CN115342721A

CN115342721A - Equipment track action induction system and automation equipment

Info

Publication number: CN115342721A
Application number: CN202110523854.8A
Authority: CN
Inventors: 黄德根
Original assignee: Suzhou Yousideng Internet Of Things Technology Co ltd
Current assignee: Suzhou Yousideng Internet Of Things Technology Co ltd
Priority date: 2021-05-13
Filing date: 2021-05-13
Publication date: 2022-11-15

Abstract

The invention discloses an equipment track action sensing system and an automatic device, wherein the equipment track action sensing system comprises a track, the track comprises a track base frame and a supporting piece accommodated in the track base frame, and further comprises a material implanting mechanism which is controlled to implant a material into a moving carrier band on the track, and further comprises a monitoring device which is configured to monitor a real-time state parameter value of the material implanting mechanism in real time, and further comprises a control device and an upper computer, the control device is used for determining the action condition of the material implanting mechanism, and the upper computer analyzes the running state of the equipment according to the action condition of the material implanting mechanism determined by the control device. When the track action sensing system is used for material transportation, the material implantation state can be judged directly through the compression amount of the elastic sheet, and after the material implantation state is determined, material badness and equipment faults caused by implantation failure can be avoided in the material transportation process.

Description

Equipment track action induction system and automation equipment

Technical Field

The invention relates to the field of equipment monitoring, in particular to an equipment track action sensing system and automation equipment.

Background

Present automatic packaging equipment mainly utilizes vacuum adsorption to realize the pan feeding of small-size components and parts such as chip, also utilizes the switching realization of vacuum adsorption and pressure release to arrange the material of components and parts, also mainly implants the small-size components and parts in the packing area through vacuum adsorption simultaneously.

However, existing automated packaging equipment does not achieve effective management of various vacuum flows. A plurality of flowmeters and flowmeter induction meters connected with the flowmeters are also arranged in various vacuum pipelines of the current equipment. However, the flow meter sensing meters have alarm limit values set by operators, and the measured values of all the flow meters exceed the alarm limit values set by the operators to give alarms.

However, the vacuum in existing automated packaging equipment often presents the following problems in use:

1. the alarm mode of the vacuum flowmeter is limit value alarm, and the equipment can not alarm in vacuum because of false alarm or speed reduction, equipment failure and product failure of the limit value setting;

2. in the actual use of the vacuum flow of the equipment, the vacuum adsorption chip state and the non-adsorption chip state alternately appear at high speed, and the limit value of a flowmeter induction meter is set to be in a state which cannot be distinguished;

3. when the suction nozzle is half-blocked or the pipeline is half-blocked due to the problems of dust and the like in vacuum, the flow meter induction meter cannot make correct state judgment;

4. when the vacuum front-end pipeline is not connected and is in an abnormal state, the flow meter induction meter displays that the flow is normal and cannot be detected;

5. when the vacuum front end is blocked (a suction nozzle is blocked and a pipeline is blocked), and the pipeline is damaged and the vacuum is leaked between the blocked part and the mounting part of the flowmeter, the flow rate displayed by the flowmeter induction meter is normal and cannot be detected;

6. during equipment production, materials are replaced, vacuum adsorption is poor due to material size deviation, equipment cannot judge the cause of failure when equipment failure and products are poor, and failure positioning and analysis become very difficult.

Chain reaction can be produced in the emergence of these above problems, and the vacuum reason does not put in place, and the validity of vacuum adsorption and row material will go wrong, and vacuum suction nozzle's action can't be monitored, and the action of vacuum adsorption and pressure release also can't be monitored, and then makes the packing of components and parts not put in place, and production will go wrong.

Furthermore, the vacuum suction nozzle of the existing automatic packaging equipment for vacuum adsorption of small components can be driven by the driving part to reciprocate up and down to implant the adsorbed components onto the carrier tape, in the process of high-speed reciprocating motion of the general vacuum suction nozzle, the general vacuum suction nozzle can generate tiny vibration invisible to naked eyes when reaching the upper and lower suction end faces due to inertia, in the high-precision suction action, the tiny vibration can cause the problem that the components are not implanted in place in the process of implanting into the carrier tape, and the component can collide with a baffle plate when moving forwards along with the carrier tape due to the fact that the component is not implanted in place, so that the component is scratched to cause the poor production.

Furthermore, the vacuum amount of the vacuum nozzle also influences the implantation action of the vacuum nozzle, when the vacuum nozzle is driven to move at a high speed, only if the vacuum amount of the vacuum nozzle reaches the standard, the vacuum nozzle can firmly suck the components, and only if the micro vibration amount of the vacuum nozzle is within a certain range, the implantation action of the vacuum nozzle is qualified, so that in the action process of the vacuum nozzle, the flow value and the jitter amount of the vacuum nozzle are monitored, the movement condition of the vacuum nozzle can be judged, and the reason that the action is not in place can be found in time.

Based on this, it is an urgent need to solve the problems that the existing equipment should be monitored in terms of actions, such as monitoring the vacuum flow rate to realize the orderly proceeding of the suction action and the discharge action of the vacuum suction nozzle, and further, for example, monitoring the implantation action of the vacuum suction nozzle to realize the accurate implantation of the suction nozzle into the packaging tape.

Moreover, the existing automatic packaging equipment needs to implant the materials into the packaging grooves of the packaging belts during the operation process, and then the packaging belts move the materials carried by the packaging belts to the next station under the driving of the equipment. The existing automatic packaging equipment does not have effective monitoring for monitoring whether materials are in place in a packaging groove. Therefore, problems often arise during operation of the plant: for example, the material is not completely implanted into the packaging groove, and in the moving process of the packaging belt, the material can be scratched and collided in the moving process, and even the equipment is clamped to cause faults; for another example, the material is placed in the packaging groove in an incorrect posture, and the material is accommodated in the packaging groove in a side-standing and inverted posture, and may be stuck in the packaging groove, which may cause inconvenience in taking, or may deform the shape of the packaging groove by squeezing, or may cause inconvenience in subsequent packaging work.

Based on this, should monitor positions such as material implantation of current automatic packaging equipment for the implanted state of material in the packaging groove can be monitored, guarantees that material implantation in-process material can be planted in the packaging groove and targets in place, prevents that the material is passive bad.

Therefore, it is necessary to provide a new technical solution to solve the problems in the prior art.

Disclosure of Invention

In order to solve the problems in the prior art, the invention provides a track induction system and an automation device, which adopt the following specific technical scheme:

an equipment track motion sensing system, comprising:

the track comprises a track base frame and a supporting piece accommodated in the track base frame, wherein the supporting piece forms a carrying track, a carrier tape for accommodating materials is driven to move on the carrying track, and a plurality of accommodating grooves are formed in the carrier tape;

the material implanting mechanism is controlled to implant materials into the carrier band moving on the track, and when the materials are implanted into the accommodating groove by the material implanting mechanism, the supporting piece corresponding to the position of the materials is deformed;

a monitoring device configured to monitor real-time status parameter values of the material implantation mechanism in real time;

the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to the monitoring device, acquire a real-time state parameter value of the monitoring device, and determine the action condition of the material implanting mechanism based on the acquired real-time state parameter value and the corresponding upper limit range and/or lower limit range;

and the upper computer is configured to process the real-time state parameter values acquired by the control device into a state curve chart representing the real-time action condition of the material implantation mechanism, and analyze the running state of the equipment according to the action condition of the material implantation mechanism determined by the control device.

In the above technical solution, a strip-shaped channel is formed on the track base frame, and the support member is accommodated in the channel; the support piece comprises an elastic sheet, the elastic sheet is provided with an elastic arm, a connecting arm and a transition arm connected with the elastic arm and the connecting arm, the connecting arm is fixedly connected with the bottom of the channel, the transition arm supports the elastic arm to be suspended, the elastic sheet is formed on the elastic arm to form the carrying track, and when the material is placed in the carrying belt on the carrying track, the elastic arm of the elastic sheet corresponding to the material position is compressed downwards.

Further, the material implantation mechanism comprises one or more implantation vacuum nozzles; the monitoring device comprises a displacement sensor, the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to the displacement sensor, acquire a real-time displacement value of the displacement sensor, determine the working condition of the implanted vacuum suction nozzle based on the acquired real-time displacement value and the corresponding upper limit range and/or lower limit range, process the real-time displacement value acquired by the control device into a displacement curve graph representing the real-time action condition of the implanted vacuum suction nozzle by the upper computer, and determine the running state of the action condition analysis equipment of the implanted vacuum suction nozzle according to the control device.

Furthermore, the monitoring device includes two displacement sensor, two displacement sensor's probe sets up relatively, implant vacuum nozzle and shell fragment linkage, the shell fragment is arranged in two between displacement sensor's the probe, when implanting the driven upper and lower vibration of vacuum nozzle, the shell fragment is in two reciprocating motion, two between displacement sensor's the probe displacement value of shell fragment is monitored in real time to the displacement sensor.

Furthermore, the probe of each displacement sensor is a field source of an electromagnetic field generated by the probe, the elastic sheet is arranged in the coverage area of the electromagnetic field, when the elastic sheet approaches one probe of the displacement sensor from far to near, the magnetic field intensity of the electromagnetic field generated by the displacement sensor is reduced from large, and the attenuation degree of the magnetic field intensity of the electromagnetic field is also increased from small to large.

Furthermore, the control device calculates a real-time displacement value of the spring plate and the probe of the displacement sensor according to a functional relationship between the distance between the spring plate and each displacement sensor probe and the magnetic field intensity of the electromagnetic field generated by the spring plate, the upper computer processes the real-time displacement value into a continuous displacement curve chart after receiving the real-time displacement value, and the continuous displacement curve chart represents the real-time displacement value of the vertical vibration of the implanted vacuum suction nozzle.

Further, at least one implanted vacuum suction nozzle is driven to reciprocate alternately between a first position and a second position, the implanted vacuum suction nozzle is located at the first position and the second position and is respectively provided with a corresponding upper limit range and/or a corresponding lower limit range for representing displacement, the displacement sensor can provide real-time displacement values in periods of the implanted vacuum suction nozzle alternating between the first position and the second position, the control device compares the highest value of the displacement of the real-time displacement values in each period of the first position and the second position alternating with the corresponding upper limit range, compares the lowest value of the displacement of the real-time displacement values in each period of the first position and the second position alternating with the corresponding lower limit range, determines the working condition of the corresponding implanted vacuum suction nozzle under the first position and the second position alternating, and compares the highest value of the displacement of the real-time displacement values in the first position of the implanted vacuum suction nozzle with the corresponding upper limit range to determine the working condition of the corresponding implanted vacuum suction nozzle under the first position; alternatively, the first and second liquid crystal display panels may be,

at least one implanted vacuum suction nozzle is switched from the first position to the second position, the implanted vacuum suction nozzle is provided with corresponding upper limit ranges and/or lower limit ranges for representing displacement at the first position and the second position, the control device compares the highest value of the displacement of the real-time displacement value when the implanted vacuum suction nozzle is at the first position with the corresponding upper limit ranges to determine the working condition of the corresponding implanted vacuum suction nozzle when the implanted vacuum suction nozzle is at the first position, and the control device determines the working condition of the corresponding implanted vacuum suction nozzle when the implanted vacuum suction nozzle is at the first position to the second position based on the curve of the real-time displacement value when the first position is switched to the second position;

it still includes:

at least one or more drive components configured to act in cooperation with the implantation vacuum nozzle to cause the implantation vacuum nozzle to pick up or drop components;

the control device is further configured to collect a motion signal of the drive component, determine which position the implanted vacuum nozzle is in based on the collected motion signal of the drive component and a real-time displacement value of the implanted vacuum nozzle.

In a further aspect of the above technical solution, the monitoring device includes a sensor probe, the control device includes a digital displacement device, and the sensor probe is in signal connection with the digital displacement device.

Furthermore, the sensor probe is arranged opposite to the elastic arm, the sensor probe is arranged below the elastic arm, when the elastic arm is compressed downwards, the distance between the sensor probe and the lower surface of the elastic arm is shortened, the sensor probe monitors the actual displacement of the elastic arm, the digital displacement device compares the actual displacement with the standard displacement, and outputs a switching value signal according to the comparison result so as to control the action of the material implanting mechanism.

Furthermore, the upper computer is connected with the digital displacement device, the digital displacement device converts the actual displacement into an actual displacement value, and the actual displacement value is processed by the upper computer into a displacement curve chart and displayed on a display interface.

Further, the control device is configured to send action control signals to one or more actuators; the monitoring device is also configured to monitor the action of one or more corresponding executing mechanisms respectively, and sends action induction signals to the single chip microcomputer according to the action of the executing mechanisms.

Furthermore, the upper computer is also configured to receive a time sequence action signal obtained by processing of the single chip microcomputer and output the time sequence action signal as a real-time action time sequence oscillogram.

Furthermore, after the actuating mechanism receives the action control signal, the actuating mechanism makes an action according to the action control signal, the monitoring device monitors the real-time action condition of the actuating mechanism and sends an action sensing signal when the actuating mechanism makes an action, the single chip microcomputer processes the action sensing signal into a time sequence action signal of the actuating mechanism, and the upper computer compares the real-time action time sequence oscillogram with a standard action time sequence oscillogram so as to obtain the abnormal action condition of the real-time action time sequence oscillogram relative to the standard action time sequence oscillogram and analyzes the reason of the abnormal action.

Furthermore, actuating mechanism includes components and parts processing apparatus's carousel, the carousel is including setting up a plurality of recesses on the edge, the driven rotation of carousel at the during operation to make recess on the carousel is rotated to components and parts processing apparatus's implantation vacuum nozzle's below one by one.

Further, when the rotary table is driven to rotate, the monitoring device sends action induction signals to the single chip microcomputer according to actions of the rotary table, the single chip microcomputer processes the action induction signals into time sequence action signals, and the upper computer processes the time sequence action signals into a real-time action time sequence oscillogram of the rotary table.

Further, the system of the upper computer stores a standard action time sequence oscillogram of the rotary disc, the upper computer compares the real-time action time sequence oscillogram of the rotary disc with the standard action time sequence oscillogram of the rotary disc so as to obtain the abnormal action condition of the real-time action time sequence oscillogram of the rotary disc relative to the standard action time sequence oscillogram of the rotary disc, and if the real-time action of the rotary disc is abnormal, the upper computer analyzes the reason of the abnormal action of the rotary disc.

Further, the actuator further comprises the implantation vacuum nozzle; when the turntable is driven to rotate, one groove on the turntable is rotated to the position below the implantation vacuum suction nozzle, the turntable stops rotating, the implantation vacuum suction nozzle is driven to move towards the groove, and the implantation vacuum suction nozzle resets after the implantation vacuum suction nozzle implants the adsorbed component into the groove.

