WO2023005604A1 - 一种用于无线充电的磁屏蔽结构及其制造方法 - Google Patents

一种用于无线充电的磁屏蔽结构及其制造方法 Download PDF

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WO2023005604A1
WO2023005604A1 PCT/CN2022/103400 CN2022103400W WO2023005604A1 WO 2023005604 A1 WO2023005604 A1 WO 2023005604A1 CN 2022103400 W CN2022103400 W CN 2022103400W WO 2023005604 A1 WO2023005604 A1 WO 2023005604A1
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nanocrystalline
shielding structure
magnetic shielding
wireless charging
unit
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PCT/CN2022/103400
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English (en)
French (fr)
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刘立东
付亚奇
唐子舜
石枫
张爱国
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横店集团东磁股份有限公司
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Priority to US18/555,235 priority Critical patent/US20240196579A1/en
Priority to JP2023563313A priority patent/JP2024516959A/ja
Publication of WO2023005604A1 publication Critical patent/WO2023005604A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/70—Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/7072—Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T90/00—Enabling technologies or technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02T90/10—Technologies relating to charging of electric vehicles
    • Y02T90/14—Plug-in electric vehicles

Definitions

  • Embodiments of the present application relate to the technical field of wireless charging, for example, a magnetic shielding structure for wireless charging and a manufacturing method thereof.
  • Magnetic material is an important part of the high-power wireless charging system, which mainly plays the role of magnetic conduction and shielding. Magnetic materials with excellent performance can greatly increase the coupling coefficient of the charging system, thereby improving charging efficiency, and at the same time can effectively shield the leakage of electromagnetic fields and avoid interference or damage to the external environment.
  • the magnetic materials used in the receiving end of high-power wireless charging systems are mainly soft ferrite materials, which have high magnetic permeability and resistivity, good magnetic isolation and low eddy current loss.
  • ferrite materials also have obvious disadvantages, such as low saturation magnetization (generally less than 0.5T), brittle texture, brittle and other defects.
  • Low saturation magnetization leads to large volume and weight of the material, which is not conducive to the small size of the device. change.
  • the size of the ferrite magnetic plate is generally limited. Therefore, the magnetic plate used for the high-power wireless charging receiving end is mostly composed of multiple pieces of ferrite magnetic plates.
  • the brittleness of the ferrite itself The car is prone to fragmentation during driving, which greatly reduces the reliability of the system.
  • nanocrystalline materials Compared with soft ferrite materials, nanocrystalline materials have a higher saturation magnetization, which is more than twice that of ferrite materials. At the same time, flexible magnetic sheets can be made through slivers, glue, etc., which avoids fragile defects. However, nanocrystalline materials also have some defects, such as low resistivity, which leads to significant eddy currents when used at high frequencies, resulting in large losses, especially for high-power wireless charging systems, strong eddy current effects and high losses A large amount of heat energy will be generated and cannot be dissipated in time, which will eventually reduce the charging efficiency and safety of the system.
  • Splitting and filming nanocrystalline materials can increase the frequency of use of nanocrystalline materials and reduce eddy current loss to a certain extent, but for high-power wireless charging systems, eddy current loss and heat generation are still serious, mainly due to the After splitting, some microcracks are formed on the surface of the nanocrystal, that is, a plurality of microfracture units (submicron) with uneven size and shape are formed on the surface of the nanocrystal strip, and the sharp corners of the microfracture units will generate obvious magnetic fields. Aggregation phenomenon, large loss and serious heat generation during the working process. At the same time, after the film treatment, the polymer material in the adhesive layer cannot effectively enter the micro-cracks, and the insulation effect is greatly reduced. In addition, the thermal conductivity of the glue used in the filming process is not good, and the heat generated by the eddy current loss cannot be effectively and quickly dissipated.
  • Embodiments of the present application provide a magnetic shielding structure for wireless charging with small eddy current loss, good heat dissipation, good insulation performance, good flexibility, high reliability, small size and light weight, and a manufacturing method thereof.
  • a magnetic shielding structure for wireless charging comprising a plurality of nanocrystal units and a heat conduction unit, the heat conduction unit is arranged between the nanocrystal units for connecting each nanocrystal unit and conducting heat; the nanocrystal unit Including multilayer nanocrystalline materials.
  • the material of the heat conduction unit includes heat conduction potting glue and epoxy resin.
  • the heat-conducting potting glue is made of silica gel material
  • the epoxy resin is made of polyamide resin-modified epoxy resin.
  • the mass ratio of the thermally conductive potting compound to the epoxy resin is 1:1 to 5:1.
  • multiple layers of the nanocrystalline material are bonded by an adhesive layer.
  • the nanocrystal unit is square, and a plurality of nanocrystal units are distributed in a matrix to form a square magnetic shielding structure.
  • the nanocrystal unit has a side length of 5-15 mm and a thickness of 1-10 mm.
  • the thickness of each layer of the nanocrystalline material in the nanocrystalline unit is 14-20 microns, and the distance between adjacent nanocrystalline units is 0.1-0.5mm.
  • the multi-layer nanocrystalline strips are bonded and laminated by the adhesive layer to achieve the expected thickness h;
  • step (2) cutting the composite material of the multilayer nanocrystalline strip material prepared by step (1) and the adhesive layer into a plurality of top surfaces that are square rectangular parallelepiped nanocrystalline units;
  • step (3) arranging and fixing a plurality of nanocrystalline units prepared in step (2) on a mold or a flat plate, and the distance between adjacent nanocrystalline units is b;
  • step (6) Curing the semi-finished magnetic shielding structure produced in step (5) to obtain a finished magnetic shielding structure.
  • the magnetic shielding structure is composed of multiple nanocrystalline units, and heat conduction units are arranged between the nanocrystal units.
  • the unit can connect the nanocrystalline units together, and on the other hand, it can conduct heat and dissipate heat, so that the magnetic shielding structure of the present application has better heat dissipation performance, and is suitable for high-power wireless charging.
  • the magnetic shielding structure provided by the present application has higher charging efficiency, less heat generation and higher reliability than pure nanocrystal strips as the magnetic shielding material.
  • the nanocrystalline unit is embedded in the thermally conductive material.
  • the nanocrystalline unit is smaller than the long nanocrystalline ribbon, so that the eddy current loss is greatly reduced.
  • the addition of the thermally conductive material increases the thermal conductivity of the magnetic shielding structure. The heat generated by the eddy current loss was quickly dissipated.
  • FIG. 1 is a schematic front view of a magnetic shielding structure for wireless charging in an embodiment of the present application
  • Fig. 2 is a schematic side view of a magnetic shielding structure for wireless charging in an embodiment of the present application
  • Fig. 3 is the test result contrast figure of embodiment 1 and comparative example 1-3 in the application;
  • Fig. 4 is the test result contrast figure of embodiment 2 and comparative example 4-5 in the application;
  • Fig. 5 is the test result comparison figure of embodiment 3 and comparative examples 6-7 in the application;
  • Fig. 6 is the test result contrast figure of embodiment 4 and comparative example 8-9 in the application;
  • Fig. 7 is the test result contrast figure of embodiment 5 and comparative examples 10-13 in the application;
  • Fig. 8 is a graph comparing the test results of Example 6 and Comparative Examples 14-15 of the present application.
  • FIG. 1 is a schematic front view of the magnetic shielding structure used for wireless charging in this application.
