WO2023016368A1 - 电路板组件、电路板堆叠结构及电子设备 - Google Patents

电路板组件、电路板堆叠结构及电子设备 Download PDF

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Publication number
WO2023016368A1
WO2023016368A1 PCT/CN2022/110556 CN2022110556W WO2023016368A1 WO 2023016368 A1 WO2023016368 A1 WO 2023016368A1 CN 2022110556 W CN2022110556 W CN 2022110556W WO 2023016368 A1 WO2023016368 A1 WO 2023016368A1
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WIPO (PCT)
Prior art keywords
circuit board
electrical
connection
connecting portion
connection part
Prior art date
Application number
PCT/CN2022/110556
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English (en)
French (fr)
Inventor
林协源
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Priority to EP22855349.1A priority Critical patent/EP4387401A1/en
Publication of WO2023016368A1 publication Critical patent/WO2023016368A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Definitions

  • the present application relates to the technical field of electronic equipment, in particular to a circuit board assembly, a circuit board stacking structure and electronic equipment.
  • circuit boards are usually laid in parallel on the main board to realize their own power supply.
  • the number of circuit boards that can be arranged is limited when the layout area on the main board is limited.
  • the number of functional devices that can be installed will be limited, and the integration and utilization of the circuit board cannot be further improved.
  • the invention provides a circuit board assembly, a circuit board stacking structure and electronic equipment to solve the problem that the integration degree and utilization rate of the circuit board cannot be further improved.
  • the present application discloses a circuit board assembly, including a first connector, a first circuit board, and a second connection seat stacked in sequence, and the first connector is provided with a second electrical connecting portion and a second connecting portion , the second connection seat is provided with a fourth connection part, the first circuit board is provided with a third electrical connection part and a third connection part on the side facing the first connection head, and the first circuit board is provided with a second connection part on the side facing the second connection seat.
  • the first circuit board includes a first wire
  • the first wire, the third connection part and the second connection part are electrically connected in sequence to form a second path
  • the electrical connecting portion and the second electrical connecting portion are electrically connected in sequence to form a first path.
  • the present application discloses a circuit board stacking structure, including a third circuit board, a circuit board assembly and a second circuit board stacked in sequence, a first connecting seat is provided on the side of the third circuit board facing the circuit board assembly, The third circuit board is connected to the first connection head through the first connection seat, the second circuit board is provided with a second connection head on the side facing the circuit board assembly, the second circuit board is connected to the second connection seat through the second connection head, and the third circuit board
  • the first receiving part and the second receiving part are provided, the first connecting seat is provided with the first electrical connecting part and the first connecting part, the second connecting head is provided with the fifth connecting part, and the second circuit board is provided with the sixth connecting part , in the first path, the sixth connection part, the fifth connection part, the fourth connection part, the fourth electric connection part, the third electric connection part, the second electric connection part, the first electric connection part and the first receiving part Electrically connected in sequence, in the second path, the first wire, the third connecting portion, the second connecting portion, the first connecting
  • the present application discloses an electronic device including a circuit board assembly.
  • the present application discloses a circuit board stacking structure, which includes a third circuit board, a circuit board assembly and a second circuit board stacked in sequence, wherein the circuit board assembly includes a first connector, a first circuit board and a second circuit board stacked in sequence.
  • the first connecting head is provided with a second electrical connecting part and a second connecting part
  • the second connecting seat is provided with a fourth connecting part
  • the side of the circuit board facing the first connecting head is provided with a third connecting part and a third connecting part.
  • a fourth electrical connection part is provided on the side of the circuit board facing the second connection seat.
  • the first wire, the third connecting part, and the second connecting part are electrically connected in sequence, so that a second path is formed between the first circuit board and the third circuit board, and the fourth connecting part, the fourth connecting part, and the third connecting part
  • the connecting portion and the second electrical connecting portion are electrically connected in sequence, so that a first path is formed between the second circuit board and the third circuit board.
  • This kind of circuit board stacking structure can lay out more circuit boards with the same wiring area by stacking, thereby improving the integration and utilization of the circuit board stacking structure, and thus meeting the power supply requirements of more functional devices .
  • Fig. 1 is a structural diagram of a circuit board assembly disclosed by an embodiment of the present invention
  • Fig. 2 is the A-direction view of Fig. 1 disclosed by the embodiment of the present invention.
  • Fig. 3 is the B direction view of Fig. 1 disclosed by the embodiment of the present invention.
  • Fig. 4 is the back structure diagram of the first circuit board disclosed by the embodiment of the present invention.
  • FIG. 5 is a front structural view of the first circuit board disclosed in the embodiment of the present invention.
  • Fig. 6 is the back structure diagram of the transition plate disclosed by the embodiment of the present invention.
  • Fig. 7 is the front structural view of the transition plate disclosed by the embodiment of the present invention.
  • Fig. 8 is a path diagram of the first path and the second path in the circuit board assembly disclosed by the embodiment of the present invention.
  • Fig. 9 is a structural diagram of a circuit board stacking structure disclosed in an embodiment of the present invention.
  • Fig. 10 is a sectional view along C-C direction of Fig. 9 disclosed by the embodiment of the present invention.
  • Fig. 11 is a D-D sectional view of Fig. 9 disclosed by an embodiment of the present invention.
  • Fig. 12 is a path diagram of the first path and the second path in the circuit board stack structure disclosed in the embodiment of the present invention.
  • Fig. 13 is another structural diagram of the circuit board stacking structure disclosed in the embodiment of the present invention.
  • a circuit board stacking structure which may include a third circuit board 700 , a circuit board assembly and a second circuit board 500 stacked in sequence.
  • the third circuit board 700 may be a main board, which serves as the installation base of the circuit board stack structure of the present application.
  • the second circuit board 500 can be a flexible printed circuit (Flexible Printed Circuit, FPC), and a flexible printed circuit can be arranged in the circuit board assembly.
  • FPC Flexible Printed Circuit
  • the stacking structure arrangement of the present application can lay out more circuit boards under the condition that the laying area remains unchanged, thereby improving the overall integration and utilization rate , so as to meet the power supply requirements of more functional devices.
  • circuit board components are firstly introduced:
  • the circuit board assembly of the present application may include a first connector 120 , a first circuit board 300 and a second connection seat 210 stacked in sequence.
  • the first circuit board 300 may be a structure such as a flexible circuit board or a data line
  • the first connector 120 and the second connection seat 210 may be interfaces respectively arranged on both sides of the first circuit board 300 for input and output of current .
