WO2023024564A1

WO2023024564A1 - Housing assembly and electronic device

Info

Publication number: WO2023024564A1
Application number: PCT/CN2022/091025
Authority: WO
Inventors: 周海刚; 王伟
Original assignee: 荣耀终端有限公司
Priority date: 2021-08-25
Filing date: 2022-05-05
Publication date: 2023-03-02
Also published as: CN113923934A; CN113923934B

Abstract

The present application discloses a housing assembly and an electronic device, which are used to solve the problems of a current electronic device being limited by the technology of a phase change heat dissipation device such as a heat pipe or a vapor chamber, and limited by a space inside the electronic device, such that the thickness of the electronic device is relatively thick, and heat dissipation effects are poor. The housing assembly is used in an electronic device to affix a functional component of the electronic device. The housing assembly comprises a housing body and a cover sheet. The housing assembly comprises oppositely disposed first and second surfaces. The first surface is recessed along a direction adjacent to the second surface to form a groove. The cover sheet covers an opening of the groove and forms a closed cavity with the groove. The closed cavity is in a vacuum state, and the closed cavity is filled with a phase change medium. The heat of the functional component can be conducted to the closed cavity, and the phase change medium can be vaporized and liquefied in the closed cavity by the heat of the functional component, thereby conducting the heat of the functional component.

Description

Housing components and electronics

This application claims the priority of a Chinese patent application filed with the State Intellectual Property Office on August 25, 2021, with application number 202110980141.4, and the title of the invention is "housing assembly and electronic equipment", the entire content of which is incorporated by reference in this application .

technical field

The present application relates to the technical field of heat dissipation, in particular to a housing assembly and electronic equipment.

Background technique

As the internal integration of mobile phones and other electronic devices becomes higher, local heating becomes more serious, which affects the performance, lifespan, and user experience of electronic components inside. At present, the commonly used heat dissipation structures include metal heat sinks, graphite sheets, and heat dissipation structures that rely on the phase change of their internal working liquid to achieve heat dissipation (subsequently, these devices will be referred to as phase change heat dissipation devices), such as heat pipes, vapor chambers, etc. Since the thermal conductivity of the phase change cooling device is several times or even ten times higher than that of graphite sheets and dozens of times higher than that of metal cooling sheets, it is often used for heat dissipation of electronic equipment.

However, limited by the processing technology, it is difficult to make the thickness of the phase change heat dissipation device less than 0.3 mm, which results in thicker electronic equipment. In addition, due to the limitation of the internal space of the electronic equipment, the area of the phase change heat dissipation device is relatively small, which results in a limited heat dissipation effect of the electronic equipment.

Contents of the invention

The embodiment of the present application provides a shell assembly and electronic equipment, which are used to solve the technical limitations of current electronic equipment such as heat pipes, vapor chambers and other phase-change heat dissipation devices, as well as the limitations of the internal space of electronic equipment, and the existing thickness is relatively thick, The cooling effect of the whole machine is not good.

In a first aspect, the present application provides a casing assembly. The casing assembly is applied in electronic equipment and is used for fixing functional devices of the electronic equipment. The housing assembly includes: a housing body and a cover sheet. Wherein, the shell assembly includes a first surface and a second surface oppositely arranged. The first surface is depressed along a direction close to the second surface to form a groove. The cover sheet covers the opening of the groove and forms a closed cavity with the groove. The closed cavity is in a vacuum state, and the closed cavity is filled with a phase change medium. The heat of the functional device can be conducted to the closed cavity, and the phase change medium can be vaporized and liquefied in the closed cavity under the action of the heat of the functional device, thereby conducting heat conduction to the functional device.

In the housing assembly, since the groove is formed by recessing the first surface of the housing body along a direction close to the second surface, the top of the groove will not be higher than the first surface of the housing body. In this case, the housing assembly with the function of a phase-change heat dissipation device occupies a dimension in the thickness direction of the electronic device that is at most the thickness of the cover sheet covering the groove. Compared with an independently formed phase-change heat dissipation The thickness of the device is thinner, so compared with the solution of the phase-change heat dissipation device arranged between the casing component and the display screen, it is beneficial to reduce the thickness of the electronic device. Moreover, since the cover sheet is very thin, its presence has little effect on the thickness of the electronic device. That is to say, the housing assembly utilizes its own structure as one of the components of the phase change heat dissipation device, so that the thickness space occupied by the housing assembly itself completes the integration of the functions of the phase change heat dissipation device. In this way, it is possible to reduce the additional space occupied by the electronic device in the thickness direction in order to satisfy the function of the phase-change heat dissipation device, thereby achieving thinning of the electronic device. In addition, compared with independently formed phase-change heat dissipation devices, the surface area of the shell assembly is larger, so the area of the heat dissipation area required for setting the function of the phase-change heat dissipation device is larger, and the heat dissipation effect is better .

In some design schemes, the above-mentioned shell assembly further includes welding contraction joints and welding bosses. Wherein, the welding shrinkage joint is formed by the depression of the first surface along the direction close to the second surface. The welding shrinkage seam surrounds the periphery of the groove and has a distance from the edge line of the groove so as to form a welding boss between the welding shrinkage seam and the groove. The cover sheet is welded with the welding boss so as to cover the top of the groove.

In this way, there will be air in the welding shrinkage joint, and air is a poor thermal conductor. Therefore, the welding shrinkage joint has a thermal insulation effect on the welding bosses distributed on both sides of the welding shrinkage joint and the area of the shell body. When welding with the welding boss, the heat on the welding boss will transfer the air through the welding shrinkage joint and the bottom of the welding shrinkage joint to the area of the shell body outside the welding shrinkage joint. Due to the heat insulation effect of the air in the welding shrinkage joint, the heat on the welding boss will not be transferred to the area outside the welding shrinkage joint of the shell body in large quantities, thereby causing high heat in this area, thereby avoiding warping deformation of the first surface, Ensure its overall flatness. In addition, when the local heat on the welding boss is transferred to the outside through the bottom of the welding shrinkage joint, it is easy to cause deformation of the bottom of the welding shrinkage joint, but basically has no effect on the first surface. Since the bottom of the welding shrinkage seam will not fix functional devices, its deformation or not has little effect on electronic equipment

Optionally, the cover sheet and the first surface are substantially on the same plane. In this case, the casing assembly does not occupy additional space in the thickness direction of the electronic device due to the integration of the function of the phase change heat dissipation device, so there is no problem of increasing the thickness of the electronic device.

