WO2023030542A1 - 激光器 - Google Patents

激光器 Download PDF

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Publication number
WO2023030542A1
WO2023030542A1 PCT/CN2022/117390 CN2022117390W WO2023030542A1 WO 2023030542 A1 WO2023030542 A1 WO 2023030542A1 CN 2022117390 W CN2022117390 W CN 2022117390W WO 2023030542 A1 WO2023030542 A1 WO 2023030542A1
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WO
WIPO (PCT)
Prior art keywords
light
laser
row
conductive
frame
Prior art date
Application number
PCT/CN2022/117390
Other languages
English (en)
French (fr)
Inventor
周子楠
田有良
张昕
卢瑶
李巍
刘显荣
薛兴鹤
顾晓强
Original Assignee
青岛海信激光显示股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202111038583.3A external-priority patent/CN113764972B/zh
Priority claimed from CN202111045935.8A external-priority patent/CN113594847A/zh
Priority claimed from CN202111672608.5A external-priority patent/CN116417895A/zh
Priority claimed from CN202123444019.XU external-priority patent/CN216929162U/zh
Application filed by 青岛海信激光显示股份有限公司 filed Critical 青岛海信激光显示股份有限公司
Publication of WO2023030542A1 publication Critical patent/WO2023030542A1/zh
Priority to US18/595,871 priority Critical patent/US20240213737A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/30—Collimators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0232—Lead-frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar

Definitions

  • the present disclosure relates to the field of optoelectronic technology, in particular to a laser.
  • lasers are widely used.
  • lasers can be used as light sources for laser projection equipment or laser TVs. Therefore, the requirements for miniaturization and reliability of lasers are also getting higher and higher.
  • some embodiments of the present disclosure provide a laser.
  • the laser includes a base plate, a frame, a plurality of light-emitting components, a plurality of conductive pins and wires.
  • the frame is arranged on the bottom plate, and includes a plurality of notches arranged at intervals at an end of the frame close to the bottom plate.
  • the multiple light emitting components are fixed on the base plate, and the frame surrounds the multiple light emitting components.
  • One conductive pin of the plurality of conductive pins is located in one of the plurality of notches.
  • the conductive pin includes a base, a connection layer and a conductive layer.
  • the base is insulated from the bottom plate; the connection layer is embedded inside the base; the conductive layer is disposed on the surface of the base away from the bottom plate and is electrically connected to the connection layer .
  • One end of the wire is electrically connected to the conductive layer, and the other end of the wire is connected to at least one light emitting component among the plurality of light emitting components.
  • the laser includes a bottom plate, a frame, a plurality of light-emitting components, a light-transmitting layer, a cover plate and a collimating lens group.
  • the frame is arranged on the bottom plate, and the side of the frame away from the bottom plate has an opening.
  • the plurality of light emitting components are fixed on the base plate and configured to emit laser light, and the frame surrounds the plurality of light emitting components.
  • the light-transmitting layer is disposed on the side of the tube housing where the opening is located.
  • the cover plate includes an inner edge area and an outer edge area, the outer edge area is fixed to the surface of the frame away from the bottom plate, and the inner edge area is fixed to the edge of the transparent layer.
  • the collimator lens group is arranged on the side of the light-transmitting layer away from the tube shell; the collimator lens group includes a plurality of collimator lenses; one collimator lens in the plurality of collimator lenses is configured In order to reduce the divergence angle of the incident laser light, and make the reduction of the divergence angle of the laser light on the slow axis smaller than the decrease amount of the divergence angle on the fast axis.
  • some embodiments of the present disclosure provide a laser.
  • the laser includes a bottom plate, a frame, a plurality of light-emitting components, a light-transmitting layer, a cover plate and a collimating lens group.
  • the frame is arranged on the bottom plate, and the side of the frame away from the bottom plate has an opening.
  • the plurality of light emitting components are fixed on the base plate and configured to emit laser light, and the frame surrounds the plurality of light emitting components.
  • the light-transmitting layer is disposed on the side of the tube housing where the opening is located.
  • the cover plate includes an inner edge area and an outer edge area, the outer edge area is fixed to the surface of the frame away from the bottom plate, and the inner edge area is fixed to the edge of the transparent layer.
  • the collimating lens group is arranged on the side of the light-transmitting layer away from the tube shell; the collimating lens group includes a plurality of collimating lenses, and the plurality of collimating lenses are arranged in multiple rows in the row direction and Multiple columns are arranged in the column direction; the maximum length of one collimator lens in the column direction is greater than the maximum length in the row direction, and two collimator lenses in the column direction
  • the widths of the end portions are all smaller than the width of the middle portion.
  • Two adjacent rows of collimating lenses in the plurality of collimating lenses are arranged in a staggered manner; and among the two adjacent rows of collimating lenses, there is a collimating lens that is close to the end of another row of collimating lenses, at least The part is located between the two ends of two adjacent collimating lenses in the other row of collimating lenses.
  • Fig. 1 is a structural diagram of a laser provided according to the related art
  • Fig. 2 is a structural diagram of a laser provided according to some embodiments of the present disclosure.
  • Fig. 3 is an exploded structure diagram of a laser provided according to some embodiments of the present disclosure.
  • Fig. 4 is a structural diagram of a laser provided according to some embodiments of the present disclosure.
  • Fig. 5 is a structural diagram of a laser provided according to some embodiments of the present disclosure.
  • Fig. 6 is a structural diagram of another laser provided according to some embodiments of the present disclosure.
  • FIG. 7 is a structural diagram of a laser provided according to the related art.
  • Fig. 8 is a structural diagram of another laser provided according to some embodiments of the present disclosure.
  • Fig. 9 is a structural diagram of another laser provided according to some embodiments of the present disclosure.
  • Fig. 10 is a structural diagram of another laser provided according to some embodiments of the present disclosure.
  • Fig. 11 is a structural diagram of another laser provided according to some embodiments of the present disclosure.
  • Fig. 12 is a structural diagram of another laser provided according to some embodiments of the present disclosure.
  • Fig. 13 is a structural diagram of a collimating lens provided according to some embodiments of the present disclosure.
  • Fig. 14 is a structural diagram of another collimator lens provided according to some embodiments of the present disclosure.
  • Fig. 15 is a structural diagram of another collimator lens provided according to some embodiments of the present disclosure.
  • Fig. 16 is a structural diagram of another collimator lens provided according to some embodiments of the present disclosure.
  • Fig. 17 is a structural diagram of a collimating lens provided according to other embodiments of the present disclosure.
  • Fig. 18 is a structural diagram of another collimator lens provided according to other embodiments of the present disclosure.
  • Fig. 19 is a structural diagram of a collimating lens group provided according to some embodiments of the present disclosure.
  • Fig. 20 is a structural diagram of another collimating lens group provided according to some embodiments of the present disclosure.
  • Fig. 21 is a structural diagram of another collimating lens group provided according to some embodiments of the present disclosure.
  • Fig. 22 is a structural diagram of another collimating lens group provided according to some embodiments of the present disclosure.
  • Fig. 23 is a structural diagram of another laser provided according to some embodiments of the present disclosure.
  • Fig. 24 is the structural diagram of section B-B' among Fig. 23;
  • Fig. 25 is a structural diagram of another laser provided according to the related art.
  • Fig. 26 is a structural diagram of another laser provided according to some embodiments of the present disclosure.
  • Fig. 27 is the structural diagram of the section D-D ' of the laser shown in Fig. 26;
  • Fig. 28 is a structural diagram of another laser provided according to some embodiments of the present disclosure.
  • Fig. 29 is a structural diagram of another laser provided according to some embodiments of the present disclosure.
  • Fig. 30 is a structural diagram of another laser provided according to some embodiments of the present disclosure.
  • Fig. 31 is a structural diagram of another laser provided according to some embodiments of the present disclosure.
  • 104-light-emitting chip 104a-the first type of light-emitting chip; 104b-the second type of light-emitting chip; 104c-the third type of light-emitting chip; G-the end face of the light-emitting chip; ; 108-light-transmitting layer; 109-collimating lens group; T-collimating lens; -The lower end of the collimator lens; T5-the middle part of the collimator lens; M1-the light incident surface of the collimator lens; M2-the light exit surface of the collimator lens; a1-straight edge; a4-straight edge; a2-arc edge ; a3-arc edge; a5-arc edge; a6-arc edge; T10-the first type of collimating lens; T20-the second type of collimating lens;
  • 110 - cover plate 110A - inner edge area of cover plate; 110B - outer edge area of cover plate;
  • 111-connector L-bending part; 111A-first strip part; 111B-second strip part; 111C-third strip part;
  • the laser 10 includes a package 120 , a plurality of conductive pins 103 , a plurality of light emitting components 130 and wires 105 .
  • the tube case 120 includes a bottom plate 101 and a frame 102 , one side of the tube case 120 has an opening, and the opening in the frame 102 away from the bottom plate 101 is the opening of the tube case 120 .
  • the frame 102 and the plurality of light-emitting components 130 are fixed on the bottom plate 101 , the frame 102 is ring-shaped, the bottom plate 101 and the frame 102 enclose an accommodating space S, and the light-emitting components 130 are disposed in the accommodating space S.
  • the frame 102 includes a plurality of notches K, and the plurality of notches K are disposed on a side of the frame 102 close to the bottom plate 101 and spaced apart from each other.
  • the plurality of notches K correspond to the plurality of conductive pins 103 , and the shapes of the conductive pins 103 match the shapes of the corresponding notches K, and the conductive pins 103 fill the corresponding notches K.
  • the bottom plate 101 and the frame 102 in the tube case 120 are integrally constructed, or may be an independent structure, and the two are welded together to form the tube case 120 .
  • the material of the shell 120 may be copper, such as oxygen-free copper. Due to the high thermal conductivity of copper, it can ensure that the heat generated by the light-emitting component 130 during operation can be quickly conducted through the tube shell 120 and dissipated quickly, so as to avoid heat accumulation and damage to the light-emitting component 130 .
  • the material of the shell can also be one or more of aluminum, aluminum nitride and silicon carbide.
  • the light emitting component 130 includes a light emitting chip 104
  • the conductive pin 103 includes a base 1031 and a conductive layer 1032 on the base 1031 .
  • the base 1031 includes a first part B1 , a second part B2 and a third part B3 connected in sequence, and the third part B3 is disposed between the first part B1 and the second part B2 .
  • the conductive layer 1032 includes a first conductive layer D1.
  • the third part B3 of the base 1031 is covered by the frame 102 , the first conductive layer D1 is disposed on the side of the first part B1 away from the bottom plate 101 , and the first conductive layer D1 is connected to the light-emitting chip 104 through the wire 105 .
  • the base 1031 plays a supporting role on the first conductive layer D1, and the base 1031 can isolate the first conductive layer D1 from other components in the laser 10, preventing other components in the laser 10 from affecting the conduction effect of the first conductive layer D1 .
  • the base 1031 can isolate the first conductive layer D1 from the bottom plate 101 , and isolate the first conductive layer D1 from the frame 102 .
  • the conductive pin 103 is fixed to the corresponding notch K by brazing. At this time, the first part B1 is located in the accommodating space S, and the second part B2 is located outside the accommodating space S.
  • the third portion B3 of the conductive pin 103 is aligned and snapped into the corresponding notch K, and solder is disposed between the conductive pin 103 and the corresponding notch K. Then place the frame 102 with the conductive pin 103 stuck in the notch K in a high-temperature furnace for sintering to melt the solder to fix the conductive pin 103 at the corresponding notch K, and ensure that the conductive pin 103 is compatible with the corresponding Sealing of joints in notch K.
  • the first conductive layer D1 is disposed on the base 1031 , at this time, the first conductive layer D1 and the base 1031 are integrated. Alternatively, after the base 1031 and the frame 102 are fixed, the first conductive layer D1 is disposed on the base 1031 . At this time, the first conductive layer D1 and the base 1031 are not in an integral structure.
  • the integral structure composed of the frame 102 and the conductive pins 103 is welded on the bottom plate 101, and the side where the conductive pins 103 are located in the overall structure is connected to the bottom plate 101. touch.
  • the base plate 101 , the frame 102 and the plurality of conductive pins 103 enclose the accommodating space S, and then the light emitting component 130 can be fixed in the accommodating space S. As shown in FIG.
  • wires 105 are set between the first conductive layer D1 in the conductive pin 103 and the light-emitting chip 104 close to the conductive pin 103, and between the light-emitting chips 104 that need to be connected in series, so that the conductive pin 103 and the light-emitting chip 104 electrical connection.
  • ball bonding technology is used to fix the wires 105 on the first conductive layer D1 and the light emitting chip 104 .
  • the wire bonding device When welding the wire 105 using ball bonding technology, one end of the wire 105 will be melted by a wire bonding device, and the melted end will be pressed on the object to be connected, and then the wire bonding device will apply ultrasonic waves to complete the connection between the wire 105 and the object to be connected. fixation of things.
  • the wire 105 is a gold wire
  • the fixing process of the wire 105 and the conductive pin 103 is called a gold wire bonding process.
  • the notch K is disposed on a side of the frame 102 close to the bottom plate 101 , and the conductive pin 103 is fixed at the notch K. Therefore, the conductive pins 103 can contact the base plate 101 to be supported by the base plate 101 . In this way, the ability of the conductive pin 103 to withstand pressure is relatively strong during wire bonding, the probability of damage to the conductive pin 103 under the pressure exerted by the wire bonding equipment is small, and the welding of the wire 105 and the first conductive layer D1 is firm higher degree. Thus, the success rate of wire bonding and the fixing effect of the wire 105 can be improved, thereby improving the manufacturing yield of the laser.
  • the components in the laser 10 that need to be connected by wires 105 are electrically connected using multiple wires 105 to ensure the reliability of the connection between the two components that need to be electrically connected and reduce the sheet resistance on the wires 105 .
  • the connection between the first conductive layer D1 and the light-emitting chip 104 , and between adjacent light-emitting chips 104 is through multiple wires 105
  • FIG. 2 only takes one wire 105 as an example for illustration.
  • the laser 10 The 'frame 102' needs to have a high height, which is not conducive to the miniaturization of the laser.
  • the conductive pin 103' is suspended in the air, when the wire bonding equipment is used to apply pressure to the conductive pin 103' in the process of preparing the laser 10' to fix the wire 105' (the wire 105' is connected to the light-emitting chip 104' and the external power supply), the conduction Pin 103' can withstand less stress.
  • the conductive pins 103' are susceptible to damage, resulting in poor reliability of the laser 10'.
  • the first conductive layer D1 can be insulated from the bottom plate 101 through the substrate 1031 , there is no need to set a safety distance between the first conductive layer D1 and the bottom plate 101 .
  • the conductive pin 103 is located at the notch K on the side of the frame 102 close to the bottom plate 101 , so the distance between the first conductive layer D1 and the bottom plate 101 is relatively short. Therefore, the height of the frame 102 can be smaller, and the thickness of the laser can be smaller, which is beneficial to miniaturization of the laser 10 .
  • the arrangement direction of the first portion B1 , the second portion B2 and the third portion B3 is parallel to the X direction.
  • the first part B1 is located in the accommodating space S
  • the second part B2 is located outside the accommodating space S
  • the third part B3 fills the gap K of the frame 102 .
  • the size of the third part B3 in the X direction is greater than or equal to the wall thickness of the frame 102 to ensure that the third part B3 has a better filling effect on the gap K, thereby ensuring the airtightness of the gap K.
  • the conductive layer 1032 further includes a second conductive layer D2, and the second conductive layer D2 is disposed on the surface of the second portion B2 away from the bottom plate 101 .
  • the conductive pin 103 includes a connection layer D3 embedded in the third portion B3.
  • the first conductive layer D1 is connected to the second conductive layer D2, for example, may be connected through a connection layer D3.
  • the second conductive layer D2 is connected to the external power supply, and then the current from the external power supply can be transmitted to the light-emitting chip 104 through the second conductive layer D2, the connection layer D3 in the conductive pin 103 and the first conductive layer D1 in sequence.
  • the surface of the first portion B1 away from the base plate 101 is flush with the surface of the second portion B2 away from the base plate 101 , which facilitates the connection between the first conductive layer D1 and the second conductive layer D2 .
  • the first conductive layer D1 covers the entire area of the surface of the first portion B1 away from the bottom plate 101 , or may also cover only a partial area of the surface.
  • the second conductive layer D2 covers the entire area of the surface of the second portion B2 away from the bottom plate 101 , or may only cover a partial area of the surface.
  • the first conductive layer D1 covers a partial area of the first part B1 away from the surface of the bottom plate 101
  • the second conductive layer D2 covers a partial area of the second part B2 away from the surface of the bottom plate 101.
  • the third portion B3 of the conductive pin 103 protrudes in a direction away from the bottom plate 101 (direction Y in the figure) relative to the first portion B1 and the second portion B2 .
  • a certain distance between the first conductive layer D1 and the second conductive layer D2 and the frame 102 can be ensured, so as to avoid the conduction of the frame 102 to the first conductive layer D1 and the second conductive layer D2 Effects make an impact.
  • the surface of the conductive pin 103 close to the bottom plate 101 is flush with the ring-shaped surface of the frame 102 close to the bottom plate 101 . In this way, after the conductive pins 103 are fixed in the gap K, it can be ensured that the overall structure composed of the frame 102 and the conductive pins 103 is flat on the surface close to the bottom plate 101, so that the overall structure and the bottom plate 101 have a better welding effect. The risk of gaps appearing at the location is small, which can ensure that the airtightness of the laser 10 is better.
  • the surfaces of the first part B1 , the second part B2 and the third part B3 close to the bottom plate 101 are flush with the annular surface of the frame 102 close to the bottom plate 101 as an example.
  • the surface of the third part B3 close to the bottom plate 101 may be flush with the annular surface of the frame 102 close to the bottom plate 101, and at least one of the first part B1 and the second part B2 is close to the surface of the bottom plate 101.
  • the surface of B3 close to the bottom plate 101 is away from the bottom plate 101 , that is, there may be a certain distance between the at least one portion and the bottom plate 101 . In this way, the safety distance between the first conductive layer D1 and the base plate 101 and the safety distance between the second conductive layer D2 and the base plate 101 can be increased.
  • the bottom plate 101 and the frame 102 of the tube case 120 may also be integrally structured.
