WO2023058263A1 - Temperature sensor, and method for manufacturing temperature sensor - Google Patents

Temperature sensor, and method for manufacturing temperature sensor Download PDF

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Publication number
WO2023058263A1
WO2023058263A1 PCT/JP2022/019272 JP2022019272W WO2023058263A1 WO 2023058263 A1 WO2023058263 A1 WO 2023058263A1 JP 2022019272 W JP2022019272 W JP 2022019272W WO 2023058263 A1 WO2023058263 A1 WO 2023058263A1
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WO
WIPO (PCT)
Prior art keywords
support film
temperature sensor
film
supporting film
supporting
Prior art date
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PCT/JP2022/019272
Other languages
French (fr)
Japanese (ja)
Inventor
大輔 荒野
翔太 我妻
守富 濱田
Original Assignee
株式会社芝浦電子
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 株式会社芝浦電子 filed Critical 株式会社芝浦電子
Priority to CN202280058709.XA priority Critical patent/CN117940748A/en
Publication of WO2023058263A1 publication Critical patent/WO2023058263A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient

Definitions

  • the present invention relates to a temperature sensor that can be made thinner.
  • thermoly sensitive resistor an abbreviation for thermally sensitive resistor
  • the temperature sensor is required to have resistance according to the usage environment. Resistance includes heat resistance, water resistance, chemical resistance, oil resistance, and the like.
  • the temperature sensor has requirements regarding size and shape in relation to the object to be measured. With respect to size and shape, there is a demand for a thin temperature sensor that is inserted into, for example, an extremely narrow space to measure the temperature of an object to be measured.
  • the temperature sensor disclosed in Patent Document 1 includes a first supporting film made of an electrically insulating material, a second supporting film made of an electrically insulating material laminated on the first supporting film, and a first supporting film and a second supporting film. a sensor element provided between the membranes. This temperature sensor is arranged such that the first support film and the second support film are opposed to each other in the region where the thermosensitive element is provided.
  • the temperature sensor of Patent Literature 1 is easy to manufacture and thin.
  • lamination of the first support film and the second support film may be performed by bonding accompanied by heating. Since the temperature sensor of Patent Document 1 is thin, with a thickness of 0.5 mm or less, preferably 0.3 mm or less, if air enters between the first support film and the second support film during bonding, heating will occur. There is a possibility that the expansion may adversely affect the connection of the conductor between the first support film and the second support film.
  • the conductor between the first supporting film and the second supporting film it is an object of the present invention to provide a thin temperature sensor capable of maintaining a connection between
  • the temperature sensor of the present invention comprises a first supporting film and a second supporting film made of an electrically insulating material and arranged opposite to each other, and provided between the first supporting film and the second supporting film, and electrically controlled by temperature.
  • a sensor element including a thermosensitive element whose characteristics change;
  • the joined body is provided in at least two regions with a predetermined interval in the planar direction of the first support film and the second support film, with the heat sensitive element interposed therebetween.
  • the area surrounded by the joined body is provided with a protector that covers the heat sensitive body and is made of an electrically insulating resin material.
  • the second support film has a smaller dimension in the length direction than the first support film, and the joined bodies are provided on both sides spaced apart in the width direction.
  • one or both of the first supporting film and the second supporting film are provided with an insertion passage through which the resin material constituting the protective body is filled, penetrating in the thickness direction.
  • the sensor element preferably comprises a first lead pattern and a second lead pattern, which are the first support film and are attached on the same plane facing the second support film.
  • the first support film supports the thermosensitive element and includes a first conductive pad electrically connected to the first lead pattern and a second conductive pad electrically connected to the second lead pattern;
  • the second support film has third conductive pads on the surface facing the region where the heat sensitive element is provided, and a dummy conductor corresponding to the heat sensitive element is provided between the second conductive pad and the third conductive pad.
  • a method for manufacturing a temperature sensor according to the present invention comprises: a first supporting film made of an electrically insulating material and having a sensor element having a heat sensitive body attached to one surface thereof; and a second supporting film made of an electrically insulating material. and a second step of bonding the first supporting film and the second supporting film with a bonding body.
  • the joined body is provided so as to sandwich the heat sensitive element and to have a passage communicating between the heat sensitive element and the outside.
  • a protective body is formed by supplying a resin material made of an electrically insulating material between the first supporting film and the second supporting film around the thermosensitive element.
  • a third step is provided.
  • the first supporting film and the second supporting film have a width direction and a length direction, and the second supporting film
  • the lengthwise dimension is also small, and in a second step, the joints are provided on both sides spaced apart in the width direction.
  • the first supporting film and the second supporting film are provided with an insertion passage penetrating in the thickness direction thereof, and in the third step , the resin material is supplied through the insertion passage.
  • the protective body before the protective body is provided, there is a passage in which no bonded body is provided between the first supporting film and the second supporting film. Therefore, even if air expands between the first supporting film and the second supporting film, the expanded air is discharged to the outside through the passage.
  • FIG. 2 shows elements of a first support film that constitute the temperature sensor according to the first embodiment, where (a) is a plan view of a base and (b) is a plan view of a cover.
  • FIG. 4 shows elements of a second support film that constitute the temperature sensor according to the first embodiment, where (a) is a plan view of a base and (b) is a plan view of a cover.
  • FIG. 2 is a cross-sectional view taken along line IV-IV in FIG. 1, showing the temperature sensor according to the first embodiment; FIG.
  • FIG. 2 is a cross-sectional view taken along the line VV in FIG. 1, showing the temperature sensor according to the first embodiment
  • FIG. 2 is a cross-sectional view taken along the line VI-VI in FIG. 1, showing the temperature sensor according to the first embodiment
  • 3A and 3B are trihedral views showing the thermistor used in the temperature sensor according to the first embodiment, which are respectively a plan view (PV), a side view (SV) and a front view (FV).
  • FIG. 4 is a diagram showing a procedure of manufacturing the temperature sensor according to the first embodiment, which is a process of manufacturing a first support film
  • FIG. 10 is a diagram showing a procedure for manufacturing the temperature sensor according to the first embodiment, which is a process for manufacturing a second support film;
  • FIG. 4 is a diagram showing a procedure for manufacturing the temperature sensor according to the first embodiment, which is a step of bonding a first support film and a second support film together;
  • the temperature sensor which concerns on 2nd Embodiment is shown, (a) is a top view, (b) is a bottom view.
  • FIG. 2 is a cross-sectional view taken along line XII-XII in FIG. 1, showing a temperature sensor according to a second embodiment;
  • FIG. 2 is a cross-sectional view taken along line XIII-XIII in FIG. 1, showing a temperature sensor according to a second embodiment;
  • 1A is a plan view showing a temperature sensor according to an embodiment, and
  • FIG. 1B is a plan view showing an extension support film connected to this temperature sensor;
  • FIG. It is a figure which shows the procedure which connects the support membrane for extension to the temperature sensor which concerns on embodiment.
  • the temperature sensor according to this embodiment will be described below with reference to the accompanying drawings.
  • the temperature sensor 1 according to the first embodiment and the temperature sensor 2 according to the second embodiment will be described below.
  • the temperature sensor 1 includes a sensor element 10, a first support film 30, and a second support film 50 laminated on the first support film 30 by bonding.
  • both the first support film 30 and the second support film 50 are formed in a rectangular shape when viewed from above, and the plane area of the second support film 50 is set smaller than that of the first support film 30. A case is illustrated and demonstrated. Therefore, the second support film 50 is in front of the first support film 30 and covers only a part including the area where the heat sensitive element 11 is provided.
  • the side of the sensor element 10 on which the heat sensitive element 11 is provided is defined as the front (F), and the opposite side of the front (F) is defined as the rear (B).
  • Front (F) is sometimes referred to as front (F), front edge (F), and so on.
  • the rear (B) the width direction (W) and the length direction (L) shall be defined.
  • the side on which the second support film 50 is provided is defined as the front side, and the opposite side is defined as the back side.
  • the sensor element 10 Between the first support film 30 and the second support film 50, a main part of the sensor element 10 is provided as described below.
  • the sensor element 10 includes a first conductive pad 14 made of copper foil, a thermosensitive element 11 having a thermistor electrically connected to the first conductive pad 14, and a first lead pattern 12 electrically connected to the thermosensitive element 11 .
  • the sensor element 10 also includes a second conductive pad 15 made of copper foil and a second lead pattern 16 electrically connected to the second conductive pad 15 .
  • the sensor element 10 comprises dummy conductors 9 electrically connected to the second conductive pads 15 . This dummy conductor 9 is provided corresponding to the heat sensitive element 11 .
  • thermosensitive element 11 and the first conductive pad 14 are arranged near the front end (F) of the temperature sensor 1 and extend to the center in the width direction (W). Further, the second conductive pad 15 is arranged closer to the rear end (B) than the thermosensitive element 11 and extends to the center in the width direction (W). That is, the heat sensitive element 11 (first conductive pad 14) and the dummy conductor 9 (second conductive pad 15) are separated from each other in the longitudinal direction (L), and are separated from the front end (F) side by the heat sensitive element 11, the The two conductive pads 15 are arranged side by side in order to bisect the temperature sensor 1 in the width direction (W).
  • the first lead pattern 12 is drawn out from the thermosensitive element 11 (first conductive pad 14) in one width direction (W) (to the right in FIG. 1(a)). From there, it extends straight toward the rear end (B), and has an L-shape in plan view.
  • a first terminal pad 13 is electrically connected to the rear end (B) side of the first lead pattern 12 .
  • the first terminal pad 13 is formed wider than the first lead pattern 12 and is connected to an external terminal or the like.
  • the second lead pattern 16 extends from the dummy conductor 9 (second conductive pad 15) to the other side of the width (W) (to the left in FIG. 1(a)).
  • a second terminal pad 17 is electrically connected to the rear end (B) side of the second lead pattern 16 .
  • the second terminal pad 17 is formed wider than the second lead pattern 16 and is connected to an external terminal or the like.
  • the first lead pattern 12 and the second lead pattern 16 have, for example, the same width and are arranged parallel to each other.
  • the first lead pattern 12 and the second lead pattern 16 are made of foil made of a conductive material, such as a copper alloy, formed on the first support film 30 .
  • the first support film 30 and the second support film 50 are composed of so-called single-sided FPCs (Flexible Printed Circuits), and include first lead patterns 12, first terminal pads 13, second lead patterns 16 and second terminal pads. 17 corresponds to the circuit portion of the FPC.
  • the first lead pattern 12 and the second lead pattern 16 are sandwiched between a base 31 and a cover 33, which will be described later, and are buried inside the first support film 30 in the thickness direction.
  • first terminal pad 13 and the second terminal pad 17 connected to the first lead pattern 12 and the second lead pattern 16 are located near the rear end (B) of the first support film 30 when the cover 33 is closed. By breaking off, it opens to the side of the front surface.
  • the sensor element 10 includes a 3A conductive pad 18 and a 3B conductive pad 19 electrically connecting the thermosensitive element 11 (first conductive pad 14) and the second conductive pad 15. and a third C conductive pad 21 .
  • the 3A conductive pad 18 is provided at a position corresponding to the heat sensitive element 11 and the first conductive pad 14, and the second lead pattern 16 and the 3A conductive pad 18 are electrically connected with the heat sensitive element 11 interposed therebetween.
  • the 3B conductive pad 19 is provided at a position corresponding to the second conductive pad 15 , and the second conductive pad 15 is electrically connected to the third conductive pad 19 .
  • the 3A conductive pad 18 and the 3B conductive pad 19 are electrically connected by the 3C conductive pad 21 .
  • the 3A conductive pad 18 , the 3B conductive pad 19 and the 3C conductive pad 21 are integrally formed and attached to the second support film 50 .
  • the thermosensitive element 11 includes a thermistor 11A, a first electrode 11B provided on one side of the thermistor 11A, and a second electrode 11C provided on the other side of the thermistor 11A.
  • the thermosensitive element 11 is arranged so that the first electrode 11B faces the first conductive pad 14 and the second electrode 11C faces the 3A conductive pad 18 . That is, the thermosensitive element 11 has the first electrode 11B and the second electrode 11C arranged along the front and back sides of the temperature sensor 1 .
  • the first lead pattern 12 and the second lead pattern 16 of the temperature sensor 1 are formed on the same plane regardless of this arrangement of the thermosensitive element 11 .
  • the thermistor 11A has a characteristic that its electrical resistance changes greatly with temperature changes.
  • thermistors There are two types of thermistors: NTC (Negative Temperature Coefficient) thermistors whose resistance value decreases as the temperature rises, and PTC (Positive Temperature Coefficient) thermistors whose resistance value is constant up to a certain temperature and rises sharply after that temperature. be.
  • NTC and PTC thermistors can be applied to the thermistor 11A of the present embodiment.
  • the first electrode 11B and the first electrode 11B are made of gold, silver, copper, platinum, or the like, and are formed on both front and back surfaces of the thermistor 11A by vapor deposition or the like.
  • the thermistor 11A has dimensions in the width direction (W), the length direction (L) and the thickness direction, for example, in the range of 0.3 to 0.5 mm.
  • the thermosensitive element 11 is not provided with a protective layer such as glass that covers the thermistor 11A, the first electrode 11B and the second electrode 11C from the surroundings. As a result, the size of the heat sensitive element 11 is reduced.
  • the first support film 30 is an element that supports the sensor element 10, and is made of FPC, for example. As shown in FIGS. 2 and 4 to 6, this FPC consists of a base 31, a cover 33 provided opposite to the base 31, and an accommodating hole cut in the cover 33 on the surface of the base 31. and a conductive pattern 35 provided on 43 and 45 .
  • the first lead pattern 12 , the first terminal pad 13 , the first conductive pad 14 , the second conductive pad 15 , the second lead pattern 16 and the second terminal pad 17 which are the components of the sensor element 10 , are composed of the conductive pattern 35 . be done.
  • the first lead pattern 12 and the second lead pattern 16 are provided on the same plane on the front surface side.
  • the shapes and thicknesses of the base 31, the cover 33, and the conductive pattern 35 in FIGS. 4 and 5 do not necessarily reflect the reality.
  • the term "film” refers to a member having a sufficiently thin thickness with respect to its area.
  • the base 31, the cover 33 and the conductive pattern 35 each have a size of, for example, 50 ⁇ m or less, preferably 30 ⁇ m, more preferably 20 ⁇ m or less, and their area is well over 50 mm 2 .
