CN115072052A

CN115072052A - Material implantation mechanism vertical material adjusting system and automatic material packaging equipment

Info

Publication number: CN115072052A
Application number: CN202210862198.9A
Authority: CN
Inventors: 黄德根
Original assignee: Suzhou Yousideng Internet Of Things Technology Co ltd
Current assignee: Suzhou Yousideng Internet Of Things Technology Co ltd
Priority date: 2021-09-18
Filing date: 2022-07-20
Publication date: 2022-09-20
Anticipated expiration: 2042-07-20
Also published as: CN115072052B

Abstract

The invention discloses a material implanting mechanism vertical material adjusting system and automatic material packaging equipment, wherein the vertical material adjusting system comprises: the first controller is used for adjusting the action of the material implanting mechanism; the digital monitoring device is used for monitoring the action condition of the material implantation mechanism and acquiring a signal representing the action state of the material implantation mechanism; the second controller forms information interaction with the digital monitoring device, and sets target parameters through a human-computer interaction interface; the digital monitoring device analyzes and processes the signals obtained by monitoring the digital monitoring device and the target parameters to obtain the deviation amount between the real-time action state of the material implanting mechanism and the normal action state set by the target parameters, and if the deviation amount exceeds a preset range, the first controller controls and adjusts the action of the material implanting mechanism according to the signals sent by the digital monitoring device. The adjusting system provided by the invention can be used for adaptively adjusting the action of the mechanism, so that the manual intervention is reduced, and the phenomenon of material standing is reduced.

Description

Material implantation mechanism vertical material adjusting system and automatic material packaging equipment

Technical Field

The invention relates to the field of self-adaptive system adjustment of automatic equipment, in particular to a vertical material adjusting system of a material implanting mechanism and automatic material packaging equipment.

Background

The existing automatic packaging equipment needs to implant materials into a packaging groove of a packaging belt in the operation process, and then the packaging belt moves the materials carried by the packaging belt to the next station under the driving of the equipment. An implantation mechanism for implanting materials in existing automatic packaging equipment comprises a suction nozzle, inertia and shaking exist in the driving of the mechanical structure, so that the problem that various materials are not implanted in place always occurs due to the action problem of the mechanical structure in the material implantation process, for example, the materials are not completely implanted into a packaging groove, and the materials are scratched and collided in the moving process of a packaging belt, even the equipment is clamped, so that the faults are caused; for another example, the material is placed in the packaging groove in an incorrect posture, and the material is contained in the packaging groove in a side-standing or upside-down posture and may be stuck in the packaging groove, which may cause inconvenience in taking, or may deform the shape of the packaging groove by squeezing, or may cause inconvenience in subsequent packaging work.

Therefore, the action of the material implanting mechanism is required to be adjusted in time, the action adjustment of the existing material implanting mechanism is adjusted by technicians according to experience, and no specific data management and control exists, so that the problems of material standing and the like in the actual production process are caused to be frequent. And the action adjustment of the material implanting mechanism relates to factors such as the stroke of the inserting part, the installation distance, the sensor parameters and the like, the professional degree is high during abnormal adjustment, special tools such as an oscilloscope and the like are needed, and the overall adjustment efficiency is low.

Based on this, should monitor the adjustment to positions such as material implantation of current automatic equipment for the action condition of implanting the mechanism can be monitored in real time, the action when implanting the mechanism appears great deviation and just adjusts in real time immediately when leading to the material to implant the precursor that does not put in place, prevent suffering from in the bud, avoid the shut down problem many times that big deviation leads to, make the action that the mechanism was implanted to the material can be monitored, guarantee that the material is implanted in-process material and can implant in place in the packaging groove, prevent that the material is passive bad.

Therefore, it is necessary to provide a new technical solution to solve the problems in the prior art.

Disclosure of Invention

The invention aims to solve the defects in the prior art and provides a material vertical adjusting system of a material implanting mechanism and automatic material packaging equipment. The invention adopts the following specific scheme:

a material is implanted mechanism and is found material governing system, it includes:

a first controller configured to effect adjustment of the motion of the material implantation mechanism;

the digital monitoring device is configured to monitor the action condition of the material implanting mechanism and obtain a signal representing the action state of the material implanting mechanism;

the second controller is configured to form information interaction with the digital monitoring device, and is provided with a human-computer interaction interface, target parameters are set through the human-computer interaction interface, and the target parameters represent action parameter standard values of normal actions of the material implantation mechanism;

the target parameters are stored in the digital monitoring device, the digital monitoring device analyzes and processes the signals obtained by monitoring the digital monitoring device and the target parameters to obtain the deviation amount between the real-time action state of the material implanting mechanism and the normal action state set by the target parameters, if the deviation amount exceeds a preset range, the digital monitoring device sends a signal to the first controller, and the first controller controls and adjusts the action of the material implanting mechanism according to the signal to realize the self-adaptive adjustment of the material implanting action of the material implanting mechanism.

The technical scheme is further that the material implanting mechanism comprises an implanting vacuum suction nozzle, the implanting vacuum suction nozzle is driven to place the implanting vacuum suction nozzle on an implanting station from materials adsorbed by a material absorbing station, a carrier belt for packaging the materials is arranged on the implanting station, a containing groove is formed in the carrier belt, and the implanting vacuum suction nozzle implants the materials into the containing groove.

Furthermore, the material implanting mechanism further comprises an implanting driving part for driving the implanting vacuum suction nozzle, the implanting driving part is connected with the implanting vacuum suction nozzle, and when the implanting driving part is controlled by the first controller to perform action adjustment, the implanting vacuum suction nozzle connected with the implanting driving part is driven to perform implantation action adjustment, so that self-adaptive dynamic adjustment of the implanting vertical material action of the implanting vacuum suction nozzle is realized.

Furthermore, the digital monitoring device comprises a displacement sensor, and the displacement sensor is used for monitoring the action amplitude of the implanted vacuum suction nozzle to obtain a real-time action amplitude value.

Further, the target parameters set through the human-machine interface comprise a standard value of the action amplitude of the implanted vacuum suction nozzle and an allowable deviation range of the standard value of the action amplitude.

Furthermore, the digital monitoring device also comprises a data memory, the target parameters are stored in the data memory, and the real-time motion amplitude value of the implanted vacuum suction nozzle obtained by monitoring of the displacement sensor is stored in the data memory.

Further, the digital monitoring device further comprises a data processor, the data processor performs logic comparison and analysis on the real-time action amplitude value and the action amplitude standard value to obtain a deviation value between the real-time action amplitude value and the action amplitude standard value, the deviation value represents the action deviation degree of the real-time action and the standard action of the implanted vacuum suction nozzle, if the deviation value is smaller than or equal to the allowable deviation range of the action amplitude standard value, the action of the implanted vacuum suction nozzle is represented to be normal, no implantation action causing the material to stand inside the accommodating groove exists, and the first controller maintains the action state of the material implanting mechanism.

Furthermore, if the deviation amount is larger than the allowable deviation range of the action amplitude standard value, the action abnormality of the implanted vacuum nozzle is represented, and there is an implantation action which causes the material to stand inside the accommodating groove, the digital monitoring device sends an adjustment signal to the first controller to realize the self-adaptive action adjustment of the material implantation mechanism, and the digital monitoring device continuously monitors the action amplitude of the implanted vacuum nozzle until the deviation amount between the real-time action amplitude value of the implanted vacuum nozzle and the action amplitude standard value is smaller than or equal to the allowable deviation range of the action amplitude standard value.

