WO2023055119A1 - 조성물 - Google Patents
조성물 Download PDFInfo
- Publication number
- WO2023055119A1 WO2023055119A1 PCT/KR2022/014646 KR2022014646W WO2023055119A1 WO 2023055119 A1 WO2023055119 A1 WO 2023055119A1 KR 2022014646 W KR2022014646 W KR 2022014646W WO 2023055119 A1 WO2023055119 A1 WO 2023055119A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- weight
- composition
- parts
- filler
- polyisocyanate
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 195
- 239000000945 filler Substances 0.000 claims description 172
- -1 polyol compound Chemical class 0.000 claims description 100
- 229920005862 polyol Polymers 0.000 claims description 96
- 239000003795 chemical substances by application Substances 0.000 claims description 76
- 239000005056 polyisocyanate Substances 0.000 claims description 66
- 229920001228 polyisocyanate Polymers 0.000 claims description 66
- 230000001588 bifunctional effect Effects 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 25
- 239000004814 polyurethane Substances 0.000 claims description 25
- 229920002635 polyurethane Polymers 0.000 claims description 25
- 150000003077 polyols Chemical class 0.000 claims description 23
- 229910052782 aluminium Inorganic materials 0.000 claims description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 22
- 229920005906 polyester polyol Polymers 0.000 claims description 19
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 16
- 229920000570 polyether Polymers 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid group Chemical group C(CCCCC(=O)O)(=O)O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid group Chemical group C(CCCCCCCCC(=O)O)(=O)O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- 125000001142 dicarboxylic acid group Chemical group 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims 1
- 229910052582 BN Inorganic materials 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical group [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims 1
- 239000000920 calcium hydroxide Substances 0.000 claims 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 44
- 239000000853 adhesive Substances 0.000 abstract description 32
- 230000001070 adhesive effect Effects 0.000 abstract description 32
- 230000017525 heat dissipation Effects 0.000 abstract description 25
- 239000004014 plasticizer Substances 0.000 abstract description 23
- 230000001747 exhibiting effect Effects 0.000 abstract description 8
- 238000002156 mixing Methods 0.000 description 57
- 239000002245 particle Substances 0.000 description 42
- 239000003054 catalyst Substances 0.000 description 41
- 239000000047 product Substances 0.000 description 32
- 230000000052 comparative effect Effects 0.000 description 27
- 238000004519 manufacturing process Methods 0.000 description 27
- 230000000704 physical effect Effects 0.000 description 18
- YXRKNIZYMIXSAD-UHFFFAOYSA-N 1,6-diisocyanatohexane Chemical compound O=C=NCCCCCCN=C=O.O=C=NCCCCCCN=C=O.O=C=NCCCCCCN=C=O YXRKNIZYMIXSAD-UHFFFAOYSA-N 0.000 description 13
- 230000003197 catalytic effect Effects 0.000 description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 13
- 238000002360 preparation method Methods 0.000 description 13
- 125000004432 carbon atom Chemical group C* 0.000 description 11
- 239000003063 flame retardant Substances 0.000 description 10
- 229920001451 polypropylene glycol Polymers 0.000 description 10
- 230000005484 gravity Effects 0.000 description 9
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 8
- 238000002411 thermogravimetry Methods 0.000 description 8
- 238000009826 distribution Methods 0.000 description 7
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- YLQLIQIAXYRMDL-UHFFFAOYSA-N propylheptyl alcohol Chemical compound CCCCCC(CO)CCC YLQLIQIAXYRMDL-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 5
- 230000006378 damage Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 3
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 238000007561 laser diffraction method Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- PMBXCGGQNSVESQ-UHFFFAOYSA-N 1-Hexanethiol Chemical compound CCCCCCS PMBXCGGQNSVESQ-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- GPZYYYGYCRFPBU-UHFFFAOYSA-N 6-Hydroxyflavone Chemical compound C=1C(=O)C2=CC(O)=CC=C2OC=1C1=CC=CC=C1 GPZYYYGYCRFPBU-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethanethiol Chemical compound CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
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- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- ZTNJGMFHJYGMDR-UHFFFAOYSA-N 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O ZTNJGMFHJYGMDR-UHFFFAOYSA-N 0.000 description 1
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- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
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- LDKZGQAUUUZYKS-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound CC(CCO)CCO.CC(CCO)CCO LDKZGQAUUUZYKS-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical group OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- HHDUMDVQUCBCEY-UHFFFAOYSA-N 4-[10,15,20-tris(4-carboxyphenyl)-21,23-dihydroporphyrin-5-yl]benzoic acid Chemical compound OC(=O)c1ccc(cc1)-c1c2ccc(n2)c(-c2ccc(cc2)C(O)=O)c2ccc([nH]2)c(-c2ccc(cc2)C(O)=O)c2ccc(n2)c(-c2ccc(cc2)C(O)=O)c2ccc1[nH]2 HHDUMDVQUCBCEY-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
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- 101710108091 DNA polymerase kappa Proteins 0.000 description 1
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- VPIAKHNXCOTPAY-UHFFFAOYSA-N Heptane-1-thiol Chemical compound CCCCCCCS VPIAKHNXCOTPAY-UHFFFAOYSA-N 0.000 description 1
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- 229910019440 Mg(OH) Inorganic materials 0.000 description 1
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
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- 239000012796 inorganic flame retardant Substances 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- ZVEZMVFBMOOHAT-UHFFFAOYSA-N nonane-1-thiol Chemical compound CCCCCCCCCS ZVEZMVFBMOOHAT-UHFFFAOYSA-N 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- DOKHEARVIDLSFF-UHFFFAOYSA-N prop-1-en-1-ol Chemical compound CC=CO DOKHEARVIDLSFF-UHFFFAOYSA-N 0.000 description 1
- RIZGKEIRSQLIBK-UHFFFAOYSA-N prop-1-ene-1-thiol Chemical compound CC=CS RIZGKEIRSQLIBK-UHFFFAOYSA-N 0.000 description 1
- UBQKCCHYAOITMY-UHFFFAOYSA-N pyridin-2-ol Chemical compound OC1=CC=CC=N1 UBQKCCHYAOITMY-UHFFFAOYSA-N 0.000 description 1
- WHMDPDGBKYUEMW-UHFFFAOYSA-N pyridine-2-thiol Chemical compound SC1=CC=CC=N1 WHMDPDGBKYUEMW-UHFFFAOYSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
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Definitions
- This application relates to a composition.
- a typical heat dissipation material known in the prior art is a material in which a resin binder is filled with a thermally conductive filler (for example, Patent Document 1).
- a silicone resin, a polyolefin resin, an acrylic resin, an epoxy resin, or the like is usually used as a resin binder.
- the heat dissipation material is basically required to have excellent thermal conductivity, and additional functions are also required depending on the use. For example, depending on the application, it may be required that the heat dissipation material exhibit high thermal conductivity and low adhesion to a specific adherend.
- the heat dissipation material when it is necessary to replace a part in contact with a heat dissipation material in a product or to change a location of a heat dissipation material in a process, the heat dissipation material needs to exhibit low adhesive strength.
- materials showing low adhesive strength include materials to which a silicone resin is applied as a resin binder.
- silicone resins are relatively expensive.
- silicone resins contain components that cause contact failure and the like when applied to electronic/electrical products, their uses are limited.
- the polyurethane material also applied in Patent Document 1 can form a heat dissipation material with high thermal conductivity and has various other advantages, but is a material that exhibits high adhesive strength to most adherends, such as acrylic resins and epoxy resins. It is not easy to realize low adhesion even with materials.
- plasticizers formulated to control adhesion have problems such as damaging the inherent advantages of the material itself or being eluted during use.
- heat dissipation material It is necessary to secure an appropriate level of hardness for the heat dissipation material. For example, if the hardness of the heat dissipation material is too high, the material itself tends to be excessively brittle, and it is difficult to apply such a heat dissipation material when impact resistance, vibration resistance and durability are required.
- a heat dissipation material When a heat dissipation material is formed through a curable composition, it may be required that the composition has so-called room temperature curability depending on the use. This is because it is often difficult to apply heat, electromagnetic waves, or moisture required for curing in the process of forming a heat dissipation material in an electric or electronic device requiring heat management.