Further, when the turntable is driven to rotate, the carrier tape is driven to move at the same time, so that each groove is communicated with one vacant accommodating groove, when the implantation vacuum suction nozzle moves downwards, components adsorbed by the implantation vacuum suction nozzle are implanted into the accommodating grooves from the grooves, the elastic arms of the elastic pieces below the accommodating grooves are compressed downwards, and the sensor probe monitors the displacement of the elastic arms in real time.

Further, when the turntable is driven to rotate, the monitoring device sends an action induction signal to the single chip microcomputer according to the action of the turntable; after the turntable is driven to rotate in place, the implanted vacuum suction nozzle starts to act under the control of an action control signal of the control device, and the monitoring device monitors the real-time action condition of the implanted vacuum suction nozzle and sends an action sensing signal when the implanted vacuum suction nozzle acts; after the implantation vacuum suction nozzle finishes the implantation action of components, the control device controls the implantation vacuum suction nozzle to reset, and after the implantation vacuum suction nozzle resets, the turntable is driven to rotate again, so that the next groove on the turntable is rotated to the position below the reset implantation vacuum suction nozzle.

Further, when the implantation vacuum suction nozzle implants the component into the accommodating groove, the single chip microcomputer obtains an action induction signal according to a sensor probe for monitoring the displacement of the elastic arm of the elastic sheet, and the control device controls the carrier tape driving part for driving the carrier tape to move the carrier tape, so that the accommodating groove of the component to be implanted on the carrier tape is moved to the position below the implantation vacuum suction nozzle, and the accommodating groove of the implanted component is moved to a next packaging station.

Furthermore, action induction signals of the turntable and action induction signals of the implanted vacuum suction nozzle, which are obtained by monitoring of the monitoring device, are synchronously collected by the single chip microcomputer and then are arranged into time sequence action signals according to time sequences, the single chip microcomputer sends the time sequence action signals to an upper computer, and the upper computer analyzes the time sequence action signals to obtain real-time action time sequence oscillograms representing the turntable and the implanted vacuum suction nozzle.

Furthermore, the upper computer stores the standard action time sequence oscillogram of the turntable and the implanted vacuum suction nozzle, and compares the real-time action time sequence oscillogram with the standard action time sequence oscillogram to obtain the abnormal action condition of the real-time action time sequence oscillogram relative to the standard action time sequence oscillogram and analyze the reason of the abnormal action.

Further, the material implantation mechanism comprises one or more implantation vacuum nozzles; the monitoring device comprises one or more flow meters, and each flow meter is configured to monitor a real-time status parameter value of one implanted vacuum nozzle corresponding to the flow meter; the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to each flowmeter, acquire a real-time flow value of each flowmeter, determine the working condition of the corresponding vacuum suction nozzle based on the acquired real-time flow value of each flowmeter and the corresponding upper limit range and/or lower limit range, process the real-time flow value of each flowmeter acquired by the control device into a flow curve diagram representing the real-time action condition of the vacuum suction nozzle by the upper computer, and analyze the running state of the equipment according to the action condition of the vacuum suction nozzle determined by the control device.

Furthermore, at least one vacuum suction nozzle has a continuous material-free state and a material-free alternating state, each state of the vacuum suction nozzle is provided with a corresponding upper limit range and/or lower limit range, the flowmeter can provide a real-time flow value in each period of the material-free alternating state, the control device compares the highest value of the real-time flow value in each period of the material-free alternating state with the corresponding upper limit range, compares the lowest value of the real-time flow value in each period of the material-free alternating state with the corresponding lower limit range, and determines the working condition of the corresponding vacuum suction nozzle in the material-free alternating state, and the control device compares the highest value of the real-time flow value in the continuous material-free state with the corresponding upper limit range, and determines the working condition of the corresponding vacuum suction nozzle in the continuous material-free state; alternatively, the first and second electrodes may be,

at least one vacuum suction nozzle has a continuous material-free state and is switched from a material-free state to a material-free state, each state of the vacuum suction nozzle is provided with a corresponding upper limit range and/or lower limit range, the control device compares the highest value of the real-time flow value in the continuous material-free state with the corresponding upper limit range to determine the working condition of the corresponding vacuum suction nozzle in the continuous material-free state, and the control device determines the working condition of the corresponding vacuum suction nozzle in the material-free state based on the waveform of the real-time flow value in the material-free state;

it still includes:

at least one or more motion components configured to act in cooperation with the vacuum nozzle to cause the vacuum nozzle to pick up or drop a component;

the control device is also configured to collect the action signal of the action component, and determine which state the vacuum suction nozzle is in the continuous material-free state and the material-free alternating state or which state the vacuum suction nozzle is in the continuous material-free state and the material-free state is switched to based on the collected action signal of the action component and the real-time flow value of the vacuum suction nozzle.

Based on the equipment track action induction system, the invention further provides an automatic device which comprises the equipment track action induction system, a material loading device, a component processing device and a material packaging device, wherein the material loading device is used for loading a carrier tape for packaging components, the component loading device is used for loading the components, the component processing device is used for implanting the components into the accommodating grooves of the carrier tape, and the material packaging device is used for packaging the carrier tape accommodating the components.

Compared with the prior art, the invention has one or more of the following beneficial effects:

1. the invention provides an equipment track action sensing system, wherein a track of the track action sensing system consists of elastic sheets sensitive to stress sensing, when a component is placed on the track consisting of the elastic sheets, the implantation state of the component in a carrier tape accommodating groove can be judged through the compression degree of the elastic sheets, compared with the track mode of the existing equipment, the track sensing force of the track action sensing system is stronger, when the track is used for material transportation, the material implantation state can be judged directly through the compression amount of the elastic sheets, and after the material implantation state is determined, the material defect and equipment fault caused by the fact that the material is not implanted in place can be avoided in the material transportation process.

2. The track action sensing system monitors the compression displacement of the elastic sheet in real time through the sensor, can directly convert the compression displacement into a displacement numerical value through the digital displacement device, and can monitor the implantation state of the material in real time through a displacement curve compressed by the elastic sheet if the displacement numerical value is connected with an upper computer.

3. The track action induction system also has a time sequence monitoring function, action induction signals of each actuating mechanism can be received through the single chip microcomputer, the action induction signals of each actuating mechanism are processed into time sequence action signals by the single chip microcomputer, the time sequence action signals are output into a real-time action time sequence oscillogram through the upper computer, and the time sequence curve output can be used for debugging the speed and the action sequence when the equipment is in no-load, so that faults are eliminated.

4. The invention provides an equipment track action induction system, which can be used for monitoring automatic equipment in real time, such as a vacuum pipeline and a vacuum flow of the automatic equipment, timely responding to vacuum adsorption and pressure release on the basis of monitoring the vacuum pipeline and the vacuum flow, ensuring that a vacuum suction nozzle serving as an actuating mechanism acts in place, monitoring the stroke of the vacuum suction nozzle and ensuring that components are effectively implanted into a packaging tape.

5. The equipment track motion sensing system can be used for managing vacuum, if the vacuum management scheme of the automatic equipment is improved by adopting the monitoring system, the automatic equipment can store the upper limit range and/or the lower limit range corresponding to a plurality of flow meters, so that the vacuum working condition of each suction nozzle is determined based on the acquired flow value of each flow meter and the corresponding upper limit range and/or lower limit range, and one or more problems in the prior art are solved.

6. The equipment track action induction system can also monitor whether the action of the vacuum suction nozzle is in place or not, monitor the stroke and the specific position of the suction nozzle, express the tiny displacement of the suction nozzle as a displacement curve, analyze and judge the running condition of the equipment through an upper computer, analyze the cause of failure and guide the maintenance of the equipment, monitor the displacement of the vacuum suction nozzle through the action monitoring system, further determine the shaking amount of the vacuum suction nozzle on the upper and lower suction surfaces, determine whether the shaking amount of the vacuum suction nozzle is in a reasonable range or not, and indicate that the equipment needs to be overhauled if the shaking amount exceeds the range.

7. The track induction system is arranged on the automatic equipment, so that the implantation state of the material can be automatically monitored in real time through the track induction system when the material is packaged, the implantation is determined to be in place, passive failure in the material transportation process is avoided, and the equipment is ensured to run smoothly and not to be clamped by the material; the automatic equipment is further provided with a carrier tape feeding device, a component processing device and a material packaging device, wherein the carrier tape feeding device is used for feeding a carrier tape for packaging components, the component feeding device is used for feeding the components, the component processing device is used for implanting the components into the accommodating groove of the carrier tape, and the material packaging device is used for packaging the carrier tape accommodating the components.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic top view of a component handling apparatus of the present invention in one embodiment, with some components not shown;

fig. 2 is a side view of a part of the structure of the component processing apparatus in fig. 1, in which only the relevant part of the structure of the material inlet part is schematically shown;

fig. 3 is a side view of a part of the structure of the component processing apparatus in fig. 1, in which only the relevant part of the structure of the discharging part is schematically shown;

fig. 4 is an enlarged side view of a part of the structure of the component processing apparatus in fig. 1, in which only the relevant part of the structure of the implant is schematically shown;

FIG. 5 is a schematic view of a gas passage structure of the component processing apparatus of FIG. 1;

fig. 6 is a schematic circuit diagram of the component processing apparatus in fig. 1;

FIGS. 7a-7c are graphs of real-time waveform data obtained from corresponding flow meters in different states of the implanted vacuum nozzle of the present invention;

FIG. 8a is a graphic diagram illustrating the real-time flow data obtained by the flow meter corresponding to the implanted vacuum nozzle of the present invention and the corresponding action signal;

FIG. 8b is an enlarged schematic illustration of a graph of waveform data obtained by the flow meter of FIG. 8a in combination with corresponding motion signals;

FIG. 9 is an enlarged side view of a vacuum nozzle of an implant of a component handling device according to an embodiment of the present invention, partially shown;

FIG. 10 is a schematic flow chart illustrating the material handling process of the automatic material packaging apparatus according to an embodiment of the present invention;

FIG. 11 is a schematic cross-sectional view of a portion of a track structure of an induction track system according to the present invention;

FIG. 12 is a schematic diagram of a track induction system of the present invention in one embodiment.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.

The detailed description of the present invention is presented primarily in terms of procedures, steps, logic blocks, processes, or other symbolic representations that directly or indirectly simulate operations of aspects of the present invention. Those skilled in the art will be able to utilize the description and illustrations herein to effectively introduce the substance of their work to others skilled in the art.

Reference herein to "one embodiment" or "an embodiment" means that a feature, structure, or characteristic described in connection with the embodiment can be included in at least an implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Furthermore, the order of blocks in a method, flowchart or functional block diagram representing one or more embodiments is not a fixed order, refers to any particular order, and is not limiting of the present invention.

Example 1:

the existing automatic packaging equipment needs to implant materials into a packaging groove of a packaging belt in the operation process, and then the packaging belt moves the materials carried by the packaging belt to the next station under the driving of the equipment. The existing automatic packaging equipment does not have effective monitoring for monitoring whether materials are in place in a packaging groove. Therefore, problems often arise during operation of the plant: for example, the material is not completely implanted into the packaging groove, and in the moving process of the packaging belt, the material can be scratched and collided in the moving process, and even the equipment is clamped to cause faults; for another example, the material is placed in the packaging groove in an incorrect posture, and the material is contained in the packaging groove in a side-standing or upside-down posture and may be stuck in the packaging groove, which may cause inconvenience in taking, or may deform the shape of the packaging groove by squeezing, or may cause inconvenience in subsequent packaging work.

In order to solve the above problems, the present invention provides an equipment track action sensing system, which includes a track base frame and elastic sheets accommodated in the track base frame, wherein a channel is formed on the track base frame, and a plurality of elastic sheets are accommodated in the channel; the elastic sheet forms a carrying track, materials move on the carrying track, and when the materials are placed on the carrying track, the elastic sheet corresponding to the positions of the materials is compressed.

Referring to fig. 11, which is a schematic cross-sectional structure diagram of a partial track structure of the induction track system according to the present invention, the track in the figure includes a track base frame 01, a channel 02, and spring plates 03, a strip-shaped groove is disposed on the track base frame 01, the strip-shaped groove forms the channel 02, a plurality of spring plates (3 spring plates are shown in the figure) are sequentially arranged in the channel 02, and the sequentially arranged spring plates form a carrying track. In one case, there may be only one elastic piece in the channel 02, and the elastic piece is disposed below the implanted vacuum nozzle and used for detecting the implanted state of the material only when the material is implanted. Certainly, in order to keep the materials transported on the same horizontal plane, a magnetic track is arranged at a position where the elastic sheet is not arranged in the channel, and the magnetic track and the elastic sheet jointly form a material track which allows the materials to be transported smoothly.

In one embodiment, the elastic sheet 03 has an elastic arm 031, a connecting arm 032, and a transition arm 033 connecting the elastic arm 031 and the connecting arm 032, the connecting arm 032 is fixedly connected to the bottom of the channel 02, the transition arm 033 supports the elastic arm 031 in the air, the upper surface of the elastic arm 031 of the elastic sheet 03 forms the carrying track, and when the material is placed on the carrying track, the elastic arm 031 of the elastic sheet 03 corresponding to the material position is compressed downward.

In one embodiment, the elastic piece 03 may be an elastic piece with various shapes like a symbol "Z", an "S", or a "U".

In one embodiment, referring to fig. 12, the track induction system further comprises a sensor probe 04, and a digitizer displacement device 05 connected to the sensor probe 04; the sensor probe 04 is opposite to the elastic arm 031, and the sensor probe 04 is installed below the elastic arm 031, when the elastic arm 031 is compressed downward, the distance between the sensor probe 04 and the lower surface of the elastic arm 031 is shortened, the sensor probe 04 monitors the actual displacement of the elastic arm 031, the digital displacement device 05 compares the actual displacement with the standard displacement, and outputs a switching value signal according to the comparison result to control the action of the material implanting mechanism.

In one embodiment, with continued reference to fig. 12, 3 clips 03 are shown, in which a sensor probe 04 is disposed below the clip 03 implanted under the vacuum nozzle 141, and the last clip 03 from left to right is shown at the end of the track, and the last clip 03 carries the carrier tape 300 to the end of the track.

In an embodiment, with continued reference to fig. 12, the track induction system further includes an upper computer 06, the upper computer 06 is connected to the digital displacement device 05, the digital displacement device 05 converts the actual displacement into an actual displacement value, and the actual displacement value is processed by the upper computer 06 into a displacement curve chart and displayed on a display interface.

