WO2023045259A1 - 处理器模组及服务器 - Google Patents

处理器模组及服务器 Download PDF

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Publication number
WO2023045259A1
WO2023045259A1 PCT/CN2022/078684 CN2022078684W WO2023045259A1 WO 2023045259 A1 WO2023045259 A1 WO 2023045259A1 CN 2022078684 W CN2022078684 W CN 2022078684W WO 2023045259 A1 WO2023045259 A1 WO 2023045259A1
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Prior art keywords
processor
processor module
board
bearing
plate
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PCT/CN2022/078684
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English (en)
French (fr)
Inventor
郑建武
宁宏超
谭显光
何永占
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Beijing Baidu Netcom Science and Technology Co Ltd
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Beijing Baidu Netcom Science and Technology Co Ltd
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Publication of WO2023045259A1 publication Critical patent/WO2023045259A1/zh
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/188—Mounting of power supply units
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • the present disclosure relates to the technical field of servers, in particular to a processor module and a server.
  • the processor is directly installed on the switch board. Once a certain processor on the switch board fails, the entire server needs to be shut down before the faulty processor can be maintained, which will increase the overall failure of the server. The high rate affects the normal work of the server.
  • the disclosure provides a processor module and a server.
  • a processor module including:
  • the bearing plate has a first end and a bearing surface perpendicular to its thickness direction;
  • processors are arranged on the bearing surface of the bearing board and are electrically connected with the bearing board;
  • the heat dissipation plate is stacked on the bearing surface of the bearing plate, and is bonded to the processor on the bearing surface;
  • the first end of the bearing plate protrudes from the heat dissipation plate.
  • the cooling plate is provided with a receiving slot; the processor is located in the receiving slot and adheres to the bottom surface of the receiving slot.
  • a plurality of bar-shaped slots are provided on a side of the cooling plate away from the processor.
  • a plurality of first connectors are arranged on the bearing surface of the bearing board;
  • Each processor is detachably connected to the corresponding first connector, and is electrically connected to the carrier board through the first connector.
  • a plurality of first connectors are arranged at intervals along the length direction of the carrying board on the carrying surface.
  • the first end is an end in the length direction of the bearing plate.
  • the bearing plate and the heat dissipation plate are connected by bolts.
  • the processor module further includes a handle, and the handle is connected to the carrying board.
  • the carrying board has two carrying surfaces perpendicular to its thickness direction, each carrying surface is provided with a processor;
  • the processor module includes two cooling plates, and each cooling plate is stacked on a corresponding carrying surface of the carrying plate, and bonded to the processor on the corresponding carrying surface.
  • a server including:
  • the first end of the carrier board in the processor module is detachably connected to the switch board.
  • At least one second connector is disposed on the switch board
  • the first end of the carrier board in the processor module is detachably connected to the corresponding second connector.
  • the server further includes a power module
  • the power module is arranged on the switch board and is electrically connected with the switch board, and is used for providing electric energy to the processor on the load board through the switch board.
  • the server further includes a fan; the fan is disposed on the switch board and is electrically connected to the switch board to dissipate heat for the processor module.
  • a plurality of processors are integrated into a processor module, and the processor module can be detachably connected through the first end of the carrier board to switch boards, realizing a single processor module as the The unit performs processor operation and maintenance, cooling and management.
  • the processor module where the processor is located can be removed for maintenance without requiring the entire server to shut down, ensuring that the server can continue to work and improving the convenience of service operation and maintenance.
  • FIG. 1 shows a schematic diagram of a disassembled structure of a processor module provided by an embodiment of the present disclosure
  • Fig. 2 shows a schematic structural diagram of a server including a processor module according to an embodiment of the present disclosure.
  • 11-loading plate 111-first end; 112-bearing surface;
  • the processor is directly installed on the switch board. Once a certain processor on the switch board fails, the entire server needs to be shut down before the faulty processor can be maintained, which will increase the overall failure of the server. The high rate affects the normal work of the server.
  • the processor module and the server provided by the embodiments of the present disclosure aim to solve at least one of the above technical problems in the prior art.
  • FIG. 1 shows a schematic diagram of a disassembled structure of a processor module provided by an embodiment of the present disclosure.