- Patent Document 1 Korean Patent Publication No. 2016-0105354
- This application aims to provide a composition.
- One object of the present application is to form a heat dissipation material that can be cured at room temperature when the composition is curable, and exhibits appropriate levels of hardness, low adhesive strength, and excellent thermal conductivity.
- an object of the present application includes achieving the low adhesive strength without using a plasticizer or the like, or even when using a plasticizer, in a state in which the use rate is minimized.
- This application also aims to provide a product containing the composition or a cured product thereof.
- the corresponding physical property is a physical property measured at room temperature unless otherwise specified.
- room temperature refers to a temperature in the range of about 10 ° C to 30 ° C or about 23 ° C or about 25 ° C as a natural temperature that is not heated and cooled.
- the unit of temperature is °C.
- normal pressure refers to a normal pressure in the range of about 700 mmHg to 800 mmHg as natural pressure that is not pressurized and reduced.
- composition of the present application may be a heat dissipation material or a composition capable of forming the heat dissipation material.
- composition of the present application is a heat dissipation material means that the composition itself exhibits adhesion to aluminum, hardness, and thermal conductivity, which will be described later.
- composition of the present application can form a heat dissipation material means that the composition forms a material (eg, a cured body) exhibiting adhesion to aluminum, hardness, and thermal conductivity through a curing reaction or the like. .
- the composition of the present application may be a curable composition.
- the composition of the present application may be a room temperature curable composition.
- a room temperature curable composition means a composition that can be cured in a state maintained at room temperature.
- the composition of the present application is a curable composition
- the composition may be a one-component composition or a two-component composition.
- the term one-component composition refers to a composition in which components necessary for curing are mixed together and stored
- the term two-component composition refers to a composition in which at least some of the components necessary for curing are physically separated and stored.
- the composition of the present application may be a polyurethane composition.
- polyurethane composition refers to a composition containing polyurethane or a component capable of forming polyurethane (eg, a polyol compound, a monohydric alcohol, a thiol compound, and/or a polyisocyanate described later) as a main component.
- a main component e.g, a polyol compound, a monohydric alcohol, a thiol compound, and/or a polyisocyanate described later.
- Including as a main component in the above means that the lower limit of the content of the polyurethane or the component capable of forming the polyurethane in the composition is 55% by weight, 60% by weight, 65% by weight, 70% by weight, 75% by weight, 80% by weight , 85% by weight, 90% by weight or 95% by weight.
- the upper limit of the content of the polyurethane or the component capable of forming the polyurethane in the composition may be 100% by weight.
- the content of the polyurethane or the component capable of forming the polyurethane is greater than or greater than any one of the lower limits described above, less than or less than any one of the upper limits described above, or less than any one of the upper limits described above, or less than the lower limit described above. It may be at least or above the lower limit of any one of the above, and below or below the upper limit of any one of the upper limits described above.
- the content of the polyurethane or the component capable of forming the polyurethane is the content in the composition excluding the filler and/or the solvent when the composition includes the filler and/or the solvent.
- the composition of the present application may be a solvent-free composition.
- solvent-free composition means that the content of the solvent in the composition is 5% by weight or less, 4% by weight or less, 3% by weight or less, 2% by weight or less, 1% by weight or less, or 0.5% by weight or less.
- the solvent content in the solvent-free composition may be 0% by weight or more, or about 0% by weight. That is, the solvent-free composition may not substantially contain a solvent.
- the composition of the present application may form a cured body exhibiting low adhesive strength or low adhesive strength with respect to a specific adherend.
- polyurethane is known as an adhesive material that exhibits excellent adhesion to various adherends. Therefore, as a method of making the polyurethane composition exhibit low adhesive strength to an adherend, a method of introducing a component that lowers the adhesive strength, such as a plasticizer, is usually used. When components such as plasticizers are applied, the adhesive strength of the polyurethane material can be lowered, but the component deteriorates other physical properties that could be secured in the polyurethane or elutes out of the material during the use of the polyurethane material. Problems can arise.
- the upper limit of the adhesive strength of the composition or its cured product to aluminum is 1 N/mm 2 , 0.9 N/mm 2 , 0.8 N/mm 2 , 0.7 N/mm 2 , 0.6 N/mm 2 , 0.5 N /mm 2 , 0.4 N/mm 2 , 0.3 N/mm 2 , 0.2 N/mm 2 or 0.1 N/mm 2 .
- the adhesive force may be the adhesive force of the composition itself to aluminum, or the adhesive force of the cured composition to aluminum when the composition is curable.
- the lower limit of the adhesive strength to aluminum is not particularly limited.
- the lower limit of the adhesive force is 0 N/mm 2 , 0.01 N/mm 2 , 0.02 N/mm 2 , 0.03 N/mm 2 , 0.04 N/mm 2 , 0.05 N/mm 2 , 0.06 N/mm 2 , 0.07 N/mm 2 , 0.08 N/mm 2 , 0.09 N/mm 2 , 0.1 N/mm 2 , 0.11 N/mm 2 , 0.12 N/mm 2 , 0.13 N/mm 2 , or 0.14 N/mm 2 . there is.
- the adhesive strength is less than or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or exceeds any one of the lower limits described above, may be less than or equal to any one of the stated upper limits.
- Adhesion to aluminum can be measured in the manner described in the Examples of this specification.
- the composition may have an adhesive strength of 0 N/mm 2 to aluminum. That is, the composition may be a composition in which adhesive strength to aluminum is not substantially measured.
- the composition may also exhibit suitable hardness.
- the hardness may be the hardness of the composition itself or, if the composition is curable, the hardness of the cured composition.
- the hardness of the composition may be adjusted so that a product having excellent impact resistance, vibration resistance and durability can be provided according to the application purpose when the composition is applied as a heat dissipation material.
- the upper limit of the hardness (Shore OO hardness) in the Shore OO type of the composition or its cured body may be about 90, 88, 86, 84 or 82, and the upper limit is 40, 45, 50 , 55, 60, 65, 70, 75, 80, 82 or 84.
- the hardness is less than or equal to or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or exceeds any one of the lower limits described above, may be less than or equal to any one of the stated upper limits.
- the hardness may be measured by the method disclosed in the Examples to be described later.
- the composition can exhibit excellent thermal conductivity.
- the lower limit of the thermal conductivity of the composition or its cured body is 1.2 W/mk, 1.4 W/mK, 1.6 W/mK, 1.8 W/mK, 2.0 W/mK, 2.2 W/mK, 2.4 W/mK , 2.6 W/mK or 2.8 W/mK
- the upper limit is 10 W/mK, 9 W/mK, 8 W/mK, 7 W/mK, 6 W/mK, 5 W/mK, 4 W /mK or even 3 W/mK.
- the thermal conductivity is less than or equal to or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or exceeds any one of the lower limits described above, may be less than or equal to any one of the upper limits described above.
- the thermal conductivity may be the thermal conductivity of the composition itself, or the thermal conductivity of the cured composition when the composition is curable. This thermal conductivity can be measured according to the ASTM D5470 standard.
- the composition may also exhibit adequate flexibility. By adjusting the flexibility of the composition to a desired level, the applications can be greatly expanded.
- the radius of curvature of the composition may be controlled.
- the radius of curvature may be the radius of curvature of the composition itself or, if the composition is curable, the radius of curvature of the cured composition.
- the lower limit of the radius of curvature may be, for example, 1, 2, 3, 4, 5 or 6, and the upper limit may be 20, 19, 18, 17, 16, 15, 14, 13, 12, 11, It can be as many as 10, 9, 8 or 7.
- the radius of curvature is less than or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or greater than any one of the lower limits described above, may be less than or equal to any one of the upper limits described above.
- the radius of curvature of this composition can be measured by the method disclosed in the Examples below. Also, the unit of the radius of curvature is mm.
- compositions of the present application may be insulating. That is, the composition may form a cured body having insulating properties and/or insulating properties.