  • the membrane in this embodiment is not directly related to its rigidity. In other words, it includes the extent to which, when a cantilever structure is used, it bends from the supporting portion without retaining its original flat shape due to its own weight, to the extent to which the flat state can be maintained.
  • the base 31 and the cover 33 are made of an electrically insulating material such as polyimide, and the conductive pattern 35 is made of copper foil as an example. Since the FPC manufacturing process is well known, the description is omitted here. Bonding layers made of an adhesive may be formed between the base 31 and the conductive pattern 35 and between the cover 33 and the conductive pattern 35, but are not shown in FIGS. Omitted.
  • the second support film 50 is a component for electrically connecting the thermosensitive element 11 and the second conductive pads 15 .
  • the second support film 50 is also made of FPC, and as shown in FIGS. a pattern 55;
  • the conductive pattern 55 on the second support film 50 is electrically connected to the second conductive pad 15 in addition to being electrically connected to the thermal sensitive element 11 .
  • the 3A conductive pad 18 , the 3B conductive pad 19 , and the 3C conductive pad 21 which are components of the sensor element 10 , are composed of conductive patterns 55 . therefore.
  • the 3A conductive pad 18 , the 3B conductive pad 19 and the 3C conductive pad 21 are attached on the same plane of the second support film 50 facing the first support film 30 .
  • the conductive pattern 55 constitutes the 3A conductive pad 18, the 3B conductive pad 19 and the 3C conductive pad 21, which are constituent elements of the sensor element 10, as shown in FIG.
  • An insulating gap 56 is formed in the conductive pattern 55 between the 3A conductive pad 18 and the 3B conductive pad 19 .
  • the insulating gap 56 penetrates not only the conductive pattern 55 but also the base 51 in the thickness direction.
  • the insulating gap 56 is arranged between the receiving holes 63 and 65 of the cover 53 in the length direction (L).
  • FIGS. 1, 4, 5 and 6 The first support film 30 and the second support film 50 are bonded together by a double-sided tape 54 as a bonded body. As shown in FIGS. 1, 5 and 6, the double-sided tape 54 is provided on both sides of the first support film 30 and the second support film 50 in the width direction (W). The second support film 50 is attached. Since only both sides in the width direction (W) are bonded together with the double-sided tape 54, as shown in FIGS. Between them, there are gaps communicating in the length direction (L).
  • a protector 7 made of an electrically insulating resin material is provided in the gap, and the protector 7 covers the dummy conductor 9, the heat sensitive member 11, and the joints 37, 39, 57, and 59.
  • the protector 7 is obtained by injecting a resin material into the gap after manufacturing the temperature sensor 1 having the gap.
  • the double-faced tapes 54, 54 on both sides in the width direction (W) join the first support film 30 and the second support film 50 around the heat sensitive element 11.
  • the resin material forming the protector 7 is not limited, for example, epoxy resin, silicone resin, silicone varnish, etc. are preferably used.
  • the second support film 50 has the same dimension in the width direction (W) as that of the first support film 30, but has a smaller dimension in the length direction (L).
  • the gap between the first support film 30 and the second support film 50 serves two functions.
  • the first function is to discharge the air existing between the first supporting film 30 and the second supporting film 50 to the outside when the first supporting film 30 and the second supporting film 50 are bonded. Since this bonding involves heating, the thermally expanded air is discharged.
  • the second function is to discharge the air existing between the first support film 30 and the second support film 50 to the outside when the protector 7 is provided.
  • the resin material forming the protective body 7 is injected into a narrow gap, and the air corresponding to the amount of the injected resin material is discharged to the outside through the gap.
  • the gap between the first support film 30 and the second support film 50 that exists before the protector 7 is formed can be said to be a passage for discharging air.
  • FIGS. 4, 5, and 6 As shown in FIGS. 4 and 5, a conductive joint 37 is provided between the heat sensitive element 11 and the first conductive pads 14, and a conductive joint 37 is provided between the heat sensitive element 11 and the conductive pattern 55. 57 are provided. Also, as shown in FIG. 6, a conductive joint 39, a joint 59 and a dummy conductor 9 are provided between the second conductive pad 15 and the conductive pattern 55. As shown in FIG. In this way, the sensor element 10 has an electric circuit composed of the first lead pattern 12 , the thermosensitive element 11 , the dummy conductor 9 and the second lead pattern 16 .
  • the sensor element 10 includes a first lead pattern 12, a dummy conductor 9, a third B conductive pad 19, a third C conductive pad 21, a third A conductive pad 18, a thermosensitive element 11, a first conductive pad 14, and a second conductive pad. 15 and the second lead pattern 16 are electrically connected in this order.
  • Conductive adhesives are widely used materials that achieve conductive bonding by dispersing conductive fillers in a binder resin such as epoxy or urethane, and forming conductive paths with these fillers after bonding.
  • a binder resin such as epoxy or urethane
  • metal powder such as copper, nickel and silver, as well as carbon-based materials such as graphite and CNT (carbon nanotube) can be used.
  • FIG. 8 First, the first support film 30 will be described with reference to FIG. 8A, a first FPC 41, which is a precursor of the first support film 30, is prepared. The first FPC 41 is already formed with housing holes 43 and 45 for the heat sensitive element 11 and the joints 37 and 39 . The receiving holes 43 , 45 are formed by etching the cover 33 . In the first FPC 41, the same components as those of the first support film 30 are denoted by the same reference numerals as those of the first support film 30, and descriptions thereof will be omitted.
  • the joining bodies 37 and 39 are applied to the receiving holes 43 and 45 of the first FPC 41, respectively.
  • the joints 37 and 39 are electrically connected to the surfaces of the first conductive pads 14 and the second conductive pads 15 in the receiving holes 43 and 45, respectively.
  • the heat sensitive element 11 is placed on the top of the joined body 37 arranged in the receiving hole 43.
  • One of the first electrode 11 ⁇ /b>B and the second electrode 11 ⁇ /b>C (not shown) of the heat sensitive body 11 is in contact with the joint 37 .
  • a dummy conductor 9 is placed on the top of the joint 39 arranged in the accommodation hole 45. As shown in FIG.
  • the dummy conductor 9 is made of a conductive material having the same shape and dimensions as the heat sensitive body 11 .
  • the dummy conductor 9 is provided to make the dimension in the thickness direction (T) of the part where the heat sensitive body 11 is arranged and the part where the dummy conductor 9 is arranged to be the same.
  • the first FPC 41 that is the precursor of the first support film 30 obtained above is used for bonding with the second FPC 61 that is the precursor of the second support film 50 .
  • a second FPC 61 which is a precursor of the second support film 50, is prepared.
  • the second FPC 61 is preliminarily formed with housing holes 63 and 65 for arranging the joints 57 and 59 .
  • the accommodation holes 63 and 65 are formed by laser processing the cover 53 as an example.
  • the same components as those of the second support film 50 are denoted by the same reference numerals as those of the second support film 50, and descriptions thereof are omitted.
  • the joining bodies 57 and 59 are applied to the receiving holes 63 and 65 of the second FPC 61, respectively.
  • the joints 57 and 59 are electrically connected to the surface of the 3B conductive pad 19 in the receiving holes 63 and 65, respectively.
  • a double-sided tape 54 is attached to the cover 53 of the second FPC 61 .
  • the double-sided tapes 54 are provided on both sides in the width direction (W) as shown in FIG.
  • the second FPC 61 thus obtained is used for bonding with the first FPC 41 .
  • first FPC 41 and second FPC 61 are aligned.
  • the first FPC 41 and the second FPC 61 are arranged so that the cover 33 and the cover 53 (double-sided tape 54) face each other.
  • This alignment means that the joined bodies 37, 39 of the first FPC 41 and the joined bodies 57, 59 of the second FPC 61 are placed at the same position in the length direction (L).
  • the first FPC 41 and the second FPC 61 are laminated (first step). At this time, as shown in FIG.
  • the bonded body 57 and the heat sensitive body 11 are brought into contact, and the bonded body 59 and the dummy conductor 9 are brought into contact with each other.
  • the cover 33 of the first FPC 41 and the cover 53 of the second FPC 61 are joined (second step). This joining is performed via double-sided tape 54 .
  • a resin material RM for forming the protector 7 is injected toward the passage AP, which is the gap between the cover 33 and the cover 53 .
  • the protector 7 shown in FIGS. 4 to 6 is formed (third step).
  • the path AP is filled with the resin material RM by forming the protector 7 .
  • the temperature sensor 1 is obtained by the above procedure.
  • the temperature sensor 1 has a dummy conductor 9 having a thickness equivalent to that of the heat sensitive element 11 between the joint 39 and the joint 59 .
  • the dimension in the thickness direction (T) from the bonded body 37 with the heat sensitive element 11 to the bonded body 57 and the thickness direction (T) from the bonded body 39 with the dummy conductor 9 in the middle to the bonded body 59 The dimensions of T) can be made equivalent.
  • the temperature sensor 1 can have uniform dimensions in the thickness direction (T), including the portion where the heat sensitive element 11 is arranged and the portion where the dummy conductor 9 is arranged.
  • the dimension in the thickness direction (T) of the portion where the heat sensitive element 11 is arranged would be larger than the other portions. Then, when the first support film 30 and the second support film 50 are thermocompressed, the second support film 50 is stressed due to this dimension, so that it is easy to bond the part where the thermosensitive element 11 is provided. Gone.
  • the temperature sensor 1 can have uniform dimensions in the thickness direction (T), including the portion where the heat sensitive element 11 is arranged and the portion where the dummy conductor 9 is arranged. stress is less likely to occur.
  • the temperature sensor 1 utilizes FPC technology to measure the total thickness of the first support film 30 and the second support film 50.
  • a thickness reduction of 0.5 mm or less, preferably 0.3 mm or less can be realized.
  • the temperature sensor 1 is formed by bonding the first support film 30 and the second support film 50 together.
  • the first support film 30 is covered only in areas electrically connected to both the lead pattern 12 and the second lead pattern 16 .
  • the larger the area of the films the more difficult it is to stick them together, and the greater the risk of causing problems such as wrinkling.
  • the larger the area of the film the higher the material cost.
  • the surface area of the second support film 50 since the surface area of the second support film 50 is small, the work of attaching it to the first support film 30 is facilitated, and the material cost can be suppressed.
  • the temperature sensor 1 is provided at a position where the thermal element 11 is closer to the front end (F) than the second conductive pad 15 is. In this way, if the thermosensitive element 11 is closest to the front end (F), even if the temperature to be measured is at the back of a narrow space, if the temperature sensor 1 is inserted into this space from the front end (F), the thermosensitive element 11 can be brought close to the object to be measured. Thereby, the temperature sensor 1 can accurately measure the temperature of the object to be measured. Further, the temperature sensor 1 has a heat sensitive element 11 arranged at the center in the width direction (W).
  • the heat sensitive element 11 can be aligned with the center of the heat source of the part to be measured. This also allows the temperature sensor 1 to accurately measure the temperature of the object to be measured.
  • the temperature sensor of the present invention is not limited to these positions, and the heat sensitive element 11 can be arranged at other positions.
  • the positions of the first conductive pad 14 and the second conductive pad 15 electrically connected to the thermosensitive element 11 can be reversed in the length direction L based on the position of the object to be measured. 11 can also be displaced from the center in the width direction (W).
  • the temperature sensor 1 has the first lead pattern 12 and the second lead pattern 16 formed between the base 31 and the cover 33 of the first support film 30 . That is, the first lead pattern 12 and the second lead pattern 16 are provided on the same plane. Thereby, the work of connecting electric wires to the first terminal pads 13 and the second terminal pads 17 from one side of the temperature sensor 1 can be performed. In order to provide the first lead pattern 12 and the second lead pattern 16 on the same plane as described above, the electrical connection relationship described above is employed.
  • FIGS. 11 to 13 ⁇ Second Embodiment: FIGS. 11 to 13>
  • a temperature sensor 2 according to a second embodiment will be described with reference to FIGS. 11 to 13.
  • FIG. In the following, the temperature sensor 2 will be described with respect to differences from the temperature sensor 1 according to the first embodiment. and the description is omitted.
  • the temperature sensor 2 is provided with an insertion path 52 for the resin material in the second support film 50, as shown in FIGS.
  • the insertion path 52 may be provided in the first support film 30 or may be provided in both the first support film 30 and the second support film 50 .
  • the insertion passage 52 is provided forward (F) from the sensor element 10 of the temperature sensor 2 and at the center in the width direction (W), as shown in FIG. Also, as shown in FIG. 12, the insertion path 52 penetrates the front and back of the second support film 50 and continues to the path AP. Although the protector 7 is shown in FIGS. 12 and 13, when the first support film 30 and the second support film 50 are bonded together, the insertion path 52 and the path AP form a gap communicating with each other. .
  • a molten resin material is supplied from the insertion passage 52 .
  • the resin material is supplied toward the sensor element 10, surrounds the sensor element 10 as shown in FIGS. 12 and 13, and then hardens.
  • the sensor element 10 is now surrounded by the protective body 7 made of a resin material and protected against the atmosphere whose temperature is to be measured.
  • the resin material forming the protector 7 is not limited, for example, epoxy resin, silicone resin, varnish, etc. are preferably used.
  • the temperature sensor 1 (first embodiment) shown in FIG. 14(a) is prepared as a standard product.
  • the extended support membrane 5 shown is connected to the temperature sensor 1 .
  • the extension support film 5 includes a base 71 and a pair of lead patterns 72 and 73 formed on the front surface of the base 71 .
  • the extension support film 5 includes terminal pads 74 and 75 connected to one ends of the lead patterns 72 and 73, respectively, and terminal pads 76 and 77 connected to the other ends of the lead patterns 72 and 73, respectively. , provided. Further, the extension support film 5 is covered with a cover 81 covering from the vicinity of the connection portions of the terminal pads 74 and 75 with the lead patterns 72 and 73 to the vicinity of the connection portions of the terminal pads 76 and 77 with the lead patterns 72 and 73. Prepare.
  • the cover 81 has a resin material filling port 83 formed at one end thereof.
  • the base 71, the lead patterns 72, 73, the terminal pads 74, 75, 76, 77 and the cover 81 are made of the same material as the corresponding parts of the first support film 30 and the second support film 50, respectively. Also, the base 71 and the cover 81 are joined by means such as an adhesive or double-sided tape.