Furthermore, the data storage device is internally stored with preset deviation adjusting time, if the adjusting time of the implantation driving part is longer than the preset deviation adjusting time, and the implantation action of the implantation vacuum suction nozzle is still in an abnormal action state, the digital monitoring device sends an abnormal action signal obtained by monitoring to the first controller, the first controller controls equipment to stop according to the abnormal action signal, the first controller sends the abnormal action signal to the second controller, and the second controller receives the abnormal action signal and then displays alarm information through the man-machine interaction interface.

Furthermore, the real-time action amplitude value of the implanted vacuum suction nozzle obtained by monitoring of the displacement sensor is processed and output by the digital monitoring device to be a real-time action amplitude value curve graph and/or a real-time action amplitude value which is displayed on the human-computer interaction interface.

Furthermore, the second controller sends an instruction to the digital monitoring device, and the digital monitoring device stores and sends the real-time action amplitude value of the implanted vacuum suction nozzle monitored by the displacement sensor into the second controller.

Further, the second controller comprises a data processing module, and the data processing module processes the received real-time motion amplitude value into a real-time motion amplitude value graph to be displayed on the human-computer interaction interface.

Based on the material implanting mechanism vertical material adjusting system, the invention also provides automatic material packaging equipment which comprises the material implanting mechanism vertical material adjusting system, a material feeding device, a component processing device and a material packaging device, wherein the material feeding device is used for feeding a carrier tape for packaging components, the component feeding device is used for feeding the components, the component processing device is used for implanting the components into a containing groove of the carrier tape, and the material packaging device is used for packaging the carrier tape containing the components; the material implanting mechanism vertical material adjusting system is used for adaptively adjusting the action of a material implanting mechanism in the automatic material packaging equipment, and the material implanting mechanism vertical material implanting action is adaptively adjusted.

Compared with the prior art, the invention has one or more of the following beneficial effects:

1. the invention provides a vertical material adjusting system of a material implanting mechanism, which can monitor the action of the material implanting mechanism through a digital monitoring device, analyze the action of the material implanting mechanism according to an action monitoring signal, send a control signal to a first controller through the digital monitoring device if the action of the material implanting mechanism is abnormal through analysis, and perform self-adaptive adjustment on the material implanting mechanism according to the control signal by the first controller. Therefore, compared with manual adjustment in the prior art, the adjusting system can realize self-adaptive adjustment of the real-time monitoring system, and the effect of the prevention and control measures is higher than that of the existing adjustment which is stopped when the user is wrong.

2. The material implanting mechanism vertical material adjusting system provided by the invention can perform waveform display on the action of the material implanting mechanism, more intuitively see the action amplitude change of the material implanting mechanism, summarize the change rule, has research and analysis significance, and can summarize the action change rule of the material implanting mechanism through the rule of the waveform image, so that the prejudgment significance is achieved, the phenomenon of insufficient action is avoided in advance, and the problem of shutdown faults is reduced.

3. The vertical material adjusting system of the material implanting mechanism provided by the invention can carry out digitization and accurate setting on control parameters on a human-computer interface of the second controller, realize real-time monitoring on the mechanism action, optimally control the equipment action and reduce the generation of vertical materials.

4. If the vertical material adjusting system of the material implanting mechanism provided by the invention is applied to equipment, full-automatic waveform adjustment can be realized only through a human-computer interaction interface when an operator corrects the action of the equipment, the efficiency is high, the requirement on the skill of the operator is low, the labor cost is reduced, and the adjustment precision is reliable without manual intervention in the adjustment process.

5. The invention also provides an automatic material packaging device based on the material placement mechanism vertical adjustment system, which not only has an action self-adaptive adjustment system, but also has a carrier tape feeding device, a component processing device and a material packaging device, wherein the carrier tape feeding device is used for feeding a carrier tape for packaging components, the component feeding device is used for feeding the components, the component processing device is used for implanting the components into a receiving groove of the carrier tape, and the material packaging device is used for packaging the carrier tape containing the components, so that the automatic material packaging device not only has the advantage of avoiding the material placement phenomenon through action self-adaptive adjustment, but also can meet the requirements of a whole packaging process to realize automatic packaging, the labor cost is reduced, and the production efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic top view of a component handling apparatus of the present invention in one embodiment, with some components not shown;

fig. 2 is a side view of a part of the structure of the component processing apparatus in fig. 1, in which only the relevant part of the structure of the material inlet part is schematically shown;

fig. 3 is a side view of a part of the structure of the component processing apparatus in fig. 1, in which only the relevant part of the structure of the discharging part is schematically shown;

fig. 4 is an enlarged side view of a part of the structure of the component processing apparatus in fig. 1, in which only the relevant part of the structure of the implant is schematically shown;

FIG. 5 is a schematic view of a gas passage structure of the component processing apparatus shown in FIG. 1;

FIG. 6 is a schematic block diagram of a material placement mechanism material placement adjustment system according to one embodiment of the present invention;

fig. 7 is a schematic flow chart of the material handling process of the automatic material packaging equipment in one embodiment of the invention.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.

The detailed description of the present invention is presented primarily in terms of procedures, steps, logic blocks, processes, or other symbolic representations that directly or indirectly simulate operations of aspects of the present invention. Those skilled in the art will be able to utilize the description and illustrations herein to effectively introduce other skilled in the art to their working essence.

Reference herein to "one embodiment" or "an embodiment" means that a feature, structure, or characteristic described in connection with the embodiment can be included in at least an implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Furthermore, the order of blocks in a method, flowchart or functional block diagram representing one or more embodiments is not a fixed order, refers to any particular order, and is not limiting of the present invention.

Example 1

The action adjustment of the existing material implanting mechanism is adjusted by technicians according to experience without specific data management and control, so that the problems of material standing and the like in the actual production process are caused to be more. And the action adjustment of the material implanting mechanism relates to factors such as the stroke of the inserting part, the installation distance, the sensor parameters and the like, the professional degree is high during abnormal adjustment, special tools such as an oscilloscope and the like are needed, and the overall adjustment efficiency is low. In order to solve the problems, the invention provides a material standing adjusting system of a material implanting mechanism, which realizes the action self-adaptive adjustment by using the system on a bag measuring machine, can realize the full-automatic waveform adjustment by an operator through the command setting of a human-computer interaction interface, has high efficiency and low requirement on the skill of the operator.

It should be noted that the term "material standing" in the material standing regulation system of the material implantation mechanism provided by the invention generally refers to various situations in which the material is not implanted in place, such as various situations of implantation posture error, such as material rollover, material inversion, material inclination, and the like.

The material implanting mechanism material standing adjusting system can comprise: the device comprises a first controller, a digital monitoring device and a second controller. Referring to fig. 6, 01-material implantation mechanism; 011-implanting a vacuum nozzle; 012-an implant drive; 02-a first controller; 03-a digital monitoring device; 031-a displacement sensor; 032 — data storage; 033-a data processor; 04-a second controller; 041-human-computer interaction interface; 042-data processing module.

The first controller 02 in the material implanting mechanism vertical material adjusting system is configured to adjust the action of the material implanting mechanism 01; the digital monitoring device 03 is configured to monitor the action condition of the material implanting mechanism 01, and obtain a signal representing the action state of the material implanting mechanism 01; the second controller 04 is configured to form information interaction with the digital monitoring device 03, and the second controller 04 has a human-computer interaction interface 041, and a target parameter is set through the human-computer interaction interface 041, where the target parameter represents an action parameter standard value of a normal action of the material implanting mechanism 01; the target parameters are stored in the digital monitoring device 03, the digital monitoring device 03 analyzes and processes the signals obtained by monitoring the target parameters and the target parameters to obtain deviation between a real-time action state of the material implanting mechanism 01 and a normal action state set by the target parameters, if the deviation exceeds a preset range, the digital monitoring device 03 sends a signal to the first controller 02, and the first controller 02 controls and adjusts the action of the material implanting mechanism 01 according to the signal to realize the self-adaptive adjustment of the material implanting action of the material implanting mechanism 01.

