WO2023015929A1 - 电子设备后盖及电子设备 - Google Patents

电子设备后盖及电子设备 Download PDF

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Publication number
WO2023015929A1
WO2023015929A1 PCT/CN2022/087448 CN2022087448W WO2023015929A1 WO 2023015929 A1 WO2023015929 A1 WO 2023015929A1 CN 2022087448 W CN2022087448 W CN 2022087448W WO 2023015929 A1 WO2023015929 A1 WO 2023015929A1
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WO
WIPO (PCT)
Prior art keywords
area
thickness
layer
back cover
electronic device
Prior art date
Application number
PCT/CN2022/087448
Other languages
English (en)
French (fr)
Inventor
霍文龙
尹帮实
武文博
郜成杰
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to EP22737550.8A priority Critical patent/EP4156659B1/en
Publication of WO2023015929A1 publication Critical patent/WO2023015929A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/02—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising animal or vegetable substances, e.g. cork, bamboo, starch
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/02—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising animal or vegetable substances, e.g. cork, bamboo, starch
    • B32B9/025—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising animal or vegetable substances, e.g. cork, bamboo, starch comprising leather
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0262—Details of the structure or mounting of specific components for a battery compartment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279—Improving the user comfort or ergonomics
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279—Improving the user comfort or ergonomics
    • H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H04M1/185—Improving the rigidity of the casing or resistance to shocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/737—Dimensions, e.g. volume or area
    • B32B2307/7375—Linear, e.g. length, distance or width
    • B32B2307/7376—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00—Containers; Receptacles
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present application relates to the field of terminal equipment, and in particular to a rear cover of an electronic equipment and the electronic equipment.
  • the back cover of some electronic equipment is a glass back cover
  • the glass back cover has the characteristics of thin thickness, and the height of the middle frame of the electronic equipment on the market is correspondingly reduced to fit the glass back cover.
  • the present application provides an electronic device back cover and the electronic device.
  • the fiber composite material is used to prepare the back cover of the electronic device, and the back cover of the electronic device is prepared into a structure of unequal thickness in which the thickness bottleneck area facing the battery part of the electronic device is thin, and the other non-thickness bottleneck areas are thicker, reducing in disguise.
  • the thickness of the back cover of the electronic device enables it to fit in the middle frame of the electronic device of the glass back cover.
  • the present application provides an electronic device back cover, which includes: the first structural layer includes a first region and a second region, and the thickness of the first region is greater than the thickness of the second region; wherein, the second The area forms a second area orthographic projection along the thickness direction of the electronic device, the battery of the electronic device forms a battery orthographic projection along the thickness direction of the electronic device, and the second area orthographic projection includes the battery orthographic projection.
  • the back cover of the electronic equipment is prepared to be thin in the thickness bottleneck area facing the battery part of the electronic equipment, and the other non-thickness bottleneck areas are thick. The cover fits in the electronics box.
  • the first structural layer is a fiber composite board.
  • the one-piece fiber composite board has a simple process for preparing and molding the back cover.
  • the first area is a fiber composite board
  • the second area is a metal substrate
  • the upper surfaces of the first area and the second area are located on the same horizontal plane; the overlapping areas of the first area and the second area are fixedly connected.
  • the overlapping area can be located in the first area, the overlapping area can also be located in the second area, and can also straddle the first area and the second area.
  • the fixed connection of the overlapping area can ensure the reliability of the connection between the first area and the second area.
  • the overlapping area between the first area and the second area is fixed by glue bonding, or the precursor of the fiber composite board in the first area is hot-pressed on the metal substrate Thermoset forming.
  • the overlapping area is fixed by colloid bonding, the process is simple and the firmness is good.
  • the precursor of the fiber composite board in the first area is hot-pressed on the metal substrate for thermosetting molding. After curing, the fiber composite board and the metal substrate are bonded by molecular force without adhesive.
  • the overlapping area between the metal substrate and the fiber composite board is partially corroded. Local corrosion of the overlapping area of the metal substrate and the fiber composite board can increase the bonding force between the fiber composite board and the metal substrate in the overlapping area.
  • holes are partially dug in the overlapping area of the metal substrate and the fiber composite board.
  • the local digging design of the overlapping area of the metal substrate and the fiber composite board can increase the bonding force between the fiber composite board and the metal substrate in the overlapping area.
  • the thickness of the metal substrate in the first structural layer of the back cover of the electronic device provided in the first aspect of the present application ranges from 0.15 mm to 0.3 mm.
  • the thickness of the metal substrate is set to 0.15 mm to 0.3 mm.
  • the first region of the first structural layer provided in the first aspect of the present application is a region bonded and fixed to the middle frame of the electronic device.
  • the thickness of the area bonded and fixed with the middle frame in the first structural layer is thickened, so that the orthographic projection area of the second area formed in the second area along the thickness direction of the electronic device is larger, so that the inside of the electronic device There is more room for accommodation.
  • the area where the edge of the back cover is bonded and fixed to the middle frame of the electronic device is thin, and can be adapted to the outer contour of the middle frame that is compatible with the glass back cover.
  • the thickness of the first region of the first structural layer provided in the first aspect of the present application is gradually changed, wherein the thickness of the first region is thicker the farther it is from the outer edge of the middle frame.
  • Designing the first region as a structure with a gradually changing thickness can make the shape of the rear case of the electronic device more individual and diverse.
  • the thickness of the outer edge of the adhesive area is in the range of 0.15 mm to 0.45 mm, which can make the back cover of the embodiment of the application fit the same glass back cover. Electronic devices in the box.
  • the electronic device rear cover provided in the first aspect of the present application further includes: a second structural layer; the second structural layer is located on the outer surface of the first structural layer. Arranging the second structural layer on the outer surface of the first structural layer can protect the first structural layer or modify the back cover.
  • the second structural layer provided in the first aspect of the present application is a covering layer, and the covering layer and the first structural layer are bonded and fixed by an adhesive layer.
  • the covering layer is arranged on the outer surface of the first structural layer, which can not only improve the aesthetics of the back cover, but also improve the gripping feel of the electronic device.
  • the adhesive layer can be double-sided tape or adhesive, and the bonding process of the adhesive layer is simple and low in cost.
  • the cover layer of the electronic device back cover provided in the first aspect of the present application includes: plain leather, genuine leather, bamboo veneer, etc.; cover layers made of different materials have different handles and appearances, and different styles of electronic devices can be prepared back cover.
  • the thickness of the third area of the cover layer covered on the first structural layer is gradually changed, wherein the third area is a predetermined distance from the outer edge of the middle frame, and the third area
  • the thickness of the third area of the partial area of the covering layer after hot stamping of the hot stamping mold is thicker the farther it is from the outer edge of the middle frame.
  • the covering layer on the outer edge of the back cover is thinned, so that the thickness of the edge of the back cover is thinned, which is better adapted to the middle frame of the electronic device of the glass back cover.
  • the first structural layer is provided with a protrusion near the outer edge of the middle frame, and the upper surface of the protrusion is embossed with the upper surface of the third area of the covering layer Smooth transition.
  • the embossed covering layer can be engaged with the protrusion provided on the edge of the first structural layer, which can improve the bonding firmness between the covering layer and the first structural layer.
  • the smooth transition between the raised upper surface and the embossed upper surface of the third area of the covering layer can improve the smoothness of the outer surface of the back cover. This type can make the back cover present a 2.5D effect by hot stamping a partial area of the outer surface covering layer of the 2D back cover.
  • the whole covering layer provided in the first aspect of the present application is hot stamped with a hot stamping mold.
  • the overall hot stamping of the covering layer can further reduce the thickness of the covering layer, thereby reducing the overall thickness of the back cover.
  • a preset pattern can be prepared on the covering layer by integral hot stamping, so as to enhance the aesthetic feeling of the back cover.
  • the covering layer provided in the first aspect of the present application is of equal thickness.
  • the manufacturing process of equal-thick covering layer is simple.
  • the first structural layer provided in the first aspect of the present application is provided with protrusions near the outer edge of the middle frame, and the upper surface of the protrusions transitions smoothly with the embossed upper surface of the covering layer.
  • the embossed cover layer can be engaged with the protrusion provided on the edge of the first structural layer, which can improve the bonding firmness between the cover layer and the first structural layer.
  • the smooth transition between the convex upper surface and the upper surface of the cover layer after integral embossing can improve the smoothness of the outer surface of the back cover.
  • the second structural layer is a ceramic layer
  • the ceramic layer covers the outer surface of the first structural layer
  • the first structural layer is configured as a structure of unequal thickness.
  • the composite structure of the ceramic layer and the first structural layer of unequal thickness on the one hand, can reduce the processing accuracy of the bonding surface of the ceramic layer; on the other hand, it can enhance the rigidity of the four corners of the ceramic back cover, thereby improving the overall reliability of the ceramic back cover .
  • the bonding surface of the first structural layer is bonded to the inner surface of the ceramic layer through a hot pressing process. Bonded by hot pressing process, the stability of the bonding is good.
  • the first structural layer and the inner surface of the ceramic layer are bonded through an adhesive layer, wherein the adhesive layer is double-sided tape or an adhesive, and the adhesive layer is bonded
  • the adhesive layer is double-sided tape or an adhesive
  • the back cover of the electronic device provided in the first aspect of the present application is covered with a ceramic layer on the outer surface of the first structural layer, and the thickness of the second region of the first structural layer is 0, that is, the first structural layer is hollow in the middle and surrounded by A thick structure, the first structural layer of which is attached to the inside of the ceramic layer, can improve the rigidity of the four corners of the ceramic back cover, thereby improving the overall reliability of the ceramic back cover.
  • the second structural layer included in the back cover of the electronic device provided in the first aspect of the present application is a decorative layer
  • the decorative layer is a coating.
  • the preparation process of the coating is simple and firm and difficult to fall off from the first structural layer.
  • the decoration layer arranged on the outer surface of the first structure layer can play a decorative role on the back cover.
  • the present application provides an electronic device, which includes: a middle frame, a display screen, and any one of the electronic device rear covers described in the first aspect.