  • the extension support film 5 is connected to the temperature sensor 1 on the side where the terminal pads 74 and 75 are provided. Specifically, the surface on the side shown in FIG. 14B is turned over, the first terminal pad 13 and terminal pad 74 of the temperature sensor 1 are connected, and the second terminal pad 17 and terminal pad 75 of the temperature sensor 1 are connected. Connected. At this time, the base 71 and the base 31 of the temperature sensor 1 are bonded by means such as an adhesive or double-sided tape.
  • an electrically insulating resin is placed between the terminal pads 13 and 74 to be connected and the terminal pads 17 and 75 to be connected in the width direction (W). material is filled.
  • a filling port 83 is provided to supply this resin material. That is, as shown in FIG. 15A, the first support film 30 and the extension support film 5 are opposed to each other with the cover 81 of the extension support film 5 facing downward. Next, as shown in FIG. 15B, the first support film 30 and the extension support film 5 are aligned with the terminal pads 13 (17) and the terminal pads 74 (75) in contact with each other. . A gap is formed between the first support film 30 and the extension support film 5 in the aligned state.
  • This gap is closed to the surroundings, except for the fill port 83 .
  • a resin material made of an electrically insulating material from the filling port 83 in this aligned state, the gap between the base 31 and the base 71 is filled with the resin material as shown in FIG.
  • a protector 8 is constructed. The protector 8 protects the connecting portion between the temperature sensor 1 and the extension support film 5 .
  • the temperature sensors 1 and 2 described above show an example in which the double-faced tapes 54 and 54 as joined bodies sandwich the thermosensitive element 11 and are provided on both sides with a gap in the width direction W.
  • the present invention is not limited to this, and even if the double-faced tapes 54, 54 sandwich the heat sensitive element 11 and are provided on both sides with a gap in the length direction L, the passage AP can be ensured.
  • the passage AP is not limited to a form communicating in the length direction L or the width direction W.
  • the present invention includes a form in which joint bodies are provided on both sides in the width direction W and joint bodies are provided only on one side in the length direction L.
  • the passage AP is secured. Further, for example, even in a mode in which a joined body is provided on one side in the width direction W and one side in the length direction L, respectively, the passage AP can be ensured.
  • the present invention secures the passage AP by sandwiching the thermosensitive element and providing the joints in at least two regions separated by a predetermined interval in the planar direction of the first support film 30 and the second support film 50 . can be done.
  • the plane direction is a concept having both the width direction W and the length direction L.
  • the present invention is not limited to this.
  • the dimension in the thickness direction of one or both of the joined body 39 and the joined body 59 may be increased by the thickness.
  • the shape and dimensions of the temperature sensors 1 and 2 merely show an example of the present invention.
  • the length (L) dimension can be longer or shorter than the temperature sensors 1-3, and the width (W) dimension can be longer or shorter.
  • the planar shape of these pads can be circular instead of rectangular.
  • the planar shape of the first support film 30 and the second support film 50 is not limited to a rectangle, and for example, one end in the length direction (L) may protrude in an arc shape or may be recessed.
  • the planar shape of the first support film 30 and the second support film 50 is arbitrary, such as a trapezoid or a triangle.
  • thermosensitive element 11 is provided on the second FPC 61 side of the second support film 50
  • first support film 30 and the first FPC 41 may be laminated and joined.
  • the first lead pattern 12 and the second lead pattern 16 are provided on the first support film 30 having a large dimension in the length direction (L), but the present invention is not limited to this.
  • the first lead pattern 12 and the second lead pattern 16 can be provided on the second support film 50 having a small dimension in the length direction (L).

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Abstract

The objective of the present invention is to provide a thin temperature sensor with which a connection between electrical conductors between a first supporting film and a second supporting film can be maintained even if air present between the first supporting film and the second supporting film expands in a manufacturing step in which joining involving heating is performed.　A temperature sensor 1 according to the present invention comprises: a first supporting film 30 and a second supporting film 50 which comprise an electrically insulating material and which are disposed facing one another; a thermosensitive body 11 which is provided between the first supporting film 30 and the second supporting film 50 and which has an electrical property that changes in accordance with temperature; and joining bodies 54 for joining the first supporting film 30 and the second supporting film 50. The first supporting film 30 and the second supporting film 50 have a width direction W and a length direction L. The joining bodies 54 are provided on both sides, spaced apart from one another across a gap in the width direction W, sandwiching the thermosensitive body 11.

Description

温度センサおよび温度センサの製造方法Temperature sensor and temperature sensor manufacturing method
　本発明は、薄型化が可能な温度センサに関する。 The present invention relates to a temperature sensor that can be made thinner.
　温度によって電気的特性、例えば電気抵抗が変化する性質を有するサーミスタ（thermally sensitive resistorの略称）を利用して温度を検出する温度センサがある。この温度センサの測定対象物は種々あり、その使用環境に応じた耐性が温度センサに要求される。耐性としては、耐熱性、耐水性、耐薬品性、耐油性などが掲げられる。また、測定対象物との関係で、温度センサには寸法、形状に関する要求もある。寸法、形状に関して、例えば極めて狭いスペースに挿入されて測定対象物の温度を測定する薄型の温度センサの要求がある。 There is a temperature sensor that detects temperature using a thermistor (an abbreviation for thermally sensitive resistor) that has the property of changing electrical properties, such as electrical resistance, depending on temperature. There are various objects to be measured by this temperature sensor, and the temperature sensor is required to have resistance according to the usage environment. Resistance includes heat resistance, water resistance, chemical resistance, oil resistance, and the like. In addition, the temperature sensor has requirements regarding size and shape in relation to the object to be measured. With respect to size and shape, there is a demand for a thin temperature sensor that is inserted into, for example, an extremely narrow space to measure the temperature of an object to be measured.
　これまで、薄型の温度センサとして例えば特許文献１に開示されるものが知られている。特許文献１に開示される温度センサは、電気絶縁材料からなる第１支持膜と、第１支持膜に積層される、電気絶縁材料からなる第２支持膜と、第１支持膜と第２支持膜の間に設けられるセンサ素子と、を備える。この温度センサは、第１支持膜と第２支持膜とが、感熱体が設けられる領域において対向するように配設される。特許文献１の温度センサは、製造が容易でありながらも薄型化される。 Until now, for example, the one disclosed in Patent Document 1 has been known as a thin temperature sensor. The temperature sensor disclosed in Patent Document 1 includes a first supporting film made of an electrically insulating material, a second supporting film made of an electrically insulating material laminated on the first supporting film, and a first supporting film and a second supporting film. a sensor element provided between the membranes. This temperature sensor is arranged such that the first support film and the second support film are opposed to each other in the region where the thermosensitive element is provided. The temperature sensor of Patent Literature 1 is easy to manufacture and thin.
国際公開２０２１／１４５０８８号公報International Publication No. 2021/145088
　特許文献１において、第１支持膜と第２支持膜との積層が加熱を伴う接合により行われることがある。特許文献１の温度センサは厚さが０．５ｍｍ以下、好ましくは０．３ｍｍ以下と薄いため、貼り合わせの際に第１支持膜と第２支持膜の間に空気が入り込んでしまうと、加熱により膨張して第１支持膜と第２支持膜の間の導電体の接続に悪影響を与えるおそれがある。 In Patent Document 1, lamination of the first support film and the second support film may be performed by bonding accompanied by heating. Since the temperature sensor of Patent Document 1 is thin, with a thickness of 0.5 mm or less, preferably 0.3 mm or less, if air enters between the first support film and the second support film during bonding, heating will occur. There is a possibility that the expansion may adversely affect the connection of the conductor between the first support film and the second support film.
　以上より、本発明は、加熱による接合を伴う製造工程において第１支持膜と第２支持膜の間に存在する空気が膨張したとしても、第１支持膜と第２支持膜の間の導電体の接続を維持できる薄型の温度センサを提供することを目的とする。 As described above, according to the present invention, even if the air existing between the first supporting film and the second supporting film expands in the manufacturing process involving bonding by heating, the conductor between the first supporting film and the second supporting film It is an object of the present invention to provide a thin temperature sensor capable of maintaining a connection between
　本発明の温度センサは、電気絶縁材料からなり、互いに対向して配置される第１支持膜および第２支持膜と、第１支持膜と第２支持膜の間に設けられ、温度によって電気的特性が変化する感熱体を含むセンサ素子と、感熱体の周辺において第１支持膜と第２支持膜を接合する接合体と、を備える。
　接合体は、感熱体を間に挟み、第１支持膜および第２支持膜の平面方向に所定の間隔を隔てる少なくとも２つの領域に設けられる。 The temperature sensor of the present invention comprises a first supporting film and a second supporting film made of an electrically insulating material and arranged opposite to each other, and provided between the first supporting film and the second supporting film, and electrically controlled by temperature. A sensor element including a thermosensitive element whose characteristics change;
The joined body is provided in at least two regions with a predetermined interval in the planar direction of the first support film and the second support film, with the heat sensitive element interposed therebetween.
　本発明の温度センサにおいて、好ましくは、接合体に取り囲まれる領域に、電気絶縁性の樹脂材料から構成される、感熱体を覆う保護体が設けられる。 In the temperature sensor of the present invention, preferably, the area surrounded by the joined body is provided with a protector that covers the heat sensitive body and is made of an electrically insulating resin material.
　本発明の温度センサにおいて、好ましくは、第２支持膜は、第１支持膜よりも長さ方向の寸法が小さく、接合体は、幅方向に間隔を隔てる両側に設けられる。 In the temperature sensor of the present invention, preferably, the second support film has a smaller dimension in the length direction than the first support film, and the joined bodies are provided on both sides spaced apart in the width direction.
　本発明の温度センサにおいて、好ましくは、第１支持膜および第２支持膜の一方または双方は、保護体を構成する樹脂材料を充填する挿入通路が、その厚さ方向に貫通して設けられる。 In the temperature sensor of the present invention, preferably, one or both of the first supporting film and the second supporting film are provided with an insertion passage through which the resin material constituting the protective body is filled, penetrating in the thickness direction.
　本発明の温度センサにおいて、好ましくは、センサ素子は、第１支持膜であって第２支持膜に対向する同じ平面上に貼り付けられる、第１リードパターンおよび第２リードパターンを備える。第１支持膜は、感熱体を支持し、第１リードパターンと電気的に接続される第１導通パッドと、第２リードパターンと電気的に接続される第２導通パッドと、を備え、第２支持膜は、感熱体が設けられる領域に対向する面に第３導通パッドを備え、第２導通パッドと第３導通パッドの間に、感熱体に対応するダミー導電体が設けられる。 In the temperature sensor of the present invention, the sensor element preferably comprises a first lead pattern and a second lead pattern, which are the first support film and are attached on the same plane facing the second support film. The first support film supports the thermosensitive element and includes a first conductive pad electrically connected to the first lead pattern and a second conductive pad electrically connected to the second lead pattern; The second support film has third conductive pads on the surface facing the region where the heat sensitive element is provided, and a dummy conductor corresponding to the heat sensitive element is provided between the second conductive pad and the third conductive pad.
　本発明の温度センサの製造方法は、電気絶縁材料からなり、感熱体を備えるセンサ素子が一方の面に貼り付けられている第１支持膜と電気絶縁材料からなる第２支持膜とを、一方の面を第２支持膜に対向させた状態で積層する第１工程と、第１支持膜と第２支持膜とを接合体により接合する第２工程と、備える。
　本発明における第２工程において、接合体は、感熱体を間に挟み、かつ、感熱体と外部が通じる通路を有するように設けられる。 A method for manufacturing a temperature sensor according to the present invention comprises: a first supporting film made of an electrically insulating material and having a sensor element having a heat sensitive body attached to one surface thereof; and a second supporting film made of an electrically insulating material. and a second step of bonding the first supporting film and the second supporting film with a bonding body.
In the second step of the present invention, the joined body is provided so as to sandwich the heat sensitive element and to have a passage communicating between the heat sensitive element and the outside.
　本発明の温度センサの製造方法において、好ましくは、感熱体の周囲であって、第１支持膜と第２支持膜の間に、電気絶縁材料からなる樹脂材料を供給して保護体を形成する第３工程を備える。 In the method of manufacturing the temperature sensor of the present invention, preferably, a protective body is formed by supplying a resin material made of an electrically insulating material between the first supporting film and the second supporting film around the thermosensitive element. A third step is provided.
　本発明の温度センサの製造方法において、好ましくは、第１工程において、第１支持膜および第２支持膜は、幅方向および長さ方向を有し、第２支持膜は、第１支持膜よりも長さ方向の寸法が小さく、第２工程において、接合体は、幅方向に間隔を隔てる両側に設けられる。 In the temperature sensor manufacturing method of the present invention, preferably, in the first step, the first supporting film and the second supporting film have a width direction and a length direction, and the second supporting film The lengthwise dimension is also small, and in a second step, the joints are provided on both sides spaced apart in the width direction.
　本発明の温度センサの製造方法において、好ましくは、第１工程において、第１支持膜および第２支持膜の一方または双方は、その厚さ方向に貫通する挿入通路が設けられ、第３工程において、挿入通路を介して樹脂材料が供給される。 In the temperature sensor manufacturing method of the present invention, preferably, in the first step, one or both of the first supporting film and the second supporting film are provided with an insertion passage penetrating in the thickness direction thereof, and in the third step , the resin material is supplied through the insertion passage.
　本発明によれば、保護体が設けられる前においては、第１支持膜と第２支持膜の間に接合体が設けられていない通路が存在する。したがって、第１支持膜と第２支持膜の間で空気の膨張が生じたとしても、膨張した分だけ通路を通じて空気が外部に排出される。 According to the present invention, before the protective body is provided, there is a passage in which no bonded body is provided between the first supporting film and the second supporting film. Therefore, even if air expands between the first supporting film and the second supporting film, the expanded air is discharged to the outside through the passage.