  • the first connector 120 may be provided with a second electrical connecting portion 121 and a second connecting portion 122 . Both the second electrical connecting portion 121 and the second connecting portion 122 can be configured as interfaces so as to be connected with different functional devices.
  • the second connecting base 210 is provided with a fourth connecting portion 211 , and the fourth connecting portion 211 may also be provided with an interface so as to communicate with the second electrical connecting portion 121 .
  • the side of the first circuit board 300 facing the first connector 120 may be provided with a third electrical connection part 311 and a third connecting part 312, and the first circuit board 300 faces the second connection
  • One side of the base 210 may be provided with a fourth electrical connecting portion 321 .
  • the third connecting portion 312 corresponds to the position of the second connecting portion 122 , for example, the two are respectively arranged as pins and pads, so that the third connecting portion 312 can be welded to the second connecting portion 122 , In order to establish an electrical connection between the third connecting portion 312 and the second connecting portion 122 .
  • a first wire is provided in the first circuit board 300, and the first wire can be etched on the first circuit board 300 in a printing manner, or arranged in the first circuit board 300, and the first wire is connected to the third connection part 312, As a transmission medium of electric energy, the first wire can realize electric conduction to the third connecting portion 312 .
  • the first wire, the third connecting portion 312 and the second connecting portion 122 can be electrically connected in sequence to form the second via 20 .
  • the current of the external power supply can be introduced into the first circuit board 300 through the first wire, and output through the third connection part 312 and the second connection part 122 in sequence.
  • the second connection part 122 is the current output end of the second path 20
  • the first wire is the current input end of the second path 20 .
  • the positions between the fourth electrical connecting portion 321 and the third electrical connecting portion 311 correspond, the positions between the fourth connecting portion 211 and the fourth electrical connecting portion 321 correspond, and the third electrical connecting portion 311 and the second electrical connecting portion 121
  • the positions between them correspond, for example, they are set as pins or pads, so that the fourth connecting part 211, the fourth electrical connecting part 321, the third electrical connecting part 311, and the second electrical connecting part 121 are electrically connected in sequence to form First access 10.
  • the first wire laid on the first circuit board 300 does not pass through the fourth electrical connection part 321 and the third electrical connection part 311, so that the fourth connection part 211 can be the current input end of the first path 10, and the second The electrical connecting portion 121 may be a current output end of the first path 10 .
  • the third connection part 312 is set as a "self-use" part of the first circuit board 300, and the first wires arranged in the first circuit board 300 will be connected to the third connection part 312, Further, the conduction of the second path 20 is realized.
  • the first wires arranged in the first circuit board 300 are kept isolated from the third electrical connection portion 311 and the fourth electrical connection portion 321 respectively, that is, the third electrical connection portion 311 and the fourth electrical connection portion 321 are set as the first circuit.
  • the "bridge” part of the board 300, the “bridge” part plays a transitional role connecting the up and down, and will not be interfered by the first wires arranged inside the first circuit board 300, and the third electrical connection part 311 and the fourth electrical connection part 321
  • the formed whole, that is, the “bridge” part can communicate with the fourth connecting portion 211 and the second electrical connecting portion 121 to form the first passage 10 .
  • the circuit board assembly of the present application not only can the conduction of the power supply connected to the first circuit board 300 itself (that is, the second path 20) be realized, so as to exert the function of the first circuit board 300 itself, but also through the first circuit board 300
  • the setting of the four connecting parts 211 and the second electrical connecting part 121, and through the setting of the "bridge" part of the third electrical connecting part 311 and the fourth electrical connecting part 321, can realize conducting other power sources and functional devices (that is, the first access 10).
  • the stacking method of the circuit board components can not only meet the requirements of more functional devices, but also occupy less layout space, thereby improving the utilization rate of the circuit board components.
  • the circuit board assembly may further include a transition board 400 .
  • the transition board 400 can reinforce the first circuit board 300 , specifically, the transition board 400 can be stacked between the first circuit board 300 and the second connection seat 210 .
  • the strength of the first circuit board 300 is partially strengthened, that is, the part of the first circuit board 300 used for installing the transition board 400 is increased in strength, so that the circuit board 300 is not prone to deformation such as warping and torsion, thereby avoiding the first circuit board 300 installed on it.
  • the second connecting seat 210 and the first connecting head 120 are shifted from the installation position according to the deformation.
  • the transition plate 400 should not interfere with the conduction of the second passage 20, so as shown in Figure 6 and Figure 7, the side of the transition plate 400 facing the second connection seat 210 can be provided with a sixth electrical connection part 421, and the transition plate 400 faces the second connecting seat 210.
  • One side of the first circuit board 300 may be provided with a fifth electrical connecting portion 411 .
  • the sixth electrical connection part 421, the fifth electrical connection part 411, the fourth electrical connection part 321, and the third electrical connection part 311 can all be set as pad structures, and their positions correspond to each other, so that the sixth electrical connection part 421,
  • the whole composed of the fifth electric connecting part 411 can play a similar role to the whole composed of the fourth electric connecting part 321 and the third electric connecting part 311, that is, the arrangement of the sixth electric connecting part 421 and the fifth electric connecting part 411 It can be used as the "bridge" part of the transition plate 400.
  • the "bridge” part plays a transitional role connecting the up and down, and can cooperate with the "bridge” part formed by the fourth electrical connecting part 321 and the third electrical connecting part 311 to make the fourth
  • the connecting portion 211 communicates with the second electrical connecting portion 121 .
  • the fourth connecting portion 211, the sixth electrical connecting portion 421, the fifth electrical connecting portion 411, the fourth electrical connecting portion 321, the third electrical connecting portion 311, and the second electrical connecting portion 121 can be electrically connected in sequence, so as to A first via 10 is formed.
  • the third electrical connector 311, the third connector 312 and the fourth electrical connector Each part 321 is provided with a plurality of pads, wherein the pads in the third electrical connection part 311 correspond to the pads in the fourth electrical connection part 321 and are connected in sequence, such as the solder pads in the third
  • the plate and the pad in the fourth electrical connection part 321 form a whole that penetrates through a plurality of electrode columns on the first circuit board 300, or the pad in the third electrical connection part 311 and the pad in the fourth electrical connection part 321 Wires and the like are provided between the pads.
  • the second electrical connecting part 121 and the second connecting part 122 can both be provided with a plurality of pins, wherein the pins in the second electrical connecting part 121 and the pins in the third electrical connecting part 311
  • the pads correspond to each other and are connected in sequence.
