Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
  • C08G63/91—Polymers modified by chemical after-treatment
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
  • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
  • C08G65/32—Polymers modified by chemical after-treatment
  • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
  • C08G65/331—Polymers modified by chemical after-treatment with organic compounds containing oxygen
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L101/00—Compositions of unspecified macromolecular compounds
  • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
  • C08L71/02—Polyalkylene oxides
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
  • C09B67/00—Influencing the physical, e.g. the dyeing or printing properties of dyestuffs without chemical reactions, e.g. by treating with solvents grinding or grinding assistants, coating of pigments or dyes; Process features in the making of dyestuff preparations; Dyestuff preparations of a special physical nature, e.g. tablets, films
  • C09B67/006—Preparation of organic pigments
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
  • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
  • C09C3/06—Treatment with inorganic compounds
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D17/00—Pigment pastes, e.g. for mixing in paints
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
  • C09D171/02—Polyalkylene oxides
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D201/00—Coating compositions based on unspecified macromolecular compounds
  • C09D201/02—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
  • C09D201/06—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
  • C09D201/08—Carboxyl groups
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/20—Filters
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
  • H10F39/10—Integrated devices
  • H10F39/12—Image sensors
  • H10F39/15—Charge-coupled device [CCD] image sensors

Definitions

• the present invention relates to resin compositions, films, optical filters, solid-state imaging devices, and image display devices.
• a film containing pigments such as color filters is used in solid-state imaging devices.
• a film containing a colorant such as a color filter is manufactured using a resin composition containing a pigment, a resin, and a solvent.
• Patent Document 1 discloses a polymer obtained by polymerizing an ethylenically unsaturated monomer in the presence of a compound having two carboxyl groups and one or more thiol groups in the molecule, and two carboxyl groups in one terminal region.
• the dispersibility of the pigment is good. If the dispersibility of the pigment is insufficient, the pigment tends to agglomerate in the resin composition and become coarse, or the viscosity of the resin composition tends to increase. Further, even if the viscosity of the resin composition immediately after production is low, the viscosity may increase over time.
• an object of the present invention is to provide a resin composition having excellent pigment dispersibility. Another object of the present invention is to provide a film, an optical filter, a solid-state imaging device, and an image display device using the resin composition.
• a coloring material A containing a pigment containing a pigment
• a resin B is a resin composition containing a resin B1 containing an acid anhydride group and a polymer chain containing a repeating unit having at least one structure selected from a polyether structure and a polyester structure.
• R 1 represents an acid anhydride group
• X 1 and X 2 each independently represent a single bond, -O-, -CO-, -COO-, -OCO-, -NR x1 -, -CONR x1 -, -NR x1 CO- or -S- and
• R x1 represents a hydrogen atom or a substituent
• L 1 represents a single bond or an m+n-valent linking group
• P 1 represents a polymer chain containing repeating units of at least one structure selected from a polyether structure and a polyester structure
• m and n each independently represent an integer of 1 or more.
• R AH1 , R AH7 , R AH8 , R AH10 and R AH11 each independently represent a hydrogen atom or a substituent
• R AH2 , R AH3 , R AH4 , R AH5 , R AH6 and R AH9 represent substituents
• r2, r3, r4, r6 and r7 each independently represent an integer of 0 to 3
• r5 represents an integer of 0 to 2
• ⁇ 6> The resin composition according to any one of ⁇ 1> to ⁇ 5>, wherein the resin B1 is a resin represented by formula (2);
• X 2 represents a single bond, -O-, -CO-, -COO-, -OCO-, -NR x1 -, -CONR x1 -, -NR x1 CO- or -S-
• R x1 represents a hydrogen
• ⁇ 7> The resin composition according to any one of ⁇ 1> to ⁇ 6>, wherein the resin B1 has a weight average molecular weight of 500 or more and less than 10,000.
• the solvent C contains at least one solvent selected from ether solvents, ester solvents and ketone solvents.
• the coloring material A contains a black pigment, The resin composition according to any one of ⁇ 1> to ⁇ 8>, wherein the content of the black pigment in the total solid content of the resin composition is 65% by mass or more.
• ⁇ 10> The resin composition according to any one of ⁇ 1> to ⁇ 9>, further comprising a polymerizable monomer.
• ⁇ 11> The resin composition according to any one of ⁇ 1> to ⁇ 10>, further comprising a photopolymerization initiator.
• ⁇ 12> A film obtained using the resin composition according to any one of ⁇ 1> to ⁇ 11>.
• ⁇ 13> An optical filter comprising the film according to ⁇ 12>.
• ⁇ 14> A solid-state imaging device having the film according to ⁇ 12>.
• ⁇ 15> An image display device comprising the film according to ⁇ 12>.
• the present invention it is possible to provide a resin composition with excellent pigment dispersibility. Also, a film, an optical filter, a solid-state imaging device, and an image display device using the resin composition can be provided.
• ⁇ is used to include the numerical values before and after it as lower and upper limits.
• a description that does not describe substitution or unsubstituted includes a group (atomic group) having no substituent as well as a group (atomic group) having a substituent.
• an "alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
• Exposure includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams, unless otherwise specified.
• Light used for exposure includes actinic rays or radiation such as emission line spectra of mercury lamps, far ultraviolet rays represented by excimer lasers, extreme ultraviolet rays (EUV light), X-rays, and electron beams.
• the (meth)allyl group represents both or either allyl and methallyl
• “(meth)acrylate” represents both or either acrylate and methacrylate
• “(meth) "Acrylic” represents both or either of acrylic and methacrylic
• “(meth)acryloyl” represents both or either of acryloyl and methacryloyl.
• the weight average molecular weight and number average molecular weight are polystyrene equivalent values measured by GPC (gel permeation chromatography).
• near-infrared light refers to light with a wavelength of 700 to 2500 nm.
• total solid content refers to the total mass of all components of the composition excluding the solvent.
• process does not refer only to an independent process, and even if it cannot be clearly distinguished from other processes, the term can be used as long as the intended action of the process is achieved. included.
• a pigment means a compound that is difficult to dissolve in a solvent.
• symbols e.g., A, etc.
• the symbols before or after the name are terms used to distinguish the components, and the type of component, the number of components, and the configuration It does not limit the superiority or inferiority of elements.
• the resin composition of the present invention is A coloring material A containing a pigment; a resin B; a solvent C,
• the resin B is characterized by containing a resin B1 containing an acid anhydride group and a polymer chain containing a repeating unit of at least one structure selected from a polyether structure and a polyester structure.
• the resin composition of the present invention has excellent pigment dispersibility. Although the detailed reason why such an effect is obtained is unknown, it is presumed to be due to the following. In the resin composition, it is presumed that the acid anhydride group of Resin B1 adsorbs to the surface of the pigment, and the polymer chain of Resin B1 acts as a steric repulsion group. In addition, since the polymer chain is a polymer chain containing repeating units of at least one structure selected from a polyether structure and a polyester structure, the resin B1 is presumed to have excellent affinity with the solvent in the resin composition. be done. For this reason, it is presumed that the resin composition of the present invention could be made into a resin composition having excellent pigment dispersibility by including the resin B1.
• the resin composition of the present invention is preferably used as a resin composition for optical filters.
• the optical filter include a color filter, a near-infrared transmission filter, a near-infrared cut filter, and the like, and a color filter is preferable.
• the resin composition of the present invention can be preferably used as a resin composition for solid-state imaging devices, and more preferably used as a resin composition for pixel formation of optical filters used in solid-state imaging devices.
• color filters include filters having colored pixels that transmit light of a specific wavelength, and at least one colored pixel selected from red pixels, blue pixels, green pixels, yellow pixels, cyan pixels, and magenta pixels.
• the filter has A color filter can be formed using a resin composition containing a chromatic colorant.
• Examples of near-infrared cut filters include filters having a maximum absorption wavelength in the wavelength range of 700 to 1800 nm.
• the maximum absorption wavelength of the near-infrared cut filter preferably exists in the wavelength range of 700 to 1300 nm, more preferably in the wavelength range of 700 to 1100 nm.
• the transmittance of the near-infrared cut filter over the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. Also, the transmittance at at least one point in the wavelength range of 700 to 1800 nm is preferably 20% or less.
• absorbance Amax/absorbance A550 which is the ratio of absorbance Amax at the maximum absorption wavelength of the near-infrared cut filter and absorbance A550 at a wavelength of 550 nm, is preferably 20 to 500, more preferably 50 to 500. , more preferably 70-450, and particularly preferably 100-400.
• a near-infrared cut filter can be formed using a resin composition containing a near-infrared absorbing colorant.
• a near-infrared transmission filter is a filter that transmits at least part of near-infrared rays.
• the near-infrared transmission filter is preferably a filter that blocks at least part of visible light and transmits at least part of near-infrared light.
• the near-infrared transmission filter has a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 640 nm, and has a transmittance in the wavelength range of 1100 to 1300 nm. Filters satisfying spectral characteristics with a minimum value of 70% or more (preferably 75% or more, more preferably 80% or more) are preferred.
• the near-infrared transmission filter is preferably a filter that satisfies any one of the following spectral characteristics (1) to (5).
• the maximum transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 800 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
• the maximum transmittance in the wavelength range of 400 to 750 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 900 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
• the maximum transmittance in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1000 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
• the maximum transmittance in the wavelength range of 400 to 950 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1100 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
• the maximum transmittance in the wavelength range of 400 to 1050 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1200 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
• the transmittance of light in the thickness direction of the film has a wavelength of 360 to 700 nm.
• An aspect that satisfies the spectral characteristics in which the maximum value in the range is 50% or more is exemplified.
• a resin composition satisfying such spectral characteristics can be preferably used as a resin composition for forming pixels of a color filter. Specifically, it can be preferably used as a resin composition for forming colored pixels selected from red pixels, blue pixels, green pixels, yellow pixels, cyan pixels and magenta pixels.
• the resin composition having the above spectral characteristics preferably contains a chromatic coloring material.
• a resin composition containing a red colorant and a yellow colorant can be preferably used as a resin composition for forming red pixels.
• a resin composition containing a blue colorant and a purple colorant can be preferably used as a resin composition for forming a blue pixel.
• a resin composition containing a green colorant can be preferably used as a resin composition for forming green or cyan pixels.
• the resin composition is used as a resin composition for forming green pixels, it is preferable that the resin composition further contains a yellow colorant in addition to the green colorant.
• spectral characteristics of the resin composition of the present invention is that Amin/B, which is the ratio of the minimum absorbance Amin in the wavelength range of 400 to 640 nm and the absorbance B at a wavelength of 1500 nm, is 5 or more.
• An embodiment that satisfies certain spectral characteristics is mentioned.
• a resin composition satisfying such spectral characteristics can be preferably used as a resin composition for forming a near-infrared transmission filter.
• the value of Amin/B, which is the absorbance ratio is preferably 7.5 or more, more preferably 15 or more, and even more preferably 30 or more.
• the absorbance A ⁇ at the wavelength ⁇ is defined by the following formula ( ⁇ 1).
• a ⁇ ⁇ log(T ⁇ /100) ( ⁇ 1)
• a ⁇ is the absorbance at wavelength ⁇
• T ⁇ is the transmittance (%) at wavelength ⁇ .
• the absorbance value may be the value measured in the state of solution or the value of the film formed using the composition.
• the composition is applied onto a glass substrate by a method such as spin coating, and dried using a hot plate or the like at 100° C. for 120 seconds to obtain a film. is preferred.
• the resin composition of the present invention preferably satisfies any one of the following spectral characteristics (Ir1) to (Ir5).
• A4/B4 which is the ratio of the minimum absorbance value A4 in the wavelength range of 400 to 950 nm to the maximum absorbance value B4 in the wavelength range of 1100 to 1500 nm, is 4.5 or more;7. It is preferably 5 or more, more preferably 15 or more, and even more preferably 30 or more.
• A5/B5 which is the ratio of the minimum absorbance value A5 in the wavelength range of 400 to 1050 nm to the maximum absorbance value B5 in the wavelength range of 1200 to 1500 nm, is 4.5 or more;7. It is preferably 5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this aspect, it is possible to form a film that can block light in the wavelength range of 400 to 1050 nm and transmit light in the wavelength range of 1150 nm or more.
• the resin composition of the present invention can also be used as a resin composition for forming a light shielding film.
• the resin composition of the present invention preferably contains a black colorant as a colorant, and more preferably contains a black pigment.
• the content of the black pigment in the total solid content of the resin composition is preferably 65% by mass or more, more preferably 70% by mass or more, and even more preferably 75% by mass or more.
• the film formed using the resin composition has an optical density (OD : Optical Density) is preferably 2.5 or more, more preferably 3.0 or more.
• OD Optical Density
• the upper limit is not particularly limited, generally 10 or less is preferable.
• the optical density per 1.5 ⁇ m film thickness in the wavelength region of 400 to 1100 nm is 2.5 or more, which means that the optical density per 1.5 ⁇ m film thickness is 2.5 or more in the entire wavelength range of 400 to 1100 nm. is 2.5 or more.
• the reflectance of the film is preferably less than 8%, more preferably less than 6%, and even more preferably less than 4%.
• the lower limit is preferably 0% or more.
• the reflectance is determined from the reflectance spectrum obtained by using a spectroscope V7200 (trade name) VAR unit manufactured by JASCO Corporation to irradiate light with a wavelength of 400 to 1100 nm at an incident angle of 5°. Specifically, the reflectance of the light having the maximum reflectance in the wavelength range of 400 to 1100 nm is taken as the reflectance of the film.
• the resin composition of the present invention is also preferably a resin composition for pattern formation by photolithography. According to this aspect, fine-sized pixels can be easily formed. Therefore, it can be particularly preferably used as a resin composition for forming pixels of optical filters used in solid-state imaging devices.
• a component having an ethylenically unsaturated bond-containing group e.g., a resin having an ethylenically unsaturated bond-containing group or a monomer having an ethylenically unsaturated bond-containing group
• a resin composition containing a photopolymerization initiator can be preferably used as a resin composition for pattern formation in photolithography. It is also preferable that the resin composition for pattern formation by photolithography further contains an alkali-soluble resin.
• the resin composition of the present invention contains coloring material A (hereinafter referred to as coloring material).
• coloring material A examples include white colorants, black colorants, chromatic colorants, and near-infrared absorption colorants.
• the white colorant includes not only a pure white colorant but also a light gray colorant close to white (for example, grayish white, light gray, etc.).
• the colorant preferably contains at least one selected from the group consisting of a chromatic colorant, a black colorant, and a near-infrared absorbing colorant, and at least one selected from the group consisting of a chromatic colorant and a black colorant. It is more preferable to contain seeds, and it is still more preferable to contain a black colorant.
• the colorant preferably contains two or more chromatic colorants and a near-infrared absorbing colorant.
• black may be formed by a combination of two or more chromatic colorants.
• the colorant preferably contains a black colorant and a near-infrared absorbing colorant.
• the resin composition of the present invention can be preferably used as a resin composition for forming a near-infrared transmission filter.
• a pigment-containing coloring material is used as the coloring material contained in the coloring composition of the present invention.
• the pigment may be either an inorganic pigment or an organic pigment.
• the crystallite size of the organic pigment is preferably 0.1 to 50 nm, more preferably 0.5 to 30 nm, even more preferably 1 to 15 nm.
• the crystallite size can be obtained from the half width of the diffraction angle peak using an X-ray diffractometer, and is calculated using Scherrer's formula.
• the crystallite size of the organic pigment can be adjusted by known methods such as adjustment of production conditions and pulverization after production. As a pulverization method, any method may be used as long as the crystallite size can be adjusted, and examples include dry pulverization and wet pulverization. Dry milling is preferred because it does not require solvent removal and is less likely to re-agglomerate.
• dry pulverization methods include impact crushing using a hammer crusher and the like, jet crushing using a jet mill and the like, ball mills, rod mills, and the like.
• a known dry grinding device can be used as the dry grinding device, and devices manufactured by Nippon Coke Kogyo Co., Ltd., Kurimoto, Ltd., Ashizawa Fine Tech, and Sugino Machine can be used.
• chromatic coloring materials include coloring materials having a maximum absorption wavelength in the wavelength range of 400 to 700 nm. Examples thereof include yellow colorant, orange colorant, red colorant, green colorant, purple colorant, and blue colorant. From the viewpoint of heat resistance, the chromatic colorant is preferably a pigment (chromatic pigment), more preferably a red pigment, a yellow pigment, and a blue pigment, and still more preferably a red pigment and a blue pigment.
• the average primary particle size of the chromatic pigment is preferably 1 to 200 nm.
• the lower limit is preferably 5 nm or more, more preferably 10 nm or more.
• the upper limit is preferably 180 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less.
• the average primary particle size of the chromatic pigment is within the above range, the chromatic pigment has good dispersion stability in the resin composition.
• the average primary particle size of the pigment is a number-average particle size calculated by arithmetically averaging the number-based particle sizes measured by the dynamic light scattering method according to JIS8826:2005. .
• Examples of the measuring device include a dynamic light scattering particle size distribution measuring device (LB-500, manufactured by Horiba, Ltd.).
• chromatic pigments include the following.
• C.I. I. Pigment Red 254, C.I. I. Pigment Red 264, C.I. I. Pigment Red 272, C.I. I. Pigment Red 122, C.I. I. Pigment Red 177 is preferred.
• As a blue pigment C.I. I. Pigment Blue 15:3, C.I. I. Pigment Blue 15:4, C.I. I. Pigment Blue 15:6, C.I. I. Pigment Blue 16 is preferred.
• a halogenated zinc phthalocyanine pigment having an average number of halogen atoms of 10 to 14, an average number of bromine atoms of 8 to 12, and an average number of chlorine atoms of 2 to 5 per molecule.