Optionally, the depth of the groove is not more than 0.3 mm, which can ensure the structural strength of the housing assembly, thereby ensuring the overall strength of the electronic device.

In some design schemes, the bottom of the groove is provided with a plurality of support columns arranged at intervals extending toward the cover sheet. The support column abuts against the cover sheet. The support column and the cover sheet are in contact, and the cover sheet can be supported by the support column to avoid its deformation and improve the strength of the whole machine.

In some design schemes, the closed cavity includes an evaporation section, and the phase change medium is vaporized in the evaporation section. The area where the bottom of the groove is located in the evaporation section has a hydrophilic structure. The evaporating section with a hydrophilic structure has a greater water absorption effect on the phase change medium in the condensing section, which helps the phase change medium in the condensing section to flow back to the evaporating section for heat absorption, thereby improving the heat dissipation effect.

Optionally, the hydrophilic structure refers to a porous capillary structure with a porosity greater than 60% to 70% and a pore diameter greater than 20 nanometers and less than 200 microns. The structure has high porosity and small interconnected pores, so it has high hydrophilicity, that is, a large water absorption capacity.

In some design schemes, the closed cavity further includes a condensation section, where the phase change medium is liquefied, and the area at the bottom of the groove located in the condensation section has a hydrophobic structure. The condensation section of the hydrophobic structure has a good condensation effect on the phase change medium in the condensation section, which helps the phase change medium liquefied in the condensation section to flow back to the evaporation section for heat absorption and vaporization, maintaining internal circulation, thereby improving the heat dissipation effect.

In some design solutions, the material of the housing component is one of magnesium alloy, aluminum alloy, or stainless steel. Compared with phase-change heat dissipation devices such as heat pipes and vapor chambers made of copper, it is beneficial to reduce the thickness and cost of the whole machine. In addition, it should be noted that the metal materials used in heat dissipation structures that use the principle of gas-liquid phase transition, such as heat pipes, vapor chambers, and housing components, have little influence on their heat dissipation effects. Specifically, heat dissipation structures such as heat pipes, vapor chambers, and housing components, due to their thinner walls and contact heat transfer time periods, have a uniform temperature effect that is affected by the metal material in the initial cooling stage, but enters a steady state. The temperature uniformity effect in the state heat transfer stage is weakly related to the shell material. Therefore, the use of magnesium alloy, aluminum alloy, or stainless steel can achieve similar heat dissipation effects without significantly reducing the thermal conductivity while greatly reducing the cost.

In a second aspect, the present application also provides an electronic device. The electronic device includes a display screen, a functional device, and the housing assembly according to any one of the first aspect. Wherein, the display screen and the housing assembly are stacked, and the functional devices are fixed through the housing assembly.

It can be understood that the electronic device provided in the second aspect is associated with the housing assembly provided in the first aspect, therefore, the beneficial effects it can achieve can refer to the beneficial effects in the housing assembly provided in the first aspect, here I won't repeat them here.

In a possible design solution, the above-mentioned electronic device further includes a rear case. The display screen, the shell assembly, and the rear shell are sequentially arranged in layers. The side of the rear shell facing away from the display screen is the exterior surface of the electronic device. The side of the housing body facing the display screen is the first surface, and the side of the housing body facing the rear shell is the second surface. Or, the side of the housing body facing the display screen is the second surface, and the side of the housing body facing the rear shell is the first surface. That is to say, this design scheme integrates the function of the phase change heat dissipation device on the middle frame component of the electronic device used for the fixed function device. Since the middle frame component is usually made of metal material, the metal properties of the middle frame component can be used for heat conduction, so as to realize heat dissipation.

In another possible design solution, the above-mentioned electronic device further includes a rear case, and the middle frame component of the electronic device includes a casing component and a middle frame. The middle frame is arranged around the periphery of the shell assembly. The display screen, the middle frame component, and the rear case are stacked in sequence. The side of the rear shell facing away from the display screen is the exterior surface of the electronic device. The side of the housing body facing the display screen is the first surface, and the side of the housing body facing the rear shell is the second surface. Or, the side of the housing body facing the display screen is the second surface, and the side of the housing body facing the rear shell is the first surface. That is to say, the design scheme integrates the function of the phase-change heat dissipation device on the front housing assembly of the middle frame assembly of the electronic device used to fix the functional device. Since the front casing component is generally made of metal material, the metal properties of the front casing component can be utilized for heat conduction, thereby achieving heat dissipation.

In another possible design solution, the side of the casing body facing away from the display screen is the appearance surface of the electronic device and is the second surface, and the side of the casing body facing the display screen is the first surface. That is to say, the design scheme integrates the function of the phase-change heat dissipation device on the rear shell of the electronic device used for the fixed-function device. When the back shell is made of metal material, the metal properties of the back shell can be used for heat conduction, thereby realizing heat dissipation.

Description of drawings

FIG. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

FIG. 2 is a schematic diagram of an exploded structure of an electronic device provided by some embodiments of the present application;

Fig. 3 is a front view and a rear view of a front housing assembly provided by some embodiments of the present application;

Fig. 4 is a schematic diagram of the exploded structure of the front housing assembly provided by some embodiments of the present application;

Fig. 5 is a sectional view cut along the section line _A1 - _A1 in Fig. 3;

FIG. 6 is a partially enlarged view of the region C shown in FIG. 4 provided by some embodiments of the present application;

Fig. 7 is an assembly flowchart of the front housing assembly provided by some embodiments of the present application;

8a to 8e are schematic structural diagrams of the assembly process of the front housing assembly provided by some embodiments of the present application.