  • FIG. 1 is a schematic diagram of a hardware structure of an exemplary electronic device
  • FIG. 2 is a schematic structural diagram of an exemplary rear cover of an electronic device
  • FIG. 3 is a schematic structural diagram of an exemplary rear cover of an electronic device
  • FIG. 4 is a schematic structural diagram of an exemplary rear cover of an electronic device
  • FIG. 5 is a schematic structural diagram of an exemplary rear cover of an electronic device
  • FIG. 6 is a schematic structural diagram of an exemplary rear cover of an electronic device
  • FIG. 7 is a schematic structural diagram of an exemplary rear cover of an electronic device
  • Fig. 8 is a schematic diagram illustrating the gradual change in thickness of the fiber composite board
  • Figures 9a to 9b are schematic diagrams of the partial hot stamping process of plain leather
  • Figures 10a to 10c are schematic diagrams of the overall hot stamping process of plain leather
  • Figures 11a to 11b are schematic diagrams of the hot stamping process of the 2D back cover shown exemplarily;
  • FIG. 12 is a schematic structural diagram of an exemplary ceramic back cover of an electronic device
  • FIG. 13 is a schematic structural diagram of an exemplary ceramic back cover of an electronic device.
  • first and second in the description and claims of the embodiments of the present application are used to distinguish different objects, rather than to describe a specific order of objects.
  • first target object, the second target object, etc. are used to distinguish different target objects, rather than describing a specific order of the target objects.
  • words such as “exemplary” or “for example” are used as examples, illustrations or illustrations. Any embodiment or design scheme described as “exemplary” or “for example” in the embodiments of the present application shall not be interpreted as being more preferred or more advantageous than other embodiments or design schemes. Rather, the use of words such as “exemplary” or “such as” is intended to present related concepts in a concrete manner.
  • multiple processing units refer to two or more processing units; multiple systems refer to two or more systems.
  • FIG. 1 shows a schematic structural diagram of an electronic device. It should be understood that the electronic device shown in FIG. 1 is only an example of an electronic device, and the electronic device may have more or fewer components than those shown in the figure, two or more components may be combined, or Different component configurations are possible.
  • the various components shown in FIG. 1 may be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and/or application specific integrated circuits.
  • the electronic device may be a mobile phone, a tablet computer, a wearable device, a vehicle-mounted device, an augmented reality (augmented reality, AR)/virtual reality (virtual reality, VR) device, a notebook computer, an ultra mobile personal computer (ultra -mobile personal computer, UMPC), netbook, personal digital assistant (personal digital assistant, PDA) and other mobile terminals, or digital cameras, SLR cameras/micro-single cameras, sports cameras, PTZ cameras, drones, etc. Professional shooting equipment, the embodiment of the present application does not limit the specific type of terminal equipment.
  • the electronic device includes: a display screen 101 , a middle frame 102 and a rear cover 103 , and the display screen 101 and the rear cover 103 are nested in the middle frame to form a shell structure of the electronic device.
  • FIG. 1 is only an exemplary illustration of the shell structure of the electronic device.
  • the electronic device may also include internal hardware, a processor, an external memory interface, an internal memory, a general serial Universal serial bus (USB) interface, charging management module, power management module, battery, antenna, mobile communication module, wireless communication module, audio module, speaker, receiver, microphone, earphone jack, sensor module, button, motor, Indicators, cameras, etc.
  • USB Universal serial bus
  • the internal hardware listed above is not shown in FIG. 1 .
  • the back cover 103 of the electronic device can adopt any structure shown in the subsequent embodiments, for example: the structure of the first structural layer with unequal thickness, the composite structure of the first structural layer with unequal thickness and the cover layer , the composite structure of the first structural layer with unequal thickness and the decorative layer, the composite structure of the fiber composite board with unequal thickness and the ceramic layer, etc., so that the electronic equipment rear cover in the embodiment of the present application can be adapted to the electronic equipment middle frame of the glass rear cover .
  • the electronic device rear cover according to the embodiment of the present application will be briefly described below with reference to FIG. 2 .
  • Fig. 2 is the back cover 103 of the electronic equipment under the three-dimensional coordinate system of X, Y, Z, and the positive aspect of the Z axis is the direction that the outer surface of the back cover 103 of the electronic equipment faces (i.e., the electronic equipment is backward), and the negative direction of the Z axis is the direction of the electronic equipment.
  • the direction facing the inner surface of the device back cover 103 i.e., the forward direction of the electronic device
  • the thickness direction of the back cover is the Z-axis direction
  • the electronic device back cover 103 can be a single-layer structure layer or a multi-layer composite structure
  • the rear cover of the single-layer structural layer only includes the first structural layer
  • the first structural layer may be a fiber composite board, or a combination structure of the fiber composite board and the metal substrate.
  • the multi-layer structure layer includes a first structure layer and a second structure layer, the first structure layer is located on the outer surface of the first structure layer, wherein the first structure layer can be a fiber composite board, a fiber composite board and a metal substrate combined structure,
  • the second structural layer may include: a cover layer, a decoration layer, and a ceramic layer.
  • the following description will be made by taking the first structural layer as an example of a fiber composite board.
  • the embodiment of the present application proposes a composite electronic device back cover with fiber composite boards of unequal thickness as the base material.
  • the equal-thickness fiber composite board structure can fully reduce the thickness of the back cover, increase the rigidity of the back cover, and make the arc shape of the back cover fit with the middle frame of the glass back cover, achieving the purpose of sharing a middle frame with the glass back cover.
  • the thickness of the whole electronic device is limited by certain positions, and these positions that restrict the thickness of the whole machine become thickness bottlenecks.
  • the design value of the thickness of the back cover for the thickness bottleneck area is relatively thin, and for the non-thickness bottleneck area, since there is relatively sufficient space under the inner surface of the back cover, a protrusion can be designed on the inner surface of the back cover.
  • the back cover of the electronic device in FIG. Fiber composite board, polyurethane substrate, polyurethane fiber composite board, substrate made of ABS resin, etc.
  • the fiber is used as a reinforcing material and the resin is used as a matrix.
  • the fiber-reinforced resin material has the characteristics of strong impact resistance, easy processing and strong rigidity.
  • ABS resin is one of the five major synthetic resins. It has the advantages of impact resistance, heat resistance, low temperature resistance, chemical resistance, easy processing, stable product size, surface gloss, easy coating, and easy coloring.
  • the subsequent back cover is described as an example of a fiber composite board, and the back cover made of a fiber composite board is referred to as a fiber composite back cover for short in the description of the subsequent embodiments.
  • the back cover 303 is a fiber composite board structure of unequal thickness
  • the back cover 303 includes a first area 3031 and a second area 3032
  • the second area 3032 forms a second area orthographic projection along the thickness direction of the electronic device
  • the battery 305 forms a battery orthographic projection along the thickness direction of the electronic device
  • the second area orthographic projection includes the battery orthographic projection.
  • the first area 3031 in the back cover 303 opposite to the battery 305 is a thickness bottleneck area, which is used to accommodate thicker devices such as batteries, and is opposite to the main board 304 and the sub-board 306
  • the second area 3032 of the back cover 303 is a non-thickness bottleneck area, which is used to accommodate thinner devices such as the main board and sub-board.
  • the upper surface is on the same level.
  • the thickness of the first region may be set to be 0.2mm ⁇ 0.5mm. Setting the thickness of the first region to 0.2 mm to 0.5 mm can also meet the rigidity requirements of the first region on the premise of satisfying the overall thickness reduction condition of the thickness bottleneck region.
  • the thickness of the second region can be flexibly set according to the height of the adapted middle frame, the height of the main board and the sub-board, which is not limited in this application.
  • the second region is a region other than the first region in the first structural layer.
  • This exemplary back cover structure helps to improve the overall rigidity of the back cover under the premise that the thickness of the electronic device remains unchanged;
  • the redundant gap between the inner surface and the main board and sub-board is reduced, which can reduce the pressure variation of the whole electronic device and improve the grip feeling of the back cover.
  • a layer of plain leather can also be covered on the unequal-thickness fiber composite layer shown in FIG. 3 .
  • the first structural layer is a fiber composite board of unequal thickness
  • the second structural layer is plain leather as an example for illustration.
  • the unequal-thickness fiber composite board 4031 and the plain skin 4032 are bonded and fixed through the glue layer 4033, and the glue layer 4033 can be filled with adhesive or double-sided tape.
  • the plain leather 4032 as the covering layer of the back cover can not only protect the unequal thickness fiber composite board 4031, but also play a decorative role.
  • the plain leather 4032 can also be made of polyurethane, namely PU, genuine leather, and bamboo veneer. and other material replacement.
  • the covering layer can also be a coating.
  • the thickness of the plain skin 4032 can be a structure of equal thickness as shown in FIG. 4 , or a structure of unequal thickness.
  • the first area of the unequal-thickness fiber composite board 4031 is opposite to the battery 405, and the second area of the unequal-thickness fiber composite board is respectively connected to the main board 404 and the sub-board of the electronic device. Relative to 406, the thickness of the first region is smaller than the thickness of the second region.
  • This optional method of covering the outer surface of the fiber composite board with unequal thickness with plain leather can not only improve the aesthetics of the back cover of the electronic device, but also improve the grip of the back cover.
  • the back cover 303 is a fiber composite board of unequal thickness, limited by the opposite relationship between the thickness and rigidity of the fiber composite board, the thickness of the second region of the back cover 303 can be reduced to 0.2 mm to 0.5 mm.
  • the rear cover can also be configured as a structure in which a fiber composite board and a metal substrate are combined, and the metal substrate is used to replace the second area of the fiber composite board.
  • the rear cover of this structure includes a first structural layer, the first region of the first structural layer is a fiber composite board and the second region is a metal substrate.
  • the back cover of the electronic device in FIG. 5 the back cover of the electronic device in FIG.
  • the plate 5031, the metal substrate 5032 and the second fiber composite plate 5033 are spliced together.