In an embodiment, the material implanting mechanism may include an implanting vacuum nozzle 141, the material may be a component, the carrying rail is further provided with a carrying tape 300, the carrying tape 300 is provided with a plurality of accommodating grooves 320, the implanting vacuum nozzle 141 is driven to implant the adsorbed component into the accommodating groove 320 of the carrying tape 300, and the carrying tape 300 carries the component which is driven to move from the carrying rail to a subsequent station.

In an embodiment, referring to fig. 12, the sensor probe 04 is disposed under the elastic arm 031 of the elastic sheet under the implantation vacuum nozzle 141, when the implantation vacuum nozzle 141 moves down to implant an adsorbed component into the accommodation groove 320 on the carrier tape 300, the elastic arm 031 of the elastic sheet under the accommodation groove 320 is compressed downward, the sensor probe 04 monitors an actual displacement of the elastic arm 031, and the digital displacement device 05 converts the actual displacement into an actual displacement value and displays the actual displacement value as a displacement curve diagram by using an upper computer 06.

In one embodiment, the digital displacement device 05 is configured to obtain an upper limit range and/or a lower limit range corresponding to a sensor, acquire a real-time displacement amount monitored by the sensor, determine whether the component is implanted in place based on the acquired real-time displacement amount and the corresponding upper limit range and/or lower limit range, process the real-time displacement amount acquired by the digital displacement device 05 into a displacement curve diagram representing a real-time implantation state of the component by the upper computer 06, determine whether the component is implanted in place according to the digital displacement device 05, and analyze an operation state of the device.

The track induction system can also have a time sequence monitoring function and is used for debugging the speed condition and the action sequence condition of the equipment when the equipment is in no-load.

In one embodiment, in order to enable the track sensing system of the present invention to have a timing monitoring function, the track sensing system of the present invention further includes one or more actuators, a control device configured to send out motion control signals to the one or more actuators, and one or more monitoring devices configured to monitor the motion of the corresponding one or more actuators respectively and send out motion sensing signals to the single chip according to the motion of the actuators.

The upper computer 06 used in the above embodiment may be configured to receive the time sequence action signal processed by the single chip microcomputer, and output the time sequence action signal as a real-time action time sequence oscillogram.

The actuating mechanism receives behind the action control signal, according to the action control signal makes the action, monitoring device monitors actuating mechanism's real-time action condition, and is in actuating mechanism sends action sensing signal when making the action, the singlechip will action sensing signal processing does actuating mechanism's chronogenesis actuating signal, host computer 06 will real-time action chronogenesis oscillogram compares with standard action chronogenesis oscillogram, in order to obtain real-time action chronogenesis oscillogram is relative the unusual action condition of standard action chronogenesis oscillogram to the analysis unusual action reason.

In one embodiment, in the above solution, the actuator includes a turntable 120 of the component processing apparatus, the turntable 120 includes a plurality of grooves 121 disposed on an edge, and the turntable 120 is driven to rotate during operation, so that the grooves 121 on the turntable 120 are rotated one by one to be below an implantation vacuum nozzle 141 of the component processing apparatus; when the turntable 120 is driven to rotate, the monitoring device sends action induction signals to the single chip microcomputer according to the action of the turntable 120, the single chip microcomputer processes the action induction signals into time sequence action signals, and the upper computer 06 processes the time sequence action signals into a real-time action time sequence oscillogram of the turntable 120.

In one embodiment, a standard action timing sequence waveform diagram of the turntable 120 is stored in the system of the upper computer 06, the upper computer 06 compares the real-time action timing sequence waveform diagram of the turntable 120 with the standard action timing sequence waveform diagram of the turntable 120 to obtain an abnormal action condition of the real-time action timing sequence waveform diagram of the turntable 120 relative to the standard action timing sequence waveform diagram of the turntable 120, and if the real-time action of the turntable 120 is abnormal, the upper computer 06 analyzes the reason for the abnormal action of the turntable 120.

In one embodiment, the actuator further comprises the implantation vacuum nozzle 141; when the turntable 120 is driven to rotate, one of the grooves 121 on the turntable 120 is rotated to a position below the implantation vacuum nozzle 141, the turntable 120 stops rotating, the implantation vacuum nozzle 141 is driven to move towards the groove 121, and the implantation vacuum nozzle 141 resets after the implantation vacuum nozzle 141 implants the adsorbed component into the groove 121.

When the turntable 120 is driven to rotate, the carrier tape 300 is driven to move at the same time, so that each groove 121 is communicated with one empty accommodating groove 320, when the implantation vacuum suction nozzle 141 moves downwards, a component adsorbed by the implantation vacuum suction nozzle 141 is implanted into the accommodating groove 320 from the groove 121, the elastic arm 031 of the elastic sheet below the accommodating groove 320 is compressed downwards, and the sensor probe 04 monitors the displacement of the elastic arm 031 in real time.

When the turntable 120 is driven to rotate, the monitoring device sends an action induction signal to the single chip microcomputer according to the action of the turntable 120; after the turntable 120 is driven to rotate in place, the implantation vacuum nozzle 141 starts to act under the control of the action control signal of the control device, and the monitoring device monitors the real-time action condition of the implantation vacuum nozzle 141 and sends out an action induction signal when the implantation vacuum nozzle 141 acts; after the implantation vacuum nozzle 141 finishes the implantation of the component, the control device controls the implantation vacuum nozzle 141 to reset, and after the implantation vacuum nozzle 141 resets, the turntable 120 is driven to rotate again, so that the next groove 121 on the turntable 120 is rotated to the position below the reset implantation vacuum nozzle 141.

When the implantation vacuum nozzle 141 implants the component into the accommodating groove 320, the single chip obtains an action sensing signal according to the sensor probe 04 for monitoring the displacement of the elastic arm 031 of the elastic piece, and the control device controls the driving part of the carrier tape 300 for driving the carrier tape 300 to move the carrier tape 300, so that the accommodating groove 320 of the component to be implanted on the carrier tape 300 is moved to the lower part of the implantation vacuum nozzle 141, and the accommodating groove 320 of the implanted component is moved to a subsequent packaging station.

The action induction signals of the turntable 120 and the action induction signals of the implanted vacuum suction nozzle 141, which are obtained by monitoring of the monitoring device, are synchronously collected by the single chip microcomputer and then are arranged into time sequence action signals according to time sequence, the single chip microcomputer sends the time sequence action signals to the upper computer 06, and the upper computer 06 analyzes to obtain real-time action time sequence oscillograms representing the turntable 120 and the implanted vacuum suction nozzle 141.

The upper computer 06 stores standard action time sequence oscillograms of the rotary disc 120 and the implanted vacuum suction nozzle 141, and the upper computer 06 compares the real-time action time sequence oscillogram with the standard action time sequence oscillogram to obtain abnormal action conditions of the real-time action time sequence oscillogram relative to the standard action time sequence oscillogram and analyze reasons of abnormal actions.

The track of the track induction system provided by the invention is composed of the elastic sheets sensitive to stress induction, when a component is placed on the track composed of the elastic sheets, the implantation state of the component in the carrier tape accommodating groove can be judged through the compression degree of the elastic sheets, compared with the track mode of the existing equipment, the track induction force is stronger, when the track is used for material transportation, the implantation state of the material can be judged directly through the compression amount of the elastic sheets, and after the implantation state of the material is determined, the poor material and equipment faults caused by the fact that the material is not implanted in place can be avoided in the material transportation process.

The track induction system monitors the compression displacement of the elastic sheet in real time through the sensor, can directly convert the compression displacement into a displacement numerical value through the digital displacement device, and can monitor the implantation state of the material in real time through a displacement curve compressed by the elastic sheet if the displacement numerical value is connected with an upper computer.

The track induction system also has a time sequence monitoring function, action induction signals of each actuating mechanism can be received through the single chip microcomputer, the action induction signals of each actuating mechanism are processed into time sequence action signals by the single chip microcomputer, the time sequence action signals are output into a real-time action time sequence oscillogram through the upper computer, and the time sequence curve output can be used for debugging the speed and the action sequence when the equipment is in no-load state, so that faults are eliminated.

Example 2:

the invention provides an equipment track induction system, which comprises: one or more controlled components;

one or more monitoring devices configured to monitor real-time status parameter values of the corresponding one or more controlled components, respectively;

the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to each monitoring device, acquire a real-time state parameter value of each monitoring device, and determine the action condition of the corresponding controlled component based on the acquired real-time state parameter value of each monitoring device and the corresponding upper limit range and/or lower limit range;

and the upper computer is configured to process the real-time state parameter value of each monitoring device acquired by the control device into a state curve chart representing the real-time action condition of the controlled component, and analyze the running state of the equipment according to the action condition of the controlled component determined by the control device.

In an embodiment, in the track sensing system for equipment provided by the present invention, the controlled component may be a vacuum nozzle, the monitoring device may be a flow meter, the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to each flow meter, collect a real-time flow value of each flow meter, and determine an operating condition of the corresponding vacuum nozzle based on the collected real-time flow value of each flow meter and the corresponding upper limit range and/or lower limit range, the upper computer processes the real-time flow value of each flow meter collected by the control device into a flow curve diagram representing a real-time operating condition of the vacuum nozzle, and analyzes an operating state of the equipment according to the operating condition of the vacuum nozzle determined by the control device.

Based on the equipment track induction system, the invention demonstrates that the equipment track induction system is applied to a component processing device, so that the component processing device adopts the equipment track induction system to improve the vacuum management scheme of the component processing device, very effective help can be provided for the use, maintenance and repair of the component processing device, and the intelligent management of a machine is realized. It should be noted that, in this document, the term "processing" in the component processing apparatus has a broad meaning, and the component pickup, transfer, inspection, removal, blanking, placement, mounting, and the like can be referred to as the processing of the component. The components in this context may include small components such as chips, resistors, capacitors, and the like.

There are many kinds of the component handling apparatuses. Some component processing equipment can utilize the principle of vacuum adsorption to pack components and parts into the holding groove in the carrier tape, wherein relate to the material loading of components and parts (being the pickup of components and parts), the transportation of components and parts, the detection of components and parts, detect getting rid of unusual components and parts, detect the implantation of normal components and parts (being the arrangement of components and parts), a plurality of action wherein all need accomplish through vacuum adsorption. In addition, some component processing apparatuses are designed not to pack the components into a carrier tape, but to select qualified components and directly load the selected components into a related container, and the operations of the component processing apparatuses include loading of components (i.e., picking up of components), transferring of components, detection of components, removal of components with abnormal detection, and unloading of components with normal detection (i.e., directly loading the selected components into a related container), and the like, and all of the operations are required to be performed by vacuum adsorption. In addition, there are component handling apparatuses for mounting components on a carrier, such as a circuit board, involving the loading of components (i.e., component pickup), component transfer, component mounting, and the like, wherein a plurality of operations are performed by vacuum suction.

The description will be given mainly by taking a component handling apparatus for packaging components in receiving grooves in a carrier tape as an example. It should be apparent that in some embodiments, other component handling apparatuses may employ the same vacuum suction principle, and those skilled in the art may apply the vacuum management scheme described in detail herein to other types of component handling devices (such as component screening apparatuses or component placement apparatuses) according to the teachings herein.

Fig. 1 is a schematic top view of a component handling apparatus 100 according to an embodiment of the present invention, with some components not shown. The component handling apparatus 100 may pack the component 200 into the receiving slot 320 in the carrier tape 300. The component 200 may be a small passive component such as a chip. Before packing components 200 into the accommodating groove 320 in the carrier tape 300, the component processing apparatus 100 can also perform electrical performance detection on the components 200, and the component processing apparatus 100 also needs to eliminate the components 200 with abnormal detection and keep detecting normal components.

As shown in fig. 1 to 4, the component processing apparatus 100 includes a machine table 180, a turntable 120 disposed on the machine table 180, a feeding portion 110, a discharging portion 130, an implanting portion 140, and a detecting device (not shown).

The turntable 120 is driven to rotate in the direction D2 in fig. 1 during operation, and the turntable 120 includes a plurality of grooves 121 disposed on the edge. For simplicity, several recesses 121 are shown in fig. 1 only as an example, which are provided on part of the edge of the turntable 120, in practice, the recesses 121 are provided uniformly on all edge parts of the turntable 120.

Fig. 2 is a side-view enlarged schematic diagram of a partial structure of the component processing apparatus 100 in fig. 1, in which only a relevant partial structure of the material inlet portion 110 is schematically shown. Fig. 5 is a schematic view of a gas passage structure of the component processing apparatus in fig. 1. As shown in fig. 1, 2 and 5, the feeding portion 110 includes a feeding vacuum nozzle 111 disposed on the machine platform 180, a feeding rail 113 disposed on the machine platform 180, a separating needle 112 and an in-position detector 114. The implantation vacuum nozzle 111 is in communication with a vacuum pump 151 (shown in FIG. 5) via a conduit. The separator pin 112 is controlled to move between a blocking position and an open position. The component 200 on the feeding track 113 is blocked when the separating pin 112 is in the blocking position, as shown in fig. 2, when the separating pin 112 is in the blocking position. When the separating pin 112 is in the open position, the top end of the separating pin 112 is lower than or equal to the track surface of the feeding track 113, the feeding vacuum nozzle 111 sucks the component 200 on the feeding track 113 into the groove 121 at the feeding vacuum nozzle 111 through vacuum suction, and then the separating pin 112 returns to the blocking position from the normally open position. The docking detector 114 is configured to detect whether the component 200 enters the recess 121 at the feeding vacuum nozzle 111. When the turntable 120 rotates, the grooves 121 of the turntable 120 sequentially pass through the feeding vacuum suction nozzle 111, and are matched with the reciprocating motion of the separating needle 112 between the blocking position and the opening position, so that the components 200 are adsorbed into the grooves 121 of the turntable 120 one by one.

With the rotation of the turntable 120, the detection device can sequentially perform electrical performance detection, such as resistance detection or capacitance detection, on the components 200 adsorbed into the grooves 121 of the turntable 120. For the components 200 that are detected to be abnormal to be excluded from the turntable 120, the bin 130 may be configured to perform the operation of excluding the components 200 that are detected to be abnormal. Of course, the ejection unit 130 does not perform the ejection operation for the component 200 that is detected to be normal, and it is necessary to suck the component 200 that is detected to be normal.

