WO2023054700A1 - Composition durcissable - Google Patents
Composition durcissable Download PDFInfo
- Publication number
- WO2023054700A1 WO2023054700A1 PCT/JP2022/036815 JP2022036815W WO2023054700A1 WO 2023054700 A1 WO2023054700 A1 WO 2023054700A1 JP 2022036815 W JP2022036815 W JP 2022036815W WO 2023054700 A1 WO2023054700 A1 WO 2023054700A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- reactive silicon
- polymer
- groups
- weight
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 69
- 229920000642 polymer Polymers 0.000 claims abstract description 178
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 146
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000000908 ammonium hydroxide Substances 0.000 claims abstract description 26
- 150000003609 titanium compounds Chemical class 0.000 claims abstract description 26
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 17
- -1 trimethoxysilyl group Chemical group 0.000 claims description 226
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 59
- 125000004432 carbon atom Chemical group C* 0.000 claims description 27
- 239000000047 product Substances 0.000 claims description 25
- 125000005842 heteroatom Chemical group 0.000 claims description 19
- 229920000058 polyacrylate Polymers 0.000 claims description 6
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 6
- 238000006243 chemical reaction Methods 0.000 abstract description 14
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 54
- 150000001875 compounds Chemical class 0.000 description 53
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 51
- 229920001451 polypropylene glycol Polymers 0.000 description 49
- 150000002430 hydrocarbons Chemical group 0.000 description 45
- 239000003054 catalyst Substances 0.000 description 39
- 239000000853 adhesive Substances 0.000 description 35
- 230000001070 adhesive effect Effects 0.000 description 35
- 239000000463 material Substances 0.000 description 30
- 238000000034 method Methods 0.000 description 29
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 26
- 150000001336 alkenes Chemical group 0.000 description 25
- 239000000243 solution Substances 0.000 description 25
- 239000000178 monomer Substances 0.000 description 24
- 239000003795 chemical substances by application Substances 0.000 description 23
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 20
- 229920005989 resin Polymers 0.000 description 20
- 239000011347 resin Substances 0.000 description 20
- 239000003822 epoxy resin Substances 0.000 description 19
- 229920000647 polyepoxide Polymers 0.000 description 19
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 18
- 239000000126 substance Substances 0.000 description 16
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 15
- 239000004014 plasticizer Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 14
- 239000003999 initiator Substances 0.000 description 14
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 13
- 238000003786 synthesis reaction Methods 0.000 description 13
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 13
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 12
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 12
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 229920002554 vinyl polymer Polymers 0.000 description 12
- 239000003963 antioxidant agent Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 125000003700 epoxy group Chemical group 0.000 description 10
- 150000004820 halides Chemical class 0.000 description 10
- 239000004611 light stabiliser Substances 0.000 description 10
- 230000000704 physical effect Effects 0.000 description 10
- 229910052697 platinum Inorganic materials 0.000 description 10
- 239000003566 sealing material Substances 0.000 description 10
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 10
- 125000001931 aliphatic group Chemical group 0.000 description 9
- 238000009826 distribution Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 9
- 239000011572 manganese Substances 0.000 description 9
- 239000003607 modifier Substances 0.000 description 9
- 239000002243 precursor Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 8
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 8
- 238000009833 condensation Methods 0.000 description 8
- 230000005494 condensation Effects 0.000 description 8
- 150000002148 esters Chemical class 0.000 description 8
- 239000000945 filler Substances 0.000 description 8
- 150000004756 silanes Chemical class 0.000 description 8
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 8
- 238000009864 tensile test Methods 0.000 description 8
- 229910052725 zinc Inorganic materials 0.000 description 8
- 239000011701 zinc Substances 0.000 description 8
- 239000006087 Silane Coupling Agent Substances 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 7
- 150000001412 amines Chemical class 0.000 description 7
- 125000003277 amino group Chemical group 0.000 description 7
- ZUMQLFHCCNIEAO-UHFFFAOYSA-N bis(ethenyl)-silyloxysilane platinum Chemical compound [Pt].[SiH3]O[SiH](C=C)C=C ZUMQLFHCCNIEAO-UHFFFAOYSA-N 0.000 description 7
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 7
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 7
- 229940093858 ethyl acetoacetate Drugs 0.000 description 7
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 7
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 7
- 238000007665 sagging Methods 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 6
- 239000004793 Polystyrene Substances 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 230000003078 antioxidant effect Effects 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 6
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 description 6
- 238000005119 centrifugation Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 6
- 239000003085 diluting agent Substances 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 229920001568 phenolic resin Polymers 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 6
- 229920002223 polystyrene Polymers 0.000 description 6
- NOGBEXBVDOCGDB-NRFIWDAESA-L (z)-4-ethoxy-4-oxobut-2-en-2-olate;propan-2-olate;titanium(4+) Chemical compound [Ti+4].CC(C)[O-].CC(C)[O-].CCOC(=O)\C=C(\C)[O-].CCOC(=O)\C=C(\C)[O-] NOGBEXBVDOCGDB-NRFIWDAESA-L 0.000 description 5
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 5
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 5
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical group SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 5
- 239000006096 absorbing agent Substances 0.000 description 5
- 229910052783 alkali metal Inorganic materials 0.000 description 5
- 125000003545 alkoxy group Chemical group 0.000 description 5
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 5
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 5
- 150000008282 halocarbons Chemical class 0.000 description 5
- 238000006459 hydrosilylation reaction Methods 0.000 description 5
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 5
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- 235000019198 oils Nutrition 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- GRWPYGBKJYICOO-UHFFFAOYSA-N 2-methylpropan-2-olate;titanium(4+) Chemical compound [Ti+4].CC(C)(C)[O-].CC(C)(C)[O-].CC(C)(C)[O-].CC(C)(C)[O-] GRWPYGBKJYICOO-UHFFFAOYSA-N 0.000 description 4
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- 238000007259 addition reaction Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 4
- 125000003368 amide group Chemical group 0.000 description 4
- 125000003710 aryl alkyl group Chemical group 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 4
- 239000012964 benzotriazole Substances 0.000 description 4
- 125000000753 cycloalkyl group Chemical group 0.000 description 4
- XYYQWMDBQFSCPB-UHFFFAOYSA-N dimethoxymethylsilane Chemical compound COC([SiH3])OC XYYQWMDBQFSCPB-UHFFFAOYSA-N 0.000 description 4
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 230000000379 polymerizing effect Effects 0.000 description 4
- RLJWTAURUFQFJP-UHFFFAOYSA-N propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)O.CC(C)O.CC(C)O RLJWTAURUFQFJP-UHFFFAOYSA-N 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 229930195734 saturated hydrocarbon Natural products 0.000 description 4
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 4
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 3
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 3
- OHXAOPZTJOUYKM-UHFFFAOYSA-N 3-Chloro-2-methylpropene Chemical compound CC(=C)CCl OHXAOPZTJOUYKM-UHFFFAOYSA-N 0.000 description 3
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 3
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 3
- NNTRMVRTACZZIO-UHFFFAOYSA-N 3-isocyanatopropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCN=C=O NNTRMVRTACZZIO-UHFFFAOYSA-N 0.000 description 3
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical class OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 125000004423 acyloxy group Chemical group 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 description 3
- 238000004581 coalescence Methods 0.000 description 3
- 239000012024 dehydrating agents Substances 0.000 description 3
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000012039 electrophile Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 3
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 3
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000007142 ring opening reaction Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 150000004760 silicates Chemical class 0.000 description 3
- 150000003377 silicon compounds Chemical class 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
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- YIMHRDBSVCPJOV-UHFFFAOYSA-N n'-(2-ethoxyphenyl)-n-(2-ethylphenyl)oxamide Chemical compound CCOC1=CC=CC=C1NC(=O)C(=O)NC1=CC=CC=C1CC YIMHRDBSVCPJOV-UHFFFAOYSA-N 0.000 description 1
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- XFFPIAQRIDTSIZ-UHFFFAOYSA-N n'-[3-(dimethoxymethylsilyl)propyl]ethane-1,2-diamine Chemical compound COC(OC)[SiH2]CCCNCCN XFFPIAQRIDTSIZ-UHFFFAOYSA-N 0.000 description 1
- RTHWPWJSSJEQNU-UHFFFAOYSA-N n,n,n',n'-tetraethylpropanediamide Chemical compound CCN(CC)C(=O)CC(=O)N(CC)CC RTHWPWJSSJEQNU-UHFFFAOYSA-N 0.000 description 1
- AOXCXILUIVQCHH-UHFFFAOYSA-N n,n,n',n'-tetramethylpropanediamide Chemical compound CN(C)C(=O)CC(=O)N(C)C AOXCXILUIVQCHH-UHFFFAOYSA-N 0.000 description 1
- NTMXFHGYWJIAAE-UHFFFAOYSA-N n,n-diethyl-3-oxobutanamide Chemical compound CCN(CC)C(=O)CC(C)=O NTMXFHGYWJIAAE-UHFFFAOYSA-N 0.000 description 1
- YPEWWOUWRRQBAX-UHFFFAOYSA-N n,n-dimethyl-3-oxobutanamide Chemical compound CN(C)C(=O)CC(C)=O YPEWWOUWRRQBAX-UHFFFAOYSA-N 0.000 description 1
- UCAOGXRUJFKQAP-UHFFFAOYSA-N n,n-dimethyl-5-nitropyridin-2-amine Chemical compound CN(C)C1=CC=C([N+]([O-])=O)C=N1 UCAOGXRUJFKQAP-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- DWYWQJWQNQLGLB-UHFFFAOYSA-N n-(dimethoxymethylsilylmethyl)cyclohexanamine Chemical compound COC(OC)[SiH2]CNC1CCCCC1 DWYWQJWQNQLGLB-UHFFFAOYSA-N 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- WUFHQGLVNNOXMP-UHFFFAOYSA-N n-(triethoxysilylmethyl)cyclohexanamine Chemical compound CCO[Si](OCC)(OCC)CNC1CCCCC1 WUFHQGLVNNOXMP-UHFFFAOYSA-N 0.000 description 1
