Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
  • C23C16/45561—Gas plumbing upstream of the reaction chamber
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
  • C23C16/45585—Compression of gas before it reaches the substrate
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/52—Controlling or regulating the coating process
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
  • G01F11/00—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it
  • G01F11/02—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it with measuring chambers which expand or contract during measurement
  • G01F11/021—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it with measuring chambers which expand or contract during measurement of the piston type
  • G01F11/029—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it with measuring chambers which expand or contract during measurement of the piston type provided with electric controlling means
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
  • G01F11/00—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it
  • G01F11/02—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it with measuring chambers which expand or contract during measurement
  • G01F11/08—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it with measuring chambers which expand or contract during measurement of the diaphragm or bellows type
  • G01F11/082—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it with measuring chambers which expand or contract during measurement of the diaphragm or bellows type of the squeeze container type

Definitions

• the invention relates to a process device for machining workpieces, in particular for semiconductor production, and a method for metering a process gas into a process chamber of a process device designed in particular for semiconductor production.
• Process gases are used in many manufacturing processes, such as those used in the electronics industry, especially in the semiconductor industry.
• process gases which can have a wide range of chemical properties from inert to highly reactive
• chemical processes on the workpiece to be processed can be initiated, supported or interrupted in the course of workpiece processing.
• a process device for workpiece processing is typically provided for processing a number of sequential work steps and has connections to a number of process gas sources for this purpose.
• the object of the invention is to provide a process device in which cost-effective dosing of process gas is made possible. Furthermore, the object of the invention is to provide a method for metering a process gas into a process chamber, with which a high degree of precision for the process gas metering can be achieved.
• Process device for workpiece processing in particular for semiconductor production, with a process chamber for receiving workpieces and for carrying out a processing process using at least one process gas and with a Metering device for at least one process gas, which is fluidically connected to the process chamber and which has an elastically deformable metering container which delimits a gas volume of variable size and on which a fluid connection for gas supply into the gas volume and/or for gas discharge from the gas volume educated is, and with a drive device for initiating a deformation movement on the dosing and with a control device for controlling the drive device.
• the process chamber is typically designed as a closed spatial volume into which workpieces can be fed in and removed through a suitable opening (hatch, door, shaft).
• one or more processing means are arranged on and/or in the process chamber, which are designed to carry out the respective desired processing process.
• These processing means can be, for example, an electrical voltage generator and electrodes which are electrically connected to it and are arranged in the process chamber, in order to be able to carry out a plasma treatment for the workpieces, for example.
• the process chamber is assigned a dosing device for dosing the process gas, which is fluidically connected to the process chamber. With this, a process gas provided by the dosing device can be fed into the process chamber in order to start, support or interrupt the desired machining process there.
• the dosing device comprises the dosing container designed to be elastically deformable, as well as a drive device connected to the dosing container and a control device, which is designed to actuate the drive device.
• the drive device can optionally be designed exclusively for compression of the dosing container to reduce the volume of the gas volume contained therein or exclusively for expansion of the dosing container to increase the volume of the gas volume contained therein. Provision is particularly preferably made for the drive device to be designed both for compression and for expansion of the dosing container. is formed in order to be able to precisely influence a pressure curve and/or a mass flow curve for the process gas both when process gas flows into the dosing container and when process gas flows out of the dosing container.
• a gas volume of the process gas is accommodated in the dosing container, so that in the course of the compression movement for the dosing container, which is caused by the drive device, the process gas quantity that is required during the execution of the respective machining process can be made available to the process chamber.
• the gas volume taken up in the dosing container can be released during a single dosing process or during a series of dosing devices that follow one another in time.
• a residual gas volume of the process gas always remains in the dosing tank, since excessive deformation of the dosing tank into the plastic range should be avoided. If necessary, provision can be made to reduce this residual gas volume in the dosing container by means of a displacement insert.
• a maximum gas volume of the dosing container is also dependent on the elastic limit of the dosing container, whereby neither the elastic limit for the compression movement nor the elastic limit for the expansion movement of the dosing container should be reached in practice. Rather, the expansion and the compression of the dosing container should be selected in such a way that a purely elastic deformation of the dosing container is always possible, even under changing environmental conditions, in particular special taking into account temperature fluctuations
• the drive device is designed to apply compressive forces or tensile forces or both tensile forces and compressive forces to the dosing container.