  • the base plate 101 and the frame 102 can be prevented from being wrinkled due to the difference in thermal expansion coefficient between the base plate 101 and the frame 102 when the base plate 101 and the frame 102 are welded at high temperature, thereby ensuring the flatness of the base plate 101 and ensuring the installation reliability of the light-emitting component 130 on the base plate 101 , so as to ensure that the light emitted by the light-emitting chip 104 exits according to a predetermined light-emitting angle, and improve the light-emitting effect of the laser 10 .
  • the plurality of notches K are evenly distributed on two opposite side walls of the frame 102 , such as distributed on two opposite side walls of the frame 102 in the X direction.
  • a plurality of conductive pins 103 are also distributed on the two opposite side walls.
  • the conductive layer 1032 disposed in the conductive pin 103 of one of the two side walls is used to connect the positive pole of the external power supply, and the conductive layer 1032 disposed in the conductive pin 103 of the other side wall is used to connect the external power supply.
  • the multiple light emitting chips 104 in the laser 10 are arranged in multiple rows and multiple columns, the row direction of the light emitting chips 104 is the X direction, and the column direction is the Y direction.
  • Each row of light-emitting chips 104 is connected in series, and two conductive pins 103 are provided at both ends, and each row of light-emitting chips 104 is respectively connected to the positive pole and the negative pole of the external power supply through the two conductive pins 103 .
  • the quantity of the first conductive layer D1 and the second conductive layer D2 is related to the arrangement and circuit connection of the light-emitting chips 104 in the laser.
  • the same type of light-emitting chips 104 in the laser 10 are used to emit laser light of the same color, and different types of light-emitting chips 104 are used to emit laser light of different colors.
  • Each type of light-emitting chip 104 is connected in series, and does not share the first conductive layer D1 or the second conductive layer D2.
  • the laser 10 is a multi-color laser, and its multiple light-emitting chips are used to emit laser light of different colors.
  • the laser 10 includes three types of light-emitting chips, which are respectively used to emit red laser light, green laser light and blue laser light.
  • the laser 10 includes six conductive pins. Three conductive pins among the six conductive pins are used as positive pole pins, and the other three conductive pins are used as negative pole pins.
  • Each type of light-emitting chip 104 is connected to a positive pin and a negative pin.
  • different types of light emitting chips 104 may also share the first conductive layer D1 and the second conductive layer D2.
  • Multiple light-emitting chips 104 of the same type of light-emitting chips 104 are connected in series.
  • the laser 10 is a monochromatic laser, and the multiple light-emitting chips 104 are used to emit laser light of the same color.
  • all light-emitting chips 104 in the laser 10 are connected in series, and the laser 10 only includes two conductive pins 103 . In this way, only one switch is needed to control the on-off of multiple light-emitting chips 104 .
  • the currents in the series circuit of multiple light-emitting chips 104 are equal, so the requirements for input current are relatively low, and the threshold current of each light-emitting chip 104 is easily reached, which is convenient for the light-emitting chips 104 to emit light.
  • the laser 10 includes multiple heat sinks 106 and multiple reflective prisms 107 , and the multiple reflective prisms 107 and multiple heat sinks 106 correspond to multiple light emitting chips 104 .
  • the heat sink 106 is disposed on the bottom plate 101 of the tube case 120 , and the light-emitting chip 104 is disposed on the corresponding heat sink 106 , and the heat sink 106 is used to assist the corresponding light-emitting chip 104 to dissipate heat.
  • the material of the heat sink 106 includes ceramics.
  • the reflective prism 107 is disposed on the light-emitting side of the corresponding light-emitting chip 104 .
  • the light-emitting chip 104 emits laser light to the corresponding reflective prism 107 , and the reflective prism 107 reflects the laser light in a direction away from the bottom plate 101 .
  • Fig. 5 is a structural diagram of the cross section A-A' of the laser 10 shown in Fig. 4 .
  • the laser 10 further includes a light-transmitting layer 108 .
  • the light-transmitting layer 108 is a plate-like structure located on a side of the frame 102 away from the bottom plate 101 , and is used to seal the accommodating space S enclosed by the frame 102 and the bottom plate 101 .
  • the material of the light-transmitting layer is glass, or other light-transmitting and highly reliable materials, such as resin materials.
  • the laser 10 further includes a cover plate 110 , and the cover plate 110 includes an inner edge region 110A and an outer edge region 110B.
  • the outer edge area 110B is fixed to the surface of the frame 102 away from the base plate 101
  • the inner edge area 110A is fixed to the transparent layer 108 .
  • the transparent layer 108 is fixed to the frame 102 through the cover plate 110 .
  • the inner edge region 110A of the cover plate 110 is recessed towards the base plate 101 relative to the outer edge region 110B.
  • the laser 10 further includes a supporting frame P.
  • Edges of the support frame P are fixed on the outer edge of the cover plate 110 away from the surface of the tube case 120 .
  • the light-transmitting layer 108 is first fixed to the support frame P, and the support frame P is then fixed to the cover plate 110 .
  • the support frame P is a rectangular frame with beams, so that the middle area of the light-transmitting layer 108 can be supported by the support frame P, thereby improving the firmness of the light-transmitting layer 108 .
  • At least one surface of the light-transmitting layer 108 near the bottom plate 101 and the surface away from the bottom plate 101 is attached with a brightness enhancement film to improve the light output brightness of the laser 10 .
  • the tube shell 120 , the cover plate 110 and the light-transmitting layer 108 form a closed accommodating space S, so that the light-emitting component 130 is placed in the closed accommodating space S, and water and oxygen are prevented from affecting the light-emitting component 130 . corrosion, so the life of the light-emitting component 130 can be extended.
  • the laser 10 further includes a collimating lens group 109, and the collimating lens group 109 is arranged on the side of the frame 102 away from the base plate 101, such as on the transparent layer 108 away from the base plate 101 side.
  • the collimator lens group 109 includes a plurality of collimator lenses T corresponding to the plurality of light-emitting chips 104 , and the collimator lenses T are used to collimate the incident laser light and can reduce the divergence angle of the incident laser light.
  • the collimating lens T can be made of glass, and multiple collimating lenses T are integrated. It should be noted that collimating the light refers to adjusting the divergence angle of the light so that the light is adjusted to be as close as possible to parallel light.
  • the laser light emitted by the light-emitting chip 104 is reflected by the corresponding reflective prism 107 to the light-transmitting layer 108 , the light-transmitting layer 108 transmits the laser light to the collimator lens T, and then emits after being collimated by the collimator lens T, thereby realizing the light emission of the laser 10 .
  • the height of the frame 102 becomes smaller, the height of the laser 10 becomes smaller correspondingly, and the total optical path becomes shorter.
  • the laser light emitted by the light-emitting chip 104 reaches the collimating lens T, its divergence angle becomes smaller.
  • the collimating lens The size of at least one dimension of T can be reduced, and the shape of the collimator lens T can no longer be too prolate. Since the area of the collimating lens T is small, the arrangement density of the collimating lens T increases, and thus the volume of the collimating lens group 109 can be reduced. Correspondingly, the distance between the light-emitting chip 104 and the corresponding reflective prism 107 is reduced, further reducing the volume of the laser.
  • the laser 10 further includes a printed circuit board 112 (Printed Circuit Board, PCB), and the printed circuit board 112 is arranged on the side of the connector 111 away from the light-emitting component 130.
  • PCB printed Circuit Board
  • the light-emitting chip 104 generally corresponds to a rated maximum operating temperature (such as 65° C.). If the light-emitting chip is in an environment higher than the maximum operating temperature, the life of the light-emitting chip will be affected, and the light-emitting chip may be directly damaged.
  • the laser 10' also includes two printed circuit boards 112'; a plurality of conductive pins 103' are fixed in the two opposite side walls of the frame 102', and are directly connected to the The printed circuit board 112' on this side is soldered.
  • the heat will be directly transferred to the accommodation space surrounded by the bottom plate 101 ′ and the frame 102 ′ through the conductive pin 103 ′, Furthermore, the light-emitting chip 104' disposed in the accommodating space is easily affected and damaged. Therefore, the reliability of the laser is low.
  • the laser 10 also includes a connector 111 .
  • the connector 111 is disposed on a side of the frame 102 away from the light emitting chip 104 .
  • the heat generated when the connector 111 is fixed can be conducted to the outside of the frame 102 through the connector 111 , but not directly transferred to the accommodating space S where the light-emitting chip 104 is located. Therefore, less heat is transferred to the light-emitting chip 104 , which can reduce the risk of damage to the light-emitting chip 104 and improve the reliability of the laser 10 .
  • the laser 10 further includes a plurality of first bonding pads H1, a plurality of second bonding pads H2 and a connection line H3.
  • the connection lines H3 and the plurality of first pads H1 are disposed on the bottom board 101 , and the plurality of first pads H1 are located at an edge region of the bottom board 101 .
  • the plurality of first pads H1 are connected to the second conductive layer D2 in the corresponding conductive pins 103 through corresponding connection lines H3.
  • the plurality of second pads H2 are disposed on the printed circuit board 112 and correspond to the plurality of first pads H1 .
  • Both ends of the connector 111 are respectively soldered to the first pad H1 and the corresponding second pad H2 , so that the connection between the second conductive layer D2 and the printed circuit board 112 can be realized.
  • two ends of the connector 111 are respectively welded to the first pad H1 and the corresponding second pad H2 by soldering.
  • the plurality of first pads H1 on the bottom board 101 are located at the edge regions on opposite sides of the bottom board 101, and the first pads H1 on one side of the two opposite sides are connected by a printed circuit board 112 to the positive pole of the power supply, and the first pad H1 on the other side is connected to the negative pole of the power supply through the printed circuit board 112 .
  • the material of the first pad H1 and the second pad H2 includes copper.
  • the connector 111 includes at least one bent portion L. As shown in FIG. As shown in FIG. 8 , the connector 111 has two bent portions L; alternatively, the connector 111 has three or even four bent portions L. Referring to FIG. In this way, the heat dissipation area of the connector 111 can be increased. The heat generated when the connector 111 is soldered to the first pad H1 and the second pad H2 can be quickly dissipated through the connector 111 , reducing the heat conducted to the area where the light-emitting chip 104 is located. When the connector 111 is heated, the bending portion L is compressed to a certain extent, which can release thermal stress and reduce the risk of damage to the connector 111 due to thermal stress, thereby ensuring the reliability of the connector 111 .
  • the connector 111 includes a first strip portion 111A, a second strip portion 111B and a third strip portion 111C connected in sequence, the first strip portion 111A is connected to the first pad H1 on the bottom board 101 , the second strip portion 111A The three strips 111C are connected to the second pad H2 on the printed circuit board 112, the extension direction of the first strip 111A (such as the Z direction) is perpendicular to the bottom plate 101, the extension direction of the third strip 111C (such as the Z direction) is perpendicular to the printed circuit board 112 .
  • the extension direction of the first strip 111A such as the Z direction
  • the third strip 111C such as the Z direction
  • the material of the connector 111 is an alloy containing silver. This material has better heat dissipation performance, which can further improve the heat dissipation efficiency during soldering and reduce the heat conducted to the light-emitting chip 104 .
  • FIG. 9 shows a schematic diagram by taking the laser 10 including a frame 102 and two light emitting chips 104 as an example.
  • the laser 10 may also include a plurality of frames 102, each frame 102 corresponds to a plurality of conductive pins 103, and the second conductive layer D2 in each conductive pin 103 is connected to the corresponding first conductive layer D2 through the connection line H3 in the base plate 101. Pad H1.
  • the number of light-emitting chips 104 can also be adjusted accordingly according to specific conditions.
  • the frame 102 and the conductive pins 103 are integrally structured.
  • the frame 102 is made of ceramics, such as aluminum nitride. Ceramic is an insulating material, so the frame 102 can insulate the bottom plate 101 , the first conductive layer D1 , and the second conductive layer D2 .
  • the bottom surface of the frame 102 has a larger area. When the bottom surface is used for welding with the bottom plate 101 , the contact area between the frame 102 and the bottom plate 101 is larger. Therefore, the firmness of welding between the bottom plate 101 and the frame 102 can be improved, thereby improving the reliability of the laser 10 .
  • the first conductive layer D1 on the frame 102 and the connected second conductive layer D2 serve as electrode pins. Since there is no need to open holes in the frame 102, the airtightness of the accommodating space S can be improved. In addition, in the process of manufacturing the laser 10 , there is no need to perform the steps of inserting the conductive pins into the openings and sealing the gap between the conductive pins and the openings, which can simplify the manufacturing process of the laser 10 .
  • the frame 102 includes four sidewalls connected end to end in sequence, respectively the opposite first sidewall 102A and the third sidewall 102C, and the opposite second sidewall 102B, and The fourth side wall 102D.
  • a plurality of conductive pins 103 are respectively located on the first sidewall 102A and the third sidewall 102C.
  • a plurality of first parts B1 are integrally formed into a first step J1
  • a plurality of second parts B2 are integrally formed into a second step J2
  • a plurality of third parts B3 are integrally formed.
  • a plurality of first conductive layers D1 are disposed on the first step J1
  • a plurality of second conductive layers D2 are disposed on the second step J2
  • the plurality of first conductive layers D1 correspond to the plurality of second conductive layers D2
  • the second step J2 corresponds to a plurality of second conductive layers D2.
  • a conductive layer D1 is connected to the corresponding second conductive layer D2, and is insulated from other first conductive layers D1 and other second conductive layers D2.
  • the first conductive layers D1 and the second conductive layers D2 can be spaced apart, so that the insulation of the first conductive layers D1 and the second conductive layers D2 can be achieved.
  • an insulating material may also be provided between adjacent first conductive layers D1 and between adjacent second conductive layers D2 to further ensure the insulation of each first conductive layer D1 and the insulation of each second conductive layer D2. insulation.
  • the laser 10 is a monochromatic laser. At this time, only two groups of interconnected first conductive layers D1 and second conductive layers D2 are provided on the frame 102 . One set of the first conductive layer D1 and the second conductive layer D2 is used as the positive lead, and another set of the first conductive layer D1 and the second conductive layer D2 is used as the negative lead.
  • the laser 10 is a multicolor laser, which includes at least two types of light-emitting chips 104, each type of light-emitting chip 104 is connected in series, and its two ends are respectively connected to two first conductive layers D1, and the first light-emitting chips 104 of different types are connected Conductive layer D1 is different.
  • the two ends of each type of light emitting chips 104 refer to the two connection ends of the plurality of light emitting chips 104 connected in series.
  • At least two types of light emitting chips 104 are arranged in two rows and multiple columns.
  • One row of light emitting chips 104 includes the first type of light emitting chips 104a, and the other row of light emitting chips 104 includes the second type of light emitting chips 104b and the third type of light emitting chips 104c.
  • the second-type light-emitting chips 104b and the third-type light-emitting chips 104c are respectively located in two areas on the base plate 101 , and the above two areas are arranged sequentially along the row direction of the light-emitting chips 104 (such as the X direction).
  • the wavelengths of the laser light emitted by the first type of light emitting chip 104 a , the second type of light emitting chip 104 b and the third type of light emitting chip 104 c decrease successively.
  • the first type of light-emitting chip 104a is used to emit red laser light
  • the second type of light-emitting chip 104b is used to emit green laser light
  • the third type of light-emitting chip 104c is used to emit blue laser light.
  • the second type of light emitting chips 104b and the third type of light emitting chips 104c are located in the same row, and one of the positive or negative pins of the second type of light emitting chips 104b is connected to a first conductive layer D1 of the row, and the third type of light emitting chips 104b One of the positive or negative pins of the chip 104c is connected to the other first conductive layer D1 of the row.
  • the other of the positive pin or the negative pin of the second type of light-emitting chip 104b needs to be connected to a first conductive layer D1 of other rows, and the other of the positive pin or the negative pin of the third type of light-emitting chip 104c needs to connected to another first conductive layer D1 of other rows.
  • the laser 10 further includes a plurality of transfer stations 113 arranged between two rows of light-emitting chips 104, and the plurality of transfer stations 113 are arranged in a row, here set 3 Take a switching station 113 as an example.
  • the transfer station 113 in the middle is connected to the two transfer stations 113 on both sides respectively, and the two transfer stations 113 on both sides are connected to the two first conductive layers D1 respectively.
  • the surface of the transfer table 113 far away from the bottom plate 101 can conduct electricity, so as to transfer the wires 105 .
  • the transfer station 113 includes a transfer station main body and a conductive layer located on a side of the transfer station main body away from the base plate 101 .
  • the main body of the transfer table is made of insulating material; the conductive layer is made of conductive material.
  • the size of the surface of the transfer table 113 away from the bottom plate 101 can be designed according to the arrangement requirements of the wires 105 .
  • One end of the second-type light-emitting chip 104b and one end of the third-type light-emitting chip 104c are both connected to a first conductive layer D1 corresponding to the location, and the other end is connected to the transfer platform 113, so as to connect with the location different from the location through the transfer station 113.
  • the transfer platform 113 located in the middle is located between the second type of light emitting chip 104b and the third type of light emitting chip 104c, so as to connect the second type of light emitting chip 104b and the third type of light emitting chip 104c to the transfer platform 113 .
  • the second-type light-emitting chips 104b and the third-type light-emitting chips 104c in the same row do not share the same set of first conductive layers D1 and second conductive layers D2, so that the second-type light-emitting chips 104b and the third-type light-emitting chips 104b
  • the light-emitting chips 104c are respectively connected to external power sources, and the arrangement of the wires 105 is more orderly.
  • the transfer platform 113 in the middle includes two insulated conductive regions, and the two conductive regions are arranged on the upper surface of the transfer platform 113 in the middle, and the two conductive regions are used to respectively connect the second type of light-emitting chip 104b and the third light-emitting chip 104c to ensure the normal transmission of current to the second-type light-emitting chip 104b and the third-type light-emitting chip 104c.
  • a set of first conductive layer D1 and second conductive layer D2 at the first side wall 102A is used as a positive pin
  • another set of first conductive layer D1 and second conductive layer D2 at the third side wall 102C is used as a pin. as the negative pin
  • the two first conductive layers D1 connected to each type of light-emitting chips 104 are respectively located on opposite sides of the frame 102 .
  • the left end of the second type light-emitting chip 104b is connected to the first conductive layer D1 on the first sidewall 102A
  • the right end is connected to the first conductive layer D1 on the third sidewall 102C through two transfer stages 113 .
  • the right end of the third type light-emitting chip 104c is connected to the first conductive layer D1 on the third sidewall 102C, and the left end is connected to the first conductive layer D1 on the first sidewall 102A through two transfer platforms 113 .
