WO2023045020A1 - Led灯座、led灯珠和led灯带 - Google Patents

Led灯座、led灯珠和led灯带 Download PDF

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Publication number
WO2023045020A1
WO2023045020A1 PCT/CN2021/126835 CN2021126835W WO2023045020A1 WO 2023045020 A1 WO2023045020 A1 WO 2023045020A1 CN 2021126835 W CN2021126835 W CN 2021126835W WO 2023045020 A1 WO2023045020 A1 WO 2023045020A1
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WO
WIPO (PCT)
Prior art keywords
side end
led lamp
track
insulating base
led
Prior art date
Application number
PCT/CN2021/126835
Other languages
English (en)
French (fr)
Inventor
刘明剑
朱更生
吴振雷
周凯
Original Assignee
东莞市欧思科光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 东莞市欧思科光电科技有限公司 filed Critical 东莞市欧思科光电科技有限公司
Priority to US18/064,935 priority Critical patent/US20230115068A1/en
Publication of WO2023045020A1 publication Critical patent/WO2023045020A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
    • H01L27/1207—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI combined with devices in contact with the semiconductor body, i.e. bulk/SOI hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes

Definitions

  • the present application relates to the technical field of light emitting diodes, in particular to an LED lamp holder, an LED lamp bead and an LED lamp strip.
  • light-emitting diodes full name in English: light-emitting diode, referred to as: LED
  • the LED packaging glue is used to package the light-emitting diode and the driver chip in the installation groove of the LED bracket to form a lamp bead, and a plurality of lamp beads are connected to form a light strip through a power line, a signal line, etc., and the signal line inputs signals to control the light.
  • Each lamp bead in the belt emits light, so as to realize various lighting effects.
  • the power line and the signal line are directly welded to the corresponding pins, and then the signal line is cut off from the part between the two pins, thereby obtaining the signal input line and the signal output line, but subject to Limited to the structure and size of the lamp bead, the power line and signal line are prone to false soldering during welding, and the pins are easily deformed or even damaged when the signal line is cut off, resulting in poor reliability of the lamp bead and light strip. There is a risk of failure.
  • the embodiment of the present application provides an LED lamp holder, LED lamp bead and LED lamp strip, aiming to solve the problem that the existing LED lamp holder has poor reliability in the manufacturing process of the lamp bead and the lamp strip, and is prone to failure during use.
  • LED lamp holder including:
  • An insulating base, the insulating base is formed with a cavity for accommodating the LED chip assembly and the LED packaging glue;
  • a plurality of conductive terminals are respectively fixed to the insulating base by injection molding, and each of the conductive terminals has a penetrating hole in the concave cavity for electrically connecting with the LED chip assembly.
  • the pad part of the connection and the pin part exposed outside the insulating base; at least some of the pin parts are spaced apart to form a first pin pair;
  • At least one pair of first pins is arranged along a first track and extends away from the insulating base, and the rest of the pins are arranged along a second track, and the first track and the second track intersect.
  • the insulating base has a first side end and a second side end opposite to the first side end; the first track connects the first side end and the straight line of the second side end, the number of the pin pair is one, and the first pin pair is away from the first side end or the second side end direction extension of the insulating base;
  • the insulating base has a first side end and a second side end opposite to the first side end; the first track is for connecting the first side end and the second side end.
  • the straight line at the side end; the number of the first pair of pins is two, one of the first pair of pins extends from the first side end to the direction away from the insulating base, and the other The first pin pair extends from the second side end in a direction away from the insulating base.
  • the two pin portions of the first pin pair arranged along the first track each have a side wall surface, and the two side wall surfaces face each other, and From the first side end or the second side end to an end away from the insulating base, the distance between the two side wall surfaces is the same or increases gradually.
  • the insulating base is formed with a avoidance part, and the avoidance part is arranged between the two pin parts of the same first pin pair arranged along the first track. between.
  • the insulating base has a bottom end and a top end
  • the escape portion is a notch extending from the bottom end to the top end
  • the opening end of the notch faces the The first side end or the second side end.
  • the orthographic projection of the notch on the bottom end is a polygonal opening or an arc-shaped opening, and the opening of the polygonal opening or the arc-shaped opening faces the first side end or said second side end;
  • the insulating base has a first side end and a second side end opposite to the first side end, and the first track is to connect the first side end and the second side end.
  • the straight line of the side end; the notch has a first surface towards the first side end or the second side end, and the first surface is from the bottom end to the first side end.
  • the insulating base has a first side end and a second side end opposite to the first side end, and the first track is to connect the first side end and the second side end.
  • the notch has a first surface and a second surface, the first surface and the second surface are connected, and the first surface and the second surface are both facing the first side end part or the second side end, the first surface and the second surface move toward the first side end or the second side end with a gradually increasing distance from the point where they are connected Extending, the part where the first surface and the second surface are connected extends toward the direction of the top end with a gradually decreasing distance from the first side end or the second side end;
  • the insulating base has a first side end and a second side end opposite to the first side end, and the first track is to connect the first side end and the second side end.
  • the straight line of the side end; the notch has an arc-shaped surface towards the first side end or the second side end, and the arc-shaped surface from the bottom end to the top end corresponds to The chord length gradually decreases.
  • first track and the second track perpendicularly intersect
  • first track and the second track are coplanar and perpendicularly intersect.
  • the LED lamp holder provided by the embodiment of the present application, since at least some of the pins are spaced two by two into first pin pairs; at least one first pin pair is arranged along the first track and moves away from the insulating base. The rest of the pins are set along the second track, and the first track and the second track intersect, so that when the LED lamp holder is assembled into LED lamp beads and LED strips, the risk of virtual soldering can be effectively reduced, and the pins can be reduced.
  • the risk of internal deformation or even deformation of the LED lamp holder is beneficial to the effective improvement of the reliability and the effective extension of the service life of the LED lamp beads and LED light strips.
  • LED lamp beads including:
  • one of the two pin portions of the first pin pair arranged along the first track is a signal input end, and the other is a signal output end;
  • the LED chip components are installed in the concave cavity of the LED lamp holder, and are electrically connected to a plurality of the pads;
  • the LED encapsulation glue is filled in the cavity and seals the LED chip assembly.
  • the LED chip assembly includes a driver chip and at least one light emitting chip, and the driver chip is electrically connected to the light emitting chip.
  • LED strips including:
  • a wire assembly includes at least two signal wires, one end of one of the signal wires is connected to an external signal source, and the other end is connected to the signal input end of one of the LED lamp beads, so as to connect the LED lamp beads Input signal; two adjacent LED lamp beads are connected through another said signal line, so that the signal is transmitted in cascade between the LED lamp beads.
  • the wire assembly further includes a power line; the power line is electrically connected to the pin part arranged along the second track.
  • the LED lamp holder provided by the embodiment of the present application, since at least some of the pins are spaced two by two into first pin pairs; at least one first pin pair is arranged along the first track and moves away from the insulating base. The rest of the pins are set along the second track, and the first track and the second track intersect, so that when the LED lamp holder is assembled into LED lamp beads and LED strips, the risk of virtual soldering can be effectively reduced, and the pins can be reduced.
  • the risk of internal deformation or even deformation of the LED lamp holder is beneficial to the effective improvement of the reliability and the effective extension of the service life of the LED lamp beads and LED light strips.
  • the LED lamp bead provided by the embodiment of the present application, since at least some of the pins in the LED lamp holder are spaced into first pin pairs; at least one first pin pair is arranged along the first track And it extends away from the insulating base, and the rest of the pins are arranged along the second track, and the first track and the second track intersect, so that when the LED lamp beads are assembled into an LED light strip, the risk of virtual soldering can be effectively reduced, and the lead-in
  • the risk of deformation of the feet or even the deformation of the LED lamp holder is beneficial to the effective improvement of the reliability and the effective extension of the service life of the LED lamp beads and LED light strips.
  • the LED light strip provided by the embodiment of the present application has a low welding rate of the LED lamp beads constituting the LED light strip, and there is no risk of deformation of the pin portion and deformation of the LED lamp holder, so that the LED light strip has High reliability and long service life.
  • FIG. 1 is a schematic diagram of the three-dimensional structure of an LED lamp holder provided in Embodiment 1 of the present application;
  • Fig. 2 is a schematic top view of the LED lamp holder provided in Embodiment 1 of the present application;
  • Fig. 3 is a schematic bottom view of the LED lamp holder provided in Embodiment 1 of the present application;
  • FIG. 4 is a schematic diagram of the three-dimensional structure of the LED lamp bead provided in Embodiment 1 of the present application;
  • Fig. 5 is a schematic diagram of the manufacturing process of the LED light strip provided in Embodiment 1 of the present application.
  • FIG. 6 is a schematic diagram of the three-dimensional structure of the LED light strip provided in Embodiment 1 of the present application.
