WO2023005205A1 - 散热装置及电子设备 - Google Patents

散热装置及电子设备 Download PDF

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Publication number
WO2023005205A1
WO2023005205A1 PCT/CN2022/078896 CN2022078896W WO2023005205A1 WO 2023005205 A1 WO2023005205 A1 WO 2023005205A1 CN 2022078896 W CN2022078896 W CN 2022078896W WO 2023005205 A1 WO2023005205 A1 WO 2023005205A1
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WO
WIPO (PCT)
Prior art keywords
cold plate
heat dissipation
floating
component
dissipation device
Prior art date
Application number
PCT/CN2022/078896
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English (en)
French (fr)
Inventor
李振杰
刘帆
范皓龙
Original Assignee
中兴通讯股份有限公司
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Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2023005205A1 publication Critical patent/WO2023005205A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to the technical field of heat dissipation devices, in particular to a heat dissipation device and electronic equipment.
  • the traditional liquid cooling technology is one of the cooling methods.
  • the electronic components are attached to the surface of the liquid cooling plate, and the heat of the electronic components is transferred to the liquid cooling plate, and the liquid cooling plate and the liquid cooling plate through heat conduction. Strong and effective convection between working fluids to remove heat.
  • a cold plate containing fluid is used as a heat sink to perform indirect liquid cooling on electronic components.
  • the heat sink in some cases has the disadvantages of poor floatability and low reliability, and cannot be stabilized with electronic components. Contact, so the electronic components cannot be effectively cooled.
  • Embodiments of the present application provide a heat dissipation device and electronic equipment.
  • the embodiment of the present application provides a heat dissipation device, including: a first cold plate, the first cold plate is provided with a through hole, and the through hole is configured to connect the water inlet pipe and the water outlet pipe; the second A cold plate, a heat dissipation cavity is formed between the first cold plate and the second cold plate, and the heat dissipation cavity communicates with the through hole; a telescopic floating component, the floating component is connected to the second cold plate connected for floating heat dissipation of the second cold plate.
  • the embodiments of the present application further provide an electronic device, including the heat dissipation device described in any one of the embodiments of the first aspect of the present application.
  • FIG. 1 is a schematic diagram of the internal structure of a heat dissipation device provided in an embodiment of the present application
  • Fig. 2 is a schematic diagram of the internal structure of a heat sink provided by another embodiment of the present application.
  • Fig. 3 is a schematic diagram of the internal structure of a heat sink provided by another embodiment of the present application.
  • FIG. 4 is an overall schematic diagram of a heat dissipation device provided in an embodiment of the present application.
  • Fig. 5 is an overall schematic diagram of a heat dissipation device provided by another embodiment of the present application.
  • Fig. 6 is a schematic diagram of the connection of the heat dissipation device provided by the embodiment of the present application.
  • Fig. 7 is a schematic diagram of floating changes of the heat sink provided by the embodiment of the present application.
  • FIG. 8 is a schematic diagram of the internal structure of a heat sink provided by another embodiment of the present application.
  • FIG. 9 is a schematic diagram of the internal structure of a heat dissipation device provided by another embodiment of the present application.
  • FIG. 10 is a schematic diagram of the internal structure of a heat sink provided by another embodiment of the present application.
  • Fig. 11 is a schematic diagram of the internal structure of a heat sink provided by another embodiment of the present application.
  • Fig. 12 is a schematic diagram of the internal structure of the floating component provided by the embodiment of the present application.
  • FIG. 13 is a schematic diagram of the internal structure of a heat dissipation device provided by another embodiment of the present application.
  • multiple means more than two, greater than, less than, exceeding, etc. are understood as not including the original number, and above, below, within, etc. are understood as including the original number. If there is a description of "first”, “second”, etc., it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the indicated The sequence relationship of the technical characteristics.
  • the heat dissipation device includes a first cold plate 110, a second cold plate 120 and a floating part 130.
  • the floating part 130 is scalable and has a telescopic adjustment capability, the floating part 130 is connected to the second cold plate 120 for the second cold plate 120 to float and dissipate heat, one of the first cold plate 110 and the second cold plate 120 is the cold plate base plate, and the other is the cold plate cover plate, in the embodiment of the present application, the first cold plate 110 is a cold plate cover plate, the second cold plate 120 is a cold plate substrate, and the second cold plate 120 is set to be in contact with electronic components such as single board components 160, and the electronic components It may be a single-board component 160, a battery or an optical module, etc.
  • the single-board component 160 may include a single board or a chip, etc.
  • the embodiment of the present application uses the single-board component 160 as an example, but it is not meant to limit the present application.
  • the first cold plate 110 is provided with a through hole 111 , as shown in FIG. 4 and FIG. 5
  • the through hole 111 can be connected to include at least one water inlet pipe 1111 and at least one water outlet pipe 1112 .
  • a cooling chamber 125 is formed between the first cold plate 110 and the second cold plate 120, and the cooling chamber 125 communicates with the through hole 111, as shown in FIG. 1111 and the outlet pipe 1112 can be part of the pipeline 150, and can also be spliced to the pipeline 150 respectively.
  • the fluid can enter the through hole 111 from the water inlet pipe 1111 of the pipeline 150, and then flow through the flow channel 124, and finally the fluid passes through another through hole 111 flows out from outlet pipe 1112.
  • the floating part 130 is connected to the second cold plate 120, and the second cold plate 120 and the first cold plate 120 can be telescopically adjusted.
  • the distance between the cold plate 110 or the distance between the second cold plate 120 and the single-board component 160 ensures that the second cold plate 120 and the single-board component 160 are always in reliable contact.