  • FIG. 2 shows a processor module including an embodiment of the present disclosure. Schematic diagram of the structure of a group of servers. As shown in FIGS. 1 and 2 , the processor module 10 includes a carrier board 11 , a plurality of processors 12 , and a heat sink 13 .
  • the bearing plate 11 has a first end portion 111 and a bearing surface 112 perpendicular to its thickness direction.
  • the carrying board 11 in the embodiment of the present disclosure is a circuit board with a certain thickness, which can transmit electrical signals, and the carrying surface 112 is the bottom surface of the carrying board 11 .
  • the processor 12 is disposed on the carrying surface 112 of the carrying board 11 and is electrically connected to the carrying board 11 .
  • the processor 12 in the embodiment of the present disclosure may be any type of processor 12, and the processor 12 is electrically connected to the carrier board 11 to receive external electrical signals or send external electrical signals.
  • the cooling plate 13 is stacked on the carrying surface 112 of the carrying plate 11 and attached to the processor 12 on the carrying surface 112 .
  • the cooling plate 13 can be made of a material with good thermal conductivity (such as aluminum), and the heat generated by the processor 12 can be conducted to the cooling plate 13 to dissipate the heat through the cooling plate 13 .
  • the first end 111 of the carrier board 11 is used to detachably connect to components other than the processor module 10 (such as the switch board 20 ), and is used to receive external electrical signals or send external electrical signals generated by the processor 12 . Therefore, the first end 111 of the carrier board 11 needs to protrude out of the heat sink 13 , so as to facilitate connection with components other than the processor module 10 .
  • a plurality of processors 12 are integrated into a processor module 10, and the processor module 10 can be detachably connected to the exchange board 20 through the first end 111 of the carrier board 11, realizing a single processor module.
  • the group 10 is used as a unit to perform operation and maintenance, heat dissipation and management of the processor 12 .
  • the processor module 10 where the processor 12 is located can be removed for maintenance without requiring the entire server to shut down, ensuring that the server can continue to work and improving the convenience of service operation and maintenance .
  • the bearing plate 11 has two bottom surfaces, both of which can be used as bearing surfaces 112, that is to say, the bearing plate 11 can have two bearing surfaces 112 perpendicular to its thickness direction, and each bearing surface 112 can be Processor 12 is set.
  • the processor module 10 may include two heat sinks 13 , and each heat sink 13 is stacked on a corresponding carrying surface 112 of the carrying board 11 and attached to the processor 12 on the corresponding carrying surface 112 .
  • each carrying surface 112 may be determined according to actual needs, as shown in FIG. 1 , four processors 12 may be disposed on the carrying surface 112 .
  • a processor module 10 two cooling plates 13 are respectively located on both sides of the carrying plate 11, each cooling plate 13 is directly opposite to a bearing surface 112 in the carrying plate 11, and each cooling plate 13
  • the board 13 is attached to the processor 12 on the bearing surface 112 facing it. It can be understood that in the assembled processor module 10, the carrier board 11 and the two heat sinks 13 are stacked, the carrier board 11 is located between the two heat sinks 13, and the carrier board 11 and the heat sink 13 are provided with Processor 12.
  • connection manner of the carrying plate 11 and the heat dissipation plate 13 may be determined according to actual design requirements.
  • the bearing plate 11 and the heat dissipation plate 13 are connected by bolts, or by bonding, which is not limited in the present disclosure.
  • the cooling plate 13 is provided with a receiving groove 131 , and the processor 12 is located in the receiving groove 131 , which can ensure the safety of the processor 12 .
  • the processor 12 can be attached to the bottom surface of the receiving groove 131 of the heat sink 13 , so that the heat generated by the processor 12 can be conducted to the heat sink 13 and dissipated through the heat sink 13 .
  • the processor 12 may be bonded to the bottom surface of the receiving groove 131 of the heat dissipation plate 13 with thermally conductive glue.
  • the thermally conductive adhesive can be made of organic silica gel as the main body, adding polymer materials such as fillers and thermally conductive materials, and kneading the silica gel, which has good thermal conductivity and electrical insulation properties.
  • a plurality of bar-shaped slots 132 are disposed on a side of the heat sink 13 away from the processor 12 .
  • the strip grooves 132 provided on the heat dissipation plate 13 can increase the surface area of the heat dissipation plate 13, thereby improving the heat dissipation efficiency.