  • Fig. 7 is a schematic diagram of the three-dimensional structure of the LED lamp holder provided in Embodiment 2 of the present application;
  • Fig. 8 is a schematic diagram of the three-dimensional structure of the LED lamp holder provided by Embodiment 3 of the present application.
  • FIG. 9 is a schematic diagram of the three-dimensional structure of the LED lamp holder provided in Embodiment 4 of the present application.
  • Fig. 10 is a schematic diagram of the three-dimensional structure of the LED lamp holder provided in Embodiment 5 of the present application;
  • Fig. 11 is a schematic bottom view of the LED lamp holder provided in Embodiment 6 of the present application.
  • Fig. 12 is a schematic bottom view of the LED lamp holder provided in the seventh embodiment of the present application.
  • Fig. 13 is a schematic bottom view of an LED lamp holder provided by another embodiment of Embodiment 7 of the present application.
  • Fig. 14 is a schematic bottom view of an LED lamp holder provided in yet another implementation manner of Embodiment 7 of the present application.
  • LED lamp holder 11. Insulation base; 110. Recess; 111. First side end; 1110. Avoidance part; 112. Second side end; 113. Top part; , conductive terminal; 120, the first pin pair; 121, pad part; 122, pin part; 1220, side wall surface; 123, connecting part; 124, transition part;
  • LED light strip 31. wire assembly; 311. signal line; 3110. punching part; 312. power line.
  • FIGS. 1 to 6 The structural diagrams of the LED lamp holder 10 , the LED lamp bead 20 , the LED lamp strip 30 and the corresponding components provided in this embodiment are shown in FIGS. 1 to 6 .
  • the LED lamp holder 10 of this embodiment includes an insulating base 11 and a plurality of conductive terminals 12 .
  • the insulating base 11 is formed with a concave cavity 110, and the concave cavity 110 is used to accommodate the LED chip assembly 21 and the LED encapsulant (not shown in the figure); a plurality of conductive terminals 12 are respectively fixed on the insulating base 11 by injection molding.
  • each conductive terminal 12 has a pad portion 121 and a pin portion 122, and the pad portion 121 is connected to the pin portion 122, wherein the pad portion 121 is penetrated in the cavity 110 for connecting with the LED chip
  • the components 21 are electrically connected, and the pins 122 are exposed outside the insulating base 11. At least some of the pins 122 are spaced apart to form the first pin pair 120; at least one first pin pair 120 is arranged along the first track PQ And extending away from the insulating base 11 , the remaining pin portions 122 are arranged along the second track RS, and the first track PQ intersects the second track RS.
  • the wires When the wires are soldered to the LED lamp holder 10, all the wires extend along the second track RS, and at least one wire is pasted along the first Two pin portions 122 of a first pin pair 120 set on the track PQ, and the remaining wires are attached to at least one pin portion 122 along the second track RS, so as to facilitate welding the wires on the LED lamp holder 10
  • the pin portion 122 reduces the phenomenon of missing soldering, virtual soldering or weak soldering, so that the soldering reliability of the wires is effectively improved.
  • a first pair of pins 120 arranged along the first track PQ extends in a direction away from the insulating base 11, and there is an interval between the two pin portions 122 of the first pair of pins 120, there is It is beneficial to punch the wire welded to the pin pair 120 arranged along the first track PQ, and the punching process will not be affected by the spatial structure of the LED lamp holder 10, nor will it cause deformation of the LED lamp holder 10, effectively improving The reliability of wire punching is improved, and the precision requirements for punching equipment are reduced.
  • the effects of the two aspects are conducive to improving the reliability of the processing of LED lamp beads 20 and LED light strips 30, improving the product qualification rate, and at the same time helping to improve The reliability of the LED lamp bead 20 and the LED lamp strip 30 during use.
  • the insulating base 11 has a first side end 111 , a second side end 112 , a top end 113 and a bottom end 114 , wherein the first side The end portion 111 and the second side end portion 112 are arranged oppositely, the top end portion 113 and the bottom end portion 114 are arranged oppositely, the first track PQ is a straight line connecting the first side end portion 111 and the second side end portion 112, one of the first The pin pairs 120 are arranged along the first track PQ, and the first pin pairs 120 arranged along the first track PQ extend from the first side end portion 111 or the second side end portion 112 to a direction away from the insulating base 11 .
  • first pair of pins 120 is arranged along the first track PQ, and when the obtained LED lamp holder 10 is manufactured into LED lamp beads 20 and LED lamp strips 30, the welding process only needs to The wires of the first pair of pins 120 arranged along the first track PQ are punched such that the wires connected between the two lead parts 122 of the first pair of pins 120 extending along the first track PQ are cut.
  • the first trajectory PQ and the second trajectory RS intersect vertically.
  • the structural design that the first track PQ and the second track RS vertically intersect that is, the first pin pair 120 arranged along the first track PQ and the pin part 122 arranged along the second track RS are perpendicular to each other, so that the plurality of wires along the When the second track RS is placed, the wires connected to the first pair of pins 120 arranged along the first track PQ are perpendicular to the first pin portion 122 arranged along the first track PQ, which can facilitate the connection between the wires and the first pin pair 120.
  • the soldering of the pair of pins 120 is also conducive to the subsequent punching of the wires connected to the first pair of pins 120 arranged along the first track PQ, effectively reducing the damage to the first pair of pins 120 due to the punching of the wires.
  • the tensile stress generated by the two pin parts 122 can avoid the deformation of the pin parts 122 caused by punching the wire.
  • the first track PQ and the second track RS are coplanar and perpendicularly intersect, which facilitates the placement and processing of multiple wires along the second track RS, and improves processing reliability.
  • a plurality of conductive terminals 12 are fixed in the insulating base 11 by injection molding, specifically insert injection molding.
  • the specific production process of insert injection molding is to load a plurality of pre-prepared conductive terminals 12 into the mold.
  • the conductive terminals 12 can be made of metal such as copper, and then inject resin into the mold, and the molten resin is bonded to the conductive terminals 12 to solidify.
  • the resin is a thermoplastic resin, such as polyphthalamide (Polyphthalamide; PPA), poly 1,4-cyclohexanedimethylene terephthalate (Poly 1,4-cyclohexylene dimethylene terephthalate, PCT), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), etc.
  • PPA polyphthalamide
  • PAT poly 1,4-cyclohexanedimethylene terephthalate
  • PET polyethylene terephthalate
  • PBT polybutylene terephthalate
  • each conductive terminal 12 further includes a connecting portion 123 , and the pad portion 121 and the pin portion 122 are connected through the connecting portion 123 .
  • the connecting portion 123 is arranged along the direction from the top end portion 113 to the bottom end portion 114, and the pin portion 122 is partially exposed at the bottom end portion 114.
  • the pad portion 121, the pin portion 122 and the connection portion 123 of each conductive terminal 12 are integrally formed.
  • the plurality of conductive terminals 12 are spaced apart from each other, so as to avoid short circuit caused by electrical connection with each other.
  • the pin portions 122 arranged along the second track RS are also spaced in pairs for being electrically connected to the power line 312 , the ground line and other wires.
  • the conductive terminal 12 including the first pair of pins 120 arranged along the first track PQ further includes a transition portion 124, and the transition portion 124 is used to connect to the pin portion 122 and The transition portion 124 between the connection portions 123 can effectively improve the reliability of the conductive terminal 12 on the insulating base 11 .
  • the transition portion 124 is attached to the bottom end portion 114, and one end extends to the first side end portion 111 or the second side end portion 112 to connect with the pin portion 122, and part of the edge is connected to the connecting portion 123, so that The reliability of punching the first pair of pins 120 arranged along the first trajectory PQ is improved.
  • the pad portion 121 of the conductive terminal 12, the connecting portion 123, the transition portion 124, and the pin portion 122 are integrally formed, that is, the pad portion 121 of the conductive terminal 12 is from the cavity 110 to the side of the insulating base 11.
  • the transition portion 124 Extend in the direction where the end portion is and bend at the side end portion of the insulating base 11 and extend toward the direction where the bottom end portion 114 is located to form a connecting portion 123 , and the connecting portion 123 is bent at the intersection of the side end portion and the bottom end portion 114 To extend along the second track RS to form a transition portion 124, the transition portion 124 is attached to the bottom end portion 114, and one end of the transition portion 124 extends to the first side end portion 111 or the second side end portion 112 along the first track PQ to The pin portion 122 is formed.
  • the two pin portions 122 of the first pin pair 120 arranged on the first track PQ each have a side wall surface 1220, and the two side wall surfaces 1220 are facing each other, and From the first side end portion 111 or the second side end portion 112 to an end away from the insulating base 11 , the distances between the two side wall surfaces 1220 are the same.
  • this embodiment also provides an LED lamp bead 20 .
