WO2023000404A1 - 显示面板和显示装置 - Google Patents

显示面板和显示装置 Download PDF

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Publication number
WO2023000404A1
WO2023000404A1 PCT/CN2021/111627 CN2021111627W WO2023000404A1 WO 2023000404 A1 WO2023000404 A1 WO 2023000404A1 CN 2021111627 W CN2021111627 W CN 2021111627W WO 2023000404 A1 WO2023000404 A1 WO 2023000404A1
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WO
WIPO (PCT)
Prior art keywords
connecting wire
overlapping
substrate
layer
projection
Prior art date
Application number
PCT/CN2021/111627
Other languages
English (en)
French (fr)
Inventor
叶剑
Original Assignee
武汉华星光电技术有限公司
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司, 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US17/602,786 priority Critical patent/US20240122024A1/en
Publication of WO2023000404A1 publication Critical patent/WO2023000404A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • the present application relates to the field of display technology, in particular to a display panel and a display device.
  • OLED Organic Light-Emitting Diode (organic light-emitting diode) display devices are widely used due to their advantages such as wide viewing angle, wide color gamut, high brightness, fast response speed, low power consumption, and bendability.
  • a display panel with a self-capacitance structure is used in an OLED display device.
  • the display panel with self-capacitance structure includes a single-layer design touch layer and a multi-layer touch layer. The lines will occupy a certain area of the touch effective area, resulting in a touch blind area, so the OLED display device will use a multi-layer touch layer.
  • the connecting wires and the touch electrodes are arranged on different layers, and the connecting wires and the touch electrodes are arranged around the pixels, the overlapping area between the connecting wires and the touch electrodes is relatively large, and the display The large parasitic capacitance of the panel causes a large voltage drop on the touch layer, which affects the touch performance.
  • the existing OLED display device has a technical problem that the overlapping area between the connecting wiring and the touch electrode is large, resulting in a large voltage drop of the touch layer.
  • Embodiments of the present application provide a display panel and a display device, which are used to alleviate the technical problem of a larger voltage drop of a touch layer caused by a large overlapping area of a connecting line and a touch electrode in an existing OLED display device.
  • An embodiment of the present application provides a display panel, which includes:
  • a driving circuit layer disposed on one side of the substrate
  • a light emitting layer disposed on a side of the driving circuit layer away from the substrate;
  • an encapsulation layer disposed on a side of the light-emitting layer away from the driving circuit layer;
  • a touch layer disposed on a side of the encapsulation layer away from the light-emitting layer
  • the touch control layer includes a touch metal layer, a connecting wire layer, and an insulating layer disposed between the touch metal layer and the connecting wire layer, and the touch metal layer includes a touch metal layer and a connecting wire layer connected to the touch control layer.
  • the touch control metal is connected to the wire
  • the connecting wire layer includes a connecting wire
  • the touch metal is arranged around the sub-pixels of the display panel, and the connecting wire passes through the via hole of the insulating layer and the overlapping wire
  • the wires are connected, and the length of the overlapping portion of the projection of the connecting wire on the substrate and the projection of the overlapping wire on the substrate is smaller than the length of the overlapping wire.
  • the connecting wire in the area where the connecting wire is connected to the overlapping wiring, includes a first end and a second end, and the first end of the connecting wire is not connected to the second end.
  • the projection of the connected side on the substrate overlaps with the projection of the overlapping trace on the substrate.
  • the overlapping routing includes a first end and a second end respectively connected to the two touch metals, and the first end of the overlapping routing is connected to the first end of the connecting wire.
  • a point between the first end and the second end of the overlapping trace is connected to the first end of the connecting wire, and the second end of the overlapping trace is Not connected to the connecting wire.
  • the first end of the overlapping trace is connected to the midpoint of the connecting wire, and the midpoint of the overlapping trace is connected to the first end of the connecting wire.
  • the touch metal includes a first circular portion and a first straight portion and a second straight portion connecting the first circular portion
  • the overlapping wiring includes a first semicircular portion part
  • the second straight line part connects the first semi-circular part and the first circular part
  • the connecting wire includes a second semi-circular part and a third straight line part connecting the second semi-circular part, the third straight line part and the second semi-circular part
  • One of the junction points is connected to the midpoint of the first semi-circular portion.
  • the connecting wire in a region where the projection of the connecting wire on the substrate does not overlap with the projection of the overlapping trace on the substrate, the connecting wire further includes a third semicircle part, the third straight line part connects the second semicircular part and the third semicircular part, and the third semicircular part and the second semicircular part are located on the third straight line part on the same side.
  • the connecting wire in the area where the projection of the connecting wire on the substrate does not overlap with the projection of the overlapping trace on the substrate, the connecting wire further includes a fourth semi-circular ring part, the third straight line part connects the second semicircular part and the fourth semicircular part, at least part of the fourth semicircular part and the second semicircular part are located in the first semicircular part Both sides of the three straight line sections.
  • the fourth semicircular part and the second semicircular part are located on both sides of the third straight line part, and the fourth semicircular part and the second semicircular part sections alternately arranged in the direction of said third straight line section.
  • the connecting wire in a region where the projection of the connecting wire on the substrate does not overlap with the projection of the overlapping trace on the substrate, the connecting wire further includes a second ring portion , the third straight line portion connects the second circular ring portion and the second semi-circular ring portion.
  • the touch metal includes a first ring portion, a first straight line portion connecting the first ring portion, and a second straight line portion
  • the overlapping wiring includes a first semi-ring part
  • the second straight line part connects the first semicircular part and the first circular part
  • the connecting wire in the area where the connecting wire overlaps with the overlapping wiring, includes an opening formed A circular ring portion and a fourth straight line portion connecting the open circular ring portion, a connection point between the fourth straight line portion and an end point of the open circular ring portion is connected to a midpoint of the first semi-circular ring portion.
  • the connecting wire in a region where the projection of the connecting wire on the substrate does not overlap with the projection of the overlapping trace on the substrate, the connecting wire further includes a third ring portion , the fourth straight line portion is connected to the third ring portion.
  • the touch metal includes a first polygonal portion and a fifth straight line portion and a sixth straight line portion connecting the first polygonal portion
  • the overlapping wiring includes a first folded line portion
  • the sixth straight line part connects the first fold line part and the first polygonal part, when the projection of the connection wire on the substrate and the overlapping trace on the substrate
  • the connecting wire includes a second broken line part and a seventh straight line part, and the junction point of the second broken line part and the seventh straight line part is connected to the midpoint of the first broken line part.
  • the connecting wire in a region where the projection of the connecting wire on the substrate does not overlap with the projection of the overlapping trace on the substrate, the connecting wire further includes a third fold line portion,
  • the seventh straight line portion connects the second fold line portion and the third fold line portion, and the second fold line portion and the third fold line portion are located on the same side of the seventh straight line portion.
  • the connecting wire in a region where the projection of the connecting wire on the substrate does not overlap with the projection of the overlapping trace on the substrate, the connecting wire further includes a fourth fold line portion,
  • the seventh straight line portion connects the second folded line portion and the fourth folded line portion, and at least part of the fourth folded line portion and the second folded line portion are located on both sides of the seventh straight line portion.
  • the fourth fold line portion and the second fold line portion are located on both sides of the seventh straight line portion, and the fourth fold line portion and the second fold line portion are along the seventh straight line portion. direction alternately.
  • the connecting wire in a region where the projection of the connecting wire on the substrate does not overlap with the projection of the overlapping trace on the substrate, the connecting wire further includes a second polygon part, the seventh line part connects the second fold line part and the second polygonal part.
  • the overlapping wiring includes a first end and a second end respectively connected to the two touch metals, and the first end of the connecting wire is connected to the first end of the overlapping wiring. connection between the first end and the second end, the second end of the connection wire is connected to the second point between the first end and the second end of the overlapping trace, and the first point It is different from the second point.
  • an embodiment of the present application provides a display device, the display device includes a display panel and electronic components, and the display panel includes:
  • a driving circuit layer disposed on one side of the substrate
  • a light emitting layer disposed on a side of the driving circuit layer away from the substrate;
  • an encapsulation layer disposed on a side of the light-emitting layer away from the driving circuit layer;
  • a touch layer disposed on a side of the encapsulation layer away from the light-emitting layer
  • the touch control layer includes a touch metal layer, a connecting wire layer, and an insulating layer disposed between the touch metal layer and the connecting wire layer, and the touch metal layer includes a touch metal layer and a connecting wire layer connected to the touch control layer.
  • the touch control metal is connected to the wire
  • the connecting wire layer includes a connecting wire
  • the touch metal is arranged around the sub-pixels of the display panel, and the connecting wire passes through the via hole of the insulating layer and the overlapping wire
  • the wires are connected, and the length of the overlapping portion of the projection of the connecting wire on the substrate and the projection of the overlapping wire on the substrate is smaller than the length of the overlapping wire.
  • the connecting wire in the area where the connecting wire is connected to the overlapping wiring, includes a first end and a second end, and the first end of the connecting wire is not connected to the second end.
  • the projection of the connected side on the substrate overlaps with the projection of the overlapping trace on the substrate.
  • the overlapping routing includes a first end and a second end respectively connected to the two touch metals, and the first end of the overlapping routing is connected to the first end of the connecting wire.
  • a point between the first end and the second end of the overlapping trace is connected to the first end of the connecting wire, and the second end of the overlapping trace is Not connected to the connecting wire.