  • the number and arrangement of the strip grooves 132 can be determined according to actual design requirements. As shown in FIG. 1 , the strip grooves 132 can extend along the length direction of the heat sink 13 .
  • a plurality of first connectors 14 are disposed on the bearing surface 112 of the bearing board 11 .
  • Each processor 12 is detachably connected to a corresponding first connector 14 , and is electrically connected to the carrier board 11 through the first connector 14 .
  • the first connector 14 has the function of transmitting signals, and the first connector 14 can be designed as a plug-in structure compatible with the processor 12, so as to facilitate the electrically detachable connection between the first connector 14 and the carrier board 11. The connection facilitates the replacement and maintenance of the processor 12.
  • the carrying board 11 may be a strip-shaped board, and a plurality of first connectors 14 may be arranged at intervals along the length direction of the carrying board 11 on the carrying surface 112 . It can be understood that the sizes of processors of different types are different, and the first connectors 14 are arranged at intervals, which can reserve installation space for processors with larger sizes, so as to facilitate replacement of processors of different types.
  • the bearing plate 11 may be a strip-shaped plate, and the first end portion 111 may be an end portion of the bearing plate 11 in the length direction.
  • the processor module 10 may further include a handle 15 connected to the carrier board 11 , and a worker may hold the handle 15 to install and disassemble the processor module 10 .
  • the handle 15 may be disposed at the other end of the carrying plate 11 opposite to the first end 111 in the length direction.
  • an embodiment of the present disclosure also provides a server. As shown in FIG. The first end 111 of 11 is detachably connected to the exchange board 20 .
  • At least one second connector 30 is disposed on the switch board 20 , and the first end 111 of the carrier board 11 in the processor module 10 is detachably connected to the corresponding second connector 30 .
  • the number and positions of the second connectors 30 may be determined according to actual design requirements. It can be understood that the second connector 30 has the function of transmitting signals, and the second connector 30 can be designed as a plug-in structure compatible with the first end 111 of the carrier board 11, so as to facilitate the connection between the second connector 30 and the carrier.