Fig. 3 is a side-view enlarged schematic diagram of a partial structure of the component processing apparatus 100 in fig. 1, in which only a relevant partial structure of the discharging portion 130 is schematically illustrated. As shown in fig. 1, 2 and 5, the discharging portion 130 includes a discharging vacuum nozzle 131, a receiving chamber 132 and a solenoid valve 133 (shown in fig. 5) disposed on the machine. A first port of the electromagnetic valve 133 is communicated with the discharge vacuum nozzle 131, a second port of the electromagnetic valve 133 is communicated with the vacuum pump 151, and a third port of the electromagnetic valve 133 is communicated with the air outlet pump 135. The solenoid valve 133 is controlled to selectively communicate the first port with one of the second port and the third port. The discharge vacuum nozzle 131 is controlled to selectively communicate with one of the vacuum pump 151 and the air outlet pump 135 through a solenoid valve 133.

For the component 200 which is normally tested, the electromagnetic valve 133 enables the discharge vacuum nozzle 131 to communicate with the vacuum pump 151, and the discharge vacuum nozzle 131 adsorbs the component which is normally tested in the groove 121 at the discharge vacuum nozzle 131 through vacuum suction. For the abnormal component 200, the electromagnetic valve 133 connects the discharge vacuum nozzle 131 with the air pump 135, the discharge vacuum nozzle 131 blows the abnormal component 200 out of the groove 121 at the discharge vacuum nozzle 131 by the blowing thrust, and the blown component 200 falls into the receiving cavity 132. Along with the rotation of the turntable 120, the grooves 121 on the edge of the turntable 120 sequentially pass through the discharging vacuum nozzles 131 of the discharging part 130, and the components 200 which are detected normally can be retained and the components 200 which are detected abnormally can be removed by matching with the action control of the electromagnetic valve 133.

As shown in fig. 1, three discharge portions 130 are schematically illustrated, the discharge vacuum nozzles of which are respectively designated 131a, 131b and 131c, the receiving chambers of which are respectively designated 132a, 132b and 132c, and the three discharge portions 130 also have three solenoid valves 133. Fig. 5 and 6 illustrate only one discharging portion 130. Of course, in other embodiments, one discharge, two discharges or more discharges may be provided, the number of discharges depending on the application and design.

Fig. 4 is an enlarged side view of a part of the structure of the component processing apparatus in fig. 1, in which only the relevant part of the structure of the implant 140 is schematically shown. As shown in connection with figures 1, 4 and 5,

the implant part 140 includes an implant vacuum nozzle 141 and an implant driving part 142. The implantation vacuum nozzle 141 is in communication with a vacuum pump 151 via a conduit. The implanting vacuum nozzle 141 sucks and implants the components 200 located in the grooves 121 at the implanting vacuum nozzle 141 into the receiving grooves 320 of the carrier tape 300 by vacuum suction. The implanting driving part 142 drives the implanting vacuum nozzle 141 to reciprocate between the taking-out position and the implanting position. As shown in fig. 4, the implantation vacuum nozzle 141 is located at a material removal position, and the implantation vacuum nozzle 141 moves downward to an implantation position (not shown). The implanting vacuum nozzle 141 sucks the components 200 in the grooves 121 at the implanting vacuum nozzle 141 at the pick-up position, and implants the sucked components 200 in the receiving grooves 320 of the carrier tape 300 at the implanting position.

The component processing apparatus 100 further includes a carrier tape drive unit (not shown). As shown in fig. 1, the carrier tape driving part drives the carrier tape 300 through the implanting part 140. The carrier tape 300 includes a plurality of receiving slots 320 arranged in a row and carrier tape holes 310 arranged in a row. The carrier tape driving part drives the receiving slots 320 of the carrier tape 300 forward through the carrier tape holes 310 of the carrier tape 300 to pass through the implanting vacuum nozzle 141 in sequence.

As shown in fig. 1, with the rotation of the turntable 120, the grooves 121 on the edge of the turntable 120 sequentially pass through the material feeding vacuum nozzle 111, the material discharging vacuum nozzle 131 and the implanting vacuum nozzle 141, and cooperate with the reciprocating motion of the separating needle 112 between the blocking position and the opening position, the components 200 are adsorbed into the grooves 121 of the turntable 120 one by one, the components 200 which are detected normally can be retained by cooperating with the motion control of the electromagnetic valve 133, the components 200 which are detected abnormally can be removed, and the components 200 which are implanted into the grooves 121 on the edge of the turntable 120 can be sequentially placed into the accommodating grooves 320 of the carrier tape 300 by the implanting vacuum nozzle 141 by cooperating with the reciprocating motion of the implanting vacuum nozzle 141 and the forward motion of the carrier tape 300.

Fig. 6 is a schematic circuit diagram of the component processing apparatus 100 in fig. 1. As shown in fig. 5-6, the component handling apparatus 100 further includes a plurality of flow meters and control apparatus 160. The plurality of flow meters are configured to measure flow values of the feed vacuum nozzle 111, the discharge vacuum nozzle 131, and the implant vacuum nozzle 141, respectively. The control device 160 is configured to store the upper and/or lower limit ranges corresponding to the respective flow meters, collect the flow rate values of the respective flow meters, and determine the vacuum operation of the implantation part 110, the material feeding part 130 and/or the implantation part 140 based on the collected flow rate values of the respective flow meters and the corresponding upper and/or lower limit ranges. It should be noted that the control device 160 can collect real-time flow rate values of the flow meter, so that the vacuum conditions can be known in more detail.

The plurality of flow meters may include a first flow meter 115 disposed on a conduit in communication with the feeding vacuum nozzle 111, a second flow meter 134 disposed on a conduit in communication with the discharging vacuum nozzle 131, and a third flow meter 134 disposed on a conduit in communication with the implanting vacuum nozzle 141.

The first flow meter 115 is electrically connected to the control device 160 and is configured to measure the gas flow rate of the inlet vacuum nozzle 111 to obtain a first flow value and transmit the obtained first flow value to the control device 160. The second flow meter 134 is electrically connected to the control device 160, and is configured to measure the gas flow of the discharge vacuum nozzle 131 to obtain a second flow value, and transmit the second flow value to the control device 160. The third flow meter 134 is electrically connected to the control device 160 and is configured to measure the flow of the gas to the implanted vacuum nozzle 141 to obtain a third flow value and to transmit the obtained second flow value to the control device 160. The control device 160 may be a single chip, a programmable controller, a microcontroller, a computing device, or the like.

The component processing apparatus 100 further includes a flow divider 152, and the flow divider 152 is connected to the vacuum pump 151 through a pipe. The vacuum pump 151 is in communication with the feeding vacuum nozzle 111, the discharging vacuum nozzle 131, and the implanting vacuum nozzle 141 through the flow splitter 152. The plurality of flow meters includes: a fourth flow meter 153 disposed on a pipe of the vacuum pump 151, the fourth flow meter 153 may be configured to measure a total flow value.

The docking detector 114 is electrically connected to the control device 160 and provides docking detection signals to the control device 160. The solenoid valve 133 is connected to the control device 160, and the control device 160 can control the solenoid valve 133. The separation needle 112 and the implantation driving part 142 are electrically connected to the control device 160, and the control device 160 controls the actions of the separation needle 112 and the implantation driving part 142. The component processing apparatus 100 further includes a turntable driving portion 122 for driving the turntable 120 to rotate, and the turntable driving portion 122 is electrically connected to the control device 160.

As shown in fig. 6, in an embodiment, the component processing apparatus 100 may further include: and a communication module 170 for communicating with an upper computer (not shown). The upper computer may be a computer device communicating with the component processing apparatus 100. The communication module 170 may be a wired or wireless module, such as a Wifi wireless communication module, a bluetooth wireless communication module, a USB communication module, an RS485 module, and the like. In one embodiment, the communication module 170 is configured to receive an upper limit range and/or a lower limit range corresponding to each flow meter transmitted by the upper computer.

In one embodiment, the upper computer may generate and update the upper limit range and/or the lower limit range corresponding to each flow meter based on the total flow value of the vacuum pump 151, the equipment type of the component processing apparatus 100, and the component type transmitted by the communication module 170. The upper limit range and/or the lower limit range corresponding to each flow meter are set in relation to the total flow rate of the vacuum pump 151, the type of equipment of the component processing apparatus 100, and the type of component, and it is necessary to combine these factors to set the appropriate upper limit range and/or lower limit range corresponding to each flow meter. Of course, other factors may be associated with the setting of the upper and/or lower range for each flow meter, and other factors may need to be considered. Of course, in another embodiment, the upper limit range and/or the lower limit range corresponding to each flow meter may also be directly set on the component processing apparatus 100.

In addition, the upper limit range and/or the lower limit range corresponding to each flow meter of the same component processing apparatus 100 are not constant, and they may vary depending on the use of the equipment. Therefore, the upper computer may recalculate the upper limit range and/or the lower limit range corresponding to each flow meter periodically or according to a request, and update the parameters into the component processing apparatus 100.

Preferably, the upper computer may be connected to an artificial intelligence module (AI), and the artificial intelligence module may generate and update an upper limit range and/or a lower limit range corresponding to each flow meter according to production record data of one or more component processing apparatuses 100. The production log data includes real-time measurement values measured by the respective flow meters during the production process, the component type, the equipment type of the component processing apparatus 100, and the like. One part of the real-time measured values is a high value, namely the flow rate value obtained by each flow meter in a material-free state, and the other part of the real-time measured values is a low value, namely the flow rate value obtained by each flow meter in a material state. The upper limit range of each flowmeter can be accurately obtained by counting the value range of the high position in the real-time measurement value, and the lower limit range of each flowmeter can be accurately obtained by counting the value range of the low position in the real-time measurement value. And the upper computer is communicated with the artificial intelligence module to obtain the upper limit range and/or the lower limit range of each flowmeter.

The upper computer determines whether to allow the component processing apparatus 100 to normally operate (or be referred to as normal operation) based on the total flow value of the vacuum pump 151 transmitted by the communication module 170 and the total flow value limit value obtained by the fourth flow meter 153.

The upper limit range comprises a highest upper limit value and a lowest upper limit value, if the flow value is between the highest upper limit value and the lowest upper limit value, the flow value is considered to be in the upper limit range, if the flow value is higher than the highest upper limit value, the flow value is considered to be higher than or exceed the upper limit range, and if the flow value is lower than the lowest upper limit value, the flow value is considered to be lower than the upper limit range. Likewise, the lower limit range includes a highest lower limit value and a lowest lower limit value, and if the flow value is between the highest lower limit value and the lowest lower limit value, the flow value is considered to be within the lower limit range, if the flow value is higher than the highest lower limit value, the flow value is considered to be higher than or exceed the lower limit range, and if the flow value is lower than the lowest lower limit value, the flow value is considered to be lower than the lower limit range. For example, if the lowest limit value is 0, the flow rate value is generally not lower than the lower limit range.

Specifically, the first flow meter 115 is provided with a corresponding upper limit range and/or lower limit range, which is the upper limit range and/or lower limit range of the gas flow rate of the material inlet vacuum nozzle 111, the second flow meter 134 is provided with a corresponding upper limit range and/or lower limit range, which is the upper limit range and/or lower limit range of the gas flow rate of the material outlet vacuum nozzle 131, and the third flow meter 143 is provided with a corresponding upper limit range and/or lower limit range, which is the upper limit range and/or lower limit range of the gas flow rate of the material inlet vacuum nozzle 141. In addition, it should be noted that, for each state of each vacuum nozzle, a corresponding upper limit range and/or lower limit range is provided, and the upper limit range and/or lower limit range corresponding to different states may be different or may be the same.

In the invention, the real-time measurement values of the flow meters are collected, so that technical support can be provided for subsequent more accurate analysis, and rich information contained in the real-time measurement values of the flow meters can be extracted. Because the corresponding upper limit range and/or lower limit range is set for the flow value of each flowmeter, the abnormal conditions of various flow values can be distinguished more clearly, so that the reason of the abnormal conditions can be analyzed, the fault removal help is provided for users, the specific conditions of the normal conditions of the flow values can be known, and the health condition of corresponding machine equipment can be evaluated.

The vacuum management scheme employed by the control device 160 is described in detail below.

1) Vacuum management with respect to the feed section 110

When the feeding portion 110 is in a continuous material-free state, if the acquired real-time flow value of the feeding vacuum nozzle 111 is lower than the corresponding upper limit range, the control device 160 determines that the feeding portion vacuum is abnormal. For the first feeding portion vacuum abnormality, the control device 160 may prompt the abnormality cause: one or more of insufficient vacuum of the feeding part 110, blockage of a feeding vacuum nozzle 111, blockage of a pipeline of the feeding part 110 and air leakage of a pipeline in front of a flow meter of the feeding part 110. When the feeding portion 110 is in a continuous material-free state, if the collected real-time flow value of the feeding vacuum nozzle 111 is higher than the corresponding upper limit range, the control device 160 determines that the feeding portion vacuum is abnormal of the second type. For the second feeding portion vacuum anomaly, the control device 160 may prompt the anomaly cause as follows: the feeding portion 110 is over-vacuumed.

And under the condition that the feeding part 110 is in a material-existence alternative conversion state, if the high value of the acquired real-time flow value of the feeding vacuum suction nozzle 111 is in the corresponding upper limit range, and the low value of the acquired real-time flow value of the feeding vacuum suction nozzle 111 is higher than the corresponding lower limit range, determining that the feeding part is in vacuum abnormity. For the third vacuum abnormality of the feeding portion, the control device 160 may prompt that the abnormality is caused by: and the air leakage of the pipeline behind the flowmeter of the feeding part.

The continuous material-free state of the feeding part is provided with a corresponding upper limit range, the material-free state of the feeding part is provided with a corresponding upper limit range and a corresponding lower limit range, and the continuous material-free state of the feeding part and the material-free state of the feeding part are alternately switched in different upper limit ranges.

Therefore, the user can be helped to quickly find out the fault reason of the vacuum abnormity of the feeding part, and the efficiency is improved. In addition, even if the real-time flow value of the feeding part is in the corresponding upper limit range or lower limit range, and the feeding part is normal in vacuum, the health condition of the feeding vacuum suction nozzle 111 of the feeding part can be evaluated according to the real-time flow value of the specific feeding part, and a prompt can be given when the health condition deteriorates to a certain threshold value, so as to avoid abnormal conditions.

The control device 160 is further configured to collect one or more of a rotation signal of the turntable 120, an implantation signal of the implantation portion 140, a feeding signal of the feeding portion 110, and a discharging signal of the discharging portion 130. The feeding motion signal of the feeding portion 110 may include a motion signal of the separation pin 112 of the feeding portion 110 and/or a detection signal of the seating detector 114. The implant operation signal of the implant part 140 may include an operation signal of the implant driving part 142 of the implant part 140. The discharging operation signal of the discharging unit 130 may include a switching signal of the solenoid valve 133 of the discharging unit 130.