  • the heat sink in the embodiment of the application has good floatability and high reliability , can be in stable contact with electronic components such as the single-board component 160, and effectively cool down the temperature of the electronic components.
  • the floating components 130 are connected to the first cold plate 110 and the second cold plate 120 respectively, and the cooling cavity 125 is arranged on the first surface 121 of the second cold plate 120 ,
  • the floating part 130 is arranged on at least one side of the heat dissipation chamber 125, thus ensuring the floating connection between the first cold plate 110 and the second cold plate 120.
  • the floating part 130 can also be arranged on the second cold plate. On the second surface 122 of the plate 120 , the second surface 122 is opposite to the first surface 121 , and the first surface 121 and the second surface 122 are opposite sides of the second cold plate 120 .
  • the floating component 130 can be separately arranged between the first cold plate 110 and the second cold plate 120 , and in another embodiment, the floating component 130 can also be separately arranged on the second side of the second cold plate 120 . On the surface 122, in another embodiment, the floating component 130 can also be arranged at the above two places at the same time, including one of the floating components 130 being arranged between the first cold plate 110 and the second cold plate 120, and the other floating component 130 It is disposed on the second surface 122 of the second cold plate 120 .
  • the heat dissipation device in the embodiment of the present application through the application of the floating part 130, during the installation and operation of the heat dissipation device, by adjusting the floating part 130 of the second cold plate 120 and the first cold plate 110, it ensures that the second cold plate 120 Always maintain a reliable and stable contact with the single-board component 160 to effectively dissipate heat for the single-board component 160 , so that the heat sink can be stably connected to the single-board component 160 .
  • the first surface 121 of the second cold plate 120 is provided with cooling teeth 123, and the cooling teeth 123 can be separately arranged on the second cold plate 120, or can be Formed after integral processing with the second cold plate 120, the second cold plate 120 is in contact with the single plate element 160, transfers heat from the single plate element 160, and convectively transfers the heat to the cooling medium in the cooling cavity 125,
  • a heat dissipation chamber 125 is formed between the first cold plate 110 and the second cold plate 120, and the heat dissipation teeth 123 are located in the heat dissipation chamber 125, and a flow channel 124 is formed between the heat dissipation teeth 123, and the flow channel 124 and the through hole 111, so that the fluid from the through hole 111 flows into the flow channel 124, that is, it flows through the gap between the cooling teeth 123, and the heat of the electronic components such as the single-board component 160 is taken away through the efficient convection heat transfer
  • the fluids in the examples of this application can be fluorinated liquids, water or water-glycol single-phase cooling fluids, etc., or phase-change fluids such as R134a and other liquids used for cooling.
  • the heat dissipation device can be applied in a pure liquid cooling system, and can also be used in an air-liquid mixed heat dissipation system.
  • the embodiment of the present application does not specifically limit it.
  • the second cold plate 120 can be provided with several fixing holes 127.
  • the fixing holes 127 can be a screw hole or a rivet hole, etc.
  • the heat dissipation device can be fixedly installed on the single board component 160 or other equipment, and the flow channel 124 between the heat dissipation teeth 123 gaps can be a shovel tooth type, a milling channel Or put the flow channel 124 in the form of spoiler, etc., which is suitable for various forms of cold plates such as milling channels or micro channels.
  • the pipe 150 is connected to multiple heat sinks, so that each heat sink is correspondingly installed on a single board component 160 in the device, and the pipe 150 can be A plurality of mother channels and sub channels are set, and the parent channel and the sub channels are connected.
  • the mother channel can be connected to multiple sub channels, and the sub channels are connected to the water inlet pipes 1111 of each cooling device.
  • the multiple sub channels Summarized to the main channel, the heat sinks are connected by pipes 150 to form a series-parallel fluid circuit, and the inlet and outlet of the pipes 150 are connected to the outside to form a closed circuit.
  • the first cold plates 110 of multiple heat sinks are always in reliable contact with the corresponding veneer components 160, and pass through the pipe 150
  • the connection through the design of the floating parts 130 of each cooling device, solves the supporting reaction force caused by the pipe 150 due to the height tolerance, so as to realize a stable and reliable connection with multiple single-board components 160 in the equipment, which not only has high pressure resistance, but also No risk of leakage, simple structure, can save a lot of hardware design costs, the small size of the heat dissipation device also greatly reduces the space designed for heat dissipation in the equipment, and the heat dissipation effect is obvious.
  • the through hole 111 can be provided on the side of the first cold plate 110 .
  • At the top of the first cold plate 110 that is, at least one of the water inlet pipe 1111 and the water outlet pipe 1112 can be arranged on the side of the first cold plate 110, and at least one of the water inlet pipe 1111 and the water outlet pipe 1112 can also be arranged on the second
  • the top of a cold plate 110 can be reasonably set according to specific application scenarios, which is not specifically limited in this embodiment of the present application.
  • the second cold plate 120 when the floating component 130 is respectively connected to the first cold plate 110 and the second cold plate 120, the second cold plate 120
  • the second cold plate 120 may be in direct contact with the single plate element 160 , or the interface material 170 may be provided on the single plate element 160 so that the second cold plate 120 is connected to the interface material 170 .
  • the floating component 130 When the floating component 130 is arranged on the second surface 122 of the second cold plate 120, the floating component 130 can be in direct contact with the veneer element 160, or an interface material 170 can be arranged on the veneer component 160, so that the floating component 130 can be in contact with the interface
  • the material 170 is connected, and the interface material 170 may be a high-tolerance interface material 170, which is not specifically limited in this embodiment of the present application.