第１実施形態に係る温度センサを示し、（ａ）は平面図、（ｂ）は底面図である。BRIEF DESCRIPTION OF THE DRAWINGS The temperature sensor which concerns on 1st Embodiment is shown, (a) is a top view, (b) is a bottom view. 第１実施形態に係る温度センサを構成する第１支持膜の要素を示し、（ａ）はベースの平面図、（ｂ）はカバーの平面図である。FIG. 2 shows elements of a first support film that constitute the temperature sensor according to the first embodiment, where (a) is a plan view of a base and (b) is a plan view of a cover. 第１実施形態に係る温度センサを構成する第２支持膜の要素を示し、（ａ）はベースの平面図、（ｂ）はカバーの平面図である。FIG. 4 shows elements of a second support film that constitute the temperature sensor according to the first embodiment, where (a) is a plan view of a base and (b) is a plan view of a cover. 第１実施形態に係る温度センサを示す、図１のＩＶ－ＩＶ線矢視断面図である。FIG. 2 is a cross-sectional view taken along line IV-IV in FIG. 1, showing the temperature sensor according to the first embodiment; 第１実施形態に係る温度センサを示す、図１のＶ－Ｖ線矢視断面図である。FIG. 2 is a cross-sectional view taken along the line VV in FIG. 1, showing the temperature sensor according to the first embodiment; 第１実施形態に係る温度センサを示す、図１のＶＩ－ＶＩ線矢視断面図である。FIG. 2 is a cross-sectional view taken along the line VI-VI in FIG. 1, showing the temperature sensor according to the first embodiment; 第１実施形態に係る温度センサに用いられるサーミスタを示す三面図であって、それぞれ平面図（ＰＶ）、側面図（ＳＶ）および正面図（ＦＶ）である。3A and 3B are trihedral views showing the thermistor used in the temperature sensor according to the first embodiment, which are respectively a plan view (PV), a side view (SV) and a front view (FV). 第１実施形態に係る温度センサを製造する手順であって、第１支持膜を製造する工程を示す図である。FIG. 4 is a diagram showing a procedure of manufacturing the temperature sensor according to the first embodiment, which is a process of manufacturing a first support film; 第１実施形態に係る温度センサを製造する手順であって、第２支持膜を製造する工程を示す図である。FIG. 10 is a diagram showing a procedure for manufacturing the temperature sensor according to the first embodiment, which is a process for manufacturing a second support film; 第１実施形態に係る温度センサを製造する手順であって、第１支持膜と第２支持膜を貼り合わせる工程を示す図である。FIG. 4 is a diagram showing a procedure for manufacturing the temperature sensor according to the first embodiment, which is a step of bonding a first support film and a second support film together; 第２実施形態に係る温度センサを示し、（ａ）は平面図、（ｂ）は底面図である。The temperature sensor which concerns on 2nd Embodiment is shown, (a) is a top view, (b) is a bottom view. 第２実施形態に係る温度センサを示す、図１のＸＩＩ－ＸＩＩ線矢視断面図である。FIG. 2 is a cross-sectional view taken along line XII-XII in FIG. 1, showing a temperature sensor according to a second embodiment; 第２実施形態に係る温度センサを示す、図１のＸＩＩＩ－ＸＩＩＩ線矢視断面図である。FIG. 2 is a cross-sectional view taken along line XIII-XIII in FIG. 1, showing a temperature sensor according to a second embodiment; （ａ）は実施形態に係る温度センサを示す平面図、（ｂ）はこの温度センサに接続される延長用支持膜を示す平面図である。1A is a plan view showing a temperature sensor according to an embodiment, and FIG. 1B is a plan view showing an extension support film connected to this temperature sensor; FIG. 実施形態に係る温度センサに延長用支持膜を接続する手順を示す図である。It is a figure which shows the procedure which connects the support membrane for extension to the temperature sensor which concerns on embodiment.
　以下、添付図面を参照しながら、本実施形態に係る温度センサについて説明する。以下で説明するのは、第１実施形態に係る温度センサ１と第２実施形態に係る温度センサ２である。 The temperature sensor according to this embodiment will be described below with reference to the accompanying drawings. The temperature sensor 1 according to the first embodiment and the temperature sensor 2 according to the second embodiment will be described below.
＜第１実施形態＞
［温度センサ１の全体構成：図1］
　図１に示されるように、温度センサ１は、センサ素子１０と、第１支持膜３０と、第１支持膜３０と貼り合せにより積層される第２支持膜５０と、を備えている。以下の説明においては、第１支持膜３０と第２支持膜５０はともに平面視した形状が矩形に形成され、第１支持膜３０に比べて第２支持膜５０は平面積が小さく設定される場合を例示して説明する。したがって、第２支持膜５０は第１支持膜３０の前方であって、感熱体１１が設けられる領域を含む一部だけを覆っている。 <First Embodiment>
[Overall configuration of temperature sensor 1: Fig. 1]
As shown in FIG. 1, the temperature sensor 1 includes a sensor element 10, a first support film 30, and a second support film 50 laminated on the first support film 30 by bonding. In the following description, both the first support film 30 and the second support film 50 are formed in a rectangular shape when viewed from above, and the plane area of the second support film 50 is set smaller than that of the first support film 30. A case is illustrated and demonstrated. Therefore, the second support film 50 is in front of the first support film 30 and covers only a part including the area where the heat sensitive element 11 is provided.
　温度センサ１において、図１に示されるように、センサ素子１０の感熱体１１が設けられる側を前（Ｆ）と定義し、前（Ｆ）の反対側を後（Ｂ）と定義する。前（Ｆ）は、場合によっては、前方（Ｆ）、前端（Ｆ）などと称される。後（Ｂ）についても同様である。
　また、温度センサ１において、図１に示されるように、幅方向（Ｗ）および長さ方向（Ｌ）が定義されるものとする。
　さらに、温度センサ１において、第２支持膜５０が設けられる側をおもて側と定義し、その反対側をうら側と定義する。 In the temperature sensor 1, as shown in FIG. 1, the side of the sensor element 10 on which the heat sensitive element 11 is provided is defined as the front (F), and the opposite side of the front (F) is defined as the rear (B). Front (F) is sometimes referred to as front (F), front edge (F), and so on. The same applies to the rear (B).
Moreover, in the temperature sensor 1, as shown in FIG. 1, the width direction (W) and the length direction (L) shall be defined.
Furthermore, in the temperature sensor 1, the side on which the second support film 50 is provided is defined as the front side, and the opposite side is defined as the back side.
［センサ素子１０：図１，図２，図３，図４，図５］
　第１支持膜３０と第２支持膜５０の間に、以下説明するように、センサ素子１０の要部が設けられる。
　センサ素子１０は、図１および図２に示されるように、銅箔からなる第１導通パッド１４と、第１導通パッド１４に電気的に接続されるサーミスタを構成要素とする感熱体１１と、感熱体１１に電気的に接続される第１リードパターン１２と、を備える。また、センサ素子１０は、銅箔からなる第２導通パッド１５と、第２導通パッド１５に電気的に接続される第２リードパターン１６と、を備える。センサ素子１０は、第２導通パッド１５に電気的に接続されるダミー導電体９を備える。このダミー導電体９は感熱体１１に対応して設けられる。 [Sensor element 10: FIGS. 1, 2, 3, 4, and 5]
Between the first support film 30 and the second support film 50, a main part of the sensor element 10 is provided as described below.
As shown in FIGS. 1 and 2, the sensor element 10 includes a first conductive pad 14 made of copper foil, a thermosensitive element 11 having a thermistor electrically connected to the first conductive pad 14, and a first lead pattern 12 electrically connected to the thermosensitive element 11 . The sensor element 10 also includes a second conductive pad 15 made of copper foil and a second lead pattern 16 electrically connected to the second conductive pad 15 . The sensor element 10 comprises dummy conductors 9 electrically connected to the second conductive pads 15 . This dummy conductor 9 is provided corresponding to the heat sensitive element 11 .
　感熱体１１および第１導通パッド１４は、図１および図４に示されるように、温度センサ１の前端（Ｆ）の近くであって、幅方向（Ｗ）の中央まで延びて配置される。また、第２導通パッド１５は、感熱体１１よりも後端（Ｂ）寄りであって、幅方向（Ｗ）の中央まで延びて配置される。つまり、感熱体１１（第１導通パッド１４）およびダミー導電体９（第２導通パッド１５）は、長さ方向（Ｌ）に間隔があけられ、前端（Ｆ）の側から感熱体１１、第２導通パッド１５の順に、温度センサ１を幅方向（Ｗ）に二等分する位置に並んで配置される。 As shown in FIGS. 1 and 4, the thermosensitive element 11 and the first conductive pad 14 are arranged near the front end (F) of the temperature sensor 1 and extend to the center in the width direction (W). Further, the second conductive pad 15 is arranged closer to the rear end (B) than the thermosensitive element 11 and extends to the center in the width direction (W). That is, the heat sensitive element 11 (first conductive pad 14) and the dummy conductor 9 (second conductive pad 15) are separated from each other in the longitudinal direction (L), and are separated from the front end (F) side by the heat sensitive element 11, the The two conductive pads 15 are arranged side by side in order to bisect the temperature sensor 1 in the width direction (W).
　第１リードパターン１２は、図１および図２に示されるように、感熱体１１（第１導通パッド１４）から幅方向（Ｗ）の一方（図１（ａ）中、右方）に引き出されてから、後端（Ｂ）に向けて真っ直ぐに延びており、平面視してＬ字状の形状をなす。第１リードパターン１２の後端（Ｂ）の側には、第１端子パッド１３が電気的に接続される。第１端子パッド１３は、第１リードパターン１２よりも幅が広く形成されており、外部の端子などと接続される。
　第２リードパターン１６は、図１および図２に示されるように、ダミー導電体９（第２導通パッド１５）から幅方向（Ｗ）の他方（図１（ａ）中、左方）に引き出されてから、後端（Ｂ）に向けて真っ直ぐに延びており、平面視してＬ字状の形状をなす。第２リードパターン１６の後端（Ｂ）の側には、第２端子パッド１７が電気的に接続される。第２端子パッド１７は、第２リードパターン１６よりも幅が広く形成されており、外部の端子などと接続される。 As shown in FIGS. 1 and 2, the first lead pattern 12 is drawn out from the thermosensitive element 11 (first conductive pad 14) in one width direction (W) (to the right in FIG. 1(a)). From there, it extends straight toward the rear end (B), and has an L-shape in plan view. A first terminal pad 13 is electrically connected to the rear end (B) side of the first lead pattern 12 . The first terminal pad 13 is formed wider than the first lead pattern 12 and is connected to an external terminal or the like.
As shown in FIGS. 1 and 2, the second lead pattern 16 extends from the dummy conductor 9 (second conductive pad 15) to the other side of the width (W) (to the left in FIG. 1(a)). It extends straight toward the rear end (B) after being drawn, and has an L-shape in plan view. A second terminal pad 17 is electrically connected to the rear end (B) side of the second lead pattern 16 . The second terminal pad 17 is formed wider than the second lead pattern 16 and is connected to an external terminal or the like.
　第１リードパターン１２と第２リードパターン１６は、図１および図２に示されるように、一例として同じ幅を有するとともに、互いに平行に配設される。第１リードパターン１２と第２リードパターン１６は、第１支持膜３０に形成された導電材料、例えば銅合金からなる箔より構成される。第１支持膜３０および第２支持膜５０は、いわゆる片面ＦＰＣ（Flexible Printed Circuits：フレキシブルプリント回路）からなり、第１リードパターン１２、第１端子パッド１３、第２リードパターン１６および第２端子パッド１７は、ＦＰＣの回路部分に相当する。
　第１リードパターン１２および第２リードパターン１６は、後述するベース３１とカバー３３の間に挟まれ、第１支持膜３０の厚さ方向の内部に埋設されている。これに対し、第１リードパターン１２および第２リードパターン１６に接続される第１端子パッド１３および第２端子パッド１７は、第１支持膜３０の後端（Ｂ）の近傍において、カバー３３が途切れることで、おもて面の側に開放される。 As shown in FIGS. 1 and 2, the first lead pattern 12 and the second lead pattern 16 have, for example, the same width and are arranged parallel to each other. The first lead pattern 12 and the second lead pattern 16 are made of foil made of a conductive material, such as a copper alloy, formed on the first support film 30 . The first support film 30 and the second support film 50 are composed of so-called single-sided FPCs (Flexible Printed Circuits), and include first lead patterns 12, first terminal pads 13, second lead patterns 16 and second terminal pads. 17 corresponds to the circuit portion of the FPC.
The first lead pattern 12 and the second lead pattern 16 are sandwiched between a base 31 and a cover 33, which will be described later, and are buried inside the first support film 30 in the thickness direction. On the other hand, the first terminal pad 13 and the second terminal pad 17 connected to the first lead pattern 12 and the second lead pattern 16 are located near the rear end (B) of the first support film 30 when the cover 33 is closed. By breaking off, it opens to the side of the front surface.
　センサ素子１０は、図１および図３に示されるように、感熱体１１（第１導通パッド１４）と第２導通パッド１５とを電気的に接続する第３Ａ導通パッド１８、第３Ｂ導通パッド１９および第３Ｃ導通パッド２１を備える。第３Ａ導通パッド１８は感熱体１１および第１導通パッド１４に対応する位置に設けられ、第２リードパターン１６と第３Ａ導通パッド１８は感熱体１１を間に挟んで電気的に接続される。また、第３Ｂ導通パッド１９は第２導通パッド１５に対応する位置に設けられ、第２導通パッド１５は第３導通パッド１９に電気的に接続される。第３Ａ導通パッド１８と第３Ｂ導通パッド１９は、第３Ｃ導通パッド２１により電気的に接続される。第３Ａ導通パッド１８、第３Ｂ導通パッド１９および第３Ｃ導通パッド２１は一体に形成され、第２支持膜５０に貼り付けられている。 As shown in FIGS. 1 and 3, the sensor element 10 includes a 3A conductive pad 18 and a 3B conductive pad 19 electrically connecting the thermosensitive element 11 (first conductive pad 14) and the second conductive pad 15. and a third C conductive pad 21 . The 3A conductive pad 18 is provided at a position corresponding to the heat sensitive element 11 and the first conductive pad 14, and the second lead pattern 16 and the 3A conductive pad 18 are electrically connected with the heat sensitive element 11 interposed therebetween. Also, the 3B conductive pad 19 is provided at a position corresponding to the second conductive pad 15 , and the second conductive pad 15 is electrically connected to the third conductive pad 19 . The 3A conductive pad 18 and the 3B conductive pad 19 are electrically connected by the 3C conductive pad 21 . The 3A conductive pad 18 , the 3B conductive pad 19 and the 3C conductive pad 21 are integrally formed and attached to the second support film 50 .
