WO2023026823A1

WO2023026823A1 - Electronic component processing device

Info

Publication number: WO2023026823A1
Application number: PCT/JP2022/030102
Authority: WO
Inventors: 純正淀川
Original assignee: 上野精機株式会社
Priority date: 2021-08-24
Filing date: 2022-08-05
Publication date: 2023-03-02
Also published as: JP7089810B1; JP2023030917A

Abstract

This electronic component processing device is provided with a conveyance processing unit, a load detection unit, and a controller. The conveyance processing unit is provided with a component retention unit, a supporting unit that supports the component retention unit, a rotation driving unit that rotates the supporting unit, and a displacement driving unit that displaces the component retention unit. The load detection unit detects a load applied to an electronic component. The controller detects contact abnormality with respect to an electronic component.

Description

electronic component processing equipment

The present disclosure relates to an electronic component processing apparatus.

Patent Document 1 discloses a holding means driving device for driving and controlling electronic component holding means for holding electronic components. This holding means driving device has a load sensor that directly detects the load applied to the operating rod when the movable holding portion is pushed down.

Japanese Patent Application Laid-Open No. 2009-136950

The present disclosure provides a processing apparatus useful for improving the reliability of electronic components.

An electronic component processing apparatus according to one aspect of the present disclosure includes a component holding unit configured to hold an electronic component, and a circular orbit passing through a processing area for performing a predetermined process on the electronic component. a rotation drive configured to rotate the support about the central axis of the circular orbit; and a displacement configured to displace the component holder in the processing area. a load detection unit configured to detect a load applied to the electronic component when the displacement drive unit displaces the component holding unit in the processing area; and a displacement of the component holding unit. a controller configured to detect an abnormality in contact with the electronic component based on transition of a detection value by the load detection unit from a first timing to a second timing when the electronic component is moved.

According to the present disclosure, a processing device useful for improving the reliability of electronic components is provided.

FIG. 1 is a plan view schematically showing an example of an electronic component processing apparatus according to a first embodiment. FIG. 2 is a side view schematically showing an example of an electronic component processing apparatus. FIG. 3 is a block diagram showing an example of the functional configuration of the controller. FIG. 4 is a graph showing an example of detection results by the load detection unit. FIG. 5 is a block diagram showing an example of the hardware configuration of the controller. FIG. 6 is a flow chart showing an example of a series of control processes executed by the controller. FIGS. 7(a) to 7(d) are schematic diagrams exemplifying how recovery processing is performed on a carrier tape. FIGS. 8(a) to 8(d) are schematic diagrams exemplifying recovery processing when abnormal contact occurs with an electronic component. FIG. 9 is a side view schematically showing an example of an electronic component processing apparatus. FIG. 10 is a flow chart showing an example of a series of control processes executed by the controller. FIGS. 11(a) to 11(c) are schematic diagrams exemplifying the state of supply processing from the carrier tape. FIG. 12 is a plan view schematically showing an example of an electronic component processing apparatus according to the second embodiment. FIG. 13 is a side view schematically showing an example of an electronic component processing apparatus. FIG. 14 is a plan view schematically showing an example of an electronic component processing apparatus according to the third embodiment. FIG. 15 is a side view schematically showing an example of an electronic component processing apparatus. FIG. 16 is a plan view schematically showing an example of an electronic component processing apparatus according to the fourth embodiment. FIG. 17 is a flow chart showing an example of a series of control processes executed by the controller.

Several embodiments will be described below with reference to the drawings. In the explanation, the same reference numerals are given to the same elements or elements having the same function, and duplicate explanations are omitted. An XYZ orthogonal coordinate system is shown in the drawings as needed. For example, the X and Y axes are horizontal and the Z axis is vertical.

[First embodiment]
First, an electronic component processing apparatus according to the first embodiment will be described with reference to FIGS. 1 to 11(c). An electronic component processing apparatus 1 shown in FIGS. 1 and 2 is a so-called die sorter. The processing device 1 is a device that sequentially conveys a plurality of electronic components W, performs processing such as appearance inspection, electrical property inspection, and marking, and then packs them in storage members such as carrier tapes and trays. The electronic component W to be processed is, for example, a component that is separated into individual pieces by dicing or the like after being formed in a pre-process of semiconductor manufacturing.

As shown in FIGS. 1 and 2, the processing device 1 includes a transport processing section 2 and a controller 100. As shown in FIGS. The transport processing section 2 has a rotary transport unit 10 (rotary transport section) and a plurality of processing units 40 .

(rotary transfer unit)
The rotary transfer unit 10 transfers the electronic component W along the circular track CR. The electronic component W to be conveyed has main surfaces Wa and Wb that are parallel to each other (opposite to each other). The rotary transfer unit 10 has, for example, a support section 12 , a plurality of component holding sections 14 , a rotation drive section 16 and a plurality of elevation drive sections 18 .

The support portion 12 supports a plurality of component holding portions 14. Specifically, the support portion 12 supports the plurality of component holding portions 14 so that each component holding portion 14 is positioned on the predetermined circular orbit CR. The support portion 12 is provided so as to be rotatable around the central axis Ax of the circular orbit CR. The circular orbit CR may be a horizontal circular orbit, and the central axis Ax may be a vertical axis line (may extend along the vertical direction). The support portion 12 is, for example, a turntable.

A plurality of component holding portions 14 are arranged at regular intervals along the circumference around the central axis Ax and fixed to the support portion 12 . Each of the component holding portions 14 is configured to hold an electronic component W. As shown in FIG. The component holding section 14 may hold the electronic component W by any method. Specific examples of the method for holding the electronic component W include vacuum adsorption, electrostatic adsorption, gripping, and the like. The component holding section 14 may vacuum-suck one of the main surfaces Wa and Wb from one side in a direction perpendicular to the support section 12 (upper surface of the turntable).

In one example, the component holding section 14 has a suction section 22, a holder 24, and a spring 26, as shown in FIG. The suction portion 22 is configured to suction one of the main surfaces Wa, Wb of the electronic component W from above. The suction part 22 is, for example, a suction rod formed to extend perpendicularly to the support part 12, and sucks the electronic component W at its lower end. The holder 24 is fixed to the outer peripheral portion of the support portion 12 and holds the suction portion 22 so that it can move up and down.

The spring 26 resists the descent of the adsorption part 22 by its elasticity. The spring 26 is elastically deformed in accordance with the descent of the adsorption section 22 when a downward external force is applied to the upper end of the adsorption section 22, and elastically returns when the downward external force is removed to move the adsorption section 22 to the height before it was lowered. push back. The component holding section 14 may have a valve for switching between on and off of the vacuum suction by the suction section 22 according to an operation instruction from the controller 100 . A specific example of the valve is an electromagnetic valve.

The rotation drive section 16 is configured to rotate the support section 12 around the central axis Ax of the circular orbit CR. The rotary drive unit 16 uses a power source such as an electric motor to rotate the support unit 12 around the central axis Ax by direct drive without gears. As a result, the plurality of component holders 14 move along the horizontal circular orbit CR centered on the central axis Ax. As a result, the electronic component W held by the component holding section 14 is conveyed along the circular track CR. The rotary drive section 16 is controlled to repeat rotation and stop of the support section 12 at the angular pitch (angular pitch around the central axis Ax) between the adjacent component holding sections 14 . Hereinafter, the plurality of positions at which the plurality of component holding portions 14 (more specifically, the plurality of suction portions 22) are arranged when the rotation driving portion 16 stops the support portion 12 will be referred to as “a plurality of stop positions SP”. .

The plurality of lifting drive units 18 are configured to displace the plurality of component holding units 14 individually. 1, illustration of the elevation driving section 18 is omitted, and FIG. 2 shows one elevation driving section 18 out of the plurality of elevation driving sections 18. As shown in FIG. The elevation driving unit 18 (displacement driving unit) applies an external force to the component holding unit 14 that holds the electronic component W placed at the stop position SP, thereby moving the component holding unit 14 in one direction perpendicular to the support unit 12 . move it to the side. The elevation driving unit 18 moves the component holding unit 14 downward, for example, in the vertical direction.

A plurality of elevation drive units 18 may be provided so as to respectively correspond to a plurality of stop positions SP. The lifting drive section 18 may not be provided at the stop position SP where the component holding section 14 does not need to be displaced. The up-and-down drive part 18 is arrange|positioned in the corresponding stop position SP or its vicinity. The elevation driving section 18 is positioned above the component holding section 14 arranged at the corresponding stop position SP. The up-and-down drive unit 18 moves downward the component holding units 14 that are successively arranged at the corresponding stop positions SP.

The transport processing section 2 may have a fixing section 38 that fixes (holds) the plurality of elevation drive sections 18 . The fixed portion 38 is, for example, a plate-like member arranged above the support portion 12 . The fixed portion 38 is provided so as not to rotate together with the support portion 12 . Therefore, even if the support portion 12 rotates, the plurality of elevation driving portions 18 do not move. The elevation drive unit 18 has, for example, a holder 32, an operating rod 34, and a motor 36. As shown in FIG.

The holder 32 is fixed to the outer peripheral portion of the fixed portion 38 in the vicinity of the stop position SP. The operating rod 34 is provided on the holder 32 so as to be movable with respect to the holder 32 (fixed portion 38). The operating rod 34 extends, for example, in the vertical direction and is held by the holder 32 so as to be movable in the vertical direction. The operating rod 34 may be positioned vertically above the suction portion 22 of the component holding portion 14 when the component holding portion 14 is positioned at the stop position SP. The motor 36 functions as a drive source and moves the operating rod 34 downward. A portion of the motor 36 may contact the operating rod 34 when moving the operating rod 34 downward. Motor 36 is, for example, a servo motor.

In one example, when the operating rod 34 is lowered by the motor 36 , the lower end of the operating rod 34 contacts the upper end of the adsorption section 22 . When the operation rod 34 is in contact with the adsorption portion 22 and the operation rod 34 is further lowered, the adsorption portion 22 is displaced (moves downward). When the operating rod 34 is lifted by the motor 36, the downward force exerted by the operating rod 34 on the attracting portion 22 is released, and the reaction force of the spring 26 causes the attracting portion 22 to return to the height before it was displaced. .

(processing unit)
A plurality of processing units 40 are provided so as to correspond to some stop positions SP, respectively. Unlike the example shown in FIG. 1, a processing unit 40 may be provided at each stop position SP. The processing unit 40 is configured to perform predetermined processing on the electronic component W in the processing area PA including the corresponding stop position SP. The processing area PA is an area for performing predetermined processing on the electronic component W, and is positioned on the circular orbit CR. That is, the circular orbit CR passes through the processing area PA. The lifting drive section 18 is arranged at the stop position SP where the processing area PA is set.