  • the present application provides a display panel and a display device;
  • the display panel includes a substrate, a driving circuit layer, a light emitting layer, a packaging layer and a touch layer, the driving circuit layer is arranged on one side of the substrate, and the light emitting layer is arranged on the driving circuit layer away from the On one side of the substrate, the encapsulation layer is disposed on the side of the light-emitting layer away from the driving circuit layer, and the touch layer is disposed on the side of the encapsulation layer away from the light-emitting layer, wherein the touch layer includes a touch metal layer, a connecting wire layer and a set An insulating layer between the touch metal layer and the connection wire layer, the touch metal layer includes the touch metal and the bonding traces connecting the touch metal, the connection wire layer includes the connection wire, and the touch metal surrounds the sub-pixels of the display panel It is set that the connecting wire passes through the via hole of the insulating layer and is connected to the overlapping wiring, and the length of the overlapping portion
  • This application realizes the connection between the connecting wire and the touch metal by passing the connecting wire through the via hole and connecting the overlapping wire, and makes the projection of the connecting wire on the substrate overlap with the projection of the overlapping wire on the substrate
  • the length of the part is shorter than the length of the overlapping wiring, which reduces the length of the overlapping part of the connecting wire and the touch metal layer, thereby reducing the parasitic capacitance, reducing the voltage drop, and alleviating the problem of large voltage drop of the touch layer.
  • FIG. 1 is a first schematic diagram of a display panel provided by an embodiment of the present application.
  • FIG. 2 is a second schematic diagram of a display panel provided by an embodiment of the present application.
  • FIG. 3 is a first schematic diagram of a touch metal layer provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a first type of connecting wire layer provided by the embodiment of the present application.
  • FIG. 5 is a first schematic diagram of the touch layer provided by the embodiment of the present application.
  • FIG. 6 is a second schematic diagram of the connection wire layer provided by the embodiment of the present application.
  • FIG. 7 is a third schematic diagram of the connection wire layer provided by the embodiment of the present application.
  • FIG. 8 is a fourth schematic diagram of the connection wire layer provided by the embodiment of the present application.
  • FIG. 9 is a third schematic diagram of a display panel provided by an embodiment of the present application.
  • FIG. 10 is a second schematic diagram of the touch metal layer provided by the embodiment of the present application.
  • FIG. 11 is a fifth schematic diagram of the connecting wire layer provided by the embodiment of the present application.
  • FIG. 12 is a second schematic diagram of the touch layer provided by the embodiment of the present application.
  • FIG. 13 is a sixth schematic diagram of the connection wire layer provided by the embodiment of the present application.
  • FIG. 14 is a seventh schematic diagram of the connecting wire layer provided by the embodiment of the present application.
  • FIG. 15 is a schematic diagram of a display device provided by an embodiment of the present application.
  • the embodiments of the present application aim at the technical problem that the existing OLED display device has a large overlapping area between the connecting wiring and the touch electrode, resulting in a large voltage drop on the touch layer, and provides a display panel and a display device to alleviate the above-mentioned problems. technical problem.
  • an embodiment of the present application provides a display panel, which includes:
  • a driving circuit layer 12 disposed on one side of the substrate 11;
  • a light emitting layer 13 disposed on a side of the driving circuit layer 12 away from the substrate 11;
  • the touch layer 15 is disposed on the side of the encapsulation layer 14 away from the light emitting layer 13;
  • the touch layer 15 includes a touch metal layer 153, a connecting wire layer 151 and an insulating layer 152 disposed between the touch metal layer 153 and the connecting wire layer 151, and the touch metal layer 153 includes a touch control metal 31 and the overlapping wiring 32 connecting the touch metal 31, the connection wire layer 151 includes a connection wire 41, the touch metal 31 is arranged around the sub-pixels of the display panel (for example, the touch control in FIG.
  • the touch metal in the control metal layer 153 is arranged around the green sub-pixel 213), the connecting wire 41 passes through the via hole of the insulating layer 152 to connect with the overlapping wire 32, and the connecting wire 41 is in the The length of the overlapping portion of the projection on the substrate 11 and the projection of the overlapping wiring 32 on the substrate 11 is smaller than the length of the overlapping wiring 32 .
  • the embodiment of the present application provides a display panel.
  • the display panel realizes the connection between the connecting wire and the touch metal by passing the connecting wire through the via hole and connecting the overlapping wire, and makes the projection of the connecting wire on the substrate and the overlapping
  • the length of the overlapping portion of the projection of the connection wire on the substrate is shorter than the length of the overlapping wire, reducing the length of the overlapping portion of the connecting wire and the touch metal layer, thereby reducing parasitic capacitance, reducing voltage drop, and relieving touch control.
  • the problem of large pressure drop in the layer is reducing the length of the overlapping portion of the connecting wire and the touch metal layer.
  • the touch metal formed on the touch electrode layer is used to receive touch signals, and the overlapping traces are used to connect different touch metals, so as to realize the voltage drop of the touch metals.
  • the connection wire formed by the connection wire layer is used to transmit the touch signal, that is, the overlapping area of the connection wire and the touch electrode in the technical problem of this application refers to: the connection wire and the touch metal and the overlapping area in the embodiment of this application The overlapping area of the traces.
  • the connecting wire in the area where the connecting wire is connected to the overlapping wiring, includes a first end and a second end, and the first end is not connected to the second end.
  • a projection of one side on the substrate does not overlap with a projection of the overlapping trace on the substrate.
  • the first end and the second end of the connecting wire 41 refer to the second semi-circular part 411 and the third half ring part 411.
  • the junction point of the straight line portion 412 can be seen from FIG. 5: the unconnected side of the first end and the second end of the connecting wire 41 (that is, the part without wires on the left side of the third straight line portion 412) is on the substrate
  • the projection on the substrate overlaps with the projection of the overlapping trace 32 on the substrate.
  • the first end and the second end of the connecting wire 41 are respectively the two end points of the opening of the open ring portion 712, one end point is connected with the fourth straight line portion 713, and the other end is Points are not connected with the fourth straight line portion 713 .
  • the two ends of the connecting wire are disconnected by making the connecting wire in the connection area with the overlapping wire, and the opening formed by the disconnection (the area where the wire is not set) is connected with the connecting wire on the substrate.
  • the opening formed by the disconnection (the area where the wire is not set) is connected with the connecting wire on the substrate.
  • There are overlapping parts in the projection so as to reduce the overlapping area of the connecting wires and the overlapping traces, and alleviate the problem of large voltage drop of the touch layer.
  • the overlapping routing includes a first end and a second end respectively connected to the two touch metals, and the first end of the overlapping routing is connected to the first end of the connecting wire.
  • One point connection between one end and the second end, one point of the first end and the second end of the overlapping routing is connected to the first end of the connecting wire, and the second end of the overlapping routing Not connected to the connecting wire.
  • the second end of the lapped trace is not connected to the connecting wire, so that the lapped trace and the connecting wire.
  • the first end of the overlapping wiring 32 (that is, the right connection point among the two connection points between the overlapping wiring 32 and the second straight line portion 313 ) is connected to the connecting wire 41
  • the midpoint of the overlapping trace 32 is connected to the first end of the third straight line portion 412 .
  • the length of the overlapping routing 32 is the length of the semicircle
  • the length of the connecting wire 41 is the length of the semicircular ring and the straight line
  • the overlapping routing 32 partially overlaps with the connecting wire 41, and the length of the overlapping portion of the projection of the connecting wire 41 on the substrate 11 and the projection of the overlapping trace 32 on the substrate 11 is less than that of the overlapping trace
  • the length of the line 32 (the length of the overlapping portion of the projection of the connecting wire 41 on the substrate 11 in FIG. 5 and the projection of the overlapping trace 32 on the substrate 11 is the length of the semicircle
  • One-half of the length of the lap trace is the length of the semi-circle).
  • the corresponding touch metal, overlapping traces, and connecting wires are at least one of the ellipse and arc structures
  • the green sub-pixel 213 has an elliptical shape
  • the red sub-pixel 212 and the blue sub-pixel 211 have an arc structure, correspondingly, as shown in Fig. 3 and Fig.
  • the wire 32 is in the shape of a semi-ellipse
  • the connecting wire 41 is composed of an arc and a straight line.
  • the frame line 20 represents a section of the touch layer 15
  • the opening 221 represents two touch units located on both sides of the opening 221 .
  • the shape of the touch metal, the overlapping wiring and the connecting wire is shown by an elliptical ring and/or a semi-elliptical ring, but the touch metal, the overlapping wiring and the connecting wire
  • the wire can also be a ring and/or a semi-circle.
  • the ring part and the semi-circle part in the following embodiments do not limit the shape of the touch metal, the overlapping wiring and the connecting wire to a ring and a semi-circle.
  • the touch metal, the overlapping wires and the connecting wires may be circular, semi-circular, semi-circular, semi-circular, elliptical, semi-elliptical, elliptical, or semi-circular.
  • the touch metal 31 includes a first ring portion 311 and a first straight line portion 312 connecting the first ring portion 311 , a second straight line part 313, the overlapping routing 32 includes a first semicircular part, the second straight part 313 connects the first semicircular part and the first circular part 311, and the connecting wire 41
  • the connecting wire 41 includes a second semi-annular portion 411 and connects the second half
  • the third straight line portion 412 of the ring portion 411, one of the junction points of the third straight line portion 412 and the second semi-ring portion 411 is connected to the midpoint of the first semi-ring portion.