  • the pins in the second connection part 122 correspond to the pads in the third connection part 312 one by one and are connected to each other.
  • the first connector 120 is soldered to the first circuit board 300 through the connection between the pad and the pin, for example, by using SMT patch or DIP plug-in soldering.
  • the design of the above-mentioned pads and pins can not only ensure the connection between the first connector 120, the first circuit board 300, the transition board 400 and the second connection seat 210 by welding is stable, but also can ensure that the second path
  • the effective electrical conduction of 20 and the effective electrical conduction of the first pathway 10 serve two purposes.
  • the fifth electrical connection part 411 and the sixth electrical connection can also be provided with a plurality of pads, and the pads in the fifth electrical connection part 411 and the pads in the sixth electrical connection part 421 correspond one-to-one and are connected in sequence, such as in the fifth electrical connection part 411
  • the whole formed by the pad of the pad and the pad in the sixth electrical connection part 421 is a plurality of electrode columns penetrating through the transition plate 400, or the pad in the fifth electrical connection part 411 and the pad in the sixth electrical connection part 421 Wires, etc. are set between the pads.
  • the fourth connecting portion 211 can be provided with multiple pins, and the pads in the sixth electrical connecting portion 421 correspond to the pins in the fourth connecting portion 211 one-to-one, and They are connected in sequence, so that the mutual welding between the second connecting seat 210 and the transition plate 400 can be realized.
  • the pads in the fourth electrical connection part 321 and the pads in the fifth electrical connection part 411 correspond one-to-one and are connected in sequence, so that the connection between the first circuit board 300 and the transition board 400 is realized. Weld each other.
  • the first connection head 120 , the first circuit board 300 , the transition board 400 and the second connection base 210 are stacked sequentially by welding to form a circuit board assembly.
  • the pins in the second electrical connection part 121, the pads in the third electrical connection part 311, the pads in the fourth electrical connection part 321, the pads in the fifth electrical connection part 411, and the sixth electrical connection part correspond one-to-one and are connected in sequence to form the first via 10; while the pins in the second connection part 122 and the pads in the third connection part 312 correspond to each other and connect with each other to form the second passage 20 .
  • the transition plate 400 may further include a reserved connection portion 412 .
  • the reserved connecting portion 412 may be an electrode column that runs through the transition plate 400 as a spare area for the location of the fifth electrical connecting portion 411 and the sixth electrical connecting portion 421. If the fifth electrical connecting portion 411 and the sixth electrical connecting portion 421 In the event of damage, the connection relationship between the reserved connection part 412 and the fourth electrical connection part 321 and the fourth connection part 211 can be established by reversing the installation of the transition plate 400 to prevent the disconnection of the first channel 10 .
  • the third circuit board 700, the circuit board assembly and the second circuit board 500 are stacked in sequence. Simultaneously as shown in FIG. 9, the third circuit board 700 is provided with the first connection seat 110 on one side facing the circuit board assembly, so that the third circuit board 700 is connected to the first connector 120 through the first connection seat 110, such as a connection seat 110 welding on the first connector 120.
  • the second circuit board 500 is provided with a second connection head 220 on the side facing the circuit board assembly, and the second circuit board 500 is connected to the second connection seat 210 through the second connection head 220, for example, the second connection head 220 is welded to the second connection seat 210.
  • the third circuit board 700 may be provided with a first receiving portion 701 and a second receiving portion 702 .
  • the first connecting seat 110 can be provided with a first electrical connecting portion 111 and a first connecting portion 112 .
  • the second connection head 220 may have a fifth connection portion 221 .
  • the second circuit board 500 may be provided with a sixth connection portion 501 .
  • the connecting portion 311 , the second electrical connecting portion 121 , the first electrical connecting portion 111 and the first receiving portion 701 are electrically connected in sequence.
  • the second circuit board 500 can be laid out the electric wire that connects with the sixth connection part 501, such as laying the second wire, and the electric wire connected with the first receiving part 701 can be laid in the third circuit board 700, such as the third wire, so that the second circuit
  • the electric energy can be transmitted to the first receiving part 701 through the first path 10, and then transmitted to the corresponding functional device through the third wire laid on the third circuit board 700 .
  • the first wire in the first circuit board 300, the third connection part 312, the second connection part 122, the first connection part 112 and the second receiving part 702 are electrically connected in sequence, and the third Wires connected to the second receiving part 702 are arranged in the circuit board 700, such as a fourth wire, so that when the first circuit board 300 is connected to a power source through the first wire, the electric energy can be transmitted to the second through the second path 20.
  • receiving part 702 and then transmit to the corresponding functional device through the fourth wire arranged on the third circuit board 700.
  • circuit board stacking structure two different circuits can be formed at the same time by stacking, that is, the first path 10 and the second path 20, and then realize power supply for different functional devices, such as respectively for the lens , memory power supply, or power supply for different lenses, etc.
  • the circuit board stacking structure of the present application can lay out more circuit boards without changing the wiring area, thereby improving the integration and utilization of the circuit board stacking structure, thereby meeting the power supply requirements of more functional devices.
  • the first connector 120 is plugged into the first connection base 110 .
  • the first electrical connecting part 111 and the first connecting part 112 are respectively provided with a socket, while the second electrical connecting part 121 and the second connecting part 122 are respectively provided with a plug.
  • the first connecting part 112 and the second connecting part 122 are plugged and connected to each other.
  • the first connecting seat 110 and the first connecting head 120 constitute the first board-to-board connector 100 .
  • the second connector 220 is plugged into the second connection base 210 .
  • the fourth connection part 211 is provided with a socket
  • the fifth connection part 221 is provided with a plug
  • the fourth connection part 211 and the fifth connection part 221 are plugged into each other.
  • the second connecting head 220 and the second connecting seat 210 constitute the second board-to-board connector 200 .
  • the socket on the fourth connecting part 211 and the plug on the fifth connecting part 221 are provided with mutually matching electrical contacts, when the first board-to-board connector 100 is plugged and formed, the second board-to-board connector
  • the matching plug and socket will complete the electrical conduction through the contact of the electrical contact, that is, the first board-to-board connector 100 and the second board-to-board connector 200 will form a conductive connection after the plug-in is formed.
  • the structure of the board-to-board connector is more suitable for realizing the electrical connection of the device of the present application.
  • the first connection seat 110 is provided with a first socket, the first part of the first socket is located at the first electrical connecting part 111 , and the second part of the first socket is located at the first connecting part 112 .
  • the first portion of the first socket communicates with the second portion of the first socket.
