WO2023065795A1 - 一种透明led显示屏 - Google Patents

一种透明led显示屏 Download PDF

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Publication number
WO2023065795A1
WO2023065795A1 PCT/CN2022/112735 CN2022112735W WO2023065795A1 WO 2023065795 A1 WO2023065795 A1 WO 2023065795A1 CN 2022112735 W CN2022112735 W CN 2022112735W WO 2023065795 A1 WO2023065795 A1 WO 2023065795A1
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Prior art keywords
led lamp
power supply
transparent
lamp bead
chip
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PCT/CN2022/112735
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English (en)
French (fr)
Inventor
林谊
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深圳市晶泓科技有限公司
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Publication of WO2023065795A1 publication Critical patent/WO2023065795A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the application relates to the field of LED displays, in particular to transparent LED display screens.
  • Transparent LED displays have gradually been widely used in the market, and various product forms have been developed.
  • a transparent LED display technology that distributes LED lamp beads in an array on a transparent substrate has begun to appear.
  • a transparent LED display screen has been proposed as shown in Figure 1 and Figure 2, which includes a transparent substrate 1', a printed circuit layer 3' is provided on the transparent substrate 1', and an LED lamp bead with a driver chip is packaged.
  • the 2' array is installed on the transparent substrate 1'; then the glue layer 5' is formed by pouring glue on the surface of the transparent substrate 1' on which the LED lamp beads 2' are arranged; then the protective cover is covered on the surface of the glue layer 5' 4'.
  • the printed circuit layer 3' includes a lamp bead welding area 31', a power supply pad 32' and a signal pad 33', etc., and each lamp bead welding area 31' is provided with two The signal pin pads and the two electrode pin pads are connected in series through printed signal lines, and the two electrode pin pads with opposite polarities are respectively printed on the transparent substrate 1'.
  • the metal grid 30' is connected to the power pad 32' for power supply.
  • the pins of the LED lamp bead 2' are welded on the above-mentioned signal pin pads and electrode pin pads.
  • This method has a certain advantage that the metal grid 30' for power supply can be directly formed on the transparent substrate 1' as a power supply circuit through the printing process; the lamp bead welding area needs to be printed on it, and then the LED lamp bead 2' is welded on the lamp bead.
  • the electrical connection is made on the bead bonding area 31 ′.
  • the transparent substrate 1' is a PET (polyethylene terephthalate) substrate
  • the prior art needs to find a way to electrically connect the pins of the lamp bead 2' to the pad on the lamp bead welding area 31'
  • the usual practice is to overheat the tin furnace or use silver paste to connect, both of which need to be processed under high temperature conditions, and high temperature will deform or even melt PET.
  • the application provides a transparent LED display screen.
  • the application discloses a transparent LED display screen, which includes a transparent substrate and LED lamp beads; a circuit pattern is arranged on the transparent substrate; the LED lamp beads include a base bracket, a driving chip and a light-emitting chip; the LED lamp beads emit The light side is the front side, and the front side of the LED lamp bead is pasted on the transparent substrate;
  • a chip mounting surface is formed on the base bracket, the driving chip is mounted on the chip mounting surface, and the light-emitting chip is mounted on the driving chip or the chip mounting surface and is controlled by the driving chip;
  • the chip mounting surface includes an isolation channel and binding pads isolated from each other by the isolation channel, binding pins are provided on the back of the base bracket, and the binding pins are electrically connected to the binding pads, so
  • the binding pins include electrode pins; the electrode pins include a first electrode pin and a second electrode pin with opposite polarities;
  • the circuit pattern includes a power supply pad and a power supply line;
  • the power supply line includes a number of first power supply lines and second power supply lines with opposite polarities;
  • the power supply pad connects the first power supply line and the second power supply line line;
  • the first electrode pin is directly or indirectly bound to the first power supply line through a power jumper, and the second electrode pin is directly or indirectly bound to the second power supply line through a power jumper;
  • the transparent LED display disclosed in this application only needs to form a power supply circuit on the transparent substrate, and does not need to print and form the lamp bead welding area as in the prior art. It adopts the method of pasting to fix the LED lamp bead upside down on the transparent substrate , and then use a power jumper to directly or indirectly electrically connect each LED lamp bead to the power supply line, and replace the existing method of welding the LED lamp bead on the lamp bead welding area by the above method.
  • the binding pins also include input and output pins, and the input and output pins include signal input pins and signal output pins;
  • the circuit pattern also includes a signal pad; each of the LED lamp beads is bound and connected by a signal jumper to form a lamp bead string, wherein, the signal input pin of each of the LED lamp beads in the lamp bead string is passed through a signal
  • the jumper wire is connected to the signal pad or the signal output pin of the previous LED lamp bead; the signal output pin of each LED lamp bead is connected to the signal input pin of the next LED lamp bead through signal jumper binding .
  • the first electrode pins on each of the LED lamp beads are bound and connected to the first power supply line or the first electrode pins on the adjacent LED lamp beads through the power jumper. Electrode pins; the second electrode pins on each of the LED lamp beads are bound and connected to the second power supply line or the second electrode pins on the adjacent LED lamp beads through the power jumper; so that each The LED lamp bead can directly obtain power from the power supply line, or obtain power from its adjacent LED lamp bead.
  • the LED lamp bead is a CHIP type LED lamp bead
  • the base bracket in the CHIP type LED lamp bead is a circuit board
  • the copper foil on the front of the circuit board is etched to form the The chip mounting surface
  • the copper foil on the back of the circuit board is etched to form the binding pins
  • the binding pins are electrically connected to the chip mounting surface.
  • a driver chip is provided on the chip mounting surface of the CHIP type LED lamp bead, and the light-emitting chip is installed on the driver chip; the driver chip is packaged in a transparent sealing layer .
  • the LED lamp bead is a TOP type LED lamp bead;
  • the TOP type LED lamp bead includes a base bracket using a plastic bracket;
  • the chip mounting surface, the binding pins extend from the chip mounting surface, and are bent towards the bottom of the plastic bracket.
  • the light-emitting chip is installed on the driving chip by means of CSP or COC.
  • the power supply lines include a plurality of the first power supply lines and the second power supply lines arranged at intervals in rows or columns; the first power supply lines and the second power supply lines Several rows or columns of the LED lamp beads are arranged between the circuits; the above-mentioned LED lamp beads share the first power supply circuit and the second power supply circuit.