　感熱体１１は、図７に示されるように、サーミスタ１１Ａと、サーミスタ１１Ａの一方の面の側に設けられる第１電極１１Ｂと、サーミスタ１１Ａの他方の面の側に設けられる第２電極１１Ｃと、を備えている。感熱体１１は、一例として、第１電極１１Ｂが第１導通パッド１４に対向し、第２電極１１Ｃが第３Ａ導通パッド１８に対向して配置される。つまり、感熱体１１は、温度センサ１の表裏に沿って第１電極１１Ｂおよび第２電極１１Ｃが配置される。この感熱体１１の配置にも関わらず、温度センサ１の第１リードパターン１２および第２リードパターン１６は、同じ平面上に形成される。 As shown in FIG. 7, the thermosensitive element 11 includes a thermistor 11A, a first electrode 11B provided on one side of the thermistor 11A, and a second electrode 11C provided on the other side of the thermistor 11A. , is equipped with As an example, the thermosensitive element 11 is arranged so that the first electrode 11B faces the first conductive pad 14 and the second electrode 11C faces the 3A conductive pad 18 . That is, the thermosensitive element 11 has the first electrode 11B and the second electrode 11C arranged along the front and back sides of the temperature sensor 1 . The first lead pattern 12 and the second lead pattern 16 of the temperature sensor 1 are formed on the same plane regardless of this arrangement of the thermosensitive element 11 .
　サーミスタ１１Ａは、温度変化に対して電気抵抗の変化が大きい特性を有する。サーミスタには、温度が上がると抵抗値が下がるＮＴＣ（Negative Temperature Coefficient）サーミスタと、ある温度まで抵抗値が一定で、ある温度を境に急激に抵抗値が高くなるＰＴＣ（Ｐpositive Temperature Coefficient）サーミスタがある。本実施形態のサーミスタ１１Ａには、ＮＴＣおよびＰＴＣのいずれのサーミスタも適用できる。
　第１電極１１Ｂおよび第１電極１１Ｂは、金、銀、銅および白金等から構成され、サーミスタ１１Ａの表裏両面に蒸着などの手段により形成される。
　本実施形態にかかるサーミスタ１１Ａは、例えば幅方向（Ｗ）、長さ方向（Ｌ）および厚さ方向の寸法が０．３～０．５ｍｍの範囲を有している。感熱体１１は、サーミスタ１１Ａ、第１電極１１Ｂおよび第２電極１１Ｃを周囲から覆うガラスなどの保護層が設けられていない。これにより感熱体１１の寸法が小さくされる。 The thermistor 11A has a characteristic that its electrical resistance changes greatly with temperature changes. There are two types of thermistors: NTC (Negative Temperature Coefficient) thermistors whose resistance value decreases as the temperature rises, and PTC (Positive Temperature Coefficient) thermistors whose resistance value is constant up to a certain temperature and rises sharply after that temperature. be. Both NTC and PTC thermistors can be applied to the thermistor 11A of the present embodiment.
The first electrode 11B and the first electrode 11B are made of gold, silver, copper, platinum, or the like, and are formed on both front and back surfaces of the thermistor 11A by vapor deposition or the like.
The thermistor 11A according to this embodiment has dimensions in the width direction (W), the length direction (L) and the thickness direction, for example, in the range of 0.3 to 0.5 mm. The thermosensitive element 11 is not provided with a protective layer such as glass that covers the thermistor 11A, the first electrode 11B and the second electrode 11C from the surroundings. As a result, the size of the heat sensitive element 11 is reduced.
［第１支持膜３０：図２，図４，図５，図６］
　次に、温度センサ１のうら側に設けられる第１支持膜３０について説明する。
　第１支持膜３０は、センサ素子１０を支持する要素であり、一例としてＦＰＣから構成される。このＦＰＣは、図２、図４～図６に示されるように、ベース３１と、ベース３１と対向して設けられるカバー３３と、ベース３１の表面であって、カバー３３の切りかかれた収容穴４３，４５に設けられる導電パターン３５と、を備える。センサ素子１０の構成要素である第１リードパターン１２、第１端子パッド１３、第１導通パッド１４、第２導通パッド１５、第２リードパターン１６および第２端子パッド１７は、導電パターン３５から構成される。つまり、第１リードパターン１２および第２リードパターン１６のおもて面側の同じ平面上に設けられる。図４および図５などにおけるベース３１、カバー３３および導電パターン３５の形状および厚さは実体を反映しているわけではない。また、本実施形態において、膜とは面積に対して厚さが十分に薄い部材をいう。ＦＰＣにおいて、ベース３１、カバー３３および導電パターン３５は、例えばそれぞれが５０μｍ以下、好ましくは３０μｍ、より好ましくは２０μｍ以下とされるが、その面積は５０ｍｍ２を優に超える。また、本実施形態における膜とは、その剛性と直接的には結び付かない。つまり、片持ち構造としたときに、自重によって偏平な原形をとどめずに支持部分から折れ曲がる程度から、偏平な状態を維持できる程度までを包含する。 [First supporting film 30: FIGS. 2, 4, 5 and 6]
Next, the first support film 30 provided on the back side of the temperature sensor 1 will be described.
The first support film 30 is an element that supports the sensor element 10, and is made of FPC, for example. As shown in FIGS. 2 and 4 to 6, this FPC consists of a base 31, a cover 33 provided opposite to the base 31, and an accommodating hole cut in the cover 33 on the surface of the base 31. and a conductive pattern 35 provided on 43 and 45 . The first lead pattern 12 , the first terminal pad 13 , the first conductive pad 14 , the second conductive pad 15 , the second lead pattern 16 and the second terminal pad 17 , which are the components of the sensor element 10 , are composed of the conductive pattern 35 . be done. That is, the first lead pattern 12 and the second lead pattern 16 are provided on the same plane on the front surface side. The shapes and thicknesses of the base 31, the cover 33, and the conductive pattern 35 in FIGS. 4 and 5 do not necessarily reflect the reality. Further, in the present embodiment, the term "film" refers to a member having a sufficiently thin thickness with respect to its area. In the FPC, the base 31, the cover 33 and the conductive pattern 35 each have a size of, for example, 50 μm or less, preferably 30 μm, more preferably 20 μm or less, and their area is well over 50 mm 2 . Also, the membrane in this embodiment is not directly related to its rigidity. In other words, it includes the extent to which, when a cantilever structure is used, it bends from the supporting portion without retaining its original flat shape due to its own weight, to the extent to which the flat state can be maintained.
　ベース３１およびカバー３３は、電気絶縁材料、一例としてポリイミドから構成され、導電パターン３５は、一例として銅箔から構成される。ＦＰＣの製造工程は周知であるので、ここでの説明を省略する。なお、ベース３１と導電パターン３５の間、および、カバー３３と導電パターン３５の間には、接着剤による接合層が形成されることがあるが、図４、図５および図６には記載が省略される。 The base 31 and the cover 33 are made of an electrically insulating material such as polyimide, and the conductive pattern 35 is made of copper foil as an example. Since the FPC manufacturing process is well known, the description is omitted here. Bonding layers made of an adhesive may be formed between the base 31 and the conductive pattern 35 and between the cover 33 and the conductive pattern 35, but are not shown in FIGS. Omitted.
［第２支持膜５０：図３，図４，図５，図６］
　次に、温度センサ１のおもて側に設けられる第２支持膜５０について説明する。
　第２支持膜５０は、感熱体１１と第２導通パッド１５とを電気的に接続するための構成要素である。
　第２支持膜５０も第１支持膜３０と同様にＦＰＣから構成され、図３、図４～図６に示されるように、ベース５１と、ベース５１と対向して設けられるカバー５３と、導電パターン５５と、を備える。第２支持膜５０における導電パターン５５は、感熱体１１と電気的に接続されるのに加えて、第２導通パッド１５と電気的に接続される。
　センサ素子１０の構成要素である第３Ａ導通パッド１８、第３Ｂ導通パッド１９および第３Ｃ導通パッド２１は、導電パターン５５から構成される。したがって。第３Ａ導通パッド１８、第３Ｂ導通パッド１９および第３Ｃ導通パッド２１は、第２支持膜５０であって第１支持膜３０に対向する同じ平面上に貼り付けられている。 [Second support film 50: FIGS. 3, 4, 5, and 6]
Next, the second support film 50 provided on the front side of the temperature sensor 1 will be described.
The second support film 50 is a component for electrically connecting the thermosensitive element 11 and the second conductive pads 15 .
Like the first support film 30, the second support film 50 is also made of FPC, and as shown in FIGS. a pattern 55; The conductive pattern 55 on the second support film 50 is electrically connected to the second conductive pad 15 in addition to being electrically connected to the thermal sensitive element 11 .
The 3A conductive pad 18 , the 3B conductive pad 19 , and the 3C conductive pad 21 , which are components of the sensor element 10 , are composed of conductive patterns 55 . therefore. The 3A conductive pad 18 , the 3B conductive pad 19 and the 3C conductive pad 21 are attached on the same plane of the second support film 50 facing the first support film 30 .
　次に、導電パターン５５は、図３に示されるように、センサ素子１０の構成要素である第３Ａ導通パッド１８、第３Ｂ導通パッド１９および第３Ｃ導通パッド２１を構成する。導電パターン５５には、第３Ａ導通パッド１８と第３Ｂ導通パッド１９の間に絶縁空隙５６が形成される。この絶縁空隙５６は、導電パターン５５のみならずベース５１を含めて厚さ方向に貫通する。ベース５１とカバー５３が積層されると、長さ方向（Ｌ）において、絶縁空隙５６はカバー５３の収容穴６３と収容穴６５の間に配置される。 Next, the conductive pattern 55 constitutes the 3A conductive pad 18, the 3B conductive pad 19 and the 3C conductive pad 21, which are constituent elements of the sensor element 10, as shown in FIG. An insulating gap 56 is formed in the conductive pattern 55 between the 3A conductive pad 18 and the 3B conductive pad 19 . The insulating gap 56 penetrates not only the conductive pattern 55 but also the base 51 in the thickness direction. When the base 51 and the cover 53 are stacked, the insulating gap 56 is arranged between the receiving holes 63 and 65 of the cover 53 in the length direction (L).
［第１支持膜３０と第２支持膜５０の貼り合せ構造：図１，図４，図５，図６］
　第１支持膜３０と第２支持膜５０は、接合体としての両面テープ５４により貼り合される。
　両面テープ５４は、図１、図５および図６に示されるように、第１支持膜３０および第２支持膜５０の幅方向（Ｗ）の両側のそれぞれに設けられ、第１支持膜３０と第２支持膜５０とを貼り合わせている。両面テープ５４で貼り合わされるのは幅方向（Ｗ）の両側だけであるから、図４、図５および図６に示されるように、幅方向（Ｗ）の両側にある両面テープ５４，５４の間には、長さ方向（Ｌ）に連通する空隙が存在する。この空隙には電気絶縁性の樹脂材料からなる保護体７が設けられ、この保護体７はダミー導電体９、感熱体１１、接合体３７，３９，５７，５９の周囲を覆う。保護体７は、当該空隙を有する温度センサ１を作製した後に、この空隙に樹脂材料を注入することで得られる。こうして、幅方向（Ｗ）の両側にある両面テープ５４，５４は、感熱体１１の周辺において第１支持膜３０と第２支持膜５０を接合する。保護体７を構成する樹脂材料は限定されないが、例えばエポキシ樹脂、シリコーン樹脂、シリコーンワニスなどが好適に用いられる。なお、第２支持膜５０は、第１支持膜３０と幅方向（Ｗ）の寸法は同じであるが、長さ方向（Ｌ）の寸法は小さい。 [Lamination Structure of First Support Film 30 and Second Support Film 50: FIGS. 1, 4, 5 and 6]
The first support film 30 and the second support film 50 are bonded together by a double-sided tape 54 as a bonded body.
As shown in FIGS. 1, 5 and 6, the double-sided tape 54 is provided on both sides of the first support film 30 and the second support film 50 in the width direction (W). The second support film 50 is attached. Since only both sides in the width direction (W) are bonded together with the double-sided tape 54, as shown in FIGS. Between them, there are gaps communicating in the length direction (L). A protector 7 made of an electrically insulating resin material is provided in the gap, and the protector 7 covers the dummy conductor 9, the heat sensitive member 11, and the joints 37, 39, 57, and 59. As shown in FIG. The protector 7 is obtained by injecting a resin material into the gap after manufacturing the temperature sensor 1 having the gap. In this way, the double- faced tapes 54, 54 on both sides in the width direction (W) join the first support film 30 and the second support film 50 around the heat sensitive element 11. As shown in FIG. Although the resin material forming the protector 7 is not limited, for example, epoxy resin, silicone resin, silicone varnish, etc. are preferably used. The second support film 50 has the same dimension in the width direction (W) as that of the first support film 30, but has a smaller dimension in the length direction (L).
　第１支持膜３０と第２支持膜５０の間の空隙は、二つの機能を発揮する。
　一つ目は、第１支持膜３０と第２支持膜５０を貼り合せる際に、第１支持膜３０と第２支持膜５０の間に存在する空気を外部に排出する機能である。この貼り合わせは加熱を伴うために、熱膨張した分の空気が排出される。
　二つ目は、保護体７を設ける際に、第１支持膜３０と第２支持膜５０の間に存在する空気を外部に排出する機能である。保護体７を構成する樹脂材料は狭い空隙に注入されるが、注入された樹脂材料の分だけ、空気が空隙を介して外部に排出される。
　以上の通りであり、保護体７が形成されるまでに存在する第１支持膜３０と第２支持膜５０の間の空隙は、空気を排出する通路ということができる。 The gap between the first support film 30 and the second support film 50 serves two functions.
The first function is to discharge the air existing between the first supporting film 30 and the second supporting film 50 to the outside when the first supporting film 30 and the second supporting film 50 are bonded. Since this bonding involves heating, the thermally expanded air is discharged.
The second function is to discharge the air existing between the first support film 30 and the second support film 50 to the outside when the protector 7 is provided. The resin material forming the protective body 7 is injected into a narrow gap, and the air corresponding to the amount of the injected resin material is discharged to the outside through the gap.
As described above, the gap between the first support film 30 and the second support film 50 that exists before the protector 7 is formed can be said to be a passage for discharging air.