- VNBLTKHUCJLFSB-UHFFFAOYSA-N n-(trimethoxysilylmethyl)aniline Chemical compound CO[Si](OC)(OC)CNC1=CC=CC=C1 VNBLTKHUCJLFSB-UHFFFAOYSA-N 0.000 description 1
- QRANWKHEGLJBQC-UHFFFAOYSA-N n-(trimethoxysilylmethyl)cyclohexanamine Chemical compound CO[Si](OC)(OC)CNC1CCCCC1 QRANWKHEGLJBQC-UHFFFAOYSA-N 0.000 description 1
- FYWQEZDJQWQJBK-UHFFFAOYSA-N n-[3-(dimethoxymethylsilyl)propyl]aniline Chemical compound COC(OC)[SiH2]CCCNC1=CC=CC=C1 FYWQEZDJQWQJBK-UHFFFAOYSA-N 0.000 description 1
- WIBFFTLQMKKBLZ-SEYXRHQNSA-N n-butyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCC WIBFFTLQMKKBLZ-SEYXRHQNSA-N 0.000 description 1
- FRDNYWXDODPUJV-UHFFFAOYSA-N n-ethyl-2-methyl-3-trimethoxysilylpropan-1-amine Chemical compound CCNCC(C)C[Si](OC)(OC)OC FRDNYWXDODPUJV-UHFFFAOYSA-N 0.000 description 1
- UIEKYBOPAVTZKW-UHFFFAOYSA-L naphthalene-2-carboxylate;nickel(2+) Chemical compound [Ni+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 UIEKYBOPAVTZKW-UHFFFAOYSA-L 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- LVBIMKHYBUACBU-CVBJKYQLSA-L nickel(2+);(z)-octadec-9-enoate Chemical compound [Ni+2].CCCCCCCC\C=C/CCCCCCCC([O-])=O.CCCCCCCC\C=C/CCCCCCCC([O-])=O LVBIMKHYBUACBU-CVBJKYQLSA-L 0.000 description 1
- 125000002560 nitrile group Chemical group 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- MTBVDKSFTCGOTN-UHFFFAOYSA-N octane pentane-2,4-dione tin(4+) Chemical compound [Sn+4].CC(=O)[CH-]C(C)=O.CC(=O)[CH-]C(C)=O.CCCCCCC[CH2-].CCCCCCC[CH2-] MTBVDKSFTCGOTN-UHFFFAOYSA-N 0.000 description 1
- MBAUOPQYSQVYJV-UHFFFAOYSA-N octyl 3-[4-hydroxy-3,5-di(propan-2-yl)phenyl]propanoate Chemical compound OC1=C(C=C(C=C1C(C)C)CCC(=O)OCCCCCCCC)C(C)C MBAUOPQYSQVYJV-UHFFFAOYSA-N 0.000 description 1
- 229940049964 oleate Drugs 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- CUQCMXFWIMOWRP-UHFFFAOYSA-N phenyl biguanide Chemical compound NC(N)=NC(N)=NC1=CC=CC=C1 CUQCMXFWIMOWRP-UHFFFAOYSA-N 0.000 description 1
- PKELYQZIUROQSI-UHFFFAOYSA-N phosphane;platinum Chemical class P.[Pt] PKELYQZIUROQSI-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 150000004980 phosphorus peroxides Chemical class 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229960005235 piperonyl butoxide Drugs 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- ZUFQCVZBBNZMKD-UHFFFAOYSA-M potassium 2-ethylhexanoate Chemical compound [K+].CCCCC(CC)C([O-])=O ZUFQCVZBBNZMKD-UHFFFAOYSA-M 0.000 description 1
- RPDAUEIUDPHABB-UHFFFAOYSA-N potassium ethoxide Chemical compound [K+].CC[O-] RPDAUEIUDPHABB-UHFFFAOYSA-N 0.000 description 1
- BDAWXSQJJCIFIK-UHFFFAOYSA-N potassium methoxide Chemical compound [K+].[O-]C BDAWXSQJJCIFIK-UHFFFAOYSA-N 0.000 description 1
- 229940096992 potassium oleate Drugs 0.000 description 1
- LPNYRYFBWFDTMA-UHFFFAOYSA-N potassium tert-butoxide Chemical compound [K+].CC(C)(C)[O-] LPNYRYFBWFDTMA-UHFFFAOYSA-N 0.000 description 1
- MLICVSDCCDDWMD-KVVVOXFISA-M potassium;(z)-octadec-9-enoate Chemical compound [K+].CCCCCCCC\C=C/CCCCCCCC([O-])=O MLICVSDCCDDWMD-KVVVOXFISA-M 0.000 description 1
- QCVVTFGMXQFNJW-UHFFFAOYSA-M potassium;7,7-dimethyloctanoate Chemical compound [K+].CC(C)(C)CCCCCC([O-])=O QCVVTFGMXQFNJW-UHFFFAOYSA-M 0.000 description 1
- ZVUVJTQITHFYHV-UHFFFAOYSA-M potassium;naphthalene-1-carboxylate Chemical compound [K+].C1=CC=C2C(C(=O)[O-])=CC=CC2=C1 ZVUVJTQITHFYHV-UHFFFAOYSA-M 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- OIGNJSKKLXVSLS-VWUMJDOOSA-N prednisolone Chemical compound O=C1C=C[C@]2(C)[C@H]3[C@@H](O)C[C@](C)([C@@](CC4)(O)C(=O)CO)[C@@H]4[C@@H]3CCC2=C1 OIGNJSKKLXVSLS-VWUMJDOOSA-N 0.000 description 1
- 125000001844 prenyl group Chemical group [H]C([*])([H])C([H])=C(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000010734 process oil Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- BPJZKLBPJBMLQG-KWRJMZDGSA-N propanoyl (z,12r)-12-hydroxyoctadec-9-enoate Chemical compound CCCCCC[C@@H](O)C\C=C/CCCCCCCC(=O)OC(=O)CC BPJZKLBPJBMLQG-KWRJMZDGSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 125000001501 propionyl group Chemical group O=C([*])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229920013730 reactive polymer Polymers 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 229920006298 saran Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- QDRKDTQENPPHOJ-UHFFFAOYSA-N sodium ethoxide Chemical compound [Na+].CC[O-] QDRKDTQENPPHOJ-UHFFFAOYSA-N 0.000 description 1
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical class S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- JKUYRAMKJLMYLO-UHFFFAOYSA-N tert-butyl 3-oxobutanoate Chemical compound CC(=O)CC(=O)OC(C)(C)C JKUYRAMKJLMYLO-UHFFFAOYSA-N 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 125000005425 toluyl group Chemical group 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- UNKMHLWJZHLPPM-UHFFFAOYSA-N triethoxy(oxiran-2-ylmethoxymethyl)silane Chemical compound CCO[Si](OCC)(OCC)COCC1CO1 UNKMHLWJZHLPPM-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- ROWWCTUMLAVVQB-UHFFFAOYSA-N triethoxysilylmethanamine Chemical compound CCO[Si](CN)(OCC)OCC ROWWCTUMLAVVQB-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- LFBULLRGNLZJAF-UHFFFAOYSA-N trimethoxy(oxiran-2-ylmethoxymethyl)silane Chemical compound CO[Si](OC)(OC)COCC1CO1 LFBULLRGNLZJAF-UHFFFAOYSA-N 0.000 description 1
- QLNOVKKVHFRGMA-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical group [CH2]CC[Si](OC)(OC)OC QLNOVKKVHFRGMA-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- ARKBFSWVHXKMSD-UHFFFAOYSA-N trimethoxysilylmethanamine Chemical compound CO[Si](CN)(OC)OC ARKBFSWVHXKMSD-UHFFFAOYSA-N 0.000 description 1
- HADKRTWCOYPCPH-UHFFFAOYSA-M trimethylphenylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C1=CC=CC=C1 HADKRTWCOYPCPH-UHFFFAOYSA-M 0.000 description 1
- AAPLIUHOKVUFCC-UHFFFAOYSA-N trimethylsilanol Chemical compound C[Si](C)(C)O AAPLIUHOKVUFCC-UHFFFAOYSA-N 0.000 description 1
- PHYFQTYBJUILEZ-IUPFWZBJSA-N triolein Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CCCCCCCC)COC(=O)CCCCCCC\C=C/CCCCCCCC PHYFQTYBJUILEZ-IUPFWZBJSA-N 0.000 description 1
- IJGSGCGKAAXRSC-UHFFFAOYSA-M tris(2-hydroxyethyl)-methylazanium;hydroxide Chemical compound [OH-].OCC[N+](C)(CCO)CCO IJGSGCGKAAXRSC-UHFFFAOYSA-M 0.000 description 1
- 235000021081 unsaturated fats Nutrition 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
- C08K5/057—Metal alcoholates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/19—Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
Definitions
- the present invention relates to a curable composition containing a reactive silicon group-containing polyoxyalkylene polymer.
- Polymers with reactive silicon groups are known as moisture-reactive polymers, are included in many industrial products such as adhesives, sealants, coating materials, paints, and adhesives, and are used in a wide range of fields. there is
- Polymer components of such reactive silicon group-containing polymers include various polymers such as polyoxyalkylene-based polymers, saturated hydrocarbon-based polymers, and (meth)acrylic acid ester-based copolymers.
- polyoxyalkylene polymers have relatively low viscosity at room temperature and are easy to handle, and the cured product obtained after the reaction exhibits good elasticity.
- Tin catalysts are often used as curing catalysts, but catalysts other than tin are sometimes desired.
- a titanium catalyst has been developed as one of the catalysts other than tin (see Patent Documents 1 and 2).
- An object of the present invention is to provide a curable composition with improved adhesion in a shear tensile test without using a tin catalyst.
- the inventors of the present invention completed the following invention as a result of intensive studies to solve the above problems.
- one aspect of the present invention is a reactive silicon group-containing polyoxyalkylene having a reactive silicon group represented by the general formula (1) and having a molecular weight of 16,000 or less per reactive silicon group.
- R 1 each independently represents a hydrocarbon group having 1 to 20 carbon atoms, and the hydrocarbon group may have a hetero-containing group.
- Each X is independently a hydroxyl group or a hydrolyzable group.
- a is 1, 2, or 3.
- R 2 is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms; n is an integer of 1 to 4; A is a ⁇ -diketone group.
- ammonium hydroxide (C) It relates to a curable composition comprising Another aspect of the present invention is a reactive silicon group-containing polyoxy which has a reactive silicon group represented by the general formula (1) and has a molecular weight of 16,000 or less per reactive silicon group.
- the present invention relates to a curable composition containing an alkylene polymer (A) and a reaction product of a titanium compound (B) represented by the general formula (2) and an ammonium hydroxide (C).
- the present invention can provide a curable composition with improved adhesion in a shear tensile test without using a tin catalyst.
- the curable composition according to the present disclosure is a reactive silicon group-containing polyoxyalkylene polymer (A) having a reactive silicon group represented by general formula (1) (hereinafter also referred to as polymer (A)) contains In the polymer (A), the molecular weight per reactive silicon group is 16,000 or less.
- polymer (A) contains In the polymer (A), the molecular weight per reactive silicon group is 16,000 or less.
- R 1 each independently represents a hydrocarbon group having 1 to 20 carbon atoms, and the hydrocarbon group may have a hetero-containing group.
- Each X is independently a hydroxyl group or a hydrolyzable group.
- a is 1, 2, or 3.
- the molecular weight per reactive silicon group is the number average molecular weight obtained in terms of polystyrene by GPC measurement of the reactive silicon group-containing polyoxyalkylene polymer (A), and the reactive silicon group-containing polyoxyalkylene polymer.
- Coalescence (A) Molecular weight determined from the average number of reactive silicon groups present in one molecule. If the molecular weight per reactive silicon group is 16,000 or less, the adhesion in a shear tensile test is improved.
- the molecular weight per reactive silicon group is preferably 14,000 or less, more preferably 12,000 or less, still more preferably 10,000 or less, and most preferably 8,000 or less.
- the lower limit of the molecular weight per reactive silicon group is preferably 1,000 or more, more preferably 2,000 or more. Specifically, it is preferably 1,000 to 16,000, more preferably 1,000 to 14,000, even more preferably 1,000 to 12,000, particularly preferably 1,000 to 10,000. 000 to 8,000 are most preferred.
- the reactive silicon group-containing polyoxyalkylene polymer (A) has the general formula (1): —Si(R 1 ) 3-a X a (1)
- R 1 each independently represents a hydrocarbon group having 1 to 20 carbon atoms, and the hydrocarbon group may have a hetero-containing group.
- X each independently represents a hydroxyl group or a hydrolyzable represents a group, and a is 1, 2, or 3.
- It has a reactive silicon group represented by
- R 1 is a hydrocarbon group having 1 to 20 carbon atoms.
- the number of carbon atoms in the hydrocarbon group for R 1 is preferably 1-12, more preferably 1-6, and particularly preferably 1-4.