The control device 160 can determine whether the feeding portion 110 is in a continuous material-free state and a material-free alternate switching state based on the collected feeding action signal of the feeding portion 110 and/or the collected real-time flow value of the feeding vacuum nozzle 111. Of course, the control device 160 may also determine the state of the material feeding portion 110 according to the rotation signal of the turntable 120.

In one embodiment, the control device 160 can determine that the material feeding portion 110 is in the continuous material-free state when the material feeding portion 110 has no action signal continuously and the collected real-time flow value of the material feeding vacuum nozzle 111 is continuously at the high value continuously for a continuous period of time. When the collected real-time flow value of the feeding vacuum nozzle 111 is alternatively switched between a high value and a low value in cooperation with the collected action signal of the feeding portion 110, the control device 160 may determine that the feeding portion 110 is in a material-presence or material-absence alternative switching state.

2) Vacuum management with respect to discharge section 130

When the discharge portion 130 is in a continuous material-free state, if the acquired real-time flow value of the discharge vacuum nozzle 131 is lower than the corresponding upper limit range, the control device 160 determines that the first type of discharge portion vacuum is abnormal. For the first discharge portion vacuum anomaly, the control device 160 may indicate the anomaly reason: the material discharging part is one or more of insufficient vacuum, blockage of a material discharging vacuum suction nozzle, blockage of a pipeline of the material discharging part and air leakage of a pipeline in front of a flowmeter of the material discharging part.

If the collected real-time flow value of the discharge vacuum nozzle is higher than the corresponding upper limit range under the continuous material-free state of the discharge part, the control device 160 determines that the second type of discharge part vacuum is abnormal. For the second type of vacuum anomaly in the discharge portion, the control device 160 may indicate the anomaly cause: one or more of excessive vacuum of the discharging part 130 and air leakage of the rear pipeline of the flowmeter of the discharging part 130

When the discharging portion is in a state of being charged and being converted into a state of being discharged, if the high value and the low value of the collected real-time flow value of the discharging vacuum nozzle are converted too slowly, the control device 160 determines that the discharging portion is in a third vacuum abnormal state. For a third discharge portion vacuum anomaly, the control device 160 may indicate the anomaly reason: one or more of aging of the solenoid valve 133 of the discharge portion 130 and clogging of the discharge vacuum nozzle 131 of the discharge portion 130.

Wherein, a corresponding upper limit range is set for the continuous material-free state of the discharging part 130.

Therefore, the user can be helped to quickly find out the fault reason of the empty abnormity of the discharging part 130, and the efficiency is improved. In addition, even if the real-time flow value of the discharging part 130 is within the corresponding upper limit range, and the discharging part 130 is normally vacuumized, the health condition of the discharging vacuum suction nozzle of the discharging part 130 can be evaluated according to the real-time flow value of the discharging part 130, and a prompt can be given when the health condition deteriorates to a certain threshold value, so as to avoid abnormal occurrence.

The control device 160 may determine whether the discharge portion 130 is in a continuous material-free state and a material-free state based on the collected discharge action signal of the discharge portion 130 and/or the collected real-time flow value of the discharge vacuum nozzle 131. The control device 160 may also determine the state of the discharging unit 130 in combination with a rotation operation signal of the turntable 120.

In one embodiment, when the discharge portion 130 continues to have no operation signal and the collected real-time flow value of the discharge vacuum nozzle 131 continues to be at the high value for a continuous period of time, the control device 160 may determine that the discharge portion 130 is in the continuous material-free state; when the collected real-time flow value of the discharge vacuum nozzle 131 is matched with the collected action signal of the discharge part 130 and is switched from a low value to a high value, the discharge part 130 is judged to be in a material-existing state and is switched to a material-nonexisting state.

3) Vacuum management with respect to implant 140

In the continuous no-material state of the implant 140, the control device 160 may determine that the implant vacuum is abnormal of a first type if the real-time flow value of the implant vacuum nozzle 141 is collected below a corresponding upper range. For the first implant vacuum abnormality, the control device 160 may indicate the abnormality cause: one or more of an implant vacuum deficiency, an implant vacuum nozzle blockage, an implant tubing blockage, an implant pre-flow meter tubing leak.

In the state that the implanted part 140 is in the material-presence/absence alternating conversion state, if the high value of the acquired real-time flow value of the implanted vacuum nozzle 141 is within the corresponding upper limit range, and the low value of the acquired real-time flow value of the implanted vacuum nozzle 141 is higher than the corresponding lower limit range, the control device 160 may determine that the implanted part is abnormal in vacuum. For the second type of vacuum anomaly of the implant, the control device 160 may indicate the anomaly cause: one or more of a breakage of the implanted vacuum nozzle, a wear of the implanted vacuum nozzle, and a leakage of air from the conduit behind the flow meter of the implanted portion.

And under the condition that the implantation part 140 is in a material-free alternate conversion state, if the high value of the acquired real-time flow value of the implantation vacuum suction nozzle 141 is in the corresponding upper limit range, and the low value of the acquired real-time flow value of the implantation vacuum suction nozzle 141 is in the corresponding lower limit range but is close to the upper limit value of the corresponding lower limit range and regularly fluctuates, determining that the implantation part is in a third implantation part vacuum anomaly. For a third type of implant vacuum anomaly, the control device 160 may indicate the anomaly cause: one or more of a half-occlusion of the implanted vacuum nozzle 141, and a single-hole occlusion of the implanted vacuum nozzle 141.

When the implanting part 140 is in the material-filled/material-free alternate switching state, if the high value of the acquired real-time flow value of the implanting vacuum nozzle 141 is within the corresponding upper limit range, and the low value of the acquired real-time flow value of the implanting vacuum nozzle 141 is within the corresponding lower limit range and fluctuates irregularly, the control device 160 may determine that the fourth implanting part is abnormal in vacuum. For the fourth implantation vacuum anomaly, the control device 160 may indicate the anomaly reason: the size of the component is abnormal.

In the case of a fourth implantation vacuum anomaly, the control device 160 can determine the nonstandard rate of the components 200 according to the collected real-time flow value of the implantation vacuum nozzle 111 with a predetermined number of component devices (e.g., 100 or other numbers).

The control device 160 may determine whether the implant 140 is in the continuous material-free state and the material-free alternate transition state based on the collected implant motion signal of the implant 140 and/or the collected real-time flow value of the implant vacuum nozzle 141. The control device 160 can also determine the state of the implantation portion 140 in combination with the rotation signal of the turntable 120.

In one embodiment, the control device 160 may determine that the implant 140 is in the material-free state when the implant 140 continues to have no motion signal and the collected real-time flow value of the implant vacuum nozzle 141 continues to be at the high value for a continuous period of time; when the collected real-time flow value of the implanted vacuum nozzle 141 is alternately switched between a high value and a low value in cooperation with the collected operation signal of the implanted part 140, the control device 160 may determine that the implanted part is in a material-presence/absence alternate switching state.

Wherein, a corresponding upper limit range is set for the continuous material-free state of the implantation part 140, and a corresponding upper limit range and a corresponding lower limit range are set for the material-free and material-free alternating conversion state of the implantation part 140, wherein the upper limit range of the continuous material-free state and the upper limit range of the material-free and material-free alternating conversion state of the implantation part 140 are different.

This helps the user to quickly find the cause of the failure of the vacuum abnormality of the implant 140, thereby improving efficiency. In addition, even if the real-time flow value of the implant part 140 is within the corresponding upper limit range or lower limit range, and the vacuum of the implant part 140 is normal, the health condition of the implant vacuum nozzle of the implant part 140 can be evaluated according to the real-time flow value of the specific implant part 140, and a prompt is given when the health condition deteriorates to a certain threshold value, so as to avoid the generation of abnormality.

In one embodiment, the control device 160 may report the vacuum abnormal conditions of the material inlet portion 110, the material discharge portion 130 and the implantation portion 140 to an upper computer, and the upper computer displays, prompts or alarms. Of course, the component processing apparatus 100 may prompt itself, specifically, the component processing apparatus may prompt through a self-configured display screen, or may display the component processing apparatus through a related indicator light. In addition, the control device 160 may also report the vacuum normal conditions of the material inlet portion 110, the material discharge portion 130, and the implantation portion 140 to an upper computer, and the upper computer may analyze the vacuum normal conditions or evaluate the health condition.

The real-time flow value of the implanted vacuum nozzle 141 will be described with reference to the drawings.

Figures 7a-7c are graphs of waveform data obtained from a corresponding flow meter in various conditions of the implanted vacuum nozzle 141 of the present invention. Fig. 7a is a waveform data diagram (real-time flow rate value) obtained by the corresponding flow meter when the implanted vacuum nozzle 141 is in a material state, wherein the Y-axis is an induced voltage value, the X-axis is time (unit is 10 us), and the voltage value obtained by the flow meter fluctuates between 2.02V and 2.62V at a period of 21ms. Fig. 7b is a waveform data diagram of the flow meter corresponding to the implanted vacuum nozzle 141 in the material-free state, wherein the Y-axis represents the induced voltage value and the X-axis represents the time (unit is 10 us), and the voltage value obtained by the flow meter fluctuates between 3.75V and 4.15V with a period of 21ms. Fig. 7c is a waveform data diagram obtained by the corresponding flow meter when the implanted vacuum nozzle 141 is in the material-presence/absence alternating state, the Y axis of the waveform data diagram is the induced voltage value, the X axis of the waveform data diagram is the time, the voltage value obtained by the flow meter fluctuates between 3.75V and 4.15V at this time, and the period is 60-80 ms.

FIG. 8a is a schematic diagram of the real-time flow value waveform data obtained by the flow meter corresponding to the implanted vacuum nozzle of the present invention, and the corresponding action signal. Fig. 8b is a time-enlarged schematic view of a graph of waveform data obtained by the flow meter of fig. 8a in combination with corresponding motion signals. For clarity, the X-axis is time (in units of 10 us) and the Y-axis is amplitude for real-time flow values, where in fig. 8a and 8b not voltage values are already present, but rather mapped values of the voltage values after the scaling. Wherein, the waveform C1 is waveform data obtained by a flowmeter corresponding to the implanted vacuum suction nozzle, and C2 is a time sequence waveform of the turntable, wherein, the high level represents the rotation of the turntable, and the low level represents the immobility of the turntable; c3 is an action signal after the implantation vacuum suction nozzle moves downwards, wherein the low level represents at an implantation position, and the high level represents at a material taking position. The falling edge of the action signal after the implanted vacuum suction nozzle moves downwards reaches the minimum value of flow sensing and is delayed by 6.5ms, and the falling edge of the action signal after the implanted vacuum suction nozzle moves downwards reaches the maximum value of flow sensing and is delayed by 7.5ms. As shown in fig. 8a, in the D1 region of the waveform C1, since the components implanted in the grooves on the corresponding turntable of the vacuum nozzle have been removed at the removing portion, the real-time flow rate value is greatly increased, and in the other portions except the D1 region, the implanting portion 140 is in the material-free alternate switching state, and the real-time flow rate value fluctuates periodically up and down, and the high values of the real-time flow rate value are all located in the corresponding upper limit range, and the low values of the real-time flow rate value are all located in the corresponding lower limit range, in cooperation with the operation signal of the turntable and the operation signal of the implanting portion.

Thus, the control device, the upper computer or the artificial intelligence module can obtain the appropriate upper limit range and/or lower limit range of each state according to the real-time flow value collected by the flow meter and related to the implanted vacuum suction nozzle 141. Therefore, by combining the real-time flow value acquired by the flowmeter and the action signals of all the action parts, the working conditions of all the vacuum suction nozzles, including abnormal conditions and normal conditions, can be analyzed very accurately. For abnormal conditions, analysis and prompt of abnormal reasons can be carried out, for normal conditions, health conditions can be evaluated, and abnormal hidden dangers can be discovered in time.

Similarly, the control device, the upper computer or the artificial intelligence module can obtain the appropriate upper limit range and/or lower limit range of other vacuum suction nozzles in each state according to the real-time flow value acquired by the flowmeter.

In accordance with another aspect of the invention, in one embodiment, a component handling apparatus of the invention includes one or more vacuum nozzles configured to pick up or drop components; one or more flow meters configured to measure real-time flow values of the corresponding one or more vacuum nozzles, respectively; and the control device is configured to obtain the upper limit range and/or the lower limit range corresponding to each flowmeter, acquire the real-time flow value of each flowmeter, and determine the working condition of the corresponding vacuum suction nozzle based on the acquired real-time flow value of each flowmeter and the corresponding upper limit range and/or lower limit range. The operating conditions may include abnormal conditions and normal conditions.

Preferably, at least one vacuum suction nozzle has a continuous material-free state and a material-free material alternating state, the flowmeter is capable of providing a real-time flow value in a period of the material-free material alternating state, the control device compares a highest value of the real-time flow value in each period of the material-free material alternating state with a corresponding upper limit range, compares a lowest value of the real-time flow value in each period of the material-free material alternating state with a corresponding lower limit range, and determines the working condition of the corresponding vacuum suction nozzle in the material-free material alternating state, and the control device compares the highest value of the real-time flow value in the continuous material-free state with the corresponding upper limit range, and determines the working condition of the corresponding vacuum suction nozzle in the continuous material-free state.

Preferably, at least one vacuum suction nozzle has a continuous material-free state and is switched from a material-free state to a material-available state, the control device compares the highest value of the real-time flow value in the continuous material-free state with the corresponding upper limit range to determine the working condition of the corresponding vacuum suction nozzle in the continuous material-free state, and the control device determines the working condition of the corresponding vacuum suction nozzle in the material-available state to the material-free state based on the waveform of the real-time flow value in the material-available state to the material-free state.

Preferably, the component processing apparatus further includes: at least one or more motion components configured to cooperate with the vacuum nozzle to cause the vacuum nozzle to pick up or drop a component; the control device is also configured to collect the action signal of the action component, and determine which state the vacuum suction nozzle is in the continuous material-free state and the material-free alternating state or which state the vacuum suction nozzle is in the continuous material-free state and the material-free state is switched to based on the collected action signal of the action component and the real-time flow value of the vacuum suction nozzle. Therefore, by combining the real-time flow value acquired by the flowmeter and the action signals of all the action parts, the working conditions of all the vacuum suction nozzles, including abnormal conditions and normal conditions, can be analyzed very accurately. The abnormal condition of the needle can be analyzed and prompted according to the abnormal reason of the vacuum, and the health condition can be evaluated according to the normal condition, so that the abnormal hidden danger can be discovered in time.

Therefore, when the equipment track induction system is applied to the component processing device, the vacuum flow in the existing component processing device can be controlled, the vacuum management scheme is practically improved, and the production management capacity is improved.