  • the power supply line is a conductive grid or an ITO conductive film or a nano-silver film.
  • a glue filling layer is provided on the transparent substrate on which the LED lamp beads are arranged, and the glue filling layer encapsulates each of the LED lamp beads; the upper surface of the glue filling layer The surface is provided with a protective cover.
  • the transparent LED display screen of the present application several transparent unit boards are arranged on the transparent substrate; the front side of the LED lamp bead is pasted on the transparent unit board; The strip serves as a power supply line; the LED lamp beads on each of the transparent unit boards are connected to the power supply line.
  • Fig. 1 is a schematic cross-sectional view of a transparent LED display disclosed in the prior art
  • Fig. 2 is a schematic top view of a transparent LED display disclosed in the prior art
  • Fig. 3 is a partial cross-sectional schematic diagram of a transparent LED display screen using CHIP type LED lamp beads provided in the specific embodiment of the present application;
  • Fig. 4 is a schematic top view of a transparent LED display using a CHIP type LED lamp bead provided in the specific embodiment of the application;
  • Fig. 5a is a schematic cross-sectional view of the CHIP type LED lamp bead in Fig. 3 and Fig. 4;
  • Fig. 5b is a three-dimensional schematic diagram of a CHIP type LED lamp bead provided in the specific mode of the present application;
  • Fig. 5c is a three-dimensional schematic diagram of the CHIP type LED lamp bead in Fig. 5b after further adding transparent encapsulation;
  • Fig. 5d is a schematic bottom view of the CHIP type LED lamp bead in Fig. 5c;
  • Fig. 6 is a schematic top view after further expansion of the transparent LED display screen using the CHIP type LED lamp bead provided in the specific embodiment of the application;
  • Fig. 7 is a schematic top view of another transparent LED display using CHIP LED lamp beads provided in the specific embodiment of the present application.
  • Fig. 8 is a schematic diagram of further deformation of the transparent LED display in Fig. 7;
  • Fig. 9 is a schematic partial cross-sectional view of the transparent LED display in Fig. 8;
  • Fig. 10 is a further expanded transparent LED display provided in the specific embodiment of the application.
  • Fig. 11 is a schematic cross-sectional view of a transparent display screen using a TOP type LED lamp bead in a specific embodiment of the present application;
  • Fig. 12a is a partially cut-away stereoscopic schematic diagram of the TOP type LED lamp bead in Fig. 11;
  • Fig. 12b is a schematic bottom view of the TOP type LED lamp bead in Fig. 12a;
  • Fig. 12c is a schematic cross-sectional view of the TOP type LED lamp bead in Fig. 12a.
  • Reference signs in the background technology are as follows: 1', transparent substrate; 2', LED lamp bead; 3', printed circuit layer; 4', protective cover plate; 5', glue filling layer; 31', lamp bead welding area ; 32', power pad; 33, signal pad; 30', metal grid;
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application in specific situations.
  • the transparent LED display disclosed in the present application includes a transparent substrate 1 and LED lamp beads 2; a circuit pattern 3 is arranged on the transparent substrate 1; the LED lamp beads 2 paste on the transparent substrate 1; the so-called paste refers to fixing with glue, and the glue can be various glues known to those skilled in the art, such as instant glue, epoxy resin bonding class, anaerobic glue, UV Glue hot melt adhesive, pressure sensitive adhesive, etc.
  • a glue-filling layer 5 is also provided on the transparent substrate 1 on which the LED lamp beads 2 are arranged, and the glue-filling layer 5 encapsulates each of the LED lamp beads 2 therein; the upper surface of the glue-filling layer 5 A protective cover 4 is provided. This is well known to those skilled in the art.
  • the light emitting surface of the existing LED lamp bead 2' is the front, and the existing LED lamp bead 2' is mounted on the transparent substrate 1', that is, the back of the LED lamp bead 2' is pasted on the transparent substrate 1'
  • the front of the LED light bead 2' faces the protective cover 4', and the light emitted by the LED light bead 2' is emitted through the protective cover 4'.
  • the LED lamp bead 2 includes a base bracket 22, a driving chip 21 and a light emitting chip 20; the LED lamp bead 2
  • the light emitting surface (the side exposing the light-emitting chip 20 ) is the front side, and the front side of the LED lamp bead 2 is pasted on the transparent substrate 1 .
  • the LED lamp bead 2 is pasted upside down on the transparent substrate 1, the front of the LED lamp bead 2 faces the transparent substrate 1, the back of the LED lamp bead 2 faces the protective cover 4, and the light emitted by the LED lamp bead 2 passes through the transparent substrate 1.
  • Substrate 1 is ejected.
  • the types of LED lamp bead 2 generally include two structures of CHIP type and TOP type. Wherein, the LED lamp beads 2 shown in Fig. 5a, Fig. 5b, Fig. 5c and Fig. 5d are CHIP type LED lamp beads, and Fig. 12a, Fig. 12b and Fig. 12c are TOP type LED lamp beads.
  • a chip mounting surface 23 is formed on the base bracket 22, the driving chip 21 is mounted on the chip mounting surface 23, and the light emitting chip 20 is mounted on the driver chip 21 (or the light-emitting chip 20 can also be installed on the chip mounting surface 23), and is controlled by the driver chip 21;
  • the chip mounting surface 23 includes an isolation channel 232 and a bonding pad 231 isolated from each other by the isolation channel 232, and the bonding pad 231 includes an electrode pad (not marked in the figure) and an input/output pad (not marked in the figure)
  • the electrode pads include the first electrode pads (not marked in the figure) and the second electrode pads (not marked in the figure) with opposite polarities;
  • the input and output pads include signal input pads (not marked in the figure) and signal The output pad (not marked in the figure);
  • the back of the base bracket 22 is provided with a binding pin 2311, and the binding pin 2311 is electrically connected to the binding pad 231;
  • the binding pin 2311 includes electrode pins and input and output leads pins; electrode pins include first electrode pins and second electrode pins with opposite polarities; input and output pins include signal input pins and signal output pins;
  • the circuit pattern 3 includes a power pad (not shown), a signal pad 33 and a power supply line 31;
  • the power supply line 31 includes a number of first power supply lines with opposite polarities 31a and the second power supply line 31b;
  • the power pad is connected to the first power supply line 31a and the second power supply line 31b;
  • the first electrode pin is directly or indirectly bound to the first power supply line 31a through the power jumper 311, and the second electrode pin is directly or indirectly bound to the second power supply line through the power jumper 311 31b;
  • Each of the LED lamp beads 2 is bound and connected by a signal jumper 32 to form a lamp bead string.