Therefore, the adjusting system can monitor the action of the material implanting mechanism 01 through the digital monitoring device 03, analyze the action of the material implanting mechanism 01 according to the action monitoring signal, and if the action of the material implanting mechanism 01 is abnormal through analysis, send a control signal to the first controller 02 through the digital monitoring device 03, and the first controller 02 performs adaptive adjustment on the material implanting mechanism 01 according to the control signal. Therefore, compared with manual adjustment in the prior art, the adjusting system can realize self-adaptive adjustment of the real-time monitoring system, and the effect of the prevention and control measures is higher than that of the existing adjustment which is stopped when the user is wrong.

In one embodiment, the material implanting mechanism 01 of the present invention may include an implanting vacuum nozzle 011, the implanting vacuum nozzle 011 being driven to place a material adsorbed from a material sucking station on an implanting station, the implanting station being provided with a carrier tape for packaging the material, the carrier tape being provided with a receiving slot, the implanting vacuum nozzle 011 implanting the material into the receiving slot. Further, the material implanting mechanism 01 further includes an implanting driving part 012 for driving the implanting vacuum nozzle 011, the implanting driving part 012 is connected to the implanting vacuum nozzle 011, and when the implanting driving part 012 is controlled by the first controller 02 to perform operation adjustment, the implanting vacuum nozzle 011 connected thereto is driven to perform implantation operation adjustment, thereby realizing adaptive dynamic adjustment of the implanting material setting operation of the implanting vacuum nozzle 011.

In one embodiment, the digital monitoring device 03 may comprise a displacement sensor 031, and the displacement sensor 031 is configured to monitor the motion amplitude of the implanted vacuum nozzle 011 to obtain a real-time motion amplitude value. The real-time motion amplitude value can represent the motion displacement of the implanted vacuum suction nozzle 011, if the motion displacement is smaller than the standard displacement value, the implantation is not in place, if the motion displacement is larger than the standard displacement value, the implantation is over-positioned, and the two conditions are the situation that the implantation is not in place substantially, and the monitoring and the adjustment are required to be carried out in time.

In one embodiment, the target parameters set by the human-machine interface include a standard value of the actuation amplitude of the implanted vacuum nozzle 011 and an allowable deviation range of the standard value of the actuation amplitude. The human-computer interaction interface 041 can display the mechanism operation in real time in front of the staff, so that better prejudgment monitoring is obtained, the human-computer interface reduces the operation difficulty of the staff, and the adjustment and the change of the equipment mechanism action can be realized through the command setting of the human-computer interface.

In one embodiment, the digital monitoring device 03 further comprises a data memory 032, the target parameter is stored in the data memory 032, and the real-time motion amplitude value of the implanted vacuum nozzle 011, which is monitored by the displacement sensor 031, is stored in the data memory 032. The data storage 032 also serves to store and update other data during the operation of the institution.

In one embodiment, the digital monitoring apparatus 03 further comprises a data processor 033, the data processor 033 logically compares and analyzes the real-time motion amplitude value and the motion amplitude standard value to obtain a deviation amount between the real-time motion amplitude value and the motion amplitude standard value, the deviation amount represents a motion deviation degree between the real-time motion and the standard motion of the implanted vacuum nozzle 011, if the deviation amount is smaller than or equal to an allowable deviation range of the motion amplitude standard value, the implanted vacuum nozzle 011 acts normally, there is no implantation motion causing the material to stand inside the accommodating slot, and the first controller 02 maintains the motion state of the material implanting mechanism 01.

In one embodiment, if the deviation is greater than the allowable deviation range of the operation amplitude standard value, the operation of the implantation vacuum nozzle 011 is characterized to be abnormal, there is an implantation operation that causes the material to stand inside the accommodating groove, the digital monitoring device 03 sends an adjustment signal to the first controller 02 to realize the adaptive operation adjustment of the material implantation mechanism 01, and the digital monitoring device 03 continuously monitors the operation amplitude of the implantation vacuum nozzle 011 until the deviation between the real-time operation amplitude value of the implantation vacuum nozzle 011 and the operation amplitude standard value is monitored to be less than or equal to the allowable deviation range of the operation amplitude standard value.

In one embodiment, a preset deviation adjustment duration is further stored in the data storage 032, if the adjustment duration of the first controller 02 to the implantation driving part 012 is longer than the preset deviation adjustment duration, and the implantation action of the implantation vacuum nozzle 011 is still in an abnormal action state, the digital monitoring device 03 sends an abnormal action signal obtained by monitoring to the first controller 02, the first controller 02 controls the equipment to stop according to the abnormal action signal, the first controller 02 sends the abnormal action signal to the second controller 04, and the second controller 04 displays an alarm message through the man-machine interface 041 after receiving the abnormal action signal. The sending of the alarm information realizes prompt and early warning, does not need real-time monitoring of personnel, automatically monitors equipment, and can automatically alarm and request intervention when manual intervention is needed.

In one embodiment, the real-time motion amplitude value of the implanted vacuum nozzle 011, which is monitored by the displacement sensor 031, is processed by the digital monitoring device 03 and output as a real-time motion amplitude curve graph and/or displayed on the human-computer interface 041. Through the digital or image-shaped data display, the operation action of the mechanism can be judged/pre-judged more intuitively, and the monitoring/pre-judging difficulty of personnel is reduced.

In one embodiment, the second controller 04 sends a command to the digital monitoring device 03, and the digital monitoring device 03 stores and sends the real-time motion amplitude value of the implanted vacuum nozzle 011, which is monitored by the displacement sensor 031, to the second controller 04. Therefore, the second controller 04 is active in receiving the operation data of the mechanism.

In one embodiment, the second controller 04 includes a data processing module 042, and the data processing module 042 processes the received real-time motion amplitude value into a real-time motion amplitude graph to be displayed on the human-computer interaction interface 041.

In one embodiment, the first controller 02 of the material-placement mechanism 01 material-standing adjustment system according to the present invention may be a high-speed control unit, the digital monitoring device 03 may be a multi-channel digital sensor module, and the second controller 04 may be an Programmable Logic Controller (PLC) having a display screen, which may be used as the man-machine interface 041. The digital sensor module can be connected with a communication module of the PLC through one or more of a plurality of communication ports, a worker sets parameters through a display screen of the PLC, data are directly stored in the digital sensor module through interaction of the PLC and the digital sensor module, the PLC sends out an instruction to enable the sensor module to transmit the data to the PLC in real time under a specific interface (an operation interface on the display screen), and real-time action waveforms are displayed on the PLC display screen; according to the set parameters, when the sensor module judges that the equipment is abnormal, the sensor module transmits an abnormal signal to the high-speed control unit, so that the equipment is stopped, alarm information data is transmitted to the PLC, and a waveform is displayed on a PLC display screen; according to the set parameters, when the sensor module analyzes that the mechanism has the vertical material characteristic action, the sensor module monitors the action of the mechanism until the mechanism is stable, and then transmits a next action signal to the high-speed control unit to enable the equipment to perform the next action.

In summary, compared with the prior art, the material placement mechanism material standing adjusting system provided by the invention can be used for digitizing and accurately setting control parameters on a second controller (PLC) human-computer interface, and can also be used for realizing real-time display of suction nozzle action waveforms, abnormal waveform display and the like on the PLC human-computer interface, so as to realize real-time monitoring of mechanism actions, optimal control of equipment actions and reduction of material standing phenomena.