  • the first connector 120 is provided with a first plug, a first portion of the first plug is located at the second electrical connecting portion 121 , and a second portion of the first plug is located at the second connecting portion 122 .
  • the first portion of the first plug communicates with the second portion of the first plug
  • the first plug is plugged into the first socket, and the first socket and the first plug are provided with mutually matching electrical contacts, so as to realize electrical conduction between the first connecting base 110 and the first connecting head 120 .
  • This arrangement of the first electrical connecting part 111 and the first connecting part 112 sharing the first socket, and the second electrical connecting part 121 and the second connecting part 122 sharing the first plug can save the first electrical connecting part 111 and the second connecting part 122.
  • the gaps between the first connecting parts 112 and between the second electrical connection part 121 and the second connecting part 122 are set to further reduce the layout space and improve the utilization rate of the circuit board stacking structure.
  • the first receiving part 701 and the second receiving part 702 can each be provided with a plurality of pads, and the first electrical connection part 111 and the first connecting part 112 can both be provided with multiple pins.
  • the pads in the first receiving part 701 and the pins in the first electrical connection part 111 correspond one-to-one and are connected in sequence.
  • the pins and the pads are connected by SMT or DIP.
  • the soldering between the first connection seat 110 and the third circuit board 700 is realized.
  • the sixth connection part 501 is provided with a plurality of pads
  • the fifth connection part 221 is provided with a plurality of pins
  • the pin in the fifth connection part 221 the pin in the sixth connection part 501
  • the pads correspond one-to-one and are connected in sequence.
  • the soldering between the pins and the pads is realized through SMT patch or DIP plug-in, and then the second connector 220 is soldered to the second circuit board. 500.
  • the pins in the first electrical connecting portion 111 correspond to the pins in the second electrical connecting portion 121 one by one
  • the pins in the first connecting portion 112 correspond to the pins in the second connecting portion 122
  • the third circuit board 700, the first board-to-board connector 100, the first circuit board 300, the transition board 400, the second board-to-board connector 200 and the second circuit board 500 are sequentially stacked by welding Form a circuit board stack structure.
  • the pads in the connecting portion 501 correspond to each other and are sequentially connected to form the first via 10 .
  • the pads in the second receiving portion 702, the pins in the first connecting portion 112, the pins in the second connecting portion 122, and the pads in the third connecting portion 312 are in one-to-one correspondence and connected in sequence to form a second Passage 20.
  • the design of the above-mentioned pads and pins can not only ensure the connection between the third circuit board 700, the circuit board assembly and the second circuit board through welding, but also ensure the effective electrical conduction of the second path 20 and the connection between the second circuit board 700 and the second circuit board.
  • the effective electrical conduction of one channel 10 kills two birds with one stone.