  • the power jumper 311 and the signal jumper 32 in this example are binding wires or bonding wires understood by those skilled in the art, and here they are only used to distinguish the devices, and they are named respectively.
  • the above-mentioned power jumper 311 and signal jumper 32 preferably have a diameter of 15 ⁇ m-70 ⁇ m and are made of gold wire, copper wire or alloy wire. Because of its small diameter, it is almost invisible to the naked eye. While the lamp bead 2 is working with current, it reduces the obstruction to the line of sight and improves the transparency of the product.
  • the power jumper 311 and the signal jumper 32 cross each other in the schematic diagram, they are bonded at different heights in the actual production process, and then fixed by glue filling, so there will be no collapse and short circuit Case.
  • the base bracket 22 in the CHIP type LED lamp bead is a circuit board, and the copper foil on the front of the circuit board is etched to form the chip mounting surface 23, that is, after the circuit board is etched, the etched place forms an isolated channel 232, a binding pad 231 is formed at the unetched part; the copper foil on the back of the circuit board is etched to form the binding pin 2311, and the binding pin 2311 is electrically connected to the chip mounting surface 23 .
  • the binding pins 2311 on the back of the circuit board are correspondingly connected to the binding pads 231 on the front of the circuit board (generally, the electrical connection is realized by way of via connection), that is, the first electrode pad is connected to the first electrode pin, and the second electrode pad is connected to the first electrode pin.
  • the electrode pads are connected to the second electrode pins, the signal input pads are connected to the signal input pins, and the signal output pads are connected to the signal output pins.
  • the light-emitting chip 20 is installed on the driving chip 21 ; the driving chip 21 is packaged in a transparent sealing layer 24 .
  • the transparent sealant layer 24 completely covers the chip mounting surface 23 .
  • the light-emitting chip 20 is installed on the driving chip 21 by means of CSP (English full name: Chip Scale Package, Chinese full name: Chip Scale Package). It can also be installed on the driver chip 21 by means of COC (full name in English: Chip On Chip, full name in Chinese: chip on chip).
  • the light-emitting chips 20 generally include light-emitting chips 20 of three colors: red, green and blue.
  • the power supply line 31 includes a plurality of the first power supply line 31a and the second power supply line 31b arranged at intervals in rows or columns; the first power supply line 31a and the second power supply line Several rows or columns of the LED lamp beads 2 are arranged between 31b; the above-mentioned LED lamp beads 2 share the first power supply line 31a and the second power supply line 31b.
  • the first power supply line 31a, the second power supply line 31b and the first power supply line 31a are arranged at intervals; wherein, there are 4 rows between the first power supply line 31a and the second power supply line 31b on the left side.
  • LED lamp beads 2 share the power supply line 31 of the same polarity, so that a circular arrangement can be made into a large-area transparent LED display screen.
  • Several LED lamp beads 2 sharing the power supply line 31 can reduce the number of power supply lines 31, reduce the obstruction to the line of sight, and help to improve the transparency of the display screen.
  • the present application is not limited to the implementation manner of the power supply line 31, which is not the core innovation content of the present application, and implementations known to those skilled in the art can be adopted.
  • the number of the first power supply line 31a and the second power supply line 31b can be There may be only one of them, or there may be a plurality of them, and the numbers of the first power supply lines 31a and the second power supply lines 31b may be the same or different.
  • the specific number depends on the power supply capacity of the power supply line 31 and the current demand of the LED lamp beads 2 between the first power supply line 31a and the second power supply line 31b. Generally, the number of LED lamp beads 2 is 3 Up to 8 columns is an ideal number.
  • each power supply line 31 may be straight, curved, or serpentine.
  • each power supply line 31 is arranged in a row or a column, and its implementation is not limited, as long as it can provide power supply.
  • it can be a metal layer etched on the transparent substrate 1, or a metal grid, it can also be a nano-silver coating or an ITO coating, or it can be a metal wire laid out in the applicant's previous patent application, or buried in Metal sheet in the transparent substrate 1 etc. realizes.
  • the power supply line 31 is a conductive grid.
  • the conductive grid can be a metal grid or ITO, and the dots in the figure are the binding points (electrical connection points) between the bonding wire and the metal grid or ITO.
  • Metal mesh or ITO has a large square resistance and relatively small conductivity, so a large area is required to meet the current demand.
  • the conductive grid is arranged on both sides of several rows of LED lamp beads 2, and the LED lamp beads 2 between the first power supply line 31a and the second power supply line 31b in the form of conductive grid share the above-mentioned first power supply line 31a and the second power supply line 31b.
  • the second power supply line 31b At this time, it is only necessary to paste the LED lamp bead 2 on the glass substrate.
  • the LED lamp bead 2 in order to enhance the conductivity of the conductive grid and expand the area of the conductive grid, the LED lamp bead 2 can be insulated and pasted on the conductive grid.
  • the left two rows of LED lamp beads 2 in the figure are arranged on the conductive grid of the first power supply line 31a
  • the right two rows of LED lamp beads 2 in the figure are arranged on the conductive grid of the second power supply line 31b. Since the conductive grid material is transparent, it has very little resistance to the light emission of the LED lamp beads, and can still ensure a good display effect.
  • the design of the power supply line 31 other forms of deformation are also possible.
  • several transparent unit boards 6 are arranged on the transparent substrate 1; On the board 6 ; both sides of each transparent unit board 6 are provided with metal strips as power supply lines 31 ; The power supply lines 31 on both sides are respectively a first power supply line 31a and a second power supply line 31b. In this way, there is no power supply line 31 on the surface of the transparent substrate 1 , but it is embedded between two transparent unit boards 6 .
  • the transparent unit panels 6 are mutually independent glass plates, and each transparent unit panel 6 is fixed on the whole transparent substrate 1 below.
  • the advantage of this method is that the cross-section of the metal strip is extremely small in the viewing direction of the screen, which can ensure sufficient current supply to several LED lamp beads 2 between the two power supply lines 31 with opposite polarities, which greatly reduces the impact of conductive materials on the screen.
  • the blocking of the line of sight improves the transparency of the screen.