Example 2

Based on the material implanting mechanism material standing adjusting system, the invention demonstrates that the material implanting mechanism material standing adjusting system is applied to a component processing device (belonging to one of the automatic material packaging devices described in embodiment 1), so that the component processing device adopts the adjusting system to complete the self-adaptive adjustment of an action part. It should be noted that, in this document, the term "processing" in the component processing apparatus has a broad meaning, and the component pickup, transfer, inspection, removal, blanking, placement, mounting, and the like can be referred to as the processing of the component. The components herein may include small components such as chips, resistors, capacitors, and the like.

There are many kinds of the component handling apparatuses. Some component processing equipment can pack components into a containing groove in a carrier tape by utilizing the principle of vacuum adsorption, wherein the loading of the components (namely, the picking of the components), the transferring of the components, the detection of the components, the removal of the abnormal components and the implantation of the normal components (namely, the arrangement of the components) are involved, and a plurality of actions are required to be completed through the vacuum adsorption. In addition, some component processing apparatuses are designed not to pack the components into a carrier tape, but to select qualified components and directly load the selected components into a related container, and the operations of the component processing apparatuses include loading of components (i.e., picking up of components), transferring of components, detection of components, removal of components with abnormal detection, and unloading of components with normal detection (i.e., directly loading the selected components into a related container), and the like, and all of the operations are required to be performed by vacuum adsorption. In addition, there are component handling apparatuses for mounting components on a carrier, such as a circuit board, involving the loading of components (i.e., component pickup), component transfer, component mounting, and the like, wherein a plurality of operations are performed by vacuum suction.

The description will be given mainly by taking a component handling apparatus for packaging components in receiving grooves in a carrier tape as an example. It should be apparent that in some embodiments, other component handling apparatuses may employ the same vacuum suction principle, and those skilled in the art may apply the vacuum management scheme described in detail herein to other types of component handling devices (such as component screening apparatuses or component placement apparatuses) according to the teachings herein.

Fig. 1 is a schematic top view of a component handling apparatus 100 according to an embodiment of the present invention, with some components not shown. The component handling apparatus 100 may pack the component 200 into the receiving slot 320 in the carrier tape 300. The component 200 may be a small passive component such as a chip. Before packing components 200 into the accommodating groove 320 in the carrier tape 300, the component processing apparatus 100 can also perform electrical performance detection on the components 200, and the component processing apparatus 100 also needs to eliminate the components 200 with abnormal detection and keep detecting normal components.

As shown in fig. 1 to 5, the component processing apparatus 100 includes a machine table 180, a turntable 120 disposed on the machine table 180, a feeding portion 110, a discharging portion 130, an implanting portion 140, and a detecting device (not shown).

The turntable 120 is driven to rotate in operation, which may be oriented as D2 in fig. 1, and the turntable 120 includes a plurality of grooves 121 disposed on an edge thereof. For simplicity, several recesses 121 are shown in fig. 1 only as an example, which are provided on part of the edge of the turntable 120, in practice, the recesses 121 are provided uniformly on all edge parts of the turntable 120.

Fig. 2 is a side-view enlarged schematic diagram of a partial structure of the component processing apparatus 100 in fig. 1, in which only a relevant partial structure of the material inlet portion 110 is schematically shown. Fig. 5 is a schematic view of a gas passage structure of the component processing apparatus in fig. 1. As shown in fig. 1, 2 and 5, the feeding portion 110 includes a feeding vacuum nozzle 111 disposed on the machine platform 180, a feeding rail 113 disposed on the machine platform 180, a separating needle 112 and a positioning detector 114. The implantation vacuum nozzle 111 is in communication with a vacuum pump 151 (shown in FIG. 5) via a conduit. The separator pin 112 is controlled to move between a blocking position and an open position. The component 200 on the feeding track 113 is blocked when the separating pin 112 is in the blocking position, as shown in fig. 2, when the separating pin 112 is in the blocking position. When the separating needle 112 is in the open position, the top end of the separating needle 112 is lower than or equal to the track surface of the feeding track 113, the feeding vacuum nozzle 111 sucks the component 200 on the feeding track 113 into the groove 121 at the feeding vacuum nozzle 111 through vacuum suction, and then the separating needle 112 returns to the blocking position from the normally open position. The docking detector 114 is configured to detect whether the component 200 enters the recess 121 at the feeding vacuum nozzle 111. When the turntable 120 rotates, the grooves 121 of the turntable 120 sequentially pass through the feeding vacuum suction nozzle 111, and are matched with the reciprocating motion of the separating needle 112 between the blocking position and the opening position, so that the components 200 are adsorbed into the grooves 121 of the turntable 120 one by one.

In one embodiment, the feeding vacuum nozzle 111 is selectively controlled by a pipeline to communicate with one of the vacuum pump and the air outlet pump, when the separating pin 112 of the feeding portion 110 is in the open position, the feeding vacuum nozzle 111 sucks the component 200 on the feeding track 113 by vacuum suction, and if the detecting device detects that the component 200 is an abnormal component, the feeding vacuum nozzle 111 switches from the vacuum state to the air outlet state to blow out the abnormal component; if the detection device detects that the component 200 is a normal component, the feeding vacuum suction nozzle 111 sucks the component 200 into the groove 121 at the feeding vacuum suction nozzle 111 through vacuum suction.

With the rotation of the turntable 120, the detection device can sequentially perform electrical performance detection, such as resistance detection or capacitance detection, on the components 200 adsorbed into the grooves 121 of the turntable 120. For the components 200 that are detected to be abnormal to be excluded from the turntable 120, the bin 130 may be configured to perform the operation of excluding the components 200 that are detected to be abnormal. Of course, the placement unit 130 does not perform the removal operation for the component 200 whose inspection is normal, and it is necessary to suck the component 200 whose inspection is normal.

Fig. 3 is a side-view enlarged schematic diagram of a partial structure of the component processing apparatus 100 in fig. 1, in which only a relevant partial structure of the discharging portion 130 is schematically illustrated. As shown in fig. 1, 3 and 5, the discharging portion 130 includes a discharging vacuum nozzle 131, a receiving chamber 132 and a solenoid valve 133 (shown in fig. 5) disposed on the machine. A first port of the electromagnetic valve 133 is communicated with the discharge vacuum nozzle 131, a second port of the electromagnetic valve 133 is communicated with the vacuum pump 151, and a third port of the electromagnetic valve 133 is communicated with the air outlet pump 135. The solenoid valve 133 is controlled to selectively communicate the first port with one of the second port and the third port. The discharge vacuum nozzle 131 is controlled to selectively communicate with one of the vacuum pump 151 and the air outlet pump 135 through a solenoid valve 133.

For the component 200 with normal detection, the electromagnetic valve 133 enables the discharge vacuum nozzle 131 to communicate with the vacuum pump 151, and the discharge vacuum nozzle 131 adsorbs the component with normal detection in the groove 121 at the discharge vacuum nozzle 131 through vacuum suction. For the abnormal component 200, the electromagnetic valve 133 connects the discharge vacuum nozzle 131 with the air pump 135, the discharge vacuum nozzle 131 blows the abnormal component 200 out of the groove 121 at the discharge vacuum nozzle 131 by the blowing thrust, and the blown component 200 falls into the receiving cavity 132. With the rotation of the turntable 120, the grooves 121 on the edge of the turntable 120 sequentially pass through the discharging vacuum nozzles 131 of the discharging unit 130, and the components 200 detected normally can be retained and the components 200 detected abnormally can be removed by cooperating with the action control of the electromagnetic valve 133.