  • the LED lamp bead 20 includes the LED lamp holder 10, the LED chip assembly 21 and the LED encapsulant, wherein the first pin pair 120 arranged along the first track PQ includes two pin portions 122, one of which is 122 is a signal input terminal, and another pin part 122 is a signal output terminal; and a plurality of pin parts 122 arranged along the second track RS may include a power input terminal, a power output terminal, and a ground terminal.
  • the LED chip assembly 21 is installed in the concave cavity 110 of the LED lamp holder 10 and is electrically connected to a plurality of pads 121 .
  • the LED encapsulant is filled in the cavity 110 and seals the LED chip assembly 21 .
  • the LED lamp bead 20 has a first pin pair 120 arranged along the first track PQ, and one pin part 122 in the first pin pair 120 is a signal input end, and the other pin part 122 It is a signal output terminal, which is convenient for multiple LED lamp beads 20 to be cascaded.
  • the external signal source inputs a signal to the first LED lamp bead 20 through the signal line 311, because the first LED lamp bead 20
  • the LED lamp bead 20 and the second LED lamp bead 20 are connected by a signal line 311, so that the signal input to the first LED lamp bead 20 is transmitted to the second LED lamp bead 20, and the second LED lamp bead 20 and The third LED lamp bead 20 is connected by a signal line 311, so that the signal input to the second LED lamp bead 20 is transmitted to the third LED lamp bead 20, ..., the n-1th LED lamp bead 20 and The nth LED lamp bead 20 is connected through the signal line 311, so as to realize the transmission of the signal input to the n-1th LED lamp bead 20 to the nth LED lamp bead 20; multiple LED lamp beads 20 are connected according to this mode And signal transmission, that is, cascading.
  • the LED chip assembly 21 includes a driver chip 211 and at least one light emitting chip 212 , and the driver chip 211 is electrically connected to the light emitting chip 212 .
  • the driving chip 211 is an IC chip, and the driving chip 211 is connected to the signal input end and the signal output end respectively.
  • the light emitting chip 212 includes a blue LED chip, a green LED chip, a red LED chip, a white LED chip and the like. Specifically, the number of light-emitting chips 212 and the type of light-emitting chips 212 can be set according to application scenarios, so that different light-emitting effects can be obtained.
  • the driving chip 211 is electrically connected to the pad part 121 through a bonding wire (not shown in the figure), and the light-emitting chip 212 is electrically connected to the pad part 121 through a bonding wire.
  • the chip 211 and the light emitting chip 212 are connected by bonding wires.
  • the bonding wires include gold wires, copper wires, palladium-coated copper wires, and alloy wires.
  • this embodiment provides a manufacturing method of the LED lamp strip 30 .
  • the manufacture of the LED light strip 30 involves the LED lamp bead 20 and the wire assembly 31.
  • the wire assembly 31 includes a plurality of wires, and the wires are wrapped with a protective layer. Then weld with each first pin pair 120 and other pin parts 122, and then make a light-conducting adhesive structure after welding, which can wrap the part of the wire without insulation, each pin and the solder joint.
  • the material of the wire assembly 31 can be copper wire, copper enameled wire, silicone rubber copper wire and the like.
  • At least two LED lamp beads 20 are placed on the wire assembly 31 at intervals along the second track RS, and the first pin pair 120 of the LED lamp bead 20 is connected to a wire, and the remaining pins 122 are correspondingly connected to each other.
  • a wire is welded subsequently, so that one wire is correspondingly welded with a first pair of pins 120, and the remaining wires are correspondingly welded with one pin portion 122 or two pin portions 122.
  • the welding is set along the first track PQ.
  • the wires of the first pair of pins 120 are formed with a punching part 3110 between the two pin parts 122 of the first pair of pins 120 .
  • this embodiment also provides an LED light strip 30 .
  • the LED light strip 30 includes a wire assembly 31 and at least two LED lamp beads 20; the wire assembly 31 is extended along the second track RS, and at least two LED lamp beads 20 are arranged on the wire assembly 31 along the second track RS at intervals;
  • the wire assembly 31 includes at least two signal wires 311, one end of one signal wire 311 is connected to an external signal source, and the other end is connected to the signal input end of one of the LED lamp beads 20, so as to input signals to the LED lamp bead 20;
  • the two LED lamp beads 20 are connected through another signal line 311 , so that the signals are transmitted in cascade between at least two LED lamp beads 20 .
  • the wire assembly 31 further includes a power line 312 ; the power line 312 is electrically connected to the pin portion 122 arranged along the second track RS.
  • the wire assembly 31 further includes a ground wire electrically connected to the pin portion 122 disposed along the second track RS.
  • the LED strip 30 includes two LED lamp beads 20 , three signal wires 311 , a power wire 312 and a ground wire (not shown in the figure).
  • One end of the first signal line 311 is connected to an external signal source, the other end is welded to the signal input end of the first LED lamp bead 20, and one end of the second signal line 311 is connected to the signal of the first LED lamp bead 20.
  • the output end and the other end are connected to the signal input end of the second LED lamp bead 20, one end of the third signal line 311 is connected to the signal output end of the second LED lamp bead 20, and the power line 312 connects the first LED lamp bead
  • the bead 20 and the second LED bead 20 are connected in series, and the ground wire connects the first LED bead 20 and the second LED bead 20 to ground respectively.
  • the control command sends an instruction from the first signal line 311 to the first LED lamp bead 20, and the first LED lamp bead 20 receives the instruction sent to the first LED lamp bead 20, and drives the first LED lamp bead 20.
  • the light-emitting chip 212 of the LED lamp bead 20 emits light, and at the same time, the instruction transmitted to the second LED lamp bead 20 is transmitted to the second LED lamp bead 20 along the second signal line 311, and is transmitted by the second LED lamp bead 20 Receive and drive the light-emitting chip 212 of the second LED lamp bead 20 to emit light.
  • this is only a partial example of the LED light strip 30, and more LED light beads 20 can also be connected in series to the LED light strip 30, such as the signal input end of the third LED light bead 20 is connected to the third signal line 311, other
  • the LED lamp beads 20 are arranged at intervals along the second track RS according to this connection mode, so as to achieve more lighting effects.
  • the difference between the LED lamp holder 10, the LED lamp bead 20 and the LED light strip 30 provided in this embodiment and the first embodiment mainly lies in the following structural differences:
  • the insulating base 11 is not formed with the escape portion 1110 .
  • the insulating base 11 is formed with an escape portion 1110 disposed between two pin portions 122 of the first pin pair 120 disposed along the first track PQ.
  • the escape portion 1110 is a notch extending from the bottom end portion 114 to the top end portion 113 , and the opening end of the notch faces the first side end portion 111 or the second side end portion 112 .
  • the orthographic projection of the notch on the bottom end 114 is a polygonal opening or an arc-shaped opening, and the polygonal or arc-shaped openings are all facing the first side end 111 or the second side end 112 . Designing the escape portion 1110 as a notch extending from the bottom end portion 114 to the top end portion 113 can facilitate feeding of the punching equipment along the bottom end portion 114 to the top end portion 113 .
  • the polygonal openings include square openings, triangular openings, or other polygonal shapes.
  • the arc-shaped openings include arc-shaped openings or semicircular openings.
  • the orthographic projection of the notch on the bottom end 114 refers to the projection formed on the plane where the bottom end 114 is located when the parallel projection line is irradiated to the bottom end 114 perpendicular to the top end 113 .
  • the LED lamp holder 10, LED lamp bead 20 and LED light strip 30 provided in Embodiment 2 can be designed correspondingly with reference to Embodiment 1. To save space, it is not described here Let's expand on that.
  • the difference between the LED lamp holder 10, the LED lamp bead 20 and the LED light strip 30 provided in this embodiment and the second embodiment mainly lies in the following structural differences:
  • the orthographic projection of the notch on the bottom end 114 is square, triangular or arc-shaped in orthographic projection.
  • the notch has a first surface facing the first side end 111 or the second side end 112, and the first surface is from the bottom end 114 to the first side end 111 or the second side end.
  • the tendency of the distance 112 to gradually decrease extends toward the direction of the tip portion 113 .
  • the notch is designed in such a structure that punching can be realized by controlling the feed depth of the punching equipment, which can save energy and improve punching precision.
  • the structural strength of the LED lamp holder 10 can be guaranteed, and at the same time, the existence of the avoidance portion 1110 does not need to modify the structure of the existing concave cavity 110, so the addition of the avoidance portion 1110 does not affect the original light emitting effect of the LED lamp holder 10 .
  • the LED lamp holder 10, LED lamp bead 20 and LED light strip 30 provided in Embodiment 3 can refer to the corresponding design of Embodiment 2. To save space, they are not described here. Let's expand on that.
  • the difference between the LED lamp holder 10, the LED lamp bead 20 and the LED light strip 30 provided in this embodiment and the second embodiment mainly lies in the following structural differences:
  • the orthographic projection of the notch on the bottom end 114 is a polygonal opening or an arc-shaped opening in the orthographic projection.