Example 3:

in one embodiment, the present invention also provides an equipment rail sensing system comprising: one or more controlled components;

In an embodiment, the controlled component in the equipment rail induction system is a vacuum suction nozzle, the monitoring device is a displacement sensor, the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to each displacement sensor, acquire a real-time displacement value of each displacement sensor, and determine a working condition of the corresponding vacuum suction nozzle based on the acquired real-time displacement value of each displacement sensor and the corresponding upper limit range and/or lower limit range, the upper computer processes the real-time displacement value of each displacement sensor acquired by the control device into a displacement curve graph representing a real-time action condition of the vacuum suction nozzle, and analyzes an operating state of the equipment according to the action condition of the vacuum suction nozzle determined by the control device.

Based on the above-mentioned equipment track induction system, the invention provides an example that the equipment track induction system is applied to a component processing device, and the equipment track induction system monitors the implantation stroke of a vacuum nozzle of the component processing device, and the jitter amount and time in the implantation process.

In one embodiment, the monitoring device comprises two displacement sensors, probes of the two displacement sensors are arranged oppositely, the vacuum suction nozzle is linked with the elastic sheet, the elastic sheet is arranged between the probes of the two displacement sensors, when the vacuum suction nozzle is driven to vibrate up and down, the elastic sheet moves back and forth between the probes of the two displacement sensors, and the two displacement sensors monitor the displacement value of the elastic sheet in real time.

The probe of each displacement sensor is a field source of an electromagnetic field generated by the probe, the elastic sheet is arranged in a coverage area of the electromagnetic field, when the elastic sheet approaches to one probe of the displacement sensor from far to near, the magnetic field intensity of the electromagnetic field generated by the displacement sensor is reduced from large, and the attenuation degree of the magnetic field intensity of the electromagnetic field is also increased from small to large;

the control device calculates real-time displacement values of the elastic pieces and the probes of the displacement sensors according to a functional relation presented by the distance between the elastic pieces and each displacement sensor probe and the magnetic field intensity of the electromagnetic field generated by the elastic pieces, the upper computer receives the real-time displacement values and processes the real-time displacement values into a continuous displacement curve graph, and the continuous displacement curve graph represents the real-time displacement values of the vertical vibration of the vacuum suction nozzle.

In one embodiment, at least one vacuum suction nozzle is driven to alternately reciprocate between a first position and a second position, the vacuum suction nozzle is respectively provided with a corresponding upper limit range and/or a corresponding lower limit range for representing displacement at the first position and the second position, the displacement sensor can provide real-time displacement values in periods of the vacuum suction nozzle alternating between the first position and the second position, the control device compares the highest value of the displacement of the real-time displacement values in each period of the first position and the second position alternating with the corresponding upper limit range, compares the lowest value of the displacement of the real-time displacement values in each period of the first position and the second position alternating with the corresponding lower limit range, determines the working condition of the corresponding vacuum suction nozzle at the first position and the second position alternating, and compares the highest value of the real-time displacement values in the first position with the corresponding upper limit range to determine the working condition of the corresponding vacuum suction nozzle at the first position; alternatively, the first and second electrodes may be,

the control device compares the maximum value of the displacement of the real-time displacement value when the vacuum suction nozzle is at the first position with the corresponding upper limit range to determine the working condition of the corresponding vacuum suction nozzle when the vacuum suction nozzle is at the first position, and the control device determines the working condition of the corresponding vacuum suction nozzle when the vacuum suction nozzle is at the first position to the second position based on the curve of the real-time displacement value when the vacuum suction nozzle is switched from the first position to the second position.

In one embodiment, the vacuum nozzle comprises at least one or more driving components configured to act in cooperation with the vacuum nozzle to cause the vacuum nozzle to pick up or drop a component; the control device is also configured to collect the action signal of the driving component, and determine that the vacuum suction nozzle is at the position based on the collected action signal of the driving component and the real-time displacement value of the vacuum suction nozzle.

The following describes the process of monitoring the vacuum nozzle 080 of the device processing apparatus by using the apparatus rail induction system of the present invention with reference to fig. 9, wherein 010-electromagnet, 020-electromagnet shaft, 030-first catch, 040-second catch, 050-shrapnel, 060-cushion, 070-coupler, 080-vacuum nozzle, 090-spring; 0100-sensor probe A; 0110-sensor Probe B.

Referring to fig. 9, the implantation portion of the component processing apparatus includes a vacuum suction nozzle 080 and an electromagnet 010 coaxially linked with the vacuum suction nozzle 080, the electromagnet 010 is installed on a first stopper 030, an electromagnet shaft 020 of the electromagnet 010 penetrates through the first stopper 030 and further penetrates through a second stopper 040 arranged opposite to the first stopper 030, one end, close to the second stopper 040, of the electromagnet shaft 020 is connected with one end of the suction nozzle 080 through a coupling 070, a spring 090 is further arranged between the coupling 070 and the second stopper 040, a metal elastic sheet 050 is further arranged on the electromagnet shaft 020, the metal elastic sheet 050 is close to one end of the electromagnet 010, cushion pads 060 are further arranged on two sides of the metal elastic sheet 050 respectively, a sensor probe is arranged on each of the first stopper 030 and the second stopper 040, two sensor probes (sensor probe a and sensor probe B) are arranged oppositely, and the metal elastic sheet connected to the electromagnet shaft 020 moves between the two sensor probes. When the electromagnet 010 receives an action signal, the electromagnet drives the vacuum suction nozzle 080 to move upwards (taking the figure as an example, wherein the upward direction or the downward direction is both described by referring to the principle in the direction of the figure, and cannot be understood as the limitation on the movement direction), at this time, the spring 090 is placed between the coupler 070 and the second baffle 040 and is compressed, and the electromagnet 010 moves upwards to enable the metal elastic piece 050 to be closer to the sensor probe a on the first baffle 030, at this time, the magnetic field strength of the electromagnetic field in the detection range of the sensor probe a on the first baffle 030 attenuates, the sensor probe a on the first baffle 030 sends a signal representing the magnetic field strength of the electromagnetic field to the control device, the control device converts the signal into a real-time displacement value of the vacuum suction nozzle 080 at this time and sends the real-time displacement value to the upper computer, and the upper computer receives the real-time displacement value and processes the real-time displacement value into a continuous displacement graph, and the continuous displacement graph represents the real-time displacement value of the vertical vibration of the vacuum suction nozzle.

In the above case, the vacuum suction nozzles 080 are driven upward so that the spring plates 050 are close to the first shutter 030, and the positions where the spring plates 050 are close to the vacuum suction nozzles 080 of the first shutter 030 are referred to as first positions, and correspondingly, the positions where the spring plates 050 are close to the vacuum suction nozzles 080 of the second shutter 040 are referred to as second positions. Then, the vacuum nozzle 080 is driven to reciprocate alternately between a first position and a second position, in which the vacuum nozzle 080 is provided with a corresponding upper range and/or lower range indicative of displacement, respectively, and the corresponding upper range and/or lower range is entered into the control device. When the vacuum suction nozzle 080 moves to the first position, the control device records the real-time displacement value of the vacuum suction nozzle 080 at this moment, compares the real-time displacement value with the upper limit range and/or the lower limit range corresponding to the recorded first position, if the real-time displacement value is within the upper limit range and/or the lower limit range corresponding to the first position, the suction nozzle 080 is indicated to operate well, and if the real-time displacement value exceeds the upper limit range and/or the lower limit range, the suction nozzle 080 does not move in place, so that the equipment needs to be overhauled. The situation when the vacuum nozzle 080 is driven to the second position is similar to when it is in the first position, and therefore, the situation when the vacuum nozzle 080 is in the second position will not be described, and can be analyzed in conjunction with fig. 9 and the above description.

Meanwhile, the control device also sends the recorded real-time displacement value to the upper computer in real time, the upper computer updates and generates a continuous displacement curve graph in real time according to the real-time displacement value, and records an upper limit range and/or a lower limit range corresponding to the first position and an upper limit range and/or a lower limit range corresponding to the second position into the upper computer, so that whether the suction nozzle 080 acts in the range can be directly observed from the displacement curve graph of the upper computer, the continuous displacement curve graph also represents the conversion condition of the suction nozzle 080 in the first position and the second position, when the suction nozzle 080 acts stably, the continuous displacement curve graph is similar to the waveform of a sine function, certainly, when the suction nozzle 080 moves at a high speed, some micro jitter also exists in the waveform of the sine function, but the action of the suction nozzle can be determined to be normal as long as the real-time displacement value does not exceed the range.

When the upper computer records and displays a displacement curve chart representing the vacuum suction nozzle 080, a large amount of data can be used as data support for the upper computer to estimate the cause of the bad movement of the suction nozzle, a set of fault analysis logic can be established in the upper computer system according to the data, and the logic is used for guiding the equipment to be overhauled and maintained.

It should be noted that, in the process of high-speed reciprocating motion of the implantation portion vacuum suction nozzle 080, micro invisible vibration occurs when the implantation portion vacuum suction nozzle 080 reaches the upper and lower suction end faces due to the problems of inertia, or collision with baffle impurities, and the like, and in the high-precision suction action, the micro vibration can cause the problem that components are not implanted in place in the process of implanting the component packaging carrier tape in the component processing device, and the component can collide with the baffle when moving forwards along with the packaging carrier tape due to the fact that the component is not implanted in place, so that the component is scratched to cause defects. The monitoring system of the invention can be applied to the implant vacuum suction nozzle 080 to monitor the motion state of the implant vacuum suction nozzle 080, and whether the micro-vibration amount and the vibration time of the implant vacuum suction nozzle 080 exceed the range is analyzed on the basis of the monitoring result, so that the condition of bad products is avoided or reduced, and one or more problems in the prior art are solved.

Example 4:

with the above embodiment, the track motion sensing system of the invention can monitor the material implantation condition in real time, and therefore, based on the above embodiment, the invention further provides an automation device.

Referring to fig. 8, which shows a flow chart of a material handling process, a packaging process of an automation device according to the present invention can be described with reference to fig. 8, where the material packaged in the automation device may include various components, and in one embodiment, the material may be used as an instructional work flow chart of the component handling process. The flow chart shown in fig. 8 is explained below:

the flowchart shown in fig. 8 can be divided into the following processes: process 1: obtaining a carrier tape for packaging the components through a carrier tape feeding device; step 2, feeding the components through a component feeding device; and 3, process: implanting components into the carrier tape by a component processing device; and 4, process: and packaging the carrier tape implanted with the components through the material packaging device. The sequence of the process 1 and the process 2 is not sequential, and generally, the process 1 and the process 2 are parallel for the production efficiency. One or more detection procedures can be set in the process 1, the process 2 or the process 3 according to the requirements, and the detection procedures are mainly used for detecting the appearance and the electrical performance of the components. Of course, the detection process cannot be set in the process 4, and the defects can be controlled at the front end of production only by detection before packaging, so that the error correction cost is reduced, and the production efficiency is improved.

In one embodiment, the process 1 requires that the carrier tape for packaging the components is prepared by matching the master tape and the lower adhesive tape (the carrier tape can be directly purchased under the support of the production cost budget), and the carrier tape is provided with a containing groove for containing the components.

In an embodiment, the process 2 is for loading, the packaged components need to be loaded to a designated position and then fed (feeding is a previous step of implanting the components in the process 3, that is, feeding is a preparation work for implanting the components into the carrier tape), the components can be subjected to appearance detection and electrical performance detection before and after feeding, and the components are stored in a defective box after detecting defective products, and a worker determines whether the defective products are really defective or not for the second time.

In one embodiment, the process 3 is to implant the components into the storage grooves of the carrier tape one by one, before or after the implantation, the components can be subjected to appearance detection and electrical performance detection, the defects detected before the implantation can be directly discharged, and the defects detected after the implantation can be taken out of the storage grooves.

In an embodiment, the process 4 is to package the carrier tape into which the component is implanted, at this time, a tape can be provided, the carrier tape is packaged by the tape, and the finished product tape is obtained after the packaging is completed.

In order to improve the efficiency of material packaging, automatic equipment for each operation step can be developed by starting from the four processing procedures, so that the automation of the operation step is realized. Further, it is necessary to develop a suitable sub-device or mechanism for the sub-step in each step to automate the sub-step. For example, for process 1, since the process includes three sub-steps of supplying a master tape, supplying a lower tape, attaching a lower tape, and the like, it may be necessary to develop three sub-devices or mechanisms for the above three sub-steps. Of course, these automation devices for the individual steps can also be integrated in order to automate the entire process of packaging materials. The present invention is based on the above inventive concept, and the following description will exemplarily describe an automation device and a whole set of automation equipment for each operation step according to various embodiments.

Material loading device (Carrier band loading device)

In one embodiment, the invention provides a material loading device, which is mainly used for completing loading of a carrier tape. Which is capable of transporting the carrier tape to a subsequent station for receiving a subsequent operation.

The material loading device can be called as a carrier tape loading device, can be used as a loading device of a component processing device, and conveys an unloaded carrier tape to the component processing device to complete the implantation of components, and at the moment, the subsequent station is a material implantation station. Of course, the material loading device described in this embodiment may also be used as a loading device of other material handling devices, and this embodiment is not particularly limited.

In an embodiment, referring to fig. 8, the carrier tape feeding device according to the present invention includes two feeding devices, one feeding device is used to feed a mother tape, and the other feeding device is used to feed a bottom tape (it should be noted that the mother tape is a plastic strip and is provided with a through hole, the shape and size of the through hole is adapted to the shape and size of the component to be packaged, the bottom tape is attached to one side of the mother tape, and the bottom tape covers the through hole on the mother tape, so that the mother tape with the bottom tape attached to one side forms a carrier tape capable of packaging the component), after the two feeding devices feed, the mother tape and the bottom tape are simultaneously conveyed to a bottom pressing station, the bottom tape is attached to one side surface of the mother tape at the bottom pressing station, the bottom pressing device is provided at the bottom pressing station, and the bottom pressing device reciprocates up and down in cooperation with a certain temperature to press the bottom pressing tape and the mother tape, thereby obtaining the carrier tape. The lower pressing device can comprise an electrified instant heating type soldering iron (called 'electric soldering iron' for short), the electric soldering iron is connected with the electromagnet, the electric soldering iron is driven by the electromagnet to reciprocate up and down to complete pressing action, in practical application, a proper heating temperature of the electric soldering iron is selected according to the materials and the characteristics of the lower adhesive tape and the mother tape, a proper pressing time is set, in order to ensure firm pressing, the lower adhesive tape stays on the lower adhesive tape for a certain time in the pressing process, a certain lower pressure is applied to the adhesive tape to ensure the adhesion of the lower adhesive tape and the mother tape, and the component processing device obtains a carrier tape for packaging components from a first front end processing line, and a containing groove is formed in the carrier tape.