  • the circuit board stack structure may include a reinforcing board 600 .
  • the reinforcement board 600 is stacked on a side of the second circuit board 500 away from the second connector 220 .
  • the arrangement of the reinforcement board 600 can increase the overall strength of the second circuit board 500 and prevent abnormal deformation such as warping and torsion.
  • the third circuit board 700 may be provided with a receiving hole 710, and at least part of the first connecting seat 110 is provided in the receiving hole 710. This structure can realize the connection between the first connecting seat 110 and the third circuit.
  • the boards 700 are at least partially overlapped in the stack height direction, thereby realizing thinning of the circuit board stack structure.
  • the pads of the first receiving part 701 and the pads of the second receiving part 702 can be arranged around the receiving hole 710, and the pins of the first electrical connecting part 111 and the pins of the first connecting part 112 can be set around A connecting seat 110 is provided around the periphery to achieve better fit between the two.
  • the electronic device disclosed in the embodiment of the present application may be a mobile phone, a tablet computer, an e-book reader, a wearable device (such as a smart watch, smart glasses), etc., and the electronic device includes a circuit board assembly, and the embodiment of the present application does not limit the electronic device Specific types.

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  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

提供一种电路板堆叠结构，包括依次叠置的第三电路板（700）、电路板组件和第二电路板（500），电路板组件包括依次叠置的第一连接头（120）、第一电路板（300）和第二连接座（210），第一连接头（120）设有第二电衔接部（121）和第二连接部（122），第二连接座（210）设有第四连接部（211），第一电路板（300）朝向第一连接头（120）的一面设有第三电衔接部（311）和第三连接部（312），第一电路板（300）朝向第二连接座（210）的一面设有第四电衔接部（321），第一电路板（300）内的第一导线、第三连接部（312）与第二连接部（122）依次电连接，从而使第一电路板（300）和第三电路板（700）之间形成第二通路（20），第四连接部（211）、第四电衔接部（321）、第三电衔接部（311）、第二电衔接部（121）依次电连接，从而使第二电路板（500）和第三电路板（700）之间形成第一通路（10）。

Description

电路板组件、电路板堆叠结构及电子设备
交叉引用
本发明要求在2021年08月11日提交中国专利局、申请号为202110921182.6、发明名称为“电路板组件、电路板堆叠结构及电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本发明中。
技术领域
本申请涉及电子设备技术领域，特别涉及一种电路板组件、电路板堆叠结构及电子设备。
背景技术
随着电子设备的不断发展，内部器件也不断增加，以手机为例，手机中的各功能器件，比如镜头、存储器、显卡等均需要通过连接电路板等来实现供电。
相关技术中，通常为在主板上平行铺设各条电路板，以实现各自的供电，但是这样的布置方式，在主板上布设面积有限的情况下，能够布置的电路板个数也是有限的，这样将限制所能安装的功能器件数量，电路板的集成度和利用率无法进一步提高。
发明内容
本发明提出了一种电路板组件、电路板堆叠结构及电子设备，以解决电路板的集成度和利用率无法进一步提高的问题。
在第一方面，本申请公开一种电路板组件，包括依次叠置的第一连接头、第一电路板和第二连接座，第一连接头设有第二电衔接部和第二连接部，第 二连接座设有第四连接部，第一电路板朝向第一连接头的一面设有第三电衔接部和第三连接部，第一电路板朝向第二连接座的一面设有第四电衔接部，第一电路板包括第一导线，第一导线、第三连接部与第二连接部依次电连接，以形成第二通路，第四连接部、第四电衔接部、第三电衔接部、第二电衔接部依次电连接，以形成第一通路。
在第二方面，本申请公开一种电路板堆叠结构，包括依次叠置的第三电路板、电路板组件和第二电路板，第三电路板朝向电路板组件的一面设第一连接座，第三电路板通过第一连接座连接第一连接头，第二电路板朝向电路板组件的一面设第二连接头，第二电路板通过第二连接头连接第二连接座，第三电路板设有第一接收部和第二接收部，第一连接座设有第一电衔接部和第一连接部，第二连接头设有第五连接部，第二电路板设有第六连接部，在第一通路中，第六连接部、第五连接部、第四连接部、第四电衔接部、第三电衔接部、第二电衔接部、第一电衔接部和第一接收部依次电连接，在第二通路中，第一导线、第三连接部、第二连接部、第一连接部和第二接收部依次电连接。
在第三方面，本申请公开一种电子设备，包括电路板组件。
本发明的有益效果如下：
本申请公开一种电路板堆叠结构，包括依次叠置的第三电路板、电路板组件和第二电路板，其中电路板组件包括依次叠置的第一连接头、第一电路板和第二连接座，第一连接头设有第二电衔接部和第二连接部，第二连接座设有第四连接部，电路板朝向第一连接头的一面设有第三电衔接部和第三连接部，电路板朝向第二连接座的一面设有第四电衔接部。
第一导线、第三连接部和第二连接部依次电连接，从而使第一电路板和第三电路板电之间形成第二通路，第四连接部、第四电衔接部、第三电衔接部、第二电衔接部依次电连接，从而使第二电路板和第三电路板之间形成第一通路。
此种电路板堆叠结构通过叠置的方式，能够在布线面积不变的情况下布局更多的电路板，从而提高电路板堆叠结构的集成度和利用率，进而满足更多功能器件的供电需求。
附图说明
此处所说明的附图用来提供对本申请的进一步理解，构成本申请的一部分，本申请的示意性实施例及其说明用于解释本申请，并不构成对本申请的不当限定。在附图中：
图1本发明实施例公开的电路板组件结构图；
图2本发明实施例公开的图1的A向视图；