  • the notch has an arcuate surface toward the first side end 111 or the second side end 112, and the chord length corresponding to the arcuate surface from the bottom end 114 to the top end 113 gradually decreases, that is, along the The notch is cross-cut along a direction perpendicular to the bottom end 114 to the top end 113 to obtain an arc-shaped section, and the chord length of the arc-shaped section gradually decreases from the bottom end 114 to the top end 113 .
  • the notch is designed in such a structure that the outside of the punching equipment can be designed as a conical structure, and the punching point is a cone top, which reduces the contact area between the punching equipment and the wire, and forms a punching pressure with a smaller punching area To achieve a better punching effect.
  • the structural strength of the LED lamp holder 10 can be guaranteed, and the existence of the avoidance portion 1110 does not need to modify the structure of the existing cavity 110, so adding the avoidance portion 1110 does not affect the original light emitting effect of the LED lamp holder 10.
  • the LED lamp holder 10, LED lamp bead 20, and LED light strip 30 provided in Embodiment 4 can refer to the corresponding design of Embodiment 2. In order to save space, it is not repeated here. Let's expand on that.
  • the difference between the LED lamp holder 10, the LED lamp bead 20 and the LED light strip 30 provided in this embodiment and the second embodiment mainly lies in the following structural differences:
  • the orthographic projection of the notch on the bottom end 114 is square, triangular or arc-shaped in orthographic projection.
  • the notch has a first surface and a second surface, and the first surface and the second surface face the first side end 111 or the second side end 112, the first surface and the second surface are connected, and the second surface
  • the first surface and the second surface extend toward the first side end 111 or the second side end 112 from the part where the two are connected to the first side end 111 or the second side end 112 at a gradually increasing distance, and the part where the first surface and the second surface are connected is to be connected to the first side
  • the trend of gradually decreasing distance between the end portion 111 or the second side end portion 112 extends toward the top end portion 113 .
  • the structural strength of the LED lamp holder 10 can be ensured, and the existence of the avoiding portion 1110 does not need to modify the structure of the existing cavity 110 , so adding the avoiding portion 1110 does not affect the original light emitting effect of the LED lamp holder 10 .
  • the LED lamp holder 10, LED lamp bead 20 and LED light strip 30 provided in the fifth embodiment can refer to the corresponding design of the second embodiment. Let's expand on that.
  • the difference between the LED lamp holder 10, the LED lamp bead 20 and the LED light strip 30 provided in this embodiment and the first embodiment mainly lies in the following structural differences:
  • first pin pair 120 there is only one first pin pair 120 arranged along the first track PQ in the structure of the LED lamp holder 10 .
  • the number of the first pair of pins 120 arranged along the first track PQ is two, and one of the first pair of pins 120 is away from the insulating base from the first side end 111. 11 , another first pair of pins 120 extends from the second side end 112 to a direction away from the insulating base 11 .
  • Such a structural design is applicable to the LED light strip 30 that needs to punch two wires in the wire assembly 31 .
  • the LED lamp holder 10, LED lamp bead 20 and LED light strip 30 provided in Embodiment 6 can be designed correspondingly with reference to Embodiment 1. In order to save space, it is not repeated here Let's expand on that.
  • the difference between the LED lamp holder 10, the LED lamp bead 20 and the LED light strip 30 provided in this embodiment and the first embodiment mainly lies in the following structural differences:
  • the two pin portions 122 of the first pin pair 120 arranged along the first track PQ each have a side wall surface 1220, and the side wall surfaces 1220 of the two pin portions 122 are facing each other, and from the first From one side end 111 or the second side end 112 to an end away from the insulating base 11 , the distances between the two side wall surfaces 1220 are the same. However, in this embodiment, from the first side end 111 or the second side end 112 to the end away from the insulating base 11, the distance between the two side wall surfaces 1220 increases gradually, wherein, as shown in FIG.
  • the side wall surface 1220 is an inclined plane from the first side end portion 111 to the end away from the insulating base 11; the side wall surface 1220 shown in FIG. 13 is an arc-shaped curved surface from the first side end portion 111 to the end away from the insulating base 11; The side wall surface 1220 shown in FIG. 14 is an arc-shaped curved surface, and the two pin portions 122 are arranged in a “eight” shape from the first side end portion 111 to the end away from the insulating base 11 .
  • a good avoidance portion 1110 can be formed between the two pin portions 122 of the first pin pair 120 arranged along the first track PQ, so that the pair of punching equipment can be connected across the two pin pairs 120.
  • the wires between the pins 122 are punched, which not only ensures that the LED lamp holder 10 will not be affected during the punching process, but also does not affect the LED because the structure of the existing cavity 110 does not need to be modified.
  • Embodiment 7 Except that the above-mentioned structural setting scheme is different from that of Embodiment 1, the LED lamp holder 10, LED lamp bead 20 and LED light strip 30 provided in Embodiment 7 can be designed correspondingly with reference to Embodiment 1. To save space, it is not repeated here Let's expand on that.

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Abstract

一种LED灯座（10）、LED灯珠（20）和LED灯带（30），涉及发光二极管技术领域。LED灯座（10）包括绝缘基座（11）和多个通过注塑成型固定于绝缘基座（11）的导电端子（12）；绝缘基座（11）形成有用于容置LED芯片组件（21）和LED封装胶的凹腔（110）；每个导电端子（12）具有穿设于凹腔（110）内以用于与LED芯片组件（21）电性连接的焊盘部（121）和露于绝缘基座（11）外的引脚部（122）；至少部分引脚部（122）两两间隔组成第一引脚对（120）；至少一个第一引脚对（120）沿第一轨迹（PQ）设置且朝远离绝缘基座（11）的方向延伸，其余引脚部（122）沿第二轨迹（RS）设置，第一轨迹（PQ）和第二轨迹（RS）相交。LED灯座（10）在组装成LED灯珠（20）及LED灯带（30）时，可有效降低虚焊、引脚变形甚至LED灯座（10）变形的风险，有利于LED灯珠（20）及LED灯带（30）可靠性的有效提高和寿命的延长。

Description

LED灯座、LED灯珠和LED灯带 技术领域
本申请涉及发光二极管技术领域，尤其涉及一种LED灯座、LED灯珠和LED灯带。
背景技术
随着经济的迅猛发展，发光二极管(英文全称：light-emitting diode，简称：LED)已经由原来仅用于照明或指示发展至品牌宣传、企业宣传及城市美化等领域中。具体是采用LED封装胶将发光二极管和驱动芯片封装于LED支架的安装槽中以形成灯珠，通过电源线、信号线等将多个灯珠经过连接形成灯带，信号线输入信号以控制灯带中各个灯珠发光，从而实现多种发光效果。在装配和使用过程中，电源线和信号线分别直接与对应的引脚焊接，再将信号线从位于两个引脚之间的部分切断，由此获得信号输入线和信号输出线，但是受限于灯珠的结构和尺寸，电源线、信号线在焊接时容易出现虚焊，信号线切断时引脚容易变形甚至损坏等问题，导致灯珠及灯带可靠性较差，在寿命期内有失效的风险。
技术问题
本申请实施例提供一种LED灯座、LED灯珠和LED灯带，旨在解决现有LED灯座导致灯珠及灯带制造过程中可靠性较差，在使用时易失效的问题。
技术解决方案
本申请的目的之一提供的技术方案如下：
LED灯座，包括：
绝缘基座，所述绝缘基座形成有用于容置LED芯片组件和LED封装胶的凹腔；
多个导电端子，所述多个导电端子分别通过注塑成型方式固定于所述绝缘基座，且每个所述导电端子具有穿设于所述凹腔内以用于与所述LED芯片组件电性连接的焊盘部和露于所述绝缘基座外的引脚部；至少部分所述引脚部两两间隔组成第一引脚对；
至少一个所述第一引脚对沿第一轨迹设置且朝远离所述绝缘基座的方向延伸，其余所述引脚沿第二轨迹设置，所述第一轨迹和所述第二轨迹相交。
在一种可能的实施方式中，所述绝缘基座具有第一侧端部和与所述第一侧端 部相对设置的第二侧端部；所述第一轨迹为连接所述第一侧端部和所述第二侧端部的直线，所述引脚对的数量为一个，所述第一引脚对自所述第一侧端部或所述第二侧端部向远离所述绝缘基座的方向延伸；
或者，所述绝缘基座具有第一侧端部和与所述第一侧端部相对设置的第二侧端部；所述第一轨迹为连接所述第一侧端部和所述第二侧端部的直线；所述第一引脚对的数量为两个，其中一个所述第一引脚对自所述第一侧端部向远离所述绝缘基座的方向延伸，另一个所述第一引脚对自所述第二侧端部向远离所述绝缘基座的方向延伸。
在一种可能的实施方式中，沿所述第一轨迹设置的所述第一引脚对的两个所述引脚部各自具有一个侧壁面，两个所述侧壁面相互正对，且自所述第一侧端部或所述第二侧端部至远离所述绝缘基座的一端，两个所述侧壁面之间的距离相同或者逐渐增大。
在一种可能的实施方式中，所述绝缘基座形成有避让部，所述避让部设于沿所述第一轨迹设置的同一所述第一引脚对的两个所述引脚部之间。
在一种可能的实施方式中，所述绝缘基座具有底端部和顶端部，所述避让部为从所述底端部向所述顶端部延伸的缺口，所述缺口的开口端朝向所述第一侧端部或所述第二侧端部。
在一种可能的实施方式中，所述缺口在所述底端部的正投影呈多边形开口或弧形开口，且所述多边形开口或所述弧形开口的开口朝向所述第一侧端部或者所述第二侧端部；
或者，所述绝缘基座具有第一侧端部和与所述第一侧端部相对设置的第二侧端部，所述第一轨迹为连接所述第一侧端部和所述第二侧端部的直线；所述缺口具有朝向所述第一侧端部或所述第二侧端部的第一表面，所述第一表面自所述底端部以与所述第一侧端部或所述第二侧端部的距离逐渐减小的趋势向所述顶端部的方向延伸；
或者，所述绝缘基座具有第一侧端部和与所述第一侧端部相对设置的第二侧端部，所述第一轨迹为连接所述第一侧端部和所述第二侧端部的直线；所述缺口具有第一表面及第二表面，所述第一表面和所述第二表面连接，所述第一表面和所述第二表面均朝向所述第一侧端部或所述第二侧端部，所述第一表面和所述第 二表面自两者相连的部位以间距逐渐增大的趋势向所述第一侧端部或者所述第二侧端部延伸，所述第一表面和所述第二表面相连的部位以与所述第一侧端部或所述第二侧端部的距离逐渐减小的趋势向所述顶端部的方向延伸；
或者，所述绝缘基座具有第一侧端部和与所述第一侧端部相对设置的第二侧端部，所述第一轨迹为连接所述第一侧端部和所述第二侧端部的直线；所述缺口具有朝向所述第一侧端部或所述第二侧端部的圆弧形表面，自所述底端部至所述顶端部所述圆弧形表面对应的弦长逐渐减小。
在一种可能的实施方式中，所述第一轨迹和所述第二轨迹垂直相交；
或者，所述第一轨迹和所述第二轨迹共面垂直相交。
相对于现有技术而言，本申请实施例提供的LED灯座由于至少部分引脚部两两间隔成第一引脚对；至少一个第一引脚对沿第一轨迹设置且朝远离绝缘基座的方向延伸，其余引脚部沿第二轨迹设置，第一轨迹和第二轨迹相交，使得LED灯座在组装成LED灯珠以及LED灯带时，可有效降低虚焊风险，降低引脚部变形甚至LED灯座变形的风险，从而有利于LED灯珠以及LED灯带可靠性的有效提高和使用寿命的有效延长。
本申请的目的之二提供的技术方案如下：
LED灯珠，包括：
上述第一方面的LED灯座，沿所述第一轨迹设置的一个所述第一引脚对的两个所述引脚部中的一者为信号输入端、另一者为信号输出端；