  • the laser 10 includes a plurality of frames 102 each enclosing a type of light emitting chip 104 .
  • FIG. 11 takes an example where the laser 10 includes three frames 102 , and the three frames 102 surround the first type light emitting chip 104 a , the second type light emitting chip 104 b and the third type light emitting chip 104 c respectively.
  • the light-emitting chips 104 in the laser 10 are respectively packaged through a plurality of frames 102, the number of light-emitting chips 104 arranged in the accommodating space S surrounded by each frame 102 is small, and the volume of each frame 102 is relatively small. Small, its contact area with the bottom plate 101 is small.
  • the bottom plate 101 includes a first region 101A and a second region 101B, the first region 101A surrounds the second region 101B, and the second region 101B protrudes relative to the first region 101A.
  • the frame 102 is fixed to the first area 101A, and a plurality of light-emitting chips 104 are disposed in the second area 101B, which is called the patch area of the bottom plate 101 .
  • the height difference between the first region 101A and the second region 101B is about the height of the first portion B1 or the second portion B2 of the conductive pin 103 , or may be slightly smaller than the height.
  • the linear distance between the light-emitting chip 104 and the first conductive layer D1 can be further shortened, the length of the wire 105 connecting the light-emitting chip 104 and the first conductive layer D1 can be shortened, and the strength of the wire 105 can be ensured to be high.
  • FIGS. 12-24 illustrate another laser according to some embodiments of the present disclosure. Only the differences between the lasers shown in FIGS. 12 to 24 and the lasers shown in FIGS. 2 to 6 will be described below, and the similarities will not be repeated here. It should be noted that in FIGS. 12 to 24 , the same reference numerals as those shown in FIGS. 2 to 6 are used for the same parts as those in the laser shown in FIGS. 2 to 6 . It should be noted that the lasers shown in FIG. 12 to FIG. 24 may use the conductive pins shown in FIG. 1 instead of the conductive pins shown in FIG. 2 to FIG. 6 .
  • the collimator lens T includes a first surface T1 and a second surface T2, the first surface T1 and the second surface T2 are two opposite surfaces in the collimator lens, and the first surface T1 is opposite to the second surface T2 closer to the package 120 .
  • the laser light emitted by the light-emitting component 130 passes through the light-transmitting layer 108 and shoots to the corresponding collimating lens T, and enters the collimating lens T through the first surface T1 of the collimating lens T, and then transmits in the collimating lens T, so that The collimator lens T exits through the second face T2 of the collimator lens T.
  • the first surface T1 is the light incident surface of the collimator lens T
  • the second surface T2 is the light output surface of the collimator lens T.
  • the collimation effect of the laser emitted by the laser will affect the energy of the laser, in the laser projection device, the collimation effect of the laser will affect its brightness.
  • the divergence angle of the laser light emitted by the light-emitting component on the fast axis is greater than that on the slow axis, and the divergence angle of the laser light on the fast axis is quite different from the divergence angle on the slow axis.
  • the fast axis and the slow axis are the directions of the two light vectors when light is transmitted, and the fast axis is perpendicular to the slow axis.
  • the slow axis of the laser beam directed to the collimator lens T is parallel to the X direction
  • the fast axis of the laser beam is perpendicular to the paper face direction.
  • the collimating lens in the collimating lens group includes two opposite surfaces.
  • one of the above two surfaces of the collimating lens is set as a plane,
  • the other setting is convex.
  • the collimating lens can collimate the incoming laser light through the function of the convex arc surface.
  • the convex arc surface is a part of the spherical surface, and the curvature of the convex arc surface in all directions is equal, so the convex arc surface reduces the divergence angle to the same degree on the fast axis and slow axis of the incident laser light, and the laser beam passing through the collimating lens
  • the divergence angle difference between the fast axis and the slow axis is still relatively large, so the collimation of the laser light emitted by the laser is poor.
  • the adjustment characteristics of the collimator lens T to the divergence angle and transmission direction of the incident laser light are determined by the curvatures of the first surface T1 and the second surface T2.
  • the shape of the collimator lens T will also be different.
  • the decrease in the divergence angle of the laser beam entering the collimator lens on the slow axis is smaller than the decrease in the divergence angle on the fast axis through various implementations, so that the laser light emitted from the collimator lens The divergence angle difference between the fast axis and the slow axis of the laser is reduced, thereby improving the collimation of the laser.
  • the first surface T1 of the collimating lens T is used to expand the divergence angle of the incident laser light on the slow axis; the second surface T2 is used to expand the divergence angle of the incident laser light on the fast axis and the slow axis.
  • the above divergence angles are all reduced.
  • the collimator lens T is cylindrical, and the first surface T1 of the collimator lens T is a concave arc surface to expand the divergence angle of the laser light on the slow axis.
  • the second surface T2 includes a convex arc surface to reduce the divergence angle of the incident laser light on both the fast axis and the slow axis.
  • the entire area of the first surface T1 is a concave arc surface
  • the entire area of the second surface T2 is a convex arc surface.
  • the first surface T1 has a radian in the first direction (such as the direction of the slow axis of the incident laser light, that is, the X direction) and the second direction (such as the direction of the fast axis of the incident laser light, that is, the direction of Y), and is
  • the radius of curvature on the axis is smaller than the radius of curvature on the fast axis.
  • the first direction is perpendicular to the second direction.
  • the curvature of the arc surface is the reciprocal of the radius of curvature, the curvature of the first surface T1 on the slow axis of the incident laser is greater than that on the fast axis, that is, the curvature of the first surface T1 on the slow axis is greater than that on the fast axis radians.
  • the concave arc surface has a diffusion effect on the incident light.
  • the divergence angle of the laser emitted by the light-emitting component on the fast axis is larger than the divergence angle on the slow axis, the divergence angle of the laser light on the slow axis after passing through the first surface T1 is different from the divergence angle on the fast axis smaller.
  • the laser beam in some embodiments of the present disclosure can reduce the angle difference between the fast axis and the slow axis after the laser beam passes through the first surface T1.
  • a partial area of the first surface T1 is a concave arc surface
  • a partial area of the second surface T2 is a convex arc surface.
  • the laser light is only irradiated to the partial area of the first surface T1 where the concave arc surface is located, and is emitted from the partial area of the second surface T2 where the convex arc surface is located.
  • the first surface T1 is a concave cylindrical surface, and the straight generatrix of the concave cylindrical surface is parallel to the second direction (such as parallel to the incident first surface
  • the fast axis direction of the laser light of T1 that is, the Y direction in FIG. 16).
  • Cylinder is a curved surface formed by the parallel movement of a straight line along a fixed curve.
  • the straight line is called the straight generatrix of the cylinder.
  • a cylinder is the portion of the side of a cylinder whose straight generatrix is parallel to the height of the cylinder.
  • the curvature of the concave cylinder on the fast axis of the incident laser is 0, the radius of curvature is infinite, and the curvature of the concave cylinder on the slow axis of the incident laser is greater than 0.
  • the divergence angle change of the laser beam incident on the first surface T1 on the fast axis is the same as the divergence angle of the laser beam incident on the flat glass.
  • the amount of change is similar, and the divergence angle of the laser on the fast axis basically does not change.
  • the degree of curvature of the first surface T1 is relatively large, and the divergence of the laser light on the slow axis is relatively large.
  • the divergence angle of the laser beam on the slow axis expands after it is injected into the first surface T1
  • the divergence angle of the laser beam on the fast axis remains basically unchanged after it is injected into the first surface T1 .
  • the difference between the divergence angle on the slow axis and the divergence angle on the fast axis is small.
  • the laser beam injected into the collimating lens is adjusted by the concave arc in the first surface T1 to adjust the divergence angle on the fast axis and the slow axis of the laser, or after adjusting the divergence angle on the slow axis of the laser, and then through
  • the convex arc surface of the second surface T2 is further collimated before being emitted, thereby ensuring that the laser emitted from the collimating lens T has a better collimating effect.
  • the curvature of the convex arc surface of the second surface T2 on the slow axis and the fast axis of the incident laser light is the same, that is, the curvature of the convex arc surface of the second surface T2 in the first direction and the second direction is the same, for example
  • a convex arc is a portion of a sphere.
  • the second surface T2 can only collimate the laser light as a whole, so that the divergence angle of the laser light on the fast axis
  • the reduction degree of the angle is similar to that of the divergence angle on the slow axis, so there is no need to design different curvatures of the convex arc surface of the second surface T2 in different directions, which simplifies the preparation process of the collimator lens.
  • the convex arc surface of the second surface T2 is a free-form surface, and its curvature radius on the slow axis of the incident laser light is larger than the curvature radius on the fast axis, that is, the convex arc surface of the second surface T2 is on the first
  • the radius of curvature in one direction is larger than the radius of curvature in the second direction
  • the curvature of the convex arc surface on the slow axis of the incident laser light is smaller than the curvature on the fast axis.
  • a curved surface with different curvature radii in different directions is called a free-form surface
  • the second surface T2 may be similar to a partial spherical surface of a football.
  • the convex arc surface has a converging effect on the incident light, and the smaller the radius of curvature of the convex arc surface, the greater the curvature of the convex arc surface, and the stronger the converging effect of the convex arc surface on the light, the less the divergence angle of the light Smaller quantities are bigger.
  • the convex arc surface can adjust the divergence angles of the incident laser light on the fast axis and the slow axis respectively, so that the degree of reduction of the divergence angle of the laser light on the slow axis is smaller than that on the fast axis.
  • the convex arc collimates the incoming laser light, which can ensure better collimation effect of the laser light emitted from the collimating lens T.
  • the convex arc surface of the second surface T2 it is close to parallel light on both the fast axis and the slow axis.
  • the required focal length of the collimator lens T can be set first, and then the specific parameters of the collimator lens T can be determined according to the focal length, such as the slow axis of the incoming laser light with the convex arc surface in the collimator lens T And the radius of curvature on the fast axis, and the radius of curvature of the concave arc surface.
  • multiple implementations of the first surface T1 of the collimator lens T can be combined with multiple implementations of the second surface T2, thereby obtaining four types of collimator lenses with different shapes.
  • both the first surface T1 and the second surface T2 are free-form surfaces; in the second type of collimating lens, the first surface T1 is a concave cylindrical surface and the second surface T2 is a convex free-form surface; In the third collimating lens, the first surface T1 is a free-form surface and the second surface T2 is a spherical surface; in the fourth collimating lens, the first surface T1 is a concave cylindrical surface and the second surface T2 is a spherical surface.
  • the radius of curvature of the concave arc surface in the first surface T1 and the convex arc surface in the second surface T2 satisfy a certain relationship, so as to ensure the collimation of the incident laser light by the collimating lens T The effect is better.
  • the curvature radius of the concave arc surface in the collimator lens T is greater than the curvature radius of the convex arc surface.
  • the curvature of the concave arc surface on the fast axis and the slow axis of the incident laser light The radii are larger than the curvature radii of the convex arc surface on the fast axis and the slow axis.
  • the radius of curvature of the concave arc surface refers to the radius of curvature of the concave arc surface on the slow axis.
  • the curvature radius of the concave arc surface on the fast axis of the incident laser light in the collimator lens is greater than the curvature radius of the convex arc surface on the fast axis, and the concave arc surface is on the slow axis of the incident laser light
  • the radius of curvature is greater than the radius of curvature of the convex arc surface on the slow axis, so that the collimator lens can collimate and converge the light, so that the divergence angle of the laser beam exiting the collimator lens is smaller than the divergence angle of the laser beam entering the collimator lens angle.
  • the concave arc surface can only reduce the divergence angle difference between the slow axis and the fast axis of the incident laser light to a certain extent, it is difficult to make the divergence angles of the laser light on the slow axis and the fast axis the same. Therefore, further adjustment is required through the convex arc surface to ensure the consistency of the collimation effect in different directions of the laser beam that finally exits the collimator lens.
  • the first surface T1 of the collimator lens is a plane
  • the second surface T2 of the collimator lens is a convex arc surface
  • the convex arc surface is a free-form surface
  • the convex arc surface The radius of curvature on the slow axis (X direction) of the incident laser light is larger than the curvature radius on the fast axis (Y direction).
  • the change degree of the first surface T1 to the divergence angle of the incident laser light on the slow axis is the same as the change degree of the divergence angle on the fast axis.
  • the difference between the divergence angle of the laser on the fast axis and the divergence angle on the slow axis is still large, so the divergence angle of the laser beam directed at the convex arc surface of the collimator lens T on the fast axis is different from that on the slow axis The difference in divergence angle is still large.
  • the converging effect of the convex arc surface on the fast axis of the injected laser light is stronger than that on the slow axis. effect, thereby reducing the divergence angle difference between the fast axis and the slow axis of the laser light emitted from the collimator lens T (that is, the laser light emitted from the convex arc surface).
  • the width of the collimator lens T on the fast axis (Y direction) of the incident laser light is greater than the width on the slow axis (X direction), that is, the top view of the collimator lens T It is rectangular.
  • the light spot of the laser light emitted by the light-emitting component 130 is elliptical when it hits the collimator lens T.
  • the long axis of the elliptical light spot is parallel to the long side direction of the rectangular collimator lens T, and the short axis of the elliptical light spot is parallel to the rectangular collimator lens T.
  • the short side direction of the collimating lens T is the long side direction of the collimating lens T.
  • the collimator lens group 109 is an integral structure. As shown in Fig. 20 and Fig. 21, the collimator lens group 109 includes a light incident surface M1 and a light exit surface M2, the light incident surface M1 and the light exit surface M2 are two opposing surfaces in the collimator lens group 109, and the light incident surface M1 is opposite to each other.
  • the light emitting surface M2 is close to the tube case 120 .
  • the light incident surface M1 includes a first surface T1 of each collimator lens T in the collimator lens group 109
  • the light output surface M2 includes a second surface T2 of each collimator lens T. For example, as shown in FIG.
  • the light incident surface M1 includes multiple concave arc surfaces
  • the light output surface M2 includes multiple convex arc surfaces
  • the part where each concave arc surface and the corresponding convex arc surface is located is a collimator lens T
  • the orthographic projection of each convex arc surface on the light incident surface of the collimator lens group 109 coincides with the orthographic projection of the corresponding convex arc surface on the light incident surface.
  • the light-incident surface M1 is a plane
  • the light-exit surface M2 includes a plurality of convex arc surfaces
  • a collimating lens T is located on each convex arc surface.
  • the collimator lens group 109 is composed of multiple independent collimator lenses T.
  • the support frame P has a plurality of hollow areas (not shown in the figure), and each collimator lens T covers one hollow area in the plurality of hollow areas.
  • the multiple hollowed out areas correspond to the multiple light emitting components 130 in the laser 10 , and the laser light emitted by each light emitting component 130 passes through the corresponding hollowed out area and shoots to the collimating lens T covering the hollowed out area.
  • the laser 10 is a multi-chip laser diode (MCL) type laser. As shown in FIG. 23 , multiple light emitting components 130 in the laser 10 are arranged in an array. FIG. 23 takes the laser 10 including 20 light emitting components 130 arranged in four rows and five columns as an example.
  • MCL multi-chip laser diode
  • the parameters of each collimating lens T in the collimating lens group 109 are the same.
  • the laser 10 is a polychromatic MCL laser, it includes multiple types of light emitting components 130 , and the collimator lens group 109 includes multiple collimator lenses T with different parameters.
  • the divergence angles of the laser light emitted by different types of light emitting components 130 may be different, and the corresponding collimator lens T in the collimator lens group 109 can be designed according to the divergence angles of the laser light emitted by each light emitting component 130 .
  • the parameters of each collimating lens T in the collimating lens group 109 may also be the same.
  • the multiple light emitting components 130 include a first light emitting component for emitting laser light of a first color, and a second light emitting component for emitting laser light of a second color.
  • the divergence angle of the laser light of the first color is smaller than the divergence angle of the laser light of the second color.
  • the collimator lens group 109 satisfies the reduction of the divergence angle of the incident laser light by the collimator lens corresponding to the first light-emitting component, which is smaller than the decrease of the divergence angle of the incident laser light by the collimator lens corresponding to the second light-emitting component .
  • the radius of curvature of the concave arc surface in the collimating lens corresponding to the first light emitting component is smaller than the curvature radius of the concave arc surface in the collimating lens corresponding to the second light emitting component; and/or, the convex in the collimating lens corresponding to the first light emitting component
  • the curvature radius of the arc surface is greater than the curvature radius of the concave arc surface in the collimating lens corresponding to the second light emitting component.
  • the first color includes blue and green
  • the first light-emitting component includes a blue light-emitting component and a green light-emitting component
  • the second color is red
  • the second light-emitting component is a red light-emitting component.
  • the divergence angle of the red laser light emitted by the red light-emitting component is greater than the divergence angle of the blue laser light emitted by the blue light-emitting component, and greater than the divergence angle of the green laser light emitted by the green light-emitting component.
  • the divergence angles of the red laser light on the fast axis and the slow axis are larger than the divergence angles of the green laser light and the blue laser light on the fast axis and the slow axis.
  • the divergence angle of the red laser on the fast axis is greater than that of the green laser and the blue laser on the fast axis
  • the divergence angle of the red laser on the slow axis is greater than that of the green laser and the blue laser on the slow axis
  • the divergence angle of the red laser light on the slow axis is smaller than that of the blue laser light and the green laser light on the fast axis.
  • the reduction of the divergence angle of the laser light by the collimating lens corresponding to the light-emitting component emitting each color of laser light can be adjusted accordingly, Such as adjusting the curvature radius of the convex arc surface of the collimating lens on the fast axis and the slow axis.
  • the divergence angle of the blue laser light on the fast axis is greater than the divergence angle of the red laser light on the slow axis, and smaller than the divergence angle of the red laser light on the fast axis of the incident laser light.
  • the first surface T1 of the collimator lens T is a concave arc surface or a concave cylindrical surface
  • the second surface T2 is a convex arc surface
  • the radius of curvature is greater than the radius of curvature of the concave arc surface on the slow axis in the collimator lens directed by the red laser light, and smaller than the curvature radius of the concave arc surface on the fast axis in the collimator lens directed by the red laser light.
  • the radius of curvature of the convex arc surface on the slow axis in the collimator lens directed by the blue laser light is smaller than the radius of curvature of the convex arc surface on the slow axis in the collimator lens directed by the red laser light, and greater than the radius of curvature of the convex arc surface on the slow axis in the collimator lens directed by the red laser light.