  • TOP-type LED lamp beads can also be used to paste on the transparent substrate 1, as shown in Figures 12a, 12b, and 12c, the so-called TOP-type structure refers to the use of PLCC (full name in Chinese: belt The plastic chip carrier of lead wire; English full name: Plastic Leaded Chip Carrier) plastic support is used as the structure of base support 22 (English name housing, what Chinese has also claims base or support).
  • PLCC full name in Chinese: belt The plastic chip carrier of lead wire; English full name: Plastic Leaded Chip Carrier
  • base support 22 English name housing, what Chinese has also claims base or support.
  • the process is well known to the public, and generally includes metal strip punching, electroplating, PPA (polyphthalamide) injection molding, bending, five-sided three-dimensional inkjet and other processes.
  • the bonding pin 2311 in this example is no longer used for soldering, but for bonding connection. It binds the pin 2311 and bends towards the bottom of the plastic bracket.
  • the bonding pad 231 is actually a metal sheet of the same material as the bonding pin 2311. The metal sheet is stamped and formed, and the vacant place is filled with injection molding to form the isolation channel 232. The isolation channel 232 is actually an insulating plastic material.
  • the binding pins 2311 are separated from each other, and at the same time play the role of fixing the base bracket 22 .
  • the bonding pads 231 include electrode pads and input/output pads.
  • the ends of the binding pins 2311 are bent and attached to the back of the base bracket 22 to form a binding pin 2311 with a U-shaped structure as shown in the figure.
  • the driver chip 21 is known to the public. Generally, the driver chip 21 is internally integrated with a driver circuit, and a passivation layer is provided on the driver chip 21 .
  • the passivation layer is a surface insulating layer formed when the driver chip 21 is manufactured.
  • the driving chip 21 is provided with several pins (or called terminals), and the pins on the driving chip 21 are electrically connected to the chip mounting surface 23 and the light-emitting chip 20 through direct welding or through bonding wires.
  • the pin (English name: PAD) is generally arranged on the passivation layer, and the pin is a terminal inside the chip.
  • the transparent LED display disclosed in this application only needs to form a power supply circuit on the transparent substrate 1, and does not need to be printed to form a lamp bead welding area as in the prior art, so the production of the power supply circuit becomes simpler;
  • the shape of the circuit pattern is extremely simple, which greatly reduces the resistance and enhances the conductivity; it adopts the method of pasting to fix the LED lamp bead 2 upside down on the transparent substrate 1, and then uses the power supply