As shown in fig. 1, three discharge portions 130 are schematically illustrated, the discharge vacuum nozzles of which are respectively designated 131a, 131b and 131c, the receiving chambers of which are respectively designated 132a, 132b and 132c, and the three discharge portions 130 also have three solenoid valves 133. Of course, in other embodiments, one discharge, two discharges or more discharges may be provided, the number of discharges depending on the application and design.

Fig. 4 is an enlarged side view of a part of the structure of the component processing apparatus in fig. 1, in which only the relevant part of the structure of the implant 140 is schematically shown. As shown in connection with figures 1, 4 and 5,

the implant part 140 includes an implant vacuum nozzle 141 and an implant driving part 142. The implantation vacuum nozzle 141 is in communication with a vacuum pump 151 via a conduit. The implanting vacuum nozzle 141 sucks and implants the components 200 located in the grooves 121 at the implanting vacuum nozzle 141 into the receiving grooves 320 of the carrier tape 300 by vacuum suction. The implantation driving part 142 drives the implantation vacuum nozzle 141 to reciprocate between the material-taking position and the implantation position. As shown in fig. 4, the implantation vacuum nozzle 141 is located at a material removal position, and the implantation vacuum nozzle 141 moves downward to an implantation position (not shown). The implanting vacuum nozzle 141 sucks the components 200 in the grooves 121 at the implanting vacuum nozzle 141 at the material taking position, and implants the sucked components 200 into the receiving grooves 320 of the carrier tape 300 at the implanting position.

The component processing apparatus 100 further includes a carrier tape drive unit (not shown). As shown in fig. 1, the carrier tape driving part drives the carrier tape 300 through the implanting part 140. The carrier tape 300 includes a plurality of receiving grooves 320 arranged in a row and carrier tape holes 310 arranged in a row. The carrier tape driving part drives the receiving slots 320 of the carrier tape 300 forward through the carrier tape holes 310 of the carrier tape 300 to pass through the implanting vacuum nozzle 141 in sequence.

As shown in fig. 1, with the rotation of the turntable 120, the grooves 121 on the edge of the turntable 120 sequentially pass through the material feeding vacuum nozzle 111, the material discharging vacuum nozzle 131 and the implanting vacuum nozzle 141, and cooperate with the reciprocating motion of the separating needle 112 between the blocking position and the opening position, the components 200 are adsorbed into the grooves 121 of the turntable 120 one by one, the components 200 detected normally can be retained by cooperating with the action control of the electromagnetic valve 133, the components 200 detected abnormally can be removed, and the components 200 implanted into the grooves 121 on the edge of the turntable 120 can be sequentially placed into the accommodating grooves 320 of the carrier tape 300 by cooperating with the reciprocating motion of the implanting vacuum nozzle 141 and the forward motion of the carrier tape 300.

Therefore, if the material implanting mechanism material standing adjusting system described in embodiment 1 is applied to the component processing device, the action mechanism in the existing component processing device can be controlled, the action of the material implanting mechanism can be adjusted in a self-adaptive manner, the material is implanted in place, the problems of material standing, side turning and the like caused by the action problem of implanting the vacuum suction nozzle are prevented, manual intervention is reduced, and the production management capability is improved.

Example 3

With reference to the foregoing embodiment 1 and embodiment 2, the present invention provides an automatic material packaging device based on the material implanting mechanism vertical material adjusting system, and the automatic material packaging device includes not only the material implanting mechanism vertical material adjusting system, but also a carrier tape feeding device, a component processing device, and a material packaging device, wherein the carrier tape feeding device is used for feeding a carrier tape for packaging components, the component feeding device is used for feeding components, the component processing device is used for implanting the components into a receiving slot of the carrier tape, and the material packaging device is used for packaging the carrier tape receiving the components, so that the automatic material packaging device of the present invention not only has the advantages of the material implanting mechanism vertical material adjusting system, but also can meet the needs of the whole packaging process, realize automatic packing, reduce the cost of labor, improve production efficiency.

Referring to fig. 7, a flow chart of a material handling process is shown, and a packaging process of the automatic material packaging apparatus according to the present invention can be described with reference to fig. 7, where the material packaged in the automatic material packaging apparatus may include various components, and in an embodiment, the material may be used as an instructional work flow chart of a component handling process. The flow chart shown in fig. 7 is explained below:

the flowchart shown in fig. 7 can be divided into the following processes: process 1: obtaining a carrier tape for packaging the components through a carrier tape feeding device; step 2, feeding the components through a component feeding device; and 3, process: implanting components into the carrier tape by a component processing device; and 4, process: and packaging the carrier tape implanted with the components by using the material packaging device. The sequence of the process 1 and the process 2 is not sequential, and generally, the process 1 and the process 2 are parallel for the production efficiency. One or more detection procedures can be set in the process 1, the process 2 or the process 3 according to the requirements, and the detection procedures are mainly used for detecting the appearance and the electrical performance of the components. Of course, the detection process cannot be set in the process 4, and the defects can be controlled at the front end of production only by detection before packaging, so that the error correction cost is reduced, and the production efficiency is improved.

In one embodiment, process 1 requires that the carrier tape for packaging the components (which can be purchased directly under the support of the budget of production cost) is made by matching the master tape and the lower tape, and the carrier tape has accommodating slots for accommodating the components.

In an embodiment, the process 2 is for loading, the packaged components need to be loaded to a designated position and then fed (feeding is a previous step of implanting the components in the process 3, that is, feeding is a preparation work for implanting the components into the carrier tape), the components can be subjected to appearance detection and electrical performance detection before and after feeding, and the components are stored in a defective box after detecting defective products, and a worker determines whether the defective products are really defective or not for the second time.

In an embodiment, the process 3 is to implant the components into the storage grooves of the carrier tape one by one, before or after the components are implanted, the components can be subjected to appearance detection and electrical performance detection, the defects detected before the components are implanted can be directly discharged, and the defects detected after the components are implanted can be taken out of the storage grooves.

In an embodiment, the process 4 is to package the carrier tape on which the component is implanted, at this time, a tape can be provided, the carrier tape is packaged by the tape, and the finished product tape is obtained after the packaging is completed.

In order to improve the efficiency of material packaging, automation equipment for each operation step can be developed by starting from the four processing procedures, so that the automation of the operation step is realized. Further, it is necessary to develop a suitable sub-device or mechanism for the sub-step in each step to automate the sub-step. For example, for process 1, since the process includes three sub-steps of supplying a master tape, supplying a lower tape, attaching a lower tape, and the like, it may be necessary to develop three sub-devices or mechanisms for the above three sub-steps. Of course, these automation devices for the individual steps can also be integrated in order to achieve full process automation of the material encapsulation. The present invention is based on the above inventive concept, and the following description will exemplarily describe the automated apparatus for each operation step and the complete automatic packaging equipment for materials according to various embodiments.

Material loading device (Carrier band loading device)

In one embodiment, the invention provides a material loading device, which is mainly used for completing loading of a carrier tape. Which is capable of transporting the carrier tape to a subsequent station for receiving a subsequent operation.

The material loading device can be called as a loading device of a component processing device, can be used as a loading device of the component processing device, and conveys a no-load carrier tape to the component processing device to complete the implantation of components, and at the moment, the subsequent station is a material implantation station. Of course, the material loading device described in this embodiment may also be used as a loading device of other material handling devices, and this embodiment is not particularly limited.