• Specific examples include compounds described in International Publication No. 2015/118720.
• a phthalocyanine compound, a phthalocyanine compound described in JP-A-2018-180023, a compound described in JP-A-2019-038958, and the like can also be used.
• An aluminum phthalocyanine compound having a phosphorus atom can also be used as a blue pigment.
• Specific examples include compounds described in paragraph numbers 0022 to 0030 of JP-A-2012-247591 and paragraph number 0047 of JP-A-2011-157478.
• X 1 to X 16 each independently represent a hydrogen atom or a halogen atom
• Z 1 represents an alkylene group having 1 to 3 carbon atoms.
• Specific examples of the compound represented by formula (QP1) include compounds described in paragraph 0016 of Japanese Patent No. 6443711.
• Y 1 to Y 3 each independently represent a halogen atom.
• n and m are integers from 0 to 6; p is an integer from 0 to 5; (n+m) is 1 or more.
• Specific examples of the compound represented by formula (QP2) include compounds described in paragraphs 0047 to 0048 of Japanese Patent No. 6432077.
• diketopyrrolopyrrole compounds in which at least one bromine atom is substituted in the structure described in JP-A-2017-201384, diketopyrrolopyrrole compounds described in paragraphs 0016 to 0022 of Japanese Patent No. 6248838, Diketopyrrolopyrrole compounds described in WO 2012/102399, diketopyrrolopyrrole compounds described in WO 2012/117965, naphthol azo compounds described in JP 2012-229344, Patent No. 6516119 and the compounds described in Japanese Patent No. 6525101 can also be used.
• red pigment a compound having a structure in which an aromatic hydrocarbon group in which a group having an oxygen atom, a sulfur atom or a nitrogen atom is bonded to an aromatic hydrocarbon ring is bonded to a diketopyrrolopyrrole skeleton.
• DPP1 compound represented by formula (DPP1)
• DPP2 a compound represented by formula (DPP2)
• R 11 and R 13 each independently represent a substituent
• R 12 and R 14 each independently represent a hydrogen atom, an alkyl group, an aryl group or a heteroaryl group
• n11 and n13 each independently represents an integer of 0 to 4
• X 12 and X 14 each independently represents an oxygen atom, a sulfur atom or a nitrogen atom
• m12 represents 1
• X m12 represents 2 when 12 is a nitrogen atom
• m14 represents 1 when X14 is an oxygen atom or a sulfur atom
• m14 represents 2 when X14 is a nitrogen atom.
• Substituents represented by R 11 and R 13 include an alkyl group, an aryl group, a halogen atom, an acyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, a heteroaryloxycarbonyl group, an amide group, a cyano group, a nitro group, and trifluoro.
• Preferred specific examples include a methyl group, a sulfoxide group, and a sulfo group.
• pyrazole azo compounds As chromatic dyes, pyrazole azo compounds, anilinoazo compounds, triarylmethane compounds, anthraquinone compounds, anthrapyridone compounds, benzylidene compounds, oxonol compounds, pyrazolotriazole azo compounds, pyridone azo compounds, cyanine compounds, phenothiazine compounds, pyrrolopyrazole azomethine compounds , xanthene compounds, phthalocyanine compounds, benzopyran compounds, indigo compounds, and pyrromethene compounds.
• 10-2020-0069730 Compound represented by 1, Compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069070, Compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069067 , the compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069062, the halogenated zinc phthalocyanine pigment described in Patent No. 6809649, and the isoindoline compound described in JP-A-2020-180176.
• the chromatic colorant may be a rotaxane
• the dye skeleton may be used in the cyclic structure of the rotaxane, may be used in the rod-like structure, or may be used in both structures. .
• Two or more chromatic colorants may be used in combination.
• the combination of two or more chromatic colorants may form black. Examples of such combinations include the following aspects (1) to (7).
• the resin composition of the present invention forms a near-infrared transmission filter. It can be preferably used as a resin composition for (1) A mode containing a red colorant and a blue colorant. (2) A mode containing a red colorant, a blue colorant, and a yellow colorant. (3) A mode containing a red colorant, a blue colorant, a yellow colorant, and a purple colorant.
• a mode containing a red colorant, a blue colorant, a yellow colorant, a purple colorant, and a green colorant (5) A mode containing a red colorant, a blue colorant, a yellow colorant, and a green colorant. (6) A mode containing a red colorant, a blue colorant, and a green colorant. (7) A mode containing a yellow colorant and a purple colorant.
• White colorants include titanium oxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silica, talc, mica, aluminum hydroxide, calcium silicate, aluminum silicate, Examples include hollow resin particles and inorganic pigments (white pigments) such as zinc sulfide.
• the white pigment is preferably particles containing titanium atoms, more preferably titanium oxide.
• the white pigment is preferably particles having a refractive index of 2.10 or more for light with a wavelength of 589 nm. The aforementioned refractive index is preferably 2.10 to 3.00, more preferably 2.50 to 2.75.
• the white pigment can also use the titanium oxide described in "Titanium Oxide Physical Properties and Application Techniques Manabu Seino, Pages 13-45, June 25, 1991, published by Gihodo Publishing".
• the white pigment is not only made of a single inorganic substance, but also particles combined with other materials may be used.
• particles having voids or other materials inside, particles in which a large number of inorganic particles are attached to a core particle, and core-shell composite particles consisting of a core particle made of polymer particles and a shell layer made of inorganic nanoparticles are used. is preferred.
• the core and shell composite particles composed of the core particles composed of the polymer particles and the shell layer composed of the inorganic nanoparticles for example, the description of paragraphs 0012 to 0042 of JP-A-2015-047520 can be referred to, The contents of which are incorporated herein.
• Hollow inorganic particles can also be used as the white pigment.
• a hollow inorganic particle is an inorganic particle having a structure having a cavity inside, and refers to an inorganic particle having a cavity surrounded by an outer shell.
• Examples of hollow inorganic particles include hollow inorganic particles described in JP 2011-075786, WO 2013/061621, JP 2015-164881, etc., the contents of which are incorporated herein. be
• the black colorant is not particularly limited, and known ones can be used.
• the black colorant means a colorant that exhibits absorption over the entire wavelength range of 400 to 700 nm.
• the black colorant is preferably a black pigment.
• the black pigment is preferably a black pigment that meets the evaluation criteria Z described below.
• the light-shielding property of the cured film after drying is evaluated using a spectrophotometer (UV-3600 manufactured by Hitachi, Ltd., etc.). If the maximum transmittance of the dried cured film at a wavelength of 400 to 700 nm is less than 10%, it can be determined that the black pigment satisfies the evaluation criteria Z. Regarding the black pigment, the maximum transmittance of the dried cured film at a wavelength of 400 to 700 nm is more preferably less than 8%, more preferably less than 5%, according to evaluation criteria Z.
• the average primary particle size of the black pigment is preferably 250 nm or less, more preferably 200 nm or less, and even more preferably 150 nm or less.
• the average primary particle size is preferably 1 nm or more, more preferably 5 nm or more, and even more preferably 20 nm or more, from the viewpoint of better handling.
• the black pigment may be an inorganic pigment (inorganic black pigment) or an organic pigment (organic black pigment).
• the black pigment is preferably an inorganic black pigment because the resulting film has better light resistance.
• black pigments tend to have lower dispersibility in resin compositions than other pigments.
• inorganic black pigments tend to have low dispersibility in resin compositions.
• the resin composition of the present invention even if it contains a black pigment, it can be a resin composition having excellent dispersibility of the pigment. , the effect of the present invention is exhibited remarkably.
• the inorganic black pigment is not particularly limited as long as it is a particle that has light shielding properties and contains an inorganic compound, but known inorganic pigments can be used.
• inorganic black pigments include Group 4 metal elements such as titanium (Ti) and zirconium (Zr), Group 5 metal elements such as vanadium (V) and niobium (Nb), yttrium (Y), aluminum (Al ), cobalt (Co), chromium (Cr), copper (Cu), manganese (Mn), ruthenium (Ru), iron (Fe), nickel (Ni), tin (Sn), and silver (Ag) Metal oxides, metal nitrides and metal oxynitrides containing one or more metal elements selected from the group are mentioned.
• Group 4 metal elements such as titanium (Ti) and zirconium (Zr)
• Group 5 metal elements such as vanadium (V) and niobium (Nb), yttrium (Y), aluminum (Al ), cobalt (Co), chromium (Cr), copper (Cu), manganese (Mn), ruthenium (Ru), iron (Fe), nickel (Ni), t
• the inorganic black pigment may contain two or more metal atoms.
• metal oxides metal nitrides and metal oxynitrides, particles in which other metal atoms are mixed may be used.
• metal nitride-containing particles further containing atoms (preferably oxygen atoms and/or sulfur atoms) selected from elements of Groups 13 to 17 of the periodic table can be used.
• the metal oxide, metal nitride and metal oxynitride may be coated with an inorganic substance and/or an organic substance.
• the inorganic substance include metal atoms contained in the inorganic black pigment.
• the organic substance include organic substances having a hydrophobic group, and silane compounds are preferred.
• the method for producing the above metal nitride, metal oxide or metal oxynitride is not particularly limited as long as a black pigment having desired physical properties can be obtained. You can use the method.
• the vapor phase reaction method includes an electric furnace method, a thermal plasma method, and the like, but the thermal plasma method is preferable from the viewpoints of less impurity contamination, easier particle diameter uniformity, and higher productivity.
• the metal nitride, metal oxide or metal oxynitride described above may be subjected to a surface modification treatment.
• the surface may be modified with a surface treatment agent having both a silicone group and an alkyl group. Examples of such inorganic particles include the "KTP-09" series (manufactured by Shin-Etsu Chemical Co., Ltd.).
• Inorganic black pigments also include, for example, zirconium nitride containing yttrium.
• the particle size (average primary particle size) of the yttrium-containing zirconium nitride is preferably 10 to 100 nm from the viewpoint of suppressing a decrease in light shielding properties at a wavelength of 550 nm (visible light).
• the average primary particle size of the yttrium-containing zirconium nitride powder can be measured by converting the measured specific surface area into spheres. Note that yttrium is contained in a solid solution state in the zirconium nitride powder.
• X1 is the light transmittance at a wavelength of 550 nm and X2 is the light transmittance at a wavelength of 365 nm. 5% or less is preferable, and 6.5% or less is more preferable.
• X2 is preferably 25% or more, more preferably 26% or more.
• the ratio of X2 to X1 (X2/X1) is preferably 3.5 or more, more preferably 4.0 or more.
• the content of yttrium is preferably 1.0 to 12.0% by mass, relative to the total mass of zirconium nitride and yttrium, from the viewpoint of suppressing a decrease in light shielding properties at a wavelength of 550 nm (visible light), and 2.0 to 2.0%. 11.0% by mass is more preferred.
• the above content can be measured by ICP (high frequency inductively coupled plasma) emission spectrometry.
• Yttrium-containing zirconium nitride and its production method include, for example, those described in JP-A-2020-180036, the contents of which are incorporated herein.
• Inorganic black pigments also include, for example, zirconium nitride containing aluminum.
• Alumina-coated zirconium nitride is preferable as the aluminum-containing zirconium nitride.
• Moisture resistance is improved by coating zirconium nitride with alumina.
• the zirconium nitride coated with alumina preferably has a volume resistivity of 1 ⁇ 10 6 ⁇ cm or more, more preferably 1 ⁇ 10 7 ⁇ cm or more. The volume resistivity of zirconium nitride coated with alumina is determined as follows.
• Alumina-coated zirconium nitride is placed in a pressure vessel and compressed at 5 to 10 MPa to form a compact, and the resistance value of the compact is measured with a digital multimeter. Then, the obtained resistance value is multiplied by a resistivity correction factor (RCF) that is referred to based on the thickness of the green compact, the shape of the apparatus, and the thickness of the green compact, to obtain the volume resistivity of the powder ( ⁇ cm) is obtained.
• RCF resistivity correction factor
• the coating amount of alumina is preferably 1.5 to 9% by mass, more preferably 3 to 7% by mass with respect to 100% by mass of zirconium nitride.
• the isoelectric point of zirconium nitride coated with alumina is preferably 5.7 or higher, more preferably 5.8 or higher.
• the “isoelectric point of alumina-coated zirconium nitride” means that when the pH of a dispersion liquid in which alumina-coated zirconium nitride is dispersed, the charge per particle becomes zero as a whole, and the dispersion It means the pH at which the powder does not move even if a voltage is applied to the liquid.
• an inorganic nitride powder such as a zirconium nitride powder, exhibits a large change in zeta potential when the pH changes, and at a certain pH, the surface potential (zeta potential) becomes zero and the isoelectric potential does not exhibit any electrophoresis. have a point.
• zeta potential is an electric double layer, which is an electric double structure formed by attracting ions with opposite polar charges around powder with a certain polar charge in a dispersion liquid. , means the potential of the sliding surface at which liquid flow begins to occur. This zeta potential is measured as follows using, for example, a zeta potential meter (model: DT1202) manufactured by Dispersion Technology.
• the device is measured using the colloidal oscillating current method.
• the above dispersion is placed in a container and sandwiched between a pair of electrodes, and a predetermined voltage is applied to these electrodes to move the powder in the dispersion.
• a predetermined voltage is applied to these electrodes to move the powder in the dispersion.
• the charged particles and their surrounding counter ions are polarized, generating an electric field called the colloidal oscillation potential, which can be detected as a current.
• This current becomes a colloidal oscillation current.
• the zeta potential is determined from the measured colloidal oscillatory currents using Smoluchowski's equation and coupling theory.
• the pH at which the zeta potential becomes zero is the isoelectric point of the powder.
• the L * value of zirconium nitride coated with alumina is preferably 13 or less.
• the “L * value of zirconium nitride coated with alumina” is the lightness index in the CIE1976 L * a * b * color space (measurement light source C: color temperature 6774K).
• the CIE1976L * a * b * color space was converted from the CIEXYZ color system in 1976 by the Commission Internationale de l'Eclairage (CIE). It is a color space defined so that a constant distance in the color system has a perceptually uniform difference in any color area.
• L * value, a * value, and b * value are quantities determined by an orthogonal coordinate system in the CIE1976L * a * b * color space, and are expressed by equations (1) to (3).
• L * 116(Y/Y0) 1/ 3-16 ( 1 )
• a * 500 [(X/X 0 ) 1/3 - (Y/Y 0 ) 1/3 ]
• b * 200 [(Y/Y 0 ) 1/3 - (Z/Z 0 ) 1/3 ] (3)
• X/X 0 , Y/Y 0 , Z/Z 0 >0.008856
• X, Y, and Z are the tristimulus values of the object color.
• the lightness index L * value of zirconium nitride coated with alumina is determined using, for example, a spectral color difference meter (model: SE7700) manufactured by Nippon Denshoku Industries Co., Ltd. When the L * value is 13 or less, the blackness is sufficient and a predetermined color tone can be obtained as a black pigment.
• the BET specific surface area of zirconium nitride coated with alumina is preferably 20 m 2 /g or more.
• the upper limit is preferably 1000 m 2 /g or less.
• the BET specific surface area is measured by using, for example, a specific surface area measuring device (model: SA1100) manufactured by Shibata Kagaku Co., Ltd., on the surface of the powder (black pigment), a gas molecule (for example, nitrogen gas, etc.) whose adsorption area is known. is adsorbed and calculated from the adsorption amount.
• the BET equation when adsorption is in equilibrium at a constant temperature, adsorption
• the amount of gas molecules in only one layer is measured, making it possible to measure the exact specific surface area.
• the BET specific surface area is 20 m 2 /g or more, a decrease in coloring power (color development power) can be suppressed.
• Alumina-coated zirconium nitride and its manufacturing method include, for example, those described in JP-A-2020-158377, the contents of which are incorporated herein.
• nitrides or oxynitrides of one or more metals selected from the group consisting of titanium, vanadium, zirconium, niobium, and iron are more preferable because they can suppress the occurrence of undercuts when forming a light-shielding film.
• zirconium nitrides or oxynitrides or titanium nitrides or oxynitrides are more preferred.
• Titanium black is black particles containing titanium oxynitride. Titanium black can be surface-modified as necessary for the purpose of improving dispersibility, suppressing cohesion, and the like. Titanium black can be coated with silicon oxide, titanium oxide, germanium oxide, aluminum oxide, magnesium oxide or zirconium oxide. processing is also possible.
• Titanium black can be produced by heating a mixture of titanium dioxide and metallic titanium in a reducing atmosphere (JP-A-49-005432), and ultrafine dioxide obtained by high-temperature hydrolysis of titanium tetrachloride.
• a method of reducing titanium in a reducing atmosphere containing hydrogen JP-A-57-205322
• a method of reducing titanium dioxide or titanium hydroxide at high temperature in the presence of ammonia JP-A-60-065069, JP-A-61-201610
• a method of adhering a vanadium compound to titanium dioxide or titanium hydroxide and reducing it at high temperature in the presence of ammonia JP-A-61-201610.
• the particle size of titanium black is not particularly limited, but is preferably 10 to 45 nm, more preferably 12 to 20 nm.
• the specific surface area of titanium black is not particularly limited, but since the water repellency after surface treatment with a water repellent agent has a predetermined performance, the value measured by the BET (Brunauer, Emmett, Teller) method is 5 to 5. It is preferably 150 m 2 /g, more preferably 20 to 100 m 2 /g.
• titanium black for example, titanium black 10S, 12S, 13R, 13M, 13M-C, 13R, 13R-N, 13M-T (trade name, manufactured by Mitsubishi Materials Corporation), Tilac D (trade name) , manufactured by Ako Kasei Co., Ltd.) and MT-150A (trade name, manufactured by Teika Co., Ltd.).
• the resin composition of the present invention contains titanium black as a dispersant containing titanium black and Si atoms.