  • the entire magnetic shielding structure includes a plurality of nanocrystal units 1 and heat conduction units 2, and the heat conduction units are arranged between the nanocrystal units , the role of the heat conduction unit can play the role of connecting each nanocrystalline unit on the one hand, and on the other hand, can conduct heat and dissipate heat, so that the magnetic shielding structure of the present application has better heat dissipation performance, and is especially suitable for high-power wireless charging.
  • the nanocrystalline unit includes multiple layers of nanocrystalline material, which are stacked in sequence to form a nanocrystalline unit, and the nanocrystalline material is mainly used to provide magnetism and play the role of magnetic isolation and shielding.
  • the multi-layer nanocrystalline materials are bonded by an adhesive layer, and the adhesive layer plays the role of bonding the nanocrystalline materials and insulating them.
  • Figure 2 is a schematic side view of the magnetic shielding structure used for wireless charging in the present application.
  • the nanocrystalline unit includes multiple layers of nanocrystalline materials, which means that in the direction of the thickness h of the magnetic shielding structure, nanometer
  • the crystal material is stacked layer by layer to form a nano crystal unit with a certain thickness h. Adjacent nanocrystalline material layers are bonded with adhesive layers.
  • the nanocrystalline alloy system and composition there is no limitation on the nanocrystalline alloy system and composition, but it must have good soft magnetic properties, preferably the Fe-Si-Nb-B-Cu system.
  • the real part of the magnetic permeability of the nanocrystalline material is in the range of 600-15000 at the working frequency of 100kHz.
  • the thickness of the single-layer nanocrystalline material is 14-20 microns, and the thickness of the adhesive layer is 5-12 microns, preferably 5-8 microns.
  • the front of the nanocrystalline unit is square, and multiple nanocrystalline units are distributed in a matrix, and the front of the formed magnetic shielding structure is also square. Referring to FIG.
  • the nanocrystal unit since the nanocrystal unit has a certain thickness h, the nanocrystal unit as a whole is in the shape of a cuboid with a square front.
  • the side length a of the front side of the nanocrystalline unit is 5-15mm. If the side length a is too large, the eddy current loss will be greatly increased, resulting in serious heating of the system. If the side length a is too small, the nanocrystal unit will be separated by the heat conduction unit. , that is, increasing the air gap will lead to a significant decrease in the magnetic permeability of the entire magnetic shielding structure, thereby affecting the coupling coefficient of the system and the wireless charging efficiency.
  • the thickness h of the nanocrystalline unit that is, the thickness h of the magnetic shielding structure is 1-10 mm, preferably 2-5 mm.
  • the heat conduction unit can be formed by mixing heat conduction potting glue and epoxy resin.
  • the heat-conducting potting glue mainly plays the role of heat conduction and insulation, and the epoxy resin mainly plays the role of bonding to improve the bonding strength of the nanocrystalline unit.
  • the cured thermally conductive potting compound has good thermal conductivity, adhesion and flexibility.
  • the thermally conductive potting compound is preferably made of silica gel.
  • Epoxy resins include epoxy resins and modified epoxy resins. Epoxy resins are required to have good adhesion and flexibility after curing. Epoxy resins modified by polyamide resins are preferred.
  • the mass ratio of thermal conductive potting compound to epoxy resin is (1:1)-(5:1).
  • the heat conduction unit is distributed between the nanocrystal units.
  • the distance b between adjacent nanocrystal units 1, that is, the size of the width b of the heat conduction unit is 0.1-0.5 mm, preferably 0.1-0.1 mm. 0.3mm. If the b value is too large, the distance between nanocrystalline units will be increased, thereby reducing the magnetic phase ratio in the entire magnetic shielding structure.
  • the heat conduction unit has excellent flexibility and cohesiveness, which avoids the falling off or fragmentation of the nanocrystalline material during the working process, and greatly improves the reliability of the system.
  • the nanocrystal-based magnetic shielding structure provided by the present application has lighter weight, smaller volume, higher reliability, and slightly higher charging efficiency.
  • the high-power wireless charging system based on the magnetic shielding structure provided by the present application has higher efficiency, less heat generation and higher reliability than the system simply using nanocrystalline strips as the magnetic shielding material.
  • the nanocrystalline unit is embedded in the thermally conductive material.
  • the nanocrystalline unit is smaller than the long nanocrystalline strip, which greatly reduces the eddy current loss.
  • the addition of the thermally conductive material increases the thermal conductivity of the magnetic shielding structure. The eddy current loss generated Heat is dissipated quickly.
  • the embodiment of the present application also provides a manufacturing method for manufacturing the above-mentioned magnetic shielding structure, including the following steps:
  • the annealed nanocrystalline strip is subjected to double-sided film coating and splitting successively, and then the multilayer nanocrystalline strip is bonded and stacked by the glue layer to reach the expected thickness h;
  • split treatment is to micro-fracture the nanocrystalline ribbon, thereby improving the high-frequency characteristics of the nanocrystalline ribbon. Not limited, preferably double-roll rolling;
  • the composite material of the multilayer nanocrystalline strip material and adhesive layer prepared in step (1) is cut into a plurality of cuboid nanocrystalline units with a square top surface, that is, cut into a plurality of a*a*h Cuboid to obtain nanocrystalline units; cutting methods are not limited, including but not limited to wire cutting, laser cutting, die cutting, etc.;
  • step (3) arranging and fixing a plurality of nanocrystalline units prepared in step (2) on a mold or a flat plate, ensuring that the distance between adjacent nanocrystalline units is b;
  • step (4) Fill the heat conduction unit colloid prepared in step (4) into the gap between the nanocrystal units in step (3) to form a semi-finished magnetic shielding structure; the heat conduction unit colloid is required to completely enter between the nanocrystal units In the gap of the nanocrystalline unit, and to achieve good bonding with the section of the nanocrystalline unit, and at the same time, there are no obvious air bubbles in the colloid; the filling method is not limited, including but not limited to injection, dispensing, impregnation, etc. The method of impregnation with pressure is preferred, that is, Impregnating under certain pressure;
  • step (6) Perform curing treatment on the semi-finished magnetic shielding structure obtained in step (5) to obtain a finished magnetic shielding structure; the curing conditions are not limited, preferably at room temperature or low temperature curing, and the curing temperature does not exceed 80 ° C, and finally obtain a high-power wireless charging. magnetic shielding structure.
  • the magnetic shielding structure mainly includes two parts: nanocrystalline unit; heat conduction unit (heat conduction glue).
  • the nanocrystalline unit is composed of 120 layers of nanocrystalline material and 119 layers of glue.
  • the composition of the nanocrystalline material is Fe 73.5 Si 13.5 Nb 3 B 9 Cu 1 .
  • the real part of the magnetic permeability of the nanocrystalline material is 100kHz. It is 10354, the average thickness of the nanocrystalline material is 19 microns, and the thickness of the adhesive layer is 6 microns; the shape of the nanocrystalline unit is a cuboid, in which the surface shape is a square, and the side length a is 10 mm.
  • the heat conduction unit is a mixture of heat conduction potting glue and epoxy resin.
  • the heat conduction potting glue is a two-component silicone material; the epoxy resin is a polyamide resin modified epoxy resin.
  • the quality of the heat conduction potting glue and epoxy resin The ratio is 2:1.
  • the distance between adjacent nanocrystalline units, the b dimension, is 0.2 mm.
  • the dimension h in the thickness direction of the magnetic shielding structure composed of the nanocrystalline unit and the heat conduction unit is 3mm, and the length*width*thickness of the magnetic shielding structure is 420mm*420mm*3mm.