［電気的な接続関係：図４，図５，図６］
　図４および図５に示されるように、感熱体１１と第１導通パッド１４の間には導電性の接合体３７が設けられ、感熱体１１と導電パターン５５の間には導電性の接合体５７が設けられる。また、図６に示されるように、第２導通パッド１５と導電パターン５５の間には導電性の接合体３９，接合体５９およびダミー導電体９が設けられる。こうして、センサ素子１０は、第１リードパターン１２、感熱体１１、ダミー導電体９および第２リードパターン１６により電気回路が構成される。つまり、センサ素子１０は、第１リードパターン１２、ダミー導電体９、第３Ｂ導通パッド１９、第３Ｃ導通パッド２１、第３Ａ導通パッド１８、感熱体１１、第１導通パッド１４、第２導通パッド１５および第２リードパターン１６の順で電気的に接続される。 [Electrical connections: FIGS. 4, 5, and 6]
As shown in FIGS. 4 and 5, a conductive joint 37 is provided between the heat sensitive element 11 and the first conductive pads 14, and a conductive joint 37 is provided between the heat sensitive element 11 and the conductive pattern 55. 57 are provided. Also, as shown in FIG. 6, a conductive joint 39, a joint 59 and a dummy conductor 9 are provided between the second conductive pad 15 and the conductive pattern 55. As shown in FIG. In this way, the sensor element 10 has an electric circuit composed of the first lead pattern 12 , the thermosensitive element 11 , the dummy conductor 9 and the second lead pattern 16 . That is, the sensor element 10 includes a first lead pattern 12, a dummy conductor 9, a third B conductive pad 19, a third C conductive pad 21, a third A conductive pad 18, a thermosensitive element 11, a first conductive pad 14, and a second conductive pad. 15 and the second lead pattern 16 are electrically connected in this order.
　接合体５７，５９などに用いられる材料は任意であり、例えば導電性接着剤が選択される。導電性接着剤は、エポキシ、ウレタンなどのバインダー樹脂の中に導電性のフィラーを分散させ、接着後にそれらのフィラーが導電パスを形成することで導電接合を達成する材料が広く適用される。導電性のフィラーとして、銅、ニッケル、銀などの金属粉のほか、グラファイトやＣＮＴ(カーボンナノチューブ）などの炭素系材料を用いることもできる。 Any material can be used for the joints 57 and 59, and for example, a conductive adhesive is selected. Conductive adhesives are widely used materials that achieve conductive bonding by dispersing conductive fillers in a binder resin such as epoxy or urethane, and forming conductive paths with these fillers after bonding. As the conductive filler, metal powder such as copper, nickel and silver, as well as carbon-based materials such as graphite and CNT (carbon nanotube) can be used.
［温度センサ１の製造方法］
　次に、図８～図１０を参照して、温度センサ１を製造する手順を説明する。
［第１支持膜３０：図８］
　はじめに、図８を参照して、第１支持膜３０について説明する。
　図８（ａ）に示されるように、第１支持膜３０の前駆体である第１ＦＰＣ４１が用意される。第１ＦＰＣ４１には、感熱体１１および接合体３７，３９の収容穴４３，４５がすでに形成される。収容穴４３，４５は、カバー３３をエッチングすることにより形成される。なお、第１ＦＰＣ４１において、第１支持膜３０と同じ構成要素については、第１支持膜３０と同じ符号を付けており、その説明を省略する。 [Manufacturing method of temperature sensor 1]
Next, the procedure for manufacturing the temperature sensor 1 will be described with reference to FIGS. 8 to 10. FIG.
[First supporting film 30: FIG. 8]
First, the first support film 30 will be described with reference to FIG.
As shown in FIG. 8A, a first FPC 41, which is a precursor of the first support film 30, is prepared. The first FPC 41 is already formed with housing holes 43 and 45 for the heat sensitive element 11 and the joints 37 and 39 . The receiving holes 43 , 45 are formed by etching the cover 33 . In the first FPC 41, the same components as those of the first support film 30 are denoted by the same reference numerals as those of the first support film 30, and descriptions thereof will be omitted.
　図８（ｂ）に示されるように、第１ＦＰＣ４１が備える収容穴４３，４５のそれぞれに、接合体３７，３９を塗布する。接合体３７，３９のそれぞれは、収容穴４３，４５において、第１導通パッド１４、第２導通パッド１５の表面に電気的に接続される。
　次いで、図８（ｃ）に示されるように、収容穴４３に配置される接合体３７の頂部に感熱体１１が置かれる。感熱体１１は、図示を省略する第１電極１１Ｂおよび第２電極１１Ｃの一方が接合体３７に接する。また、図８（ｃ）に示されるように、収容穴４５に配置される接合体３９の頂部にダミー導電体９が置かれる。ダミー導電体９は、感熱体１１と同じ形状および寸法を有する導電材料から構成される。ダミー導電体９は、感熱体１１が設けられる部位とダミー導電体９が設けられる部位の厚さ方向（Ｔ）の寸法を同等とするために設けられる。
　以上で得られる第１支持膜３０の前駆体である第１ＦＰＣ４１は、第２支持膜５０の前駆体である第２ＦＰＣ６１との貼り合わせに供される。 As shown in FIG. 8(b), the joining bodies 37 and 39 are applied to the receiving holes 43 and 45 of the first FPC 41, respectively. The joints 37 and 39 are electrically connected to the surfaces of the first conductive pads 14 and the second conductive pads 15 in the receiving holes 43 and 45, respectively.
Next, as shown in FIG. 8(c), the heat sensitive element 11 is placed on the top of the joined body 37 arranged in the receiving hole 43. Then, as shown in FIG. One of the first electrode 11</b>B and the second electrode 11</b>C (not shown) of the heat sensitive body 11 is in contact with the joint 37 . Also, as shown in FIG. 8(c), a dummy conductor 9 is placed on the top of the joint 39 arranged in the accommodation hole 45. As shown in FIG. The dummy conductor 9 is made of a conductive material having the same shape and dimensions as the heat sensitive body 11 . The dummy conductor 9 is provided to make the dimension in the thickness direction (T) of the part where the heat sensitive body 11 is arranged and the part where the dummy conductor 9 is arranged to be the same.
The first FPC 41 that is the precursor of the first support film 30 obtained above is used for bonding with the second FPC 61 that is the precursor of the second support film 50 .
［第２支持膜５０：図９］
　次に、図９を参照して、第２支持膜５０について説明する。
　図９（ａ）に示されるように、第２支持膜５０の前駆体である第２ＦＰＣ６１が用意される。第２ＦＰＣ６１には、予め接合体５７，５９が配置されるための収容穴６３，６５が形成されている。収容穴６３，６５は、一例として、カバー５３をレーザー加工することにより形成される。なお、第２ＦＰＣ６１において、第２支持膜５０と同じ構成要素については、第２支持膜５０と同じ符号を付けており、その説明を省略する。 [Second support film 50: FIG. 9]
Next, the second support film 50 will be described with reference to FIG.
As shown in FIG. 9A, a second FPC 61, which is a precursor of the second support film 50, is prepared. The second FPC 61 is preliminarily formed with housing holes 63 and 65 for arranging the joints 57 and 59 . The accommodation holes 63 and 65 are formed by laser processing the cover 53 as an example. In the second FPC 61, the same components as those of the second support film 50 are denoted by the same reference numerals as those of the second support film 50, and descriptions thereof are omitted.
　図９（ｂ）に示されるように、第２ＦＰＣ６１が備える収容穴６３，６５のそれぞれに、接合体５７，５９を塗布する。接合体５７，５９は、収容穴６３，６５において、第３Ｂ導通パッド１９の表面に電気的に接続される。加えて、第２ＦＰＣ６１には、両面テープ５４がカバー５３に貼り付けられている。両面テープ５４は、図５などに示されるように、幅方向（Ｗ）の両側に設けられる。
　以上で得られる第２ＦＰＣ６１は第１ＦＰＣ４１との貼り合わせに供される。 As shown in FIG. 9(b), the joining bodies 57 and 59 are applied to the receiving holes 63 and 65 of the second FPC 61, respectively. The joints 57 and 59 are electrically connected to the surface of the 3B conductive pad 19 in the receiving holes 63 and 65, respectively. In addition, a double-sided tape 54 is attached to the cover 53 of the second FPC 61 . The double-sided tapes 54 are provided on both sides in the width direction (W) as shown in FIG.
The second FPC 61 thus obtained is used for bonding with the first FPC 41 .
［第１ＦＰＣ４１と第２ＦＰＣ６１の貼り合せ：図１０］
　次に、図１０（ａ）に示されるように、第１ＦＰＣ４１と第２ＦＰＣ６１とを位置合わせをする。第１ＦＰＣ４１と第２ＦＰＣ６１とは、カバー３３とカバー５３（両面テープ５４）とが対向するように配置される。この位置合わせは、第１ＦＰＣ４１の接合体３７，３９と第２ＦＰＣ６１の接合体５７，５９とが長さ方向（Ｌ）において、同じ位置に置かれることをいう。
　第１ＦＰＣ４１と第２ＦＰＣ６１とを位置合わせした後に、第１ＦＰＣ４１と第２ＦＰＣ６１とを積層する（第１工程）。このとき、図１０（ｂ）に示されるように、接合体５７と感熱体１１が接触し、接合体５９とダミー導電体９が接触する。積層した状態で、第１ＦＰＣ４１のカバー３３と第２ＦＰＣ６１のカバー５３とを接合する（第２工程）。この接合は両面テープ５４を介して行われる。 [Lamination of first FPC 41 and second FPC 61: FIG. 10]
Next, as shown in FIG. 10A, the first FPC 41 and the second FPC 61 are aligned. The first FPC 41 and the second FPC 61 are arranged so that the cover 33 and the cover 53 (double-sided tape 54) face each other. This alignment means that the joined bodies 37, 39 of the first FPC 41 and the joined bodies 57, 59 of the second FPC 61 are placed at the same position in the length direction (L).
After aligning the first FPC 41 and the second FPC 61, the first FPC 41 and the second FPC 61 are laminated (first step). At this time, as shown in FIG. 10(b), the bonded body 57 and the heat sensitive body 11 are brought into contact, and the bonded body 59 and the dummy conductor 9 are brought into contact with each other. In the laminated state, the cover 33 of the first FPC 41 and the cover 53 of the second FPC 61 are joined (second step). This joining is performed via double-sided tape 54 .
　その後、カバー３３とカバー５３の間の隙間である通路ＡＰに向けて、保護体７を構成するための樹脂材料ＲＭが注入される。注入された樹脂材料ＲＭが硬化することで、図４～図６で示される保護体７が形成される（第３工程）。保護体７が形成されることで通路ＡＰは樹脂材料ＲＭで満たされる。
　以上の手順により、温度センサ１が得られる。 After that, a resin material RM for forming the protector 7 is injected toward the passage AP, which is the gap between the cover 33 and the cover 53 . By curing the injected resin material RM, the protector 7 shown in FIGS. 4 to 6 is formed (third step). The path AP is filled with the resin material RM by forming the protector 7 .
The temperature sensor 1 is obtained by the above procedure.
［第１実施形態が奏する効果］
　次に、温度センサ１が奏する効果について説明する。
［第１の効果：長さ方向（Ｌ）の隙間］
　温度センサ１において、第１支持膜３０と第２支持膜５０との幅方向（Ｗ）の両端だけが長さ方向（Ｌ）に沿う両面テープ５４で貼り合わされる。保護体７のための樹脂材料の供給の前までは、両面テープ５４の部分を除いて、温度センサ１の長さ方向（Ｌ）にわたって空隙が設けられる。つまり、温度センサ１は、第１支持膜３０と第２支持膜５０の間に長さ方向（Ｌ）に連なる通路ＡＰが形成される。
　ここで、仮に第１支持膜３０と第２支持膜５０の間において、幅方向（Ｗ）および長さ方向（Ｌ）の通気が遮断され、膨張した空気の逃げ場が失われると、膨張した空気によって導通部分に圧力が加わって接続不良が生じるおそれがある。
　これに対して、長さ方向（Ｌ）に通路ＡＰを備えていた温度センサ１によれば、第１支持膜３０と第２支持膜５０の間で空気の膨張が生じたとしても、膨張した分だけ通路ＡＰを通じて空気が外部に排出される。 [Effect of the first embodiment]
Next, the effects of the temperature sensor 1 will be described.
[First Effect: Gap in Length Direction (L)]
In the temperature sensor 1, only both ends in the width direction (W) of the first support film 30 and the second support film 50 are attached together with double-sided tape 54 along the length direction (L). A gap is provided in the length direction (L) of the temperature sensor 1 except for the portion of the double-sided tape 54 before supplying the resin material for the protector 7 . That is, in the temperature sensor 1 , a passage AP is formed between the first support film 30 and the second support film 50 and continues in the length direction (L).
Here, if ventilation in the width direction (W) and the length direction (L) is blocked between the first support film 30 and the second support film 50, and the expanded air cannot escape, the expanded air There is a risk that pressure will be applied to the conductive part and connection failure will occur.
On the other hand, according to the temperature sensor 1 having the passage AP in the length direction (L), even if the air expands between the first support film 30 and the second support film 50, the expansion occurs. The air is discharged to the outside through the passage AP.
［第２の効果：段差解消］
　温度センサ１は、接合体３９と接合体５９の間に、感熱体１１と同等の厚さを有するダミー導電体９を設ける。これにより、感熱体１１を間に備える接合体３７から接合体５７までの厚さ方向（Ｔ）の寸法と、ダミー導電体９を間に備える接合体３９から接合体５９までの厚さ方向（Ｔ）の寸法を同等にすることができる。これにより、温度センサ１は、感熱体１１が配置される部位およびダミー導電体９が配置される部位を含めて、厚さ方向（Ｔ）の寸法を均一にできる。
　ここで、仮にダミー導電体９が存在しなければ、感熱体１１が配置される部位の厚さ方向（Ｔ）の寸法が他の部位より大きくなる。そうすると、第１支持膜３０と第２支持膜５０を熱圧着する際に、第２支持膜５０にはこの寸法の際に基づく応力が生じるため、感熱体１１が設けられる部位の接合が容易でなくなる。
　これに対して、温度センサ１は、感熱体１１が配置される部位およびダミー導電体９が配置される部位を含めて、厚さ方向（Ｔ）の寸法を均一にできるので、接合の障害となる応力が生じにくい。 [Second effect: elimination of steps]
The temperature sensor 1 has a dummy conductor 9 having a thickness equivalent to that of the heat sensitive element 11 between the joint 39 and the joint 59 . As a result, the dimension in the thickness direction (T) from the bonded body 37 with the heat sensitive element 11 to the bonded body 57 and the thickness direction (T) from the bonded body 39 with the dummy conductor 9 in the middle to the bonded body 59 The dimensions of T) can be made equivalent. As a result, the temperature sensor 1 can have uniform dimensions in the thickness direction (T), including the portion where the heat sensitive element 11 is arranged and the portion where the dummy conductor 9 is arranged.