  • the metal substrate 5032 is located on the same horizontal plane as the upper surfaces of the first fiber composite board 5031 and the second fiber composite board 5033, and the overlapping area of the metal substrate 5032 and the first fiber composite board 5031 and the overlapping area of the second fiber composite board 5033 are fixedly connected .
  • the orthographic projection of the first fiber composite board 5031 in the thickness direction of the electronic device that is, the Z direction includes the orthographic projection of the main board 504 in the Z direction, and the orthographic projection of the metal substrate 5032 in the Z direction
  • the projection includes the orthographic projection of the battery 505 in the Z direction
  • the projection of the second fiber composite plate 5033 includes the projection of the sub-plate 506 .
  • the area corresponding to the metal substrate 5032 is a thickness bottleneck area, and the areas corresponding to the first fiber composite board 5031 and the second fiber composite board 5033 are non-thickness bottleneck areas.
  • the thickness of the metal substrate 5032 is smaller than the thickness of the first fiber composite board 5031 and the second fiber composite board 5033 .
  • Metal substrates may include, but are not limited to: stainless steel substrates, aluminum alloy substrates, and the like.
  • the thickness of the metal substrate can be set to 0.2mm-0.5mm, or can be set to be less than 0.2mm. In an optional embodiment, the thickness of the metal substrate is set to 0.15mm ⁇ 0.3mm.
  • Fig. 5 only exemplifies that the overlapping area is located at the first In the setting mode of an area, in the actual implementation process, the overlapping area may be located in the second area or span the first area and the second area.
  • the metal substrate 5032 in the overlapping area, the first fiber composite board 5031 and the second fiber composite board 5033 can be bonded by colloids such as adhesives or double-sided tape, and can also be bonded by metal and polymer splicing technology such as in-mold injection molding technology stitching.
  • colloids such as adhesives or double-sided tape
  • metal and polymer splicing technology such as in-mold injection molding technology stitching.
  • the overlapping area of the metal substrate 5032 and the first fiber composite board 5031 is bonded and fixed by the first double-sided adhesive 5034, and the overlapping area of the metal substrate 5032 and the second fiber composite board 5031 is fixed by the second double-sided adhesive tape.
  • Surface glue 5035 is bonded and fixed.
  • the bonding width of the first double-sided adhesive 5034 and the second double-sided adhesive 5035 is 0.7-3.5 mm, for example, the bonding width is the length along the Y-axis direction, and the thickness of the adhesive layer is 0.05 mm. ⁇ 0.3mm.
  • the bonding width can also be controlled to be 0.7-3.5 mm, and the thickness of the adhesive layer to be 0.05-0.3 mm.
  • the bonding width and the thickness of the adhesive layer are controlled within the above optional ranges, the influence of the thickness of the adhesive layer on the thickness of the electronic device can be minimized on the basis of ensuring the stability of the bonding.
  • the first region and the second region of the lower surface of the metal substrate 5032 are partially corroded or partially dug, which can increase the bonding force between the fiber composite board and the metal substrate.
  • the first fiber composite board in addition to the method of bonding the overlapping regions of the first fiber composite board, the second fiber composite board and the metal substrate with an adhesive, can also be The precursor of the second fiber composite board is hot-pressed on the metal substrate for thermosetting molding. After curing, an overlapping area is formed in the area where the first fiber composite board is in contact with the lower surface of the metal substrate, and the second fiber composite board is in contact with the lower surface of the metal substrate. The area forms an overlapping area, and the fiber composite board and the metal substrate in the overlapping area are combined by the molecular force between the fiber composite board and the metal substrate after curing, without adhesive.
  • the precursor is a form of existence before obtaining the target product.
  • the precursor of the fiber composite board in the examples of this application is fiber A form of existence before the composite board is prepared and formed.
  • the material of the fiber composite board or the ratio of each material is different, and the precursor of the fiber composite board is different.
  • This kind of rear cover that combines the metal substrate and the fiber composite board with a single structural layer can further reduce the thickness of the whole machine in the thickness bottleneck area on the premise that the rigidity of the metal substrate meets the conditions.
  • the thickness of the second area can be flexibly set according to the height of the adapted middle frame, the height of the main board and the sub-board.
  • the back cover of the electronic device in FIG. 6 the back cover of the electronic device in FIG.
  • the second structural layer, the first structural layer is mainly spliced by the first fiber composite board 6031, the metal substrate 6032, and the second fiber composite board 6033 as the inner layer of the rear cover
  • the second structural layer is plain leather 6036 as the outer layer of the rear cover layer as an example.
  • the first structural layer and the plain leather 6036 can be bonded and fixed through the adhesive layer 6037, and can also be bonded and fixed through double-sided adhesive tape.
  • the orthographic projection of the first fiber composite board 6031 in the X direction includes the orthographic projection of the main board 604 in the Z direction
  • the orthographic projection of the metal substrate 6032 in the Z direction includes the battery 605 in the Z direction
  • the orthographic projection of the second fiber composite plate 6033 in the Z direction includes the orthographic projection of the sub-panel 606 in the Z direction.
  • the area corresponding to the metal substrate 6032 is a thickness bottleneck area, and the areas corresponding to the first fiber composite board 6031 and the second fiber composite board 6033 are non-thickness bottleneck areas.
  • the thickness of the metal substrate 6032 is smaller than the thickness of the first fiber composite board 6031 and the second fiber composite board 6033 .
  • Metal substrates may include, but are not limited to: stainless steel substrates, aluminum alloy substrates, and the like.
  • the thickness of the metal substrate is set to 0.15mm ⁇ 0.3mm.
  • the thickness of the metal substrate is set to 0.15 mm to 0.3 mm. If the rigidity of the metal substrate 6032 meets the conditions, the thickness of the whole machine in the thickness bottleneck area can be further reduced.
  • the plain leather 6036 as the covering layer of the back cover can also be replaced with materials such as polyurethane, namely PU, genuine leather, and bamboo veneer.
  • This optional fiber composite board and metal base plate spliced first structure layer and plain leather composite structure can not only improve the aesthetics of the back cover of the electronic device, but also improve the grip of the back cover.
  • the overlapping area of the metal substrate 6032 and the first fiber composite board 6031 is bonded and fixed by the first double-sided adhesive 6034, and the overlapping area of the metal substrate 6032 and the second fiber composite board 6031 is fixed by the second double-sided adhesive tape.
  • Surface glue 6035 is bonded and fixed.
  • the bonding width of the first double-sided adhesive 6034 and the second double-sided adhesive 6035 is 0.7-3.5 mm, for example, the bonding width is the length along the Y-axis direction, and the thickness of the adhesive layer is 0.05 mm. ⁇ 0.3mm.
  • the bonding width can also be controlled to be 0.7-3.5 mm, and the thickness of the adhesive layer to be 0.05-0.3 mm.
  • the bonding width and the thickness of the adhesive layer are controlled within the above optional ranges, the influence of the thickness of the adhesive layer on the thickness of the electronic device can be minimized on the basis of ensuring the stability of the bonding.
  • the adhesive area can also be The thickness of the fiber composite board is gradually thinned, and finally the thickness of the back cover from the center to the edge is gradually reduced.
  • the viscose area of the fiber composite board is the first area of the fiber composite board with different thicknesses.
  • the adhesive layer 7033 can also be replaced by double-sided tape.
  • the fiber composite board 7031 and the middle frame 702 are fixedly bonded by double-sided adhesive 7034 .
  • the area where the fiber composite board 7031 is bonded with double-sided adhesive tape that is, the thickness of the viscose area gradually changes, and the thickness gradually increases from the edge of the back cover to the center, that is, the thickness of the viscose area is farther away from the outer edge of the middle frame, and the thickness becomes thicker.
  • the thickness of the plain skin 7032 is uniform .
  • the middle frame is a thick frame, the inner edge of the middle frame is attached to the back cover and the display screen, and the outer edge of the middle frame is exposed outside the fuselage.
  • FIG 8 is a schematic diagram of the thickness gradient of the fiber composite board.
  • the thickness of the fiber composite board is positively correlated with the distance between the outer edges of the middle frame. The smaller the distance, the thinner the thickness, and the larger the distance, the thicker the thickness.
  • the effect presented is that the outer edge thickness of the fiber composite board is thinned, and the inner thickness is thickened.
  • the maximum thickness of the center of the fiber composite board can be set by those skilled in the art according to actual needs.
  • the thickness of the outermost edge of the fiber composite board is 0.15-0.45mm.
  • the thickness of the outermost edge of the fiber composite board is set to 0.15-0.45 mm, so that the rear cover and the glass rear cover of the embodiment of the present application can be adapted to the same middle frame of the electronic device.
  • the embodiment of the present application also provides a back cover with a composite layer structure of fiber composite boards of unequal thickness and plain leather of unequal thickness.
  • the back cover is covered with plain leather on the outer surface of the fiber composite board with unequal thickness, and after partial hot stamping of the plain leather, the plain leather presents a shape of unequal thickness.
  • the hot stamping process of the back cover of the embodiment is shown in the schematic diagram of the local hot stamping process of the plain leather in Figures 9a-9b, and the back cover of the electronic device in Figures 9a-9b is a schematic X-Z cross-sectional diagram. As shown in FIG.
  • the back cover is a composite layer structure of fiber composite boards 9031 of unequal thickness and plain skin 9032 , and the fiber composite board 9031 and plain skin 9032 are bonded and fixed by an adhesive layer 9033 .
  • the fiber composite board 9031 and the middle frame 902 are fixedly bonded by double-sided adhesive 9034 .
  • the hot stamping mold 901 is placed above the area to be hot stamped on the plain leather 9032, and the structure diagram of the back cover after hot stamping through the hot stamping mold is shown in Figure 9b.
  • the thickness of the unequal-thickness fiber composite board 9031 does not change, and the local area of the plain skin 9032 after being hot stamped by the hot stamping mold is the third area, and the third area can also be called the thickness reduction of the hot stamping area .
  • the third area is at a predetermined distance from the outer edge of the middle frame.
  • the specific value of the predetermined distance can be set by those skilled in the art according to actual needs, for example: setting the third area at the middle part of the outer surface of the plain leather, or setting the third area at the part of the outer surface of the plain leather close to the outer edge of the middle frame.