  • the nanocrystalline strip is the nanocrystalline strip in the above step (1): the nanocrystalline strip is punched into an outer diameter of 18.8mm, A ring with an inner diameter of 9.9mm is used for the magnetic permeability test.
  • the test equipment is Keysight E4990A, and the test frequency is 100kHz.
  • the wireless charging magnetic shielding structure is spliced by 16 square ferrites, the ferrite material is manganese zinc ferrite, the brand is PC95, and the size of each square ferrite is 105mm*105mm *3mm, the square ferrite is directly bonded with epoxy resin.
  • the wireless charging magnetic shielding structure is spliced by 16 square ferrites, the ferrite material is manganese zinc ferrite, the brand is PC95, and the size of each square ferrite is 105mm*105mm *5mm, the square ferrite is directly bonded with epoxy resin.
  • the wireless charging magnetic shielding structure adopts the 7 nanocrystalline strips obtained in step (1) in Example 1 for flat splicing, that is, the cutting of step (2) and its subsequent design and processing are not carried out.
  • the size of the multilayer nanocrystalline strips is 60mm*420mm*3mm, and the colloid bonding of the heat conduction unit in Example 1 is used between the nanocrystalline strips.
  • Example 1 and Comparative Examples 1-3 are shown in Figure 3. It can be seen from the test results that when the thickness of the magnetic shielding structure is the same, the special design provided by this application has more advantages in charging efficiency, light weight and reliability. When the thickness of the ferrite magnet is increased to 5mm, the efficiency is equivalent to that of this application, but the difference in light weight and reliability is more obvious. Although the temperature rise of the magnetic shielding structure provided by this application is slightly higher after charging for 30 minutes, it has little effect on the safety of the entire system. Compared with the magnetic shielding structure composed of flat nanocrystalline ribbons, the present application has obvious advantages in terms of charging efficiency and temperature rise.
  • the magnetic shielding structure mainly includes two parts: nanocrystalline unit and heat conduction unit.
  • the nanocrystalline unit is composed of 120 layers of nanocrystalline material and 119 layers of glue.
  • the composition of the nanocrystalline material is Fe 73.5 Si 13.5 Nb 3 B 9 Cu 1 .
  • the real part of the magnetic permeability of the nanocrystalline material is 100kHz. It is 1634, the average thickness of the nanocrystalline material is 20 microns, and the thickness of the adhesive layer is 5 microns; the shape of the nanocrystalline unit is a cuboid, in which the surface shape is a square, and the side length a is 14 mm.
  • the heat conduction unit is a mixture of heat conduction potting glue and epoxy resin.
  • the heat conduction potting glue is a two-component silicone material; the epoxy resin is a polyamide resin modified epoxy resin.
  • the quality of the heat conduction potting glue and epoxy resin The ratio is 4.5:1.
  • the distance between adjacent nanocrystalline units, the b dimension, is 0.3 mm.
  • the dimension h in the thickness direction of the magnetic shielding structure composed of the nanocrystalline unit and the heat conduction unit is 3mm.
  • the nanocrystalline strip is the nanocrystalline strip in the above step (1): the nanocrystalline strip is punched into an outer diameter of 18.8mm, A ring with an inner diameter of 9.9mm is used for the magnetic permeability test.
  • the test equipment is Keysight E4990A, and the test frequency is 100kHz.
  • Embodiment 2 As a comparative example of Embodiment 2, the difference lies in that the real part of the magnetic permeability of the nanocrystalline material is 567, and the rest is exactly the same as Embodiment 2.
  • Example 2 As a comparative example of Example 2, the difference is that the real part of the magnetic permeability of the nanocrystalline material is 16450, and the rest are identical to Example 2.
  • Example 2 Comparative Example 4, and Comparative Example 5 are shown in Figure 4. From the test results, it can be seen that when the magnetic permeability of the nanocrystalline material exceeds the limited range, the efficiency of the entire charging system will decrease.
  • the magnetic shielding structure mainly includes two parts: nanocrystalline unit and heat conduction unit.
  • the nanocrystalline unit is composed of 120 layers of nanocrystalline material and 119 layers of glue.
  • the composition of the nanocrystalline material is Fe 73.5 Si 13.5 Nb 3 B 9 Cu 1 .
  • the real part of the magnetic permeability of the nanocrystalline material is 100kHz. It is 2153, the average thickness of the nanocrystalline material is 19 microns, and the thickness of the adhesive layer is 6 microns; the shape of the nanocrystalline unit is a cuboid, in which the surface shape is a square, and the side length a is 12mm.
  • the heat conduction unit is a mixture of heat conduction potting glue and epoxy resin.
  • the heat conduction potting glue is a two-component silicone material; the epoxy resin is a polyamide resin modified epoxy resin.
  • the quality of the heat conduction potting glue and epoxy resin The ratio is 1.5:1.
  • the distance between adjacent nanocrystalline units, the b dimension, is 0.2 mm.
  • the dimension h in the thickness direction of the magnetic shielding structure composed of the nanocrystalline unit and the heat conduction unit is 3mm.
  • the nanocrystalline strip is the nanocrystalline strip in the above step (1): the nanocrystalline is punched into an outer diameter of 18.8 mm and an inner diameter of 9.9 mm. mm ring for permeability testing.
  • the test equipment is Keysight E4990A, and the test frequency is 100kHz.
  • Example 3 As a comparative example of Example 3, the difference is that the thickness of the glue layer in the nanocrystal unit 1 is 3 microns, the number of nanocrystal materials is 136 layers, and the glue layer is 135 layers, and the rest are exactly the same as in Example 3.
  • Example 3 As a comparative example of Example 3, the difference is that the thickness of the glue layer in the nanocrystal unit is 14 microns, the number of nanocrystal materials is 92 layers, and the glue layer is 91 layers. The rest are exactly the same as in Example 3.
  • Embodiment 3 comparative example 6, comparative example 7 test results are as shown in Figure 5, as can be seen from the test results, when the thickness of the adhesive layer is too thin, the adhesion between the nanocrystalline material layer and the layer is poor, and the reliability decreases ; When the thickness of the adhesive layer is too thick, the magnetic isolation and shielding effect of the magnetic material is reduced, which affects the coupling coefficient of the entire system, resulting in a decrease in the charging efficiency of the wireless charging system.
  • the magnetic shielding structure mainly includes two parts: nanocrystalline unit and heat conduction unit.
  • the nanocrystalline unit is composed of 120 layers of nanocrystalline material and 119 layers of glue.
  • the composition of the nanocrystalline material is Fe 73.5 Si 13.5 Nb 3 B 9 Cu 1 .
  • the real part of the magnetic permeability of the nanocrystalline material is 100kHz. It is 3146, the average thickness of the nanocrystalline material is 20 microns, and the thickness of the adhesive layer is 5 microns; the shape of the nanocrystalline unit is a cuboid, and the surface shape is a square, and the side length a is 11 mm.
  • the heat conduction unit is a mixture of heat conduction potting glue and epoxy resin.
  • the heat conduction potting glue is a two-component silicone material; the epoxy resin is a polyamide resin modified epoxy resin.
  • the quality of the heat conduction potting glue and epoxy resin The ratio is 2:1.
  • the distance between adjacent nanocrystalline units 1, ie, the b dimension, is 0.1 mm microns.
  • the dimension h in the thickness direction of the magnetic shielding structure composed of the nanocrystalline unit and the heat conduction unit is 3mm.
  • the nanocrystalline strip is the nanocrystalline strip in the above step (1): the nanocrystalline is punched into an outer diameter of 18.8 mm and an inner diameter of 9.9 mm. mm ring for permeability testing.