- the composition or its cured product has a breakdown voltage of about 3 kV/mm or more, about 5 kV/mm or more, about 7 kV/mm or more, 10 kV/mm or more, or 15 kV, measured in accordance with ASTM D149. /mm or more or 20 kV/mm or more. The higher the value of the dielectric breakdown voltage, the better the insulation.
- the upper limit is not particularly limited, but considering the composition of the composition, the dielectric breakdown voltage is about 50 kV/mm or less, 45 kV/mm It may be about 40 kV/mm or less, 35 kV/mm or less, or 30 kV/mm or less.
- the breakdown voltage as described above can be controlled by adjusting the insulating properties of the composition, and can be achieved, for example, by applying an insulating filler in the resin layer.
- a ceramic filler is known as a component capable of securing insulation.
- the composition or cured product thereof may have flame retardancy.
- the composition or a cured product thereof may exhibit a V-0 grade in the UL 94 V Test (Vertical Burning Test). Accordingly, it is possible to secure stability against fire and other accidents that are of concern depending on the application of the composition.
- the composition or a cured product thereof may have a specific gravity of 5 or less.
- the specific gravity may be 4.5 or less, 4 or less, 3.5 or less, or 3 or less in another example.
- a resin layer exhibiting a specific gravity within this range is advantageous for providing a more lightweight product.
- the lower limit of the specific gravity is not particularly limited.
- the specific gravity may be about 1.5 or more or 2 or more.
- Components added to the resin layer may be adjusted in order to show the specific gravity of the composition or its cured product.
- a filler capable of securing a desired characteristic eg, thermal conductivity
- a desired characteristic eg, thermal conductivity
- applying a filler having a low specific gravity itself or applying a filler having a surface treatment method, etc. may be used.
- the composition or its cured product may also have a 5% weight loss temperature in thermogravimetric analysis (TGA) of 400°C or more, or a residual amount of 800°C or more of 70% by weight or more. Due to these properties, stability at high temperatures can be further improved.
- the remaining amount at 800° C. may be about 75% by weight or more, about 80% by weight or more, about 85% by weight or more, or about 90% by weight or more in another example.
- the remaining amount at 800 ° C. may be about 99% by weight or less in another example.
- the thermogravimetric analysis (TGA) may measure within the range of 25°C to 800°C at a heating rate of 20°C/min under a nitrogen (N 2 ) atmosphere of 60 cm 3 /min.
- thermogravimetric analysis (TGA) result can also be achieved by adjusting the composition of the composition.
- the remaining amount at 800°C is usually influenced by the type or ratio of the filler contained in the composition, and when an excessive amount of filler is included, the remaining amount increases.
- the composition may include a resin component.
- resin component includes a component known as a resin in the industry as well as a component capable of forming a resin component through a curing reaction or the like.
- polyurethane may be formed by reacting a polyol compound with a polyisocyanate, etc.
- the polyisocyanate itself is not a resin component, and the polyol compound is also not a resin component in some cases.
- a monohydric alcohol or thiol compound to be described later referred to herein may not be a resin component.
- the polyol compound, polyisocyanate, monohydric alcohol and/or thiol compound in this specification is intended to form a polyurethane corresponding to the resin component, it can be regarded as a resin component in this specification.
- the resin component may include at least one selected from the group consisting of polyurethane, polyol compound, monohydric alcohol, thiol compound, and polyisocyanate.
- a polyol compound, a monohydric alcohol, a thiol compound, or a polyisocyanate may be included as a resin component when the composition of the present application is a curable composition.
- polyol compound means a compound containing two or more hydroxyl groups. These polyol compounds may be monomolecular, oligomeric or macromolecular compounds.
- the number of hydroxy groups included in the polyol compound is not particularly limited, but in one example, the lower limit of the number of hydroxy groups included in the polyol compound may be about 2 or 3, and the upper limit is 10 or 9 , 8, 7, 6, 5, 4, 3 or 2.
- the number of hydroxyl groups is less than or equal to or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or exceeds any one of the lower limits described above , may be less than or equal to any one of the upper limits described above.
- the polyol compound may be selected to secure desired physical properties.
- the composition of the present application or the resin component may include a trifunctional or higher functional polyol compound and a bifunctional polyol compound as the polyol compound.
- trifunctional or higher means that the number of hydroxyl groups included in the polyol compound is three or more
- bifunctional means that the number of hydroxyl groups included in the polyol compound is two.
- the upper limit of the number of hydroxyl groups included in the trifunctional or higher functional polyol compound may be about 10, 9, 8, 7, 6, 5, 4 or 3.
- the number of hydroxyl groups included in the trifunctional or higher functional polyol compound may be 3 or more and may be equal to or less than any one of the upper limits described above.
- At least one of the trifunctional or higher functional polyol compound and the bifunctional polyol compound may have a controlled number average molecular weight (Mn).
- Mn controlled number average molecular weight
- the lower limit of the number average molecular weight may be about 300 g/mol, 500 g/mol, 700 g/mol, 900 g/mol, 1100 g/mol, 1300 g/mol, 1500 g/mol, 1700 g/mol or 1900 g/mol.
- the upper limit may be about 3000 g / mol, 2800 g / mol, 2600 g / mol, 2400 g / mol, 2200 g / mol, 2000 g / mol, 1800 g / mol, 1600 g / mol, 1400 g / mol or 1200 g / mol.
- the number average molecular weight is less than or equal to or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or exceeds any one of the lower limits described above , may be less than or equal to any one of the upper limits described above.
- both the trifunctional or higher functional polyol compound and the bifunctional polyol compound may have a number average molecular weight within the above range.
- one of the trifunctional or higher functional polyol compound and the bifunctional polyol compound may have a number average molecular weight of 1500 g/mol or more, and the other may have a number average molecular weight of less than 1500 g/mol.
- the lower limit of the number average molecular weight of the polyol compound having a higher number average molecular weight among the trifunctional or higher functional polyol compound and the bifunctional polyol compound may be about 1500 g/mol, 1700 g/mol or 1900 g/mol.
- the upper limit may be about 3000 g/mol, 2800 g/mol, 2600 g/mol, 2400 g/mol, 2200 g/mol or 2000 g/mol.
- the number average molecular weight is less than or equal to or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or exceeds any one of the lower limits described above , may be less than or equal to any one of the upper limits described above.
- the upper limit of the number average molecular weight of the polyol compound having a smaller number average molecular weight among the trifunctional or higher functional polyol compound and the bifunctional polyol compound is 1500 g / mol, 1400 g / mol, 1300 g / mol, 1200 g / mol , It may be about 1100 g/mol or 1000 g/mol, and the lower limit may be about 500 g/mol, 700 g/mol or 900 g/mol.
- the number average molecular weight is less than or equal to or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or exceeds any one of the lower limits described above , may be less than or equal to any one of the upper limits described above.
- the tri- or higher functional polyol compound may have a higher number average molecular weight than the bifunctional polyol compound.
- one of the trifunctional or higher functional polyol compound and the bifunctional polyol compound may be a so-called polyester polyol, and the other may be a polyether polyol.
- polyester polyol a known polyester polyol can be applied without particular limitation.
- a polyol having an alkane diol unit, a polyol unit, and a dicarboxylic acid unit may be used as the polyester polyol compound.
- Such polyols may be mixtures of the above alkane diols, polyols and dicarboxylic acids, or reactants thereof.
- the alkane diol is 3-methyl-1,5-pentanediol (3-methyl-1,5-pentanediol), 1,9-nonanediol (1,9-nonanediol) or 1,6-hexanediol
- Diol compounds having 1 to 20 carbon atoms, 4 to 20 carbon atoms, 4 to 16 carbon atoms, or 4 to 12 carbon atoms, such as 1,6-hexanediol may be exemplified.
- the polyol includes 3 to 10, 3 to 9, 3 to 8, 3 to 7, 3 to 6, 3 to 5, or 3 to 6, such as trimethylolpropane.
- Alkanes having 1 to 20 carbon atoms, 4 to 20 carbon atoms, 4 to 16 carbon atoms, or 4 to 12 carbon atoms substituted with four hydroxyl groups may be exemplified.
- dicarboxylic acid adipic acid, terephthalic acid, isophthalic acid, or sebacic acid
- suitable examples include adipic acid or sebacic acid.