  • the area where the edge of the plain leather 9032 is hot stamped by the hot stamping mold is the third area, and the thickness of the plain leather in the third area is thicker the farther it is from the outer edge of the middle frame.
  • the plain leather 9032 is used as the covering layer of the back cover, and the plain leather 9032 can also be replaced with materials such as polyurethane, PU, genuine leather, or bamboo veneer.
  • the first structural layer is provided with a protrusion 9035 near the outer edge of the middle frame, wherein the protrusion 9035 is the part circled by the dotted line in Figure 9b, and the upper surface of the protrusion is connected to the third part of the covering layer. Smooth transition of the upper surface after area imprinting.
  • the size of the protrusion can be flexibly set according to the thickness of the plain cortex.
  • the embossed cover layer can be engaged with the protrusion provided on the edge of the first structural layer, which can improve the bonding firmness between the cover layer and the first structural layer.
  • the smooth transition between the raised upper surface and the embossed upper surface of the third area of the covering layer can improve the smoothness of the outer surface of the back cover.
  • the plain skin is prepared into a structure of unequal thickness by means of mold hot stamping, and the plain skin on the outer edge of the back cover is thinned, so that the thickness of the edge of the back cover is thinned, which is consistent with the glass back cover. Better fit in the box for electronics.
  • Figures 10a to 10c are schematic diagrams of the overall hot stamping process of plain leather
  • Figures 10a to 10c are schematic diagrams of X-Z cross-sections of the back cover
  • Figure 10a is a schematic diagram of the structure of the back cover before hot stamping
  • the back cover is made of fibers of unequal thickness
  • the composite layer structure of the composite board 10031 and the plain skin 10032 , the fiber composite board 10031 and the plain skin 10032 are bonded and fixed by the adhesive layer 10033 .
  • the fiber composite board 10031 and the middle frame 1002 are fixedly bonded by the first double-sided adhesive 10034 and the second double-sided adhesive 10035 .
  • the thickness of the unequal-thickness fiber composite board 10031 gradually becomes thicker from the edges of the two middle frames 1002 to the left and right edges of the battery 1005, and the area of the unequal-thickness fiber composite board 10031 opposite to the battery is equal in thickness.
  • the plain skin 10032 covers the outer surface of the fiber composite board 10031 with unequal thickness with equal thickness. As shown in Figure 10b, the whole plain leather 10032 is used as the area to be hot stamped. After the hot stamping mold 1006 is covered on the plain leather 10032, the whole plain leather 1003 is hot stamped.
  • the structure diagram of the back cover after hot stamping is shown in Figure 10c.
  • the plain skin 10032 is overall thinner than the plain skin 10032 in FIG. 10a.
  • the first structural layer is provided with a protrusion 10036 near the outer edge of the middle frame, and the protrusion 10036 is a part circled by a dotted circle in Figure 10c.
  • the raised upper surface 10036 has a smooth transition with the embossed upper surface of the covering layer.
  • the embossed cover layer can be engaged with the protrusion provided on the edge of the first structural layer, which can improve the bonding firmness between the cover layer and the first structural layer.
  • the smooth transition between the convex upper surface and the upper surface of the cover layer after integral embossing can improve the smoothness of the outer surface of the back cover.
  • the plain leather 10032 is used as the covering layer of the back cover, and the plain leather 10032 can also be replaced with materials such as polyurethane, namely PU, genuine leather or bamboo veneer.
  • the preset graphics can also be hot stamped on the plain leather 10032 by the hot stamping mold.
  • This optional method of integrally hot stamping the plain leather on the outer surface of the back cover can not only reduce the thickness of the edge of the back cover, but also reduce the overall thickness of the back cover, thereby reducing the thickness of the entire electronic device.
  • the method of hot stamping the plain leather can also be applied to the 2D back cover. By hot stamping a part of the plain leather on the outer surface of the 2D back cover, the back cover can show a 2.5D effect.
  • Figures 11a-11b are schematic diagrams of the hot stamping process of the 2D back cover
  • Figures 11a-11b are schematic cross-sectional views of the X-Z back cover
  • Figure 11a is a schematic diagram of the positional relationship between the 2D back cover and the hot stamping mold
  • Figure 11b is a schematic diagram of the structure of the 2.5D rear cover after hot stamping.
  • the 2D back cover includes a fiber composite board 11031 and a plain skin 11032.
  • the fiber composite board 11031 is bonded to the plain skin 11032 through an adhesive layer 11033.
  • the composite board 11031 is fixedly bonded to the middle frame 1102 by double-sided adhesive tape 11034 .
  • the hot stamping mold 1104 is placed on the edge area of the plain leather close to the middle frame 1102 for hot stamping, wherein the area of the edge of the plain leather 11032 after being hot stamped by the hot stamping mold is the third area.
  • the structural diagram of the back cover after hot stamping is shown in Figure 11b.
  • the thickness of the third area of the plain leather gradually changes. The closer the distance between the plain leather in the third area and the middle frame, the thinner the thickness.
  • the edge of the plain leather 11032 of the 2D back cover is smooth , presenting a 2.5D effect.
  • the hot stamping tool can also hot stamp preset graphics, such as personalized graphics or mobile phone brand logos, on the area to be hot stamped on the plain skin 11032 .
  • This method of hot stamping the edge of the plain leather of the 2D back cover to obtain the effect of the 2.5D back cover is conducive to shaping a better shape of the back cover, and can also weaken the scratchy feel of the back cover.
  • the decorative layer includes a coating, which is a solid continuous film obtained by applying a coating, and has effects such as protection, insulation, and decoration.
  • the material of the coating may include but not limited to: chromium nitride, titanium nitride, titanium carbonitride, titanium carbide and tungsten carbide carbon film and the like.
  • the decoration layer plays a decorative role on the back cover of the electronic equipment.
  • the back cover with the composite structure of the first structural layer and the ceramic layer will be described below still taking the first structural layer as an example of a fiber composite board.
  • the gluing surface of the single ceramic back cover and the middle frame of the electronic device needs a good control surface shape to achieve good gluing and sealing effects, so the CNC machining of the single ceramic back cover has high precision and takes a long time.
  • the back cover is prepared by laminating the fiber composite board on the inner surface of the ceramic, so as to solve the problems of high precision and time-consuming CNC machining of a single ceramic back cover.
  • FIG. 12 is a schematic structural diagram of a ceramic back cover of an electronic device
  • FIG. 12 is a schematic X-Z cross-sectional view of the back cover.
  • the ceramic back cover includes a fiber composite board 12031 and a ceramic layer 12032 .
  • the fiber composite board 12031 is bonded to the middle frame 1202 of the electronic device through double-sided adhesive tape 12033 .
  • the bonding process of the fiber composite board 12031 and the ceramic layer 12032 can be as follows: combined with the preset mold, the precursor of the fiber composite board 12031 is hot-pressed to prepare a formed bonding surface; then, the bonding surface is pasted on the ceramic layer. Inside the layer 12032, the pasting of the two is completed.
  • This method of laminating the fiber composite board and the ceramic layer has low requirements on the machining accuracy of the bonding surface of the ceramic layer, and can save time and labor costs for CNC machining of the bonding surface of the ceramic layer.
  • the fiber composite board 12301 can be directly hot-pressed to the inner surface of the ceramic layer 12302, and the bonding is realized by the molecular force between the fiber composite board and the ceramic interface.
  • the formed bonding surface of the fiber composite board 12301 can also be bonded to the inner surface of the ceramic layer 12302 by adhesive or double-sided adhesive.
  • the precursor is to impregnate continuous fibers or fabrics with a resin matrix under strictly controlled conditions to make a composition of resin matrix and reinforcement, such as fiber-reinforced resin.
  • Hot pressing is to press the prepared composition with a preset model at a preset temperature to obtain a shaped fiber composite board, and finally to cure the pressed fiber composite board to prepare the final required fiber composite board.
  • the preset temperature during hot pressing and the shape of the preset mold can be flexibly set by those skilled in the art according to actual needs, which are not specifically limited in the embodiments of the present application.
  • the inner surface of the ceramic layer 12032 is covered with a fiber composite board 12301 as a whole, the fiber composite board 12301 attached to the inner surface of the ceramic layer 12032 is of different thickness, and the thickness of the first area of the fiber composite board 12301 is greater than that of the second area
  • the first area is the area where the fiber composite board is bonded and fixed to the middle frame of the electronic device
  • the second area is the area of the fiber composite board other than the first area.
  • the fiber composite board 12301 is thin in the middle and thick at the edges.
  • the rigidity of the four corners of the ceramic back cover can be enhanced by pasting a fiber composite board with a thin middle and thick edges inside a single ceramic layer, thereby improving the overall reliability of the ceramic back cover .
  • FIG. 13 is a schematic structural diagram of a ceramic back cover of an electronic device
  • FIG. 13 is a schematic X-Z cross-sectional view of the back cover.
  • the ceramic back cover includes a fiber composite board 13031 and a ceramic layer 13032 .
  • the fiber composite board 13031 is bonded to the middle frame 1302 of the electronic device through double-sided adhesive tape 13033 .
  • the inner surface of the ceramic layer 13032 is not entirely covered with a fiber composite board, but a hollow fiber composite board 13301 is pasted on the edge of the inner surface of the ceramic layer 13032.
  • the hollow size and shape of the fiber composite board can be determined by those skilled in the art according to actual needs. set up.
  • the rigidity of the four corners of the ceramic back cover can be improved by attaching the annular fiber composite board to the inner edge of the single ceramic layer, thereby improving the overall reliability of the ceramic back cover.
  • the thickness of the ceramic back cover and the annular fiber composite plate can be set by those skilled in the art according to actual needs.
  • the annular fiber composite board can also be prepared into a structure of unequal thickness, for example: the smaller the distance from the frame, the thicker the fiber composite board, etc. Not only that, but it is also possible to attach fiber composite panels only at the four corners of the ceramic layer.