  • the touch metal 31 includes an elliptical first ring portion, a first straight line portion, and a second straight line portion
  • the corresponding overlapping wiring 32 includes a semi-elliptical first semicircle
  • the ring part as shown in Figure 4, is then designed to include the second semicircle part 411 and the 3rd straight line part 412 of semiellipse shape/quasi-semiellipse shape by connecting wire design, as shown in Figure 5, the second semicircle
  • the ring part is arranged along the installation direction of the touch metal, and the overlapping wiring is arranged along the vertical direction of the touch metal, so that the overlapping wiring and the connecting wire can be partially overlapped.
  • the embodiment of the present application is reduced by making the length of the overlapping portion of the connecting wire and the overlapped trace less than the length of the overlapped trace.
  • the above embodiment is described by taking one of the junction points of the third straight line part and the second semi-circular part as an example to connect with the midpoint of the first semi-circular part, that is, the connecting wire is connected to the substrate
  • the length of the overlapping part of the projection on the substrate and the projection of the overlapping trace on the substrate is equal to half of the length of the overlapping trace, but in the embodiment of the present application, in order to further reduce
  • the length of the overlapping portion of the projection of the connecting wire on the substrate and the projection of the overlapping trace on the substrate can also make the intersection of the third straight line part and the second semi-circular part
  • One of the first semi-circular parts is connected to any point along the opening of the second semi-circular ring away from the midpoint direction, then the shape and length of the connecting wire can be changed correspondingly at this time, so as to avoid the connection wire and touch Metal overlap.
  • the connecting wire 41 also includes a third semicircular part
  • the third straight line part 412 connects the second semicircular part 411 and the third semicircular part
  • the third semicircular part The ring portion and the second semi-circular portion 411 are located on the same side of the third straight line portion 412 .
  • the third semi-circular part is not marked in Fig. 4 and Fig. 5. It can be understood that the semi-circular part that does not overlap with the overlapping wiring is the third semi-circular part.
  • the circular ring part it can be seen from FIG. 4 that the second semi-circular ring part and the third semi-circular ring part are arranged on the same side of the third straight line part.
  • the lengths of the second semicircular part and the third semicircular part are equal, and the shapes of the second semicircular part and the third semicircular part are the same.
  • the second semi-circular part and the third semi-circular part have the same length and the same shape as an example, but in the embodiment of the present application, the projection of the connecting wire on the substrate is not limited.
  • the semi-circle of the area that does not overlap with the projection of the overlapping traces on the substrate, the projection of the connecting wires on the substrate, and the projection of the overlapping traces on the substrate The shape and length of the semi-circular rings in the overlapping area can be different in shape and length from the semi-circular rings located on the left and right sides of the straight line in order to avoid contact between the connecting wire and the touch metal.
  • the length of the semicircular ring connecting the wires is the same as the length of the overlapping traces.
  • the connecting wire 41 also includes a fourth semicircular part 511, the third straight part 412 connects the second semicircular part 411 and the fourth semicircular part 511, at least part of the fourth semicircular part 511 and the second semi-circular portion 411 are located on both sides of the third linear portion 412 .
  • the second semi-annular part and the fourth semi-annular part are connected with the overlapping wiring, while the fourth semi-annular part is not connected with the overlapping wiring.
  • the lines overlap to avoid a large overlapping length between the overlapping traces and the connecting wires, and reduce the voltage drop of the touch layer.
  • the fourth semicircle part 511 and the second semicircle part 411 are located on both sides of the third straight line part 412, and the fourth semicircle The ring portions 511 and the second semicircular ring portions 411 are arranged alternately along the direction of the three straight line portions 412 .
  • the second semi-circular part of the connecting wire is arranged at equal intervals, and has an overlapping part with the overlapping wiring, but the area where the connecting wire and the overlapping wiring do not overlap
  • the fourth semi-circular part is arranged on the other side of the third straight line part, so as to reduce the length of the overlapping part of the connecting wire and the touch metal layer, reduce the parasitic capacitance, and reduce the voltage drop.
  • the second semicircular part and the fourth semicircular part are arranged alternately along the direction of the third straight line part.
  • the second semicircular part and the fourth semicircular part can also be arranged at unequal intervals, for example, part of the fourth semicircular part and the second semicircular part are located on the same side of the first straight line part , part of the fourth semicircular part and the second semicircular part are located on both sides of the third straight line part.
  • connection wire 41 does not overlap with the projection of the overlapping wiring 32 on the substrate 11
  • the connection wire 41 further includes a second ring portion 611 , and the third straight line portion 412 connects the second ring portion 611 and the second semi-ring portion 411 .
  • the connection wire can also be set as a ring, an ellipse ring, a ring-like, The shape of the elliptical ring reduces the impedance of the connecting wire.
  • the touch metal 31 includes a first circular portion 311 , a first straight line portion 312 connecting the first circular portion 311 and The second straight line portion 313, the overlapping routing 32 includes a first semi-circular portion, the second straight portion 313 connects the first semi-circular portion and the first circular portion 311, in the The area where the connecting wire 41 overlaps with the overlapping wiring 32, the connecting wire 41 includes an open ring portion 712 and a fourth straight portion 713 connected to the open ring portion 712, the fourth straight portion The connection point of 713 with the end point of the open circular ring portion 712 is connected with the midpoint of the first half circular ring portion.
  • the length of the overlapping part of the connecting wire and the overlapping routing is less than the length of the overlapping routing, thus Reduce the parasitic capacitance and reduce the voltage drop of the touch layer.
  • the length of the open circular ring part ranges from one-half to three-quarters of the length of the first circular ring part. Considering that the length of the overlapping wiring is one-half of the circular ring, Then the length of the open ring is in the range of 1/2 to 3/4 of the length of the first ring part, the open ring can be connected vertically, and the length of the overlapping part of the open ring part and the overlapping routing Less than or equal to half of the length of the bonding trace, thereby reducing parasitic capacitance.
  • the projection of the connection wire 41 on the substrate 11 does not overlap with the projection of the overlapping wiring 32 on the substrate 11 area
  • the connecting wire 41 also includes a third ring portion 711
  • the fourth straight portion 713 connects the third ring portion 711, by combining the projection of the connecting wire on the substrate and the overlapping wiring in the
  • the non-overlapping area of the projection on the substrate is set in the shape of a ring, a quasi-circle, an ellipse, or a quasi-ellipse ring, so as to reduce the impedance of the connecting wiring.
  • the touch metal 31 includes a first polygonal portion 811 and a
  • the fifth straight line portion 812, the sixth straight line portion 813, the overlapping routing 32 includes a first folded line portion
  • the sixth straight line portion 813 connects the first folded line portion and the first polygonal portion 811 , in the area where the projection of the connecting wire 41 on the substrate 11 overlaps with the projection of the overlapping trace 32 on the substrate 11, the connecting wire 41 includes a second fold line portion 911 and a second fold line portion 911.
  • the seven straight line portions 912, the intersection point of the second fold line portion 911 and the seventh straight line portion 912 are connected to the midpoint of the first fold line portion.
  • the length of the overlapping part of the connecting wire and the overlapping wiring is 1/2 of the overlapping wiring, reducing The length of the overlapped part of the connecting wire and the touch metal layer is reduced, the parasitic capacitance is reduced, and the voltage drop is reduced.
  • the overlapping trace in FIG. 10 is a broken line formed by three straight lines, the length of the overlapping portion of the connecting trace in FIG. 11 and the projection of the overlapping trace in FIG. 10 on the substrate is less than One-half the length of the bonded trace.
  • the connection will be a straight line, and the wiring is easy to break. Therefore, in the embodiment of the The example is not limited thereto, the sides of the polygon may be directly connected to form a quadrilateral, for example, the polygon is a rhombus.
  • the connecting wire 41 also includes a third folded line portion
  • the seventh straight line portion 912 connects the second folded line portion 911 and the third folded line portion
  • the second folded line portion 911 and the third folded line portion The broken line portion is located on the same side of the seventh straight line portion 912 .
  • the projection of the connection wire 41 on the substrate 11 does not overlap with the projection of the overlapping wiring 32 on the substrate 11 area
  • the connecting wire 41 also includes a fourth folded line portion 913
  • the seventh straight line portion 912 connects the second folded line portion 911 and the fourth folded line portion 913, at least part of the fourth folded line portion 913 and
  • the second fold line portion 911 is located on two sides of the seventh straight line portion 912 .
  • the second folded line part is connected to the overlapping trace, and the fourth folded line part does not overlap with the overlapping trace, so as to avoid overlapping
  • the overlapping length of the wire and the connecting wire is relatively large, which reduces the voltage drop of the touch layer.
  • the fourth folded line portion 913 and the second folded line portion 911 are located on both sides of the seventh straight line portion 912, and the fourth folded line portion 913 and the The second folded line portions 911 are arranged alternately along the direction of the seventh straight line portion 912 .
  • the second folded line part of the connecting wire is arranged at equal intervals, and has an overlapping part with the overlapping wiring, and the first part of the area where the connecting wire and the overlapping wiring do not overlap
  • the four-fold line part is arranged on the other side of the seventh straight line part, so as to reduce the length of the overlapping part of the connecting wire and the touch metal layer, reduce parasitic capacitance, and reduce voltage drop.