  • the jumper wire 311 directly or indirectly electrically connects each LED lamp bead 2 to the power supply line 31, and uses the signal jumper wire 32 to realize the serial connection of the LED lamp beads 2, and replaces the conventional welding of the LED lamp beads 2 on the The way on the lamp bead soldering area.
  • the LED lamp bead 2 can be firmly bonded at room temperature, and the bonding and wiring are also carried out at room temperature, thus avoiding the high temperature environment and providing a very good solution for the production of flexible transparent screens with PET as the substrate.
  • the adoption of this method greatly improves the transparency of the transparent LED display.
  • This method provides a variety of choices for the material of the transparent substrate 1 , such as glass, plastic, and film materials, and the processing conditions are simple, and ideal effects can be easily achieved.

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Abstract

为克服现有技术中采用在透明基板上印刷灯珠焊区较难实现，且灯珠焊区容易脱落的问题，本申请提供了一种透明LED显示屏,包括透明基板及LED灯珠；所述透明基板上布设有电路图案；所述LED灯珠倒装粘贴于所述透明基板上；所述LED灯珠出射光线的面为正面，所述LED灯珠的正面粘贴于所述透明基板上；本申请公开的透明LED显示屏，其采用倒装粘贴的方式将LED灯珠倒装固定在透明基板上，然后采用电源跳线将各LED灯珠直接或间接电连接至供电线路，采用信号跳线实现LED灯珠的串接，通过上述方式以取代现有将LED灯珠焊接在灯珠焊区上的方式。容易实施，且LED灯珠固定牢固，不容易脱落。

Description

一种透明LED显示屏
本申请要求于2021年10月22日提交中国专利局、申请号为202111234659.X，发明名称为“一种透明LED显示屏”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及LED显示器领域，尤其指透明LED显示屏。
背景技术
透明的LED显示屏在市场中逐渐得到广泛的应用，并发展出各种产品形态。一种在透明基板上阵列分布LED灯珠的透明LED显示屏技术开始出现。现有提出了如图1、图2所示的方案透明LED显示屏，其包括透明基板1’，所述透明基板1’上设有印制电路层3’，封装有驱动芯片的LED灯珠2’阵列安装于该透明基板1’上；然后通过在布置了LED灯珠2’的透明基板1’表面灌胶形成灌胶层5’；然后在灌胶层5’的表面覆盖保护盖板4’。
如图2所示，具体的，该印制电路层3’上包括灯珠焊区31’、电源焊盘32’和信号焊盘33’等，各灯珠焊区31’内设有两个信号引脚焊盘和两个电极引脚焊盘，其信号引脚焊盘通过印刷信号线路进行串接，而极性相反的两个电极引脚焊盘分别通过印刷在透明基板1’上的金属网格30’连通电源焊盘32’进行供电。LED灯珠2’的引脚焊接在上述信号引脚焊盘和电极引脚焊盘上。
该种方式有一定好处就是通过印刷工艺可以直接在透明基板1’上形成供电的金属网格30’作为供电电路；需要在其上印刷灯珠焊区，然后将LED灯珠2’焊接在灯珠焊区31’上进行电连接，然而在透明基板1’上形成灯珠焊区31’在工 艺上较难实现，同时该灯珠焊区31’容易脱落。如果透明基板1’是PET(聚对苯二甲酸乙二醇酯)基材，则现有技术需要想办法让灯珠2’的引脚与灯珠焊区31’上的焊盘电性连接，通常做法是过高温锡炉或者使用银浆连接，均需要在高温条件下加工，而高温会让PET变形甚至融化。
申请内容
为克服现有技术中采用在透明基板上印刷灯珠焊区较难实现，且灯珠焊区容易脱落的问题，本申请提供了一种透明LED显示屏。
本申请公开了一种透明LED显示屏，包括透明基板及LED灯珠；所述透明基板上布设有电路图案；所述LED灯珠包括底座支架、驱动芯片及发光晶片；所述LED灯珠出射光线的面为正面，所述LED灯珠的正面粘贴于所述透明基板上；
所述底座支架上形成有芯片安装面，所述驱动芯片安装于所述芯片安装面上，所述发光晶片安装于所述驱动芯片或者所述芯片安装面上，受所述驱动芯片的控制；
所述芯片安装面包括隔离河道及通过隔离河道相互隔离的绑定焊盘，所述底座支架的背面设置有绑定引脚，所述绑定引脚与所述绑定焊盘电连接，所述绑定引脚包括电极引脚；所述电极引脚包括极性相反的第一电极引脚和第二电极引脚；
所述电路图案包括电源焊盘及供电线路；所述供电线路包括若干极性相反的第一供电线路和第二供电线路；所述电源焊盘连接所述第一供电线路和所述第二供电线路；
所述第一电极引脚通过电源跳线直接或间接绑定至所述第一供电线路，所述第二电极引脚通过电源跳线直接或间接绑定至所述第二供电线路；
本申请公开的透明LED显示屏，只需透明基板上形成供电电路，无需再像现有技术中一样需要印刷形成灯珠焊区，其采用粘贴的方式将LED灯珠倒装固 定在透明基板上，然后采用电源跳线将各LED灯珠直接或间接电连接至供电线路，通过上述方式以取代现有将LED灯珠焊接在灯珠焊区上的方式。采用上述LED灯珠倒装粘贴固定的方式，无需考虑LED灯珠与透明基板之间的电性连接，仅用胶水即可实现，在实际生产中容易实施，且LED灯珠固定牢固，不容易脱落，采用电源跳线实现各灯珠的供电，在工艺上也容易实施。同时，采用该种方式，还极大的提高了透明LED显示屏的透明度。此种方式为透明基板的材质提供了多样性选择，可选择玻璃、塑料、薄膜材质，加工条件简单，均容易实现理想效果。
在本申请上述透明LED显示屏中，所述绑定引脚还包括输入输出引脚，所述输入输出引脚包括信号输入引脚和信号输出引脚；
所述电路图案还包括信号焊盘；各所述LED灯珠通过信号跳线绑定连接形成灯珠串，其中，所述灯珠串中的各所述LED灯珠的信号输入引脚通过信号跳线连接至所述信号焊盘或者前一LED灯珠的信号输出引脚；各所述LED灯珠的信号输出引脚通过信号跳线绑定连接至后一LED灯珠的信号输入引脚。