  • the radius of curvature of the concave arc in the collimating lens on the fast axis If the first surface T1 of the collimator lens T in the collimator lens group is a plane, and the second surface T2 is a convex arc surface, then the radius of curvature of the convex arc surface on the fast axis in the collimator lens directed by the blue laser is, It is larger than the curvature radius of the convex arc surface on the fast axis in the collimating lens directed by the red laser light, and smaller than the curvature radius of the convex arc surface on the slow axis in the collimating lens directed by the red laser light. For other size relationships of the divergence angles of the laser beams of each color, the same can be deduced, which will not be repeated here.
  • multiple light-emitting points may be set in the red light-emitting component of the laser, and only one light-emitting point may be set in the blue light-emitting component and the green light-emitting component.
  • the laser light spot emitted by each light-emitting component in the laser 10 is prolate, and the aspect ratio of the formed light spot can be reduced after the laser beam is emitted through the collimating lens.
  • a plurality of light-emitting chips 104 in the laser 10 are arranged in an array, and a plurality of collimating lenses T in the collimating lens group 109 are also arranged in an array, and the row direction of the light-emitting chips 104 is the same as that of the collimating lenses T,
  • the row direction of the light emitting chips 104 is the same as the row direction of the collimator lenses T.
  • the light emitting direction of the light emitting chips 104 is perpendicular to the row direction of the plurality of light emitting chips 104 and parallel to the column direction of the plurality of light emitting chips 104 .
  • the slow axis of the laser light emitted by the light emitting chip 104 is parallel to the row direction. When the laser light is directed to the collimating lens group 109 , the slow axis is parallel to the row direction of the collimating lens T, and the fast axis is parallel to the column direction of the collimating lens T.
  • the light-emitting chip 104 is in the shape of a cuboid, which includes an end face G opposite to the corresponding reflective prism 107 , and the laser light is emitted from the end face G.
  • the actual light emitting area in the end face G is rectangular.
  • the length direction of the rectangular light emitting area is parallel to the board surface of the bottom board 101 , and the width direction is perpendicular to the board surface of the bottom board 101 .
  • the fast axis of the laser light emitted by the light emitting chip 104 is parallel to the width direction, and the slow axis of the laser light is parallel to the length direction.
  • the collimating effect of the collimating lens T on the laser in a certain direction is related to the width of the light exit area of the laser in this direction. If only the collimating lens with the same curvature on the slow axis and the fast axis is used to collimate the laser light emitted by the light-emitting chip 104, when the divergence angle on the fast axis is reduced to ensure that the laser beam is collimated on the fast axis, the There is a difference between the divergence angle on the slow axis and the divergence angle on the fast axis, which is not conducive to laser shaping and subsequent propagation.
  • the divergence angle and The divergence angles in the fast axis direction are adjusted separately, thereby improving the shaping and collimating effect of the collimating lens on the laser.
  • the light-emitting components in the laser 10' are arranged in regular rows and columns, and each light-emitting component has necessary gaps in the row direction and the column direction, and correspondingly the collimator lens group 109'
  • the collimating lenses T' are also arranged in regular rows and columns.
  • the laser light emitted by the light-emitting component has an aperture angle.
  • the area of the collimator lens T’’s orthographic projection on the base plate needs to be larger than the area of the spot formed by the laser light emitted by the corresponding light-emitting component.
  • FIGS. 26-31 illustrate yet another laser according to some embodiments of the present disclosure. Only the differences between the lasers shown in FIGS. 26 to 31 and the lasers shown in FIGS. 2 to 6 will be described below, and the similarities will not be repeated. It should be noted that in FIGS. 26 to 31 , the same reference numerals as those shown in FIGS. 2 to 6 are used for the same parts as those in the laser shown in FIGS. 2 to 6 . It should be noted that the lasers shown in FIG. 26 to FIG. 31 may use the conductive pins shown in FIG. 1 instead of the conductive pins shown in FIG. 2 to FIG. 6 . The arrangement of the collimator lenses T in some embodiments of the present disclosure will be described below.
  • the collimator lens T is elongated as a whole, the maximum length of the collimator lens T in the first direction is greater than the maximum length in the second direction, and the first direction is perpendicular to the second direction.
  • the first direction is the column direction of the collimator lenses T
  • the second direction is the row direction of the collimator lenses T.
  • the collimator lens T includes two end portions and an intermediate portion T5 between the two end portions in the column direction, the two end portions include an upper end portion T3 and a lower end portion T4, and the width of the upper end portion T is and the width of the lower end portion T4 are respectively smaller than the width of the middle portion T5.
  • the width of the end portion and the width of the middle portion refer to the width in the row direction; the end portion and the middle portion of the collimator lens are only relative concepts, and the end portion only refers to a part of the area located at both ends of the collimator lens , the middle portion represents the area other than the end portion of the collimator lens, which is not a precisely divided area.
  • the orthographic projection of each collimating lens T on the base plate 101 is elliptical, the long axis of the ellipse is parallel to the column direction (Y direction) of the collimating lens T, and the short axis is parallel to the row direction of the collimating lens T (X direction).
  • the size of the initial spot of the laser light emitted by the light emitting component 130 on the fast axis is smaller than that on the slow axis.
  • the laser light spot is elliptical.
  • the long axis of the elliptical light spot is parallel to the column direction of the collimator lens T, and the short axis of the elliptical light spot is parallel to the row direction of the collimator lens T.
  • the width of the upper end T3 and the width of the lower end T4 of the collimator lens T in the column direction are smaller than the width of the middle part T5, so that it can be guaranteed
  • the shape of the collimating lens T is closer to the shape of the light spot formed by the laser on the collimating lens T, and then the size of the collimating lens T can be reduced on the basis of ensuring receiving laser light.
  • any two adjacent rows of collimating lenses T among the multiple rows of collimating lenses T in the collimating lens group 109 are arranged alternately.
  • the staggered arrangement of two rows of collimator lenses T means that the two rows of collimator lenses T are misaligned in the column direction (Y direction), and the two rows of collimator lenses T are not aligned in the column direction, that is, they belong to two rows and are adjacent to each other.
  • the line connecting the two collimating lenses T is not parallel to the column direction.
  • the line connecting the two collimating lenses T refers to the connecting line between the centers of the two collimating lenses T.
  • the two rows of collimator lenses T may be completely shifted, or may be shifted only partially.
  • Full misalignment means that any two collimator lenses T in the two rows of collimator lenses T are not aligned in the column direction.
  • Partial misalignment means that some of the collimator lenses T in the two rows of collimator lenses T are aligned in the column direction. There is also some misalignment of the collimating lenses T in the column direction.
  • Some embodiments of the present disclosure take as an example that any two adjacent rows of collimator lenses T are all misaligned in the column direction. If two rows of collimating lenses T are misaligned, each collimating lens T in a row of collimating lenses T is located between two adjacent collimating lenses T in an adjacent row of collimating lenses T, or in the row direction The adjacent row of collimating lenses T is outside.
  • the second collimator lens T of the first row of collimator lenses T in FIG. 26 is located at the first collimator lens T and the second collimator lens T of the second row of collimator lenses T Between; the first collimator lens T in the first row of collimator lenses T is located on the left side of the second row of collimator lenses T in the x direction, and is located outside the second row of collimator lenses T.
  • any two adjacent rows of collimating lenses T in the collimating lens group 109 there is a collimating lens T that satisfies the end portion of the collimating lens T that is close to another row of collimating lenses T, at least partly located in two adjacent rows of collimating lenses T in another row Between the two ends of a collimating lens T.
  • a collimator in another row of collimator lenses T At least part of the end of the straight lens T. That is, as shown in FIG.
  • the orthographic projections of two adjacent rows of collimating lenses overlap.
  • the lower end of the second collimating lens T in the first row of collimating lenses T is located at the second row of collimating lenses Between the upper end of the first collimator lens T and the second collimator lens T in T.
  • adjacent rows of collimator lenses T are arranged in a staggered manner, and the space between the ends of two adjacent collimator lenses T in each row is collimated by another row.
  • the end of the lens T is occupied, so that the space utilization rate in the collimator lens group 109 can be improved, and the arrangement of the collimator lens T is more compact.
  • the gap between adjacent collimating lenses T is smaller, and the arrangement density is higher.
  • the laser light emitted by the light-emitting component 130 can be directed toward the collimating lens T as much as possible instead of the invalid gap between the collimating lenses T, so the laser light emitted by the light-emitting component can be used more, reducing the optical loss of the laser 10 .
  • the arrangement of the collimating lenses T is relatively compact, the area occupied by a certain number of collimating lenses T is relatively small. Therefore, only a small volume is required to realize the light-emitting components and collimating lenses in the laser 10. The arrangement of is beneficial to improve the miniaturization of the laser 10 .
  • FIG. 26 is illustrated by taking the orthographic projection of the collimator lens T on the base plate 101 as an ellipse as an example.
  • the orthographic projection of the collimator lens T on the base plate 101 may also be in other shapes.
  • the shape of the orthographic projection of the collimator lens T on the base plate 101 is directly referred to as the shape of the collimator lens T below.
  • the orthographic projection of the collimator lens T on the base plate 101 is in the shape of a capsule.
  • the capsule shape is surrounded by two opposite and parallel straight sides and two opposite arc sides.
  • the capsule shape is equivalent to the shape obtained by cutting off a part of the left and right ends of the ellipse along the long axis of the ellipse; or equivalent to cutting off a part of the opposite ends of the circle along the diameter direction of the circle shape.
  • the orthographic projection of the collimator lens T on the base plate 101 is hexagonal, and the maximum length of the hexagon in the Y direction is greater than the maximum length in the X direction. Adjacent sides of any adjacent collimator lenses T overlap, and the collimator lenses T in the collimator lens group 109 are arranged in a honeycomb shape.
  • the hexagon is an axisymmetric figure, and one axis of symmetry is parallel to the Y direction.
  • the hexagon may also have another axis of symmetry, the other axis of symmetry being parallel to the X direction.
  • the first collimator lens T in the first row of collimator lenses T it includes a first axis of symmetry Z1 and a second axis of symmetry Z2, the first axis of symmetry Z1 is parallel to the Y direction, and the second axis of symmetry Z2 parallel to the X direction.
  • the first axis of symmetry Z1 is a straight line where a diagonal of the hexagon is located, and bisects two diagonals of the hexagon.
  • the collimator lens group 109 includes collimator lenses T with various shapes, and the collimator lenses T include a first-type collimator lens T10 whose orthographic projection on the base plate 101 has a target shape.
  • the collimator lenses T include a first-type collimator lens T10 whose orthographic projection on the base plate 101 has a target shape.
  • the row of collimating lenses T in the middle is the first type of collimating lens T10.
  • the target shape is surrounded by six sides, as please refer to the labeling of the first collimating lens T in the second row in FIG. 30 , the six sides are marked a1, a2, a3, a4, a5 and a6 respectively.
  • the six sides include parallel and opposite straight sides a1 and a4, arc sides a2 and a3 respectively connecting one ends of the two straight sides, and arc sides a5 and a3 respectively connecting the other ends of the two straight sides Arc edge a6, the arc edge is concave toward the target shape.
  • the straight side a1 and the straight side a4 are parallel to the y direction, one end of the two straight sides is the upper end, and the other end of the two straight sides is the lower end.
  • the collimator lens T further includes a second type of collimator lens T20 , whose orthographic projection on the base plate 101 is in an auxiliary shape.
  • the auxiliary shape may be similar to the target shape, except that the edges of the collimator lens T20 of the second type that are not adjacent to other collimator lenses T are straight sides.
  • the second type of collimator lens T20 is located at the edge of the collimator lens group 109 . As shown in FIG.
  • the collimator lens T located in the fourth row has an auxiliary shape
  • the rightmost collimator lens T in the second row also has an auxiliary shape
  • the collimator lens T in the fourth row in FIG. 30 and the rightmost collimator lens T in the second row can also be in the target shape.
  • the edges of the second type of collimator lens T20 that are not adjacent to other collimator lenses are partial edges of an ellipse.
  • the auxiliary shape is equivalent to the part of the ellipse that needs to be adjacent to other collimator lenses, Change to a straight edge or an inwardly concave arc edge, and the other parts remain unchanged.
  • any two adjacent collimator lenses T located in adjacent rows are in contact with each other.
  • the first collimator lens T and the second collimator lens T in the first row of collimator lenses T and the second row of collimator lenses T The first collimator lens T in the first row of collimator lenses T is adjacent; The upper end portion of one collimator lens T is in contact.
  • FIG. 26 and FIG. 28 when the collimator lens T is in the shape of an ellipse or a capsule, only a few edges of two adjacent collimator lenses located in adjacent rows may be in contact. As shown in FIG.
  • the collimator lens T when the collimator lens T is hexagonal, at least one edge of two adjacent collimator lenses located in adjacent rows coincides.
  • the first collimator lens T of the first row of collimator lenses T overlaps with the first collimator lens T of the second row of collimator lenses T.
  • the edge of the first type of collimating lens T10 coincides with the edge of the adjacent elliptical collimating lens T in another row
  • the edge of the second type of collimating lens T The edge of lens T20 coincides with the edge of its elliptical collimating lens T adjacent in another row.
  • any two collimating lenses located in the same row and adjacent to each other are in contact.
  • the edges of the first collimator lens T and the second collimator lens T in the first row of collimator lenses T are in contact with each other.
  • the collimator lenses T are elliptical, only a small portion of the edges of two adjacent collimator lenses T in the same row are in contact.
  • the right edge of the first collimator lens T and the left edge of the second collimator lens T in the first row only have one point of contact.
  • the space utilization of the collimating lenses can be further improved, and the area waste of the collimating lens group 109 can be avoided.
  • the collimating lens T is used to collimate the laser light emitted by the corresponding light-emitting component 130, in order to realize the normal operation of the laser 10, it is necessary to ensure that the laser light emitted by each light-emitting component 130 is directed to the corresponding collimating lens T, so the laser 10
  • the arrangement of the collimator lenses T must correspond to the arrangement of the light emitting components 130 .
  • the arrangement of the plurality of light emitting components 130 is the same as that of the collimator lenses T shown in FIGS. 26 , 28 , 29 and 30 .
  • a plurality of light-emitting assemblies 130 are arranged in multiple rows, and any two adjacent rows of light-emitting assemblies 130 are arranged alternately.
  • staggered arrangement of the light emitting components 130 reference may be made to the relevant introduction on the staggered arrangement of collimator lenses T in the embodiments of the present disclosure, which will not be repeated here.
  • the collimator lenses T in every row can be arranged in a dislocation, or aligned in the column direction.
  • Some embodiments of the present disclosure take the collimator lenses T aligned in the column direction as an example.
  • Interval rows of collimator lenses refer to two rows of collimator lenses separated by one row in the middle; that is, in the collimator lens group 109, they are respectively located on both sides of any row of collimator lenses T in the column direction and are aligned with the row of collimator lenses. T two adjacent rows of collimating lenses.
  • the second row of collimator lenses T and the fourth row of collimator lenses T are also spaced rows of collimator lenses T, which are aligned in the column direction.
  • the alignment of the two rows of collimating lenses in the column direction means that the two collimating lenses respectively located in the two rows, one directly below the other, and the line connecting the two collimating lenses is parallel to the column direction.
  • the number of collimating lenses T in each row of the collimating lens group 109 is equal. As shown in FIG. 26 , FIG. 28 , FIG. 29 and FIG. 30 , the number of collimating lenses T in each row of the collimating lens group 109 is seven as an example. Of course, the numbers of collimating lenses T in different rows may also be unequal.
  • the number of collimating lenses T can be determined according to the setting requirements of the light emitting component 130 . For example, the brightness required by the laser 10 needs to be realized by 20 light-emitting chips 104 , then the laser 10 needs to include 20 light-emitting components 130 , and correspondingly, the collimating lens group 109 needs to include 20 collimating lenses T. For example, the distance between any two adjacent light-emitting chips 104 in the row direction is equal.
  • the light-emitting chip 104 Since the light-emitting chip 104 generates heat when emitting light, the heat can spread to the surroundings.
  • the heat generated by the light-emitting chips 104 in the middle area of the base plate 101 has a high degree of overlap, and heat accumulation in the middle area is significant, resulting in a high probability of heat damage to the light-emitting chips 104 .
  • the heat generated by the light-emitting chip 104 in the edge area can be diffused to the outer area of the base plate 101 where the light-emitting chip 104 is not provided. of heat. Therefore, for example, in the package 120 , the number of light emitting assemblies 130 located in the middle area is less than the number of light emitting assemblies 130 located in the edge area.
  • the number of collimator lenses T in each row located in the middle area is less than the number of collimator lenses T in each row located in the edge area.
  • the heat emitted by the light-emitting chips 104 in the middle area can be reduced, and the heat received by the middle area of the bottom plate 101 can be reduced, thereby reducing the heat density per unit area, and increasing the heat dissipation area of each light-emitting chip 104 in the middle area, which is convenient for the middle area.
  • the heat in the area is dissipated quickly, which reduces the probability of damage to the light-emitting chip 104 in the middle area due to heat, and improves the reliability of the laser 10 .