  • the test equipment is Keysight E4990A, and the test frequency is 100kHz.
  • Example 4 As a comparative example of Example 4, the difference is that the side length a in the nanocrystalline unit is 4 mm, and the rest are identical to Example 4.
  • Example 4 As a comparative example of Example 4, the difference is that the side length a in the nanocrystalline unit is 16 mm, and the rest are identical to Example 4.
  • Example 4 Comparative Example 8, and Comparative Example 9 are shown in Figure 6. From the test results, it can be seen that when the value of a exceeds the limited range, the charging efficiency of the system will drop significantly, and if the value of a is too large, excessive charging will occur. Large eddy current loss, temperature rise is also more obvious.
  • the magnetic shielding structure mainly includes two parts: nanocrystalline unit and heat conduction unit.
  • the nanocrystalline unit is composed of 120 layers of nanocrystalline material and 119 layers of glue.
  • the composition of the nanocrystalline material is Fe 73.5 Si 13.5 Nb 3 B 9 Cu 1 .
  • the real part of the magnetic permeability of the nanocrystalline material is 100kHz. It is 14371, the average thickness of the nanocrystalline material is 20 microns, and the thickness of the adhesive layer is 5 microns; the shape of the nanocrystalline unit is a cuboid, in which the surface shape is a square, and the side length a is 6mm.
  • the heat conduction unit is a mixture of heat conduction potting glue and epoxy resin.
  • the heat conduction potting glue is a two-component silicone material; the epoxy resin is a polyamide resin modified epoxy resin.
  • the quality of the heat conduction potting glue and epoxy resin The ratio is 3:1.
  • the distance between adjacent nanocrystalline units 1, ie, the b dimension, is 0.2 mm microns.
  • the dimension h in the thickness direction of the magnetic shielding structure composed of the nanocrystalline unit and the heat conduction unit is 3 mm.
  • the nanocrystalline strip is the nanocrystalline strip in the above step (1): the nanocrystalline is punched into an outer diameter of 18.8 mm and an inner diameter of 9.9 mm. mm ring for permeability testing.
  • the test equipment is Keysight E4990A, and the test frequency is 100kHz.
  • Example 5 As a comparative example of Example 5, the difference is that the heat conduction unit uses only heat conduction potting compound without epoxy resin, and the rest is exactly the same as Example 5.
  • Example 5 As a comparative example of Example 5, the difference is that epoxy resin is used alone in the heat conduction unit without heat conduction potting compound, and the rest is exactly the same as Example 5.
  • Example 5 As a comparative example of Example 5, the difference is that the mass ratio of the heat-conducting potting compound to the epoxy resin in the heat-conducting unit is 0.8:1, and the rest are identical to Example 5.
  • Example 5 As a comparative example of Example 5, the difference lies in that the mass ratio of the heat-conducting potting compound to the epoxy resin in the heat-conducting unit is 6:1, and the rest is exactly the same as that of Example 5.
  • Embodiment 5, comparative example 10-13 test results are as shown in Figure 7, can know by test result, when not adding epoxy resin in the thermal conduction unit or its content is low, the cohesiveness of colloid is poor, and reliability is low; When the heat conduction potting compound is not added to the unit or its content is low, the heat dissipation performance of the heat conduction unit is poor, which in turn affects the charging efficiency.
  • the magnetic shielding structure mainly includes two parts: nanocrystalline unit and heat conduction unit.
  • the nanocrystalline unit is composed of 120 layers of nanocrystalline material and 119 layers of glue.
  • the composition of the nanocrystalline material is Fe 73.5 Si 13.5 Nb 3 B 9 Cu 1 . It is 5314, the average thickness of the nanocrystalline material is 20 microns, and the thickness of the adhesive layer is 5 microns; the shape of the nanocrystalline unit is a cuboid, in which the surface shape is a square, and the side length a is 10mm.
  • the heat conduction unit is a mixture of heat conduction potting glue and epoxy resin.
  • the heat conduction potting glue is a two-component silicone material; the epoxy resin is a polyamide resin modified epoxy resin.
  • the quality of the heat conduction potting glue and epoxy resin The ratio is 4.5:1.
  • the distance between adjacent nanocrystalline units, the b dimension, is 0.3 mm microns.
  • the dimension h in the thickness direction of the magnetic shielding structure composed of the nanocrystalline unit and the heat conduction unit is 3 mm.
  • the nanocrystalline strip is the nanocrystalline strip in the above step (1): the nanocrystalline is punched into an outer diameter of 18.8 mm and an inner diameter of 9.9 mm. mm ring for permeability testing.
  • the test equipment is Keysight E4990A, and the test frequency is 100kHz.
  • Embodiment 6 As a comparative example of Embodiment 6, the difference is that the distance between adjacent nanocrystalline units is 0.08 mm, and the rest are identical to Embodiment 6.
  • Embodiment 6 As a comparative example of Embodiment 6, the difference is that the distance between adjacent nanocrystalline units is 0.6 mm, and the rest is exactly the same as Embodiment 6.
  • Embodiment 6, Comparative Example 14, and Comparative Example 15 test results are shown in Figure 8, as can be seen from the test results, when b is too small, the thermally conductive colloid cannot completely fill the gap between the nanocrystals, resulting in poor system reliability; when the b value When it is too large, it will greatly reduce the magnetic isolation of the entire magnetic shielding structure, the shielding effect will decrease, and the coupling coefficient of the charging system will decrease, thereby deteriorating the charging efficiency.