在本申请上述透明LED显示屏中，各所述LED灯珠上的第一电极引脚通过所述电源跳线绑定连接至所述第一供电线路、或者其邻近LED灯珠上的第一电极引脚；各所述LED灯珠上的第二电极引脚通过所述电源跳线绑定连接至所述第二供电线路、或者其邻近LED灯珠上的第二电极引脚；使得各LED灯珠可以直接从所述供电线路取电、或者从其邻近的LED灯珠上取电。
在本申请上述透明LED显示屏中，所述LED灯珠为CHIP型LED灯珠，所述CHIP型LED灯珠中的底座支架为电路板，所述电路板正面的铜箔被蚀刻后形成所述芯片安装面，所述电路板背面的铜箔被蚀刻后形成所述绑定引脚，所述绑定引脚与所述芯片安装面电连接。
在本申请上述透明LED显示屏中，所述CHIP型LED灯珠的芯片安装面上设有驱动芯片，所述发光晶片安装于所述驱动芯片；所述驱动芯片封装于一透明封胶层中。
在本申请上述透明LED显示屏中，所述LED灯珠为TOP型LED灯珠；所述TOP型LED灯珠包括采用塑胶支架的底座支架；所述塑胶支架的表面上通过金属料带形成所述芯片安装面，所述芯片安装面上延伸出绑定引脚，并向所述塑胶支架的底部弯折。
在本申请上述透明LED显示屏中，所述发光晶片通过CSP或COC方式安装于所述驱动芯片上。
在本申请上述透明LED显示屏中，所述供电线路包括若干呈行、或者列间隔设置的所述第一供电线路和所述第二供电线路；所述第一供电线路和所述第二供电线路之间设有若干行、或者列所述LED灯珠；上述LED灯珠共用所述第一供电线路和所述第二供电线路。
在本申请上述透明LED显示屏中，所述供电线路为导电网格或ITO导电膜或纳米银薄膜。
在本申请上述透明LED显示屏中，布置有所述LED灯珠的透明基板上设有灌胶层，所述灌胶层将各所述LED灯珠封装在其中；所述灌胶层的上表面设有保护盖板。
在本申请上述透明LED显示屏中，所述透明基板上设有若干透明单元板；所述LED灯珠的正面粘贴在所述透明单元板上；各所述透明单元板的两侧设置有金属条作为供电线路；各所述透明单元板上的LED灯珠连接至所述供电线路。
附图说明
图1是现有技术中公开的一种透明LED显示屏的剖视示意图；
图2是现有技术中公开的一种透明LED显示屏的俯视示意图；
图3是本申请具体实施方式中提供的一种采用CHIP型LED灯珠的透明LED显示屏的局部剖视示意图；
图4是本申请具体实施方式中提供的一种采用CHIP型LED灯珠的透明 LED显示屏的俯视示意图；
图5a是图3、图4中CHIP型LED灯珠的剖视示意图；
图5b是本申请具体方式中提供的一种CHIP型LED灯珠立体示意图；
图5c是图5b中CHIP型LED灯珠进一步增加透明封装后的立体示意图；
图5d是图5c中CHIP型LED灯珠的仰视示意图；图6是本申请具体实施方式中提供的采用CHIP型LED灯珠的透明LED显示屏进一步扩展后的俯视示意图；
图7是本申请具体实施方式中提供的采用CHIP型LED灯珠的另一种透明LED显示屏的俯视示意图；
图8是图7中透明LED显示屏进一步变形的示意图；
图9是图8中透明LED显示屏的局部剖视示意图；
图10是本申请具体实施方式中提供的一种进一步扩展的一种透明LED显示屏；
图11是本申请具体实施方式中一种采用TOP型LED灯珠的透明显示屏的剖视示意图；
图12a是图11中TOP型LED灯珠的局部剖视立体示意图；
图12b是图12a中TOP型LED灯珠的仰视示意图；
图12c是图12a中TOP型LED灯珠的剖视示意图。
背景技术中附图标记如下：1’、透明基板；2’、LED灯珠；3’、印制电路层；4’、保护盖板；5’、灌胶层；31’、灯珠焊区；32’、电源焊盘；33、信号焊盘；30’、金属网格；
具体实施方式中附图标记：1、透明基板；2、LED灯珠；3、电路图案；4、保护盖板；5、灌胶层；6、透明单元板；20、发光晶片；21、驱动芯片；22、底座支架；23、芯片安装面；24、透明封胶层；231、绑定焊盘；232、隔离河道；31、供电线路；31a、第一供电线路；31b、第二供电线路；32、信号跳线；33、信号焊盘；311、电源跳线；2311、绑定引脚。
具体实施方式
为了使本申请所解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本申请，并不用于限定本申请。
在本申请的描述中，需要理解的是，术语“纵向”、“径向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
实施例
本例将对本申请公开的透明LED显示屏进行具体解释如下，如图3所示，其包括透明基板1及LED灯珠2；所述透明基板1上布设有电路图案3；所述LED灯珠2粘贴于所述透明基板1上；所谓的粘贴指的是用胶水固定，胶水可以为本领域技术人员所公知的各种胶水，比如瞬间胶、环氧树脂粘结类、厌氧胶水、UV胶水热熔胶、压敏胶等。
一般还在布置有所述LED灯珠2的透明基板1上设有灌胶层5，所述灌胶层5将各所述LED灯珠2封装在其中；所述灌胶层5的上表面设有保护盖板 4。此为本领域技术人员所公知。
由图1可知，现有LED灯珠2’的出射光线的面为正面，现有的LED灯珠2’正装在透明基板1’上，即LED灯珠2’的背面粘贴在透明基板1’上，LED灯珠2’的正面朝向保护盖板4’，LED灯珠2’发出的光线透过保护盖板4’射出。
如图5a、图5b、图5c、图5d和图12a、图12b、图12c两种方式，所述LED灯珠2包括底座支架22、驱动芯片21及发光晶片20；所述LED灯珠2出射光线的面(露出所述发光晶片20的一侧面)为正面，LED灯珠2的正面粘贴于透明基板1。本例中的LED灯珠2倒装粘贴在透明基板1上，LED灯珠2的正面朝向透明基板1，LED灯珠2的背面朝向保护盖板4，LED灯珠2发出的光线透过透明基板1射出。LED灯珠2的类型通常包括CHIP型和TOP型两种结构。其中，图5a、图5b、图5c和图5d所示的LED灯珠2为CHIP型LED灯珠，图12a、图12b和图12c为TOP型LED灯珠。
以CHIP型LED灯珠为例，如图5b和图5c所示，所述底座支架22上形成有芯片安装面23，所述驱动芯片21安装于所述芯片安装面23上，所述发光晶片20安装于所述驱动芯片21上(或者也可以为将发光晶片20安装所述芯片安装面23上)，受所述驱动芯片21的控制；
其中，芯片安装面23包括隔离河道232及通过隔离河道232相互隔离的绑定焊盘231，绑定焊盘231包括电极焊盘(图中未标记)及输入输出焊盘(图中未标记)；电极焊盘包括极性相反的第一电极焊盘(图中未标记)和第二电极焊盘(图中未标记)；输入输出焊盘包括信号输入焊盘(图中未标记)和信号输出焊盘(图中未标记)；底座支架22的背面设置有绑定引脚2311，绑定引脚2311与绑定焊盘231电连接；绑定引脚2311包括电极引脚及输入输出引脚；电极引脚包括极性相反的第一电极引脚和第二电极引脚；输入输出引脚包括信号输入引脚和信号输出引脚；