Detailed ways

The following will describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them.

Hereinafter, the terms "first", "second", etc. are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first", "second", etc. may expressly or implicitly include one or more of that feature. In the description of the present application, unless otherwise specified, "plurality" means two or more.

In addition, in this application, directional terms such as "upper" and "lower" are defined relative to the schematic placement of components in the drawings. It should be understood that these directional terms are relative concepts, and they are used for relative For descriptions and clarifications, it may vary accordingly according to changes in the orientation of parts placed in the drawings.

In this application, unless otherwise specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral body; it can be a direct connection, or It can be connected indirectly through an intermediary.

An embodiment of the present application provides an electronic device. The electronic device may be a handheld terminal such as a mobile phone or a tablet. For the convenience of description, the following embodiments are all described by taking the electronic device as a mobile phone as an example.

As shown in FIG. 1 , the electronic device 01 includes a display screen 10 , a middle frame assembly 20 and a rear case (not shown in the figure). Among them, the middle frame assembly 20 is used to fix and support the functional devices in the electronic equipment (such as the display screen 10, the main control board, the battery, etc.), and the middle frame assembly 20 is usually made of metal materials such as stainless steel, aluminum alloy, magnesium alloy make. The display screen 10 and the rear case are respectively disposed on opposite sides of the middle frame assembly 20 , and the display screen 10 , the middle frame assembly 20 and the rear case are stacked. It should be noted that functional devices will generate heat during operation, which will cause localized heating of electronic devices to become more serious, affecting the performance, lifespan, and user experience of electronic components inside them.

In order to solve the above-mentioned problem of heat generation, in the related art, usually between the display screen 10 and the middle frame assembly 20, a heat dissipation structure that relies on the phase change of its internal working liquid to realize heat dissipation (hereinafter referred to as a phase change heat dissipation device for short) ), such as heat pipes and/or vapor chambers, etc. Since the thermal conductivity of the phase change heat dissipation device is several times or even ten times that of graphite sheets, and dozens of times that of metal heat sinks, it is often used for heat dissipation of electronic equipment 01.

However, limited by the processing technology, it is difficult to make the thickness of the phase change heat dissipation device less than 0.3 mm, which results in thicker electronic equipment. In order to reduce the thickness of the electronic equipment, in some embodiments, the phase change heat dissipation device may be embedded by slotting or digging holes on the middle frame assembly 20 . On the one hand, the phase change heat dissipation device is fixed by slotting. When the phase change heat dissipation device is fixed in the groove of the middle frame assembly 20 as a device, it needs to be attached to the side near the bottom of the groove to assist in fixing, and the adhesive will Occupies extra space, therefore, its thinning effect on electronic equipment is not obvious. On the other hand, although a large thickness benefit can be obtained by setting the phase-change heat dissipation device by digging holes, this method will inevitably greatly reduce the structural strength of the whole machine and reduce the strength and reliability of electronic equipment. In addition, due to the limitation of the internal space of the electronic equipment, there is not enough space to install a large-area phase-change heat dissipation device. In other words, the phase-change heat dissipation device of the electronic equipment can only be made into a small area, which will lead to The cooling effect is limited.

Based on this, in order to solve the above problems, the present application provides an improved electronic device. In this electronic device, an independently formed phase-change heat dissipation device is no longer designed. Instead, the function of the phase-change heat dissipation device is integrated into the middle frame assembly 20. , thereby providing a middle frame assembly 20 with a heat dissipation function. The electronic device 01 and the middle frame assembly 20 with heat dissipation function provided by the present application will be described in detail below with reference to FIGS. 2 to 8e.

Please refer to FIG. 2 . FIG. 2 is a schematic diagram of an exploded structure of the electronic device shown in FIG. 1 . In the electronic device 01 , the middle frame assembly 20 includes a front casing assembly 21 (ie, casing assembly), and a middle frame 22 arranged around the periphery of the front casing assembly 21 . Wherein, a main control board 41, a battery 42, an FPC 43, an antenna module, a rear camera module (not shown in the figure), a speaker (not shown in the figure), etc. are arranged between the rear shell 30 and the front shell assembly 21 functional device. The display screen 10 is disposed on a side of the front housing assembly 21 away from the rear housing 30 .

In some embodiments of the present application, please refer to FIG. 3 , (a) in FIG. 3 illustrates a front view of the front housing assembly 21 of FIG. 2 , and (b) in FIG. 3 illustrates the front housing of FIG. 2 Rear view of assembly 21. As shown in (a) and (b) in Figure 3, the above-mentioned front housing assembly 21 includes an opposite front surface 1a (shown in (a) in Figure 3 ) and a rear surface 1b (shown in (b) in Figure 3 Shows). The front surface 1a is used to face the display screen 10, and can be fixed with functional devices such as the display screen 10, front camera (not shown in the figure), speaker (not shown in the figure), microphone (not shown in the figure), The rear surface 1 b is used to face the rear shell 30 and can be fixed with functional devices such as the main control board 41 , the battery 42 , and the rear camera module (not shown in the figure). It should be noted that the above-mentioned functional devices fixed on the front surface 1a and the rear surface 1b are only illustrative, and do not constitute a specific limitation on the functions of the front surface 1a and the rear surface 1b. In other embodiments, when the electronic device When the arrangement position of the internal functional devices changes, the functional devices fixed on the front surface 1 a and the rear surface 1 b may also be adaptively changed. For example, a speaker is fixed to the rear surface 1b.

As shown in FIG. 4 , FIG. 4 is a schematic diagram of the exploded structure of the front housing assembly 21 shown in FIG. 3 . The front housing assembly 21 includes a front housing body 211 (ie, the housing body) and a cover 212 . The front case body 211 includes a first surface 2a and a second surface (not shown in the figure) opposite to each other. It should be understood that, in the electronic device shown in FIG. One side close to the rear case 30 . And, the front surface 1a of the front housing assembly 21 in FIG. That is, the second surface of the front shell body 211 .