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Abstract

本文公布一种用于无线充电的磁屏蔽结构及其制造方法，属于无线充电技术领域。所述磁屏蔽结构包括：包括多个纳米晶单元及导热单元，所述导热单元设于所述纳米晶单元之间，用于连接各纳米晶单元及导热；所述纳米晶单元包括多层纳米晶材料。该申请提供一种涡流损耗较小，且散热较好，绝缘性能好，柔韧性好可靠性高，体积小重量轻，适用于大功率无线充电的磁屏蔽结构及其制造方法。

Description

一种用于无线充电的磁屏蔽结构及其制造方法 技术领域
本申请实施例涉及无线充电技术领域，例如一种用于无线充电的磁屏蔽结构及其制造方法。
背景技术
随着电动汽车产业的快速发展，汽车无线充电受到越来越多的关注。与有线充电技术相比，无线充电更加智能、安全、便利。相比于消费电子类产品(如手机)的无线充电，电动汽车的无线充电系统功率更高，一般在6kW以上，其系统复杂程度、技术难度也更高。磁性材料是大功率无线充电系统中重要的组成部分，其主要起到导磁及屏蔽的作用。性能优异的磁性材料可以大大提升充电系统的耦合系数，进而提高充电效率，同时可以有效屏蔽电磁场的泄露，避免对外界环境产生干扰或伤害。
目前，用于大功率无线充电系统接收端的磁性材料主要为软磁铁氧体材料，其具有较高的磁导率和电阻率，具备良好的隔磁作用和较低的涡流损耗。但铁氧体材料也存在明显的缺点，如饱和磁化强度低(一般小于0.5T)、质地较脆、易碎等缺陷，低的饱和磁化强度导致材料的体积和重量大，不利于器件的小型化。同时，由于受到制备工艺限制，铁氧体磁板一般尺寸有限，因此，大功率无线充电接收端用的磁性板多由多片铁氧体磁板拼接而成，加之铁氧体自身的脆性，汽车在行驶的过程中容易发生碎裂，大大降低了系统的可靠性。
与软磁铁氧体材料相比，纳米晶材料具有更高的饱和磁化强度，其值是铁氧体材料的两倍以上。同时，通过裂片、黏胶等方式，可制成柔性的磁片，避免了易碎的缺陷。然而，纳米晶材料也有一些缺陷，如电阻率低，这导致材料在高频下使用产生明显的涡流，致使损耗较大，尤其是对于大功率的无线充电系统，强的涡流效应和高的损耗会产生大量的热能并无法及时散失掉，最终导致系统的充电效率和安全性降低。对纳米晶材料进行裂片及贴膜处理，可以在一定程度上提高纳米晶材料的使用频率和降低涡流损耗，但对于大功率无线充电系统而言，涡流损耗和发热问题依然较严重，主要是由于经过裂片后，纳米晶表面形成了一些微裂纹，即在纳米晶带材表面形成多个尺寸和形状不均匀的 微碎单元(亚微米级)，而微碎单元的尖角处会产生明显的磁场聚集现象，工作过程中损耗大、发热严重，同时经过贴膜处理后，胶层中的高分子材料无法有效进入到微裂纹中，绝缘效果大打折扣。此外，贴膜处理使用的胶导热性能不佳，涡流损耗产生的热量无法有效、快速散失掉。
因此，现有技术还有待于改进和发展。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本申请实施例提供一种涡流损耗较小，且散热较好，绝缘性能好，柔韧性好可靠性高，体积小重量轻的用于无线充电的磁屏蔽结构及其制造方法。
一种用于无线充电的磁屏蔽结构，包括多个纳米晶单元及导热单元，所述导热单元设于所述纳米晶单元之间，用于连接各纳米晶单元及导热；所述纳米晶单元包括多层纳米晶材料。
作为上述用于无线充电的磁屏蔽结构的可选方案，所述导热单元的材料包括导热灌封胶和环氧树脂。
作为上述用于无线充电的磁屏蔽结构的可选方案，所述导热灌封胶采用硅胶材料，所述环氧树脂采用经聚酰胺树脂改性的环氧树脂。
作为上述用于无线充电的磁屏蔽结构的可选方案，所述导热灌封胶与所述环氧树脂的质量比为1:1至5:1。
作为上述用于无线充电的磁屏蔽结构的可选方案，多层所述纳米晶材料之间通过胶层粘接。
作为上述用于无线充电的磁屏蔽结构的可选方案，所述纳米晶单元为方形，多个所述纳米晶单元呈矩阵式分布，形成的所述磁屏蔽结构为方形。
作为上述用于无线充电的磁屏蔽结构的可选方案，所述纳米晶单元的边长为5-15mm，厚度为1-10mm。
作为上述用于无线充电的磁屏蔽结构的可选方案，所述纳米晶单元中的每层所述纳米晶材料的厚度为14-20微米，相邻的所述纳米晶单元之间的距离为0.1-0.5mm。
一种用于如上所述的用于无线充电的磁屏蔽结构的制造方法，包括如下步 骤：
(1)对纳米晶带材依次进行双面贴膜和裂片处理后，再将多层纳米晶带材依靠胶层进行黏合叠片，达到预期的厚度h；
(2)将步骤(1)制备的多层纳米晶带材和胶层的复合材料裁切成多个顶面为正方形的长方体纳米晶单元；
(3)将步骤(2)制备的多个纳米晶单元排布并固定在模具或平板上，相邻的纳米晶单元之间的距离为b；
(4)按照比例混合并搅拌导热灌封胶和环氧树脂，获得用来形成导热单元的胶体；
(5)将步骤(4)制得的导热单元胶体填充至步骤(3)中的各个纳米晶单元之间的缝隙中，形成磁屏蔽结构半成品；
(6)对步骤(5)制得的磁屏蔽结构半成品进行固化处理，获得磁屏蔽结构成品。
本申请的有益之处在于：磁屏蔽结构由多个纳米晶单元组合而成，纳米晶单元之间设置导热单元，导热单元的材料可采用导热灌封胶和环氧树脂的混合而成，导热单元一方面可以将纳米晶单元连接在一起，另一方面可以起到导热散热作用，使本申请的磁屏蔽结构具有较好的散热性能，适用于大功率无线充电。本申请提供的由多个纳米晶单元组合而成的磁屏蔽结构与单纯使用纳米晶带材作为磁屏蔽材料相比，充电效率更高，发热更小，同时可靠性更高。将纳米晶单元嵌入到导热材料中，纳米晶单元比长的纳米晶带材尺寸更小，使得涡流损耗大大降低，同时导热材料的加入，增加了磁屏蔽结构的导热特性，涡流损耗产生的热量被快速散失掉。
在阅读并理解了附图和详细描述后，可以明白其他方面。
附图说明
附图用来提供对本文技术方案的进一步理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本文的技术方案，并不构成对本文技术方案的限制。
图1是本申请实施例中用于无线充电的磁屏蔽结构的正视结构示意图；
图2是本申请实施例中用于无线充电的磁屏蔽结构的侧视结构示意图；
图3是本申请中实施例1和对比例1-3的测试结果对比图；
图4是本申请中实施例2和对比例4-5的测试结果对比图；
图5是本申请中实施例3和对比例6-7的测试结果对比图；
图6是本申请中实施例4和对比例8-9的测试结果对比图；
图7是本申请中实施例5和对比例10-13的测试结果对比图；
图8是本申请中实施例6和对比例14-15的测试结果对比图。
具体实施方式
下面结合附图和实施例对本申请作进一步的详细说明。可以理解的是，此处所描述的具体实施例仅仅用于解释本申请，而非对本申请的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与本申请相关的部分而非全部结构。