  • a retractable shrapnel 140 is also included, and one end of the shrapnel 140 is connected to the heat dissipation tooth 123, that is, connected to the top of the heat dissipation tooth 123, and the elastic piece 140 The other end is connected with the first cold plate 110.
  • FIG. 7 when the floating part 130 is deformed, in order to ensure the fit between the tooth tops of the cooling teeth 123 and the first cold plate 110, it is necessary to prevent the fluid from flowing from the tooth tops to the first cold plate 110. The gaps between the cold plates 110 flow out, and a stretchable and deformable shrapnel 140 is designed.
  • the elastic piece 140 is a structure with a certain elastic deformation capacity, and its material and shape are not limited. For example, a plurality of elastic elements can be provided in the elastic piece 140, which can satisfy a certain elastic deformation capacity.
  • the fluid in the pipe 150 has a certain pressure on the cooling cavity 125, and acts on the floating part 130, so the elasticity of the shrapnel 140 is better than that of the floating part. The amount of deformation of the component 130 under the reaction force of the pipe 150 is used to stabilize the cooling device.
  • the elastic piece 140 may not be provided between the first cold plate 110 and the heat dissipation teeth 123, and by The floating connection between the heat sink and the single-board component 160 can be realized by separately disposing the floating component 130 on the second surface 122 .
  • the floating component 130 is arranged around the heat dissipation chamber 125.
  • the floating component 130 is located at least on one side of the cooling cavity 125, in order to better realize floating and improve stability, the floating component 130 is positioned on the opposite sides of the cooling cavity 125, and on the other side
  • the floating component 130 is arranged around the heat dissipation cavity 125, enclosing the heat dissipation cavity 125 in a closed space, improving the stability of the heat dissipation device, and preventing fluid from flowing out of the heat dissipation device, and protecting the connection with the heat dissipation device.
  • the first cold plate 110 and the second cold plate 120 are arranged in a rectangular shape
  • the cooling cavity 125 is also designed as a rectangular cavity
  • the floating component 130 can be separately arranged in one of the rectangular cavity. On the side, it can be arranged on the opposite sides of the rectangular cavity.
  • the floating component 130 is arranged on a rectangular cavity. On the four sides of the cavity, the heat dissipation cavity 125 is surrounded and surrounded.
  • the specific shape of the first cold plate 110 and the second cold plate 120 can be a regular geometric shape or an irregular geometric shape In the drawings of the embodiment of the present application, a rectangle is taken as an example, but it is not meant to limit the present application.
  • the first cold plate 110 is provided with a protrusion 112, the protrusion 112 is a structural form of the first cold plate 110, in one embodiment, the protrusion 112 and the first cold plate 110 can be formed integrally. In another embodiment, the protruding part 112 and the first cold plate 110 can also be separately processed and connected.
  • the first cold plate 110 is provided with a first groove 113 at a position corresponding to the protrusion 112, the through hole 111 is arranged on the protrusion 112 and the position of the through hole 111 corresponds to the position of the first groove 113, and the protrusion 112 has a certain length , in one embodiment, the protruding portion 112 is located on both sides of the first cold plate 110, and the formed groove may be a recessed part on the first cold plate 110, as shown in FIG.
  • the fluid from the through hole 111 enters the first groove 113 and the heat dissipation cavity 125, and then passes through the flow channel 124 in the heat dissipation cavity 125 to reach Converge in the groove on the other side, and communicate with the outside world through the through hole 111 and the water outlet pipe 1112 .
  • the design of the flow channel 124 in the cooling chamber 125 of the cold plate improves the cooling capacity of the cold plate.
  • the corresponding flow channel 124 can be specially set to meet the heat dissipation, such as milling grooves, placing spoilers or shovel-tooth microchannels, etc. , to ensure its heat dissipation and fluid circulation, and improve the effect of heat dissipation.
  • the floating component 130 is connected to the first cold plate 110 and the second cold plate 120 respectively, one end of the floating component 130 is connected to the first cold plate
  • the protruding part 112 on 110 is connected, and the other end of the floating part 130 is connected with the first surface 121 of the second cold plate 120, realizing the floating connection between the first cold plate 110 and the second cold plate 120, through the floating part 130
  • the heat dissipation chamber 125 is sealed to improve the stability of the heat dissipation device, prevent fluid from flowing out of the heat dissipation device, and protect and connect the single-board component 160 on the heat dissipation device. It should be noted that, in another embodiment, as shown in FIG.
  • the protrusion 112 can be directly connected to the second cold plate On the first surface 121 of 120 , the protruding part 112 seals the cooling cavity 125 to improve the stability of the cooling device, prevent fluid from flowing out of the cooling device, and protect and connect the single board component 160 on the cooling device.
  • the second cold plate 120 is provided with a second groove 126 on the second surface 122, and the second The shape of the groove 126 matches the shape of the floating component 130, and the floating component 130 can be embedded in the second groove 126, so that when the floating component 130 does not need to be deformed or slightly deformed, the floating component 130 can be embedded in the second groove 126.
  • the second surface 122 of the second cold plate 120 is flat.
  • the other end of the floating component 130 is connected to the veneer element 160 or the interface material 170 through expansion and contraction, and by setting the second groove 126, if the floating component 130 is arranged on the second surface 122, heat dissipation is saved
  • the space of the device while ensuring a certain heat dissipation effect, also greatly reduces the space designed for heat dissipation in the device.
  • the floating component 130 includes a telescopic housing 131, and an elastic element 132 is arranged in the housing 131, and the two ends of the elastic element 132 are respectively connected to two ends in the housing 131.
  • the housing 131 contains a large number of miniature springs or shrapnels as elastic elements 132.