Wherein, the first surface 2 a of the front housing body 211 is recessed in the direction where the second surface of the front housing body 211 is located, forming a groove 2111 . Since no hole is dug on the front shell body 211 , the strength of the whole machine is better than that of opening a hole to embed a phase-change heat dissipation device. In some embodiments, in order to ensure the strength of the whole machine, the depth of the groove 2111 is not more than 0.3 mm. The cover sheet 212 covers the groove 2111 and forms a closed cavity B shown in FIG. 5 between the groove 2111 and the groove 2111 , thereby forming a heat dissipation area on the front housing assembly 21 . Please refer to (a) in FIG. 3 , the area A (shown by the shaded part in the figure) is the projection of the heat dissipation area on the front surface 1 a of the front housing assembly 21 . The area A only occupies a part of the front surface 1a, and generally presents an inverted "concave" shape, but this illustration does not constitute a specific limitation on the heat dissipation area. In other embodiments, the projection of the heat dissipation area on the front surface 1a may also occupy the entire area of the front surface 1a, and may also be in the shape of a square, a circle, or the like. That is to say, the heat dissipation area can occupy the entire space or part of the space of the front housing assembly 21 in the first direction, and the shape of the heat dissipation area can be set as required. The first direction refers to the first surface perpendicular to the front housing body 211 2a and the direction of the alignment direction of the second surface of the front case body 211.

In order to make the front housing assembly 21 have the function of a phase change heat dissipation device, the closed cavity is also filled with a phase change medium, for example, ultrapure water, acetone, ethanol, methanol, etc. with a resistivity ≥ 18MΩ*cm (25°C) have a low boiling point medium. This kind of low-boiling point medium can be vaporized by absorbing the heat emitted by the functional devices of the electronic equipment, thereby taking away the heat of the functional devices and having a heat dissipation effect. Moreover, the closed cavity is vacuum-processed to form a vacuum state, so as to reduce the boiling point of the phase-change medium as much as possible and improve the heat dissipation effect. So far, the front housing assembly 21 with the function of a phase-change heat dissipation device is obtained. Exemplarily, the vacuum state may refer to a state where the air pressure is lower than 6KPa.

In the front housing assembly 21 , functional devices can be fixed to the front surface 1 a or the rear surface 1 b by a heat conduction structure such as a heat conduction pad or heat conduction glue. In this way, the heat of the functional device is transmitted to the front surface 1a or the rear surface 1b of the front housing assembly 21 through the heat conduction structure, and then transferred to the closed cavity, and the phase change medium in the closed cavity absorbs heat and vaporizes, pushing the steam in the evaporation section to the The condensation section flows; the steam releases heat and liquefies after reaching the condensation section, and the phase change medium flows back to the evaporation section through the internal capillary structure to maintain circulation. It can be seen that the front housing assembly 21 exchanges heat through the evaporating section and the condensing section, which can spread the heat evenly and efficiently to all parts of the electronic equipment, so that the heat does not accumulate locally to generate high heat, and passes through the structural parts of the electronic equipment (such as the middle frame) to dissipate heat, which increases the heat dissipation area in a disguised form and improves the heat dissipation effect.

It should be noted that the area of the front surface 1a of the front housing assembly 21 shown in FIG. Larger, better heat dissipation.

In addition, the front housing assembly 21 shown in FIG. 3 utilizes its own structure as one of the components of the phase change heat dissipation device, so that the front housing assembly 21 completes the function of the phase change heat dissipation device by utilizing the thickness space occupied by itself. integration. In this way, it is possible to reduce the extra space occupied by the electronic device in the thickness direction in order to meet the function of the phase change heat dissipation device, and thus realize the reduction of the thickness of the electronic device. The following is a specific analysis in conjunction with FIG. 5 .

Please refer to FIG. 5 . FIG. 5 is a cross-sectional view of FIG. 3 taken along the section line A ₁ -A ₁ . Because the groove 2111 is formed by the first surface 2a of the front shell body 211 being recessed in the direction where the second surface of the front shell body 211 is located, therefore, as shown in Figure 5, the top of the groove 2111 will not be higher than the front shell body 211 of the first surface 2a. In this case, the size of the front case assembly 21 having the function of a phase change heat dissipation device in the thickness direction of the electronic device is at most the thickness of the cover sheet 212 covering the groove 2111, and the cover sheet 212 is compared to the independent The formed phase-change heat dissipation device has a thinner thickness, so compared with the phase-change heat dissipation device disposed between the front housing assembly 21 and the display screen 10 , it is beneficial to reduce the thickness of the electronic device. Moreover, since the cover sheet 212 is very thin, its presence has little effect on the thickness of the electronic device. Moreover, in some embodiments, the cover sheet 212 is substantially on the same plane as the first surface 2 a of the front case body 211 . In this case, the front housing assembly 21 does not occupy additional space in the thickness direction of the electronic device due to the integration of the function of the phase change heat dissipation device, so there is no problem of increasing the thickness of the electronic device. It should be understood that the cover sheet 212 is substantially on the same plane as the first surface 2 a of the front housing body 211 , which means that they are not absolutely required to be on the same plane, but relatively appear to be substantially on the same plane. And, compared to slotting on the front shell body 211 to embed a single phase change heat sink, since the front shell assembly 21 integrates the function of the phase change heat sink, there is no need to use back adhesive Therefore, there is no need to set the back glue, and the space occupied by the back glue is benefited, thereby realizing the thinning of the electronic equipment.

In addition, in some embodiments, the above-mentioned front shell body 211 with the groove 2111 can be made of metal materials such as magnesium alloy, aluminum alloy, or stainless steel through injection molding, die-casting, or computerized numerical control machining (CNC) processing The front casing assembly 21 with the function of a phase-change heat dissipation device can be obtained by one-time forming by a process, and then by covering the cover sheet 212 above the groove 2111 .