  • the second folded line portion and the fourth folded line portion are arranged alternately along the direction of the third straight line portion.
  • the second folded line part and the fourth folded line part can also be arranged at unequal intervals, for example, part of the fourth folded line part and the second folded line part are located on the same side of the first straight line part, and part of the fourth folded line part is located on the same side as the first straight line part.
  • the two broken line parts are located on both sides of the third straight line part.
  • the projection of the connection wire 41 on the substrate 11 does not overlap with the projection of the bonding wire 32 on the substrate 11
  • the connecting wire 41 further includes a second polygonal portion 914
  • the seventh straight line portion 912 connects the second fold line portion 911 and the second polygonal portion 914 .
  • the length of the broken line part of the connecting wire is 1/2 of the length of the polygon as an example in the overlapping part of the connecting wire and the overlapping trace, but in the embodiment of the present application, it is not limited
  • the length of the broken line part of the connecting wire, the length range of the broken line part may be less than 3/4 of the length of the polygon.
  • the length of the folded line part that can be connected to the overlapping trace through the via hole is the smaller length.
  • the overlapping wiring includes a first end and a second end respectively connected to the two touch metals, and the first end of the connecting wire is connected to the first end of the overlapping wiring.
  • the first point between one end and the second end is connected, the second end of the connection wire is connected to the second point between the first end and the second end of the overlapping trace, and the first The point is different from the second point; that is, the two ends of the connecting wire are connected to the two points in the overlapping trace, and the first point and the second point are different, so that the overlap between the connecting wire and the overlapping trace can be reduced area, thereby reducing pressure drop.
  • the substrate 11 includes a protection layer 111 , a polyimide layer 112 , a barrier layer 113 and a buffer layer 114 .
  • the driving circuit layer 12 includes an active layer 121, a gate insulating layer 122, a gate layer 123, an interlayer insulating layer 124, a source-drain layer 125 and a planarization Layer 126.
  • the light emitting layer 13 includes a pixel electrode layer 131 , a pixel definition layer 132 , a light emitting material layer 133 and a common electrode layer 134 .
  • the encapsulation layer includes a first inorganic layer, an organic layer and a second inorganic layer.
  • the display panel further includes a passivation layer 16 , a polarizing layer 17 , an adhesive layer 18 and a cover plate 19 .
  • an embodiment of the present application provides a display device, the display device displays a panel and an electronic component 90, and the display panel includes:
  • a driving circuit layer 12 disposed on one side of the substrate 11;
  • a light emitting layer 13 disposed on a side of the driving circuit layer 12 away from the substrate 11;
  • the touch layer 15 is disposed on the side of the encapsulation layer 14 away from the light emitting layer 13;
  • the touch layer 15 includes a touch metal layer 153, a connecting wire layer 151 and an insulating layer 152 disposed between the touch metal layer 153 and the connecting wire layer 151, and the touch metal layer 153 includes a touch control metal 31 and the overlapping wiring 32 connecting the touch metal 31, the connection wire layer 151 includes a connection wire 41, and the touch metal 31 is arranged around the sub-pixels of the display panel (for example, the touch control in FIG.
  • the touch metal in the control metal layer 153 is arranged around the green sub-pixel 213), the connecting wire 41 passes through the via hole of the insulating layer 152 to connect with the overlapping wire 32, and the connecting wire 41 is in the
  • the overlapping portion of the projection on the substrate 11 and the projection of the overlapping trace 32 on the substrate 11 has a length shorter than the length of the overlapping trace 32 .
  • An embodiment of the present application provides a display device.
  • the display device includes a display panel and electronic components.
  • the display panel realizes the connection between the connecting wire and the touch metal by passing the connecting wire through the via hole and connecting the overlapping wire, and the The length of the overlapping portion of the projection of the connecting wire on the substrate and the projection of the overlapping trace on the substrate is shorter than the length of the overlapping trace, reducing the length of the overlapping portion of the connecting wire and the touch metal layer, thereby reducing parasitic Capacitors reduce the voltage drop and alleviate the problem of large voltage drop in the touch layer.
  • the electronic component includes an under-display camera, and the corresponding display panel may form a via hole for lighting.
  • the touch metal includes a first ring portion, a first straight line portion and a second straight line portion connecting the first ring portion, and the overlapping wiring Including a first semi-circular part, the second straight line part connects the first semi-circular part and the first circular part, and the projection of the connecting wire on the substrate and the overlapping
  • the connecting wire includes a second semi-circular part and a third straight part connecting the second semi-circular part, the third straight part and the One of the intersection points of the second semi-annular portion is connected to the midpoint of the first semi-annular portion.
  • the connecting wire in a region where the projection of the connecting wire on the substrate does not overlap with the projection of the overlapping wiring on the substrate, the connecting wire is also Including a third semicircular part, the third straight line part connects the second semicircular part and the third semicircular part, the third semicircular part and the second semicircular part on the same side as the third straight line portion.
  • the connecting wire in a region where the projection of the connecting wire on the substrate does not overlap with the projection of the overlapping wiring on the substrate, the connecting wire is also including a fourth semi-circular portion, the third straight line portion connects the second semi-circular portion and the fourth semi-circular portion, at least part of the fourth semi-circular portion and the second semi-circular portion Ring portions are located on both sides of the third straight line portion.
  • the fourth semicircular part and the second semicircular part are located on both sides of the third straight line part, and the fourth semicircular part and the The second semi-circular parts are arranged alternately along the direction of the third straight line part.
  • the connecting wire in a region where the projection of the connecting wire on the substrate does not overlap with the projection of the overlapping wiring on the substrate, the connecting wire is also A second circular ring portion is included, and the third straight line portion connects the second circular ring portion and the second semi-circular ring portion.
  • the touch metal in the display device, includes a first circular portion, a first straight portion connecting the first circular portion, and a second straight portion, and the overlapping wires It includes a first semi-circular part, the second straight line part connects the first semi-circular part and the first circular part, and in the area where the connecting wire overlaps with the overlapping wiring, the
  • the connecting lead comprises an open circular ring part and a fourth straight part connecting the open circular ring part, and the connection point between the fourth straight line part and the end point of the open circular ring part is connected with the first half circular ring part. midpoint connection.
  • Embodiments of the present application provide a display panel and a display device;
  • the display panel includes a substrate, a driving circuit layer, a light emitting layer, a packaging layer and a touch layer,
  • the driving circuit layer is disposed on one side of the substrate, and the light emitting layer is disposed on the driving circuit layer away from the substrate,
  • the encapsulation layer is disposed on the side of the light-emitting layer away from the drive circuit layer
  • the touch layer is disposed on the side of the encapsulation layer away from the light-emitting layer, wherein the touch layer includes a touch metal layer, and the connection wire layer and an insulating layer arranged between the touch metal layer and the connecting wire layer,
  • the touch metal layer includes the touch metal and the overlapping wires connected to the touch metal,
  • the connecting wire layer includes connecting wires, and the touch metal surrounds the display panel
  • the sub-pixel is set, the connecting wire passes through the via hole of the insulating layer and is connected to the overlapping wiring, and
  • This application realizes the connection between the connecting wire and the touch metal by passing the connecting wire through the via hole and connecting the overlapping wire, and makes the projection of the connecting wire on the substrate overlap with the projection of the overlapping wire on the substrate
  • the length of the part is shorter than the length of the overlapping wiring, which reduces the length of the overlapping part of the connecting wire and the touch metal layer, thereby reducing the parasitic capacitance, reducing the voltage drop, and alleviating the problem of large voltage drop of the touch layer.