  • the miniature springs or shrapnels 140 can be processed by conventional processing methods or new 3D printing technologies, which are not specifically limited in the embodiment of the present application.
  • the spring or shrapnel is made of metal material or graphite sheet or other high thermal conductivity materials, its thermal conductivity is good, its own thermal resistance is small, and the heat dissipation effect of the heat dissipation device is improved.
  • the structure of the floating part 130 needs to be integrated. Processing, or the connection method after processing separately does not affect its floating or stretching ability.
  • the floating component 130 if the floating component 130 is arranged on the second surface 122 of the second cold plate 120, the floating component 130 includes a retractable housing 131; if the floating component 130 is arranged on the first cold plate 110 and the second In the case between the two cold plates 120, the floating member 130 can also be in the shape of a plate or a tube, as shown in FIG. structure of capabilities.
  • the outer surface of the housing 131 is provided with a braided layer 133
  • the braided layer 133 covers the housing 131
  • the material of the braided layer 133 can be a metal material, It can also be other materials, such as carbon fibers, organic polymer materials, etc., which are not specifically limited in this embodiment of the present application.
  • the thickness of the floating part 130 can be specifically set according to the expansion and contraction requirements of the specific scene, resulting in different strengths of the floating part 130. By setting the braided layer 133, the strength of the floating part 130 can be improved, the structure is simple, and the heat dissipation is improved. device stability.
  • the floating component 130 if it is connected to the first cold plate 110 and the second cold plate 120 respectively, it can be connected by welding in occasions requiring high reliability, and one end of the floating component 130 is welded On the first cold plate 110, the other end of the floating part 130 is welded on the first surface 121, or, for occasions with low reliability requirements, it can also be connected in a form such as a medium, and the floating part 130 is provided with a first medium (in the figure not shown), one end of the floating component 130 is connected to the first cold plate 110 through the first medium, and the other end of the floating component 130 is connected to the first surface 121 through the first medium.
  • the floating part 130 is arranged on the second surface 122, it can be connected by welding for occasions with high reliability requirements, and the floating part 130 is welded on the second surface 122, or, for occasions with low reliability requirements
  • the connection may be in the form of a medium or the like.
  • the floating component 130 is provided with a second medium (not shown in the figure), and the floating component 130 is connected to the second surface 122 through the second medium.
  • the heat sink adopts different methods for connecting the floating component 130 for different reliability occasions. For occasions with high reliability requirements, welding is used, and for occasions with low reliability, the connection is made through the first medium or the second medium.
  • the floating part 130 can also be integrated with the first cold plate 110 Or the second cold plate 120 is connected, and the floating part 130 can also realize the contact with the first cold plate 110 or the second cold plate 120 through the force.
  • Different connection modes may be used, which are not specifically limited in this embodiment of the present application.
  • the embodiment of the present application also provides an electronic device.
  • the electronic device can apply the heat dissipation device in any one of the above embodiments.
  • the electronic device can be an ICT device, or it can be a device that needs heat dissipation, such as a battery cooling system.
  • the electronic device can be Including electronic components such as single-board components 160, batteries, or optical modules.
  • the embodiment of the present application uses the single-board component 160 as an example, but it is not meant to limit this application.
  • the single-board component 160 can be a single board or a chip, and the electronic device can also be It may include an interface material 170 connected to the veneer element 160.
  • the veneer element 160 may be directly connected to the second surface 122 of the second cold plate 120 of the heat dissipation device, or may be connected through the interface material 170.
  • the heat dissipation device may The telescopic floating part 130 and the heat dissipation cavity 125 formed between the first cold plate 110 and the second cold plate 120 can realize heat dissipation.
  • the floating part 130 can be arranged on the first cold plate 110 and the second cold plate 120
  • the distance between the first cold plate 110 and the second cold plate 120 can be adjusted by telescopic adjustment, and it can also be correspondingly arranged on the second surface 122 of the second cold plate 120, and the second cold plate 120 can be connected to the The distance of the single-board component 160 on the heat sink, through the setting of the floating part 130, the electronic equipment in the embodiment of the present application has good floating performance and high reliability, and can make stable contact with the heat sink, which is the electronic component inside the electronic equipment. Effective cooling, through electronic equipment, can also be applied to the design of air-cooled whole-board radiators and the design of VC vapor chambers.
  • the heat dissipation device in the embodiment of the present application is provided with a retractable floating part, and a heat dissipation cavity is formed between the first cold plate and the second cold plate.
  • the distance between the second cold plate and the first cold plate or the distance between the second cold plate and the single plate element can be adjusted telescopically to ensure the distance between the second cold plate and the unit.