In one embodiment, the master tape and the lower adhesive tape are both roll-shaped materials, the master tape roll and the lower adhesive tape roll are respectively fixed on stations reserved on the rack, the master tape and the lower adhesive tape roll are conveyed to a lower pressing station, and then the lower adhesive tape roll is adhered to the master tape through the lower pressing device, so that the carrier tape is obtained.

In one embodiment, the carrier tape loading device further comprises a carrier tape driving part, and the carrier tape driving part conveys the prepared carrier tape to a subsequent station.

In one embodiment, if the carrier tape is directly provided without processing through the master tape and the lower tape, the carrier tape loading device of the invention may only include one carrier tape driving part, and the carrier tape is loaded to the material implanting station through the carrier tape driving part.

The material loading attachment that this embodiment provided can regard as a component part, constitutes whole set of automation equipment use with component loading attachment, component processing apparatus and material packaging device integration together. When the material loading device is used as a component of the whole set of automation equipment, the material loading device loads the carrier tape into the component processing device to receive subsequent loading operation, and the specific process can refer to the relevant content of the automation equipment in the subsequent embodiment.

Of course, the material feeding device can also be used as a feeding device of other types of material processing devices.

Component feeding device

In one embodiment, the present invention provides a device loading apparatus, which can store, load, and feed devices one by one to convey the devices to a subsequent station to receive a subsequent operation.

The component feeding device can be used as a feeding device of a component processing device, so that components are conveyed into the component processing device, and at the moment, the subsequent station is a material implantation station on the component processing device. Of course, the component feeding device may also be used as a feeding device for other component handling devices, and the embodiment is not particularly limited.

The component feeding device in the embodiment of the invention can be used for realizing the scattering of concentrated materials, the scattered materials can be sequentially arranged in a single row, the preparation for feeding is ready for the subsequent materials to be implanted into the carrier tape, after the materials are sequentially arranged in the single row, the detection device can be arranged for sequentially carrying out electrical performance detection (the electrical performance detection can comprise two resistance detections and one capacitance detection) on each component, and if the defective products are detected, the defective products are discharged into the corresponding storage box. Implanting detection device in components and parts loading attachment can be at the material loading in-process to the accuse components and parts quality to with bad control before accomodating, reduce the cost of doing over again. Of course, the detection device may not be implanted in the component feeding device, only the storage, feeding and feeding of the components are completed in the feeding process, the screening process of the electrical performance detection is performed in the subsequent process, and the stage of the electrical performance detection can be determined according to the actual integrated structure of the component processing device.

In one embodiment, the component feeding device provided by the invention can comprise a hopper, a material vibration disc and a material transmission rail, wherein one end of the hopper is communicated with a feeding hole of the material vibration disc, a discharging hole of the material vibration disc is connected with the material transmission rail, the material vibration disc is also provided with a sensor, the sensor can monitor the material quantity in the material vibration disc, if the material quantity is not enough, the hopper is controlled to feed materials into the material vibration disc, and the hopper is controlled to stop feeding materials after the material quantity is set. The material vibration dish can arrange the material single file on the material transmission track through mechanical vibration. Wherein, the hopper is used for storage components and parts, material vibration dish can sort the material through the vibration, and the material transmission track then can be carried the material list and make things convenient for the pan feeding.

In an embodiment, if a detection process is implanted in the component feeding device, the detection device may be inversely installed below the material conveying track (the installation position is related to the detection method, in this embodiment, the detection device is inversely installed mainly because a probe extends from bottom to top during electrical performance detection to detect whether the resistance and capacitance performance is qualified, so the detection device is inversely installed below the material conveying track, and when the material is conveyed to a detection station (in this embodiment, the detection station coincides with a station where the material is conveyed by the material conveying track), the detection device performs electrical performance detection on the material.

In an embodiment, the detecting device of the present invention may include three detecting processes, wherein two detecting processes may be resistance detection and the other detecting process may be capacitance detection (certainly, the two detecting processes may be redistributed, and this embodiment only provides an example to illustrate the problem, and does not limit the present invention).

In one embodiment, the detection device is described as including three detection members, each corresponding to a detection process. For example, the first detection part and the second detection part for detecting the resistance respectively comprise two detection probes, when a component is monitored at a detection station, the detection probes extend out and penetrate into a target detection part of the component, the resistance value of the resistance is obtained from the target detection part, whether the electrical property of the detected component is qualified or not is judged, if the electrical property is qualified, the next detection procedure is carried out, and if the electrical property is not qualified, the component is discharged into a corresponding defective product storage box. The third detection component for capacitance detection comprises two detection probes, the detection probes are the same as the resistance detection probes, the detection probes are required to pierce into a target capacitance detection part of the component, a capacitance value is obtained from the target detection part, whether the electrical property of the detected component is qualified or not is judged, if the electrical property of the detected component is qualified, the next detection procedure is carried out, and if the electrical property of the detected component is unqualified, the component is discharged into a corresponding defective product storage box. The components passing through the three detection processes are conveyed to a material implantation station on a material conveying track. Through the mode of screening layer by layer, the poor control is at the front end of accomodating, and the quality of the finished product is guaranteed.

The component feeding device provided by the embodiment can be used as an assembly part and integrated with the carrier tape feeding device, the component processing device and the material packaging device to form a whole set of automatic equipment for use. When the component feeding device is used as a component of the whole set of automation equipment, the component feeding device feeds components into the component processing device to receive subsequent loading operation, and the specific process can refer to the relevant content of the automation equipment in the subsequent embodiment.

Of course, the component feeding device can also be used as a feeding device of other types of material processing devices. Such as other material loading devices, etc.

Component processing device

The invention provides a component processing device which can realize the picking, transferring, detecting and implanting of components and convey carrier bands for implanting the components to a subsequent station to receive subsequent operation.

The component processing device can be used as a feeding device of a material packaging device, so that a carrier tape with implanted components to be packaged is conveyed into the material packaging device, and at the moment, the subsequent station is an upper pressing station of the material packaging device. Of course, the component handling apparatus may also be used as a loading apparatus for other component handling apparatuses, and the embodiment is not particularly limited.

The component processing device that this embodiment provided receives the carrier band of carrier band loading attachment material loading, also receives the component of component loading attachment material loading simultaneously, and component processing device's main function is to implant the component to the carrier band promptly, but in order to guarantee product quality, has still increased the detection function in component processing device, and the purpose is just to control badly at the production front end, reduces the cost of doing over again.

And a material implantation station is arranged in the component processing device, and the loaded components are implanted into the carrier tape at the material implantation station. The electrical performance detection process can also be completed together with the material implantation station. Of course, in order to ensure the quality, the electrical performance detection can be carried out in the component feeding process and the material implantation station, so that the probability of implanting the damaged material is greatly reduced.

The process of packaging the component into the receiving slot in the carrier tape by the component processing apparatus has been described in detail in embodiment 1, and is not described herein again with reference to fig. 1 to 5.

In one embodiment, the component processing apparatus 100 further includes a carrier tape driving unit (not shown). The carrier tape driving part drives the carrier tape 300 to pass through an implanting part of the component processing equipment and drives the carrier tape to continuously move forwards to reach an appearance detection station on an equipment machine table after the components are implanted into the carrier tape, the appearance detection station is provided with a detection window, an image detection device is arranged right above the detection window, the detection window is provided with an amplification lens, the amplification lens can amplify the components in the accommodating groove, the image detection device can conveniently identify the images of the components, the image detection device is used for carrying out appearance inspection and positioning inspection on the components, the components are determined to be qualified in appearance and correctly accommodated in the accommodating groove with the front face upward, if the components are detected to be unqualified in appearance or incorrect in positioning, the carrier tape is continuously moved forwards to a screening station, a push-pull plate is arranged on the screening station, after the unqualified components are moved to the screening station, the push-pull plate is started to take out the unqualified components, and if the components are not detected to be unqualified, the carrier tape passes through the screening station and continuously moves to the next station.

The component processing device provided by the embodiment can be used as an assembly part and integrated with the carrier tape feeding device, the component feeding device and the material packaging device to form a whole set of automatic equipment for use. When the component processing device is used as a component of the whole set of automation equipment, the component processing device loads the carrier tape containing the components to the material packaging device to receive subsequent packaging operation, and the specific process can refer to the relevant content of the automation equipment in the subsequent embodiment.

Of course, the component processing apparatus may be used as a loading apparatus of other types of material processing apparatuses, and may also be put into production as a single component processing device, which is not particularly limited herein.

Material packaging device

In one embodiment, the invention provides a material packaging device, which mainly packages a carrier tape containing components, and the packaged carrier tape is made into a material roll.

The material packaging device can be used as the next packaging device of the component processing device, and the carrier tape processed by the component processing device is packaged, coiled, terminated and labeled to finally obtain a finished product coil. Of course, the material packaging device described in this embodiment may also be used as a packaging device for other material handling devices, and this embodiment is not limited in particular.

In an embodiment, referring to fig. 8, the material packaging apparatus of the present invention needs to package the carrier tape containing the components, that is, a feeding device is further needed to supply a tape (the tape is used to package the carrier tape, that is, the tape is attached to the other side of the mother tape to complete component packaging), and the material packaging apparatus attaches the tape to a side surface of the carrier tape, so as to package the components.

In one embodiment, the material packaging device comprises an upper pressing device, the upper pressing device is arranged on an upper pressing station, an upper adhesive tape supplied by the feeding device and a carrier tape supplied by the component processing device are conveyed to the upper pressing station, and packaging of the carrier tape is completed on the upper pressing station (the upper adhesive tape seals the carrier tape).

In one embodiment, a next station of the screening station in the component processing apparatus may be connected to the upper press-fit station, and the carrier tape supplied from the component processing apparatus is conveyed to the upper press-fit station at the screening station. The upper pressing device arranged at the upper pressing station can comprise an electrified instant heating type soldering iron (called electric soldering iron for short), the electric soldering iron is connected with the electromagnet, the electric soldering iron is driven by the electromagnet to reciprocate up and down to adhere the upper adhesive tape to the carrier tape, the upper adhesive tape is used for packaging the carrier tape after the pressing action is finished, a finished material tape is obtained, and the carrier tape driving part drives the finished material tape to continuously move to the next station.

In one embodiment, the material packaging device is further provided with a material rolling station, the finished material belt is moved to the material rolling station from the upper pressing station, the material rolling station is provided with a tail label feeding device and an automatic material rolling device, the tail label feeding device feeds a tail label to the material rolling station, the automatic material rolling device automatically winds the finished material belt into a roll through a roller, the material roll is obtained after the roll reaches a set length/thickness, and the automatic material rolling device pastes the tail label to the end of the material roll to obtain the finished material roll after packaging is completed.

In one embodiment, a labeling station is further arranged on the material packaging device, the packaged finished material roll is conveyed to the labeling station, a labeling device and a scanning device are arranged at the labeling station, the labeling device attaches a nameplate on a reel of the finished material roll, and the scanning device scans and detects whether a bar code on the nameplate can be correct. Of course, the nameplate can be attached manually or identified by a machine matched sensor.

The material packaging device provided by the embodiment can be used as a component part, and is integrated with the component feeding device, the material feeding device and the component processing device to form a whole set of automatic equipment for use. When the material packaging device is used as a component of the whole set of automation equipment, the material packaging device receives materials from the component processing device and packages the materials. Of course, the material feeding device can also be used as other types of material processing devices, and is not particularly limited herein according to the packaging requirements.

Automation device

The invention provides an automatic device which can continuously and automatically complete the operations of feeding, arranging, packaging, coiling and the like of components, thereby greatly improving the processing efficiency of materials.

In one embodiment, the automation equipment provided by the invention comprises a rack, and a material loading device, a component processing device and a material packaging device which are integrally installed on the rack. Wherein:

the material loading device is used for loading the carrier tape to the component processing device;

the component feeding device is used for feeding components to the component processing device;

the component processing device is arranged in the accommodating groove of the carrier tape and conveys the carrier tape accommodating the components to the material packaging device;

the material packaging device packages, rolls, finishes and labels the carrier tape containing the components, and finally, a finished material roll which can be sold externally is manufactured.

It should be noted that the material loading device, the component processing device, and the material packaging device are not necessarily completely independent in structure, and some or several structural components may be reused among the devices. Correspondingly, the processing stations in each device are not necessarily completely staggered in spatial position, and some stations may be partially or even completely overlapped. The structure is multiplexed and the stations are overlapped so as to save production space and shorten production transfer routes, for example, the feeding stations in the component feeding device can be multiplexed as detection stations.

It should be particularly noted that in some embodiments, the present invention provides only one type of transfer member that is not only capable of reciprocating between the devices to transfer a carrier tape from one device to another, but that is also accessible within the devices to effect transfer of a carrier tape between processing stations within the devices. In these embodiments, the carrier tape driving component mentioned in the present invention refers specifically to the transfer component, and certainly, in order to improve the processing efficiency of the automation equipment, multiple sets of transfer components may be provided, and the multiple sets of transfer components operate in parallel, so that the automation equipment can simultaneously package materials of multiple carrier tapes, and certainly, at the same time, the carrier tapes are located at different stations to receive different operations, thereby ensuring that the carrier tapes do not interfere with each other and are not misplaced.

In other embodiments, the interior of each device is provided with separate internal transfer elements as needed, which are moved only within the device to effect transfer of the carrier tape between the processing stations within the device. The machine table or the rack is additionally provided with an external transfer component, and the external transfer component can move back and forth among the devices, so that the carrier tape is transferred from one device to another device. In these embodiments, the transfer mechanism of the present invention includes an inner transfer member and an outer transfer member within each device, and the carrier tape is transported by the carrier tape drive unit.

The material loading device in the automation equipment in the embodiment of the present invention is the material loading device in the embodiment of the present invention, and since the detailed description has been given to the specific structure and the working process of the material loading device in the foregoing, detailed description is omitted here, and reference is made to the related description in the embodiment of the present invention. In addition, it should be noted that, when the following description is provided for the material loading device, the description of the components in the material loading device is not repeated, and please refer to the related description in the above embodiment directly.

It should be noted that in other embodiments, manual loading is used to load the carrier tape into the material implantation station. Therefore, in these embodiments, the automatic apparatus in the embodiments of the present invention is not equipped with the material feeding device. The device only comprises a component feeding device, a component processing device and a material packaging device which are arranged on a rack, and can sequentially complete the processing operation of components.

The component feeding device in the automation equipment in the embodiment of the present invention is the component feeding device in the above embodiment of the present invention, and since the specific structure and the working process of the component feeding device have been described in detail in the foregoing, detailed description is omitted here, and reference is made to the related description in the above embodiment.