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Abstract

一种显示面板和显示装置；显示面板通过使连接导线（41）穿过过孔与搭接走线（32）连接，实现连接导线（41）和触控金属（31）的连接，且使连接导线（41）在衬底（11）上的投影与搭接走线（32）在衬底（11）上的投影的重叠部分的长度小于搭接走线（32）的长度，降低连接导线（41）与触控金属层（153）的重叠部分的长度，从而减小寄生电容，减小压降，缓解触控层（15）的压降较大的问题。

Description

显示面板和显示装置 技术领域
本申请涉及显示技术领域，尤其是涉及一种显示面板和显示装置。
 背景技术
OLED（Organic Light-Emitting Diode，有机发光二极管）显示器件由于具有广视角、色域宽、亮度高、响应速度快、低功耗、可弯曲等优点被广泛应用。为了避免互电容存在的信号量小、触控电极压降较大、触控灵敏度较差的问题，在OLED显示器件中会采用自电容结构的显示面板。自电容结构的显示面板包括单层设计的触控层和多层设置的触控层，其中，单层设计的触控层指将触控电极和连接走线设置在同层，但由于连接走线会占据触控有效区域的一定面积导致出现触控盲区，因此OLED显示器件会采用多层设置的触控层。但在多层设置的触控层中，由于连接走线与触控电极设置在不同层，连接走线和触控电极围绕像素设置，导致连接走线与触控电极的重叠区域较大，显示面板的寄生电容较大，从而导致触控层的压降较大，影响触控性能。
所以，现有OLED显示器件存在连接走线和触控电极的重叠区域较大，导致触控层的压降较大的技术问题。
 技术问题
本申请实施例提供一种显示面板和显示装置，用以缓解现有OLED显示器件存在连接走线和触控电极的重叠区域较大所导致触控层的压降较大的技术问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请实施例提供一种显示面板，该显示面板包括：
衬底；
驱动电路层，设置于所述衬底一侧；
发光层，设置于所述驱动电路层远离所述衬底的一侧；
封装层，设置于所述发光层远离所述驱动电路层的一侧；
触控层，设置于所述封装层远离所述发光层的一侧；
其中，所述触控层包括触控金属层、连接导线层和设置于所述触控金属层和连接导线层之间的绝缘层，所述触控金属层包括触控金属和连接所述触控金属的搭接走线，所述连接导线层包括连接导线，所述触控金属围绕所述显示面板的子像素设置，所述连接导线穿过所述绝缘层的过孔与所述搭接走线连接，且所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影的重叠部分的长度小于所述搭接走线的长度。
在一些实施例中，在所述连接导线与所述搭接走线连接的区域，所述连接导线包括第一端和第二端，所述连接导线的第一端与所述第二端未相连的一侧在所述衬底上的投影与所述搭接走线在所述衬底上的投影存在重合部分。
在一些实施例中，所述搭接走线包括分别与两个所述触控金属连接的第一端和第二端，所述搭接走线的第一端与所述连接导线的第一端和第二端之间的一点连接，所述搭接走线的第一端和第二端之间的一点与所述连接导线的第一端连接，所述搭接走线的第二端与所述连接导线未连接。
在一些实施例中，所述搭接走线的第一端与所述连接导线的中点连接，所述搭接走线的中点与所述连接导线的第一端连接。
在一些实施例中，所述触控金属包括第一圆环部分以及连接所述第一圆环部分的第一直线部分、第二直线部分，所述搭接走线包括第一半圆环部分，所述第二直线部分连接所述第一半圆环部分和所述第一圆环部分，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影重叠的区域，所述连接导线包括第二半圆环部分和连接所述第二半圆环部分的第三直线部分，所述第三直线部分与所述第二半圆环部分交界点中的一个与所述第一半圆环部分的中点连接。
在一些实施例中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第三半圆环部分，所述第三直线部分连接所述第二半圆环部分和所述第三半圆环部分，所述第三半圆环部分和所述第二半圆环部分位于所述第三直线部分的同一侧。
在一些实施例中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第四半圆环部分，所述第三直线部分连接所述第二半圆环部分和所述第四半圆环部分，至少部分所述第四半圆环部分和所述第二半圆环部分位于所述第三直线部分的两侧。
在一些实施例中，所述第四半圆环部分与所述第二半圆环部分位于所述第三直线部分两侧，且所述第四半圆环部分和所述第二半圆环部分沿所述第三直线部分的方向交替设置。
在一些实施例中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第二圆环部分，所述第三直线部分连接所述第二圆环部分和所述第二半圆环部分。
在一些实施例中，所述触控金属包括第一圆环部分、连接所述第一圆环部分的第一直线部分以及第二直线部分，所述搭接走线包括第一半圆环部分，所述第二直线部分连接所述第一半圆环部分和所述第一圆环部分，在所述连接导线与所述搭接走线重叠的区域，所述连接导线包括形成有开口圆环部分和连接所述开口圆环部分的第四直线部分，所述第四直线部分与所述开口圆环部分的端点的连接点与所述第一半圆环部分的中点连接。
在一些实施例中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第三圆环部分，所述第四直线部分连接所述第三圆环部分。
在一些实施例中，所述触控金属包括第一多边形部分以及连接所述第一多边形部分的第五直线部分、第六直线部分，所述搭接走线包括第一折线部分，所述第六直线部分连接所述第一折线部分与所述第一多边形部分，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影重叠的区域，所述连接导线包括第二折线部分和第七直线部分，所述第二折线部分和所述第七直线部分的交界点与所述第一折线部分的中点连接。
在一些实施例中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第三折线部分，所述第七直线部分连接所述第二折线部分和所述第三折线部分，所述第二折线部分和所述第三折线部分位于所述第七直线部分的同一侧。
在一些实施例中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第四折线部分，所述第七直线部分连接所述第二折线部分和所述第四折线部分，至少部分所述第四折线部分与所述第二折线部分位于所述第七直线部分的两侧。
在一些实施例中，所述第四折线部分与所述第二折线部分位于所述第七直线部分两侧，且所述第四折线部分与所述第二折线部分沿所述第七直线部分的方向交替设置。
在一些实施例中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第二多边形部分，所述第七直线部分连接所述第二折线部分和所述第二多边形部分。
在一些实施例中，所述搭接走线包括分别与两个所述触控金属连接的第一端和第二端，所述连接导线的第一端与所述搭接走线的第一端和第二端之间的第一点连接，所述连接导线的第二端与所述搭接走线的第一端和第二端之间的第二点连接，且所述第一点和第二点不同。
同时，本申请实施例提供一种显示装置，该显示装置包括显示面板和电子元件，所述显示面板包括：
衬底；
驱动电路层，设置于所述衬底一侧；
发光层，设置于所述驱动电路层远离所述衬底的一侧；
封装层，设置于所述发光层远离所述驱动电路层的一侧；
触控层，设置于所述封装层远离所述发光层的一侧；
其中，所述触控层包括触控金属层、连接导线层和设置于所述触控金属层和连接导线层之间的绝缘层，所述触控金属层包括触控金属和连接所述触控金属的搭接走线，所述连接导线层包括连接导线，所述触控金属围绕所述显示面板的子像素设置，所述连接导线穿过所述绝缘层的过孔与所述搭接走线连接，且所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影的重叠部分的长度小于所述搭接走线的长度。
在一些实施例中，在所述连接导线与所述搭接走线连接的区域，所述连接导线包括第一端和第二端，所述连接导线的第一端与所述第二端未相连的一侧在所述衬底上的投影与所述搭接走线在所述衬底上的投影存在重合部分。
在一些实施例中，所述搭接走线包括分别与两个所述触控金属连接的第一端和第二端，所述搭接走线的第一端与所述连接导线的第一端和第二端之间的一点连接，所述搭接走线的第一端和第二端之间的一点与所述连接导线的第一端连接，所述搭接走线的第二端与所述连接导线未连接。
 有益效果
本申请提供一种显示面板和显示装置；该显示面板包括衬底、驱动电路层、发光层、封装层和触控层，驱动电路层设置于衬底一侧，发光层设置于驱动电路层远离衬底的一侧，封装层设置于发光层远离驱动电路层的一侧，触控层设置于封装层远离发光层的一侧，其中，触控层包括触控金属层，连接导线层和设置于触控金属层和连接导线层之间的绝缘层，触控金属层包括触控金属和连接触控金属的搭接走线，连接导线层包括连接导线，触控金属围绕显示面板的子像素设置，连接导线穿过绝缘层的过孔与搭接走线连接，且连接导线在衬底上的投影与搭接走线在衬底上的投影的重叠部分的长度小于搭接走线的长度。本申请通过使连接导线穿过过孔与搭接走线连接，实现连接导线和触控金属的连接，且使连接导线在衬底上的投影与搭接走线在衬底上的投影的重叠部分的长度小于搭接走线的长度，降低连接导线与触控金属层的重叠部分的长度，从而减小寄生电容，减小压降，缓解触控层的压降较大的问题。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为本申请实施例提供的显示面板的第一种示意图。
图2为本申请实施例提供的显示面板的第二种示意图。
图3为本申请实施例提供的触控金属层的第一种示意图。
图4为本申请实施例提供的连接导线层的第一种示意图。
图5为本申请实施例提供的触控层的第一种示意图。
图6为本申请实施例提供的连接导线层的第二种示意图。