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Abstract

本申请提供了一种电子设备后盖及电子设备。该电子设备后盖包括：第一结构层包括第一区域和第二区域，第一区域的厚度大于第二区域的厚度；其中，第二区域沿电子设备厚度方向形成第二区域正投影，电子设备电池沿电子设备厚度方向形成电池正投影，第二区域正投影包含电池正投影。该后盖能够与玻璃后盖的电子设备中框适配。

Description

电子设备后盖及电子设备
本申请要求于2021年08月12日提交中国国家知识产权局、申请号为202110922162.0、申请名称为“电子设备后盖及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及终端设备领域，尤其涉及一种电子设备后盖及电子设备。
背景技术
目前，一些电子设备后盖为玻璃后盖，玻璃后盖具有厚度薄的特点，为适配玻璃后盖市面上的电子设备中框高度也相应变小。而随着用户对电子设备的个性化需求不断提升，单一的玻璃后盖已经无法满足用户的需求，为提升电子设备在市场上的竞争力，则需要研发其它材质的后盖。而其它材质的后盖厚度较大，无法与玻璃后盖的电子设备中框适配。
发明内容
为了解决上述技术问题，本申请提供一种电子设备后盖及电子设备。在该方法中，采用纤维复合材料制备电子设备后盖，将电子设备后盖制备成与电子设备电池部分正对的厚度瓶颈区域薄，其它非厚度瓶颈区域厚的不等厚结构，变相减小电子设备后盖的厚度，使其能够与玻璃后盖的电子设备中框适配。
第一方面，本申请提供一种电子设备后盖，该电子设备后盖包括：第一结构层包括第一区域和第二区域，第一区域的厚度大于第二区域的厚度；其中，第二区域沿电子设备厚度方向形成第二区域正投影，电子设备电池沿电子设备厚度方向形成电池正投影，第二区域正投影包含电池正投影。该种将电子设备后盖制备成与电子设备电池部分正对的厚度瓶颈区域薄，其它非厚度瓶颈区域厚的不等厚结构，变相减小电子设备后盖的厚度，使其能够与玻璃后盖的电子设备中框适配。
示例性的，本申请第一方面中所提供的电子设备后盖，所述第一结构层为纤维复合板。该种一体式纤维复合板制备成型后盖工艺简单。
示例性的，本申请第一方面中所提供的电子设备后盖，第一区域为纤维复合板、第二区域为金属基板；该种金属基板与纤维复合板结合构成的后盖，在金属基板的刚性满足条件的前提下，能够进一步减小厚度瓶颈区域的整机厚度。
示例性的，本申请第一方面中所提供的电子设备后盖，第一区域与第二区域的上表面位于同一水平面上；第一区域与第二区域的重叠区域固定连接。重叠区域可以位于第一区域，重叠区域也可以位于第二区域，还可以跨越第一区域和第二区域。重叠区域固定连接能够确保第一区域与第二区域连接的可靠性。
示例性的，本申请第一方面中所提供的电子设备后盖，第一区域与第二区域的重叠区域通过胶体粘接固定，或第一区域的纤维复合板的前驱体热压在金属基板上热固成型。 重叠区域通过胶体粘接固定，工艺简单且牢固性好。第一区域的纤维复合板的前驱体热压在金属基板上热固成型，固化后靠纤维复合板与金属基板之间的分子作用力结合，无需胶黏剂。
示例性的，本申请第一方面中所提供的电子设备后盖，金属基板与纤维复合板的重叠区域局部腐蚀。将金属基板与纤维复合板的重叠区域局部腐蚀，可以增大重叠区域的纤维复合板与金属基板之间的结合力。
示例性的，本申请第一方面中所提供的电子设备后盖，金属基板与纤维复合板的重叠区域局部挖孔。将金属基板与纤维复合板的重叠区域局域挖孔设计，可以增大重叠区域的纤维复合板与金属基板之间的结合力。
示例性的，本申请第一方面中所提供的电子设备后盖的第一结构层中的金属基板的厚度范围为0.15mm～0.3mm。将金属基板的厚度设置为0.15mm～0.3mm，在金属基板的刚性满足条件的情况下，还能够进一步减小厚度瓶颈区域的整机厚度。示例性的，本申请第一方面中所提供的第一结构层的第一区域为与电子设备中框粘接固定的区域。该可选实施例中仅将第一结构层中与中框粘结固定区域的厚度加厚，使得第二区域沿电子设备厚度方向形成的第二区域正投影面积更大，从而使电子设备内部有更大的容纳空间。该种不等厚第一结构层的后盖，后盖边缘处与电子设备中框粘接固定的区域薄，能够与玻璃后盖适配的中框的外轮廓适配。
示例性的，本申请第一方面中所提供的第一结构层的第一区域厚度渐变，其中，所述第一区域的厚度距离中框外边缘越远厚度越厚。将第一区域设计为厚度渐变的结构，可使得电子设备后壳的外形更加个性，多样化。
示例性的，本申请第一方面中所提供的电子设备后盖，粘胶区域外边缘的厚度范围为0.15mm～0.45mm，能够使本申请实施例的后盖与玻璃后盖适配同样的电子设备中框。
示例性的，本申请第一方面中所提供的电子设备后盖还包括：第二结构层；第二结构层位于第一结构层的外表面。在第一结构层的外表面上设置第二结构层，可以对第一结构层起到保护的作用或修饰后盖的作用。
示例性的，本申请第一方面中所提供的第二结构层为覆盖层，覆盖层与第一结构层之间通过胶层粘接固定。第一结构层的外表面上设置覆盖层，既能够提升后盖的美观度，又能够改善电子设备的握持手感。例如：胶层可以为双面胶或胶粘剂，胶层粘接工艺简单且成本低。示例性的，本申请第一方面中所提供的电子设备后盖，覆盖层包括：素皮、真皮以及竹木皮等；不同材质的覆盖层，手感和外观不同，可制备得到不同样式的电子设备后盖。
示例性的，本申请第一方面中所提供的电子设备后盖，第一结构层上覆盖的覆盖层的第三区域厚度渐变，其中，第三区域距离中框外边缘预定距离，第三区域为烫印模具烫印后的覆盖层局部区域第三区域的厚度距离中框外边缘越远厚度越厚。将后盖外边缘部分的覆盖层减薄，使得后盖边缘处的厚度减薄，与玻璃后盖的电子设备中框更好的适配。
示例性的，本申请第一方面中所提供的电子设备后盖，第一结构层靠近中框外边缘处设置有凸起，凸起上表面与覆盖层的第三区域压印后的上表面平滑过渡。在第一结构 层的边缘处设置凸起可卡接被压印的覆盖层，能够提升覆盖层与第一结构层之间粘接牢固性。再一方面，凸起上表面与覆盖层的第三区域压印后的上表面平滑过渡，能够提升后盖外表面的平滑度。该种通过对2D后盖外表面覆盖层的局部区域进行烫印，可使后盖呈现出2.5D的效果。
示例性的，本申请第一方面中所提供的覆盖层整体通过烫印模具烫印。一方面，覆盖层整体烫印能够进一步减薄覆盖层的厚度，从而减薄后盖的整体厚度。再一方面，通过整体烫印可在覆盖层上制备出预设图形，提升后盖的美感。
示例性的，本申请第一方面中所提供的覆盖层等厚。等厚覆盖层制作工艺简单。
示例性的，本申请第一方面中所提供的第一结构层靠近中框外边缘处设置有凸起，凸起上表面与覆盖层压印后的上表面平滑过渡。在第一结构层的边缘处设置凸起可卡接被压印的覆盖层，能够提升覆盖层与第一结构层之间粘接牢固性。凸起上表面与覆盖层整体压印后的上表面平滑过渡，能够提升后盖外表面的平滑。
示例性的，本申请第一方面所提供的电子设备后盖，第二结构层为陶瓷层，陶瓷层覆盖在第一结构层外表面上，第一结构层设置为不等厚结构，该种将瓷层与不等厚第一结构层复合的结构，一方面，可以降低陶瓷层贴合面的加工精度；第二方面，能够增强陶瓷后盖四角刚度，从而提升陶瓷后盖整体的可靠性。
示例性的，本申请第一方面中所提供的电子设备后盖，第一结构层的粘接面与陶瓷层的内表面通过热压工艺粘接。热压工艺粘接，粘接处的稳定性好。
示例性的，本申请第一方面中所提供的电子设备后盖，第一结构层与陶瓷层的内表面通过胶层粘接，其中，胶层为双面胶或胶粘剂，通过胶层粘接两个结构层的粘接工艺简单且成本低。
示例性的，本申请第一方面中所提供的电子设备后盖，在第一结构层外表面覆盖陶瓷层，第一结构层的第二区域厚度为0即第一结构层为中间空、四周有厚度的结构，该种结构的第一结构层帖覆在陶瓷层内部上，能够提高陶瓷后盖四角刚度，从而提升陶瓷后盖整体的可靠性。
示例性的，本申请第一方面中所提供的电子设备后盖中包括的第二结构层为装饰层，装饰层为涂层，涂层制备工艺简单且牢固不易从第一结构层上脱落。在第一结构层的外表面上设置的装饰层，能够对后盖起到装饰的作用。
第二方面，本申请提供了一种电子设备，该电子设备包括：中框、显示屏以及第一方面述的任意一种电子设备后盖。
附图说明
图1为示例性示出的电子设备的硬件结构示意图；
图2为示例性示出的电子设备后盖的结构示意图；
图3为示例性示出的电子设备后盖的结构示意图；
图4为示例性示出的电子设备后盖的结构示意图；
图5为示例性示出的电子设备后盖的结构示意图；
图6为示例性示出的电子设备后盖的结构示意图；
图7为示例性示出的电子设备后盖的结构示意图；
图8为示例性示出的纤维复合板厚度渐变示意图；
图9a至9b为示例性示出的素皮局部烫印过程示意图；
图10a至10c为示例性示出的素皮整体烫印过程示意图；
图11a至11b为示例性示出的2D后盖的烫印过程示意图；
图12为示例性示出的电子设备陶瓷后盖的结构示意图；
图13为示例性示出的电子设备陶瓷后盖的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本文中术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。