- the hydrocarbon group may be an unsubstituted hydrocarbon group or a hydrocarbon group having a substituent.
- the hetero-containing group which the hydrocarbon group as R 1 may have as a substituent is a group containing a hetero atom.
- atoms other than carbon atoms and hydrogen atoms are heteroatoms.
- heteroatoms include N, O, S, P, Si, and halogen atoms.
- the total number of carbon atoms and heteroatoms is preferably 1-10, more preferably 1-6, even more preferably 1-4.
- mercapto groups halogen atoms such as Cl, Br, I, and F; nitro groups; cyano groups; methoxy, ethoxy, n-propyloxy, and isopropyloxy groups.
- alkoxy groups such as; alkylthio groups such as methylthio, ethylthio, n-propylthio, and isopropylthio; acyl groups such as acetyl, propionyl, and butanoyl; acetyloxy, propionyloxy, and butanoyl.
- Acyloxy group such as oxy group; substituted or unsubstituted amino group such as amino group, methylamino group, ethylamino group, dimethylamino group and diethylamino group; aminocarbonyl group, methylaminocarbonyl group, ethylaminocarbonyl group, dimethyl substituted or unsubstituted aminocarbonyl groups such as an aminocarbonyl group and a diethylaminocarbonyl group; and a cyano group.
- R 1 is a hydrocarbon group substituted with a hetero-containing group
- the total number of carbon atoms and hetero atoms in R 1 is preferably from 2 to 30, more preferably from 2 to 18, and further from 2 to 10. 2 to 6 are particularly preferred.
- hydrocarbon groups having 1 to 20 carbon atoms as R 1 include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group and tert-butyl.
- n-pentyl group n-hexyl group, n-heptyl group, n-octyl group, 2-ethyl-n-hexyl group, n-nonyl group, n-decyl group, n-undecyl group, n-dodecyl group , n-tridecyl group, n-tetradecyl group, n-pentadecyl group, n-hexadecyl group, n-octadecyl group, n-nonadecyl group, and n-icosyl group; vinyl group, 2-propenyl group, 3 alkenyl groups such as -butenyl group and 4-pentenyl group; cycloalkyl groups such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, 2-
- R 1 include alkyl groups such as methyl group and ethyl group; alkyl groups having hetero-containing groups such as chloromethyl group and methoxymethyl group; cycloalkyl groups such as cyclohexyl group; aryl groups such as; aralkyl groups such as benzyl group; and the like.
- R 1 is preferably a methyl group, a methoxymethyl group and a chloromethyl group, more preferably a methyl group and a methoxymethyl group, and still more preferably a methyl group.
- a is 1, 2, or 3; As a, 2 or 3 is preferable, and 3 is more preferable in that the curability is improved and the strength is high.
- Examples of X include hydroxyl group, halogen, alkoxy group, acyloxy group, ketoximate group, amino group, amide group, acid amide group, aminooxy group, mercapto group, and alkenyloxy group.
- an alkoxy group is more preferable, a methoxy group and an ethoxy group are more preferable, and a methoxy group is particularly preferable, since they are moderately hydrolyzable and easy to handle.
- reactive silicon groups include a trimethoxysilyl group, a triethoxysilyl group, a tris(2-propenyloxy)silyl group, a triacetoxysilyl group, a dimethoxymethylsilyl group, a diethoxymethylsilyl group and a dimethoxyethylsilyl group.
- trimethoxysilyl group a (chloromethyl)dimethoxysilyl group, and a (methoxymethyl)dimethoxysilyl group are more preferable, and a trimethoxysilyl group is particularly preferable because it improves curability.
- the main chain structure of the reactive silicon group-containing polyoxyalkylene polymer (A) may be linear or branched, but is preferably branched. From the viewpoint of improving adhesiveness, it is preferable to have 3 or more main chain ends in one molecule, and it is more preferable to have 3 main chain ends in one molecule.
- the main chain of the reactive silicon group-containing polyoxyalkylene polymer (A) is represented by —R 3 —O— (wherein R 3 is a linear or branched alkylene group having 1 to 14 carbon atoms). R 3 is more preferably a linear or branched alkylene group having 2 to 4 carbon atoms. Specific examples of the repeating unit represented by -R 3 -O- include -CH 2 O-, -CH 2 CH 2 O-, -CH 2 CH(CH 3 )O-, and -CH 2 C(CH 3 ).
- the number average molecular weight of the reactive silicon group-containing polyoxyalkylene polymer (A) is not particularly limited, but the polystyrene equivalent molecular weight in GPC is preferably 5,000 to 100,000, and 10,000 to 40,000. More preferably, 12,000 to 25,000 is particularly preferred, and 13,000 to 20,000 is most preferred.
- the introduction amount of the reactive silicon group is moderate, so that the production cost is kept within a moderate range, and the reactive silicon group-containing polyoxyalkylene polymer having high strength is obtained. Coalescence (A) is easily obtained.
- the polymer precursor before introduction of the reactive silicon group was measured by the hydroxyl value measurement method of JIS K 1557 and Terminal group equivalent molecular weight obtained by directly measuring the terminal group concentration by titration analysis based on the principle of the iodine value measurement method and considering the polymer structure (branching degree determined by the polymerization initiator used) can also be shown as
- the terminal group-equivalent molecular weight of the polymer (A) is obtained by preparing a calibration curve of the number average molecular weight obtained by general GPC measurement of the polymer precursor and the above-mentioned terminal group-equivalent molecular weight, and performing GPC of the reactive silicon group-containing polymer. It is also possible to obtain by converting the number average molecular weight obtained by the method into a terminal group equivalent molecular weight.
- the molecular weight distribution (Mw/Mn) of the reactive silicon group-containing polyoxyalkylene polymer (A) is not particularly limited, it is preferably narrow. Specifically, it is preferably 1.6 or less, more preferably 1.4 or less, still more preferably 1.3 or less, and particularly preferably 1.2 or less.
- the molecular weight distribution of the reactive silicon group-containing polyoxyalkylene polymer (A) can be determined from the number average molecular weight and weight average molecular weight obtained by GPC measurement.
- Polymer (A) can be produced by introducing reactive silicon groups into a precursor polymer capable of introducing reactive silicon groups. Specifically, the polymer (A) is obtained by introducing an olefin group into the polyoxyalkylene polymer (a1) having a hydroxyl group at the end by utilizing the reactivity of the hydroxyl group, thereby obtaining a prepolymer having an olefin group. After the coalescence is obtained, the precursor polymer is reacted with a reactive silicon group-containing compound having reactivity with the olefin group to introduce a reactive silicon group.
- the polymer skeleton of the polyoxyalkylene polymer can be formed by polymerizing an epoxy compound with an initiator having a hydroxyl group by a conventionally known method, whereby a polyoxyalkylene polymer having a terminal hydroxyl group can be obtained. (a1) is obtained.
- the specific polymerization method is not particularly limited, since a hydroxyl group-terminated polymer with a small molecular weight distribution (Mw/Mn) can be obtained, a polymerization method using a double metal cyanide complex catalyst such as a zinc hexacyanocobaltate glyme complex is used. is preferred.
- hydroxyl-containing initiators include, but are not limited to, ethylene glycol, propylene glycol, glycerin, pentaerythritol, low molecular weight polyoxypropylene glycol, low molecular weight polyoxypropylene triol, butanol, allyl alcohol, methanol, ethanol, Propanol, butanol, pentanol, hexanol, low molecular weight polyoxypropylene monoallyl ether, low molecular weight polyoxypropylene monoalkyl ether and the like.
- glycerin, pentaerythritol, low molecular weight polyoxypropylene triol, etc. having 3 or more hydroxyl groups can be used.
- the epoxy compound is not particularly limited, examples thereof include alkylene oxides such as ethylene oxide and propylene oxide, and glycidyl ethers such as methyl glycidyl ether and butyl glycidyl ether. Propylene oxide is preferred.
- reaction with alkali metal salt In introducing an olefin group into the polyoxyalkylene polymer (a1) having a terminal hydroxyl group, first, an alkali metal salt is allowed to act on the polyoxyalkylene polymer (a1) to convert the terminal hydroxyl group into a metaloxy group. It is preferred to convert to a group.
- a double metal cyanide complex catalyst can also be used instead of the alkali metal salt. As described above, the metaloxy group-terminated polyoxyalkylene polymer (a2) is formed.
- the alkali metal salt is not particularly limited, examples thereof include sodium hydroxide, sodium alkoxide, potassium hydroxide, potassium alkoxide, lithium hydroxide, lithium alkoxide, cesium hydroxide, and cesium alkoxide.
- Sodium hydroxide, sodium methoxide, sodium ethoxide, sodium tert-butoxide, potassium hydroxide, potassium methoxide, potassium ethoxide, and potassium tert-butoxide are preferred from the viewpoint of ease of handling and solubility, and sodium methoxide and sodium tert. -butoxide is more preferred.
- Sodium methoxide is preferred because of its availability.
- the alkali metal salt may be dissolved in a solvent before being subjected to the reaction.
- reaction with electrophile (a3) By reacting the metaloxy group-terminated polyoxyalkylene polymer (a2) obtained as described above with an electrophilic agent (a3) having an olefin group, the metaloxy group is converted to a structure containing an olefin group can be converted to As a result, a polyoxyalkylene polymer (a4) having an olefin group in the terminal structure is formed.
- the electrophilic agent (a3) having an olefin group is particularly limited as long as it is a compound capable of reacting with the metaloxy group possessed by the polyoxyalkylene polymer (a2) and introducing an olefin group into the polyoxyalkylene polymer.
- Examples include an organic halide (a3-1) having an olefin group, an epoxy compound (a3-2) having an olefin group, and the like.
- An organic halide (a3-1) having an olefin group which is one embodiment of the electrophile (a3), reacts with the metaloxy group through a halogen substitution reaction to form an ether bond, resulting in a polyoxyalkylene-based
- a structure containing an olefin group can be introduced as the terminal structure of the polymer.
- organic halide (a3-1) having an olefin group are not particularly limited, but vinyl chloride, allyl chloride, methallyl chloride, vinyl bromide, allyl bromide, methallyl bromide, vinyl iodide, iodide allyl, methallyl iodide, and the like. Allyl chloride and methallyl chloride are preferred for ease of handling. Moreover, methallyl chloride, methallyl bromide, and methallyl iodide are preferable because the average ratio of the number of reactive silicon groups to the number of terminals of the polymer skeleton is improved.
- a halogenated hydrocarbon compound having a carbon-carbon triple bond can also be used as the organic halide (a3-1) having an olefin group.
- the polyoxyalkylene polymer (a5) obtained by reacting the compound has a carbon-carbon triple bond at the terminal of the polymer skeleton.
- reactive silicon groups are introduced into such a polymer (a5), the atoms adjacent to the reactive silicon groups have carbon-carbon double bonds.
- halogenated hydrocarbon compounds having a carbon-carbon triple bond examples include propargyl chloride, 1-chloro-2-butyne, 4-chloro-1-butyne, 1-chloro-2-octyne, and 1-chloro-2-pentyne.
- 1,4-dichloro-2-butyne 1,4-dichloro-2-butyne, 5-chloro-1-pentyne, 6-chloro-1-hexyne, propargyl bromide, 1-bromo-2-butyne, 4-bromo-1-butyne, 1-bromo -2-octyne, 1-bromo-2-pentyne, 1,4-dibromo-2-butyne, 5-bromo-1-pentyne, 6-bromo-1-hexyne, propargyl iodide, 1-iodo-2-butyne , 4-iodo-1-butyne, 1-iodo-2-octyne, 1-iodo-2-pentyne, 1,4-diiodo-2-butyne, 5-iodo-1-pentyne, and 6-iodo-1- Hexyne and the like.