• the dosing container has an average gas volume in an off initial state in which the drive device is completely power-free and thus allows for an expansion movement to reach its maximum
• the dosing container has either a minimum gas volume or a maximum gas volume in the powerless starting position of the drive device and accordingly either an expansion movement or a compression movement must be provided by the drive device in order to enable the desired process gas dosing.
• the control device which is designed, for example, as a microprocessor or microcontroller with corresponding peripherals, is used to provide drive energy to the drive device, with this drive energy depending on a control signal from a higher-level controller connected to the control device and/or depending on sensor signals from a or more sensors that are electrically connected to the control device can be provided.
• Advantageous embodiments of the invention are the subject matter of the dependent claims.
• the dosing container or the drive device is assigned a position sensor which is designed to provide a position signal dependent on the deformation of the dosing container and which is connected to the control device, the control device being used to process the position signal, in particular for Carrying out a position control for the drive device, is designed to cause a predetermined deformation for the dosage container.
• the position sensor has the task of making a position signal available to the control device, with which the control device is able to determine a volume change for the dosing container before, during and after an activation period of the drive device and a corresponding activation of the to allow drive device.
• a large number of position sensors in particular sensors for incremental or absolute length determination or sensors for distance determination on an optical, magnetic or capacitive basis, can be used for such a deformation determination.
• a further development of the invention provides that a pressure sensor is attached to the dosing container, in particular to the fluid connection, which is designed to provide a pressure signal as a function of a gas pressure in the dosing container and which is electrically connected to the control device.
• the pressure sensor allows the Steuerein device, knowing the gas pressure in the dosing container, to make a targeted control of the drive device in order to either receive a precisely defined volume of gas in the dosing container or to deliver a precisely defined volume of gas from the dosing container.
• the control device can also use the pressure signal from the pressure sensor to estimate or determine a mass flow for the process gas that is corrected from the dosing container into the process chamber.
• a valve device is arranged on the fluid connection and is electrically connected to the control device and if the control device is designed to activate the valve device as a function of the position signal and/or the pressure signal.
• the valve device which can be designed in particular as a fluidically pre-controlled switching valve or as a solenoid valve or as a piezo valve, enables the process gas stream to be delivered from the dosing container into the process chamber to be influenced precisely over time.
• valve device Before process gas is made available from the dosing container to the process chamber, with the valve device closed, pressure can be built up in the dosing container by activating the drive device accordingly, in order to then open the valve device and allow the process gas to flow out into the Pro process chamber within a predetermined time interval to allow.
• the valve device can also be designed as a proportional valve, although the mass flow between metering container and process chamber can also be influenced by appropriate control of the drive device.
• a non-linear change over time for the gas volume of the dosing container can be provided in order to be able to meet the corresponding requirements of the machining process in the process chamber.
• the control device carries out a corresponding non-linear control of the drive device.
• the valve device has at least one inlet connection for connection to a process gas source and an outlet connection for connection to the process chamber as well as an internal connection for coupling to the fluid connection and between at least two Switching positions can be switched. It is preferably provided that the valve device has three switching positions so that either a fluidically communicating connection between the process gas source and the dosing container or a fluidly communicating connection between the dosing container and the process chamber or a blocking of the fluid connection can be implemented.
• the fluid connection is connected to the process chamber and that a process gas connection is formed on the dosing container, which is provided for connection to a process gas source and on which a process gas valve is arranged, which is electrically connected to the Control device is connected and which is designed for metering a process gas into the gas volume of the metering container.
• valve device and a process gas valve assigned to the process gas connection can each be designed as 2/2-way switching valves, both of which are controlled by the control device Process chamber are made, in which case both the valve device and the process gas valve are permanently open.
• a second process gas connection is formed on the dosing container, which is provided for connection to a second process gas source and on which a second process gas valve is arranged, which is electrically connected to the control device and is used for dosing a second process gas is formed in the gas volume of the dosing container.