  • the board 11 is electrically detachably connected to facilitate the replacement and maintenance of the processor module 10 .
  • the server further includes a power supply module 40 (Power Supply Unit, PSU).
  • the power module 40 is disposed on the switch board 20 and is electrically connected to the switch board 20 .
  • the number and positions of the power supply modules 40 may be determined according to actual design requirements. It can be understood that the power module 40 can provide power to the processor 12 on the carrier board 11 through the switch board 20 .
  • the server further includes a fan 50 .
  • the fans 50 are arranged on the switch board 20 and are electrically connected to the switch board 20. The number and position of the fans 50 can be determined according to actual design requirements.
  • the fan 50 can accelerate the air flow, can dissipate heat for the processor module 10, and improve heat dissipation efficiency. It can be understood that the power module 40 can provide power to the processor 12 on the fan 50 through the switch board 20 .
  • the server may further include a chassis 60, and components such as the processor module 10 and the switch board 20 may be disposed in the chassis 60 to ensure that these components are not damaged.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种处理器模组及服务器，属于服务器技术领域。处理器模组（10）包括承载板（11）、散热板（13）和多个处理器（12）；承载板具有第一端部（111）、以及垂直于其厚度方向的承载面（112）；处理器（12）设置在承载板（11）的承载面（112）上、并且与承载板（11）电连接；散热板（13）层叠于承载板（11）的承载面（112），且与承载面（112）上的处理器（12）贴合；承载板（11）的第一端部（111）探出于散热板（13）。处理器模组（10）可以通过承载板（11）的第一端部（111）交换板（20）可拆卸地连接，实现了以单个处理器模组（10）为单位进行处理器（12）运维、散热和管理。当某个处理器（12）出现故障时，可以将处理器（12）所在的处理器模组（10）拆下来进行维修，而不必要求整个服务器停机，确保服务器可以持续工作。

Description

处理器模组及服务器 技术领域
本公开涉及服务器技术领域，具体涉及一种处理器模组及服务器。
背景技术
在现有的服务器中，处理器是直接安装交换板上的，一旦交换板上某一个处理器出现故障，需要整个服务器停机后才能对出现故障的处理器进行维护，这会增加服务器整体的故障率高，影响服务器的正常工作。
发明内容
本公开提供了一种处理器模组及服务器。
根据本公开的第一方面，提供了一种处理器模组，包括：
承载板，承载板具有第一端部、以及垂直于其厚度方向的承载面；
多个处理器，处理器设置在承载板的承载面上、并且与承载板电连接；
散热板，散热板层叠于承载板的承载面，且与承载面上的处理器贴合；
承载板的第一端部探出于散热板。
在本公开实施例中，散热板设置有容纳槽；处理器位于容纳槽内，并且与容纳槽的底面贴合。
在本公开实施例中，散热板中远离处理器的一侧设置有多个条形槽。
在本公开实施例中，承载板的承载面上设置有多个第一连接器；
每个处理器与对应的第一连接器可拆卸地连接，并通过第一连接器与承载板电连接。
在本公开实施例中，多个第一连接器在承载面上沿承载板的长度方向间隔设置。
在本公开实施例中，第一端部为承载板长度方向上的一个端部。
在本公开实施例中，承载板和散热板通过螺栓连接。
在本公开实施例中，处理器模组还包括把手，把手与承载板连接。
在本公开实施例中，承载板具有两个垂直于其厚度方向的承载面，每个承载面都设置有处理器；