In the present disclosure, "processing" performed on the electronic component W includes any action that changes the state of the electronic component W. For example, marking the electronic component W, causing the electronic component W to be held by the component holding unit 14 (handing over), and recovering the electronic component W from the component holding unit 14 (receiving) are referred to as “processing ”. Further, executing some kind of inspection on the electronic component W also corresponds to "processing" because it changes a state in which the inspection data is unknown to a state in which the inspection data is known. The multiple processing units 40 include, for example, a component supply unit 42 , a component recovery unit 44 , and one or more intermediate processing units 46 .

The component supply unit 42 is a unit that supplies electronic components W to the rotary transfer unit 10 . The component supply unit 42 is arranged at one of the stop positions SP. In one example, the component supply unit 42 conveys the carrier tape 60 containing a plurality of electronic components W to the corresponding stop position SP. A carrier tape 60 conveyed by the component supply unit 42 has a plurality of storage portions 62 each storing a plurality of electronic components W therein. The component supply unit 42 conveys the carrier tape 60 so that the storage portions 62 (the electronic components W stored in the storage portions 62) are arranged in order in the processing area PA including the corresponding stop position SP.

The component holder 14 moved to the corresponding stop position SP in a state where the container 62 containing the electronic component W is arranged in the processing area PA (area for supplying the electronic component W) is moved by the up-and-down drive unit 18 While being displaced, it receives the electronic component W inside the accommodating portion 62 . As a result, the electronic component W is supplied from the component supply unit 42 to the rotary transfer unit 10 . Hereinafter, the stop position SP where the component supply unit 42 supplies the electronic component W will be referred to as a "supply stop position SP". Also, the processing area PA including the supply stop position SP is referred to as "supply area SA".

The component recovery unit 44 is a unit that recovers the electronic components W from the rotary transfer unit 10 . The component recovery unit 44 is arranged at one of the stop positions SP. In one example, the component recovery unit 44 conveys the carrier tape 60 capable of accommodating a plurality of electronic components W (the carrier tape 60 with an empty storage portion 62) to the corresponding stop position SP. The component recovery unit 44 conveys the carrier tape 60 so that the storage portions 62 in which the electronic components W are not stored are arranged in order in the processing area PA including the corresponding stop position SP. The carrier tape 60 is made of resin and formed in a film shape (sheet shape).

The component holder 14 moved to the corresponding stop position SP in a state where the container 62 not containing the electronic component W is arranged in the processing area PA (area for collecting the electronic component W) is moved to the up-and-down drive unit. 18, the electronic component W is transferred into the accommodating portion 62. As shown in FIG. As a result, the electronic component W is recovered from the rotary transfer unit 10 to the component recovery unit 44 . Hereinafter, the stop position SP at which the component recovery unit 44 recovers the electronic component W will be referred to as a "collection stop position SP". Also, the processing area PA including the stop position SP for recovery is referred to as a "collection area RA". In the circular orbit CR, the supply stop position SP side is called the "upstream side", and the recovery stop position SP side is called the "downstream side". The electronic component W is conveyed from the upstream side to the downstream side on the circular track CR.

The intermediate processing unit 46 is a unit that performs predetermined processing on the electronic component W at any stop position SP other than the stop positions SP for supply and recovery. Specific examples of processing by the intermediate processing unit 46 include electrical property inspection, optical property inspection, appearance inspection, posture or position correction, and marking (laser marking).

(Load detector)
As shown in FIG. 2 , the processing device 1 has a load detection section 50 . The load detection unit 50 is configured to detect the load applied to the electronic component W when the elevation drive unit 18 displaces the component holding unit 14 in the processing area PA. The load detection unit 50 detects the load applied to the electronic component W processed in the processing area PA, for example, when the elevation driving unit 18 lowers the component holding unit 14 in the processing area PA. The load detection unit 50 may be a sensor that detects load by any method. The load detection unit 50 may be a mechanical sensor such as a strain gauge that detects changes in electrical resistance, or may be a load cell.

The load detection section 50 may be provided in the elevation drive section 18 so as to detect the load applied to the elevation drive section 18 . The load detection unit 50 is provided on the operating rod 34 so as to detect the load applied to the operating rod 34 of the elevation driving unit 18, for example. When the component holding portion 14 is displaced by the operating rod 34 in order to perform a predetermined process on the electronic component W, the load applied to the operating rod 34 includes, for example, the force received from the motor 36 and the force received from the component holding portion 14 . (the reaction force of the spring 26). Further, the load applied to the electronic component W to be processed when the component holding portion 14 is displaced is reflected in the load applied to the operating rod 34 . The load detection unit 50 outputs detection results to the controller 100 . When a plurality of lifting drive units 18 are arranged in each of the plurality of processing areas PA, a plurality of load detection units 50 may be provided corresponding to the plurality of lifting drive units 18, respectively.

In the following, a case of detecting the load applied to the electronic component W when displacing the component holding portion 14 in the recovery area RA where the electronic component W is recovered from the rotary transfer unit 10 to the component recovery unit 44 will be exemplified. The load detection unit 50 provided in the lifting drive unit 18 located above the recovery area RA lowers the suction unit 22 of the component holding unit 14 holding the electronic component W to the holding unit 62 of the carrier tape 60 . When the electronic component W is handed over, the load received by the electronic component W is detected.

In one example, the suction unit 22 sucking the electronic component W is lowered by the lifting drive unit 18 so that the electronic component W does not come into contact with the carrier tape 60 until the suction of the electronic component W is released. However, for some reason, when the electronic component W is delivered to the housing portion 62 of the carrier tape 60 , the electronic component W attracted by the suction portion 22 may come into contact with the carrier tape 60 . The load that the electronic component W receives at this time includes the external force (reaction force) applied to the electronic component W from the carrier tape 60 .

When the electronic component W adsorbed by the adsorption section 22 contacts the carrier tape 60 , the load received by the electronic component W is applied to the operating rod 34 of the elevation drive section 18 . Therefore, the load detection portion 50 provided on the operating rod 34 can detect the load that the electronic component W receives when it comes into contact with the carrier tape 60 . In the present disclosure, the detection of the load received by the electronic component W is performed not only when the electronic component W is in contact with the carrier tape 60 but also when the electronic component W is not in contact with the carrier tape 60 . (that is, detecting that the load received by the electronic component W is zero).

(controller)
The processing device 1 may comprise an input/output device 102 connected to the controller 100 (see FIG. 1). The input/output device 102 is a device for inputting a user instruction indicating an instruction from a user such as a worker to the controller 100 and for outputting information from the controller 100 to the worker or the like. The input/output device 102 may include a keyboard, operation panel, or mouse as an input device, and may include a monitor (for example, a liquid crystal display) as an output device. The input/output device 102 may be a touch panel in which an input device and an output device are integrated. Controller 100 and input/output device 102 may be integrated.

The controller 100 is composed of one or more control computers. The controller 100 controls the transport processing section 2 and the load detection section 50 according to a predetermined control procedure so that a plurality of electronic components W are sequentially subjected to predetermined processing. The controller 100 includes, for example, an operation control unit 112, a load information acquisition unit 114, an abnormality determination unit 116, a model storage unit 118, and a notification unit 122 as a functional configuration (hereinafter referred to as "function modules"). and Processing executed by these functional modules corresponds to processing executed by the controller 100 . Hereinafter, the processing executed by the controller 100 or each functional module will be referred to as “control processing” to distinguish it from the processing for the electronic component W in the transport processing section 2 .

The operation control unit 112 controls the transport processing unit 2 so as to perform corresponding processing on the electronic components W at several stop positions SP while transporting each of the plurality of electronic components W along the circular track CR. is configured as The operation control unit 112 controls the transport processing unit 2 so as to sequentially perform (repeatedly perform) the processing in each processing area PA for the plurality of electronic components W in the processing area PA. The operation control unit 112 may cause the transport processing unit 2 to execute control processing for ejecting the electronic component W when an abnormality in contact with the electronic component W is detected. The operation control unit 112 stops the operation of the transport processing unit 2, for example. In this case, the operation control unit 112 may control the transport processing unit 2 so as to interrupt the predetermined processing that is continuously performed on the plurality of electronic components W in each processing area PA.

The motion control section 112 intermittently rotates the support section 12 by the rotation drive section 16 so that the plurality of component holding sections 14 are sequentially arranged at the plurality of stop positions SP. Intermittently rotating means that the supporting portion 12 alternately rotates and stops. The motion control section 112 intermittently rotates the support section 12 by the rotation driving section 16 at the same angular pitch as the adjacent component holding sections 14 on the circular orbit CR. As a result, one of the component holding portions 14 (one of the suction portions 22) is arranged in order at each stop position SP.

The operation control unit 112 controls the elevation driving unit 18, the component holding unit 14, and the electronic components W so that the electronic components W are recovered from the rotary transfer unit 10 to the component recovery unit 44 in the recovery area RA including the stop position SP for recovery. It controls the parts recovery unit 44 . The operation control unit 112 causes the component recovery unit 44 to pitch-convey the carrier tape 60 so that the empty storage portions 62 of the carrier tape 60 are sequentially arranged in the recovery area RA. Pitch transport means that the carrier tape 60 is moved by the same pitch as the pitch between adjacent housing portions 62 in the carrier tape 60 .

The operation control section 112 lowers the suction section 22 of the component holding section 14 by the elevation drive section 18 corresponding to the recovery stop position SP. The operation control unit 112 lowers the suction unit 22, for example, to such an extent that the main surface Wb of the electronic component W held by the suction unit 22 comes into contact with the storage unit 62 located in the recovery area RA. Then, the operation control unit 112 controls the elevation driving unit 18 so that the suction unit 22 returns to the height before the descent after releasing the suction by the suction unit 22 .

The load information acquisition unit 114 is configured to acquire a value detected by the load detection unit 50 when the component holding unit 14 is displaced by the elevation drive unit 18 in the processing area PA (recovery area RA). For example, the load information acquisition unit 114 detects the load applied to the lifting drive unit 18 when the suction unit 22 of the component holding unit 14 placed at the stop position SP for collection is lowered by the lifting drive unit 18 . A value detected by the detection unit 50 is acquired.

The load information acquisition section 114 may continuously acquire the detection value by the load detection section 50 during any period including the period during which the lifting drive section 18 displaces the component holding section 14 . In this case, the load information acquisition unit 114 acquires data indicating temporal changes in the values detected by the load detection unit 50 . Hereinafter, data indicating the time change of the detection value obtained from the load detection unit 50 during an arbitrary period including the period during which the component holding unit 14 is displaced by the elevation driving unit 18 will be referred to as "time-series data". In one example, the load information acquisition unit 114 acquires time-series data indicating changes in the load over time from when the component holding unit 14 starts to displace to when the component holding unit 14 returns to its original height. do.