- propargyl chloride propargyl bromide, and propargyl iodide are more preferred.
- Halogenated hydrocarbon compounds with carbon-carbon double bonds may also be used together with halogenated hydrocarbon compounds with carbon-carbon triple bonds.
- An epoxy compound (a3-2) having an olefin group which is another embodiment of the electrophile (a3), reacts with the metaloxy group through a ring-opening addition reaction of the epoxy group to form an ether bond to form a poly
- a structure containing an olefin group and a hydroxyl group can be introduced as the terminal structure of the oxyalkylene polymer.
- one or more epoxy compounds (a3- 2) can be added.
- epoxy compound (a3-2) having an olefin group examples are not particularly limited, but allyl glycidyl ether, methallyl glycidyl ether, glycidyl acrylate, glycidyl methacrylate and butadiene monoxide are preferable from the viewpoint of reaction activity, and allyl glycidyl Ethers are particularly preferred.
- the epoxy compound (a3-2) having an olefin group is allowed to act on the metaloxy group-terminated polyoxyalkylene polymer (a2), a new metaloxy group is generated by ring opening of the epoxy group. Therefore, after reacting the epoxy compound (a3-2), the organic halide (a3-1) having an olefin group can be reacted continuously.
- hydrosilane compound (a6) having a reactive silicon group include trichlorosilane, dichloromethylsilane, chlorodimethylsilane, dichlorophenylsilane, (chloromethyl)dichlorosilane, (dichloromethyl)dichlorosilane, bis(chloromethyl) ) chlorosilane, (methoxymethyl)dichlorosilane, (dimethoxymethyl)dichlorosilane, bis(methoxymethyl)chlorosilane and other halosilanes; trimethoxysilane, triethoxysilane, dimethoxymethylsilane, diethoxymethylsilane, dimethoxyphenylsilane, ethyl dimethoxysilane, methoxydimethylsilane, ethoxydimethylsilane, (chloromethyl)methylmethoxysilane, (chloromethyl)dimethoxysilane,
- Alkoxysilanes Alkoxysilanes; acyloxysilanes such as diacetoxymethylsilane and diacetoxyphenylsilane; ketoximate silanes such as bis(dimethylketoximate)methylsilane and bis(cyclohexylketoximate)methylsilane; triisopropenyloxysilane , (chloromethyl)diisopropenyloxysilane, (methoxymethyl)diisopropenyloxysilane (deacetone type), and the like.
- the hydrosilylation reaction is preferably carried out in the presence of a hydrosilylation catalyst in order to promote the reaction.
- a hydrosilylation catalyst metals such as cobalt, nickel, iridium, platinum, palladium, rhodium, ruthenium, and complexes thereof are known, and these can be used.
- platinum-phosphine complexes [eg Ph(PPh 3 ) 4 , Pt(PBu 3 ) 4 ]; platinum-phosphite complexes [eg Pt ⁇ P(OPh) 3 ⁇ 4 ].
- platinum catalysts such as chloroplatinic acid and platinum-vinylsiloxane complexes are preferred.
- a polyoxyalkylene polymer (a1) precursor polymer having a hydroxyl group at its end is treated with a reactive silicon group and an isocyanate group in one molecule.
- a method of reacting compound (a7) to form a urethane bond to introduce a reactive silicon group can also be applied.
- Polymer (A) can also be produced by this method.
- an isocyanate group capable of undergoing a urethanization reaction with the hydroxyl group of the polyoxyalkylene polymer (a1) and a reactive silicon group are It is not particularly limited as long as it is a compound having both in the molecule, but specific examples include (3-isocyanatopropyl)trimethoxysilane, (3-isocyanatopropyl)dimethoxymethylsilane, (3-isocyanatopropyl)triethoxysilane, ( 3-isocyanatopropyl)diethoxymethylsilane, (isocyanatomethyl)trimethoxysilane, (isocyanatomethyl)triethoxysilane, (isocyanatemethyl)dimethoxymethylsilane, (isocyanatomethyl)diethoxymethylsilane and the like.
- the urethanization reaction may be carried out without using a urethanization catalyst, but may be carried out in the presence of a urethanization catalyst for the purpose of improving the reaction rate or improving the reaction rate.
- a urethanization catalyst examples include conventionally known urethanization catalysts listed in Polyurethanes: Chemistry and Technology, Part I, Table 30, Chapter 4, Saunders and Frisch, Interscience Publishers, New York, 1963.
- a catalyst can be used. Specific examples thereof include base catalysts such as organic tin compounds, bismuth compounds, and organic amines, but are not limited to these.
- the polyoxyalkylene polymer (a1) having a terminal hydroxyl group is reacted with an excess polyisocyanate compound (a8) to form an isocyanate group at the terminal.
- an isocyanate group e.g., an amino group
- a compound (a9) having a reactive silicon group are reacted with the precursor polymer. be able to.
- This method can also produce a polyoxyalkylene polymer (A) having a reactive silicon group at the end of the polymer backbone.
- polyisocyanate compound (a8) examples include aromatic polyisocyanates such as toluene (tolylene) diisocyanate, diphenylmethane diisocyanate and xylylene diisocyanate; aliphatic polyisocyanates such as isophorone diisocyanate and hexamethylene diisocyanate.
- aromatic polyisocyanates such as toluene (tolylene) diisocyanate, diphenylmethane diisocyanate and xylylene diisocyanate
- aliphatic polyisocyanates such as isophorone diisocyanate and hexamethylene diisocyanate.
- Examples of the compound (a9) having a group that reacts with an isocyanate group and a reactive silicon group include ⁇ -aminopropyltrimethoxysilane, ⁇ -aminopropyldimethoxymethylsilane, ⁇ -aminopropyltriethoxysilane, N-( ⁇ -aminoethyl)- ⁇ -aminopropyltrimethoxysilane, N-( ⁇ -aminoethyl)- ⁇ -aminopropyldimethoxymethylsilane, N-( ⁇ -aminoethyl)- ⁇ -aminopropyltriethoxysilane, ⁇ -( N-phenyl)aminopropyltrimethoxysilane, ⁇ -(N-phenyl)aminopropyldimethoxymethylsilane, N-ethylaminoisobutyltrimethoxysilane, N-ethylaminoisobuty
- a polyoxyalkylene polymer (a4) precursor polymer having an olefin group in the terminal structure is added with a reactive silicon group and A method of reacting a compound (a10) having a mercaptan group to add a mercaptan group to an olefin group to form a sulfide bond to introduce a reactive silicon group can also be applied.
- This method can also produce a polyoxyalkylene polymer (A) having a reactive silicon group at the end of the polymer backbone.
- a mercaptan group capable of addition reaction to the olefin group of the polyoxyalkylene polymer (a4) and a reactive silicon group are Although it is not particularly limited as long as it is a compound having both in the molecule, specific examples include (3-mercaptopropyl)methyldimethoxysilane, (3-mercaptopropyl)trimethoxysilane, (3-mercaptopropyl)methyldiethoxysilane, (3-mercaptopropyl)triethoxysilane, (mercaptomethyl)methyldimethoxysilane, (mercaptomethyl)trimethoxysilane, (mercaptomethyl)methyldiethoxysilane, (mercaptomethyl)triethoxysilane and the like.
- the addition reaction of the mercaptan group to the olefin group may be carried out without using a radical initiator.
- a radical initiator conventionally known ones can be used. Specific examples include azo initiators and peroxide initiators, but are not limited to these.
- radical initiators catalysts with low activity toward reactive silicon groups are preferred. From this viewpoint, 2,2'-azobis(isobutyronitrile) (AIBN), 2,2'-azobis( -methylbutyronitrile) (V-59) and 2,2'-azobis(1-methylcyclohexanecarbonitrile) (V-40) are particularly preferred.
- AIBN 2,2'-azobis(isobutyronitrile)
- V-59 2,2'-azobis( -methylbutyronitrile)
- V-40 2,2'-azobis(1-methylcyclohexanecarbonitrile)
- reactive silicon group-containing organic polymer (A) examples include Kaneka Corporation SAT350, SAT400, S203H, S303H, EST280, SAX530, SAX580, SAX590, S810, S257, S258, S227, S327, MA452, MA480, etc.
- a curable composition according to an aspect of the present disclosure can contain a titanium compound (B) represented by general formula (2).
- (R 2 —O) n Ti—A 4-n (2) R 2 is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms; n is an integer of 1 to 4; A is a ⁇ -diketone group
- the substituted or unsubstituted hydrocarbon group represented by R 2 is preferably a substituted or unsubstituted aliphatic or aromatic hydrocarbon group, more preferably an aliphatic hydrocarbon group.
- Aliphatic hydrocarbon groups include saturated or unsaturated hydrocarbon groups. A linear or branched alkyl group is preferred as the saturated hydrocarbon group.
- the number of carbon atoms in the hydrocarbon group is 1-10, preferably 1-6, more preferably 1-4.
- Hydrocarbon groups include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, pentyl, hexyl, heptyl, octyl, 2-ethylhexyl, nonyl, decyl.
- Examples of the substituent that the hydrocarbon group may have include a methoxy group, an ethoxy group, a hydroxyl group, an acetoxy group, and the like. When there are multiple R2 's, they may be the same or different.
- the ⁇ -diketone group represented by A is not particularly limited as long as it is a ⁇ -diketone group that can be blended with titanium.
- 1-aryl-1,3-butanedione such as ,6,6-tetramethyl-3,5-heptanedione, 1-phenyl-1,3-butanedione, 1-(4-methoxyphenyl)-1,3-butanedione , 1,3-diphenyl-1,3-propanedione, 1,3-bis(2-pyridyl)-1,3-propanedione, 1,3-bis(4-methoxyphenyl)-1,3-propanedione diketones such as 1,3-diaryl-1,3-propanedione such as 3-benzyl-2,4-pentanedione, methyl acetoacetate, ethyl acetoacetate, butyl acetoacetate, t-butyl
- malonic acid esters and malonic acid amides such as N,N,N',N'-tetramethylmalonamide and N,N,N',N'-tetraethylmalonamide.
- diketones and ketoamides are preferred, and diketones are more preferred.
- 2,4-pentanedione, 1-aryl-1,3-butanedione, 1,3-diaryl-1,3-propanedione, methylacetoacetate and ethylacetoacetate are preferred, and methylacetoacetate and ethylacetoacetate are preferred.
- Acetate is particularly preferred. When there are multiple A's, they may be the same or different.
- n represents an integer of 1 to 4. n preferably represents 2, 3 or 4, particularly preferably 4, so that better curability can be achieved.
- titanium compound represented by the general formula (2) examples include tetramethoxytitanium, trimethoxyethoxytitanium, trimethoxyisopropoxytitanium, trimethoxybutoxytitanium, dimethoxydiethoxytitanium, dimethoxydiisopropoxytitanium, dimethoxy Dibutoxytitanium, methoxytriethoxytitanium, methoxytriisopropoxytitanium, methoxytributoxytitanium, tetraethoxytitanium, triethoxyisopropoxytitanium, triethoxybutoxytitanium, diethoxydiisopropoxytitanium, diethoxydibutoxytitanium, ethoxytri isopropoxytitanium, ethoxytributoxytitanium, tetraisopropoxytitanium, triisopropoxybutoxytitanium, diisopropoxyd
- the above titanium compound (B) may be used alone or in combination of two or more.