In the related art, in the electronic equipment that utilizes phase-change cooling devices such as independently formed heat pipes or vapor chambers to dissipate heat, firstly, the independently formed phase-change cooling devices and the front case assembly 21 need to be processed separately, and then the front case Grooves are dug on the component 21 to embed phase-change heat dissipation devices. Apparently, the front housing assembly 21 completes the integration of the functions of the phase change heat dissipation device during the process of processing the front housing body 211 , which makes the process more convenient and helps to save costs. In addition, the front housing assembly 21 made of magnesium alloy, aluminum alloy, stainless steel and other metal materials with the function of a phase change heat dissipation device, compared with the use of phase change heat dissipation devices such as copper heat pipes or copper vapor chambers, Obviously, the cost can be greatly reduced, and the heat dissipation effect can be effectively guaranteed while reducing the cost. Specifically, compared with the front housing assembly 21 made of metal materials such as magnesium alloy, aluminum alloy, and stainless steel, copper heat pipes or copper vapor chambers have a faster cooling rate in the initial cooling stage. Fast, that is, it has a good heat dissipation effect in the initial stage of heat dissipation. As the temperature gradually stabilizes, the gap in heat dissipation effect gradually narrows, and the heat dissipation effect is basically the same.

In some embodiments, the cover sheet 212 can be fixed with the groove 2111 by welding, so as to cover the groove 2111 . In this case, in order to avoid warping and deformation of the surface of the front shell body 211 close to the display screen 10 caused by the high temperature of welding, resulting in poor flatness, as shown in FIG. 6 , which is a partially enlarged view of area C in FIG. 4 . It should be understood that, for convenience of presentation, FIG. 6 is flipped by 180° relative to area C in FIG. 4 . Wherein, the first surface 2a of the front shell body 211 is further formed with a welding shrinkage seam 2112a in the direction where the second surface of the front shell body 211 is located. The welding shrinkage seam 2112a surrounds the periphery of the groove 2111, and has a distance from the edge line of the groove 2111, so as to form a welding boss 2113a between the welding shrinkage seam 2112a and the groove 2111 (the darker shadow in the figure area illustrates the mesa of the solder boss 2113a). The edge of the cover sheet 212 is welded to the welding boss 2113a, so as to cover the groove 2111.

In this way, there will be air in the welding shrinkage joint 2112a, and air is a poor thermal conductor. Therefore, the welding shrinkage joint 2112a has a thermal insulation effect on the welding boss 2113a distributed on both sides of the welding shrinkage joint 2112a and the front shell body 211 area, so , when the cover sheet 212 and the welding boss 2113a are welded, the heat on the welding boss 2113a will transfer the air through the welding shrinkage seam 2112a and the bottom of the welding shrinkage seam 2112a to the front shell body 211 outside the welding shrinkage seam 2112a area. Due to the heat insulation effect of the air in the welding shrinkage joint 2112a, the heat on the welding boss 2113a will not be transferred to the area outside the welding shrinkage joint 2112a of the front shell body 211 in large quantities, thereby causing high heat in this area, thereby avoiding the first surface 2a warping deformation, to ensure its flatness. In addition, when a large amount of heat on the welding boss 2113a is transferred to the outside through the bottom of the welding shrinkage seam 2112a, it is easy to cause deformation of the bottom of the welding shrinkage seam 2112a, but basically has no effect on the first surface 2a. Since the bottom of the welding shrinkage seam 2112a will not fix the functional device, its deformation or not has little influence on the electronic device.

In some embodiments, please continue to refer to FIG. 4 , since the cover sheet 212 needs to be in contact with the functional device to conduct heat, in order to facilitate the cover sheet 212 to have a good heat conduction effect, the cover sheet 212 can be designed as a thin film structure, for example, the thickness should be less than 0.08mm Structure. In this case, in order to obtain the cover sheet 212 with a film structure, the cover sheet 212 may be made of weldable and ductile materials. For example, metal (titanium, stainless steel, copper alloy, etc.) film, plate, or polyimide film (polyimide film, PI) film material, etc. In this way, the weldability ensures that the thinner cover sheet 212 is not easily damaged during welding, and the ductility prevents the cover sheet 212 from breaking during the forming process of stretching into a film.

Furthermore, since the cover sheet 212 is thin and needs to be fixed and supported for the functional devices, it is easy to deform during the assembly process and daily use. Please refer to FIG. 4 or FIG. 6 . A plurality of support columns 2114 extending from 212 are arranged at intervals, and each support column 2114 abuts against the cover sheet 212 . The support column 2114 is in contact with the cover sheet 212, and the cover sheet 212 can be supported by the support column 2114 to avoid its deformation and improve the strength of the whole machine.

It should be noted that the above-mentioned evaporating section and the above-mentioned condensing section are relative concepts, which respectively change according to the position where the phase-change medium absorbs heat to vaporize and releases heat to liquefy. For this application, the evaporating section is the high heat accumulation area on the closed cavity, and the condensing section is other areas except the evaporating section. Exemplary, please continue to refer to Figure 2, since a large number of heat generating devices are integrated on the main control board 41, which belongs to a high heat accumulation area, therefore, the area of the closed cavity where the main control board 41 is located can be regarded as an evaporation section; and the front shell The area of the body component 21 where no functional devices are fixed, and the area where the functional devices are sparse, the area of the closed cavity can be regarded as the condensation section. For example, for mobile phones, since the main control board 41 is distributed near the top of the mobile phone (the side of the mobile phone close to the camera), the position where the closed cavity is at the top of the mobile phone can be regarded as the evaporation section, and other areas are condensation sections. In other examples, the area of all heat-generating functional devices can also be regarded as the evaporation section, and the area of the front housing assembly 21 where no functional devices are fixed can be regarded as the condensation section.

In order to promote the rapid circulation of the phase change medium in the closed cavity between the evaporation section and the condensation section, in some embodiments, the area where the bottom of the groove 2111 is located in the evaporation section (hereinafter referred to as the evaporation section area) is a hydrophilic structure. The evaporating section with a hydrophilic structure has a greater water absorption effect on the phase change medium in the condensing section, which helps the phase change medium in the condensing section to flow back to the evaporating section for heat absorption, thereby improving the heat dissipation effect.