LED芯片组件，所述LED芯片组件安装于所述LED灯座的凹腔中，且与多个所述焊盘部电性连接；
LED封装胶，所述LED封装胶填充于所述凹腔中并密封所述LED芯片组件。
在一种可能的实施方式中，所述LED芯片组件包括驱动芯片和至少一种发光芯片，所述驱动芯片与所述发光芯片电性连接。
本申请的目的之三提供的技术方案如下：
LED灯带，包括：
至少两个如上所述的LED灯珠；至少两个所述LED灯珠沿所述第二轨迹间隔设置；
导线组件，所述导线组件包括至少两条信号线，其中一条所述信号线的一端 与外部信号源连接、另一端与其一个所述LED灯珠的信号输入端连接，以向所述LED灯珠输入信号；相邻两个所述LED灯珠之间通过另一条所述信号线连接，以使信号在所述LED灯珠之间级联传输。
在一种可能的实施方式中，所述信号线与所述绝缘基座具有间距；
和/或，所述导线组件还包括电源线；所述电源线与沿所述第二轨迹设置的所述引脚部电性连接。
有益效果
相对于现有技术而言，本申请实施例提供的LED灯座由于至少部分引脚部两两间隔成第一引脚对；至少一个第一引脚对沿第一轨迹设置且朝远离绝缘基座的方向延伸，其余引脚部沿第二轨迹设置，第一轨迹和第二轨迹相交，使得LED灯座在组装成LED灯珠以及LED灯带时，可有效降低虚焊风险，降低引脚部变形甚至LED灯座变形的风险，从而有利于LED灯珠以及LED灯带可靠性的有效提高和使用寿命的有效延长。
相对于现有技术而言，本申请实施例提供的LED灯珠，由于LED灯座中至少部分引脚部两两间隔成第一引脚对；至少一个第一引脚对沿第一轨迹设置且朝远离绝缘基座的方向延伸，其余引脚部沿第二轨迹设置，第一轨迹和第二轨迹相交，使得LED灯珠在组装成LED灯带时，可有效降低虚焊风险，降低引脚部变形甚至LED灯座变形的风险，从而有利于LED灯珠以及LED灯带可靠性的有效提高和使用寿命的有效延长。
相对于现有技术而言，本申请实施例提供的LED灯带，由于构成LED灯带的LED灯珠虚焊率低，无引脚部变形以及LED灯座变形的风险，使得LED灯带具有较高的可靠性和较长的使用寿命。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例一提供的LED灯座的立体结构示意图；
图2为本申请实施例一提供的LED灯座的俯视示意图；
图3为本申请实施例一提供的LED灯座的仰视示意图；
图4为本申请实施例一提供的LED灯珠的立体结构示意图；
图5为本申请实施例一提供的LED灯带的制造流程示意图；
图6为本申请实施例一提供的LED灯带的立体结构示意图；
图7为本申请实施例二提供的LED灯座的立体结构示意图；
图8为本申请实施例三提供的LED灯座的立体结构示意图；
图9为本申请实施例四提供的LED灯座的立体结构示意图；
图10为本申请实施例五提供的LED灯座的立体结构示意图；
图11为本申请实施例六提供的LED灯座的仰视示意图；
图12为本申请实施例七一实施方式提供的LED灯座的仰视示意图；
图13为本申请实施例七另一实施方式提供的LED灯座的仰视示意图；
图14为本申请实施例七又一实施方式提供的LED灯座的仰视示意图。
附图标记：
10、LED灯座；11、绝缘基座；110、凹腔；111、第一侧端部；1110、避让部；112、第二侧端部；113、顶端部；114、底端部；12、导电端子；120、第一引脚对；121、焊盘部；122、引脚部；1220、侧壁面；123、连接部；124、过渡部；
PQ：第一轨迹；RS：第二轨迹；
20、LED灯珠；21、LED芯片组件；211、驱动芯片；212、发光芯片；
30、LED灯带；31、导线组件；311、信号线；3110、冲切部；312、电源线。
本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
实施例一
本实施例提供的LED灯座10、LED灯珠20以及LED灯带30及相应的零部件的结构示意图如图1至图6所示。
请参阅图1、图2以及图3，本实施例的LED灯座10包括绝缘基座11和多个导电端子12。其中，绝缘基座11形成有凹腔110，凹腔110用于容置LED芯片组件21和LED封装胶(图中未标示)；多个导电端子12分别通过注塑成型方式固定于绝缘基座11，每个导电端子12都具有焊盘部121和引脚部122，且焊盘部121和引脚部122连接，其中，焊盘部121穿设于凹腔110内，以用于与LED芯片组件21电性连接，引脚部122则露于绝缘基座11外，至少部分引脚部122两两间隔组成第一引脚对120；至少一个第一引脚对120沿第一轨迹PQ设置且朝远离绝缘基座11的方向延伸，其余引脚部122沿第二轨迹RS设置，第一轨迹PQ和第二轨迹RS相交。本实施例中，一方面，由于LED灯座10的一个第一引脚对120沿第一轨迹PQ设置且该第一引脚对120朝远离绝缘基座11的方向延伸，其余引脚部122沿第二轨迹RS设置，且第一轨迹PQ和第二轨迹RS相交，当将导线焊接在LED灯座10时，所有的导线沿着第二轨迹RS延伸，至少一条导线贴设在沿第一轨迹PQ设置的一个第一引脚对120的两个引脚部122，其余导线则沿着第二轨迹RS贴设于至少一个引脚部122，从得有利于将导线焊接在LED灯座10的引脚部122，降低了漏焊、虚焊或者焊接不牢固的现象，使得导线的焊接可靠性得到有效的提高。另一方面，由于沿第一轨迹PQ设置的一个第一引脚对120朝远离绝缘基座11的方向延伸，且该第一引脚对120的两个引脚部122之间具有间隔，有利于对焊接于沿第一轨迹PQ设置的引脚对120的导线进行冲切，冲切过程不会受LED灯座10空间结构的影响，也不会使得LED灯座10发生形变，有效地提高了导线冲切的可靠性，并且降低了对冲切设备的精度要求，两方面的作用有利于提高LED灯珠20以及LED灯带30加工的可靠性，提高产品合格率，同时还能有利于提高LED灯珠20和LED灯带30使用过程的可靠性。
请参阅图1、图2和图3，在一些实施方式中，绝缘基座11具有第一侧端部111、第二侧端部112、顶端部113和底端部114，其中，第一侧端部111和第二侧端部112相对设置，顶端部113和底端部114相对设置，第一轨迹PQ为连接第一侧端部111和第二侧端部112的直线，其中一个第一引脚对120沿第一轨迹PQ设置，并且沿第一轨迹PQ设置的第一引脚对120自第一侧端部111或第二侧端部112向远离绝缘基座11的方向延伸。在这种实施方式中，只有一个第一 引脚对120沿第一轨迹PQ设置，得到的LED灯座10，在制造成LED灯珠20以及LED灯带30时，焊接过程只需要对焊接在沿第一轨迹PQ设置的第一引脚对120的导线进行冲切，使得连接于沿第一轨迹PQ延伸的第一引脚对120的两个引脚部122之间的导线被切断。
请参阅图1、图2和图3，在一些实施方式中，第一轨迹PQ和第二轨迹RS垂直相交。第一轨迹PQ和第二轨迹RS垂直相交的结构设计，也即沿第一轨迹PQ设置的第一引脚对120和沿第二轨迹RS设置的引脚部122相互垂直，从而多条导线沿第二轨迹RS摆放时，跨接在沿第一轨迹PQ设置的第一引脚对120的导线与沿第一轨迹PQ设置的第一引脚部122垂直，从而可以有利于导线和第一引脚对120的焊接，同时有利于后续对跨接在沿第一轨迹PQ设置的第一引脚对120的导线的冲切，有效减小由于对导线冲切而对第一引脚对120的两个引脚部122产生的拉应力，避免冲切导线而导致引脚部122变形。在一些实施方式中，第一轨迹PQ和第二轨迹RS共面垂直相交，这样有利于多条导线沿第二轨迹RS摆放以及加工，提高加工可靠性。
请参阅图1、图2和图3，在本实施例中，多个导电端子12通过注塑成型方式固定于绝缘基座11中，具体是嵌件注塑成型。嵌件注塑成型的具体生产过程为在模具内装入预先准备的多个导电端子12，导电端子12可以是铜等金属材质，随后向模具中注入树脂，熔融的树脂与导电端子12接合固化。在一些实施方式中，树脂为热塑型树脂，如包括聚邻苯二甲酰胺(Polyphthalamide；PPA)、聚对苯二甲酸1,4-环己烷二甲醇酯(Poly 1,4-cyclohexylene dimethylene terephthalate，PCT)、聚对苯二甲酸乙二醇酯(PET)、聚对苯二甲酸丁二酯(PBT)等中的任一种。借助热塑型树脂的易成型性、弯曲性与金属的刚性、强度及耐热性的相互组合补充可制成结构复杂且精巧的LED灯座10，这样的LED灯座10既具有树脂的绝缘性和金属的导电性，又能有效地满足LED灯座10对电气性能的要求。
请参阅图1、图2和图3，在一些实施方式中，每个导电端子12还包括连接部123，焊盘部121和引脚部122通过连接部123实现连接。在一些实施方式中，连接部123沿着顶端部113至底端部114的方向设置，且引脚部122则局部外露于底端部114，这样的结构设计，有利于提高导电端子12和绝缘基座11的可靠性。在一些实施方式中，每个导电端子12的焊盘部121、引脚部122和连接部 123一体成型。
请参阅图1、图2和图3，在一些实施方式中，多个导电端子12之间相互具有间隔，以避免相互之间电连接而导致短路等。沿第二轨迹RS设置的引脚部122也两两间隔成对，以用于供与电源线312、接地线等导线电性连接。
请参阅图3和图2，在一些实施方式中，包含沿第一轨迹PQ设置的第一引脚对120的导电端子12还包括过渡部124，过渡部124用于连接于引脚部122和连接部123之间，通过过渡部124，可以有效提高导电端子12在绝缘基座11的可靠性。在一些实施方式中，过渡部124贴附于底端部114，且一端向第一侧端部111或第二侧端112延伸以与引脚部122连接，部分边缘与连接部123连接，从而提高对沿第一轨迹PQ设置的第一引脚对120进行冲切的可靠性。在一些实施方式中，导电端子12的焊盘部121、连接部123、过渡部124以及引脚部122一体成型，即导电端子12的焊盘部121自凹腔110向绝缘基座11的侧端部所在的方向延伸并于绝缘基座11的侧端部弯折向底端部114所在的方向延伸以形成连接部123，连接部123在侧端部和底端部114的交接处弯折以沿第二轨迹RS延伸以形成过渡部124，过渡部124贴附于底端部114，过渡部124的一端沿第一轨迹PQ向第一侧端部111或者第二侧端部112延伸以形成引脚部122。