在本实施例的描述中，术语“上”、“下”、“左”、“右”等方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述和简化操作，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
下面结合附图并通过具体实施方式来进一步说明本申请的技术方案。
本申请实施例提供了一种用于无线充电的磁屏蔽结构。图1是本申请中用于无线充电的磁屏蔽结构的正视结构示意图，如图1所示，整个磁屏蔽结构包括多个纳米晶单元1及导热单元2，导热单元设置在纳米晶单元之间，导热单元的作用一方面可以起到连接各纳米晶单元的作用，另一方面，可以导热和散热，使本申请的磁屏蔽结构具有较好的散热性能，尤其适用于大功率无线充电。纳米晶单元包括多层纳米晶材料，多层纳米晶材料依次叠设形成纳米晶单元，纳米晶材料主要用于提供磁性，起到隔磁、屏蔽的作用。多层纳米晶材料之间通过胶层粘接，胶层起到粘结纳米晶材料以及绝缘的作用。图2是本申请中用于无线充电的磁屏蔽结构的侧视结构示意图，如图2所示，纳米晶单元包括多层纳米晶材料的意思是指在磁屏蔽结构的厚度h方向上，纳米晶材料层层叠设形成具有一定厚度h的纳米晶单元。相邻的纳米晶材料层之间用胶层粘接。
本申请一实施例中，对于纳米晶合金体系和成分不作限制，但要具有良好的软磁性能，优选Fe-Si-Nb-B-Cu体系。纳米晶材料在100kHz的工作频率下其 磁导率实部在600—15000范围内。单层纳米晶材料厚度为14-20微米，胶层厚度为5-12微米，优选5-8微米。结合图1及图2，如图1，纳米晶单元正面为正方形，多个纳米晶单元呈矩阵式分布，形成的磁屏蔽结构的正面也为方形。而参考图2，纳米晶单元由于具有一定的厚度h，因此，纳米晶单元整体呈正面为正方形的长方体形状。纳米晶单元正面的边长a尺寸为5-15mm，边长a的尺寸过大会大大增加涡流损耗，导致系统发热严重，边长a的尺寸过小会导致纳米晶单元被导热单元隔离得较分散，即增加了气隙，会导致整个磁屏蔽结构的磁导率下降明显，进而影响系统的耦合系数和无线充电效率。同时，大量气隙的引入虽然可以在一定程度上减小涡流损耗，但会导致磁滞损耗增加。纳米晶单元的厚度h，也即磁屏蔽结构的厚度h为1-10mm，优选2-5mm。
导热单元可以采用由导热灌封胶和环氧树脂混合而成。导热灌封胶主要起到导热、绝缘的作用，环氧树脂主要起到粘结作用，提高纳米晶单元的粘结强度。固化后的导热灌封胶具有良好的导热系数、粘结性和柔韧性。导热灌封胶优选硅胶材料。环氧树脂包括环氧树脂及其改性后环氧树脂，环氧树脂要求具有良好的粘结性，同时固化后具有一定的柔韧性，优选经聚酰胺树脂改性的环氧树脂。导热灌封胶与环氧树脂的质量比为(1:1)-(5:1)。导热单元分布在纳米晶单元之间，本申请中，如图2所示，相邻的纳米晶单1之间的距离b，即导热单元的宽度b的尺寸为0.1-0.5mm，优选0.1-0.3mm。b值过大，会增加纳米晶单元之间的距离，从而降低整个磁屏蔽结构中的磁性相比例。本申请中，导热单元具有优良的柔韧性和粘结性，避免了纳米晶材料在工作过程中脱落或碎裂，系统的可靠性大大提高。
与传统的铁氧体磁屏蔽结构相比，本申请提供的基于纳米晶的磁屏蔽结构重量更轻、体积更小、可靠性更高，同时充电效率也略高。基于本申请提供的磁屏蔽结构的大功率无线充电系统比单纯使用纳米晶带材作为磁屏蔽材料的系统效率更高，发热更小，同时可靠性更高。将纳米晶单元嵌入到导热材料之中，纳米晶单元比长的纳米晶带材尺寸更小，使得涡流损耗大大降低，同时导热材料的加入，增加了磁屏蔽结构的导热特性，涡流损耗产生的热量被快速散失掉。
本申请实施例还提供一种用于制作上述磁屏蔽结构的制造方法，包括如下步骤：
(1)将经过退火处理的纳米晶带材依次进行双面贴膜和裂片处理，再将多 层纳米晶带材依靠胶层进行黏合叠片，达到预期的厚度h；
裂片处理的目的是对纳米晶带材进行微碎化处理，进而提高纳米晶带材的高频特性，同时根据裂片方式及其强度，可调控纳米晶带材的磁导率实部，裂片方式不限，优选双辊碾压；
(2)将步骤(1)制备的多层纳米晶带材和胶层的复合材料裁切成多个顶面为正方形的长方体纳米晶单元，也就是裁切成多个a*a*h的长方体，获得纳米晶单元；裁切方式不限，包括但不限于线切割、激光切割、模切等；
(3)将步骤(2)制备的多个纳米晶单元排布并固定在模具或和平板上，保证相邻的纳米晶单元之间的距离为b；
(4)按照比例混合并搅拌导热灌封胶和环氧树脂，获得混合均匀的、用来形成导热单元的胶体；
(5)将步骤(4)制得的导热单元胶体填充至步骤(3)中的各个纳米晶单元之间的缝隙中，形成磁屏蔽结构半成品；要求导热单元胶体完全进入到纳米晶单元之间的缝隙中，并且与纳米晶单元断面实现良好的粘结，同时胶体中无明显气泡；填充的方式不限，包括但不限于注入、点胶、含浸等方式，优选带压力含浸的方式，即在施加一定压力的情况进行含浸；
(6)对步骤(5)制得的磁屏蔽结构半成品进行固化处理，获得磁屏蔽结构成品；固化条件不限，优选常温或者低温固化，固化温度不超过80℃，最终获得大功率无线充电用的磁屏蔽结构。
实施例1
磁屏蔽结构主要包括两部分：纳米晶单元；导热单元(导热胶)。
纳米晶单元由120层纳米晶材料和119层胶层复合而成，纳米晶材料成分为Fe 73.5Si 13.5Nb 3B 9Cu 1，纳米晶材料在工作频率为100kHz工况下磁导率实部为10354，纳米晶材料平均厚度为19微米，胶层厚度为6微米；纳米晶单元形状为长方体，其中表面形状为正方形，边长a尺寸为10mm。
导热单元由导热灌封胶和环氧树脂组成的混合物，导热灌封胶为双组份硅胶材料；环氧树脂为聚酰胺树脂改性的环氧树脂，导热灌封胶与环氧树脂的质量比为2：1。相邻纳米晶单元之间的距离即b尺寸为0.2mm。
纳米晶单元和导热单元组成的磁屏蔽结构厚度方向尺寸h为3mm，磁屏蔽结构长*宽*厚为420mm*420mm*3mm。
测试：
首先要对纳米晶带材的磁导率进行测试，以便于后续的计算，纳米晶带材即上述步骤(1)中的纳米晶带材：将纳米晶带材冲裁成外径18.8mm、内径9.9mm的圆环，进行磁导率测试。测试设备为是德E4990A，测试频率为100kHz。
对本申请的磁屏蔽结构进行无线充电效率和温升测试：将磁屏蔽结构置于大功率无线充电系统中，测试无线充电系统工作30min后的充电效率，采用测温仪器测试测试磁屏蔽结构表面温度，记录充电前和工作30min后磁屏蔽结构表面的最高温度，计算充电前后的温升，无线充电系统功率为11kW。利用天平称量磁屏蔽结构的重量，对磁屏蔽结构进行初步的可靠性测试，可靠性包括抗冲击、纳米晶单元之间的粘结特性等。
对比实例1
作为实例1的对比实例，无线充电磁屏蔽结构采用16块方形铁氧体拼接而成，铁氧体材质为锰锌铁氧体，牌号为PC95，每块方形铁氧体的尺寸为105mm*105mm*3mm，方形铁氧体直接采用环氧树脂粘结粘连。
对比实例2