• titanium black is contained as a dispersed substance in the resin composition.
• the content ratio (Si/Ti) of Si atoms and Ti atoms in the material to be dispersed is preferably 0.05 to 0.5, more preferably 0.07 to 0.4 in terms of mass.
• the material to be dispersed includes both titanium black in the state of primary particles and titanium black in the state of aggregates (secondary particles).
• the Si/Ti ratio of the substance to be dispersed is at least a predetermined value
• a composition layer using the substance to be dispersed is patterned by photolithography or the like, it is difficult for a residue to remain in the removed portion. If /Ti is equal to or less than a predetermined value, the light shielding ability tends to be good.
• the following means can be used. First, titanium oxide and silica particles are dispersed using a disperser to obtain a dispersion, and this mixture is subjected to a reduction treatment at a high temperature (for example, 850 to 1000 ° C.), so that titanium black particles are the main component. Then, a dispersed material containing Si and Ti can be obtained. Titanium black in which Si/Ti is adjusted can be produced, for example, by the method described in paragraphs 0005 and 0016 to 0021 of JP-A-2008-266045. The content ratio (Si/Ti) of Si atoms and Ti atoms in the material to be dispersed is, for example, the method (2-1) or method (2 -3) can be used.
• the above titanium black can be used.
• a composite oxide of a plurality of metals selected from Cu, Fe, Mn, V, Ni, etc., cobalt oxide, Black pigments such as iron oxide, carbon black, and aniline black may be used singly or in combination of two or more as an object to be dispersed.
• the dispersed material comprising titanium black accounts for 50% by mass or more of the total dispersed material.
• Inorganic black pigments also include carbon black.
• Carbon blacks include, for example, furnace black, channel black, thermal black, acetylene black and lamp black.
• As the carbon black carbon black, carbon black produced by a known method such as an oil furnace method may be used, or a commercially available product may be used. Specific examples of commercial products of carbon black include C.I. I. Inorganic black pigments such as Pigment Black 7 are included.
• Carbon black that has undergone surface treatment is preferable as the carbon black.
• the surface treatment can modify the surface state of the carbon black particles and improve the dispersion stability in the composition.
• Examples of the surface treatment include coating treatment with a resin, surface treatment for introducing an acidic group, and surface treatment with a silane coupling agent.
• Coating resins include epoxy resins, polyamides, polyamideimides, novolac resins, phenolic resins, urea resins, melamine resins, polyurethanes, diallyl phthalate resins, alkylbenzene resins, polystyrene, polycarbonates, polybutylene terephthalate, and modified polyphenylene oxides.
• the content of the coating resin is preferably 0.1 to 40% by mass, more preferably 0.5 to 30% by mass, based on the total of the carbon black and the coating resin, from the viewpoint of better light shielding properties and insulating properties.
• the crystallite size of the inorganic black pigment is preferably 10 nm or more, more preferably 20 nm or more.
• the upper limit is preferably 60 nm or less, more preferably 50 nm or less, and even more preferably 40 nm or less.
• the crystallite size is 10 nm or more, the particle surface is less likely to be oxidized, and a decrease in light shielding properties is suppressed.
• the crystallite size is 60 nm or less, the shift of the transmission peak to a longer wavelength when formed into a colored film is suppressed, the decrease in light transmittance in the ultraviolet region is suppressed, and light blocking in the visible light region is suppressed. Decrease in sexuality is suppressed.
• the crystallite size is determined, for example, by the following method. It can be calculated from the half width of the X-ray diffraction peak derived from the (111) plane in the X-ray diffraction spectrum when CuK ⁇ rays are used as the X-ray source.
• K represents a constant of 0.9.
• ⁇ represents 0.15406 (nm).
• ⁇ is a value represented by the above formula (5).
• ⁇ is as described above.
• Equation (5) ⁇ e represents the half width of the diffraction peak.
• ⁇ O represents the half width correction value (0.12°).
• ⁇ , ⁇ e and ⁇ O are calculated in radians.
• the X-ray diffraction spectrum is measured by a wide-angle X-ray diffraction method using CuK ⁇ rays as an X-ray source.
• RU-200R manufactured by Rigakusha
• the measurement conditions are an output of 50 kV/200 mA, a slit system of 1°-1°-0.15 mm-0.45 mm, a measurement step (2 ⁇ ) of 0.02°, and a scan speed of 2°/min.
• examples of the diffraction peak values include those shown in paragraphs 0027 to 0028 of JP-A-2009-091205, the contents of which are incorporated herein.
• a method of adjusting the crystallite size within the above range includes, for example, a method of adjusting crystal growth conditions during particle synthesis by gas phase reaction.
• the crystallite size can be easily adjusted within the above range by adjusting the cooling time and cooling rate after the particles are vaporized.
• inorganic black pigments examples include zirconium in JP-A-2017-222559, WO-2019/130772, WO-2019/059359 and JP-A-2009-091205. incorporated into the specification.
• Organic black pigments used as black pigments are not particularly limited as long as they are particles that have light shielding properties and contain an organic compound, and known organic black pigments can be used.
• organic black pigments include bisbenzofuranone compounds, azomethine compounds, perylene compounds and azo compounds, with bisbenzofuranone compounds and perylene compounds being preferred.
• Examples of the bisbenzofuranone compound include compounds described in Japanese Patent Publication No. 2010-534726, Japanese Patent Publication No. 2012-515233 and Japanese Patent Publication No. 2012-515234.
• a bisbenzofuranone compound is available as “Irgaphor Black” (trade name) manufactured by BASF.
• Perylene compounds include those described in JP-A-62-001753 and JP-B-63-026784. The perylene compound is C.I. I. Pigment Black 21, 30, 31, 32, 33 and 34.
• the colorant used in the resin composition of the present invention may be the above-described black colorant only, or may further include a chromatic colorant. According to this aspect, it is easy to obtain a resin composition capable of forming a film having excellent light-shielding properties in the visible light region.
• chromatic colorant 100:10 to 300, preferably 100:20 to 200. is more preferable.
• it is preferable to use a black pigment as the black colorant and it is preferable to use a chromatic pigment as the chromatic colorant.
• Preferred combinations of black colorants and chromatic colorants include, for example, the following.
• A-1 An embodiment containing an organic black colorant and a blue colorant.
• A-2) An embodiment containing an organic black colorant, a blue colorant and a yellow colorant.
• A-3) An embodiment containing an organic black colorant, a blue colorant, a yellow colorant and a red colorant.
• A-4) An embodiment containing an organic black colorant, a blue colorant, a yellow colorant and a purple colorant.
• the near-infrared absorbing colorant is preferably a pigment, more preferably an organic pigment. Also, the near-infrared absorbing colorant preferably has a maximum absorption wavelength in the range of more than 700 nm and 1400 nm or less. Also, the maximum absorption wavelength of the near-infrared absorbing colorant is preferably 1200 nm or less, more preferably 1000 nm or less, and even more preferably 950 nm or less.
• the near-infrared absorbing colorant preferably has an A 550 /A max ratio of the absorbance A 550 at a wavelength of 550 nm to the absorbance A max at the maximum absorption wavelength of 0.1 or less, and is 0.05 or less. is more preferably 0.03 or less, and particularly preferably 0.02 or less.
• the lower limit is not particularly limited, but can be, for example, 0.0001 or more, and can also be 0.0005 or more. If the absorbance ratio is within the above range, a near-infrared absorbing colorant having excellent visible light transparency and near-infrared shielding properties can be obtained.
• the maximum absorption wavelength of the near-infrared absorbing colorant and the absorbance at each wavelength are values obtained from the absorption spectrum of a film formed using a resin composition containing the near-infrared absorbing colorant.
• the near-infrared absorbing colorant is not particularly limited, but pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, croconium compounds, oxonol compounds, iminium compounds, dithiol compounds, tria
• pyrrolopyrrole compounds cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, croconium compounds, oxonol compounds, iminium compounds, dithiol compounds, tria
• reelmethane compounds include reelmethane compounds, pyrromethene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, and dithiolene metal complexes.
• pyrrolopyrrole compound compounds described in paragraph numbers 0016 to 0058 of JP-A-2009-263614, compounds described in paragraph numbers 0037-0052 of JP-A-2011-068731, WO 2015/166873 Compounds described in Paragraph Nos. 0010 to 0033 and the like.
• examples of the squarylium compound include compounds described in paragraph numbers 0044 to 0049 of JP-A-2011-208101, compounds described in paragraph numbers 0060 to 0061 of Japanese Patent No. 6065169, and paragraph number 0040 of WO 2016/181987.
• Examples of croconium compounds include compounds described in JP-A-2017-082029.
• As the iminium compound for example, compounds described in JP-A-2008-528706, compounds described in JP-A-2012-012399, compounds described in JP-A-2007-092060, International Publication No. 2018/043564 and the compounds described in paragraphs 0048 to 0063 of.
• phthalocyanine compound examples include compounds described in paragraph number 0093 of JP-A-2012-077153, oxytitanium phthalocyanine described in JP-A-2006-343631, and paragraph numbers 0013 to 0029 of JP-A-2013-195480. compounds, vanadium phthalocyanine compounds described in Japanese Patent No. 6081771, and compounds described in International Publication No. 2020/071470. Examples of naphthalocyanine compounds include compounds described in paragraph number 0093 of JP-A-2012-077153. Dithiolene metal complexes include compounds described in Japanese Patent No. 5733804.
• the near-infrared absorbing colorant the squarylium compound described in JP-A-2017-197437, the squarylium compound described in JP-A-2017-025311, the squarylium compound described in International Publication No. 2016/154782, the patent Squarylium compounds described in Japanese Patent No. 5884953, squarylium compounds described in Japanese Patent No. 6036689, squarylium compounds described in Japanese Patent No. 5810604, squarylium compounds described in paragraph numbers 0090 to 0107 of International Publication No.
• amide-linked squarylium compounds compounds having a pyrrole bis-type squarylium skeleton or croconium skeleton described in JP-A-2017-141215, dihydrocarbazole bis-type squarylium compounds described in JP-A-2017-082029, JP-A-2017 -Asymmetric compounds described in paragraphs 0027 to 0114 of JP-A-068120, pyrrole ring-containing compounds (carbazole type) described in JP-A-2017-067963, phthalocyanine compounds described in Japanese Patent No. 6251530, A squarylium compound described in JP-A-2020-075959, a copper complex described in Korean Patent Publication No. 10-2019-0135217, and the like can also be used.
• the content of the coloring material in the total solid content of the resin composition is preferably 20 to 90% by mass.
• the lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more.
• the upper limit is preferably 80% by mass or less, more preferably 70% by mass or less.
• the content of the pigment in the total solid content of the resin composition is preferably 20 to 90% by mass.
• the lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more.
• the upper limit is preferably 80% by mass or less, more preferably 70% by mass or less.
• the content of the dye in the coloring material is preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 30% by mass or less.
• the colorant contained in the resin composition contains a black pigment, and the content of the black pigment in the total solid content of the resin composition is 65% by mass or more.
• the content of the black pigment in the total solid content of the resin composition is preferably 70% by mass or more, more preferably 75% by mass or more.
• the upper limit is preferably 90% by mass or less, more preferably 80% by mass or less.
• the content of the black pigment in the colorant is preferably 90% by mass or more, more preferably 95% by mass or more, even more preferably 99% by mass or more, and 100% by mass. is particularly preferred.
• the resin composition of the present invention contains resin B (hereinafter also referred to as resin).
• resin B hereinafter also referred to as resin
• the resin contained in the resin composition is a resin B1 (hereinafter also referred to as a specific resin) containing an acid anhydride group and a polymer chain containing a repeating unit having at least one structure selected from a polyether structure and a polyester structure. include.
• the specific resin preferably has an acid anhydride group at the end of the specific resin.
• the number of acid anhydride groups possessed by the specific resin is preferably 1 to 5, more preferably 1 to 3, and preferably 1 for the reason that the dispersibility of the pigment can be further improved. Especially preferred.
• the acid anhydride group possessed by the specific resin is preferably a cyclic acid anhydride group because it can further improve the dispersibility of the pigment.
• the acid anhydride group possessed by the specific resin is preferably a group represented by any one of formulas (RAH-1) to (RAH-7), and is a group represented by formula (RAH-4). is more preferable.
• * represents a link
• R AH1 , R AH7 , R AH8 , R AH10 and R AH11 each independently represent a hydrogen atom or a substituent
• R AH2 , R AH3 , R AH4 , R AH5 , R AH6 and R AH9 represent substituents
• r2, r3, r4, r6 and r7 each independently represent an integer of 0 to 3
• r5 represents an integer of 0 to 2;
• Each of r2, r3, r4, r6 and r7 is preferably an integer of 0 to 2, more preferably 0 or 1, even more preferably 0.
• r5 is preferably 0 or 1, more preferably 0.
• Substituents represented by R AH1 to R AH11 include a substituent T described later, preferably a halogen atom, a carboxy group, an alkyl group or a hydroxy group, more preferably a carboxy group.
• the polymer chain possessed by the specific resin may contain at least one selected from ethylenically unsaturated bond-containing groups, epoxy groups and oxetanyl groups. These groups are preferably contained at the ends of the polymer chain. Examples of ethylenically unsaturated bond-containing groups include vinyl groups, (meth)allyl groups, and (meth)acryloyl groups.
• the polymer chain possessed by the specific resin is preferably a polymer chain containing repeating units represented by any one of formulas (P-1) to (P-4).
• R G1 to R G4 each independently represent an alkylene group.
• the alkylene group represented by R G1 to R G4 is preferably a linear or branched alkylene group having 1 to 20 carbon atoms, and is a linear or branched alkylene group having 2 to 16 carbon atoms. More preferably, it is a linear or branched alkylene group having 3 to 12 carbon atoms.
• the polymer chain possessed by the specific resin may contain two or more repeating units.
• a repeating unit represented by any one of formulas (P1-1) to (P1-3) and a repeating unit represented by formula (P1-4) may be included.
• the terminal structure of the polymer chain is not particularly limited. It may be a hydrogen atom or a substituent.
• Substituents include alkyl groups, aryl groups, heteroaryl groups, alkoxy groups, aryloxy groups, heteroaryloxy groups, alkylthioether groups, arylthioether groups, heteroarylthioether groups, ethylenically unsaturated bond-containing groups, and epoxy groups. and an oxetanyl group.
• the specific resin is preferably a resin represented by formula (1).
• R 1 represents an acid anhydride group
• X 1 and X 2 each independently represent a single bond, -O-, -CO-, -COO-, -OCO-, -NR x1 -, -CONR x1 -, -NR x1 CO- or -S- and R x1 represents a hydrogen atom or a substituent
• L 1 represents a single bond or an m+n-valent linking group
• P 1 represents a polymer chain containing repeating units of at least one structure selected from a polyether structure and a polyester structure
• m and n each independently represent an integer of 1 or more.
• the acid anhydride group represented by R 1 in formula (1) is preferably a cyclic acid anhydride group because it can further improve the dispersibility of the pigment.
• the acid anhydride group represented by R 1 in formula (1) is preferably a group represented by any one of formulas (RAH-1) to (RAH-7) described above, and formula (RAH-4). is more preferably a group represented by
• the polymer chain represented by P1 in formula ( 1 ) may contain at least one selected from an ethylenically unsaturated bond-containing group, an epoxy group and an oxetanyl group. These groups are preferably contained at the ends of the polymer chain. Examples of ethylenically unsaturated bond-containing groups include vinyl groups, (meth)allyl groups, and (meth)acryloyl groups.
• the polymer chain represented by P 1 in formula (1) is preferably a polymer chain containing a repeating unit represented by any one of formulas (P-1) to (P-4) described above.
• the terminal structure of the polymer chain represented by P1 in formula ( 1 ) is not particularly limited. It may be a hydrogen atom or a substituent.
• Substituents include alkyl groups, aryl groups, heteroaryl groups, alkoxy groups, aryloxy groups, heteroaryloxy groups, alkylthioether groups, arylthioether groups, heteroarylthioether groups, ethylenically unsaturated bond-containing groups, and epoxy groups. and an oxetanyl group.
• the polymer chain represented by P1 is preferably a polymer chain represented by formula (P100).
• *-P 10 -Lp 10 -(Rp 10 ) q (P100) In the formula (P100), * represents a connecting hand, P 10 represents a polymer chain containing repeating units of at least one structure selected from a polyether structure and a polyester structure, Lp 10 represents a single bond or a q+1 valent group, Rp 10 represents a hydrogen atom or a substituent, q represents 1 or 2;
• the repeating unit having a polyether structure in P10 of formula (P100) is preferably a repeating unit represented by formula (P - 4) described above.
• the repeating unit of the polyester structure in P 10 of formula (P100) is preferably a repeating unit represented by any one of formulas (P-1) to (P-3) described above.
• the q+1 valent group represented by Lp 10 in the formula (P100) includes a hydrocarbon group, a heterocyclic group, -NRp L1 -, -N ⁇ , -SO-, -SO 2 -, -CO-, -O-, --COO--, --OCO--, --S--, --NRp L1 CO-- and --CONRp L1-- and groups consisting of combinations of two or more of these.
• Rp L1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom.
• Hydrocarbon groups include aliphatic hydrocarbon groups and aromatic hydrocarbon groups.
• the number of carbon atoms in the aliphatic hydrocarbon group is preferably 1-30, more preferably 1-20, even more preferably 1-15.
• the aliphatic hydrocarbon group may be linear, branched or cyclic.
• the cyclic aliphatic hydrocarbon group may be monocyclic or condensed.
• the cyclic aliphatic hydrocarbon group may have a crosslinked structure.
• the number of carbon atoms in the aromatic hydrocarbon group is preferably 6-30, more preferably 6-20, even more preferably 6-10.
