JP4012029B2 - Metal plate resistor and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a metal plate resistor and a method for manufacturing the metal plate resistor, and in particular, a metal plate resistor having a compact structure that is excellent in heat dissipation and can be set to a relatively high resistance value of several hundred mΩ or more. Regarding the method.
[0002]
[Prior art]
Conventionally, a resistor using a metal plate formed in a plate shape as a resistor is known. As such a metal plate resistor, as shown in FIG. 6, by preparing a long plate-shaped metal material 1 and cutting one surface side of the central portion, the central portion is a resistor portion made of a metal plate. 2 and both end portions thereof are formed on the connecting electrode portion 3 (see, for example, Patent Document 1).
[0003]
Further, as shown in FIG. 7, a metal material 4 made in a long plate shape having a desired resistance value is prepared, and the metal material 4 is bent into a “bridge” shape so that the central portion is made of metal. While making it the resistor part 5 which consists of a board, making the both ends into the electrode part 6 for a connection is also performed.
[0004]
[Patent Document 1]
JP 2001-118701 (“Summary”, FIG. 2)
[0005]
[Problems to be solved by the invention]
However, in such a conventional metal plate resistor, it is necessary that the resistor portions 2 and 5 in the central portion themselves function as a structure that supports itself, and therefore the thickness must be a certain level or more. I must. For this reason, the conventional metal plate resistor has a problem that it is difficult to set a high resistance value of, for example, 100 mΩ or more because the specific resistance value of the resistor material is low.
[0006]
Since the resistor parts 2 and 5 are made of a metal material, the resistor parts 2 and 5 themselves are excellent in thermal conductivity, but the resistor parts 2 and 5 themselves are directly mounted on a mounting board such as a printed circuit board. Since they are not in contact with each other, only the heat conduction to the electrode portions 3 and 6 and the air becomes a heat dissipation path. For this reason, the conventional metal plate resistor has a problem that it is difficult to efficiently dissipate heat from the resistor portions 2 and 5 themselves.
[0007]
The present invention has been made in view of the above-described circumstances, and provides a metal plate resistor that is excellent in heat dissipation and can be set to a relatively high resistance value of several hundred mΩ or more, and a method for manufacturing the same. For the purpose.
[0008]
[Means for Solving the Problems]
To solve the above problems, the metal plate resistor of the present invention includes a flat plate-shaped resistance body, it is connected to both ends of the resistive element antibodies portion are spaced apart from each other on the lower side of the resistor portion The resistor part and the electrode part are made of a single metal material, and the electrode part is in a block shape having a thickness larger than that of the resistor part. it is characterized in that fixing the one surface of the electrode portion before Symbol resistor portion via the insulating layer. Here, it is preferable to interpose an insulating material between the pair of electrode portions.
[0009]
In this invention, the block-shaped electrode portion connected to the land of the mounting substrate supports (fixes) the thin flat plate-like resistor portion via the thin insulating layer thereon. Therefore, the resistor portion does not need to have a strength sufficient to support its own posture, and can be thinned and set to a high resistance value. Further, the heat generated in the resistor portion can be efficiently radiated from the block-shaped electrode portion through the thin insulating layer. Further, the electrode portion and the resistor portion have a compact laminated structure, and a chip-type structure capable of surface mounting can be obtained.
[0010]
Here, the metal plate resistor of this invention may laminate | stack a highly conductive metal material on the said electrode part, and may form the said electrode part in a laminated structure.
[0011]
Method for producing a metal plate resistor of the present invention includes a flat plate-shaped resistance body, which in succession to form a pair of block-shaped electrode portions which is thicker than the resistor unit, the resistor portion An insulating layer is formed, and both ends of the resistor portion are bent so that one surface of the block-shaped electrode portion is brought into contact with and fixed to the resistor portion via the insulating layer. It is. In addition, by performing horizontal and vertical cutting on a metal plate having a rectangular cross section, a flat metal resistor portion on the upper surface and a pair of block-shaped metal electrode portions connected to both ends thereof It is possible to manufacture by filling an insulating material in a void formed by the cutting process and formed below the resistor.
[0012]
In this manufacturing method, a step of laminating a highly conductive metal material on the electrode portion and forming the electrode portion in a laminated structure may be included.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the accompanying drawings. 1 and 2 are views showing a first embodiment of a metal plate resistor and a manufacturing method thereof according to the present invention.