• the dosing container can be used to mix a first process gas and a second process gas before they are fed to the process chamber.
• the process gas valve can be opened in a first step in order to introduce a predetermined quantity of a process gas, which can also be referred to as the first process gas, from the process gas source into the dosing container.
• the second process gas valve is opened, with which a second process process gas can be fed from the second process gas source into the metering container in order to mix there with the first process gas.
• the second process gas valve is then closed and when the valve device is subsequently opened, the gas mixture now present in the dosing container can be made available to the process chamber.
• the dosing container is made as a bellows made of a metallic material and is designed for elastic deformation along a deformation axis and/or that a dimensionally stable coupling plate is attached to opposite end regions of the dosing container, with a Drive housing and a movably mounted in Antriebsgephaseu se drive element of the drive device is connected to one of the coupling plates.
• the dimensionally stable coupling plates of the dosing container thus serve to introduce the force that must be applied by the drive device to the bellows in order to bring it from a force-free neutral position into a compression position and/or into an expansion position.
• the bellows is preferably produced in a seamless manufacturing process, ie it has no connecting seam on its circumference.
• the bellows which are preferably designed to be rotationally symmetrical to the deformation axis, are sealingly accommodated at each end on the corresponding dimensionally stable coupling plate, in particular connected to the dimensionally stable coupling plate in a materially bonded manner.
• the drive device comprises a drive housing which is fixed to one of the two coupling plates, and a movable, in particular linearly movable, drive element mounted in the drive housing, which is connected to the other of the two coupling plates at an end region remote from the drive housing.
• the drive device When a suitable flow of energy is provided, which is made available by the control device, is provided, a relative movement between the drive element and the drive housing can be effected, which leads to an increase or decrease in the distance between the two coupling plates.
• one or more guide devices in particular linear guides, can be provided which extend between the two coupling plates and ensure that the coupling plates are always aligned in parallel.
• the drive device is designed to provide a linear deformation movement on the dosing container and is selected from the group: electric spindle drive, electric rack and pinion drive, hydraulic cylinder, pneumatic cylinder.
• the drive device is preferably designed as an electric spindle drive, in which an electric motor sets a gear arrangement, for example a threaded spindle, in rotation, on which a lock nut is accommodated, which is rotatably and li nearmovably mounted in the drive housing. and which is linearly displaced when the threaded spindle rotates.
• an electric spindle drive With such an electric spindle drive, a particularly precise expansion movement or compression movement can be effected for the dosing container.
• At least one sensor for detecting at least one physical property of the gas contained in the metering container from the group: temperature sensor, gas density sensor, humidity sensor is arranged on the dosing container, which is electrically connected to the control device and that the Control device for processing a Sensorsig signal of the at least one sensor is formed.
• the control device is provided with information that can be used for a particularly precise dosing of that process gas quantity that is to be provided from the gas volume of the dosing container into the process chamber. For this purpose, information about the temperature of the gas in the gas volume and/or about the density of the gas contained in the gas volume and/or about a moisture content of the gas contained in the gas volume is of particular interest.
• the object of the invention is achieved by a method for metering a process gas into a process chamber of a process device designed in particular for semiconductor production, with the following steps: Opening a process gas valve connected to a process gas source in order to supply a process gas to a process gas connection of an elastic to provide a deformable dosing container, initiating an expansion movement for the dosing container with a drive device that is controlled by a control device, determining at least one physical variable from the group: change in shape of the dosing container, process gas pressure in the dosing container, process gas density in the dosing container, change in position the drive device, is selected; Closing the process gas valve and deactivating the drive device when a predetermined threshold value is reached for the at least one physical variable that is monitored by the control device; Opening a valve device connected to a fluid connection on the dosing container and initiating a compression movement on the dosing container with the drive device, which is controlled by the control device in order to at least partially provide the process
• FIG. 1 shows a process device with a process chamber and with a dosing device that has a dosing container, a control device, a drive unit and valves, with the dosing container being shown in a neutral position.