Here, if the dummy conductor 9 were not present, the dimension in the thickness direction (T) of the portion where the heat sensitive element 11 is arranged would be larger than the other portions. Then, when the first support film 30 and the second support film 50 are thermocompressed, the second support film 50 is stressed due to this dimension, so that it is easy to bond the part where the thermosensitive element 11 is provided. Gone.
On the other hand, the temperature sensor 1 can have uniform dimensions in the thickness direction (T), including the portion where the heat sensitive element 11 is arranged and the portion where the dummy conductor 9 is arranged. stress is less likely to occur.
［第３の効果：薄型化］
　温度センサ１は、感熱体１１がガラスなどの保護層を備えていないのに加えて、ＦＰＣの技術を利用することで第１支持膜３０および第２支持膜５０を含む全体の厚さを、０．５ｍｍ以下、好ましくは０．３ｍｍ以下の薄型化を実現できる。 [Third effect: reduction in thickness]
In addition to the fact that the thermosensitive element 11 does not have a protective layer such as glass, the temperature sensor 1 utilizes FPC technology to measure the total thickness of the first support film 30 and the second support film 50. A thickness reduction of 0.5 mm or less, preferably 0.3 mm or less can be realized.
［第４の効果：貼り合わせの範囲］
　次に、温度センサ１は、第１支持膜３０と第２支持膜５０が貼り合わされて形成されるが、第２支持膜５０は第１支持膜３０の一部、特に感熱体１１を第１リードパターン１２と第２リードパターン１６の両者に電気的に接続する領域に限って第１支持膜３０を覆っている。
　ここで、２枚のフィルムを貼り合わせる際に、フィルムの面積が大きくなるほど、貼り合わせるのが難しくなり、シワがよるなどの不具合が生じるおそれが大きくなる。また、フィルムの面積が大きくなるほど、材料費が高くなる。
　以上に対して温度センサ１は、第２支持膜５０の表面積が小さいので、第１支持膜３０と貼り合せる作業が容易になるとともに、材料費を抑えることができる。 [Fourth effect: Bonding range]
Next, the temperature sensor 1 is formed by bonding the first support film 30 and the second support film 50 together. The first support film 30 is covered only in areas electrically connected to both the lead pattern 12 and the second lead pattern 16 .
Here, when two films are pasted together, the larger the area of the films, the more difficult it is to stick them together, and the greater the risk of causing problems such as wrinkling. Also, the larger the area of the film, the higher the material cost.
In contrast to the above, in the temperature sensor 1, since the surface area of the second support film 50 is small, the work of attaching it to the first support film 30 is facilitated, and the material cost can be suppressed.
［第５の効果：感熱体１１の位置］
　温度センサ１は、第２導通パッド１５よりも感熱体１１が前端（Ｆ）に近い位置に設けられている。このように、感熱体１１が最も前端（Ｆ）に近ければ、狭いスペースの奥に温度の測定対象があったとしても、このスペースに前端（Ｆ）から温度センサ１を挿入すれば、感熱体１１を測定対象物に近接させることができる。これにより、温度センサ１は測定対象物の温度を精度よく測定できる。
　また、温度センサ１は、幅方向（Ｗ）の中央に感熱体１１が配置される。したがって、測定対象部の熱源の中心に感熱体１１の位置を合わせれば、熱源からの熱を効率よく吸収できる。これによっても、温度センサ１は測定対象物の温度を精度よく測定できる。
　ただし、本発明の温度センサは、これらの位置に限らず、他の位置に感熱体１１を配置できる。例えば、測定対象物の位置に基づいて、感熱体１１が電気的に接続される第１導通パッド１４と第２導通パッド１５の位置を長さ方向Ｌにおいて逆にすることができるし、感熱体１１の位置を幅方向（Ｗ）の中央から変位させることもできる。 [Fifth Effect: Position of Heat Sensitive Body 11]
The temperature sensor 1 is provided at a position where the thermal element 11 is closer to the front end (F) than the second conductive pad 15 is. In this way, if the thermosensitive element 11 is closest to the front end (F), even if the temperature to be measured is at the back of a narrow space, if the temperature sensor 1 is inserted into this space from the front end (F), the thermosensitive element 11 can be brought close to the object to be measured. Thereby, the temperature sensor 1 can accurately measure the temperature of the object to be measured.
Further, the temperature sensor 1 has a heat sensitive element 11 arranged at the center in the width direction (W). Therefore, by aligning the heat sensitive element 11 with the center of the heat source of the part to be measured, the heat from the heat source can be efficiently absorbed. This also allows the temperature sensor 1 to accurately measure the temperature of the object to be measured.
However, the temperature sensor of the present invention is not limited to these positions, and the heat sensitive element 11 can be arranged at other positions. For example, the positions of the first conductive pad 14 and the second conductive pad 15 electrically connected to the thermosensitive element 11 can be reversed in the length direction L based on the position of the object to be measured. 11 can also be displaced from the center in the width direction (W).
［第６の効果：第１リードパターン１２と第２リードパターン１６の位置関係］
　次に、温度センサ１は、第１リードパターン１２および第２リードパターン１６が第１支持膜３０のベース３１とカバー３３の間に形成される。つまり、第１リードパターン１２と第２リードパターン１６は、同じ平面上に設けられる。これにより、温度センサ１の一方の面側から第１端子パッド１３および第２端子パッド１７への電線の接続作業を行うことができる。
　このように第１リードパターン１２と第２リードパターン１６とを同じ平面上に設けるために、上述した電気的な接続関係を採用している。 [Sixth Effect: Positional Relationship Between First Lead Pattern 12 and Second Lead Pattern 16]
Next, the temperature sensor 1 has the first lead pattern 12 and the second lead pattern 16 formed between the base 31 and the cover 33 of the first support film 30 . That is, the first lead pattern 12 and the second lead pattern 16 are provided on the same plane. Thereby, the work of connecting electric wires to the first terminal pads 13 and the second terminal pads 17 from one side of the temperature sensor 1 can be performed.
In order to provide the first lead pattern 12 and the second lead pattern 16 on the same plane as described above, the electrical connection relationship described above is employed.
＜第２実施形態：図１１～図１３＞
　次に、第２実施形態に係る温度センサ２について、図１１～図１３を参照して説明する。なお、以下では第１実施形態に係る温度センサ１との相違点について温度センサ２を説明することとし、温度センサ１と一致する部分については温度センサ１と同じ符号を図１１～図１３に付してその説明を省略する。 <Second Embodiment: FIGS. 11 to 13>
Next, a temperature sensor 2 according to a second embodiment will be described with reference to FIGS. 11 to 13. FIG. In the following, the temperature sensor 2 will be described with respect to differences from the temperature sensor 1 according to the first embodiment. and the description is omitted.
　温度センサ２は、保護体７を構成するための樹脂材料を供給するために、図１１および図１２に示されるように、第２支持膜５０に樹脂材料の挿入通路５２を設ける。なお、挿入通路５２は、第１支持膜３０に設けてもよいし、第１支持膜３０と第２支持膜５０の双方に設けてもよい。 The temperature sensor 2 is provided with an insertion path 52 for the resin material in the second support film 50, as shown in FIGS. The insertion path 52 may be provided in the first support film 30 or may be provided in both the first support film 30 and the second support film 50 .
　挿入通路５２は、図１１に示されるように、温度センサ２のセンサ素子１０よりも前方（Ｆ）であって幅方向（Ｗ）の中央に設けられる。また、挿入通路５２は、図１２に示されるように、第２支持膜５０の表裏を貫通し、通路ＡＰと連なる。図１２および図１３には保護体７が示されているが、第１支持膜３０と第２支持膜５０が貼り合わされた時点では、挿入通路５２と通路ＡＰは連通する空隙を形成している。 The insertion passage 52 is provided forward (F) from the sensor element 10 of the temperature sensor 2 and at the center in the width direction (W), as shown in FIG. Also, as shown in FIG. 12, the insertion path 52 penetrates the front and back of the second support film 50 and continues to the path AP. Although the protector 7 is shown in FIGS. 12 and 13, when the first support film 30 and the second support film 50 are bonded together, the insertion path 52 and the path AP form a gap communicating with each other. .
　第１支持膜３０と第２支持膜５０が貼り合わされた後に、挿入通路５２から溶融状態とされた樹脂材料が供給される。この樹脂材料は、センサ素子１０に向けて供給されることで、図１２および図１３に示されるように、センサ素子１０の周囲を取り囲んだ後に硬化する。これで、センサ素子１０は、樹脂材料からなる保護体７で取り囲まれ、温度測定する雰囲気に対して保護される。保護体７を構成する樹脂材料は限定されないが、例えばエポキシ樹脂、シリコーン樹脂、ワニスなどが好適に用いられる。 After the first support film 30 and the second support film 50 are bonded together, a molten resin material is supplied from the insertion passage 52 . The resin material is supplied toward the sensor element 10, surrounds the sensor element 10 as shown in FIGS. 12 and 13, and then hardens. The sensor element 10 is now surrounded by the protective body 7 made of a resin material and protected against the atmosphere whose temperature is to be measured. Although the resin material forming the protector 7 is not limited, for example, epoxy resin, silicone resin, varnish, etc. are preferably used.
　上記以外にも、本発明の主旨を逸脱しない限り、上記実施形態で挙げた構成を取捨選択したり、他の構成に適宜変更したりすることが可能である。
　例えば、図１４（ａ）に示される温度センサ１（第１実施形態）を標準品として用意しておくが、第１支持膜３０の部分を長くしたいという場合には、図１４（ｂ）に示される延長用支持膜５を温度センサ１に接続する。 In addition to the above, it is possible to select the configurations described in the above embodiments or to change them to other configurations as appropriate without departing from the gist of the present invention.
For example, the temperature sensor 1 (first embodiment) shown in FIG. 14(a) is prepared as a standard product. The extended support membrane 5 shown is connected to the temperature sensor 1 .
　延長用支持膜５は、ベース７１と、ベース７１のおもて面に形成される一対のリードパターン７２，７３と、を備える。また、延長用支持膜５は、リードパターン７２，７３の一方端にそれぞれが接続される端子パッド７４，７５と、リードパターン７２，７３の他方端にそれぞれが接続される端子パッド７６，７７と、を備える。さらに、延長用支持膜５は、端子パッド７４，７５のリードパターン７２，７３との接続部の近傍から、端子パッド７６，７７のリードパターン７２，７３との接続部の近傍までを覆うカバー８１を備える。カバー８１は、樹脂材料の充填口８３がその一方端に形成される。なお、ベース７１、リードパターン７２，７３、端子パッド７４，７５，７６，７７およびカバー８１は、第１支持膜３０および第２支持膜５０の対応する部位と同様の材料から構成される。また、ベース７１とカバー８１とは、接着剤、両面テープなどの手段により接合される。 The extension support film 5 includes a base 71 and a pair of lead patterns 72 and 73 formed on the front surface of the base 71 . The extension support film 5 includes terminal pads 74 and 75 connected to one ends of the lead patterns 72 and 73, respectively, and terminal pads 76 and 77 connected to the other ends of the lead patterns 72 and 73, respectively. , provided. Further, the extension support film 5 is covered with a cover 81 covering from the vicinity of the connection portions of the terminal pads 74 and 75 with the lead patterns 72 and 73 to the vicinity of the connection portions of the terminal pads 76 and 77 with the lead patterns 72 and 73. Prepare. The cover 81 has a resin material filling port 83 formed at one end thereof. The base 71, the lead patterns 72, 73, the terminal pads 74, 75, 76, 77 and the cover 81 are made of the same material as the corresponding parts of the first support film 30 and the second support film 50, respectively. Also, the base 71 and the cover 81 are joined by means such as an adhesive or double-sided tape.
　延長用支持膜５は、端子パッド７４，７５が設けられる側が温度センサ１と接続される。具体的には、図１４（ｂ）に示される側の面を裏返し、温度センサ１の第１端子パッド１３と端子パッド７４が接続され、温度センサ１の第２端子パッド１７と端子パッド７５が接続される。このとき、ベース７１と温度センサ１のベース３１とは例えば接着剤、両面テープなどの手段により接合される。 The extension support film 5 is connected to the temperature sensor 1 on the side where the terminal pads 74 and 75 are provided. Specifically, the surface on the side shown in FIG. 14B is turned over, the first terminal pad 13 and terminal pad 74 of the temperature sensor 1 are connected, and the second terminal pad 17 and terminal pad 75 of the temperature sensor 1 are connected. Connected. At this time, the base 71 and the base 31 of the temperature sensor 1 are bonded by means such as an adhesive or double-sided tape.
　ベース７１とベース３１とは接合されるが、接続される端子パッド１３および端子パッド７４と接続される端子パッド１７および端子パッド７５との幅方向（Ｗ）の間には、電気絶縁性の樹脂材料が充填される。充填口８３は、この樹脂材料を供給するために設けられる。つまり、図１５（ａ）に示すように、延長用支持膜５のカバー８１を下向きにして、第１支持膜３０と延長用支持膜５とを対向させる。
　次に、図１５（ｂ）に示すように、端子パッド１３（１７）と端子パッド７４（７５）とを接触させた状態で、第１支持膜３０と延長用支持膜５とを位置合わせする。位置合わせされた状態で、第１支持膜３０と延長用支持膜５の間には空隙が形成される。この空隙は、充填口８３を除けば、周囲に対して閉じられている。
　この位置合わせされた状態で充填口８３から電気絶縁材料からなる樹脂材料を注入することで、図１５（ｃ）に示すように、ベース３１とベース７１の間の空隙に樹脂材料が充填され、保護体８が構成される。この保護体８により、温度センサ１と延長用支持膜５の接続部分が保護される。 Although the base 71 and the base 31 are joined, an electrically insulating resin is placed between the terminal pads 13 and 74 to be connected and the terminal pads 17 and 75 to be connected in the width direction (W). material is filled. A filling port 83 is provided to supply this resin material. That is, as shown in FIG. 15A, the first support film 30 and the extension support film 5 are opposed to each other with the cover 81 of the extension support film 5 facing downward.