In one embodiment, referring to fig. 7, the carrier tape feeding device of the present invention includes two feeding devices, one feeding device is used to feed a mother tape, the other feeding device is used to feed a bottom tape (it should be noted that the mother tape is a plastic strip, which is provided with a through hole having a shape and size corresponding to the shape and size of the component to be packaged), the bottom tape is attached to one side of the mother tape, the bottom tape seals the through hole on the mother tape, so that the mother tape with the bottom tape attached to one side forms a carrier tape capable of packaging the component), after the two feeding devices feed, the mother tape and the bottom tape are simultaneously conveyed to a bottom pressing station, the bottom tape is attached to one side surface of the mother tape at the bottom pressing station, the bottom pressing device is arranged at the bottom pressing station, the bottom pressing device reciprocates up and down to match a certain temperature to complete pressing of the bottom tape and the mother tape, and pressing to obtain the carrier tape. The lower pressing device can comprise an electrified instant heating type soldering iron (called electric soldering iron for short), the electric soldering iron is connected with the electromagnet, the electric soldering iron is driven by the electromagnet to reciprocate up and down to complete pressing action, in practical application, an appropriate heating temperature of the electric soldering iron is selected according to the material and the characteristics of the lower adhesive tape and the mother tape, an appropriate pressing time is set, in order to ensure firm pressing, the electric soldering iron stays on the lower adhesive tape for a certain time in the pressing process, a certain pressing force is given to the adhesive tape to ensure the adhesion of the lower adhesive tape and the mother tape, and thus the component processing device obtains a carrier tape which can be used for packaging components from a first front end processing route, and a containing groove is formed in the carrier tape.

In one embodiment, the mother tape and the lower adhesive tape are both roll-shaped materials, the mother tape roll and the lower adhesive tape roll are respectively fixed on stations reserved on the rack, the mother tape and the lower adhesive tape are both conveyed to a lower pressing station, and the lower adhesive tape is adhered to the mother tape through a lower pressing device, so that the carrier tape is obtained.

In one embodiment, the carrier tape loading device further comprises a carrier tape driving part, and the carrier tape driving part conveys the prepared carrier tape to a subsequent station.

In one embodiment, if the carrier tape is directly provided without processing through the master tape and the lower tape, the carrier tape loading device of the invention may only include one carrier tape driving part, and the carrier tape is loaded to the material implanting station through the carrier tape driving part.

The material loading attachment that this embodiment provided can regard as an integral part, constitutes whole set of material automatic packaging equipment to use together with components and parts loading attachment, components and parts processing apparatus and material packaging device integration. When the material loading device is used as a component of the whole set of material automatic packaging equipment, the material loading device loads the carrier tape into the component processing device to receive subsequent loading operation, and the specific process can refer to the related content of the material automatic packaging equipment in the subsequent embodiment.

Of course, the material feeding device can also be used as a feeding device of other types of material processing devices.

Component feeding device

In one embodiment, the present invention provides a component feeding device, which is capable of storing, feeding and feeding components to convey the components one by one to a subsequent station to receive a subsequent operation.

The component feeding device can be used as a feeding device of the component processing device, so that components are conveyed into the component processing device, and at the moment, the subsequent station is a material implantation station on the component processing device. Of course, the component feeding device may also be used as a feeding device for other component handling devices, and the embodiment is not particularly limited.

The component feeding device in the embodiment of the invention can be used for realizing the scattering of concentrated materials, the scattered materials can be sequentially arranged in a single row, the preparation for feeding is well carried out for the subsequent materials implanted into the carrier tape, after the materials are sequentially arranged in the single row, the detection device can be arranged for sequentially carrying out electrical performance detection (the electrical performance detection can comprise two resistance detections and one capacitance detection) on each component, and if the defective products are detected, the defective products are discharged into the corresponding storage boxes. Implanting detection device in components and parts loading attachment can be at the material loading in-process with accuse components and parts quality to before accomodating bad control, reduce the cost of doing over again. Of course, the detection device may not be implanted in the component feeding device, only the storage, feeding and feeding of the components are completed in the feeding process, the screening process of the electrical performance detection is performed in the subsequent process, and the specific stage of the electrical performance detection can be determined according to the actual integrated structure of the component processing device.

In one embodiment, the component feeding device provided by the invention can comprise a hopper, a material vibration disc and a material transmission rail, wherein one end of the hopper is communicated with a feeding hole of the material vibration disc, a discharging hole of the material vibration disc is connected with the material transmission rail, the material vibration disc is also provided with a sensor, the sensor can monitor the material quantity in the material vibration disc, if the material quantity is not enough, the hopper is controlled to feed materials into the material vibration disc, and the hopper is controlled to stop feeding materials after the material quantity is set. The material vibration dish accessible mechanical vibration arranges the material single file on the material transmission track. Wherein, the hopper is used for storage components and parts, material vibration dish can sort the material through the vibration, and the material transmission track then can be carried the convenient pan feeding with the material list.

In an embodiment, if a detection process is implanted in the component feeding device, the detection device may be installed upside down below the material conveying track (the installation position is related to the detection method, in this embodiment, the detection device is upside down, mainly because a probe extends from bottom to top during the electrical performance detection to detect whether the resistance and capacitance performance is qualified, so the detection device is installed upside down below the material conveying track), and when the material is conveyed to a detection station (in this embodiment, the detection station coincides with the material conveying track feeding station), the detection device performs the electrical performance detection on the material.

In an embodiment, the detecting device of the present invention may include three detecting processes, wherein two detecting processes may be resistance detection and the other detecting process may be capacitance detection (certainly, the detecting processes may be redistributed, and this embodiment only provides an example to illustrate the problem, and does not limit the present invention).

In one embodiment, the detection device may include three detection components, and each detection component corresponds to one detection process. For example, the first detection part and the second detection part for detecting the resistance respectively comprise two detection probes, when a component is monitored at a detection station, the detection probes extend out and penetrate into a target detection part of the component, the resistance value of the resistance is obtained from the target detection part, whether the electrical property of the detected component is qualified or not is judged, if the electrical property is qualified, the next detection procedure is carried out, and if the electrical property is not qualified, the component is discharged into a corresponding defective product storage box. The third detection part for capacitance detection comprises two detection probes, is the same as resistance detection, needs to be penetrated into a target capacitance detection part of the component by the detection probes, obtains a capacitance value from the target detection part, judges whether the electrical property of the detected component is qualified or not, enters the next detection procedure if the electrical property of the detected component is qualified, and arranges the component into a corresponding defective storage box if the electrical property of the detected component is unqualified. The components passing through the three detection processes are conveyed to a material implantation station on a material conveying track. Through the mode of screening layer by layer, the poor control is at the front end of accomodating, and the quality of the finished product is guaranteed.

The component feeding device provided by the embodiment can be used as an assembly part and integrated with the carrier tape feeding device, the component processing device and the material packaging device to form a whole set of material automatic packaging equipment for use. When the component feeding device is used as a component of the whole set of material automatic packaging equipment, the component feeding device feeds components into the component processing device to receive subsequent loading operation, and the specific process can refer to the related content of the material automatic packaging equipment in the subsequent embodiment.

Of course, the component feeding device can also be used as a feeding device of other types of material processing devices. Such as other material loading devices, etc.

Component processing device

The invention provides a component processing device which can realize the picking, transferring, detecting and implanting of components and convey carrier bands for implanting the components to a subsequent station to receive subsequent operation.

The component processing device can be used as a feeding device of a material packaging device, so that a carrier tape with implanted components to be packaged is conveyed into the material packaging device, and at the moment, the subsequent station is an upper pressing station of the material packaging device. Of course, the component handling apparatus may also be used as a loading apparatus for other component handling apparatuses, and the embodiment is not particularly limited.

The component processing device that this embodiment provided receives the carrier band of carrier band loading attachment material loading, also receives the component of component loading attachment material loading simultaneously, and component processing device's main function is to implant the component to the carrier band promptly, but in order to guarantee product quality, has still increased the detection function in component processing device, and the purpose is just to control badly at the production front end, reduces the cost of doing over again.