- the amount of the titanium compound (B) used is, when the titanium compound (B) and the ammonium hydroxide (C) are used without being reacted in advance, relative to 100 parts by weight of the polymer (A) having a reactive silicon group. 0.1 to 20 parts by weight is preferable, 0.2 to 10 parts by weight is more preferable, and 0.5 to 5 parts by weight is particularly preferable.
- a curable composition according to one aspect of the present disclosure may comprise ammonium hydroxide (C).
- Ammonium hydroxide (C) is preferably represented by the following general formula (3).
- R 4 , R 5 , R 6 and R 7 are the same or different and represent a substituted or unsubstituted hydrocarbon group having 1 to 8 carbon atoms.
- Y represents a hydroxyl group.
- the substituted or unsubstituted hydrocarbon group represented by R 4 , R 5 , R 6 and R 7 is preferably a substituted or unsubstituted aliphatic or aromatic hydrocarbon group, and an aliphatic hydrocarbon group is more preferred.
- a linear or branched alkyl group is preferable as the aliphatic hydrocarbon group.
- the number of carbon atoms in the hydrocarbon group is 1-8, preferably 1-6, more preferably 1-4.
- aliphatic hydrocarbon groups include saturated hydrocarbon groups such as methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, pentyl group, hexyl group, cyclohexyl group, heptyl group and octyl group; group, allyl group, prenyl group, crotyl group, cyclopentadienyl group, and other unsaturated hydrocarbon groups, preferably methyl group, ethyl group, and butyl group.
- saturated hydrocarbon groups such as methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, pentyl group, hexyl group, cyclohexyl group, heptyl group and octyl group
- aromatic hydrocarbon group examples include phenyl group, tolyl group, and benzyl group.
- Examples of the substituent that the hydrocarbon group may have include a methoxy group, an ethoxy group, a hydroxy group, and an acetoxy group.
- Examples of substituted hydrocarbon groups include alkoxyalkyl groups such as methoxymethyl group, methoxyethyl group, ethoxymethyl group and ethoxyethyl group; hydroxyalkyl groups such as hydroxymethyl group, hydroxyethyl group and 3-hydroxypropyl group; 2-acetoxyethyl group and the like.
- ammonium hydroxide represented by the general formula (3) examples include tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetraalkylammonium hydroxide such as tetrabutylammonium hydroxide, trimethylbenzyl ammonium hydroxide, benzyltriethylammonium hydroxide, trimethylphenylammonium hydroxide, tris(2-hydroxyethyl)methylammonium hydroxide and the like.
- tetraalkylammonium hydroxide is preferred, and tetrabutylammonium hydroxide is preferred.
- ammonium hydroxide (C) when the titanium compound (B) and the ammonium hydroxide (C) are used without being reacted in advance, 100 parts by weight of the polymer (A) having a reactive silicon group On the other hand, 0.1 to 20 parts by weight is preferable, 0.2 to 10 parts by weight is more preferable, and 0.5 to 5 parts by weight is particularly preferable.
- the content ratio (B/C) of the titanium compound (B) and the ammonium hydroxide (C) is in the range of 0.1/1 to 10/1 in terms of molar ratio, from the viewpoint of obtaining good curability. is preferably from 1/1 to 10/1, more preferably from 2/1 to 5/1.
- the curable composition according to the present disclosure may contain the titanium compound (B) and the ammonium hydroxide (C), respectively, or may react the titanium compound (B) and the ammonium hydroxide (C). It may contain a reaction product obtained by the reaction. In either aspect, it is possible to improve the adhesiveness in a shear tensile test.
- the reaction product can be obtained by reacting a mixture of both at, for example, 40 to 100°C. Specifically, this temperature is preferably 40 to 100°C.
- the molar ratio of titanium compound (B) to ammonium hydroxide (C) in the mixture may be, for example, 0.1-100, more preferably 0.2-10.
- the amount of the reaction product of the titanium compound (B) and ammonium hydroxide (C) used is preferably 0.1 to 30 parts by weight with respect to 100 parts by weight of the polymer (A) having a reactive silicon group. , more preferably 0.2 to 20 parts by weight, particularly preferably 0.5 to 10 parts by weight.
- the curable composition according to the present disclosure may further contain a (meth)acrylate polymer (D) having a reactive silicon group (hereinafter also referred to as polymer (D)). Weather resistance and adhesiveness can be improved by containing the polymer (D).
- the (meth)acrylic acid ester-based monomer constituting the main chain of the (meth)acrylic acid ester-based polymer (D) having a reactive silicon group is not particularly limited, and various types can be used. Specifically, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, and isobutyl (meth)acrylate.
- tert-butyl (meth)acrylate n-pentyl (meth)acrylate, n-hexyl (meth)acrylate, cyclohexyl (meth)acrylate, n-heptyl (meth)acrylate, n-(meth)acrylate -octyl, 2-ethylhexyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, dodecyl (meth)acrylate, phenyl (meth)acrylate, toluyl (meth)acrylate, (meth)acrylate Benzyl acrylate, 2-methoxyethyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, stearyl (meth)acrylate , glycidyl (meth)acrylate, (3
- Examples of monomer units other than the above include acrylic acid such as acrylic acid and methacrylic acid; amide groups such as N-methylol acrylamide and N-methylol methacrylamide; epoxy groups such as glycidyl acrylate and glycidyl methacrylate; , diethylaminoethyl methacrylate, and the like.
- the (meth)acrylate polymer (D) may be a polymer obtained by copolymerizing a (meth)acrylate monomer and a vinyl monomer copolymerizable therewith.
- the vinyl-based monomer is not particularly limited, and examples thereof include styrene-based monomers such as styrene, vinyltoluene, ⁇ -methylstyrene, chlorostyrene, styrenesulfonic acid and salts thereof; perfluoroethylene, perfluoropropylene, vinylidene fluoride, and the like.
- Fluorine-containing vinyl monomers Silicon-containing vinyl monomers such as vinyltrimethoxysilane and vinyltriethoxysilane; Maleic anhydride, maleic acid, maleic acid monoalkyl esters and dialkyl esters; Fumaric acid, fumaric acid monoalkyl esters and dialkyl esters; maleimide-based monomers such as maleimide, methylmaleimide, ethylmaleimide, propylmaleimide, butylmaleimide, hexylmaleimide, octylmaleimide, dodecylmaleimide, stearylmaleimide, phenylmaleimide, cyclohexylmaleimide; nitrile groups such as acrylonitrile and methacrylonitrile Containing vinyl-based monomers; amide group-containing vinyl-based monomers such as acrylamide and methacrylamide; vinyl ester-based monomers such as vinyl acetate, vinyl propionate, vinyl pivalate, vinyl
- a copolymer composed of a styrene monomer and a (meth)acrylic acid monomer is preferable because of its excellent physical properties.
- a (meth)acrylic ester-based polymer composed of an acid ester monomer is more preferable, and an acrylic ester-based polymer composed of an acrylic ester monomer is particularly preferable.
- the average number of reactive silicon groups in the polymer (D) is preferably 1.0 to 5.0 per molecule, and from the viewpoint of mechanical properties during curing of the curable composition, 1.27 or more. is more preferable, and from the viewpoint of the stability of the polymer (D), 3.0 or less is more preferable.
- the method for introducing a reactive silicon group into the (meth)acrylic acid ester polymer is not particularly limited, and for example, the following method can be used.
- V group a reactive functional group
- a method of reacting the hydroxyl group with an isocyanate silane having a reactive silicon-containing group, or after copolymerizing glycidyl acrylate, the epoxy group and the reactive Examples include a method of reacting an aminosilane compound having a silicon-containing group.
- Examples of the silicon compound that can be used to introduce the reactive silicon group of the (meth)acrylic acid ester polymer (D) using the above method include the following compounds.
- Compounds having a polymerizable unsaturated group and a reactive silicon group used in method (i) include 3-(trimethoxysilyl)propyl (meth)acrylate and 3-(dimethoxymethylsilyl)propyl (meth)acrylate.
- trimethoxysilylpropyl (meth)acrylate and (dimethoxymethylsilyl)propyl (meth)acrylate are particularly preferred.
- Mercaptosilane compounds with reactive silicon-containing groups used in method (ii) include 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyldimethoxymethylsilane, 3-mercaptopropyltriethoxysilane, mercaptomethyltrimethoxysilane, (mercaptomethyl)dimethoxymethylsilane, mercaptomethyltriethoxysilane and the like.
- Compounds having a reactive silicon group and a functional group reactive with the V group used in method (iii) include 3-isocyanatopropyltrimethoxysilane, 3-isocyanatopropyldimethoxymethylsilane, 3-isocyanatopropyltriethoxysilane, isocyanate isocyanatosilane compounds such as methyltrimethoxysilane, isocyanatomethyltriethoxysilane, isocyanatomethyldimethoxymethylsilane, isocyanatomethyldiethoxymethylsilane; 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3 - epoxysilane compounds such as glycidoxypropyldimethoxymethylsilane, glycidoxymethyltrimethoxysilane, glycidoxymethyltriethoxysilane, glycidoxymethyldimethoxymethylsilane, glycid
- the reactive silicon group of polymer (D) has the general formula (4): —SiR 8 3-b Z b (4) (R 8 each independently represents a hydrocarbon group having 1 to 20 carbon atoms, and the hydrocarbon group may have a hetero-containing group. Z each independently represents a hydroxyl group or a hydrolyzable represents a group, and b is 1, 2, or 3.) is represented by
- R 8 is a hydrocarbon group having 1 to 20 carbon atoms.
- the number of carbon atoms in the hydrocarbon group for R 8 is preferably 1-12, more preferably 1-6, and particularly preferably 1-4.
- the hydrocarbon group may be an unsubstituted hydrocarbon group or a hydrocarbon group having a substituent.
- R 8 examples include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, n-hexyl group, n-heptyl group, n-octyl group, 2-ethyl-n-hexyl group, n-nonyl group, n-decyl group, n-undecyl group, n-dodecyl group, n-tridecyl group, n-tetradecyl group, n - alkyl groups such as pentadecyl, n-hexadecyl, n-octadecyl, n-nonadecyl, and n-icosyl groups; alkenyl groups such as vinyl, 2-propenyl, 3-butenyl group
- R 8 include, for example, alkyl groups such as methyl group and ethyl group; alkyl groups having hetero-containing groups such as chloromethyl group and methoxymethyl group; cycloalkyl groups such as cyclohexyl group; aryl groups such as; aralkyl groups such as benzyl group; and the like.
- R 8 is preferably a methyl group, a methoxymethyl group and a chloromethyl group, more preferably a methyl group and a methoxymethyl group, and still more preferably a methyl group.
- Z examples include a hydroxyl group, a halogen, an alkoxy group, an acyloxy group, a ketoximate group, an amino group, an amide group, an acid amide group, an aminooxy group, a mercapto group, and an alkenyloxy group.
- alkoxy groups such as methoxy and ethoxy are more preferable, methoxy and ethoxy are more preferable, and methoxy is particularly preferable, because they are moderately hydrolyzable and easy to handle.
- b is 1, 2, or 3; b is preferably 2 or 3.
- reactive silicon groups include a trimethoxysilyl group, a triethoxysilyl group, a tris(2-propenyloxy)silyl group, a triacetoxysilyl group, a dimethoxymethylsilyl group, a diethoxymethylsilyl group and a dimethoxyethylsilyl group.