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Abstract

一种激光器（10），包括底板（101）、框架（102）、多个发光组件（130）、多个导电引脚（103）和导线（105）。框架（102）设置于底板（101）上，且包括间隔设置于框架（102）靠近底板（101）的端部的多个缺口（K）。多个发光组件（130）固定于底板（101）上，框架（102）包围多个发光组件（130）。多个导电引脚（103）中的一个导电引脚（103）位于多个缺口（K）中的一个缺口（K）中。导电引脚（103）包括基底（1031）、连接层（D3）和导电层（1032）。基底（1031）与底板（101）绝缘；连接层（D3）嵌设于基底（1031）的内部；导电层（1032）设置于基底（1031）远离底板（101）的一侧的表面上，且与连接层（D3）电连接。导线（105）的一端与导电层（1032）电连接、导线（105）的另一端与多个发光组件（130）中的至少一个发光组件（130）连接。

Description

激光器
本申请要求于2021年12月31日提交的、申请号为202111672608.5的中国专利申请的优先权，于2021年9月6日提交的、申请号为202111038583.3的中国专利申请的优先权，于2021年9月7日提交的、申请号为202111045935.8的中国专利申请的优先权，以及于2021年12月31日提交的、申请号为202123444019.X的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及光电技术领域，尤其涉及一种激光器。
背景技术
随着光电技术的发展，激光器被广泛应用，例如，激光器可以作为激光投影设备或激光电视的光源。因此，对激光器的小型化以及可靠性的要求也越来越高。
发明内容
一方面，本公开一些实施例提供一种激光器。所述激光器包括底板、框架、多个发光组件、多个导电引脚和导线。所述框架设置于所述底板上，且包括间隔设置于所述框架靠近所述底板的端部的多个缺口。所述多个发光组件固定于所述底板上，所述框架包围所述多个发光组件。所述多个导电引脚中的一个导电引脚位于所述多个缺口中的一个缺口中。所述导电引脚包括基底、连接层和导电层。所述基底与所述底板绝缘；所述连接层嵌设于所述基底的内部；所述导电层设置于所述基底远离所述底板的一侧的表面上，且与所述连接层电连接。所述导线的一端与所述导电层电连接、所述导线的另一端与所述多个发光组件中的至少一个发光组件连接。
另一方面，本公开一些实施例提供一种激光器。所述激光器包括底板、框架、多个发光组件、透光层、盖板和准直镜组。所述框架设置于所述底板上，所述框架远离所述底板的一侧具有开口。所述多个发光组件固定于所述底板上且被配置为发出激光，且所述框架包围所述多个发光组件。所述透光层设置于所述管壳的所述开口所在侧。所述盖板包括内边缘区域与外边缘区域，所述外边缘区域与所述框架远离所述底板的表面固定，所述内边缘区域与所述透光层的边缘固定。所述准直镜组设置于所述透光层远离所述管壳的一侧；所述准直镜组包括多个准直透镜；所述多个准直透镜中的一个准直透镜被配置为减小射入的激光的发散角度，且使所述激光在慢轴上的发散角度减小量小于在快轴上的发散角度减小量。
又一方面，本公开一些实施例提供一种激光器。所述激光器包括底板、框架、多个发光组件、透光层、盖板和准直镜组。所述框架设置于所述底板上，所述框架远离所述底板的一侧具有开口。所述多个发光组件固定于所述底板上且被配置为发出激光，且所述框架包围所述多个发光组件。所述透光层设置于所述管壳的所述开口所在侧。所述盖板包括内边缘区域与外边缘区域，所述外边缘区域与所述框架远离所述底板的表面固定，所述内边缘区域与所述透光层的边缘固定。所述准直镜组设置于所述透光层远离所述管壳的一侧；所述准直镜组包括多个准直透镜，所述多个准直透镜在行方向上排成多行并且列方向上排成多列；所述多个准直透镜中的一个准直透镜在所述列方向上的最大长度大于在所述行方向上的最大长度，且在所述列方向上的两个端部的宽度均小于中间部的宽度。所述多个准直透镜中相邻的两行准直透镜交错排布；且所述相邻的两行准直透镜中，存在准直透镜满足其靠近另一行准直透镜的端部，至少部分位于所述另一行准直透镜中相邻的两个准直透镜的两个端部之间。
附图说明
图1是根据相关技术提供的一种激光器的结构图；
图2是根据本公开一些实施例提供的一种激光器的结构图；
图3是根据本公开一些实施例提供的一种激光器的爆炸结构图；
图4是根据本公开一些实施例提供的一种激光器的结构图；
图5是根据本公开一些实施例提供的一种激光器的结构图；
图6是根据本公开一些实施例提供的另一种激光器的结构图；
图7是根据相关技术提供的一种激光器的结构图；
图8是根据本公开一些实施例提供的又一种激光器的结构图；
图9是根据本公开一些实施例提供的另一种激光器的结构图；
图10是根据本公开一些实施例提供的另一种激光器的结构图；
图11是根据本公开一些实施例提供的又一种激光器的结构图；
图12是根据本公开一些实施例提供的再一种激光器的结构图；
图13是根据本公开一些实施例提供的一种准直透镜的结构图；
图14是根据本公开一些实施例提供的另一种准直透镜的结构图；
图15是根据本公开一些实施例提供的再一种准直透镜的结构图；
图16是根据本公开一些实施例提供的又一种准直透镜的结构图；
图17是根据本公开另一些实施例提供的一种准直透镜的结构图；
图18是根据本公开另一些实施例提供的另一种准直透镜的结构图；
图19是根据本公开一些实施例提供的一种准直镜组的结构图；
图20是根据本公开一些实施例提供的另一种准直镜组的结构图；
图21是根据本公开一些实施例提供的再一种准直镜组的结构图；
图22是根据本公开一些实施例提供的又一种准直镜组的结构图；
图23是根据本公开一些实施例提供的又一种激光器的结构图；
图24是图23中截面B-B’的结构图；
图25是根据相关技术提供的另一种激光器的结构图；
图26是根据本公开一些实施例提供的又一种激光器的结构图；
图27是图26所示的激光器的截面D-D’的结构图；
图28是根据本公开一些实施例提供的再一种激光器的结构图；
图29是根据本公开一些实施例提供的又一种激光器的结构图；
图30是根据本公开一些实施例提供的又一种激光器的结构图；
图31是根据本公开一些实施例提供的又一种激光器的结构图。
附图标记：
10-激光器；105-导线；112-印制电路板；P-支撑框；113-转接台；
103-导电引脚；B1-导电引脚的第一部分；B2-导电引脚的第二部分；B3-导电引脚的第三部分；D1-第一导电层；D2-第二导电层；D3-连接层；
120-管壳；101-底板；H1-第一焊盘；H2-第二焊盘；H3-连接线路；101A第一区域；101B-第二区域；102-框架；K-缺口；102A-框架的第一侧壁；102B-框架的第二侧壁；102C-框架的第三侧壁；102D-框架的第四侧壁；J1-第一台阶；J2-第二台阶；S-容置空间；
130-发光组件；104-发光芯片；104a-第一类发光芯片；104b-第二类发光芯片；104c-第三类发光芯片；G-发光芯片的端面；106-热沉；107-反射棱镜；108-透光层；109-准直镜组；T-准直透镜；T1-准直透镜的第一面；T2-准直透镜的第二面；T3-准直透镜的上端部；T4-准直透镜的下端部；T5-准直透镜的中间部；M1-准直透镜的入光面；M2-准直透镜的出光面；a1-直边；a4-直边；a2-弧边；a3-弧边；a5-弧边；a6-弧边；T10-第一类准直透镜；T20-第二类准直透镜；
110-盖板；110A-盖板的内边缘区域；110B-盖板的外边缘区域；
111-连接器；L-弯折部；111A-第一条状部；111B-第二条状部；111C-第三条状部；
10’-激光器；101’-底板；102’-侧壁；103’-导电引脚；104’-发光芯片；105’-导线。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
图2至图6为根据本公开一些实施例的一种激光器。如图2至图4所示，激光器10包括管壳120、多个导电引脚103、多个发光组件130和导线105。管壳120包括底板101与框架102，管壳120的一侧具有开口，框架102中远离底板101的开口即为管壳120的开口。框架102与多个发光组件130均固定于底板101，框架102呈环形，底板101与框架102围成容置空间S，发光组件130设置于该容置空间S中。框架102包括多个缺口K，多个缺口K设置于框架102靠近底板101的一侧，且相互间隔。多个缺口K与多个导电引脚103对应，且导电引脚103的形状与对应的缺口K的形状相匹配，导电引脚103填充对应的缺口K。
管壳120中的底板101与框架102为一体结构，或者也可以为独立的结构，二者通过焊接在一起形成管壳120。管壳120的材质可以为铜，如无氧铜。由于铜的导热系数较大，因此可以保证发光组件130在工作时产生的热量可以快速地通过管壳120进行传导，进而较快地散发，避免热量聚集对发光组件130造成损伤。管壳的材质也可以为铝、氮化铝和碳化硅中的一种或多种。
在一些实施例中，如图3所示，发光组件130包括发光芯片104，导电引脚103包括基底1031和位于基底1031上的导电层1032。基底1031包括依次连接的第一部分B1、第二部分B2和第三部分B3，第三部分B3设置于第一部分B1与第二部分B2之间。导电层1032包括第一导电层D1。基底1031中的第三部分B3被框架102覆盖，第一导电层D1设置于第一部分B1远离底板101的一侧，第一导电层D1通过导线105与发光芯片104连接。
基底1031对第一导电层D1起承载作用，且基底1031可以使第一导电层D1与激光器10中的其他部件相隔离，避免激光器10中的其他部件对第一导电层D1的导电效果产生影响。示例地，基底1031可以隔离第一导电层D1与底板101，以及隔离第一导电层D1与框架102。在一些实施例中，导电引脚103通过钎焊的方式固定于对应的缺口K处,此时，第一部分B1位于容置空间S内，第二部分B2位于容置空间S外。示例地，将导电引脚103的第三部分B3对准并卡入对应的缺口K，在导电引脚103与对应的缺口K之间设置焊料。之后将缺口K处卡有导电引脚103的框架102放置于高温炉中进行烧结，使该焊料熔化，以将导电引脚103固定于对应的缺口K处，且保证导电引脚103与对应的缺口K的连接处的密封。示例地，在焊接导电引脚103与框架102之前，将第一导电层D1设置于基底1031上，此时，第一导电层D1与基底1031为一体结构。或者，在基底1031与框架102固定后，再将第一导电层D1设置在基底1031上，此时，第一导电层D1与基底1031不是一体结构。
在将全部导电引脚103固定于各自对应的缺口K处后，将由框架102与导电引脚103组成的整体结构焊接于底板101上，且该整体结构中的导电引脚103所在侧与底板101接触。底板101、框架102以及多个导电引脚103围成容置空间S，进而可以将发光组件130固定于容置空间S中。之后，在导电引脚103中的第一导电层D1与靠近导电引脚103的发光芯片104之间、以及需要串联的发光芯片104之间设置导线105，以使导电引脚103与发光芯片104电连接。
在一些实施例中，采用球焊技术以在第一导电层D1及发光芯片104上固定导线105。在采用球焊技术焊接导线105时，会采用打线设备将导线105的一端熔化，并将该熔化的一端压于待连接物上，之后打线设备施加超声波，以完成导线105与该待连接物的固定。示例地，导线105为金线，导线105与导电引脚103的固定工艺称为金线键合工艺。缺口K设置于框架102靠近底板101的一侧，导电引脚103固定于缺口K处。因此，导电引脚103可以与底板101接触，以被底板101支撑。如此，在打线时导电引脚103承受压力的能力较强，导电引脚103在打线设备施加的压力的作用下发生破损的概率较小，且导线105与第一导电层D1的焊接牢固度较高。由此，可以提高打线的成功率以及导线105的固定效果，进而提高激光器的制备良率。
在一些实施例中，激光器10中需要通过导线105连接的部件采用多根导线105进行电连接，以保证需要电连接的两个部件之间的连接可靠性，并降低导线105上的方块电阻。 如图4所示，第一导电层D1与发光芯片104之间、相邻的发光芯片104之间通过多根导线105连接，而图2仅以一根导线105为例进行示意。
在相关技术中，如图1所示，为了避免底板101’对导电引脚103’的导电性能的影响，需要使导电引脚103’与底板101’保持较大的安全距离，因此，激光器10’中的框架102’的需要具有较高的高度，不利于激光器的小型化。另外由于导电引脚103’悬空，在制备激光器10’的过程中采用打线设备向导电引脚103’施加压力以固定导线105’(导线105’连接发光芯片104’和外部电源)时，导电引脚103’可承受的压力较小。导电引脚103’容易受到损伤，导致激光器10’的可靠性较差。但在本公开一些实施例提供的激光器中，由于第一导电层D1可以通过基底1031与底板101绝缘，则无需在第一导电层D1与底板101之间设置安全距离。此外，导电引脚103位于框架102靠近底板101的一侧的缺口K处，则第一导电层D1与底板101的距离较近。因此，框架102的高度可以较小，激光器的厚度可以较小，有利于实现激光器10的小型化。
下面结合附图对激光器10中的导电引脚103的结构进行介绍。
在一些实施例中，请参考图2至图4，第一部分B1、第二部分B2以及第三部分B3的排布方向平行于X方向。第一部分B1位于容置空间S内，第二部分B2位于容置空间S外，第三部分B3填充框架102的缺口K。示例地，第三部分B3在X方向上的尺寸大于或等于框架102的壁厚，以保证第三部分B3对缺口K具有较好的填充效果，从而保证缺口K处的气密性。
示例地，导电层1032还包括第二导电层D2，第二导电层D2设置于第二部分B2远离底板101的表面。导电引脚103包括连接层D3，连接层D3嵌设于第三部分B3的内部。第一导电层D1与第二导电层D2连接，如可以通过连接层D3连接。第二导电层D2与外部电源连接，进而外部电源发出的电流可以依次通过第二导电层D2、导电引脚103中的连接层D3以及第一导电层D1传输至发光芯片104。
示例地，第一部分B1远离底板101的表面与第二部分B2远离底板101的表面平齐，如此有利于第一导电层D1与第二导电层D2的连接。或者，第一部分B1远离底板101的表面与第二部分B2远离底板101的表面也可以存在高度差。
示例地，第一导电层D1覆盖第一部分B1远离底板101的表面的全部区域，或者也可以仅覆盖该表面的部分区域。第二导电层D2覆盖第二部分B2远离底板101的表面的全部区域，或者也可以仅覆盖该表面的部分区域。本公开一些实施例以第一导电层D1覆盖第一部分B1远离底板101的表面的部分区域，第二导电层D2覆盖第二部分B2远离底板101的表面的部分区域为例进行示意，如此可以降低框架102接触第一导电层D1和第二导电层D2的风险。
在一些实施例中，导电引脚103中第三部分B3相对第一部分B1与第二部分B2朝远离底板101的方向(如图中的Y方向)凸起。在第三部分B3凸起的作用下，可以确保第一导电层D1和第二导电层D2均与框架102存在一定的间隔，避免框架102对第一导电层D1和第二导电层D2的导电效果产生影响。
在一些实施例中，导电引脚103靠近底板101的表面与框架102靠近底板101的环状表面平齐。如此在将导电引脚103固定于缺口K中后，可以保证框架102与导电引脚103组成的整体结构靠近底板101的表面平坦，以使该整体结构与底板101进行焊接的效果较好，焊接处出现缝隙的风险较小，可以保证激光器10的气密性较好。
本公开一些实施例以第一部分B1、第二部分B2以及第三部分B3中靠近底板101的表面平齐，且与框架102靠近底板101的环状表面平齐为例。当然，也可以仅第三部分B3靠近底板101的表面与框架102靠近底板101的环状表面平齐，第一部分B1与第二部分B2中至少一个部分靠近底板101的表面，相对于第三部分B3靠近底板101的表面远离底板101，也即该至少一个部分与底板101之间可以间隔一定的距离。这样可以增大第一导电层D1与底板101之间的安全距离，以及第二导电层D2与底板101之间的安全距离。
上述说明均以管壳120的底板101与框架102为需要组装的两个单独的结构为例进行说明。当然，底板101与框架102也可以为一体结构。如此可以避免底板101与框架102 在高温焊接时由于底板101与框架102的热膨胀系数不同导致的底板101产生褶皱，进而可以保证底板101的平坦度，保证发光组件130在底板101上的设置可靠性，从而保证发光芯片104发出的光线按照预定的发光角度出射，提高激光器10的发光效果。
示例地，多个缺口K平均分布于框架102中相对的两个侧壁上，如分布于框架102在X方向上相对的两个侧壁上。相应地，多个导电引脚103也分布于该相对的两个侧壁上。设置于该两个侧壁中的一个侧壁的导电引脚103中的导电层1032用于连接外部电源的正极，设置于另一个侧壁的导电引脚103中的导电层1032用于连接外部电源的负极。示例地，激光器10中的多个发光芯片104排成多行多列，发光芯片104的行方向为X方向，列方向为Y方向。每行发光芯片104串联，且两端分别设置有两个导电引脚103，每行发光芯片104通过两个导电引脚103分别与外部电源的正极和负极连接。
在一些实施例中，第一导电层D1和第二导电层D2的数量与激光器中发光芯片104的排布方式以及电路连接方式相关。例如，激光器10中同一类发光芯片104用于发出同一颜色的激光，不同类发光芯片104用于发出不同颜色的激光。每类发光芯片104串联，且不共用第一导电层D1或第二导电层D2。