图7为本申请实施例提供的连接导线层的第三种示意图。
图8为本申请实施例提供的连接导线层的第四种示意图。
图9为本申请实施例提供的显示面板的第三种示意图。
图10为本申请实施例提供的触控金属层的第二种示意图。
图11为本申请实施例提供的连接导线层的第五种示意图。
图12为本申请实施例提供的触控层的第二种示意图。
图13为本申请实施例提供的连接导线层的第六种示意图。
图14为本申请实施例提供的连接导线层的第七种示意图。
图15为本申请实施例提供的显示装置的示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例针对现有OLED显示器件存在连接走线和触控电极的重叠区域较大，导致触控层的压降较大的技术问题，提供一种显示面板和显示装置，用以缓解上述技术问题。
如图1至图5所示，本申请实施例提供一种显示面板，该显示面板包括：
衬底11；
驱动电路层12，设置于所述衬底11一侧；
发光层13，设置于所述驱动电路层12远离所述衬底11的一侧；
封装层14，设置于所述发光层13远离所述驱动电路层12的一侧；
触控层15，设置于所述封装层14远离所述发光层13的一侧；
其中，所述触控层15包括触控金属层153、连接导线层151和设置于所述触控金属层153和连接导线层151之间的绝缘层152，所述触控金属层153包括触控金属31和连接所述触控金属31的搭接走线32，所述连接导线层151包括连接导线41，所述触控金属31围绕所述显示面板的子像素设置（例如图2中触控金属层153中触控金属围绕绿色子像素213设置），所述连接导线41穿过所述绝缘层152的过孔与所述搭接走线32连接，且所述连接导线41在所述衬底11上的投影与所述搭接走线32在所述衬底11上的投影的重叠部分的长度小于所述搭接走线32的长度。
本申请实施例提供一种显示面板，该显示面板通过使连接导线穿过过孔与搭接走线连接，实现连接导线和触控金属的连接，且使连接导线在衬底上的投影与搭接走线在衬底上的投影的重叠部分的长度小于搭接走线的长度，降低连接导线与触控金属层的重叠部分的长度，从而减小寄生电容，减小压降，缓解触控层的压降较大的问题。
需要说明的是，在本申请实施例中，触控电极层形成的触控金属用于接收触控信号，搭接走线用于连接不同的触控金属，以实现触控金属的压降的均一性，连接导线层形成的连接导线用于传递触控信号，即本申请的技术问题中连接走线和触控电极的重叠区域在本申请实施例中指：连接导线与触控金属和搭接走线的重叠区域。
在一种实施例中，在所述连接导线与所述搭接走线连接的区域，所述连接导线包括第一端和第二端，所述第一端与所述第二端未相连的一侧在所述衬底上的投影与所述搭接走线在所述衬底上的投影存在不重合的部分。
具体的，如图5所示，在所述连接导线41与所述搭接走线32连接的区域，连接导线41的第一端和第二端均指第二半圆环部分411和第三直线部分412的交界点，从图5可以看到：连接导线41的第一端和第二端的未相连的一侧（即位于第三直线部分412的左侧无导线部分）在所述衬底上的投影与所述搭接走线32在所述衬底上的投影存在重合部分。
具体的，对于图8中的连接导线，则连接导线41的第一端和第二端分别为开口圆环部分712的开口的两个端点，其中一端点与第四直线部分713连接，另一端点未与第四直线部分713连接。
本申请实施例通过使得连接导线在与搭接走线连接区域的，将连接导线的两端断开，并使得断开形成的开口（未设置导线区域）与搭接走线在衬底上的投影存在重合部分，从而减小连接导线与搭接走线的重叠面积，缓解触控层压降较大的问题。
在一种实施例中，所述搭接走线包括分别与两个所述触控金属连接的第一端和第二端，所述搭接走线的第一端与所述连接导线的第一端和第二端之间的一点连接，所述搭接走线的第一端和第二端中的一点与所述连接导线的第一端连接，所述搭接走线的第二端与所述连接导线未连接。即通过将搭接走线的第一端与连接导线中非第一端和第二端的一点连接，将搭接走线的第二端不与连接导线连接，从而使得搭接走线和连接导线存在不重叠的部分，减小搭接走线和连接导线的重叠面积，减小触控层的压降。
具体的，如图5所示，所述搭接走线32的第一端（即搭接走线32与第二直线部分313的两个连接点中右侧连接点）与所述连接导线41的中点连接，所述搭接走线32的中点与所述第三直线部分412的第一端连接。
如图3所示，搭接走线32的长度为半圆环的长度，如图4所示，连接导线41的长度为半圆环和直线的长度，如图5所示，搭接走线32与连接导线41部分重叠，所述连接导线41在所述衬底11上的投影与所述搭接走线32在所述衬底11上的投影的重叠部分的长度小于所述搭接走线32的长度（图5中所述连接导线41在所述衬底11上的投影与所述搭接走线32在所述衬底11上的投影的重叠部分的长度为半圆环的长度的二分之一，搭接走线的长度为半圆环的长度）。
如图2所示，以子像素为椭圆或者弧线结构为例，相应的触控金属、搭接走线和连接导线为椭圆和弧线结构中的至少一种，从图2中可以看到，绿色子像素213为椭圆形状、红色子像素212和蓝色子像素211为弧线结构，相应的，如图3、图4所示，触控金属31由椭圆形状和直线组成，搭接走线32为半椭圆形状，连接导线41为弧线和直线组成。
需要说明的是，在图2中，框线20表示截取部分触控层15，开口221表示位于开口221两侧的为两个触控单元。
需要说明的是，在本申请实施例附图中，以椭圆环和/或半椭圆环示出触控金属、搭接走线和连接导线的形状，但触控金属、搭接走线和连接导线还可以为圆环和/半圆环，下述实施例中的圆环部分和半圆环部分并不限定触控金属、搭接走线和连接导线的形状为圆环和半圆环，触控金属、搭接走线和连接导线可以为圆环、半圆环、类圆环、类半圆环、椭圆环、半椭圆环、类椭圆环、类半圆环。
在一种实施例中，如图3至图5所示，所述触控金属31包括第一圆环部分311以及连接所述第一圆环部分311的第一直线部分312、第二直线部分313，所述搭接走线32包括第一半圆环部分，所述第二直线部分313连接所述第一半圆环部分和所述第一圆环部分311，在所述连接导线41在所述衬底11上的投影与所述搭接走线32在所述衬底11上的投影重叠的区域，所述连接导线41包括第二半圆环部分411和连接所述第二半圆环部分411的第三直线部分412，所述第三直线部分412与所述第二半圆环部分411交界点中的一个与所述第一半圆环部分的中点连接。
具体的，如图3所示，触控金属31包括椭圆形状的第一圆环部分、第一直线部分和第二直线部分，相应的搭接走线32包括半椭圆形状的第一半圆环部分，如图4所示，则通过将连接导线设计为包括半椭圆形状/类半椭圆形状的第二半圆环部分411和第三直线部分412，如图5所示，第二半圆环部分沿触控金属的设置方向设置，搭接走线沿触控金属的垂直方向设置，则可以使得搭接走线与连接导线部分重叠，具体重叠部分的长度为第一半圆环部分的长度的二分之一，从而减小了连接导线与触控金属层的重叠部分的长度，减小了压降。且由于所述第三直线部分与所述第二半圆环部分交界点中的一个与所述第一半圆环部分的中点连接，使过孔的面积较大，连接导线与搭接走线的接触较好，避免出现接触不良或者断线。
相较于现有连接导线与搭接走线的重叠部分的长度等于或者大于搭接走线的长度，或者连接导线与搭接走线的重叠部分的长度等于连接导线的长度，本申请实施例通过使连接导线与搭接走线部分的重叠部分的长度小于搭接走线的长度，减小了触控层的压降。
上述实施例以第三直线部分与所述第二半圆环部分交界点中的一个与所述第一半圆环部分的中点连接为例进行说明，即所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影的重叠部分的长度等于所述搭接走线的长度的二分之一，但在本申请实施例中，为了进一步减小连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影的重叠部分的长度，还可以使第三直线部分与所述第二半圆环部分交界点中的一个与所述第一半圆环部分的沿第二半圆环的开口远离中点方向的任一点连接，则此时连接导线的形状和长度可以相应的改变，以避免连接导线和触控金属重叠。
在一种实施例中，如图1、图5所示，在所述连接导线41在所述衬底11上的投影与所述搭接走线32在所述衬底11上的投影不重叠的区域，所述连接导线41还包括第三半圆环部分，所述第三直线部分412连接所述第二半圆环部分411和所述第三半圆环部分，所述第三半圆环部分和所述第二半圆环部分411位于所述第三直线部分412的同一侧。通过将第二半圆环部分和第三半圆环部分设置在同一侧，减小连接导线的占用面积，减小连接导线和触控金属重叠的可能性。
需要说明的是，为了使附图比较清晰，在图4和图5中未标示出第三半圆环部分，可以理解的是，与搭接走线无重叠的半圆环部分为第三半圆环部分，从图4中可以看出，第二半圆环部分和第三半圆环部分设置在第三直线部分的同一侧。
在一种实施例中，所述第二半圆环部分和所述第三半圆环部分的长度相等，所述第二半圆环部分和所述第三半圆环部分的形状相同。
上述实施例中以第二半圆环部分和第三半圆环部分的长度相等和形状相同进行了举例说明，但在本申请实施例中，并不限定连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域的半圆环，与连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影重叠的区域的半圆环的形状和长度，为了避免连接导线和触控金属接触，可以使位于直线左侧和右侧的半圆环的形状和长度不同。相应的，并不限定连接导线的半圆环的长度与搭接走线的长度相同。
如图1、图6所示，在所述连接导线41在所述衬底11上的投影与所述搭接走线32在所述衬底11上的投影不重叠的区域，所述连接导线41还包括第四半圆环部分511，所述第三直线部分412连接所述第二半圆环部分411和所述第四半圆环部分511，至少部分所述第四半圆环部分511和所述第二半圆环部分411位于所述第三直线部分412的两侧。通过将第二半圆环部分和第四半圆环部分设置于第三直线部分的两侧，使第二半圆环与搭接走线连接，而第四半圆环部分不与搭接走线重叠，避免搭接走线与连接导线的重叠长度较大，减小触控层的压降。