• the hydrocarbon group may have a substituent. Substituents include the substituent T described later.
• the heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group.
• the heterocyclic group is preferably a 5- or 6-membered ring.
• Types of heteroatoms constituting the ring of the heterocyclic group include a nitrogen atom, an oxygen atom, a sulfur atom and the like.
• the number of heteroatoms constituting the ring of the heterocyclic group is preferably 1-3.
• the heterocyclic group may be monocyclic or condensed.
• the heterocyclic group may have a substituent. Substituents include the substituent T described later.
• substituents represented by Rp 10 in formula (P100) include alkyl groups, aryl groups, heteroaryl groups, alkoxy groups, aryloxy groups, heteroaryloxy groups, alkylthioether groups, arylthioether groups, heteroarylthioether groups, and ethylene. and an ethylenically unsaturated bond-containing group, an epoxy group and an oxetanyl group, preferably an ethylenically unsaturated bond-containing group, an epoxy group and an oxetanyl group.
• Examples of ethylenically unsaturated bond-containing groups include vinyl groups, (meth)allyl groups, and (meth)acryloyl groups.
• q in formula (P100) represents 1 or 2, preferably 1.
• P1 polymer chain represented by P1
• P1-1 to P1-22 shown below.
• * is a linker.
• L 1 in formula (1) represents a single bond or an m+n-valent linking group.
• the m+n-valent linking group represented by L 1 includes a hydrocarbon group, a heterocyclic group, -NR L1 -, -N ⁇ , -SO-, -SO 2 -, -CO-, -O-, -COO-, -OCO-, -S-, -NR L1 CO- and -CONR L1 - and groups formed by combinations of two or more of these.
• R L1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom.
• Hydrocarbon groups include aliphatic hydrocarbon groups and aromatic hydrocarbon groups.
• the number of carbon atoms in the aliphatic hydrocarbon group is preferably 1-30, more preferably 1-20, even more preferably 1-15.
• the aliphatic hydrocarbon group may be linear, branched or cyclic.
• the cyclic aliphatic hydrocarbon group may be monocyclic or condensed.
• the cyclic aliphatic hydrocarbon group may have a crosslinked structure.
• the number of carbon atoms in the aromatic hydrocarbon group is preferably 6-30, more preferably 6-20, even more preferably 6-10.
• the hydrocarbon group may have a substituent. Substituents include the substituent T described later.
• the heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group.
• the heterocyclic group is preferably a 5- or 6-membered ring.
• Types of heteroatoms constituting the ring of the heterocyclic group include a nitrogen atom, an oxygen atom, a sulfur atom and the like.
• the number of heteroatoms constituting the ring of the heterocyclic group is preferably 1-3.
• the heterocyclic group may be monocyclic or condensed.
• the heterocyclic group may have a substituent. Substituents include the substituent T described below.
• the m+n-valent linking group is hydrocarbon group; heterocyclic group; a hydrocarbon group, a heterocyclic group, -NR L1 -, -N ⁇ , -SO-, -SO 2 -, -CO-, -O-, -COO-, -OCO-, -S-, -NR L1 a group having a structure in combination with at least one group selected from CO— and —CONR L1 ; or a heterocyclic group, a hydrocarbon group, -NR L1 -, -N ⁇ , -SO-, -SO 2 -, -CO-, -O-, -COO-, -OCO-, -S-, -NR L1 It is preferably a group having a structure in combination with at least one group selected from CO-- and --CONR L1 .
• m+n-valent linking group represented by L 1 examples include -(CH 2 ) 2 -, -(CH 2 ) 3 -, -(CH 2 ) 4 -, -(CH 2 ) 5 -, -(CH 2 ) 6 -, and (Z1-1) to (Z1-23) shown below.
• X 1 and X 2 in formula (1) are each independently a single bond, -O-, -CO-, -COO-, -OCO-, -NR x1 -, -CONR x1 -, -NR x1 CO- or represents -S-.
• R x1 represents a hydrogen atom or a substituent. Examples of the substituent represented by R x1 include a substituent T described later, and an alkyl group is preferable.
• R x1 is preferably a hydrogen atom or an alkyl group, more preferably a hydrogen atom.
• X 1 in formula (1) is preferably -S-, -CO-, -COO-, -OCO-, -NR x1 -, -CONR x1 - or -NR x1 CO-, and -CO-, -COO- or -OCO- is more preferred, and -COO- is even more preferred.
• X 2 in formula (1) is preferably a single bond, -O- or -NR x1 -. When L 1 in formula (1) is a single bond and X 1 is --COO--, X 2 is preferably a single bond.
• m and n in formula (1) each independently represent an integer of 1 or more.
• m is preferably an integer of 1 to 5, more preferably an integer of 1 to 3, more preferably 1 or 2, and 1 for the reason that the dispersibility of the pigment can be further improved. is particularly preferred.
• n is preferably an integer of 1 to 5, more preferably an integer of 1 to 4, even more preferably an integer of 1 to 3, even more preferably 1 or 2, and development residue 1 is particularly preferable because the occurrence of is more suppressed.
• the specific resin is preferably a resin represented by Formula (2).
• X 2 represents a single bond, -O-, -CO-, -COO-, -OCO-, -NR x1 -, -CONR x1 -, -NR x1 CO- or -S-
• R x1 represents a hydrogen atom or a substituent
• L 1 represents a single bond or an m+n-valent linking group
• P 1 represents a polymer chain containing repeating units of at least one structure selected from a polyether structure and a polyester structure
• m and n each independently represent an integer of 1 or more.
• X 2 in formula (2) has the same definition as X 2 in formula (1), and the preferred range is also the same.
• L 1 in formula (2) has the same meaning as L 1 in formula (1), and the preferred range is also the same.
• P 1 in formula (2) has the same meaning as P 1 in formula (1), and the preferred range is also the same.
• m in formula (2) has the same meaning as m in formula (1), and the preferred range is also the same.
• n in formula (2) has the same meaning as n in formula (1), and the preferred range is also the same.
• the substituent T includes an alkyl group (preferably an alkyl group having 1 to 30 carbon atoms), an alkenyl group (preferably an alkenyl group having 2 to 30 carbon atoms), an alkynyl group (preferably an alkynyl group having 2 to 30 carbon atoms).
• an aryl group preferably an aryl group having 6 to 30 carbon atoms
• an amino group preferably an amino group having 0 to 30 carbon atoms
• an alkoxy group preferably an alkoxy group having 1 to 30 carbon atoms
• an aryloxy group preferably having 6 to 30 carbon atoms
• heteroaryloxy group preferably heteroaryloxy group having 1 to 30 carbon atoms
• acyl group preferably acyl group having 2 to 30 carbon atoms
• alkoxycarbonyl group preferably alkoxycarbonyl group having 2 to 30 carbon atoms
• aryloxycarbonyl group preferably aryloxycarbonyl group having 7 to 30 carbon atoms
• acyloxy group preferably acyloxy group having 2 to 30 carbon atoms
• acylamino group preferably acylamino group having 2 to 30 carbon atoms
• alkoxycarbonylamino group preferably alkoxycarbonylamino group having 2 to 30 carbon atoms
• the weight average molecular weight of the specific resin is preferably 500 or more and less than 10,000.
• the lower limit is preferably 800 or more, more preferably 1000 or more.
• the upper limit is preferably 8000 or less, more preferably 6000 or less.
• the ethylenically unsaturated bond group value of the specific resin is preferably 0.1 to 2.0 mmol/g, and 0.2 to 1.5 mmol/g. more preferably 0.3 to 1.0 mmol/g.
• the epoxy group value of the specific resin is preferably 0.1 to 2.0 mmol/g, more preferably 0.2 to 1.5 mmol/g, More preferably 0.3 to 1.0 mmol/g.
• the oxetanyl group value of the specific resin is preferably 0.1 to 2.0 mmol/g, more preferably 0.2 to 1.5 mmol/g, More preferably 0.3 to 1.0 mmol/g.
• a specific resin can be synthesized, for example, by the following method.
• a macromonomer obtained by ring-opening polymerization of a lactone using a compound having a hydroxy group and a mercapto group e.g., mercaptoethanol, mercaptopropanol, mercaptohexanol, mercaptoglycerol, etc.
• an acid anhydride or Synthesis method by reacting with acid anhydride chloride e.g., 2-ethylhexanol
• some specific resins may react with other materials in the resin composition.
• the resin composition of the present invention may contain other resins than the specific resins described above.
• Other resins include (meth)acrylic resins, epoxy resins, (meth)acrylamide resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene resins.
• resins include resins described in Examples of International Publication No. 2016/088645, resins described in JP-A-2017-057265, resins described in JP-A-2017-032685, Resins described in JP-A-2017-075248, resins described in JP-A-2017-066240, resins described in JP-A-2017-167513, JP-A-2017-173787 Resins, resins described in paragraph numbers 0041 to 0060 of JP 2017-206689, resins described in paragraphs 0022 to 0071 of JP 2018-010856, described in JP 2016-222891 Block polyisocyanate resin, resin described in JP-A-2020-122052, resin described in JP-A-2020-111656, resin described in JP-A-2020-139021, JP-A-2017-138503 A resin containing a structural unit having a cyclic structure in the main chain and a structural unit having a biphenyl group in the side chain described in JP-A
• the weight average molecular weight (Mw) of other resins is preferably 3,000 to 2,000,000.
• the upper limit is preferably 1,000,000 or less, more preferably 500,000 or less.
• the lower limit is preferably 4000 or more, more preferably 5000 or more.
• the other resin it is preferable to use a resin with alkali developability or a resin as a dispersant.
• the weight average molecular weight (Mw) of the resin having alkali developability is preferably 3,000 to 2,000,000.
• the upper limit is more preferably 1,000,000 or less, and even more preferably 500,000 or less.
• the lower limit is more preferably 4000 or more, and even more preferably 5000 or more.
• resins having alkali developability examples include (meth)acrylic resins, polyimine resins, polyether resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, polyimide resins, etc. (meth)acrylic resins and polyimine resins. is preferred, and (meth)acrylic resin is more preferred.
• the resin having alkali developability it is preferable to use a resin having an acid group.
• the acid group include phenolic hydroxy group, carboxy group, sulfo group, phosphoric acid group, phosphonic acid group, active imide group, sulfonamide group and the like, and carboxy group is preferred.
• the resin having an acid group a resin obtained by introducing an acid group by reacting an acid anhydride with a hydroxy group generated by epoxy ring opening may be used. Examples of such resins include those described in Japanese Patent No. 6349629.
• a resin having an acid group can be used, for example, as an alkali-soluble resin.
• the alkali-soluble resin may be a cardo resin having a cardo skeleton. Cardo resins include, for example, V-259ME (manufactured by Nippon Steel & Sumikin Co., Ltd.).
• the alkali-developable resin preferably contains a repeating unit having an acid group, and more preferably contains 1 to 70 mol % of the repeating unit having an acid group in the total repeating units of the resin.
• the upper limit of the content of repeating units having an acid group is preferably 50 mol % or less, more preferably 40 mol % or less.
• the lower limit of the content of repeating units having an acid group is preferably 2 mol % or more, more preferably 5 mol % or more.
• the acid value of the resin having alkali developability is preferably 200 mgKOH/g or less, more preferably 150 mgKOH/g or less, even more preferably 120 mgKOH/g or less, and particularly preferably 100 mgKOH/g or less.
• the acid value of the resin having alkali developability is preferably 5 mgKOH/g or more, more preferably 10 mgKOH/g or more, and even more preferably 20 mgKOH/g or more.
• the resin having alkali developability further have an ethylenically unsaturated bond-containing group.
• the ethylenically unsaturated bond-containing group includes a vinyl group, an allyl group, a (meth)acryloyl group and the like, preferably an allyl group and a (meth)acryloyl group, and more preferably a (meth)acryloyl group.
• the resin having alkali developability includes a compound represented by the following formula (ED1) and/or a compound represented by the following formula (ED2) (hereinafter, these compounds are sometimes referred to as "ether dimer”). It is also preferred that repeating units derived from monomer components are included.
• R 1 and R 2 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent.
• R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms.
• the alkali-developable resin preferably contains a repeating unit derived from a compound represented by the following formula (X).
• R 1 represents a hydrogen atom or a methyl group
• R 2 represents an alkylene group having 2 to 10 carbon atoms
• R 3 represents a hydrogen atom or 1 to 20 carbon atoms which may contain a benzene ring.
• represents an alkyl group of n represents an integer from 1 to 15;
• resins having alkali developability examples include resins having the following structures.
• Me represents a methyl group.
• the resin composition of the present invention can also contain a resin as a dispersant.
• Dispersants include acidic dispersants (acidic resins) and basic dispersants (basic resins).
• the acidic dispersant (acidic resin) represents a resin in which the amount of acid groups is greater than the amount of basic groups.
• the acidic dispersant (acidic resin) is preferably a resin in which the amount of acid groups is 70 mol % or more when the total amount of acid groups and basic groups is 100 mol %. A resin consisting only of groups is more preferred.
• the acid group possessed by the acidic dispersant (acidic resin) is preferably a carboxy group.
• the acid value of the acidic dispersant is preferably from 40 to 105 mgKOH/g, more preferably from 50 to 105 mgKOH/g, even more preferably from 60 to 105 mgKOH/g.
• a basic dispersant represents a resin in which the amount of basic groups is greater than the amount of acid groups.
• the basic dispersant is preferably a resin in which the amount of basic groups exceeds 50 mol % when the total amount of acid groups and basic groups is 100 mol %.
• the basic group possessed by the basic dispersant is preferably an amino group.
• the resin used as the dispersant preferably contains a repeating unit having an acid group.
• the resin used as the dispersant is also preferably a graft polymer.
• Graft polymers include resins described in paragraphs 0025 to 0094 of JP-A-2012-255128, the contents of which are incorporated herein.
• the resin used as the dispersant is also preferably a polyimine-based dispersant (polyimine resin) containing nitrogen atoms in at least one of the main chain and the side chain.
• the polyimine-based dispersant has a main chain having a partial structure having a functional group with a pKa of 14 or less and a side chain having 40 to 10,000 atoms, and at least one of the main chain and the side chain has a basic nitrogen atom.
• a resin having The basic nitrogen atom is not particularly limited as long as it is a nitrogen atom exhibiting basicity.
• Polyimine-based dispersants include resins described in paragraphs 0102 to 0166 of JP-A-2012-255128, the contents of which are incorporated herein.
• the resin used as the dispersant is also preferably a resin having a structure in which a plurality of polymer chains are bonded to the core.
• resins include, for example, dendrimers (including star polymers). Further, specific examples of dendrimers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of JP-A-2013-043962.
• the dispersant includes block copolymers (EB-1) to (EB-9) described in paragraphs 0219 to 0221 of Japanese Patent No. 6432077, and resins described in Japanese Patent Application Laid-Open No. 2018-087939.
• Polyethyleneimine having a polyester side chain described in WO 2016/104803, a block copolymer described in WO 2019/125940, a block having an acrylamide structural unit described in JP 2020-066687 Polymers, block polymers having acrylamide structural units described in JP-A-2020-066688, dispersants described in WO 2016/104803, resins described in JP-A-2019-095548, etc. can also be used. .
• Dispersants are also available as commercial products, and specific examples thereof include BYK Chemie's DISPERBYK series (e.g., DISPERBYK-111, 161, etc.), Lubrizol's Solsperse series (e.g., Solsperse 36000, etc.). etc. Also, the pigment dispersants described in paragraphs 0041 to 0130 of JP-A-2014-130338 can be used, the contents of which are incorporated herein.
• the resin described as the dispersant can also be used for applications other than the dispersant.
• it can also be used as a binder.
• the resin content in the total solid content of the resin composition is preferably 5 to 60% by mass.
• the lower limit is preferably 10% by mass or more, more preferably 15% by mass or more.
• the upper limit is preferably 50% by mass or less, more preferably 40% by mass or less.
• the content of the above-mentioned specific resin in the total solid content of the resin composition is preferably 0.1 to 60% by mass.
• the lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more.
• the upper limit is preferably 50% by mass or less, more preferably 40% by mass or less.
• the content of the specific resin described above is preferably 10 to 80 parts by mass with respect to 100 parts by mass of the pigment.
• the lower limit is preferably 20 parts by mass or more, more preferably 30 parts by mass or more.
• the upper limit is preferably 70 parts by mass or less, more preferably 50 parts by mass or less.
• the total content of the colorant and the above-mentioned specific resin in the total solid content of the resin composition is preferably 30 to 100% by mass.
• the lower limit is more preferably 35% by mass or more, and even more preferably 40% by mass or more.
• the upper limit is more preferably 90% by mass or less, and even more preferably 80% by mass or less.
• the content of the other resin described above is preferably 230 parts by mass or less, more preferably 200 parts by mass or less, and 150 parts by mass with respect to 100 parts by mass of the specific resin described above. More preferably: The lower limit may be 0 parts by mass, 5 parts by mass or more, or 10 parts by mass or more. It is also preferred that the resin composition does not substantially contain the other resins described above. According to this aspect, better dispersibility can be obtained. When substantially free of other resins, it means that the content of other resins in the total solid content of the resin composition is 0.1% by mass or less, and is 0.05% by mass or less. is preferred, and not containing is more preferred.
• the resin composition of the present invention contains solvent C (hereinafter referred to as solvent).
• solvent is basically not particularly limited as long as it satisfies the solubility of each component and the coatability of the resin composition.
• the solvent is an organic solvent.
• solvents include ester-based solvents, ketone-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, and hydrocarbon-based solvents. It is preferable that at least one solvent selected from an ester solvent, an ether solvent, an alcohol solvent and a ketone solvent is included because it is possible.
• Ester-based solvents substituted with cyclic alkyl groups and ketone-based solvents substituted with cyclic alkyl groups can also be used.
• organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2 -heptanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene Glycol Monomethyl Ether, Propylene Glycol Monomethyl Ether Acetate, 3-Methoxy-N,N-Dimethylpropanamide, 3-Butoxy-N,N-Dimethylpropanamide,
• aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) as organic solvents may be better reduced for environmental reasons (e.g., 50 mass ppm (parts per million), 10 ppm by mass or less, or 1 ppm by mass or less).
• an organic solvent with a low metal content it is preferable to use an organic solvent with a low metal content, and the metal content of the organic solvent is preferably, for example, 10 mass ppb (parts per billion) or less. If necessary, an organic solvent with a ppt (parts per trillion) mass level may be used, and such an organic solvent is provided by, for example, Toyo Gosei Co., Ltd. (Chemical Daily, November 13, 2015).
• Methods for removing impurities such as metals from organic solvents include, for example, distillation (molecular distillation, thin film distillation, etc.) and filtration using a filter.
• the filter pore size of the filter used for filtration is preferably 10 ⁇ m or less, more preferably 5 ⁇ m or less, and even more preferably 3 ⁇ m or less.
• the material of the filter is preferably polytetrafluoroethylene, polyethylene or nylon.
• the organic solvent may contain isomers (compounds with the same number of atoms but different structures). Moreover, only one isomer may be contained, or a plurality of isomers may be contained.
• the content of peroxide in the organic solvent is preferably 0.8 mmol/L or less, and more preferably substantially free of peroxide.
• the content of the solvent in the resin composition is preferably 10-95% by mass, more preferably 20-90% by mass, and even more preferably 30-90% by mass.
• the resin composition of the present invention may contain a pigment derivative.
• Pigment derivatives include compounds having a structure in which a portion of the chromophore is substituted with an acid group, a basic group, or a phthalimidomethyl group.
• Chromophores constituting pigment derivatives include quinoline skeleton, benzimidazolone skeleton, diketopyrrolopyrrole skeleton, azo skeleton, phthalocyanine skeleton, anthraquinone skeleton, quinacridone skeleton, dioxazine skeleton, perinone skeleton, perylene skeleton, thioindigo skeleton, iso Examples thereof include indoline skeleton, isoindolinone skeleton, quinophthalone skeleton, threne skeleton, metal complex skeleton, and the like, and quinoline skeleton, benzimidazolone skeleton, diketopyrrolopyrrole skeleton, azo skeleton, quinophthalone skeleton, isoindoline skeleton and phthalocyanine skeleton.
• the azo skeleton and the benzimidazolone skeleton are preferred.
• the acid group possessed by the pigment derivative a sulfo group and a carboxy group are preferable, and a sulfo group is more preferable.
• the basic group possessed by the pigment derivative is preferably an amino group, more preferably a tertiary amino group.
• a pigment derivative excellent in visible light transparency (hereinafter also referred to as a transparent pigment derivative) can be used.
• the maximum value ( ⁇ max) of the molar extinction coefficient of the transparent pigment derivative in the wavelength region of 400 to 700 nm is preferably 3000 L ⁇ mol ⁇ 1 ⁇ cm ⁇ 1 or less, and 1000 L ⁇ mol ⁇ 1 ⁇ cm ⁇ 1 or less. is more preferable, and 100 L ⁇ mol ⁇ 1 ⁇ cm ⁇ 1 or less is even more preferable.
• the lower limit of ⁇ max is, for example, 1 L ⁇ mol ⁇ 1 ⁇ cm ⁇ 1 or more, and may be 10 L ⁇ mol ⁇ 1 ⁇ cm ⁇ 1 or more.
• the crystallite size of the pigment derivative is preferably 0.1 to 50 nm, more preferably 0.5 to 30 nm, even more preferably 1 to 15 nm.
• the crystallite size can be obtained from the half width of the diffraction angle peak using an X-ray diffractometer, and is calculated using Scherrer's formula.
• the crystallite size of the pigment derivative can be adjusted by known methods such as adjustment of production conditions and pulverization after production. As a pulverization method, any method may be used as long as the crystallite size can be adjusted, and examples include dry pulverization and wet pulverization. Dry milling is preferred because it does not require solvent removal and is less likely to re-agglomerate.
• pigment derivatives include compounds described in JP-A-56-118462, compounds described in JP-A-63-264674, compounds described in JP-A-01-217077, JP-A-03- 009961, compounds described in JP-A-03-026767, compounds described in JP-A-03-153780, compounds described in JP-A-03-045662, JP-A-04-285669 Compounds described in publications, compounds described in JP-A-06-145546, compounds described in JP-A-06-212088, compounds described in JP-A-06-240158, JP-A-10-030063 Compounds described, compounds described in JP-A-10-195326, compounds described in paragraphs 0086 to 0098 of WO 2011/024896, WO 2012/102399 described in paragraphs 0063 to 0094 Compounds, compounds described in paragraph number 0082 of WO 2017/038252, compounds described in paragraph number 0171 of JP 2015-151530, JP 2011-25
• the content of the pigment derivative is preferably 1 to 30 parts by mass, more preferably 3 to 20 parts by mass, based on 100 parts by mass of the pigment. Only one pigment derivative may be used, or two or more pigment derivatives may be used in combination.
• the resin composition of the present invention preferably contains a polymerizable monomer.
• a known compound that can be crosslinked by radicals, acids, or heat can be used as the polymerizable monomer.
• the polymerizable monomer include compounds having an ethylenically unsaturated bond-containing group, compounds having a cyclic ether group, and the like, and compounds having an ethylenically unsaturated bond-containing group are preferred.
• Examples of ethylenically unsaturated bond-containing groups include vinyl groups, (meth)allyl groups, and (meth)acryloyl groups.
• Cyclic ether groups include epoxy groups and oxetane groups.
• a compound having an ethylenically unsaturated bond-containing group can be preferably used as a radically polymerizable monomer.
• a compound having a cyclic ether group can also be preferably used as a cationically polymerizable monomer.
• the polymerizable monomer is preferably a polyfunctional polymerizable monomer. That is, the polymerizable monomer is preferably a monomer having two or more polymerizable groups such as ethylenically unsaturated bond-containing groups and cyclic ether groups.
• the molecular weight of the polymerizable monomer is preferably 100-3000.
• the upper limit is more preferably 2000 or less, and even more preferably 1500 or less.
• the lower limit is more preferably 150 or more, even more preferably 250 or more.
• the compound having an ethylenically unsaturated bond-containing group that is used as a polymerizable monomer is preferably a polyfunctional compound. That is, it is preferably a compound containing two or more ethylenically unsaturated bond-containing groups, more preferably a compound containing three or more ethylenically unsaturated bond-containing groups, and three ethylenically unsaturated bond-containing groups. A compound containing up to 15 groups is more preferable, and a compound containing 3 to 6 ethylenically unsaturated bond-containing groups is even more preferable.
• the compound having an ethylenically unsaturated bond-containing group is preferably a 3- to 15-functional (meth)acrylate compound, more preferably a 3- to 6-functional (meth)acrylate compound.
• Specific examples of the compound having an ethylenically unsaturated bond-containing group paragraph numbers 0095 to 0108 of JP-A-2009-288705, paragraph 0227 of JP-A-2013-029760, paragraph of JP-A-2008-292970 Numbers 0254 to 0257, paragraph numbers 0034 to 0038 of JP 2013-253224, paragraph number 0477 of JP 2012-208494, JP 2017-048367, JP 6057891, JP 6031807 , and compounds described in JP-A-2017-194662, the contents of which are incorporated herein.
• Examples of compounds having an ethylenically unsaturated bond-containing group include dipentaerythritol triacrylate (commercially available as KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetraacrylate (commercially available as KAYARAD D- 320; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta(meth)acrylate (as a commercial product, KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa(meth)acrylate (as a commercial product) KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd., NK Ester A-DPH-12E; manufactured by Shin-Nakamura Chemical Co., Ltd.), and their (meth)acryloyl groups via ethylene glycol and/or propylene glycol residues
• Examples of compounds having an ethylenically unsaturated bond-containing group include diglycerin EO (ethylene oxide)-modified (meth)acrylate (commercially available as M-460; manufactured by Toagosei), pentaerythritol tetraacrylate (Shin-Nakamura Chemical Industry ( Ltd., NK Ester A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), Aronix TO-2349 (manufactured by Nippon Kayaku Co., Ltd.) Toagosei Co., Ltd.), NK Oligo UA-7200 (Shin-Nakamura Chemical Co., Ltd.), 8UH-1006, 8UH-1012 (Taisei Fine Chemical Co., Ltd.), Light acrylate POB-A0 (Kyoeish
• trifunctional (meth)acrylate compounds such as oxy-modified tri(meth)acrylate and pentaerythritol tri(meth)acrylate.
• Commercial products of trifunctional (meth)acrylate compounds include Aronix M-309, M-310, M-321, M-350, M-360, M-313, M-315, M-306 and M-305.
• M-303, M-452, M-450 manufactured by Toagosei Co., Ltd.
• a compound having an acid group can also be used as the compound having an ethylenically unsaturated bond-containing group. Generation of development residue can be suppressed by using a compound having an acid group.
• the acid group includes a carboxy group, a sulfo group, a phosphoric acid group and the like, and a carboxy group is preferred.
• Commercially available polymerizable monomers having an acid group include Aronix M-305, M-510, M-520 and Aronix TO-2349 (manufactured by Toagosei Co., Ltd.).
• the acid value of the polymerizable monomer having an acid group is preferably 0.1-40 mgKOH/g, more preferably 5-30 mgKOH/g. When the acid value of the polymerizable compound is 0.1 mgKOH/g or more, the solubility in the developer is good, and when it is 40 mgKOH/g or less, it is advantageous in terms of production and handling.
• the compound having an ethylenically unsaturated bond-containing group is a compound having a caprolactone structure.
• Compounds having a caprolactone structure are commercially available from Nippon Kayaku Co., Ltd. under the KAYARAD DPCA series, including DPCA-20, DPCA-30, DPCA-60, DPCA-120, and the like.
• a compound having an alkyleneoxy group can also be used as the compound having an ethylenically unsaturated bond-containing group.
• the compound having an alkyleneoxy group is preferably a compound having an ethyleneoxy group and/or a propyleneoxy group, more preferably a compound having an ethyleneoxy group, and a tri- to hexa-functional (meth)acrylate having 4 to 20 ethyleneoxy groups.
• Compounds are more preferred.
• Examples of commercially available compounds having an alkyleneoxy group include SR-494, a tetrafunctional (meth)acrylate having 4 ethyleneoxy groups and a trifunctional (meth)acrylate having 3 isobutyleneoxy groups, manufactured by Sartomer. KAYARAD TPA-330, etc.
• a compound having a fluorene skeleton can also be used as the compound having an ethylenically unsaturated bond-containing group.
• Commercially available compounds having a fluorene skeleton include Ogsol EA-0200 and EA-0300 (manufactured by Osaka Gas Chemicals Co., Ltd., (meth)acrylate monomers having a fluorene skeleton).
• the compound having an ethylenically unsaturated bond-containing group it is also preferable to use a compound such as toluene that does not substantially contain environmentally regulated substances.
• Commercially available products of such compounds include KAYARAD DPHA LT and KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.).
• the polymerizable compound includes UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, Commercial products such as T-600, AI-600, and LINC-202UA (manufactured by Kyoeisha Chemical Co., Ltd.) can also be used.
• Compounds having a cyclic ether group that are also used as polymerizable monomers include compounds having an epoxy group (hereinafter also referred to as epoxy compounds) and compounds having an oxetane group (hereinafter also referred to as oxetane compounds).
• the epoxy compound is preferably a polyfunctional epoxy compound. That is, the epoxy compound is preferably a compound having two or more epoxy groups. The upper limit of the number of epoxy groups is preferably 20 or less, more preferably 10 or less.
• the oxetane compound is preferably a polyfunctional oxetane compound. That is, the oxetane compound is preferably a compound having two or more oxetane groups. The upper limit of the number of oxetane groups is preferably 20 or less, more preferably 10 or less.
• ADEKA Resin EP-4000S, EP-4003S, EP-4010S, EP-4011S manufactured by ADEKA Corporation
• NC-2000, NC-3000, NC-7300, XD-1000, EPPN -501, EPPN-502 manufactured by ADEKA Co., Ltd.
• oxetane compounds include OXT-201, OXT-211, OXT-212, OXT-213, OXT-121, OXT-221, OX-SQ TX-100 (manufactured by Toagosei Co., Ltd.), etc. can be used.
• the content of the polymerizable monomer in the total solid content of the resin composition is preferably 0.1 to 40% by mass.
• the lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more.
• the upper limit is preferably 30% by mass or less, more preferably 20% by mass or less.
• the content of the compound having an ethylenically unsaturated bond-containing group as the polymerizable monomer is 1 per 100 parts by mass of the specific resin described above. It is preferably up to 50 parts by mass.
• the lower limit is preferably 3 parts by mass or more, more preferably 5 parts by mass or more.
• the upper limit is preferably 40 parts by mass or less, more preferably 30 parts by mass or less.
• the content of the compound having a cyclic ether group as the polymerizable monomer is 1 to 50 parts by mass with respect to 100 parts by mass of the specific resin described above.
• the lower limit is preferably 3 parts by mass or more, more preferably 5 parts by mass or more.
• the upper limit is preferably 40 parts by mass or less, more preferably 30 parts by mass or less.
• the resin composition contains a cyclic ether with respect to 100 parts by mass of the compound having an ethylenically unsaturated bond-containing group. It is preferable to contain 10 to 500 parts by mass of the compound having a group.
• the lower limit is preferably 20 parts by mass or more, more preferably 30 parts by mass or more.
• the upper limit is preferably 400 parts by mass or less, more preferably 300 parts by mass or less. If the ratio of both is within the above range, a film having excellent heat resistance (inhibition of cracks and film shrinkage) can be formed.
• the resin composition of the present invention preferably contains a photopolymerization initiator.
• the photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, compounds having photosensitivity to light in the ultraviolet region to the visible light region are preferred.
• the photopolymerization initiator is preferably a photoradical polymerization initiator.
• photopolymerization initiators include halogenated hydrocarbon derivatives (e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, ⁇ -hydroxyketone compounds, ⁇ -aminoketone compounds and the like.
• halogenated hydrocarbon derivatives e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, etc.
• acylphosphine compounds e.g., acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, ⁇ -hydroxyketone compounds, ⁇ -aminoketone compounds and the like.
• photopolymerization initiators include trihalomethyltriazine compounds, benzyldimethylketal compounds, ⁇ -hydroxyketone compounds, ⁇ -aminoketone compounds, acylphosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, hexaarylbi imidazole compounds, onium compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds, cyclopentadiene-benzene-iron complexes, halomethyloxadiazole compounds and 3-aryl-substituted coumarin compounds, oxime compounds, ⁇ -hydroxyketones compounds, ⁇ -aminoketone compounds, and acylphosphine compounds, more preferably oxime compounds.
• Aminoacetophenone-based initiators with aromatic ring-fused groups that may contain atoms and the like are included, the contents of which are incorporated herein.
• Hexaarylbiimidazole compounds include 2,2-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole and 2,2'-bis(o-chlorophenyl)-4,4' ,5,5-tetrakis(3,4,5-trimethoxyphenyl)-1,2'-biimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'- tetraphenylbiimidazole, 2,2'-bis(o-chlorophenyl)-4,4,5,5'-tetraphenyl-1,2'-biimidazole, and the like.
• ⁇ -hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, Omnirad 127 (manufactured by IGM Resins B.V.), Irgacure 184, Irgacure 1173, Irgacure 2959, Irgacure 127 (above company) and the like.
• ⁇ -aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (manufactured by IGM Resins B.V.), Irgacure 907, Irgacure 369, Irgacure 369E, Irgacure 379EG (manufactured by Irgacure 369E, Irgacure 379EG). ), Api307 (1-(biphenyl-4-yl)-2-methyl-2-morpholinopropan-1-one) (manufactured by MFCI), and the like.
• acylphosphine compounds include Omnirad 819, Omnirad TPO (manufactured by IGM Resins B.V.), Irgacure 819 and Irgacure TPO (manufactured by BASF).
• Examples of oxime compounds include compounds described in JP-A-2001-233842, compounds described in JP-A-2000-080068, compounds described in JP-A-2006-342166, J. Am. C. S. Compounds described in Perkin II (1979, pp.1653-1660); C. S. Compounds described in Perkin II (1979, pp.156-162), compounds described in Journal of Photopolymer Science and Technology (1995, pp.202-232), compounds described in JP-A-2000-066385, Compounds described in JP-A-2004-534797, compounds described in JP-A-2017-019766, compounds described in Patent No.
• oxime compounds include 3-benzoyloxyiminobutane-2-one, 3-acetoxyiminobutane-2-one, 3-propionyloxyiminobutane-2-one, 2-acetoxyiminopentane-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one, and 2-ethoxycarbonyloxy and imino-1-phenylpropan-1-one.
• An oxime compound having a fluorene ring can also be used as a photopolymerization initiator.
• Specific examples of oxime compounds having a fluorene ring include compounds described in JP-A-2014-137466.
• an oxime compound having a skeleton in which at least one benzene ring of a carbazole ring is a naphthalene ring can be used.
• Specific examples of such oxime compounds include compounds described in WO2013/083505.
• An oxime compound having a fluorine atom can also be used as a photopolymerization initiator.
• Specific examples of the oxime compound having a fluorine atom include compounds described in JP-A-2010-262028, compounds 24, 36 to 40 described in JP-A-2014-500852, and JP-A-2013-164471. and the compound (C-3) of.
• an oxime compound in which a substituent having a hydroxy group is bonded to the carbazole skeleton can also be used.