  • the board components are always in reliable contact, and the cooling device in the embodiment of the application has good floatability and high reliability, and can make stable contact with electronic components such as single board components, and effectively cool down the temperature of the electronic components.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置及电子设备，散热装置包括第一冷板(110)，第一冷板(110)上设置有通孔(111)，通孔(111)被设置为连接进水管(1111)和出水管(1112)；第二冷板(120)，第一冷板(110)和第二冷板(120)之间形成散热腔(125)，散热腔(125)与通孔(111)连通；可伸缩的浮动部件(130)，浮动部件(130)与第二冷板(120)连接，以供第二冷板(120)进行浮动散热。

Description

散热装置及电子设备
相关申请的交叉引用
本申请基于申请号为202110859071.7，申请日为2021年7月28日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请涉及散热装置技术领域，特别是涉及一种散热装置及电子设备。
背景技术
随着电子技术的高速发展，电子元件的功耗和散热也随之不断提高，为了提高电子器件的运行效率、保护电子元件以使其正常工作，往往需要对运行中的电子元件进行降温，间接式的液冷技术就是其中的一种降温方式，在发展较快的间接式液冷技术中，电子元件与液冷板表面贴合，电子元件热量通过热传导传递给液冷板、液冷板与工质间进行强有效的对流换热带走热量。在一些情形下，通过含有流体的冷板设成散热装置给电子元件进行间接式的液冷降温，但是，一些情形中的散热装置存在浮动性差、可靠性低的缺点，无法与电子元件进行稳定接触，因此无法为电子元件进行有效降温。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本申请实施例提供了一种散热装置及电子设备。
第一方面，本申请实施例提供了一种散热装置，包括：第一冷板，所述第一冷板上设置有通孔，所述通孔被设置为连接进水管和出水管；第二冷板，所述第一冷板和所述第二冷板之间形成散热腔，所述散热腔与所述通孔连通；可伸缩的浮动部件，所述浮动部件与所述第二冷板连接，以供所述第二冷板进行浮动散热。
第二方面，本申请实施例还提供了一种电子设备，包括如本申请第一方面实施例中任意一项所述散热装置。
本申请的其他特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本申请而了解。本申请的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本申请技术方案的进一步理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本申请的技术方案，并不构成对本申请技术方案的限制。
图1是本申请实施例提供的散热装置的内部结构示意图；
图2是本申请另一实施例提供的散热装置的内部结构示意图；
图3是本申请另一实施例提供的散热装置的内部结构示意图；
图4是本申请实施例提供的散热装置的整体示意图；
图5是本申请另一实施例提供的散热装置的整体示意图；
图6是本申请实施例提供的散热装置的连接示意图；
图7是本申请实施例提供的散热装置的浮动变化示意图；
图8是本申请另一实施例提供的散热装置的内部结构示意图；
图9是本申请另一实施例提供的散热装置的内部结构示意图；
图10是本申请另一实施例提供的散热装置的内部结构示意图；
图11是本申请另一实施例提供的散热装置的内部结构示意图；
图12是本申请实施例提供的浮动部件的内部结构示意图；
图13是本申请另一实施例提供的散热装置的内部结构示意图。
附图标记：
第一冷板110；通孔111；进水管1111；出水管1112；突出部112；第一凹槽113；第二冷板120；第一表面121；第二表面122；散热齿123；流道124；散热腔125；第二凹槽126；固定孔127；浮动部件130；壳体131；弹性元件132；编织层133；弹片140；管道150；单板元件160；界面材料170。
具体实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
应了解，在本申请实施例的描述中，多个(或多项)的含义是两个以上，大于、小于、超过等理解为不包括本数，以上、以下、以内等理解为包括本数。如果有描述到“第一”、“第二”等只是用于区分技术特征为目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量或者隐含指明所指示的技术特征的先后关系。
参照图1至图3所示，本申请实施例中提供了一种散热装置，散热装置包括第一冷板110、第二冷板120和浮动部件130，浮动部件130可伸缩，具备伸缩调节的能力，浮动部件130连接在第二冷板120上，以供第二冷板120进行浮动散热，第一冷板110和第二冷板120中的一个为冷板基板，另一个为冷板盖板，在本申请实施例中，第一冷板110为冷板盖板，第二冷板120为冷板基板，第二冷板120被设置为与单板元件160等电子元件接触，电子元件可以是单板元件160、电池或光模块等，单板元件160可以包括单板或芯片等，本申请实施例以单板元件160为例子，但并不表示为对本申请的限制。其中，第一冷板110上设置有通孔111，参照图4和图5所示，通孔111可以连接包括至少一个的进水管1111和至少一个的出水管1112。第一冷板110和第二冷板120之间形成散热腔125，散热腔125与通孔111连通，参照图6所示，在一实施例中，通孔111可与管道150连接，进水管1111和出水管1112可以是管道150的一部分，还可以分别拼接到管道150上，流体可从管道150的进水管1111进入通孔111，再流经流道124内，后流体经另一个通孔111从出水管1112流出。通过浮动部件130的设置，根据冷板之间由于高度差和/或公差带来的管道150支反力，浮动部件130连接在第二冷板120上可以伸缩调节第二冷板120与第一冷板110的间距或第二冷板120与单板元件160的间距，保证第二冷板120与单板元件160始终保持可靠接触，本申请实施例 中的散热装置浮动性好、可靠性高，能与单板元件160等电子元件进行稳定接触，为电子元件进行有效降温。