在一种实施例中，如图6所示，所述第四半圆环部分511与所述第二半圆环部分411位于所述第三直线部分412两侧，且所述第四半圆环部分511和所述第二半圆环部分411沿所述三直线部分412的方向交替设置。在搭接走线沿触控金属等间距设置时，使连接导线的第二半圆环部分等间距设置，且与搭接走线具有重叠部分，而连接导线与搭接走线不重叠的区域的第四半圆环部分设置在第三直线部分的另一侧，从而减小连接导线与触控金属层的重叠部分的长度，减小寄生电容，减小压降。
上述实施例对第二半圆环部分和第四半圆环部分沿第三直线部分的方向交替设置进行了详细说明。在本申请实施例中，第二半圆环部分和第四半圆环部分还可以不等间距设置，例如部分第四半圆环部分与第二半圆环部分位于第一直线部分同侧，部分第四半圆环部分与第二半圆环部分位于第三直线部分的两侧。
在一种实施例中，如图1、图7所示，在所述连接导线41在所述衬底11上的投影与所述搭接走线32在所述衬底11上的投影不重叠的区域，所述连接导线41还包括第二圆环部分611，所述第三直线部分412连接所述第二圆环部分611和所述第二半圆环部分411。在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，还可以将连接导线设置为圆环、椭圆环、类圆环、类椭圆环形状，从而降低连接导线的阻抗。
在一种实施例中，如图1、图3、图8所示，所述触控金属31包括第一圆环部分311、连接所述第一圆环部分311的第一直线部分312以及第二直线部分313，所述搭接走线32包括第一半圆环部分，所述第二直线部分313连接所述第一半圆环部分和所述第一圆环部分311，在所述连接导线41与所述搭接走线32重叠的区域，所述连接导线41包括形成有开口圆环部分712和连接所述开口圆环部分712的第四直线部分713，所述第四直线部分713与所述开口圆环部分712的端点的连接点与所述第一半圆环部分的中点连接。通过将第四直线部分与开口圆环部分的端点的连接点与第一半圆环部分的中点连接，则连接导线与搭接走线的重叠部分的长度小于搭接走线的长度，从而减小寄生电容，减小触控层的压降。
在一种实施例中，开口圆环部分的长度范围为第一圆环部分的长度的二分之一至四分之三，考虑到搭接走线的长度为圆环的二分之一，则使得开口圆环的长度范围为第一圆环部分的长度的二分之一至四分之三，开口圆环能够竖直连接，且开口圆环部分与搭接走线的重叠部分的长度小于或者等于搭接走线的长度的二分之一，从而减小寄生电容。
在一种实施例中，如图1、图8所示，在所述连接导线41在所述衬底11上的投影与所述搭接走线32在所述衬底11上的投影不重叠的区域，所述连接导线41还包括第三圆环部分711，所述第四直线部分713连接所述第三圆环部分711，通过将连接导线在衬底上的投影与搭接走线在衬底上的投影不重叠的区域设置为圆环、类圆环、椭圆环、类椭圆环形状，降低连接走线的阻抗。
在一种实施例中，如图1、图9、图10、图11、图12所示，所述触控金属31包括第一多边形部分811以及连接所述第一多边形部分811的第五直线部分812、第六直线部分813，所述搭接走线32包括第一折线部分，所述第六直线部分813连接所述第一折线部分与所述第一多边形部分811，在所述连接导线41在所述衬底11上的投影与所述搭接走线32在所述衬底11上的投影重叠的区域，所述连接导线41包括第二折线部分911和第七直线部分912，所述第二折线部分911和所述第七直线部分912的交界点与所述第一折线部分的中点连接。通过将第二折线部分和第七直线部分的交界点与第一折线部分的中点连接，则连接导线与搭接走线的重叠部分的长度为搭接走线的二分之一，减小了连接走线与触控金属层的重叠部分的长度，减小了寄生电容，减小压降。
需要说明的是，由于图10中的搭接走线为三段直线形成的折线，图11中的连接走线与图10中的搭接走线在衬底上的投影的重叠部分的长度小于搭接走线的长度的二分之一。
在本申请实施例中，考虑到多边形的边直接连接时会导致连接处为直线，走线容易断裂，因此在本申请实施例中多边形的边均通过直线连接而不是直接连接，但本申请实施例不限于此，多边形的边可以为直接连接形成四边形，例如多边形为菱形。
在一种实施例中，如图1、图11所示，在所述连接导线41在所述衬底11上的投影与所述搭接走线32在所述衬底11上的投影不重叠的区域，所述连接导线41还包括第三折线部分，所述第七直线部分912连接所述第二折线部分911和所述第三折线部分，所述第二折线部分911和所述第三折线部分位于所述第七直线部分912的同一侧。通过将第二折线部分和第三折线部分设置在第七直线部分的同一侧，减小连接导线的占用面积，减小连接导线和触控金属重叠的可能性。
在一种实施例中，如图1、图13所示，在所述连接导线41在所述衬底11上的投影与所述搭接走线32在所述衬底11上的投影不重叠的区域，所述连接导线41还包括第四折线部分913，所述第七直线部分912连接所述第二折线部分911和所述第四折线部分913，至少部分所述第四折线部分913与所述第二折线部分911位于所述第七直线部分912的两侧。通过将第四折线部分和第二折线部分设置与第七直线部分的两侧，使第二折线部分与搭接走线连接，而第四折线部分不与搭接走线重叠，避免搭接走线与连接导线的重叠长度较大，减小触控层的压降。
在一种实施例中，如图13所示，所述第四折线部分913与所述第二折线部分911位于所述第七直线部分912两侧，且所述第四折线部分913与所述第二折线部分911沿所述第七直线部分912的方向交替设置。在搭接走线沿触控金属等间距设置时，使连接导线的第二折线部分等间距设置，且与搭接走线具有重叠部分，而连接导线与搭接走线不重叠的区域的第四折线部分设置在第七直线部分的另一侧，从而减小连接导线与触控金属层的重叠部分的长度，减小寄生电容，减小压降。
上述实施例对第二折线部分和第四折线部分沿第三直线部分的方向交替设置进行了详细说明。在本申请实施例中，第二折线部分和第四折线部分还可以不等间距设置，例如部分第四折线部分与第二折线部分位于第一直线部分同侧，部分第四折线部分与第二折线部分位于第三直线部分的两侧。
在一种实施例中，如图1、图14所示，在所述连接导线41在所述衬底11上的投影与所述搭接走线32在所述衬底11上的投影不重叠的区域，所述连接导线41还包括第二多边形部分914，所述第七直线部分912连接所述第二折线部分911和所述第二多边形部分914。通过将连接导线与搭接走线不重叠的部分设置为多边形，降低连接导线的阻抗。
上述实施例中，在连接导线和搭接走线重叠的部分，以连接导线的折线部分的长度为多边形的长度的二分之一为例进行了说明，但本申请实施例中，并不限定连接导线的折线部分的长度，该折线部分的长度范围可以为小于多边形的长度的四分之三。以该折线部分能够与搭接走线通过过孔连接的长度为较小长度。
在一种实施例中，所述搭接走线包括分别与两个所述触控金属连接的第一端和第二端，所述连接导线的第一端与所述搭接走线的第一端和第二端之间的第一点连接，所述连接导线的第二端与所述搭接走线的第一端和第二端之间的第二点连接，且所述第一点和第二点不同；即通过连接导线的两个端点与搭接走线中的两点连接，且使得第一点和第二点不同，从而可以减小连接导线和搭接走线的重叠面积，从而降低压降。在一种实施例中，如图1所示，所述衬底11包括保护层111、聚酰亚胺层112、阻挡层113和缓冲层114。
在一种实施例中，如图1所示，所述驱动电路层12包括有源层121、栅极绝缘层122、栅极层123、层间绝缘层124、源漏极层125和平坦化层126。
在一种实施例中，如图1所示，所述发光层13包括像素电极层131、像素定义层132、发光材料层133和公共电极层134。
在一种实施例中，封装层包括第一无机层、有机层和第二无机层。
在一种实施例中，如图1所示，所述显示面板还包括钝化层16、偏光层17、粘合层18和盖板19。
同时，如图2至图5、图15所示，本申请实施例提供一种显示装置，该显示装置显示面板和电子元件90，所述显示面板包括：
衬底11；
驱动电路层12，设置于所述衬底11一侧；
发光层13，设置于所述驱动电路层12远离所述衬底11的一侧；
封装层14，设置于所述发光层13远离所述驱动电路层12的一侧；
触控层15，设置于所述封装层14远离所述发光层13的一侧；
其中，所述触控层15包括触控金属层153、连接导线层151和设置于所述触控金属层153和连接导线层151之间的绝缘层152，所述触控金属层153包括触控金属31和连接所述触控金属31的搭接走线32，所述连接导线层151包括连接导线41，所述触控金属31围绕所述显示面板的子像素设置（例如图2中触控金属层153中触控金属围绕绿色子像素213设置），所述连接导线41穿过所述绝缘层152的过孔与所述搭接走线32连接，且所述连接导线41在所述衬底11上的投影与所述搭接走线32在所述衬底11上的投影的重叠部分的长度小于所述搭接走线32的长度。
本申请实施例提供一种显示装置，该显示装置包括显示面板和电子元件，该显示面板通过使连接导线穿过过孔与搭接走线连接，实现连接导线和触控金属的连接，且使连接导线在衬底上的投影与搭接走线在衬底上的投影的重叠部分的长度小于搭接走线的长度，降低连接导线与触控金属层的重叠部分的长度，从而减小寄生电容，减小压降，缓解触控层的压降较大的问题。
在一种实施例中，所述电子元件包括屏下摄像头，相应的显示面板可以形成过孔以进行采光。
在一种实施例中，在显示装置中，所述触控金属包括第一圆环部分以及连接所述第一圆环部分的第一直线部分、第二直线部分，所述搭接走线包括第一半圆环部分，所述第二直线部分连接所述第一半圆环部分和所述第一圆环部分，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影重叠的区域，所述连接导线包括第二半圆环部分和连接所述第二半圆环部分的第三直线部分，所述第三直线部分与所述第二半圆环部分交界点中的一个与所述第一半圆环部分的中点连接。
在一种实施例中，在显示装置中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第三半圆环部分，所述第三直线部分连接所述第二半圆环部分和所述第三半圆环部分，所述第三半圆环部分和所述第二半圆环部分位于所述第三直线部分的同一侧。