处理器模组包括两个散热板，每个散热板层叠于承载板中对应的一个承载面，并且与对应的承载面上的处理器贴合。
根据本公开的第二方面，提供了一种服务器，包括：
交换板；
至少一个本公开的第一方面提供的处理器模组，处理器模组中承载板的第一端部与交换板可拆卸地连接。
在本公开实施例中，交换板上设置有至少一个第二连接器；
处理器模组中承载板的第一端部与对应的第二连接器可拆卸地连接。
在本公开实施例中，服务器还包括电源模块；
电源模块设置于交换板，并且与交换板电连接，用于通过交换板为承载板上的处理器提供电能。
在本公开实施例中，服务器还包括风扇；风扇设置于交换板，并且与交换板电连接，用于为处理器模组散热。
应当理解，本部分所描述的内容并非旨在标识本公开的实施例的关键或重要特征，也不用于限制本公开的范围。本公开的其它特征将通过以下的说明书而变得容易理解。
本公开提供的技术方案带来的有益效果是：
在本公开的技术方案中，将多个处理器集成为一个处理器模组，处理器模组可以通过承载板的第一端部交换板可拆卸地连接，实现了以单个处理器模组为单位进行处理器运维、散热和管理。当某个处理器出现故障时，可以将处理器所在的处理器模组拆下来进行维修，而不必要求整个服务器停机，确保服务器可以持续工作，提高了服务的运维工作的便利性。
附图说明
附图用于更好地理解本方案，不构成对本公开的限定。其中：
图1示出了本公开实施例提供的一种处理器模组的结构拆分示意图；
图2示出了包含本公开实施例的处理器模组的服务器的结构示意图。
附图标号的说明如下：
10-处理器模组；
11-承载板；111-第一端部；112-承载面；
12-处理器；13-散热板；131-容纳槽；132-条形槽；
14-第一连接器；15-把手；
20-交换板；30-第二连接器；
40-电源模块；50-风扇；60-机箱。
具体实施方式
以下结合附图对本公开的示范性实施例做出说明，其中包括本公开实施例的各种细节以助于理解，应当将它们认为仅仅是示范性的。因此，本领域普通技术人员应当认识到，可以对这里描述的实施例做出各种改变和修改，而不会背离本公开的范围和精神。同样，为了清楚和简明，以下的描述中省略了对公知功能和结构的描述。
在现有的服务器中，处理器是直接安装交换板上的，一旦交换板上某一个处理器出现故障，需要整个服务器停机后才能对出现故障的处理器进行维护，这会增加服务器整体的故障率高，影响服务器的正常工作。
本公开实施例提供的处理器模组及服务器，旨在解决现有技术的如上技术问题中的至少一个。
本公开实施例提供了一种处理器模组，图1示出了本公开实施例提供的一种处理器模组的结构拆分示意图，图2示出了包含本公开实施例的处理器模组的服务器的结构示意图。如图1和图2所示，处理器模组10包括承载板11、多个处理器12、散热板13。
承载板11具有第一端部111、以及垂直于其厚度方向的承载面112。本公开实施例的承载板11是具有一定厚度的电路板，可以传输电信号，承载面112是承载板11的底面。
处理器12设置在承载板11的承载面112上、并且与承载板11电连接。本公开实施例中的处理器12可以是任一种类型的处理器12，处理器12与承载板11电连接以接收外部的电信号或者向外部发送电信号。
散热板13层叠于承载板11的承载面112，并且与承载面112上的处理器12贴合。散热板13可以由具有较好的导热性能的材料(如铝)制成，处理器12产生的热量可以传导至散热板13，通过散热板13将热量散发出去。
承载板11的第一端部111用于与处理器模组10之外的部件(如交换板20)可拆卸地连接，用于接收外部的电信号或者向外部发送处理器12产生的电信号。因此，承载板11的第一端部111需要探出于散热板13，从而方便与处理器模组10之外的部件连接。
在公开实施例将多个处理器12集成为一个处理器模组10，处理器模组10可以通过承载板11的第一端部111交换板20可拆卸地连接，实现了以单个处理器模组10为单位进行处理器12运维、散热和管理。当某个处理器12出现故障时，可以将处理器12所在的处理器模组10拆下来进行维修，而不必要求整个服务器停机，确保服务器可以持续工作，提高了服务的运维工作的便利性。
可以理解，承载板11具有两个底面，这两个底面都可以作为承载面112，也就是说，承载板11可以具有两个垂直于其厚度方向的承载面112，每个承载面112都可以设置处理器12。处理器模组10包括可以包括两个散热板13，每个散热板13层叠于承载板11中对应的一个承载面112，并且与对应的承载面112上的处理器12贴合。
每个承载面112上设置的处理器12的数量可以根据实际的需要而定，如图1所示，可以在承载面112上设置4个处理器12。如图1所示，在一个处理器模组10中，两个散热板13分别位于承载板11的两侧，每个散热板13与承载板11中的一个承载面112正对，每个散热板13与其所正对的承载面112上的处理器12贴合。可以理解，在装配好的处理器模组10中，承载板11和两个散热板13层叠设置，承载板11位于和两个散热板13之间，承载板11和散热板13之间设置有处理器12。
在本公开实施例中，承载板11和散热板13的连接方式可以根据实际的设计需要而定。例如，承载板11和散热板13通过螺栓连接，也可以通过粘接等方式连接，本公开对此不作限定。
在本公开实施例中，散热板13设置有容纳槽131，处理器12位于容纳槽131内，可以确保处理器12的安全。处理器12可以与散热板13的容纳槽131的底面贴合，从而方便处理器12产生的热量可以传导至散热板13，通过散热板13将热量散发出去。可选地，可以将处理器12通过导热胶贴合到散热板13的容纳槽131的底面。导热胶可以是以有机硅胶为主体，添加填充料、导热材料等高分子材料，混炼而成的硅胶，具有较好的导热、电绝缘性能。