The component processing apparatus in the automation device in the embodiment of the present invention is the component processing apparatus in the above embodiment of the present invention, and since the specific structure and the working process of the component processing apparatus have been described in detail in the foregoing, no further description is given here, and reference is made to the related description in the above embodiment.

The material packaging device in the automation equipment in the embodiment of the present invention is the material packaging device in the above embodiment of the present invention, and since the detailed description has been given to the specific structure and the working process of the material packaging device in the foregoing, detailed description is omitted here, and reference is made to the related description in the above embodiment.

Each functional device in the automation equipment provided by the invention can be split, recombined, replaced or deleted according to the actual application environment, but the basic function of the automation equipment is still not influenced.

In an embodiment, the real-time motion monitoring system of the present invention may be applied to an automation apparatus of the present invention, such as a vacuum nozzle of a component processing device, and further such as a soldering iron in an upper pressing device of a material packaging device, to monitor the displacement and motion of a measured object, so as to ensure stable operation of important parts of the apparatus and ensure production yield.

In this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, which may include other elements not expressly listed in addition to those listed.

In this document, the terms front, back, upper and lower are used to define the components in the drawings and the positions of the components relative to each other, and are used for clarity and convenience of the technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims. The features of the embodiments and embodiments described herein above may be combined with each other without conflict. The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. An equipment track motion sensing system, comprising:

the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to the monitoring device, acquire a real-time state parameter value of the monitoring device, and determine the action condition of the material implantation mechanism based on the acquired real-time state parameter value and the corresponding upper limit range and/or lower limit range;

2. The device track motion sensing system of claim 1,

a strip-shaped channel is formed on the track base frame, and the supporting piece is accommodated in the channel;

the support piece comprises an elastic sheet, the elastic sheet is provided with an elastic arm, a connecting arm and a transition arm, the transition arm is connected with the elastic arm and the connecting arm, the connecting arm is fixedly connected with the bottom of the channel, the transition arm supports the elastic arm to be suspended, the carrying track is formed on the elastic arm of the elastic sheet, and when the material is placed in the carrying belt on the carrying track, the elastic arm of the elastic sheet corresponding to the material position is compressed downwards.

3. The device track motion sensing system of claim 2,

the material implanting mechanism comprises one or more implanting vacuum nozzles;

the monitoring device comprises a displacement sensor, the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to the displacement sensor, acquire a real-time displacement value of the displacement sensor, determine the working condition of the implanted vacuum suction nozzle based on the acquired real-time displacement value and the corresponding upper limit range and/or lower limit range, process the real-time displacement value acquired by the control device into a displacement curve graph representing the real-time action condition of the implanted vacuum suction nozzle by the upper computer, and determine the running state of the action condition analysis equipment of the implanted vacuum suction nozzle according to the control device.

4. The device track motion sensing system of claim 3,

the monitoring device comprises two displacement sensors, probes of the two displacement sensors are arranged oppositely, the implanted vacuum suction nozzle is linked with an elastic sheet, the elastic sheet is arranged between the probes of the two displacement sensors, when the implanted vacuum suction nozzle is driven to vibrate up and down, the elastic sheet moves back and forth between the probes of the two displacement sensors, and the two displacement sensors monitor the displacement value of the elastic sheet in real time;

when the elastic sheet approaches to one probe of the displacement sensor from far to near, the magnetic field intensity of the electromagnetic field generated by the displacement sensor is reduced from large to small, and the attenuation degree of the magnetic field intensity of the electromagnetic field is also increased from small to large;

the control device calculates real-time displacement values of the spring plate and the probes of the displacement sensors according to a functional relation presented by the distance between the spring plate and each displacement sensor probe and the magnetic field intensity of an electromagnetic field generated by the spring plate, the upper computer processes the real-time displacement values into a continuous displacement curve graph after receiving the real-time displacement values, and the continuous displacement curve graph represents the real-time displacement values of the vertical vibration of the implanted vacuum suction nozzle.

5. The device track motion sensing system of claim 4,

at least one implanted vacuum suction nozzle is driven to reciprocate alternately between a first position and a second position, the implanted vacuum suction nozzle is positioned at the first position and the second position and is respectively provided with a corresponding upper limit range and/or a corresponding lower limit range for representing displacement, the displacement sensor can provide real-time displacement values in periods of the implanted vacuum suction nozzle alternating between the first position and the second position, the control device compares the highest value of the displacement of the real-time displacement values in each period of the first position and the second position with the corresponding upper limit range, compares the lowest value of the displacement of the real-time displacement values in each period of the first position and the second position with the corresponding lower limit range, determines the working condition of the corresponding implanted vacuum suction nozzle under the first position and the second position alternately, and compares the highest value of the displacement of the real-time displacement values in the first position with the corresponding upper limit range to determine the working condition of the corresponding implanted vacuum suction nozzle under the first position; alternatively, the first and second electrodes may be,

it still includes:

6. The device track motion sensing system of claim 2, wherein the monitoring means comprises a sensor probe, the control means comprises a digital displacement device, and the sensor probe is in signal communication with the digital displacement device;

the sensor probe is arranged opposite to the elastic arm and is arranged below the elastic arm, when the elastic arm is compressed downwards, the distance between the sensor probe and the lower surface of the elastic arm is shortened, the sensor probe monitors the actual displacement of the elastic arm, the digital displacement device compares the actual displacement with the standard displacement and outputs a switching value signal according to the comparison result so as to control the action of the material implanting mechanism;

the upper computer is connected with the digital displacement device, the digital displacement device converts the actual displacement into an actual displacement value, and the actual displacement value is processed by the upper computer into a displacement curve graph to be displayed on a display interface.

7. The device track motion sensing system of claim 2,

the control device is also configured to send action control signals to one or more actuators;

the monitoring device is also configured to monitor the actions of one or more corresponding executing mechanisms respectively and send action induction signals to the single chip microcomputer according to the actions of the executing mechanisms;

the upper computer is also configured to receive a time sequence action signal obtained by the processing of the single chip microcomputer and output the time sequence action signal as a real-time action time sequence oscillogram;

the actuating mechanism receives after the action control signal, according to the action control signal makes the action, monitoring device monitors actuating mechanism's real-time action condition, and is in actuating mechanism sends action sensing signal when making the action, the singlechip will action sensing signal processing does actuating mechanism's chronogenesis actuating signal, the host computer will real-time action chronogenesis oscillogram compares with standard action chronogenesis oscillogram, in order to obtain real-time action chronogenesis oscillogram is relative the unusual action condition of standard action chronogenesis oscillogram to the analysis unusual action reason.

8. The device track motion sensing system of claim 7, wherein the actuator comprises a turntable of the component handler, the turntable comprising a plurality of grooves disposed on an edge, the turntable being driven to rotate during operation such that the grooves on the turntable are rotated one by one below an implantation vacuum nozzle of the component handler;

when the turntable is driven to rotate, the monitoring device sends an action sensing signal to the single chip microcomputer according to the action of the turntable, the single chip microcomputer processes the action sensing signal into a time sequence action signal, and the upper computer processes the time sequence action signal into a real-time action time sequence oscillogram of the turntable;

the upper computer compares the real-time action time sequence oscillogram of the turntable with the standard action time sequence oscillogram of the turntable to obtain the abnormal action condition of the real-time action time sequence oscillogram of the turntable relative to the standard action time sequence oscillogram of the turntable,

and if the real-time action of the turntable is abnormal, the upper computer analyzes the reason of the abnormal action of the turntable.

9. The device track motion sensing system of claim 8,

the actuator further comprises the implantation vacuum nozzle;

when the turntable is driven to rotate, one groove on the turntable is rotated to the position below the implantation vacuum suction nozzle, the turntable stops rotating, the implantation vacuum suction nozzle is driven to move towards the groove, and the implantation vacuum suction nozzle resets after the implantation vacuum suction nozzle implants the adsorbed component into the groove;

when the turntable is driven to rotate, the carrier tape is driven to move simultaneously, so that each groove is communicated with one vacant accommodating groove, when the implantation vacuum suction nozzle moves downwards, a component adsorbed by the implantation vacuum suction nozzle is implanted into the accommodating groove from the groove, an elastic arm of an elastic sheet below the accommodating groove is compressed downwards, and the sensor probe monitors the displacement of the elastic arm in real time;

when the turntable is driven to rotate, the monitoring device sends an action induction signal to the single chip microcomputer according to the action of the turntable; after the turntable is driven to rotate in place, the implanted vacuum suction nozzle starts to act under the control of an action control signal of the control device, and the monitoring device monitors the real-time action condition of the implanted vacuum suction nozzle and sends an action sensing signal when the implanted vacuum suction nozzle acts; after the implantation vacuum suction nozzle completes the implantation action of the component, the control device controls the implantation vacuum suction nozzle to reset, and after the implantation vacuum suction nozzle resets, the turntable is driven to rotate again, so that the next groove on the turntable is rotated to the position below the reset implantation vacuum suction nozzle.

10. The device track motion sensing system according to claim 9, wherein when the component is implanted into the receiving slot by the implanting vacuum nozzle, the single chip obtains a motion sensing signal according to a sensor probe for monitoring a displacement of the elastic arm of the elastic piece, and the control device controls a carrier tape driving part for driving the carrier tape to move so as to move the carrier tape, so that the receiving slot for the component to be implanted on the carrier tape is moved to a position below the implanting vacuum nozzle, and the receiving slot for the component to be implanted is moved to a subsequent packaging station;

the action induction signals of the turntable and the action induction signals of the implanted vacuum suction nozzle, which are obtained by monitoring of the monitoring device, are synchronously acquired by the single chip microcomputer and then are arranged into time sequence action signals according to a time sequence, the single chip microcomputer sends the time sequence action signals to an upper computer, and the upper computer analyzes the time sequence action signals to obtain a real-time action time sequence oscillogram representing the turntable and the implanted vacuum suction nozzle;

the upper computer is used for comparing the real-time action time sequence oscillogram with the standard action time sequence oscillogram so as to obtain the abnormal action condition of the real-time action time sequence oscillogram relative to the standard action time sequence oscillogram and analyzing the reason of the abnormal action.

11. The device track motion sensing system of claim 1,

the material implantation mechanism comprises one or more implantation vacuum suction nozzles;

the monitoring device comprises one or more flow meters, and each flow meter is configured to monitor a real-time status parameter value of one implanted vacuum nozzle corresponding to the flow meter;

the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to each flowmeter, acquire a real-time flow value of each flowmeter, determine the working condition of the corresponding vacuum suction nozzle based on the acquired real-time flow value of each flowmeter and the corresponding upper limit range and/or lower limit range, process the real-time flow value of each flowmeter acquired by the control device into a flow curve diagram representing the real-time action condition of the vacuum suction nozzle by the upper computer, and analyze the running state of the equipment according to the action condition of the vacuum suction nozzle determined by the control device.

12. The device track motion sensing system of claim 11,

at least one vacuum suction nozzle is provided with a continuous material-free state and a material-free alternating state, each state of the vacuum suction nozzle is provided with a corresponding upper limit range and/or lower limit range, the flowmeter can provide a real-time flow value in each period of the material-free alternating state, the control device compares the highest value of the real-time flow value in each period of the material-free alternating state with the corresponding upper limit range, compares the lowest value of the real-time flow value in each period of the material-free alternating state with the corresponding lower limit range, and determines the working condition of the corresponding vacuum suction nozzle in the material-free alternating state, and the control device compares the highest value of the real-time flow value in the continuous material-free state with the corresponding upper limit range, and determines the working condition of the corresponding vacuum suction nozzle in the continuous material-free state; alternatively, the first and second liquid crystal display panels may be,

it still includes:

13. An automated machine comprising a machine track motion sensing system according to any one of claims 1 to 12;

it still includes material loading attachment, components and parts processing apparatus and material packaging hardware, material loading attachment is used for carrying out the material loading to the carrier band of packing components and parts, components and parts loading attachment is used for realizing the material loading to components and parts, components and parts processing apparatus be used for with components and parts implant extremely in the groove of accomodating of carrier band, material packaging hardware is used for realizing packing the carrier band of accomodating components and parts.

14. An automated apparatus according to claim 13, wherein the component handling apparatus comprises:

a machine platform;

the rotary table is arranged on the machine table, driven to rotate when in work and comprises a plurality of grooves arranged on the edge;

the feeding part comprises one or more feeding vacuum suction nozzles arranged on the machine table;

the discharging part comprises one or more discharging vacuum suction nozzles arranged on the machine table, and a plurality of grooves positioned on the edge of the turntable sequentially pass through the feeding vacuum suction nozzles and the discharging vacuum suction nozzles when the turntable rotates;

a detection device;

an implantation portion comprising one or more implantation vacuum nozzles;

a carrier tape driving part which drives a carrier tape through the implanting part, wherein the carrier tape comprises a plurality of accommodating grooves arranged in a row; and

wherein the implantation vacuum suction nozzle is communicated with a vacuum pump through a pipeline, the feeding vacuum suction nozzle is communicated with the vacuum pump through a pipeline, the discharging vacuum suction nozzle is controlled by a pipeline to be selectively communicated with one of the vacuum pump and the air outlet pump,

the feeding vacuum suction nozzle sucks components into a groove at the feeding vacuum suction nozzle through vacuum suction, the components in the groove of the turntable can be detected by the detection device, the discharging vacuum suction nozzle adsorbs the components which are normally detected into the groove at the discharging vacuum suction nozzle through the vacuum suction, the discharging vacuum suction nozzle blows out the components which are abnormally detected from the groove at the discharging vacuum suction nozzle through blowing thrust, and the implanting vacuum suction nozzle sucks the components in the groove at the implanting vacuum suction nozzle through the vacuum suction and implants the components into a receiving groove of the carrier tape;

the feeding part also comprises a feeding track, a separation needle and a positioning detector, the feeding track, the separation needle and the positioning detector are arranged on the machine table, the separation needle is controlled to move between a blocking position and an opening position, components on the feeding track are blocked when the separation needle is at the blocking position, the feeding vacuum suction nozzle sucks the components on the feeding track into a groove at the feeding vacuum suction nozzle through vacuum suction when the separation needle is at the opening position, and the positioning detector is configured to detect whether the components enter the groove at the feeding vacuum suction nozzle;

the implantation part further comprises an implantation driving part which drives the implantation vacuum suction nozzle to reciprocate between a material taking position and an implantation position, the implantation vacuum suction nozzle is used for sucking components in the groove at the implantation vacuum suction nozzle position when the material taking position is reached, and the sucked components are implanted into the accommodating groove of the carrier tape when the material taking position is reached.