Next, as shown in FIG. 15B, the first support film 30 and the extension support film 5 are aligned with the terminal pads 13 (17) and the terminal pads 74 (75) in contact with each other. . A gap is formed between the first support film 30 and the extension support film 5 in the aligned state. This gap is closed to the surroundings, except for the fill port 83 .
By injecting a resin material made of an electrically insulating material from the filling port 83 in this aligned state, the gap between the base 31 and the base 71 is filled with the resin material as shown in FIG. A protector 8 is constructed. The protector 8 protects the connecting portion between the temperature sensor 1 and the extension support film 5 .
　以上説明した温度センサ１，２は、接合体である両面テープ５４，５４が感熱体１１を間に挟み、幅方向Ｗに間隔を隔てる両側に設けられる例を示している。しかし、本発明はこれに限らず、両面テープ５４，５４が感熱体１１を間に挟み、長さ方向Ｌに間隔を隔てる両側に設けられても、通路ＡＰを確保できる。また、通路ＡＰは、長さ方向Ｌまたは幅方向Ｗに連通する形態に限定されない。例えば、本発明は、幅方向Ｗの両側に接合体が設けられるのに加えて、長さ方向Ｌの一方の側だけに接合体を設ける形態を包含する。この形態であっても、長さ方向Ｌの他方の側は開放されるため、通路ＡＰが確保される。また例えば、幅方向Ｗの一方の側と長さ方向Ｌの一方の側のそれぞれに接合体を設ける形態であっても、通路ＡＰを確保できる。つまり本発明は、感熱体を間に挟み、第１支持膜３０および第２支持膜５０の平面方向に所定の間隔を隔てる少なくとも２つの領域に接合体を設けることで、通路ＡＰを確保することができる。平面方向は幅方向Ｗと長さ方向Ｌを合わせ持つ概念である。 The temperature sensors 1 and 2 described above show an example in which the double- faced tapes 54 and 54 as joined bodies sandwich the thermosensitive element 11 and are provided on both sides with a gap in the width direction W. However, the present invention is not limited to this, and even if the double- faced tapes 54, 54 sandwich the heat sensitive element 11 and are provided on both sides with a gap in the length direction L, the passage AP can be ensured. Moreover, the passage AP is not limited to a form communicating in the length direction L or the width direction W. For example, the present invention includes a form in which joint bodies are provided on both sides in the width direction W and joint bodies are provided only on one side in the length direction L. Even in this form, since the other side in the length direction L is open, the passage AP is secured. Further, for example, even in a mode in which a joined body is provided on one side in the width direction W and one side in the length direction L, respectively, the passage AP can be ensured. In other words, the present invention secures the passage AP by sandwiching the thermosensitive element and providing the joints in at least two regions separated by a predetermined interval in the planar direction of the first support film 30 and the second support film 50 . can be done. The plane direction is a concept having both the width direction W and the length direction L.
　以上説明した温度センサ１，２は、厚さを均一にするためにダミー導電体９を設けるが、本発明はこれに限らず、ダミー導電体９を設けるのに替えて、ダミー導電体９の厚さの分だけ接合体３９および接合体５９の一方または双方の厚さ方向の寸法を大きくしてもよい。 Although the temperature sensors 1 and 2 described above are provided with the dummy conductor 9 in order to make the thickness uniform, the present invention is not limited to this. The dimension in the thickness direction of one or both of the joined body 39 and the joined body 59 may be increased by the thickness.
　また、例えば、温度センサ１～２の形状、寸法は本発明の一例を示したに過ぎない。温度センサ１～３よりも長さ方向（Ｌ）の寸法を長くまたは短くし、幅方向（Ｗ）の寸法を長くまたは短くすることができる。第１導通パッド１４、第２導通パッド１５などについても同様であり、例えばこれらパッドの平面形状を矩形以外の例えば円形にすることができる。また、第１支持膜３０および第２支持膜５０の平面形状は矩形に限らず、例えば長さ方向（Ｌ）の一方端を円弧状に突き出す、あるいは、凹ますことができる。第１支持膜３０および第２支持膜５０の平面形状は台形、三角形など任意である。 Also, for example, the shape and dimensions of the temperature sensors 1 and 2 merely show an example of the present invention. The length (L) dimension can be longer or shorter than the temperature sensors 1-3, and the width (W) dimension can be longer or shorter. The same applies to the first conductive pad 14, the second conductive pad 15, etc. For example, the planar shape of these pads can be circular instead of rectangular. Further, the planar shape of the first support film 30 and the second support film 50 is not limited to a rectangle, and for example, one end in the length direction (L) may protrude in an arc shape or may be recessed. The planar shape of the first support film 30 and the second support film 50 is arbitrary, such as a trapezoid or a triangle.
　さらに、温度センサ１の製造手順において、感熱体１１を第２支持膜５０の第２ＦＰＣ６１の側に設けてから、第１支持膜３０の第１ＦＰＣ４１との積層、接合を行ってもよい。 Further, in the manufacturing procedure of the temperature sensor 1, after the thermosensitive element 11 is provided on the second FPC 61 side of the second support film 50, the first support film 30 and the first FPC 41 may be laminated and joined.
　また、以上の実施形態においては、長さ方向（Ｌ）の寸法が大きい第１支持膜３０に第１リードパターン１２および第２リードパターン１６を設けているが、本発明はこれに限らない。長さ方向（Ｌ）の寸法が小さい第２支持膜５０に第１リードパターン１２および第２リードパターン１６を設けることができる。 Also, in the above embodiments, the first lead pattern 12 and the second lead pattern 16 are provided on the first support film 30 having a large dimension in the length direction (L), but the present invention is not limited to this. The first lead pattern 12 and the second lead pattern 16 can be provided on the second support film 50 having a small dimension in the length direction (L).
１，２　温度センサ
５　　　延長用支持膜
７，８　保護体
９　　　ダミー導電体
１０　　センサ素子
１１　　感熱体
１１Ａ　サーミスタ
１１Ｂ　第１電極
１１Ｃ　第２電極
１２　第１リードパターン
１６　第２リードパターン
１３　第１端子パッド
１７　第２端子パッド
１４　第１導通パッド
１５　第２導通パッド
１８　第３Ａ導通パッド
１９　第３Ｂ導通パッド
２１　第３Ｃ導通パッド
３０　　第１支持膜
３１　　ベース
３３　　カバー
３５　　導電パターン
３７，３９　接合体
４３，４５　収容穴
５０　　第２支持膜
５１　　ベース
５２　　挿入通路
５３　　カバー
５４　　両面テープ
５５　　導電パターン
５６　　絶縁空隙
５７，５９　接合体
６３，６５　収容穴
７１　　ベース
７２，７３　リードパターン
７４，７５，７６，７７　端子パッド
８１　カバー
８３　充填口
ＡＰ　　通路
Ｈ　　水平方向
Ｌ　　長さ方向
Ｗ　　幅方向 Reference Signs List 1, 2 Temperature sensor 5 Extension supporting films 7, 8 Protective body 9 Dummy conductor 10 Sensor element 11 Thermosensitive body 11A Thermistor 11B First electrode 11C Second electrode 12 First lead pattern 16 Second lead pattern 13 First terminal pad 17 Second terminal pad 14 First conduction pad 15 Second conduction pad 18 3A conduction pad 19 3B conduction pad 21 3C conduction pad 30 First support film 31 Base 33 Cover 35 Conductive patterns 37, 39 Bonds 43, 45 Accommodating hole 50 Second support film 51 Base 52 Insertion path 53 Cover 54 Double-sided tape 55 Conductive pattern 56 Insulating gaps 57, 59 Bonds 63, 65 Accommodating hole 71 Bases 72, 73 Lead patterns 74, 75, 76, 77 Terminal pad 81 Cover 83 Filling port AP Passage H Horizontal direction L Length direction W Width direction

Claims (9)

  1. 　電気絶縁材料からなり、互いに対向して配置される第１支持膜および第２支持膜と、
    　前記第１支持膜と前記第２支持膜の間に設けられ、温度によって電気的特性が変化する感熱体を含むセンサ素子と、
    　前記感熱体の周辺において前記第１支持膜と前記第２支持膜を接合する接合体と、を備え、
    　前記接合体は、
    　前記感熱体を間に挟み、前記第１支持膜および前記第２支持膜の平面方向に所定の間隔を隔てる少なくとも２つの領域に設けられる、
    ことを特徴とする温度センサ。     a first supporting film and a second supporting film made of an electrically insulating material and arranged to face each other;
    a sensor element provided between the first support film and the second support film and including a thermosensitive element whose electrical characteristics change depending on temperature;
    a bonding body that bonds the first supporting film and the second supporting film around the thermosensitive element;
    The conjugate is
    Provided in at least two regions that sandwich the thermosensitive element and are separated by a predetermined distance in the planar direction of the first support film and the second support film,
    A temperature sensor characterized by:
  2. 　前記接合体に取り囲まれる領域に、電気絶縁性の樹脂材料から構成される、前記感熱体を覆う保護体が設けられる、
    請求項１に記載の温度センサ。     A protective body made of an electrically insulating resin material and covering the heat sensitive body is provided in a region surrounded by the joined body.
    A temperature sensor according to claim 1 .
  3. 　前記第１支持膜および前記第２支持膜は、幅方向および長さ方向を有する、平面視して矩形形状を有し、
    　前記第２支持膜は、前記第１支持膜よりも前記長さ方向の寸法が小さく、
    　前記接合体は、前記幅方向に間隔を隔てる両側に設けられる、
    請求項２に記載の温度センサ。     The first supporting film and the second supporting film have a rectangular shape in plan view having a width direction and a length direction,
    the second support film has a dimension in the length direction smaller than that of the first support film;
    The bonded bodies are provided on both sides spaced apart in the width direction,
    The temperature sensor according to claim 2.
  4. 　前記第１支持膜および前記第２支持膜の一方または双方は、
    　前記保護体を構成する前記樹脂材料を充填する挿入通路が、その厚さ方向に貫通して設けられる、
    請求項２または請求項３に記載の温度センサ。     one or both of the first supporting film and the second supporting film,
    An insertion passage filled with the resin material constituting the protective body is provided through the thickness direction thereof,
    The temperature sensor according to claim 2 or 3.
  5. 　前記センサ素子は、
    　前記第１支持膜であって前記第２支持膜に対向する同じ平面上に貼り付けられる、第１リードパターンおよび第２リードパターンを備え、
    　前記第１支持膜は、
    　前記感熱体を支持し、前記第１リードパターンと電気的に接続される第１導通パッドと、
    　前記第２リードパターンと電気的に接続される第２導通パッドと、を備え、
    　前記第２支持膜は、
    　前記感熱体が設けられる領域に対向する面に第３導通パッドを備え、
    　前記第２導通パッドと前記第３導通パッドの間に、前記感熱体に対応するダミー導電体が設けられる、
    請求項１から請求項４のいずれか一項に記載の温度センサ。     The sensor element is
    comprising a first lead pattern and a second lead pattern, which are the first support film and are attached on the same plane facing the second support film;
    The first support film is
    a first conductive pad supporting the thermosensitive element and electrically connected to the first lead pattern;
    a second conductive pad electrically connected to the second lead pattern;
    The second support film is
    A third conductive pad is provided on the surface facing the area where the thermosensitive element is provided,
    A dummy conductor corresponding to the thermosensitive element is provided between the second conductive pad and the third conductive pad.
    The temperature sensor according to any one of claims 1 to 4.
  6. 　電気絶縁材料からなり、感熱体を備えるセンサ素子が一方の面に貼り付けられている第１支持膜と電気絶縁材料からなる第２支持膜とを、前記一方の面を前記第２支持膜に対向させた状態で積層する第１工程と、
    　前記第１支持膜と前記第２支持膜とを接合体により接合する第２工程と、備え、
    　前記第２工程において、
    　前記接合体は、前記感熱体を間に挟み、かつ、前記感熱体と外部が通じる通路を有するように設けられる、ことを特徴とする温度センサの製造方法。     A first supporting film made of an electrical insulating material, on one side of which a sensor element having a thermosensitive element is attached, and a second supporting film made of an electrical insulating material, the one side being attached to the second supporting film. A first step of laminating in a state of facing each other;
    a second step of bonding the first supporting film and the second supporting film with a bonding body;
    In the second step,
    A method of manufacturing a temperature sensor, wherein the joined body is provided so as to sandwich the heat sensitive element and to have a path communicating between the heat sensitive element and the outside.
  7. 　前記感熱体の周囲であって、前記第１支持膜と前記第２支持膜の間に、電気絶縁材料からなる樹脂材料を供給して保護体を形成する第３工程を備える、
    請求項６に記載の温度センサの製造方法。     A third step of forming a protective body by supplying a resin material made of an electrically insulating material between the first support film and the second support film around the heat sensitive body,
    A method of manufacturing a temperature sensor according to claim 6 .
  8. 　前記第１工程において、
    　前記第１支持膜および前記第２支持膜は、幅方向および長さ方向を有し、前記第２支持膜は、前記第１支持膜よりも前記長さ方向の寸法が小さく、
    　前記第２工程において、
    　前記接合体は、前記幅方向に間隔を隔てる両側に設けられる、
    請求項６または請求項７に記載の温度センサの製造方法。     In the first step,
    the first support film and the second support film have a width direction and a length direction, and the second support film has a smaller dimension in the length direction than the first support film;
    In the second step,
    The bonded bodies are provided on both sides spaced apart in the width direction,
    8. A method of manufacturing a temperature sensor according to claim 6 or 7.
  9. 　前記第１工程において、
    　前記第１支持膜および前記第２支持膜の一方または双方は、その厚さ方向に貫通する挿入通路が設けられ、
    　前記第３工程において、
    　前記挿入通路を介して前記樹脂材料が供給される、
    　請求項７または請求項８に記載の温度センサの製造方法。     In the first step,
    One or both of the first support film and the second support film are provided with an insertion passage penetrating in the thickness direction thereof,
    In the third step,
    the resin material is supplied through the insertion passage;
    9. A method of manufacturing a temperature sensor according to claim 7 or 8.
PCT/JP2022/019272 2021-10-08 2022-04-28 Temperature sensor, and method for manufacturing temperature sensor WO2023058263A1 (en)

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