在本申请的一些实施例中，参照图1所示，浮动部件130分别与第一冷板110和第二冷板120连接，散热腔125设置于第二冷板120的第一表面121上，浮动部件130设置于散热腔125的至少一侧上，从而保证了第一冷板110和第二冷板120之间的浮动连接，参照图2所示，浮动部件130还可以设置于第二冷板120的第二表面122上，第二表面122与第一表面121相对设置，第一表面121和第二表面122分别为第二冷板120的对立的两面。在一实施例中，浮动部件130可单独设置在第一冷板110和第二冷板120之间，在另一实施例中，浮动部件130也可以单独设置在第二冷板120的第二表面122上，在另一实施例中，浮动部件130还可以同时设置在以上两处，包括其中一个浮动部件130设于第一冷板110和第二冷板120之间，另一个浮动部件130设置在第二冷板120的第二表面122上。本申请实施例中的散热装置，通过应用了浮动部件130，在散热装置安装及运行过程中，通过调节第二冷板120和第一冷板110的浮动部件130，保证了第二冷板120与单板元件160始终保持可靠稳定接触，为单板元件160进行有效散热，从而更好地让散热装置稳定连接在单板元件160上。
参照图1所示，在本申请的一些实施例中，第二冷板120的第一表面121上设置有散热齿123，散热齿123可以是单独设置在第二冷板120上，也可以是与第二冷板120一体化加工后形成的，第二冷板120与单板元件160接触，传递来自单板元件160上的热量，并将热量对流传递到散热腔125中的冷却介质中，需要说明的是，第一冷板110和第二冷板120之间形成散热腔125，散热齿123位于散热腔125内，散热齿123的间隙之间形成流道124，流道124与通孔111连通，以将来自通孔111的流体流到流道124内，即流经散热齿123之间的间隙，通过高效的对流换热带走单板元件160等电子元件的热量，流道124内可填充冷却液等流体作为冷却介质。
需要说明的是，本申请实施例中的流体可以是氟化液、水类或水-乙二醇类单相冷却工质等，也可以是相变工质如R134a等用于冷却的液体，散热装置可应用在纯液冷散热系统中，也可以用在风液混合散热系统中，本申请实施例不对其作具体限制，第二冷板120上可设有若干个固定孔127，固定孔127可以是螺钉孔或柳钉孔等，通过固定孔127可将散热装置固定安装在单板元件160或其它设备上，散热齿123间隙之间的流道124可以是铲齿式、铣槽道或者放扰流片等形式的流道124，适用于铣槽道或微通道等各种形式的冷板中。
参照图6所示，需要说明的是，在散热装置的一个应用场景中，管道150连接有多个散热装置，以将每个散热装置对应安装在设备中的单板元件160上，管道150可设置多个母道和子道，母道和子道连通，母道可连接多个子道，通过子道与各个散热装置的进水管1111连接，再经过散热装置内的出水管1112后，多个子道再汇总到母道上，散热装置之间通过管道150连接，形成串并联的流体回路，管道150的进出口与外界相连，形成闭合回路，在一实施例中，设备内设有多个单板元件160，由于单板元件160的高度差或公差，单板元件160之间存在一定的高度公差，多个散热装置的第一冷板110始终与对应的单板元件160保持可靠接触，并通过管道150连接，通过各个散热装置的浮动部件130的设计解决由于高度公差造成管道150带来的支反力，从而实现与设备中的多个单板元件160实现稳定可靠连接，不仅耐压能力高，且无泄漏风险，结构简单，可以节省大量的硬件设计成本，散热装置尺寸小，也大大降低设备内的为散热而多设计的空间，散热效果明显。
需要说明的是，在本申请的一些实施例中，参照图1和图4所示，通孔111可设在第一冷板110的侧方，参照图3和图5所示，也可以设在第一冷板110的顶端，即，进水管1111和出水管1112中的至少一个可以设在第一冷板110的侧方，进水管1111和出水管1112中的至少一个也可以设在第一冷板110的顶端，可根据具体的应用场景进行合理设置，本申请实施例不对其作具体限制。
参照图1和图2所示，需要说明的是，在本申请的一些实施例中，当浮动部件130分别与第一冷板110和第二冷板120连接的情况下，第二冷板120可以与单板元件160直接接触，也可以通过在单板元件160上设置界面材料170，使得第二冷板120与界面材料170连接。当浮动部件130设置于第二冷板120的第二表面122上，浮动部件130可以与单板元件160直接接触，也可以通过在单板元件160上设置界面材料170，使得浮动部件130与界面材料170连接，界面材料170可以是高容差界面材料170，本申请实施例不对其作具体限制。
参照图1和图2所示，在本申请的一些实施例中，还包括可伸缩的弹片140，弹片140的一端与散热齿123连接，即连接在散热齿123的齿顶上，弹片140的另一端与第一冷板110连接，参照图7所示，当浮动部件130发生形变时，为保证散热齿123的齿顶与第一冷板110的贴合，防止流体从齿顶与第一冷板110之间的间隙流出，设计了可伸缩变形的弹片140。弹片140是具有一定弹性变形能力的结构，其材料和形状不限，例如弹片140内可设有多个弹性的元件，能满足一定的弹性变形能力，在一实施例中，若浮动部件130分别与第一冷板110和第二冷板120连接的情况下，管道150内的流体对散热腔125具有一定的压强，并将作用力作用到浮动部件130上，因此弹片140的弹性优于浮动部件130在管道150反力作用下的变形量，以使得散热装置的稳定性。