The load information acquisition unit 114 may continuously acquire the values detected by the load detection unit 50 during the above arbitrary period. The load information acquisition unit 114 may (intermittently) acquire the value detected by the load detection unit 50 in each sampling cycle. The sampling period may be set in advance so that the tendency of load change can be grasped in the time-series data, or may be set each time according to a user's instruction or the like. The load information acquisition unit 114 may continue acquiring detection values by the load detection unit 50 while the processing device 1 is operating (while the processing of the plurality of electronic components W is continued). In this case, the load information acquisition unit 114 extracts detection value data for an arbitrary period including the period during which the component holding unit 14 is being displaced by the elevation driving unit 18 from the continuously acquired detection value data. , the above time-series data may be acquired.

The abnormality determination unit 116 is configured to detect an abnormality in contact with the electronic component W to be processed in the processing area PA based on the value detected by the load detection unit 50 . Specifically, the abnormality determination unit 116 determines whether or not the contact with the electronic component W is abnormal based on the value detected by the load detection unit 50 . The abnormal contact with the electronic component W is, for example, an object (such as the carrier tape 60 described in the next paragraph) that may cause the electronic component W to malfunction compared to the case where the processing of the electronic component W is normal. ) means to make strong contact with

When the suction unit 22 is displaced so that the electronic component W sucked by the suction unit 22 does not come into contact with the carrier tape 60 before the suction release, the electronic component W is displaced before the suction release when the processing of the electronic component W is normal. The load experienced by is approximately equal to zero. In this case, the fact that the electronic component W contacts the carrier tape 60 before the suction release itself is an abnormal contact with the electronic component W. FIG. As an example of a case where the electronic component W contacts the carrier tape 60 abnormally, when the suction unit 22 is lowered, the opening edge of the accommodation portion 62 and its vicinity (the accommodation portion 62 of the carrier tape 60 is not provided). The base portion) may be in contact with the electronic component W. The opening edge of the housing portion 62 is a boundary portion between the side surface inside the housing portion 62 and the base portion.

The abnormality determination unit 116 detects an abnormality in the contact with the electronic component W based on the transition of the detection value by the load detection unit 50 from the first timing to the second timing when the suction unit 22 of the component holding unit 14 is displaced. detect. The second timing is timing different from the first timing. At the first timing and the second timing, the load applied to the electronic component W due to abnormal contact with the electronic component W when the suction unit 22 is displaced in transition of the detection value by the load detection unit 50 between these timings. This is the timing when changes in

The first timing is, for example, from the time when the lifting drive unit 18 starts displacing the suction unit 22 to the time when the electronic component W that the suction unit 22 is sucking can come into contact with another member (eg, the carrier tape 60). Any timing between In one example, the first timing is the main surface Wb (main surface facing downward) of the electronic component W that is sucked by the sucking unit 22 from the time when the lifting drive unit 18 actually starts lowering the sucking unit 22 . It is any timing until the height position reaches the base portion of the carrier tape 60 . The second timing is, for example, any time between when the electronic component W attracted by the suction unit 22 can come into contact with another member until the suction unit 22 returns to the position before the displacement after the electronic component W is released from the suction. This is the timing. In one example, the second timing is the time from when the height position of the main surface Wb of the electronic component W adsorbed by the adsorption unit 22 reaches the base portion of the carrier tape 60 to when the adsorption of the electronic component W is released. It is the timing of either

For example, the abnormality determination unit 116 performs electronic Abnormal contact with component W is detected. The abnormality determination unit 116 may determine whether or not the contact with the electronic component W is abnormal based on the time-series data. The time-series data includes detection values obtained from the load detection unit 50 during a period including at least the first timing and the second timing.

The abnormality determination unit 116 may determine whether or not the contact with the electronic component W is abnormal based on the time-series data acquired from the load detection unit 50 and a determination model constructed in advance (the electronic component It may also detect anomalies in contact with W). The determination model is constructed by machine learning so as to output a determination result as to whether or not the contact with the electronic component W is abnormal in response to the input of time series data indicating the time change of the load applied to the electronic component W. model.

　Machine learning is a method of autonomously discovering laws or rules by learning repeatedly based on given information. The decision model can be constructed using algorithms and data structures. The judgment model is realized using, for example, a neural network, which is an information processing model imitating the mechanism of human cranial nerves. A specific machine learning algorithm that is performed when constructing a judgment model is not particularly limited.

The model storage unit 118 stores the judgment model. The controller 100 may construct the determination model by performing machine learning based on learning data for constructing the determination model. Specifically, the controller 100 performs machine learning using data given as input for machine learning and a label that is the correct answer for the output of machine learning, thereby autonomously creating a determination model for determining the presence or absence of an abnormality. may be generated in Inputs for machine learning are various time-series data. The output of machine learning is the determination result as to whether or not the contact with the electronic component W is abnormal. The controller 100 uses multiple combinations of time-series data and labels to iteratively learn a technique for determining whether contact with the electronic component W is abnormal.

As described above, the stage of autonomously generating a judgment model corresponds to the learning phase. In the production phase or the determination phase, the abnormality determination unit 116 of the controller 100 uses the determination model stored in the model storage unit 118 to determine whether or not contact with the electronic component W is abnormal from time-series data. , to determine the presence or absence of abnormal contact. A decision model, which is a trained model, is portable between computers. Therefore, the controller 100 may store the judgment model in the model storage unit 118 by acquiring the judgment model constructed in another computer. In this case, the controller 100 may execute the production phase (determination phase) without executing the learning phase.

Fig. 4 shows various time-series data used in the learning phase. The horizontal axis indicates time, and the vertical axis indicates the detected value by the load detection section 50 . In FIG. 4, the graph indicated by "a" is the time-series data classified (labeled) that the contact with the electronic component W is normal, and is indicated by "b", "c" and "d". The graph shown is time-series data classified as abnormal contact with the electronic component W. FIG. In the graphs indicated by "b", "c" and "d", the state of contact (type of abnormality) with respect to the electronic component W is different from each other.

In the learning phase, various time-series data with different contact states (time-series data classified as abnormal) may be used. Alternatively, in the learning phase, the judgment model may be constructed by preparing time-series data for a normal contact state without preparing time-series data for abnormal contact states. In this case, the constructed judgment model calculates the degree of divergence between the time-series data in which the contact state is unknown and various time-series data in the normal state, thereby judging whether or not there is an abnormality in the electronic component W. good.

Returning to FIG. 3, the notification unit 122 is configured to notify a user such as an operator of the result of abnormality determination by the abnormality determination unit 116 . For example, when an abnormality in contact with the electronic component W is detected, the notification unit 122 outputs information indicating that an abnormality has been detected to the input/output device 102 . The notification unit 122 may output to the monitor of the input/output device 102 information indicating that an abnormality has been detected and information for identifying the electronic component W that has made abnormal contact. The information for identifying the electronic component W that has made abnormal contact may be any information that can identify the individual electronic component W. FIG.

In one example, the operation control unit 112 interrupts (temporarily stops) the processing for collecting the electronic components W before the next accommodation unit 62 is placed in the collection area RA. In this case, the notification unit 122 causes the monitor to display a message such as "the electronic component W that was accommodated immediately before in the accommodation unit 62 is in abnormal contact" as information for specifying the electronic component W that has made abnormal contact. good too.

The controller 100 has a circuit 150 as shown in FIG. Circuitry 150 includes one or more processors 152 , memory 154 , storage 156 , input/output ports 158 and timers 162 . The storage 156 has a computer-readable storage medium such as a non-volatile semiconductor memory. The storage 156 stores a program for causing the controller 100 to control the transport processing section 2, the load detection section 50, and the input/output device 102 according to a preset control procedure. For example, the storage 156 stores programs for configuring each functional module described above.

The memory 154 temporarily stores the program loaded from the storage medium of the storage 156 and the calculation result by the processor 152 . The processor 152 configures each functional module of the controller 100 by executing the program in cooperation with the memory 154 . The input/output port 158 inputs/outputs electric signals to/from the transport processing unit 2, the load detection unit 50, the input/output device 102, and the like according to commands from the processor 152. FIG. The timer 162 measures the elapsed time by, for example, counting reference pulses of a constant cycle. Note that the circuit 150 is not necessarily limited to configuring each function by a program. For example, the circuit 150 may configure at least part of its functions by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) integrating this.

(Control method)
Next, an example of a control procedure (control method) executed by the controller 100 will be described. FIG. 6 is a flow chart showing a series of control processes for sequentially recovering a plurality of electronic components W to the storage portions 62 of the carrier tape 60 in the processing area PA (collection area RA) including the stop position SP for recovery. be. The controller 100 may continue to acquire detection values from the load detection section 50 while continuously executing this series of control processes. In this series of processes, the suction unit 22 of the component holding unit 14 holding the electronic component W to be collected is positioned at the stop position SP one upstream of the stop position SP for collection, and the controller 100 first executes step S11.

In step S11, for example, the operation control unit 112 rotates the support unit 12 by the rotation driving unit 16 so that the suction unit 22 sucking the electronic component W to be collected is positioned at the recovery stop position SP. . The operation control unit 112 waits until the end of the processing of the electronic component W in all of the processing areas PA set in the transport processing unit 2, and then causes the rotation driving unit 16 to start rotating the supporting unit 12. good too. The operation control unit 112 may control the rotation driving unit 16 so that the electronic component W is rotationally conveyed along the circular orbit CR after the processing with the longest processing time in the processing area PA is completed. In this case, the time during which the supporter 12 is stopped during the intermittent operation of the supporter 12 substantially coincides with the longest processing time.

Next, the controller 100 executes step S12. In step S12, for example, the operation control section 112 causes the component recovery unit 44 to pitch-convey the carrier tape 60 so that the storage section 62, which is to store the electronic component W to be recovered, is arranged in the recovery area RA. Let As a result, the suction unit 22 that holds the electronic component W to be collected and the storage unit 62 that is to store the electronic component W are arranged in the recovery area RA for performing the delivery process of the electronic component W ( See FIG. 7(a)).

Next, the controller 100 executes step S13. In step S13, for example, the operation control section 112 controls the corresponding elevation driving section 18 so as to lower the suction section 22 holding the electronic component W to be collected. The operation control unit 112 may control the elevation driving unit 18 so as to move the adsorption unit 22 downward by a predetermined amount of descent. The amount of descent is such that the electronic component W to be collected is accommodated in the accommodation portion 62 to be accommodated in a state in which it has been lowered by the amount of descent, and a slight clearance is provided between the main surface Wb and the bottom surface of the accommodation portion 62. It may be set to the extent that FIGS. 7A and 7B illustrate the operation of lowering the suction unit 22. In this example, the electronic component W to be collected is normally accommodated in the accommodation unit 62. there is

Next, the controller 100 executes steps S14 and S15. In step S14 , for example, the operation control section 112 controls the component holding section 14 so as to release the suction by the suction section 22 . In step S15, for example, the operation control unit 112 controls the elevation driving unit 18 so as to return the suction unit 22 to the height before the displacement. FIG. 7(c) illustrates an operation when the suction portion 22 returns to the height before displacement. By the control process described above, the electronic component W is handed over from the adsorption unit 22 to the accommodation unit 62 to be accommodated. That is, the electronic components W are collected from the rotary conveying unit 10 onto the carrier tape 60 conveyed by the component collecting unit 44 .