如图3-图4所示，所述电路图案3包括电源焊盘(图中未示出)、信号焊盘33及供电线路31；所述供电线路31包括若干极性相反的第一供电线路31a 和第二供电线路31b；所述电源焊盘连接所述第一供电线路31a和所述第二供电线路31b；
所述第一电极引脚通过电源跳线311直接或间接绑定至所述第一供电线路31a，所述第二电极引脚通过电源跳线311直接或间接绑定至所述第二供电线路31b；
各所述LED灯珠2通过信号跳线32绑定连接形成灯珠串，其中，所述灯珠串中的各所述LED灯珠2的信号输入引脚通过信号跳线32连接至信号焊盘33或者前一LED灯珠2的信号输出引脚；各所述LED灯珠2的信号输出引脚通过信号跳线32绑定连接至后一LED灯珠2的信号输入引脚。若当前LED灯珠2后无其他LED灯珠2，则信号输出引脚空接或者返回连接至信号焊盘。
关于绑定引脚2311与供电线路31的直接或间接连接，下面进行具体解释如下，如图3、图4所示，各所述LED灯珠2上的第一电极引脚通过电源跳线311绑定连接至所述第一供电线路31a、或者其邻近LED灯珠2上的第一电极引脚；各所述LED灯珠2上的第二电极引脚通过电源跳线311绑定连接至所述第二供电线路31b、或者其邻近LED灯珠2上的第二电极引脚；使得各LED灯珠2可以直接从所述供电线路31取电、或者从其邻近的LED灯珠2上取电。
本例中的电源跳线311和信号跳线32即为本领域人员所理解的绑定线或者键合线，此处仅为区分器件，给其分别命名。上述的电源跳线311和信号跳线32，优选直径15μm-70μm，材质为金线、铜线或合金线，由于其直径很小，肉眼几乎不可见，因此，在保证满足所连接的若干LED灯珠2工作电流的同时，减少了对视线的阻挡，提升了产品的透明度。
电源跳线311和信号跳线32在示意图中虽然相互交叉，但是在实际的生产工艺中是在不同高度上进行打线绑定的，然后通过灌胶的方式固定，因此并不会发生塌陷短路的情况。
所述CHIP型LED灯珠中的底座支架22为电路板，所述电路板正面的铜 箔被蚀刻后形成所述芯片安装面23，也即电路板被蚀刻后，被蚀刻的地方形成隔离河道232，未被蚀刻之处形成绑定焊盘231；所述电路板背面的铜箔被蚀刻后形成所述绑定引脚2311，所述绑定引脚2311与所述芯片安装面23电连接。电路板背面的绑定引脚2311与电路板正面的绑定焊盘231对应连接(一般采用过孔连接的方式实现电连接)，即第一电极焊盘与第一电极引脚连接，第二电极焊盘与第二电极引脚连接，信号输入焊盘与信号输入引脚连接，信号输出焊盘与信号输出引脚连接。
作为优选的方式，如图5c所示，所述发光晶片20安装于所述驱动芯片21上；所述驱动芯片21封装于一透明封胶层24中。该种方式可以通过透明封胶层24对发光晶片20和驱动芯片21先封装保护。其中，透明封胶层24全覆盖芯片安装面23。
本例中，关于发光晶片20安装的方式，优选所述发光晶片20通过CSP(英文全称：Chip Scale Package，中文全称：芯片尺寸封装)方式安装于所述驱动芯片21上。也还可以通过COC(英文全称：Chip On Chip，中文全称：芯片上安装芯片)方式安装在所述驱动芯片21上。发光晶片20一般包括红、绿、蓝三种颜色的发光晶片20。
作为优选的方式，所述供电线路31包括若干呈行、或者列间隔设置的所述第一供电线路31a和所述第二供电线路31b；所述第一供电线路31a和所述第二供电线路31b之间设有若干行、或者列所述LED灯珠2；上述LED灯珠2共用所述第一供电线路31a和所述第二供电线路31b。如图6所示，间隔设置有第一供电线路31a、第二供电线路31b和第一供电线路31a；其中，左侧的第一供电线路31a和第二供电线路31b之间设有4行4列LED灯珠2；上述4行4列LED灯珠2共用第一供电线路31a和第二供电线路31b。右侧的第一供电线路31a和第二供电线路31b之间也设有4行4列LED灯珠2；上述4行4列LED灯珠2共用右侧的第一供电线路31a和第二供电线路31b。
采用上述方式，使得若干列或者若干行的LED灯珠2共享同一极性的供电 线路31，如此循环排列，可以制成大面积的透明LED显示屏。若干个LED灯珠2共用供电线路31可以减少供电线路31的数量，减少对视线的阻挡，有利于提高显示屏的透明度。
本申请并不局限于供电线路31的实施方式，其非本申请的核心创新内容，可以采用本领域技术人员所公知的实现方式，第一供电线路31a和第二供电线路31b的个数可以为各自仅有一个，或者也可以各自为多个，其第一供电线路31a和第二供电线路31b的个数可以相同，也可以有差异。其具体的数量，根据供电线路31的供电能力和第一供电线路31a和第二供电线路31b之间的LED灯珠2的用电电流需求而定，一般情况，LED灯珠2的数量为3至8列是比较理想数量。
供电线路31的形式可以为直线型，也可以设置为曲线型，也可以设置为蛇形线段等。作为优选的方式，一般每条供电线路31采用行或者列的方式设置，其实现方式也并不局限，只要其能提供供电电能即可。比如，其可以采用蚀刻在透明基板1上的金属层，或者为金属网格，也可以是纳米银镀膜或ITO镀膜，也可以为申请人此前申请的专利中布局的例如金属丝、或者埋设在透明基板1中的金属片等方式实现。
作为优选的方式，如图7所示，优选所述供电线路31为导电网格。导电网格可以是金属网格或者ITO，图中圆点为绑定线和金属网格或ITO的绑定点(电性连接点)。金属网格或ITO的方阻较大、导电能力比较小，所以需要大面积才能满足电流需求。在该图中，导电网格设置在若干列LED灯珠2两侧，导电网格形式的第一供电线路31a和第二供电线路31b之间的LED灯珠2共用上述第一供电线路31a和第二供电线路31b。此时，只需要将LED灯珠2粘贴于玻璃基板上即可。
如图8、图9所示，为了增强导电网格的导电能力，也可扩展导电网格的面积，可以将LED灯珠2绝缘粘贴在导电网格上。比如，图中左侧两列LED灯珠2布置于第一供电线路31a的导电网格上，图中右侧两列LED灯珠2布置 于第二供电线路31b的导电网格上。由于导电网格材料为透明材质，因此对LED灯珠发光阻挡极小，仍能保证显示画面的良好效果。
至于供电线路31的设计，还可以有其他形式的变形，例如，如图10所示，在所述透明基板1上设有若干透明单元板6；所述LED灯珠2布设于所述透明单元板6上；各所述透明单元板6的两侧设置有金属条作为供电线路31；各所述透明单元板6上的LED灯珠2连接至供电线路31。两侧的供电线路31分别为第一供电线路31a和第二供电线路31b。该种方式使得透明基板1表面没有供电线路31，而是嵌于两块透明单元板6之间。透明单元板6为相互独立的玻璃板，各透明单元板6固定在下方的整块的透明基板1上。这种方式的好处是，金属条在屏幕观看方向上截面积极小，可以保证足够的电流供应极性相反的两条供电线路31之间的若干个LED灯珠2，极大地减少了导电材质对视线的阻挡，提升了屏幕的透明度。