• a process device 1 shown in FIG. 1 is used for
• the process device 1 comprises a process chamber 2, which is purely exemplary of a box-shaped design and delimits a process space, not shown in detail, in which a workpiece, also not shown, can be accommodated for carrying out the machining process.
• the process chamber 2 is assigned processing means, not shown in detail, for example an electrical high-voltage source and electrodes arranged in the process space, with which a plasma can be ignited by supplying a process gas, with the aid of which the processing process can be carried out.
• processing means not shown in detail, for example an electrical high-voltage source and electrodes arranged in the process space, with which a plasma can be ignited by supplying a process gas, with the aid of which the processing process can be carried out.
• other machining processes can also be carried out in the process chamber 2 using a process gas.
• the process chamber 2 is connected to a dosing device 3 which is designed to provide the process gas to the process chamber 2 .
• the dosing device 3 comprises a dosing container 4 which is designed to be elastically deformable in some areas and is provided with a drive device 6 which is designed to initiate a deformation movement on the dosing container 4 .
• the dosing device 3 includes a control device 7, which is provided for electrically activating the drive device 6 and which is also set up for processing sensor signals and for activating valves 10, 12, which are described in more detail below.
• the dosing container 4 has a thin-walled bellows 13 made of a metallic material and extending along a deformation axis 22, which is preferably produced in a manufacturing process that enables the bellows 13 to be designed seamlessly.
• the bellows 13 has a wavy profile and is rotationally symmetrical to the deformation axis 22, so that during an expansion movement along the deformation axis 22 or during a compression movement along the deformation axis 22, a substantially uniform bending load is always exerted on all wall sections of the bellows 13.
• the bellows 13 is in a neutral position according to the illustration in FIG.
• the bellows 13 can be exposed along the deformation axis 22 to either an expansion movement in an expansion direction 23 or a compression movement in a compression direction 24 be, whereby a limited by the bellows 13 gas volume 25 is selectively increased or decreased.
• the bellows is connected to a first, circular ring-shaped end region 15 with a first coupling plate 17 in a sealing manner, in particular cohesively, and a second, circular ring-shaped end region 16 to a second coupling plate 18 sealingly, in particular cohesively, connected.
• the first coupling plate 17 and the second coupling plate 18 are each dimensioned in such a way that they do not experience any significant elastic deformation when the dosing device 3 is used as intended and can therefore be regarded as dimensionally stable.
• the drive device 6 is arranged between the first coupling plate 17 and the second coupling plate 18 in order to enable a distance between the first coupling plate 17 and the second coupling plate 18 to be set.
• the drive device 6 comprises a drive housing 19 which is connected to the second coupling plate.
• the driving device 6 comprises a drive element 20 which is connected to the first coupling plate 17 and which is accommodated in a linearly movable housing 19 in the drive.
• an electric motor is accommodated in the drive housing 19, which is designed via a gear unit, also not shown, for initiating a linear movement on the drive element 20, with the linear movement of the drive element 20 being aligned parallel to the deformation axis 22.
• the guide device 26 comprises a guide rod 27 fixed to the second coupling plate 18 and a slidable guide axis 28 accommodated on the guide rod and connected to the first coupling plate 17.
• the drive device 6 is assigned a position sensor 8 which is designed to determine a linear relative position of the drive element 20 with respect to the drive housing 19 . Due to the arrangement of the drive unit 6 between the first coupling plate 17 and the second coupling plate 18, there is a clear relationship between the relative position of the drive element 20 relative to the drive housing 19 and the deformation of the bellows 13 along the deformation axis 22.
• a control device 7 is provided for controlling the drive device 6 and for processing position signals from the position sensor 8, which can be embodied, for example, as a decentralized control device in a control network that is not shown in detail, the control network being used to control a subarea of a production line for semiconductor production or another manufacturing process or for controlling a complete production line.
• control device 7 is equipped with a bus interface 29, which can be used for digital communication with a non-illustrated, higher-level machine control, with this machine control, for example, also for controlling the Not shown processing means of the process chamber 2 can be formed.
• the control device 7 comprises, for example, a microprocessor or microcontroller, not shown, which is designed to run computer software in order to generate a process gas flow of a process gas source 30 to the process chamber 2 to allow.