参照图8所示，需要说明的是，若浮动部件130设置于第二冷板120的第二表面122上的情况下，第一冷板110和散热齿123之间可以不设置弹片140，通过单独设置浮动部件130在第二表面122上，即可实现散热装置与单板元件160之间的浮动连接。
参照图4和图5所示，在本申请的一些实施例中，若浮动部件130分别与第一冷板110和第二冷板120连接的情况下，浮动部件130环绕设置于散热腔125的四周，在一实施例中，浮动部件130至少位于散热腔125的一侧上，为了更好的实现浮动性和提高稳定性，浮动部件130位于散热腔125的对立的两侧上，在另一实施例中，浮动部件130围绕设置于散热腔125的四周，将散热腔125包围在一个密闭的空间内，提高了散热装置的稳定性，也避免了流体从散热装置中流出，保护了与连接在散热装置上的单板元件160。需要说明的是，在一实施例中，第一冷板110和第二冷板120设置为矩形，散热腔125也为设计为矩形的腔体，浮动部件130可单独设置在矩形腔体的一侧上，可以设置在矩形腔体的对立两侧上，为了提高散热装置的稳定性，避免流体从散热装置中流出，保护与连接在散热装置上的单板元件160，浮动部件130设置在矩形腔体的四个边上，实现对散热腔125的环绕包围，需要说明的是，第一冷板110和第二冷板120的具体形态可以是规则的几何形状也可以是不规则的几何形状，本申请实施例附图以矩形为例，但并不表示为对本申请的限制。
参照图9所示，在本申请的一些实施例中，第一冷板110上设置有突出部112，突出部112是第一冷板110的一种结构形式，在一实施例中，突出部112与第一冷板110可以是一体加工成型的，在另一实施例中，突出部112与第一冷板110还可以是分别加工后连接的，根据突出部112的存在，第一冷板110在与突出部112对应位置上设置有第一凹槽113，通 孔111设置于突出部112上且通孔111的位置与第一凹槽113的位置相对应，突出部112具有一定的长度，在一实施例中，突出部112位于第一冷板110的两侧，所形成的槽可以是在第一冷板110上凹陷的部分，参照图10所示，也可以是第一凹槽113与散热齿123之间的部分，通过第一凹槽113的设计，来自通孔111的流体进入第一凹槽113内，及散热腔125内，然后通过散热腔125内的流道124到达另一边凹槽内汇聚，通过通孔111与出水管1112与外界连通。冷板散热腔125中流道124的设计提高了冷板的散热能力，同时根据实际的需要可以专门设置满足散热对应的流道124，比如铣槽道，放置扰流片或铲齿式微通道等类型，以保证其散热和流体的流通，提高了散热的效果。
参照图9和图10所示，在本申请的一些实施例中，若浮动部件130分别与第一冷板110和第二冷板120连接的情况下，浮动部件130的一端与第一冷板110上的突出部112连接，浮动部件130的另一端与第二冷板120的第一表面121连接，实现了第一冷板110和第二冷板120之间的浮动连接，通过浮动部件130密闭散热腔125，提高散热装置的稳定性，避免流体从散热装置中流出，保护与连接在散热装置上的单板元件160。需要说明的是，在另一实施例中，参照图2所示，若浮动部件130设置于第二冷板120的第二表面122上的情况下，突出部112可以直接连接到第二冷板120的第一表面121上，通过突出部112密闭散热腔125，提高散热装置的稳定性，避免流体从散热装置中流出，保护与连接在散热装置上的单板元件160。
参照图11所示，在本申请的一些实施例中，若浮动部件130设置于第二表面122上的情况下，第二冷板120在第二表面122设置有第二凹槽126，第二凹槽126的形状与浮动部件130的形状相匹配，浮动部件130可嵌于第二凹槽126中，以使得当浮动部件130不需要发送形变或轻微发生形变，浮动部件130可以镶嵌在第二凹槽126内，第二冷板120的第二表面122平整，当浮动部件130需要进行形变以与单板元件160进行稳定连接，浮动部件130的一端可固定连接在第二冷板120的第二表面122上，浮动部件130的另一端通过伸缩连接到单板元件160或界面材料170上，通过设置第二凹槽126，使得若浮动部件130设置于第二表面122上时，节省了散热装置的空间，在确保一定的散热效果的同时，也大大降低设备内的为散热而多设计的空间。
参照图12所示，在本申请的一些实施例中，浮动部件130包括可伸缩的壳体131，壳体131内设置有弹性元件132，弹性元件132的两端分别连接在壳体131内的两侧上，壳体131内部含有大量微型弹簧或弹片作为弹性元件132，该微型弹簧或弹片140可以通过常规加工方式或新型3D打印等技术加工，本申请实施例不对其作具体限制。在实现浮动变形特性的同时，由于弹簧或弹片为金属材质或石墨片或其他高导热材料，其导热特性良好，自身热阻小，提高了散热装置的散热效果，浮动部件130的结构需要一体化加工，或者分别加工后连接方式不影响其浮动性或伸缩能力。
需要说明的是，若浮动部件130设置在第二冷板120的第二表面122上的情况下，浮动部件130包括可伸缩的壳体131，若浮动部件130设置在第一冷板110和第二冷板120之间的情况下，浮动部件130还可以是板式形状，也可以是管式形状，参照图13所示，还可以是波纹板，亦或是其他形状或不同材质的具有一定伸缩能力的结构。
参照图9和图10所示，在本申请的一些实施例中，壳体131的外表面设置有编织层133，编织层133覆盖在壳体131上，编织层133的材料可以是金属材质，也可以是其他材料，比 如碳纤维，有机高分子材料等，本申请实施例不对其作具体限制。在实际应用中，浮动部件130的厚度可根据具体场景的伸缩要求具体设置，致使浮动部件130的强度不一，通过编织层133的设置，可以提高浮动部件130的强度，结构简单，提高了散热装置的稳定性。