图3本发明实施例公开的图1的B向视图；
图4本发明实施例公开的第一电路板的背面结构图；
图5本发明实施例公开的第一电路板的正面结构图；
图6本发明实施例公开的过渡板的背面结构图；
图7本发明实施例公开的过渡板的正面结构图；
图8本发明实施例公开的电路板组件中第一通路和第二通路的路径图；
图9本发明实施例公开的电路板堆叠结构的结构图；
图10本发明实施例公开的图9的C-C向剖视图；
图11本发明实施例公开的图9的D-D向剖视图；
图12本发明实施例公开的电路板堆叠结构中第一通路和第二通路的路径图；
图13本发明实施例公开的电路板堆叠结构的另一种结构图。
附图标记说明：
20-第二通路、10-第一通路、
100-第一板对板连接器100、
110-第一连接座、111-第一电衔接部、112-第一连接部、
120-第一连接头、121-第二电衔接部、122-第二连接部、
200-第二板对板连接器、
210-第二连接座、211-第四连接部、
220-第二连接头、221-第五连接部、
300-第一电路板、
311-第三电衔接部、312-第三连接部、
321-第四电衔接部、
400-过渡板、
411-第五电衔接部、412-预留连接部、
421-第六电衔接部、
500-第二电路板、
501-第六连接部、
600-补强板、
700-第三电路板、
710-容纳孔、701-第一接收部、702-第二接收部。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请具体实施例及相应的附图对本申请技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
如图1～图13所示，本申请公开了一种电路板堆叠结构，该电路板堆叠结构可以包括依次叠置的第三电路板700、电路板组件和第二电路板500。
第三电路板700可以是主板，以作为本申请电路板堆叠结构的安装基础。第二电路板500可以是柔性电路板(Flexible Printed Circuit，FPC)，电路板 组件中可以设置柔性电路板。
采用该种电路板堆叠结构，可使第三电路板700和电路板组件之间，以及第三电路板700和第二电路板500之间分别形成独立的电流通路。较之相关技术中通过平铺在主板上贴片布置的方式，本申请的此种堆叠结构布置，在布设面积不变的情况下能够布设更多的电路板，从而提高整体集成度和利用率，进而满足更多功能器件的供电需求。
为达到上述技术效果，首先对电路板组件进行介绍：
请参考图1～图8，本申请的电路板组件可以包括依次叠置的第一连接头120、第一电路板300和第二连接座210。其中第一电路板300可以是柔性电路板或者数据线等结构，第一连接头120和第二连接座210可以是分别布设在第一电路板300两侧上的接口，以供电流的输入输出。
如图1～图3所示，第一连接头120可以设有第二电衔接部121和第二连接部122。第二电衔接部121和第二连接部122均可以设置为接口，以便与不同的功能器件进行连接。第二连接座210设有第四连接部211，第四连接部211也可以设置接口，以便与第二电衔接部121进行连通。
如图1、图4和图5所示，第一电路板300朝向第一连接头120的一面可以设有第三电衔接部311和第三连接部312，第一电路板300朝向第二连接座210的一面可以设有第四电衔接部321。
如图8所示，第三连接部312与第二连接部122的位置对应，比如两者分别设置为引脚和焊盘的结构，这样第三连接部312可以焊接于第二连接部122，以在第三连接部312与第二连接部122之间建立电连接。
同时，第一电路板300内设有第一导线，第一导线可以印刷方式刻蚀在第一电路板300上，或者设置在第一电路板300内，第一导线连接第三连接部312，第一导线作为电能的传输介质，可以实现对第三连接部312的电传导。
此种方式的设置，可以使第一导线、第三连接部312与第二连接部122 依次电连接，以形成第二通路20。这样外接电源的电流可经第一导线引入第一电路板300中，并依次经过第三连接部312和第二连接部122进行输出。可以看出，第二连接部122为第二通路20的电流输出端，第一导线为第二通路20的电流输入端。
第四电衔接部321和第三电衔接部311之间的位置对应，第四连接部211和第四电衔接部321之间的位置对应，第三电衔接部311和第二电衔接部121之间的位置对应，比如设置为引脚或者焊盘的结构，这样第四连接部211、第四电衔接部321、第三电衔接部311、第二电衔接部121依次电连接，以形成第一通路10。
在此结构中，第一电路板300布设的第一导线不经过第四电衔接部321和第三电衔接部311，这样第四连接部211可以为第一通路10的电流输入端，第二电衔接部121可以为第一通路10的电流输出端。
可以看出，在此种电路板组件结构中，第三连接部312设置为第一电路板300的“自用”部分，第一电路板300内布设的第一导线将连接第三连接部312，进而实现第二通路20的导通。
而第一电路板300内布设的第一导线分别与第三电衔接部311、第四电衔接部321保持隔离，即第三电衔接部311和第四电衔接部321的设置为第一电路板300的“桥梁”部分，该“桥梁”部分起承上启下的过渡作用，不会受到第一电路板300内部布设的第一导线的干扰，并且第三电衔接部311和第四电衔接部321所构成的整体，即该“桥梁”部分可连通第四连接部211和第二电衔接部121，以形成第一通路10。
综上，本申请的电路板组件中，不仅可以实现第一电路板300自身所接入的电源的导通(即第二通路20)，以发挥第一电路板300本身的功能，而且通过第四连接部211和第二电衔接部121的设置，并通过第三电衔接部311和第四电衔接部321的“桥梁”部分的设置，可实现导通其他电源和功能器件(即第一通路10)。这样，电路板组件的此种堆叠方式，不仅可满足更多 功能器件需求，而且将占用更少的布置空间，从而提高了电路板组件的利用率。
进一步的，对于柔性电路板结构的第一电路板300来说，电路板组件还可以设置包括过渡板400。过渡板400可以为第一电路板300进行补强，具体来说，过渡板400可以叠置于第一电路板300和第二连接座210之间。这样第一电路板300强度得到局部加强，即第一电路板300用于安装过渡板400的部分被增加了强度，这样电路板300不易发生翘曲、扭转等形变，进而避免其上安装的第二连接座210和第一连接头120随形变偏移安装位置。
而过渡板400应当不干涉第二通路20的导通，故如图6和图7所示，过渡板400朝向第二连接座210的一面可以设有第六电衔接部421，过渡板400朝向第一电路板300的一面可以设有第五电衔接部411。
其中第六电衔接部421、第五电衔接部411、第四电衔接部321、第三电衔接部311可以均设置为焊盘结构，并且彼此位置相互对应，这样第六电衔接部421、第五电衔接部411所构成的整体可以起到第四电衔接部321、第三电衔接部311所构成的整体类似的作用，即第六电衔接部421、第五电衔接部411的设置可以作为过渡板400的“桥梁”部分，该“桥梁”部分起承上启下的过渡作用，可与第四电衔接部321、第三电衔接部311所形成的“桥梁”部分相互配合，使第四连接部211和第二电衔接部121之间进行连通。换句话说，第四连接部211、第六电衔接部421、第五电衔接部411、第四电衔接部321、第三电衔接部311、第二电衔接部121可以依次电连接，以形成第一通路10。
进一步的，对于第一连接头120与第一电路板300之间的连接方式来说，可以如图4和图5所示，第三电衔接部311、第三连接部312和第四电衔接部321均设有多个焊盘，其中第三电衔接部311中的焊盘和第四电衔接部321中的焊盘一一对应、并依次相连，比如第三电衔接部311中的焊盘和第四电衔接部321中的焊盘所形成的整体为贯穿于第一电路板300上的多个电极柱， 或者第三电衔接部311中的焊盘和第四电衔接部321中的焊盘之间设置有电线等。
同时如图1和图2所示，第二电衔接部121和第二连接部122可以均设有多个引脚，其中第二电衔接部121中的引脚和第三电衔接部311中的焊盘一一对应、并依次相连。第二连接部122中的引脚和第三连接部312中的焊盘一一对应、并相互连接。这样，通过焊盘和引脚之间的连接，比如采用SMT贴片、或者DIP插接的焊接方式，便实现第一连接头120焊接于第一电路板300上。