Next, the controller 100 executes step S16. In step S16, for example, the load information acquisition unit 114 acquires time-series data indicating temporal changes in the detected value by the load detection unit 50 in a period including at least the first timing and the second timing. In one example, the load information acquisition unit 114 extracts data from the start of step S13 to the end of step S15 from the data of the detected value by the load detection unit 50 that is continuously acquired, thereby Get series data. That is, the load information acquisition unit 114 acquires time-series data indicating the time-dependent change in the load applied to the lifting drive unit 18 during the period from the start of the displacement of the adsorption unit 22 to the end of the displacement of the adsorption unit 22. do.

Next, the controller 100 executes step S17. In step S17, for example, the abnormality determination unit 116 determines whether or not the contact with the electronic component W to be collected is abnormal. The abnormality determination unit 116 inputs the time-series data obtained in step S16 to the determination model stored in the model storage unit 118, and obtains the output result from the determination model to determine the presence or absence of contact abnormality. You may

In step S17, if an abnormality in contact with the electronic component W to be collected is not detected (step S17: NO), the control process executed by the controller 100 returns to step S11. In this case, the controller 100 executes a series of control processes of steps S11 to S17 for the next electronic component W to be collected. FIG. 7(d) illustrates how the suction unit 22 for sucking the next electronic component W to be collected and the next storage unit 62 are arranged in the collection area RA.

On the other hand, if an abnormality in contact with the electronic component W to be collected is detected in step S17 (step S17: YES), the control process executed by the controller 100 proceeds to step S18. In step S18, for example, the operation control unit 112 stops the operation of the transport processing unit 2 (interrupts the transport and processing operations of the electronic component W by the transport processing unit 2). In one example, the operation control unit 112 intermittently operates the support unit 12 by the rotation drive unit 16 and keeps the component holding unit 14 by each of the up-and-down drive units 18 until there is a user instruction from the operator or the like in the next step S19. , and processing operations by all the processing units 40 are not performed.

The operation control unit 112 may control the transport processing unit 2 to interrupt the transport and processing operations of the electronic component W for a time longer than the longest processing time of all the processing units 40 . That is, the operation control unit 112 intermittently operates the supporting unit 12, displacing the component holding unit 14, And the processing operation by each processing unit 40 may not be executed. In step S18, the notification unit 122 outputs to the input/output device 102 information indicating that an abnormality in the contact state of the electronic component W to be collected has been detected and information for specifying the electronic component W. good too.

FIGS. 8(a) to 8(d) exemplify a state in which contact with the electronic component W is abnormal when the suction portion 22 is displaced by the elevation driving portion 18. FIG. As shown in FIGS. 8(a) and 8(b), when the suction unit 22 for sucking the electronic component W to be collected is lowered, the electronic component W is caught by the opening edge of the storage unit 62 and its It is in contact with the vicinity (the base portion of the carrier tape 60 where the accommodation portion 62 is not provided). As shown in FIG. 8( c ), when the electronic component W contacts the edge of the opening and its vicinity, at least a portion of the electronic component W is removed from the opening of the housing portion 62 when the suction by the suction portion 22 is released. There is a possibility of riding on the rim (base part).

FIG. 8(d) illustrates a state in which the operation control unit 112 interrupts the transportation and processing operations of the electronic component W. As shown in FIG. In the interrupted state illustrated in FIG. 8D, the suction unit 22 that has been sucking the electronic component W to be collected remains in the collection area RA. In addition, the storage portion 62 in which the electronic component W that has made abnormal contact is stored in an inclined state without the carrier tape 60 being transported remains in the collection area RA.

Next, the controller 100 executes step S19. In step S19, the controller 100 waits until it receives a user instruction to restart the operation from a user such as a worker. In other words, the operation control unit 112 suspends the transportation and processing operations of the electronic component W until the operator or the like executes a user instruction instructing restart. The operator or the like may eject the electronic component W determined to be in abnormal contact from the carrier tape 60 based on the information displayed on the monitor of the input/output device 102, for example.

Upon receiving a user instruction indicating a restart instruction from an operator or the like, the control process executed by the controller 100 returns to step S11. The controller 100 executes a series of control processes of steps S11 to S17 for the next electronic component W to be collected. In this case, the controller 100 controls the transport processing unit 2 so that the electronic component W to be collected next is stored in the storage unit 62 to which the electronic component W determined to have made abnormal contact is delivered. good too. While the processing apparatus 1 is operating, the controller 100 causes the transfer processing section 2 to continuously execute the series of control processing described above.

(Modification)
The above-described series of control processing shown in FIG. 6 is an example, and can be changed as appropriate. In the series of control processes described above, the controller 100 may execute one step and the next step in parallel, or may execute each step in an order different from the above example. For example, the controller 100 may perform step S11 after performing step S12, or may perform step S11 and step S12 in parallel so as to at least partially overlap.

The timing of stopping the operation when abnormal contact is detected is not limited to the above example. When the controller 100 detects an abnormality in the contact with the electronic component W, the controller 100 starts pitch transportation for arranging the next storage unit 62 at the recovery stop position SP, and before stopping the pitch transportation, The transport processing unit 2 may be controlled so as to stop the operation of the transport processing unit 2 . The controller 100 performs the transfer process after performing the pitch transport for arranging the next storage unit 62 at the recovery stop position SP, and before displacing the adsorption unit 22 that adsorbs the next electronic component W to be recovered. The transport processing unit 2 may be controlled so as to stop the operation of the unit 2 . After the electronic component W is housed in the housing portion 62, when the housing portion 62 is sealed with tape so as to cover the housing portion 62, the controller 100 controls the housing portion 62 housing the electronic component W determined to be in abnormal contact. The operation by the transport processing unit 2 may be stopped before sealing with tape.

When an abnormality in contact with the electronic component W is detected, in addition to interrupting the operation of the transport processing unit 2, the electronic component W determined to be in abnormal contact may be ejected by the transport processing unit 2. For example, the transport processing section 2 may have a discharge unit 70, as shown in FIG. The ejecting unit 70 is a unit that ejects the electronic component W determined to be in abnormal contact from the accommodating member (carrier tape 60 ) based on an operation instruction from the controller 100 . The ejection unit 70 has, for example, an ejection holding portion 72 , a drive portion 74 and an ejection bin 76 .

The ejection holding part 72 is configured to be able to hold the electronic component W. The discharge holder 72 may hold the electronic component W by any method. The discharge holder 72 can hold the electronic component W by vacuum suction, for example. The driving section 74 includes a power source such as an electric motor, and moves the ejection holding section 72 along a predetermined direction. The drive unit 74 may move the ejection holding unit 72 along each of the horizontal direction and the vertical direction. The ejection bin 76 accommodates the electronic component W separated from the ejection holding portion 72 . The electronic components W are discharged from the carrier tape 60 by accommodating the electronic components W in the discharge bin 76 .

FIG. 10 is a flow chart showing another example of a series of control processes for sequentially collecting a plurality of electronic components W into the storage portions 62 of the carrier tape 60 in the collection area RA. In this series of control processes, the electronic component W is ejected by the ejection unit 70 when an abnormality in contact with the electronic component W is detected. Controller 100 executes steps S31 to S37 in the same manner as steps S11 to S17 in the series of control processes shown in FIG.

In step S37, when an abnormality in contact with the electronic component W to be collected is detected (step S37: YES), the control process executed by the controller 100 proceeds to step S38. In step S38 , for example, the operation control section 112 controls the discharge unit 70 so as to discharge the electronic component W determined to be in abnormal contact from the housing section 62 . In one example, the operation control unit 112 moves the ejection holding unit 72 to a position where the electronic component W to be ejected can be picked up by the drive unit 74, and controls the ejection holding unit 72 to hold the electronic component W. . Then, the operation control unit 112 controls the ejection holding unit 72 so that the ejection holding unit 72 holding the electronic component W is moved to above the ejection bin 76 by the driving unit 74 and the electronic component W is released from the suction. do.

After executing step S38, the control process executed by the controller 100 returns to step S31. Then, the controller 100 executes a series of control processes of steps S31 to S37 for the next electronic component W to be collected. While the control process of step S38 is being executed, the operation control section 112 interrupts the transportation and processing operations of the electronic component W by the transportation processing section 2 . For example, while executing the control process of step S38, the motion control unit 112 intermittently operates the support unit 12 by the rotation drive unit 16, displaces the component holding unit 14 by each of all the elevation drive units 18, and no processing operations are performed by any processing unit 40 .

When abnormal contact with the electronic component W is detected, the processing device 1 may discharge the electronic component W determined to be abnormally contacted by the rotary transfer unit 10 instead of the discharge unit 70 . After ejecting the electronic component W determined to be in abnormal contact by the ejecting unit 70 or the rotary transfer unit 10, the processing apparatus 1 stores the next electronic component W in the accommodation unit 62 in which the electronic component W was to be accommodated. A part W may be accommodated.

Abnormal contact with the electronic component W is not limited to the case where the electronic component W released from adsorption rides on the opening edge of the housing portion 62, as exemplified in FIGS. 8(a) to 8(d). For example, the electronic component W may come into contact with the opening edge of the accommodating portion 62 once and be accommodated in the accommodating portion 62 as in the normal state. Further, the electronic component W may contact the opening edge of the housing portion 62 once and be housed in the housing portion 62 in an oblique state between the side surface and the bottom surface of the housing portion 62 . In FIG. 4, the graph indicated by "b" is time-series data of the load when the electronic component W is housed in the housing portion 62 in the same manner as in the normal state after contacting the opening edge. The graph indicated by "c" is time-series data when the electronic component W is accommodated in the accommodating portion 62 in an inclined state, and the graph indicated by "d" is the electronic component W running over the edge of the opening. This is time-series data when it is stored in a

As exemplified in FIG. 4, the change tendency of the time-series data (transition of the detected value by the load detection unit 50) differs depending on how the contact abnormality with the electronic component W occurs. Therefore, the abnormality determination unit 116 may determine the type of abnormality in addition to determining whether there is an abnormality in contact with the electronic component W. FIG. For example, the abnormality determination unit 116 determines the type of abnormality using a determination model constructed by machine learning so as to output the determination result of the presence or absence of abnormality, including the type of abnormality, in response to the input of time-series data. can be determined. The notification unit 122 may cause the monitor of the input/output device 102 to display information indicating the type of abnormality. The notification unit 122 may cause the monitor of the input/output device 102 to display time-series data (graph) when a contact abnormality is detected.