如图11所示，作为替代方式，还可以采用TOP型LED灯珠粘贴在透明基板1上实现，如图12a、12b、12c所示，所谓的TOP型结构，指采用PLCC(中文全称：带引线的塑料芯片载体；英文全称：Plastic Leaded Chip Carrier)塑胶支架作为底座支架22(英文名称housing，中文有的也称底座或支架)的结构。其工艺为公众所知，一般包含金属料带冲切、电镀、PPA(聚邻苯二酰胺)注塑、折弯、五面立体喷墨等工序。其核心是在塑胶支架的表面上通过金属料带形成芯片安装面23；且芯片安装面23上延伸出绑定引脚2311。本例中的绑定引脚2311不再做焊接使用，而是用来进行绑定连接。其绑定引脚2311并向所述塑胶支架的底部弯折。绑定焊盘231其实是与绑定引脚2311同一材质的金属片，金属片被冲压成型，空缺的地方被注塑填充，就成了隔离河道232，隔离河道232其实是绝缘塑胶材料，把各绑定引脚2311分别隔开，同时起到固定底座支架22的作用。具体的，绑定焊盘231包括电极焊盘和输入输出焊盘。
其中，如图12a、12b、12c所示，绑定引脚2311的末端弯折贴合在底座支架22的背面，形成一图示U形结构的绑定引脚2311。
该驱动芯片21为公众所知，一般其驱动芯片21内部集成有驱动电路，并在驱动芯片21上设有钝化层，钝化层是制造驱动芯片21的时候形成的表面绝缘层。所述驱动芯片21上设有若干管脚(或称端子)，所述驱动芯片21上的管脚通过直接焊接或者通过键合线与芯片安装面23和发光晶片20电连接。管脚(英文名称：PAD)一般设置在钝化层上，管脚是芯片内部的端子。
本申请公开的透明LED显示屏，只需透明基板1上形成供电电路，无需再像现有技术中一样需要印刷形成灯珠焊区，因此供电线路的制作也变得更加简单；在使用透明导电材料的情况下(如图8实施例)，电路图形形状极简单，大幅降低了电阻，增强了导电能力；其采用粘贴的方式将LED灯珠2倒装固定在透明基板1上，然后采用电源跳线311将各LED灯珠2直接或间接电连接至供电线路31，采用信号跳线32实现LED灯珠2的串接，通过上述方式以取代现有将LED灯珠2的灯珠焊接在灯珠焊区上的方式。采用上述LED灯珠2倒装粘贴固定的方式，无需考虑LED灯珠2与透明基板1之间的电性连接，仅用胶水即可实现，在实际生产中容易实施，避免了灯珠焊区在透明基板上难以制作的缺点，且LED灯珠2固定牢固，不容易脱落，采用电源跳线311实现各LED灯珠的供电以及采用信号跳线32实现信号的传输，在工艺上也容易实施。采用本技术手段，LED灯珠2在常温下就可以实现牢固粘接，绑定打线也在常温下进行，从而避免了高温环境，为制作以PET为基板的柔性透明屏提供了非常好的技术手段。同时，采用该种方式，还极大的提高了透明LED显示屏的透明度。此种方式为透明基板1的材质提供了多样性选择，可选择玻璃、塑料、薄膜材质，加工条件简单，均容易实现理想效果。
以上所述仅为本申请的较佳实施例而已，并不用以限制本申请，凡在本申请的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本申请的保护范围之内。

Claims (11)

  1. 一种透明LED显示屏，其中，包括透明基板及LED灯珠；所述透明基板上布设有电路图案；所述LED灯珠包括底座支架、驱动芯片及发光晶片；所述LED灯珠出射光线的面为正面，所述LED灯珠的正面粘贴于所述透明基板上；
    所述底座支架上形成有芯片安装面，所述驱动芯片安装于所述芯片安装面上，所述发光晶片安装于所述驱动芯片或者所述芯片安装面上，受所述驱动芯片的控制；
    所述芯片安装面包括隔离河道及通过隔离河道相互隔离的绑定焊盘，所述底座支架的背面设置有绑定引脚，所述绑定引脚与所述绑定焊盘电连接，所述绑定引脚包括电极引脚；所述电极引脚包括极性相反的第一电极引脚和第二电极引脚；
    所述电路图案包括电源焊盘及供电线路；所述供电线路包括若干极性相反的第一供电线路和第二供电线路；所述电源焊盘连接所述第一供电线路和所述第二供电线路；
    所述第一电极引脚通过电源跳线直接或间接绑定至所述第一供电线路，所述第二电极引脚通过电源跳线直接或间接绑定至所述第二供电线路。
  2. 根据权利要求1所述的透明LED显示屏，其中，所述绑定引脚还包括输入输出引脚，所述输入输出引脚包括信号输入引脚和信号输出引脚；
    所述电路图案还包括信号焊盘；各所述LED灯珠通过信号跳线绑定连接形成灯珠串，其中，所述灯珠串中的各所述LED灯珠的信号输入引脚通过信号跳线连接至所述信号焊盘或者前一LED灯珠的信号输出引脚；各所述LED灯珠的信号输出引脚通过信号跳线绑定连接至后一LED灯珠的信号输入引脚。
  3. 根据权利要求1所述的透明LED显示屏，其中，各所述LED灯珠上的第一电极引脚通过所述电源跳线绑定连接至所述第一供电线路、或者其邻近LED灯珠上的第一电极引脚；各所述LED灯珠上的第二电极引脚通过所述电源跳线绑定连接至所述第二供电线路、或者其邻近LED灯珠上的第二电极引脚；使得各LED灯珠可以直接从所述供电线路取电、或者从其邻近的LED灯珠上取电。
  4. 根据权利要求1所述的透明LED显示屏，其中，所述LED灯珠为CHIP型LED灯珠，所述CHIP型LED灯珠中的底座支架为电路板，所述电路板正面的铜箔被蚀刻后形成所述芯片安装面，所述电路板背面的铜箔被蚀刻后形成所述绑定引脚，所述绑定引脚与所述芯片安装面电连接。
  5. 根据权利要求4所述的透明LED显示屏，其中，所述CHIP型LED灯珠的芯片安装面上设有驱动芯片，所述发光晶片安装于所述驱动芯片；所述驱动芯片封装于一透明封胶层中。
  6. 根据权利要求1所述的透明LED显示屏，其中，所述LED灯珠为TOP型LED灯珠；所述TOP型LED灯珠包括采用塑胶支架的底座支架；所述塑胶支架的表面上通过金属料带形成所述芯片安装面，所述芯片安装面上延伸出所述绑定引脚，并向所述塑胶支架的底部弯折。
  7. 根据权利要求1所述的透明LED显示屏，其中，所述发光晶片通过CSP或COC方式安装于所述驱动芯片上。
  8. 根据权利要求1所述的透明LED显示屏，其中，所述供电线路包括若干呈行、或者列间隔设置的所述第一供电线路和所述第二供电线路；所述第一供电线路和所述第二供电线路之间设有若干行、或者列所述LED灯珠；上述 LED灯珠共用所述第一供电线路和所述第二供电线路。
  9. 根据权利要求1所述的透明LED显示屏，其中，所述供电线路为导电网格或ITO导电膜或纳米银薄膜。
  10. 根据权利要求1所述的透明LED显示屏，其中，布置有所述LED灯珠的透明基板上设有灌胶层，所述灌胶层将各所述LED灯珠封装在其中；所述灌胶层的上表面设有保护盖板。
  11. 根据权利要求10所述的透明LED显示屏，其中，所述透明基板上设有若干透明单元板；所述LED灯珠的正面粘贴在所述透明单元板上；各所述透明单元板的两侧设置有金属条作为供电线路；各所述透明单元板上的LED灯珠连接至所述供电线路。
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