请参阅图3和图2，在一些实施方式中，第一轨迹PQ设置的第一引脚对120的两个引脚部122各自具有一侧壁面1220，两个侧壁面1220相互正对，并且自第一侧端部111或第二侧端部112至远离绝缘基座11的一端，两个侧壁面1220之间的距离相同。
请参阅图4以及图1至图3，基于上述的LED灯座10，本实施例还提供一种LED灯珠20。
具体地，LED灯珠20包括LED灯座10、LED芯片组件21以及LED封装胶，其中，沿第一轨迹PQ设置的第一引脚对120包括两个引脚部122，其中一个引脚部122为信号输入端、另一个引脚部122为信号输出端；而沿着第二轨迹RS设置的多个引脚部122，可以包括电源输入端、电源输出端以及接地端等。LED芯片组件21安装于LED灯座10的凹腔110中，且与多个焊盘部121电性连接。LED封装胶填充于凹腔110中并密封LED芯片组件21。在本实施例中，LED灯珠20具有沿第一轨迹PQ设置的第一引脚对120，且第一引脚对120中 的一个引脚部122为信号输入端，另一个引脚部122为信号输出端，方便多个LED灯珠20进行级联。
需要说明的是，本实施例中，将n(n≥2)个LED灯珠20进行串并联应用时，外部信号源通过信号线311向第一个LED灯珠20输入信号，由于第一个LED灯珠20和第二个LED灯珠20之间通过信号线311连接，从而实现输入第一个LED灯珠20的信号向第二个LED灯珠20传输，第二个LED灯珠20和第三个LED灯珠20之间通过信号线311连接，从而实现输入第二个LED灯珠20的信号向第三个LED灯珠20传输，……，第n-1个LED灯珠20和第n个LED灯珠20之间通过信号线311连接，从而实现输入第n-1个LED灯珠20的信号向第n个LED灯珠20传输；多个LED灯珠20按照此模式进行连接和信号传输，即为级联。
请参阅图4，在一些实施方式中，LED芯片组件21包括驱动芯片211和至少一种发光芯片212，驱动芯片211与发光芯片212电性连接。在一些实施方式中，驱动芯片211为IC芯片，驱动芯片211与信号输入端、信号输出端分别连接。在一些实施方式中，发光芯片212包括蓝光LED芯片、绿光LED芯片、红光LED芯片、白光LED芯片等。具体可以根据应用场景设置发光芯片212的数量和发光芯片212的种类，从而可以获得不同的发光效果。
请参阅图4，在一些实施方式中，驱动芯片211通过键合线(图中未标示)与焊盘部121电性连接，发光芯片212通过键合线与焊盘部121电性连接，驱动芯片211和发光芯片212之间通过键合线连接。具体的，键合线包括金线、铜线、镀钯铜线以及合金线等。
请参阅图5、图6以及图4，基于上述LED灯珠20，本实施例提供LED灯带30的一种制造方法。
LED灯带30制造涉及LED灯珠20和导线组件31，导线组件31包括多条导线，并且导线包裹有保护层，制造LED灯带30时，需要导线部分芯裸露以供焊接，即将保护层剥掉，再与各个第一引脚对120、其余引脚部122焊接，焊接后再进行导光胶结构的制作，可以将导线没有绝缘皮的部分和各个引脚及焊点均包裹住。导线组件31的材质可以是铜线、铜漆包线、硅橡胶铜线等等。
(1)对导线组件31进行保护层的剥离，使得导线组件31内的线芯局部裸 露，且导线组件31裸露的部分与LED灯珠20焊接的部位相配适。
(2)将至少两个LED灯珠20沿第二轨迹RS间隔放置于导线组件31上，且LED灯珠20的第一引脚对120分跨接一条导线，其余引脚部122对应跨接一条导线，随后进行焊接，使得一条导线对应与一个第一引脚对120焊接，其余导线对应与一个引脚部122或者两个引脚部122焊接，焊接结束，焊接于沿第一轨迹PQ设置的第一引脚对120的导线在第一引脚对120的两个引脚部122之间形成有冲切部3110。
(3)将导线组件31和LED灯珠20翻转180°，使得导线组件31朝上，LED灯珠20朝下，即LED灯珠20的顶端部113朝下、底端部114朝上，随后采用冲切设备对冲切部3110进行冲切，冲切时冲切设备从底端部114向顶端部113的方向进给，从而使得冲切部3110被冲断。
(4)进行滴胶封装，将导线组件31裸露的部位以及和LED灯珠20焊接的部位进行包裹，以与外界隔绝，得到LED灯带30。
请参阅图6和图4，基于上述的基础，本实施例还提供一种LED灯带30。
具体地，LED灯带30包括导线组件31和至少两个LED灯珠20；导线组件31沿第二轨迹RS延伸设置，至少两个LED灯珠20沿第二轨迹RS间隔设置于导线组件31；导线组件31包括至少两条信号线311，其中一条信号线311的一端与外部信号源连接、另一端与其中一个LED灯珠20的信号输入端连接，以向LED灯珠20输入信号；相邻两个LED灯珠20之间通过另一条信号线311连接，以使信号在至少两个LED灯珠20之间级联传输。
请参阅图6和图4，在一些实施方式中，信号线311和信号输入端、信号输出端焊接后，与绝缘基座11具有间距。
请参阅图6和图4，导线组件31还包括电源线312；电源线312与沿第二轨迹RS设置的引脚部122电性连接。导线组件31还包括接地线，接地线与沿第二轨迹RS设置的引脚部122电性连接。
请参阅图6和图4，在一个示例性的实施方式中，LED灯带30包括两个LED灯珠20、三条信号线311、电源线312和接地线(图中未标示)。其中第一条信号线311的一端与外部信号源连接、另一端与第一个LED灯珠20的信号输入端焊接，第二条信号线311的一端连接于第一个LED灯珠20的信号输出端、另一 端连接于第二个LED灯珠20的信号输入端，第三条信号线311的一端连接于第二个LED灯珠20的信号输出端，电源线312将第一个LED灯珠20和第二LED灯珠20串联，接地线则分别将第一个LED灯珠20、第二个LED灯珠20接地。使用时，控制指令发出指令，从第一信号线311向第一个LED灯珠20发送，第一个LED灯珠20接收发送给第一个LED灯珠20的指令后，并驱动第一个LED灯珠20的发光芯片212发光，同时，传输给第二个LED灯珠20的指令沿着第二条信号线311向第二个LED灯珠20传输，并被第二个LED灯珠20接收，并驱动第二个LED灯珠20的发光芯片212发光。当然，这只是LED灯带30的局部示例，LED灯带30还可以串接更多的LED灯珠20，如第三个LED灯珠20的信号输入端与第三条信号线311连接，其他LED灯珠20按照此连接模式沿着第二轨迹RS间隔设置，从而实现更多的发光效果。
实施例二
请参阅图7以及图1至图6，本实施例提供的LED灯座10、LED灯珠20和LED灯带30与实施例一的区别主要在于如下所述结构上的不同：
对于实施例一，LED灯座10的结构中，绝缘基座11没有形成有避让部1110。而在本实施例中，绝缘基座11形成有避让部1110，避让部1110设于沿第一轨迹PQ设置的第一引脚对120的两个引脚部122之间。通过设置避让部1110，进行LED灯珠20以及LED灯带30加工制造时，可以有效避免冲切设备与绝缘基座11发生碰撞而导致LED灯座10发生形变甚至被冲坏，还可以降低对冲切设备的精度要求。
在一些实施方式中，避让部1110为从底端部114向顶端部113延伸的缺口，所述缺口的开口端朝向第一侧端部111或第二侧端部112。进一步地，在一些实施方式中，缺口在底端部114的正投影呈多边形开口或弧形开口，并且所述多边形开口或弧形开口均朝向第一侧端部111或第二侧端部112。将避让部1110设计成从底端部114向顶端部113延伸的缺口，可以有利于冲切设备沿着底端部114至顶端部113进给。在一些实施方式中，所述多边形开口包括方形开口、三角形开口或其他多边形等。在一些实施方式中，弧形开口包括圆弧形开口或半圆形开口等。
需要说明的是，缺口在底端部114的正投影，指的是平行投射线垂直于顶端 部113向底端部114照射，在底端部114所在的平面形成的投影。
除了上述的结构设置方案与实施例一不同外，本实施例二提供的LED灯座10、LED灯珠20和LED灯带30等均可参照实施例一对应设计，为节约篇幅，在此不再展开赘述。
实施例三
请参阅图8和图7以及图1至图6，本实施例提供的LED灯座10、LED灯珠20和LED灯带30与实施例二的区别主要在于如下所述结构上的不同：
对于实施例二，LED灯座10的结构中，缺口在底端部114的正投影为正投影呈方形或三角形或圆弧形。而在本实施例中，缺口具有朝向第一侧端部111或第二侧端部112的第一表面，第一表面自底端部114以与第一侧端部111或第二侧端部112的距离逐渐减小的趋势向顶端部113的方向延伸。将缺口设计成这样的结构，可以通过控制冲切设备的进给深度来实现冲切，既能够节约能耗，还能够提高冲切精度。更重要的是，可以保证LED灯座10的结构强度，同时避让部1110的存在不需要对现有凹腔110的结构进行改动，因此增设避让部1110不影响LED灯座10的原有出光效果。
除了上述的结构设置方案与实施例二不同外，本实施例三提供的LED灯座10、LED灯珠20和LED灯带30等均可参照实施例二对应设计，为节约篇幅，在此不再展开赘述。
实施例四
请参阅图9、图7以及图1至图6，本实施例提供的LED灯座10、LED灯珠20和LED灯带30与实施例二的区别主要在于如下所述结构上的不同：
对于实施例二，LED灯座10的结构中，缺口在底端部114的正投影为正投影呈多边形开口或弧形开口。而在本实施例中，缺口具有朝向第一侧端部111或第二侧端部112的弧形表面，自底端部114至顶端部113弧形表面对应的弦长逐渐减小，即沿着垂直于底端部114至顶端部113的方向横截缺口，得到弧形截面，从底端部114至顶端部113，弧形截面的弦长逐渐减小。缺口设计成这样的结构，可以使得冲切设备的外部可以设计成锥形结构，冲切点为锥顶，减小冲切设备和导线的接触面积，以更小的冲切面积形成冲切压力而达到更好的冲切效果。与此同时，可以保证LED灯座10的结构强度，同时避让部1110的存在不需要对现 有凹腔110的结构进行改动，因此增设避让部1110不影响LED灯座10的原有出光效果。
除了上述的结构设置方案与实施例二不同外，本实施例四提供的LED灯座10、LED灯珠20和LED灯带30等均可参照实施例二对应设计，为节约篇幅，在此不再展开赘述。
实施例五
请参阅图10、图7以及图1至图6，本实施例提供的LED灯座10、LED灯珠20和LED灯带30与实施例二的区别主要在于如下所述结构上的不同：