- the number average molecular weight of the polymer (D) is not particularly limited, but the polystyrene equivalent molecular weight measured by GPC is preferably 500 to 100,000, more preferably 500 to 50,000, and particularly preferably 1,000 to 30,000. .
- the method of blending the polymer (A) and the polymer (D) having a reactive silicon group is disclosed in JP-A-59-122541, JP-A-63-112642, JP-A-6-172631, JP-A-11- No. 116763, etc., have proposed this.
- a method of polymerizing a (meth)acrylic acid ester-based monomer in the presence of a polyoxypropylene-based polymer having a reactive silicon group can be used. This manufacturing method is specifically disclosed in each publication such as JP-A-59-78223, JP-A-60-228516 and JP-A-60-228517.
- Polymer (A) and polymer (D) can also be blended by similar methods, but are not limited thereto.
- the mixing ratio of polymer (A) and polymer (D) is not particularly limited, but (A):(D) is preferably 95:5 to 5:95 (parts by weight), and 80:20 to 20:80 (parts by weight). Parts by weight) is more preferred, and 70:30 to 30:70 (parts by weight) is particularly preferred.
- the polymer (A) and the polymer (D) may be used alone or in combination of two or more.
- the curable composition according to the present disclosure includes additives such as other silanol condensation catalysts and fillers. , Adhesion imparting agents, plasticizers, solvents, diluents, anti-sagging agents, antioxidants, light stabilizers, ultraviolet absorbers, physical property modifiers, tackifying resins, compounds containing epoxy groups, photocurable substances, Oxygen-curable substances, epoxy resins, and other resins may be added.
- additives may be added to the curable composition according to the present disclosure as necessary for the purpose of adjusting various physical properties of the curable composition or cured product.
- additives examples include surface property modifiers, foaming agents, curability modifiers, flame retardants, silicates, radical inhibitors, metal deactivators, antiozonants, phosphorus peroxides, Examples include decomposing agents, lubricants, pigments, and antifungal agents.
- silanol condensation catalyst for hydrolyzing and condensing the reactive silicon groups of the polymer (A) having reactive silicon groups, a titanium compound (B) and ammonium hydroxide (C), or reaction products thereof is used, but other silanol condensation catalysts may also be used.
- silanol condensation catalysts include, for example, organic tin compounds, carboxylic acid metal salts, amine compounds, carboxylic acids, and alkoxy metals.
- organic tin compounds include dibutyltin dilaurate, dibutyltin dioctanoate, dibutyltin bis(butyl maleate), dibutyltin diacetate, dibutyltin oxide, dibutyltin bis(acetylacetonate), dioctyltin bis(acetylacetonate), phosphate), dioctyltin dilaurate, dioctyltin distearate, dioctyltin diacetate, dioctyltin oxide, reaction products of dibutyltin oxide and silicate compounds, reaction products of dioctyltin oxide and silicate compounds, dibutyltin oxide and phthalates and the like.
- carboxylate metal salts include tin carboxylate, bismuth carboxylate, titanium carboxylate, zirconium carboxylate, iron carboxylate, potassium carboxylate, and calcium carboxylate.
- carboxylic acid group the following carboxylic acid and various metals can be combined.
- iron 2-ethylhexanoate (bivalent), iron 2-ethylhexanoate (trivalent), titanium 2-ethylhexanoate (tetravalent), vanadium 2-ethylhexanoate (3 valence), calcium 2-ethylhexanoate (divalent), potassium 2-ethylhexanoate (monovalent), barium 2-ethylhexanoate (divalent), manganese 2-ethylhexanoate (divalent) , Nickel 2-ethylhexanoate (divalent), Cobalt 2-ethylhexanoate (divalent), Zirconium 2-ethylhexanoate (tetravalent), Iron neodecanoate (divalent), Iron neodecanoate (3 valence), titanium neodecanoate (tetravalent), vanadium neodecanoate (trivalent), calcium neo
- amine compounds include amines such as octylamine, 2-ethylhexylamine, laurylamine, stearylamine; pyridine, 1,8-diazabicyclo[5,4,0]undecene-7 (DBU), 1, Nitrogen-containing heterocyclic compounds such as 5-diazabicyclo[4,3,0]nonene-5 (DBN); guanidines such as guanidine, phenylguanidine and diphenylguanidine; biguanides such as phenyl biguanide; amino group-containing silane coupling agents; ketimine compounds;
- carboxylic acids include acetic acid, propionic acid, butyric acid, 2-ethylhexanoic acid, lauric acid, stearic acid, oleic acid, linoleic acid, neodecanoic acid, and versatic acid.
- alkoxy metals include aluminum compounds such as aluminum tris (acetylacetonate) and diisopropoxyaluminum ethylacetoacetate, and zirconium compounds such as zirconium tetrakis (acetylacetonate).
- fluorine anion-containing compounds As other silanol condensation catalysts, fluorine anion-containing compounds, photoacid generators, and photobase generators can also be used.
- Two or more different silanol condensation catalysts may be used in combination.
- the amount of the silanol condensation catalyst used is preferably 0.001 to 20 parts by weight, more preferably 0.01 to 15 parts by weight, relative to 100 parts by weight of the polymer (A) having a reactive silicon group. 0.01 to 10 parts by weight are particularly preferred.
- Fillers include ground calcium carbonate, colloidal calcium carbonate, magnesium carbonate, diatomaceous earth, clay, talc, titanium oxide, fumed silica, precipitated silica, crystalline silica, fused silica, anhydrous silicic acid, hydrous silicic acid, carbon black, ferric oxide, fine aluminum powder, zinc oxide, active zinc white, PVC powder, PMMA powder, glass fiber and filament, and the like.
- the amount of filler used is preferably 1 to 600 parts by weight, particularly preferably 10 to 300 parts by weight, per 100 parts by weight of the polymer (A) having a reactive silicon group.
- Organic balloons and inorganic balloons may be added for the purpose of weight reduction (lower specific gravity) of the composition.
- the balloon is hollow inside with a spherical filler, and is made of inorganic materials such as glass, shirasu, and silica, and organic materials such as phenolic resin, urea resin, polystyrene, and saran.
- the amount of the balloon used is preferably 0.1 to 100 parts by weight, particularly preferably 1 to 20 parts by weight, per 100 parts by weight of the polymer (A) having a reactive silicon group.
- Adhesion imparting agents can be added to the curable composition according to the present disclosure.
- a silane coupling agent or a reactant of the silane coupling agent can be added as an adhesion imparting agent.
- silane coupling agents include ⁇ -aminopropyltrimethoxysilane, ⁇ -aminopropylmethyldimethoxysilane, N- ⁇ -aminoethyl- ⁇ -aminopropyltrimethoxysilane, N- ⁇ -aminoethyl- ⁇ - Amino group-containing silanes such as aminopropylmethyldimethoxysilane, N-phenyl- ⁇ -aminopropyltrimethoxysilane, (2-aminoethyl)aminomethyltrimethoxysilane; ⁇ -isocyanatopropyltrimethoxysilane, ⁇ -isocyanatopropyltrimethoxysilane; isocyanate group-containing silanes such as ethoxysilane, ⁇ -isocyanatopropylmethyldimethoxysilane, ⁇ -isocyanatomethyltrimethoxysilane, ⁇ -isocyan
- Condensates of various silane coupling agents such as condensates of aminosilane, condensates of aminosilane and other alkoxysilanes; reaction products of aminosilane and epoxysilane; reaction products of aminosilane and (meth)acrylic group-containing silane; A reaction product of various silane coupling agents such as can also be used.
- Specific examples include Dynasylan 1146 and Dynasylan 1124 (manufactured by EVONIK).
- the adhesiveness-imparting agent may be used alone or in combination of two or more.
- the amount of the silane coupling agent used is preferably 0.1 to 20 parts by weight, particularly preferably 0.5 to 10 parts by weight, per 100 parts by weight of the polymer (A) having a reactive silicon group.
- plasticizer can be added to the curable composition according to the present disclosure.
- plasticizers include dibutyl phthalate, diisononyl phthalate (DINP), diheptyl phthalate, di(2-ethylhexyl) phthalate, diisodecyl phthalate (DIDP), phthalate compounds such as butylbenzyl phthalate; bis(2-ethylhexyl )-terephthalate compounds such as 1,4-benzenedicarboxylate; non-phthalate compounds such as 1,2-cyclohexanedicarboxylic acid diisononyl ester (specifically, trade name: Hexamoll DINCH (manufactured by BASF)); Aliphatic polyvalent carboxylic acid ester compounds such as dioctyl adipate, dioctyl sebacate, dibutyl sebacate, diisodecyl succinate and tributyl ace
- polymer plasticizer can be used.
- polymeric plasticizers include vinyl polymers; polyester plasticizers; polyether polyols such as polyethylene glycol and polypropylene glycol having a number average molecular weight of 500 or more; polyethers such as derivatives converted to polystyrenes; polybutadiene, polybutene, polyisobutylene, butadiene-acrylonitrile, polychloroprene and the like.
- the amount of the plasticizer used is preferably 5 to 150 parts by weight, more preferably 10 to 120 parts by weight, and particularly preferably 20 to 100 parts by weight, relative to 100 parts by weight of the polymer (A) having a reactive silicon group. . If it is less than 5 parts by weight, the effect as a plasticizer will not be exhibited, and if it exceeds 150 parts by weight, the mechanical strength of the cured product will be insufficient.
- a plasticizer may be used individually and may use 2 or more types together.
- Solvents or diluents may be added to the curable compositions of the present disclosure.
- Solvents and diluents that can be used include, but are not limited to, aliphatic hydrocarbons, aromatic hydrocarbons, alicyclic hydrocarbons, halogenated hydrocarbons, alcohols, esters, ketones, and ethers.
- the boiling point of the solvent is preferably 150° C. or higher, more preferably 200° C. or higher, and particularly preferably 250° C. or higher, because of the problem of air pollution when the composition is used indoors. .
- the above solvents or diluents may be used alone or in combination of two or more.
- An anti-sagging agent may be added to the curable composition according to the present disclosure as necessary to prevent sagging and improve workability.
- the anti-sagging agent is not particularly limited, but examples thereof include polyamide waxes; hydrogenated castor oil derivatives; metal soaps such as calcium stearate, aluminum stearate and barium stearate. These anti-sagging agents may be used alone or in combination of two or more.
- the amount of anti-sagging agent used is preferably 0.1 to 20 parts by weight with respect to 100 parts by weight of the polymer (A) having a reactive silicon group.
- antioxidant antioxidant agent
- An antioxidant can be used in the curable composition according to the present disclosure.
- the use of an antioxidant can enhance the weather resistance of the cured product.
- antioxidants include hindered phenols, monophenols, bisphenols, and polyphenols. Examples include BHT, Irganox 245, Irganox 1010, Irganox 1035, Irganox 1076, Irganox 1135, Irganox 1330, Irganox 1520 and SONGNOX 1076.
- Tinuvin 622LD, Tinuvin 144, Tinuvin 292; CHIMASSORB944LD, CHIMASSORB119FL (all of which are manufactured by BASF); Sanol LS-2626, Sanol LS-1114, Sanol LS-744 (all of these are manufactured by Sankyo Lifetech Co., Ltd.); Hindered amines shown in Nocrack CD (manufactured by Ouchi Shinko Kagaku Kogyo Co., Ltd.) System light stabilizers can also be used. Other antioxidants such as SONGNOX 4120, NOUGARD 445, and OKABEST CLX050 can also be used.