In the above example, the component recovery unit 44 recovers the electronic components W to the carrier tape 60, but the component recovery unit 44 may also recover the electronic components W to the storage tray. The storage tray may be made of hard resin. The storage tray may have a plurality of storage pockets arranged in a row, or may have a plurality of storage pockets arranged in rows and columns in two directions perpendicular to each other. The load information acquisition unit 114 is information indicating the load applied to the electronic component W when the lifting drive unit 18 displaces the adsorption unit 22 in order to collect the electronic component W in the storage pocket arranged in the collection area RA. may be acquired from the load detection unit 50 .

The abnormality determination unit 116 may determine whether there is an abnormality in contact with the electronic component W based on the load time-series data obtained from the load detection unit 50, as in the case where the carrier tape 60 is used. The abnormality determination unit 116 may determine the presence or absence of abnormal contact of the electronic component W using a determination model constructed by machine learning based on time-series data for learning obtained when the storage tray is used.

Instead of or in addition to the recovery of the electronic components W by the component recovery unit 44, when the electronic components W are supplied by the component supply unit 42, the load applied to the electronic component W to be supplied is detected, and the electronic component W is detected. may be detected. As shown in FIGS. 11A to 11C, in the processing area PA (supply area SA) including the supply stop position SP corresponding to the component supply unit 42, the suction unit 22 of the component holding unit 14 A load detection unit 50 may be provided in the lifting drive unit 18 that displaces the . For example, a series of control processes are executed as follows.

The operation control section 112 moves the support section 12 by the rotation drive section 16 so that the suction section 22 that does not hold (suck) the electronic component W is arranged in the supply area SA. After or during this movement, the operation control unit 112 causes the component supply unit 42 to pitch-convey the carrier tape 60 so that the container 62 containing the electronic component W to be supplied is arranged in the supply area SA. . As a result, as shown in FIG. 11A, the suction section 22 that does not suck the electronic component W and the storage section 62 that stores the electronic component W to be supplied are opposed to each other.

Next, the operation control section 112 controls the elevation drive section 18 to lower the adsorption section 22 . As shown in FIG. 11(b), the operation control unit 112 is designed to contact the electronic component W or slightly between the suction surface (lower surface) of the suction unit 22 and the main surface Wa of the electronic component W. The suction unit 22 may be lowered by the lifting drive unit 18 to such an extent that a sufficient clearance is provided. Then, the operation control section 112 controls the component holding section 14 so that the suction section 22 starts sucking the electronic component W. As shown in FIG. After that, as shown in FIG. 11C, the operation control section 112 controls the elevation driving section 18 so that the component holding section 14 with the electronic component W sucked returns to the height before the displacement. As a result, the electronic components W are supplied to the rotary transport unit 10 from the carrier tape 60 transported by the component supply unit 42 .

The load information acquiring unit 114, during the period from the time when the suction unit 22 that does not absorb the electronic component W starts to descend to the time when the suction unit 22 returns to the height before the displacement after the electronic component W is suctioned, A value detected by the load detection unit 50 may be acquired, or data of the detected value (load time-series data) during the period may be extracted. When the suction portion 22 contacts the electronic component W inside the housing portion 62 , the reaction force from the electronic component W to the suction portion 22 is reflected in the time-series data obtained from the load detection portion 50 . Thus, the load detection unit 50 detects the load applied to the electronic component W when the suction unit 22 is displaced to receive the electronic component W. As shown in FIG.

Similar to the case where the electronic component W is collected on the carrier tape 60, the abnormality determination unit 116 is based on the transition of the detected value by the load detection unit 50 from the first timing to the second timing when the suction unit 22 is displaced. to detect an abnormality in contact with the electronic component W. In one example, the first timing is any timing from when the lifting drive unit 18 starts displacing the suction unit 22 to when the suction unit 22 is stopped. The second timing is any timing from when the suction unit 22 is stopped to when the suction unit 22 returns to the position before displacement after the electronic component W is sucked.

The abnormality determination unit 116 determines whether or not there is an abnormality in contact with the electronic component W based on the load time-series data obtained from the load detection unit 50 in a period including at least the first timing and the second timing. good. The abnormality determination unit 116 uses a determination model constructed by machine learning based on time-series data for learning obtained when supplying the electronic component W from the carrier tape 60 to determine abnormal contact of the electronic component W to be supplied. The presence or absence may be determined. Instead of the carrier tape 60, the controller 100 receives information indicating the load applied to the electronic components W when supplying the electronic components W to the rotary transfer unit 10 from a storage tray in which a plurality of electronic components W are stored. may be acquired and abnormal contact with the electronic component W may be detected.

The processing device 1 may be configured to process one type of electronic component W. Alternatively, the processing device 1 may be configured to process different types of electronic components W from each other. In the processing device 1, the part type of the electronic part W to be processed may be changed in a predetermined processing unit (for example, the number of days or the number of processed parts). The processing apparatus 1 may continuously process the plurality of electronic components W of the second type after continuously processing the plurality of electronic components W of the first type. At least one of the size and weight may be different among the plurality of types of electronic components W.

A plurality of different types of carrier tapes 60 may be used depending on the component type (kind) of the electronic component W, and the electronic component W may be collected. The component collection unit 44 collects the electronic components W from the rotary transport unit 10 onto, for example, the carrier tape 60 corresponding to the component type of the electronic components W to be processed. Alternatively, when the component type of the electronic component W is replaced, another component recovery unit 44 capable of transporting the carrier tape 60 corresponding to the component type of the electronic component W to be processed may be used.

Depending on the component type of the electronic component W, the tendency of the time-series data obtained when the electronic component W is collected on the carrier tape 60 differs. More specifically, the tendency of change in the time-series data obtained when the electronic component W makes abnormal contact with the carrier tape 60 differs depending on the component type of the electronic component W. FIG. Therefore, in order to detect abnormal contact with the electronic component W based on time-series data, a plurality of determination models corresponding to a plurality of types of electronic components W may be constructed in the learning phase. The controller 100 may detect abnormal contact with the electronic component W to be processed using a determination model corresponding to the component type of the electronic component W to be processed.

The model storage unit 118 described above may store a database in which component types (a plurality of component types) of a plurality of types of electronic components W are associated with a plurality of determination models. In the database, for example, one determination model is associated with each part type. In the learning phase, various time-series data may be prepared as learning data for each component type (one type of electronic component W), and then a determination model corresponding to the component type may be constructed. The controller 100 may have a product type information acquisition unit 132 and a model selection unit 134 as functional modules (see FIG. 3).

The product type information acquisition unit 132 acquires information indicating the component type of the electronic component W to be processed (hereinafter referred to as "product type information"). The product type information acquisition unit 132 may acquire the product type information by any method. The product type information acquisition unit 132 acquires product type information based on, for example, a user instruction (user input via the input/output device 102) indicating the component type of the electronic component W. FIG. The product type information acquisition unit 132 (controller 100) reads an identification code indicating the type of electronic component W instead of a user instruction, or obtains information from a file or data in which the type of electronic component W is written. , you may acquire the variety information.

The model selection unit 134 selects a judgment model corresponding to the electronic component W to be processed from among a plurality of judgment models based on the product type information. The model selection unit 134 selects a determination model constructed for the electronic component W to be processed, for example, by referring to the database stored in the model storage unit 118 . The selection of the determination model by the model selection unit 134 may be performed (every time) when the component type of the electronic component W to be processed is replaced.

The abnormality determination unit 116 determines whether the contact with the electronic component W to be processed is abnormal based on the time-series data acquired from the load detection unit 50 and the determination model corresponding to the electronic component W to be processed. may be determined (an abnormality in contact with the electronic component W to be processed may be detected). Also when the electronic component W is supplied by the component supply unit 42, the controller 100 selects a corresponding determination model according to the component type of the electronic component W to be processed, and determines the electronic component at the time of supply. Abnormal contact with W may be detected.

Different types of carrier tapes 60 may be used for electronic components W of the same component type. In this case, a corresponding determination model may be constructed for each type of carrier tape 60 . The controller 100 may select a determination model according to the type of the carrier tape 60 and then detect abnormal contact with the electronic component W using the determination model. The controller 100 may select a determination model according to the combination of the component type of the electronic component W and the type of the carrier tape 60, and then detect the abnormal contact with the electronic component W using the selected determination model.

(Effect of Embodiment)
The processing apparatus 1 according to the first embodiment described above has a component holding unit 14 configured to hold the electronic component W, and a processing area PA for executing a predetermined process on the electronic component W. A support portion 12 that supports the component holding portion 14 so as to be positioned on the circular orbit CR passing therethrough, a rotation driving portion 16 that is configured to rotate the support portion 12 around the central axis Ax of the circular orbit CR, and a processing area PA When the displacement drive unit (elevating drive unit 18) configured to displace the component holding unit 14 in the transport processing unit 2 and the displacement drive unit displaces the component holding unit 14 in the processing area PA, Based on the transition of the detected value by the load detection unit 50 configured to detect the load applied to the electronic component W and the load detection unit 50 from the first timing to the second timing when the component holding unit 14 is displaced and a controller 100 configured to detect abnormal contact with the electronic component W.

As a method of detecting abnormal contact with electronic components, a method of evaluating the magnitude of the detected value by the load sensor at each time and determining contact abnormality at each time is also conceivable. However, the value detected by the load sensor may include loads detected by various factors, and even if abnormal contact occurs, only a load close to normal is applied in some cases. For this reason, it is difficult to distinguish between the detected load value in the normal state and the detected load value in the abnormal state at each time. On the other hand, in the processing device 1, an abnormality in the contact with the electronic component W is detected based on the transition of the load detection value between different timings. Since an abnormality is detected by observing a change in the load applied to the electronic component W in this manner, an abnormality in contact with the electronic component W can be detected with high accuracy. Therefore, it is useful for improving the reliability of the electronic component W.

The controller 100 may control the transport processing unit 2 so as to sequentially perform a predetermined process in the processing area PA on a plurality of electronic components W, and when an abnormality in contact with the electronic components W is detected, the transport The operation of the processing unit 2 may be stopped. In this case, when the controller 100 detects an abnormal contact, the operator or the transport processing unit 2 can confirm the electronic component W that is in abnormal contact and remove the electronic component W. Therefore, it is more useful for improving the reliability of the electronic component W.

The controller 100 may be configured to detect an abnormality in contact with the electronic component W based on time-series data indicating changes over time in values detected by the load detection unit 50 . The time-series data in the normal state and the time-series data in the event of a contact abnormality are likely to differ in their changing tendencies. Therefore, an abnormality in contact with the electronic component W can be detected with high accuracy. Therefore, it is more useful for improving the reliability of the electronic component W.