• the dosing device 3 comprises a process gas connection 11 assigned to the second coupling plate 18 and connected to the process gas source 30 via a process gas line 31 .
• a process gas valve 12 is provided, which is designed purely as an example as a 2/2-way solenoid valve and which is connected to the control device 7 via a first control line 32 .
• a fluid connection 5 is provided between the metering container 4 and the process chamber 2 and is used to discharge process gas from the gas volume 25 into the process chamber 2 .
• the fluid connection 5 is assigned a valve device 10 which, purely by way of example, is designed as a 2/2-way solenoid valve which is connected to the control device 7 via a second control line 33 connected is.
• the Fluidan circuit 5 is associated with a pressure sensor 9, which is connected via a sensor line 34 to the control device 7, wherein the control device 7 is designed to process the sensor signal of the pressure sensor 9 .
• the first coupling plate 17 is assigned a sensor 21, which can be, for example, a temperature sensor or a gas density sensor or a moist sensor or a combination thereof, with this sensor 21 being in fluid communication in a manner not shown in detail with the gas volume 25 and is connected to the control device 7 via a sensor line 35 .
• a sensor 21 can be, for example, a temperature sensor or a gas density sensor or a moist sensor or a combination thereof, with this sensor 21 being in fluid communication in a manner not shown in detail with the gas volume 25 and is connected to the control device 7 via a sensor line 35 .
• a mode of operation of the dosing device 3 can be described as follows: in order to provide a process gas to the process chamber 2 of the process device 1, both the valve device 10 and the process gas valve 12 are opened in a first step in order to carry out a flushing process for all gas-carrying sections of the process device 1 to be able to carry out. It is preferably provided here that the elastically deformable dosing container 4 has a minimal volume. After completion of this flushing process, both the valve device 10 and the process gas valve 12 are closed. If necessary, provision can now be made to evacuate the elastically deformable dosing container 4 and/or the process chamber 2 via a vacuum line (not shown) which is connected to a vacuum pump (also not shown).
• the drive device 6 is then actuated by the control device 7 in the expansion direction 23, so that an increase in volume for the gas volume 25 of the metering container 4, which is designed to be elastically deformable, takes place.
• the process gas valve 12 is already opened during this expansion movement, so that process gas can flow from the process gas source 30 into the gas volume 25 of the elastically deformed mibar trained dosing container 4 can flow.
• the inflow process can be monitored, for example, using the pressure signal from the pressure sensor, and the position signal from the position sensor 8 can also be used to set a maximum gas volume for the subsequent process gas metering process.
• the process gas valve 12 is closed.
• a sensor signal from sensor 21 can be evaluated in control device 7, for example to obtain information about the extent to which a gas density and/or a temperature of the gas and/or a moisture content of the gas in gas volume 25 is within a specified target interval.
• valve device 10 can be opened in a subsequent step so that the process gas can flow from the gas volume 25 of the elastically deformable metering container 4 into the process chamber 2, which is usually kept under vacuum.
• This outflow process is supported by an actuation of the drive device 6 by means of the control device 7 in such a way that a compression movement for the dosing container 4 is caused in the compression direction 24, so that a pressure in the gas volume 25 is kept constant at least as far as possible in order to keep the pressure as equal as possible to ensure a shaped outflow of the process gas into the process chamber 2 .
• valve device 10 is now actuated by the control device 7 to block the fluidically communicating connection between the dosing container 4 and the process chamber 2. This step completes the process gas dosing.

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• Chemical & Material Sciences (AREA)
• General Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Mechanical Engineering (AREA)
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• Organic Chemistry (AREA)
• Physics & Mathematics (AREA)
• Fluid Mechanics (AREA)
• General Physics & Mathematics (AREA)
• Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
• Drying Of Semiconductors (AREA)

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• 2021
  • 2021-07-20 DE DE102021207727.7A patent/DE102021207727B4/de active Active
• 2022
  • 2022-07-07 KR KR1020247005349A patent/KR20240031409A/ko unknown
  • 2022-07-07 WO PCT/EP2022/068860 patent/WO2023001569A1/de active Application Filing
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