在一种实施例中，在显示装置中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第四半圆环部分，所述第三直线部分连接所述第二半圆环部分和所述第四半圆环部分，至少部分所述第四半圆环部分和所述第二半圆环部分位于所述第三直线部分的两侧。
在一种实施例中，在显示装置中，所述第四半圆环部分与所述第二半圆环部分位于所述第三直线部分两侧，且所述第四半圆环部分和所述第二半圆环部分沿所述第三直线部分的方向交替设置。
在一种实施例中，在显示装置中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第二圆环部分，所述第三直线部分连接所述第二圆环部分和所述第二半圆环部分。
在一种实施例中，在显示装置中，所述触控金属包括第一圆环部分、连接所述第一圆环部分的第一直线部分以及第二直线部分，所述搭接走线包括第一半圆环部分，所述第二直线部分连接所述第一半圆环部分和所述第一圆环部分，在所述连接导线与所述搭接走线重叠的区域，所述连接导线包括形成有开口圆环部分和连接所述开口圆环部分的第四直线部分，所述第四直线部分与所述开口圆环部分的端点的连接点与所述第一半圆环部分的中点连接。
根据以上实施例可知：
本申请实施例提供一种显示面板和显示装置；该显示面板包括衬底、驱动电路层、发光层、封装层和触控层，驱动电路层设置于衬底一侧，发光层设置于驱动电路层远离衬底的一侧，封装层设置于发光层远离驱动电路层的一侧，触控层设置于封装层远离发光层的一侧，其中，触控层包括触控金属层，连接导线层和设置于触控金属层和连接导线层之间的绝缘层，触控金属层包括触控金属和连接触控金属的搭接走线，连接导线层包括连接导线，触控金属围绕显示面板的子像素设置，连接导线穿过绝缘层的过孔与搭接走线连接，且连接导线在衬底上的投影与搭接走线在衬底上的投影的重叠部分的长度小于搭接走线的长度。本申请通过使连接导线穿过过孔与搭接走线连接，实现连接导线和触控金属的连接，且使连接导线在衬底上的投影与搭接走线在衬底上的投影的重叠部分的长度小于搭接走线的长度，降低连接导线与触控金属层的重叠部分的长度，从而减小寄生电容，减小压降，缓解触控层的压降较大的问题。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种显示面板和显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (20)

  1. 一种显示面板，其包括：
    衬底；
    驱动电路层，设置于所述衬底一侧；
    发光层，设置于所述驱动电路层远离所述衬底的一侧；
    封装层，设置于所述发光层远离所述驱动电路层的一侧；
    触控层，设置于所述封装层远离所述发光层的一侧；
    其中，所述触控层包括触控金属层、连接导线层和设置于所述触控金属层和连接导线层之间的绝缘层，所述触控金属层包括触控金属和连接所述触控金属的搭接走线，所述连接导线层包括连接导线，所述触控金属围绕所述显示面板的子像素设置，所述连接导线穿过所述绝缘层的过孔与所述搭接走线连接，且所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影的重叠部分的长度小于所述搭接走线的长度。
  2. 如权利要求1所述的显示面板，其中，在所述连接导线与所述搭接走线连接的区域，所述连接导线包括第一端和第二端，所述连接导线的第一端与所述第二端未相连的一侧在所述衬底上的投影与所述搭接走线在所述衬底上的投影存在重合部分。
  3. 如权利要求2所述的显示面板，其中，所述搭接走线包括分别与两个所述触控金属连接的第一端和第二端，所述搭接走线的第一端与所述连接导线的第一端和第二端之间的一点连接，所述搭接走线的第一端和第二端之间的一点与所述连接导线的第一端连接，所述搭接走线的第二端与所述连接导线未连接。
  4. 如权利要求3所述的显示面板，其中，所述搭接走线的第一端与所述连接导线的中点连接，所述搭接走线的中点与所述连接导线的第一端连接。
  5. 如权利要求4所述的显示面板，其中，所述触控金属包括第一圆环部分以及连接所述第一圆环部分的第一直线部分、第二直线部分，所述搭接走线包括第一半圆环部分，所述第二直线部分连接所述第一半圆环部分和所述第一圆环部分，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影重叠的区域，所述连接导线包括第二半圆环部分和连接所述第二半圆环部分的第三直线部分，所述第三直线部分与所述第二半圆环部分交界点中的一个与所述第一半圆环部分的中点连接。
  6. 如权利要求5所述的显示面板，其中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第三半圆环部分，所述第三直线部分连接所述第二半圆环部分和所述第三半圆环部分，所述第三半圆环部分和所述第二半圆环部分位于所述第三直线部分的同一侧。
  7. 如权利要求5所述的显示面板，其中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第四半圆环部分，所述第三直线部分连接所述第二半圆环部分和所述第四半圆环部分，至少部分所述第四半圆环部分和所述第二半圆环部分位于所述第三直线部分的两侧。
  8. 如权利要求7所述的显示面板，其中，所述第四半圆环部分与所述第二半圆环部分位于所述第三直线部分两侧，且所述第四半圆环部分和所述第二半圆环部分沿所述第三直线部分的方向交替设置。
  9. 如权利要求5所述的显示面板，其中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第二圆环部分，所述第三直线部分连接所述第二圆环部分和所述第二半圆环部分。
  10. 如权利要求4所述的显示面板，其中，所述触控金属包括第一圆环部分、连接所述第一圆环部分的第一直线部分以及第二直线部分，所述搭接走线包括第一半圆环部分，所述第二直线部分连接所述第一半圆环部分和所述第一圆环部分，在所述连接导线与所述搭接走线重叠的区域，所述连接导线包括形成有开口圆环部分和连接所述开口圆环部分的第四直线部分，所述第四直线部分与所述开口圆环部分的端点的连接点与所述第一半圆环部分的中点连接。
  11. 如权利要求10所述的显示面板，其中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第三圆环部分，所述第四直线部分连接所述第三圆环部分。
  12. 如权利要求4所述的显示面板，其中，所述触控金属包括第一多边形部分以及连接所述第一多边形部分的第五直线部分、第六直线部分，所述搭接走线包括第一折线部分，所述第六直线部分连接所述第一折线部分与所述第一多边形部分，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影重叠的区域，所述连接导线包括第二折线部分和第七直线部分，所述第二折线部分和所述第七直线部分的交界点与所述第一折线部分的中点连接。
  13. 如权利要求12所述的显示面板，其中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第三折线部分，所述第七直线部分连接所述第二折线部分和所述第三折线部分，所述第二折线部分和所述第三折线部分位于所述第七直线部分的同一侧。
  14. 如权利要求13所述的显示面板，其中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第四折线部分，所述第七直线部分连接所述第二折线部分和所述第四折线部分，至少部分所述第四折线部分与所述第二折线部分位于所述第七直线部分的两侧。
  15. 如权利要求14所述的显示面板，其中，所述第四折线部分与所述第二折线部分位于所述第七直线部分两侧，且所述第四折线部分与所述第二折线部分沿所述第七直线部分的方向交替设置。
  16. 如权利要求12所述的显示面板，其中，在所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影不重叠的区域，所述连接导线还包括第二多边形部分，所述第七直线部分连接所述第二折线部分和所述第二多边形部分。
  17. 如权利要求2所述的显示面板，其中，所述搭接走线包括分别与两个所述触控金属连接的第一端和第二端，所述连接导线的第一端与所述搭接走线的第一端和第二端之间的第一点连接，所述连接导线的第二端与所述搭接走线的第一端和第二端之间的第二点连接，且所述第一点和第二点不同。
  18. 一种显示装置，其包括显示面板和电子元件，所述显示面板包括：
    衬底；
    驱动电路层，设置于所述衬底一侧；
    发光层，设置于所述驱动电路层远离所述衬底的一侧；
    封装层，设置于所述发光层远离所述驱动电路层的一侧；
    触控层，设置于所述封装层远离所述发光层的一侧；
    其中，所述触控层包括触控金属层、连接导线层和设置于所述触控金属层和连接导线层之间的绝缘层，所述触控金属层包括触控金属和连接所述触控金属的搭接走线，所述连接导线层包括连接导线，所述触控金属围绕所述显示面板的子像素设置，所述连接导线穿过所述绝缘层的过孔与所述搭接走线连接，且所述连接导线在所述衬底上的投影与所述搭接走线在所述衬底上的投影的重叠部分的长度小于所述搭接走线的长度。
  19. 如权利要求18所述的显示装置，其中，在所述连接导线与所述搭接走线连接的区域，所述连接导线包括第一端和第二端，所述连接导线的第一端与所述第二端未相连的一侧在所述衬底上的投影与所述搭接走线在所述衬底上的投影存在重合部分。
  20. 如权利要求19所述的显示装置，其中，所述搭接走线包括分别与两个所述触控金属连接的第一端和第二端，所述搭接走线的第一端与所述连接导线的第一端和第二端之间的一点连接，所述搭接走线的第一端和第二端之间的一点与所述连接导线的第一端连接，所述搭接走线的第二端与所述连接导线未连接。
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