The controller 100 determines whether or not the contact with the electronic component W is abnormal according to the time-series data acquired from the load detection unit 50 and the input of the time-series data. It may be configured to detect an abnormality in contact with the electronic component W based on the model. In this case, by making a judgment using a judgment model constructed by machine learning, it is possible to detect an abnormality in contact with the electronic component W with higher accuracy. Therefore, it is more useful for improving the reliability of the electronic component W.

The controller 100 selects a determination model from among a plurality of determination models based on a database in which a plurality of component types and a plurality of determination models are associated with each other and the component type of the electronic component W; and detecting an abnormality in contact with the electronic component W based on the time-series data acquired from the unit 50 and the determination model corresponding to the electronic component W. Depending on the type of the electronic component W, the tendency of the time-series data when an abnormality in contact with the electronic component W occurs may change. In the above configuration, by making a determination using a determination model corresponding to the type of the electronic component W to be processed, an abnormality in contact with the electronic component W can be detected with higher accuracy. Therefore, it is more useful for improving the reliability of the electronic component W.

The displacement driving section may be configured to displace the component holding section 14 by applying an external force to the component holding section 14 . The load detection section 50 may be provided in the displacement drive section. When an external force is applied to displace the component holding portion 14, the component holding portion 14 and the displacement drive portion come into contact with each other. Data on the load associated with the contact is reflected in the value detected by the load detection unit 50 . Since the processing device 1 detects an abnormality based on the time-series data, the abnormality can be detected without considering the load associated with the contact between the component holding section 14 and the displacement driving section. Therefore, it is useful for detecting abnormal contact with the electronic component W with high accuracy. By providing the load detection unit 50 in the displacement driving unit, there is no need to provide a load detection unit in each rotating component holding unit 14, and the device configuration of the processing apparatus 1 provided with a plurality of component holding units 14 can be simplified. useful for

As described above, in one example, when the electronic components W are collected on the carrier tape 60, an abnormality in contact with the electronic components W is detected. Since the carrier tape 60 is made of a resin film, the carrier tape 60 is pushed in when the electronic component W comes into contact with the edge of the opening of the carrier tape 60 or the like. As a result, the reaction force from the carrier tape 60 to the electronic component W becomes weaker, making it difficult to distinguish between the normal load detection value and the abnormal load detection value compared to the case of using other housing members. In the processing device 1, the presence or absence of an abnormality is determined based on the transition of the detected load value between different timings (for example, time-series data). Also, it is possible to determine abnormality with high accuracy.

[Second embodiment]
Next, an electronic component processing apparatus according to a second embodiment will be described with reference to FIGS. 12 and 13. FIG. Instead of the carrier tape 60 or the storage tray, the electronic components W may be collected on a wafer sheet, or the electronic components W may be supplied from the wafer sheet. A processing apparatus 1A shown in FIG. The transport processing section 2A has a rotary transport unit 10A and a component recovery unit 44A.

While the rotary transfer unit 10 described above displaces the component holder along the central axis Ax, the rotary transfer unit 10A displaces the component holder along the radial direction of the circumference centered on the central axis Ax. Displace. The rotary transfer unit 10A has, for example, a support section 12A, a plurality of component holding sections 14A, a rotation drive section 16A, and a plurality of forward/backward drive sections 18A. The support portion 12A supports a plurality of component holding portions 14A. Specifically, the support portion 12A supports the plurality of component holding portions 14A so that each of the plurality of component holding portions 14A is positioned on the circular orbit CR. The support portion 12A is rotatable around the central axis Ax of the circular orbit CR. The support portion 12A is, for example, a turntable.

The plurality of component holding portions 14A are arranged at regular intervals along the circumference around the central axis Ax and fixed to the support portion 12A. The component holding portion 14A may hold the electronic component W by any method. The component holding portion 14A, for example, vacuum-sucks either the main surface Wa or Wb from one side along the radial direction of the circumference centered on the central axis Ax. In one example, the component holding section 14A has a suction section 22A and a holder 24A.

The suction part 22A is provided (fixed) to the support part 12A via a holder 24A so that the suction surface faces the outside of the circular track CR. 22 A of adsorption|suction parts may be provided in the support part 12A so that the front-end|tip part containing the adsorption|suction surface and its vicinity may be located in circular track|orbit CR. 22 A of adsorption|suction parts are comprised so that the main surface Wa of the electronic component W may be adsorb|sucked so that the electronic component W may be located in the outer side of the circular track|orbit CR. In this case, the central axis Ax, the suction portion 22A, and the electronic component W are arranged in this order along the radial direction of the circular orbit CR. The holder 24A is fixed to the outer peripheral portion of the support portion 12A and holds the suction portion 22A displaceably. In this disclosure, the terms "inner" and "outer" are used with respect to the central axis Ax.

The rotary drive section 16A, like the rotary drive section 16, is configured to rotate the support section 12A around the central axis Ax. Due to the rotation of the support portion 12A by the rotary drive portion 16A, the plurality of component holding portions 14A move along the circular orbit CR centered on the central axis Ax. As a result, the electronic component W held by the component holding portion 14A is conveyed along the circumference around the central axis Ax. The rotation drive section 16A is controlled to repeat rotation and stop of the support section 12A at the angular pitch (angular pitch around the central axis Ax) between the adjacent component holding sections 14A. Hereinafter, when the rotation drive unit 16A stops the support unit 12A, the plurality of positions on the circular orbit CR where the plurality of component holding units 14A (the plurality of suction units 22A) are arranged will also be referred to as "the plurality of stop positions SP ”.

The plurality of advance/retreat drive portions 18A are configured to move the suction portion 22A of the component holding portion 14A along the radial direction of the circular orbit CR in the processing area PA (recovery area RA) including the stop position SP for recovery. 18A (displacement drive section). The advance/retreat drive portion 18A displaces the suction portion 22A from the central axis Ax toward the outside of the circular orbit CR. As shown in FIG. 13, the forward/backward drive unit 18A has, for example, a holder 32A, an operating rod 34A, and a motor 36A.

The holder 32A is provided so as not to move along with the rotation of the support portion 12A by the rotary drive portion 16A. The operating rod 34A is provided on the holder 32A so as to be displaceable with respect to the holder 32A. The operating rod 34A extends, for example, along the radial direction of the circular track CR, and is held by the holder 32A so as to be movable along the radial direction. The operating rod 34A may be positioned inside (closer to the central axis Ax) than the component holding portion 14 when the component holding portion 14A is positioned at the stop position SP. The motor 36A functions as a drive source and displaces (moves) the operating rod 34A outside the circular orbit CR. Motor 36A may include an eccentric cam.

In one example, when the operating rod 34A is displaced by the motor 36A, the outward facing tip of the operating rod 34A contacts the transmission section 28A of the component holding section 14A. The transmission portion 28A is connected to the adsorption portion 22A and transmits the external force received from the operation rod 34A to the adsorption portion 22A. The transmission portion 28A is provided so as not to interfere with the support portion 12A when displaced. When the operation rod 34A is moved further outward while the operation rod 34A is in contact with the transmission portion 28A, the adsorption portion 22A is displaced (moves outward). When the operating rod 34A is moved inward by the motor 36A, the state in which the operating rod 34A exerts an outward force on the attracting portion 22A is released, and the attracting portion 22A returns to the position before it was displaced.

A load detection section 50 is provided in the advance/retreat drive section 18A in the same manner as the elevation drive section 18 . Specifically, the load detection portion 50 is provided on the operating rod 34A. The load detector 50 detects a load (external force) applied to the operating rod 34A.

The component recovery unit 44A is a processing unit that sequentially recovers a plurality of electronic components W from the rotary transfer unit 10A in the recovery area RA. The component recovery unit 44A has, for example, a sheet holding section 82 and a sheet position adjusting section 84. As shown in FIG. The sheet holding part 82 holds the wafer sheet 66 . Electronic components W collected from the rotary transfer unit 10 are attached to the wafer sheet 66 . For example, the main surface Wb of the electronic component W is attached to the attachment surface 66a of the wafer sheet 66 .

A ring frame (not shown) may be attached to the peripheral portion of the wafer sheet 66, and the sheet holding portion 82 may hold the ring frame. In one example, the sheet holding portion 82 faces (is parallel to) the tip end face of the adsorption portion 22A positioned at the collection stop position SP, with the sticking surface 66a standing vertically. A wafer sheet 66 is held around the circular orbit CR.

The sheet position adjusting portion 84 is arranged to hold the sheet along a plane intersecting the direction in which the wafer sheet 66 and the suction portion 22A positioned at the recovery stop position SP face each other (the radial direction of the circumference around the central axis Ax). Adjust the position of the portion 82 . The sheet position adjusting section 84 may change the position of the sheet holding section 82 along a plane perpendicular to the direction in which the wafer sheet 66 and the suction section 22A face each other. By changing the position of the sheet holding portion 82, the position of the wafer sheet 66 held by the sheet holding portion 82 is changed. As a result, the position of the area on the wafer sheet 66 to which the electronic component W to be collected is to be attached (hereinafter referred to as the "scheduled attachment area") is changed. The seat position adjusting section 84 may include two driving sections that move the sheet holding section 82 along two directions perpendicular to each other.

Next, a series of control processes executed by the controller 100 of the processing device 1A will be described. The operation control section 112 of the controller 100 rotates the support section 12A by the rotation driving section 16A so that the suction section 22A holding (adsorbing) the electronic component W is arranged in the recovery area RA. Then, the operation control section 112 controls the sheet position adjusting section 84 so that the planned pasting area of the electronic component W to be collected on the wafer sheet 66 is arranged in the collection area RA.

Next, the operation control section 112 controls the advance/retreat drive section 18A so as to move the suction section 22A positioned at the recovery stop position SP outward. The operation control section 112 moves the adsorption section 22 by the advance/retreat drive section 18A until the electronic component W adsorbed by the adsorption section 22A comes into contact with the sticking surface 66a of the wafer sheet 66 . Then, the operation control section 112 controls the component holding section 14A so as to cancel the suction of the electronic component W by the suction section 22A. After that, the operation control section 112 controls the advance/retreat driving section 18A so as to return the suction section 22A in the state of releasing the suction of the electronic component W to the position before the displacement.

The load information acquisition unit 114 determines the load information during the period from the time when the suction unit 22A that is suctioning the electronic component W starts to move to the time when the suction unit 22A is returned to the position before displacement after the suction of the electronic component W is released. Data (load time-series data) indicating the time change of the detected value by the load detection unit 50 may be acquired. When the electronic component W to be adsorbed by the adsorption portion 22A contacts the sticking surface 66a of the wafer sheet 66, the reaction force from the wafer sheet 66 to the electronic component W is reflected in the time-series data obtained from the load detection portion 50.