上述的焊盘、引脚的设计，不仅能够通过焊接的方式保证第一连接头120、第一电路板300、过渡板400和第二连接座210之间的连接稳固，而且能够保证第二通路20有效电传导、以及第一通路10的有效电传导，一举两得。
如图6和图7所示，对于过渡板400和第二连接座210之间，以及过渡板400和第一电路板300之间连接方式来说，第五电衔接部411和第六电衔接部421也可以均设有多个焊盘，并且第五电衔接部411中的焊盘和第六电衔接部421中的焊盘一一对应、并依次相连，比如第五电衔接部411中的焊盘和第六电衔接部421中的焊盘所形成的整体为贯穿于过渡板400上的多个电极柱，或者第五电衔接部411中的焊盘和第六电衔接部421中的焊盘之间设置电线等。
同时，如图1和图3所示，第四连接部211可以设有多个引脚，并且第六电衔接部421中的焊盘和第四连接部211中的引脚一一对应、并依次相连，这样便实现第二连接座210和过渡板400之间的相互焊接。
还需要指出的是，第四电衔接部321中的焊盘和第五电衔接部411中的焊盘一一对应、并依次相连，这样便实现第一电路板300和过渡板400之间的相互焊接。
如此一来，第一连接头120、第一电路板300、过渡板400和第二连接座210通过焊接方式依次叠置以形成电路板组件。同时第二电衔接部121中的 引脚、第三电衔接部311中的焊盘、第四电衔接部321中的焊盘、第五电衔接部411中的焊盘、第六电衔接部421中的焊盘、第四连接部211中的引脚一一对应、并依次相连，以形成第一通路10；而第二连接部122中的引脚和第三连接部312中的焊盘一一对应、并相互连接以形成第二通路20。
更为具体的，如图6所示，过渡板400还可以包括预留连接部412。预留连接部412可以是贯穿过渡板400的电极柱，以作为第五电衔接部411和第六电衔接部421所在位置的备用区，如果第五电衔接部411和第六电衔接部421出现损坏，可通过将过渡板400换向安装的方式，使预留连接部412与第四电衔接部321、第四连接部211建立连接关系，防止第一通路10断开连接。
以上是电路板组件的结构介绍，下面继续介绍安装有电路板组件的电路板堆叠结构：
如上文所述，第三电路板700、电路板组件和第二电路板500依次叠置。同时如图9所示，第三电路板700朝向电路板组件的一面设第一连接座110，这样第三电路板700通过第一连接座110连接第一连接头120，比如一连接座110焊接于第一连接头120。
同时，第二电路板500朝向电路板组件的一面设第二连接头220，第二电路板500通过第二连接头220连接第二连接座210，比如第二连接头220焊接于第二连接座210。
如图9～图12所示，第三电路板700可以设有第一接收部701和第二接收部702。第一连接座110可以设有第一电衔接部111和第一连接部112。第二连接头220可以设有第五连接部221。第二电路板500可以设有第六连接部501。
这样在第一通路10中，第六连接部501、第五连接部221、第四连接部211、第六电衔接部421、第五电衔接部411、第四电衔接部321、第三电衔接部311、第二电衔接部121、第一电衔接部111和第一接收部701依次电连 接。其中第二电路板500中可以布设连通第六连接部501的电线，比如布设第二导线，第三电路板700中可以布设连通第一接收部701的电线，比如第三导线，这样第二电路板500在通过第二导线接入电源的情况下，可将电能通过第一通路10传输至第一接收部701，并再通过第三电路板700上布设的第三导线传输至对应的功能器件。
而在在第二通路20中，第一电路板300中的第一导线、第三连接部312、第二连接部122、第一连接部112和第二接收部702依次电连接，同时第三电路板700中布设连通第二接收部702的电线，比如布设第四导线，这样第一电路板300在通过第一导线接入电源的情况下，可将电能通过第二通路20传输至第二接收部702，并再通过第三电路板700上布设的第四导线传输至对应的功能器件。
综上，在此种电路板堆叠结构中，通过叠置的方式可以同时形成两条不同的回路，即第一通路10和第二通路20，进而实现为不同的功能器件供电，比如分别为镜头、存储器供电，或者为不同的镜头供电等。这样，本申请的电路板堆叠结构能够在布线面积不变的情况下，布局更多的电路板，从而提高了电路板堆叠结构的集成度和利用率，进而满足更多功能器件供电需求。
更为具体的，第一连接头120插接于第一连接座110。比如第一电衔接部111、第一连接部112各自设一插口，而第二电衔接部121、第二连接部122各自设一插头，第一电衔接部111和第二电衔接部121之间相互插接，第一连接部112和第二连接部122之间相互插接。第一连接座110和第一连接头120构成第一板对板连接器100。
第二连接头220插接于第二连接座210。比如第四连接部211设一插口，而第五连接部221设一插头，第四连接部211和第五连接部221之间相互插接。第二连接头220和第二连接座210构成第二板对板连接器200。
在此种结构中，具体来说第一电衔接部111上的插口和第二电衔接部121的插头之间、第一连接部112上的插口和第二连接部122上的插头之间、以 及第四连接部211上的插口和第五连接部221上的插头之间均设有相互匹配的电触头，当第一板对板连接器100插接形成、第二板对板连接器200插接形成时，相互匹配的插头和插口之间便通过电触头的接触完成导电，即第一板对板连接器100、第二板对板连接器200在插接形成后便形成导电体，此种板对板连接器的结构设置更适于实现本申请本装置的电连接。
进一步的，如图10所示，第一连接座110设有第一插口，第一插口的第一部分位于第一电衔接部111，第一插口的第二部分位于第一连接部112。第一插口的第一部分与第一插口的第二部分连通。
如图2所示，第一连接头120设有第一插头，第一插头的第一部分位于第二电衔接部121、第一插头的第二部分位于第二连接部122。第一插头的第一部分与第一插头的第二部分连通
第一插头插接于第一插口，第一插口和第一插头上均设有相互匹配的电触头，以实现第一连接座110和第一连接头120之间的电导通。
此种第一电衔接部111和第一连接部112共用第一插口，以及第二电衔接部121和第二连接部122共用第一插头的设置方式，可以省去第一电衔接部111和第一连接部112之间、第二电衔接部121和第二连接部122之间的间隙设置，进一步减小布设空间，提高电路板堆叠结构的利用率。
更为具体的，如图9和图10所示，第一接收部701和第二接收部702可以均设有多个焊盘，第一电衔接部111、第一连接部112可以均设有多个引脚。第一接收部701中的焊盘、第一电衔接部111中的引脚一一对应、并依次相连，比如引脚和焊盘之间通过SMT贴片或者DIP插装的方式实现两者之间的焊接，进而实现第一连接座110焊接于第三电路板700。
同时如图9和图11所示，第六连接部501设有多个焊盘，第五连接部221设有多个引脚，第五连接部221中的引脚、第六连接部501中的焊盘一一对应、并依次相连，比如引脚和焊盘之间通过SMT贴片或者DIP插装的方式实现两者之间的焊接，进而实现第二连接头220焊接于第二电路板500。
同时，第一电衔接部111中的引脚和第二电衔接部121中的引脚一一对应，第一连接部112中的引脚和第二连接部122中的引脚一一对应，这样配合电触头的设置，第一连接座110和第一连接头120组装后，第一电衔接部111中的引脚和第二电衔接部121中的引脚可以相互连接以实现电导通，第一连接部112中的引脚和第二连接部122中的引脚可以相互连接以实现电导通。
如此一来，第三电路板700、第一板对板连接器100、第一电路板300、过渡板400、第二板对板连接器200和第二电路板500通过焊接方式依次叠置以形成电路板堆叠结构。
同时，第一接收部701中的焊盘、第一电衔接部111中的引脚、第二电衔接部121中的引脚、第三电衔接部311中的焊盘、第四电衔接部321中的焊盘、第五电衔接部411中的焊盘、第六电衔接部421中的焊盘、第四连接部211中的引脚、第五连接部221中的引脚、第六连接部501中的焊盘一一对应、并依次相连以形成第一通路10。
第二接收部702中的焊盘、第一连接部112中的引脚、第二连接部122中的引脚和第三连接部312中的焊盘一一对应、并依次相连以形成第二通路20。