During specific implementation, the hydrophilicity of the evaporation section area can be increased by increasing the roughness of the evaporation section area. The contact angle of a liquid on a solid surface is an important parameter to measure the wettability of the liquid to the solid surface (and vice versa, the hydrophilicity of the solid). The smaller the contact angle, the better the wettability of the liquid to the solid surface, that is, the better the hydrophilicity.

It should be noted that the contact angle of the same liquid on a rough fixed surface and on an ideal smooth fixed surface is as follows:

cosθ _w = r*cosθ;

Among them, θ _w is the contact angle of the liquid on the rough fixed surface; r is the roughness of the rough fixed surface (generally greater than 1); θ is the contact angle of the liquid on the ideal smooth solid surface. It can be seen that through the equation, it can be found that the contact angle _θw of liquid on a rough fixed surface is smaller than the contact angle θ of liquid on an ideal smooth solid surface. Therefore, by changing the roughness of the solid surface in contact with the liquid, the wettability of the liquid to the solid surface can be changed, that is, the hydrophilicity of the solid surface to the liquid. For the embodiment of the present application, the surface of the evaporation section can be made more hydrophilic by increasing the roughness of the area of the evaporation section.

Exemplarily, a porous capillary structure with a pore diameter of 20 nanometers to 200 microns and a porosity of 60%-70% or more can be formed in the evaporation section area by etching, electrochemical deposition, anodic oxidation, or radium engraving. The porous capillary structure with porosity and small interconnected pores has high hydrophilicity, that is, a large water absorption capacity.

In other examples, the porous capillary structure can also be formed by sintering copper powder, metal mesh and the like. In addition, in other embodiments, the hydrophilicity of the evaporation section area can also be increased by designing the evaporation section area as a fiber structure, a groove structure, or a multi-layered metal mesh. The embodiment of the present application does not specifically limit the manner of forming the evaporation section region.

In some other embodiments, the area where the bottom of the groove 2111 is located in the condensation section (hereinafter referred to as the condensation section area for short) has a hydrophobic structure. The condensation section of the hydrophobic structure has a good condensation effect on the phase change medium in the condensation section, which helps the phase change medium liquefied in the condensation section to flow back to the evaporation section for heat absorption and vaporization, maintaining internal circulation, thereby improving the heat dissipation effect. In the specific implementation process, the hydrophobicity of the evaporating section of the condensing section can be improved by increasing the smoothness of the condensing section. Exemplarily, alcohol liquids such as lauryl stearic acid may be used to soak the region of the condensation section to make it smooth.

It should be noted that the above-mentioned embodiment of designing the evaporating section area as a hydrophilic structure and the embodiment of designing the condensing section area as a hydrophobic structure can be implemented independently in the front housing assembly 21, and can also be implemented in combination. The embodiment of the application does not specifically limit this.

In some embodiments, referring to FIG. 4 or FIG. 6 , in order to fill the closed cavity with a phase change medium and perform vacuum treatment on the closed cavity, the front housing body 211 has a through hole 2115 . Optionally, the through hole 2115 may be a hole in FIG. 2 through which the connecting wires of the main control board 41 and the display screen 10 pass, that is to say, the closed cavity and the connecting wires of the display screen 10 share the same hole. Of course, in other embodiments, the holes for the connection lines between the closed cavity and the display screen 10 can also be set independently. The hole 2115 can also be repaired after use, and of course it can also be retained, which is not specifically limited in this embodiment of the present application.

It should be noted that, please refer to FIG. 6 , in order to use the through hole 2115 to fill and vacuum the closed cavity, the above-mentioned through hole 2115 needs to communicate with the chamber where the closed cavity is located during the production stage, and after filling and vacuum treatment and The closed cavity is isolated and impervious to ensure that the closed cavity is in a vacuum state and the phase change medium does not overflow. For the convenience of description, when the chamber where the closed cavity is located and the through hole 2115 are connected during the production stage, the chamber where the closed cavity is located at this time is in an unsealed state, and the closed cavity in this state is called an unsealed state. As for the cavity, after the unsealed cavity is filled with the phase change medium and subjected to vacuum treatment, the unsealed cavity is sealed to form a closed closed cavity. It should be understood that, in some embodiments, the above-mentioned through hole 2115 may be located on the closed cavity. In this case, after the unsealed cavity is filled with the phase change medium and subjected to vacuum treatment, the through hole 2115 can be closed, Form a closed cavity. In some other embodiments, the above-mentioned through hole 2115 may also be located in other areas outside the closed cavity. Exemplarily, the through hole 2115 is located in an area outside the welding shrinkage joint 2112a. In this case, when the cavity is not closed After filling the phase change medium and performing vacuum treatment, the cover sheet 212 and the front casing 211 outside the closed cavity and the area inside the through hole 2115 (such as the welding boss 2113a) can be welded to form a closed cavity. Next, with reference to Fig. 7 and Fig. 8a to Fig. 8e, and taking the position of the above-mentioned through hole 2115 outside the welding shrinkage joint 2112a as an example, the manufacturing process of the above-mentioned front housing assembly 21 will be described in detail, so as to facilitate Comprehend the relative positional relationship between the above-mentioned through hole 2115 and the closed cavity.

In some embodiments, as shown in FIG. 7 , the above-mentioned front housing assembly 21 may be formed through the following steps S101 to S105:

S101, prepare the cover sheet 212a and the front shell body 211 to be cut.

As shown in FIG. 8 a , the front shell body 211 is sequentially distributed with grooves 2111 , welding bosses 2113 a , and welding contraction joints 2112 a. In addition, the front shell body 211 is further provided with a through hole 2115, and the through hole 2115 is located in an area outside the welding contraction joint 2112a.

