芯片防抖固定部211的所述上盖2112与所述镜头驱动固定部一体成型。
综上，基于本申请实施例的所述摄像模组被阐明，其中，所述摄像模组1的驱动组件20以线路板311的弹性件组3112作为SMA驱动器的复位和限位元件，通过元件复用的方式来降低芯片防抖部21的整体高度尺寸，通过这样的方式，来满足所述摄像模组的防抖需求和尺寸需求。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (53)

  1. 一种驱动组件，其特征在于，包括：
    具有收容腔的芯片防抖固定部，所述芯片防抖固定部包括位于所述收容腔内的至少一驱动元件固定部；
    位于所述收容腔内的芯片防抖可动部，所述芯片防抖可动部包括可动载体和可联动地连接于所述可动载体的至少一驱动元件可动部；
    被悬持地固定于所述收容腔内的线路板，其中，所述线路板包括内线路板、外线路板和延伸于所述内线路板和所述外线路板之间的弹性件组，所述内线路板通过所述弹性件组被悬持地设置于所述外线路板内，且所述内线路板相对于所述外线路板可移动，其中，所述内线路板适于安装感光芯片，且所述内线路板被固定于所述芯片防抖可动部的可动载体；以及
    驱动元件，包括延伸于所述至少一驱动元件固定部和所述至少一驱动元件可动部之间的至少一SMA线；
    其中，在所述至少一SMA线被驱动时，所述至少一SMA线适于作动于所述至少一驱动元件可动部以带动所述芯片防抖可动部的可动载体从而带动所述线路板的内线路板相对于所述外线路板进行移动，通过这样的方式，适于带动安装于所述内线路板的该感光芯片进行移动，且所述线路板的弹性件组适于将所述内线路板复位。
  2. 根据权利要求1所述的驱动组件，其中，所述至少一驱动元件可动部包括相对设置的第一驱动元件可动部和第二驱动元件可动部，所述至少一驱动元件固定部包括相对设置的第一驱动元件固定部和第二驱动元件固定部，所述第一驱动元件固定部、所述第二驱动元件固定部、所述第一驱动元件可动部和所述第二驱动元件可动部位于所述收容腔的四个转角处；其中，所述至少一SMA线包括延伸于所述第一驱动元件固定部和所述第一驱动元件可动部的第一SMA线、延伸于所述第一驱动元件可动部和所述第二驱动元件固定部的第二SMA线、延伸于所述第二驱动元件固定部和所述第二驱动元件可动部的第三SMA线，以及，延伸于所述第二驱动元件可动部和所述第一驱动元件固定部的第四SMA线。
  3. 根据权利要求2所述驱动组件，其中，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线位于同一平面，且所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线所在的平面与所述内线路板所在的平面平行。
  4. 根据权利要求3所述的驱动组件，其中，所述第一SMA线与所述第三SMA线平行，且所述第一SMA线与所述第二SMA线垂直，且所述第一SMA线与所述第四SMA线垂直，其中，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线具有相同的长度。
  5. 根据权利要求4所述的驱动组件，其中，在所述驱动组件所设定的Z轴方向上，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线与所述弹性件组之间具有间隙，所述间隙大于等于0.1mm。
  6. 根据权利要求5所述的驱动组件，其中，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线低于所述内线路板的底面。
  7. 根据权利要求6所述的驱动组件，其中，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线位于所述内线路板的外侧。
  8. 根据权利要求1所述的驱动组件，其中，所述防抖固定部包括基底和与所述基底相扣合的上盖，所述收容腔形成于所述上盖和所述基底之间。
  9. 根据权利要求8所述的驱动组件，其中，所述线路板的外线路板被夹持于所述上盖和所述基底之间，通过这样的方式使得，所述线路板被悬持地固定于所述收容腔内。
  10. 根据权利要求9所述的驱动组件，其中，所述线路板的弹性件组与所述上盖之间具有间隙。
  11. 根据权利要求10所述的驱动组件，其中，所述芯片防抖可动部进 一步包括固定于所述内线路板的顶面的防撞组件。