在本申请的一些实施例中，若浮动部件130分别与第一冷板110和第二冷板120连接的情况下，对于可靠性要求高的场合可以采用焊接形式连接，浮动部件130的一端焊接在第一冷板110上，浮动部件130的另一端焊接在第一表面121上，或，对于可靠性要求低的场合也可以采用介质等形式连接，浮动部件130设置有第一介质(图中未示出)，浮动部件130的一端通过第一介质连接在第一冷板110上，浮动部件130的另一端通过第一介质连接在第一表面121上。而若浮动部件130设置于第二表面122上的情况下，对于可靠性要求高的场合可以采用焊接形式连接，浮动部件130焊接在第二表面122上，或，对于可靠性要求低的场合也可以采用介质等形式连接，浮动部件130设置有第二介质(图中未示出)，浮动部件130通过第二介质连接在第二表面122上。在一实施例中，散热装置对不同可靠性场合，对浮动部件130的连接采用了不同的方式，可靠性要求高的场合采用焊接，可靠性低的场合通过第一介质或第二介质进行连接，其中，第一介质和第二介质可以是密封圈、粘胶或硅胶等密封连接的材料，在另一实施例中，浮动部件130还可以通过一体化加工的方式，与第一冷板110或第二冷板120连接，浮动部件130还可以通过作用力实现与第一冷板110或第二冷板120的接触等，在本申请实施例中，根据不同的可靠性要求的场合，具体可应用不同的连接方式，本申请实施例不对其作具体限制。
本申请实施例还提供了一种电子设备，电子设备可应用上述实施例中任意一项的散热装置，电子设备可以是ICT设备，也可以是电池散热系统等需要进行散热的设备，电子设备可以包括单板元件160、电池或光模块等电子元件，本申请实施例以单板元件160为例子，但并不表示为对本申请的限制，单板元件160可以是单板或芯片，电子设备还可以包括与单板元件160连接的界面材料170，单板元件160可直接与散热装置的第二冷板120的第二表面122连接，也可以通过界面材料170实现连接，散热装置通过设置了可伸缩的浮动部件130，第一冷板110和第二冷板120之间形成的散热腔125可实现散热，需要说明的是，浮动部件130可设在第一冷板110和第二冷板120之间，通过伸缩调节第一冷板110和第二冷板120之间的距离，也可对应设在第二冷板120的第二表面122上，通过伸缩调节第二冷板120与连接在散热装置上的单板元件160的距离，通过浮动部件130的设置，本申请实施例中的电子设备浮动性好、可靠性高，能与散热装置进行稳定接触，为电子设备内部的电子元件进行有效降温，通过电子设备还可以应用在风冷整板散热器的设计以及VC均温板的设计。
本申请实施例至少包括以下有益效果：本申请实施例中的散热装置通过设置了可伸缩的浮动部件，第一冷板和第二冷板之间形成散热腔，通过浮动部件的设置，根据冷板之间由于高度差和/或公差带来的管道支反力，伸缩调节第二冷板与第一冷板的间距或第二冷板与单板元件的间距，保证第二冷板与单板元件始终保持可靠接触，本申请实施例中的散热装置浮动性好、可靠性高，能与单板元件等电子元件进行稳定接触，为电子元件进行有效降温。
还应了解，本申请实施例提供的各种实施方式可以任意进行组合，以实现不同的技术效果。
以上是对本申请的若干实施方式进行了具体说明，但本申请并不局限于上述实施方式，熟悉本领域的技术人员在不违背本申请精神的共享条件下还可作出种种等同的变形或替换， 这些等同的变形或替换均包括在本申请权利要求所限定的范围内。

Claims (14)

  1. 散热装置，包括：
    第一冷板，所述第一冷板上设置有通孔，所述通孔被设置为连接进水管和出水管；
    第二冷板，所述第一冷板和所述第二冷板之间形成散热腔，所述散热腔与所述通孔连通；
    可伸缩的浮动部件，所述浮动部件与所述第二冷板连接，以供所述第二冷板进行浮动散热。
  2. 根据权利要求1所述的散热装置，其中，所述浮动部件分别与所述第一冷板和所述第二冷板连接，所述浮动部件设置于所述散热腔的至少一侧上。
  3. 根据权利要求1或2所述的散热装置，其中，所述散热腔设置于所述第二冷板的第一表面上，所述浮动部件设置于所述第二冷板的第二表面上，所述第二表面与所述第一表面相对设置。
  4. 根据权利要求1或2所述的散热装置，其中，所述第二冷板的第一表面上设置有散热齿，所述散热齿位于所述散热腔内，所述散热齿的间隙之间形成流道，所述流道与所述通孔连通。
  5. 根据权利要求1或2所述的散热装置，其中，所述第一冷板上设置有突出部，所述第一冷板在与所述突出部对应位置上设置有第一凹槽，所述通孔设置于所述突出部上且所述通孔的位置与所述第一凹槽的位置相对应。
  6. 根据权利要求5所述的散热装置，其中，所述浮动部件的一端与所述突出部连接，所述浮动部件的另一端与所述第二冷板的第一表面连接。
  7. 根据权利要求1或2所述的散热装置，其中，所述浮动部件包括可伸缩的壳体，所述壳体内设置有弹性元件，所述弹性元件的两端分别连接在所述壳体内的两侧上。
  8. 根据权利要求7所述的散热装置，其中所述壳体的外表面设置有编织层。
  9. 根据权利要求2所述的散热装置，其中所述浮动部件环绕设置于所述散热腔的四周。
  10. 根据权利要求2所述的散热装置，其中，所述浮动部件的一端焊接在所述第一冷板上，所述浮动部件的另一端焊接在所述第二冷板上，或，所述浮动部件设置有第一介质，所述浮动部件的一端通过所述第一介质连接在所述第一冷板上，所述浮动部件的另一端通过所述第一介质连接在所述第二冷板上。
  11. 根据权利要求3所述的散热装置，其中，所述第二冷板在所述第二表面设置有第二凹槽，所述浮动部件嵌于所述第二凹槽中。
  12. 根据权利要求3所述的散热装置，其中，所述浮动部件焊接在所述第二表面上，或，所述浮动部件设置有第二介质，所述浮动部件通过所述第二介质连接在所述第二表面上。
  13. 根据权利要求4所述的散热装置，还包括可伸缩的弹片，所述弹片的一端与所述散热齿连接，所述弹片的另一端与所述第一冷板连接。
  14. 电子设备，包括如权利要求1至13中任意一项所述散热装置。
PCT/CN2022/078896 2021-07-28 2022-03-02 散热装置及电子设备 WO2023005205A1 (zh)

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