As shown in FIG. 8 b , compared with the cover sheet 212 , the cover sheet 212 a to be cut has a cut area D and a non-cut area E reserved. Wherein, the cut area D is used to cover the through hole 2115 of the front shell body 211 , and the non-cut area E is used to cover the groove 2111 of the front shell body 211 .

S102, align the cover sheet 212a to be cut with the front shell body 211, and perform welding for the first time.

As shown in FIG. 8a to FIG. 8c, in the aligned cover sheet 212a to be cut and the front shell body 211, the cut area D covers the through hole 2115, and the non-cut area E covers the groove 2111.

As shown in Figure 8c, the specific process of welding for the first time can be as follows: along the non-overlapping path of the non-cutting area E (the thicker black solid line in the figure), the non-overlapping path of the cutting area D (in the figure thicker black dotted line), the cover sheet 212a to be cut and the front shell body 211 are welded together by welding methods such as laser welding or resistance welding. Among them, the non-overlapping path of the cutting area D refers to the position on the front shell body 211 facing the cutting area D that does not touch the non-cutting area E, and the non-overlapping path of the non-cutting area E refers to the front shell The welding boss 2113 a around the edge of the groove 2111 on the body 211 is facing the position where the non-cutting area E is not in contact with the cutting area D. After the first welding, the through hole 2115 is located in the area of the front case 211 facing the welding path, wherein the welding path refers to the path of the first welding of the cover sheet 212a to be cut and the front case body 211, as shown in the figure Path bounded by thicker black solid and dashed black lines.

It should be understood that, in some embodiments, this operation may cause deformation of the front housing 211 due to the non-overlapping paths of the cutout area D on the front housing 211 during the first weld. Based on this, welding contraction joints 2112b may be provided outside the area of the front housing 211 facing the welding path. Wherein, there is a gap between the welding shrinkage seam 2112b and the through hole 2115 , so as to form a welding boss 2113b between the welding shrinkage seam 2112b and the through hole 2115 . It should be understood that the above-mentioned non-overlapping path of the cutting area D refers to the position on the welding boss 2113b that is directly opposite to the cutting area D and not connected to the non-cutting area E.

S103, filling the phase change medium and performing vacuum treatment.

Specifically, from the position where the second surface of the front shell body 211 is located at the through hole 2115, the unsealed cavity is filled with a phase change medium through the processing channel; after standing for a period of time, the unsealed cavity is pumped through the processing channel. Vacuum, keep pumping, heat around the front shell body 211, so that the air in the corner of the unsealed cavity expands and is driven out of the closed cavity, making the air pressure in the unsealed cavity lower than 6KPa.

It should be noted that, during the process of filling the phase change medium, the front shell body 211 can be tilted so that the through hole 2115 is at a higher position, so as to prevent the phase change medium from flowing out. In addition, the heating temperature should not exceed 80°, so as to prevent the phase change medium from vaporizing and expanding out of the unsealed cavity.

S104, performing a second welding on the cover sheet 212a to be cut and the front shell body 211, and cutting the cover sheet 212a to be cut.

Specifically, as shown in FIG. 8d, the cover sheet 212a to be cut is welded to the front shell body 211 along the overlapping path (the thicker black solid line in the figure), thereby forming a closed cavity, and the closed cavity and The through hole 2115 no longer runs through. Wherein, as shown in FIG. 8a and FIG. 8b , the overlapping path refers to the position where the non-cutting area E and the cutting area D meet on the welding boss 2113a around the edge of the groove 2111 on the front shell body 211 . Then, the part of the cover sheet 212a to be cut outside the welding boss 2113a (that is, the cutting area D) is cut off to expose the through hole 2115, and the front housing assembly 21 shown in FIG. 8e is obtained.

S105, performing surface passivation and performance testing.

It should be noted that, FIG. 2 to FIG. 8 e illustrate the situation that the function of the phase change heat dissipation device is integrated into the front surface 1 a of the front housing assembly 21 . In other embodiments, the function of the phase change heat dissipation device may also be integrated into the rear surface 1 b of the front housing assembly 21 , which is not specifically limited in this embodiment of the present application. It should be understood that when the function of the phase change heat dissipation device is integrated into the rear surface 1b, in the electronic device shown in FIG. The second surface of the housing assembly 21 refers to a side of the front housing body 211 close to the display screen 10 . The specific implementation can be adaptively referred to the specific implementation of setting the function of the phase change heat dissipation device on the front surface 1 a of the front housing assembly 21 in FIGS. 2 to 8 e , which will not be described in detail here. In this case, the front surface 1a of the front housing assembly 21 is the second surface of the front housing body 211, the rear surface 1b of the front housing assembly 21 is composed of the first surface (excluding the bottom surface of the groove 2111), and the cover The sheet 212 is formed on the side away from the groove 2111 , and the specific implementation can refer to the realization of being disposed on the front surface 1a, which will not be described in detail here.

It should be noted that, in the above embodiments, the structure of the middle frame assembly 20 is described by taking the middle frame assembly 20 including the independently formed front casing assembly 21 and the middle frame 22 as an example. In other embodiments, the front casing body 211 and the middle frame 22 can also be integrated to form the middle frame assembly body (ie, the housing body), and then cover the cover sheet 212 to form the middle frame assembly 20 (ie, the housing assembly), which is not specifically limited in this embodiment of the present application. When the front case body 211 and the middle frame 22 are integrated to form the middle frame assembly body, there is no longer the independent concept of the front case body 211, the front case assembly 21, and the middle frame 22. Instead, the middle frame assembly 20 includes the middle frame assembly housing, and cover. The housing of the middle frame assembly includes a first surface and a second surface. Wherein, the first surface of the middle frame assembly casing is recessed toward the direction where the second surface of the middle frame assembly casing is located, forming a groove. The cover sheet covers the groove and forms a closed cavity with the groove. On this basis, in some embodiments, the side of the middle frame assembly 20 facing the display screen 10 can be regarded as the first surface 2a of the middle frame assembly 21, and the side of the middle frame assembly 20 facing the rear case 30 can be regarded as the second surface . In other embodiments, the side of the middle frame assembly 20 facing the display screen 10 may also be regarded as the second surface, and the side of the middle frame assembly 20 facing the rear case 30 may be regarded as the first surface. It should be understood that the specific implementation of how to integrate the phase-change heat dissipation device can refer to the above-mentioned embodiment of integrating the functions of the phase-change heat dissipation device into the front surface 1 a and the rear surface 1 b respectively, which will not be described in detail here.