- Polyester polyol compounds of this kind include, for example, Kuraray's P-510, P-1010, P-2010, P-3010, P-4010, P-5010, P-6010, F-510, F-1010, Known under product names such as F-2010, F-3010, P-2011, P-520, P-2020, P-1012, P-2012, P-630, P-2030, P-2050 or N-2010 .
- polyether polyol any known polyether polyol can be applied without particular limitation.
- polyalkylene glycol can be applied as the polyether polyol compound.
- alkylene alkylene having 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms may be exemplified.
- an alkylene or alkylene group refers to a divalent substituent formed by leaving two hydrogen atoms from an alkane. It can also break away from a single carbon atom.
- the polyester polyol is applied as the trifunctional or higher functional polyol compound among the trifunctional or higher functional polyol compound and the bifunctional polyol compound, and the polyether polyol is used as the bifunctional polyol compound. can be applied.
- the content of the bi-functional polyol compound relative to 100 parts by weight of the tri- or higher-functional polyol compound The lower limit is 5 parts by weight, 10 parts by weight, 15 parts by weight, 20 parts by weight, 25 parts by weight, 30 parts by weight, 35 parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 55 parts by weight, 60 parts by weight.
- 65 parts by weight, 70 parts by weight, 75 parts by weight, 80 parts by weight may be about 85 parts by weight or 90 parts by weight, the upper limit of which is 200 parts by weight, 190 parts by weight, 180 parts by weight, 170 parts by weight, 160 parts by weight parts, 150 parts, 140 parts, 130 parts, 120 parts, 110 parts, 100 parts, or 90 parts by weight.
- the ratio is less than or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or exceeds any one of the lower limits described above, may be less than or equal to any one of the stated upper limits. Under this ratio, desired physical properties can be effectively secured.
- the resin component may further include a monohydric alcohol or thiol compound.
- the monohydric alcohol is a compound containing one hydroxyl group.
- the monohydric alcohol or thiol compound a compound having a molecular weight (molar mass) within a predetermined range can be used.
- the lower limit of the molecular weight (molar mass) of the monohydric alcohol or thiol compound is 50 g/mol, 55 g/mol, 60 g/mol, 65 g/mol, 70 g/mol, 75 g/mol, 80 g/mol, 85g/mol, 90g/mol, 95g/mol, 100g/mol, 110g/mol, 120g/mol, 130g/mol, 140g/mol or 150g/mol, the upper limit being 500g/mol, 480g/mol mol, 460g/mol, 440g/mol, 420g/mol, 400g/mol, 380g/mol, 360g/mol, 340g/mol, 320g/mol, 300g/mol, 280g/mol, 260g/mol, 240g/mol, It may be on the order of 220 g/mol,
- the molecular weight (molar mass) of the monohydric alcohol or thiol compound is less than or equal to any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is less than or equal to any one of the lower limits described above. It may be equal to or greater than any one lower limit and less than or equal to any one of the upper limits set forth above.
- any compound having one hydroxy group (monohydric alcohol) or one compound having one thiol group (thiol compound) can be applied without particular limitation.
- Non-limiting examples of monohydric alcohols that can be applied are 2-propylheptanol (2-propylheptanol), ethanol, propanol, butanol, pentanol, hexanol, heptanol, octanol, 2-ethylhexanol, nonanol , decanol, ethenol, propenol, butenol, acetylenol, propanol, butynol, phenol, methylphenol, pyridinol and/or methylpyridinol, etc.
- thiol compound examples include ethanethiol , Propanethiol, butanethiol, pentanethiol, hexanethiol, heptanethiol, octanethiol, 2-ethylhexanethiol, nonanethiol, tecanthiol, 2-propylheptanethiol, ethenethiol, propenethiol, butenethiol, Acetylenethiol, propinethiol, butynthiol, benzenethiol, methylbenzenethiol, pyridinethiol and/or methylpyridinethiol may be exemplified, but is not limited thereto.
- the lower limit of the content of the monohydric alcohol or thiol compound relative to 100 parts by weight of the trifunctional or higher polyfunctional polyol compound is 1 part by weight, 3 parts by weight, 5 parts by weight, 7 parts by weight, 9 parts by weight, 11 parts by weight It may be about 13 parts by weight, 15 parts by weight, 17 parts by weight, 19 parts by weight, 21 parts by weight, 23 parts by weight, 25 parts by weight, 27 parts by weight or 29 parts by weight, and the upper limit is 100 parts by weight, 95 parts by weight, 90 parts by weight, 85 parts by weight, 80 parts by weight, 75 parts by weight, 70 parts by weight, 65 parts by weight, 60 parts by weight, 55 parts by weight, 50 parts by weight, 45 parts by weight, 40 parts by weight, 35 parts by weight part or about 30 parts by weight.
- the ratio is less than or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or exceeds any one of the lower limits described above, may be less than or equal to any one of the stated upper limits. At this ratio, desired physical properties can be secured more efficiently.
- the composition may contain polyisocyanate.
- This polyisocyanate can react with the polyol compound and the like to form polyurethane.
- polyisocyanate means a compound having two or more isocyanate groups.
- the lower limit of the number of isocyanate groups of the polyisocyanate may be 2 or 3, and the upper limit is 10, 9, 8, 7, 6, 5, 4, 3 or 2 may be of a degree.
- the number of the isocyanate groups is less than or equal to or less than any one of the upper limits described above, is equal to or more than the lower limit of any one of the lower limits described above, or exceeds or exceeds the lower limit of any one of the lower limits described above. While, it may be within a range of less than or less than any one of the upper limits described above.
- polyisocyanate is not particularly limited, but non-aromatic polyisocyanate containing no aromatic group may be used to secure desired physical properties.
- polyisocyanate compound examples include aliphatic polyisocyanates such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate methyl, ethylene diisocyanate, propylene diisocyanate or tetramethylene diisocyanate; alicyclic polyisocyanates such as transcyclohexane-1,4-diisocyanate, isophorone diisocyanate, bis(isocyanatemethyl)cyclohexane diisocyanate, or dicyclohexylmethane diisocyanate; Alternatively, one or more of the above carbodiimide-modified polyisocyanates or isocyanurate-modified polyisocyanates may be used.
- aliphatic polyisocyanates such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate
- polyisocyanate the addition reaction product of the above-mentioned diisocyanate and polyol (for example, trimethylol propane etc.) can also be used. Also, a mixture of two or more of the compounds listed above may be used.
- polyfunctional polyisocyanates having at least three functions that is, three or more isocyanate groups, and bifunctional polyisocyanates (compounds having two isocyanate groups) may be used together.
- the upper limit of the number of isocyanate groups included in the trifunctional or higher functional polyisocyanate may be about 10, 9, 8, 7, 6, 5, 4 or 3.
- the number of isocyanate groups of the trifunctional or higher functional polyisocyanate may be three or more, and may be equal to or less than any one of the upper limits described above.
- the application rate of the polyisocyanate may be adjusted in consideration of the number of hydroxy groups and thiol groups present in the polyol compound, monohydric alcohol and/or thiol compound included in the composition and physical properties after curing.
- the polyisocyanate may be included in an appropriate ratio within the range of 10 parts by weight to 2000 parts by weight based on 100 parts by weight of the polyol compound present in the composition.
- the lower limit of the ratio of the bifunctional polyisocyanate to 100 parts by weight of the trifunctional or higher multifunctional polyisocyanate is 5 parts by weight part, 10 parts by weight, 15 parts by weight, 20 parts by weight, 25 parts by weight, 30 parts by weight, 35 parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 55 parts by weight, or about 60 parts by weight
- the upper limit is 200 parts by weight, 190 parts by weight, 180 parts by weight, 170 parts by weight, 160 parts by weight, 150 parts by weight, 140 parts by weight, 130 parts by weight, 120 parts by weight, 110 parts by weight, 100 parts by weight, 90 parts by weight.
- the ratio is less than or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or exceeds any one of the lower limits described above, may be less than or equal to any one of the stated upper limits. Under this ratio, desired physical properties can be effectively secured.
- the composition may further contain a filler component as an additional component.