作为实例1的对比实例，无线充电磁屏蔽结构采用16块方形铁氧体拼接而成，铁氧体材质为锰锌铁氧体，牌号为PC95，每块方形铁氧体的尺寸为105mm*105mm*5mm，方形铁氧体直接采用环氧树脂粘结粘连。
对比实例3
作为实例1的对比实例，无线充电磁屏蔽结构采用实例1中步骤(1)获得的7条纳米晶带材进行平铺式拼接，即未进行步骤(2)的裁切及其后续设计和加工。多层纳米晶带材尺寸为60mm*420mm*3mm，纳米晶带材之间采用实例1中导热单元的胶体粘结。
实施例1、对比实例1-3测试结果如图3所示，由测试结果可知，磁屏蔽结构厚度相同时，本申请提供的特殊设计在充电效率、轻量化以及可靠性上均更具优势，当铁氧体磁体厚度增加到5mm时，与本申请效率相当，但轻质化和可靠性方面差距更加明显。虽然本申请提供的磁屏蔽结构在充电30min后温升略高，但对整个系统的安全性影响不大。与平铺纳米晶带材构成的磁屏蔽结构相比，本申请在充电效率和温升方面有着明显的优势。
实施例2
磁屏蔽结构主要包括两部分：纳米晶单元；导热单元。
纳米晶单元由120层纳米晶材料和119层胶层复合而成，纳米晶材料成分为Fe 73.5Si 13.5Nb 3B 9Cu 1，纳米晶材料在工作频率为100kHz工况下磁导率实部为1634，纳米晶材料平均厚度为20微米，胶层厚度为5微米；纳米晶单元形状为长方体，其中表面形状为正方形，边长a尺寸为14mm。
导热单元由导热灌封胶和环氧树脂组成的混合物，导热灌封胶为双组份硅胶材料；环氧树脂为聚酰胺树脂改性的环氧树脂，导热灌封胶与环氧树脂的质量比为4.5：1。相邻纳米晶单元之间的距离即b尺寸为0.3mm。
纳米晶单元和导热单元组成的磁屏蔽结构厚度方向尺寸h为3mm。
测试：
首先要对纳米晶带材的磁导率进行测试，以便于后续的计算，纳米晶带材即上述步骤(1)中的纳米晶带材：将纳米晶带材冲裁成外径18.8mm、内径9.9mm的圆环，进行磁导率测试。测试设备为是德E4990A，测试频率为100kHz。
对本申请的磁屏蔽结构进行无线充电效率和温升测试：将磁屏蔽结构置于大功率无线充电系统中，测试无线充电系统工作30min后的充电效率，采用测温仪器测试测试磁屏蔽结构表面温度，记录充电前和工作30min后磁屏蔽结构表面的最高温度，计算充电前后的温升，无线充电系统功率为11kW。利用天平称量磁屏蔽结构的重量，对磁屏蔽结构进行初步的可靠性测试，可靠性包括抗冲击、纳米晶单元之间的粘结特性等。
对比实例4
作为实施例2的对比实例，区别在于纳米晶材料的磁导率实部为567，其余与实施例2完全相同。
对比实例5
作为实例2的对比实例，区别在于纳米晶材料的磁导率实部为16450，其余与实施例2完全相同。
实施例2、对比实例4、对比实例5的测试结果如图4所示，由测试结果可知，当纳米晶材料的磁导率超出限定范围后，会导致整个充电系统的效率下降。
实施例3
磁屏蔽结构主要包括两部分：纳米晶单元；导热单元。
纳米晶单元由120层纳米晶材料和119层胶层复合而成，纳米晶材料成分 为Fe 73.5Si 13.5Nb 3B 9Cu 1，纳米晶材料在工作频率为100kHz工况下磁导率实部为2153，纳米晶材料平均厚度为19微米，胶层厚度为6微米；纳米晶单元形状为长方体，其中表面形状为正方形，边长a尺寸为12mm。
导热单元由导热灌封胶和环氧树脂组成的混合物，导热灌封胶为双组份硅胶材料；环氧树脂为聚酰胺树脂改性的环氧树脂，导热灌封胶与环氧树脂的质量比为1.5：1。相邻纳米晶单元之间的距离即b尺寸为0.2mm。
纳米晶单元和导热单元组成的磁屏蔽结构厚度方向尺寸即h为3mm。
测试：
首先要对纳米晶带材的磁导率进行测试，以便于后续的计算，纳米晶带材即上述步骤(1)中的纳米晶带材：将纳米晶冲裁成外径18.8mm、内径9.9mm的圆环，用于磁导率测试。测试设备为是德E4990A，测试频率为100kHz。
对本申请的磁屏蔽结构进行无线充电效率和温升测试：将磁屏蔽结构置于大功率无线充电系统中，测试无线充电系统工作30min后的充电效率，采用测温仪器测试测试磁屏蔽结构表面温度，记录充电前和工作30min后磁屏蔽结构表面的最高温度，计算充电前后的温升，无线充电系统功率为11kW。利用天平称量磁屏蔽结构的重量，对磁屏蔽结构进行初步的可靠性测试，可靠性包括抗冲击、纳米晶单元之间的粘结特性等。
对比实例6
作为实例3的对比实例，区别在于纳米晶单元1中胶层厚度为3微米，纳米晶材料为136层，胶层为135层，其余与实施例3完全相同。
对比实例7
作为实施例3的对比实例，区别在于纳米晶单元中胶层厚度为14微米，纳米晶材料为92层，胶层为91层，其余与实施例3完全相同。
实施例3、对比实例6、对比实例7测试结果如图5所示，由测试结果可知，当胶层厚度过薄时候，纳米晶材料层与层之间的粘结性较差，可靠性下降；当胶层厚度过厚时，磁性材料的隔磁、屏蔽作用降低，影响了整个系统的耦合系数，导致无线充电系统充电效率降低。
实施例4
磁屏蔽结构主要包括两部分：纳米晶单元；导热单元。
纳米晶单元由120层纳米晶材料和119层胶层复合而成，纳米晶材料成分 为Fe 73.5Si 13.5Nb 3B 9Cu 1，纳米晶材料在工作频率为100kHz工况下磁导率实部为3146，纳米晶材料平均厚度为20微米，胶层厚度为5微米；纳米晶单元形状为长方体，其中表面形状为正方形，边长a尺寸为11mm。
导热单元由导热灌封胶和环氧树脂组成的混合物，导热灌封胶为双组份硅胶材料；环氧树脂为聚酰胺树脂改性的环氧树脂，导热灌封胶与环氧树脂的质量比为2：1。相邻纳米晶单元1之间的距离即b尺寸为0.1mm微米。
纳米晶单元和导热单元组成的磁屏蔽结构厚度方向尺寸即h为3mm。
测试：
首先要对纳米晶带材的磁导率进行测试，以便于后续的计算，纳米晶带材即上述步骤(1)中的纳米晶带材：将纳米晶冲裁成外径18.8mm、内径9.9mm的圆环，用于磁导率测试。测试设备为是德E4990A，测试频率为100kHz。
对本申请的磁屏蔽结构进行无线充电效率和温升测试：将磁屏蔽结构置于大功率无线充电系统中，测试无线充电系统工作30min后的充电效率，采用测温仪器测试测试磁屏蔽结构表面温度，记录充电前和工作30min后磁屏蔽结构表面的最高温度，计算充电前后的温升，无线充电系统功率为11kW。利用天平称量磁屏蔽结构的重量，对磁屏蔽结构进行初步的可靠性测试，可靠性包括抗冲击、纳米晶单元之间的粘结特性等。
对比实例8
作为实施例4的对比实例，区别在于纳米晶单元中边长a为4mm，其余与实施例4完全相同。
对比实例9
作为实施例4的对比实例，区别在于纳米晶单元中边长a为16mm，其余与实施例4完全相同。
实施例4、对比实例8、对比实例9测试结果如图6所示，由测试结果可知，当a值超出限定的范围，系统的充电效率会显著下降，同时若a值过大，会产生过大的涡流损耗，温升也较为明显。
实施例5
磁屏蔽结构主要包括两部分：纳米晶单元；导热单元。