  12. 根据权利要求1所述的驱动组件，其中，所述弹性件组包括第一弹性件、第二弹性件、第三弹性件和第四弹性件，所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件相对于所述内线路板所设定的中心以旋转对称的方式布置，其中，所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件分别围绕所述内线路板的四个转角分布，且所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件分别连接呈垂直分布的所述外线路板的其中一个内侧面和所述内线路板的其中一个外侧面。
  13. 根据权利要求11所述的驱动组件，其中，所述芯片防抖固定部还包括叠置于所述基底的固定载体，所述固定载体包括固定载体主体和自所述固定载体分别相对地往外延伸的第一固定载体支部和第二固定载体支部，其中，所述第一驱动元件固定部和所述第二驱动元件固定部被分别安装于所述第一固定载体支部和所述第二固定载体支部。
  14. 根据权利要求11所述的驱动组件，其中，所述芯片防抖固定部还包括设置于所述基底的支撑件，所述支撑件的顶面抵触于所述外线路板。
  15. 根据权利要求1所述的驱动组件，进一步包括设置于所述可动载体和所述芯片防抖固定部之间的滚珠组件。
  16. 一种摄像模组，其特征在于，包括：
    光学镜头；
    感光芯片；以及
    如权利要求1至15任一所述的驱动组件，其中，所述感光芯片被安装于所述内线路板。
  17. 一种驱动组件，其特征在于，包括：
    具有收容腔的芯片防抖固定部，所述芯片防抖固定部包括位于所述收容 腔内的至少一驱动元件固定部；
    位于所述收容腔内的芯片防抖可动部，所述芯片防抖可动部包括可动载体和可联动地连接于所述可动载体的至少一驱动元件可动部；
    被悬持地固定于所述收容腔内的线路板，其中，所述线路板包括内线路板、外线路板和延伸于所述内线路板和所述外线路板之间的弹性件组，所述内线路板通过所述弹性件组被悬持地设置于所述外线路板内，其中，所述内线路板适于安装感光芯片，且所述内线路板被固定于所述芯片防抖可动部的可动载体；
    驱动元件，包括延伸于所述至少一驱动元件固定部和所述至少一驱动元件可动部之间的至少一SMA线；以及
    被可移动地夹持于所述可动载体和所述芯片防抖固定部之间的滚珠组件，其中，所述内线路板和所述外线路板之间具有高度差以使得所述弹性件组处于拉伸状态，处于拉伸状态的所述弹性件组提供使得所述滚珠组件抵靠于所述芯片防抖固定部的迫紧力。
  18. 根据权利要求17所述的驱动组件，其中，所述防抖固定部包括基底和与所述基底相扣合的上盖，所述收容腔形成于所述上盖和所述基底之间。
  19. 根据权利要求18所述的驱动组件，其中，所述滚珠组件和所述至少一SMA线位于所述上盖和所述可动载体之间。
  20. 根据权利要求18所述的驱动组件，其中，所述滚珠组件和所述至少一SMA线位于所述基底和所述可动载体之间。
  21. 根据权利要求20所述的驱动组件，其中，所述内线路板高于所述外线路板。
  22. 根据权利要求21所述的驱动组件，其中，所述内线路板与所述外线路板之间的高度差在0.05mm至0.1mm之间。
  23. 根据权利要求21所述的驱动组件，其中，所述迫紧力的大小在20mN至50mN之间。
  24. 根据权利要求22所述的驱动组件，其中，所述滚珠组件包括被滚动地夹持于所述基底和所述可移动载体之间的至少三滚珠，所述至少三滚珠的顶端形成与所述内线路板平行的平面。
  25. 根据权利要求24所述的驱动组件，其中，所述内线路板的顶面具有感光芯片贴装区域和形成于所述感光芯片贴装区域外围的外围区域，其中，所述至少三滚珠对应于所述外围区域。
  26. 根据权利要求24所述的驱动组件，其中，所述至少三滚珠固定于所述可动载体，或者，所述至少三滚珠固定于所述基底。
  27. 根据权利要求24所述的驱动组件，其中，所述至少一驱动元件可动部包括相对设置的第一驱动元件可动部和第二驱动元件可动部，所述至少一驱动元件固定部包括相对设置的第一驱动元件固定部和第二驱动元件固定部，所述第一驱动元件固定部、所述第二驱动元件固定部、所述第一驱动元件可动部和所述第二驱动元件可动部位于所述收容腔的四个转角处；其中，所述至少一SMA线包括延伸于所述第一驱动元件固定部和所述第一驱动元件可动部的第一SMA线、延伸于所述第一驱动元件可动部和所述第二驱动元件固定部的第二SMA线、延伸于所述第二驱动元件固定部和所述第二驱动元件可动部的第三SMA线，以及，延伸于所述第二驱动元件可动部和所述第一驱动元件固定部的第四SMA线。