对于实施例二，LED灯座10的结构中，缺口在底端部114的正投影为正投影呈方形或三角形或圆弧形。而在本实施例中，缺口具有第一表面和第二表面，并且第一表面和第二表面朝向第一侧端部111或第二侧端部112，第一表面和第二表面连接，第一表面和第二表面自两者相连的部位以间距逐渐增大的趋势向第一侧端部111或者第二侧端部112延伸，第一表面和第二表面相连的部位以与第一侧端部111或第二侧端部112的距离逐渐减小的趋势向顶端部113的方向延伸。与此同时，可以保证LED灯座10的结构强度，同时避让部1110的存在不需要对现有凹腔110的结构进行改动，因此增设避让部1110不影响LED灯座10的原有出光效果。
除了上述的结构设置方案与实施例二不同外，本实施例五提供的LED灯座10、LED灯珠20和LED灯带30等均可参照实施例二对应设计，为节约篇幅，在此不再展开赘述。
实施例六
请参阅图11以及图1至图6，本实施例提供的LED灯座10、LED灯珠20和LED灯带30与实施例一的区别主要在于如下所述结构上的不同：
对于实施例一，LED灯座10的结构中沿第一轨迹PQ设置的第一引脚对120的数量只有一个。而在本实施例中，沿第一轨迹PQ设置的第一引脚对120的数量为两个，其中一个第一引脚对120引脚对120自第一侧端部111向远离绝缘基座11的方向延伸，另一个第一引脚对120自第二侧端部112向远离绝缘基座11的方向延伸。这样的结构设计，可适用于需要对导线组件31中两条导线进行冲切的LED灯带30。
除了上述的结构设置方案与实施例一不同外，本实施例六提供的LED灯座10、LED灯珠20和LED灯带30等均可参照实施例一对应设计，为节约篇幅，在此不再展开赘述。
实施例七
请参阅图12、图13、图14以及图1至图6，本实施例提供的LED灯座10、LED灯珠20和LED灯带30与实施例一的区别主要在于如下所述结构不同：
在实施例一中，沿第一轨迹PQ设置的第一引脚对120的两个引脚部122各具有一个侧壁面1220，两个引脚部122的侧壁面1220相互正对，且自第一侧端部111或第二侧端部112至远离绝缘基座11的一端，两个侧壁面1220之间的距离相同。而在本实施例中，自第一侧端部111或第二侧端部112至远离绝缘基座11的一端，两个侧壁面1220之间的距离逐渐增大，其中，图12所示的侧壁面1220为第一侧端部111至远离绝缘基座11的一端的倾斜平面；图13所示的侧壁面1220为第一侧端部111至远离绝缘基座11的一端的弧形曲面；图14所示的侧壁面1220为弧形曲面，且两个引脚部122自第一侧端部111至远离绝缘基座11的一端呈“八”字型设置。这样的结构设计，沿第一轨迹PQ设置的第一引脚对120的两个引脚部122之间可以形成良好的避让部1110，便于冲切设备对跨接于一引脚对120的两个引脚部122之间的导线进行冲切，这不仅可以保证冲切过程中不会对LED灯座10产生影响，而且由于不需要对现有凹腔110的结构进行改动，因此不影响LED灯座10的原有出光效果；此外，由于两个引脚部122呈“八”字型设置，还不会因为形成避让部1110而导致引脚部122与导线(如信号线)的焊接面积变小，保证导线的焊接可靠性。
除了上述的结构设置方案与实施例一不同外，本实施例七提供的LED灯座10、LED灯珠20和LED灯带30等均可参照实施例一对应设计，为节约篇幅，在此不再展开赘述。
以上所述的仅是本申请的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本申请创造构思的前提下，还可以做出改进，但这些均属于本申请的保护范围。

Claims (11)

  1. LED灯座，其特征在于，包括：
    绝缘基座，所述绝缘基座形成有用于容置LED芯片组件和LED封装胶的凹腔；
    多个导电端子，所述多个导电端子分别通过注塑成型方式固定于所述绝缘基座，且每个所述导电端子具有穿设于所述凹腔内以用于与所述LED芯片组件电性连接的焊盘部和露于所述绝缘基座外的引脚部；至少部分所述引脚部两两间隔组成第一引脚对；
    至少一个所述第一引脚对沿第一轨迹设置且朝远离所述绝缘基座的方向延伸，其余所述引脚部沿第二轨迹设置，所述第一轨迹和所述第二轨迹相交。
  2. 如权利要求1所述的LED灯座，其特征在于，所述绝缘基座具有第一侧端部和与所述第一侧端部相对设置的第二侧端部；所述第一轨迹为连接所述第一侧端部和所述第二侧端部的直线，所述第一引脚对的数量为一个，所述第一引脚对自所述第一侧端部或所述第二侧端部向远离所述绝缘基座的方向延伸；
    或者，所述绝缘基座具有第一侧端部和与所述第一侧端部相对设置的第二侧端部；所述第一轨迹为连接所述第一侧端部和所述第二侧端部的直线；所述第一引脚对的数量为两个，其中一个所述第一引脚对自所述第一侧端部向远离所述绝缘基座的方向延伸，另一个所述第一引脚对自所述第二侧端部向远离所述绝缘基座的方向延伸。
  3. 如权利要求2所述的LED灯座，其特征在于，沿所述第一轨迹设置的所述第一引脚对的两个所述引脚部各自具有一个侧壁面，两个所述侧壁面相互正对，且自所述第一侧端部或所述第二侧端部至远离所述绝缘基座的一端，两个所述侧壁面之间的距离相同或者逐渐增大。
  4. 如权利要求1至3任一项所述的LED灯座，其特征在于，所述绝缘基座形成有避让部，所述避让部设于沿所述第一轨迹设置的同一所述第一引脚对的两个所述引脚部之间。
  5. 如权利要求4所述的LED灯座，其特征在于，所述绝缘基座具有底端部和顶端部，所述避让部为从所述底端部向所述顶端部延伸的缺口，所述缺口的开口端朝向所述第一侧端部或所述第二侧端部。
  6. 如权利要求5所述的LED灯座，其特征在于，所述缺口在所述底端部的正投影呈多边形开口或弧形开口，且所述多边形开口或所述弧形开口的开口朝向所述第一侧端部或者所述第二侧端部；
    或者，所述绝缘基座具有第一侧端部和与所述第一侧端部相对设置的第二侧端部，所述第一轨迹为连接所述第一侧端部和所述第二侧端部的直线；所述缺口具有朝向所述第一侧端部或所述第二侧端部的第一表面，所述第一表面自所述底端部以与所述第一侧端部或所述第二侧端部的距离逐渐减小的趋势向所述顶端部的方向延伸；
    或者，所述绝缘基座具有第一侧端部和与所述第一侧端部相对设置的第二侧端部，所述第一轨迹为连接所述第一侧端部和所述第二侧端部的直线；所述缺口具有第一表面及第二表面，所述第一表面和所述第二表面连接，所述第一表面和所述第二表面均朝向所述第一侧端部或所述第二侧端部，所述第一表面和所述第二表面自两者相连的部位以间距逐渐增大的趋势向所述第一侧端部或者所述第二侧端部延伸，所述第一表面和所述第二表面相连的部位以与所述第一侧端部或所述第二侧端部的距离逐渐减小的趋势向所述顶端部的方向延伸；
    或者，所述绝缘基座具有第一侧端部和与所述第一侧端部相对设置的第二侧端部，所述第一轨迹为连接所述第一侧端部和所述第二侧端部的直线；所述缺口具有朝向所述第一侧端部或所述第二侧端部的圆弧形表面，自所述底端部至所述顶端部所述圆弧形表面对应的弦长逐渐减小。
  7. 如权利要求1至3任一项所述的LED灯座，其特征在于，所述第一轨迹和所述第二轨迹垂直相交；
    或者，所述第一轨迹和所述第二轨迹共面垂直相交。
  8. LED灯珠，其特征在于，包括：
    权利要求1至7任一项所述的LED灯座，沿所述第一轨迹设置的一个所述第一引脚对的两个所述引脚部中的一者为信号输入端、另一者为信号输出端；
    LED芯片组件，所述LED芯片组件安装于所述LED灯座的凹腔中，且与多个所述焊盘部电性连接；
    LED封装胶，所述LED封装胶填充于所述凹腔中并密封所述LED芯片组件。
  9. 如权利要求8所述的LED灯珠，其特征在于，所述LED芯片组件包括 驱动芯片和至少一种发光芯片，所述驱动芯片与所述发光芯片电性连接。
  10. LED灯带，其特征在于，包括：
    至少两个如权利要求8至9任一项所述的LED灯珠；至少两个所述LED灯珠沿所述第二轨迹间隔设置；
    导线组件，所述导线组件包括至少两条信号线，其中一条所述信号线的一端与外部信号源连接、另一端与其一个所述LED灯珠的信号输入端连接，以向所述LED灯珠输入信号；相邻两个所述LED灯珠之间通过另一条所述信号线连接，以使信号在所述LED灯珠之间级联传输。
  11. 如权利要求10所述的LED灯带，其特征在于，所述信号线与所述绝缘基座具有间距；
    和/或，所述导线组件还包括电源线；所述电源线与沿所述第二轨迹设置的所述引脚部电性连接。
PCT/CN2021/126835 2021-09-22 2021-10-27 Led灯座、led灯珠和led灯带 WO2023045020A1 (zh)

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CN202434564U (zh) * 2011-12-15 2012-09-12 深圳市长盈精密技术股份有限公司 Led热电分离型支架
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CN108278516A (zh) * 2018-02-28 2018-07-13 杭州小太阳农业科技有限公司 一种灯带
CN109027732A (zh) * 2018-09-14 2018-12-18 江西顺慈科技有限公司 一种led线灯、led灯屏、led显示屏
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CN210956723U (zh) * 2020-01-20 2020-07-07 深圳市天成照明有限公司 一种内封ic的led灯珠
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CN104637930A (zh) * 2014-12-30 2015-05-20 木林森股份有限公司 一种双色led灯珠和基于该灯珠的灯带、以及该灯珠的封装工艺
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