- antioxidants are also described in JP-A-4-283259 and JP-A-9-194731.
- the amount of antioxidant used is preferably 0.1 to 10 parts by weight, particularly preferably 0.2 to 5 parts by weight, per 100 parts by weight of the polymer (A) having a reactive silicon group.
- a light stabilizer can be used in the curable compositions according to the present disclosure.
- the use of a light stabilizer can prevent photo-oxidative deterioration of the cured product.
- Benzotriazole-based, hindered amine-based, and benzoate-based compounds can be exemplified as light stabilizers, and hindered amine-based compounds are particularly preferred.
- Hindered amine light stabilizers include Tinuvin 123, Tinuvin 144, Tinuvin 249, Tinuvin 292, Tinuvin 312, Tinuvin 622LD, Tinuvin 765, Tinuvin 770, Tinuvin 880, Tinuvin 5866, Tinuvin B97; ADEKA STAB LA-57, LA-62, LA-63, LA-67, LA-68 (both of which are manufactured by ADEKA Co., Ltd.); Sanol LS-292, LS-2626, LS-765, LS-744, LS- 1114 (all of which are manufactured by Sankyo Lifetech Co., Ltd.); light such as SABOSTAB UV91, SABOSTAB UV119, SONGSORB CS5100, SONGSORB CS622, SONGSORB CS944 (all of which are manufactured by SONGWON), and Nocrac CD (manufactured by Ouchi Shinko Kagaku Kogyo Co., Ltd.) Stabilizers can be exe
- the amount of light stabilizer used is preferably 0.1 to 10 parts by weight, particularly preferably 0.2 to 5 parts by weight, per 100 parts by weight of the polymer (A) having a reactive silicon group.
- a UV absorber can be used in the curable composition according to the present disclosure.
- the use of an ultraviolet absorber can enhance the surface weather resistance of the cured product.
- Benzophenone-based, benzotriazole-based, salicylate-based, triazine-based, substituted acrylonitrile-based and metal chelate-based compounds can be exemplified as UV absorbers, and benzotriazole-based compounds are particularly preferred.
- triazine-based compounds include Tinuvin 400, Tinuvin 405, Tinuvin 477, Tinuvin 1577ED (all of which are manufactured by BASF); SONGSORB CS400 and SONGSORB1577 (manufactured by SONGWON).
- benzophenone compounds include SONGSORB8100 (manufactured by SONGWON).
- the amount of the ultraviolet absorber used is preferably 0.1 to 10 parts by weight, particularly preferably 0.2 to 5 parts by weight, per 100 parts by weight of the polymer (A) having a reactive silicon group.
- Addworks IBC760 (manufactured by Clariant) can also be used as a product in which antioxidants, light stabilizers, and ultraviolet absorbers are mixed.
- the curable composition according to the present disclosure may optionally contain a physical property modifier for adjusting the tensile properties of the resulting cured product.
- a physical property modifier for adjusting the tensile properties of the resulting cured product.
- the physical property modifier is not particularly limited, for example, alkylalkoxysilanes such as phenoxytrimethylsilane, methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane, and n-propyltrimethoxysilane; diphenyldimethoxysilane, phenyltrimethoxysilane.
- arylalkoxysilanes such as; alkylisopropenoxysilanes such as dimethyldiisopropenoxysilane, methyltriisopropenoxysilane, ⁇ -glycidoxypropylmethyldiisopropenoxysilane; trialkylsilylborates such as silyl)borate; silicone varnishes; polysiloxanes;
- the physical property modifiers may be used alone or in combination of two or more.
- a compound that produces a compound having a monovalent silanol group in the molecule by hydrolysis has the effect of lowering the modulus of the cured product without worsening the surface stickiness of the cured product.
- Compounds that generate trimethylsilanol are particularly preferred.
- examples of compounds that generate a compound having a monovalent silanol group in the molecule by hydrolysis include alcohol derivatives such as hexanol, octanol, phenol, trimethylolpropane, glycerin, pentaerythritol, and sorbitol, which are hydrolyzed into silane monovalent groups.
- Mention may be made of silicon compounds that produce ols. Specific examples include phenoxytrimethylsilane and tris((trimethylsiloxy)methyl)propane.
- the amount of the physical property modifier used is preferably 0.1 to 10 parts by weight, particularly preferably 0.5 to 5 parts by weight, per 100 parts by weight of the polymer (A) having a reactive silicon group.
- a tackifying resin can be added for the purpose of enhancing the adhesiveness or adhesion to the substrate, or for other purposes.
- the tackifying resin there is no particular limitation, and those commonly used can be used.
- terpene-based resins aromatic modified terpene resins, hydrogenated terpene resins, terpene-phenolic resins, phenolic resins, modified phenolic resins, xylene-phenolic resins, cyclopentadiene-phenolic resins, coumarone-indene resins, rosin-based Resins, rosin ester resins, hydrogenated rosin ester resins, xylene resins, low molecular weight polystyrene resins, styrene copolymer resins, styrene block copolymers and hydrogenated products thereof, petroleum resins (e.g., C5 hydrocarbon resins, C9 hydrocarbon resins, C5C9 hydrocarbon copolymer resins, etc.), hydrogenated petroleum resins, DCPD resins, and the like. These may be used alone or in combination of two or more.
- petroleum resins e.g., C5 hydrocarbon resins, C9 hydrocarbon resins, C
- the amount of the tackifier resin used is preferably 2 to 100 parts by weight, more preferably 5 to 50 parts by weight, more preferably 5 to 30 parts by weight, based on 100 parts by weight of the polymer (A) having a reactive silicon group. is more preferred. If the amount is less than 2 parts by weight, it is difficult to obtain adhesion and adhesion effects to the substrate, and if the amount exceeds 100 parts by weight, the viscosity of the composition becomes too high and handling may become difficult.
- Compounds containing epoxy groups can be used in the curable compositions of the present disclosure.
- the use of a compound having an epoxy group can enhance the restorability of the cured product.
- Examples of compounds having an epoxy group include epoxidized unsaturated fats and oils, epoxidized unsaturated fatty acid esters, alicyclic epoxy compounds, epichlorohydrin derivatives, and mixtures thereof.
- epoxidized soybean oil epoxidized linseed oil, bis(2-ethylhexyl)-4,5-epoxycyclohexane-1,2-dicarboxylate (E-PS), epoxyoctyl stearate , epoxy butyl stearate and the like.
- the epoxy compound is preferably used in an amount of 0.5 to 50 parts by weight per 100 parts by weight of the polymer (A) having a reactive silicon group.
- Photocurable materials can be used in the curable compositions of the present disclosure.
- a photocurable substance When a photocurable substance is used, a film of the photocurable substance is formed on the surface of the cured product, and the stickiness of the cured product and the weather resistance of the cured product can be improved.
- Many compounds such as organic monomers, oligomers, resins, or compositions containing them are known as this type of compound. Unsaturated acrylic compounds, polyvinyl cinnamates, azide resins, etc., which are monomers, oligomers, or mixtures thereof can be used.
- the photocurable substance is preferably used in an amount of 0.1 to 20 parts by weight, preferably 0.5 to 10 parts by weight, per 100 parts by weight of the polymer (A) having a reactive silicon group. If it is less than 1 part by weight, there is no effect of improving the weather resistance, and if it is more than 20 parts by weight, the cured product becomes too hard and tends to crack.
- Oxygen-curable materials can be used in the curable compositions of the present disclosure.
- oxygen-curable substances include unsaturated compounds that can react with oxygen in the air, and react with oxygen in the air to form a hardened film near the surface of the cured product, which causes the surface to become sticky and dust on the surface of the cured product. and prevent the adhesion of dust.
- Specific examples of oxygen-curable substances include drying oils such as paulownia oil and linseed oil, various alkyd resins obtained by modifying these compounds; acrylic polymers modified with drying oils, and epoxy resins.
- silicone resins obtained by polymerizing or copolymerizing diene compounds such as butadiene, chloroprene, isoprene, 1,3-pentadiene, 1,4-polybutadiene, C5-C8 diene polymers, etc.
- diene compounds such as butadiene, chloroprene, isoprene, 1,3-pentadiene, 1,4-polybutadiene, C5-C8 diene polymers, etc.
- liquid polymers These may be used alone or in combination of two or more.
- the amount of the oxygen-curable substance used is preferably in the range of 0.1 to 20 parts by weight, more preferably 0.5 to 10 parts by weight, per 100 parts by weight of the polymer (A) having a reactive silicon group. weight part. If the amount used is less than 0.1 part by weight, the improvement in staining resistance will not be sufficient, and if it exceeds 20 parts by weight, the tensile properties of the cured product will tend to be impaired. As described in JP-A-3-160053, oxygen-curable substances are preferably used in combination with photo-curable substances.
- Epoxy resin can be used in combination with the curable composition according to the present disclosure.
- a composition containing an epoxy resin is particularly preferred as an adhesive, especially an adhesive for exterior wall tiles.
- epoxy resins include bisphenol A type epoxy resins and novolac type epoxy resins.
- the ratio of (A)/epoxy resin is less than 1/100, it becomes difficult to obtain the effect of improving the impact strength and toughness of the cured epoxy resin, and the ratio of (A)/epoxy resin exceeds 100/1. and the strength of the cured polymer becomes insufficient.
- a curing agent that cures the epoxy resin can be used in combination with the curable composition according to the present disclosure.
- the epoxy resin curing agent that can be used is not particularly limited, and generally used epoxy resin curing agents can be used.
- the amount used is in the range of 0.1 to 300 parts by weight with respect to 100 parts by weight of the epoxy resin.
- the curable composition according to the present disclosure can also be prepared as a one-component type in which all the ingredients are preformed and sealed and cured by moisture in the air after application, and a curing catalyst and filling are separately used as curing agents. It can also be prepared as a two-component type in which components such as the material, plasticizer, and water are blended and the blending materials and the organic polymer composition are mixed before use. From the viewpoint of workability, the one-component type is preferred.
- the ingredients containing water are preliminarily dehydrated and dried before use, or dehydrated by decompression or the like during blending and kneading. is preferred.
- n-propyltrimethoxysilane, vinyltrimethoxysilane, phenyltrimethoxysilane, vinylmethyldimethoxysilane, ⁇ -mercaptopropylmethyldimethoxysilane, ⁇ -mercaptopropylmethyldiethoxysilane, ⁇ -glycol Addition of an alkoxysilane compound such as sidoxypropyltrimethoxysilane further improves storage stability.
- the amount of the dehydrating agent, particularly the silicon compound capable of reacting with water such as vinyltrimethoxysilane, is preferably 0.1 to 20 parts by weight per 100 parts by weight of the polymer (A) having a reactive silicon group. is 0.5 to 10 parts by weight.
- the curable composition according to the present disclosure includes adhesives, sealing materials for buildings, ships, automobiles, roads, etc., adhesives, waterproofing materials, coating film waterproofing materials, molding agents, vibration-proof materials, vibration-damping materials, and soundproofing materials. It can be used for materials, foam materials, paints, spray materials, etc.
- a cured product obtained by curing the curable composition according to the present disclosure is excellent in flexibility and adhesiveness, and therefore, among these, it is more preferably used as a sealant or an adhesive.