- a filler component means a component made of a filler, that is, a component containing only a filler.
- the filler component may include two or more types of fillers having different average particle diameters.
- the filler component includes three or more types of fillers having different average particle diameters, or consists of 3 to 6 types, 3 to 5 types, 3 to 4 types, or 3 types of fillers with different average particle diameters. can That is, in one example, the filler component may include only 3 to 6 types, 3 to 5 types, 3 to 4 types, or 3 types of fillers having different average particle diameters.
- the filler component may exhibit at least two peaks in a volume curve of a particle size distribution measured using laser diffraction.
- the filler component may exhibit 3 or more peaks, 3 to 6 peaks, 3 to 5 peaks, 3 to 4 peaks, or 3 peaks in the volume curve of the particle size distribution.
- the range of filler components exhibiting three peaks does not include filler components exhibiting one, two, or four or more peaks.
- the average particle diameter of the filler of the present application means the particle diameter at which the volume accumulation is 50% in the volume curve of the particle size distribution measured by laser diffraction, and may be referred to as the median diameter. That is, in the present application, the particle size distribution is obtained on a volume basis through the laser diffraction method, and the particle diameter at the point where the cumulative value is 50% in the cumulative curve with the total volume as 100% is the average particle diameter, and this average particle diameter Silver, in another example, may be called a median particle diameter or a D50 particle diameter.
- the two types of fillers having different average particle diameters may mean fillers having different particle diameters at the point where the cumulative value becomes 50% in the volume curve of the particle size distribution.
- the volume curve of the particle size distribution measured using the laser diffraction method for the filler component is equal to the type of the mixed filler. peak appears. Therefore, for example, when a filler component is formed by mixing three types of fillers having different average particle diameters, the volume curve of the particle size distribution measured using the laser diffraction method for the filler component shows three peaks.
- the filler component of the composition of the present application may be a thermally conductive filler component.
- thermally conductive filler component means a filler component that functions so that the composition or its cured product exhibits the above-mentioned thermal conductivity.
- the filler component may include at least a first filler having an average particle diameter of 60 ⁇ m to 200 ⁇ m, a second filler having an average particle diameter of 10 ⁇ m to 30 ⁇ m, and a third filler having an average particle diameter of 5 ⁇ m or less. there is.
- the lower limit of the average particle diameter of the first filler may be about 62 ⁇ m, 62 ⁇ m, 64 ⁇ m, 66 ⁇ m or about 68 ⁇ m, and the upper limit thereof is 200 ⁇ m, 195 ⁇ m, 190 ⁇ m, 185 ⁇ m, 180 ⁇ m, 175 ⁇ m.
- the average particle diameter of the first filler is less than or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or equal to any one of the lower limits described above. or greater, but may be within a range of less than or equal to any one of the upper limits described above.
- the lower limit of the average particle diameter of the second filler may be about 10 ⁇ m, 12 ⁇ m, 13 ⁇ m, 14 ⁇ m, 15 ⁇ m, 16 ⁇ m, 17 ⁇ m, 18 ⁇ m, 19 ⁇ m, or 20 ⁇ m, and the upper limit is 29 ⁇ m. , 28 ⁇ m, 27 ⁇ m, 26 ⁇ m, 25 ⁇ m, 24 ⁇ m, 23 ⁇ m, 22 ⁇ m, 21 ⁇ m or about 20 ⁇ m.
- the average particle diameter of the second filler is less than or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or equal to any one of the lower limits described above. or greater, but may be within a range of less than or equal to any one of the upper limits described above.
- the lower limit of the third filler may be about 0.01 ⁇ m, 0.1 ⁇ m, about 0.5 ⁇ m, 1 ⁇ m, 1.5 ⁇ m, or 2 ⁇ m, and the upper limit thereof is about 5 ⁇ m, 4.5 ⁇ m, about 4 ⁇ m, 3.5 ⁇ m, 3 ⁇ m, or 2.5 ⁇ m. Alternatively, it may be on the order of 2 ⁇ m.
- the average particle diameter of the third filler is less than or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or equal to any one of the lower limits described above. or greater, but may be within a range of less than or equal to any one of the upper limits described above.
- a ratio (D1/D3) between the average particle diameter (D1) of the first filler and the average particle diameter (D3) of the third filler may be in the range of 25 to 300.
- the third filler may be a filler having the smallest average particle diameter among fillers included in the filler component when the filler component includes two or more types of fillers having different average particle diameters
- the first filler may be a filler in which the filler components are different from each other.
- the filler may have the largest average particle size among the fillers included in the filler component. In this state, the particle size ratio may be satisfied.
- the lower limit of the ratio (D1/D3) is 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 40, 50, 60, 70, 80, 90, 100, 110, 120 , 130, 140, 150, 160, 170, 180, 190, 200, 210, 220, 230 or 235
- the upper limit is 300, 290, 280, 270, 260, 250, 240, 220, 200, 180, 160, 140, 120, 100, 95, 90, 85, 80, 75, 70, 65 or 60 degrees.
- the ratio is less than or equal to or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or exceeds any one of the lower limits described above, It may be within a range of less than or equal to any one of the upper limits described.
- the lower limit of the ratio (D1/D2) of the average particle diameter (D1) of the first filler to the average particle diameter (D2) of the second filler is about 3, 3.1, 3.2, 3.3, 3.4, or 3.5, or 20 , 18, 17, 16, 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5 or 4.
- the ratio is less than or equal to or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or exceeds any one of the lower limits described above, It may be within a range of less than or equal to any one of the upper limits described.
- the filler for example, aluminum oxide (alumina: Al 2 O 3 ), aluminum nitride (AlN), boron nitride (BN), silicon nitride (Si 3 N 4 ), silicon carbide (SiC), beryllium oxide (BeO), oxide Ceramic fillers such as zinc (ZnO), magnesium oxide (MgO), aluminum hydroxide (Al(OH) 3 ), magnesium hydroxide (Mg(OH) 2 ), calcium carbonate (CaCO 3 ) and/or Boehmite can be used Such a filler is advantageous in satisfying the thermal conductivity within the above-mentioned range, and additionally, the above-described insulation may be satisfied through the application of a ceramic filler.
- AlN aluminum nitride
- BN boron nitride
- Si 3 N 4 silicon carbide
- BeO beryllium oxide
- oxide Ceramic fillers such as zinc (ZnO), magnesium oxide (MgO), aluminum hydroxide (Al(OH) 3
- the upper limit of the proportion of the filler component in the composition is 98%, 97.5%, 97%, 96.5%, 96%, 95.5%, 95%, 94.5%, 94%, 93.5%, 93%, 92.5%, 92%, 91.5%, 91%, 90.5%, 90.0%, 89.5%, 89.0%, 88.5% or 88.0% by weight; ,
- the lower limit is 70% by weight, 71% by weight, 72% by weight, 73% by weight, 74% by weight, about 75% by weight, 76% by weight, 77% by weight, 78% by weight, 79% by weight, 80% by weight, 81%, 82%, 83%, 84%, 85%, 86%, 87% or 88% by weight.
- the ratio is less than or equal to or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or exceeds any one of the lower limits described above, It may be within a range of less than or equal to any one of the upper limits described.
- the content of the filler component is a ratio based on the total weight of the composition when the composition is a one-component composition, and when the composition is a two-component composition, based on the total weight of the main part and the curing agent part of the two-component composition It may be a ratio, or a ratio based on the total weight of the subject or curing agent part alone.
- the composition is composed of a two-component composition
- the ratio (A/B) of the weight (A) of the filler included in the main part and the weight (B) of the filler included in the curing agent part is within the range of 0.5 to 2, 0.5 to 1.5 or within the range of 0.8 to 1.2.
- the filler component may include various types of fillers, if necessary, in addition to the thermally conductive filler.
- a carbon filler such as graphite, fumed silica, or clay may be applied.
- composition may further include necessary components in addition to the components described above.
- the composition may further include a plasticizer.
- a plasticizer As described above, in the present application, it is possible to secure low adhesion to a specific material without applying a plasticizer, but a small amount of plasticizer may be applied if necessary.