  28. 根据权利要求27所述驱动组件，其中，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线位于同一平面，且所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线所在的平面与所述内线路板所在的平面平行，其中，所述第一SMA线与所述第三SMA线平行，且所述第一SMA线与所述第二SMA线垂直，且所述第一SMA线与所述第四SMA线垂直，其中，所述第一SMA线、所述第二SMA 线、所述第三SMA线和所述第四SMA线具有相同的长度。
  29. 根据权利要求28所述的驱动组件，其中，在所述驱动组件所设定的Z轴方向上，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线与所述弹性件组之间具有间隙，所述间隙大于等于0.1mm。
  30. 根据权利要求28所述的驱动组件，其中，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线位于所述内线路板的外侧。
  31. 根据权利要求27所述的驱动组件，其中，所述芯片防抖固定部还包括叠置于所述基底的固定载体，所述固定载体包括固定载体主体和自所述固定载体分别相对地往外延伸的第一固定载体支部和第二固定载体支部，其中，所述第一驱动元件固定部和所述第二驱动元件固定部被分别安装于所述第一固定载体支部和所述第二固定载体支部，其中，所述可动载体包括可动载体主体和自所述可动载体主体分别相对地往下且往外延伸的第一可动载体支部和第二可动载体支部，其中，所述第一驱动元件可动部和所述第二驱动元件可动部分别安装于所述第一可动载体支部和所述第二可动载体支部。
  32. 根据权利要求31所述的驱动组件，其中，所述固定载体主体具有用于收容所述至少三滚珠的至少三滚珠槽。
  33. 根据权利要求31所述的驱动组件，其中，所述芯片防抖固定部还包括设置于所述基底的支撑件，所述支撑件的顶面抵触于所述外线路板。
  34. 根据权利要求24所述的驱动组件，其中，所述线路板的弹性件组与所述上盖之间具有间隙，所述芯片防抖可动部进一步包括固定于所述内线路板的顶面的防撞组件。
  35. 根据权利要求17所述的驱动组件，其中，所述弹性件组包括第一弹性件、第二弹性件、第三弹性件和第四弹性件，所述第一弹性件、所述第 二弹性件、所述第三弹性件和所述第四弹性件相对于所述内线路板所设定的中心以旋转对称的方式布置，其中，所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件分别围绕所述内线路板的四个转角分布，且所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件分别连接呈垂直分布的所述外线路板的其中一个内侧面和所述内线路板的其中一个外侧面。
  36. 一种摄像模组，其特征在于，包括：
    光学镜头；
    感光芯片；以及
    如权利要求17至35任一所述的驱动组件，其中，所述感光芯片被安装于所述内线路板。
  37. 一种驱动组件，其特征在于，包括：
    具有收容腔的芯片防抖固定部，所述芯片防抖固定部包括位于所述收容腔内的至少一驱动元件固定部；
    位于所述收容腔内的芯片防抖可动部，所述芯片防抖可动部包括可动载体和可联动地连接于所述可动载体的至少一驱动元件可动部；
    被悬持地固定于所述收容腔内的线路板，其中，所述线路板包括内线路板、外线路板和延伸于所述内线路板和所述外线路板之间的弹性件组，所述内线路板通过所述弹性件组被悬持地设置于所述外线路板内，所述内线路板适于安装感光芯片且所述内线路板相对于所述外线路板可移动，其中，所述可动载体被附着于所述内线路板的底面；以及
    驱动元件，包括延伸于所述至少一驱动元件固定部和所述至少一驱动元件可动部之间的至少一SMA线，所述至少一SMA线低于所述内线路板的底面；
    其中，在所述至少一SMA线被驱动时，所述至少一SMA线适于作动于所述至少一驱动元件可动部以带动所述芯片防抖可动部的可动载体从而带动所述线路板的内线路板相对于所述外线路板进行移动，通过这样的方式，适于带动安装于所述内线路板的该感光芯片进行移动，且所述线路板的弹性件组适于将所述内线路板复位。
  38. 根据权利要求37所述的驱动组件，其中，所述防抖固定部包括基底和与所述基底相扣合的上盖，所述收容腔形成于所述上盖和所述基底之间，其中，所述至少一SMA线和所述可动载体位于所述内线路板和所述基底之间。