The above embodiments are described by taking a mobile phone as an example. It should also be noted that since the mobile phone usually needs antenna radiation through the rear case and the middle frame 30, in order to reduce the impact on the performance of the 5G antenna, the mobile phone rear case 30 is usually not made of metal materials. Therefore, for mobile phones In other words, it is not convenient to integrate a heat dissipation structure that needs to conduct heat through metal at the rear case 30 . However, when some electronic equipment is a handheld terminal device (such as a tablet) whose back shell 30 is a metal material, the function of the phase change heat dissipation device can also be integrated in the back shell 30 (that is, the housing body) facing the middle frame assembly 20. Surface, thereby forming the rear shell assembly (ie, the shell assembly) for heat conduction. When the function of the phase-change heat dissipation device is integrated into the back shell 30, the side of the back shell 30 facing the display screen 10 is the first surface of the back shell 30; the side of the back shell 30 facing away from the display screen is the appearance surface of the electronic device, which is also the second surface of the rear case 30 . The specific implementation can be adaptively referred to the specific implementation of setting the function of the phase change heat dissipation device on the front surface 1 a of the front housing assembly 21 in FIGS. 2 to 8 e , which will not be described in detail here. In this case, the rear shell assembly has a front surface and a rear surface oppositely arranged, wherein the front surface is used to face the display screen 10, and can be connected with the functional components of the electronic device 01, such as the display screen 10, the main control board 41, the battery 42. Fixing the speaker, microphone, etc. may be formed by the first surface (excluding the bottom surface of the groove 2111 ) and the side of the cover sheet 212 away from the groove 2111 . The specific implementation can be adaptively referred to the implementation disposed on the front surface 1a, which will not be described in detail here. The rear surface is also the second surface of the rear case 30 , that is, the appearance surface of the electronic device 01 .

The above are only specific implementation methods of this application, but the protection scope of this application is not limited thereto. Any changes or replacements within the technical scope disclosed in this application shall be covered within the protection scope of this application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

A housing assembly, characterized in that it is applied to electronic equipment for fixing functional devices of the electronic equipment, and the housing assembly includes:

The housing body includes a first surface and a second surface opposite to each other; the first surface is depressed along a direction close to the second surface to form a groove;

A cover sheet, covering the opening of the groove, and forming a closed cavity with the groove; the closed cavity is in a vacuum state, and the closed cavity is filled with a phase change medium;

Wherein, the heat of the functional device can be conducted to the closed cavity, and the phase change medium can be vaporized and liquefied in the closed cavity under the action of the heat of the functional device, so that the functional device Conduct heat conduction.
The housing assembly according to claim 1, further comprising:

Welding shrinkage seam, the welding shrinkage seam is formed by the depression of the first surface along the direction close to the second surface; the welding shrinkage seam surrounds the periphery of the groove and is aligned with the edge line of the groove with spacing between

The welding boss is located between the welding shrinkage joint and the groove; the cover sheet is welded to the welding boss so as to cover the groove.
The housing assembly according to claim 1 or 2, wherein the cover sheet and the first surface are substantially on the same plane.
The casing assembly according to any one of claims 1 to 3, wherein the depth of the groove is no more than 0.3mm.
The housing assembly according to any one of claims 1 to 4, wherein the bottom of the groove is provided with a plurality of spaced support columns extending toward the cover;

The support column abuts against the cover sheet.
The housing assembly according to any one of claims 1 to 5, wherein the closed cavity comprises an evaporation section;

The phase change medium is vaporized in the evaporation section, and the area where the bottom of the groove is located in the evaporation section has a hydrophilic structure.
The shell assembly according to claim 6, wherein the hydrophilic structure refers to a porous capillary structure with a porosity greater than 60% to 70% and a pore diameter greater than 20 nanometers and less than 200 microns.
The shell assembly according to any one of claims 1 to 7, wherein the closed cavity further includes a condensation section;

The phase change medium is liquefied in the condensation section, and the area where the bottom of the groove is located in the condensation section has a hydrophobic structure.
The casing assembly according to any one of claims 1 to 8, wherein the material of the casing assembly is one of magnesium alloy, aluminum alloy, or stainless steel.
An electronic device, characterized in that it comprises a display screen, a functional device, and a casing assembly according to any one of claims 1 to 8, the display screen and the casing assembly are stacked, and the functional device passes through The housing assembly is fixed.
The electronic device according to claim 10, further comprising a rear case;

The display screen, the housing assembly, and the back shell are sequentially stacked; the side of the back shell facing away from the display screen is the appearance surface of the electronic device;

The side of the housing body facing the display screen is the first surface, and the side of the housing body facing the rear shell is the second surface; or,

A side of the housing body facing the display screen is the second surface, and a side of the housing body facing the rear shell is the first surface.
The electronic device according to claim 10, further comprising a rear case;

The middle frame assembly of the electronic device includes the housing assembly and a middle frame; wherein, the middle frame surrounds the periphery of the housing assembly;

The display screen, the middle frame assembly, and the back shell are stacked in sequence; the side of the back shell facing away from the display screen is the appearance surface of the electronic device;

The side of the housing body facing the display screen is the first surface, and the side of the housing body facing the rear shell is the second surface; or,

A side of the housing body facing the display screen is the second surface, and a side of the housing body facing the rear shell is the first surface.
The electronic device according to claim 10, wherein the side of the casing body facing away from the display screen is the appearance surface of the electronic device and is the second surface;

A side of the housing body facing the display screen is the first surface.