纳米晶单元由120层纳米晶材料和119层胶层复合而成，纳米晶材料成分为Fe 73.5Si 13.5Nb 3B 9Cu 1，纳米晶材料在工作频率为100kHz工况下磁导率实部为 14371，纳米晶材料平均厚度为20微米，胶层厚度为5微米；纳米晶单元形状为长方体，其中表面形状为正方形，边长a尺寸为6mm。
导热单元由导热灌封胶和环氧树脂组成的混合物，导热灌封胶为双组份硅胶材料；环氧树脂为聚酰胺树脂改性的环氧树脂，导热灌封胶与环氧树脂的质量比为3：1。相邻纳米晶单元1之间的距离即b尺寸为0.2mm微米。
纳米晶单元和导热单元组成的磁屏蔽结构厚度方向尺寸即h为3mm。
测试：
首先要对纳米晶带材的磁导率进行测试，以便于后续的计算，纳米晶带材即上述步骤(1)中的纳米晶带材：将纳米晶冲裁成外径18.8mm、内径9.9mm的圆环，用于磁导率测试。测试设备为是德E4990A，测试频率为100kHz。
对本申请的磁屏蔽结构进行无线充电效率和温升测试：将磁屏蔽结构置于大功率无线充电系统中，测试无线充电系统工作30min后的充电效率，采用测温仪器测试测试磁屏蔽结构表面温度，记录充电前和工作30min后磁屏蔽结构表面的最高温度，计算充电前后的温升，无线充电系统功率为11kW。利用天平称量磁屏蔽结构的重量，对磁屏蔽结构进行初步的可靠性测试，可靠性包括抗冲击、纳米晶单元之间的粘结特性等。
对比实例10
作为实例5的对比实例，区别在于导热单元中单独使用导热灌封胶，无环氧树脂，其余与实施例5完全相同。
对比实例11
作为实例5的对比实例，区别在于导热单元中单独使用环氧树脂，无导热灌封胶，其余与实施例5完全相同。
对比实例12
作为实例5的对比实例，区别在于导热单元中导热灌封胶与环氧树脂的质量比为0.8:1，其余与实施例5完全相同。
对比实例13
作为实施例5的对比实例，区别在于导热单元中导热灌封胶与环氧树脂的质量比为6:1，其余与实施例5完全相同。
实施例5、对比实例10-13测试结果如图7所示，由测试结果可知，当导热单元中不添加环氧树脂或者其含量较低时，胶体的粘结性差，可靠性低；当导 热单元中不添加导热灌封胶或者其含量较低时，导热单元的散热特性较差，进而影响充电效率。
实施例6
磁屏蔽结构主要包括两部分：纳米晶单元；导热单元。
纳米晶单元由120层纳米晶材料和119层胶层复合而成，纳米晶材料成分为Fe 73.5Si 13.5Nb 3B 9Cu 1，纳米晶材料在工作频率为100kHz工况下磁导率实部位为5314，纳米晶材料平均厚度为20微米，胶层厚度为5微米；纳米晶单元形状为长方体，其中表面形状为正方形，边长a尺寸为10mm。
导热单元由导热灌封胶和环氧树脂组成的混合物，导热灌封胶为双组份硅胶材料；环氧树脂为聚酰胺树脂改性的环氧树脂，导热灌封胶与环氧树脂的质量比为4.5：1。相邻纳米晶单元之间的距离即b尺寸为0.3mm微米。
纳米晶单元和导热单元组成的磁屏蔽结构厚度方向尺寸即h为3mm。
测试：
首先要对纳米晶带材的磁导率进行测试，以便于后续的计算，纳米晶带材即上述步骤(1)中的纳米晶带材：将纳米晶冲裁成外径18.8mm、内径9.9mm的圆环，用于磁导率测试。测试设备为是德E4990A，测试频率为100kHz。
对本申请的磁屏蔽结构进行无线充电效率和温升测试：将磁屏蔽结构置于大功率无线充电系统中，测试无线充电系统工作30min后的充电效率，采用测温仪器测试测试磁屏蔽结构表面温度，记录充电前和工作30min后磁屏蔽结构表面的最高温度，计算充电前后的温升，无线充电系统功率为11kW。利用天平称量磁屏蔽结构的重量，对磁屏蔽结构进行初步的可靠性测试，可靠性包括抗冲击、纳米晶单元之间的粘结特性等。
对比实例14
作为实施例6的对比实例，区别在于相邻纳米晶单元之间的距离为0.08mm，其余与实施例6完全相同。
对比实例15
作为实施例6的对比实例，区别在于相邻纳米晶单元之间的距离为0.6mm，其余与实施例6完全相同。
实施例6、对比实例14、对比实例15测试结果如图8所示，由测试结果可知，当b过小时，导热胶体无法完全填充纳米晶之间的缝隙中，导致系统可靠 性差；当b值过大时，会大大降低整个磁屏蔽结构隔磁、屏蔽作用下降，充电系统耦合系数减小，进而恶化了充电效率。
显然，本申请的上述实施例仅仅是为了清楚说明本申请所作的举例，而并非是对本申请的实施方式的限定。对于所属领域的普通技术人员来说，能够进行各种明显的变化、重新调整和替代而不会脱离本申请的保护范围。这里无需也无法对所有的实施方式予以穷举。凡在本申请的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本申请权利要求的保护范围之内。

Claims (9)

  1. 一种用于无线充电的磁屏蔽结构，其包括多个纳米晶单元及导热单元，所述导热单元设于所述纳米晶单元之间，用于连接各纳米晶单元及导热；所述纳米晶单元包括多层纳米晶材料。
  2. 根据权利要求1所述的用于无线充电的磁屏蔽结构，其中，所述导热单元的材料包括导热灌封胶和环氧树脂。
  3. 根据权利要求2所述的用于无线充电的磁屏蔽结构，其中，所述导热灌封胶采用硅胶材料，所述环氧树脂采用经聚酰胺树脂改性的环氧树脂。
  4. 根据权利要求3所述的用于无线充电的磁屏蔽结构，其中，所述导热灌封胶与所述环氧树脂的质量比为1:1至5:1。
  5. 根据权利要求1所述的用于无线充电的磁屏蔽结构，其中，多层所述纳米晶材料之间通过胶层粘接。
  6. 根据权利要求1所述的用于无线充电的磁屏蔽结构，其中，所述纳米晶单元为方形，多个所述纳米晶单元呈矩阵式分布，形成的所述磁屏蔽结构为方形。
  7. 根据权利要求6所述的用于无线充电的磁屏蔽结构，其中，所述纳米晶单元的边长为5-15mm，厚度为1-10mm。。
  8. 根据权利要求1所述的用于无线充电的磁屏蔽结构，其中，所述纳米晶单元中的每层所述纳米晶材料的厚度为14-20微米，相邻的所述纳米晶单元之间的距离为0.1-0.5mm。
  9. 一种用于权利要求1至8任一项所述的用于无线充电的磁屏蔽结构的制造方法，其包括如下步骤：
    (1)对纳米晶带材依次进行双面贴膜和裂片处理后，再将多层纳米晶带材依靠胶层进行黏合叠片，达到预期的厚度h；
    (2)将步骤(1)制备的多层纳米晶带材和胶层的复合材料裁切成多个顶面为正方形的长方体纳米晶单元；
    (3)将步骤(2)制备的多个纳米晶单元排布并固定在模具或平板上，相邻的纳米晶单元之间的距离为b；
    (4)按照比例混合并搅拌导热灌封胶和环氧树脂，获得用来形成导热单元的胶体；
    (5)将步骤(4)制得的导热单元胶体填充至步骤(3)中的各个纳米晶单 元之间的缝隙中，形成磁屏蔽结构半成品；
    (6)对步骤(5)制得的磁屏蔽结构半成品进行固化处理，获得磁屏蔽结构成品。
PCT/CN2022/103400 2021-07-26 2022-07-01 一种用于无线充电的磁屏蔽结构及其制造方法 WO2023005604A1 (zh)

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