示例地，激光器10为多色激光器，其多个发光芯片用于发出不同颜色的激光。如激光器10包括三类发光芯片，分别用于发出红色激光、绿色激光和蓝色激光。此时，激光器10包括六个导电引脚。六个导电引脚中的三个导电引脚作为正极引脚，另三个导电引脚作为负极引脚。每类发光芯片104与一个正极引脚和一个负极引脚连接。或者，不同类发光芯片104也可以共用第一导电层D1和第二导电层D2。
同一类发光芯片104中的多个发光芯片104串联，例如，激光器10为单色激光器，其多个发光芯片104用于发出相同颜色的激光。此时，激光器10中的所有发光芯片104串联，激光器10仅包括两个导电引脚103。如此，仅需一个开关便可以控制多个发光芯片104的通断。并且，多个发光芯片104的串联电路中各处的电流相等，故对输入电流的要求较低，较容易达到各个发光芯片104的阈值电流，便于发光芯片104的发光。
在一些实施例中，请继续参考图2至图4，激光器10包括多个热沉106和多个反射棱镜107，多个反射棱镜107和多个热沉106与多个发光芯片104对应。热沉106设置在管壳120的底板101上，发光芯片104设置于对应的热沉106上，热沉106用于辅助对应的发光芯片104散热。热沉106的材料包括陶瓷。反射棱镜107设置于对应的发光芯片104的出光侧。发光芯片104向对应的反射棱镜107发出激光，反射棱镜107将该激光朝远离底板101的方向反射。
图5为图4所示的激光器10的截面A-A’的结构图。在一些实施例中，如图5所示，激光器10还包括透光层108。透光层108为板状结构，其位于框架102远离底板101的一侧，用于密封框架102与底板101围成的容置空间S。示例地，透光层的材质为玻璃，或者其他透光且可靠性较强的材质，如树脂材料等。
在一些实施例中，如图6所示，激光器10还包括盖板110，盖板110包括内边缘区域110A与外边缘区域110B。外边缘区域110B与框架102远离底板101的表面固定，内边缘区域110A与透光层108固定。透光层108通过盖板110实现与框架102的固定。示例地，盖板110的内边缘区域110A相对于外边缘区域110B朝底板101凹陷。
示例地，如图22所示，激光器10还包括支撑框P。支撑框P的边缘固定于盖板110的外边缘远离管壳120的表面。透光层108先与支撑框P固定，支撑框P再与盖板110固定。例如，支撑框P为具有横梁的矩形框架，如此透光层108的中间区域可以被支撑框P支撑，进而可以提升透光层108的设置牢固度。透光层108靠近底板101的表面和远离底板101的表面中，至少一个表面上还贴附有增亮膜，以提高激光器10的出光亮度。
示例地，如图6所示，管壳120、盖板110和透光层108构成密闭的容置空间S，以使发光组件130处于密闭的容置空间S中，防止水氧对发光组件130的侵蚀，故可以延长发光组件130的寿命。
在一些实施例中，请继续参考图5和图6，激光器10还包括准直镜组109，准直镜组109设置于框架102远离底板101的一侧，如位于透光层108远离底板101的一侧。
示例地，准直镜组109包括与多个发光芯片104对应的多个准直透镜T，准直透镜T用于对射入的激光进行准直，可以减小射入的激光的发散角度。准直透镜T可以由玻璃制成，多个准直透镜T为一体结构。需要说明的是，对光线进行准直指的是调整光线的发散角度，使光线被调整至尽可能接近平行光。发光芯片104发出的激光被对应的反射棱镜107反射至透光层108，透光层108将激光透射至准直透镜T，经准直透镜T准直后射出，进而实现激光器10的发光。
当框架102的高度变小后，激光器10的高度相应变小，总的光程变短，由发光芯片104发出的激光到达准直透镜T时，其发散角度变小，由此，准直透镜T的至少一个维度的尺寸可减小，准直透镜T的形状可以不再太过扁长。由于准直透镜T的面积较小，准直透镜T的排布密度增大，进而准直镜组109的体积可以减小。相应地，发光芯片104与对应的反射棱镜107的距离缩小，进一步减小了激光器的体积。
图8至图11为根据本公开一些实施例的另一种激光器。下面仅描述图8至图11所示的激光器与前述图2至图6所示的激光器的不同之处，相同之处不再赘述。需要说明的是，在图8至图11中，对于与图2至图6所示的激光器中相同的部分，使用与图2至图6示出的相同的附图标记。如图8所示，激光器10还包括印制电路板112(Printed Circuit Board，PCB)，印制电路板112设置于连接器111远离发光组件130的一侧。
发光芯片104一般对应一个额定的最高工作温度(如65℃)，如果发光芯片处于高于该最高工作温度的环境下，则发光芯片的寿命将会受到影响，且可能会使发光芯片直接损坏。在相关技术中，如图7所示，激光器10’还包括两个印制电路板112’；多个导电引脚103’固定于框架102’的相对两个侧壁中，并通过焊锡直接与该侧的印制电路板112’焊接。由于焊接导电引脚103’与印制电路板112’时温度较高(如300℃)，热量会通过导电引脚103’直接传递至底板101’与框架102’围成的容置空间中，进而设置于容置空间中的发光芯片104’容易受到影响而损坏。因此，激光器的可靠性较低。
为了降低低固定印制电路板时传输至发光芯片的温度，降低发光芯片在该温度的影响下发生损坏的风险，进而提高激光器的可靠性，如图8所示，激光器10还包括连接器111。连接器111设置于框架102远离发光芯片104的一侧。如此一来，在固定连接器111时产生的热量可以通过连接器111传导至框架102的外侧，而并不会直接传导至发光芯片104所在的容置空间S中。因此，传递至发光芯片104的热量较少，可以降低发光芯片104发生损坏的风险，提高激光器10的可靠性。
在一些实施例中，如图8所示，框架102的底面的全部区域与底板101相接触。示例地，激光器10还包括多个第一焊盘H1、多个第二焊盘H2和连接线路H3。连接线路H3和多个第一焊盘H1设置于底板101上，多个第一焊盘H1位于底板101的边缘区域。多个第一焊盘H1通过对应连接线路H3与对应的导电引脚103中的第二导电层D2连接。多个第二焊盘H2设置于印制电路板112上，且与多个第一焊盘H1对应。连接器111的两端分别与第一焊盘H1及其对应的第二焊盘H2焊接，如此，可以实现第二导电层D2与印制电路板112的连接。示例地，连接器111的两端通过焊锡分别与第一焊盘H1及其对应的第二焊盘H2焊接。
示例地，在X方向上，底板101上的多个第一焊盘H1位于底板101的相对两侧的边缘区域，该相对两侧中一侧的第一焊盘H1通过印制电路板112连接至电源正极，另一侧的第一焊盘H1通过印制电路板112连接至电源负极。第一焊盘H1和第二焊盘H2的材质包括铜。
在一些实施例中，连接器111包括至少一个弯折部L。如图8所示，连接器111具有两个弯折部L；或者，连接器111具有三个甚至四个弯折部L。如此，可以增大连接器111的散热面积。连接器111在与第一焊盘H1和第二焊盘H2焊接时产生的热量可以通过连接器111进行较快地散发，减少传导至发光芯片104所在区域的热量。连接器111在受热时，弯折部L在一定程度上被压缩，可以释放热应力，减小由于热应力导致连接器111损坏的风险，从而保证连接器111的可靠性。
示例地，连接器111包括依次连接的第一条状部111A、第二条状部111B和第三条状 部111C，第一条状部111A与底板101上的第一焊盘H1连接，第三条状部111C与印制电路板112上的第二焊盘H2连接，该第一条状部111A的延伸方向(如Z方向)与底板101垂直，该第三条状部111C的延伸方向(如Z方向)与印制电路板112垂直。由此，便于在完成焊接之后观察第一条状部111A、第三条状部111C分别与第一焊盘H1、第二焊盘H2的焊接效果，方便对焊接效果进行调整。
在一些实施例中，连接器111的材质为含银的合金，该材质的散热性能较好，可以进一步提高焊接时热量的散发效率，减少传导至发光芯片104的热量。
图9以激光器10包括一个框架102和两个发光芯片104为例进行示意。激光器10也可以包括多个框架102，每个框架102对应多个导电引脚103，每个导电引脚103中的第二导电层D2通过底板101中的连接线路H3，连接至对应的第一焊盘H1。发光芯片104的数量也可以视具体情况进行相应调整。
在一些实施例中，如图9所示，框架102与导电引脚103为一体结构。框架102的材质包括陶瓷，例如氮化铝。陶瓷为绝缘材质，故框架102可对底板101、第一导电层D1、以及第二导电层D2进行绝缘。此外，当框架102与导电引脚103为一体结构时，框架102的底面的面积较大。当上述底面用于与底板101焊接时，框架102与底板101的接触面积较大。因此，可以提高底板101与框架102的焊接牢固度，从而提高激光器10的可靠性。
在一些实施例中，当导电引脚103与框架102为一体结构时，框架102上的第一导电层D1及其连接的第二导电层D2作为电极引脚。由于无需在框架102上开孔，因此可以提高容置空间S的气密性。另外，在制备激光器10的过程中，无需执行设置在开孔中插入导电引脚、并将导电引脚与开孔的缝隙进行密封的步骤，可以简化激光器10的制备过程。
如图10所示，在一些实施例中，框架102包括依次首尾连接的四个侧壁，分别为相对的第一侧壁102A和第三侧壁102C，以及相对的第二侧壁102B、和第四侧壁102D。多个导电引脚103分别位于第一侧壁102A和第三侧壁102C处。
示例地，多个第一部分B1一体成型为第一台阶J1、多个第二部分B2一体成型为第二台阶J2、且多个第三部分B3一体成型。该第一台阶J1上设置有多个第一导电层D1，该第二台阶J2上设置有多个第二导电层D2，多个第一导电层D1与多个第二导电层D2对应，第一导电层D1与对应的第二导电层D2连接，且与其他第一导电层D1和其它第二导电层D2绝缘。
由于框架102绝缘，故可以使各个第一导电层D1相间隔，以及各个第二导电层D2相间隔，从而可实现各个第一导电层D1的绝缘，以及各个第二导电层D2的绝缘。或者，也可以在相邻的第一导电层D1之间以及相邻的第二导电层D2之间设置绝缘材料，以进一步确保各个第一导电层D1的绝缘，以及各个第二导电层D2的绝缘。
示例地，激光器10为单色激光器，此时，在框架102上仅设置两组互相连接的第一导电层D1和第二导电层D2。一组第一导电层D1和第二导电层D2作为正极引脚，另一组第一导电层D1和第二导电层D2作为负极引脚。
又示例地，激光器10为多色激光器，其包括至少两类发光芯片104，每类发光芯片104串联，且两端分别与两个第一导电层D1连接，不同类发光芯片104连接的第一导电层D1不同。每类发光芯片104的两端指的是该串联的多个发光芯片104的两个连接端。
在一些实施例中，如图10所示，至少两类发光芯片104排布成两行多列。其中一行发光芯片104包括第一类发光芯片104a，另一行发光芯片104包括第二类发光芯片104b与第三类发光芯片104c。第二类发光芯片104b与第三类发光芯片104c分别位于底板101上的两个区域，上述两个区域沿发光芯片104的行方向(如X方向)依次排布。示例地，第一类发光芯片104a、第二类发光芯片104b和第三类发光芯片104c发出的激光的波长依次递减。第一类发光芯片104a用于发出红色激光，第二类发光芯片104b用于发出绿色激光，第三类发光芯片104c用于发出蓝色激光。
第二类发光芯片104b与第三类发光芯片104c位于同一行，第二类发光芯片104b的正极引脚或负极引脚中的一个连接至该行的一个第一导电层D1，第三类发光芯片104c的正极引脚或负极引脚中的一个连接至该行的另一个第一导电层D1。第二类发光芯片104b的 正极引脚或负极引脚中的另一个需要连接至其他行的一个第一导电层D1，第三类发光芯片104c的正极引脚或负极引脚中的另一个需要连接至其他行的另一个第一导电层D1。
为此，在一些实施例中，如图10所示，激光器10还包括设置于两行发光芯片104之间的多个转接台113，多个转接台113排成一行，此处以设置3个转接台113为例。位于中间的转接台113分别与其两侧的两个转接台113相连，位于两侧的两个转接台113分别与两个第一导电层D1相连。
示例地，转接台113远离底板101的表面能导电，以进行导线105的转接。转接台113包括转接台主体和位于该转接台主体远离底板101的一侧的导电层。转接台主体为绝缘材质；导电层为导电材质。转接台113远离底板101的表面的尺寸可以根据导线105的设置需求进行相应设计。
第二类发光芯片104b的一端与第三类发光芯片104c的一端均连接与所在位置对应的一个第一导电层D1，另一端连接转接台113，以通过转接台113连接与所在位置不对应的另一个第一导电层D1。示例地，位于中间的转接台113位于第二类发光芯片104b与第三类发光芯片104c之间，以便于使第二类发光芯片104b与第三类发光芯片104c连接至该转接台113。由此，可以满足位于同一行的第二类发光芯片104b与第三类发光芯片104c不共用同一组第一导电层D1和第二导电层D2，以使第二类发光芯片104b与第三类发光芯片104c分别与外部电源连接，并使导线105的排布更有序。
位于中间的转接台113包括两个绝缘的导电区，两个导电区设置于位于中间的转接台113的上表面，该两个导电区用于分别连接第二类发光芯片104b与第三类发光芯片104c，以保证对第二类发光芯片104b与第三类发光芯片104c的电流的正常传输。
示例地，第一侧壁102A处的一组第一导电层D1和第二导电层D2用作正极引脚，第三侧壁102C处另一组第一导电层D1和第二导电层D2用作负极引脚。进而，每类发光芯片104连接的两个第一导电层D1分别位于框架102的相对两侧。例如，第二类发光芯片104b的左端连接第一侧壁102A上的第一导电层D1，右端通过两个转接台113连接至第三侧壁102C上的第一导电层D1。第三类发光芯片104c的右端连接第三侧壁102C上的第一导电层D1，左端通过两个转接台113连接至第一侧壁102A上的第一导电层D1。
在一些实施例中，激光器10包括多个框架102，每个框架102包围一类发光芯片104。图11以激光器10包括三个框架102，且三个框架102分别包围第一类发光芯片104a、第二类发光芯片104b与第三类发光芯片104c为例。如此，由于将激光器10中的发光芯片104分别通过多个框架102封装，则由每个框架102围成的容置空间S中设置的发光芯片104的数量较少，每个框架102的体积较小，其与底板101的接触面积较小。由于两物体焊接时的热应力与两物体的接触面积正相关，因此，在底板101上分时焊接各个框架102时，每次焊接产生的热应力较小，进而可以减小框架102与底板101在焊接时由于热应力而受到损伤的风险。
在一些实施例中，请继续参考图9，底板101包括第一区域101A以及第二区域101B，该第一区域101A包围第二区域101B，且该第二区域101B相对第一区域101A凸起。框架102与第一区域101A固定，多个发光芯片104设置于第二区域101B，第二区域101B称为底板101的贴片区。示例地，第一区域101A与第二区域101B的高度差约为导电引脚103的第一部分B1或第二部分B2的高度，或者可以略小于该高度。如此一来，可以进一步缩短发光芯片104与第一导电层D1的直线距离，缩短连接发光芯片104与第一导电层D1的导线105的长度，保证导线105的强度较高。
图12至图24为根据本公开一些实施例的另一种激光器。下面仅描述图12至图24所示的激光器与前述图2至图6所示的激光器的不同之处，相同之处不再赘述。需要说明的是，在图12至图24中，对于与图2至图6所示的激光器中相同的部分，使用与图2至图6示出的相同的附图标记。需要说明的是，图12至图24所示的激光器可以不使用图2至图6所示的导电引脚，而是使用图1所示的导电引脚。
如图12所示，准直透镜T包括第一面T1和第二面T2，第一面T1和第二面T2为准直透镜中相对的两面，且第一面T1相对于第二面T2更靠近管壳120。发光组件130发出 的激光穿过透光层108射向对应的准直透镜T，且通过准直透镜T的第一面T1射入该准直透镜T，进而在准直透镜T中传输，以通过准直透镜T的第二面T2射出准直透镜T。第一面T1即为准直透镜T的入光面，第二面T2即为准直透镜T的出光面。
由于激光器射出的激光的准直效果会对激光的能量产生影响，在激光投影装置中，激光的准直效果会对其亮度产生影响，激光的准直效果越好其亮度越高，进而根据该激光形成的显示画面的显示效果越好。但是，发光组件发出的激光在快轴上的发散角度大于在慢轴上的发散角度，且激光在快轴上的发散角度与慢轴上的发散角度相差较大。快轴和慢轴为光线传输时的两个光矢量的方向，快轴垂直于慢轴。示例地，如图12所示(图12为沿图23中C-C’线的截面图)，射向准直透镜T的激光的慢轴平行于X方向，该激光的快轴垂直于纸面的方向。
相关技术中，准直镜组中的准直透镜包括相对的两个面，为了提高准直镜组的生产效率或者安装便利性，将准直透镜的上述两个面中一个面设置为平面，另一个设置为凸弧面。准直透镜能通过凸弧面的作用对射入的激光进行准直。凸弧面为球面的一部分，凸弧面在各个方向上的曲率相等，故凸弧面在射入的激光的快轴和慢轴上对发散角度的缩小程度相同，穿过准直透镜的激光在快轴和慢轴上的发散角度差异仍较大，因此，激光器射出的激光的准直性较差。
准直透镜T对射入的激光的发散角度以及传输方向的调整特性由第一面T1和第二面T2的曲率决定。当第一面T1和第二面T2的曲率不同时，准直透镜T的形状也会存在差异。在本公开一些实施例中，可以通过多种实现方式实现射入准直透镜的激光在慢轴上发散角度减小量小于在快轴上的发散角度减小量，以使从准直透镜射出的激光在快轴和慢轴上的发散角度差异减小，从而提高激光的准直度。
在一些实施例中，准直透镜T的第一面T1用于对射入的激光在慢轴上的发散角度进行扩大；第二面T2用于对射入的激光在快轴上和慢轴上的发散角度均进行缩小。如图13和图14所示，准直透镜T呈柱状，准直透镜T的第一面T1为凹弧面，以对激光在慢轴上的发散角度进行扩大。第二面T2包括凸弧面，以对射入的激光在快轴上和慢轴上的发散角度均进行缩小。有多种方式可以实现第一面T1和第二面T2对激光的发散角度的调整作用。