  39. 根据权利要求38所述的驱动组件，其中，所述至少一驱动元件可动部包括相对设置的第一驱动元件可动部和第二驱动元件可动部，所述至少一驱动元件固定部包括相对设置的第一驱动元件固定部和第二驱动元件固定部，所述第一驱动元件固定部、所述第二驱动元件固定部、所述第一驱动元件可动部和所述第二驱动元件可动部位于所述收容腔的四个转角处；其中，所述至少一SMA线包括延伸于所述第一驱动元件固定部和所述第一驱动元件可动部的第一SMA线、延伸于所述第一驱动元件可动部和所述第二驱动元件固定部的第二SMA线、延伸于所述第二驱动元件固定部和所述第二驱动元件可动部的第三SMA线，以及，延伸于所述第二驱动元件可动部和所述第一驱动元件固定部的第四SMA线。
  40. 根据权利要求39所述驱动组件，其中，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线位于同一平面，且所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线所在的平面与所述内线路板所在的平面平行，其中，所述第一SMA线与所述第三SMA线平行，且所述第一SMA线与所述第二SMA线垂直，且所述第一SMA线与所述第四SMA线垂直，且所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线具有相同的长度。
  41. 根据权利要求40所述的驱动组件，其中，在所述驱动组件所设定的Z轴方向上，所述第一SMA线、所述第二SMA线、所述第三SMA线和所述第四SMA线与所述弹性件组之间具有间隙，所述间隙大于等于0.1mm。
  42. 根据权利要求38所述的驱动组件，其中，所述线路板的外线路板被夹持于所述上盖和所述基底之间，通过这样的方式使得，所述线路板被悬 持地固定于所述收容腔内。
  43. 根据权利要求42所述的驱动组件，其中，所述线路板的弹性件组与所述上盖之间具有间隙，所述芯片防抖可动部进一步包括固定于所述内线路板的顶面的防撞组件。
  44. 根据权利要求38所述的驱动组件，其中，所述驱动组件，进一步包括：被可移动地夹持于所述可动载体和所述基底之间的滚珠组件，其中，所述内线路板和所述外线路板之间具有高度差以使得所述弹性件组处于拉伸状态，处于拉伸状态的所述弹性件组提供使得所述滚珠组件抵靠于所述芯片防抖固定部的迫紧力。
  45. 根据权利要求44所述的驱动组件，其中，所述内线路板高于所述外线路板。
  46. 根据权利要求45所述的驱动组件，其中，所述内线路板与所述外线路板之间的高度差在0.05mm至0.1mm之间，所述迫紧力的大小在20mN至50mN之间。
  47. 根据权利要求46所述的驱动组件，其中，所述滚珠组件包括被滚动地夹持于所述基底和所述可移动载体之间的至少三滚珠，所述至少三滚珠固定于所述可动载体或者固定于所述基底。
  48. 根据权利要求47所述的驱动组件，其中，所述内线路板的顶面具有感光芯片贴装区域和形成于所述感光芯片贴装区域外围的外围区域，其中，所述至少三滚珠对应于所述外围区域。
  49. 根据权利要求47所述的驱动组件，其中，所述芯片防抖固定部还包括叠置于所述基底的固定载体，所述固定载体包括固定载体主体和自所述固定载体分别相对地往外延伸的第一固定载体支部和第二固定载体支部，其中，所述第一驱动元件固定部和所述第二驱动元件固定部被分别安装于所述 第一固定载体支部和所述第二固定载体支部，其中，所述固定载体主体具有用于收容所述至少三滚珠的至少三滚珠槽。
  50. 根据权利要求46所述的驱动组件，其中，所述可动载体包括可动载体主体和自所述可动载体主体分别相对地往下且往外延伸的第一可动载体支部和第二可动载体支部，其中，所述第一驱动元件可动部和所述第二驱动元件可动部分别安装于所述第一可动载体支部和所述第二可动载体支部。
  51. 根据权利要求49所述的驱动组件，其中，所述芯片防抖固定部还包括设置于所述基底的支撑件，所述支撑件的顶面抵触于所述外线路板。
  52. 根据权利要求37所述的驱动组件，其中，所述弹性件组包括第一弹性件、第二弹性件、第三弹性件和第四弹性件，所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件相对于所述内线路板所设定的中心以旋转对称的方式布置，其中，所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件分别围绕所述内线路板的四个转角分布，且所述第一弹性件、所述第二弹性件、所述第三弹性件和所述第四弹性件分别连接呈垂直分布的所述外线路板的其中一个内侧面和所述内线路板的其中一个外侧面。
  53. 一种摄像模组，其特征在于，包括：
    光学镜头；
    感光芯片；以及
    如权利要求37至52任一所述的驱动组件，其中，所述感光芯片被安装于所述内线路板。
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