• Examples of such a photopolymerization initiator include the compounds described in International Publication No. 2019/088055.
• An oxime compound having a nitro group can be used as a photopolymerization initiator.
• the oxime compound having a nitro group is also preferably a dimer.
• Specific examples of the oxime compound having a nitro group include the compounds described in paragraph numbers 0031 to 0047 of JP-A-2013-114249 and paragraph numbers 0008-0012 and 0070-0079 of JP-A-2014-137466; Compounds described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071 and ADEKA Arkles NCI-831 (manufactured by ADEKA Corporation) can be mentioned.
• An oxime compound having a benzofuran skeleton can also be used as a photopolymerization initiator.
• Specific examples include OE-01 to OE-75 described in WO 2015/036910.
• an oxime compound in which a substituent having a hydroxy group is bonded to the carbazole skeleton can also be used.
• Examples of such a photopolymerization initiator include the compounds described in International Publication No. 2019/088055.
• the oxime compound is preferably a compound having a maximum absorption wavelength in the wavelength range of 350 to 500 nm, more preferably a compound having a maximum absorption wavelength in the wavelength range of 360 to 480 nm.
• the molar extinction coefficient of the oxime compound at a wavelength of 365 nm or a wavelength of 405 nm is preferably high from the viewpoint of sensitivity, more preferably 1000 to 300000, further preferably 2000 to 300000, even more preferably 5000 to 200000. It is particularly preferred to have The molar extinction coefficient of a compound can be measured using known methods. For example, it is preferable to measure with a spectrophotometer (Cary-5 spectrophotometer manufactured by Varian) using ethyl acetate at a concentration of 0.01 g/L.
• a bifunctional or trifunctional or higher functional photoradical polymerization initiator may be used as the photopolymerization initiator.
• a radical photopolymerization initiator two or more radicals are generated from one molecule of the radical photopolymerization initiator, so good sensitivity can be obtained.
• the crystallinity is lowered, the solubility in a solvent or the like is improved, and precipitation becomes difficult over time, and the stability over time of the resin composition can be improved.
• Specific examples of bifunctional or trifunctional or higher photoradical polymerization initiators include Japanese Patent Publication No. 2010-527339, Japanese Patent Publication No. 2011-524436, International Publication No.
• the content of the photopolymerization initiator in the total solid content of the resin composition is preferably 0.1 to 30% by mass.
• the lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more.
• the upper limit is preferably 20% by mass or less, more preferably 15% by mass or less.
• a photoinitiator may use only 1 type and may use 2 or more types.
• the resin composition of the present invention can contain a silane coupling agent.
• a silane coupling agent means a silane compound having a hydrolyzable group and other functional groups.
• the hydrolyzable group refers to a substituent that is directly bonded to a silicon atom and capable of forming a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction.
• Hydrolyzable groups include, for example, halogen atoms, alkoxy groups, acyloxy groups and the like, with alkoxy groups being preferred. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group.
• Examples of functional groups other than hydrolyzable groups include vinyl group, (meth)allyl group, (meth)acryloyl group, mercapto group, epoxy group, amino group, ureido group, sulfide group, isocyanate group, and phenyl group. etc., and amino group, (meth)acryloyl group and epoxy group are preferred.
• Specific examples of the silane coupling agent include compounds described in paragraph numbers 0018 to 0036 of JP-A-2009-288703 and compounds described in paragraph numbers 0056-0066 of JP-A-2009-242604. the contents of which are incorporated herein.
• the content of the silane coupling agent in the total solid content of the resin composition is preferably 0.1 to 5% by mass.
• the upper limit is preferably 3% by mass or less, more preferably 2% by mass or less.
• the lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more.
• the number of silane coupling agents may be one, or two or more.
• the resin composition of the present invention can further contain a curing accelerator for the purpose of accelerating the reaction of the resin or polymerizable compound and lowering the curing temperature.
• Curing accelerators include methylol compounds (for example, compounds exemplified as cross-linking agents in paragraph number 0246 of JP-A-2015-034963), amines, phosphonium salts, amidine salts, amide compounds (above, for example, JP-A Curing agent described in paragraph number 0186 of 2013-041165), a base generator (e.g., an ionic compound described in JP-A-2014-055114), a cyanate compound (e.g., JP-A-2012-150180 Compounds described in paragraph number 0071), alkoxysilane compounds (e.g., alkoxysilane compounds having an epoxy group described in JP-A-2011-253054), onium salt compounds (e.g., paragraph numbers of JP-A-2015-034963 0216
• the content of the curing accelerator is preferably 0.3 to 8.9 mass% of the total solid content of the resin composition, and 0.8 to 6.4 % by mass is more preferred.
• the resin composition of the present invention can contain a polymerization inhibitor.
• Polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4′-thiobis(3-methyl-6-tert-butylphenol), 2,2′-methylenebis(4-methyl-6-t-butylphenol), N-nitrosophenylhydroxyamine salts (ammonium salts, cerous salts, etc.). Among them, p-methoxyphenol is preferred.
• the content of the polymerization inhibitor in the total solid content of the resin composition is preferably 0.0001 to 5% by mass.
• the resin composition of the present invention can contain a surfactant.
• a surfactant various surfactants such as fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants and silicone surfactants can be used.
• the surfactant is preferably a fluorosurfactant or a silicone surfactant.
• Surfactants include those described in paragraphs 0238-0245 of WO2015/166779, the contents of which are incorporated herein.
• the fluorine content in the fluorine-based surfactant is preferably 3-40% by mass, more preferably 5-30% by mass, and particularly preferably 7-25% by mass.
• a fluorosurfactant having a fluorine content within this range is effective in uniformity of the thickness of the coating film and liquid saving, and has good solubility in the resin composition.
• JP 2014-041318 Paragraph Nos. 0060 to 0064 As the fluorine-based surfactant, JP 2014-041318 Paragraph Nos. 0060 to 0064 (corresponding International Publication No. 2014/017669 Paragraph Nos. 0060 to 0064) surfactants described in, JP 2011- 132503, paragraphs 0117-0132, the contents of which are incorporated herein.
• Commercially available fluorosurfactants include Megafac F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143 and F-144.
• fluorosurfactant it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound as the fluorosurfactant.
• fluorine-based surfactants the description in JP-A-2016-216602 can be referred to, the content of which is incorporated herein.
• a block polymer can also be used as the fluorosurfactant.
• the fluorosurfactant has 2 or more (preferably 5 or more) repeating units derived from a (meth)acrylate compound having a fluorine atom and an alkyleneoxy group (preferably an ethyleneoxy group or a propyleneoxy group) (meta).
• a fluorine-containing polymer compound containing a repeating unit derived from an acrylate compound can also be preferably used.
• the following compounds are also exemplified as fluorosurfactants used in the present invention.
• the weight average molecular weight of the above compound is preferably 3000-50000, for example 14000. In the above compounds, % indicating the ratio of repeating units is mol %.
• a fluoropolymer having an ethylenically unsaturated bond-containing group in a side chain can also be used as the fluorosurfactant.
• Specific examples include compounds described in paragraph numbers 0050 to 0090 and paragraph numbers 0289 to 0295 of JP-A-2010-164965, MEGAFACE RS-101, RS-102 and RS-718K manufactured by DIC Corporation, and RS-72-K.
• compounds described in paragraphs 0015 to 0158 of JP-A-2015-117327 can also be used.
• a fluorine-containing imide salt compound represented by formula (fi-1) is also preferable to use as a surfactant.
• m represents 1 or 2
• n represents an integer of 1 to 4
• a represents 1 or 2
• X a+ is an a-valent metal ion, primary ammonium ion, Represents secondary ammonium ion, tertiary ammonium ion, quaternary ammonium ion or NH 4 + .
• Nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane and their ethoxylates and propoxylates (e.g., glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, Polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester, Pluronic (registered trademark) L10, L31, L61, L62, 10R5, 17R2 , 25R2 (manufactured by BASF), Tetronic 304, 701, 704, 901, 904, 150R1 (manufactured by BASF), Solsperse 20000 (manufactured by Nippon Lubrizol Co., Ltd.), NCW-101, NC
• Cationic surfactants include tetraalkylammonium salts, alkylamine salts, benzalkonium salts, alkylpyridium salts, imidazolium salts, and the like. Specific examples include dihydroxyethylstearylamine, 2-heptadecenyl-hydroxyethylimidazoline, lauryldimethylbenzylammonium chloride, cetylpyridinium chloride, stearamidomethylpyridinium chloride and the like.
• Anionic surfactants include dodecylbenzenesulfonic acid, sodium dodecylbenzenesulfonate, sodium lauryl sulfate, sodium alkyldiphenyletherdisulfonate, sodium alkylnaphthalenesulfonate, sodium dialkylsulfosuccinate, sodium stearate, potassium oleate, sodium dioctyl Sulfosuccinate, sodium polyoxyethylene alkyl ether sulfate, sodium polyoxyethylene alkyl ether sulfate, sodium polyoxyethylene alkylphenyl ether sulfate, sodium dialkyl sulfosuccinate, sodium stearate, sodium oleate, t-octylphenoxyethoxypolyethoxyethyl sodium sulfate and the like.
• silicone-based surfactants include DC3PA, SH7PA, DC11PA, SH21PA, SH28PA, SH29PA, SH30PA, SH8400, SH8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, SF8419 OIL (Dow Toray Co., Ltd.), TSF-4300, TSF-4445, TSF-4460, TSF-4452 (manufactured by Momentive Performance Materials), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (manufactured by Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-3760 BYK-UV3510 (manufactured by BYK-Chemie Co., Ltd.), etc. be done.
• a compound having the following structure can also be used as the silicone-based surfactant.
• the content of the surfactant in the total solid content of the resin composition is preferably 0.001% by mass to 5.0% by mass, more preferably 0.005% by mass to 3.0% by mass. Only one type of surfactant may be used, or two or more types may be used. When two or more kinds are used, the total amount is preferably within the above range.
• the resin composition of the present invention can contain an ultraviolet absorber.
• a conjugated diene compound, an aminodiene compound, a salicylate compound, a benzophenone compound, a benzotriazole compound, an acrylonitrile compound, a hydroxyphenyltriazine compound, an indole compound, a triazine compound, or the like can be used as the ultraviolet absorber.
• paragraph numbers 0052 to 0072 of JP-A-2012-208374, paragraph numbers 0317-0334 of JP-A-2013-068814, and paragraph numbers 0061-0080 of JP-A-2016-162946 are described.
• UV absorbers examples include UV-503 (manufactured by Daito Chemical Co., Ltd.), Tinuvin series and Uvinul series manufactured by BASF, and Sumisorb series manufactured by Sumika Chemtex Co., Ltd. .
• UV-503 manufactured by Daito Chemical Co., Ltd.
• Tinuvin series and Uvinul series manufactured by BASF and Sumisorb series manufactured by Sumika Chemtex Co., Ltd.
• MYUA series made from Miyoshi oil and fats (Chemical Daily, February 1, 2016) is mentioned.
• the ultraviolet absorber is a compound described in paragraph numbers 0049 to 0059 of Japanese Patent No. 6268967, a compound described in paragraph numbers 0059 to 0076 of WO 2016/181987, and WO 2020/137819.
• a thioaryl group-substituted benzotriazole-type ultraviolet absorber described in can also be used.
• the content of the ultraviolet absorber in the total solid content of the resin composition is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass. Only one type of ultraviolet absorber may be used, or two or more types may be used. When two or more kinds are used, the total amount is preferably within the above range.
• the resin composition of the present invention can contain an antioxidant.
• Antioxidants include phenol compounds, phosphite ester compounds, thioether compounds and the like. Any phenolic compound known as a phenolic antioxidant can be used as the phenolic compound. Preferred phenolic compounds include hindered phenolic compounds. A compound having a substituent at a site adjacent to the phenolic hydroxy group (ortho position) is preferred. As the aforementioned substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferred.
• the antioxidant is also preferably a compound having a phenol group and a phosphite ester group in the same molecule.
• Phosphorus-based antioxidants can also be suitably used as antioxidants.
• antioxidants may be compounds described in Korean Patent Publication No. 10-2019-0059371.
• the content of the antioxidant in the total solid content of the resin composition is preferably 0.01 to 20% by mass, more preferably 0.3 to 15% by mass. Only one kind of antioxidant may be used, or two or more kinds thereof may be used. When two or more kinds are used, the total amount is preferably within the above range.
• the resin composition of the present invention may optionally contain sensitizers, fillers, thermosetting accelerators, plasticizers and other auxiliaries (e.g., conductive particles, antifoaming agents, flame retardants, leveling agents, peeling agents, etc.). accelerators, fragrances, surface tension modifiers, chain transfer agents, etc.). Properties such as film physical properties can be adjusted by appropriately containing these components. These components are, for example, described in JP 2012-003225, paragraph number 0183 and later (corresponding US Patent Application Publication No. 2013/0034812, paragraph number 0237), JP 2008-250074 paragraph The descriptions of numbers 0101 to 0104, 0107 to 0109, etc. can be referred to, and the contents thereof are incorporated herein.
• the resin composition may contain a latent antioxidant as needed.
• the latent antioxidant is a compound in which the site functioning as an antioxidant is protected with a protective group, and is heated at 100 to 250°C, or heated at 80 to 200°C in the presence of an acid/base catalyst.
• a compound that functions as an antioxidant by removing the protective group by the reaction is exemplified.
• Examples of latent antioxidants include compounds described in International Publication No. 2014/021023, International Publication No. 2017/030005, and JP-A-2017-008219.
• Commercially available products include ADEKA Arkles GPA-5001 (manufactured by ADEKA Co., Ltd.).
• the resin composition of the present invention may contain a light resistance improver.
• a light resistance improver compounds described in paragraph numbers 0036 to 0037 of JP-A-2017-198787, compounds described in paragraph numbers 0029-0034 of JP-A-2017-146350, JP-A-2017-129774 Compounds described in paragraph numbers 0036 to 0037, 0049 to 0052 of JP 2017-129674 JP 2017-129674 paragraph numbers 0031 to 0034, 0058 to 0059 compounds described in JP 2017-122803 paragraph numbers 0036 to 0037 , compounds described in 0051 to 0054, compounds described in paragraph numbers 0025 to 0039 of WO 2017/164127, compounds described in paragraph numbers 0034 to 0047 of JP 2017-186546, JP 2015-025116 Compounds described in paragraph numbers 0019 to 0041 of JP-A-2012-145604, compounds described in paragraph numbers 0101-0125 of JP-A-2012-103475, compounds
• perfluoroalkylsulfonic acid and its salts may be regulated.
• perfluoroalkylsulfonic acid especially perfluoroalkylsulfonic acid having 6 to 8 carbon atoms in the perfluoroalkyl group
• perfluoroalkylsulfonic acid especially perfluoroalkylsulfonic acid having 6 to 8 carbon atoms in the perfluoroalkyl group
• the content of fluoroalkylcarboxylic acid (especially perfluoroalkylcarboxylic acid having 6 to 8 carbon atoms in the perfluoroalkyl group) and its salt is 0.01ppb to 1,000ppb with respect to the total solid content of the resin composition.
• the resin composition of the present invention may be substantially free of perfluoroalkylsulfonic acid and its salts and perfluoroalkylcarboxylic acid and its salts.
• a compound that can substitute for perfluoroalkylsulfonic acid and its salt and a compound that can substitute for perfluoroalkylcarboxylic acid and its salt, perfluoroalkylsulfonic acid and its salt, and perfluoroalkylcarboxylic acid and salts thereof may be selected.
• Examples of compounds that can substitute for regulated compounds include compounds that are excluded from the scope of regulation due to differences in the number of carbon atoms in perfluoroalkyl groups. However, the above content does not prevent the use of perfluoroalkylsulfonic acid and its salts, and perfluoroalkylcarboxylic acid and its salts.
• the resin composition of the present invention may contain perfluoroalkylsulfonic acid and its salts, and perfluoroalkylcarboxylic acid and its salts within the maximum permissible range.
• the resin composition of the present invention preferably does not substantially contain terephthalic acid ester.
• substantially free means that the content of the terephthalic acid ester is 1000 mass ppb or less, more preferably 100 mass ppb or less, in the total amount of the resin composition. Zero is particularly preferred.
• the storage container for the resin composition is not particularly limited, and known storage containers can be used.
• a storage container a multi-layer bottle whose inner wall is composed of 6 types and 6 layers of resins and a bottle with a 7-layer structure of 6 types of resins are used for the purpose of suppressing contamination of raw materials and resin compositions. It is also preferred to use Examples of such a container include the container described in JP-A-2015-123351.
• the inner wall of the container is preferably made of glass or stainless steel for the purpose of preventing metal elution from the inner wall of the container, enhancing the storage stability of the resin composition, and suppressing deterioration of components.
• the resin composition of the present invention can be prepared by mixing the aforementioned components. In preparing the resin composition, all components may be dissolved and/or dispersed in an organic solvent at the same time to prepare the resin composition. , and these may be mixed at the time of use (at the time of application) to prepare a resin composition.
• a process of dispersing the pigment when preparing the resin composition.
• mechanical forces used for dispersing pigments include compression, squeezing, impact, shearing, cavitation, and the like.
• Specific examples of these processes include bead mills, sand mills, roll mills, ball mills, paint shakers, microfluidizers, high speed impellers, sand grinders, flow jet mixers, high pressure wet atomization, ultrasonic dispersion, and the like.
• 2015-157893 can be suitably used. Further, in the process of dispersing the pigment, the particles may be made finer in the salt milling process. Materials, equipment, processing conditions, etc. used in the salt milling process can be referred to, for example, Japanese Patent Application Laid-Open Nos. 2015-194521 and 2012-046629.
• any filter that has been conventionally used for filtration or the like can be used without particular limitation.