[0014]
First, the configuration of the metal plate resistor of the present invention will be described. In FIG. 1, a metal plate resistor 10 includes a resistor portion 11 made of a metal material that is formed in a thin flat plate shape and has a dimension set to have a desired resistance value, and both ends of the resistor portion 11. A pair of block-like electrode portions 12 which are connected to and located on the lower side of the 11a side, and a thin insulating layer 13 sandwiched so as to be interposed between the resistor portion 11 and the electrode portion 12; And an insulator block 14 sandwiched between the pair of electrode portions 12 and a heat-resistant protective layer 15 that protects the influence of electrical contact with other components and the external environment. In particular, the thin insulating layer 13 is sandwiched between the thin flat plate-like resistor portion 11 and the block-like electrode portion 12, and the thin flat plate-like resistor portion 11 is interposed via the insulating layer 13 into the block-like electrode portion 12. It is formed in a compact structure that supports it.
[0015]
In this metal plate resistor 10, by processing a member made of a resistance metal material such as copper-nickel or nickel-chromium, the resistor portion 11 and the electrode portion 12 are integrally configured by a single member.
[0016]
The resistor portion 11 is designed so that the resistance value between the electrode portions 12 becomes a desired value by the length, width, and thickness of the thin flat plate resistor. The basic resistance value R of the resistor portion 11 can be calculated by the following equation using the specific resistivity r of the resistance metal material to be used.
Resistance value R = specific resistivity r × length L / cross-sectional area (width W1 × sheet thickness t)
Note that a trimming cut can be provided in the resistor portion 11 to substantially extend the current path and increase the resistance value. For example, by setting the plate thickness t to about 50 μm, the resistance value can be increased to 500 mΩ or more. Can be set.
[0017]
The resistor part 11 and the electrode part 12 have a structure in which a current path connected at both ends 11a of the resistor part 11 is bent, and the electrode part 12 has an insulating layer 13 inside the both ends 11a. The resistor 11 is supported (fixed) by interposing. The pair of electrode portions 12 are firmly supported (fixed) by the insulator block 14 at intervals.
[0018]
The electrode portion 12 is formed in a block shape so as to have a height of a chip part dimension designed as a resistor, and a bonding surface to the mounting substrate on the back surface side (lower surface side in FIG. 1) with respect to the resistor portion 11. 12a is formed in a large area that is approximately half or more of the area of the resistor portion 11. With the configuration of the block-shaped electrode portion 12, the thin flat plate-shaped resistor portion 11 is stably supported and good heat dissipation is ensured.
[0019]
In addition, when the resistor part 11 and the electrode part 12 are integrally formed using a resistance metal material, it is necessary to reduce the resistance value in the electrode part 12. Therefore, by increasing the thickness of the electrode portion 12 as compared with the plate thickness t of the resistor portion 11, the resistance value of the electrode portion 12 can be lowered and can function as an electrode. The required thickness of the electrode portion 12 varies depending on the resistance metal material to be used, but it is desirable that the thickness be about 10 times the plate thickness t of the resistor portion 11. In the case where a highly conductive material piece is joined to the electrode portion, which will be described later (see FIG. 4), it is not necessary to consider the thickness of the electrode portion 12.
[0020]
Moreover, since the electrode part 12 is formed in the block shape which has sufficient volume, an electric current can be sent without generating a big potential difference inside, and the resistance value precision of the resistor part 11 can be improved. .
[0021]
Therefore, the metal plate resistor 10 can set the resistance value with high accuracy only by the resistor portion 11. In addition, since the resistor portion 11 is supported by the electrode portion 12 disposed inward of the both end portions 11a, the resistor portion 11 is required to have strength sufficient to maintain its shape and posture. For example, it can be reduced to a high resistance value of several hundred mΩ or more by thinning it into a metal foil of 50 μm, etc. Also, the mounting area on the mounting board etc. can be reduced, and a compact chip component structure Can be.
[0022]
The metal plate resistor 10 has an insulating layer 13 interposed between the resistor portion 11 and the electrode portion 12 and an insulator block 14 interposed between the pair of electrode portions 12, thereby providing insulation. In addition to ensuring, the deformation of the resistor portion 11 and the electrode portion 12 is restricted and the shape thereof is firmly maintained.
[0023]
Next, an example of a manufacturing procedure (method) of the metal plate resistor 10 will be described with reference to FIG. First, a length (L + 2W2) obtained by adding the width W1 of the metal plate resistor 10 (resistor portion 11) to be produced, the length L of the resistor portion 11 and the width W2 of the electrode portion 12 in the longitudinal direction, and the electrode A resistance metal material 21 having a height H of the portion 12 is prepared (see (a)). It should be noted that a continuous material may be used in the width W1 direction so that a plurality of resistors are obtained, and the width W1 may be cut in a later process.