And a material implantation station is arranged in the component processing device, and the loaded components are implanted into the carrier tape at the material implantation station. The electrical performance detection process can also be completed together with the material implantation station. Of course, in order to ensure the quality, the electrical performance detection can be carried out in the component feeding process and the material implantation station, so that the probability of implanting the damaged material is greatly reduced.

In embodiment 2, the process of packaging the component into the receiving slot in the carrier tape by the component processing apparatus has been described in detail, and is not described herein again with reference to fig. 1 to 5.

In one embodiment, the component processing apparatus 100 according to the present invention further includes a carrier tape driving unit (not shown). The carrier tape driving part drives the carrier tape 300 to pass through an implanting part of the component processing equipment, the carrier tape is driven to continuously move forwards to reach an appearance detection station on an equipment machine table after the components are implanted into the carrier tape, the appearance detection station is provided with a detection window, an image detection device is arranged right above the detection window, the detection window is provided with an amplification lens, the amplification lens can amplify the components in the accommodating groove, the image detection device can conveniently identify the images of the components, the image detection device can carry out appearance inspection and swing inspection on the components, the components are determined to be qualified in appearance and correctly accommodated in the accommodating groove with the front face upwards, if the appearance of the components is detected to be unqualified or the swing position is not correct, any carrier tape continuously moves forwards to a screening station, the screening station is provided with a push-pull plate, and when the unqualified components are moved to the screening station, and opening the push-pull plate to take out unqualified components, and if the defects of the components are not detected, enabling the carrier belt to pass through the screening station and continue to move to the next station.

The component processing device provided by the embodiment can be used as an assembly part and integrated with the carrier tape feeding device, the component feeding device and the material packaging device to form a whole set of material automatic packaging equipment for use. When the component processing device is used as a component of the whole set of material automatic packaging equipment, the component processing device loads the carrier tape containing the components to the material packaging device to receive subsequent packaging operation, and the specific process can refer to the related content of the material automatic packaging equipment in the subsequent embodiment.

Of course, the component processing apparatus may be used as a loading apparatus of other types of material processing apparatuses, and may also be put into production as a single component processing device, which is not particularly limited herein.

Material packaging device

In one embodiment, the present invention provides a material packaging apparatus, which is mainly used for packaging a carrier tape containing components, and the packaged carrier tape is made into a material roll.

The material packaging device can be used as the next packaging device of the component processing device, and the carrier tape processed by the component processing device is packaged, coiled, terminated and labeled to finally obtain a finished product coil. Of course, the material packaging device described in this embodiment may also be used as a packaging device for other material handling devices, and this embodiment is not particularly limited.

In an embodiment, referring to fig. 7, the material packaging apparatus of the present invention needs to package the carrier tape containing the components, that is, needs to further have a feeding device for supplying an adhesive tape (the adhesive tape is used to package the carrier tape, that is, the adhesive tape is pasted on the other side of the mother tape to complete component packaging), and the material packaging apparatus pastes the adhesive tape on one side surface of the carrier tape, so as to package the components.

In one embodiment, the material packaging device comprises an upper pressing device, the upper pressing device is arranged on an upper pressing station, an upper adhesive tape supplied by the feeding device and a carrier tape supplied by the component processing device are conveyed to the upper pressing station, and packaging of the carrier tape (adhering the upper adhesive tape to the carrier tape) is completed on the upper pressing station.

In one embodiment, a next station of the screening station in the component processing apparatus may be connected to the upper press-fit station, and the carrier tape supplied from the component processing apparatus is conveyed to the upper press-fit station at the screening station. The upper pressing device arranged at the upper pressing station can comprise an electrified instant heating type soldering iron (called electric soldering iron for short), the electric soldering iron is connected with the electromagnet, the electric soldering iron is driven by the electromagnet to reciprocate up and down to adhere the upper adhesive tape to the carrier tape, the upper adhesive tape is used for packaging the carrier tape after the pressing action is finished, a finished material tape is obtained, and the carrier tape driving part drives the finished material tape to continuously move to the next station.

In one embodiment, the material packaging device is further provided with a material rolling station, the finished material belt is moved to the material rolling station from the upper pressing station, the material rolling station is provided with a tail label feeding device and an automatic material rolling device, the tail label feeding device feeds a tail label to the material rolling station, the automatic material rolling device automatically winds the finished material belt into a roll through a roller, the material roll is obtained after the roll reaches a set length/thickness, and the automatic material rolling device pastes the tail label to the material roll terminal to obtain the packaged finished material roll.

In one embodiment, the material packaging device is further provided with a labeling station, the packaged finished material roll is conveyed to the labeling station, the labeling station is provided with a labeling device and a scanning device, the labeling device attaches a nameplate on a reel of the finished material roll, and the scanning device scans and detects whether a bar code on the nameplate can be correct. Of course, the nameplate can be attached manually or identified by a machine matched sensor.

The material packaging device provided by the embodiment can be used as an assembly part and integrated with the component feeding device, the material feeding device and the component processing device to form a whole set of material automatic packaging equipment for use. When the material packaging device is used as a component of the whole set of material automatic packaging equipment, the material packaging device receives materials from the component processing device and packages the materials. Of course, the material feeding device can also be used as other types of material processing devices, and is not particularly limited herein according to the packaging requirements.

Automatic material packaging equipment

The invention provides automatic material packaging equipment which can continuously and automatically complete the operations of feeding, arranging, packaging, coiling and the like of components, thereby greatly improving the processing efficiency of materials.

In one embodiment, the automatic material packaging equipment comprises a rack, and a material feeding device, a component processing device and a material packaging device which are integrally installed on the rack. Wherein:

the material loading device is used for loading the carrier tape to the component processing device;

the component feeding device is used for feeding components to the component processing device;

the component processing device is arranged in the accommodating groove of the carrier tape and conveys the carrier tape accommodating the components to the material packaging device;

the material packaging device packages, rolls, finishes and labels the carrier tape containing the components, and finally, a finished material roll which can be sold externally is manufactured.

It should be noted that the material loading device, the component processing device, and the material packaging device are not necessarily completely independent in structure, and some or several structural components may be reused among the devices. Correspondingly, the processing stations in each device are not necessarily completely staggered in spatial position, and some stations may be partially or even completely overlapped. The structure is multiplexed, the stations are overlapped, so that the production space is saved, the production transfer route is shortened, and for example, the feeding stations in the component feeding device can be multiplexed into the detection stations.

It should be particularly noted that in some embodiments, the present invention provides only one type of transfer member that is not only capable of reciprocating between the devices to transfer a carrier tape from one device to another, but that is also accessible within the devices to effect transfer of a carrier tape between processing stations within the devices. In these embodiments, the carrier tape driving component mentioned in the present invention refers specifically to the transfer component, and certainly, in order to improve the processing efficiency of the automatic material packaging equipment, multiple sets of transfer components may be provided, and the multiple sets of transfer components operate in parallel, so that the automatic material packaging equipment can simultaneously package materials of multiple carrier tapes, and certainly, at the same time, the carrier tapes are located at different stations to receive different operations, thereby ensuring that mutual dislocation is not interfered.

In other embodiments, the interior of each device is provided with separate internal transfer elements as needed, which move only within the device to effect transfer of the carrier tape between the processing stations within the device. An external transfer member is additionally arranged on the machine table or the rack, and the external transfer member can reciprocate among the devices so as to transfer the carrier tape from one device to another device. In these embodiments, the transfer mechanism of the present invention includes an inner transfer member and an outer transfer member within each device, and the carrier tape is transported by the carrier tape drive unit.