Similar to the case where the electronic components W are collected on the carrier tape 60, the abnormality determination unit 116 determines whether there is an abnormality in the contact with the electronic components W based on the load time-series data obtained from the load detection unit 50. good. The abnormality determination unit 116 uses a determination model constructed by machine learning based on time-series data for learning obtained when the electronic components W are collected on the wafer sheet 66 to detect abnormal contact with the electronic components W to be collected. The presence or absence may be determined. When detecting an abnormal contact with the electronic component W, the operation control unit 112 may cause the transport processing unit 2A to suspend the processing such as recovery in the transport processing unit 2A.

An example of abnormal contact when collecting electronic components W onto the wafer sheet 66 is that the electronic components W to be collected come into contact with the electronic components W already attached to the wafer sheet 66 . Further, as the abnormal contact, it is conceivable that the attitude of the electronic component W sucked by the sucking portion 22A deviates from the standard state, and the wafer sheet 66 receives a reaction force different from normal.

(Modification)
Instead of or in addition to the recovery of the electronic components W by the component recovery unit 44A, when the electronic components W attached to the wafer sheet are supplied to the rotary transfer unit 10A, the load applied to the electronic components W to be supplied is detected. , an abnormality in contact with the electronic component W may be detected. The transport processing section 2A has a component supply unit 42A. The plurality of advance/retreat drive portions 18A move the suction portion 22A of the component holding portion 14A along the radial direction of the circular orbit CR in the processing area PA (supply area SA) including the stop position SP for supply. (displacement driver).

The component supply unit 42A is a processing unit that sequentially supplies a plurality of electronic components W to the rotary transfer unit 10 in the supply area SA. The component supply unit 42A has, for example, a sheet holding portion 82, a sheet position adjusting portion 84, and a protruding portion 86. As shown in FIG. The sheet holding section 82 and the sheet position adjusting section 84 of the component supply unit 42A have the same configurations and functions as the sheet holding section 82 and the sheet position adjusting section 84 of the component collecting unit 44A, except that they hold the wafer sheet 64. .

The wafer sheet 64 held by the sheet holding section 82 of the component supply unit 42A has an adhesive sticking surface 64a to which a semiconductor wafer is stuck. The semiconductor wafer is attached to the attachment surface 64a in a state in which it is cut into a plurality of electronic components W by dicing or the like. The main surface Wb of the electronic component W may be attached to the attachment surface 64a.

The projecting portion 86 is arranged so as to sandwich the wafer sheet 64 (the electronic component W to be supplied) between itself and the supply stop position SP. The protruding portion 86 protrudes a region of the wafer sheet 64 to which the electronic components W to be supplied are attached so as to approach the stop position SP for supply. The protruding portion 86 protrudes the region from the back surface 64b of the wafer sheet 64 toward the sticking surface 64a. The protruding portion 86 protrudes the above region toward the suction portion 22A when the suction portion 22A arranged at the stop position SP for supply is displaced to suck the electronic component W to be supplied. Thereby, 22 A of adsorption|suction parts and the electronic component W of the supply object contact. Then, in a state where the suction section 22A has started suction, the electronic component W is transferred from the wafer sheet 64 to the suction section 22A by retracting inwardly by the advance/retreat driving section 18A.

The load information acquisition unit 114 detects the load in a period from the time when the suction unit 22A, which does not absorb the electronic component W, starts to move to the time when the suction unit 22A returns to the position before displacement after the electronic component W has been absorbed. Data (load time-series data) indicating the time change of the detected value by the unit 50 may be obtained. When the suction portion 22A contacts the electronic component W attached to the wafer sheet 64, the reaction force from the electronic component W to the suction portion 22A is reflected in the time-series data obtained from the load detection portion 50.

Similar to the case where the electronic components W are collected on the wafer sheet 66, the abnormality determination unit 116 determines whether there is an abnormality in contact with the electronic components W based on the load time-series data obtained from the load detection unit 50. good. The abnormality determination unit 116 uses a determination model constructed by machine learning based on time-series data for learning obtained when the electronic components W are supplied from the wafer sheet 64 to determine abnormal contact of the electronic components W to be supplied. The presence or absence may be determined.

Ejection for ejecting the electronic component W determined to be in abnormal contact without interrupting the operation (continuous processing for a plurality of electronic components W) by the transport processing unit 2 when the abnormal contact of the electronic component W is detected. Processing may be performed. The transport processing section 2A has, for example, a defective product ejection unit 48A. The defective product discharge unit 48A is a unit that collects electronic components W classified as defective products. The defective product discharge unit 48A is arranged, for example, at a stop position SP downstream of the recovery stop position SP. The defective product discharge unit 48A may be arranged at the stop position SP upstream of the stop position SP for collection. The component recovery unit 44A recovers electronic components W classified as non-defective products.

When the suction unit 22A holding the electronic component W determined to be defective is placed at the corresponding stop position SP, the operation control unit 112 transfers the electronic component W from the rotary transfer unit 10 to the defective product discharging unit 48A. The component holding unit 14 and the defective product ejection unit 48A are controlled so as to eject the . When an abnormal contact with the electronic component W is detected when the electronic component W is supplied from the wafer sheet 64 to the rotary transfer unit 10, the operation control unit 112 continues various processes including the supply of the electronic component W. may

In one example, the operation control unit 112 causes the electronic component W to be placed in the component recovery unit 44A when the adsorption unit 22A that adsorbs the electronic component W determined to be in abnormal contact is placed at the recovery stop position SP. The transport processing section 2A is controlled so as not to be collected. Then, the operation control unit 112 removes the electronic component W determined to be in abnormal contact with the defective product ejection unit 48A when the suction unit 22A is placed at the stop position SP where the defective product ejection unit 48A is arranged. The transport processing unit 2 is controlled to collect. As described above, the controller 100 may cause the transport processing unit 2 to execute the process for discharging the electronic component W while continuing various processes including the supply of the electronic component W to the transport processing unit 2 .

In the processing apparatus 1A according to the second embodiment described above, abnormal contact with the electronic component W can be detected with high accuracy. Therefore, it is useful for improving the reliability of the electronic component W. In the processing apparatus 1A according to the second embodiment, part of the contents described in the first embodiment and its modification may be applied.

[Third embodiment]
Next, an electronic component processing apparatus according to a second embodiment will be described with reference to FIGS. 14 and 15. FIG. A plurality of electronic components W may be sequentially transported by two or more rotating transport units, and when the electronic components W are transferred between the rotating transport units, the load applied to the electronic components W is detected, and the electronic component W is detected. The presence or absence of an abnormality in contact with the component W may be determined. A processing apparatus 1B shown in FIGS. 14 and 15 includes a transport processing section 2B instead of the

transport processing sections

2 and 2A. The transport processing section 2B has

rotary transport units

10B and 10C, a component supply unit 42B, a component recovery unit 44B, and a defective product ejection unit 48B.

Each of the

rotary transfer units

10B and 10C is configured in the same manner as the rotary transfer unit 10A. The rotary transfer unit 10B is configured to move a plurality of component holders 14A along a circular track CR1 around the central axis Ax1. The rotary transfer unit 10C is configured to move a plurality of component holders 14A along a circular track CR2 around the central axis Ax2. The central axis Ax1 and the central axis Ax2 may be parallel to each other or may be vertical axes. The circular trajectory CR1 and the circular trajectory CR2 may be arranged along one horizontal direction without overlapping each other.

The rotary transport unit 10B transports the electronic component W supplied from the component supply unit 42B to a stop position SP for delivery to the rotary transport unit 10C (hereinafter referred to as "delivery stop position SP"). The electronic component W is transferred from the rotary transfer unit 10B to the rotary transfer unit 10C in a processing area PA (hereinafter referred to as a "transfer area TA") that includes the transfer stop position SP and is used for the transfer process. The rotary transfer unit 10C transfers the electronic component W received from the rotary transfer unit 10B to the stop position SP where the component recovery unit 44B is arranged. The defective product discharge unit 48B is arranged at a stop position SP upstream of the stop position SP where the component recovery unit 44B is arranged.

The transport processing unit 2B has an advance/retreat drive unit 18A (displacement drive unit) that moves the component holding unit 14A arranged at the delivery stop position SP toward the outside of the circular track CR1. In this example, the rotary transfer unit 10C does not have an advance/retreat drive section for moving the component holding section 14A that receives the electronic component W in the delivery area TA (see also FIG. 15).

Next, a series of control processes executed by the controller 100 of the processing device 1B will be described. The operation control section 112 of the controller 100 controls the rotary transfer unit 10B so that the suction section 22A of the rotary transfer unit 10B holding (adsorbing) the electronic component W is arranged in the delivery area TA. Then, the operation control section 112 controls the rotary transfer unit 10C so that the suction section 22A (the suction section 22A of the rotary transfer unit 10C) scheduled to receive the electronic component W is arranged in the delivery area TA.

Next, the operation control section 112 controls the advance/retreat drive section 18A so as to move the suction section 22A arranged in the transfer area TA outward. The operation control unit 112 controls the advance/retreat driving unit 18A until the electronic component W that is being sucked by the sucking unit 22A contacts the sucking surface (the surface facing the outside of the circular track CR2) of the sucking unit 22A of the rotary transfer unit 10C. to move the suction portion 22A to be driven. Then, after the operation control unit 112 controls the rotary transfer unit 10C to start sucking (sucking) the electronic component W by the suction unit 22A of the rotary transfer unit 10C, the electronic component W is picked up by the suction unit 22A of the rotary transfer unit 10B. The rotary transfer unit 10B is controlled so as to release W from being sucked. After that, the operation control section 112 controls the advance/retreat driving section 18A so as to return the suction section 22A in the state of releasing the suction of the electronic component W to the position before the displacement. Note that while the forward/backward drive unit 18A is displacing the suction unit 22A to be driven, the operation control unit 112, before the electronic component W held by the suction unit 22A contacts the reception side suction unit 22A, The rotary transport unit 10C may be controlled so as to start suctioning (sucking) by the suction section 22A on the receiving side.

The load information acquisition unit 114 acquires the detected value by the load detection unit 50 provided in the forward/backward drive unit 18A. The load information acquisition section 114 returns the suction section 22A to the position before the displacement after releasing the suction of the electronic component W from the time when the suction section 22A of the rotary transfer unit 10B that is suctioning the electronic component W starts to move. Data (load time-series data) indicating the time change of the detected value by the load detection unit 50 during the period up to the point in time may be acquired. When the electronic component W to be picked up by the suction section 22A of the rotary transfer unit 10B contacts the suction surface of the suction section 22A of the rotary transfer unit 10C, the reaction force that the electronic component W receives from the suction section 22A of the rotary transfer unit 10C is , are reflected in the time-series data obtained from the load detection unit 50 .