[0024]
Next, a block-like shape is formed on both end sides of the resistance metal material 21 by cutting or the like so that a desired plate thickness t (t << H) remains in the central portion of the length L of the one surface side (the lower surface side in the drawing). The resistor part 11 in which the electrode part 12 continues is formed (see (b)). Here, the process of the resistance metal material 21 is not limited to the cutting process, and may be an etching process, or the resistor part 11 and the electrode part 12 are directly formed by injection molding or rolling process (foil making process). Needless to say, it may be produced.
[0025]
Next, an insulating resin such as polyimide or epoxy is applied to one surface side (the upper surface side in the figure) of the resistive metal material 21 to a required thickness, for example, 50 μm to 150 μm, and the insulating layer 13 is applied. At the same time, an inorganic paste having insulating properties and heat resistance such as boron nitride is applied to the other surface side (lower surface side in the figure) of the manufactured resistor portion 11 so as to have a necessary thickness. A protective layer (insulating layer) 15 is formed (see (c)). Then, the resistor unit 11 and the electrode are formed by turning and bending (bending) the electrode unit 12 by 180 ° in directions close to each other (in the direction of the arrow in the drawing) around both ends 11a of the resistor unit 11. A laminated structure in which the insulating layer 13 is sandwiched between the portions 12 is formed (see (d)). At this time, the insulating layer 13 on the upper surface of the electrode portion 12 and the insulating layer 13 on the upper surface of the resistor portion 11 in FIG. In addition, (d) has shown the state which turned (c) upside down.
[0026]
Next, the metal block resistor 10 is completed by fitting the insulator block 14 between the electrode parts 12 and fixing the electrode parts 12 by fusion or the like (see (e)). Here, in the case of adjusting the resistance value of the resistor portion 11 with high accuracy, after the thin resistor portion 11 is formed at the central portion on the one surface side of the resistance metal material 21, press processing, etching processing, laser cutting processing is performed. This can be done by trimming.
[0027]
As described above, in this embodiment, the resistor unit 11 is supported by the pair of electrode units 12 to be bonded / fixed on the mounting substrate and the insulator block 14 therebetween via the insulating layer 13. Thin metal foil with low strength can be thinned to increase resistance. The heat generated by the current flowing through the resistor portion 11 can be radiated to the electrode portion 12 through the insulating layer 13 and effectively released to the mounting substrate side. Moreover, the space | interval of the electrode part 12 is maintained by the insulator block 14, and it can be set as the compact chip-type laminated structure which inserts the insulating layer 13 between this electrode part 12 and the resistor part 11. FIG.
[0028]
The metal plate resistor 10 can be manufactured at low cost by a simple and easy process in which the electrode portion 12 is rotated and bent at both ends 11a of the resistor portion 11.
[0029]
As another aspect of the present embodiment, as shown in FIG. 3, contrary to the above-described embodiment, the insulating layer 13 is formed on one surface side (lower surface side in the drawing) of the manufactured resistor portion 11, and resistance is increased. The heat-resistant protective layer 15 is formed except for the folded surface on the other surface side (upper surface side in the drawing) of the metal material 21. Then, with the both end portions 11a of the resistor portion 11 as an axis, the electrode portion 12 is bent in a direction (inward) close to each other and rotated by 90 ° so as to be in close contact with the insulating layer 13, thereby the resistor body. A laminated structure in which the insulating layer 13 is sandwiched between the part 11 and the electrode part 12 may be adopted. At this time, the side surface of the electrode part 12 in the drawing is in close contact with the insulating layer 13. Further, since the folded surface is removed from the heat-resistant protective layer 15, cracks and the like do not occur.
[0030]
Further, as another embodiment, as shown in FIG. 4, for example, a highly conductive material piece 32 such as Cu is bonded to the lower surface of the electrode portion 12 to form the electrode portion 12 c having a laminated structure. Good. That is, for example, in the state of FIG. 2B, the highly conductive material piece 32 is bonded to the lower surface of the electrode portion 12 to form the laminated electrode portion 12 c. After the insulating layer 13 and the heat-resistant protective layer 15 are applied and formed, the laminated electrode portion 12c is rotated to bend and bend 180 degrees about the both end portions 11a of the resistor portion 11 so that the metal plate resistor 30 is formed. Can be produced. Here, as the metal plate resistor, it is preferable that the electrode portion 12c has a laminated structure as in the present embodiment because it is excellent in conductivity and heat dissipation.