• PTFE polytetrafluoroethylene
• PVDF polyvinylidene fluoride
• polyamide resins such as nylon (eg nylon-6, nylon-6,6), polyethylene
• polyolefin resins such as polypropylene (PP) (including high-density, ultra-high-molecular-weight polyolefin resin).
• PP polypropylene
• polypropylene including high density polypropylene
• nylon are preferred.
• the pore size of the filter is preferably 0.01-7.0 ⁇ m, more preferably 0.01-3.0 ⁇ m, and even more preferably 0.05-0.5 ⁇ m. If the pore diameter of the filter is within the above range, fine foreign matter can be removed more reliably.
• the pore size value of the filter reference can be made to the filter manufacturer's nominal value.
• filters provided by Nippon Pall Co., Ltd. (DFA4201NIEY, DFA4201NAEY, DFA4201J006P, etc.), Advantech Toyo Co., Ltd., Nihon Entegris Co., Ltd. (former Japan Microlith Co., Ltd.), Kitz Micro Filter Co., Ltd., etc. can be used as filters. .
• fibrous filter media include polypropylene fibers, nylon fibers, and glass fibers.
• Commercially available products include SBP type series (SBP008, etc.), TPR type series (TPR002, TPR005, etc.), and SHPX type series (SHPX003, etc.) manufactured by Roki Techno.
• filters When using filters, different filters (eg, a first filter and a second filter, etc.) may be combined. At that time, filtration with each filter may be performed only once, or may be performed twice or more. Also, filters with different pore sizes within the range described above may be combined. Further, the filtration with the first filter may be performed only on the dispersion liquid, and after mixing other components, the filtration with the second filter may be performed. In addition, the filter can be appropriately selected according to the hydrophilicity/hydrophobicity of the resin composition.
• the film of the present invention is a film obtained from the resin composition of the present invention described above.
• the film of the present invention can be used for optical filters such as color filters, near-infrared transmission filters, and near-infrared cut filters.
• the film of the present invention can also be used as a light shielding film. In addition to sensors, it can also be used for optical communication filters and the like.
• the film thickness of the film of the present invention can be appropriately adjusted according to the purpose.
• the film thickness is preferably 20 ⁇ m or less, more preferably 10 ⁇ m or less, and even more preferably 5 ⁇ m or less.
• the lower limit of the film thickness is preferably 0.1 ⁇ m or more, more preferably 0.2 ⁇ m or more, and even more preferably 0.3 ⁇ m or more.
• the film of the present invention When using the film of the present invention as a color filter, the film of the present invention preferably has a hue of green, red, blue, cyan, magenta or yellow. Moreover, the film of the present invention can be preferably used as a colored pixel of a color filter. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels.
• the maximum absorption wavelength of the film of the present invention preferably exists in the wavelength range of 700 to 1800 nm, more preferably in the wavelength range of 700 to 1300 nm. More preferably, it exists in the wavelength range of 700 to 1100 nm.
• the transmittance of the film over the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. Further, it is preferable that the transmittance of the film at least at one point in the wavelength range of 700 to 1800 nm is 20% or less.
• the absorbance Amax/absorbance A550 which is the ratio of the absorbance Amax at the maximum absorption wavelength and the absorbance A550 at a wavelength of 550 nm, is preferably 20 to 500, more preferably 50 to 500, and 70 to 450. more preferably 100 to 400.
• the film of the present invention preferably has, for example, any one of the following spectral characteristics (i1) to (i5).
• a film having such spectral characteristics can block light in the wavelength range of 400 to 640 nm and transmit light in the wavelength range of 750 nm or more.
• the maximum transmittance in the wavelength range of 400 to 750 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 900 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
• a film having such spectral characteristics can block light in the wavelength range of 400 to 750 nm and transmit light in the wavelength range of 850 nm or more.
• the maximum transmittance in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1000 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
• a film having such spectral characteristics can block light in the wavelength range of 400 to 830 nm and transmit light in the wavelength range of 950 nm or more.
• the maximum transmittance in the wavelength range of 400 to 950 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1100 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
• a film having such spectral characteristics can block light in the wavelength range of 400 to 950 nm and transmit light in the wavelength range of 1050 nm or more.
• the maximum transmittance in the wavelength range of 400 to 1050 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1200 to 1500 nm is A filter that is 70% or more (preferably 75% or more, more preferably 80% or more).
• a film having such spectral characteristics can block light in the wavelength range of 400 to 1050 nm and transmit light in the wavelength range of 1150 nm or more.
• the optical density (OD) per 1.5 ⁇ m film thickness in the wavelength range of 400 to 1100 nm of the film is preferably 2.5 or more, and preferably 3.0. It is more preferable to be above.
• the upper limit is not particularly limited, it is generally preferably 10 or less.
• the reflectance of the film is preferably less than 8%, more preferably less than 6%, and even more preferably less than 4%.
• the lower limit is preferably 0% or more.
• the light-shielding film is used in portable devices such as personal computers, tablets, mobile phones, smartphones, and digital cameras; OA (Office Automation) devices such as multi-function printers and scanners; industrial equipment such as automated teller machines), high-speed cameras, and equipment with personal authentication functions using face image authentication or biometric authentication; vehicle-mounted camera equipment; medical cameras such as endoscopes, capsule endoscopes, and catheters equipment; and space equipment such as biosensors, biosensors, military reconnaissance cameras, stereo map cameras, weather and ocean observation cameras, land resource exploration cameras and exploration cameras for space astronomy and deep space targets; It can be used for optical filters and modules used.
• OA Office Automation
• industrial equipment such as automated teller machines
• high-speed cameras and equipment with personal authentication functions using face image authentication or biometric authentication
• vehicle-mounted camera equipment medical cameras such as endoscopes, capsule endoscopes, and catheters equipment
• space equipment such as biosensors, biosensors, military reconnaissance cameras, stereo map cameras, weather and ocean observation cameras, land resource exploration cameras and exploration cameras
• the light-shielding film can also be used for applications such as micro LEDs (Light Emitting Diodes) and micro OLEDs (Organic Light Emitting Diodes).
• Micro LEDs and micro OLEDs include, for example, examples described in Japanese Patent Publication No. 2015-500562 and Japanese Patent Publication No. 2014-533890.
• the light-shielding film is also suitable as an optical filter and an optical film used in quantum dot sensors and quantum dot solid-state imaging devices. Examples of quantum dot sensors and quantum dot solid-state imaging devices include those described in US Patent Application Publication No. 2012/37789 and International Publication No. 2008/131313.
• the light shielding film can be used in headlight units for vehicles such as automobiles.
• the light shielding film used in the headlight unit is preferably formed in a pattern so as to shield at least part of the light emitted from the light source.
• the membrane of the present invention can be produced through the step of applying the above resin composition of the present invention onto a support. It is preferable that the method for producing a film of the present invention further includes a step of forming a pattern (pixels).
• a method for forming the pattern (pixels) includes a photolithography method and a dry etching method, and the photolithography method is preferable.
• Pattern formation by photolithography includes the steps of forming a resin composition layer on a support using the resin composition of the present invention, exposing the resin composition layer in a pattern, and exposing the resin composition layer to light. and forming a pattern (pixels) by developing and removing the exposed portion. If necessary, a step of baking the resin composition layer (pre-baking step) and a step of baking the developed pattern (pixels) (post-baking step) may be provided.
• the resin composition of the present invention is used to form a resin composition layer on a support.
• the support is not particularly limited and can be appropriately selected depending on the application. Examples thereof include glass substrates and silicon substrates, and silicon substrates are preferred. Also, a charge-coupled device (CCD), a complementary metal oxide semiconductor (CMOS), a transparent conductive film, or the like may be formed on the silicon substrate.
• CCD charge-coupled device
• CMOS complementary metal oxide semiconductor
• the silicon substrate is formed with a light-shielding film such as a black matrix that isolates each pixel.
• the silicon substrate may be provided with an underlying layer for improving adhesion with the upper layer, preventing diffusion of substances, or flattening the substrate surface.
• the surface contact angle of the underlayer is preferably 20 to 70° when measured with diiodomethane. Further, it is preferably 30 to 80° when measured with water.
• the surface contact angle of the underlayer can be adjusted, for example, by adding a surfactant.
• a known method can be used as a method for applying the resin composition.
• drop method drop cast
• slit coating method spray method
• roll coating method spin coating
• methods described in publications inkjet (e.g., on-demand method, piezo method, thermal method), discharge system printing such as nozzle jet, flexo printing, screen printing, gravure printing, reverse offset printing, metal mask printing method, etc.
• inkjet e.g., on-demand method, piezo method, thermal method
• discharge system printing such as nozzle jet, flexo printing, screen printing, gravure printing, reverse offset printing, metal mask printing method, etc.
• Examples include various printing methods; transfer methods using molds and the like; nanoimprinting methods and the like.
• the application method for inkjet is not particularly limited.
• the resin composition layer formed on the support may be dried (pre-baked). Pre-baking may not be performed when the film is manufactured by a low-temperature process.
• the pre-baking temperature is preferably 150° C. or lower, more preferably 120° C. or lower, and even more preferably 110° C. or lower.
• the lower limit can be, for example, 50° C. or higher, and can also be 80° C. or higher.
• the pre-bake time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, even more preferably 80 to 220 seconds. Pre-baking can be performed using a hot plate, an oven, or the like.
• the resin composition layer is exposed in a pattern (exposure step).
• the resin composition layer can be exposed in a pattern by exposing through a mask having a predetermined mask pattern using a stepper exposure machine, a scanner exposure machine, or the like. Thereby, the exposed portion can be cured.
• Radiation (light) that can be used for exposure includes g-line, i-line, and the like.
• Light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used.
• Light having a wavelength of 300 nm or less includes KrF rays (wavelength: 248 nm), ArF rays (wavelength: 193 nm), etc., and KrF rays (wavelength: 248 nm) are preferable.
• a long-wave light source of 300 nm or more can also be used.
• the exposure may be performed by continuously irradiating the light, or by pulsing the light (pulse exposure).
• pulse exposure is an exposure method in which exposure is performed by repeating light irradiation and rest in short-time (for example, millisecond level or less) cycles.
• the pulse width is preferably 100 nanoseconds (ns) or less, more preferably 50 nanoseconds or less, and even more preferably 30 nanoseconds or less.
• the lower limit of the pulse width is not particularly limited, but may be 1 femtosecond (fs) or more, and may be 10 femtoseconds or more.
• the frequency is preferably 1 kHz or higher, more preferably 2 kHz or higher, and even more preferably 4 kHz or higher.
• the upper limit of the frequency is preferably 50 kHz or less, more preferably 20 kHz or less, and even more preferably 10 kHz or less.
• the maximum instantaneous illuminance is preferably 50000000 W/ m2 or more, more preferably 100000000 W/ m2 or more, and even more preferably 200000000 W/ m2 or more.
• the upper limit of the maximum instantaneous illuminance is preferably 1000000000 W/m 2 or less, more preferably 800000000 W/m 2 or less, and even more preferably 500000000 W/m 2 or less.
• the pulse width is the time during which the light is applied in the pulse cycle.
• the frequency is the number of pulse cycles per second.
• the maximum instantaneous illuminance is the average illuminance within the time during which the light is irradiated in the pulse cycle.
• the pulse cycle is a cycle in which light irradiation and rest in pulse exposure are set as one cycle.
• the irradiation amount is, for example, preferably 0.03 to 2.5 J/cm 2 , more preferably 0.05 to 1.0 J/cm 2 .
• the oxygen concentration at the time of exposure can be selected as appropriate, and in addition to exposure in the atmosphere, for example, in a low oxygen atmosphere with an oxygen concentration of 19% by volume or less (e.g., 15% by volume, 5% by volume, or substantially oxygen-free) or in a high-oxygen atmosphere with an oxygen concentration exceeding 21% by volume (for example, 22% by volume, 30% by volume, or 50% by volume).
• the exposure illuminance can be set as appropriate, and is usually selected from the range of 1000 W/m 2 to 100000 W/m 2 (eg, 5000 W/m 2 , 15000 W/m 2 or 35000 W/m 2 ). can be done. Oxygen concentration and exposure illuminance may be appropriately combined. For example, illuminance of 10000 W/m 2 at oxygen concentration of 10% by volume and illuminance of 20000 W/m 2 at oxygen concentration of 35% by volume.
• the unexposed portions of the resin composition layer are removed by development to form a pattern (pixels).
• the development and removal of the unexposed portion of the resin composition layer can be performed using a developer.
• the unexposed portion of the resin composition layer in the exposure step is eluted into the developer, leaving only the photocured portion.
• the temperature of the developer is preferably 20 to 30° C., for example.
• the development time is preferably 20 to 180 seconds. Further, in order to improve the residue removability, the step of shaking off the developer every 60 seconds and then supplying new developer may be repeated several times.
• the developer includes an organic solvent, an alkaline developer, etc., and an alkaline developer is preferably used.
• an alkaline developer an alkaline aqueous solution (alkali developer) obtained by diluting an alkaline agent with pure water is preferable.
• alkaline agents include ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, diethanolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, and tetrabutylammonium hydroxide.
• alkaline compounds and inorganic alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, sodium silicate and sodium metasilicate.
• concentration of the alkaline agent in the alkaline aqueous solution is preferably 0.001 to 10% by mass, more preferably 0.01 to 1% by mass.
• the developer may further contain a surfactant.
• the surfactant include the surfactants described above, and nonionic surfactants are preferred.
• the developer may be produced once as a concentrated solution and then diluted to the required concentration when used.
• the dilution ratio is not particularly limited, it can be set, for example, in the range of 1.5 to 100 times.
• wash (rinse) with pure water after development. Rinsing is preferably carried out by supplying a rinse liquid to the resin composition layer after development while rotating the support on which the resin composition layer after development is formed. It is also preferable to move the nozzle for discharging the rinsing liquid from the central portion of the support to the peripheral portion of the support.
• the moving speed of the nozzle may be gradually decreased.
• in-plane variations in rinsing can be suppressed.
• a similar effect can be obtained by gradually decreasing the rotation speed of the support while moving the nozzle from the center of the support to the periphery.
• Additional exposure processing and post-baking are post-development curing treatments for complete curing.
• the heating temperature in post-baking is, for example, preferably 100 to 240.degree. C., more preferably 200 to 240.degree.
• Post-baking can be performed continuously or batchwise using a heating means such as a hot plate, a convection oven (hot air circulating dryer), or a high-frequency heater so that the developed film satisfies the above conditions. .
• the light used for exposure preferably has a wavelength of 400 nm or less.
• the additional exposure process may be performed by the method described in Korean Patent Publication No. 10-2017-0122130.
• Pattern formation by a dry etching method includes a step of forming a resin composition layer on a support using the resin composition of the present invention, and curing the entire resin composition layer to form a cured product layer; A step of forming a photoresist layer on the cured layer, a step of exposing the photoresist layer in a pattern and then developing it to form a resist pattern, and etching the cured layer using the resist pattern as a mask. and dry etching using a gas. In forming the photoresist layer, it is preferable to further perform a pre-baking process.
• the optical filter of the present invention has the film of the present invention as described above.
• the optical filter includes a color filter, a near-infrared transmission filter, a near-infrared cut filter, and the like, and is preferably a color filter.
• a color filter it is preferable to have the film of the present invention as a colored pixel of the color filter.
• the optical filter may have a light shielding film.
• a color filter, a near-infrared transmission filter, a near-infrared cut filter, or the like may be formed in the openings of the light-shielding film formed on the support.
• the optical filter of the present invention can be used for solid-state imaging devices such as CCDs (charge-coupled devices) and CMOSs (complementary metal oxide semiconductors), image display devices, and the like.
• the film thickness of the film of the present invention can be appropriately adjusted according to the purpose.
• the film thickness of the pixels included in the optical filter is preferably 5 ⁇ m or less, more preferably 1 ⁇ m or less, and even more preferably 0.6 ⁇ m or less.
• the lower limit of the film thickness is preferably 0.1 ⁇ m or more, more preferably 0.2 ⁇ m or more, and even more preferably 0.3 ⁇ m or more.
• the width of pixels included in the optical filter is preferably 0.4 to 10.0 ⁇ m.
• the lower limit is preferably 0.4 ⁇ m or more, more preferably 0.5 ⁇ m or more, and even more preferably 0.6 ⁇ m or more.
• the upper limit is preferably 5.0 ⁇ m or less, more preferably 2.0 ⁇ m or less, even more preferably 1.0 ⁇ m or less, and even more preferably 0.8 ⁇ m or less.
• the Young's modulus of the pixel is preferably 0.5 to 20 GPa, more preferably 2.5 to 15 GPa.
• Each pixel included in the optical filter preferably has high flatness.
• the pixel surface roughness Ra is preferably 100 nm or less, more preferably 40 nm or less, and even more preferably 15 nm or less. Although the lower limit is not specified, it is preferably 0.1 nm or more, for example.
• the surface roughness of a pixel can be measured using, for example, AFM (Atomic Force Microscope) Dimension 3100 manufactured by Veeco.
• the contact angle of water on the pixel can be appropriately set to a preferable value, but is typically in the range of 50 to 110°. The contact angle can be measured using, for example, a contact angle meter CV-DT-A type (manufactured by Kyowa Interface Science Co., Ltd.).
• the volume resistance value of the pixel is high.
• the volume resistance value of the pixel is preferably 10 9 ⁇ cm or more, more preferably 10 11 ⁇ cm or more.
• the upper limit is not specified, it is preferably 10 14 ⁇ cm or less, for example.
• the volume resistance value of the pixel can be measured using an ultra-high resistance meter 5410 (manufactured by Advantest).
• the film thickness of the light shielding film is preferably 5 ⁇ m or less, more preferably 2.5 ⁇ m or less.