本申请实施例的说明书和权利要求书中的术语“第一”和“第二”等是用于区别不同的对象，而不是用于描述对象的特定顺序。例如，第一目标对象和第二目标对象等是用于区别不同的目标对象，而不是用于描述目标对象的特定顺序。
在本申请实施例中，“示例性的”或者“例如”等词用于表示作例子、例证或说明。本申请实施例中被描述为“示例性的”或者“例如”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。确切而言，使用“示例性的”或者“例如”等词旨在以具体方式呈现相关概念。
在本申请实施例的描述中，除非另有说明，“多个”的含义是指两个或两个以上。例如，多个处理单元是指两个或两个以上的处理单元；多个系统是指两个或两个以上的系统。
图1示出了电子设备的结构示意图。应该理解的是，图1所示电子设备仅是电子设备的一个范例，并且电子设备可以具有比图中所示的更多的或者更少的部件，可以组合两个或多个的部件，或者可以具有不同的部件配置。图1中所示出的各种部件可以在包括一个或多个信号处理和/或专用集成电路在内的硬件、软件、或硬件和软件的组合中实现。
本申请实施例中，电子设备可以是手机、平板电脑、可穿戴设备、车载设备、增强现实(augmented reality，AR)/虚拟现实(virtual reality，VR)设备、笔记本电脑、超级移动个人计算机(ultra-mobile personal computer，UMPC)、上网本、个人数字助理(personal digital assistant，PDA)等移动终端，或者，也可以是数码相机、单反相机/微单相机、运动摄像机、云台相机、无人机等专业的拍摄设备，本申请实施例对终端设备的具体类型不作限制。
下面以手机为例对本申请实施例进行说明。如图1所示，电子设备包括：显示屏101、 中框102以及后盖103，显示屏101、后盖103嵌套在中框中，构成电子设备外壳结构。需要说明的是，图1中仅是示例性的对电子设备的外壳结构进行了说明，电子设备除包含该外壳结构外，还可以包括内部硬件，处理器，外部存储器接口，内部存储器，通用串行总线(universal serial bus，USB)接口，充电管理模块，电源管理模块，电池，天线，移动通信模块，无线通信模块，音频模块，扬声器，受话器，麦克风，耳机接口，传感器模块，按键，马达，指示器，摄像头等。上述所列举的内部硬件在图1中未示出。
在本申请实施例中，电子设备的后盖103可采用后续实施例中所示的任意一种结构，例如：不等厚第一结构层结构、不等厚第一结构层与覆盖层复合结构、不等厚第一结构层与装饰层复合结构、不等厚纤维复合板与陶瓷层复合的结构等，使得本申请实施例中的电子设备后盖能够适配玻璃后盖的电子设备中框。
下面结合图2对本申请实施例的电子设备后盖进行简要说明。
图2为X、Y、Z三维坐标系下的电子设备后盖103，Z轴正方面为电子设备后盖103的外表面所朝向的方向(即电子设备后向)，Z轴负方向为电子设备后盖103的内表面所朝向的方向(即电子设备前向)，其中，后盖的厚度方向为Z轴方向，电子设备后盖103可以为单层结构层也可以为多层复合结构，单层结构层的后盖仅包括第一结构层，第一结构层可以为纤维复合板、纤维复合板与金属基板结合结构。多层结构层包括第一结构层和第二结构层，第一结构层位于第一结构层的外表面上，其中，第一结构层可以为纤维复合板、纤维复合板与金属基板结合结构，第二结构层可以包括：覆盖层、装饰层以及陶瓷层。下面参照图3至图13，对图2中所定义的坐标系下的后盖的详细结构进行说明。
下面以第一结构层为纤维复合板为例，进行说明。
为平衡后盖的刚度、厚度以及外表面形态三个维度，提升后盖的竞争力，本申请实施例提出一种以不等厚纤维复合板为基材的复合材料电子设备后盖，通过不等厚纤维复合板结构可充分减薄后盖厚度、增加后盖刚度、使得后盖弧面形态与玻璃后盖的中框适配，达到与玻璃后盖共用一个中框的目的。通常情况下电子设备整机厚度受限于某些位置，这些制约整机厚度的位置成为厚度瓶颈。本申请实施例中，对于厚度瓶颈区域的后盖厚度设计值较薄，对于非厚度瓶颈区域由于后盖内表面下方的空隙相对充足，因此可以在后盖内表面设计凸起。
示例性的，参照图3的电子设备后盖结构示意图所示，图3中的电子设备后盖为Y-Z截面示意图，后盖303为不等厚结构，后盖303可以为纤维增强树脂基材质的纤维复合板、聚氨酯基板、聚氨酯纤维复合板、ABS树脂材质的基板等。纤维增强树脂材质中，纤维作为增强材料，树脂作为基体，纤维增强树脂材质具有抗冲击性强、易加工以及刚性强等特点。ABS树脂是五大合成树脂之一，其具有抗冲击性、耐热性、耐低温性、耐化学药品、易加工、制品尺寸稳定、表面光泽性、易涂装、易着色等优点。本申请实施例中，后续以后盖为纤维复合板为例进行说明，纤维复合板制备的后盖在后续实施例说明中简称为纤维复合后盖。
参照图3所示，后盖303为不等厚纤维复合板结构，后盖303包括第一区域3031和第二区域3032，第二区域3032沿电子设备厚度方向形成第二区域正投影，电子设备电池 305沿电子设备厚度方向形成电池正投影，第二区域正投影包含电池正投影。后盖303置于电子设备中框302中后，后盖303中与电池305相对的第一区域3031为厚度瓶颈区域，用于容纳电池等厚度较厚的器件，与主板304、副板306相对的第二区域3032为非厚度瓶颈区域，用于容纳主板、副板等厚度较薄的器件，后盖303中第一区域的厚度小于第二区域的厚度，且第一区域与第二区域的上表面位于同一水平面上。在一种可选的实施例中，第一区域的厚度可以设置为0.2mm～0.5mm。将第一区域的厚度设置为0.2mm～0.5mm，在满足厚度瓶颈区域整体厚度减薄条件的前提下，还能够满足对第一区域的刚性要求。第二区域的厚度可依据所适配中框的高度、主板以及副板的高度灵活设置，本申请对此不作限制。第二区域为第一结构层中除第一区域以外的区域。
该种示例性的后盖结构，一方面，在电子设备整机厚度不变的前提下有利于提高后盖的总体刚度；另一方面，由于后盖的第二区域边缘厚中间薄使得后盖内表面与主板、副板间的多余间隙减小，能够减小电子设备整机按压型变量，提升后盖握持手感。
为提升电子设备后盖的美观度、握持手感，还可以在图3中所示的不等厚纤维复合层上方覆盖一层素皮。下面以第一结构层为不等厚纤维复合板，第二结构层为素皮为例进行说明。示例性的，参照图4的电子设备后盖结构示意图所示，图4中的电子设备后盖为Y-Z截面示意图，不等厚纤维复合板4031与素皮4032的复合层结构组成电子设备后盖。其中，不等厚纤维复合板4031与素皮4032之间通过胶层4033贴合固定，胶层4033可以为粘胶剂填充或者双面胶。素皮4032作为后盖的覆盖层既可起到保护不等厚纤维复合板4031的作用，又可起到装饰的作用，素皮4032也可以用聚氨基甲酸酯即PU、真皮、竹木皮等材质替换。此外，覆盖层还可以为涂层。素皮4032的厚度可以如图4中所示为等厚结构，也可以为不等厚结构。
电子设备后盖置于电子设备的中框402中后，不等厚纤维复合板4031的第一区域与电池405相对，不等厚纤维复合板的第二区域分别与电子设备主板404、副板406相对，第一区域的厚度小于第二区域的厚度。
该种可选的在不等厚纤维复合板外表面覆盖素皮的方式，既能够提升电子设备后盖的美观度以及后盖握持手感。由于后盖303为不等厚纤维复合板的情况下，受限于纤维复合板厚度与刚性之间的对立关系，后盖303的第二区域的厚度可减薄至0.2mm～0.5mm，为了进一步减薄后盖的厚度，还可以将后盖设置成纤维复合板与金属基板结合的结构，采用金属基板替换纤维复合板的第二区域。该种结构的后盖包括第一结构层，第一结构层的第一区域为纤维复合板的第二区域为金属基板。
示例性的，参照图5的电子设备后盖结构示意图所示，图5中的电子设备后盖为Y-Z截面示意图，后盖为单层结构层不等厚结构，后盖主要由第一纤维复合板5031、金属基板5032以及第二纤维复合板5033拼接而成。金属基板5032与第一纤维复合板5031、第二纤维复合板5033的上表面位于同一水平面上，金属基板5032与第一纤维复合板5031的重叠区域、第二纤维复合板5033的重叠区域固定连接。后盖置于电子设备中框502中后，第一纤维复合板5031在电子设备厚度方向即Z方向上的正投影包含主板504在Z方向上的正投影，金属基板5032在Z方向上的正投影包含电池505在Z方向上的正投影，第二纤维复合板5033的投影包含副板506的投影。金属基板5032所对应区域为厚度瓶 颈区域，第一纤维复合板5031和第二纤维复合板5033所对应区域为非厚度瓶颈区域。金属基板5032的厚度小于第一纤维复合板5031与第二纤维复合板5033的厚度。