- the type of plasticizer that can be applied is not particularly limited, and examples thereof include dioctyl phthalate (DOP), dibutyl phthalate (DBP), butylbenzyl phthalate (BBP), and diisononyl phthalate.
- DOP dioctyl phthalate
- DBP dibutyl phthalate
- BBP butylbenzyl phthalate
- diisononyl phthalate diisononyl phthalate.
- diisononyl phthalate, DINP diisononyl phthalate
- PET polyethylene terephthalate
- phthalate-based plasticizers dioctyl adipate (DOA), or diisononyl adipate (diisononyl adipate, DINA)
- DOA dioctyl adipate
- diisononyl adipate diisononyl adipate
- adipate-based plasticizers a fatty acid-based plasticizer, a phosphoric acid-based plasticizer, or a polyester-based plasticizer may be applied.
- the lower limit of the weight ratio of the plasticizer relative to 100 parts by weight of the polyol compound is 0.5 parts by weight, 1.5 parts by weight, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 15 parts, 20 parts, 25 parts, 30 parts, 35 parts, 40 parts, 45 parts, It may be about 50 parts by weight, 100 parts by weight, 150 parts by weight, 200 parts by weight, 250 parts by weight or 300 parts by weight, and the upper limit is 500 parts by weight, 450 parts by weight, 400 parts by weight, 350 parts by weight, 300 parts by weight.
- the ratio is less than or equal to or less than any one of the upper limits described above, is greater than or exceeds any one of the lower limits described above, or is greater than or exceeds any one of the lower limits described above, It may be within a range of less than or equal to any one of the upper limits described.
- the ratio may be changed in consideration of the composition of the entire composition or intended use.
- the composition may include additional components as needed.
- additional components are catalysts that assist or accelerate the curing reaction, viscosity modifiers (e.g., thixotropy imparting agents, diluent, etc.), a dispersing agent, a surface treatment agent, or a coupling agent.
- the composition may further include a flame retardant or a flame retardant aid.
- a flame retardant may be used without particular limitation, and for example, a solid filler type flame retardant or a liquid flame retardant may be applied.
- the flame retardant examples include organic flame retardants such as melamine cyanurate and inorganic flame retardants such as magnesium hydroxide.
- organic flame retardants such as melamine cyanurate
- inorganic flame retardants such as magnesium hydroxide.
- a liquid type flame retardant material TEP, Triethyl phosphate or TCPP, tris(1,3-chloro-2-propyl)phosphate, etc.
- TEP Triethyl phosphate or TCPP, tris(1,3-chloro-2-propyl)phosphate, etc.
- silane coupling agent capable of acting as a flame retardant synergist may be added.
- the composition may be a one-component composition or a two-component composition, as described above.
- each of the above-described components of the composition may be separately included in a physically separated main part and a curing agent part.
- the present application relates to a composition in which the composition is a two-component composition (two-component composition).
- Such a two-component composition may include at least a main component part and a curing agent part, and the main component and curing agent part may be physically separated from each other. When these physically separated main body and curing agent parts are mixed, a curing reaction is initiated, resulting in the formation of polyurethane.
- the main part may include at least the polyol compound
- the curing agent part may include at least the polyisocyanate
- composition includes the aforementioned monohydric alcohol and/or thiol compound
- this compound may be included in the main part, for example.
- the filler component may be included in any one of the subject and curing agent parts, or may be included in both of the subject and curing agent parts. When the filler component is included in both the main agent and the curing agent part, the same amount of the filler component may be included in the main agent and the curing agent part.
- a volume ratio (P/N) of the volume (P) of the main part to the volume (N) of the curing agent part may be in the range of about 0.8 to 1.2.
- This two-component composition or its cured product also has the aforementioned adhesion to aluminum, thermal conductivity, hardness, radius of curvature, insulation, flame retardancy, specific gravity and/or 5% weight loss in thermogravimetric analysis (TGA) temperature. etc. can be shown.
- TGA thermogravimetric analysis
- This application also relates to a product containing the composition or a cured product thereof.
- the composition of the present application or a cured product thereof may be usefully applied as a heat dissipation material.
- the product may include a heating component.
- the term heating component refers to a component that emits heat during use, and the type is not particularly limited. Representative heating components include various electric/electronic products including battery cells, battery modules, or battery packs.
- the product of the present application may include, for example, the heat-generating component and the composition (or the two-component composition) present adjacent to the heat-generating component or a cured product thereof.
- a specific method of configuring the product of the present application is not particularly limited, and if the composition of the present application or a two-component composition or a cured product thereof is applied as a heat dissipation material, the product may be configured in various known ways.
- the present application it is possible to provide a composition that can be cured at room temperature in the case of curing, and can form a heat dissipation material exhibiting an appropriate level of hardness, low adhesive strength, and excellent thermal conductivity.
- the low adhesive strength and the like can be achieved without using a plasticizer or the like, or in a state where the use ratio is minimized.
- the present application may also provide a product containing the composition or a cured product thereof.
- the cured body mentioned below is formed by mixing the main agent and curing agent parts of the compositions of Examples or Comparative Examples prepared in a two-component type at a volume ratio of 1:1, and then maintaining at room temperature for about 24 hours.
- the thermal conductivity of the composition or its cured product was measured by a hot-dist method according to ISO 22007-2 standards. Specifically, a mixture of a volume ratio of 1:1 of the subject part and the curing agent part of Examples or Comparative Examples composed of a two-component type was placed in a mold having a thickness of about 7 mm, and thermal conductivity was measured in the through plane direction using a hot disk device. was measured.
- Hot Disk equipment is a device that can check thermal conductivity by measuring temperature change (electrical resistance change) while the sensor in which the nickel wire has a double spiral structure is heated. Thermal conductivity was measured according to.
- An uncured resin composition (a mixture of a main part and a curing agent part) is coated on the center of an aluminum substrate having a width of 2 cm and a length of 7 cm, respectively, to a size of about 2 cm in width and 2 cm in length, and then on the coating layer again.
- the two aluminum substrates were attached to form an angle of 90 degrees to each other.
- the lower aluminum substrate was pressed at a speed of 0.5 mm/min to measure the force while the lower aluminum substrate was separated, and the maximum force measured in the process was expressed as the area of the specimen.
- the adhesion to aluminum was obtained by dividing (peel angle of 90 degrees).
- the hardness of the cured body of the composition was measured according to ASTM D 2240 and JIS K 6253 standards. It was performed using an ASKER, durometer hardness device, and the initial hardness was measured by applying a load of 1 Kg or more (about 1.5 Kg) to the surface of the sample (resin layer) in a flat state, and after 15 seconds, the hardness was confirmed as a stabilized measurement value. evaluated.
- the radius of curvature of the cured body was evaluated using a cured body having a width, length, and thickness of 1 cm, 10 cm, and 2 mm, respectively.
- the radius of curvature is the minimum radius of a cylinder at which cracks do not occur in the hardened body when the hardened body is attached to cylinders having various radii and bent along the longitudinal direction.
- the unit of curvature radius in this specification is mm.
- the weight average molecular weight (Mw) was measured using GPC (Gel permeation chromatography). Specifically, for the weight average molecular weight (Mw), put the sample to be analyzed in a 5 mL vial, dilute with a THF (tetrahydrofuran) solvent to a concentration of about 1 mg/mL, and then prepare a standard sample for calibration and an analysis sample. It can be filtered and measured through a syringe filter (pore size: 0.45 ⁇ m). ChemStation of Agilent technologies was used as an analysis program, and the weight average molecular weight (Mw) can be obtained by comparing the elution time of the sample with the calibration curve.
- GPC Gel permeation chromatography
- Standard samples using polystyrene (MP: 3900000, 723000, 316500, 52200, 31400, 7200, 3940, 485).
- polystyrene resin As a polyol compound, trifunctional polyester polyol (Kuraray, F-2010) and bifunctional polyether polyol (polypropylene glycol) (PPG-1000D, Kumho Petrochemical) and 2-propylheptanol as a monohydric alcohol ( The main part was prepared by mixing 2-propylheptanol, 2PH) with a filler component and a catalyst (dibutyltin dilaurate, DBTDL).