• the lower limit of the film thickness is preferably 0.1 ⁇ m or more, more preferably 0.5 ⁇ m or more, and even more preferably 1 ⁇ m or more.
• a protective layer may be provided on the surface of the film of the present invention.
• the protective layer By providing the protective layer, it is possible to impart various functions such as blocking oxygen, reducing reflection, making the film hydrophilic and hydrophobic, and blocking light of a specific wavelength (ultraviolet rays, near-infrared rays, etc.).
• the thickness of the protective layer is preferably 0.01-10 ⁇ m, more preferably 0.1-5 ⁇ m.
• Examples of the method for forming the protective layer include a method of applying a protective layer-forming resin composition dissolved in an organic solvent, a chemical vapor deposition method, and a method of adhering a molded resin with an adhesive.
• Components constituting the protective layer include (meth)acrylic resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene ether phosphine oxide resins, and polyimides.
• the protective layer preferably contains a polyol resin, SiO 2 and Si 2 N 4 .
• the protective layer preferably contains a (meth)acrylic resin and a fluororesin.
• the protective layer-forming resin composition When the protective layer-forming resin composition is applied to form the protective layer, known methods such as a spin coating method, a casting method, a screen printing method, an inkjet method, and the like can be used as a method for applying the protective layer-forming resin composition. can be used.
• known methods such as a spin coating method, a casting method, a screen printing method, an inkjet method, and the like can be used as a method for applying the protective layer-forming resin composition. can be used.
• the organic solvent contained in the protective layer-forming resin composition known organic solvents (eg, propylene glycol 1-monomethyl ether 2-acetate, cyclopentanone, ethyl lactate, etc.) can be used.
• the protective layer is formed by a chemical vapor deposition method
• the chemical vapor deposition method includes known chemical vapor deposition methods (thermal chemical vapor deposition method, plasma chemical vapor deposition method, photochemical vapor deposition method). can be used.
• the protective layer contains organic/inorganic fine particles, absorbers for light of specific wavelengths (e.g., ultraviolet rays, near-infrared rays, etc.), refractive index modifiers, antioxidants, adhesion agents, additives such as surfactants. may contain.
• organic/inorganic fine particles include polymeric fine particles (eg, silicone resin fine particles, polystyrene fine particles, melamine resin fine particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, titanium nitride, and titanium oxynitride. , magnesium fluoride, hollow silica, silica, calcium carbonate, barium sulfate, and the like.
• a known absorber can be used as the absorber for light of a specific wavelength.
• the content of these additives can be appropriately adjusted, but is preferably 0.1 to 70% by mass, more preferably 1 to 60% by mass, based on the total mass of the protective layer.
• the protective layer the protective layers described in paragraphs 0073 to 0092 of JP-A-2017-151176 can also be used.
• the optical filter may have a structure in which each pixel is embedded in a space partitioned by partition walls, for example, in a grid pattern.
• the resin composition of the present invention can also be suitably used for the pixel configuration described in International Publication No. 2019/102887.
• the solid-state imaging device of the present invention has the film of the present invention described above.
• the configuration of the solid-state imaging device of the present invention is not particularly limited as long as it has the film of the present invention and functions as a solid-state imaging device.
• a plurality of photodiodes forming a light receiving area of a solid-state imaging device CCD (charge-coupled device) image sensor, CMOS (complementary metal oxide semiconductor) image sensor, etc.) and transfer electrodes made of polysilicon or the like are provided on the substrate. and a device protective film made of silicon nitride or the like formed on the light shielding film so as to cover the entire surface of the light shielding film and the photodiode light receiving portion. and a color filter on the device protective film.
• the color filter may have a structure in which each color pixel is embedded in a space partitioned by partition walls, for example, in a grid pattern.
• the partition wall preferably has a lower refractive index than each color pixel. Examples of imaging devices having such a structure are described in JP-A-2012-227478, JP-A-2014-179577, International Publication No. 2018/043654, and US Patent Application Publication No.
• an ultraviolet absorption layer may be provided in the structure of the solid-state imaging device to improve light resistance.
• An imaging device equipped with the solid-state imaging device of the present invention can be used not only for digital cameras and electronic devices having an imaging function (mobile phones, etc.), but also for vehicle-mounted cameras and monitoring cameras.
• the solid-state imaging device incorporating the color filter of the present invention may further incorporate another color filter, a near-infrared cut filter, an organic photoelectric conversion film, etc., in addition to the color filter of the present invention.
• the image display device of the present invention has the film of the present invention described above.
• image display devices include liquid crystal display devices and organic electroluminescence display devices.
• electroluminescence display devices For a definition of an image display device and details of each image display device, see, for example, “Electronic Display Device (by Akio Sasaki, Industrial Research Institute, 1990)", “Display Device (by Junsho Ibuki, Sangyo Tosho ( Co., Ltd.), issued in 1989), etc.
• Liquid crystal display devices are described, for example, in “Next Generation Liquid Crystal Display Technology (edited by Tatsuo Uchida, published by Kogyo Choukai Co., Ltd., 1994)". There is no particular limitation on the liquid crystal display device to which the present invention can be applied.
• the acid number of a sample represents the mass of potassium hydroxide required to neutralize acidic components per gram of solid content in the sample.
• A 56.11 x Vs x 0.5 x f/w
• f titer of 0.1 mol/L potassium hydroxide aqueous solution
• w mass of sample (g) (in terms of solid content)
• the resulting terminal mercapto group polymer solution was heated to 60° C., 10.9 g of maleic anhydride was added, and a thermal radical generator (V-65, manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) was added. 0.32 g of the solution was added and stirred under heating at 60° C. for 8 hours in a nitrogen atmosphere to obtain a solution of resin B-1 having the following structure.
• the weight average molecular weight of the resulting resin B-1 was 1,150.
• Resins B-2 to B-4 were synthesized in the same manner as resin B-1.
• resins B-6 to B-41 were synthesized in the same manner as resin B-5.
• AH-1 to AH-7 groups of the following structures (wherein * is a linking hand)
• Z1-1, Z1-2, Z1-12, Z1-13, Z1-14 groups of the following structures (wherein * is a linker)
• P1-1 to P1-16, P1-18 to P1-22 groups of the following structures (wherein * is a linking hand)
• a mixed liquid obtained by mixing the raw materials shown in the table below was mixed and dispersed for 3 hours using a bead mill (using zirconia beads with a diameter of 0.3 mm), and then a high-pressure disperser NANO-3000-10 with a pressure reduction mechanism (Nippon BEE (manufactured by Co., Ltd.) under a pressure of 2000 MPa and a flow rate of 500 g/min. This dispersion treatment was repeated 10 times to obtain each dispersion.
• the unit of the numerical value indicating the compounding amount of each raw material described in the above table is parts by mass.
• the details of raw materials indicated by abbreviations are as follows.
• PR122 C.I. I. Pigment Red 122 (red pigment, quinacridone pigment)
• PR179 C.I. I. Pigment Red 179 (red pigment, perylene pigment)
• PR254 C.I. I. Pigment Red 254 (red pigment, diketopyrrolopyrrole pigment)
• PR264 C.I. I. Pigment Red 264 (red pigment, diketopyrrolopyrrole pigment)
• PR291 C.I. I.
• Pigment Red 291 red pigment, diketopyrrolopyrrole pigment
• PO71 C.I. I. Pigment Orange 71 (orange pigment, diketopyrrolopyrrole pigment)
• PB15:6 C.I. I. Pigment Blue 15:6 (blue pigment, phthalocyanine pigment)
• PB16 C.I. I. Pigment Blue 16 (blue pigment, phthalocyanine pigment)
• PG7 C.I. I. Pigment Green 7 (green pigment, phthalocyanine pigment)
• PG36 C.I. I. Pigment Green 36 (green pigment, phthalocyanine pigment)
• PG58 C.I. I. Pigment Green 58 (green pigment, phthalocyanine pigment)
• PY185 C.I.
• I. Pigment Yellow 185 (yellow pigment, isoindoline pigment)
• PY215 C.I. I. Pigment Yellow 215 (yellow pigment, pteridine pigment)
• PV23 C.I. I. Pigment Violet 23 (purple pigment, dioxazine pigment)
• IR dye a compound having the following structure (near-infrared absorbing pigment, in the structural formula, Me represents a methyl group and Ph represents a phenyl group)
• Black color material 1 Titanium black (a-1) produced by the following method 100 g of titanium oxide MT-150A (manufactured by Tayca) having an average particle diameter of 15 nm, 25 g of silica particles AEROGIL 300/30 (manufactured by Evonik) having a BET surface area of 300 m 2 /g, and 100 g of a dispersant Disperbyk 190 (manufactured by BYK-Chemie) were weighed.
• a-1 Titanium black (a-1) produced by the following method 100 g of titanium oxide MT-150A (manufactured by Tayca) having an average particle diameter of 15 nm, 25 g of silica particles AEROGIL 300/30 (manufactured by Evonik) having a BET surface area of 300 m 2 /g, and 100 g of a dispersant Disperbyk 190 (manufactured by BYK-Chemie) were weighed.
• ion-exchanged water was added, and treated with MAZERSTAR KK-400W manufactured by KURABO for 20 minutes at a revolution speed of 1,360 rpm and a rotation speed of 1,047 rpm to obtain a homogeneous mixture aqueous solution.
• This aqueous solution is filled in a quartz container, heated to 920° C. in an oxygen atmosphere using a small rotary kiln (manufactured by Motoyama Co., Ltd.), then the atmosphere is replaced with nitrogen, and ammonia gas is flowed at 100 mL/min for 5 hours at the same temperature. Nitriding reduction treatment was carried out.
• the recovered powder was pulverized in a mortar to obtain a powdery titanium black (a-1) containing Si atoms and having a specific surface area of 73 m 2 /g [titanium black particles and a substance to be dispersed containing Si atoms]. Obtained.
• Black color material 2 Coated carbon black produced by the following method Carbon black was produced by a conventional oil furnace method. However, ethylene bottom oil with low Na content, Ca content and S content was used as raw material oil, and gas fuel was used for combustion. Furthermore, pure water treated with an ion exchange resin was used as the water for stopping the reaction. Using a homomixer, 540 g of the obtained carbon black was stirred with 14500 g of pure water at 5000 to 6000 rpm for 30 minutes to obtain a slurry.
• This slurry was transferred to a container equipped with a screw type stirrer, and 600 g of toluene containing 60 g of an epoxy resin (Epikote 828, manufactured by Mitsubishi Chemical Corporation) dissolved therein was added little by little while mixing at about 1000 rpm. In about 15 minutes, all of the carbon black dispersed in water migrated to the toluene side and formed particles of about 1 mm. Next, after draining with a 60-mesh wire mesh, the separated grains were placed in a vacuum dryer and dried at 70° C. for 7 hours to remove toluene and water to obtain coated carbon black. The resin coating amount of the obtained coated carbon black was 10% by mass with respect to the total amount of carbon black and resin.
• Black color material 3 Irgaphor Black S 0100 CF (manufactured by BASF, compound having the following structure, lactam pigment)
• Black color material 4 zirconium oxynitride (powder specific surface area 65 m 2 /g)
• Derivative 1 a compound having the following structure
• Derivative 2 a compound having the following structure
• Derivative 3 a compound having the following structure
• Derivative 4 S12000 (manufactured by Lubrizol)
• cB-1 Resin having the following structure (weight average molecular weight: 2500, description of "Poly” means that the polymer chain having a structure in which the repeating units of the structure indicated by “Poly” are bonded by the number of subscripts is a sulfur atom (S) ).
• cB-2 Resin with the following structure (weight average molecular weight: 2800, description of "Poly” means that a polymer chain having a structure in which repeating units of the structure indicated by “Poly” are bonded with the number of subscripts is a sulfur atom (S) ).
• ⁇ resin ⁇ Ba-1 resin having the following structure (numerical values attached to the main chain are molar ratios; weight average molecular weight: 11,000)
• Ba-2 resin having the following structure (numerical values attached to the main chain are molar ratios; weight average molecular weight: 15,000)
• Ba-3 resin having the following structure (numerical values attached to the main chain are molar ratios. The total value of x, y and z is 50.
• Ba-4 cardo resin V-259ME (manufactured by Nippon Steel & Sumikin Co., Ltd.)
• Bb-1 Resin having the following structure (numerical values attached to the main chain are molar ratios; weight average molecular weight: 13,000)
• Bb-2 resin cB-1 described above
• B-11, B-12 Resins B-11, B-12 having the structures described above
• D-1 Acrylate compound (KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd., a mixture of dipentaerythritol hexaacrylate and dipentaerythritol pentaacrylate)
• D-2 Epoxy compound (TETRAD-X, manufactured by Mitsubishi Gas Chemical Company, Inc., N,N,N',N'-tetraglycidyl-m-xylylenediamine)
• D-3 Oxetane compound (OXT-221, manufactured by Toagosei Co., Ltd., 3-ethyl-3 ⁇ [(3-ethyloxetan-3-yl)methoxy]methyl ⁇ oxetane)
• D-4 Oxetane compound (OX-SQ TX-100, manufactured by Toagosei Co., Ltd.)
• E-1 Omnirad 379EG (manufactured by IGM Resins B.V., 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butane-1- on)
• E-2 Irgacure OXE01 (manufactured by BASF, oxime compound)
• E-3 A compound having the following structure
• ⁇ Vis was 0.5 mPa ⁇ s or less.
• B ⁇ Vis exceeded 0.5 mPa ⁇ s and was 1.0 mPa ⁇ s or less.
• D ⁇ Vis exceeded 2.0 mPa ⁇ s and was 2.5 mPa ⁇ s or less.
• E ⁇ Vis exceeded 2.5 mPa ⁇ s.
• A The number average particle size of the pigment was 0.05 ⁇ m or less.
• B The number average particle size of the pigment was more than 0.05 ⁇ m and 0.10 ⁇ m or less.
• C The number average particle size of the pigment exceeded 0.10 ⁇ m and was 0.20 ⁇ m or less.
• D The number average particle size of the pigment was more than 0.20 ⁇ m and 0.50 ⁇ m or less.
• E The number average particle size of the pigment exceeded 0.50 ⁇ m.
• the glass substrate on which the coating film after exposure is formed is placed on a horizontal rotating table of a spin shower developing machine (DW-30 type, manufactured by Chemitronics Co., Ltd.), and a developing solution (CD-2000 , manufactured by FUJIFILM Electronic Materials Co., Ltd.), puddle development was performed at 23° C. for 60 seconds.
• a spin shower developing machine DW-30 type, manufactured by Chemitronics Co., Ltd.
• a developing solution CD-2000 , manufactured by FUJIFILM Electronic Materials Co., Ltd.
• pure water was supplied from above the center of rotation in the form of a shower from an ejection nozzle to perform a rinse treatment, followed by spray drying.
• the rinsed coating film was post-baked at 220° C. for 300 seconds to form a patterned substrate.
• Proximity exposure was performed at a lamp power of 50 mW/cm 2 and an exposure amount of 500 mJ/cm 2 .
• the above-mentioned coating film after exposure is paddle-developed at 23° C. for 15 seconds with a developer (CD-1040, manufactured by Fuji Film Electronic Materials Co., Ltd.) using AD-1200 (manufactured by Mikasa), followed by showering. It was rinsed with pure water using a nozzle for 30 seconds. The rinsed coating film was post-baked at 220° C. for 300 seconds to form a patterned substrate.
• the space part (non-exposed part) where the pattern is not formed on the substrate is observed using a transmission microscope, and evaluated from the following viewpoints. did.
• Adhesion (peeling) Each resin composition was used to form a patterned substrate in the same manner as described above, except that the opening line width of the mask used in the exposure was changed to 10 ⁇ m and the exposure was performed while varying the exposure amount. made. With respect to the resulting patterned substrate, a line pattern with a width of 10 ⁇ m was observed using an optical microscope, and the presence or absence of pattern peeling was evaluated from the following viewpoints. It is preferable that the amount of exposure is as small as possible to form a pattern (image portion) that adheres to the substrate and does not peel off. A: A pattern free from peeling can be formed at an exposure amount of 1000 mJ or less.
• a pattern free from peeling can be formed at an exposure amount of more than 1000 mJ and 1400 mJ or less.
• C A pattern free from peeling can be formed at an exposure amount of more than 1400 mJ and 1700 mJ or less.
• D A pattern free from peeling can be formed at an exposure amount of more than 1700 mJ.
• a patterned substrate was produced using each resin composition in the same manner as described above, except that the opening line width of the mask used during exposure was changed to 300 ⁇ m.
• a scanning electron microscope S-4800 manufactured by Hitachi High-Technologies Co., Ltd. was used to observe a cross-sectional scanning electron microscope image of a pattern with a width of 300 ⁇ m, and the undercut width was actually measured. It was evaluated from the viewpoint of The undercut width is defined as "[(line width at the widest part of the pattern cross section)-(line width at the part where the line pattern touches the substrate on the pattern cross section)]/2".
• the line width at the portion where the line width is the widest in the pattern cross section is 300 ⁇ m.
• Dispersions R2-1 to R2-24 were prepared in the same manner as Dispersion R2, except that Derivative 2, which was also used as a pigment derivative, was changed to Derivatives 10 to 33 in Dispersion R2. Resin compositions were produced in the same manner as in Example 3, except that dispersion R2 in Example 3 was changed to dispersions R2-1 to R2-24. When the obtained resin composition was evaluated in the same manner as described above, the same evaluation results as in Example 3 were obtained.
• Derivatives 10-33 compounds having the following structures. The crystallite size of each derivative was adjusted by grinding.
• the crystallite size and crystallinity of derivatives 10-33 are as follows.

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• 2022
  • 2022-05-25 JP JP2023529726A patent/JP7836307B2/ja active Active
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