- electrical and electronic component materials such as solar cell back sealing materials, electrical and electronic component materials such as insulating coating materials for electric wires and cables, electrical insulating materials for equipment, acoustic insulating materials, elastic adhesives, binders, contact type Adhesives, spray-type sealing materials, crack repair materials, tiling adhesives, asphalt waterproofing adhesives, powder coatings, casting materials, medical rubber materials, medical adhesives, medical adhesive sheets, medical equipment Sealing materials, dental impression materials, food packaging materials, joint sealing materials for exterior materials such as sizing boards, coating materials, anti-slip coating materials, cushioning materials, primers, conductive materials for shielding electromagnetic waves, thermal conductive materials, hot-melt materials , electric and electronic potting agents, films, gaskets, concrete reinforcing materials, adhesives for temporary fixing, various molding materials, rust-proof and waterproof sealing materials for wire glass and laminated glass edges (cut parts), automobile parts , trucks, buses and other large vehicle parts, train vehicle parts, aircraft parts, ship parts, electrical parts, various machine parts,
- the curable compositions of the present disclosure are also used in interior panel adhesives, exterior panel adhesives, tiling adhesives, masonry adhesives, ceiling finish adhesives, floor finish adhesives, wall finish adhesives, adhesives for automobiles, adhesives for vehicle panels, adhesives for assembling electrical, electronic and precision equipment, adhesives for bonding leather, textiles, fabrics, paper, boards and rubber, reactive post-crosslinking pressure-sensitive adhesives, It can also be used as a sealing material for direct glazing, a sealing material for double glazing, a sealing material for SSG construction method, a sealing material for working joints of buildings, a material for civil engineering, and a bridge material. Furthermore, it can be used as an adhesive material such as an adhesive tape and an adhesive sheet.
- a reactive silicon group-containing polyoxyalkylene polymer having a reactive silicon group represented by the general formula (1) and having a molecular weight of 16,000 or less per reactive silicon group; —Si(R 1 ) 3-a X a (1)
- R 1 each independently represents a hydrocarbon group having 1 to 20 carbon atoms, and the hydrocarbon group may have a hetero-containing group.
- Each X is independently a hydroxyl group or a hydrolyzable group.
- a is 1, 2, or 3.
- R 2 is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms; n is an integer of 1 to 4; A is a ⁇ -diketone group.
- ammonium hydroxide (C) A curable composition comprising: [Item 2] a reactive silicon group-containing polyoxyalkylene polymer (A) having a reactive silicon group represented by the general formula (1) and having a molecular weight of 16,000 or less per reactive silicon group; and —Si(R 1 ) 3-a X a (1) (R 1 each independently represents a hydrocarbon group having 1 to 20 carbon atoms, and the hydrocarbon group may have a hetero-containing group.
- Each X is independently a hydroxyl group or a hydrolyzable group.
- a is 1, 2, or 3.
- a reaction product of a titanium compound (B) represented by the general formula (2) and an ammonium hydroxide (C), (R 2 —O) n Ti—A 4-n (2) (R 2 is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms; n is an integer of 1 to 4; A is a ⁇ -diketone group)
- a curable composition comprising: [Item 3] 3. The curable composition according to item 1 or 2, wherein the reactive silicon group-containing polyoxyalkylene polymer (A) has 3 or more main chain ends in one molecule. [Item 4] 4.
- the number average molecular weight in the examples is the GPC molecular weight measured under the following conditions.
- Liquid delivery system Tosoh HLC-8220GPC Column: TSKgel SuperH series manufactured by Tosoh Solvent: THF Molecular weight: Polystyrene equivalent Measurement temperature: 40°C
- the average number of reactive silicon groups per terminal of the polymer shown in Examples and the average number of reactive silicon groups per polymer molecule were calculated from the structure of the polymer and the results of NMR measurement. .
- the molecular weight per reactive silicon group is a value determined from the GPC molecular weight (number average molecular weight) and the average number of reactive silicon groups per polymer molecule.
- polystyrene resin To 500 g of this polymer (Q-3) was added 50 ⁇ l of a platinum divinyldisiloxane complex solution (3% by weight isopropanol solution in terms of platinum), and 9.8 g of trimethoxysilane was slowly added dropwise while stirring. After reacting at 100° C. for 2 hours, unreacted trimethoxysilane is distilled off under reduced pressure to obtain polyoxypropylene (A-2) having a terminal trimethoxysilyl group and a number average molecular weight of about 15,800. Obtained. It was found that the polymer (A-2) had an average of 0.8 trimethoxysilyl groups at one terminal and an average of 1.6 trimethoxysilyl groups per molecule. Also, the molecular weight per reactive silicon group was 9,900.
- polystyrene resin To 500 g of this polymer (Q-4) was added 50 ⁇ l of a platinum-divinyldisiloxane complex solution (3% by weight isopropanol solution in terms of platinum), and 6.9 g of trimethoxysilane was slowly added dropwise while stirring. After reacting at 100° C. for 2 hours, unreacted trimethoxysilane is distilled off under reduced pressure to obtain polyoxypropylene (A-3) having a terminal trimethoxysilyl group and a number average molecular weight of about 26,200. Obtained. It was found that the polymer (A-3) had an average of 0.7 trimethoxysilyl groups at one terminal and an average of 2.1 trimethoxysilyl groups per molecule. Also, the molecular weight per reactive silicon group was 12,500.
- polystyrene resin To 500 g of this polymer (Q-5) was added 50 ⁇ l of a platinum divinyldisiloxane complex solution (3% by weight isopropanol solution in terms of platinum), and 9.6 g of trimethoxysilane was slowly added dropwise while stirring. After reacting at 100° C. for 2 hours, unreacted trimethoxysilane is distilled off under reduced pressure to obtain polyoxypropylene (A-4) having a terminal trimethoxysilyl group and a number average molecular weight of about 28,000. Obtained. It was found that the polymer (A-4) had an average of 1.7 trimethoxysilyl groups at one terminal and an average of 3.4 trimethoxysilyl groups per molecule. Also, the molecular weight per reactive silicon group was 8,200.
- concentration under reduced pressure (final degree of reduced pressure: 10 mmHg) was carried out to distill off isopropanol and methanol to obtain 80 g of a reaction product obtained by further adding 25 g of isopropanol to obtain 105 g of catalyst (B-1) as a transparent liquid. .
- Example 1 Per 100 parts by weight of the polymer (A-1) obtained in Synthesis Example 1, DINCH (manufactured by BASF: 1,2-cyclohexanedicarboxylic acid diisononyl ester) 50 parts by weight, Omyacoll P100 (manufactured by Omya: calcium carbonate) 250 Parts by weight and 1 part by weight of Irganox 245 (manufactured by BASF: hindered phenolic antioxidant) were mixed and dispersed uniformly.
- DINCH manufactured by BASF: 1,2-cyclohexanedicarboxylic acid diisononyl ester
- Omyacoll P100 manufactured by Omya: calcium carbonate
- Irganox 245 manufactured by BASF: hindered phenolic antioxidant
- Example 2 Evaluation was carried out in the same manner as in Example 1, except that 3 parts by weight of catalyst (B-1) was added. Table 1 shows the results.
- Examples 1 and 2 containing the reactive silicon group-containing polyoxyalkylene polymer (A) and the reaction product of the titanium compound (B) and the ammonium hydroxide (C) correspond to the polymer (A).
- the cohesive failure rate is high in the shear tensile test, the shear strength is high, and the adhesiveness is improved.
- Shear bond strength A cover material of 3 mm ⁇ 25 mm ⁇ 100 mm was used as an adherend, and the curable composition was applied so as to have a thickness of 1 mm and an area of 25 ⁇ 12.5 mm. Immediately after application, the adherend was laminated and fixed. After that, after curing for 3 days at 23°C and 50% RH, and after curing for 3 days at 23°C and 50% RH and 7 days at 40°C, a shear tensile test was performed using AR-5422 manufactured by Shimadzu Corporation. did The test speed was 50 mm/min. In addition, the fracture surface of the test piece after measuring the shear adhesive strength was visually observed to evaluate the ratio of the adhesive remaining on the surface of the birch material (cohesive failure rate).
- Irganox 1010 Hindered phenol antioxidant BASF Japan Ltd.
- Tinuvin 326 Benzotriazole UV absorber BASF Japan Ltd.
- Tinuvin 770 Hindered amine light stabilizer BASF Japan Co., Ltd.
- Dynasylan 6490 vinyl silane oligomer manufactured by Evonik (tackifier)
- Dynasylan 1146 diaminosilane-containing silane oligomer manufactured by Evonik Silquest A-187: ⁇ -glycidoxypropyltrimethoxysilane manufactured by Momentive Performance Materials Japan (catalyst) Tyzor 9000: Tetra (tert-butoxy) titanium manufactured by Dorf Ketal Tyzor KE-6: Titanium diisobutoxybis(ethylacetoacetate)
- Dorf Ketal TC-750 Diisopropoxytitanium bis(ethylacetoacetate) manufactured by Matsumoto Fine Chemical Co., Ltd. Tetrabutylammonium hydroxide (“TBAH”): 37%
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Abstract
L'invention concerne une composition durcissable contenant un polymère (A) de polyoxyalkylène contenant un groupe silicium réactif qui présente un groupe silicium réactif et a un poids moléculaire par groupe silicium réactif individuel de 16000, et un composé de titane (B) et de l'hydroxyde d'ammonium (C), ou un produit réactionnel résultant d'une réaction entre le composé de titane (B) et l'hydroxyde d'ammonium (C).
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CN102391529A (zh) * | 2011-07-14 | 2012-03-28 | 杭州师范大学 | 一种封装用硅树脂型有机无机杂化材料制备方法 |
CN103694888A (zh) * | 2013-12-17 | 2014-04-02 | 中昊北方涂料工业研究设计院有限公司 | 一种含硅透明耐磨涂料及其制备方法 |
CN108329473A (zh) * | 2017-01-20 | 2018-07-27 | 中国科学院化学研究所 | 一种含有高苯基聚硅氧烷的组合物和包括该组合物的封装材料或光学薄膜 |
WO2021106942A1 (fr) * | 2019-11-29 | 2021-06-03 | 日東化成株式会社 | Catalyseur de durcissement destiné à être utilisé pour le durcissement d'un polymère, composition durcissable à l'humidité, et procédé de production d'un produit durci |
WO2021106943A1 (fr) * | 2019-11-29 | 2021-06-03 | 日東化成株式会社 | Catalyseur de durcissement destiné à être utilisé pour le durcissement d'un polymère, procédé de production dudit catalyseur de durcissement, composition durcissable à l'humidité, et procédé de production d'article durci |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102391529A (zh) * | 2011-07-14 | 2012-03-28 | 杭州师范大学 | 一种封装用硅树脂型有机无机杂化材料制备方法 |
CN103694888A (zh) * | 2013-12-17 | 2014-04-02 | 中昊北方涂料工业研究设计院有限公司 | 一种含硅透明耐磨涂料及其制备方法 |
CN108329473A (zh) * | 2017-01-20 | 2018-07-27 | 中国科学院化学研究所 | 一种含有高苯基聚硅氧烷的组合物和包括该组合物的封装材料或光学薄膜 |
WO2021106942A1 (fr) * | 2019-11-29 | 2021-06-03 | 日東化成株式会社 | Catalyseur de durcissement destiné à être utilisé pour le durcissement d'un polymère, composition durcissable à l'humidité, et procédé de production d'un produit durci |
WO2021106943A1 (fr) * | 2019-11-29 | 2021-06-03 | 日東化成株式会社 | Catalyseur de durcissement destiné à être utilisé pour le durcissement d'un polymère, procédé de production dudit catalyseur de durcissement, composition durcissable à l'humidité, et procédé de production d'article durci |
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