The material loading device in the automatic material packaging equipment in the embodiment of the present invention is the material loading device in the embodiment of the present invention, and since the detailed description has been given above on the specific structure and the working process of the material loading device, the detailed description is omitted here, and reference is made to the related description in the embodiment of the present invention. In addition, it should be noted that, when the following description is made on the material loading device, it is not necessary to introduce each component part therein, and please refer to the related description in the above embodiments directly.

It should be noted that in other embodiments, the carrier tape is manually loaded to the material implantation station. Therefore, in these embodiments, the automatic material packaging equipment in the embodiments of the present invention is not equipped with the material feeding device. The device only comprises a component feeding device, a component processing device and a material packaging device which are arranged on a rack, and can sequentially complete the processing operation of components.

The component feeding device in the automatic material packaging equipment in the embodiment of the present invention is the component feeding device in the above embodiment of the present invention, and since the specific structure and the working process of the component feeding device have been described in detail in the foregoing, detailed description is omitted here, and reference is made to the related description in the above embodiment.

The component processing device in the automatic material packaging equipment in the embodiment of the present invention is the component processing device in the above embodiment of the present invention, and since the specific structure and the working process of the component processing device have been described in detail in the foregoing, details are not described here, and reference is made to the related description in the above embodiment.

The material packaging device in the automatic material packaging equipment in the embodiment of the present invention is the material packaging device in the above embodiment of the present invention, and since the specific structure and the working process of the material packaging device have been described in detail in the foregoing, detailed description is omitted here, and reference is made to the related description in the above embodiment.

Each functional device in the automatic material packaging equipment provided by the invention can be detached, recombined, replaced or deleted according to the actual application environment, but the basic function of the automatic material packaging equipment is still not influenced.

In an embodiment, the adaptive adjustment system of the present invention may be applied to the automatic material packaging apparatus of the present invention, for example, a vacuum suction nozzle of a component handling device, and further, for example, a soldering iron in an upper pressing device of a material packaging device, so as to monitor the displacement and the movement of a measured object, to ensure stable operation of important parts of the apparatus, and to ensure production yield.

As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed. In this document, the terms front, back, upper, lower and the like in the drawings are used for the sake of clarity and convenience only for the components are located in the drawings and the positions of the components relative to each other. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims. The features of the embodiments and embodiments described herein above may be combined with each other without conflict. The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. The utility model provides a mechanism founds material governing system is implanted to material which characterized in that, it includes:

the second controller is configured to form information interaction with the digital monitoring device, and is provided with a human-computer interaction interface, target parameters are set through the human-computer interaction interface, and the target parameters represent action parameter standard values of normal actions of the material implanting mechanism;

the target parameters are stored in the digital monitoring device, the digital monitoring device analyzes and processes the signals obtained by monitoring the digital monitoring device and the target parameters to obtain the deviation value of the real-time action state of the material implanting mechanism and the normal action state set by the target parameters, if the deviation value exceeds a preset range, the digital monitoring device sends a signal to the first controller, and the first controller controls and adjusts the action of the material implanting mechanism according to the signal to realize the self-adaptive adjustment of the implanting material action of the material implanting mechanism.

2. The material implanting mechanism material standing regulating system of claim 1,

the material implanting mechanism comprises an implanting vacuum suction nozzle, the implanting vacuum suction nozzle is driven to place materials adsorbed by a material absorbing station on the implanting station, a carrier belt for packaging the materials is arranged on the implanting station, a containing groove is formed in the carrier belt, and the implanting vacuum suction nozzle implants the materials into the containing groove;

the material implanting mechanism further comprises an implanting driving part used for driving the implanting vacuum nozzle, the implanting driving part is connected with the implanting vacuum nozzle, and when the implanting driving part is controlled by the first controller to perform action adjustment, the implanting driving part is driven by the implanting vacuum nozzle to perform implantation action adjustment, so that self-adaptive dynamic adjustment of the implanting material standing action of the implanting vacuum nozzle is realized.

3. The material implanting mechanism material standing regulating system of claim 2,

the digital monitoring device comprises a displacement sensor, and the displacement sensor is used for monitoring the action amplitude of the implanted vacuum suction nozzle to obtain a real-time action amplitude value;

the target parameters set through the human-computer interface comprise a standard value of the action amplitude of the implanted vacuum suction nozzle and an allowable deviation range of the standard value of the action amplitude;

the digital monitoring device further comprises a data storage, the target parameters are stored in the data storage, and the real-time action amplitude value of the implanted vacuum suction nozzle, which is obtained by monitoring the displacement sensor, is stored in the data storage.

4. The material implanting mechanism material standing regulating system of claim 3,

the digital monitoring device also comprises a data processor, the data processor carries out logic comparison analysis on the real-time action amplitude value and the action amplitude standard value to obtain a deviation value of the real-time action amplitude value and the action amplitude standard value, the deviation value represents the action deviation degree of the real-time action and the standard action of the implanted vacuum suction nozzle, if the deviation value is smaller than or equal to the allowable deviation range of the action amplitude standard value, the action of the implanted vacuum suction nozzle is represented to be normal, no implantation action causing the material to stand inside the accommodating groove exists, and the first controller maintains the action state of the material implanting mechanism;

if the deviation amount is larger than the allowable deviation range of the action amplitude standard value, the action abnormality of the implanted vacuum suction nozzle is represented, the implantation action which causes the material to stand in the accommodating groove exists, the digital monitoring device sends an adjusting signal to the first controller so as to realize the self-adaptive action adjustment of the material implantation mechanism, and the digital monitoring device continuously monitors the action amplitude of the implanted vacuum suction nozzle until the deviation amount of the real-time action amplitude value of the implanted vacuum suction nozzle and the action amplitude standard value is smaller than or equal to the allowable deviation range of the action amplitude standard value.

5. The material implanting mechanism material standing regulating system of claim 4,

the data storage device is internally provided with a preset deviation adjusting time length, if the adjusting time length of the implantation driving part is longer than the preset deviation adjusting time length, and the implantation action of the implantation vacuum suction nozzle is still in an abnormal action state, the digital monitoring device sends an abnormal action signal obtained by monitoring to the first controller, the first controller controls equipment to stop according to the abnormal action signal, the first controller sends the abnormal action signal to the second controller, and the second controller receives the abnormal action signal and then displays alarm information through the man-machine interaction interface.

6. The material implanting mechanism material standing regulating system according to claim 3,

the real-time action amplitude value of the implanted vacuum suction nozzle obtained by monitoring of the displacement sensor is processed and output by the digital monitoring device to be a real-time action amplitude value curve graph and/or a real-time action amplitude value which is displayed on the human-computer interaction interface.

7. The material implantation mechanism stand material adjustment system of claim 6,

the second controller sends an instruction to the digital monitoring device, and the digital monitoring device stores and sends the real-time action amplitude value of the implanted vacuum suction nozzle monitored by the displacement sensor to the second controller;

the second controller comprises a data processing module, and the data processing module processes the received real-time motion amplitude value into a real-time motion amplitude value curve chart and displays the real-time motion amplitude value curve chart on the human-computer interaction interface.

8. An automatic material packaging device, characterized in that the device comprises a material implantation mechanism material adjusting system according to any one of claims 1-7; the material implanting mechanism vertical material adjusting system is used for adaptively adjusting the action of a material implanting mechanism in the automatic material packaging equipment, so that the adaptive adjustment of the implanting vertical material action of the material implanting mechanism is realized;

it still includes material loading attachment, components and parts processing apparatus and material packaging hardware, material loading attachment is used for carrying out the material loading to the carrier band of packing components and parts, components and parts loading attachment is used for realizing the material loading to components and parts, components and parts processing apparatus be used for with components and parts implant extremely in the groove of accomodating of carrier band, material packaging hardware is used for realizing packing the carrier band of accomodating components and parts.