上述的焊盘、引脚的设计，不仅能够通过焊接的方式保证第三电路板700、电路板组件和第二电路板之间的连接稳固，而且能够保证第二通路20有效电传导、以及第一通路10的有效电传导，一举两得。
更为具体的，如图9所示，电路板堆叠结构可以包括补强板600。补强板600叠置于第二电路板500背离第二连接头220的一侧。对于柔性电路板结构的第二电路板500来说，补强板600的设置可以增加第二电路板500的整体强度，防止出现翘曲、扭转等异常形变。
更进一步的，如图13所示，第三电路板700可以设有容纳孔710，第一连接座110的至少部分设于容纳孔710，此种结构可以实现第一连接座110 和第三电路板700在堆叠高度方向的至少部分重叠，进而实现电路板堆叠结构的减薄。
更为具体的，第一接收部701的焊盘和第二接收部702的焊盘可以围绕容纳孔710进行设置，第一电衔接部111的引脚和第一连接部112的引脚可以围绕一连接座110周部设置，以实现两者之间更好的适配。
本申请实施例公开的电子设备可以是手机、平板电脑、电子书阅读器、可穿戴设备(例如智能手表、智能眼镜)等，该电子设备包括电路板组件，本申请实施例不限制电子设备的具体种类。
以上所述仅为本申请的实施例而已，并不用于限制本申请。对于本领域技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本申请的权利要求范围之内。

Claims (10)

  1. 一种电路板组件，包括依次叠置的第一连接头(120)、第一电路板(300)和第二连接座(210)，
    所述第一连接头(120)设有第二电衔接部(121)和第二连接部(122)，所述第二连接座(210)设有第四连接部(211)，
    所述第一电路板(300)朝向所述第一连接头(120)的一面设有第三电衔接部(311)和第三连接部(312)，所述第一电路板(300)朝向所述第二连接座(210)的一面设有第四电衔接部(321)，
    所述第一电路板(300)包括第一导线，所述第一导线、所述第三连接部(312)与所述第二连接部(122)依次电连接，以形成第二通路(20)，
    所述第四连接部(211)、所述第四电衔接部(321)、所述第三电衔接部(311)、所述第二电衔接部(121)依次电连接，以形成第一通路(10)。
  2. 根据权利要求1所述的电路板组件，其中：所述电路板组件还包括过渡板(400)，所述过渡板(400)叠置于所述第一电路板(300)和所述第二连接座(210)之间，
    所述过渡板(400)朝向所述第二连接座(210)的一面设有第六电衔接部(421)，所述过渡板(400)朝向所述第一电路板(300)的一面设有第五电衔接部(411)，
    所述第四连接部(211)、所述第六电衔接部(421)、所述第五电衔接部(411)、所述第四电衔接部(321)、所述第三电衔接部(311)、所述第二电衔接部(121)依次电连接，以形成所述第一通路(10)。
  3. 根据权利要求2所述的电路板组件，其中：所述第三电衔接部(311)、所述第三连接部(312)、第四电衔接部(321)、所述第五电衔接部(411)和所述第六电衔接部(421)均设有多个焊盘，
    所述第四连接部(211)、所述第二电衔接部(121)和所述第二连接部(122)均设有多个引脚，
    所述第二电衔接部(121)中的引脚、所述第三电衔接部(311)中的焊盘、所述第四电衔接部(321)中的焊盘、所述第五电衔接部(411)中的焊盘、所述第六电衔接部(421)中的焊盘、所述第四连接部(211)中的引脚一一对应、并依次相连，
    所述第二连接部(122)中的引脚和所述第三连接部(312)中的焊盘一一对应、并相互连接。
  4. 一种电路板堆叠结构，包括依次叠置的第三电路板(700)、权利要求1所述的电路板组件和第二电路板(500)，
    所述第三电路板(700)朝向所述电路板组件的一面设第一连接座(110)，所述第三电路板(700)通过所述第一连接座(110)连接所述第一连接头(120)，
    所述第二电路板(500)朝向所述电路板组件的一面设第二连接头(220)，所述第二电路板(500)通过所述第二连接头(220)连接所述第二连接座(210)，
    所述第三电路板(700)设有第一接收部(701)和第二接收部(702)，所述第一连接座(110)设有第一电衔接部(111)和第一连接部(112)，所述第二连接头(220)设有第五连接部(221)，所述第二电路板(500)设有第六连接部(501)，
    在所述第一通路(10)中，所述第六连接部(501)、所述第五连接部(221)、所述第四连接部(211)、所述第四电衔接部(321)、所述第三电衔接部(311)、所述第二电衔接部(121)、所述第一电衔接部(111)和所述第一接收部(701)依次电连接，
    在所述第二通路(20)中，所述第一导线、所述第三连接部(312)、所述第二连接部(122)、所述第一连接部(112)和所述第二接收部(702)依次电连接。
  5. 根据权利要求4所述的电路板堆叠结构，其中：所述电路板组件还包括过渡板(400)，所述过渡板(400)叠置于所述第一电路板(300)和所述第二连接座(210)之间，
    所述过渡板(400)朝向所述第二连接座(210)的一面设有第六电衔接部(421)，所述过渡板(400)朝向所述第一电路板(300)的一面设有第五电衔接部(411)，
    在所述第一通路(10)中，所述第六连接部(501)、所述第五连接部(221)、所述第四连接部(211)、所述第六电衔接部(421)、第五电衔接部(411)、所述第四电衔接部(321)、所述第三电衔接部(311)、所述第二电衔接部(121)、所述第一电衔接部(111)和所述第一接收部(701)依次电连接。
  6. 根据权利要求5所述的电路板堆叠结构，其中：所述第一连接头(120)插接于所述第一连接座(110)，所述第一连接座(110)和所述第一连接头(120)构成第一板对板连接器(100)；
    所述第二连接头(220)插接于所述第二连接座(210)，所述第二连接头(220)和所述第二连接座(210)构成第二板对板连接器(200)。
  7. 根据权利要求5所述的电路板堆叠结构，其中：所述第一接收部(701)、第二接收部(702)、所述第三电衔接部(311)、所述第三连接部(312)、第四电衔接部(321)、所述第五电衔接部(411)、所述第六电衔接部(421)和所述第六连接部(501)均设有多个焊盘，
    第一电衔接部(111)、第一连接部(112)、所述第四连接部(211)、所述第五连接部(221)、所述第二电衔接部(121)和所述第二连接部(122)均设有多个引脚，
    所述第一接收部(701)中的焊盘、所述第一电衔接部(111)中的引脚、所述第二电衔接部(121)中的引脚、所述第三电衔接部(311)中的焊盘、所述第四电衔接部(321)中的焊盘、所述第五电衔接部(411)中的焊盘、所述第六电衔接部(421)中的焊盘、所述第四连接部(211)中的引脚、所述第五连接部(221)中的引脚、所述第六连接部(501)中的焊盘一一对应、并依次相连，
    所述第二接收部(702)中的焊盘、所述第一连接部(112)中的引脚、 所述第二连接部(122)中的引脚和第三连接部(312)中的焊盘一一对应、并依次相连。
  8. 根据权利要求4所述的电路板堆叠结构，其中：所述第三电路板(700)设有容纳孔(710)，所述第一连接座(110)的至少部分设于所述容纳孔(710)中。
  9. 根据权利要求4所述的电路板堆叠结构，其中：所述电路板堆叠结构包括补强板(600)，所述补强板(600)叠置于所述第二电路板(500)背离所述第二连接头(220)的一侧。
  10. 一种电子设备，包括权利要求1～3中任意一项所述的电路板组件。
PCT/CN2022/110556 2021-08-11 2022-08-05 电路板组件、电路板堆叠结构及电子设备 WO2023016368A1 (zh)

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