[0031]
Furthermore, as another aspect, the metal plate resistor 40 can be manufactured also by the process shown in FIG. That is, first, the resistance metal material 41 is manufactured in a shape that substantially matches the outer shape of the metal plate resistor 40 to be manufactured (see (a)). Next, one surface side of the resistance metal material 41 is formed by vertically cutting, for example, a rotary blade 42a that rotates in the vertical surface of the cutting tool 42 at the center of the one surface side (lower surface side in the drawing) of the resistance metal material 41. A vertical groove 43 is formed to leave a desired thickness t (see (b)). Next, for example, a horizontal groove that leaves both sides of the resistance metal material 41 by guiding a rotation shaft 44b of a cutting tool 44 that rotates the rotary blade 44a in a horizontal plane into the vertical groove 43 and making horizontal cuts. 45 is formed, and the resistor portion 46 and the electrode portion 47 are produced (see (c)). Thereafter, an insulating resin is filled into the formed vertical grooves 43 and horizontal grooves 45 to form a T-shaped insulating layer 48 and inorganic on the other surface side (upper surface side in the drawing) of the resistance metal material 41. The paste is applied to form the heat-resistant protective layer 49 (see (d)), and the metal plate resistor 40 is completed. Thereby, the metal plate resistor 40 can be produced simply by cutting the resistance metal material 41 and filling the resin material or the like. The filling of the insulating resin into the vertical grooves 43 and the horizontal grooves 45 may be performed by filling solid resin in addition to filling by injection of molten resin. Also in this step, as a matter of course, the electrode portion 47 may have a laminated structure of a resistance metal material and a highly conductive material such as Cu as shown in FIG.
[0032]
Although one embodiment of the present invention has been described so far, it is needless to say that the present invention is not limited to the above-described embodiment, and may be implemented in various forms within the scope of the technical idea.
[0033]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the metal plate resistor of the compact chip type structure which can be set to the high resistance value of several hundred m (ohm) or more which was difficult with the conventional metal plate resistor can be provided.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a first embodiment of a metal plate resistor according to the present invention.
FIG. 2 is a process diagram showing a first embodiment of a method for producing a metal plate resistor according to the present invention.
FIG. 3 is a perspective view showing a modification of the first embodiment.
FIG. 4 is a perspective view showing a second embodiment of the metal plate resistor.
FIG. 5 is a process diagram showing a second embodiment of a method for manufacturing a metal plate resistor.
FIG. 6 is a perspective view showing a conventional metal plate resistor.
FIG. 7 is a perspective view showing another conventional metal plate resistor.
[Explanation of symbols]
10, 30, 40 Metal plate resistor 11, 46 Resistor portion 11a Both ends 12, 12c, 47 Electrode portion 13, 48 Insulating layer 14 Insulator block 15, 49 Heat-resistant protective layer 21, 41 Resistance metal material 32 Conductive piece

Claims (6)

A flat resistor part;
Is connected to both ends of the resistive element antibodies portion, and a pair of electrode portions that are spaced apart from each other on the lower side of the resistor unit,
The resistor part and the electrode part are made of a single metal material,
The electrode portion has a block shape having thickness than the resistor unit, a metal plate resistor, characterized in that fixed to the front Symbol resistor section one side of the electrode portion was blocky through an insulating layer .   The metal plate resistor according to claim 1, wherein an insulating material is interposed between the pair of electrode portions. The metal plate resistor according to claim 1, wherein a highly conductive metal material is laminated on a lower surface of the electrode portion. Forming a plate-shaped resistance body, a pair of block-shaped electrode portions which is thicker than the resistor portion contiguous thereto,
An insulating layer is formed on the resistor portion, and one end of the block-shaped electrode portion is brought into contact with and fixed to the resistor portion via the insulating layer by bending both ends of the resistor portion. A method of manufacturing a metal plate resistor.   By applying horizontal and vertical cutting to a metal plate having a rectangular cross section, a plate-shaped metal resistor portion on the upper surface and a pair of block-shaped metal electrode portions connected to both ends of the resistor are connected to the resistor. A method for manufacturing a metal plate resistor, comprising: forming an insulating material in a gap formed by a cutting process formed below a body part. Method for producing a metal plate resistor of claim 4 or 5, characterized in that it comprises a step you product layer highly conductive metal material on a lower surface of the electrode portion.

Images