- a catalyst dibutyltin dilaurate
- the trifunctional polyester polyol (Kuraray Co., F-2010) has three hydroxy groups, a number average molecular weight of about 2000 g / mol, 3-methyl-1,5-pentanediol unit and trimethylol propane unit and a compound having an adipic acid unit, and the bifunctional polyether polyol is polypropylene glycol having a number average molecular weight of about 1000 g/mol.
- the mixing ratio of the above components was set to a weight ratio of 100:90:30:1869 (F-2010:PPG-1000D:2-PH:filler component), and a catalyst was added in a catalytic amount.
- a first alumina filler having an average particle diameter of about 70 ⁇ m, a second alumina filler having an average particle diameter of about 20 ⁇ m, and a third alumina filler having an average particle diameter of about 1 ⁇ m were mixed and prepared.
- the weight ratio during the mixing was about 60:20:20 (first alumina filler:second alumina filler:third alumina filler).
- a trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) and a bifunctional polyisocyanate (Asahi Kasei, AE700-100) were mixed with a filler component to prepare a curing agent part.
- the mixing ratio was 100:60:3271 by weight (HD T LV2:AE700-100:filler component:).
- the filler component in the above the same component as that applied in the main part was used.
- a composition was prepared by preparing the subject part and the curing agent part at a volume ratio of 1:1. Mixing and curing of the subject part and the curing agent part were all performed at room temperature.
- a main part was prepared by mixing a bifunctional polyether polyol (polypropylene glycol) (PPG-1000D, Kumho Petrochemical Co., Ltd.) with a filler component and a catalyst.
- the mixing ratio of the above components was set to a weight ratio of 100:1010 (PPG-1000D: filler component), and a catalyst was added in a catalytic amount.
- PPG-1000D polypropylene glycol
- a catalyst was added in a catalytic amount.
- the filler component and the catalyst the same components as in Example 1 were used.
- polyisocyanate As the polyisocyanate, a trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) and a bifunctional polyisocyanate (Asahi Kasei, AE700-100) were mixed with a filler component to prepare a curing agent part.
- the mixing ratio was 100:25:5631 by weight (HD T LV2:AE700-100:filler component:).
- the same filler component as in Example 1 was used.
- a composition was prepared by preparing the subject part and the curing agent part at a volume ratio of 1:1. Mixing and curing of the subject part and the curing agent part were all performed at room temperature.
- a main part was prepared by mixing a bifunctional polyether polyol (polypropylene glycol) (PPG-1000D, Kumho Petrochemical Co., Ltd.) with a filler component and a catalyst.
- the mixing ratio of the above components was set to a weight ratio of 100:1010 (PPG-1000D: filler component), and the catalyst was blended in a catalytic amount.
- PPG-1000D polypropylene glycol
- the filler component and the catalyst the same components as in Example 1 were used.
- a curing agent part was prepared by mixing a trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) with a filler component.
- the mixing ratio was 100:4990 by weight (HD T LV2: Filler component:).
- HD T LV2 Filler component:
- a composition was prepared by preparing the subject part and the curing agent part at a volume ratio of 1:1. Mixing and curing of the subject part and the curing agent part were all performed at room temperature.
- a main part was prepared by mixing a bifunctional polyether polyol (polypropylene glycol) (PPG-1000D, Kumho Petrochemical Co., Ltd.) with a filler component and a catalyst.
- the mixing ratio of the components was set to a weight ratio of 100:1156 (PPG-1000D: filler component), and the catalyst was blended in a catalytic amount.
- PPG-1000D polypropylene glycol
- the filler component and the catalyst the same components as in Example 1 were used.
- a curing agent part was prepared by mixing trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) with a filler component.
- the mixing ratio was 100:4416 by weight (HD T LV2: Filler component:).
- HD T LV2 Filler component:
- a composition was prepared by preparing the subject part and the curing agent part at a volume ratio of 1:1. Mixing and curing of the subject part and the curing agent part were all performed at room temperature.
- a polyol compound As a polyol compound, a trifunctional polyester polyol (Kuraray, F-2010) and a bifunctional polyether polyol (polypropylene glycol) (PPG-1000D, Kumho Petrochemical) are mixed with a filler component and a catalyst to form a main part. manufactured.
- the mixing ratio of the above components was set to a weight ratio of 100:233:3788 (F-2010:PPG-1000D:filler component), and the catalyst was blended in a catalytic amount.
- the filler component and the catalyst the same components as in Example 1 were used.
- a curing agent part was prepared by mixing a trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) with a filler component.
- the mixing ratio was 100:4698 by weight (HD T LV2: Filler component:).
- HD T LV2 Filler component:
- a composition was prepared by preparing the subject part and the curing agent part at a volume ratio of 1:1. Mixing and curing of the subject part and the curing agent part were all performed at room temperature.
- a polyol compound As a polyol compound, a trifunctional polyester polyol (Kuraray, F-2010) and a bifunctional polyether polyol (polypropylene glycol) (PPG-1000D, Kumho Petrochemical) are mixed with a filler component and a catalyst to form a main part. manufactured.
- the mixing ratio of the above components was set to a weight ratio of 100:150:2825 (F-2010:PPG-1000D:filler component), and the catalyst was blended in a catalytic amount.
- the filler component and the catalyst the same components as in Example 1 were used.
- trifunctional polyisocyanate trifunctional HDI Trimer, Vencorex Co., HD T LV2
- the mixing ratio was 100:4811 by weight (HD T LV2: Filler component:).
- HD T LV2 Filler component:
- a composition was prepared by preparing the subject part and the curing agent part at a volume ratio of 1:1. Mixing and curing of the subject part and the curing agent part were all performed at room temperature.
- a polyol compound As a polyol compound, a trifunctional polyester polyol (Kuraray, F-2010) and a bifunctional polyether polyol (polypropylene glycol) (PPG-1000D, Kumho Petrochemical) are mixed with a filler component and a catalyst to form a main part. manufactured.
- the mixing ratio of the above components was set to a weight ratio of 100:100:2252 (F-2010:PPG-1000D:filler component), and the catalyst was blended in a catalytic amount.
- the filler component and the catalyst the same components as in Example 1 were used.
- a curing agent part was prepared by mixing a trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) with a filler component.
- the mixing ratio was 100:4912 by weight (HD T LV2: Filler component:).
- HD T LV2 Filler component:
- a composition was prepared by preparing the subject part and the curing agent part at a volume ratio of 1:1. Mixing and curing of the subject part and the curing agent part were all performed at room temperature.
- a polyol compound As a polyol compound, a trifunctional polyester polyol (Kuraray, F-2010) and a bifunctional polyether polyol (polypropylene glycol) (PPG-1000D, Kumho Petrochemical) are mixed with a filler component and a catalyst to form a main part. manufactured.
- the mixing ratio of the above components was set to a weight ratio of 100:150:2793 (F-2010:PPG-1000D:filler component), and the catalyst was blended in a catalytic amount.
- the filler component and the catalyst the same components as in Example 1 were used.
- a curing agent part was prepared by mixing a trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) with a filler component.
- the mixing ratio was 100:5091 by weight (HD T LV2: Filler component:).
- HD T LV2 Filler component:
- a composition was prepared by preparing the subject part and the curing agent part at a volume ratio of 1:1. Mixing and curing of the subject part and the curing agent part were all performed at room temperature.
- a polyol compound As a polyol compound, a trifunctional polyester polyol (Kuraray, F-2010) and a bifunctional polyether polyol (polypropylene glycol) (PPG-1000D, Kumho Petrochemical) are mixed with a filler component and a catalyst to form a main part. manufactured.
- the mixing ratio of the above components was set to a weight ratio of 100:150:2759 (F-2010:PPG-1000D:filler component), and the catalyst was blended in a catalytic amount.
- the filler component and the catalyst the same components as in Example 1 were used.
- a curing agent part was prepared by mixing a trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) with a filler component.
- the mixing ratio was 100:5344 by weight (HD T LV2: Filler component:).
- HD T LV2 Filler component:
- a composition was prepared by preparing the subject part and the curing agent part at a volume ratio of 1:1. Mixing and curing of the subject part and the curing agent part were all performed at room temperature.