金属基板可以包括但不限于：不锈钢基板、铝合金基板等。金属基板的厚度可以设置为0.2mm～0.5mm，也可以设置为小于0.2mm。在一种可选的实施例中，将金属基板的厚度设置为0.15mm～0.3mm。金属基板作为第一结构层的第二区域，第一纤维复合板与第二纤维复合板作为第一结构层的第二区域的情况下，图5中仅是示例性的列举了重叠区域位于第一区域这一种设置方式，在实际实现过程中，重叠区域可以位于第二区域也可以跨域第一区域和第二区域。重叠区域的金属基板5032第一纤维复合板5031以及第二纤维复合板5033，可以通过胶体如胶粘剂或者双面胶进行粘接，又可以采用金属与高分子聚合物拼接工艺例如模内注塑工艺进行拼接。示例性的，继续参照图5，金属基板5032与第一纤维复合板5031的重叠区域通过第一双面胶5034粘接固定，金属基板5032与第二纤维复合板5031的重叠区域通过第二双面胶5035粘接固定。在一种可选的实施例中，第一双面胶5034、第二双面胶5035的粘接宽度为0.7～3.5mm，例如粘结宽度为沿Y轴方向的长度，胶层厚度为0.05～0.3mm。通过胶粘剂粘接第一纤维复合板5031、金属基板5032以及第二纤维复合板5033时，也可以控制粘接宽度为0.7～3.5mm，胶层厚度为0.05～0.3mm。将粘接宽度、胶层厚度控制在上述可选的范围内时，能够在保证粘接稳定性的基础上，最大限度的减小胶层厚度对电子设备整机厚度的影响。可选的，金属基板5032下表面的第一区域和第二区域局部腐蚀或者局部挖孔，可以增大纤维复合板与金属基板之间的结合力。
在一种可选的实施例中，除上所列举的通过胶粘剂粘接第一纤维复合板、第二纤维复合板以及金属基板的重叠区域的方式外，还可以将所述第一纤维复合板与第二纤维复合板的前驱体热压在金属基板上热固成型，固化后在第一纤维复合板与金属基板下表面接触的区域形成重叠区域，第二纤维复合板与金属基板下表面接触区域形成重叠区域，固化后重叠区域的纤维复合板与金属基板靠纤维复合板与金属基板之间的分子作用力结合，无需胶黏剂。其中，前驱体是获得目标产物前的一种存在形式，大多是以有机-无机配合物或混合物固体存在，也有部分是以溶胶形式存在，本申请实施例中纤维复合板的前驱体则为纤维复合板制备成形前的一种存在形式，纤维复合板的材质或者各材质的配比不同，则纤维复合板的前驱体不同。
该种将金属基板与纤维复合板结合单结构层的后盖，在金属基板的刚性满足条件的前提下，还能够进一步减小厚度瓶颈区域的整机厚度。第二区域的厚度可依据所适配中框的高度、主板以及副板的高度灵活设置。
示例性的，参照图6的电子设备后盖结构示意图所示，图6中的电子设备后盖为Y-Z截面示意图，后盖为双结构层，双结构层包括不等厚的第一结构层以及第二结构层，以第一结构层主要由第一纤维复合板6031、金属基板6032、第二纤维复合板6033拼接而成作为后盖内层，第二结构层为素皮6036作为后盖外层为例进行说明。第一结构层与素皮6036可通过胶黏剂层6037粘接固定，还可以通过双面胶粘接固定。后盖置于电子设备中框602中后，第一纤维复合板6031在X方向上的正投影包含主板604在Z方向上的正投影，金属基板6032在Z方向上的正投影包含电池605在Z方向上的正投影，第二 纤维复合板6033在Z方向上的正投影包含副板606在Z方向上的正投影。金属基板6032所对应区域为厚度瓶颈区域，第一纤维复合板6031和第二纤维复合板6033所对应区域为非厚度瓶颈区域。金属基板6032的厚度小于第一纤维复合板6031与第二纤维复合板6033的厚度。
金属基板可以包括但不限于：不锈钢基板、铝合金基板等。在一种可选的实施例中，将金属基板的厚度设置为0.15mm～0.3mm。将金属基板的厚度设置为0.15mm～0.3mm，在金属基板6032的刚性满足条件的情况下，还能够进一步减小厚度瓶颈区域的整机厚度。素皮6036作为后盖的覆盖层也可以用聚氨基甲酸酯即PU、真皮以及竹木皮等材质替换。该种可选的纤维复合板和金属基板拼接的第一结构层与素皮复合结构的方式，既能够提升电子设备后盖的美观度以及后盖握持手感。
示例性的，继续参照图6，金属基板6032与第一纤维复合板6031的重叠区域通过第一双面胶6034粘接固定，金属基板6032与第二纤维复合板6031的重叠区域通过第二双面胶6035粘接固定。在一种可选的实施例中，第一双面胶6034、第二双面胶6035的粘接宽度为0.7～3.5mm，例如粘结宽度为沿Y轴方向的长度，胶层厚度为0.05～0.3mm。通过胶粘剂粘接第一纤维复合板5031、金属基板5032以及第二纤维复合板6033时，也可以控制粘接宽度为0.7～3.5mm，胶层厚度为0.05～0.3mm。将粘接宽度、胶层厚度控制在上述可选的范围内时，能够在保证粘接稳定性的基础上，最大限度的减小胶层厚度对电子设备整机厚度的影响。
除上述图3至图6中所示的将后盖中厚度瓶颈区域的厚度减薄的结构外，为了实现纤维复合后盖与玻璃后盖适配相同的电子设备边框，还可以将粘胶区域的纤维复合板的厚度渐进减薄，最终呈现出后盖从中心到边缘的厚度依次减薄的效果，纤维复合板的粘胶区域为不等厚纤维复合板的第一区域。示例性的，如图7中的电子设备后盖结构示意图所示，图7中的电子设备后盖为X-Z截面示意图，后盖为纤维复合板7031与素皮7032的复合层结构，纤维复合板7031与素皮7032通过胶粘剂层7033粘接固定。可选地，胶粘剂层7033还可以替换为双面胶。
后盖置于电子设备中框702中后，纤维复合板7031与中框702通过双面胶7034固定粘接。纤维复合板7031粘接双面胶的区域即粘胶区域厚度渐变，从后盖边缘到中心厚度逐渐增加即粘胶区域的厚度距离中框外边缘越远厚度越厚，素皮7032的厚度均匀。中框为一个具有厚度的框，中框内边缘与后盖、显示屏贴合固定，中框外边缘裸露在机身外。需要说明的是，素皮7032也可以制备成凹凸质感的外表面，使得后盖外观更加个性和美观。图8为纤维复合板厚度渐变示意图，如图8所示，纤维复合板的厚度与中框外边缘之间的距离正相关，距离越小则厚度越薄，距离越大则厚度越厚，所呈现出的效果为纤维复合板外边缘厚度减薄，内部厚度增厚。纤维复合板中心最大厚度可由本领域技术人员根据实际需求进行设置，纤维复合板中心越厚，则后盖边缘与中心处的高度差越大，后盖中心的隆起越明显。纤维复合板最外边缘的厚度为0.15～0.45mm。将纤维复合板最外边缘的厚度设置为0.15～0.45mm，能够使本申请实施例的后盖与玻璃后盖适配同样的电子设备中框。
本申请实施例中还提供了一种不等厚纤维复合板与不等厚素皮复合层结构的后盖。 该后盖在不等厚纤维复合板的外表面上，覆盖素皮，对素皮局部烫印后，使得素皮呈现出不等厚的形态。示例性的，实施例的后盖的烫印过程如图9a～9b中的素皮局部烫印过程示意图所示，图9a～9b中的电子设备后盖为X-Z截面示意图。如图9a所示，后盖为不等厚纤维复合板9031与素皮9032的复合层结构，纤维复合板9031与素皮9032通过胶黏剂层9033粘接固定。纤维复合板9031与中框902通过双面胶9034固定粘接。对于不等厚纤维复合板9031厚度渐变的相关说明，参照图7所示实施例中的相关说明即可。在制备不等厚素皮时，将烫印模具901置于素皮9032的待烫印区域上方，通过烫印模具烫印后的后盖结构示意图如图9b所示，通过烫印模具烫印后，不等厚纤维复合板9031的厚度未发生变化，而素皮9032中受烫印模具烫印后的局域区域为第三区域，第三区域又可称为烫印区域的厚度减薄。第三区域距离中框外边缘预定距离。预定距离的具体数值可由本领域技术人员根据实际需求进行设置，例如：将第三区域设置在素皮外表面中间部分，或将第三区域设置在素皮外表面靠近中框外边缘的部分。示例性的，素皮9032边缘受烫印模具烫印后的区域为第三区域，第三区域的素皮距离中框外边缘越远厚度越厚。素皮9032作为后盖的覆盖层，素皮9032也可以用聚氨基甲酸酯即PU、真皮或者竹木皮等材质替换。如图9b所示，第一结构层靠近所述中框外边缘处设置有凸起9035，其中，凸起9035为图9b中虚线框圈起的部分，凸起上表面与覆盖层的第三区域压印后的上表面平滑过渡。凸起的尺寸可根据素皮层的厚度灵活设置。在第一结构层的边缘处设置凸起可卡接被压印的覆盖层，能够提升覆盖层与第一结构层之间粘接牢固性。再一方面，凸起上表面与覆盖层的第三区域压印后的上表面平滑过渡，能够提升后盖外表面的平滑度。
本可选的实施例中，通过模具烫印的方式将素皮制备成不等厚结构，将后盖外边缘部分的素皮减薄，使得后盖边缘处的厚度减薄，与玻璃后盖的电子设备中框更好的适配。
除图9中所示的将后盖素皮的边缘部分厚度减薄的方式外，还可以将后盖素皮整体减薄。示例性的，图10a～10c为素皮整体烫印过程示意图，图10a～10c为后盖的X-Z截面示意图，其中，图10a为烫印前的后盖结构示意图，后盖为不等厚纤维复合板10031与素皮10032的复合层结构，纤维复合板10031与素皮10032通过胶黏剂层10033粘接固定。纤维复合板10031与中框1002通过第一双面胶10034、第二双面胶10035固定粘接。不等厚纤维复合板10031厚度从两个中框1002边缘处起至电池1005的左右边缘处止逐渐变厚，不等厚纤维复合板10031与电池相对的区域等厚。素皮10032等厚覆盖在不等厚纤维复合板10031的外表面上。如图10b所示，素皮10032整体作为待烫印区域，将烫印模具1006覆盖在素皮10032上后，对素皮1003整体进行烫印，烫印后的后盖结构示意图如图10c所示，素皮10032相较于图10a中的素皮10032整体减薄。如图10c所示，第一结构层靠近中框外边缘处设置有凸起10036，凸起10036为图10c中用虚线圈起的部分。凸起上表面10036与覆盖层压印后的上表面平滑过渡。在第一结构层的边缘处设置凸起可卡接被压印的覆盖层，能够提升覆盖层与第一结构层之间粘接牢固性。凸起上表面与覆盖层整体压印后的上表面平滑过渡，能够提升后盖外表面的平滑。