示例地，第一面T1的全部区域为凹弧面，第二面T2的全部区域为凸弧面。第一面T1在第一方向(如射入的激光的慢轴方向，即X方向)上和第二方向(如射入的激光的快轴方向，即Y方向)上具有弧度，且在慢轴上的曲率半径小于在快轴上的曲率半径。第一方向与第二方向垂直。由于弧面的曲率为曲率半径的倒数，第一面T1在射入的激光的慢轴上的曲率大于在快轴上的曲率，即第一面T1在慢轴上的弧度大于在快轴上的弧度。
凹弧面对于射入的光线有扩散作用，凹弧面的曲率半径越大表明该凹弧面的弯曲程度越小，进而凹弧面对光线的扩散效果越弱，对光线的发散角度的扩散量越小。由于第一面T1在射入的激光的慢轴上的曲率半径小于在快轴上的曲率半径，发光组件130发出的激光在穿过第一面T1后，在快轴上的发散角度的扩大量小于在慢轴上的发散角度的扩大量。由于发光组件射出的激光原本在快轴上的发散角度大于在慢轴上的发散角度，因此，激光在穿过第一面T1后在慢轴上的发散角度与在快轴上的发散角度相差较小。相对于相关技术中激光射入准直透镜后的发散角度，本公开一些实施例中的激光在穿过第一面T1后，可以减小激光在快轴和慢轴上的角度差异。
示例地，如图15所示，第一面T1的部分区域为凹弧面，第二面T2的部分区域为凸弧面。激光仅射向第一面T1中凹弧面所在的部分区域，并从第二面T2中凸弧面所在的部分区域射出。
又示例地，请结合图13与图16，或者结合图15与图16，第一面T1为凹柱面，且凹柱面的直母线平行于第二方向(如平行于射入第一面T1的激光的快轴方向，即图16中的Y方向)。柱面(Cylinder)是直线沿着一条定曲线平行移动所形成的曲面，该直线称为柱面的直母线。例如，柱面为一圆柱的侧面中的部分，其直母线平行于圆柱的高度方向。凹柱面在射入的激光的快轴上的曲率为0，曲率半径无限大，凹柱面在射入的激光的慢轴上 的曲率大于0。
由于在射入第一面T1的激光的快轴上，第一面T1近似于平面，射入第一面T1的激光在快轴上发散角度的改变量与射入平面玻璃的激光的发散角度的改变量相近，激光在快轴上的发散角度基本无变化。而在射入第一面T1的激光的慢轴上，第一面T1的弯曲程度较大，激光在慢轴上发散角度的扩散量较大。如图13或图15所示，射入第一面T1后激光在慢轴上的发散角度扩大，如图16所示，射入第一面T1后激光在快轴上的发散角度基本不变。如此，激光在准直透镜T中传输进而射向第二面T2的凸弧面时，在慢轴上的发散角度与快轴上的发散角度差异较小。
射入准直透镜的激光，经过第一面T1中的凹弧面对激光的快轴和慢轴上的发散角度的调整后，或者对激光的慢轴上的发散角度进行调整后，再经第二面T2的凸弧面进行进一步地准直后射出，进而保证从准直透镜T射出的激光具有较好的准直效果。
示例地，第二面T2的凸弧面在射入的激光的慢轴和快轴上的曲率相同，即第二面T2的凸弧面在第一方向和第二方向上的曲率相同，例如凸弧面为球面中的部分。由于通过第一面T1的凹弧面已经使激光在快轴和慢轴上的发散角度相差较小，因此第二面T2可以仅对激光进行整体的准直，使激光在快轴上的发散角度的缩小程度与在慢轴上的发散角度的缩小程度相近即可，如此无需对第二面T2的凸弧面在不同方向的曲率进行不同的设计，简化了准直透镜的制备过程。
又示例地，第二面T2的凸弧面为自由曲面，其在射入的激光的慢轴上的曲率半径大于在快轴上的曲率半径，即第二面T2的凸弧面在第一方向上的曲率半径大于在第二方向上的曲率半径，凸弧面在射入的激光的慢轴上的曲率小于在快轴上的曲率。在不同方向上具有不同的曲率半径的曲面称为自由曲面，第二面T2可以类似于橄榄球的部分球面。凸弧面对于射入的光线有会聚作用，且凸弧面的曲率半径越小表明该凸弧面的弯曲程度越大，进而凸弧面对光线的会聚效果越强，对光线的发散角度减小量越大。如此，凸弧面可以对射入的激光在快轴和慢轴上的发散角度再次分别进行调整，使激光在慢轴上的发散角度的缩小程度小于在快轴上的发散角度的缩小程度，以进一步缩小准直透镜射出的激光在快轴和慢轴上发散角度的差异。如此，凸弧面对射入的激光进行准直，可以保证从准直透镜T射出的激光的准直效果较好。如图13至图16，激光在射出第二面T2的凸弧面后，在快轴上和慢轴上均接近平行光。
在一些实施例中，可以先设定所需的准直透镜T的焦距，进而根据焦距来确定准直透镜T的具体参数，如准直透镜T中凸弧面在射入的激光的慢轴和快轴上的曲率半径，以及凹弧面的曲率半径。在一些实施例中，准直透镜T的第一面T1的多种实现方式可以与第二面T2的多种实现方式任意组合，进而可以得到四种不同形状的准直透镜。在第一种准直透镜中，第一面T1和第二面T2均为自由曲面；在第二种准直透镜中，第一面T1为凹柱面且第二面T2为凸自由曲面；在第三种准直透镜中，第一面T1为自由曲面且第二面T2为球面；在第四种准直透镜中，第一面T1为凹柱面且第二面T2为球面。在上述四种准直透镜中，第一面T1中的凹弧面与第二面T2中的凸弧面的曲率半径满足一定的关系，以保证准直透镜T对射入的激光的准直效果较好。
在一些实施例中，准直透镜T中凹弧面的曲率半径大于凸弧面的曲率半径。示例地，对于第一面T1的全部区域为凹弧面或第一面T1的部分区域为凹弧面的准直透镜T，凹弧面在射入的激光的快轴和慢轴上的曲率半径均大于凸弧面在快轴和慢轴上的曲率半径。对于第一面T1为凹柱面准直透镜T，凹柱面仅在射入的激光的慢轴上弯曲，则该凹弧面的曲率半径即指凹弧面在慢轴上的曲率半径。在一些实施例中，准直透镜中凹弧面在射入的激光的快轴上的曲率半径均大于凸弧面在快轴上的曲率半径，凹弧面在射入的激光的慢轴上的曲率半径均大于凸弧面在慢轴上的曲率半径，如此可以保证准直透镜能对光线进行准直会聚，使射出准直透镜的激光的发散角度小于射入准直透镜的激光的发散角度。但是，由于凹弧面仅能在一定程度上缩小射入的激光在慢轴和快轴上的发散角度的差异，使该激光在慢轴和快轴上的发散角度相同比较困难。因此，还需通过凸弧面进一步调整，以保证最终射出准直透镜的激光在不同方向的准直效果的一致性。
在一些实施例中，如图17和图18所示，准直透镜的第一面T1为平面，准直透镜的第二面T2为凸弧面，凸弧面为自由曲面，且凸弧面在射入的激光的慢轴(X方向)上的曲率半径大于在快轴(Y方向)上的曲率半径。
由于准直透镜的第一面T1为平面，故第一面T1对射入的激光在慢轴上的发散角度的改变程度与在快轴上的发散角度的改变程度相同，激光在射入第一面T1之后，激光在快轴上的发散角度与慢轴上的发散角度的差异仍较大，故射向准直透镜T的凸弧面的激光在快轴上的发散角度与慢轴上的发散角度的差异仍较大。而由于凸弧面在射入的激光的慢轴上的曲率半径大于在快轴上的曲率半径，故凸弧面对射入的激光在快轴上的会聚效果强于在慢轴上的会聚效果，进而降低了准直透镜T射出的激光(即从凸弧面射出的激光)在快轴上和慢轴上的发散角度的差异。
在一些实施例中，如图19所示，准直透镜T在射入的激光的快轴(Y方向)上的宽度大于在慢轴(X方向)上的宽度，即准直透镜T的俯视图呈长方形。发光组件130发出的激光在射向准直透镜T时的光斑呈椭圆形，椭圆形的光斑的长轴平行于长方形的准直透镜T的长边方向，椭圆形的光斑的短轴平行于长方形的准直透镜T的短边方向。如此，可以保证射向准直透镜T的光斑形状与准直透镜T的形状的匹配度较高，在保证激光均射向准直透镜T的基础上，避免准直透镜T的尺寸浪费，有利于激光器10的小型化。
下面结合附图对准直镜组109的多种实现方式进行解释说明。
在一些实施例中，准直镜组109为一体结构。如图20和图21所示，准直镜组109包括入光面M1和出光面M2，入光面M1和出光面M2为准直镜组109中相对的两个表面，入光面M1相对于出光面M2靠近管壳120。入光面M1包括准直镜组109中各个准直透镜T的第一面T1，出光面M2包括各个准直透镜T的第二面T2。示例地，如图20所示，入光面M1包括多个凹弧面，出光面M2包括多个凸弧面，每个凹弧面和对应的凸弧面所在的部分为一个准直透镜T，每个凸弧面在准直镜组109的入光面上的正投影与对应的凸弧面在入光面上的正投影重合。又示例地，如图21所示，入光面M1为平面，出光面M2包括多个凸弧面，每个凸弧面所在的部分为一个准直透镜T。
在另一些实施例中，如图22所示，准直镜组109由多个独立的准直透镜T组成。示例地，支撑框P具有多个镂空区域(图中未示出)，每个准直透镜T覆盖多个镂空区域中的一个镂空区域。多个镂空区域与激光器10中的多个发光组件130对应，每个发光组件130射出的激光穿过对应的镂空区域射向覆盖该镂空区域的准直透镜T。
在一些实施例中，激光器10为多芯片激光二极管(Multi chip Laser Diode，MCL)型的激光器。如图23所示，激光器10中的多个发光组件130阵列排布，图23以激光器10包括20个发光组件130，且该发光组件130排成四行五列为例。
当激光器10为单色MCL激光器时，准直镜组109中各个准直透镜T的参数相同。当激光器10为多色MCL激光器时，其包括多种类型的发光组件130，准直镜组109包括参数不同的多种准直透镜T。不同类型的发光组件130发出的激光的发散角度可能会存在差别，可以根据各个发光组件130发出的激光的发散角度，来设计准直镜组109中对应的准直透镜T。示例地，对于多色MCL激光器，准直镜组109中各个准直透镜T的参数也可以相同。
在一些实施例中，以激光器10为多色MCL激光器为例，多个发光组件130包括用于发出第一颜色的激光的第一发光组件，以及用于发出第二颜色的激光的第二发光组件，第一颜色的激光的发散角度小于第二颜色的激光的发散角度。准直镜组109满足第一发光组件对应的准直透镜对射入的激光的发散角度的减小量，小于第二发光组件对应的准直透镜对射入的激光的发散角度的减小量。第一发光组件对应的准直透镜中凹弧面的曲率半径，小于第二发光组件对应的准直透镜中凹弧面的曲率半径；和/或，第一发光组件对应的准直透镜中凸弧面的曲率半径，大于第二发光组件对应的准直透镜中凹弧面的曲率半径。
示例地，第一颜色包括蓝色和绿色，第一发光组件包括蓝色发光组件和绿色发光组件；第二颜色为红色，第二发光组件为红色发光组件。红色发光组件发出的红色激光的发散角度大于蓝色发光组件发出的蓝色激光的发散角度，且大于绿色发光组件发出的绿色激光的 发散角度。例如，红色激光在快轴上和慢轴上的发散角度均大于绿色激光和蓝色激光在快轴和慢轴上的发散角度。或者，红色激光在快轴上的发散角度大于绿色激光和蓝色激光在快轴上的发散角度，红色激光在慢轴上的发散角度大于绿色激光和蓝色激光在慢轴上的发散角度，但是红色激光在慢轴上的发散角度小于蓝色激光和绿色激光在快轴上的发散角度。根据红色激光、蓝色激光和绿色激光在快轴和慢轴上的发散角度的大小，可以相应地调整发出各个颜色的激光的发光组件对应的准直透镜对激光的发散角度的减小量，如调整准直透镜的凸弧面在快轴和慢轴上的曲率半径的大小。
示例地，蓝色激光在快轴上的发散角度大于红色激光在慢轴上的发散角度，且小于红色激光在射入的激光的快轴上的发散角度。此时，若准直透镜T的第一面T1为凹弧面或凹柱面、第二面T2为凸弧面，则蓝色激光射向的准直透镜中凹弧面在慢轴上的曲率半径，大于红色激光射向的准直透镜中的凹弧面在慢轴上的曲率半径，且小于红色激光射向的准直透镜中的凹弧面在快轴上的曲率半径。或者，蓝色激光射向的准直透镜中凸弧面在慢轴上的曲率半径，小于红色激光射向的准直透镜中的凸弧面在慢轴上的曲率半径，且大于红色激光射向的准直透镜中的凹弧面在快轴上的曲率半径。若准直镜组中的准直透镜T的第一面T1为平面、第二面T2为凸弧面，则蓝色激光射向的准直透镜中凸弧面在快轴上的曲率半径，大于红色激光射向的准直透镜中的凸弧面在快轴上的曲率半径，且小于红色激光射向的准直透镜中的凸弧面在慢轴上的曲率半径。对于各个颜色的激光的发散角度的其他大小关系，均可以以此类推，在此不再赘述。
在一些实施例中，激光器中红色发光组件中可以设置多个发光点，蓝色发光组件和绿色发光组件中可以仅设置一个发光点。激光器10中每个发光组件发出的激光的光斑呈扁长形，激光在经过准直透镜射出后，形成的光斑的长宽比可以减小。
示例地，激光器10中的多个发光芯片104阵列排布，准直镜组109中的多个准直透镜T也阵列排布，发光芯片104的行方向与准直透镜T的行方向相同，发光芯片104的列方向与准直透镜T的列方向相同。发光芯片104的出光方向垂直于多个发光芯片104的行方向，平行于多个发光芯片104的列方向。发光芯片104发出的激光的慢轴平行于该行方向。激光在射向准直镜组109时，慢轴平行于准直透镜T的行方向，快轴平行于准直透镜T的列方向。
在一些实施例中，请参考图23和图24，发光芯片104呈长方体状，其包括与对应的反射棱镜107相对的端面G，激光从端面G射出。端面G中实际的出光区域呈长方形。长方形的出光区域的长度方向平行于底板101的板面，宽度方向垂直于底板101的板面。发光芯片104发出的激光的快轴平行于该宽度方向，激光的慢轴平行于该长度方向。示例地，准直透镜T对激光在某一方向上的准直效果与激光的出光区域在该方向上的宽度有关。若仅采用在慢轴和快轴上曲率相同的准直透镜对发光芯片104发出的激光进行准直，则在对快轴上的发散角度进行缩小以保证激光在快轴上准直时，仍存在在慢轴上的发散角度与在快轴上的发散角度的差异，如此不利于激光的整形以及后续的传播。在本公开一些实施例中，通过将第一面设置为凹柱面、自由曲面或平面，且第二面设置为自由曲面的准直透镜，可以实现对激光在慢轴方向上的发散角度和快轴方向上的发散角度分别调整，进而可以提高准直透镜对激光的整型和准直效果。
在相关技术中，如图25所示，激光器10’中的发光组件呈规律的行列排布，各个发光组件在行方向和列方向上均存在必要的间隙，相应地准直镜组109’中的准直透镜T’也呈规律的行列排布。发光组件发出的激光具有张角，准直透镜T’为了完全接收对应的发光组件发出的激光，其在底板上的正投影的面积需大于对应的发光组件发出的激光形成的光斑的面积。相邻准直透镜T’之间会存在无效的光处理区域，该区域中射出的激光为杂散光，较难被后续的光学元件接收并利用，进而形成光损。且发光组件之间在行方向和列方向上的间隙越大，光损会越多。
图26至图31为根据本公开一些实施例的又一种激光器。下面仅描述图26至图31所示的激光器与前述图2至图6所示的激光器的不同之处，相同之处不再赘述。需要说明的是，在图26至图31中，对于与图2至图6所示的激光器中相同的部分，使用与图2至图 6示出的相同的附图标记。需要说明的是，图26至图31所示的激光器可以不使用图2至图6所示的导电引脚，而是使用图1所示的导电引脚。下面对本公开一些实施例中的准直透镜T的排布方式进行说明。
在一些实施例中，准直透镜T整体呈长条形，准直透镜T在第一方向上的最大长度大于在第二方向上的最大长度，第一方向垂直于第二方向。第一方向为准直透镜T的列方向，第二方向为准直透镜T的行方向。如图26所示，准直透镜T在列方向上包括两个端部和位于两个端部之间的中间部T5，两个端部包括上端部T3和下端部T4，上端部T的宽度和下端部T4的宽度分别小于中间部T5的宽度。需要说明的是，端部的宽度和中间部的宽度指的是在行方向上的宽度；准直透镜的端部与中间部仅为相对概念，端部仅表示准直透镜中位于两端的一部分区域，中间部表示准直透镜的端部之外的区域，其并非精确划分的区域。示例地，每个准直透镜T在底板101上的正投影呈椭圆形，椭圆形的长轴平行于准直透镜T的列方向(Y方向)，短轴平行于准直透镜T的行方向(X方向)。
发光组件130发出的激光的初始光斑，在快轴上的尺寸小于在慢轴上的尺寸。发光组件130发出的激光在管壳120的容置空间S中传播进而穿过透光层108，并射向对应的准直透镜T时，该激光的光斑为椭圆形。椭圆光斑的长轴平行于准直透镜T的列方向，椭圆光斑的短轴平行于准直透镜T的行方向。由于准直透镜T在列方向上的最大长度大于在行方向上的最大长度，准直透镜T在列方向上的上端部T3的宽度和下端部T4的宽度小于中间部T5的宽度，如此可以保证准直透镜T的形状更贴近激光在准直透镜T上形成的光斑的形状，进而在保证接收激光的基础上减小准直透镜T的尺寸。
在一些实施例中，如图26所示，准直镜组109的多行准直透镜T中相邻的任两行准直透镜T交错排布。两行准直透镜T交错排布指的是两行准直透镜T在列方向(Y方向)上错位，两行准直透镜T在列方向上不对齐，也即分别属于两行且相邻的两个准直透镜T的连线与列方向不平行。两个准直透镜T的连线指两个准直透镜T的中心的连线。两行准直透镜T可以全部错位，或者也可以仅部分错位。全部错位指的是两行准直透镜T中任两个准直透镜T在列方向上均不对齐，部分错位指的是两行准直透镜T中存在部分准直透镜T在列方向对齐，也存在部分准直透镜T在列方向上不对齐。本公开一些实施例以相邻的任两行准直透镜T在列方向上全部错位为例。两行准直透镜T错位，则一行准直透镜T中的每个准直透镜T在行方向上，位于相邻的一行准直透镜中T两个相邻的准直透镜T之间，或者位于相邻的一行准直透镜T之外。示例地，图26中第一行准直透镜T的第二个准直透镜T在X方向上，位于第二行准直透镜T的第一个准直透镜T和第二个准直透镜T之间；第一行准直透镜T中的第一个准直透镜T在x方向上，位于第二行准直透镜T的左侧，且位于第二行准直透镜T之外。
准直镜组109中相邻的任两行准直透镜T中，存在准直透镜T满足其靠近另一行准直透镜T的端部，至少部分位于另一行准直透镜T中相邻的两个准直透镜T的两个端部之间。两行相邻的准直透镜T中，位于同一行的任意相邻的两个准直透镜T中靠近另一行准直透镜T的端部之间，均存在另一行准直透镜T中一个准直透镜T的端部的至少部分。即，如图27所示，在平行于列方向的参考平面上，相邻两行准直透镜的正投影存在交叠。示例地，对于图26中第一行准直透镜T和第二行准直透镜T，第一行准直透镜T中的第二个准直透镜T的下端部，位于第二行准直透镜T中第一个准直透镜T和第二个准直透镜T的上端部之间。即，第一行准直透镜T中的每相邻两个准直透镜T的下端部之间均有第二行准直透镜T中一个准直透镜T的上端部，第二行准直透镜T中每相邻两个准直透镜T的上端部之间也均有第一行准直透镜T中一个准直透镜T的下端部。