Similar to the case where the electronic components W are collected on the carrier tape 60, the abnormality determination unit 116 determines whether there is an abnormality in the contact with the electronic components W based on the load time-series data obtained from the load detection unit 50. good. The abnormality determination unit 116 uses a determination model constructed by machine learning based on time-series data for learning obtained when the electronic component W is transferred to another rotary transfer unit to detect abnormal contact with the electronic component W to be delivered. You may determine the presence or absence of When detecting abnormal contact with an electronic component W, the operation control unit 112 may control the transport processing unit 2B so that the electronic component W determined to be in abnormal contact is collected in the defective product discharge unit 48B.

Abnormal contact when the electronic component W is handed over to another rotary transfer unit is caused, for example, by the suction unit 22A scheduled to receive the electronic component W already holding the other electronic component W for some reason. As a result, it is conceivable that a reaction force different from that during normal operation is generated. Further, as the abnormal contact, it is conceivable that a reaction force different from that in the normal state is generated due to the deviation of the posture of the electronic component W sucked by the sucking section 22A of the rotary transfer unit 10B from the standard state. .

(Modification)
Unlike the above example, in the transfer area TA, the suction section 22A of the rotary transfer unit 10C (the suction section 22A scheduled to receive the electronic component W) is displaced to the outside of the circular track CR2, whereby the electronic component W is transferred. may be performed. In this case, in the rotary transfer unit 10C, an advance/retreat driving section 18A that displaces the suction section 22A to receive the electronic component W may be arranged, and the load detection section 50 may be provided in the advance/retreat driving section 18A. As in the above example, the controller 100, based on the time-series data reflecting the reaction force received by the suction unit 22A from the electronic component W when the suction unit 22A to receive the electronic component W is displaced, The presence or absence of an abnormality in contact with the electronic component W may be determined.

The central axis Ax1 and the central axis Ax2 may be horizontal axes. One of the central axis Ax1 and the central axis Ax2 may be a horizontal axis, and the other may be a vertical axis. The number of component holders 14A included in the rotary transfer unit 10B may be the same as or different from the number of component holders 14 included in the rotary transfer unit 10A. The size of the circular trajectory CR1 may be the same as or different from the size of the circular trajectory CR2.

The transport processing section 2B may have one or more other rotating transport units in addition to the

rotating transport units

10B and 10C. The electronic component W may be transferred between one of the

rotary transfer units

10B and 10C and any other rotary transfer unit, and the load applied to the electronic component W during the transfer may be detected. and determination of presence/absence of abnormal contact.

The controller 100 may detect the load and determine the presence or absence of abnormal contact in the transfer between the rotating transfer units different from the above example. When the rotary transfer unit 10 shown in FIG. 1 transfers the electronic component W to another rotary transfer unit, the load may be detected and the presence or absence of abnormal contact may be determined. As another rotary transport unit, a satellite transports the electronic parts W along a circular orbit (circular orbit) set to intersect the stop positions SP located between the supply and recovery stop positions SP. A table is mentioned. Further, as another rotary transfer unit, there is a rotary pickup that delivers (supplies) the electronic component W to the rotary transfer unit 10 at the stop position SP for supply.

When an electronic component W is transferred between a rotary transfer unit such as the rotary transfer unit 10 and an intermediate processing unit 46 that executes a predetermined process including transfer of the electronic component W to and from the rotary transfer unit, a load is applied. and determination of the presence or absence of abnormal contact may be performed. In any one of the various examples described above, unlike the example shown in FIG. 14, the electronic component W is transferred in a state in which the suction portion of one unit and the suction portion of the other unit face each other in the vertical direction. may be performed. When the suction unit on the delivery side is arranged above and the suction unit on the receiving side is arranged below, the operation control unit 112 provides a slight clearance so that the suction unit on the receiving side and the electronic component W do not come into contact with each other. You may displace one adsorption|suction part to the position of the grade to which it is. Then, the operation control unit 112 may cause the electronic component W to be transferred by canceling the suction by the suction unit on the delivery side. In this case, contact of the electronic component W with the receiving suction portion before the displacement of one suction portion is completed can also be a cause of abnormal contact.

Also in the processing device 1B according to the third embodiment, abnormal contact with the electronic component W can be detected with high accuracy. Therefore, it is useful for improving the reliability of the electronic component W. A part of the contents described in the first embodiment and its modification may be applied to the processing apparatus 1B according to the third embodiment.

[Fourth embodiment]
Next, an electronic component processing apparatus according to a fourth embodiment will be described with reference to FIGS. 16 and 17. FIG. The detection of the load and the determination of the presence or absence of abnormal contact may be performed when the component holding portion 14 (suction portion 22) is displaced without the electronic component W being transferred. The transport processing section 2 of the processing apparatus 1C shown in FIG. 16 has a component inspection unit 90 as one of the intermediate processing units 46 . The component inspection unit 90 is a unit that inspects the electronic component W in an inspection area IA (processing area) including one of the stop positions SP.

The component inspection unit 90 is a processing unit that inspects the electrical characteristics of the electronic component W, for example. The component inspection unit 90 includes a stylus 92 . For example, the component inspection unit 90 obtains electrical characteristics by applying a voltage to an electrode included in an electronic component W to be inspected, while the probe 92 is in contact with the electrode. The electrodes included in the electronic component W may be provided on the main surface Wb.

FIG. 17 is a flowchart showing a series of control processes executed by the controller 100 of the processing device 1C. While this series of control processes is being executed, the load information acquisition unit 114 obtains the detected value from the load detection unit 50 provided in the elevation drive unit 18 corresponding to the stop position SP where the parts inspection unit 90 is arranged. You can continue to get it. Controller 100 executes step S51 in the same manner as step S11 shown in FIG. Next, the controller 100 executes step S52. In step S52 , for example, the operation control unit 112 causes the corresponding lift driving unit 18 to start lowering the suction unit 22 holding (sucking) the electronic component W to be inspected.

Next, the controller 100 executes steps S53 and S54. In step S53, for example, the controller 100 determines whether the load value obtained from the load detection unit 50 (the load value at each acquisition timing) has reached a predetermined set value. The predetermined set value is set in advance to a value that enables inspection of electrical characteristics by the component inspection unit 90 . In step S54 , for example, the operation control section 112 stops the lifting drive section 18 from lowering the suction section 22 sucking the electronic component W to be inspected. The operation control section 112 may control the elevation drive section 18 so that the load value obtained from the load detection section 50 follows a predetermined set value even after the descent is stopped.

Next, the controller 100 executes steps S55 and S56. In step S55 , for example, the controller 100 applies a voltage to the electrodes of the electronic component W using the component inspection unit 90 and acquires information indicating electrical characteristics from the stylus 92 . In step S56, for example, the load information acquisition unit 114 extracts data of detection values from the start of step S52 to the end of step S55 from the data of detection values continuously acquired by the load detection unit 50. By doing so, the above time-series data is obtained. That is, the load information acquisition unit 114 indicates the time change in the value detected by the load detection unit 50 during the period from the time when the electronic component W to be inspected starts to descend to the time when the acquisition of the information indicating the electrical characteristics ends. Get time series data.

Next, the controller 100 executes step S57 in the same manner as step S17. In step S57, when the contact abnormality with respect to the electronic component W to be inspected is detected (step S57: YES), the controller 100 executes steps S58 and S59 in the same manner as steps S18 and S19. The controller 100 may execute steps S58 and S59 even when the information indicating the electrical characteristics indicates an abnormality.

As for the abnormal contact when inspecting the electronic component W, for example, the posture of the electronic component W to be inspected sucked by the sucking unit 22A deviates from the standard state, and the electronic component W is different from the normal state. It is conceivable that different reaction forces are received from the stylus 92 .

(Modification)
The component inspection unit 90 may be a processing unit that inspects properties other than electrical properties. The component inspection unit 90 may be, for example, a processing unit that inspects optical characteristics by causing the light emitting surface of the electronic component W to emit light.

Also in the processing device 1C according to the fourth embodiment, it is possible to detect an abnormality in contact with the electronic component W with high accuracy. Therefore, it is useful for improving the reliability of the electronic component W. A part of the contents described in the first embodiment and its modification may be applied to the processing apparatus 1C according to the fourth embodiment.

Although several embodiments have been described above, the present disclosure is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the gist thereof. The contents of the description of each embodiment described above can be applied to each other. For example, the electronic component processing apparatus may detect a load applied to the electronic component W in each of the plurality of processing areas, and detect abnormal contact with the electronic component W. FIG. The electronic component processing apparatus may detect an abnormality in contact with the electronic component W for each processing area using a judgment model constructed by machine learning for each processing area.

This application is based on a Japanese patent application (Japanese Patent Application No. 2021-136339) filed on August 24, 2021, the content of which is incorporated herein by reference.

1, 1A, 1B, 1C... Electronic parts processing apparatus, W... Electronic parts, 2, 2A, 2B... Transfer processing unit, 10, 10A, 10B, 10C... Rotary transfer unit, 12, 12A... Support part, CR, CR1,

CR2 Circular orbit

14, 14A

Component holding unit

16, 16A Rotation drive unit 18 Elevation drive unit 18A Retraction drive unit 50 Load detection unit 100 Controller.

Claims

a component holding portion configured to hold an electronic component; and a support portion supporting the component holding portion so as to be positioned on a circular orbit passing through a processing area for performing a predetermined process on the electronic component. and a transfer processing unit comprising a rotation drive unit configured to rotate the support unit around the central axis of the circular orbit, and a displacement drive unit configured to displace the component holding unit in the processing area. and,
a load detection unit configured to detect a load applied to the electronic component when the displacement drive unit displaces the component holding unit in the processing area;
a controller configured to detect an abnormality in contact with the electronic component based on transition of the detection value by the load detection unit from a first timing to a second timing when the component holding unit is displaced; An electronic component processing apparatus comprising:
The controller is
controlling the transport processing unit to sequentially perform the predetermined processing in the processing area on a plurality of electronic components including the electronic component;
2. The processing apparatus according to claim 1, wherein an operation of said transport processing unit is stopped when an abnormality in contact with said electronic component is detected.
The controller is configured to detect an abnormality in contact with the electronic component based on time-series data indicating changes in values detected by the load detection unit during a period including at least the first timing and the second timing. 3. The processing apparatus according to claim 1 or 2, wherein a
The controller is constructed by machine learning so as to output the time-series data obtained from the load detection unit and a determination result as to whether or not the contact with the electronic component is abnormal according to the input of the time-series data. 4. The processing apparatus according to claim 3, configured to detect an abnormality in contact with said electronic component based on said judgment model.
The controller is
selecting the determination model from among the plurality of determination models based on a database in which a plurality of component types and a plurality of determination models are associated with each other and the component type of the electronic component;
Detecting an abnormality in contact with the electronic component based on the time-series data acquired from the load detection unit and the determination model corresponding to the electronic component, 5. The processing apparatus according to claim 4.
The displacement driving section is configured to displace the component holding section by applying an external force to the component holding section,
The processing device according to any one of claims 3 to 5, wherein the load detection section is provided in the displacement drive section.