- a trifunctional polyester polyol (Kuraray, F-2010) was mixed with a monohydric alcohol (2-propylheptanol, 2-PH), a filler component, and a catalyst to prepare a main part.
- the mixing ratio of the components was 100: 11: 1230 by weight (F-2010: 2-PH: filler component), and the catalyst was blended in a catalytic amount.
- the filler component and the catalyst the same components as in Example 1 were used.
- a curing agent part was prepared by mixing a trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) with a filler component.
- the mixing ratio was 100:3562 by weight (HD T LV2: Filler component:).
- HD T LV2 Filler component:
- a composition was prepared by preparing the subject part and the curing agent part at a volume ratio of 1:1. Mixing and curing of the subject part and the curing agent part were all performed at room temperature.
- a trifunctional polyester polyol (Kuraray, F-2010) was mixed with a monohydric alcohol (2-propylheptanol, 2-PH), a filler component, and a catalyst to prepare a main part.
- the mixing ratio of the above components was set to a weight ratio of 100:25:1619 (F-2010:2-PH:filler component:catalyst), and the catalyst was blended in a catalytic amount.
- the filler component and the catalyst the same components as in Example 1 were used.
- a curing agent part was prepared by mixing a trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) with a filler component.
- the mixing ratio was 100:3111 by weight (HD T LV2: Filler component:).
- HD T LV2 Filler component:
- a composition was prepared by preparing the subject part and the curing agent part at a volume ratio of 1:1. Mixing and curing of the subject part and the curing agent part were all performed at room temperature.
- a trifunctional polyester polyol (Kuraray, F-2010) was mixed with a monohydric alcohol (2-propylheptanol, 2-PH), a filler component, and a catalyst to prepare a main part.
- the mixing ratio of the above components was set to a weight ratio of 100:67:2371 (F-2010:2-PH: filler component), and the catalyst was blended in a catalytic amount.
- the filler component and the catalyst the same components as in Example 1 were used.
- a curing agent part was prepared by mixing a trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) with a filler component.
- the mixing ratio was 100:2555 by weight (HD T LV2: Filler component:).
- HD T LV2 Filler component:
- a composition was prepared by preparing the subject part and the curing agent part at a volume ratio of 1:1. Mixing and curing of the subject part and the curing agent part were all performed at room temperature.
- a trifunctional polyester polyol (Kuraray, F-2010) was mixed with a monohydric alcohol (2-propylheptanol, 2-PH), a filler component, and a catalyst to prepare a main part.
- the mixing ratio of the components was 100: 104: 3046 in weight ratio (F-2010: 2-PH: filler component), and the catalyst was blended in a catalytic amount.
- the filler component and the catalyst the same components as in Example 1 were used.
- a curing agent part was prepared by mixing a trifunctional polyisocyanate (trifunctional HDI Trimer, Vencorex, HD T LV2) with a filler component.
- the mixing ratio was 100:2357 by weight (HD T LV2: Filler component:).
- HD T LV2 Filler component:
- a composition was prepared by preparing the subject part and the curing agent part at a volume ratio of 1:1. Mixing and curing of the subject part and the curing agent part were all performed at room temperature.
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- Chemical Kinetics & Catalysis (AREA)
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- Polyurethanes Or Polyureas (AREA)
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Abstract
Description
접착력(Al)(N/mm2) | 경도(shore OO) | 곡률 반경(mm) | 열전도도(W/mK) | |
실시예1 | 0.1 | 82~85 | 6.5 | 2.546 |
비교예1 | 벌크파괴 | 18 | 측정불가 | 2.537 |
비교예2 | 벌크파괴 | 32~37 | 측정불가 | 2.519 |
비교예3 | 1.07 | 72 | 측정불가 | 2.698 |
비교예4 | 0.22 | 92 | >11 | 2.604 |
비교예5 | 0.27 | 94 | >11 | 2.633 |
비교예6 | 0.06 | 96 | >11 | 2.579 |
비교예7 | 0.17 | 92 | >11 | 2.564 |
비교예8 | 0.15 | 93 | >11 | 2.552 |
비교예9 | 0.18 | 95 | >11 | 2.802 |
비교예10 | 0.10 | 92 | 7 | 2.803 |
비교예11 | 벌크파괴 | 0 | 0 | 측정불가 |
비교예12 | 벌크파괴 | 0 | 0 | 측정불가 |
Claims (17)
- 수지 성분 및 필러 성분을 포함하고,알루미늄에 대한 접착력이 1 N/mm2 이하이고, 쇼어 OO 경도가 90 미만인 조성물.
- 제 1 항에 있어서, 열전도율이 1.2 W/mK 이상인 조성물.
- 제 1 항 또는 제 2 항에 있어서, 수지 성분은, 폴리올 화합물, 1가 알코올, 티올 화합물, 폴리이소시아네이트 화합물 또는 폴리우레탄을 포함하는 조성물.
- 제 1 항 내지 제 3 항 중 어느 한 항에 있어서, 수지 성분은, 3관능 이상의 다관능성 폴리올 화합물 및 2관능성 폴리올 화합물을 포함하는 조성물.
- 제 4 항에 있어서, 3관능 이상의 다관능성 폴리올 화합물 및 2관능성 폴리올 화합물 중 적어도 하나는 수평균분자량이 300 내지 3000 g/mol의 범위 내에 있는 조성물.
- 제 4 항에 있어서, 3관능 이상의 다관능성 폴리올 화합물 및 2관능성 폴리올 화합물 중 어느 하나는 수평균분자량이 1500 g/mol 이상이고, 다른 하나는 1500 g/mol 미만인 조성물.
- 제 4 항에 있어서, 3관능 이상의 다관능성 폴리올 화합물 및 2관능성 폴리올 화합물 중 어느 하나는 폴리에스테르 폴리올이고, 다른 하나는 폴리에테르 폴리올인 조성물.
- 제 7 항에 있어서, 폴리에스테르 폴리올은, 알칸 디올 단위, 폴리올 단위 및 디카복실산 단위를 포함하고, 상기 디카복실산 단위는 아디프산 단위 또는 세바스산 단위인 조성물.
- 제 4 항에 있어서, 수지 성분은, 3관능 이상의 다관능성 폴리올 화합물 100 중량부 대비 5 내지 200 중량부의 2관능성 폴리올 화합물을 포함하는 조성물.
- 제 4 항에 있어서, 수지 성분은 1가 알코올 또는 티올 화합물을 추가로 포함하는 조성물.
- 제 10 항에 있어서, 수지 성분은, 3관능 이상의 다관능성 폴리올 화합물 100 중량부 대비 1 내지 100 중량부의 1가 알코올 또는 티올 화합물을 포함하는 조성물.
- 제 1 항 내지 제 11 항 중 어느 한 항에 있어서, 수지 성분은, 폴리이소시아네이트를 포함하는 조성물.
- 제 12 항에 있어서, 폴리이소시아네이트는 3관능 이상의 다관능성 폴리이소시아네이트 및 2관능성 폴리이소시아네이트를 포함하는 조성물.
- 제 13 항에 있어서, 폴리이소시아네이트는 3관능 이상의 다관능성 폴리이소시아네이트 100 중량부 대비 5 내지 200 중량부의 2관능성 폴리이소시아네이트를 포함하는 조성물.
- 제 1 항 내지 제 14 항 중 어느 한 항에 있어서, 필러는, 수산화 알루미늄, 수산화 마그네슘, 수산화 칼슘, 하이드로마그네사이트, 마그네시아, 알루미나, 질화 알루미늄, 질화 붕소, 질화 규소, 탄화 규소, 산화 아연 또는 산화 베릴륨인 조성물.
- 폴리올 성분 및 필러를 포함하는 주제 파트; 및경화제 성분 및 필러를 포함하는 경화제 파트를 포함하고,알루미늄에 대한 접착력이 1 N/mm2 이하이고, 쇼어 OO 경도가 90 미만인 2액형 조성물.
- 발열 부품 및 상기 발열 부품과 인접하여 존재하는, 제 1 항의 조성물 또는 제 16 항의 2액형 조성물 또는 상기 조성물의 경화체를 포함하는 제품.
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