素皮10032作为后盖的覆盖层，素皮10032也可以用聚氨基甲酸酯即PU、真皮或者竹木皮等材质替换。通过烫印模具还可以在素皮10032的待上烫印出预设图形。
该种可选的对后盖外表面的素皮进行整体烫印的方式，不仅能够减小后盖边缘的厚度，还可以减小后盖整体厚度，从而减小电子设备整机厚度。对素皮进行烫印的方式，还可以应用于2D后盖，通过对2D后盖外表面素皮的部分区域进行烫印，可使后盖呈现出2.5D的效果。
示例性的，图11a～11b为2D后盖的烫印过程示意图，图11a～11b为后盖的X-Z截面示意图，具体地，图11a为2D后盖与烫印模具间的位置关系示意图，图11b为烫印后的2.5D后盖结构示意图。如图11a所示，2D后盖包括纤维复合板11031，素皮11032，纤维复合板11031通过胶黏剂层11033与素皮11032贴合粘接，2D后盖置于中框1102中时，纤维复合板11031通过双面胶11034与中框1102固定粘接。烫印模具1104置于素皮靠近中框1102的边缘区域上进行烫印，其中，素皮11032边缘受烫印模具烫印后的区域为第三区域。烫印后的后盖结构示意图如图11b所示，素皮的第三区域的厚度渐变，第三区域的素皮距离中框边框距离越近厚度越薄，2D后盖的素皮11032边缘圆滑，呈现出了2.5D的效果。需要说明的是，烫印工具还可以在素皮11032的待烫印区域中烫印预设图形，例如个性化定制图形或者手机品牌logo等。
该种通过烫印工艺对2D后盖的素皮边缘进行烫印制备得到2.5D后盖效果的方式，有利于塑造更好的后盖形态，并且还能够弱化后盖的刮手感。
需要说明的是，除在第一结构层外表面设置真皮、竹木皮或素皮等覆盖层外，还可以设置装饰层或陶瓷层等。其中，装饰层包括涂层，涂层是涂料施涂所得到的固态连续膜，具有防护，绝缘，装饰等效果。涂层的材质可以包括但不限于：氮化铬、氮化钛、碳氮化钛、碳化钛以及碳化钨碳膜等。装饰层对电子设备后盖起到装饰作用。
下面依然以第一结构层为纤维复合板为例，对第一结构层与陶瓷层复合结构的后盖进行说明。单一陶瓷后盖与电子设备中框的粘胶面需要很好的控制面型，以实现良好的粘胶和密封效果，因此单一陶瓷后盖数控加工精度高且耗时长。本申请实施例中，在陶瓷内表面贴合纤维复合板制备得到后盖，以解决单一陶瓷后盖数控加工精度高、加工耗时长的问题。
示例性的，如图12所示的电子设备陶瓷后盖结构示意图所示，图12为后盖的X-Z截面示意图，陶瓷后盖包括纤维复合板12031以及陶瓷层12032。纤维复合板12031通过双面胶12033粘接在电子设备中框1202上。纤维复合板12031以及陶瓷层12032的贴覆工艺流程可以如下：结合预设模具对纤维复合板12031的前驱体进行热压处理制备出成型的粘接面；然后，将粘接面贴合在陶瓷层12032内部，完成二者的贴覆。该种将纤维复合板与陶瓷层进行贴覆的方式，对陶瓷层贴合面的加工精度要求低，能够节省数控加工陶瓷层贴合面所耗时长和人工成本。制备出成型的粘接面后，纤维复合板12301可直接热压至陶瓷层12302的内表面，依靠纤维复合板与陶瓷界面之间的分子作用力实现粘接。此外，纤维复合板12301的成型粘接面还可以通过胶黏剂或双面胶粘与陶瓷层12302的内表面粘接。
前驱体是用树脂基体在严格控制的条件下浸渍连续纤维或织物，制成树脂基体与增强体的组合物如纤维增强树脂。热压是在预设温度下采用预设模型对制成的组合物进行压制以得到成型的纤维复合板，最后再对压制成型的纤维复合板进行固化，制备得到最 终所需的纤维复合板。对于热压时的预设温度、预设模具的形状，均可由本领域技术人员根据实际需求灵活设置，本申请实施例中对此不做具体限制。
如图12所示，陶瓷层12032内表面整体贴覆纤维复合板12301，贴覆于陶瓷层12032内表面的纤维复合板12301不等厚，纤维复合板12301的第一区域的厚度大于第二区域的厚度，第一区域为纤维复合板与电子设备中框粘接固定的区域，第二区域为纤维复合板中除第一区域之外的区域，该纤维复合板12301中间薄，边缘厚。由于单一陶瓷后盖的可靠性薄弱点在四个角落，通过在单一陶瓷层内部贴覆中间薄、边缘厚的纤维复合板，能够增强陶瓷后盖四角刚度，从而提升陶瓷后盖整体的可靠性。
示例性的，如图13所示的电子设备陶瓷后盖结构示意图所示，图13为后盖的X-Z截面示意图，陶瓷后盖包括纤维复合板13031以及陶瓷层13032。纤维复合板13031通过双面胶13033粘接在电子设备中框1302上。陶瓷层13032内表面并未全部贴覆纤维复合板，而是在陶瓷层13032内表面边缘贴覆一个中空纤维复合板13301，该纤维复合板中空的尺寸和形状可由本领域技术人员根据实际需求进行设置。
由于单一陶瓷后盖的可靠性薄弱点在四个角落，通过在单一陶瓷层内部边缘贴附环形纤维复合板，能够提高陶瓷后盖四角刚度，从而提升陶瓷后盖整体的可靠性。对于陶瓷后盖、环形纤维复合板的厚度，可由本领域技术人员根据实际需求进行设置。并且，环形纤维复合板也可以制备成不等厚结构，例如：与边框距离越小则纤维复合板厚度越厚等。不仅如此，还可以仅在陶瓷层的四个角落贴附纤维复合板。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (24)

  1. 一种电子设备后盖，其特征在于，包括：第一结构层；
    所述第一结构层包括第一区域和第二区域，所述第一区域的厚度大于所述第二区域的厚度；
    其中，所述第二区域沿电子设备厚度方向形成第二区域正投影，所述电子设备电池沿所述电子设备厚度方向形成电池正投影，所述第二区域正投影包含所述电池正投影。
  2. 根据权利要求1所述的后盖，其特征在于，所述第一结构层为纤维复合板。
  3. 根据权利要求1所述的后盖，其特征在于，所述第一区域为纤维复合板、所述第二区域为金属基板；
    所述第一区域与第二区域的上表面位于同一水平面上；
    所述第一区域与所述第二区域的重叠区域固定连接。
  4. 根据权利要求3所述的后盖，其特征在于，所述第一区域与所述第二区域的重叠区域通过胶体粘接固定，或所述第一区域的纤维复合板的前驱体热压在所述金属基板上热固成型。
  5. 根据权利要求3所述的后盖，其特征在于：
    所述金属基板与所述纤维复合板的重叠区域局部腐蚀。
  6. 根据权利要求3所述的后盖，其特征在于：
    所述金属基板与所述纤维复合板的重叠区域局部挖孔。
  7. 根据权利要求3所述的后盖，其特征在于：所述金属基板的厚度范围为0.15mm～0.3mm。
  8. 根据权利要求1所述的后盖，其特征在于，所述第一结构层的所述第一区域为与电子设备中框粘接固定的区域。
  9. 根据权利要求8所述的后盖，其特征在于，所述第一区域厚度渐变，其中，所述第一区域的厚度距离中框外边缘越远厚度越厚。
  10. 根据权利要求9所述的后盖，其特征在于，所述第一区域外边缘的厚度范围为0.15mm～0.45mm。
  11. 根据权利要求1-10任一项所述的后盖，其特征在于，所述后盖还包括：第二结构层；
    所述第二结构层位于所述第一结构层的外表面。
  12. 根据权利要求11所述的后盖，其特征在于，所述第二结构层为覆盖层，所述覆盖层与所述第一结构层之间通过胶层粘接固定。
  13. 根据权利要求12所述的后盖，其特征在于，所述覆盖层的第三区域厚度渐变，所述第三区域距离中框外边缘预定距离，所述第三区域为烫印模具烫印后的所述覆盖层局部区域，所述第三区域的厚度距离所述中框外边缘越远厚度越厚。
  14. 根据权利要求13所述的后盖，其特征在于，所述第一结构层靠近所述中框外边缘处设置有凸起，所述凸起上表面与所述覆盖层的第三区域压印后的上表面平滑过渡。
  15. 根据权利要求12所述的后盖，其特征在于，所述覆盖层整体通过烫印模具烫印。
  16. 根据权利要求15所述的后盖，其特征在于，所述覆盖层等厚。
  17. 根据权利要求15所述的后盖，其特征在于，所述第一结构层靠近所述中框外边缘处设置有凸起，所述凸起上表面与所述覆盖层压印后的上表面平滑过渡。
  18. 根据权利要求12所述的后盖，其特征在于：所述覆盖层的材质为素皮、真皮或者竹木皮。
  19. 根据权利要求11所述的后盖，其特征在于，所述第二结构层为陶瓷层。
  20. 根据权利要求19所述的后盖，其特征在于，所述第一结构层与所述陶瓷层的内表面通过热压工艺粘接。
  21. 根据权利要求19所述的后盖，其特征在于，所述第一结构层与所述陶瓷层的内表面通过胶层粘接。
  22. 根据权利要求19所述的后盖，其特征在于，所述第二区域的厚度为0。
  23. 根据权利要求11所述的后盖，其特征在于，所述第二结构层为装饰层，所述装饰层为涂层。
  24. 一种电子设备，其特征在于，包括中框、显示屏以及如权利要求1-23中任意一项所述的电子设备后盖。
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