在本公开实施例中，散热板13中远离处理器12的一侧设置有多个条形槽132。散热板13上设置条形槽132可以增加散热板13的表面积，从而提高散热效率。条形槽132的数量和排列可以根据实际的设计需要而定，如图1所示，条形槽132可以沿散热板13的长度方向延伸。
在本公开实施例中，承载板11的承载面112上设置有多个第一连接器14。每个处理器12与对应的第一连接器14可拆卸地连接，并通过第一连接器14与承载板11电连接。可以理解，第一连接器14具有传输信号的功能，第一连接器14可以设计为与处理器12相适配的插拔式结构，从而方便第一连接器14与承载板11电可拆卸地连接，便于处理器12的更换和维护。
在本公开实施例中，承载板11可以是长条形板，多个第一连接器14可以在承载面112上沿承载板11的长度方向间隔设置。可以理解，不同型号的处理器的尺寸是不同的，第一连接器14之间间隔设置，可以为尺寸较大的处理器预留出安装空间，方便更换不同型号的处理器。
在本公开实施例中，承载板11可以是长条形板，第一端部111可以为承载板11长度方向上的一个端部。处理器模组10还可以包括把手15，把手15与承载板11连接，工作人员可以握住把手15进行处理器模组10的安装与拆卸。这里，把手15可以设置在承载板11长度方向上的与第一端部111相对的另一端。
基于同一发明构思，本公开实施例还提供了一种服务器，如图2所示，服务器包括交换板20、以及本公开上述实施例提供的处理器模组10，处理器模组10中承载板11的第一端部111与交换板20可拆卸地连接。
在本公开实施例中，交换板20上设置有至少一个第二连接器30，处理器模组10中承载板11的第一端部111与对应的第二连接器30可拆卸地连接。第二连接器30的数量以及部位位置可以根据实际的设计需要而定。可以理解，第二连接器30具有传输信号的功能，第二连接器30可以设计为与承载板11的第一端部111相适配的插拔式结构，从而方便第二连接器30与承载板11电可拆卸地连接，便于处理器模组10的更换和维护。
在本公开实施例中，服务器还包括电源模块40(Power Supply Unit，PSU)。电源模块40设置于交换板20，并且与交换板20电连接。电源模块40的数量以及部位位置可以根据实际的设计需要而定。可以理解，电源模块40可以通过交换板20为承载板11上的处理器12提供电能。
在本公开实施例中，服务器还包括风扇50。风扇50设置于交换板20，并且与交换板20电连接，风扇50的数量以及部位位置可以根据实际的设计需要而定。风扇50可以加速空气流动，可以为处理器模组10散热，提高散热效率。可以理解，电源模块40可以通过交换板20为风扇50上的处理器12提供电能。
可选地，服务器还可以包括机箱60，处理器模组10和交换板20等部件可以设置在机箱60，以确保这些部件不被损坏。
以上描述仅为本公开的较佳实施例以及对所运用技术原理的说明。本领域技术人员应当理解，本公开中所涉及的实用新型范围，并不限于上述技术特征的特定组合而成的技术方案，同时也应涵盖在不脱离所述实用新型构思的情况下，由上述技术特征或其等同特征进行任意组合而形成的其它技术方案。例如上述特征与本公开中公开的(但不限于)具有类似功能的技术特征进行互相替换而形成的技术方案。

Claims (13)

  1. 一种处理器模组，包括：
    承载板，所述承载板具有第一端部、以及垂直于其厚度方向的承载面；
    多个处理器，所述处理器设置在所述承载板的承载面上、并且与所述承载板电连接；
    散热板，所述散热板层叠于所述承载板的承载面，并且与所述承载面上的所述处理器贴合；
    所述承载板的第一端部探出于所述散热板。
  2. 根据权利要求1所述的处理器模组，其中，所述散热板设置有容纳槽；所述处理器位于所述容纳槽内，并且与所述容纳槽的底面贴合。
  3. 根据权利要求1所述的处理器模组，其中，所述散热板中远离所述处理器的一侧设置有多个条形槽。
  4. 根据权利要求1所述的处理器模组，其中，所述承载板的承载面上设置有多个第一连接器；
    每个所述处理器与对应的所述第一连接器可拆卸地连接，并通过所述第一连接器与所述承载板电连接。
  5. 根据权利要求4所述的处理器模组，其中，所述多个所述第一连接器在承载面上沿所述承载板的长度方向间隔设置。
  6. 根据权利要求4所述的处理器模组，其中，所述第一端部为所述承载板长度方向上的一个端部。
  7. 根据权利要求1所述的处理器模组，其中，所述承载板和所述散热板通过螺栓连接。
  8. 根据权利要求1-7中任一项所述的处理器模组，还包括把手，所述把手与所述承载板连接。
  9. 根据权利要求1-7中任一项所述的处理器模组，其中，所述承载板具有两个垂直于其厚度方向的承载面，每个所述承载面都设置有所述处理器；
    所述处理器模组包括两个所述散热板，每个所述散热板层叠于所述承载板中对应的一个承载面，并且与对应的所述承载面上的所述处理器贴合。
  10. 一种服务器，包括：
    交换板；
    至少一个如权利要求1-9中任一项所述的处理器模组，所述处理器模组中承载板的第一端部与所述交换板可拆卸地连接。
  11. 根据权利要求10所述的服务器，其中，所述交换板上设置有至少一个第二连接器；
    所述处理器模组中承载板的第一端部与对应的所述第二连接器可拆卸地连接。
  12. 根据权利要求10所述的服务器，其中，还包括电源模块；
    所述电源模块设置于所述交换板，并且与所述交换板电连接，用于通过所述交换板为所述承载板上的处理器提供电能。
  13. 根据权利要求10所述的服务器，其中，还包括风扇；
    所述风扇设置于所述交换板，并且与所述交换板电连接，用于为所述处理器模组散热。
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