在本公开一些实施例中，如图26所示，相邻行的准直透镜T交错排布，且每行中相邻两个准直透镜T的端部之间的空间被另一行准直透镜T的端部占用，如此可以提高准直镜组109中的空间利用率，准直透镜T的排布更为紧凑。与相关技术相比，相邻准直透镜T之间的间隙较小，排布密度较大。发光组件130发出的激光可以尽可能地射向准直透镜T，而非准直透镜T之间无效的间隙，因此，发光组件发出的激光可以被更多地利用，降低了激光器10的光损。另外，由于准直透镜T的排布较为紧凑，一定数量的准直透镜T 所占用的区域面积较小，因此，仅需较小的体积，即可实现激光器10中各发光组件和准直透镜的设置，有利于提高激光器10的小型化。
图26以准直透镜T在底板101上的正投影呈椭圆形为例进行示意。准直透镜T在底板101上的正投影也可以呈其他形状。为了便于描述，下面直接将准直透镜T在底板101上的正投影的形状简称为准直透镜T的形状。
在一些实施例中，如图28所示，准直透镜T在底板101上的正投影呈胶囊形。胶囊形由相对且平行的两条直边和相对的两条弧边围成。胶囊形相当于沿椭圆形的长轴方向，将椭圆形的左右两端分别切去一部分所得的形状；或者相当于沿圆形的直径方向，将该圆形的相对两端分别切去一部分所得的形状。
在另一些实施例中，如图29所示，准直透镜T在底板101上的正投影呈六边形，且六边形在Y方向上的最大长度大于在X方向上的最大长度。任意相邻的准直透镜T的相邻边重合，准直镜组中109的准直透镜T以蜂窝状排布。六边形为轴对称图形，其一条对称轴平行于Y方向。六边形还可以具有另一条对称轴，另一条对称轴平行于X方向。示例地，对于第一行准直透镜T中的第一个准直透镜T，其包括第一对称轴Z1和第二对称轴Z2，第一对称轴Z1平行于Y方向，第二对称轴Z2平行于X方向。第一对称轴Z1为六边形的一条对角线所在的直线，且平分六边形的两个对角。
在一些实施例中，准直镜组109包括具有多种形状的准直透镜T，准直透镜T包括第一类准直透镜T10，其在底板101上的正投影呈目标形状。如图30所示，准直镜组109中存在相邻的三行准直透镜T(如前三行)满足以下条件：该三行准直透镜T中分别位于两端的两行准直透镜T(也即第一行和第三行)中，每个准直透镜T在底板101上的正投影呈椭圆形。位于中间的一行准直透镜T为第一类准直透镜T10。目标形状由六个边围成，如请参考图30中对第二行的第一个准直透镜T的标注，上述六个边分别标记为a1、a2、a3、a4、a5和a6。例如，六个边包括平行且相对的直边a1和直边a4、分别连接两个直边的一端的弧边a2和弧边a3、以及分别连接两个直边的另一端的弧边a5和弧边a6，弧边朝目标形状内凹陷。直边a1和直边a4平行于y方向，两个直边的一端为靠上的一端，两个直边的另一端为靠下的一端。在一些实施例中，请继续参考图30，准直透镜T还包括第二类准直透镜T20，其在底板101上的正投影呈辅助形状。辅助形状可以与目标形状类似，不同之处在于第二类的准直透镜T20中与其他准直透镜T不相邻的边缘为直边。对于辅助形状与目标形状的相同之处，请参考上述对目标形状的介绍，在此不再赘述。示例地，第二类准直透镜T20位于准直镜组109的边缘。如图30中，位于第四行准直透镜T呈辅助形状，第二行中最靠右的准直透镜T也呈辅助形状。或者，图30中第四行的准直透镜T与第二行中最靠右的准直透镜T也可以呈目标形状。示例地，第二类准直透镜T20中与其他准直透镜不相邻的边缘为椭圆的部分边缘，在此情况下，辅助形状相当于将椭圆中需与其他准直透镜相邻的部分，更改为直边或者向内凹的弧边，其他部分不改变。
在一些实施例中，分别位于相邻行且相邻的任两个准直透镜T相接触。示例地，如图26、图28、图29和图30所示，第一行准直透镜T中的第一个准直透镜T和第二个准直透镜T与第二行准直透镜T中的第一个准直透镜T相邻；第一行准直透镜T中第一个准直透镜T和第二个准直透镜T的下端部，与第二行准直透镜T中的第一个准直透镜T的上端部相接触。如图26和图28所示，在准直透镜T呈椭圆形或胶囊形时，位于相邻行且相邻的两个准直透镜之间可以仅较少部分的边缘相接触。如图29所示，在准直透镜T呈六边形时，位于相邻行且相邻的两个准直透镜的至少一个边缘重合。如第一行准直透镜T的第一个准直透镜T与第二行准直透镜T的第一个准直透镜T有一个边缘重合。对于图30的情况，在相邻行准直透镜T中，第一类准直透镜T10的边缘与其在另一行中相邻的椭圆形的准直透镜T的边缘重合，第二类的准直透镜T20的边缘与其在另一行中相邻的椭圆形的准直透镜T的边缘重合。
在一些实施例中，位于同行且相邻的任两个准直透镜相接触。示例地，如图26、图28、图29和图30所示，第一行准直透镜T中第一个准直透镜T和第二个准直透镜T相互靠近的边缘相接触。示例地，如图26所示，在准直透镜T呈椭圆形时，位于同行且相邻 的两个准直透镜T之间仅较少部分的边缘相接触。如第一行中第一个准直透镜T的右边缘与第二个准直透镜T的左边缘仅有一个点相接触。如图28和图29所示，在准直透镜T呈胶囊形或六边形时，位于同行且相邻的两个准直透镜的至少一个边缘重合。如第一行准直透镜T中第一个准直透镜T的右边缘与第二个准直透镜T的左边缘重合。对于图30的情况，形状为椭圆形的任一行准直透镜T中，相邻的两个准直透镜T仅较少部分边缘相接触；在具有目标形状或者辅助形状的任一行准直透镜中，相邻的两个准直透镜的边缘重合。当相邻的准直透镜T相接触时，可以进一步地提高准直透镜的空间利用率，避免准直镜组109的面积浪费。当然，准直镜组109中相邻的准直透镜T之间也可以存在间隙。
由于准直透镜T用于准直对应的发光组件130射出的激光，要实现激光器10的正常工作，需保证每个发光组件130发出的激光均射向对应的准直透镜T，故激光器10中准直透镜T的排布方式与发光组件130的排布方式需对应。在一些实施例中，如图31所示，多个发光组件130的排布方式与图26、图28、图29和图30所示的准直透镜T的排布方式相同。即，多个发光组件130排成多行，且任两行相邻的发光组件130交错排布。对于发光组件130的交错排布，可以参考本公开实施例中对于准直透镜T交错排布的相关介绍，在此不再赘述。
激光器10的准直镜组109中，间隔行准直透镜T可以错位排布，也可以在列方向上对齐。本公开一些实施例以间隔行准直透镜T在列方向上对齐为例。间隔行准直透镜指的是中间间隔了一行的两行准直透镜；即，准直镜组109中，在列方向上分别位于任一行准直透镜T两侧、且与该行准直透镜T相邻的两行准直透镜。示例地，图26、图28、图29和图30所示的准直镜组109中第一行准直透镜T和第三行准直透镜T为间隔行准直透镜T，其在列方向上对齐；第二行准直透镜T和第四行准直透镜T也为间隔行准直透镜T，其在列方向上对齐。两行准直透镜在列方向上对齐是指分别位于该两行中的两个准直透镜，一个位于另一个的正下方，该两个准直透镜的连线平行于列方向。
在一些实施例中，准直镜组109中各行准直透镜T数量相等。如图26、图28、图29和图30，均以准直镜组109中每行准直透镜T的数量为七个为例。当然，不同行准直透镜T的数量也可以不相等。准直透镜T的数量可依据发光组件130的设置需求来确定。例如，激光器10所需发出的亮度需要由20个发光芯片104才能实现，则激光器10需包括20个发光组件130，相应地，准直镜组109需包括20个准直透镜T。示例地，在行方向上相邻的任两个发光芯片104的间距相等。
由于发光芯片104在发光时会产生热量，且热量可以向周围扩散。底板101的中间区域的发光芯片104产生的热量可扩散的范围重叠度较高，中间区域的热量聚集显著，导致发光芯片104受热损坏的概率较高。而边缘区域的发光芯片104产生的热量可以向底板101中未设置发光芯片104的外侧区域扩散，发光芯片104的散热面积较大，而外侧区域并无热量产生，可以较快地传导发光芯片产生的热量。因此，示例地，在管壳120中，位于中间区域的发光组件130的数量少于位于边缘区域的发光组件130的数量。相应地，在准直镜组109中，位于中间区域的每行准直透镜T的数量少于位于边缘区域的每行准直透镜T的数量。如此，可以减少中间区域的发光芯片104发出的热量，减少底板101的中间区域接收的热量，从而减少了单位面积的热密度，且增大了中间区域中各个发光芯片104的散热面积，便于中间区域的热量较快地散发，降低中间区域的发光芯片104由于受热而损坏的概率，提高了激光器10的可靠性。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (25)

  1. 一种激光器，包括：
    底板；
    框架，设置于所述底板上，且包括多个缺口，所述多个缺口间隔设置于所述框架靠近所述底板的端部；
    多个发光组件，固定于所述底板上，且所述框架包围所述多个发光组件；
    多个导电引脚，所述多个导电引脚中的一个导电引脚位于所述多个缺口中的一个缺口中；所述导电引脚包括：
    基底，所述基底与所述底板绝缘；
    连接层，所述连接层嵌设于所述基底的内部；
    导电层，设置于所述基底远离所述底板的一侧的表面上，且与所述连接层电连接；
    导线，所述导线的一端与所述导电层电连接、所述导线的另一端与所述多个发光组件中的至少一个发光组件连接。
  2. 根据权利要求1所述的激光器，其中，所述导电引脚靠近所述底板的表面与所述框架靠近所述底板的表面平齐。
  3. 根据权利要求1或2所述的激光器，其中，
    所述基底包括：
    第一部分，设置于所述框架靠近所述多个发光组件的一侧；
    第二部分，设置于所述框架远离所述多个发光组件的一侧；
    第三部分，与所述第一部分和所述第二部分连接，所述第三部分设置于所述第一部分与所述第二部分之间，且所述第三部分被所述框架包围；
    所述导电层包括：
    第一导电层，设置于所述第一部分远离所述底板的一侧；
    第二导电层，设置于所述第二部分远离所述底板的一侧；
    其中，所述连接层嵌设于所述第三部分内部，所述第一导电层与所述第二导电层通过所述连接层电连接。
  4. 根据权利要求3所述的激光器，其中，所述第一部分远离所述底板的表面与所述第二部分远离所述底板的表面平齐。
  5. 根据权利要求4所述的激光器，其中，所述多个缺口平均分布于所述框架中相对的两个侧壁处。
  6. 根据权利要求3所述的激光器，还包括：
    印制电路板，设置于所述框架远离所述多个发光组件的一侧；
    第一焊盘，设置于所述底板上；
    第二焊盘，设置于所述印制电路板上；
    连接线路，设置于所述底板上，所述连接线路的一端与所述第二导电层电连接、所述连接线路的另一端与所述第一焊盘电连接；
    连接器，设置于所述框架与所述印刷电路板之间，所述连接器的一端与所述第一焊盘电连接、所述连接器的另一端与所述第二焊盘电连接。
  7. 根据权利要求6所述的激光器，其中，所述连接器包括至少一个弯折部。
  8. 根据权利要求1至7任一项所述的激光器，其中，所述框架与所述导电引脚为一体结构；
    所述多个导电引脚的多个所述基底包括：
    多个所述第一部分，所述多个第一部分一体成型为第一台阶；
    多个所述第二部分，所述多个第二部分一体成型为第二台阶；
    多个所述第三部分，所述多个第三部分一体成型。
  9. 根据权利要求8所述的激光器，其中，所述多个导电引脚的多个所述导电层包括多个所述第一导电层和多个所述第二导电层；
    所述多个第一导电层间隔设置于所述第一台阶远离所述底板一侧的表面，所述多个第二导电层间隔设置于所述第二台阶远离所述底板一侧的表面，所述多个导电引脚的多个所 述连接层间隔嵌设于所述多个第三部分的内部，且所述多个第一导电层通过所述多个连接层与所述多个第二导电层电连接。
  10. 根据权利要求2所述的激光器，其中，所述多个发光组件包括一行发光组件，所述一行发光组件对应一行第一导电层，所述一行第一导电层包括两个第一导电层；
    所述激光器还包括转接台，所述转接台设置于所述底板上，且与另一行第一导电层相对应，所述另一行第一导电层包括两个第一导电层；所述转接台被配置为转接所述导线；
    所述一行发光组件中的一部分串联的发光组件的一端与所述一行第一导电层中的一个第一导电层电连接，所述一行发光组件中的一部分串联的发光组件的另一端与所述转接台电连接，所述转接台与所述另一行第一导电层中的一个第一导电层电连接；
    所述一行发光组件中的另一部分串联的发光组件的一端与所述一行第一导电层中的另一个第一导电层电连接，所述一行发光组件中的另一部分串联的发光组件的另一端与所述转接台电连接，所述转接台与所述另一行第一导电层中的另一个第一导电层电连接。
  11. 根据权利要求10所述的激光器，其中，所述转接台包括相互绝缘的两个导电区，所述两个导电区设置于所述转接台远离底板一侧的表面上；
    所述两个导电区中的一个导电区与所述一行发光组件中的一部分串联的发光组件的另一端电连接；所述两个导电区中的另一个导电区与所述一行发光组件中的另一部分串联的发光组件的另一端电连接。
  12. 一种激光器，包括：
    底板；
    框架，所述框架设置于所述底板上，所述框架远离所述底板的一侧具有开口；
    多个发光组件，固定于所述底板上且被配置为发出激光，且所述框架包围所述多个发光组件；
    透光层，设置于所述管壳的所述开口所在侧；
    盖板，包括内边缘区域与外边缘区域，所述外边缘区域与所述框架远离所述底板的表面固定，所述内边缘区域与所述透光层的边缘固定；
    准直镜组，设置于所述透光层远离所述管壳的一侧；所述准直镜组包括多个准直透镜；所述多个准直透镜中的一个准直透镜被配置为减小射入的激光的发散角度，且使所述激光在慢轴上的发散角度减小量小于在快轴上的发散角度减小量。
  13. 根据权利要求12所述的激光器，其中，所述准直透镜包括：
    第一面，所述发光组件发出的激光通过所述第一面射入所述准直透镜，所述第一面被配置为扩大射入的激光在慢轴上的发散角度；
    第二面，所述发光组件发出的激光通过所述第二面射出所述准直透镜，所述第二面被配置为缩小射入的激光在快轴和慢轴上的发散角度。
  14. 根据权利要求13所述的激光器，其中，所述第一面包括凹弧面，所述凹弧面在第一方向上的曲率半径小于在第二方向上的曲率半径；所述第一方向与所述第二方向垂直。
  15. 根据权利要求13所述的激光器，其中，所述第一面包括凹柱面，且所述凹柱面的直母线平行于第二方向。
  16. 根据权利要求13所述的激光器，其中，所述第二面包括凸弧面，所述凸弧面在第一方向和第二方向上的曲率相同，所述第一方向与所述第二方向垂直。
  17. 根据权利要求13所述的激光器，其中，所述第二面包括凸弧面，所述凸弧面为自由曲面，所述凸弧面在第一方向上的曲率半径大于在第二方向上的曲率半径，所述第一方向与所述第二方向垂直。
  18. 根据权利要求13所述的激光器，其中，所述第一面包括凹弧面，所述第二面包括凸弧面，所述凹弧面的曲率半径大于所述凸弧面的曲率半径；或
    所述第一面为平面，所述第二面包括凸弧面，所述凸弧面为自由曲面，所述凸弧面在第一方向上的曲率半径大于在第二方向上的曲率半径，所述第一方向与所述第二方向垂直。
  19. 一种激光器，包括：
    底板；
    框架，所述框架设置于所述底板上，所述框架远离所述底板的一侧具有开口；
    多个发光组件，固定于所述底板上且被配置为发出激光，且所述框架包围所述多个发光组件；
    透光层，设置于所述管壳的所述开口所在侧；
    盖板，包括内边缘区域与外边缘区域，所述外边缘区域与所述框架远离所述底板的表面固定，所述内边缘区域与所述透光层的边缘固定；
    准直镜组，设置于所述透光层远离所述管壳的一侧；所述准直镜组包括多个准直透镜，所述多个准直透镜在行方向上排成多行并且列方向上排成多列；所述多个准直透镜中的一个准直透镜在所述列方向上的最大长度大于在所述行方向上的最大长度，且在所述列方向上的两个端部的宽度均小于中间部的宽度；
    所述多个准直透镜中相邻的两行准直透镜交错排布；且所述相邻的两行准直透镜中，存在准直透镜满足其靠近另一行准直透镜的端部，至少部分位于所述另一行准直透镜中相邻的两个准直透镜的两个端部之间。
  20. 根据权利要求19所述的激光器，其中，所述准直透镜在所述底板上的正投影呈六边形，所述六边形关于平行于所述列方向的对称轴对称。
  21. 根据权利要求19所述的激光器，其中，所述准直透镜在所述底板上的正投影呈椭圆形，所述椭圆形的长轴平行于所述列方向。
  22. 根据权利要求19所述的激光器，其中，在相邻的三行准直透镜中，分别位于两端的两行准直透镜中的每个准直透镜在所述底板上的正投影呈椭圆形；位于中间的一行准直透镜包括第一类准直透镜，所述第一类准直透镜在所述底板上的正投影呈目标形状；其中，所述目标形状由六个边围成，所述六个边包括平行且相对的两个直边，分别连接所述两个直边的一端的两个弧边，以及分别连接所述两个直边的另一端的两个弧边，所述弧边朝所述目标形状内凹陷。
  23. 根据权利要求19所述的激光器，其中，所述准直透镜包括第二类准直透镜，所述第二类准直透镜在所述底板上的正投影呈辅助形状，所述第二类准直透镜位于所述准直镜组的边缘，所述第二类准直透镜中与其他准直透镜不相邻的边缘为直边。
  24. 根据权利要求19至23任一项所述的激光器，其中，所述多个准直镜组中，分别位于相邻行且相邻的任两个准直透镜相接触；或
    位于同行且相邻的任两个准直透镜相接触。
  25. 根据权利要求24所述的激光器，其中，所述准直镜组中，分别位于任一行准直透镜两侧，且与所述任一行准直透镜相邻的两行准直透镜在列方向上对齐。
PCT/CN2022/117390 2021-09-06 2022-09-06 激光器 WO2023030542A1 (zh)

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